WO2016155328A1 - 一种扬声器模组 - Google Patents

一种扬声器模组 Download PDF

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Publication number
WO2016155328A1
WO2016155328A1 PCT/CN2015/094929 CN2015094929W WO2016155328A1 WO 2016155328 A1 WO2016155328 A1 WO 2016155328A1 CN 2015094929 W CN2015094929 W CN 2015094929W WO 2016155328 A1 WO2016155328 A1 WO 2016155328A1
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WO
WIPO (PCT)
Prior art keywords
speaker
conductive filler
housing
outer casing
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/094929
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English (en)
French (fr)
Inventor
邵明辉
杨健斌
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Goertek Inc
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Goertek Inc
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Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US15/542,866 priority Critical patent/US10397676B2/en
Publication of WO2016155328A1 publication Critical patent/WO2016155328A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H04R7/127—Non-planar diaphragms or cones dome-shaped
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/022—Cooling arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3418—Loud speakers

Definitions

  • the invention relates to a speaker module, and more particularly to a miniature speaker module with good heat dissipation effect.
  • Micro-speaker modules are very common electronic components in mobile phones, mobile computers and other electronic products. It provides communication, entertainment and other conveniences for people's lives. At present, the development trend of devices such as mobile phones is thinner, smaller, and more powerful. Accordingly, the volume of each component in the mobile phone needs to be further miniaturized.
  • the micro-speaker module is a relatively large-volume component. How to reduce the size of the micro-speaker module is a key issue for further thinning and shrinking the mobile phone. How to reduce the space occupied by the micro-speakers has become the main research and development direction of those skilled in the art.
  • the main means of reducing the volume of the microspeaker is to change the layout and structural features of the various components of the speaker, as well as to reduce the volume of the components themselves, such as reducing the size of the voice coil and magnet.
  • the volume of the microspeaker while reducing the volume of the microspeaker, its performance needs to be continuously improved, and the performance cannot be reduced due to the volume reduction.
  • the performance improvement of the speaker is mainly manifested in the fact that the magnetic field strength rises, the vibration of the diaphragm and the voice coil is more free, and the amplitude is larger. Reducing the volume of the microspeaker and improving the performance of the speaker has become a research and development direction for those skilled in the art.
  • the inventors of the present invention have found that in the case where the volume of the microspeaker is reduced and the power is increased, more heat is generated during operation, which becomes a factor that restricts the performance of the self.
  • the voice coil When the high-powered micro-speaker module is working, the voice coil generates more heat, causing the speaker structure temperature to rise sharply.
  • the volume of the micro-speaker is too small, it is difficult to release the heat immediately, which causes the temperature of the components around the voice coil to rise sharply, such as diaphragm, magnet, and injection molded casing.
  • Those skilled in the art are unaware that a combination of factors such as volume reduction and power increase may result in Obvious high temperature problems.
  • the heat dissipation capability of the product is often improved by using a pure metal casing or adding a metal heat sink.
  • a pure metal casing or adding a metal heat sink may affect the performance of the antenna near the speaker, and hinder the normal operation of the antenna and other related components.
  • the size of the heat sink cannot be too large, so it often fails to meet the ideal heat dissipation requirements.
  • the provision of a heat sink inevitably increases the number of components inside the speaker, increasing the space required for the microspeaker.
  • the provision of a heat sink in a microspeaker does not effectively solve the heat dissipation problem, but increases the volume.
  • the inventors of the present invention believe that it is necessary to provide a solution that can provide a good heat dissipation environment without affecting the normal operation of other antennas and other related components without increasing the volume of the microspeaker.
  • a speaker module comprising:
  • the module housing may include a first housing and a second housing, the second housing being mounted in combination with the first housing, the material of the first housing being doped with a thermally conductive filler. Further, the material of the second outer casing may also be doped with a heat conductive filler.
  • the module housing may further include a front cover mounted on the first outer casing or the second outer casing, and the material of the front cover is doped with a heat conductive filler.
  • the material of the module casing is plastic, and the plastic is doped with particles or powder of heat-conductive filler during injection molding.
  • the speaker assembly can include a single housing that is doped with a thermally conductive filler.
  • the thermally conductive filler may be silicon carbide, fibrous carbon powder, scaly carbon powder or boron nitride.
  • the thermally conductive filler is made of a metal material.
  • the mass ratio and/or volume ratio of the thermally conductive filler to the first outer casing is greater than 0.5%.
  • the thermally conductive filler has a thermal conductivity greater than 20 W/(m*k).
  • the speaker module may further include a heat conducting plate mounted at a bottom of the speaker assembly.
  • the speaker module provided by the invention effectively improves the heat dissipation performance of the module by improving the module casing, and can quickly transfer the heat generated by the speaker assembly to prevent the influence of high temperature on the normal operation of the speaker.
  • FIG. 1 is an exploded view showing the structure of a speaker module in a specific embodiment of the present invention
  • FIG. 2 is a schematic view showing a doped thermally conductive filler in the first outer casing of the present invention
  • Figure 3 is a cross-sectional view of a first outer casing and a second outer casing in accordance with an embodiment of the present invention
  • FIG. 4 is a cross-sectional view of a speaker module in accordance with an embodiment of the present invention.
  • the invention provides a speaker module, which comprises a speaker assembly, a module housing and a module front cover.
  • the speaker assembly includes an electromagnetic component, a vibration component, and the like for manufacturing a sound
  • the speaker component is mounted in the module housing.
  • the module housing includes a first housing and a second housing.
  • the front cover is mounted in cooperation with the module housing for encapsulating the speaker assembly in the module housing.
  • the first housing is doped with a thermally conductive filler.
  • the first housing 11 has a speaker slot 111, and the speaker assembly 3 is mounted inside the speaker slot 111.
  • the second outer casing 12 may be mounted in combination with the first outer casing 11 , for example, the second outer casing 12 is mounted below the first outer casing 11 , and the speaker assembly is sealed from the bottom of the speaker slot 111 . 3.
  • the second housing 12 may have an opening corresponding to the speaker slot 111 for ease of assembly and heat dissipation.
  • a heat conducting plate 5 may be mounted at the bottom of the speaker assembly 3 for connecting the bottom of the speaker assembly 3 to an outer casing, such as an outer casing of an electronic device, to facilitate heat transfer.
  • the heat conducting plate 5 may be a metal material or a non-metal material with high thermal conductivity.
  • the front cover 4 may be mounted on the first outer casing 11 to seal the front surface of the speaker slot 111 for protecting the speaker assembly.
  • the vibration assembly of the speaker assembly 3 may include a diaphragm and a voice coil, the electromagnetic assembly may include a magnet and a washer, and in addition, the speaker assembly 3 may further include a single housing.
  • the speaker module is an integrated module, and the speaker assembly 3 does not include a single housing.
  • the speaker assembly 3 includes a single housing, and the diaphragm, voice coil, magnet, and washer are mounted in the unit housing, and the unit housing is mounted in the In the speaker slot 111.
  • the heat conductive filler 2 may also be doped in the single housing.
  • the single housing is in contact with the first housing 11, and the heat generated by the diaphragm and the voice coil can be efficiently extracted.
  • the thermally conductive filler 2 serves to increase the thermal conductivity of the first outer casing 11, the second outer casing 12, and the outer casing.
  • the first outer casing 11, the second outer casing 12, and the single outer casing may be made of plastic.
  • the injection molding material may be doped with particles or powder of the heat conductive material to make the heat conductive filler 2 uniform as much as possible. The distribution is in plastic to increase the thermal conductivity of the outer casing, as shown in Figure 2.
  • the thermal conductivity coefficient of plastic is very low, usually less than 1W/(m*k), and the thermal conductivity coefficient of the thermal conductive filler 2 is preferably greater than 20W/(m*k), which ensures that after the material shell is doped with the thermally conductive filler 2, in terms of heat dissipation
  • a metal material can be used as the heat conductive filler 2 such as copper powder, aluminum powder or the like.
  • Metal materials have good thermal conductivity, but metal heat conductive filler 2 can affect the normal operation of other parts in electronic equipment. Therefore, the thermally conductive filler 2 may also be a non-metallic material such as silicon carbide, fibrous carbon powder, scaly carbon powder, boron nitride or the like.
  • Toner has a very high thermal conductivity coefficient, but it is expensive and is not suitable for use in everyday speaker structures, and is generally used in precision instruments.
  • Boron nitride, silicon carbide and other materials have thermal conductivity coefficients greater than 50W/(m*k), which are suitable for general everyday speaker structure housings.
  • the shape of the thermally conductive filler 2 may be in the form of granules, flakes, spheres, fibers, whiskers, etc., and those skilled in the art may prepare powders of different shapes of thermally conductive filler 2 according to actual needs, and sheet-like and fibrous heat-conductive fillers.
  • thermally conductive filler 2 has a higher thermal conductivity coefficient in some directions, and the granular, spherical thermally conductive filler 2 has a uniform thermal conductivity coefficient in all directions.
  • the size of the thermally conductive filler 2 can also be adjusted according to actual needs.
  • the size of the thermally conductive filler 2 particles ranges from nanometers to centimeters, especially ultrafinely refined materials.
  • the surface of the thermally conductive filler 2 may be modified to enhance the adhesion of the substrate to the thermally conductive filler.
  • the mass ratio of the thermally conductive filler 2 to the first outer casing 11 should be greater than 0.5% to ensure that the thermal conductivity coefficient of the first outer casing 11 after filling the thermally conductive filler 2 is significantly improved. Achieve enhanced thermal conductivity.
  • the volume ratio of the thermally conductive filler 2 to the first outer casing 11 should also be greater than 0.5%.
  • the first outer casing 11 is doped and filled with a heat conductive filler 2
  • the second outer casing 12 is not doped with the heat conductive filler 2.
  • the structural stability, strength, toughness and the like of the plastic itself may be changed, and in order to prevent the performance change of the plastic outer casing from affecting the reliability and sound quality of the speaker module, in this embodiment only
  • the first outer casing 11 is doped with a thermally conductive filler 2.
  • the thermally conductive filler 2 may also be doped in the second outer casing 12 in the case where the reliability of the speaker module can be ensured.
  • the heat-conductive filler 2 can also be doped in the single-shell, so that the heat generated by the diaphragm and the voice coil can be smoothly transmitted from the single-shell.
  • Heat is conducted to the outside of the device through the first outer casing 11 and the second outer casing 12.
  • the first outer casing 11 and the second outer casing 12 are doped with a non-metallic material such as silicon carbide or boron nitride.
  • the heat generated when the speaker assembly 3 is in operation can be transmitted outward through the first outer casing 11, the second outer casing 12, and the bottom heat conducting plate 5.
  • the outer casing doped and filled with the heat conductive filler 2 and the heat conducting plate 5 have a good thermal conductivity coefficient, and can quickly and efficiently conduct heat, thereby preventing magnet degaussing, softening of the diaphragm and the like caused by excessive temperature, and avoiding the operation of the speaker. decline in quality.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开了一种扬声器模组其中包括：扬声器组件、模组外壳和前盖。所述模组外壳用于承载所述扬声器组件，其中包括第一外壳和第二外壳，所述第一外壳中掺杂有导热填料。所述前盖用于与所述模组外壳配合封装所述扬声器组件。本发明提供的扬声器模组能够快速将扬声器组件工作时产生的热量经模组外壳传出，防止扬声器组件过热，进而避免由于高温引起的扬声器性能损失。

Description

一种扬声器模组 技术领域
本发明涉及一种扬声器模组，更具体地，涉及一种具有良好散热效果的微型扬声器模组。
背景技术
微型扬声器模组在手机、移动电脑等电子产品中是十分常见的电子零件，它为人们的生活提供了通讯、娱乐等多方面的便利。目前，对于手机等设备的发展趋势是厚度更薄、体积更小、功能更强，相应的，手机中的各部件的体积也需要进一步微型化。
在手机中，微型扬声器模组是占用空间相对较大的部件，如何减小微型扬声器模组的体积是进一步减薄、缩小手机的关键问题。如何减小微型扬声器占用的空间成为本领域技术人员的主要研发方向。现阶段，减小微型扬声器的体积的主要手段是通过改变扬声器各部件的布局和结构特征，以及缩小个部件自身的体积，例如减小音圈、磁铁的大小。相对的，在减小微型扬声器的体积的同时，其性能也需要不断提高，不能由于体积减小造成性能的下降。所以，如何提高微型扬声器的性能成为本领域技术人员的另一个主要研发方向。扬声器的性能提升，主要表现在磁场强度上升、振膜和音圈的振动更自由、振幅更大等特点。减小微型扬声器的体积并提高扬声器的性能，成为目前本领域技术人员的只要研发方向。
但是，本发明的发明人却发现，在微型扬声器体积减小、功率增大的情况下，其工作时会产生更多的热量，这成为制约自身性能发挥的因素。功率较大的微型扬声器模组在工作时，音圈会产生更多的热量，造成扬声器结构温度大幅上升。而由于微型扬声器的体积过小，热量难以即时释放，从而造成音圈周围的零部件温度也会大幅升高，如振膜，磁铁，注塑外壳等。本领域技术人员并未意识到，体积缩小、功率上升的综合因素会造成 明显的高温问题。微型扬声器模组内部温度过高会导致振膜变软，磁铁退磁，注塑外壳软化变形等问题，最终导致扬声器性能衰退，甚至失效。所以，本发明人意识到，在微型扬声器工作功率提高的情况下，其各个部件自身的耐热性及扬声器系统的散热能力成为制约扬声器整体性能提升的障碍。
一般情况下，当扬声器温度过高时，往往通过使用纯金属的外壳或者添加金属散热片来改善产品的散热能力。但对于使用在手机等通讯终端中的微型扬声器，金属成分过多的外壳会对扬声器附近的天线的性能造成影响，阻碍天线等相关零件的正常工作。而另一方面，由于微型扬声器模组的体积限制，散热片的尺寸不能过大，所以往往也达到不到理想的散热要求。但是设置散热片则不可避免的增加了扬声器内部的部件数量，增大了微型扬声器需要占用的空间。所以，在微型扬声器中设置散热片并不能有效的解决散热问题，反而增加了体积。本发明的发明人认为，有必要提供一种既能够提供良好散热环境，又能不影响其他天线等相关零件的正常工作，同时不增大微型扬声器体积的解决办法。
发明内容
本发明的一个目的是提供一种具有良好散热性能的扬声器模组。
根据本发明的一个方面，提供了一种扬声器模组，其中包括：
扬声器组件；
承载所述扬声器组件的模组外壳，所述模组外壳的材料中掺杂有导热填料。
所述模组外壳可以包括第一外壳和第二外壳，所述第二外壳与第一外壳组合安装，所述第一外壳的材料中掺杂有导热填料。进一步地，所述第二外壳的材料中也可以掺杂有导热填料。
所述模组外壳还可以包括前盖，所述前盖安装在所述第一外壳或第二外壳上，所述前盖的材料中掺杂有导热填料。
优选地，所述模组外壳的材料为塑料，在注塑加工时，塑料中掺杂有导热填料的颗粒或粉末。
所述扬声器组件可以包括单体外壳，所述单体外壳的材料中掺杂有导热填料。
所述导热填料可以为碳化硅、纤维状碳粉、鳞片状碳粉或氮化硼。或者，所述导热填料采用金属材料。
优选的，所述导热填料与所述第一外壳的质量比和/或体积比大于0.5％。所述导热填料的导热系数大于20W/(m*k)。
另外，所述扬声器模组还可以包括导热板，所述导热板安装在所述扬声器组件的底部。
本发明提供的扬声器模组通过对模组外壳的改进，有效提高了模组的散热性能，可以快速将扬声器组件工作是产生的热量传出，防止高温对扬声器正常工作的影响。通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明具体实施例中扬声器模组的结构爆炸图；
图2是本发明所述第一外壳中掺杂导热填料的示意图；
图3是本发明具体实施例中第一外壳和第二外壳的截面图；
图4是本发明具体实施例中扬声器模组的截面图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明提供一种扬声器模组，其中包括扬声器组件、模组外壳以及模组前盖。所述扬声器组件包括电磁组件、振动组件等用于制造声音的设备零件，所述扬声器组件安装在所述模组外壳中。为了便于装配扬声器组件，所述模组外壳包括第一外壳和第二外壳。所述前盖与所述模组外壳配合安装，用于将所述扬声器组件封装在所述模组外壳中。特别的，为了增强所述模组外壳的散热性能，所述第一外壳中掺杂有导热填料。
在具体实施例中，如图1所示，所述第一外壳11上具有扬声器槽111，所述扬声器组件3安装在所述扬声器槽111内部。所述第二外壳12可以与所述第一外壳11上下组合安装，例如所述第二外壳12安装在所述第一外壳11的下方，从所述扬声器槽111的底部封住所述扬声器组件3。特别的，为了便于装配和散热，所述第二外壳12上可以具有与所述扬声器槽111相对应的开口。所述扬声器组件3安装在所述扬声器槽111中时，扬声器组件3的底部往往不接触到所述第二壳体的下表面，如果所述第二壳体上具有开口，则所述扬声器组件3的底面相对于第二壳体的表面，向所述扬声器槽111内部缩进一段距离，不会与外部结构接触。在本发明的实施例中，可以在所述扬声器组件3的底部安装导热板5，用于将所述扬声器组件3的底部连接到外部壳体，例如电子设备的外壳体上，以便于热量的传递。所述导热板5可以为金属材料，也可以为高导热率的非金属材料，本领域技术人员可以视实际情况，在金属材料不会影响到天线等电磁设备正常工作的前提下，选择金属质地的导磁板。所述前盖4可以安装在所述第一外壳11上，将所述扬声器槽111的正面封住，用于保护所述扬声器组件。
所述扬声器组件3的振动组件可以包括振膜和音圈，所述电磁组件可以包括磁铁和华司，另外，扬声器组件3还可以包括单体外壳。在本发明 图1所述的实施例中，所述扬声器模组为一体化模组，扬声器组件3不包括单体外壳。在本发明的另一实施例中，所述扬声器组件3包括单体外壳，所述振膜、音圈、磁铁和华司安装在所述单体外壳中，所述单体外壳安装在所述扬声器槽111中。特别的，为了增强所述扬声器组件3的散热效果，所述单体外壳中也可以掺杂导热填料2。所述单体外壳与所述第一外壳11接触，可以高效的将振膜、音圈产生的热量导出。
所述导热填料2用于增加所述第一外壳11、第二外壳12以及单体外壳的导热率。通常，所述第一外壳11、第二外壳12以及单体外壳均可以由塑料制成，在注塑加工时，可以向注塑材料中掺杂导热材料的颗粒或粉末，尽可能使导热填料2均匀的分布在塑料中，以增加外壳的导热率，如图2所示。塑料的导热率系数很低，通常小于1W/(m*k)，导热填料2的导热率系数优选大于20W/(m*k)，这样可以确保物料外壳掺杂导热填料2之后，在散热方面有明显提升。例如可以采用金属材料作为导热填料2，如铜粉、铝粉等。金属材料具有良好的导热性能，但是，金属导热填料2会影响电子设备中其它零件的正常工作。所以，所述导热填料2还可以是非金属材料，例如碳化硅、纤维状碳粉、鳞片状碳粉、氮化硼等材料。碳粉具有极高的导热率系数，但是价格昂贵，不适合使用于日常扬声器结构，一般用于精密仪器中。氮化硼、碳化硅等材料的热导率系数均大于50W/(m*k)，适用于一般日常的扬声器结构外壳中。所述导热填料2的形状可以是粒状、片状、球形、纤维状、晶须等形态，本领域技术人员可以根据实际需要，制备不同形状的导热填料2粉末，片状、纤维状的导热填料2具有在某些方向上导热率系数更高的性质，而粒状、球形的导热填料2在各个方向上具有均匀的导热率系数。所述导热填料2的尺寸也可以根据实际需求进行调整，导热填料2颗粒的尺寸包含从纳米级到厘米级之间，尤其是经过超细微化处理的材料。另外，在将所述导热填料2掺杂、填充到塑料中之前，还可以对导热填料2的表面进行改性处理，增强基体与导热填剂的粘接程度。
特别的，所述导热填料2与所述第一外壳11的质量比应大于0.5％，以保证所述第一外壳11填充导热填料2之后，导热率系数有明显的提升， 达到增强导热性的效果。优选的，所述导热填料2与第一外壳11的体积比也应大于0.5％。
另外，如图3所示，在本发明上述实施例中，所述第一外壳11中掺杂、填充了导热填料2，所述第二外壳12中未掺杂导热填料2。当塑料外壳中填充有导热填料2时，塑料自身的结构稳定性、强度、韧性等性能会发生改变，为防止塑料外壳的性能变化影响扬声器模组的可靠性和声音质量，该实施例中仅在第一外壳11中掺杂了导热填料2。在其它实施方式中，在所述扬声器模组的可靠性能够得到保障的情况下，所述第二外壳12中也可以掺杂所述导热填料2。另外，当所述扬声器组件3包括单体外壳时，所述单体外壳中也可以掺杂导热填料2，以使振膜、音圈工作时产生的热量能够顺畅的从单体外壳中传出，经过第一外壳11和第二外壳12将热量传导至设备之外。优选的，为使导热填料2不影响电子设备中其它零件的正常运转，所述第一外壳11和所述第二外壳12掺杂的导热材料采用非金属材料，例如碳化硅、氮化硼。
如图4所示，所述扬声器组件3工作时产生的热量，可以通过侧面的第一外壳11、第二外壳12以及底部的导热板5向外传出。掺杂、填充有导热填料2的外壳以及导热板5具有良好的导热率系数，能够快速、高效的将热量导出，从而防止温度过高造成的磁铁消磁、振膜软化等问题，避免扬声器的工作质量下降。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括：
    扬声器组件(3)；
    承载所述扬声器组件(3)的模组外壳，所述模组外壳的材料中掺杂有导热填料(2)。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述模组外壳包括第一外壳(11)和第二外壳(12)，所述第二外壳(12)与第一外壳(11)组合安装，所述第一外壳(11)的材料中掺杂有导热填料(2)。
  3. 根据权利要求2所述的扬声器模组，其特征在于，第二外壳(12)的材料中掺杂有导热填料(2)。
  4. 根据权利要求2所述的扬声器模组，其特征在于，所述模组外壳包括前盖(4)，所述前盖(4)安装在所述第一外壳(11)或第二外壳(12)上，所述前盖(4)的材料中掺杂有导热填料(2)。
  5. 根据权利要求1所述的扬声器模组，其特征在于，所述模组外壳的材料为塑料，在注塑加工时，塑料中掺杂有导热填料(2)的颗粒或粉末。
  6. 根据权利要求1所述的扬声器模组，其特征在于，所述扬声器组件(3)包括单体外壳，所述单体外壳的材料中掺杂有导热填料(2)。
  7. 根据权利要求1所述的扬声器模组，其特征在于，所述导热填料(2)为碳化硅、纤维状碳粉、鳞片状碳粉、氮化硼，或者，所述导热填料(2)为金属材料。
  8. 根据权利要求2所述的扬声器模组，其特征在于，所述导热填料(2)与所述第一外壳(11)的质量比和/或体积比大于0.5％。
  9. 根据权利要求1所述的扬声器模组，其特征在于，所述导热填料(2)的导热系数大于20W/(m*k)。
  10. 根据权利要求1所述的扬声器模组，其特征在于，所述扬声器模组包括导热板(5)，所述导热板(5)安装在所述扬声器组件(3)的底部。
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