WO2016165252A1 - 一种背光模组及显示装置 - Google Patents

一种背光模组及显示装置 Download PDF

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Publication number
WO2016165252A1
WO2016165252A1 PCT/CN2015/087496 CN2015087496W WO2016165252A1 WO 2016165252 A1 WO2016165252 A1 WO 2016165252A1 CN 2015087496 W CN2015087496 W CN 2015087496W WO 2016165252 A1 WO2016165252 A1 WO 2016165252A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
light source
backlight module
layer
source assembly
Prior art date
Application number
PCT/CN2015/087496
Other languages
English (en)
French (fr)
Inventor
李文波
马永达
朱琳
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/913,324 priority Critical patent/US9939142B2/en
Publication of WO2016165252A1 publication Critical patent/WO2016165252A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a backlight module and a display device.
  • the size of display devices is diversified, functions are diversified, integrated, and intelligent, etc., and the heat generated by the display devices is also greatly increased due to an increase in the configuration and functions of the display devices.
  • an LCD Liquid Crystal Display
  • the light source assembly includes a carrier and a light emitting diode (Light Emitting Diode) disposed on the carrier. , hereinafter referred to as LED light), the carrier is in contact with the back plate in the backlight module, and the heat generated by the LED lamp is transmitted to the back plate through the carrier, and the heat is dissipated through the back plate.
  • LED light Light Emitting Diode
  • the local position of the carrier corresponding to the position of the LED lamp is higher than that of the back plate, so that the local position of the carrier and the back plate corresponding to the position of the LED lamp is dissipated slowly, resulting in poor heat dissipation of the display device as a whole. , which in turn affects the display performance of the display device.
  • An object of the present invention is to provide a backlight module and a display device for improving the heat dissipation effect of the display device as a whole and ensuring the display performance of the display device.
  • the present invention provides the following technical solutions:
  • an embodiment of the present invention provides a backlight module including a backplane, a light source assembly fixed to the backplane, and a first heat dissipation disposed in an overlapping area of the backplane and the light source assembly.
  • a backlight module including a backplane, a light source assembly fixed to the backplane, and a first heat dissipation disposed in an overlapping area of the backplane and the light source assembly.
  • the backing plate includes a support plate
  • the overlapping region may be a region where the support plate overlaps with a position of the light source assembly or a region where the support plate and the projection of the light source assembly overlap.
  • the backing plate includes a support plate and a side edge connected to the support plate, and the overlapping area may be an area where the side edge overlaps with a position of the light source assembly or the side An area where the edge overlaps the projection of the light source assembly.
  • first heat dissipation layer is located above the light source assembly, and the back plate A second heat dissipation layer is disposed between the light source assembly; or the first heat dissipation layer is disposed under the light source assembly, and the second heat dissipation layer is disposed above the light source assembly.
  • first heat dissipation layer is connected to the second heat dissipation layer.
  • a side of the back plate facing the light source assembly has a groove, and a side of the back plate facing the light source assembly is provided with a leveling layer for covering the groove.
  • first heat dissipation layer is located between the back plate and the light source component, and the first heat dissipation layer and the leveling layer may be a unitary structure.
  • the leveling layer includes a plurality of leveling blocks, each of the leveling blocks correspondingly covering at least one of the grooves.
  • the leveling layer includes a flat portion covering the groove, and a filling portion connected to the flat portion for filling the groove.
  • At least one surface of the first heat dissipation layer is provided with a glue layer.
  • the first heat dissipation layer is a light absorbing material layer.
  • the first heat dissipation layer is a carbon black material layer or a graphene material layer.
  • an embodiment of the present invention further provides a display device including a display panel and the backlight module described in the above technical solution.
  • a first heat dissipation layer is disposed in an overlapping area of the back plate and the light source assembly, and the high heat generated by the LED lamp is transmitted to the first heat dissipation layer corresponding to the LED lamp.
  • the local heat dissipation layer has a good thermal conductivity, so that the first heat dissipation layer rapidly conducts the heat received at the local position to the entire first heat dissipation layer, and the heat distribution on the first heat dissipation layer is uniform, which is related to the background art.
  • the heat dissipation area of the heat transmitted to the local position is increased, and the first heat dissipation layer dissipates the evenly distributed heat to avoid the phenomenon that the heat dissipation of the local position is slow, so that the heat generated by the LED lamp can be uniform. Quickly dissipate, improve the overall heat dissipation of the display device, and thus ensure the display performance of the display device.
  • FIG. 1 is a schematic structural view of a backlight module according to an embodiment of the present invention.
  • 1a is a schematic diagram of an overlapping region in a backlight module according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a backlight module according to another embodiment of the present invention.
  • FIG. 2a is a schematic structural view of a backlight module according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a backlight module according to another embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a backlight module according to another embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a backlight module according to another embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a first heat dissipation layer and a second heat dissipation layer in a backlight module according to another embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a backlight module according to still another embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a backlight module according to still another embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a backlight module according to still another embodiment of the present invention.
  • FIG. 10 is a schematic view showing a positional relationship between a leveling block and a groove according to still another embodiment of the present invention.
  • FIG. 11 is a schematic structural view of a leveling layer according to still another embodiment of the present invention.
  • FIG. 12 is a schematic structural diagram of a display device according to still another embodiment of the present invention.
  • a backlight module includes a backplane 10 and a light source assembly 11 fixed to the backplane 10.
  • the light source assembly 11 can be fixed by a structure such as a screw, a glue layer or a via.
  • the backing plate 10 includes a support plate 101 and side edges 102. Generally, the side 102 is formed by rolling up the edge of the support plate; the back plate 10 is made of metal having a certain hardness and rigidity and good thermal conductivity, and can be used for accommodating a backlight assembly, such as the light source assembly 11 and the optical film. Wait.
  • the light source assembly 11 may specifically include a carrier 13 and be disposed on the carrier
  • the backlight module further includes a first heat dissipation layer 12 disposed in a portion of the overlap region of the back panel 10 and the light source assembly 11, that is, the first heat dissipation layer 12 may be disposed in a partially overlapping region, or may be disposed in the entire overlap.
  • the region; wherein the overlapping region is a region where the backing plate 10 overlaps with the position of the light source assembly 11, or a region where the backing plate 10 overlaps with the projection of the light source assembly 11.
  • the overlapping area of the backplane 10 and the light source assembly 11 may be a space enclosed by a broken line in FIG. 1a.
  • the setting of the overlapping area includes but is not limited to the following two modes:
  • the overlap region may be an area where the support plate 101 of the backboard 10 overlaps with the position of the light source assembly, or a region where the support plate 101 and the projection of the light source assembly overlap.
  • the overlap region can be above or below the light source assembly.
  • the overlapping region When the overlapping region is located under the light source assembly, it may be located between the back plate and the light source assembly.
  • the first heat dissipation layer 12 is located between the back plate and the light source assembly, or, as shown in FIG.
  • the first heat dissipation layer 12 is located above the light source assembly.
  • the overlapping area may also be an area where the side 102 of the backboard 10 overlaps with the position of the light source component, or an area where the side 102 overlaps with the projection of the light source component, for example, as shown in FIG. 2a, the first heat dissipation.
  • Layer 12 is located between side 102 of backing plate 10 and carrier 13.
  • the first heat dissipation layer 12 has good thermal conductivity.
  • the heat dissipation coefficient of the first heat dissipation layer 12 is greater than the heat conduction coefficient of the back plate 10, so that the first heat dissipation layer 12 has a certain local position. The heat is quickly conducted to the entire first heat dissipation layer 12.
  • a heat conducting layer may be disposed between the carrier 13 of the light source assembly 11 and the backing plate 10.
  • the heat conducting layer may be different from the material of the carrier 13 of the light source assembly 11, or may be integrated with the carrier 13 of the light source assembly 11. structure.
  • the first heat dissipation layer 12 and the carrier 13 of the light source assembly 11 may be made of different materials.
  • the first heat dissipation layer 12 may be a light absorbing material layer such as a black material layer or other dark material layer.
  • the first heat dissipation layer 12 may be a carbon black material layer or a graphene material layer, and the carbon black material layer or the graphene material layer has excellent thermal conductivity.
  • the backlight module may further include a plurality of optical films, such as a reflector, a light guide plate, a diffusion plate, a prism film, a diffusion sheet, etc., and the application technology of the optical film in the backlight module is relatively mature.
  • the specific arrangement of the optical film in the backlight module in the embodiment of the present invention is not described herein again.
  • the back panel 10 and the light source assembly 11 The first heat dissipation layer 12 is disposed in the overlap region, and the first heat dissipation layer 12 has good thermal conductivity.
  • the high heat generated by the LED lamp 14 can be transmitted to a local position of the first heat dissipation layer 12 corresponding to the LED lamp 14.
  • the layer 12 rapidly conducts the heat received at the local position to the entire first heat dissipation layer 12, so that the heat on the first heat dissipation layer 12 is evenly distributed, and the conduction to the local position is increased as compared with the backlight module proposed in the background art.
  • the heat dissipation area of the heat dissipation layer 12 dissipates the evenly distributed heat to avoid the phenomenon that the heat dissipation of the local position is slow, so that the heat generated by the LED lamp 14 can be uniformly and quickly dissipated, thereby improving the overall heat dissipation of the display device.
  • the effect ensures the display performance of the display device.
  • the light source assembly 11 of the side-entry backlight module includes a carrier 13 and a plurality of vertically disposed one side of the carrier 13.
  • LED light 14 please refer to FIG. 3, the overlapping region may be located under the light source assembly 11, and a first heat dissipation layer 12 may be disposed above the back plate 10.
  • the first heat dissipation layer 12 may be a light absorbing material layer, such as a black material layer or Other dark material layers, for example, the first heat dissipation layer 12 may be a carbon black material layer or a graphene material layer, and the carbon black material layer or the graphene material layer has excellent thermal conductivity.
  • a carrier 13 may be disposed above the first heat dissipation layer 12, and a plurality of LED lamps 14 are vertically disposed on one side of the carrier 13.
  • the carrier 13 may be a metal material plate with better thermal conductivity, such as an aluminum plate, and the side of the carrier 13 is further
  • a drive circuit board for driving the LED lamps may be provided.
  • the heat generated by the plurality of LED lamps 14 disposed on one side of the carrier 13 is conducted to the first heat dissipation layer 12 through the carrier 13, and the heat in the first heat dissipation layer 12 is uniformly distributed, and is dissipated through the back plate 10, thereby accelerating the heat dissipation speed, thereby further Improve the overall heat dissipation of the display device.
  • the overlapping region may be located above the light source assembly, and a carrier 13 is disposed above the backing plate.
  • One side of the carrier 13 is vertically disposed with a plurality of LED lamps 14 above the plurality of LED lamps 14.
  • the first heat dissipation layer 12 is disposed, and the first heat dissipation layer 12 located above the LED lamp 14 can uniformly conduct heat emitted from the plurality of LED lamps 14 to the entire first heat dissipation layer 12, thereby dissipating heat quickly and uniformly.
  • the structure of the side-entry backlight module is described in detail by taking the overlapping area below or above the light source component. Similarly, when the overlapping area is at other positions, for example, the overlapping area is located at the side of the backing plate and the light source assembly. For the case of the case, the structure can be applied to the side-in backlight module. The structure can be referred to FIG. 2a, and details are not described herein again.
  • At least one surface of the first heat dissipation layer 12 is provided with a glue layer, for example, the first heat dissipation layer 12 is located on the back plate 10 and the light source assembly.
  • the first contact surface of the bottom surface is provided with a glue layer
  • the second heat contact layer 12 faces the second contact surface of the light source assembly 11 to provide a glue layer
  • the glue layer can close the first heat dissipation layer 12 and the bottom surface of the back plate 10 Bonding, or bonding the first heat dissipation layer 12 to the carrier 13 or other structure in the light source assembly 11, and the above-mentioned rubber layer has better thermal conductivity and can better conduct heat.
  • the structure of the first heat dissipation layer 12 and the upper and lower portions may be connected by a structure such as a screw or a via hole, and the connection manner of the first heat dissipation layer 12 with other structures is not limited herein.
  • a heat dissipation layer may be disposed above and below the light source assembly 11.
  • the first heat dissipation layer 12 is located above the light source assembly 11, and the first plate 10 and the light source assembly 11 are disposed.
  • the following is a description of the case where the overlapping region is located between the backplane 10 and the light source assembly 11. Referring to FIG.
  • a first heat dissipation layer 12 is disposed above the back panel 10, and the carrier 13 and the LED are disposed above the first heat dissipation layer 12.
  • the lamp 14 may further be provided with a second heat dissipation layer 19 above the LED lamp 14.
  • the second heat dissipation layer 19 is similar to the first heat dissipation layer 12, and the second heat dissipation layer 19 may be a light absorbing material layer, such as a black material layer or other dark material.
  • the second heat dissipation layer 19 may specifically be a carbon black material layer or a graphene material layer.
  • the second heat dissipation layer 19 can also reduce or avoid light leakage of the display device and ensure the flatness above the LED lamp 14.
  • the first heat dissipation layer 12 and the second heat dissipation layer 19 may be connected in order to dissipate heat generated by the LED lamp 14 more quickly and uniformly.
  • the second heat dissipation layer 19 can extend and bypass the LED lamp 14 and the carrier 13 and be in contact with the first heat dissipation layer 12, thereby causing heat in the first heat dissipation layer 12 and the second heat dissipation layer 19. They can conduct to each other, increasing the area of heat conduction to facilitate faster dissipation of heat from the display device.
  • the method of connecting the first heat dissipation layer 12 and the second heat dissipation layer 19 is not limited to the above, and is not limited thereto.
  • the light source assembly of the direct-lit backlight module may include a carrier and a plurality of LED lamps arranged in an array on the carrier. Referring to FIG. 7 , the overlapping area is located below the light source assembly 11 , and the first heat dissipation layer 12 is disposed above the back plate 10 , and the reflection plate 20 is disposed above the first heat dissipation layer 12 .
  • the carrier 13 is disposed above the reflection plate 20 .
  • a plurality of LED lamps 14 arranged in an array are provided, and the carrier 13 may be a plate of a metal material having a good thermal conductivity, such as an aluminum plate.
  • the heat dissipation effect is lower under the reflector 20, and the heat generated by the LED lamp 14 and the heat generated by the reflector 20 are transmitted to the first heat dissipation layer 12, and the first heat dissipation layer
  • the heat in 12 is evenly distributed, and is quickly dissipated through the back plate 10, thereby accelerating the heat dissipation speed, thereby improving the overall heat dissipation effect of the display device.
  • the overlapping region is located above the light source assembly, similar to the case where the overlapping region of the side-entry backlight module is located above the light source assembly in the above embodiment, and reference may be made to the above. The specific description of the embodiments will not be repeated here.
  • a heat dissipation layer may be disposed above and below the light source assembly 11, and the specific arrangement may be similar to the previous embodiment.
  • the following is a description of the case where the first heat dissipation layer 12 is located between the back plate 10 and the light source assembly 11. Referring to FIG. 8, a first heat dissipation layer 12 is disposed above the back plate 10, and a reflection plate 20 is disposed above the first heat dissipation layer 12.
  • a carrier 13 and an LED lamp 14 are disposed above the reflector 20, and a second heat dissipation layer 19 may be disposed above the LED lamp 14.
  • the first heat dissipation layer 12 may be connected to the second heat dissipation layer 19, and the first heat dissipation layer 12, the second heat dissipation layer 19, and the first heat dissipation layer 12 and the second heat dissipation layer 19 are connected.
  • the embodiment is not described here.
  • the first heat dissipation layer may be located between the back plate 10 and the light source assembly 11, and one side of the back plate 10 may be provided with a plurality of protrusions for mounting the driving circuit board or the wall mounting support, and the protrusions
  • one side of the back plate 10 may be provided with a plurality of protrusions for mounting the driving circuit board or the wall mounting support, and the protrusions
  • the flatness requirement of the surface of the structure with which the light source component 11 is in contact may be high, and in order to meet the requirements for the above flatness, as shown in FIG. 9, the side of the backboard facing the light source component may be disposed.
  • the screed layer 21 covers the groove so that the surface in contact with the light source assembly 11 is flat.
  • the screed layer 21 may be disposed between the first heat dissipation layer 12 and the back plate 10, and the first heat dissipation layer 12 may be in contact with the leveling layer 21, or another structure may be disposed between the first heat dissipation layer 12 and the leveling layer 21.
  • the relative positional relationship between the first heat dissipation layer 12 and the leveling layer 21 is not limited herein.
  • the screed layer 21 may also have better thermal conductivity and be capable of conducting the received heat to the backing plate 10 to dissipate heat from the backing plate 10.
  • the leveling layer 21 may cover the entire surface of the backing plate 10 facing the light source assembly 11, thereby maximally ensuring the flatness of the surface in contact with the light source assembly 11.
  • the screed 21 includes a plurality of leveling blocks, each leveling block correspondingly covering at least one groove.
  • the area of the leveling layer 21 can be reduced, and the material for the screed layer 21 can be saved, thereby saving the manufacturing cost of the backlight module in the embodiment of the present invention.
  • the first heat dissipation layer 12 and the leveling layer 21 may be an integrated structure.
  • the first heat dissipation layer 12 may be used as the screed layer 21 At the same time, it achieves fast, uniform heat dissipation and improved flatness.
  • the leveling layer 21 is damaged.
  • the structure of the leveling layer 21 may further include a flat portion 17 covering the groove 15 and A filling portion 18 for filling the groove 15 is connected to the flat portion 17.
  • an embodiment of the present invention further provides a display device including a display panel 22 and a backlight module 23 in the above embodiment.
  • the backlight module 23 in the display device is in the above embodiment.
  • the backlight module 23 has the same advantages and will not be described again here. Since the heat distribution on the first heat dissipation layer is uniform, the phenomenon that the heat dissipation at the local position is slow is avoided, thereby improving the heat dissipation effect of the entire display device and ensuring the display performance of the display device.
  • the display device may be any product or component having a display function, such as a liquid crystal display panel, an electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a liquid crystal display panel, an electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.

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  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

一种背光模组（23）及显示装置。所述背光模组（23）包括背板（10），固定于背板（10）的光源组件（11），至少在部分背板（10）和光源组件（11）的交叠区域设有第一散热层（12）。所述显示装置包括显示面板（22）和上述背光模组（23）。

Description

一种背光模组及显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种背光模组及显示装置。
背景技术
随着显示技术的发展，显示装置的尺寸多样化，功能多样化、集成化和智能化等也日趋明显，由于显示装置的配置和功能等增加，相应的，显示装置产生的热量也大量增加。
例如，LCD(Liquid Crystal Display，液晶显示器)作为显示装置的一种，其热量主要来源于背光模组中光源组件产生的热量，光源组件包括载体和设置在载体上的发光二极管灯(Light Emitting Diode，以下简称LED灯)，载体与背光模组中的背板接触，LED灯产生的热量通过载体传导给背板，通过背板将热量散出。而与LED灯的位置对应的载体与背板接触的局部位置热量较高，从而使得与LED灯的位置对应的载体与背板接触的局部位置散热较慢，导致显示装置整体的散热效果较差，进而影响显示装置的显示性能。
发明内容
本发明的目的在于提供一种背光模组及显示装置，用于提高显示装置整体的散热效果，保证显示装置的显示性能。
为了实现上述目的，本发明提供如下技术方案：
一方面，本发明的实施例提供了一种背光模组，包括背板，固定于所述背板的光源组件，设置在所述背板和所述光源组件的交叠区域中的第一散热层。
在一个实施例中，背板包括支撑板，所述交叠区域可以是所述支撑板与所述光源组件的位置重叠的区域或者所述支撑板和所述光源组件的投影相重叠的区域。
在另一实施例中，所述背板包括支撑板以及与所述支撑板连接的侧边，所述交叠区域可以是所述侧边与所述光源组件的位置重叠的区域或者所述侧边和所述光源组件的投影相重叠的区域。
进一步地，所述第一散热层位于所述光源组件的上方，所述背板 与所述光源组件之间设有第二散热层；或者，所述第一散热层位于所述光源组件下方，所述光源组件上方设有第二散热层。
进一步地，所述第一散热层与所述第二散热层连接。
进一步地，所述背板面向所述光源组件的一面具有凹槽，所述背板面向所述光源组件的一面上设有用于遮盖所述凹槽的找平层。
进一步地，所述第一散热层位于所述背板与所述光源组件之间，所述第一散热层与所述找平层可以是一体结构。
进一步地，所述找平层包括多个找平块，每个所述找平块对应遮盖至少一个所述凹槽。
进一步地，所述找平层包括遮盖所述凹槽的平整部，以及与所述平整部连接用于填充所述凹槽的填充部。
进一步地，所述第一散热层的至少一个表面上设置有胶层。
进一步地，所述第一散热层为吸光材料层。
进一步地，所述第一散热层为碳黑材料层或石墨烯材料层。
另一方面，本发明的实施例还提供了一种显示装置，包括显示面板和上述技术方案中所述的背光模组。
对于本发明实施例所提供的背光模组和显示装置，在背板和光源组件的交叠区域设有第一散热层，LED灯产生的高热量传导至与LED灯对应的第一散热层的局部位置，第一散热层具有良好的导热性，使得第一散热层将局部位置接收到的热量快速传导至整个第一散热层，第一散热层上的热量分布均匀，与背景技术所提的背光模组相比，增大了传导到局部位置的热量的散热面积，第一散热层将均匀分布的热量散出，避免出现局部位置散热较慢的现象，使得LED灯产生的热量可以均匀、快速的散出，提高显示装置整体的散热效果，进而保证显示装置的显示性能。
附图说明
此处所说明的附图用来提供对本发明实施例的进一步理解，构成本发明的实施例的说明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1为本发明的一个实施例的背光模组的结构示意；
图1a为本发明的一个实施例的背光模组中交叠区域的示意图；
图2为本发明另一实施例的背光模组的结构示意图；
图2a为本发明另一实施例的背光模组的结构示意图；
图3为本发明另一实施例的背光模组的结构示意图；
图4为本发明另一实施例的背光模组的结构示意图；
图5为本发明另一实施例的背光模组的结构示意图；
图6为本发明另一实施例中的背光模组中的第一散热层与第二散热层连接的示意图；
图7为本发明又一实施例的背光模组的结构示意图；
图8为本发明又一实施例的背光模组的结构示意图；
图9为本发明又一实施例的背光模组的结构示意图；
图10为本发明又一实施例的找平块与凹槽的位置关系示意图；
图11为本发明又一实施例的找平层的结构示意图；
图12为本发明又一实施例的显示装置的结构示意图。
附图标记：
10-背板，                    101-支撑板，
102-侧边，                   11-光源组件，
12-第一散热层，              13-载体，
14-LED灯，                   15-凹槽，
16-找平块，                  17-平整部，
18-填充部，                  19-第二散热层，
20-反射板                    21-找平层，
22-显示面板，                23-背光模组。
具体实施方式
为了进一步说明本发明实施例提供的背光模组及显示装置，下面结合说明书附图进行详细描述。
请参阅图1和图2a，本发明实施例提供的背光模组包括背板10和固定于背板10的光源组件11，其中，光源组件11可以通过螺钉、胶层或过孔等结构固定于背板10，背板10包括支撑板101以及侧边102。通常，侧边102是支撑板边沿卷起而形成；背板10由具有一定硬度及刚度，且导热性较好的金属制成，可以用于容置背光组件，比如光源组件11、光学膜片等。光源组件11具体可以包括载体13和设置在载 体13上的LED灯14，其中，载体13主要用于设置LED灯，载体13可以为陶瓷材料、金属材料或合金材料等，例如具体可以为铝或铜。上述背光模组还包括设置在背板10和光源组件11的交叠区域的一部分中的第一散热层12，即第一散热层12可以设于部分交叠区域，也可以设于整个交叠区域；其中，交叠区域为背板10与光源组件11的位置重叠的区域，或背板10与光源组件11的投影相重叠的区域。例如，如图1a所示，背板10与光源组件11的交叠区域可以为图1a中虚线围成的空间，具体的，交叠区域的设置包括但不限于下述两种方式：方式一、交叠区域可以为背板10的支撑板101与光源组件的位置重叠，或支撑板101和光源组件的投影相重叠的区域。比如：交叠区域可以位于光源组件上方或下方。交叠区域位于光源组件下方时，其可位于背板和光源组件之间，例如，如图1所示，第一散热层12位于背板与光源组件之间，或者，如图2所示，第一散热层12位于光源组件上方。方式二、交叠区域还可以为背板10的侧边102与光源组件的位置重叠的区域，或侧边102和光源组件的投影相重叠的区域，例如：如图2a所示，第一散热层12位于背板10的侧边102与载体13之间。
为了便于背光模组均匀、快速的散热，第一散热层12具有良好的导热性，例如：第一散热层12的热传导系数大于背板10的热传导系数，使得第一散热层12某一局部位置的热量快速的传导至整个第一散热层12。
在另一实施例中，光源组件11的载体13与背板10之间还可以设有导热层，导热层可以与光源组件11的载体13材质不同，也可以与光源组件11的载体13是一体结构。
在实施例中，第一散热层12与光源组件11的载体13材质可以不同。第一散热层12可以为吸光材料层，比如黑色材料层或其他深色材料层。或者，第一散热层12可以为碳黑材料层或石墨烯材料层，碳黑材料层或石墨烯材料层均具有优良的导热性。
需要说明的是，背光模组中还可以包括多种光学膜片，比如反射板、导光板、扩散板、棱镜膜、扩散片等，光学膜片在背光模组中的应用技术已经较为成熟，本发明实施例中的背光模组中的光学膜片的具体设置方式在此不再赘述。
在本发明实施例提供的背光模组中，在背板10和光源组件11的 交叠区域设有第一散热层12，第一散热层12具有良好的导热性，LED灯14产生的高热量可以传导至与LED灯14对应的第一散热层12的局部位置，第一散热层12将局部位置接收到的热量快速传导至整个第一散热层12，使得第一散热层12上的热量均匀分布，与背景技术所提的背光模组相比，增大了传导到局部位置的热量的散热面积，第一散热层12将均匀分布的热量散出，避免出现局部位置散热较慢的现象，使得LED灯14产生的热量可以均匀、快速的散出，提高显示装置整体的散热效果，进而保证显示装置的显示性能。
下面将以侧入式背光模组为例，介绍本发明实施例的一种具体应用，侧入式背光模组的光源组件11包括载体13，以及在载体13的一侧竖直设置的多个LED灯14，请参阅图3，所述交叠区域可位于光源组件11下方，在背板10上方设置有第一散热层12，第一散热层12可以为吸光材料层，比如黑色材料层或其他深色材料层，例如，第一散热层12可以为碳黑材料层或石墨烯材料层，碳黑材料层或石墨烯材料层均具有优良的导热性。这样，可减少或避免背光模组漏光。第一散热层12上方还可设置有载体13，载体13的一侧竖直设置有多个LED灯14，载体13可以为导热性较好的金属材料板，比如铝板，载体13的侧边还可设有用于驱动LED灯的驱动电路板。载体13的一侧设置的多个LED灯14产生的热量通过载体13传导至第一散热层12，第一散热层12中的热量均匀分布，通过背板10散出，从而加快散热速度，进而提高显示装置的整体散热效果。或者，请参阅图4，所述交叠区域可位于光源组件的上方，在背板上方设置有载体13，载体13的一侧竖直设置有多个LED灯14，在多个LED灯14上方设置第一散热层12，位于LED灯14上方的第一散热层12能够将多个LED灯14发出的热量均匀的传导至整个第一散热层12中，从而快速、均匀的将热量散出。上面以交叠区域位于光源组件下方或上方为例，详细说明了侧入式背光模组的结构，同理，交叠区域位于其他位置时，如交叠区域位于背板的侧边与光源组件之间等情况，均可适用于侧入式背光模组，其结构可参考图2a，在此不再赘述。
需要说明的是，为了便于第一散热层12与上方以及下方的结构连接牢固，第一散热层12的至少一个表面上设有胶层，比如：第一散热层12位于背板10与光源组件11之间，第一散热层12面向背板10的 底面的第一接触面上设有胶层，以及第一散热层12面向光源组件11的第二接触面上设有胶层，上述胶层能够将第一散热层12与背板10的底面紧密粘接，或将第一散热层12与光源组件11中的载体13或其他结构紧密粘接，且上述胶层具有较好的导热性，能够较好的传导热量。也可以采用螺钉或过孔等结构来连接第一散热层12与上方以及下方的结构，在此并不限定第一散热层12与其他结构的连接方式。
为了进一步提高显示装置整体的散热效果，可以在光源组件11的上方和下方均设置散热层，比如，第一散热层12位于光源组件11的上方，背板10与光源组件11之间设有第二散热层；或者，第一散热层12位于光源组件11下方，光源组件11上方设有第二散热层。下面以交叠区域位于背板10与光源组件11之间的情况进行说明，请参阅图5，在背板10上方设置有第一散热层12，第一散热层12上方设有载体13和LED灯14，还可以在LED灯14上方设置第二散热层19，第二散热层19与第一散热层12类似，第二散热层19可为吸光材料层，比如黑色材料层或其他深色材料层，第二散热层19具体可以为碳黑材料层或石墨烯材料层。该第二散热层19还能够减少或避免显示装置出现漏光现象，并且能保证LED灯14上方的平整度。
在实施例中，为了能够更加快速、均匀的将LED灯14产生的热量散出，可将第一散热层12与第二散热层19连接。例如，请参阅图6，第二散热层19可延伸并绕过LED灯14和载体13，并与第一散热层12相接，从而使得第一散热层12和第二散热层19中的热量可以相互传导，增大热量传导的面积，以便于更快速的将显示装置中的热量散出。第一散热层12与第二散热层19之间的连接方法并不限于上述方式，在此并不限定。
下面将以直下式背光模组为例，介绍本发明实施例的具体应用，直下式背光模组的光源组件可包括载体，以及在载体上呈阵列排布的多个LED灯。请参阅图7，交叠区域位于光源组件11下方，在背板10上方设置有第一散热层12，第一散热层12上方设置反射板20，反射板20上方设有载体13，载体13上设置有呈阵列排布的多个LED灯14，载体13可以为导热性较好的金属材料板，比如铝板。对于直下式背光模组来说，反射板20下方对散热效果的要求更高，LED灯14产生的热量和反射板20产生的热量传导至第一散热层12，第一散热层 12中的热量均匀分布，通过背板10快速散出，从而加快散热速度，进而提高显示装置的整体散热效果。此外，在直下式背光模组中，所述交叠区域位于光源组件的上方的情况，与上述实施例中侧入式背光模组中交叠区域位于光源组件的上方的情况相似，可参照上述实施例的具体说明，在此不再赘述。
与之前的实施例类似，为了进一步提高显示装置整体的散热效果，也可以在光源组件11的上方和下方均设置散热层，具体设置方式可以与之前实施例相似。下面以第一散热层12位于背板10与光源组件11之间的情况进行说明，请参阅图8，在背板10上方设置有第一散热层12，第一散热层12上方设置反射板20，反射板20上方设有载体13和LED灯14，还可以在LED灯14上方设置第二散热层19。在实施例中，第一散热层12可以与第二散热层19相连接，第一散热层12、第二散热层19及第一散热层12与第二散热层19连接的相关说明请参照之前的实施例，在此不再赘述。
在背光模组中，第一散热层可位于背板10与光源组件11之间，背板10的一面可设置有多个用于安装驱动电路板或壁挂支撑件的凸起，与凸起相对应，在与背板10的这一面的相对的面上，即背板10面向光源组件11的面上可具有凹槽，该凹槽可以是与前述的凸起一起形成的。在该情形中，光源组件11对与其接触的结构的表面的平整度要求可能较高，为了满足对上述平整度的要求，如图9所示，在背板面向光源组件的一面上可设置用于遮盖凹槽的找平层21，找平层21遮盖上述凹槽，使得与光源组件11接触的面平整度较高。找平层21可以设于第一散热层12与背板10之间，第一散热层12可以与找平层21接触，或者，也可以在第一散热层12与找平层21之间设置其他结构，第一散热层12与找平层21之间的相对位置关系在此并不限定。在实施例中，找平层21也可具有较好的导热性，能够将接收到的热量传导给背板10，从而将热量从背板10散出。在实施例中，找平层21可以遮盖背板10面向光源组件11的整个面，从而最大限度的保证与光源组件11接触的面的平整度。或者，找平层21包括多个找平块，每个找平块对应覆盖至少一个凹槽。例如，请参考图10，在背板面向光源组件11的面上可具有5个凹槽15，找平层21包括5块找平块16，每个找平块16对应覆盖一个凹槽15，这样，在保证与光源组件11接触 的面的平整度的基础上，可减小找平层21的面积，节省制作找平层21的材料，从而节省本发明实施例中背光模组的制作成本。
需要说明的是，为了进一步节省制作找平层21和第一散热层12的材料，第一散热层12与找平层21可以是一体的结构，比如，第一散热层12可以复用作找平层21，同时实现快速、均匀散热和提升平整度的效果。
为了防止背板10的底面上方的结构重量较重，导致找平层21破损，如图11所示，在另一实施例中，找平层21的结构还可以包括遮盖凹槽15的平整部17和与平整部17连接用于填充凹槽15的填充部18。
请参阅图12，本发明实施例还提供了一种显示装置，该显示装置包括显示面板22和上述实施例中的背光模组23，所述显示装置中的背光模组23与上述实施例中的背光模组23具有的优势相同，此处不再赘述。由于第一散热层上的热量分布均匀，避免了局部位置散热较慢的现象的出现，因此，提高了显示装置整体的散热效果，保证了显示装置的显示性能。具体的，该显示装置可以为：液晶显示面板、电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
在上述实施方式的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种背光模组，包括：
    背板，
    固定于所述背板的光源组件，以及
    设置在所述背板和所述光源组件的交叠区域中的第一散热层。
  2. 如权利要求1所述的背光模组，其中，所述背板包括支撑板，所述交叠区域是所述支撑板与所述光源组件的位置重叠的区域或者所述支撑板和所述光源组件的投影相重叠的区域。
  3. 如权利要求1所述的背光模组，其中所述背板包括支撑板以及与所述支撑板连接的侧边，所述交叠区域是所述侧边与所述光源组件的位置重叠的区域或者所述侧边和所述光源组件的投影相重叠的区域。
  4. 根据权利要求2所述的背光模组，其中所述第一散热层位于所述光源组件的上方，所述背板与所述光源组件之间设有第二散热层；或者，所述第一散热层位于所述光源组件下方，所述光源组件上方设有第二散热层。
  5. 根据权利要求4所述的背光模组，其中所述第一散热层与所述第二散热层连接。
  6. 根据权利要求1所述的背光模组，其中所述背板面向所述光源组件的一面具有凹槽，所述背板面向所述光源组件的一面上设有用于遮盖所述凹槽的找平层。
  7. 根据权利要求6所述的背光模组其中所述第一散热层位于所述背板与所述光源组件之间，所述第一散热层与所述找平层是一体结构。
  8. 根据权利要求6或7所述的背光模组，其中所述找平层包括多个找平块，每个所述找平块对应遮盖至少一个所述凹槽。
  9. 根据权利要求6或7所述的背光模组，其中所述找平层包括遮盖所述凹槽的平整部，以及与所述平整部连接用于填充所述凹槽的填充部。
  10. 根据权利要求1所述的背光模组，其中所述第一散热层的至少一个表面上设置有胶层。
  11. 根据权利要求1所述的背光模组，其中所述第一散热层为吸 光材料层。
  12. 根据权利要求1所述的背光模组，其中所述第一散热层为碳黑材料层或石墨烯材料层。
  13. 一种显示装置，该显示装置包括权利要求1-12中任意一项所述的背光模组。
PCT/CN2015/087496 2014-04-14 2015-08-19 一种背光模组及显示装置 WO2016165252A1 (zh)

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CN204494234U (zh) 2015-04-14 2015-07-22 京东方科技集团股份有限公司 一种背光模组及显示装置
CN207939941U (zh) 2018-03-27 2018-10-02 京东方科技集团股份有限公司 用于显示面板的散热装置和显示装置
CN111999791A (zh) * 2020-08-14 2020-11-27 武汉华星光电半导体显示技术有限公司 偏光片、显示模组以及显示装置
US11540421B2 (en) * 2020-09-11 2022-12-27 Seagate Technology Llc Data storage device (DSD) and cooling system for DSD chassis
CN112422861B (zh) * 2020-11-05 2023-03-28 重庆惠科金渝光电科技有限公司 背板组件、显示屏及电视机
CN113539091B (zh) * 2021-07-13 2023-11-24 京东方科技集团股份有限公司 一种显示装置
CN113848665A (zh) * 2021-09-27 2021-12-28 京东方科技集团股份有限公司 背光模组及其制造方法、显示装置
WO2024000308A1 (zh) * 2022-06-29 2024-01-04 京东方科技集团股份有限公司 一种显示模组、智能终端

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