WO2016150165A1 - 对设备外壳的处理方法、设备外壳及设备 - Google Patents
对设备外壳的处理方法、设备外壳及设备 Download PDFInfo
- Publication number
- WO2016150165A1 WO2016150165A1 PCT/CN2015/093415 CN2015093415W WO2016150165A1 WO 2016150165 A1 WO2016150165 A1 WO 2016150165A1 CN 2015093415 W CN2015093415 W CN 2015093415W WO 2016150165 A1 WO2016150165 A1 WO 2016150165A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ink layer
- film
- attached
- casing
- equipment
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
- B44C1/17—Dry transfer
- B44C1/1704—Decalcomanias provided with a particular decorative layer, e.g. specially adapted to allow the formation of a metallic or dyestuff layer on a substrate unsuitable for direct deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
Definitions
- the present disclosure relates to the field of device housing manufacturing technology, and in particular, to a method for processing a device housing, a device housing, and a device.
- some devices with communication or network functions such as mobile phones and tablet computers, need to be equipped with antennas in the housing of the device.
- some equipment manufacturers will use metal materials to make the device casing.
- the antenna technology needs to use a non-conductive material to cut the metal frame into several independent parts to meet the RF requirements. Therefore, it is necessary to add a non-conductive material (usually a plastic material) partition strip outside the entire metal casing of the device. Although this can meet the antenna RF requirements, it will seriously affect the appearance consistency and aesthetics of the device casing.
- Embodiments of the present disclosure provide a method of processing a device housing, a device housing, and a device for achieving an overall appearance consistency effect of the device housing.
- a method of processing a device housing including:
- the film layer in the film attached to the outer surface is removed such that the ink layer is attached to the outer surface.
- the attaching the membrane to the outer surface of the outer casing comprises:
- the film is applied to the outer surface to which the glue is sprayed, wherein the ink layer in the film is bonded to the outer surface.
- the removing the film layer in the film attached to the outer surface comprises:
- the shape of the film attached to the outer surface is cut so that the shape of the film attached to the outer surface after cutting is a preset shape shape;
- the film layer in the predetermined shape of the film attached to the outer surface is removed such that the ink layer of the predetermined shape is attached to the outer surface.
- the method further includes:
- the ink layer attached to the outer surface is reinforced such that the adhesion between the ink layer and the outer surface is equal to or greater than a predetermined threshold.
- the method further comprises: before attaching the diaphragm to an outer surface of the outer casing, the method further comprising:
- the outer surface is chamfered and/or polished.
- the thickness of the ink layer ranges from 0.002 mm to 0.2 mm.
- the thickness of the glue ranges from 0.002 mm to 0.2 mm.
- the ink layer comprises a metallic ink layer.
- an apparatus casing treated with any one of the methods of treating a device casing, the outer surface of which is coated with an ink layer.
- the thickness of the ink layer ranges from 0.002 mm to 0.2 mm.
- the ink layer comprises a metallic ink layer.
- an apparatus including any one of the device housings.
- the ink layer may be attached to the outer surface of the device as needed, so that the outer surface of the outer casing can exhibit an overall and consistent appearance effect as needed, and can satisfy various textures. And materials and other requirements, improve the aesthetics.
- FIG. 1 is a flow chart showing a method of processing a device housing according to an exemplary embodiment.
- FIG. 2 is a cross-sectional effect view of the device casing after performing step S101 in FIG. 1.
- FIG. 2 is a cross-sectional effect view of the device casing after performing step S101 in FIG. 1.
- FIG. 3 is a cross-sectional effect view of the device casing after performing step S102 in FIG. 1.
- FIG. 3 is a cross-sectional effect view of the device casing after performing step S102 in FIG. 1.
- FIG. 4 is a flow chart of another method of processing a device housing, according to an exemplary embodiment.
- Figure 5 is a cross-sectional perspective view of a method of treating a device housing, as shown in an exemplary embodiment, after processing the device housing.
- FIG. 6 is another plan view of the processing of the device housing, which is illustrated by an exemplary embodiment, after processing the device housing.
- FIG. 7 is a block diagram suitable for use with a device, according to an exemplary embodiment.
- FIG. 1 is a flow chart of a method for processing a device housing according to an exemplary embodiment. As shown in FIG. 1 , the method is used to fabricate a device housing, including the following steps S101-S103:
- step S101 an ink layer is coated on the film layer to form a film.
- the ink may be thoroughly agitated to achieve a uniform density of the ink, and then the ink layer is applied to the film layer to form a film.
- the thickness of the ink layer ranges from 0.002 mm to 0.2 mm.
- a cross-sectional effect view of the diaphragm is shown in Fig. 2, wherein reference numeral 21 denotes a film layer, reference numeral 22 denotes an ink layer, and reference numeral 20 denotes a film sheet.
- step S102 the diaphragm is attached to the outer surface of the outer casing, wherein the ink layer in the diaphragm is attached to the outer surface.
- the cross-sectional effect diagram of the outer casing after step S102 is as shown in FIG. 3, and the reference numeral 23 is an outer casing.
- step S102 can be implemented as the following steps S1021-S1022: in step S1021, spraying glue on the outer surface; in step S1022, attaching the film to the outer surface coated with glue Wherein the ink layer in the film is bonded to the outer surface.
- the thickness of the glue ranges from 0.002 mm to 0.2 mm.
- the fitting process of the outer casing and the diaphragm can be carried out in a special mold, and the film and the glue-coated outer casing are accurately positioned by the positioning mechanism through the film feeding machine, and the film is attached to the glued spray.
- the diaphragm can be attached to the outer surface of the outer casing by means of an adhesive.
- other methods can be used, which are all within the protection scope of the embodiments of the present disclosure.
- the method may further include step S1020: performing any one of chamfering processing, polishing processing, or both processing on the outer surface.
- Chamfering and polishing, both In order to make the outer surface of the outer casing more favorable for attaching the diaphragm.
- step S103 the film layer in the film attached to the outer surface is removed, so that an ink layer is attached to the outer surface.
- step S103 can be implemented as steps S1031-S1032: in step S1031, the film attached to the outer surface is shaped and cut to be attached to the outer surface of the diaphragm after cutting.
- the shape is a preset shape; in step S1032, the film layer in the film of the predetermined shape attached to the outer surface is removed, so that an ink layer of a predetermined shape is attached to the outer surface.
- the preset shape can be designed into any shape as needed, for example, it can be exactly the same as the shape of the outer surface, so that the ink layer can completely cover the outer surface of the outer casing, and the cross-sectional effect diagram thereof is as shown in FIG. 5, and the numeral 22 indicates the ink layer.
- Reference numeral 23 denotes a casing; for example, it may be smaller than the shape of the outer surface, covering only one region on the outer surface, and the effect diagram thereof is as shown in FIG. 6.
- the ink layer 22 has a circular shape and covers only the outer casing 23. Corresponding circular areas on the outer surface.
- step S104 may be further performed after step S103: the ink layer attached to the outer surface is reinforced to make the adhesion between the ink layer and the outer surface equal to or greater than
- the threshold is set to achieve the corresponding adhesion and the like to prevent the ink layer from being easily peeled off from the outer casing.
- the reinforcing treatment can be performed by a curing process such as cooling and secondary heating.
- the device casing in the embodiment of the present disclosure may be made of any material, such as a metal material, a plastic material, or the like.
- the outer casing may be of any shape, and other components such as a partition strip may be provided on the outer casing.
- the ink layer in the embodiment of the present disclosure may be a metal ink layer, and the metal ink refers to an ink having a unique metal shining effect prepared by replacing a pigment or a dye in a conventional ink with a fine metal foil; a metal ink layer,
- the outer casing of the device may have an overall metallic effect, or one of the outer casing may have a metallic effect; the ink layer may also be an ink layer made of a coating material that can be attached to the surface of the outer casing.
- it may be an ink layer which forms a texture on the surface of the outer casing, or an ink layer which gives a wooden effect to the surface of the outer casing, and the user may decide which ink layer to use according to different appearance requirements.
- the above method provided by the embodiments of the present disclosure can adhere the ink layer on the outer surface of the device as needed, so that the outer surface of the outer casing exhibits an overall and consistent appearance effect as needed. Can meet a variety of textures and materials and other requirements, improve the aesthetics.
- the outer casing of the device may have an overall metallic texture effect, or a metal texture effect may be imparted to a certain region of the outer casing, thereby improving the aesthetics.
- the outer casing is made of a metal material, in order to ensure the radio frequency requirement of the antenna, it is necessary to divide the metal casing into several parts by using a non-conductive material partition strip on the metal casing.
- the casing of the device cannot be Showing the overall metallic texture, but After the casing of the device is processed by the above method provided by the embodiment of the present disclosure, the RF requirement of the antenna can be ensured, and the outer casing of the device can be presented with an overall metallic texture, and the partition strip is not seen in the appearance. Improve the aesthetics of the device's outer casing.
- the embodiment of the present disclosure further provides a device casing that has been treated by any of the foregoing methods for treating a device casing, and an ink layer is attached to an outer surface of the casing (refer to FIG. 5 or FIG. 6).
- the thickness of the ink layer ranges from 0.002 mm to 0.2 mm.
- the ink layer in the embodiment of the present disclosure may be a metal ink layer, which may have an overall metal texture effect on the outer casing of the device, or may also have a metal texture effect on a certain area of the outer casing; the ink layer may also be used for other purposes.
- the ink layer made of the coating material attached to the surface of the outer casing may be, for example, an ink layer which forms a texture on the surface of the outer casing, or an ink layer which gives a wooden effect to the surface of the outer casing, etc., and the user may decide according to different appearance requirements. Which ink layer to use.
- An embodiment of the present disclosure further provides an apparatus, including the apparatus housing provided by the embodiment of the present disclosure.
- FIG. 7 is a block diagram of an apparatus 800, according to an exemplary embodiment.
- device 800 can be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a gaming console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.
- device 800 can include one or more of the following components: processing component 802, memory 804, power component 806, multimedia component 808, audio component 810, input/output (I/O) interface 812, sensor component 814, And a communication component 816.
- Processing component 802 typically controls the overall operation of device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations.
- Processing component 802 can include one or more processors 820 to execute instructions to perform all or part of the steps of the above described methods.
- processing component 802 can include one or more modules to facilitate interaction between component 802 and other components.
- processing component 802 can include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.
- Memory 804 is configured to store various types of data to support operation at device 800. Examples of such data include instructions for any application or method operating on device 800, contact data, phone book data, messages, pictures, videos, and the like.
- the memory 804 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read only memory (EEPROM), erasable.
- SRAM static random access memory
- EEPROM electrically erasable programmable read only memory
- EPROM Electrically erasable programmable read only memory
- PROM Programmable Read Only Memory
- ROM Read Only Memory
- Magnetic Memory Flash Memory
- Disk Disk or Optical Disk.
- Power component 806 provides power to various components of device 800.
- Power component 806 can include a power management system, One or more power sources, and other components associated with generating, managing, and distributing power for device 800.
- the multimedia component 808 includes a screen between the device 800 and the user that provides an output interface.
- the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user.
- the touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor may sense not only the boundary of the touch or sliding action, but also the duration and pressure associated with the touch or slide operation.
- the multimedia component 808 includes a front camera and/or a rear camera. When the device 800 is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.
- the audio component 810 is configured to output and/or input an audio signal.
- the audio component 810 includes a microphone (MIC) that is configured to receive an external audio signal when the device 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode.
- the received audio signal may be further stored in memory 804 or transmitted via communication component 816.
- the audio component 810 also includes a speaker for outputting an audio signal.
- the I/O interface 812 provides an interface between the processing component 802 and the peripheral interface module, which may be a keyboard, a click wheel, a button, or the like. These buttons may include, but are not limited to, a home button, a volume button, a start button, and a lock button.
- Sensor assembly 814 includes one or more sensors for providing device 800 with a status assessment of various aspects.
- sensor component 814 can detect an open/closed state of device 800, a relative positioning of components, such as the display and keypad of device 800, and sensor component 814 can also detect a change in position of one component of device 800 or device 800. The presence or absence of user contact with device 800, device 800 orientation or acceleration/deceleration, and temperature variation of device 800.
- Sensor assembly 814 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact.
- Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications.
- the sensor assembly 814 can also include an acceleration sensor, a gyro sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
- Communication component 816 is configured to facilitate wired or wireless communication between device 800 and other devices.
- Device 800 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof.
- the communication component 816 receives broadcast signals or broadcast associated information from an external broadcast management system via a broadcast channel.
- the communication component 816 also includes a near field communication (NFC) module to facilitate short range communication.
- NFC near field communication
- the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
- RFID radio frequency identification
- IrDA infrared data association
- UWB ultra-wideband
- Bluetooth Bluetooth
- device 800 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable A gate array (FPGA), controller, microcontroller, microprocessor, or other electronic component implementation for performing the above methods.
- ASICs application specific integrated circuits
- DSPs digital signal processors
- DSPDs digital signal processing devices
- PLDs programmable logic devices
- FPGA field programmable A gate array
- controller microcontroller, microprocessor, or other electronic component implementation for performing the above methods.
- non-transitory computer readable storage medium comprising instructions, such as a memory 804 comprising instructions executable by processor 820 of device 800 to perform the above method.
- the non-transitory computer readable storage medium may be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device.
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
Claims (12)
- 一种对设备外壳的处理方法,其特征在于,包括:在薄膜层上涂覆油墨层,形成一膜片;将所述膜片附着于所述外壳的外表面,其中,所述膜片中的油墨层与所述外表面贴合;将附着于所述外表面的膜片中的薄膜层去除,使得在所述外表面上附着有所述油墨层。
- 如权利要求1所述的方法,其特征在于,所述将所述膜片附着于所述外壳的外表面上,包括:在所述外表面上喷涂胶水;将所述膜片贴至喷涂有胶水的所述外表面,其中,所述膜片中的油墨层与所述外表面贴合。
- 如权利要求1所述的方法,其特征在于,所述将附着于所述外表面的膜片中的薄膜层去除,包括:对附着于外表面的膜片进行形状裁剪,使裁剪后附着于外表面的膜片的形状为预设形状;将附着于外表面上的、所述预设形状的膜片中的薄膜层去除,使得在外表面上附着有所述预设形状的油墨层。
- 如权利要求1所述的方法,其特征在于,所述将附着于所述外表面的膜片中的薄膜层去除之后,所述方法还包括:对附着于所述外表面上的油墨层进行加固处理,使所述油墨层与所述外表面之间的附着力等于或大于预设阈值。
- 如权利要求1所述的方法,其特征在于,所述将所述膜片附着于所述外壳的外表面之前,所述方法还包括:对所述外表面进行倒角和/或抛光处理。
- 如权利要求1所述的方法,其特征在于,所述油墨层的厚度取值范围为0.002毫米至0.2毫米。
- 如权利要求2所述的方法,其特征在于,所述胶水的厚度取值范围为0.002毫米至0.2毫米。
- 如权利要求1所述的方法,其特征在于,所述油墨层包括金属油墨层。
- 一种采用权利要求1至8中任一种对设备外壳的处理方法处理过的设备外壳,其特征在于,所述外壳的外表面上附着有油墨层。
- 如权利要求9所述的设备外壳,其特征在于,所述油墨层的厚度取值范围为0.002毫米至0.2毫米。
- 如权利要求9所述的设备外壳,其特征在于,所述油墨层包括金属油墨层。
- 一种设备,其特征在于,包括权利要求9至11中任一所述的设备外壳。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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MX2016001767A MX363237B (es) | 2015-03-23 | 2015-10-30 | Carcasa de dispositivo y su metodo de procesamiento, dispositivo. |
JP2017507062A JP6378421B2 (ja) | 2015-03-23 | 2015-10-30 | 装置筐体、その処理方法、及び装置 |
RU2016108114A RU2636492C2 (ru) | 2015-03-23 | 2015-10-30 | Корпус устройства и способ его обработки, устройство |
KR1020167005147A KR20160124420A (ko) | 2015-03-23 | 2015-10-30 | 디바이스 쉘 및 그 프로세싱 방법, 디바이스 |
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CN201510128804.4 | 2015-03-23 | ||
CN201510128804.4A CN106163161A (zh) | 2015-03-23 | 2015-03-23 | 对设备外壳的处理方法、设备外壳及设备 |
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WO2016150165A1 true WO2016150165A1 (zh) | 2016-09-29 |
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PCT/CN2015/093415 WO2016150165A1 (zh) | 2015-03-23 | 2015-10-30 | 对设备外壳的处理方法、设备外壳及设备 |
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EP (1) | EP3072705B1 (zh) |
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KR (1) | KR20160124420A (zh) |
CN (1) | CN106163161A (zh) |
MX (1) | MX363237B (zh) |
RU (1) | RU2636492C2 (zh) |
WO (1) | WO2016150165A1 (zh) |
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CN110191592B (zh) * | 2019-06-04 | 2020-11-06 | 万奔电子科技股份有限公司 | 一种电路板封胶工艺 |
CN111491471A (zh) * | 2020-04-26 | 2020-08-04 | Oppo广东移动通信有限公司 | 壳体组件、制备方法和电子设备 |
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JPH0755598B2 (ja) * | 1986-12-10 | 1995-06-14 | 大日本印刷株式会社 | 装飾方法 |
FI20001895A0 (fi) * | 2000-08-28 | 2000-08-28 | Jukka Pekonen | Menetelmä matkapuhelimen tms. värikuoren valmistamiseksi ja menetelmässä käytettävä värikuva-aihio |
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US8163662B2 (en) * | 2009-05-13 | 2012-04-24 | W. L. Gore & Associates, Inc. | Lightweight, durable enclosures and laminates for making the same |
CN101941314A (zh) * | 2009-07-08 | 2011-01-12 | 深圳富泰宏精密工业有限公司 | 具有金属质感的壳体的制作方法及由该方法制得的壳体 |
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2015
- 2015-03-23 CN CN201510128804.4A patent/CN106163161A/zh active Pending
- 2015-10-30 KR KR1020167005147A patent/KR20160124420A/ko active Search and Examination
- 2015-10-30 JP JP2017507062A patent/JP6378421B2/ja active Active
- 2015-10-30 MX MX2016001767A patent/MX363237B/es unknown
- 2015-10-30 WO PCT/CN2015/093415 patent/WO2016150165A1/zh active Application Filing
- 2015-10-30 RU RU2016108114A patent/RU2636492C2/ru active
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2016
- 2016-01-13 EP EP16151149.8A patent/EP3072705B1/en active Active
- 2016-03-18 US US15/074,901 patent/US20160279668A1/en not_active Abandoned
Patent Citations (4)
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CN101554823A (zh) * | 2008-04-11 | 2009-10-14 | 深圳富泰宏精密工业有限公司 | 壳体的制作方法及由该方法制得的壳体 |
CN102065653A (zh) * | 2009-11-13 | 2011-05-18 | 广达电脑股份有限公司 | 具无油墨图案的塑料外壳及其制作方法 |
US20120121871A1 (en) * | 2010-11-17 | 2012-05-17 | Ming-Hung Huang | In-mold roller manufacturing method and casing product made thereby |
CN202172545U (zh) * | 2011-06-28 | 2012-03-21 | 福建省石狮市通达电器有限公司 | 一种新型电器面板 |
Also Published As
Publication number | Publication date |
---|---|
KR20160124420A (ko) | 2016-10-27 |
US20160279668A1 (en) | 2016-09-29 |
MX363237B (es) | 2019-03-15 |
MX2016001767A (es) | 2016-12-14 |
JP6378421B2 (ja) | 2018-08-22 |
EP3072705B1 (en) | 2019-10-30 |
CN106163161A (zh) | 2016-11-23 |
RU2016108114A (ru) | 2017-09-14 |
JP2017519371A (ja) | 2017-07-13 |
RU2636492C2 (ru) | 2017-11-23 |
EP3072705A1 (en) | 2016-09-28 |
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