WO2016152905A1 - 配線基板、電子装置および電子モジュール - Google Patents

配線基板、電子装置および電子モジュール Download PDF

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Publication number
WO2016152905A1
WO2016152905A1 PCT/JP2016/059157 JP2016059157W WO2016152905A1 WO 2016152905 A1 WO2016152905 A1 WO 2016152905A1 JP 2016059157 W JP2016059157 W JP 2016059157W WO 2016152905 A1 WO2016152905 A1 WO 2016152905A1
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Prior art keywords
insulating substrate
wiring board
view
electrode
plan
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PCT/JP2016/059157
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English (en)
French (fr)
Inventor
健策 村上
晃一 川崎
陽介 森山
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京セラ株式会社
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Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2017508382A priority Critical patent/JP6595580B2/ja
Priority to CN201680017683.9A priority patent/CN107431047B/zh
Priority to US15/559,092 priority patent/US10290591B2/en
Publication of WO2016152905A1 publication Critical patent/WO2016152905A1/ja

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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12035—Zener diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Definitions

  • the present invention relates to a wiring board, an electronic device, and an electronic module.
  • a wiring board is provided on one main surface of an insulating substrate, and includes a mounting electrode for mounting electronic components, a terminal electrode provided on the other main surface of the insulating substrate, and a mounting electrode and a terminal electrode. Some are connected and have a wiring conductor provided on the main surface or inside of the insulating substrate.
  • the terminal electrode is bonded to the module substrate via a bonding material such as solder (Japanese Patent Laid-Open No. 2009-267041). See the official gazette).
  • the wiring board is provided on the insulating substrate and on one main surface of the insulating substrate so as to face along a pair of sides facing the insulating substrate in a plan view.
  • a mounting electrode and a terminal electrode provided on the other main surface of the insulating substrate so as to face each other along a pair of opposite sides of the insulating substrate in a plan view.
  • an electronic device includes the wiring board having the above-described configuration and an electronic component mounted on the wiring board.
  • an electronic module includes the electronic device having the above-described configuration, and a module substrate having a connection pad, the electronic device being connected to the connection pad via a bonding material. ing.
  • a wiring board includes an insulating substrate, and a mounting electrode provided on one main surface of the insulating substrate so as to face each other along a pair of sides facing the insulating substrate in plan view,
  • the other main surface of the insulating substrate has terminal electrodes provided so as to face each other along another set of sides facing the insulating substrate in a plan view.
  • An electronic device includes a wiring board having the above-described configuration and an electronic component mounted on the wiring board, so that an electronic device having excellent long-term reliability can be obtained.
  • An electronic module includes an electronic device having the above configuration, a connection pad, and the electronic device includes a module substrate connected to the connection pad via a bonding material. It can be excellent in long-term reliability.
  • (A) is a top view which shows the electronic device in the 1st Embodiment of this invention
  • (b) is a bottom view of (a).
  • (A) is a longitudinal sectional view taken along line AA of the electronic device shown in FIG. 1 (a), and (b) is taken along line BB of the electronic device shown in FIG. 1 (a). It is a longitudinal cross-sectional view.
  • (A) And (b) is a longitudinal cross-sectional view which shows the electronic module mounted in the board
  • (A) is a top view which shows the electronic device in the other example of the 1st Embodiment of this invention
  • (b) is a bottom view of (a).
  • FIG. 7 is an internal top view of a wiring board in the electronic device shown in FIG. 6.
  • A) is a longitudinal sectional view taken along line AA of the electronic device shown in FIG. 6 (a), and (b) is taken along line BB of the electronic device shown in FIG. 1 (a). It is a longitudinal cross-sectional view. It is an upper surface perspective view which shows the wiring board in the other example of the 2nd Embodiment of this invention.
  • FIG. 11 is an internal bottom view of a wiring board in the electronic device shown in FIG.
  • FIG. 10A is a longitudinal sectional view taken along line AA of the electronic device shown in FIG. 10A
  • FIG. 10B is taken along line BB of the electronic device shown in FIG. It is a longitudinal cross-sectional view. It is a lower surface perspective view which shows the wiring board in the other example of the 3rd Embodiment of this invention.
  • the light emitting device includes a wiring board 1 and an electronic component 2 provided on the upper surface of the wiring board 1 as in the example shown in FIGS. 1 and 2.
  • the electronic device is connected to the connection pads 51 on the module substrate 5 constituting the electronic module, for example, using the bonding material 6.
  • the wiring board 1 in this embodiment includes an insulating substrate 11, a mounting electrode 12 provided on one main surface of the insulating substrate 11, a terminal electrode 13 provided on the other main surface of the insulating substrate 11, and a mounting electrode.
  • the wiring conductor 14 is connected to the electrode 12 and the terminal electrode 13 and provided on the surface or inside of the insulating substrate 11.
  • the mounting electrodes 12 are provided so as to face each other along a pair of opposing sides of the insulating substrate 11 in plan view.
  • the terminal electrodes 13 are provided so as to face each other along a pair of opposing sides of the insulating substrate 11 in a plan view. 1 to 3, the electronic device is mounted on an xy plane in a virtual xyz space. 1 to 3, the upward direction means the positive direction of the virtual z-axis.
  • the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the wiring board 1 or the like is actually used.
  • FIG. 1A a portion where the outer edge of the mounting electrode 12 and the electronic component 2 overlap, and in FIG. 1, the wiring conductor 14 (through conductor) is indicated by a broken line.
  • FIG. 1B the electronic component 2 is indicated by a two-dot chain line.
  • the insulating substrate 11 has one main surface (upper surface in FIGS. 1 and 2) and the other main surface (lower surface in FIGS. 1 and 2).
  • the insulating substrate 11 has a rectangular plate shape having two sets of opposing sides (four sides) with respect to each of the one main surface and the other main surface in plan view.
  • the insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is placed on a mounting electrode 12 provided on one main surface of the insulating substrate 11 via a connection member 3 such as a solder bump. Glued and fixed.
  • the insulating substrate 11 for example, ceramics such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body can be used.
  • the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc.
  • a suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry.
  • a ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method.
  • the ceramic green sheet is subjected to an appropriate punching process, and a plurality of ceramic green sheets are laminated as necessary to form a generated shape, and the generated shape is fired at a high temperature (about 1600 ° C.).
  • An insulating substrate 11 is manufactured.
  • the mounting electrode 12 is provided on one main surface of the insulating substrate 11 so as to face along a pair of sides facing the insulating substrate 11 in plan view.
  • the terminal electrode 13 is provided on the other main surface of the insulating substrate 11 so as to face along another set of sides facing the insulating substrate 11 in a plan view.
  • two mounting electrodes 12 are provided in parallel in the Y direction along a pair of opposing sides, and the length of the mounting electrode 12 is The length in the Y direction is longer than the length in the X direction.
  • Two terminal electrodes 13 are provided in parallel in the X direction along another set of sides, and the length of the terminal electrode 13 is longer in the X direction than in the Y direction. It has become.
  • the mounting electrode 12 is used to electrically connect the electronic component 2 mounted on the wiring substrate 1 and the module substrate 5 or to join the wiring substrate 1 and the electronic component 2 together.
  • the terminal electrode 13 is used to electrically connect the electronic component 2 mounted on the wiring board 1 and the module board 5 or to join the wiring board 1 and the module board 5.
  • the wiring conductor 14 is electrically connected to the mounting electrode 12 and the terminal electrode 13 to electrically connect the electronic component 2 mounted on the wiring substrate 1 and the module substrate 5.
  • the wiring conductor 14 includes a wiring layer provided on the surface or inside of the insulating substrate 11, and a through conductor that penetrates the insulating substrate 11 and electrically connects the wiring layers positioned above and below.
  • the material of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 is, for example, a metal powder mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. It is metallization.
  • the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 are, for example, printing means such as a screen printing method using a metallized paste for the mounting electrode 12, the terminal electrode 13 and the wiring conductor 14 on a ceramic green sheet for the insulating substrate 11. Is formed by printing and coating with a ceramic green sheet for the insulating substrate 11.
  • the through conductor is formed, for example, in a ceramic green sheet for the insulating substrate 11 by a die or punching process by punching or laser processing or the like, and through metal for the through conductor is formed in the through hole. It is formed by filling the paste with the above printing means and firing it together with the ceramic green sheet for the insulating substrate 11.
  • the metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.
  • the surface of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 exposed from the insulating substrate 11 is coated with a metal plating layer having excellent corrosion resistance, such as nickel or gold. It is possible to reduce the corrosion of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14, and the bonding between the mounting electrode 12 and the electronic component 2, the connection between the mounting electrode 12 and the connection member 3, or the module substrate 5 and the terminal electrode 13 can be firmly bonded.
  • a nickel plating layer having a thickness of about 1 to 10 ⁇ m and a gold plating layer having a thickness of about 0.1 to 3 ⁇ m are sequentially formed on the surface of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 exposed from the insulating substrate 11. To be attached.
  • the plating layer is not limited to nickel plating layer / gold plating layer, but other plating including nickel plating layer / gold plating layer / silver plating layer, or nickel plating layer / palladium plating layer / gold plating layer, etc. It may be a layer.
  • the electronic device 2 can be manufactured by mounting the electronic component 2 on the mounting electrode 12 provided on one main surface of the wiring board 1.
  • the electronic component 2 mounted on the wiring board 1 is a semiconductor element such as an IC chip or an LSI chip, a light emitting element, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, and various sensors.
  • the semiconductor element is connected to the semiconductor element via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin).
  • connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin).
  • the semiconductor element 2 is mounted on one mounting electrode 12 on which the electronic component 2 is mounted by a bonding member such as a low melting point brazing material or a conductive resin.
  • a bonding member such as a low melting point brazing material or a conductive resin.
  • the electrode of the semiconductor element and the other mounting electrode 12 are electrically connected via the connecting member 3 such as a bonding wire to be mounted on the wiring board 1.
  • a plurality of electronic components 2 may be mounted on the wiring board 1, and other electronic components such as a resistor element, a capacitor element, and a Zener diode may be mounted as necessary.
  • the electronic component 2 is sealed with a sealing material 4 made of resin, glass, or the like, a lid made of resin, glass, ceramics, metal, or the like, as necessary.
  • the electronic device according to the present embodiment is connected to the connection pad 51 of the module substrate 5 via the bonding material 6 such as solder to form an electronic module.
  • the insulating substrate 11 and the mounting surface provided on one main surface of the insulating substrate 11 so as to face each other along a pair of opposite sides of the insulating substrate 11 in plan view.
  • the electrode 12 and the terminal electrode 13 provided on the other main surface of the insulating substrate 11 so as to face each other along a pair of opposite sides of the insulating substrate 11 in a plan view.
  • the insulating substrate 11 Suppresses the concentration of thermal stress due to the difference in thermal expansion coefficient between the mounting electrode 12 and the insulating substrate 11 and the terminal electrode 13 in the same direction, thereby suppressing the deformation and distortion of the wiring substrate 1, and the electronic component 2 and the wiring substrate.
  • 1 or good connection between the wiring board 1 and the module board 5 And things may be a wiring board 1 having excellent reliability.
  • the wiring board 1 in the present embodiment can be suitably used in a thin and high-power electronic device, and the reliability in the wiring board 1 can be improved.
  • a light emitting element is mounted as the electronic component 2, it can be suitably used as the wiring substrate 1 for a thin and high luminance light emitting device.
  • orthogonal in plane perspective means that the mounting electrode 12 long in one direction (Y direction in FIG. 1) and the terminal electrode 13 long in the other direction (X direction in FIG. 1) It shows that they are orthogonal.
  • the mounting electrode 12 and the terminal electrode 13 are orthogonally overlapped with each other, the portion of the insulating substrate 11 alone in which the mounting electrode 12 or the terminal electrode 13 is not provided is small in a plan view. Thus, leakage of light to the outside can be effectively suppressed.
  • the electronic device is used when the electronic device is used. Even if high heat is applied from the component 2 to the wiring board 1, the thermal stress due to the difference in thermal expansion coefficient between the insulating substrate 11 and the mounting electrode 12 and between the insulating substrate 11 and the terminal electrode 13 is concentrated in the same direction.
  • the total area of the mounting electrodes 12 provided so as to face each other is provided in a region of 30% or more of the area of one main surface of the insulating substrate 11, and provided in a region of 50% or more. It is preferable. Further, the total area of the terminal electrodes 13 provided so as to face each other in plan view is provided in a region of 30% or more of the area of the other main surface of the insulating substrate 11 in plan view, and is 50% or more. It is preferable to be provided in the region.
  • the area where the mounting electrode 12 and the terminal electrode 13 overlap is 20% or more of the area of the mounting electrode 12 in a plan view.
  • the region preferably overlaps with the terminal electrode 13, and more preferably overlaps with the terminal electrode 13 in a region of 50% or more of the area of the mounting electrode 12.
  • the terminal electrode 13 preferably overlaps with the mounting electrode 12 in a region of 20% or more of the area of the terminal electrode 13 in a plan view, and a region of 50% or more of the area of the terminal electrode 13 It is more preferable that the electrode overlaps with the mounting electrode 12 in FIG.
  • the above effect is further improved. can do.
  • the total area of the mounting electrodes 12 provided so as to face each other is 0.5 times or more and 1.5 times or less than the total area of the terminal electrodes 13 provided so as to face each other, the above-described effect is obtained. Since it can be made more effective, it is preferable. Further, it is more effective if the thickness of the mounting electrode 12 provided so as to be opposed is 0.8 to 1.2 times the thickness of the terminal electrode 13 provided so as to be opposed. Therefore, it is preferable.
  • three or more mounting electrodes 12 and terminal electrodes 13 may be provided on the main surface of the insulating substrate 11 as in the example shown in FIG. Also in this case, as described above, the total area of the mounting electrodes 12 provided so as to face each other is 0.8 to 1.2 times the total area of the terminal electrodes 13 provided so as to face each other. It is preferable.
  • three mounting electrodes 12 are provided on one main surface of the insulating substrate 11 so as to face each other along a pair of sides of the insulating substrate 11. Yes.
  • the three terminal electrodes 13 face each other along the other main surface of the insulating substrate 11 along another set of sides of the insulating substrate 11. It is provided as follows.
  • the mounting electrodes 12 or the terminal electrodes 13 are arranged so as to be orthogonal to each other and to overlap with a plurality of electrodes in a plan view.
  • the sizes and shapes of the mounting electrodes 12 or the terminal electrodes 13 may be different.
  • the mounting electrode 12 and the terminal electrode 13 intersect so as to be orthogonal to each other as seen in a plan view, as in the example shown in FIGS.
  • the electrodes are arranged so as to cross a plurality of electrodes.
  • the electrical reliability is improved by having the wiring board 1 having the above-described configuration.
  • the electronic device having the above-described configuration is connected to the connection pad 51 of the module substrate 5 via the bonding material 6, the long-term reliability is excellent. be able to.
  • the electronic device according to the second embodiment of the present invention differs from the electronic device according to the above-described embodiment in that the insulating substrate 11 is one of the insulating substrates 11 as in the examples shown in FIGS. This is that the surface side has a concave portion 15 sandwiched between the mounting electrodes 12 in a plan view.
  • FIG. 6A a portion where the outer edge of the mounting electrode 12 and the inner wall of the recess 15 and the electronic component 2 overlap, and in FIG. 6 and FIG. 7, the wiring conductor 14 (through conductor) is the first embodiment.
  • FIG. 6B The other electronic component 7 in FIG. 6A and the electronic component 2 in FIG. 6B are indicated by a two-dot chain line.
  • the mounting electrode 12 and the terminal electrode 13 are arranged so as to extend in different directions, as in the first embodiment. Even when high heat is applied from the electronic component 2 to the wiring board 1 when the apparatus is used, the thermal stress due to the difference in thermal expansion coefficient between the insulating substrate 11 and the mounting electrode 12 and between the insulating substrate 11 and the terminal electrode 13 is the same direction. To suppress the deformation and distortion of the wiring board 1 and to improve the connection between the electronic component 2 and the wiring board 1 or between the wiring board 1 and the module board 5.
  • the wiring board 1 can be made excellent in performance.
  • the recess 15 for example, when a light emitting element is used as the electronic component 2, if another electronic component 7 such as a Zener diode is accommodated in the recess 15, it is formed on one main surface of the insulating substrate 11. Compared to the case where other electronic components 7 are arranged, it is not necessary to provide a large area for mounting the other electronic components 7 in the plane direction, and light from the light emitting element in the lateral direction is blocked. Therefore, a light emitting device with a small size and high luminance can be obtained. Further, the recess 15 may be sealed with a resin or the like containing a fluorescent agent or a reflective agent to improve the luminance of the light emitting device.
  • the recess 15 can be used as a region for mounting other electronic components 7 as in the examples shown in FIGS.
  • a wiring conductor 14 for electrical connection with other electronic components 7 is led out to the bottom surface of the recess 15.
  • Such recesses 15 are formed in the ceramic green sheets for the insulating substrate 11 by laser processing, punching with a mold, or the like to form through holes to be the recesses 15 in a plurality of ceramic green sheets. It can be formed by laminating on a ceramic green sheet in which no through hole is formed.
  • the recess 15 is provided so as to extend along the mounting electrode 12 as in the example shown in FIGS. At this time, in a plan view, the concave portion 15 overlaps with the plurality of terminal electrodes 13 provided on the other main surface of the insulating substrate 11, and in the concave portion 15 where the thickness of the insulating substrate 11 is reduced, The mechanical strength can be improved, and the possibility that cracks and the like occur in the insulating substrate 11 can be reduced. Further, as in the examples shown in FIGS. 6 to 8, the wiring conductor 14 provided inside the insulating substrate 11 and led out to the bottom surface of the recess 15 and the plurality of mounting electrodes 12 are respectively provided. It is more preferable that the longitudinal directions are provided so as to overlap each other at right angles.
  • the area where the mounting electrode 12 and the wiring conductor 14 overlap is 20% or more of the area of the mounting electrode 12 in a plan view. It is preferable to overlap the wiring conductor 14 in the region because the above effect can be made more effective. Further, it is preferable that the wiring conductor 14 also overlaps the mounting electrode 12 in a region of 20% or more of the area of the wiring conductor 14 in a plan view.
  • the shape of the recess 15 may not be rectangular in plan view. As in the example shown in FIG. 9, in plan view, the width of both ends of the recess 15 is smaller than the width of the central portion, for example, the width of the recess 15 other than the region where the other electronic component 7 is mounted When the width is smaller than the width of the recess 15 in the region where the electronic component 7 is mounted, deformation and distortion of the wiring board 1 can be suppressed.
  • the length in the longitudinal direction in plan view is shortened and arranged so that the mounting electrode 12 spreads to the opposite side, and this region, the electronic component 2 and the terminal electrode 13 provided on the other main surface, If they overlap, the deformation and distortion of the wiring board 1 can be suppressed, and the heat dissipation from the electronic component 2 to the wiring board 1 can be improved.
  • the mounting electrode 12 is provided so as to extend from both ends along a pair of opposing sides of the insulating substrate 11 so as to surround the recess 15 in a plan view.
  • the mechanical strength can be improved in the recess 15 where the thickness of the insulating substrate 11 is reduced, and the possibility that cracks or the like occur in the insulating substrate 11 can be reduced.
  • the wiring board 1 of the second embodiment can be manufactured using the same manufacturing method as the wiring board 1 of the first embodiment described above.
  • the electronic device according to the third embodiment of the present invention is different from the electronic device according to the above-described embodiment in that the insulating substrate 11 is the other main substrate of the insulating substrate 11 as in the examples shown in FIGS.
  • the surface side has a recess 15 sandwiched between the terminal electrodes 13 in a plan view.
  • FIG. 10A the portion where the outer edge of the mounting electrode 12 and the electronic component 2 overlap, and in FIGS. 10 and 11, the wiring conductor 14 (through conductor) is a broken line as in the first embodiment. Is shown.
  • FIG. 10B the electronic component 2 is indicated by a two-dot chain line.
  • the mounting electrode 12 and the terminal electrode 13 are arranged so as to extend in different directions. Even when high heat is applied from the electronic component 2 to the wiring board 1 when the apparatus is used, the thermal stress due to the difference in thermal expansion coefficient between the insulating substrate 11 and the mounting electrode 12 and between the insulating substrate 11 and the terminal electrode 13 is the same direction. To suppress the deformation and distortion of the wiring board 1 and to improve the connection between the electronic component 2 and the wiring board 1 or between the wiring board 1 and the module board 5.
  • the wiring board 1 can be made excellent in performance.
  • the recess 15 is used to mount other electronic components 7 as in the second embodiment, as in the examples shown in FIGS. It can be used as a region.
  • a wiring conductor 14 is led out from the bottom surface of the recess 15 in order to be electrically connected to another electronic component 7.
  • the recess 15 is provided between the terminal electrodes 13 so as to extend long in one direction along the terminal electrodes 13 as in the examples shown in FIGS.
  • the concave portion 15 overlaps with the plurality of mounting electrodes 12 provided on one main surface of the insulating substrate 11, and the concave portion 15 in which the thickness of the insulating substrate 11 becomes thin is reduced.
  • the mechanical strength can be improved, and the possibility that cracks and the like occur in the insulating substrate 11 can be reduced.
  • the wiring conductor 14 provided inside the insulating substrate 11 and led out to the bottom surface of the recess 15 and the plurality of terminal electrodes 13 are each provided in the longitudinal direction.
  • the directions are provided so as to overlap each other at right angles.
  • the area where the mounting electrode 12 and the wiring conductor 14 overlap is an area that is 20% or more of the area of the terminal electrode 13 in a plan view. It is preferable that the two layers overlap each other since the above effect can be further improved.
  • the wiring conductor 14 also preferably overlaps with the terminal electrode 13 in a region of 20% or more of the area of the wiring conductor 14 in plan view.
  • the width of both end portions of the recess 15 is smaller than the width of the central portion in plan view, deformation and distortion of the wiring board 1 can be suppressed.
  • the wiring board 1 of the third embodiment can be manufactured using the same manufacturing method as the wiring board 1 of the first embodiment or the second embodiment described above.
  • the present invention is not limited to the above-described embodiments, and various modifications can be made.
  • the wiring substrate 1 in which chamfered portions or arc-shaped notches are formed in the thickness direction of the insulating substrate 11 at corners of the insulating substrate 11 may be used.
  • the terminal electrode 13 is provided on the other main surface of the insulating substrate 11, but a hole is provided between the side surface of the insulating substrate 11 and the other main surface, and the terminal electrode 13 is formed on the inner surface of the hole. May have a so-called castellation conductor extended.
  • the mounting electrode 12 may extend to the inner surface of a hole provided on the side surface of the insulating substrate 11.
  • the form of the wiring board 1 of the first to third embodiments may be combined.
  • the wiring substrate 1 of the second embodiment three or more terminal electrodes 13 provided on the other main surface side of the insulating substrate 11 may be provided.
  • the wiring substrate 1 of the third embodiment Three or more mounting electrodes 12 provided on one main surface of the insulating substrate 11 may be provided.
  • the mounting electrode 12 and the terminal electrode 13 have a rectangular shape in plan view, but for example, in the plan view, the wiring substrate 1 or
  • the mounting electrode 12 or the terminal electrode 13 provided with a convex portion or the like on the edge of the electrode partially in plan view, or the edge of the electrode is partially Alternatively, the mounting electrode 12 or the terminal electrode 13 may be removed.
  • the mounting electrode 12 and the terminal electrode 13 are examples formed by the cofiring method in the above-described example, but may be a metal layer formed by a forming method such as a post-fire method or a thin film forming method. good.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　本発明の配線基板（１）は、絶縁基板（11）と、絶縁基板（11）の一方主面に、平面視で絶縁基板（11）の対向する一組の辺に沿って対向するように設けられた搭載用電極（12）と、絶縁基板（11）の他方主面に、平面透視で絶縁基板（11）の対向する他の一組の辺に沿って対向するように設けられた端子用電極（13）とを有している。

Description

配線基板、電子装置および電子モジュール
　本発明は、配線基板、電子装置および電子モジュールに関するものである。
　従来、配線基板は、絶縁基板の一方主面に設けられ、電子部品を搭載する搭載用電極と、絶縁基板の他方主面に設けられた端子用電極と、搭載用電極と端子用電極とに接続され、絶縁基板の主面または内部に設けられ配線導体とを有するものがある。電子部品および配線基板を含む電子装置を半田等の接合材によって例えばモジュール用基板に接合する場合、端子用電極が半田等の接合材を介しモジュール用基板に接合される（特開2009－267041号公報参照）。
　近年、電子装置の高機能化および薄型化が求められており、配線基板の厚みが薄くなるにつれて、電子装置の使用時の、絶縁基板と搭載用電極および端子用電極との熱膨張率の差による熱応力により配線基板の変形やひずみが大きくなりやすく、長期間使用時に電子部品と配線基板との間、あるいは配線基板とモジュール用基板との間で接続不良が発生することが懸念される。
　本発明の一つの態様によれば、配線基板は、絶縁基板と、該絶縁基板の一方主面に、平面視で前記絶縁基板の対向する一組の辺に沿って対向するように設けられた搭載用電極と、前記絶縁基板の他方主面に、平面透視で前記絶縁基板の対向する他の一組の辺に沿って対向するように設けられた端子用電極とを有している。
　本発明の他の態様によれば、電子装置は、上記構成の配線基板と、該配線基板に搭載された電子部品とを有している。
　本発明の他の態様によれば、電子モジュールは、上記構成の電子装置と、接続パッドを有し、前記電子装置が前記接続パッドに接合材を介して接続されたモジュール用基板とを有している。
　本発明の一つの態様による配線基板は、絶縁基板と、絶縁基板の一方主面に、平面視で絶縁基板の対向する一組の辺に沿って対向するように設けられた搭載用電極と、絶縁基板の他方主面に、平面透視で絶縁基板の対向する他の一組の辺に沿って対向するように設けられた端子用電極とを有している。この構成により、搭載用電極と端子用電極とが互いに異なる方向に延びるように配置されているので、電子装置の使用時に電子部品から配線基板に高い熱が印加されたとしても、絶縁基板と搭載用電極および絶縁基板と端子用電極の熱膨張率の差による熱応力が同一方向に集中するのを抑制し、配線基板の変形、ひずみを抑え、電子部品と配線基板との間、あるいは配線基板とモジュール用基板との間の接続を良好なものとし、信頼性に優れた配線基板とすることができる。
　本発明の他の態様による電子装置は、上記構成の配線基板と、配線基板に搭載された電子部品とを有していることによって、長期信頼性に優れた電子装置とすることができる。
　本発明の他の態様による電子モジュールは、上記構成の電子装置と、接続パッドを有し、電子装置が接続パッドに接合材を介して接続されたモジュール用基板とを有していることによって、長期信頼性に優れたものとすることができる。
（ａ）は、本発明の第１の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。 （ａ）は、図１（ａ）に示された電子装置のＡ－Ａ線における縦断面図であり、（ｂ）は、図１（ａ）に示された電子装置のＢ－Ｂ線における縦断面図である。 （ａ）および（ｂ）は、図１における電子装置を用いたモジュール用基板に実装した電子モジュールを示す縦断面図である。 （ａ）は、本発明の第１の実施形態の他の例における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。 （ａ）は、本発明の第１の実施形態の他の例における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。 （ａ）は、本発明の第２の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。 図６に示された電子装置における配線基板の内部上面図である。 （ａ）は、図６（ａ）に示された電子装置のＡ－Ａ線における縦断面図であり、（ｂ）は、図１（ａ）に示された電子装置のＢ－Ｂ線における縦断面図である。 本発明の第２の実施形態の他の例における配線基板を示す上面透視図である。 （ａ）は、本発明の第３の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。 図10に示された電子装置における配線基板の内部下面図である。 （ａ）は、図10（ａ）に示された電子装置のＡ－Ａ線における縦断面図であり、（ｂ）は、図１（ａ）に示された電子装置のＢ－Ｂ線における縦断面図である。 本発明の第３の実施形態の他の例における配線基板を示す下面透視図である。
　本発明のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。
　（第１の実施形態）
　本発明の第１の実施形態における発光装置は、図１および図２に示された例のように、配線基板１と、配線基板１の上面に設けられた電子部品２とを含んでいる。電子装置は、図３に示された例のように、例えば電子モジュールを構成するモジュール用基板５上の接続パッド51に接合材６を用いて接続される。
　本実施形態における配線基板１は、絶縁基板11と、絶縁基板11の一方主面に設けられた搭載用電極12と、絶縁基板11の他方主面に設けられた端子用電極13と、搭載用電極12および端子用電極13に接続され、絶縁基板11の表面または内部に設けられた配線導体14とを有している。搭載用電極12は、平面視で絶縁基板11の対向する一組の辺に沿って対向するように設けられている。端子用電極13は、平面透視で絶縁基板11の対向する他の一組の辺に沿って対向するように設けられている。図１～図３において、電子装置は仮想のｘｙｚ空間におけるｘｙ平面に実装されている。図１～図３において、上方向とは、仮想のｚ軸の正方向のことをいう。なお、以下の説明における上下の区別は便宜的なものであり、実際に配線基板１等が使用される際の上下を限定するものではない。
　図１（ａ）において、搭載用電極12の外縁と電子部品２とが重なる部分、また、図１において、配線導体14（貫通導体）は、破線で示している。図１（ｂ）において、電子部品２は、２点鎖線で示している。
　絶縁基板11は、一方主面（図１および図２では上面）および他方主面（図１および図２では下面）を有している。絶縁基板11は、平面視において、一方主面および他方主面のそれぞれに対して二組の対向する辺（４辺）を有した矩形の板状の形状を有している。絶縁基板11は、電子部品２を支持するための支持体として機能し、絶縁基板11の一方主面に設けられた搭載用電極12上に電子部品２が半田バンプ等の接続部材３を介して接着され固定される。
　絶縁基板11は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体またはガラスセラミックス焼結体等のセラミックスを用いることができる。絶縁基板11は、例えば酸化アルミニウム質焼結体である場合であれば、酸化アルミニウム（Ａｌ２Ｏ３），酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して泥漿物を作製する。この泥漿物を、従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを作製する。次に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、セラミックグリーンシートを必要に応じて複数枚積層して生成形体を形成し、この生成形体を高温（約1600℃）で焼成することによって絶縁基板11が製作される。
　搭載用電極12は、絶縁基板11の一方主面に、平面視で絶縁基板11の対向する一組の辺に沿って対向するように設けられている。端子用電極13は、絶縁基板11の他方主面に、平面透視で絶縁基板11の対向する他の一組の辺に沿って対向するように設けられている。例えば、図１および図２に示された例においては、２つの搭載用電極12が、対向する一組の辺に沿ってＹ方向にそれぞれ平行に設けられており、搭載用電極12の長さは、Ｙ方向の長さがＸ方向の長さよりも長くなっている。２つの端子用電極13が、他の一組の辺に沿ってＸ方向にそれぞれ平行に設けられており、端子用電極13の長さは、Ｘ方向の長さがＹ方向の長さよりも長くなっている。搭載用電極12は、配線基板１に搭載された電子部品２とモジュール用基板５とを電気的に接続するため、または配線基板１と電子部品２とを接合するためのものである。端子用電極13は、配線基板１に搭載された電子部品２とモジュール用基板５とを電気的に接続するため、または配線基板１とモジュール用基板５とを接合するためのものである。配線導体14は、搭載用電極12と端子用電極13とに電気的に接続され、配線基板１に搭載された電子部品２とモジュール用基板５とを電気的に接続するためのものである。配線導体14は、絶縁基板11の表面または内部に設けられた配線層と、絶縁基板11を貫通して上下に位置する配線層同士を電気的に接続する貫通導体とを含んでいる。
　搭載用電極12、端子用電極13、配線導体14の材料は、例えばタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ）または銅（Ｃｕ）等を主成分とする金属粉末メタライズである。搭載用電極12、端子用電極13、配線導体14は、例えば絶縁基板11用のセラミックグリーンシートに搭載用電極12、端子用電極13、配線導体14用のメタライズペーストをスクリーン印刷法等の印刷手段によって印刷塗布し、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。また、貫通導体は、例えば絶縁基板11用のセラミックグリーンシートに金型またはパンチングによる打ち抜き加工またはレーザー加工等の加工方法によって貫通導体用の貫通孔を形成し、この貫通孔に貫通導体用のメタライズペーストを上記印刷手段によって充填しておき、絶縁基板11用のセラミックグリーンシートとともに焼成することによって形成される。メタライズペーストは、上述の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基板11との接合強度を高めるために、ガラス粉末、セラミック粉末を含んでいても構わない。
　搭載用電極12、端子用電極13、配線導体14の絶縁基板11から露出した表面には、ニッケル，金等の耐蝕性に優れる金属めっき層が被着される。搭載用電極12、端子用電極13、配線導体14が腐食することを低減できるとともに、搭載用電極12と電子部品２との接合、搭載用電極12と接続部材３との接続、またはモジュール用基板５と端子用電極13とを強固に接合することができる。例えば、搭載用電極12、端子用電極13、配線導体14の絶縁基板11から露出した表面には、厚さ１～10μｍ程度のニッケルめっき層と厚さ0.1～３μｍ程度の金めっき層とが順次被着される。
　また、めっき層は、ニッケルめっき層／金めっき層に限られるものではなく、ニッケルめっき層／金めっき層／銀めっき層、あるいはニッケルめっき層／パラジウムめっき層／金めっき層等を含むその他のめっき層であっても構わない。
　配線基板１の一方主面に設けられた搭載用電極12上に、電子部品２が搭載されることによって電子装置を作製できる。配線基板１に搭載される電子部品２は、ＩＣチップやＬＳＩチップ等の半導体素子，発光素子，水晶振動子や圧電振動子等の圧電素子および各種センサ等である。例えば、電子部品２がフリップチップ型の半導体素子である場合には、半導体素子は、はんだバンプや金バンプまたは導電性樹脂（異方性導電樹脂等）等の接続部材３を介して、半導体素子の電極と搭載用電極12とが電気的および機械的に接続されることによって配線基板１に搭載される。また、例えば、電子部品２がワイヤボンディング型の半導体素子である場合には、半導体素子は、低融点ろう材または導電性樹脂等の接合部材によって、電子部品２を搭載する一方の搭載用電極12上に固定された後、ボンディングワイヤ等の接続部材３を介して半導体素子の電極と他方の搭載用電極12とが電気的に接続されることによって配線基板１に搭載される。また、配線基板１には、複数の電子部品２を搭載しても良いし、必要に応じて、抵抗素子や容量素子、ツェナーダイオード等の他の電子部品を搭載しても良い。また、電子部品２は必要に応じて、樹脂やガラス等からなる封止材４、樹脂やガラス、セラミックス、金属等からなる蓋体等により封止される。
　本実施形態の電子装置が、図５に示された例のように、モジュール用基板５の接続パッド51に半田等の接合材６を介して接続されて、電子モジュールとなる。
　本実施形態の配線基板１によれば、絶縁基板11と、絶縁基板11の一方主面に、平面視で絶縁基板11の対向する一組の辺に沿って対向するように設けられた搭載用電極12と、絶縁基板11の他方主面に、平面透視で絶縁基板11の対向する他の一組の辺に沿って対向するように設けられた端子用電極13とを有していることにより、搭載用電極12と端子用電極13とが互いに異なる方向に延びるように配置されているので、電子装置の使用時に電子部品２から配線基板１に高い熱が印加されたとしても、絶縁基板11と搭載用電極12および絶縁基板11と端子用電極13の熱膨張率の差による熱応力が同一方向に集中するのを抑制し、配線基板１の変形、ひずみを抑え、電子部品２と配線基板１との間、あるいは配線基板１とモジュール用基板５との間の接続を良好なものとし、信頼性に優れた配線基板１とすることができる。
　本実施形態における配線基板１は、薄型で高出力の電子装置において好適に使用することができ、配線基板１における信頼性を向上することができる。例えば、電子部品２として、発光素子を搭載する場合、薄型で高輝度の発光装置用の配線基板１として好適に用いることができる。
　搭載用電極12と端子用電極13とは、図１および図２に示された例のように、平面透視で直交していると、電子装置の使用時に電子部品２から配線基板１に高い熱が印加されたとしても、搭載用電極12および端子用電極13の膨張が同一方向に集中するのを効果的に抑制し、配線基板１に変形やひずみが生じるのを抑え、電子部品２と配線基板１との間、あるいは配線基板１とモジュール用基板５との間の接続をより良好なものとし、信頼性に優れた配線基板１とすることができる。ここで、平面透視で直交するとは、一方方向（図１ではＹ方向）に長い搭載用電極12と他方方向（図１ではＸ方向）に長い端子用電極13とが、各々の長手方向同士が直交していることを示している。
　また、搭載用電極12と端子用電極13とが互いに直交して重なっていることにより、平面透視において、搭載用電極12または端子用電極13が設けられていない、絶縁基板11のみの部分が少なくなり、外部への光の漏洩を効果的に抑制することができる。
　また、図１および図２に示された例のように、２つの搭載用電極12が、平面透視において共に２つの端子用電極13と重なるように配置されていると、電子装置の使用時に電子部品２から配線基板１に高い熱が印加されたとしても、絶縁基板11と搭載用電極12および絶縁基板11と端子用電極13の熱膨張率の差による熱応力が同一方向に集中するのをより効果的に抑制し、配線基板１に変形やひずみが生じることを抑えることができ、また平面透視で搭載用電極12と端子用電極13とが重なる部分が大きいものとなり、配線基板１の機械的強度を向上させることができ、絶縁基板11にクラック等が発生する可能性を低減することができる。
　平面視において、対向するように設けられた搭載用電極12の総面積は、絶縁基板11の一方主面の面積の30％以上の領域に設けられており、50％以上の領域に設けられていると好ましい。また、平面視において、対向するように設けられた端子用電極13の総面積は、平面視において、絶縁基板11の他方主面の面積の30％以上の領域に設けられており、50％以上の領域に設けられていると好ましい。
　また、搭載用電極12と端子用電極13とが直交した構成において、搭載用電極12と端子用電極13とが重なっている領域は、平面透視において、搭載用電極12の面積の20％以上の領域において端子用電極13と重なっていることが好ましく、搭載用電極12の面積の50％以上の領域において端子用電極13と重なっていることがより好ましい。さらに、端子用電極13においても、平面透視において、端子用電極13の面積の20％以上の領域において搭載用電極12と重なっていることが好ましく、端子用電極13の面積の50％以上の領域において搭載用電極12と重なっていることがより好ましい。このように、搭載用電極12と端子用電極13とが直交した構成において、広い領域にわたって、搭載用電極12と端子用電極13とが重なっていると、上記の効果をより向上させたものとすることができる。また、対向するように設けられた搭載用電極12の総面積が、対向するように設けられた端子用電極13の総面積の0.5倍以上1.5倍以下となるように設けられると、上記効果をより効果的なものとすることができるので好ましい。また、対向するように設けられた搭載用電極12の厚みは、対向するように設けられた端子用電極13の厚みの0.8倍以上1.2倍以下となるように設けられると、より効果的なものとすることができるので好ましい。
　また、搭載用電極12および端子用電極13は、図４に示された例のように、絶縁基板11の主面に３つ以上設けていても構わない。この場合においても、上述と同様に、対向するように設けられた搭載用電極12の総面積は、対向するように設けられた端子用電極13の総面積の0.8倍以上1.2倍以下に設けられることが好ましい。
　図４（ａ）に示された例において、３つの搭載用電極12が、絶縁基板11の一方主面に、絶縁基板11の一組の辺に沿って、それぞれが対向するように設けられている。図４（ｂ）に示された例のように、３つの端子用電極13は、絶縁基板11の他方主面に、絶縁基板11の他の一組の辺に沿って、それぞれが互いに対向するように設けられている。
　図４に示された例においても、搭載用電極12または端子用電極13は、互いに直交するとともに、平面透視において複数の電極に重なるように配置しておくことが好ましい。
　また、図５に示された例のように、搭載用電極12同士、または端子用電極13同士の大きさや形状が異なっていても構わない。
　なお、図４および図５に示された例においても、図１および図２に示された例と同様に、搭載用電極12と端子用電極13とは、平面透視で互いに直交するように交わる、あるいは複数の電極に交わるように配置しておくことが好ましい。
　本実施形態の電子装置によれば、上記構成の配線基板１を有していることによって、電気的信頼性に関して向上されている。
　本発明の他の態様による電子モジュールによれば、上記構成の電子装置がモジュール用基板５の接続パッド51に接合材６を介して接続されていることから、長期信頼性に優れたものとすることができる。
　（第２の実施形態）
　次に、本発明の第２の実施形態による電子装置について、図６～図８を参照しつつ説明する。
　本発明の第２の実施形態における電子装置において、上記した実施形態の電子装置と異なる点は、図６～図８に示された例のように、絶縁基板11は、絶縁基板11の一方主面側に、平面視で搭載用電極12に挟まれた凹部15を有している点である。
　図６（ａ）において、搭載用電極12の外縁および凹部15の内壁と電子部品２とが重なる部分、また、図６および図７において、配線導体14（貫通導体）は、第１の実施形態と同様に、破線で示している。図６（ａ）における他の電子部品７と、図６（ｂ）における電子部品２は、２点鎖線で示している。
　本発明の第２の実施形態の配線基板１によれば、第１の実施形態と同様に、搭載用電極12と端子用電極13とが互いに異なる方向に延びるように配置されているので、電子装置の使用時に電子部品２から配線基板１に高い熱が印加されたとしても、絶縁基板11と搭載用電極12および絶縁基板11と端子用電極13の熱膨張率の差による熱応力が同一方向に集中するのを抑制し、配線基板１の変形、ひずみを抑え、電子部品２と配線基板１との間、あるいは配線基板１とモジュール用基板５との間の接続を良好なものとし、信頼性に優れた配線基板１とすることができる。
　また、凹部15を有することによって、例えば、電子部品２として発光素子が用いられる場合、ツェナーダイオード等の他の電子部品７を凹部15内に収納していると、絶縁基板11の一方主面に他の電子部品７を配置する場合と比較して、他の電子部品７を搭載するための領域を平面方向に大きく設ける必要がなくなるとともに、発光素子からの横方向への光が遮断されることがなくなるので、小型で高輝度の発光装置とすることができる。また、凹部15内には、蛍光剤あるいは反射剤を含有した樹脂等を封入することで、発光装置の輝度を良好なものとするようにしても構わない。
　凹部15は、図６～図８に示された例のように、他の電子部品７を搭載するための領域として用いることができる。凹部15の底面には、他の電子部品７と電気的に接続するための配線導体14が導出している。このような凹部15は、絶縁基板11用のセラミックグリーンシートにレーザー加工や金型による打ち抜き加工等によって、凹部15となる貫通孔を複数のセラミックグリーンシートに形成し、これらのセラミックグリーンシートを、貫通孔を形成していないセラミックグリーンシートに積層することで形成できる。
　凹部15は、図６～図８に示された例のように、搭載用電極12に沿って延びるように設けられている。この際、平面透視において、凹部15は、絶縁基板11の他方主面に設けられた複数の端子用電極13と重なっていると、絶縁基板11の厚みが薄いものとなった凹部15において、機械的強度を向上させることができ、絶縁基板11にクラック等が発生する可能性を低減することができる。また、図６～図８に示された例のように、絶縁基板11の内部に設けられ、凹部15の底面に導出している配線導体14と、複数の搭載用電極12とが、各々の長手方向同士が直交して重なるように設けておくとより好ましい。この場合、搭載用電極12と配線導体14とが互いに直交した構成において、搭載用電極12と配線導体14とが重なっている領域は、平面透視において、搭載用電極12の面積の20％以上の領域において配線導体14と重なっていると、上記効果をより効果的なものとすることができるので好ましい。さらに、配線導体14においても、平面透視において、配線導体14の面積の20％以上の領域において搭載用電極12と重なっていることが好ましい。
　また、凹部15の形状は、平面視にて矩形状でなくても構わない。図９に示された例のように、平面視において、凹部15における両端部の幅が中央部の幅より小さい、例えば他の電子部品７が搭載される領域以外の凹部15の幅を他の電子部品７が搭載される領域の凹部15の幅より小さくすると、配線基板１の変形やひずみを抑制することができる。好ましくは平面視における長手方向の長さを短くして、かつ搭載用電極12が対向する側に広がるように配置し、この領域と電子部品２および他方主面に設けられた端子用電極13とが重なるようにしておくと、配線基板１の変形やひずみを抑制するとともに、電子部品２から配線基板１への放熱性を向上することができる。
　また、図９に示された例のように、平面視において、搭載用電極12は、凹部15を取り囲むように、両端部から絶縁基板11の対向する一組の辺に沿って延出して設けられていると、絶縁基板11の厚みが薄いものとなった凹部15において、機械的強度を向上させることができ、絶縁基板11にクラック等が発生する可能性を低減することができる。
　第２の実施形態の配線基板１は、上述の第１の実施形態の配線基板１と同様の製造方法を用いて製作することができる。
　（第３の実施形態）
　次に、本発明の第３の実施形態による電子装置について、図10～図12を参照しつつ説明する。
　本発明の第３の実施形態における電子装置において、上記した実施形態の電子装置と異なる点は、図10～図12に示された例のように、絶縁基板11は、絶縁基板11の他方主面側に、平面透視で端子用電極13に挟まれた凹部15を有している点である。図10（ａ）において、搭載用電極12の外縁と電子部品２とが重なる部分、また、図10および図11において、配線導体14（貫通導体）は、第１の実施形態と同様に、破線で示している。図10（ｂ）において、電子部品２は、２点鎖線で示している。
　本発明の第３の実施形態の配線基板１によれば、第１の実施形態と同様に、搭載用電極12と端子用電極13とが互いに異なる方向に延びるように配置されているので、電子装置の使用時に電子部品２から配線基板１に高い熱が印加されたとしても、絶縁基板11と搭載用電極12および絶縁基板11と端子用電極13の熱膨張率の差による熱応力が同一方向に集中するのを抑制し、配線基板１の変形、ひずみを抑え、電子部品２と配線基板１との間、あるいは配線基板１とモジュール用基板５との間の接続を良好なものとし、信頼性に優れた配線基板１とすることができる。
　本発明の第３の実施形態の配線基板１において、凹部15は、図10～図12に示された例のように、第２の実施形態と同様に、他の電子部品７を搭載するための領域として用いることができる。また、凹部15の底面には、他の電子部品７と電気的に接続するために配線導体14が導出している。
　凹部15は、図10～図12に示された例のように、端子用電極13の間に、端子用電極13に沿って一方向に長く延びるように設けられている。この際、平面透視において、凹部15は、絶縁基板11の一方主面に設けられた複数の搭載用電極12と重なっていると、絶縁基板11の厚みが薄いものとなった凹部15において、機械的強度を向上させることができ、絶縁基板11にクラック等が発生する可能性を低減することができる。また、図10～図12に示された例のように、絶縁基板11内部に設けられ、凹部15の底面に導出している配線導体14と、複数の端子用電極13とが、各々の長手方向同士が直交して重なるように設けておくとより好ましい。この場合、端子用電極13と配線導体14とが直交した構成において、搭載用電極12と配線導体14とが重なっている領域は、平面透視において、端子用電極13の面積の20％以上の領域において互いに重なっていると、上記の効果をより向上させたものとすることができるので好ましい。また、さらに、配線導体14においても、平面視において、配線導体14の面積の20％以上の領域において端子用電極13と重なっていることが好ましい。また、第２の実施形態と同様に、平面視において、凹部15における両端部の幅が中央部の幅より小さいと、配線基板１の変形やひずみを抑制することができる。
　第３の実施形態の配線基板１は、上述の第１の実施形態または第２の実施形態の配線基板１と同様の製造方法を用いて製作することができる。
　本発明は、上述の実施の形態の例に限定されるものではなく、種々の変更は可能である。例えば、絶縁基板11の角部に、面取り部あるいは円弧状の切欠き部が絶縁基板11の厚み方向に形成された配線基板１であっても構わない。
　また、端子用電極13は、絶縁基板11の他方主面に設けられているが、絶縁基板11の側面と他方主面との間に穴が設けられており、穴の内面に端子用電極13が延出された、いわゆるキャスタレーション導体を有していてもよい。また、搭載用電極12も同様に、絶縁基板11の側面に設けられた穴の内面に延出していても構わない。
　また、第１～第３の実施形態の配線基板１の形態を組み合わせても構わない。例えば、第２の実施形態の配線基板１において、絶縁基板11の他方主面側に設けられた端子用電極13を３つ以上設けても良いし、第３の実施形態の配線基板１において、絶縁基板11の一方主面に設けられた搭載用電極12を３つ以上設けても構わない。
　また、第１～第３の実施形態の配線基板１において、搭載用電極12および端子用電極13は、平面視にて、矩形状の形状としているが、例えば、平面視において、配線基板１または電子装置の向き等を確認するために、平面視にて部分的に、電極の縁部に凸状部等が設けられた搭載用電極12または端子用電極13、あるいは、電極の縁部が部分的に除かれた搭載用電極12または端子用電極13であっても構わない。
　また、搭載用電極12および端子用電極13は、上述の例において、コファイヤ法により形成した例を示しているが、ポストファイヤ法または薄膜形成法等の形成方法により形成した金属層であっても良い。

Claims (11)

  1. 　絶縁基板と、
    該絶縁基板の一方主面に、平面視で前記絶縁基板の対向する一組の辺に沿って対向するように設けられた搭載用電極と、
    前記絶縁基板の他方主面に、平面透視で前記絶縁基板の対向する他の一組の辺に沿って対向するように設けられた端子用電極とを有していることを特徴とする配線基板。
  2. 　平面透視において、前記搭載用電極と前記端子用電極とが直交していることを特徴とする請求項１に記載の配線基板。
  3. 　平面透視において、前記搭載用電極と前記端子用電極とが重なっていることを特徴とする請求項２に記載の配線基板。
  4. 　前記絶縁基板の一方主面に、平面視で前記搭載用電極に挟まれた凹部を有していることを特徴とする請求項１乃至請求項３のいずれかに記載の配線基板。
  5. 　前記凹部は、前記搭載用電極に沿って延びるように設けられており、平面透視で前記端子用電極と重なっていることを特徴とする請求項４に記載の配線基板。
  6. 　平面視において、前記搭載用電極は、前記凹部を取り囲むように、両端部から前記絶縁基板の対向する一組の辺に沿って延出して設けられていることを特徴とする請求項４または請求項５に記載の配線基板。
  7. 　前記絶縁基板の他方主面に、平面透視で前記端子用電極に挟まれた凹部を有していることを特徴とする請求項１乃至請求項３のいずれかに記載の配線基板。
  8. 　前記凹部は、前記端子用電極に沿って延びるように設けられており、平面透視で前記搭載用電極と重なっていることを特徴とする請求項７に記載の配線基板。
  9. 　平面視において、前記凹部における両端部の幅が中央部の幅より小さいことを特徴とする請求項５または請求項６または請求項８のいずれかに記載の配線基板。
  10. 　請求項１乃至請求項９のいずれかに記載の配線基板と、
    該配線基板に搭載された電子部品とを有していることを特徴とする電子装置。
  11. 　請求項１０記載の電子装置と、
    接続パッドを有し、前記電子装置が前記接続パッドに接合材を介して接続されたモジュール用基板とを有することを特徴とする電子モジュール。
PCT/JP2016/059157 2015-03-26 2016-03-23 配線基板、電子装置および電子モジュール WO2016152905A1 (ja)

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