CN214708436U - Heat dissipation insulating film capable of carrying electronic device - Google Patents
Heat dissipation insulating film capable of carrying electronic device Download PDFInfo
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- CN214708436U CN214708436U CN202120482649.7U CN202120482649U CN214708436U CN 214708436 U CN214708436 U CN 214708436U CN 202120482649 U CN202120482649 U CN 202120482649U CN 214708436 U CN214708436 U CN 214708436U
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- heat dissipation
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- electronic device
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Abstract
The utility model belongs to the technical field of heat dissipation film, the utility model discloses a heat dissipation insulating film of portable electronic device, including insulating heat conduction bottom and cover protection skin, insulating heat conduction bottom up end fixedly connected with graphite alkene package presss from both sides the inlayer, graphite alkene package presss from both sides the inlayer and is located cover protection skin and graphite alkene package presss from both sides between the inlayer, the shape of graphite alkene package presss from both sides the inlayer is latticed, insulating heat conduction bottom up end fixedly connected with a plurality of matrix distribution's heat dissipation bellying platform; and graphite alkene package presss from both sides the inlayer and for latticed interlude simultaneously inside the protruding platform of heat dissipation, when graphite alkene package presss from both sides the inlayer and carries out the temperature diffusion, the protruding platform of heat dissipation extends to the outer top of cover protection, and when the protruding platform of heat dissipation and outside exchange were radiating this moment, the cover protection skin can prevent that external friction from taking place the damaged condition, has improved film self intensity, has improved insulating stability, has very high practicality.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation film, specifically a heat dissipation insulating film of portability electronic device.
Background
The current market-available portable electronic device, after long-term use, is locally overheated, which not only causes the performance degradation of the electronic device and the problem of the body being hot or crashed, but also only remains two ways of heat conduction and heat radiation because the current appearance of the portable electronic device requires too thin thickness and no space is reserved for the heat convection (using fan to obtain convection) in the traditional heat transfer method, and most of the current market-available portable electronic devices utilize high composite materials such as graphite flake and copper foil attached near the heat source to achieve the purpose of heat dissipation and cooling, and from the mass mobile phones of the brands such as charm, millet, Huashi, etc., there is no significant heat dissipation and cooling effect, and the local temperature is still high, which not only causes the phenomenon of performance degradation of the electronic device, the problem of the body being hot or crashed, even causes the touch temperature of the consumer to be too high and even scald the user, there are many complaints about consumer use.
Chinese patent discloses a heat-dissipating insulating film capable of carrying an electronic device, whose publication number is (CN 206585877U), and this patent technology can use a flexible thin layer of insulating elastic material or heat-conducting metal to match with a nano heat-dissipating coating or array compounded by a viscose and a heat-dissipating layer, so that a heat source is uniformly distributed on the whole heat-dissipating insulating film through the nano heat-dissipating coating or array, and the problem of local overheating of a housing is not caused. Accordingly, one skilled in the art provides a heat dissipating insulating film for a portable electronic device to solve the above-mentioned problems of the related art.
Disclosure of Invention
An object of the utility model is to provide a heat dissipation insulating film of portability electronic device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a heat dissipation insulating film capable of carrying an electronic device comprises an insulating heat conduction bottom layer and a covering protection outer layer, wherein the upper end face of the insulating heat conduction bottom layer is fixedly connected with a graphene cladding inner layer, the graphene cladding inner layer is positioned between the covering protection outer layer and the graphene cladding inner layer, the shape of the graphene cladding inner layer is in a grid shape, the upper end face of the covering protection outer layer is provided with a plurality of abdicating surrounding holes distributed in a matrix manner, the upper end face of the insulating heat conduction bottom layer is provided with a plurality of bottom filling holes corresponding to the abdicating surrounding holes, the upper end face of the insulating heat conduction bottom layer is fixedly connected with a plurality of heat dissipation lug bosses distributed in a matrix manner, the heat dissipation lug bosses are positioned inside the bottom filling holes, the graphene cladding inner layer is inserted inside the heat dissipation lug bosses, and the upper end face of the heat dissipation lug bosses penetrates through the abdicating surrounding holes to extend to the upper end face of the covering protection outer layer, the upper end surface of the heat dissipation boss protrudes from the upper end surface of the covering protection outer layer.
As a further aspect of the present invention: arc face of stepping down has all been seted up to the inner wall bottom surface corner in underfill hole.
As a further aspect of the present invention: the insulating heat conduction bottom layer and the heat dissipation boss are made of heat conduction insulating silica gel.
As a further aspect of the present invention: the thickness of the covering and protecting outer layer is equal to the depth of the bottom filling hole and less than the height of the heat dissipation boss.
As a further aspect of the present invention: the heat dissipation boss is cylindrical.
As a further aspect of the present invention: the diameter of the abduction enclosure hole is consistent with the diameter of the underfill hole.
As a further aspect of the present invention: the top of the side surface of the heat dissipation boss is provided with an arc-shaped guide surface.
Compared with the prior art, the beneficial effects of the utility model are that:
insulating heat conduction bottom at first with the source contact that generates heat, the heat transfer that will generate heat the source this moment is to insulating heat conduction bottom surface, graphite alkene package presss from both sides the inlayer with the quick scattering all around of temperature this moment, and then make the temperature diffusion homogenization, and graphite alkene package presss from both sides the inlayer and for latticed interlude simultaneously inside the protruding platform of heat dissipation, when graphite alkene package presss from both sides the inlayer and carries out the temperature diffusion, the protruding platform of heat dissipation extends to the outer top of cover protection, when the protruding platform of heat dissipation and outside exchange heat dissipation this moment, the cover protection skin can effectually prevent that external friction from taking place the damaged condition, guarantee the insulating nature of whole film, make whole film collection heat dissipation insulating integration, when having guaranteed the heat dissipation, film self intensity has been improved, the stability of insulating has been improved, has very high practicality.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic sectional view of the heat dissipating boss of the present invention after being disassembled;
fig. 4 is a schematic front view of the cross section of the present invention.
In the figure: 1. an insulating heat-conducting bottom layer; 11. bottom filling holes; 12. an arc abdicating surface; 2. covering a protective outer layer; 21. the abdicating surrounding hole; 3. the graphene sandwiches the inner layer; 4. a heat dissipation boss; 41. an arc-shaped guide surface.
Detailed Description
Referring to fig. 1-4, in an embodiment of the present invention, a heat dissipation insulating film for portable electronic device includes an insulating and heat conducting bottom layer 1 and a covering and protecting outer layer 2, a graphene sandwiching inner layer 3 is fixedly connected to an upper end surface of the insulating and heat conducting bottom layer 1, the graphene sandwiching inner layer 3 is located between the covering and protecting outer layer 2 and the graphene sandwiching inner layer 3, the graphene sandwiching inner layer 3 is in a grid shape, a plurality of matrix-distributed receding surrounding holes 21 are formed in an upper end surface of the covering and protecting outer layer 2, a plurality of bottom filling holes 11 corresponding to the receding surrounding holes 21 are formed in an upper end surface of the insulating and heat conducting bottom layer 1, a plurality of matrix-distributed heat dissipation bosses 4 are fixedly connected to an upper end surface of the insulating and heat conducting bottom layer 1, the heat dissipation bosses 4 are located inside the bottom filling holes 11, the graphene sandwiching inner layer 3 is inserted into the heat dissipation bosses 4, the upper end surface of the heat dissipation bosses 4 extends to the upper end surface of the covering and protecting outer layer 2 through the receding surrounding holes 21, the upper end face of the heat dissipation boss 4 protrudes from the upper end face of the covering protection outer layer 2; insulating heat conduction bottom 1 at first with generate heat the source contact, the heat transfer that will generate heat the source this moment is to insulating heat conduction bottom 1 surface, graphite alkene package presss from both sides inlayer 3 with the quick scattering all around of temperature this moment, and then make the temperature diffusion homogenization, and graphite alkene package presss from both sides inlayer 3 and alternates inside heat dissipation protruding platform 4 for latticed simultaneously, when graphite alkene package presss from both sides inlayer 3 and carries out temperature diffusion, heat dissipation protruding platform 4 extends to the top of covering protection skin 2, when heat dissipation protruding platform 4 and outside exchange heat dissipation this moment, covering protection skin 2 can effectually prevent that external friction from taking place the damaged condition, guarantee the insulating nature of whole film, make whole film collection heat dissipation insulating integration, when having guaranteed the heat dissipation, film self intensity has been improved, the stability of insulating has been improved, and has very high practicality.
In fig. 3: the diameter of the abdicating surrounding hole 21 is consistent with that of the bottom filling hole 11, the insulating heat-conducting bottom layer 1 and the heat-radiating boss 4 are both made of heat-conducting insulating silica gel, and arc abdicating surfaces 12 are arranged at corners of the bottom surface of the inner wall of the bottom filling hole 11; the heat dissipation boss 4 is formed after subsequent liquid glue filling and curing, and the arc-shaped receding surface 12 can enable viscous glue to be attached more fully.
In fig. 4: the thickness of the covering protective outer layer 2 is equal to the depth of the bottom filling hole 11 and is less than the height of the heat dissipation boss 4; the purpose is to make the side surface of the heat dissipation boss 4 contact with air, so as to increase the heat exchange area.
In fig. 4: the heat dissipation boss 4 is cylindrical; the periphery of the cylindrical heat dissipation boss 4 is smooth, so that the heat dissipation boss 4 is attached to the abdicating surrounding hole 21 more tightly.
In fig. 4: the top of the side surface of the heat dissipation boss 4 is provided with an arc-shaped guide surface 41; when receiving horizontal acting force, the arc-shaped guide surface 41 can decompose a part of acting force to enable the heat dissipation boss 4 to bear downward force under the guiding action of the inclined surface, so that the heat dissipation boss 4 is prevented from shaking and loosening.
The utility model discloses a theory of operation is: the insulating heat conduction bottom layer 1 is firstly contacted with a heating source, the heat of the heating source is transferred to the surface of the insulating heat conduction bottom layer 1, the graphene cladding inner layer 3 rapidly scatters the temperature to the periphery, the temperature diffusion is further homogenized, the heat dissipation boss 4 is formed after subsequent liquid glue filling solidification, the arc abdication surface 12 can enable viscous glue to be attached more firmly, the graphene cladding inner layer 3 is in a grid shape and is inserted into the heat dissipation boss 4, the heat dissipation boss 4 extends to the top of the covering protection outer layer 2 when the graphene cladding inner layer 3 conducts the temperature diffusion, the covering protection outer layer 2 can effectively prevent the damage condition caused by external friction when the heat dissipation boss 4 exchanges heat with the outside, the arc guide surface 41 can decompose a part of acting force to enable the heat dissipation boss 4 to be stressed downwards through the guide effect of the inclined surface when receiving horizontal acting force, prevent that heat dissipation bellying platform 4 from taking place to rock the not hard up condition, guarantee the insulating nature of whole film, make whole film collection heat dissipation insulating integration, when having guaranteed the heat dissipation, improved film self intensity, improved insulating stability, have very high practicality.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The heat dissipation insulating film capable of carrying an electronic device is characterized by comprising an insulating and heat conducting bottom layer (1) and a covering and protecting outer layer (2), wherein the upper end face of the insulating and heat conducting bottom layer (1) is fixedly connected with a graphene cladding inner layer (3), and the graphene cladding inner layer (3) is positioned between the covering and protecting outer layer (2) and the graphene cladding inner layer (3);
the graphene inclusion inner layer (3) is in a grid shape, a plurality of abdicating surrounding holes (21) distributed in a matrix are formed in the upper end face of the covering and protecting outer layer (2), the upper end surface of the insulating heat-conducting bottom layer (1) is provided with a plurality of bottom filling holes (11) corresponding to the abdicating surrounding holes (21), the upper end surface of the insulating heat-conducting bottom layer (1) is fixedly connected with a plurality of heat-radiating lug bosses (4) distributed in a matrix, the heat dissipation boss (4) is positioned inside the bottom filling hole (11), the graphene cladding inner layer (3) is inserted inside the heat dissipation boss (4), the upper end surface of the heat dissipation boss (4) penetrates through the abdication surrounding hole (21) and extends to the upper end surface of the covering protection outer layer (2), the upper end face of the heat dissipation boss (4) protrudes out of the upper end face of the covering protection outer layer (2).
2. The heat dissipating insulation film for a portable electronic device as defined in claim 1, wherein the corners of the bottom surface of the inner wall of the underfill hole (11) are provided with curved relief surfaces (12).
3. A heat-dissipating insulation film for a portable electronic device as defined in claim 1, wherein the insulating and heat-conducting bottom layer (1) and the heat-dissipating raised platform (4) are made of heat-conducting and insulating silicone.
4. A heat dissipating insulation film for a portable electronic device as defined in claim 1 wherein the thickness of the cover protective outer layer (2) is less than the depth of the underfill hole (11) and less than the height of the heat dissipating raised platform (4).
5. A heat dissipating insulation film for a portable electronic device as defined in claim 1 wherein the heat dissipating boss (4) is cylindrical in shape.
6. A heat dissipating insulation film for a portable electronic device as defined in claim 1 wherein the diameter of the relief surrounding hole (21) is the same as the diameter of the underfill hole (11).
7. A heat-dissipating insulation film for a portable electronic device as defined in claim 1, wherein the top of the side of the heat-dissipating raised table (4) is formed with an arc-shaped guide surface (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120482649.7U CN214708436U (en) | 2021-03-07 | 2021-03-07 | Heat dissipation insulating film capable of carrying electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120482649.7U CN214708436U (en) | 2021-03-07 | 2021-03-07 | Heat dissipation insulating film capable of carrying electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214708436U true CN214708436U (en) | 2021-11-12 |
Family
ID=78569765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120482649.7U Expired - Fee Related CN214708436U (en) | 2021-03-07 | 2021-03-07 | Heat dissipation insulating film capable of carrying electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214708436U (en) |
-
2021
- 2021-03-07 CN CN202120482649.7U patent/CN214708436U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211112 |