WO2016157422A1 - Substrate suctioning device and substrate suctioning method - Google Patents

Substrate suctioning device and substrate suctioning method Download PDF

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Publication number
WO2016157422A1
WO2016157422A1 PCT/JP2015/060170 JP2015060170W WO2016157422A1 WO 2016157422 A1 WO2016157422 A1 WO 2016157422A1 JP 2015060170 W JP2015060170 W JP 2015060170W WO 2016157422 A1 WO2016157422 A1 WO 2016157422A1
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WO
WIPO (PCT)
Prior art keywords
suction
substrate
plate
hole
suction hole
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PCT/JP2015/060170
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French (fr)
Japanese (ja)
Inventor
昇 新開
茂 河田
高橋　伸幸
Original Assignee
株式会社メイコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2015/060170 priority Critical patent/WO2016157422A1/en
Priority to JP2015541356A priority patent/JP5878269B1/en
Priority to PCT/JP2016/057636 priority patent/WO2016158301A1/en
Priority to TW105109445A priority patent/TWI672203B/en
Publication of WO2016157422A1 publication Critical patent/WO2016157422A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a substrate adsorption apparatus and a substrate adsorption method for adsorbing and holding a substrate.
  • an adsorption device that adsorbs and holds a plate material such as a substrate is used (for example, see Patent Document 1).
  • An adsorption device like patent document 1 adsorbs and holds a board material using negative pressure by attracting air.
  • the suction device of Patent Document 1 includes a valve body that is freely movable in a sucked hole, and the valve body is held by a negative pressure on a plate member by using an operation in which the valve body is acted on by gravity. I am trying.
  • an adsorption part that is in contact with an object to be adsorbed and formed with a plurality of suction holes, and a negative pressure chamber are formed in cooperation with the adsorption part.
  • An adsorption device is disclosed that includes a closing portion that closes a portion and closes the suction hole.
  • the valve body has a root portion that is one end portion located in the negative pressure chamber, and the root portion is bridged between the side walls in the negative pressure chamber. It is fixed to a plate-like flexible body having a fixed flexibility.
  • the present invention has been made in view of such a problem, and an object of the present invention is to realize a substrate suction apparatus capable of realizing simplification of a suction mechanism, facilitating maintenance and reducing costs. It is to provide a substrate adsorption method.
  • a substrate suction device is a substrate suction device that sucks an inner gas and sucks the contacted substrate, and includes a suction part that contacts the substrate and includes a plurality of suction holes.
  • a suction hole connecting portion that forms an internal shared space that is connected to each of the plurality of suction holes in cooperation with the suction portion, and includes a suction port for sucking the internal gas from the internal shared space;
  • a plate-like suction hole opening / closing part provided in the suction part and having a plurality of valve bodies for opening and closing the suction hole, and the valve body abutting against the inner surface of the suction part exposed by the suction hole
  • a closing plate for closing the suction hole, and an elastic support plate for supporting the closing plate so as to be displaceable in the extending direction of the suction hole are provided.
  • a substrate suction method of the present invention includes a contact step of contacting a substrate to a suction portion having a plurality of suction holes, and a suction step of sucking internal gas in the suction holes.
  • the suction step when the amount of suction of the internal gas exceeds a threshold value, the plate-like elastic support plate disposed in the suction hole bends in the extending direction of the suction hole, and the elastic support plate The supported closing plate is displaced to close the suction hole.
  • the suction mechanism can be simplified, maintenance can be facilitated, and cost can be reduced.
  • FIG. 5 is an enlarged view of a broken line region V in FIG. 4.
  • FIG. 4 is an enlarged view of a broken line area VI in FIG. 3.
  • FIG. 8 is an enlarged view of a broken line area VIII in FIG. 7.
  • FIG. 6 is an enlarged plan view of a metal flat plate according to a modification of the present invention shown in the same manner as in FIG. 5. It is sectional drawing of the board
  • FIG. 1 is a schematic perspective view of the substrate suction apparatus 1 according to the present embodiment.
  • FIG. 2 is a front view of the suction surface side of the substrate suction apparatus 1 according to this embodiment.
  • FIG. 3 is a cross-sectional view of the substrate suction apparatus 1 according to the present embodiment taken along line III-III in FIG.
  • the substrate suction apparatus 1 includes a suction part 2 that comes into contact with and sucks a substrate that is a suction target, and a lid 3 that is installed on one end surface of the suction part 2. And a metal flat plate 4 provided in the suction portion 2 and a connecting pipe 5 connected to the lid 3.
  • the adsorbing portion 2 includes a plate-like elastomer 6, a first holding plate 7 connected to one end surface of the elastomer 6, and a metal plate 4 that carries the first holding plate 7. It is composed of two sandwiching plates 8.
  • connection members such as a volt
  • suction apparatus 1 itself is isolate
  • the elastomer 6 has a plurality of through holes 11 formed in a substantially matrix shape.
  • a total of 24 columnar through holes 11 are formed so that the through holes 11 are not formed in the center portion, which is 5 rows ⁇ 5 columns.
  • the said quantity, a shape, and an arrangement configuration are not limited to these, It can change suitably according to the dimension of the board
  • a plurality of through holes 12 are formed in the first clamping plate 7, and a plurality of through holes 13 are formed in the second clamping plate 8.
  • the through holes 12 and the through holes 13 are formed in a substantially matrix shape so as to correspond to the through holes 11. Therefore, one through hole 11, one through hole 12, and one through hole 13 communicate with each other to form one suction hole 14, and the substrate suction apparatus 1 itself has 24 suctions. Holes 14 will be provided.
  • the through-hole 12 has a columnar first opening 12 a, a columnar second opening 12 b, and a columnar third opening 12 c that have different opening dimensions. It is formed by.
  • the opening diameter of the first opening 12a is larger than the opening diameter of the through hole 11
  • the opening diameter of the second opening 12b is smaller than the opening diameter of the first opening 12a
  • the third opening 12c Is set larger than the opening diameters of the first opening 12a and the second opening 12b.
  • the through hole 13 is also formed by communication between a columnar first opening 13a and a columnar second opening 13b having different opening dimensions.
  • the opening diameter of the first opening 13a is the same as the opening diameter of the third opening 12c of the through hole 12, and the opening diameter of the second opening 13b is larger than the opening diameter of the first opening 13a. It is set small.
  • the shape of each opening part and an opening dimension are not limited to the content mentioned above, For example, an opening shape may be a polygon or an ellipse, and internal gas (for example, air, etc.) which remains in the board
  • the opening size can be adjusted as appropriate so that the atmospheric gas (nitrogen, oxygen, air, or the like) can be optimally sucked when the substrate adsorption apparatus 1 is used.
  • the lid 3 is formed with through holes 15 that connect the 24 suction holes 14 and connect to the through holes 5 a of the connection pipe 5. More specifically, the through hole 15 includes a connection port 15a for connecting the 24 suction holes 14, and a suction port for sucking the internal gas from the central portion of the connection port 15a to the through hole 5a of the connection tube 5. 15b. With such a configuration of the lid 3, the lid 3 and the second clamping plate 8 (suction portion 2) cooperate to form an internal shared space (that is, a space corresponding to the connection port 15 a). Thus, the lid 3 functions as a connecting portion (suction hole connecting portion) of the suction holes 14.
  • the suction hole 14 and the through hole 15 are connected by the above-described through holes and connected to the through hole 5a of the connecting pipe 5.
  • suction apparatus 1 which concerns on a present Example
  • suction object is made to contact
  • the inside of the substrate suction device 1 is brought into a negative pressure state (general vacuum state), and the substrate can be sucked. A detailed description of the adsorption of the substrate will be described later.
  • the plate-like elastomer 6 in order to suck without damaging the substrate which is the suction target, the plate-like elastomer 6 is used for the portion in contact with the substrate, but the substrate is not damaged and penetrated. If the hole 11 can be easily formed, another member (for example, a flat plate made of resin) may be used instead of the elastomer 6. Further, in this embodiment, the first sandwiching plate 7 and the second sandwiching plate 8 are made of acrylic flat plates for preventing damage to the substrate suction device 1 and improving the strength. Other plate materials that can be provided and can easily form through holes may be used.
  • FIG. 4 is a plan view of the metal flat plate 4.
  • FIG. 5 is an enlarged view of a broken line region V in FIG.
  • FIG. 6 is an enlarged view of a broken line area VI in FIG.
  • the metal flat plate 4 has a square outer shape, and the material of the metal flat plate 4 is stainless steel.
  • a plurality of valve bodies 21 for opening and closing the suction holes 14 are formed on the metal flat plate 4 in a substantially matrix shape.
  • a total of 24 valve bodies 21 are formed so as to be 5 rows ⁇ 5 columns and not to form the valve bodies 21 at the center.
  • the material and shape of the metal flat plate 4, the number of the valve bodies 21, and the arrangement configuration of the valve bodies 21 are not limited to the above-described contents, but the shape of the substrate suction device 1 itself, the number of suction holes 14, and the suction The position can be appropriately changed according to the position where the hole 14 is formed.
  • the material of the metal flat plate 4 other metal materials such as nickel and copper can be used.
  • each of the valve bodies 21 is located at the center and is located so as to surround the disk-shaped closing plate 22 for closing the suction hole 14 and the periphery of the closing plate 22. It is comprised from the elastic support plate 23 which supports 22 so that the displacement to the extension direction (namely, the direction which penetrates the front and back surfaces of the obstruction board 22) of the suction hole 14 is possible.
  • the elastic support plate 23 includes four annular portions 24 formed concentrically around the closing plate 22, the annular portions 24, the annular portion 24 and the closing plate 22, and the annular portion 24 and the valve body 21. A total of ten connecting portions 26 that connect the peripheral region 25 are included.
  • two connecting portions 26 are provided for each of the adjacent annular portions 24, and two are provided for each of the adjacent annular portions 24 and the closing plate 22. Are provided two each for the adjacent annular portion 24 and the peripheral region 25 of the valve body 21. Further, the connecting portions 26 provided at the same distance from the center of the closing plate 22 are arranged at positions facing each other (that is, point-symmetric with respect to the center of the closing plate 22). That is, the valve body 21 includes a total of five sets of connecting portions 26, where two sets of connecting portions 26 provided at the same distance from the center of the blocking plate 22 are taken as one set. Further, the one set of connecting portions 26 provided at the same distance from the center of the closing plate 22 is another set of connecting portions 26 disposed on the inner side of the one set of connecting portions 26. Compared with the center of the closing plate 22, it is disposed at a position rotated 90 degrees with respect to the center.
  • ten anti-arc-shaped openings 27 are formed concentrically around the closing plate 22, and are formed at the same distance from the center of the closing plate 22. Assuming that the opening 27 is one set, a total of five sets of the opening 27 are formed.
  • the one set of openings 27 formed at the same distance from the center of the closing plate 22 is another set of openings 27 formed on the inner side of the one set of openings 27.
  • the center of the closing plate 22 is rotated 90 degrees as a reference. Due to the structure and arrangement of the closing plate 22, the annular portion 24, the connecting portion 26, and the opening 27 described above, the valve body 21 is configured by a leaf spring having a two-point link structure.
  • the third opening 12 c of the through hole 12 and the first opening 13 a of the through hole 13 are used.
  • the valve body 21 will be arrange
  • the closing plate 22 of the valve body 21 has a diameter larger than the opening diameter of the second opening 13 b of the through hole 13.
  • the diameter of the valve body 21 itself is about 4 mm
  • the diameter of the closing plate 22 is about 2 mm
  • the opening diameter of the second opening 13b of the through hole 13 is 1.6 mm. Can be appropriately changed according to the suction force required for the substrate suction apparatus 1.
  • valve body 21 is configured by a plate spring having a two-point link structure, when an atmospheric gas (for example, air or nitrogen) flows from the outside of the substrate adsorption device 1 into the suction hole 14, the closing plate 22 passes through the through hole 13.
  • the pushing force toward the second opening 13b is generated in the valve body 21.
  • the pushing force can be expressed by the following formula (1).
  • F ⁇ W (1)
  • F is a force that pushes the closing plate 22
  • ⁇ is a proportional constant
  • W is the flow rate of the atmospheric gas.
  • ⁇ is a proportional constant existing in the material, size, structure, etc. of the valve body 21.
  • the displacement amount can be expressed by the following mathematical formula (2).
  • L ⁇ F (2)
  • L the displacement amount of the closing plate 22
  • ⁇ is a proportionality constant
  • F the force pushing the closing plate 22 described above.
  • ⁇ is a proportional constant existing in the material, dimensions, structure, etc. of the valve body 21.
  • the valve body 21 opens and closes the suction hole 14 according to the flow rate of the atmospheric gas.
  • the valve body 21 can plug the suction hole 14 according to the flow rate of the atmospheric gas.
  • the threshold value of the flow rate of the atmospheric gas described above is the displacement of the distance A (indicated by the double-headed arrow A in FIG. 6) from the position before displacement of the closing plate 22 to the position of the inner surface 8a of the second clamping plate 8. Therefore, by reducing the distance A, the threshold value of the atmospheric gas flow rate can be reduced, and by increasing the distance A, the threshold value of the atmospheric gas flow rate can be reduced. Can be bigger. That is, the start of the closing of the suction hole 14 by the closing plate 22 (that is, the timing at which the closing plate 22 contacts the inner surface 8a) can be controlled by the distance A. In other words, the self-plugging timing of the valve body 21 can be adjusted only by the depth (amount of counterbore) of the first opening 13a of the second clamping plate 8.
  • the closing plate 22 since the diameter of the closing plate 22 is larger than the opening diameter of the second opening 13b, the closing plate 22 is displaced to the second opening 13b side of the through hole 13 to ensure that the second opening 13b is displaced. 2 It becomes possible to block
  • the opening diameters of the valve body 21, the closing plate 22, and the through hole 13 can be appropriately changed according to the suction force required for the substrate suction device 1.
  • a single plate made of metal is opened at a desired location by a known mask forming technique using photolithography and known etching or laser processing. You may form the metal plate 4 which forms the part 27 and is provided with the some valve body 21.
  • the metal plate 4 provided with a plurality of valve bodies 21 may be formed by plating a mold having a gap corresponding to the valve body 21 and the peripheral region 25 to fill the gap with metal. .
  • positioned at 5 rows x 5 columns (it is not formed in the center) like a present Example is made into one block, and several blocks are formed simultaneously, and then It is also possible to cut one metal flat plate 4 at a time. Therefore, the metal flat plate 4 of the present embodiment can be manufactured in large quantities and easily as compared with a conventional mechanism in which a valve body and a member that supports the valve body are independent.
  • FIG. 7 is a cross-sectional view of the substrate suction apparatus 1 in a state in which the substrate 31 is in contact, as shown in FIG.
  • FIG. 8 is an enlarged view of a broken line region VIII in FIG.
  • an abutting step of abutting the adsorption unit 2 on the substrate 31 is performed. More specifically, the surface of the elastomer 6 is brought into contact with the surface of the substrate 31 that is the object.
  • the through hole 32 provided in the substrate 31 communicates with one suction hole 14.
  • suction of the internal gas in the suction hole 14 is started via the connection pipe 5 (suction process).
  • suction hole 14 not connected to the through hole 32 after the start of suction the internal gas is sucked and the low pressure state is maintained, but in the suction hole 14 connected to the through hole 32, the through hole 32 is maintained.
  • Atmospheric gas will circulate from the outside via In the state where the atmospheric gas is flowing, the through hole 15 is not in a negative pressure state, and the adsorption of the substrate 31 becomes unstable.
  • the closing plate 22 vibrates at a constant cycle in the extending direction of the suction hole 14 due to the bending of the elastic support plate 23, and actually contacts and non-contacts with the inner surface 8 a of the second clamping plate at the cycle. Although it repeats, since the said period is very short, it will not change substantially from the state always contacted substantially.
  • a plurality of valve bodies 21 are formed on the metal flat plate 4 in a plate-like suction hole opening / closing section provided in the adsorption section 2, and the valve body 21 is not affected by gravity, and the atmospheric gas
  • the suction hole 14 is opened and closed by an elastic force depending on the suction amount.
  • the suction direction of the substrate suction apparatus 1 according to the present embodiment is not limited.
  • the valve body and the member that supports the valve body are composed of different members.
  • the suction mechanism itself can be simplified as compared with the case where the valve body and the valve bodies are independent, and the maintenance of the substrate suction device 1 itself can be facilitated and the cost can be reduced. .
  • valve body 21 is constituted by a leaf spring having a two-point link structure.
  • four connecting portions 26 for connecting the annular portion 24 and the peripheral region 25 of the valve body 21 to form a four-point link structure leaf spring, or a three-point link structure leaf spring (not shown). May be configured. Note that when the number of link mechanisms (that is, the number of connecting portions 26) increases, the amount of flexure of the elastic support plate 23 decreases and the amount of displacement of the closing plate 22 also decreases. It is preferable to constitute a spring.
  • the link structure may not be provided.
  • a structure in which an elastic support plate is formed in a spiral shape and a closing plate is disposed at the central portion of the elastic support plate may be employed.
  • the elastomer 6 may be subjected to spot facing, and the through hole 11 may be constituted by a first opening 11a and a second opening 11b.
  • the opening diameter of the first opening portion 11a located at the portion in contact with the substrate may be larger than the opening diameter of the second opening portion 11b, and the suction force is improved by such a structure.
  • a substrate suction device is a substrate suction device that sucks an inner gas and sucks and comes into contact with the substrate, and includes a suction part that contacts the substrate and includes a plurality of suction holes;
  • a suction hole connecting portion that forms an internal shared space connected to each of the plurality of suction holes in cooperation with the suction portion, and includes a suction port for sucking the internal gas from the internal shared space;
  • a plate-like suction hole opening / closing part provided inside the part and having a plurality of valve bodies for opening and closing the suction hole, and the valve body abutting against the inner surface of the suction part exposed by the suction hole,
  • a closing plate for closing the suction hole, and an elastic support plate for supporting the closing plate so as to be displaceable in the extending direction of the suction hole are provided.
  • a valve body is formed in a plate-like suction hole opening / closing section provided in the suction section, and the suction hole is opened / closed by a movement that is not affected by the gravity of the valve body.
  • the suction direction is not limited.
  • the suction mechanism itself can be simplified, and maintenance of the substrate suction apparatus itself is performed. Simplification and cost reduction.
  • the substrate suction apparatus according to the second embodiment of the present invention is the substrate suction apparatus according to the first embodiment described above, wherein the elastic support plate is formed concentrically with the closing plate as a center, and the plurality of rings. It is including the connection part which connects parts. Accordingly, the elastic support plate functions like a leaf spring of a spring, and the suction hole can be opened and closed accurately without being affected by gravity.
  • the closing plate, the annular portion, and the annular portions adjacent to each other are connected by the two connecting portions. It is. Thereby, a two-point link mechanism can be realized, the displacement amount of the closing plate can be increased, and the suction hole can be opened and closed more easily and accurately.
  • the substrate suction apparatus is the substrate suction apparatus according to any one of the first to third embodiments described above, wherein the suction hole includes a first through hole in which the valve body is disposed, and An opening shape smaller than the closing plate is included. Thereby, the closing plate can be reliably brought into contact with the inner side surface of the suction portion, and the suction hole can be reliably closed.
  • a substrate suction apparatus is the substrate suction apparatus according to any one of the first to fourth embodiments described above, wherein the suction portion sandwiches the elastomer that contacts the substrate and the suction hole opening / closing portion.
  • a first sandwiching plate and a second sandwiching plate are the number of main constituent members of the suction portion.
  • the plurality of valve bodies are formed in a matrix at the suction hole opening / closing portion. It is. Thereby, a board
  • suction apparatus will be provided with the valve body installed in the several suction hole and the said suction hole, and can aim at the improvement of suction power.
  • a substrate suction method includes a contact step of contacting a substrate to a suction portion having a plurality of suction holes, and a suction step of sucking internal gas in the suction holes,
  • a suction step when the suction amount of the internal gas exceeds a threshold value, a plate-like elastic support plate disposed in the suction hole bends in the extending direction of the suction hole and is supported by the elastic support plate. The closed closing plate is displaced to close the suction hole.
  • a valve body is formed in a plate-like suction hole opening / closing section provided in the suction section, and the suction hole is opened / closed by movement of the valve body in accordance with the amount of suction of the internal gas. Therefore, the suction direction is not limited, the suction mechanism itself can be simplified, and further, the maintenance of the substrate suction device itself can be facilitated and the cost can be reduced.
  • the start of the suction hole closing by the closing plate is an inner surface of the suction portion exposed by the suction hole. It is adjusted by the distance to the part which contacts the said obstruction board, and the position of the said obstruction board before a displacement.
  • the timing of starting the closing of the suction hole by the closing plate can be easily adjusted, and the suction hole is optimally timed according to the size and characteristics of the substrate as the adsorbed material and the size of the substrate suction device.
  • the substrate can be closed, and the substrate can be more accurately adsorbed.

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Abstract

This substrate suction device (1), for sucking an internal gas to suction a substrate (31) in contact therewith, is provided with: a suctioning unit (2) which contacts the substrate and is provided with multiple suction holes; a suction hole connecting unit (3) which, in conjunction with the suctioning unit, forms a shared internal space connected to the suction holes and which is provided with a suction port (15b) for sucking the internal gas from the shared internal space; and a plate-shape suction hole opening and closing unit (4) which is provided inside of the suctioning unit and which comprises multiple valve bodies (21) for opening and closing the suction holes. The valve bodies are provided with a closing plate (22) which closes the suction holes by contacting the inner surface (8a) of the suctioning unit exposed by the suction holes, and with an elastic support plate (23) which supports the closing plate so as to enable displacement in the extension direction of the suction hole.

Description

基板吸着装置及び基板吸着方法Substrate adsorption apparatus and substrate adsorption method
　本発明は、基板を吸着して保持するための基板吸着装置及び基板吸着方法に関する。 The present invention relates to a substrate adsorption apparatus and a substrate adsorption method for adsorbing and holding a substrate.
　基板製造プロセスにおいて基板を取り扱う際には、基板のような板材を吸着保持する吸着装置が用いられている（例えば特許文献１参照）。特許文献１のような吸着装置は、空気を吸引することで負圧を利用して板材を吸着保持する。具体的には、特許文献１の吸着装置は、吸引される孔内に自由移動可能な弁体を備え、この弁体が重力により作用される動作を利用して板材への負圧による保持を図っている。 When a substrate is handled in the substrate manufacturing process, an adsorption device that adsorbs and holds a plate material such as a substrate is used (for example, see Patent Document 1). An adsorption device like patent document 1 adsorbs and holds a board material using negative pressure by attracting air. Specifically, the suction device of Patent Document 1 includes a valve body that is freely movable in a sucked hole, and the valve body is held by a negative pressure on a plate member by using an operation in which the valve body is acted on by gravity. I am trying.
　特許文献１のような重力の作用を利用する吸着装置では、吸引孔が下向きの場合のみしか使用できない。すなわち、板材を上側にして上向きにすると、弁体が重力により下がって負圧室と板材との間を弁体が塞いでしまい、板材を吸引保持することができない。すなわち、重量の作用を利用する吸着装置では使用方向に制限があり、吸着対象物たる基板に対する空気の吸引方向がどのような向きであっても、吸着対象物を確実に吸引保持することが困難であった。 In the suction device using the action of gravity as in Patent Document 1, it can be used only when the suction hole faces downward. That is, when the plate member is turned upward with the plate member facing upward, the valve member is lowered by gravity and the valve member closes between the negative pressure chamber and the plate member, and the plate member cannot be sucked and held. That is, in the suction device that uses the action of weight, there is a limitation in the direction of use, and it is difficult to reliably suck and hold the suction target regardless of the direction of the air suction with respect to the substrate that is the suction target. Met.
　このような問題を解決するために、例えば特許文献２には、吸着対象物に当接し、複数の吸引孔が形成された吸着部と、当該吸着部と協働して負圧室を形成する側壁及び天壁と、当該負圧室から当該吸引孔内に延びるピン形状の弁体と、当該弁体が当該吸引孔内をスライドすることにより当該弁体の一部と当該吸引孔の内壁の一部とが密接して当該吸引孔を閉塞する閉塞部とを備える吸着装置が開示されている。また、特許文献２に係る吸着装置において、当該弁体は、当該負圧室に位置する一方の端部である根元部を有し、当該根元部が負圧室内で側壁間に架け渡されて固定された可撓性を有する板形状の可撓体に固定されている。 In order to solve such a problem, for example, in Patent Document 2, an adsorption part that is in contact with an object to be adsorbed and formed with a plurality of suction holes, and a negative pressure chamber are formed in cooperation with the adsorption part. A side wall and a ceiling wall, a pin-shaped valve body extending from the negative pressure chamber into the suction hole, and a part of the valve body and the inner wall of the suction hole by sliding the valve body through the suction hole. An adsorption device is disclosed that includes a closing portion that closes a portion and closes the suction hole. Further, in the adsorption device according to Patent Document 2, the valve body has a root portion that is one end portion located in the negative pressure chamber, and the root portion is bridged between the side walls in the negative pressure chamber. It is fixed to a plate-like flexible body having a fixed flexibility.
特開２００５－２８４８９号公報JP 2005-28489 A 国際公開２０１４／１１２０３７号公報International Publication No. 2014/112037
　しかしながら、特許文献２に開示されているような構造を備える吸着装置においては、板形状の可撓体に吸引孔を閉塞するための弁体が複数固定されているため、近接する弁体同士が可撓体を介して互いに影響を受けることになり、吸引孔の適切な閉塞を実現するために、近接する弁体同士及び可撓体の影響を考慮する必要がある。また、可撓体に複数の弁体を固定するため、部品点数の増加とともにコストが増加し、更には弁体自体の清掃等にも手間がかかることになる。すなわち、特許文献２のような構造を備える吸着装置では、吸着に関する構造が複雑となり、吸着機構の単純化、メンテナンスの容易化、及びコストの低減を図ることが困難であった。 However, in the suction device having a structure as disclosed in Patent Document 2, a plurality of valve bodies for closing the suction holes are fixed to the plate-shaped flexible body, so that adjacent valve bodies are connected to each other. It will be influenced mutually through a flexible body, and in order to implement | achieve appropriate obstruction | occlusion of a suction hole, it is necessary to consider the influence of adjacent valve bodies and a flexible body. Further, since a plurality of valve bodies are fixed to the flexible body, the cost increases as the number of parts increases, and further, it takes time to clean the valve bodies themselves. That is, in the suction device having the structure as in Patent Document 2, the structure related to suction is complicated, and it is difficult to simplify the suction mechanism, facilitate maintenance, and reduce costs.
　本発明はこのような課題に鑑みてなされたものであり、その目的とするところは、吸着機構の単純化を実現するとともに、メンテナンスの容易化及びコストの低減を図ることができる基板吸着装置及び基板吸着方法を提供することにある。 The present invention has been made in view of such a problem, and an object of the present invention is to realize a substrate suction apparatus capable of realizing simplification of a suction mechanism, facilitating maintenance and reducing costs. It is to provide a substrate adsorption method.
　上記目的を達成するため、本発明の基板吸着装置は、内部ガスを吸引して当接した基板を吸着する基板吸着装置であって、前記基板に当接し、複数の吸引孔を備える吸着部と、前記複数の吸引孔のそれぞれと連結する内部共有空間を前記吸着部と協働して形成し、前記内部共有空間から前記内部ガスを吸引するための吸引口を備える吸引孔連結部と、前記吸着部に内設され、前記吸引孔の開閉を行う複数の弁体を備える板状の吸引孔開閉部と、前記弁体は、前記吸引孔によって露出した前記吸着部の内側表面に当接して前記吸引孔を閉塞する閉塞板、前記閉塞板を前記吸引孔の延在方向に変位可能に支持する弾性支持板を備える。 In order to achieve the above object, a substrate suction device according to the present invention is a substrate suction device that sucks an inner gas and sucks the contacted substrate, and includes a suction part that contacts the substrate and includes a plurality of suction holes. A suction hole connecting portion that forms an internal shared space that is connected to each of the plurality of suction holes in cooperation with the suction portion, and includes a suction port for sucking the internal gas from the internal shared space; A plate-like suction hole opening / closing part provided in the suction part and having a plurality of valve bodies for opening and closing the suction hole, and the valve body abutting against the inner surface of the suction part exposed by the suction hole A closing plate for closing the suction hole, and an elastic support plate for supporting the closing plate so as to be displaceable in the extending direction of the suction hole are provided.
　上記目的を達成するため、本発明の基板吸着方法は、複数の吸引孔を備える吸着部に基板を当接する当接工程と、前記吸引孔内の内部ガスを吸引する吸引工程と、を有し、前記吸引工程においては、前記内部ガスの吸引量が閾値以上になると、前記吸引孔内に配設された板状の弾性支持板が前記吸引孔の延在方向に撓み、前記弾性支持板に支持された閉塞板が変位して前記吸引孔を閉塞する。 In order to achieve the above object, a substrate suction method of the present invention includes a contact step of contacting a substrate to a suction portion having a plurality of suction holes, and a suction step of sucking internal gas in the suction holes. In the suction step, when the amount of suction of the internal gas exceeds a threshold value, the plate-like elastic support plate disposed in the suction hole bends in the extending direction of the suction hole, and the elastic support plate The supported closing plate is displaced to close the suction hole.
　本発明により、吸着機構の単純化を実現するとともに、メンテナンスの容易化及びコストの低減を図ることができる。 According to the present invention, the suction mechanism can be simplified, maintenance can be facilitated, and cost can be reduced.
本発明の実施例に係る基板吸着装置の概略斜視図である。It is a schematic perspective view of the board | substrate adsorption | suction apparatus based on the Example of this invention. 本発明の実施例に係る基板吸着装置の吸着面側の正面図である。It is a front view by the side of a suction surface of a substrate suction device concerning an example of the present invention. 図２の線III-IIIに沿った基板吸着装置の断面図である。It is sectional drawing of the board | substrate adsorption | suction apparatus along line III-III of FIG. 本発明の実施例に係る基板吸着装置の構成部材である金属平板の平面図である。It is a top view of the metal flat plate which is a structural member of the board | substrate adsorption | suction apparatus which concerns on the Example of this invention. 図４における破線領域Ｖの拡大図である。FIG. 5 is an enlarged view of a broken line region V in FIG. 4. 図３における破線領域ＶＩの拡大図である。FIG. 4 is an enlarged view of a broken line area VI in FIG. 3. 図３と同様にして示す、基板を当接した状態の基板吸着装置の断面図である。It is sectional drawing of the board | substrate adsorption | suction apparatus of the state which contacted the board | substrate shown similarly to FIG. 図７における破線領域VIIIの拡大図である。FIG. 8 is an enlarged view of a broken line area VIII in FIG. 7. 図５と同様にして示す、本発明の変形例に係る金属平板の拡大平面図である。FIG. 6 is an enlarged plan view of a metal flat plate according to a modification of the present invention shown in the same manner as in FIG. 5. 図３と同様にして示す、本発明の変形例に係る基板吸着装置の断面図である。It is sectional drawing of the board | substrate adsorption | suction apparatus based on the modification of this invention shown similarly to FIG.
　以下、図面を参照し、本発明の実施の形態を実施例に基づき詳細に説明する。なお、本発明は以下に説明する内容に限定されるものではなく、その要旨を変更しない範囲において任意に変更して実施することが可能である。また、実施例の説明に用いる図面は、いずれも本発明による基板吸着装置及びその構成部材を模式的に示すものであって、理解を深めるべく部分的な強調、拡大、縮小、または省略などを行っており、基板吸着装置及びその構成部材の縮尺や形状等を正確に表すものとはなっていない場合がある。更に、実施例で用いる様々な数値は、一例を示すものであり、必要に応じて様々に変更することが可能である。 Hereinafter, embodiments of the present invention will be described in detail based on examples with reference to the drawings. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. The drawings used to describe the embodiments schematically show the substrate adsorption apparatus and its constituent members according to the present invention, and are partially emphasized, enlarged, reduced, omitted, etc., for better understanding. In some cases, it does not accurately represent the scale, shape, and the like of the substrate adsorption device and its constituent members. Furthermore, various numerical values used in the embodiments are examples, and can be variously changed as necessary.
＜実施例＞
　先ず、本発明の実施例に係る基板吸着装置１の構造について、図１乃至図３を参照して説明する。ここで、図１は、本実施例に係る基板吸着装置１の概略斜視図である。また、図２は、本実施例に係る基板吸着装置１の吸着面側の正面図である。更に、図３は、図２の線III-IIIに沿った本実施例に係る基板吸着装置１の断面図である。 <Example>
First, the structure of the substrate suction apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. Here, FIG. 1 is a schematic perspective view of the substrate suction apparatus 1 according to the present embodiment. FIG. 2 is a front view of the suction surface side of the substrate suction apparatus 1 according to this embodiment. FIG. 3 is a cross-sectional view of the substrate suction apparatus 1 according to the present embodiment taken along line III-III in FIG.
　図１乃至図３からわかるように、本実施例に係る基板吸着装置１は、吸着対象物である基板に当接して吸着する吸着部２、吸着部２の一端面に設置された蓋体３、吸着部２に内設された金属平板４、及び蓋体３に接続された接続管５を有している。また、図３に示すように、吸着部２は、平板状のエラストマー６、当該エラストマー６の一端面に接続された第１挟持板７、及び金属平板４を第１挟持板７と担持する第２挟持板８から構成されている。なお、吸着部２、蓋体３、及び金属平板４の接続は、ボルト等の接続部材（図示せず）によって行われており、これらの部材を容易に分離することにより、基板吸着装置１自体のメンテナンス及び清掃等が行い易くなっている。 As can be seen from FIG. 1 to FIG. 3, the substrate suction apparatus 1 according to the present embodiment includes a suction part 2 that comes into contact with and sucks a substrate that is a suction target, and a lid 3 that is installed on one end surface of the suction part 2. And a metal flat plate 4 provided in the suction portion 2 and a connecting pipe 5 connected to the lid 3. Further, as shown in FIG. 3, the adsorbing portion 2 includes a plate-like elastomer 6, a first holding plate 7 connected to one end surface of the elastomer 6, and a metal plate 4 that carries the first holding plate 7. It is composed of two sandwiching plates 8. In addition, the adsorption | suction part 2, the cover body 3, and the metal flat plate 4 are connected by connection members (not shown), such as a volt | bolt, The board | substrate adsorption | suction apparatus 1 itself is isolate | separated easily. It is easy to perform maintenance and cleaning.
　図２及び図３からわかるように、エラストマー６には略マトリックス状に複数の貫通孔１１が形成されている。ここで、本実施例においては、５行×５列であって中央部に貫通孔１１が形成されないように合計２４個の円柱状の貫通孔１１が形成されている。なお、当該数量、形状、配置構成はこれらに限定されることなく、基板吸着装置１自体の寸法、取り扱う基板の寸法、必要となる吸引力に応じて適宜変更することができる。 As can be seen from FIGS. 2 and 3, the elastomer 6 has a plurality of through holes 11 formed in a substantially matrix shape. Here, in the present embodiment, a total of 24 columnar through holes 11 are formed so that the through holes 11 are not formed in the center portion, which is 5 rows × 5 columns. In addition, the said quantity, a shape, and an arrangement configuration are not limited to these, It can change suitably according to the dimension of the board | substrate adsorption | suction apparatus 1 itself, the dimension of the board | substrate to handle, and required suction | attraction force.
　また、図３に示すように、第１挟持板７には複数の貫通孔１２が形成され、第２挟持板８には複数の貫通孔１３が形成されている。ここで、貫通孔１２及び貫通孔１３は、貫通孔１１に対応するように、略マトリックス状に形成されている。このため、１つの貫通孔１１と、１つの貫通孔１２と、１つの貫通孔１３とは連通しており、１つの吸引孔１４を形成し、基板吸着装置１自体としては、２４個の吸引孔１４を備えることになる。 Further, as shown in FIG. 3, a plurality of through holes 12 are formed in the first clamping plate 7, and a plurality of through holes 13 are formed in the second clamping plate 8. Here, the through holes 12 and the through holes 13 are formed in a substantially matrix shape so as to correspond to the through holes 11. Therefore, one through hole 11, one through hole 12, and one through hole 13 communicate with each other to form one suction hole 14, and the substrate suction apparatus 1 itself has 24 suctions. Holes 14 will be provided.
　更に、図３に示すように、貫通孔１２は、開口寸法が互いに異なる円柱状の第１開口部１２ａ、円柱状の第２開口部１２ｂ、及び円柱状の第３開口部１２ｃが連通することにより形成されている。本実施例において、第１開口部１２ａの開口径は貫通孔１１の開口径よりも大きく、第２開口部１２ｂの開口径は第１開口部１２ａの開口径よりも小さく、第３開口部１２ｃの開口径は第１開口部１２ａ及び第２開口部１２ｂの開口径よりも大きく設定されている。一方、貫通孔１３も、開口寸法が互いに異なる円柱状の第１開口部１３ａ、及び円柱状の第２開口部１３ｂが連通することにより形成されている。本実施例において、第１開口部１３ａの開口径は貫通孔１２の第３開口部１２ｃの開口径と同一であり、第２開口部１３ｂの開口径は第１開口部１３ａの開口径よりも小さく設定されている。なお、各開口部の形状、及び開口寸法は、上述した内容に限定されることなく、例えば、開口形状が多角形又は楕円でもよく、基板吸着装置１内に残存する内部ガス（例えば、空気、又は基板吸着装置１が使用される際の雰囲気ガス（窒素、酸素、又は空気等））の吸引を最適に行うことができるように開口寸法を適宜調整することができる。 Further, as shown in FIG. 3, the through-hole 12 has a columnar first opening 12 a, a columnar second opening 12 b, and a columnar third opening 12 c that have different opening dimensions. It is formed by. In this embodiment, the opening diameter of the first opening 12a is larger than the opening diameter of the through hole 11, the opening diameter of the second opening 12b is smaller than the opening diameter of the first opening 12a, and the third opening 12c. Is set larger than the opening diameters of the first opening 12a and the second opening 12b. On the other hand, the through hole 13 is also formed by communication between a columnar first opening 13a and a columnar second opening 13b having different opening dimensions. In this embodiment, the opening diameter of the first opening 13a is the same as the opening diameter of the third opening 12c of the through hole 12, and the opening diameter of the second opening 13b is larger than the opening diameter of the first opening 13a. It is set small. In addition, the shape of each opening part and an opening dimension are not limited to the content mentioned above, For example, an opening shape may be a polygon or an ellipse, and internal gas (for example, air, etc.) which remains in the board | substrate adsorption | suction apparatus 1 may be sufficient as it. Alternatively, the opening size can be adjusted as appropriate so that the atmospheric gas (nitrogen, oxygen, air, or the like) can be optimally sucked when the substrate adsorption apparatus 1 is used.
　そして、図３に示すように、蓋体３には、２４個の吸引孔１４を連結して接続管５の貫通孔５ａに接続する貫通孔１５が形成されている。より具体的に、貫通孔１５は、２４個の吸引孔１４を連結するための連結口１５ａ、及び連結口１５ａの中央部から接続管５の貫通孔５ａに内部ガスを吸引するための吸引口１５ｂから構成されている。このような蓋体３の構成により、蓋体３と第２挟持板８（吸着部２）とは、協働することによって内部共有空間（すなわち、連結口１５ａに該当する空間）を形成することになり、蓋体３は吸引孔１４の連結部（吸引孔連結部）として機能することになる。 As shown in FIG. 3, the lid 3 is formed with through holes 15 that connect the 24 suction holes 14 and connect to the through holes 5 a of the connection pipe 5. More specifically, the through hole 15 includes a connection port 15a for connecting the 24 suction holes 14, and a suction port for sucking the internal gas from the central portion of the connection port 15a to the through hole 5a of the connection tube 5. 15b. With such a configuration of the lid 3, the lid 3 and the second clamping plate 8 (suction portion 2) cooperate to form an internal shared space (that is, a space corresponding to the connection port 15 a). Thus, the lid 3 functions as a connecting portion (suction hole connecting portion) of the suction holes 14.
　本実施例においては、上述した各貫通孔によって吸引孔１４及び貫通孔１５が連結し、接続管５の貫通孔５ａに接続されている。このため、本実施例に係る基板吸着装置１においては、吸着対象物である基板をエラストマー６に当接させ、接続管５に接続された吸引ポンプ（図示せず）によって接続管５側から内部ガスを吸引することにより、基板吸着装置１内を負圧状態（一般的な真空状態）にして基板の吸着が可能になる。なお、基板の吸着に関する詳細な説明は後述する。 In the present embodiment, the suction hole 14 and the through hole 15 are connected by the above-described through holes and connected to the through hole 5a of the connecting pipe 5. For this reason, in the board | substrate adsorption | suction apparatus 1 which concerns on a present Example, the board | substrate which is an adsorption | suction object is made to contact | abut to the elastomer 6, and an inside is connected from the connection pipe 5 side by the suction pump (not shown) connected to the connection pipe 5. By sucking the gas, the inside of the substrate suction device 1 is brought into a negative pressure state (general vacuum state), and the substrate can be sucked. A detailed description of the adsorption of the substrate will be described later.
　本実施例においては、吸引対象物である基板を損傷することなく吸引するために、当該基板と当接する部分に板状のエラストマー６を用いたが、当該基板を損傷することがなく、また貫通孔１１を容易に形成することができれば、エラストマー６に代えて他の部材（例えば樹脂からなる平板）を用いてもよい。また、本実施例においては、第１挟持板７及び第２挟持板８については、基板吸着装置１の破損防止や強度向上のために、アクリル製の平板を用いているが、一定の強度を備え且つ貫通孔を容易に形成することができる他の板材を用いてもよい。 In this embodiment, in order to suck without damaging the substrate which is the suction target, the plate-like elastomer 6 is used for the portion in contact with the substrate, but the substrate is not damaged and penetrated. If the hole 11 can be easily formed, another member (for example, a flat plate made of resin) may be used instead of the elastomer 6. Further, in this embodiment, the first sandwiching plate 7 and the second sandwiching plate 8 are made of acrylic flat plates for preventing damage to the substrate suction device 1 and improving the strength. Other plate materials that can be provided and can easily form through holes may be used.
　次に、図４乃至図６を参照しつつ、金属平板４について詳細に説明する。ここで、図４は、金属平板４の平面図である。また、図５は、図４における破線領域Ｖの拡大図である。更に、図６は、図３における破線領域ＶＩの拡大図である。 Next, the metal flat plate 4 will be described in detail with reference to FIGS. 4 to 6. Here, FIG. 4 is a plan view of the metal flat plate 4. FIG. 5 is an enlarged view of a broken line region V in FIG. Further, FIG. 6 is an enlarged view of a broken line area VI in FIG.
　本実施例において、金属平板４は正方形の外形を備えており、金属平板４の材料にはステンレスが用いられている。また、図４に示すように、金属平板４には、吸引孔１４の開閉を行うための複数の弁体２１が略マトリックス状に形成されている。ここで、本実施例においては、５行×５列であって中央部に弁体２１が形成されないように合計２４個の弁体２１が形成されている。なお、金属平板４の材料及び形状、弁体２１の数量、並びに弁体２１の配置構成は上述した内容に限定されることなく、基板吸着装置１自体の形状、吸引孔１４の数量、及び吸引孔１４の形成位置に対応させて適宜変更することができる。例えば、金属平板４の材料としては、ニッケル、銅等の他の金属材料を用いることができる。 In this embodiment, the metal flat plate 4 has a square outer shape, and the material of the metal flat plate 4 is stainless steel. As shown in FIG. 4, a plurality of valve bodies 21 for opening and closing the suction holes 14 are formed on the metal flat plate 4 in a substantially matrix shape. Here, in the present embodiment, a total of 24 valve bodies 21 are formed so as to be 5 rows × 5 columns and not to form the valve bodies 21 at the center. The material and shape of the metal flat plate 4, the number of the valve bodies 21, and the arrangement configuration of the valve bodies 21 are not limited to the above-described contents, but the shape of the substrate suction device 1 itself, the number of suction holes 14, and the suction The position can be appropriately changed according to the position where the hole 14 is formed. For example, as the material of the metal flat plate 4, other metal materials such as nickel and copper can be used.
　図５に示すように、弁体２１のそれぞれは、中央部に位置し、吸引孔１４を閉塞するための円盤状の閉塞板２２、及び閉塞板２２の周囲を囲むように位置し、閉塞板２２を吸引孔１４の延在方向（すなわち、閉塞板２２の表裏面を貫く方向）に変位可能に支持する弾性支持板２３から構成されている。また、弾性支持板２３は、閉塞板２２を中心として同心状に形成された４つの環状部２４、並びに環状部２４同士、環状部２４と閉塞板２２と、及び環状部２４と弁体２１の周辺領域２５とを連結する合計１０個の連結部２６を含んでいる。 As shown in FIG. 5, each of the valve bodies 21 is located at the center and is located so as to surround the disk-shaped closing plate 22 for closing the suction hole 14 and the periphery of the closing plate 22. It is comprised from the elastic support plate 23 which supports 22 so that the displacement to the extension direction (namely, the direction which penetrates the front and back surfaces of the obstruction board 22) of the suction hole 14 is possible. The elastic support plate 23 includes four annular portions 24 formed concentrically around the closing plate 22, the annular portions 24, the annular portion 24 and the closing plate 22, and the annular portion 24 and the valve body 21. A total of ten connecting portions 26 that connect the peripheral region 25 are included.
　より具体的には、連結部２６は、隣接する環状部２４同士に対して２個ずつ設けられており、隣接する環状部２４と閉塞板２２とに対しても２ずつ設けられており、更には隣接する環状部２４と弁体２１の周辺領域２５とに対しても２ずつ設けられている。また、閉塞板２２の中心からの距離が等しい位置に設けられる連結部２６同士は、互いに対向する位置に（すなわち、閉塞板２２の中心として点対称に）配設されている。すなわち、弁体２１は、閉塞板２２の中心からの距離が等しい位置に設けられる２つの連結部２６を１組とすると、合計５組の連結部２６を備えている。更に、閉塞板２２の中心からの距離が等しい位置に設けられる１組の連結部２６は、当該１組の連結部２６よりも１つの内側に配設されている他の１組の連結部２６と比較して、閉塞板２２の中心を基準として９０度回転した位置に配設されている。 More specifically, two connecting portions 26 are provided for each of the adjacent annular portions 24, and two are provided for each of the adjacent annular portions 24 and the closing plate 22. Are provided two each for the adjacent annular portion 24 and the peripheral region 25 of the valve body 21. Further, the connecting portions 26 provided at the same distance from the center of the closing plate 22 are arranged at positions facing each other (that is, point-symmetric with respect to the center of the closing plate 22). That is, the valve body 21 includes a total of five sets of connecting portions 26, where two sets of connecting portions 26 provided at the same distance from the center of the blocking plate 22 are taken as one set. Further, the one set of connecting portions 26 provided at the same distance from the center of the closing plate 22 is another set of connecting portions 26 disposed on the inner side of the one set of connecting portions 26. Compared with the center of the closing plate 22, it is disposed at a position rotated 90 degrees with respect to the center.
　これらのことを換言すると、閉塞板２２の周囲には、１０個の反円弧状の開口部２７が同心状に形成され、閉塞板２２の中心からの距離が等しい位置に形成されている２つの開口部２７を１組とすると、合計５組の開口部２７が形成されていることになる。そして、閉塞板２２の中心からの距離が等しい位置に形成される１組の開口部２７は、当該１組の開口部２７よりも１つの内側に形成されている他の１組の開口部２７と比較して、閉塞板２２の中心を基準として９０度回転して形成されていることになる。上述した閉塞板２２、環状部２４、連結部２６、及び開口部２７の構造及び配置構成により、弁体２１は２点リンク構造の板バネから構成されていることになる。 In other words, ten anti-arc-shaped openings 27 are formed concentrically around the closing plate 22, and are formed at the same distance from the center of the closing plate 22. Assuming that the opening 27 is one set, a total of five sets of the opening 27 are formed. The one set of openings 27 formed at the same distance from the center of the closing plate 22 is another set of openings 27 formed on the inner side of the one set of openings 27. As compared with the above, the center of the closing plate 22 is rotated 90 degrees as a reference. Due to the structure and arrangement of the closing plate 22, the annular portion 24, the connecting portion 26, and the opening 27 described above, the valve body 21 is configured by a leaf spring having a two-point link structure.
　図６に示すように、基板吸着装置１の吸着部２の内部に設置された状態の金属平板４においては、貫通孔１２の第３開口部１２ｃと貫通孔１３の第１開口部１３ａとによって囲まれた空間内に弁体２１が配置されることになる。ここで、弁体２１の閉塞板２２は、貫通孔１３の第２開口部１３ｂの開口径よりも大きい直径を有している。本実施例においては、弁体２１自体の直径を約４ｍｍとし、閉塞板２２の直径を約２ｍｍとし、貫通孔１３の第２開口部１３ｂの開口径を１．６ｍｍとしているが、これらの数値は基板吸着装置１に要求される吸引力等に応じて適宜変更することができる。 As shown in FIG. 6, in the metal flat plate 4 installed inside the suction portion 2 of the substrate suction device 1, the third opening 12 c of the through hole 12 and the first opening 13 a of the through hole 13 are used. The valve body 21 will be arrange | positioned in the enclosed space. Here, the closing plate 22 of the valve body 21 has a diameter larger than the opening diameter of the second opening 13 b of the through hole 13. In this embodiment, the diameter of the valve body 21 itself is about 4 mm, the diameter of the closing plate 22 is about 2 mm, and the opening diameter of the second opening 13b of the through hole 13 is 1.6 mm. Can be appropriately changed according to the suction force required for the substrate suction apparatus 1.
　弁体２１は、２点リンク構造の板バネから構成されるため、吸引孔１４内に基板吸着装置１の外部から雰囲気ガス（例えば、空気又は窒素）が流通すると、閉塞板２２を貫通孔１３の第２開口部１３ｂに向かって押す力が弁体２１に生じることになる。当該押す力は、以下の数式（１）によって表すことができる。 Since the valve body 21 is configured by a plate spring having a two-point link structure, when an atmospheric gas (for example, air or nitrogen) flows from the outside of the substrate adsorption device 1 into the suction hole 14, the closing plate 22 passes through the through hole 13. The pushing force toward the second opening 13b is generated in the valve body 21. The pushing force can be expressed by the following formula (1).
Ｆ＝αＷ　　　（１）
ここで、Ｆが閉塞板２２を押す力であり、αは比例定数であり、Ｗは雰囲気ガスの流量である。なお、αは弁体２１の材質、寸法、構造等に既存する比例定数である。 F = αW (1)
Here, F is a force that pushes the closing plate 22, α is a proportional constant, and W is the flow rate of the atmospheric gas. Α is a proportional constant existing in the material, size, structure, etc. of the valve body 21.
　弁体２１に閉塞板２２を押す力が生じると（すなわち、弾性支持板２３が撓むと）、閉塞板２２が貫通孔１３の第２開口部１３ｂに向かって変位することになる。当該変位量は、以下の数式（２）によって表すことができる。 When a force pushing the closing plate 22 is generated in the valve body 21 (that is, when the elastic support plate 23 is bent), the closing plate 22 is displaced toward the second opening 13b of the through hole 13. The displacement amount can be expressed by the following mathematical formula (2).
Ｌ＝βＦ　　　（２）
ここで、Ｌが閉塞板２２の変位量であり、βは比例定数であり、Ｆは上述した閉塞板２２を押す力である。なお、βは弁体２１の材質、寸法、構造等に既存する比例定数である。 L = βF (2)
Here, L is the displacement amount of the closing plate 22, β is a proportionality constant, and F is the force pushing the closing plate 22 described above. Β is a proportional constant existing in the material, dimensions, structure, etc. of the valve body 21.
　上記数式（１）、（２）により、雰囲気ガスの流量（すなわち、吸引量）が閾値以上になると、閉塞板２２が貫通孔１３の第１開口部１３ａによって露出した第２挟持板８の内側表面８ａに当接することになる。すなわち、弁体２１は、雰囲気ガスの流量に応じて吸引孔１４の開閉を行うことになる。換言すれば、弁体２１は、雰囲気ガスの流量に応じて吸引孔１４を自栓することができる。 According to the above formulas (1) and (2), when the flow rate (that is, the suction amount) of the atmospheric gas is equal to or greater than the threshold value, the inner side of the second clamping plate 8 where the closing plate 22 is exposed by the first opening 13a of the through hole 13 It will contact the surface 8a. That is, the valve body 21 opens and closes the suction hole 14 according to the flow rate of the atmospheric gas. In other words, the valve body 21 can plug the suction hole 14 according to the flow rate of the atmospheric gas.
　ここで、上述した雰囲気ガスの流量の閾値とは、閉塞板２２の変位前の位置から第２挟持板８の内側表面８ａの位置までの距離Ａ（図６における両方向矢印Ａで示す）を変位するために必要な流量のことであるため、当該距離Ａを小さくすることにより、雰囲気ガスの流量の閾値を小さくすることができ、当該距離Ａを大きくすることにより、雰囲気ガスの流量の閾値を大きくすることができる。すなわち、閉塞板２２による吸引孔１４の閉塞の開始（すなわち、閉塞板２２が内側表面８ａに当接するタイミング）は、当該距離Ａによって制御することができる。換言すると、第２挟持板８の第１開口部１３ａの深さ（座グリ量）のみによって、弁体２１の自栓のタイミングを調整することが可能になる。 Here, the threshold value of the flow rate of the atmospheric gas described above is the displacement of the distance A (indicated by the double-headed arrow A in FIG. 6) from the position before displacement of the closing plate 22 to the position of the inner surface 8a of the second clamping plate 8. Therefore, by reducing the distance A, the threshold value of the atmospheric gas flow rate can be reduced, and by increasing the distance A, the threshold value of the atmospheric gas flow rate can be reduced. Can be bigger. That is, the start of the closing of the suction hole 14 by the closing plate 22 (that is, the timing at which the closing plate 22 contacts the inner surface 8a) can be controlled by the distance A. In other words, the self-plugging timing of the valve body 21 can be adjusted only by the depth (amount of counterbore) of the first opening 13a of the second clamping plate 8.
　そして、本実施例においては、閉塞板２２の直径が第２開口部１３ｂの開口径よりも大きいため、閉塞板２２が貫通孔１３の第２開口部１３ｂ側に変位することにより、確実に第２開口部１３ｂ（すなわち、吸引孔１４）を閉塞することが可能になる。すなわち、金属平板４は、吸引孔１４の開閉を行う吸引孔開閉部として機能することになる。なお、弁体２１、閉塞板２２、及び貫通孔１３の開口径は、基板吸着装置１に要求される吸引力に応じて適宜変更することができる。 In this embodiment, since the diameter of the closing plate 22 is larger than the opening diameter of the second opening 13b, the closing plate 22 is displaced to the second opening 13b side of the through hole 13 to ensure that the second opening 13b is displaced. 2 It becomes possible to block | close the opening part 13b (namely, suction hole 14). That is, the metal flat plate 4 functions as a suction hole opening / closing part that opens and closes the suction hole 14. In addition, the opening diameters of the valve body 21, the closing plate 22, and the through hole 13 can be appropriately changed according to the suction force required for the substrate suction device 1.
　本実施例に係る金属平板４の製造方法としては、金属からなる１枚の平板に対して、フォトリソグラフィを用いた公知のマスク形成技術、及び公知のエッチング又はレーザ加工により、所望の箇所に開口部２７を形成し、複数の弁体２１を備える金属平板４を形成してもよい。或いは、弁体２１及び周辺領域２５に対応する空隙を備えた金型に対して、めっきを施して当該空隙に金属を充填し、複数の弁体２１を備える金属平板４を形成してもよい。そして、本実施例のような５行×５列（中心には形成されていない）に配置された弁体２１を備える金属平板４を１つのブロックとし、複数のブロックを同時に形成して、その後に１枚ずつの金属平板４に切断してもよい。従って、本実施例の金属平板４は、従来のような弁体と当該弁体を支持する部材が独立した機構と比較して、大量かつ容易に製造することが可能になる。 As a method for manufacturing the metal flat plate 4 according to the present embodiment, a single plate made of metal is opened at a desired location by a known mask forming technique using photolithography and known etching or laser processing. You may form the metal plate 4 which forms the part 27 and is provided with the some valve body 21. FIG. Alternatively, the metal plate 4 provided with a plurality of valve bodies 21 may be formed by plating a mold having a gap corresponding to the valve body 21 and the peripheral region 25 to fill the gap with metal. . And the metal flat plate 4 provided with the valve body 21 arrange | positioned at 5 rows x 5 columns (it is not formed in the center) like a present Example is made into one block, and several blocks are formed simultaneously, and then It is also possible to cut one metal flat plate 4 at a time. Therefore, the metal flat plate 4 of the present embodiment can be manufactured in large quantities and easily as compared with a conventional mechanism in which a valve body and a member that supports the valve body are independent.
　次に、図７及び図８を参照しつつ、本実施例に係る基板吸着装置１を用いた基板吸着方法について説明する。図７は、図３と同様にして示す、基板３１を当接した状態の基板吸着装置１の断面図である。また、図８は、図７における破線領域VIIIの拡大図である。 Next, a substrate suction method using the substrate suction apparatus 1 according to the present embodiment will be described with reference to FIGS. FIG. 7 is a cross-sectional view of the substrate suction apparatus 1 in a state in which the substrate 31 is in contact, as shown in FIG. FIG. 8 is an enlarged view of a broken line region VIII in FIG.
　先ず、基板吸着方法として、吸着部２を基板３１に当接する当接工程を行う。より具体的には、対象物である基板３１の表面に対してエラストマー６の表面を接触させる。ここで、図７に示すように、基板３１に設けられたスルーホール３２が１つの吸引孔１４と連通した状態を想定する。 First, as a substrate adsorption method, an abutting step of abutting the adsorption unit 2 on the substrate 31 is performed. More specifically, the surface of the elastomer 6 is brought into contact with the surface of the substrate 31 that is the object. Here, as shown in FIG. 7, it is assumed that the through hole 32 provided in the substrate 31 communicates with one suction hole 14.
　この状態において、接続管５を介して吸引孔１４内の内部ガスの吸引を開始する（吸引工程）。吸引開始後において、スルーホール３２と連結していない吸引孔１４においては、内部ガスが吸引されて低圧状態が維持されるが、スルーホール３２と連結している吸引孔１４においては、スルーホール３２を経由して外部から雰囲気ガスが流通することになる。なお、当該雰囲気ガスが流通している状態では、貫通孔１５が負圧状態とならず、基板３１の吸着が不安定となる。 In this state, suction of the internal gas in the suction hole 14 is started via the connection pipe 5 (suction process). In the suction hole 14 not connected to the through hole 32 after the start of suction, the internal gas is sucked and the low pressure state is maintained, but in the suction hole 14 connected to the through hole 32, the through hole 32 is maintained. Atmospheric gas will circulate from the outside via In the state where the atmospheric gas is flowing, the through hole 15 is not in a negative pressure state, and the adsorption of the substrate 31 becomes unstable.
　上述した状態において、スルーホール３２と連結していない吸引孔１４においては、雰囲気ガスが流通しないため、弁体２１の閉塞板２２が変位することがない。一方、外部から雰囲気ガスが流通する吸引孔１４においては、図７及び図８に示すように、弾性支持板２３が撓み、閉塞板２２が第２挟持板８の内側表面８ａに当接することになる。これによって、全ての吸引孔１４が閉じた状態となり、全ての貫通孔１３及び貫通孔１５が負圧状態となり、更に当該負圧状態が維持されることよって基板３１の吸着を確実に行うことができる。 In the above-described state, the atmospheric gas does not flow in the suction hole 14 not connected to the through hole 32, so that the closing plate 22 of the valve body 21 is not displaced. On the other hand, in the suction hole 14 through which the atmospheric gas flows from the outside, as shown in FIGS. 7 and 8, the elastic support plate 23 bends and the closing plate 22 contacts the inner surface 8 a of the second sandwiching plate 8. Become. As a result, all the suction holes 14 are closed, all the through holes 13 and the through holes 15 are in a negative pressure state, and the negative pressure state is maintained, so that the substrate 31 can be reliably adsorbed. it can.
　なお、閉塞板２２は、弾性支持板２３の撓みによって吸引孔１４の延在方向に一定の周期で振動し、実際には第２挟持板の内側表面８ａとの接触及び非接触を当該周期で繰り返すことになるが、当該周期が非常に短いため実質的には常に接触している状態とほぼ変わることがない。 The closing plate 22 vibrates at a constant cycle in the extending direction of the suction hole 14 due to the bending of the elastic support plate 23, and actually contacts and non-contacts with the inner surface 8 a of the second clamping plate at the cycle. Although it repeats, since the said period is very short, it will not change substantially from the state always contacted substantially.
　また、図７及び図８においては、基板３１に設けられたスルーホール３２が１つの吸引孔１４と連通した状態を想定したが、基板にスルーホール３２がない場合や、スルーホール３２が存在しても、吸引孔１４と連通しない場合には、基板３１を当接することで、吸引孔１４が閉じ、その後の吸引によって全ての貫通孔１３及び貫通孔１５の負圧状態を維持することができる。このため、このような場合には、閉塞板２２が変位することもない。 7 and 8, it is assumed that the through hole 32 provided in the substrate 31 communicates with one suction hole 14. However, when the through hole 32 is not provided in the substrate, or the through hole 32 exists. However, when not communicating with the suction hole 14, the suction hole 14 is closed by contacting the substrate 31, and the negative pressure state of all the through holes 13 and the through holes 15 can be maintained by the subsequent suction. . For this reason, in such a case, the closing plate 22 is not displaced.
　本実施例においては、吸着部２に内設された板状の吸引孔開閉部に金属平板４に複数の弁体２１を形成し、当該弁体２１が重力に影響されることなく、雰囲気ガスの吸引量に依存する弾性力によって吸引孔１４の開閉を行っている。このため、本実施例に係る基板吸引装置１は、吸引方向が限定されることもない。また、吸引孔１４の開閉に対して、複数の弁体２１が形成された１枚の板状の金属平板４のみ使用するため、弁体と当該弁体を支持する部材が異なる部材から構成されているものや、弁体のそれぞれが独立しているものと比較して、吸引機構自体も単純化することができ、基板吸着装置１自体のメンテナンスの容易化及びコストの低減を図ることができる。 In the present embodiment, a plurality of valve bodies 21 are formed on the metal flat plate 4 in a plate-like suction hole opening / closing section provided in the adsorption section 2, and the valve body 21 is not affected by gravity, and the atmospheric gas The suction hole 14 is opened and closed by an elastic force depending on the suction amount. For this reason, the suction direction of the substrate suction apparatus 1 according to the present embodiment is not limited. Further, since only one plate-shaped metal flat plate 4 in which a plurality of valve bodies 21 are formed is used for opening and closing the suction hole 14, the valve body and the member that supports the valve body are composed of different members. The suction mechanism itself can be simplified as compared with the case where the valve body and the valve bodies are independent, and the maintenance of the substrate suction device 1 itself can be facilitated and the cost can be reduced. .
　上述した実施例において、弁体２１は２点リンク構造の板バネから構成されている場合を説明したが、図９に示すように、互いに隣接する環状部２４同士、環状部２４と閉塞板２２と、及び環状部２４と弁体２１の周辺領域２５とを連結する連結部２６を４個ずつにし、４点リンク構造の板バネを構成してもよく、図示しない３点リンク構造の板バネを構成してもよい。なお、リンク機構の数量（すなわち、連結部２６の数量）が増加すると、弾性支持板２３の撓み量が小さくなり、閉塞板２２の変位量も小さくなるため、できる限りリンク機構の数量が少ない板バネを構成することが好ましい。 In the above-described embodiment, the case where the valve body 21 is constituted by a leaf spring having a two-point link structure has been described. However, as shown in FIG. 9, the annular portions 24 adjacent to each other, the annular portion 24 and the closing plate 22. And four connecting portions 26 for connecting the annular portion 24 and the peripheral region 25 of the valve body 21 to form a four-point link structure leaf spring, or a three-point link structure leaf spring (not shown). May be configured. Note that when the number of link mechanisms (that is, the number of connecting portions 26) increases, the amount of flexure of the elastic support plate 23 decreases and the amount of displacement of the closing plate 22 also decreases. It is preferable to constitute a spring.
　また、弁体２１は板バネから構成されていれば、リンク構造を備えていなくてもよい。例えば、渦巻き状に弾性支持板を形成し、当該弾性支持板の中心部分に閉塞板を配置する構造であってもよい。 Further, as long as the valve body 21 is constituted by a leaf spring, the link structure may not be provided. For example, a structure in which an elastic support plate is formed in a spiral shape and a closing plate is disposed at the central portion of the elastic support plate may be employed.
　更に、図１０に示すように、エラストマー６に座グリ加工を施し、貫通孔１１を第１開口部１１ａ、第２開口部１１ｂから構成してもよい。具体的には、基板に当接する部分に位置する第１開口部１１ａの開口径を第２開口部１１ｂの開口径よりも大きくしてもよい、このような構造により、吸引力が向上することになり、より高精度且つ強力な基板の吸着を実現することができる。 Furthermore, as shown in FIG. 10, the elastomer 6 may be subjected to spot facing, and the through hole 11 may be constituted by a first opening 11a and a second opening 11b. Specifically, the opening diameter of the first opening portion 11a located at the portion in contact with the substrate may be larger than the opening diameter of the second opening portion 11b, and the suction force is improved by such a structure. Thus, it is possible to realize a highly accurate and powerful adsorption of the substrate.
＜本発明の実施態様＞
　本発明の第１実施態様に係る基板吸着装置は、内部ガスを吸引して当接した基板を吸着する基板吸着装置であって、前記基板に当接し、複数の吸引孔を備える吸着部と、前記複数の吸引孔のそれぞれと連結する内部共有空間を前記吸着部と協働して形成し、前記内部共有空間から前記内部ガスを吸引するための吸引口を備える吸引孔連結部と、前記吸着部に内設され、前記吸引孔の開閉を行う複数の弁体を備える板状の吸引孔開閉部と、前記弁体は、前記吸引孔によって露出した前記吸着部の内側表面に当接して前記吸引孔を閉塞する閉塞板、前記閉塞板を前記吸引孔の延在方向に変位可能に支持する弾性支持板を備える。 <Embodiment of the present invention>
A substrate suction device according to a first embodiment of the present invention is a substrate suction device that sucks an inner gas and sucks and comes into contact with the substrate, and includes a suction part that contacts the substrate and includes a plurality of suction holes; A suction hole connecting portion that forms an internal shared space connected to each of the plurality of suction holes in cooperation with the suction portion, and includes a suction port for sucking the internal gas from the internal shared space; A plate-like suction hole opening / closing part provided inside the part and having a plurality of valve bodies for opening and closing the suction hole, and the valve body abutting against the inner surface of the suction part exposed by the suction hole, A closing plate for closing the suction hole, and an elastic support plate for supporting the closing plate so as to be displaceable in the extending direction of the suction hole are provided.
　本実施態様においては、吸着部に内設された板状の吸引孔開閉部に弁体を形成し、当該弁体の重力に影響を受けない動きによって吸引孔の開閉を行う。このため、吸引方向が限定されることもない。また、吸引孔の開閉に対して、複数の弁体が形成された１枚の板状の吸引孔開閉部のみ使用するため、吸引機構自体も単純化することができ、基板吸着装置自体のメンテナンスの容易化及びコストの低減を図ることができる。 In this embodiment, a valve body is formed in a plate-like suction hole opening / closing section provided in the suction section, and the suction hole is opened / closed by a movement that is not affected by the gravity of the valve body. For this reason, the suction direction is not limited. In addition, since only a single plate-like suction hole opening / closing section formed with a plurality of valve elements is used for opening and closing the suction holes, the suction mechanism itself can be simplified, and maintenance of the substrate suction apparatus itself is performed. Simplification and cost reduction.
　本発明の第２実施態様に係る基板吸着装置は、上述した第１実施態様において、前記弾性支持板が、前記閉塞板を中心として同心状に形成された複数の環状部、及び前記複数の環状部同士を連結する連結部を含むことである。これにより、弾性支持板がばねの板バネのように機能することになり、重力の影響を受けずに、吸引孔の開閉を正確に行うことができる。 The substrate suction apparatus according to the second embodiment of the present invention is the substrate suction apparatus according to the first embodiment described above, wherein the elastic support plate is formed concentrically with the closing plate as a center, and the plurality of rings. It is including the connection part which connects parts. Accordingly, the elastic support plate functions like a leaf spring of a spring, and the suction hole can be opened and closed accurately without being affected by gravity.
　本発明の第３実施態様に係る基板吸着装置は、上述した第２実施態様において、前記閉塞板と前記環状部、及び互いに隣接する前記環状部が、２つの前記連結部によって連結されていることである。これにより、２点リンク機構を実現することができ、閉塞板の変位量を増加し、吸引孔の開閉をより容易且つ正確に行うことができる。 In the substrate suction apparatus according to the third embodiment of the present invention, in the second embodiment described above, the closing plate, the annular portion, and the annular portions adjacent to each other are connected by the two connecting portions. It is. Thereby, a two-point link mechanism can be realized, the displacement amount of the closing plate can be increased, and the suction hole can be opened and closed more easily and accurately.
　本発明の第４実施態様に係る基板吸着装置は、上述した第１乃至第３のいずれかの実施態様において、前記吸引孔が、前記弁体が内部に配設された第１貫通孔、及び前記閉塞板よりも小なる開口形状を含むことである。これにより、閉塞板を吸着部の内側側面に確実に当接することができ、吸引孔を確実に閉塞することができる。 The substrate suction apparatus according to a fourth embodiment of the present invention is the substrate suction apparatus according to any one of the first to third embodiments described above, wherein the suction hole includes a first through hole in which the valve body is disposed, and An opening shape smaller than the closing plate is included. Thereby, the closing plate can be reliably brought into contact with the inner side surface of the suction portion, and the suction hole can be reliably closed.
　本発明の第５実施態様に係る基板吸着装置は、上述した第１乃至第４のいずれかの実施態様において、前記吸着部が、前記基板に当接するエラストマー、並びに前記吸引孔開閉部を挟持する第１挟持板及び第２挟持板を含むことである。これにより、吸着部の主要構成部材を３つにすることができ、吸引機構自体もより単純化することができ、基板吸着装置自体のメンテナンスの容易化及びコストの低減を更に図ることができる。 A substrate suction apparatus according to a fifth embodiment of the present invention is the substrate suction apparatus according to any one of the first to fourth embodiments described above, wherein the suction portion sandwiches the elastomer that contacts the substrate and the suction hole opening / closing portion. A first sandwiching plate and a second sandwiching plate. As a result, the number of main constituent members of the suction portion can be made three, the suction mechanism itself can be further simplified, and the maintenance of the substrate suction device itself can be facilitated and the cost can be further reduced.
　本発明の第６実施態様に係る基板吸着装置は、上述した第１乃至第５のいずれかの実施態様において、前記複数の弁体が、前記吸引孔開閉部においてマトリックス状に形成されていることである。これにより、基板吸着装置が複数の吸引孔及び当該吸引孔に内設された弁体を備えることになり、吸引力の向上を図ることができる。 In the substrate suction apparatus according to the sixth embodiment of the present invention, in any one of the first to fifth embodiments described above, the plurality of valve bodies are formed in a matrix at the suction hole opening / closing portion. It is. Thereby, a board | substrate adsorption | suction apparatus will be provided with the valve body installed in the several suction hole and the said suction hole, and can aim at the improvement of suction power.
　本発明の第７実施態様に係る基板吸着方法は、複数の吸引孔を備える吸着部に基板を当接する当接工程と、前記吸引孔内の内部ガスを吸引する吸引工程と、を有し、前記吸引工程においては、前記内部ガスの吸引量が閾値以上になると、前記吸引孔内に配設された板状の弾性支持板が前記吸引孔の延在方向に撓み、前記弾性支持板に支持された閉塞板が変位して前記吸引孔を閉塞する。 A substrate suction method according to a seventh embodiment of the present invention includes a contact step of contacting a substrate to a suction portion having a plurality of suction holes, and a suction step of sucking internal gas in the suction holes, In the suction step, when the suction amount of the internal gas exceeds a threshold value, a plate-like elastic support plate disposed in the suction hole bends in the extending direction of the suction hole and is supported by the elastic support plate. The closed closing plate is displaced to close the suction hole.
　本実施態様においては、吸着部に内設された板状の吸引孔開閉部に弁体を形成し、内部ガスの吸引量に応じた当該弁体の動きによって吸引孔の開閉を行う。このため、吸引方向が限定されることもなく、吸引機構自体も単純化することができ、更には基板吸着装置自体のメンテナンスの容易化及びコストの低減を図ることができる。 In this embodiment, a valve body is formed in a plate-like suction hole opening / closing section provided in the suction section, and the suction hole is opened / closed by movement of the valve body in accordance with the amount of suction of the internal gas. Therefore, the suction direction is not limited, the suction mechanism itself can be simplified, and further, the maintenance of the substrate suction device itself can be facilitated and the cost can be reduced.
　本発明の第８実施態様に係る基板吸着方法は、上述した第７実施態様において、前記閉塞板による前記吸引孔の閉塞の開始は、前記吸引孔によって露出した前記吸着部の内側表面であって前記閉塞板と接触する部分と、変位前の前記閉塞板の位置とまでの距離によって調整されることである。これにより、閉塞板による吸引孔の閉塞の開始のタイミングを容易に調整することができ、吸着物である基板の寸法及び特性、並びに基板吸引装置の寸法に応じて、最適なタイミングにて吸引孔を閉塞することができ、より高精度の基板の吸着を実現することができる。 In the substrate suction method according to the eighth embodiment of the present invention, in the seventh embodiment described above, the start of the suction hole closing by the closing plate is an inner surface of the suction portion exposed by the suction hole. It is adjusted by the distance to the part which contacts the said obstruction board, and the position of the said obstruction board before a displacement. Thereby, the timing of starting the closing of the suction hole by the closing plate can be easily adjusted, and the suction hole is optimally timed according to the size and characteristics of the substrate as the adsorbed material and the size of the substrate suction device. The substrate can be closed, and the substrate can be more accurately adsorbed.
　１　　基板吸着装置
　２　　吸着部
　３　　蓋体（吸引孔連結部）
　４　　金属平板（吸引孔開閉部）
　５　　接続管
　５ａ　　貫通孔
　６　　エラストマー
　７　　第１挟持板
　８　　第２挟持板
　８ａ　　内側表面
　１１　　貫通孔
　１２　　貫通孔
　１２ａ　　第１開口部
　１２ｂ　　第２開口部
　１２ｃ　　第３開口部
　１３　　貫通孔
　１３ａ　　第１開口部
　１３ｂ　　第２開口部
　１４　　吸引孔
　１５　　貫通孔
　１５ａ　　連結口
　１５ｂ　　吸引口
　２１　　弁体
　２２　　閉塞板
　２３　　弾性支持板
　２４　　環状部
　２５　　周辺領域
　２６　　連結部
　２７　　開口部
　３１　　基板
　３２　　スルーホール
 
  DESCRIPTION OF SYMBOLS 1 Substrate adsorption device 2 Adsorption part 3 Lid (suction hole connection part)
4 Metal flat plate (suction hole opening / closing part)
DESCRIPTION OF SYMBOLS 5 Connection pipe 5a Through-hole 6 Elastomer 7 1st clamping board 8 2nd clamping board 8a Inner surface 11 Through-hole 12 Through-hole 12a 1st opening part 12b 2nd opening part 12c 3rd opening part 13 Through-hole 13a 1st opening part 13b 2nd opening part 14 Suction hole 15 Through-hole 15a Connection port 15b Suction port 21 Valve body 22 Blocking plate 23 Elastic support plate 24 Annular part 25 Peripheral area 26 Connection part 27 Opening part 31 Substrate 32 Through hole

Claims (8)

  1. 　内部ガスを吸引して当接した基板を吸着する基板吸着装置であって、
    　前記基板に当接し、複数の吸引孔を備える吸着部と、
    　前記複数の吸引孔のそれぞれと連結する内部共有空間を前記吸着部と協働して形成し、前記内部共有空間から前記内部ガスを吸引するための吸引口を備える吸引孔連結部と、
    　前記吸着部に内設され、前記吸引孔の開閉を行う複数の弁体を備える板状の吸引孔開閉部と、
    　前記弁体は、前記吸引孔によって露出した前記吸着部の内側表面に当接して前記吸引孔を閉塞する閉塞板、前記閉塞板を前記吸引孔の延在方向に変位可能に支持する弾性支持板を備える基板吸着装置。     A substrate adsorbing device that adsorbs an abutting substrate by sucking an internal gas,
    An adsorbing portion that contacts the substrate and includes a plurality of suction holes;
    A suction hole connecting portion that forms an internal shared space connected to each of the plurality of suction holes in cooperation with the suction portion, and includes a suction port for sucking the internal gas from the internal shared space;
    A plate-like suction hole opening and closing part provided in the suction part and provided with a plurality of valve bodies for opening and closing the suction hole;
    The valve body is in contact with an inner surface of the suction portion exposed by the suction hole and closes the suction hole, and an elastic support plate that supports the closure plate so as to be displaceable in the extending direction of the suction hole. A substrate suction apparatus comprising:
  2. 　前記弾性支持板は、前記閉塞板を中心として同心状に形成された複数の環状部、及び前記複数の環状部同士を連結する連結部を含む請求項１に記載の基板吸着装置。 2. The substrate suction apparatus according to claim 1, wherein the elastic support plate includes a plurality of annular portions formed concentrically with the closing plate as a center, and a connecting portion that connects the plurality of annular portions.
  3. 　前記閉塞板と前記環状部、及び互いに隣接する前記環状部は、２つの前記連結部によって連結されている請求項２に記載の基板吸着装置。 3. The substrate suction apparatus according to claim 2, wherein the closing plate, the annular portion, and the annular portions adjacent to each other are connected by the two connecting portions.
  4. 　前記吸引孔は、前記弁体が内部に配設された第１貫通孔、及び前記閉塞板よりも小なる開口形状を含む第２貫通孔を備える請求項１乃至３のいずれか１項に記載の基板吸着装置。 The said suction hole is provided with the 1st through-hole by which the said valve body was arrange | positioned inside, and the 2nd through-hole containing the opening shape smaller than the said obstruction | occlusion board. Substrate adsorption device.
  5. 　前記吸着部は、前記基板に当接するエラストマー、並びに前記吸引孔開閉部を挟持する第１挟持板及び第２挟持板を含む請求項１乃至４のいずれか１項に記載の基板吸着装置。 5. The substrate suction apparatus according to claim 1, wherein the suction unit includes an elastomer that contacts the substrate, and a first sandwiching plate and a second sandwiching plate that sandwich the suction hole opening / closing unit.
  6. 　前記複数の弁体は、前記吸引孔開閉部においてマトリックス状に形成されている請求項１乃至５のいずれか１項に記載の基板吸着装置。 The substrate adsorbing device according to any one of claims 1 to 5, wherein the plurality of valve bodies are formed in a matrix at the suction hole opening / closing portion.
  7. 　複数の吸引孔を備える吸着部に基板を当接する当接工程と、
    　前記吸引孔内の内部ガスを吸引する吸引工程と、を有し、
    　前記吸引工程においては、前記内部ガスの吸引量が閾値以上になると、前記吸引孔内に配設された板状の弾性支持板が前記吸引孔の延在方向に撓み、前記弾性支持板に支持された閉塞板が変位して前記吸引孔を閉塞する基板吸着方法。     An abutting step of abutting the substrate on an adsorption portion having a plurality of suction holes;
    A suction step of sucking the internal gas in the suction hole,
    In the suction step, when the suction amount of the internal gas exceeds a threshold value, a plate-like elastic support plate disposed in the suction hole bends in the extending direction of the suction hole and is supported by the elastic support plate. A substrate suction method in which the closed plate is displaced to close the suction hole.
  8. 　前記閉塞板による前記吸引孔の閉塞の開始は、前記吸引孔によって露出した前記吸着部の内側表面であって前記閉塞板と接触する部分と、変位前の前記閉塞板の位置とまでの距離によって調整される請求項７に記載の基板吸着方法。
     

          The start of the closing of the suction hole by the blocking plate depends on the distance between the inner surface of the suction portion exposed by the suction hole and the portion in contact with the blocking plate and the position of the blocking plate before displacement. The substrate adsorption | suction method of Claim 7 adjusted.


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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556376U (en) * 1992-01-16 1993-07-27 茂男 広瀬 Adsorption device
JPH06311597A (en) * 1993-04-21 1994-11-04 Tadashi Itagaki Electro-mechanical vibration converter
JP2002350483A (en) * 2001-05-29 2002-12-04 Hioki Ee Corp Circuit board sucker and circuit board inspection device
JP2004055707A (en) * 2002-07-18 2004-02-19 Matsushita Electric Ind Co Ltd Work suction unit
JP2006019396A (en) * 2004-06-30 2006-01-19 Tokyo Electron Ltd Substrate processing device
JP2010027726A (en) * 2008-07-16 2010-02-04 Nikon Corp Substrate joining apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010076929A (en) * 2008-09-29 2010-04-08 Ushio Inc Substrate conveying arm
JP5289164B2 (en) * 2009-04-24 2013-09-11 株式会社オプトニクス精密 Surface spring and safety valve using the same
JP5878269B1 (en) * 2015-03-31 2016-03-08 株式会社メイコー Substrate adsorption apparatus and substrate adsorption method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556376U (en) * 1992-01-16 1993-07-27 茂男 広瀬 Adsorption device
JPH06311597A (en) * 1993-04-21 1994-11-04 Tadashi Itagaki Electro-mechanical vibration converter
JP2002350483A (en) * 2001-05-29 2002-12-04 Hioki Ee Corp Circuit board sucker and circuit board inspection device
JP2004055707A (en) * 2002-07-18 2004-02-19 Matsushita Electric Ind Co Ltd Work suction unit
JP2006019396A (en) * 2004-06-30 2006-01-19 Tokyo Electron Ltd Substrate processing device
JP2010027726A (en) * 2008-07-16 2010-02-04 Nikon Corp Substrate joining apparatus

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