WO2016152905A1 - 配線基板、電子装置および電子モジュール - Google Patents
配線基板、電子装置および電子モジュール Download PDFInfo
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- WO2016152905A1 WO2016152905A1 PCT/JP2016/059157 JP2016059157W WO2016152905A1 WO 2016152905 A1 WO2016152905 A1 WO 2016152905A1 JP 2016059157 W JP2016059157 W JP 2016059157W WO 2016152905 A1 WO2016152905 A1 WO 2016152905A1
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Definitions
- the present invention relates to a wiring board, an electronic device, and an electronic module.
- a wiring board is provided on one main surface of an insulating substrate, and includes a mounting electrode for mounting electronic components, a terminal electrode provided on the other main surface of the insulating substrate, and a mounting electrode and a terminal electrode. Some are connected and have a wiring conductor provided on the main surface or inside of the insulating substrate.
- the terminal electrode is bonded to the module substrate via a bonding material such as solder (Japanese Patent Laid-Open No. 2009-267041). See the official gazette).
- the wiring board is provided on the insulating substrate and on one main surface of the insulating substrate so as to face along a pair of sides facing the insulating substrate in a plan view.
- a mounting electrode and a terminal electrode provided on the other main surface of the insulating substrate so as to face each other along a pair of opposite sides of the insulating substrate in a plan view.
- an electronic device includes the wiring board having the above-described configuration and an electronic component mounted on the wiring board.
- an electronic module includes the electronic device having the above-described configuration, and a module substrate having a connection pad, the electronic device being connected to the connection pad via a bonding material. ing.
- a wiring board includes an insulating substrate, and a mounting electrode provided on one main surface of the insulating substrate so as to face each other along a pair of sides facing the insulating substrate in plan view,
- the other main surface of the insulating substrate has terminal electrodes provided so as to face each other along another set of sides facing the insulating substrate in a plan view.
- An electronic device includes a wiring board having the above-described configuration and an electronic component mounted on the wiring board, so that an electronic device having excellent long-term reliability can be obtained.
- An electronic module includes an electronic device having the above configuration, a connection pad, and the electronic device includes a module substrate connected to the connection pad via a bonding material. It can be excellent in long-term reliability.
- (A) is a top view which shows the electronic device in the 1st Embodiment of this invention
- (b) is a bottom view of (a).
- (A) is a longitudinal sectional view taken along line AA of the electronic device shown in FIG. 1 (a), and (b) is taken along line BB of the electronic device shown in FIG. 1 (a). It is a longitudinal cross-sectional view.
- (A) And (b) is a longitudinal cross-sectional view which shows the electronic module mounted in the board
- (A) is a top view which shows the electronic device in the other example of the 1st Embodiment of this invention
- (b) is a bottom view of (a).
- FIG. 7 is an internal top view of a wiring board in the electronic device shown in FIG. 6.
- A) is a longitudinal sectional view taken along line AA of the electronic device shown in FIG. 6 (a), and (b) is taken along line BB of the electronic device shown in FIG. 1 (a). It is a longitudinal cross-sectional view. It is an upper surface perspective view which shows the wiring board in the other example of the 2nd Embodiment of this invention.
- FIG. 11 is an internal bottom view of a wiring board in the electronic device shown in FIG.
- FIG. 10A is a longitudinal sectional view taken along line AA of the electronic device shown in FIG. 10A
- FIG. 10B is taken along line BB of the electronic device shown in FIG. It is a longitudinal cross-sectional view. It is a lower surface perspective view which shows the wiring board in the other example of the 3rd Embodiment of this invention.
- the light emitting device includes a wiring board 1 and an electronic component 2 provided on the upper surface of the wiring board 1 as in the example shown in FIGS. 1 and 2.
- the electronic device is connected to the connection pads 51 on the module substrate 5 constituting the electronic module, for example, using the bonding material 6.
- the wiring board 1 in this embodiment includes an insulating substrate 11, a mounting electrode 12 provided on one main surface of the insulating substrate 11, a terminal electrode 13 provided on the other main surface of the insulating substrate 11, and a mounting electrode.
- the wiring conductor 14 is connected to the electrode 12 and the terminal electrode 13 and provided on the surface or inside of the insulating substrate 11.
- the mounting electrodes 12 are provided so as to face each other along a pair of opposing sides of the insulating substrate 11 in plan view.
- the terminal electrodes 13 are provided so as to face each other along a pair of opposing sides of the insulating substrate 11 in a plan view. 1 to 3, the electronic device is mounted on an xy plane in a virtual xyz space. 1 to 3, the upward direction means the positive direction of the virtual z-axis.
- the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the wiring board 1 or the like is actually used.
- FIG. 1A a portion where the outer edge of the mounting electrode 12 and the electronic component 2 overlap, and in FIG. 1, the wiring conductor 14 (through conductor) is indicated by a broken line.
- FIG. 1B the electronic component 2 is indicated by a two-dot chain line.
- the insulating substrate 11 has one main surface (upper surface in FIGS. 1 and 2) and the other main surface (lower surface in FIGS. 1 and 2).
- the insulating substrate 11 has a rectangular plate shape having two sets of opposing sides (four sides) with respect to each of the one main surface and the other main surface in plan view.
- the insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is placed on a mounting electrode 12 provided on one main surface of the insulating substrate 11 via a connection member 3 such as a solder bump. Glued and fixed.
- the insulating substrate 11 for example, ceramics such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body can be used.
- the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc.
- a suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry.
- a ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method.
- the ceramic green sheet is subjected to an appropriate punching process, and a plurality of ceramic green sheets are laminated as necessary to form a generated shape, and the generated shape is fired at a high temperature (about 1600 ° C.).
- An insulating substrate 11 is manufactured.
- the mounting electrode 12 is provided on one main surface of the insulating substrate 11 so as to face along a pair of sides facing the insulating substrate 11 in plan view.
- the terminal electrode 13 is provided on the other main surface of the insulating substrate 11 so as to face along another set of sides facing the insulating substrate 11 in a plan view.
- two mounting electrodes 12 are provided in parallel in the Y direction along a pair of opposing sides, and the length of the mounting electrode 12 is The length in the Y direction is longer than the length in the X direction.
- Two terminal electrodes 13 are provided in parallel in the X direction along another set of sides, and the length of the terminal electrode 13 is longer in the X direction than in the Y direction. It has become.
- the mounting electrode 12 is used to electrically connect the electronic component 2 mounted on the wiring substrate 1 and the module substrate 5 or to join the wiring substrate 1 and the electronic component 2 together.
- the terminal electrode 13 is used to electrically connect the electronic component 2 mounted on the wiring board 1 and the module board 5 or to join the wiring board 1 and the module board 5.
- the wiring conductor 14 is electrically connected to the mounting electrode 12 and the terminal electrode 13 to electrically connect the electronic component 2 mounted on the wiring substrate 1 and the module substrate 5.
- the wiring conductor 14 includes a wiring layer provided on the surface or inside of the insulating substrate 11, and a through conductor that penetrates the insulating substrate 11 and electrically connects the wiring layers positioned above and below.
- the material of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 is, for example, a metal powder mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. It is metallization.
- the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 are, for example, printing means such as a screen printing method using a metallized paste for the mounting electrode 12, the terminal electrode 13 and the wiring conductor 14 on a ceramic green sheet for the insulating substrate 11. Is formed by printing and coating with a ceramic green sheet for the insulating substrate 11.
- the through conductor is formed, for example, in a ceramic green sheet for the insulating substrate 11 by a die or punching process by punching or laser processing or the like, and through metal for the through conductor is formed in the through hole. It is formed by filling the paste with the above printing means and firing it together with the ceramic green sheet for the insulating substrate 11.
- the metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.
- the surface of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 exposed from the insulating substrate 11 is coated with a metal plating layer having excellent corrosion resistance, such as nickel or gold. It is possible to reduce the corrosion of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14, and the bonding between the mounting electrode 12 and the electronic component 2, the connection between the mounting electrode 12 and the connection member 3, or the module substrate 5 and the terminal electrode 13 can be firmly bonded.
- a nickel plating layer having a thickness of about 1 to 10 ⁇ m and a gold plating layer having a thickness of about 0.1 to 3 ⁇ m are sequentially formed on the surface of the mounting electrode 12, the terminal electrode 13, and the wiring conductor 14 exposed from the insulating substrate 11. To be attached.
- the plating layer is not limited to nickel plating layer / gold plating layer, but other plating including nickel plating layer / gold plating layer / silver plating layer, or nickel plating layer / palladium plating layer / gold plating layer, etc. It may be a layer.
- the electronic device 2 can be manufactured by mounting the electronic component 2 on the mounting electrode 12 provided on one main surface of the wiring board 1.
- the electronic component 2 mounted on the wiring board 1 is a semiconductor element such as an IC chip or an LSI chip, a light emitting element, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, and various sensors.
- the semiconductor element is connected to the semiconductor element via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin).
- connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin).
- the semiconductor element 2 is mounted on one mounting electrode 12 on which the electronic component 2 is mounted by a bonding member such as a low melting point brazing material or a conductive resin.
- a bonding member such as a low melting point brazing material or a conductive resin.
- the electrode of the semiconductor element and the other mounting electrode 12 are electrically connected via the connecting member 3 such as a bonding wire to be mounted on the wiring board 1.
- a plurality of electronic components 2 may be mounted on the wiring board 1, and other electronic components such as a resistor element, a capacitor element, and a Zener diode may be mounted as necessary.
- the electronic component 2 is sealed with a sealing material 4 made of resin, glass, or the like, a lid made of resin, glass, ceramics, metal, or the like, as necessary.
- the electronic device according to the present embodiment is connected to the connection pad 51 of the module substrate 5 via the bonding material 6 such as solder to form an electronic module.
- the insulating substrate 11 and the mounting surface provided on one main surface of the insulating substrate 11 so as to face each other along a pair of opposite sides of the insulating substrate 11 in plan view.
- the electrode 12 and the terminal electrode 13 provided on the other main surface of the insulating substrate 11 so as to face each other along a pair of opposite sides of the insulating substrate 11 in a plan view.
- the insulating substrate 11 Suppresses the concentration of thermal stress due to the difference in thermal expansion coefficient between the mounting electrode 12 and the insulating substrate 11 and the terminal electrode 13 in the same direction, thereby suppressing the deformation and distortion of the wiring substrate 1, and the electronic component 2 and the wiring substrate.
- 1 or good connection between the wiring board 1 and the module board 5 And things may be a wiring board 1 having excellent reliability.
- the wiring board 1 in the present embodiment can be suitably used in a thin and high-power electronic device, and the reliability in the wiring board 1 can be improved.
- a light emitting element is mounted as the electronic component 2, it can be suitably used as the wiring substrate 1 for a thin and high luminance light emitting device.
- orthogonal in plane perspective means that the mounting electrode 12 long in one direction (Y direction in FIG. 1) and the terminal electrode 13 long in the other direction (X direction in FIG. 1) It shows that they are orthogonal.
- the mounting electrode 12 and the terminal electrode 13 are orthogonally overlapped with each other, the portion of the insulating substrate 11 alone in which the mounting electrode 12 or the terminal electrode 13 is not provided is small in a plan view. Thus, leakage of light to the outside can be effectively suppressed.
- the electronic device is used when the electronic device is used. Even if high heat is applied from the component 2 to the wiring board 1, the thermal stress due to the difference in thermal expansion coefficient between the insulating substrate 11 and the mounting electrode 12 and between the insulating substrate 11 and the terminal electrode 13 is concentrated in the same direction.
- the total area of the mounting electrodes 12 provided so as to face each other is provided in a region of 30% or more of the area of one main surface of the insulating substrate 11, and provided in a region of 50% or more. It is preferable. Further, the total area of the terminal electrodes 13 provided so as to face each other in plan view is provided in a region of 30% or more of the area of the other main surface of the insulating substrate 11 in plan view, and is 50% or more. It is preferable to be provided in the region.
- the area where the mounting electrode 12 and the terminal electrode 13 overlap is 20% or more of the area of the mounting electrode 12 in a plan view.
- the region preferably overlaps with the terminal electrode 13, and more preferably overlaps with the terminal electrode 13 in a region of 50% or more of the area of the mounting electrode 12.
- the terminal electrode 13 preferably overlaps with the mounting electrode 12 in a region of 20% or more of the area of the terminal electrode 13 in a plan view, and a region of 50% or more of the area of the terminal electrode 13 It is more preferable that the electrode overlaps with the mounting electrode 12 in FIG.
- the above effect is further improved. can do.
- the total area of the mounting electrodes 12 provided so as to face each other is 0.5 times or more and 1.5 times or less than the total area of the terminal electrodes 13 provided so as to face each other, the above-described effect is obtained. Since it can be made more effective, it is preferable. Further, it is more effective if the thickness of the mounting electrode 12 provided so as to be opposed is 0.8 to 1.2 times the thickness of the terminal electrode 13 provided so as to be opposed. Therefore, it is preferable.
- three or more mounting electrodes 12 and terminal electrodes 13 may be provided on the main surface of the insulating substrate 11 as in the example shown in FIG. Also in this case, as described above, the total area of the mounting electrodes 12 provided so as to face each other is 0.8 to 1.2 times the total area of the terminal electrodes 13 provided so as to face each other. It is preferable.
- three mounting electrodes 12 are provided on one main surface of the insulating substrate 11 so as to face each other along a pair of sides of the insulating substrate 11. Yes.
- the three terminal electrodes 13 face each other along the other main surface of the insulating substrate 11 along another set of sides of the insulating substrate 11. It is provided as follows.
- the mounting electrodes 12 or the terminal electrodes 13 are arranged so as to be orthogonal to each other and to overlap with a plurality of electrodes in a plan view.
- the sizes and shapes of the mounting electrodes 12 or the terminal electrodes 13 may be different.
- the mounting electrode 12 and the terminal electrode 13 intersect so as to be orthogonal to each other as seen in a plan view, as in the example shown in FIGS.
- the electrodes are arranged so as to cross a plurality of electrodes.
- the electrical reliability is improved by having the wiring board 1 having the above-described configuration.
- the electronic device having the above-described configuration is connected to the connection pad 51 of the module substrate 5 via the bonding material 6, the long-term reliability is excellent. be able to.
- the electronic device according to the second embodiment of the present invention differs from the electronic device according to the above-described embodiment in that the insulating substrate 11 is one of the insulating substrates 11 as in the examples shown in FIGS. This is that the surface side has a concave portion 15 sandwiched between the mounting electrodes 12 in a plan view.
- FIG. 6A a portion where the outer edge of the mounting electrode 12 and the inner wall of the recess 15 and the electronic component 2 overlap, and in FIG. 6 and FIG. 7, the wiring conductor 14 (through conductor) is the first embodiment.
- FIG. 6B The other electronic component 7 in FIG. 6A and the electronic component 2 in FIG. 6B are indicated by a two-dot chain line.
- the mounting electrode 12 and the terminal electrode 13 are arranged so as to extend in different directions, as in the first embodiment. Even when high heat is applied from the electronic component 2 to the wiring board 1 when the apparatus is used, the thermal stress due to the difference in thermal expansion coefficient between the insulating substrate 11 and the mounting electrode 12 and between the insulating substrate 11 and the terminal electrode 13 is the same direction. To suppress the deformation and distortion of the wiring board 1 and to improve the connection between the electronic component 2 and the wiring board 1 or between the wiring board 1 and the module board 5.
- the wiring board 1 can be made excellent in performance.
- the recess 15 for example, when a light emitting element is used as the electronic component 2, if another electronic component 7 such as a Zener diode is accommodated in the recess 15, it is formed on one main surface of the insulating substrate 11. Compared to the case where other electronic components 7 are arranged, it is not necessary to provide a large area for mounting the other electronic components 7 in the plane direction, and light from the light emitting element in the lateral direction is blocked. Therefore, a light emitting device with a small size and high luminance can be obtained. Further, the recess 15 may be sealed with a resin or the like containing a fluorescent agent or a reflective agent to improve the luminance of the light emitting device.
- the recess 15 can be used as a region for mounting other electronic components 7 as in the examples shown in FIGS.
- a wiring conductor 14 for electrical connection with other electronic components 7 is led out to the bottom surface of the recess 15.
- Such recesses 15 are formed in the ceramic green sheets for the insulating substrate 11 by laser processing, punching with a mold, or the like to form through holes to be the recesses 15 in a plurality of ceramic green sheets. It can be formed by laminating on a ceramic green sheet in which no through hole is formed.
- the recess 15 is provided so as to extend along the mounting electrode 12 as in the example shown in FIGS. At this time, in a plan view, the concave portion 15 overlaps with the plurality of terminal electrodes 13 provided on the other main surface of the insulating substrate 11, and in the concave portion 15 where the thickness of the insulating substrate 11 is reduced, The mechanical strength can be improved, and the possibility that cracks and the like occur in the insulating substrate 11 can be reduced. Further, as in the examples shown in FIGS. 6 to 8, the wiring conductor 14 provided inside the insulating substrate 11 and led out to the bottom surface of the recess 15 and the plurality of mounting electrodes 12 are respectively provided. It is more preferable that the longitudinal directions are provided so as to overlap each other at right angles.
- the area where the mounting electrode 12 and the wiring conductor 14 overlap is 20% or more of the area of the mounting electrode 12 in a plan view. It is preferable to overlap the wiring conductor 14 in the region because the above effect can be made more effective. Further, it is preferable that the wiring conductor 14 also overlaps the mounting electrode 12 in a region of 20% or more of the area of the wiring conductor 14 in a plan view.
- the shape of the recess 15 may not be rectangular in plan view. As in the example shown in FIG. 9, in plan view, the width of both ends of the recess 15 is smaller than the width of the central portion, for example, the width of the recess 15 other than the region where the other electronic component 7 is mounted When the width is smaller than the width of the recess 15 in the region where the electronic component 7 is mounted, deformation and distortion of the wiring board 1 can be suppressed.
- the length in the longitudinal direction in plan view is shortened and arranged so that the mounting electrode 12 spreads to the opposite side, and this region, the electronic component 2 and the terminal electrode 13 provided on the other main surface, If they overlap, the deformation and distortion of the wiring board 1 can be suppressed, and the heat dissipation from the electronic component 2 to the wiring board 1 can be improved.
- the mounting electrode 12 is provided so as to extend from both ends along a pair of opposing sides of the insulating substrate 11 so as to surround the recess 15 in a plan view.
- the mechanical strength can be improved in the recess 15 where the thickness of the insulating substrate 11 is reduced, and the possibility that cracks or the like occur in the insulating substrate 11 can be reduced.
- the wiring board 1 of the second embodiment can be manufactured using the same manufacturing method as the wiring board 1 of the first embodiment described above.
- the electronic device according to the third embodiment of the present invention is different from the electronic device according to the above-described embodiment in that the insulating substrate 11 is the other main substrate of the insulating substrate 11 as in the examples shown in FIGS.
- the surface side has a recess 15 sandwiched between the terminal electrodes 13 in a plan view.
- FIG. 10A the portion where the outer edge of the mounting electrode 12 and the electronic component 2 overlap, and in FIGS. 10 and 11, the wiring conductor 14 (through conductor) is a broken line as in the first embodiment. Is shown.
- FIG. 10B the electronic component 2 is indicated by a two-dot chain line.
- the mounting electrode 12 and the terminal electrode 13 are arranged so as to extend in different directions. Even when high heat is applied from the electronic component 2 to the wiring board 1 when the apparatus is used, the thermal stress due to the difference in thermal expansion coefficient between the insulating substrate 11 and the mounting electrode 12 and between the insulating substrate 11 and the terminal electrode 13 is the same direction. To suppress the deformation and distortion of the wiring board 1 and to improve the connection between the electronic component 2 and the wiring board 1 or between the wiring board 1 and the module board 5.
- the wiring board 1 can be made excellent in performance.
- the recess 15 is used to mount other electronic components 7 as in the second embodiment, as in the examples shown in FIGS. It can be used as a region.
- a wiring conductor 14 is led out from the bottom surface of the recess 15 in order to be electrically connected to another electronic component 7.
- the recess 15 is provided between the terminal electrodes 13 so as to extend long in one direction along the terminal electrodes 13 as in the examples shown in FIGS.
- the concave portion 15 overlaps with the plurality of mounting electrodes 12 provided on one main surface of the insulating substrate 11, and the concave portion 15 in which the thickness of the insulating substrate 11 becomes thin is reduced.
- the mechanical strength can be improved, and the possibility that cracks and the like occur in the insulating substrate 11 can be reduced.
- the wiring conductor 14 provided inside the insulating substrate 11 and led out to the bottom surface of the recess 15 and the plurality of terminal electrodes 13 are each provided in the longitudinal direction.
- the directions are provided so as to overlap each other at right angles.
- the area where the mounting electrode 12 and the wiring conductor 14 overlap is an area that is 20% or more of the area of the terminal electrode 13 in a plan view. It is preferable that the two layers overlap each other since the above effect can be further improved.
- the wiring conductor 14 also preferably overlaps with the terminal electrode 13 in a region of 20% or more of the area of the wiring conductor 14 in plan view.
- the width of both end portions of the recess 15 is smaller than the width of the central portion in plan view, deformation and distortion of the wiring board 1 can be suppressed.
- the wiring board 1 of the third embodiment can be manufactured using the same manufacturing method as the wiring board 1 of the first embodiment or the second embodiment described above.
- the present invention is not limited to the above-described embodiments, and various modifications can be made.
- the wiring substrate 1 in which chamfered portions or arc-shaped notches are formed in the thickness direction of the insulating substrate 11 at corners of the insulating substrate 11 may be used.
- the terminal electrode 13 is provided on the other main surface of the insulating substrate 11, but a hole is provided between the side surface of the insulating substrate 11 and the other main surface, and the terminal electrode 13 is formed on the inner surface of the hole. May have a so-called castellation conductor extended.
- the mounting electrode 12 may extend to the inner surface of a hole provided on the side surface of the insulating substrate 11.
- the form of the wiring board 1 of the first to third embodiments may be combined.
- the wiring substrate 1 of the second embodiment three or more terminal electrodes 13 provided on the other main surface side of the insulating substrate 11 may be provided.
- the wiring substrate 1 of the third embodiment Three or more mounting electrodes 12 provided on one main surface of the insulating substrate 11 may be provided.
- the mounting electrode 12 and the terminal electrode 13 have a rectangular shape in plan view, but for example, in the plan view, the wiring substrate 1 or
- the mounting electrode 12 or the terminal electrode 13 provided with a convex portion or the like on the edge of the electrode partially in plan view, or the edge of the electrode is partially Alternatively, the mounting electrode 12 or the terminal electrode 13 may be removed.
- the mounting electrode 12 and the terminal electrode 13 are examples formed by the cofiring method in the above-described example, but may be a metal layer formed by a forming method such as a post-fire method or a thin film forming method. good.
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
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- Geometry (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
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Abstract
Description
本発明の第1の実施形態における発光装置は、図1および図2に示された例のように、配線基板1と、配線基板1の上面に設けられた電子部品2とを含んでいる。電子装置は、図3に示された例のように、例えば電子モジュールを構成するモジュール用基板5上の接続パッド51に接合材6を用いて接続される。
次に、本発明の第2の実施形態による電子装置について、図6~図8を参照しつつ説明する。
次に、本発明の第3の実施形態による電子装置について、図10~図12を参照しつつ説明する。
Claims (11)
- 絶縁基板と、
該絶縁基板の一方主面に、平面視で前記絶縁基板の対向する一組の辺に沿って対向するように設けられた搭載用電極と、
前記絶縁基板の他方主面に、平面透視で前記絶縁基板の対向する他の一組の辺に沿って対向するように設けられた端子用電極とを有していることを特徴とする配線基板。 - 平面透視において、前記搭載用電極と前記端子用電極とが直交していることを特徴とする請求項1に記載の配線基板。
- 平面透視において、前記搭載用電極と前記端子用電極とが重なっていることを特徴とする請求項2に記載の配線基板。
- 前記絶縁基板の一方主面に、平面視で前記搭載用電極に挟まれた凹部を有していることを特徴とする請求項1乃至請求項3のいずれかに記載の配線基板。
- 前記凹部は、前記搭載用電極に沿って延びるように設けられており、平面透視で前記端子用電極と重なっていることを特徴とする請求項4に記載の配線基板。
- 平面視において、前記搭載用電極は、前記凹部を取り囲むように、両端部から前記絶縁基板の対向する一組の辺に沿って延出して設けられていることを特徴とする請求項4または請求項5に記載の配線基板。
- 前記絶縁基板の他方主面に、平面透視で前記端子用電極に挟まれた凹部を有していることを特徴とする請求項1乃至請求項3のいずれかに記載の配線基板。
- 前記凹部は、前記端子用電極に沿って延びるように設けられており、平面透視で前記搭載用電極と重なっていることを特徴とする請求項7に記載の配線基板。
- 平面視において、前記凹部における両端部の幅が中央部の幅より小さいことを特徴とする請求項5または請求項6または請求項8のいずれかに記載の配線基板。
- 請求項1乃至請求項9のいずれかに記載の配線基板と、
該配線基板に搭載された電子部品とを有していることを特徴とする電子装置。 - 請求項10記載の電子装置と、
接続パッドを有し、前記電子装置が前記接続パッドに接合材を介して接続されたモジュール用基板とを有することを特徴とする電子モジュール。
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CN201680017683.9A CN107431047B (zh) | 2015-03-26 | 2016-03-23 | 布线基板、电子装置以及电子模块 |
JP2017508382A JP6595580B2 (ja) | 2015-03-26 | 2016-03-23 | 配線基板、電子装置および電子モジュール |
US15/559,092 US10290591B2 (en) | 2015-03-26 | 2016-03-23 | Wiring board, electronic device, and electronic module |
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- 2016-03-23 JP JP2017508382A patent/JP6595580B2/ja active Active
- 2016-03-23 US US15/559,092 patent/US10290591B2/en active Active
- 2016-03-23 WO PCT/JP2016/059157 patent/WO2016152905A1/ja active Application Filing
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