WO2016157697A1 - Dispositif d'exposition et procédé d'exposition - Google Patents

Dispositif d'exposition et procédé d'exposition Download PDF

Info

Publication number
WO2016157697A1
WO2016157697A1 PCT/JP2016/000908 JP2016000908W WO2016157697A1 WO 2016157697 A1 WO2016157697 A1 WO 2016157697A1 JP 2016000908 W JP2016000908 W JP 2016000908W WO 2016157697 A1 WO2016157697 A1 WO 2016157697A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
optical system
dmd
imaging optical
exposure
Prior art date
Application number
PCT/JP2016/000908
Other languages
English (en)
Japanese (ja)
Inventor
大塚　明
Original Assignee
ウシオ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ウシオ電機株式会社 filed Critical ウシオ電機株式会社
Priority to CN201680018422.9A priority Critical patent/CN107430353B/zh
Priority to KR1020177029900A priority patent/KR20170128561A/ko
Publication of WO2016157697A1 publication Critical patent/WO2016157697A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Definitions

  • the present invention relates to an exposure apparatus and an exposure method for passing light modulated by a spatial light modulation element through an imaging optical system and forming an image of this light on a predetermined surface.
  • the DI exposure apparatus includes a plurality of exposure heads having a spatial light modulator (DMD), a first projection optical system, a microlens array (MLA), and a second projection optical system.
  • DMD Digital Micromirror Device
  • MLA microlens array
  • the DI exposure apparatus projects light modulated by DMD onto the MLA by the first projection lens, and projects light transmitted through the MLA onto a predetermined light irradiation surface by the second projection lens.
  • the MLA is a lens in which microlenses corresponding to the respective pixel portions of the DMD are arranged in an array in accordance with the positions of the respective pixels of the DMD.
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-305663
  • light from a light source is irradiated on the entire surface of the DMD.
  • the DMD has a configuration in which micromirrors (micromirrors) are two-dimensionally arranged, and there are microscopic gaps between adjacent micromirrors. Therefore, when light is irradiated on the entire surface of the DMD, the gap is also irradiated with light.
  • the light applied to the gaps between the micromirrors does not contribute to the spatial modulation, causing a reduction in element efficiency.
  • light from the light source for example, ultraviolet light (UV light) is used.
  • UV light ultraviolet light
  • an object of the present invention is to provide an exposure apparatus and an exposure method that can improve the efficiency and life of the spatial light modulator.
  • an aspect of the exposure apparatus includes a microlens array in which microlenses that collect light from a light source are arranged in an array, and the microlens array that collects the light.
  • a spatial light modulation unit in which pixel units for modulating light are arranged; a first imaging optical system that forms an image of the light collected by the microlens array on the spatial light modulation unit; and the spatial light modulation unit
  • a second image-forming optical system that forms an image on the photosensitive material.
  • the light condensed by the MLA can enter the spatial light modulator without loss. Therefore, the efficiency of spatial modulation can be improved. Further, the light condensed by the MLA is not irradiated onto, for example, the substrate of the spatial light modulator that does not contribute to the spatial modulation. Therefore, the deterioration of the element can be suppressed and the life can be extended.
  • the spatial light modulation unit may be a digital micromirror device
  • the pixel unit may be a micromirror that has a one-to-one correspondence with the microlens.
  • DMD digital micromirror device
  • the DMD micromirrors are made to correspond one-to-one with the MLA microlens, and the light collected by the MLA is imaged on the DMD micromirror, thereby suppressing crosstalk between pixels and reducing the extinction ratio. Can be suppressed.
  • the first imaging optical system is configured to apply spot-like light collected by each microlens of the microlens array onto the corresponding micromirror. You may image with a spot size smaller than the size of. In this way, since light having a spot size smaller than the size of the micromirror is imaged on the micromirror, it is possible to reliably prevent light from entering the gap formed between the micromirrors. .
  • the second imaging optical system may be an enlarged imaging optical system. In this way, by adopting a configuration in which the light modulated by the spatial light modulator is enlarged and imaged on the photosensitive material, the resolution requirement can be appropriately satisfied by adjusting the magnification. Further, the image can be enlarged while keeping the sharpness of the image projected on the photosensitive material high.
  • the first imaging optical system may be a reduction imaging optical system.
  • the first imaging optical system may be a reduction imaging optical system.
  • the MLA by reducing the light collected by the MLA and forming an image on the spatial light modulation unit, it is possible to employ an MLA having a relatively large condensing spot size. Therefore, manufacture of MLA becomes easy.
  • light from a light source is collected by a microlens array in which microlenses are arranged in an array, and light collected by the microlens array is arranged in a pixel unit. The light is imaged on the spatial light modulation unit, and the light modulated by the spatial light modulation unit is imaged on the photosensitive material.
  • the light condensed by the MLA can be incident on the spatial light modulator without loss, and the efficiency of spatial modulation can be improved.
  • the light collected by the MLA is not irradiated onto, for example, the substrate of the spatial light modulation unit that does not contribute to the spatial modulation, the deterioration of the element can be suppressed and the life can be extended.
  • the light condensed by the microlens array can be incident on the spatial light modulator without loss. Therefore, it is possible to improve the efficiency and extend the life of the spatial light modulator.
  • FIG. 1 is a schematic block diagram that shows the exposure apparatus of the present embodiment.
  • FIG. 2 is a view showing the main part of the exposure head unit.
  • FIG. 3 is a partially enlarged view showing the structure of the DMD.
  • FIG. 4 is a perspective view showing a schematic configuration of the exposure head.
  • FIG. 5 is an optical arrangement diagram showing the configuration of the exposure head.
  • FIG. 6 is a diagram illustrating a state of a spot irradiated on the DMD surface.
  • FIG. 7 is an optical arrangement diagram showing a configuration of a conventional exposure head.
  • FIG. 8 is a diagram illustrating a state of light irradiated on a conventional DMD surface.
  • FIG. 9 is a diagram showing a configuration of a conventional MLA surface.
  • FIG. 1 is a schematic block diagram that shows the exposure apparatus of the present embodiment.
  • the exposure apparatus 100 is an apparatus that exposes light that has been modulated by a spatial light modulation unit (spatial light modulation element) through an imaging optical system, and forms an image of the light on a photosensitive material (resist). Since such an exposure apparatus directly forms an image with a spatial light modulation element, no mask (or reticle) is required, and it is called a DI (direct image) exposure apparatus.
  • a spatial light modulation unit spatial light modulation element
  • DI direct image
  • the exposure apparatus 100 includes an exposure head unit 10, a transport system 20 that transports a substrate (workpiece) W to be exposed, and a thick plate-shaped installation base 30 on which the exposure head unit 10 and the transport system 20 are installed.
  • the workpiece W is, for example, a resin printed board coated with a resist.
  • the exposure head unit 10 is fixed to a gate-like gate (gantry) 31 provided so as to straddle the installation table 30, and each end of the gate 31 is fixed to a side surface of the installation table 30. Further, the installation table 30 is supported by a plurality of (for example, four) leg portions 32.
  • the transport system 20 includes, as an example, a flat plate-like stage 21 that sucks and holds the workpiece W by a method such as vacuum suction, two guides 22 that extend along the moving direction of the stage 21, and a moving mechanism of the stage 21. And an electromagnet 23.
  • a linear motor stage is employed as the moving mechanism.
  • a moving body (stage) is levitated by air on a flat platen provided with ferromagnetic convex poles in a lattice shape, and a magnetic force is applied to the moving body, so that the moving body and the platen
  • This is a mechanism for moving the moving body (stage) by changing the magnetic force between the convex poles.
  • the moving mechanism for example, a mechanism using a ball screw can be adopted.
  • the stage 21 is arranged so that its longitudinal direction is directed to the stage moving direction, and is supported by the guide 22 so as to be able to reciprocate in a state where straightness is compensated.
  • the moving direction of the stage 21 is defined as the X direction
  • the horizontal direction perpendicular to the X direction is defined as the Y direction
  • the vertical direction is defined as the Z direction.
  • the workpiece W has a square shape and is held on the stage 21 in a posture in which one side is directed in the X direction and the other side is directed in the Y direction.
  • the X direction may be referred to as the length direction of the workpiece W
  • the Y direction may be referred to as the width direction of the workpiece W.
  • the moving path of the stage 21 is designed to pass directly under the exposure head unit 10, and the transport system 20 transports the workpiece W to a light irradiation position by the exposure head unit 10 and passes the irradiation position. It is configured as follows. In the process of passing, the pattern of the image formed by the exposure head unit 10 is exposed on the workpiece W.
  • the exposure head unit 10 is provided on one side of the gate 31 in the X direction, and a plurality of (for example, two) sensors 40 for detecting the front and rear ends of the workpiece W are provided on the other side. That is, the gate 31 provided with the exposure head unit 10 and the sensor 40 is fixedly arranged upstream of the moving path of the stage 21.
  • the exposure head unit 10 and the sensor 40 are connected to a controller (not shown) that controls them.
  • the exposure head unit 10 includes a plurality of (14 in FIG. 2) exposure heads 11 arranged in a substantially matrix of m rows and n columns. Each exposure head 11 incorporates the spatial light modulation element described above and irradiates light with a preset pattern.
  • An exposure area 51 by each exposure head 11 has a rectangular shape with a short side in the sub-scanning direction. Accordingly, as the stage 21 moves, a strip-shaped exposed area 52 is formed on the work W for each exposure head 11.
  • a digital micromirror device (DMD) 12 shown in FIG. 3 is used as the spatial light modulation element.
  • the DMD 12 has a configuration in which fine mirrors (micromirrors) 122 of about 13 ⁇ m square that constitute each pixel (pixel) are two-dimensionally arranged on a memory cell (for example, SRAM cell) 121.
  • the number of micromirrors 122 arranged is, for example, 1024 ⁇ 768.
  • a rectangular micromirror 122 supported by a support column is provided at the top, and a material having a high reflectance such as aluminum is deposited on the surface of the micromirror 122. Note that a minute gap of 1 ⁇ m or less exists between adjacent micromirrors 122.
  • each micromirror 122 supported by the support is tilted to any one of ⁇ ⁇ degrees with respect to the substrate side on which the DMD 12 is disposed with the diagonal line as the center.
  • the controller controls the angle of each micromirror 122 of the DMD 12 so as to form a desired pattern on the workpiece W. That is, the angle of each micro mirror 122 of the DMD 12 is selectively controlled according to the pattern of the image to be formed.
  • the exposure head 11 includes a light source unit 13, an incident optical system 14, and a mirror 15 on the light incident side of the DMD 12.
  • the light source unit 13 includes a light source such as a lamp that emits laser light having a wavelength of 400 nm and a semiconductor laser (laser diode).
  • the light source unit 13 includes an optical fiber that guides output light from the light source.
  • the optical fiber for example, a quartz fiber can be used.
  • the emission end portions (light emission points) of the optical fiber are arranged in a line along a direction corresponding to the long side direction of the exposure area 51 to constitute a laser emission unit 131.
  • the incident optical system 14 is an optical system for causing the laser light emitted from the light source unit 13 to be incident on the DMD 12.
  • the incident optical system 14 is schematically shown.
  • the mirror 15 reflects the laser beam emitted from the incident optical system 14 toward the DMD 12.
  • the incident optical system 14 includes an illumination optical system 141, a microlens array (MLA) 142, and a first imaging optical system 143.
  • MLA microlens array
  • the illumination optical system 141 is configured by an integrator lens, a collimator lens, a prism, and the like, and enters the laser beam emitted from the laser emitting unit 131 of the light source unit 13 into the MLA 142 as parallel light.
  • the MLA 142 is an optical component in which a large number of minute convex lenses (microlens elements) are arranged two-dimensionally. Each microlens element has a one-to-one correspondence with each micromirror 122 of the DMD 12.
  • the first imaging optical system 143 is a reduced imaging optical system that reduces the light collected in a spot shape by the MLA 142 and forms an image on the DMD 12, for example. In other words, the DMD 12 and the MLA 142 are aligned and arranged so that light emitted from one microlens element passes through the first imaging optical system 143 and is condensed on one specific micromirror 122. Has been.
  • the exposure head 11 includes a second imaging optical system 16 on the light exit side of the DMD 12.
  • the second imaging optical system 16 is an enlarged imaging optical system that magnifies the image from the DMD 12 by, for example, 5 times and projects it onto the workpiece W.
  • a controller (not shown) of the exposure apparatus 100 stores digital data (original data) of an image (exposure pattern) to be formed, sends a control signal to the transport system 20, and moves the stage 21 on which the workpiece W is placed. Move at a predetermined speed.
  • the controller sends a control signal to the DMD 12 to control the angle of each micromirror 122 at a predetermined timing and sequence so that an exposure pattern based on the original data is formed on the workpiece W.
  • an exposure pattern based on the original data is formed on the workpiece W.
  • the MLA 142 is disposed in the previous stage (light incident side) of the DMD 12 and is spot-shaped on the micromirror 122 of the DMD 12 via the first imaging optical system 143. It has the structure which condenses light.
  • the MLA 142 divides and collects the light from the light source unit 13 that has been converted into parallel light by each microlens, and the first imaging optical system 143 has a spot collected by the MLA 142 as shown in FIG. Shaped light (laser beam B) is imaged on each micromirror 122 of the DMD 12.
  • the laser beam B is focused on a diameter of about 2.4 ⁇ m on, for example, a 13 ⁇ m square micromirror 122.
  • the exposure apparatus 100 condenses spot-like light on the micromirror 122 of the DMD 12, it is possible to suppress light loss and improve element efficiency.
  • this point will be described in detail.
  • FIG. 7 is a view showing an exposure head 111 having a conventional configuration in which an MLA is arranged on the light exit side of the DMD.
  • the exposure head 111 includes a light source unit 113, an illumination optical system 114, and a mirror 115 on the light incident side of the DMD 112.
  • the exposure head 111 includes a first imaging lens 116, an MLA 117, and a second imaging lens 118 on the light exit side of the DMD 112.
  • the light source unit 113, the illumination optical system 114, and the mirror 115 have the same configuration as the light source unit 13, the illumination optical system 141, and the mirror 15 shown in FIG.
  • the first imaging lens 116 and the second imaging lens 118 are, for example, magnification projection lenses.
  • the first imaging lens 116 may be an equal magnification projection lens or a reduction projection lens.
  • the illumination optical system 114 converts the light from the light source unit 113 into parallel light, which is incident on the DMD 112. That is, as shown in FIG. 8, the light from the light source (laser beam B) is irradiated on the entire surface of the DMD 112. As described above, since there is a minute gap between the adjacent micromirrors 1122, the laser beam B incident on this gap is absorbed by the substrate material of the DMD 112 and causes optical loss. Further, there is a possibility that the substrate material of the DMD 112 absorbs the laser beam B to deteriorate the element, or the temperature of the DMD 112 rises to promote the deterioration of the element.
  • the exposure apparatus 100 collects spot-like light on the micromirrors 122 of the DMD 12 as shown in FIG.
  • the beam B is not irradiated. Therefore, it is possible to suppress a loss due to light irradiation on the surface other than the micromirror 122 surface, and to improve the light output by the DMD 12 accordingly.
  • the exposure apparatus 100 can improve the element efficiency of the DMD 12.
  • the exposure apparatus 100 can reduce the replacement frequency of the DMD 12 and improve the throughput. Further, in the case where the MLA 117 is arranged on the light emitting side of the DMD 112 as in the exposure head 111 shown in FIG. 7, high accuracy is required for alignment between the DMD 112 and the MLA 117.
  • micromirrors constituting the DMD 112 and the microlenses constituting the MLA 117 are in a one-to-one relationship, and the reflected light of one micromirror must be accurately incident on one corresponding microlens. .
  • the resolution performance is lowered and the extinction ratio is lowered.
  • the exposure apparatus 100 can prevent light from one micromirror from entering a plurality of microlenses, thereby preventing a reduction in resolution performance and improving an extinction ratio. it can.
  • the MLA has a configuration in which a plurality of microlenses are arranged, light incident on a joint portion with an adjacent microlens can become stray light. Therefore, in order to prevent this, for example, as shown in FIG. 9, it is considered that a light blocking member 117a is provided on the light incident side of the MLA 117 to block the incidence of light on the joint.
  • a light shielding member 117a for example, a light shielding film containing a chromium-based material can be used. That is, the exposure head 111 causes only light that has passed through the opening formed by the light shielding member 117a to enter the MLA 117 so as to contribute to exposure. In this case, in order not to reduce the efficiency of the optical system, it is necessary to shield only the range where the light condensing performance of the MLA 117 is not sufficient, such as the above-described joint, and set the opening as large as possible.
  • the opening cannot be made larger than a certain extent. That is, as shown in FIG. 9, the light effective area A, which is an area of light that passes through the opening formed by the light blocking member 117a and passes through the microlens, is made narrower than the light transmissive area B of the microlens. I must. Therefore, light loss occurs in the MLA 117. For example, when the cell size of the microlens is 39.73 ⁇ m square and the size of the opening is 37 ⁇ m square, 30% or more of the light in the area ratio is absorbed by the light shielding member, which directly becomes a light loss.
  • the exposure apparatus 100 of the present embodiment forms an image of the spot-like light condensed by the MLA 142 on the micromirror of the DMD 12, it is possible to suppress the occurrence of crosstalk between adjacent pixels. it can.
  • light from the light source is incident on the entire surface of the MLA 142. That is, the light is not selectively incident on each microlens of the MLA 142. Therefore, it is not necessary to provide the MLA 142 with a light shielding member corresponding to the above-described light shielding member 117a, or use a light shielding member that shields light only in a range where the light condensing performance of the MLA 142 is insufficient and sets an opening as large as possible. it can. When the light shielding member is eliminated, the output can be improved by about 40%.
  • the exposure apparatus 100 can prevent the loss of light due to kicking and increase the efficiency of the optical system by disposing the MLA 142 on the light incident side of the DMD 12. Therefore, it is possible to increase the light intensity on the exposure surface and improve the throughput.
  • the exposure apparatus 100 in the present embodiment can reduce the loss of light, when the light intensity on the exposure surface is equivalent to that of the conventional apparatus shown in FIG. Light intensity can be weakened.
  • the intensity of light incident on the DMD can be weaker than that of the conventional device. Therefore, it is possible to reduce the load on the DMD surface, the DMD hinge, and the like, and to mitigate the temperature rise in the DMD part. Therefore, degradation of DMD can be suppressed. As a result, the DMD replacement frequency can be reduced and the maintenance cost can be reduced.
  • the exposure apparatus 100 in the present embodiment includes a first imaging optical system 143 in order to form an image of the light collected by the MLA 142 on the DMD 12. Since the first imaging optical system 143 is a reduction imaging optical system, the light condensed by the MLA 142 is reduced and imaged on the DMD 12. Therefore, it is possible to employ the MLA 142 having a relatively large condensing spot size, and the MLA 142 can be easily manufactured. Furthermore, the exposure apparatus 100 according to the present embodiment includes a second imaging optical system 16 in order to image light modulated by the DMD 12 on the exposure surface. Since the second imaging optical system 16 is an enlargement imaging optical system, the light modulated by the DMD 12 is enlarged and imaged on the exposure surface.
  • the DMD 12 which is a reflective spatial light modulation element is used as the spatial light modulation element.
  • a transmissive spatial light modulation element using liquid crystal can also be used.
  • the first imaging optical system may be a unity imaging optical system, An enlarged imaging optical system may be used.
  • the magnification imaging optical system is used as the second imaging optical system has been described.
  • the second imaging optical system may be an equal magnification imaging optical system or a reduction imaging optical system.
  • the embodiments are merely examples and are not intended to limit the scope of the present invention.
  • the devices and methods described herein can be embodied in forms other than those described above.
  • omissions, substitutions, and changes can be made as appropriate to the above-described embodiments without departing from the scope of the present invention. Such omissions, substitutions, and modifications are included in the scope of the claims and their equivalents, and belong to the technical scope of the present invention.
  • DESCRIPTION OF SYMBOLS 100 Exposure apparatus, 10 ... Exposure head unit, 11 ... Exposure head, 12 ... DMD, 121 ... SRAM cell (memory cell), 122 ... Micromirror, 13 ... Light source, 14 ... Incident optical system, 141 ... Illumination optical system, 142: microlens array (MLA), 143: first imaging optical system, 15: mirror, 16 ... second imaging optical system, 20 ... transport system, 21 ... stage, 22 ... guide, 23 ... electromagnet, 30 ... Installation table, 31 ... Gate (gantry), 32 ... Leg, 51 ... Exposed area, 52 ... Exposed area, W ... Workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Microscoopes, Condenser (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

L'invention concerne un dispositif d'exposition et un procédé d'exposition permettant de doter un modulateur spatial de lumière d'une haute efficacité et d'une durée de vie prolongée. Un dispositif d'exposition (100) selon l'invention comprend : un réseau de microlentilles (142) constitué d'un réseau de microlentilles destinées à capter la lumière émanant d'une source de lumière ; un élément de modulation spatiale de lumière (matrice de micromiroirs) (12) constitué de pixels destinés à moduler la lumière captée par le réseau de microlentilles (142) ; un premier système optique de focalisation (143) destiné à focaliser la lumière captée par le réseau de microlentilles (142) sur l'élément de modulation spatiale de lumière (12) ; et un deuxième système optique de focalisation (16) destiné à focaliser la lumière modulée par l'élément de modulation spatiale de lumière (12) sur un matériau photosensible.
PCT/JP2016/000908 2015-03-30 2016-02-19 Dispositif d'exposition et procédé d'exposition WO2016157697A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680018422.9A CN107430353B (zh) 2015-03-30 2016-02-19 曝光装置以及曝光方法
KR1020177029900A KR20170128561A (ko) 2015-03-30 2016-02-19 노광 장치 및 노광 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-068555 2015-03-30
JP2015068555A JP2016188923A (ja) 2015-03-30 2015-03-30 露光装置及び露光方法

Publications (1)

Publication Number Publication Date
WO2016157697A1 true WO2016157697A1 (fr) 2016-10-06

Family

ID=57005532

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/000908 WO2016157697A1 (fr) 2015-03-30 2016-02-19 Dispositif d'exposition et procédé d'exposition

Country Status (5)

Country Link
JP (1) JP2016188923A (fr)
KR (1) KR20170128561A (fr)
CN (1) CN107430353B (fr)
TW (1) TWI649632B (fr)
WO (1) WO2016157697A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7090002B2 (ja) * 2018-09-27 2022-06-23 株式会社オーク製作所 露光装置
NO20190876A1 (en) 2019-07-11 2021-01-12 Visitech As Real time Registration Lithography system

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004126034A (ja) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd 画像形成装置
JP2004361939A (ja) * 2003-05-12 2004-12-24 Seiko Epson Corp プロジェクタおよび表示装置
JP2005031280A (ja) * 2003-07-10 2005-02-03 Fuji Photo Film Co Ltd 露光装置
JP2006163339A (ja) * 2004-05-12 2006-06-22 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
WO2007040165A1 (fr) * 2005-09-30 2007-04-12 Fujifilm Corporation Appareil d'exposition d'image
JP2007094095A (ja) * 2005-09-29 2007-04-12 Olympus Imaging Corp 投影型映像表示装置
WO2008090942A1 (fr) * 2007-01-25 2008-07-31 Nikon Corporation Procédé d'exposition, dispositif d'exposition et procédé de fabrication d'un microdispositif
JP2008197222A (ja) * 2007-02-09 2008-08-28 Fujifilm Corp ポジ型感光性組成物及びパターン形成方法
JP2013543647A (ja) * 2010-06-11 2013-12-05 オーボテック リミテッド 光学シアリングのシステムと方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090696A (ja) * 2000-09-20 2002-03-27 Sony Corp 光学装置及び投射型表示装置
WO2003025656A1 (fr) * 2001-09-03 2003-03-27 Kabushiki Kaisha Hayashi Soken Procede et dispositif de balayage a commande numerique
JP4057937B2 (ja) * 2003-03-25 2008-03-05 富士フイルム株式会社 露光装置
CN1950750B (zh) * 2004-05-12 2012-10-24 旭化成电子材料株式会社 图案形成材料、图案形成设备和图案形成方法
JP2005345591A (ja) * 2004-06-01 2005-12-15 Hitachi Displays Ltd 表示装置の製造方法及びその装置
KR100726737B1 (ko) * 2005-07-04 2007-06-11 한국과학기술원 마이크로렌즈 어레이와 마이크로미러 어레이를 이용한 프로젝션 디스플레이 장치
US7839487B2 (en) * 2006-04-13 2010-11-23 Asml Holding N.V. Optical system for increasing illumination efficiency of a patterning device
US8115904B2 (en) * 2008-05-30 2012-02-14 Corning Incorporated Illumination system for sizing focused spots of a patterning system for maskless lithography

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004126034A (ja) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd 画像形成装置
JP2004361939A (ja) * 2003-05-12 2004-12-24 Seiko Epson Corp プロジェクタおよび表示装置
JP2005031280A (ja) * 2003-07-10 2005-02-03 Fuji Photo Film Co Ltd 露光装置
JP2006163339A (ja) * 2004-05-12 2006-06-22 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007094095A (ja) * 2005-09-29 2007-04-12 Olympus Imaging Corp 投影型映像表示装置
WO2007040165A1 (fr) * 2005-09-30 2007-04-12 Fujifilm Corporation Appareil d'exposition d'image
WO2008090942A1 (fr) * 2007-01-25 2008-07-31 Nikon Corporation Procédé d'exposition, dispositif d'exposition et procédé de fabrication d'un microdispositif
JP2008197222A (ja) * 2007-02-09 2008-08-28 Fujifilm Corp ポジ型感光性組成物及びパターン形成方法
JP2013543647A (ja) * 2010-06-11 2013-12-05 オーボテック リミテッド 光学シアリングのシステムと方法

Also Published As

Publication number Publication date
TWI649632B (zh) 2019-02-01
KR20170128561A (ko) 2017-11-22
TW201636738A (zh) 2016-10-16
CN107430353B (zh) 2020-04-28
CN107430353A (zh) 2017-12-01
JP2016188923A (ja) 2016-11-04

Similar Documents

Publication Publication Date Title
KR100354158B1 (ko) 리소그래피 시스템
JP2006261155A (ja) 露光装置及び露光方法
JP6652618B2 (ja) 照度割合変更方法及び露光方法
JP6480680B2 (ja) 照度割合変更方法及び露光方法
US20140347641A1 (en) Device, lithographic apparatus, method for guiding radiation and device manufacturing method
US7177011B2 (en) Image drawing apparatus and image drawing method
US9791784B2 (en) Assembly for a projection exposure apparatus for EUV projection lithography
KR100742251B1 (ko) 화상노광방법 및 장치
JP4679249B2 (ja) パターン描画装置
WO2016157697A1 (fr) Dispositif d'exposition et procédé d'exposition
US7339602B2 (en) Image-drawing device and image-drawing method
JP4979462B2 (ja) 画像露光装置
JP4511502B2 (ja) 基板露光装置
JP2019015974A (ja) 露光装置及び露光方法
JP7090002B2 (ja) 露光装置
JP2004191660A (ja) 露光装置
JP2005202226A (ja) 感光材料の感度検出方法および装置並びに露光補正方法
WO2023127499A1 (fr) Dispositif d'exposition
US20240126178A1 (en) Exposure apparatus, control method, and device manufacturing method
JP7465636B2 (ja) 描画装置
JP2004266198A (ja) パターン描画装置
JP2006133431A (ja) 露光方法および装置
KR20240143739A (ko) 노광 장치
KR101390512B1 (ko) 개선된 패턴 형성용 노광 광원, 노광 장치, 노광 시스템, 및 노광 방법
JP2006133432A (ja) 露光方法および装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16771592

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20177029900

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 16771592

Country of ref document: EP

Kind code of ref document: A1