WO2016150064A1 - 新型光伏旁路集成模块 - Google Patents

新型光伏旁路集成模块 Download PDF

Info

Publication number
WO2016150064A1
WO2016150064A1 PCT/CN2015/086152 CN2015086152W WO2016150064A1 WO 2016150064 A1 WO2016150064 A1 WO 2016150064A1 CN 2015086152 W CN2015086152 W CN 2015086152W WO 2016150064 A1 WO2016150064 A1 WO 2016150064A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal lead
integrated module
lead frames
pin
diode
Prior art date
Application number
PCT/CN2015/086152
Other languages
English (en)
French (fr)
Inventor
吴念博
李志军
陆飞敏
张雄杰
张洪海
Original Assignee
苏州固锝电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州固锝电子股份有限公司 filed Critical 苏州固锝电子股份有限公司
Publication of WO2016150064A1 publication Critical patent/WO2016150064A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details

Definitions

  • the utility model relates to a photovoltaic power generation device, in particular to a novel photovoltaic bypass integrated module.
  • Photovoltaic power plants typically have several photovoltaic modules.
  • the photovoltaic module consists of a series of photovoltaic cells.
  • Some photovoltaic power generation units exhibit high power consumption status ("hot spot"), causing power unit damage and power generation operation failure.
  • the photovoltaic bypass diode circuit is used to protect the photovoltaic modules and maintain the normal operation of the photovoltaic power generation equipment.
  • the existing photovoltaic bypass integrated module is an integrated form of photovoltaic bypass diode, but has the following disadvantages: (1) high stress during pin and cable assembly, (2) high risk of damage to the chip, and (3) increased cost, (4) ) The technical problem of low connection efficiency between the cable and the module pins.
  • the utility model provides a novel photovoltaic bypass integrated module.
  • the novel photovoltaic bypass integrated module reduces stress on the chip, reduces the risk of damaging the chip, improves reliability and reduces cost.
  • a novel photovoltaic bypass integrated module comprising at least two diode chips, a plurality of metal lead frames and a plurality of connecting pieces in the epoxy body, the plurality of The metal lead frames are arranged side by side, and the at least two diode chips are located on the surface of the metal lead frame and are connected in series by a plurality of connecting pieces to form a diode bypass circuit;
  • the front end surface of the metal lead frame extends for connecting with the bus bar a front lead, a rear end surface of the metal lead frame extends a rear pin for connecting to the cable, the front pin has a through hole thereon; and a middle portion of the front pin has a first bent portion The middle portion of the rear pin has a second bent portion.
  • the through hole is a strip through hole.
  • both sides of the rear pin have a raised portion.
  • the photovoltaic bypass integrated module of the utility model saves the cable bypassing the module, reduces the connection point, improves the reliability, reduces the cost, and is quick and reliable to assemble, and can be used without solder; secondly, the middle part of the front pin has the first fold The bent portion, the middle portion of the rear pin has a second bent portion to change the direction, reduces the stress on the chip, reduces the risk of damaging the chip, overcomes the original straight pin, and bends the cable at the lead bend The resulting stress may damage the chip.
  • FIG. 1 is a schematic structural view of a novel photovoltaic bypass integrated module of the present invention
  • Figure 2 is a schematic right side view of Figure 1;
  • Figure 3 is a schematic bottom view of Figure 1.
  • a novel photovoltaic bypass integrated module includes at least two diode chips 2, a plurality of metal lead frames 3 and a plurality of connecting sheets 4 located in the epoxy body 1, and the plurality of metal lead frames 3 are arranged side by side It is provided that the at least two diode chips 2 are located on the surface of the metal lead frame 3 and are connected in series by a plurality of connecting pieces 4 to form a diode bypass circuit; a front end surface of the metal lead frame 3 extends for connecting with the bus bar a front lead 5, a rear end surface of the metal lead frame 3 extending from a rear lead 6 for connecting to a cable, the front lead 5 having a through hole 7 therein; and a middle portion of the front lead 5 having The first bent portion 8 has a second bent portion 9 at a middle portion of the rear lead 6.
  • the rear lead 6 has a raised portion 10 on both sides.
  • Embodiment 2 A novel photovoltaic bypass integrated module comprising at least two diode chips 2, a plurality of metal lead frames 3 and a plurality of connecting sheets 4 located in the epoxy body 1, the plurality of metal lead frames 3 being side by side It is provided that the at least two diode chips 2 are located on the surface of the metal lead frame 3 and are connected in series by a plurality of connecting pieces 4 to form a diode bypass circuit; a front end surface of the metal lead frame 3 extends for connecting with the bus bar a front lead 5, a rear end surface of the metal lead frame 3 extending from a rear lead 6 for connecting to a cable, the front lead 5 having a through hole 7 therein; and a middle portion of the front lead 5 having The first bent portion 8 has a second bent portion 9 at a middle portion of the rear lead 6.
  • the through hole 7 is a strip through hole.
  • the middle portion of the front pin has the first The bent portion, the middle portion of the rear pin has a second bent portion that changes direction, reduces stress on the chip, reduces the risk of damaging the chip; overcomes the original straight pin, and bends the cable at the lead bend
  • the stress generated by the wire may damage the chip.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Photovoltaic Devices (AREA)

Abstract

一种新型光伏旁路集成模块，包括位于环氧本体（1）内的至少2个二极管芯片（2）、若干个金属引线框（3）和若干个连接片（4），若干个金属引线框(3)并排设置，至少2个二极管芯片(2)位于金属引线框(3)表面并通过若干个连接片(4)串连焊接构成二极管旁路电路；金属引线框(3)前端面延伸出一用于与汇流条连接的前引脚(5)，金属引线框(3)后端面延伸出一用于与电缆线连接的后引脚(6)，前引脚(5)上具有通孔(7)；前引脚的中部具有第一折弯部(8)，后引脚(6)的中部具有第二折弯部(9)。该新型光伏集成模块降低了对芯片的应力，降低了损坏芯片的风险，提高可靠性，降低成本。

Description

新型光伏旁路集成模块 技术领域
本实用新型涉及光伏发电装置，具体涉及一种新型光伏旁路集成模块。
背景技术
光伏发电装置通常有若干个光伏组件构成。光伏组件由光伏发电单元(cell)串联组成。为防止发电工作时，部分光伏发电单元呈现高功耗状态(“热斑”)，引发发电单元损坏和发电运行故障，行内采用光伏旁路二极管电路来保护光伏组件，维持光伏发电装置正常运行。
现有光伏旁路集成模块是光伏旁路二极管的集成形式，但存在以下缺点：(1)引脚与电缆装配时应力大，(2)损坏芯片的风险高，(3)成本增加，(4)电缆与模块引脚的连接工效低等技术问题。
发明内容
本实用新型提供一种新型光伏旁路集成模块，此新型光伏旁路集成模块降低了对芯片的应力，降低了损坏芯片的风险，提高可靠性，降低成本。
为达到上述目的，本实用新型采用的技术方案是：一种新型光伏旁路集成模块，包括位于环氧本体内的至少2个二极管芯片、若干个金属引线框和若干个连接片，所述若干个金属引线框并排设置，所述至少2个二极管芯片位于金属引线框表面并通过若干个连接片串连焊接构成二极管旁路电路；所述金属引线框前端面延伸出一用于与汇流条连接的前引脚，所述金属引线框后端面延伸出一用于与电缆线连接的后引脚，所述前引脚的上具有通孔；所述前引脚的中部具有第一折弯部，所述后引脚的中部具有第二折弯部。
上述技术方案中进一步改进技术方案如下：
1.上述方案中，所述通孔为条形通孔。
2.上述方案中，所述后引脚两侧均具有翘起部。
由于上述技术方案运用，本实用新型与现有技术相比具有下列优点：
本实用新型光伏旁路集成模块，节省了绕过模块的电缆、减少了连接点，提高可靠性，降低成本，装配快捷、可靠、可不用焊料；其次，其前引脚的中部具有第一折弯部，所述后引脚的中部具有第二折弯部改变了方向，降低了对芯片的应力，降低了损坏芯片的风险，克服了原来直的引脚，在引脚弯曲包封电缆线产生的应力，可能对芯片的损伤。
附图说明
附图1为本实用新型新型光伏旁路集成模块结构示意图；
附图2为附图1的右视结构示意图；
附图3为附图1的仰视结构示意图。
以上附图中：1、环氧本体；2、二极管芯片；3、金属引线框；4、连接片；5、前引脚；6、后引脚；7、通孔；8、第一折弯部；9、第二折弯部；10、翘起部。
具体实施方式
下面结合附图及实施例对本实用新型作进一步描述：
实施例1：一种新型光伏旁路集成模块，包括位于环氧本体1内的至少2个二极管芯片2、若干个金属引线框3和若干个连接片4，所述若干个金属引线框3并排设置，所述至少2个二极管芯片2位于金属引线框3表面并通过若干个连接片4串连焊接构成二极管旁路电路；所述金属引线框3前端面延伸出一用于与汇流条连接的前引脚5，所述金属引线框3后端面延伸出一用于与电缆线连接的后引脚6，所述前引脚5的上具有通孔7；所述前引脚5的中部具有第一折弯部8，所述后引脚6的中部具有第二折弯部9。
上述后引脚6两侧均具有翘起部10。
实施例2：一种新型光伏旁路集成模块，包括位于环氧本体1内的至少2个二极管芯片2、若干个金属引线框3和若干个连接片4，所述若干个金属引线框3并排设置，所述至少2个二极管芯片2位于金属引线框3表面并通过若干个连接片4串连焊接构成二极管旁路电路；所述金属引线框3前端面延伸出一用于与汇流条连接的前引脚5，所述金属引线框3后端面延伸出一用于与电缆线连接的后引脚6，所述前引脚5的上具有通孔7；所述前引脚5的中部具有第一折弯部8，所述后引脚6的中部具有第二折弯部9。
上述通孔7为条形通孔。
采用上述新型光伏旁路集成模块时，节省了绕过模块的电缆、减少了连接点，提高可靠性，降低成本，装配快捷、可靠、可不用焊料；其次，其前引脚的中部具有第一折弯部，所述后引脚的中部具有第二折弯部改变了方向，降低了对芯片的应力，降低了损坏芯片的风险；克服了原来直的引脚，在引脚弯曲包封电缆线产生的应力，可能对芯片的损伤。
上述实施例只为说明本实用新型的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本实用新型的内容并据以实施，并不能以此限制本实用新型的保护范围。凡根据本实用新型精神实质所作的等效变化或修饰，都应涵盖在本实用新型的保护范围之内。

Claims (3)

  1. 一种新型光伏旁路集成模块，其特征在于：包括位于环氧本体(1)内的至少2个二极管芯片(2)、若干个金属引线框(3)和若干个连接片(4)，所述若干个金属引线框(3)并排设置，所述至少2个二极管芯片(2)位于金属引线框(3)表面并通过若干个连接片(4)串连焊接构成二极管旁路电路；所述金属引线框(3)前端面延伸出一用于与汇流条连接的前引脚(5)，所述金属引线框(3)后端面延伸出一用于与电缆线连接的后引脚(6)，所述前引脚(5)的上具有通孔(7)；所述前引脚(5)的中部具有第一折弯部(8)，所述后引脚(6)的中部具有第二折弯部(9)。
  2. 根据权利要求1所述的光伏旁路集成模块，其特征在于：所述通孔(7)为条形通孔。
  3. 根据权利要求1所述的光伏旁路集成模块，其特征在于：所述后引脚(6)两侧均具有翘起部(10)。
PCT/CN2015/086152 2015-03-20 2015-08-05 新型光伏旁路集成模块 WO2016150064A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2015201582211 2015-03-20
CN201520158221.1U CN204577425U (zh) 2015-03-20 2015-03-20 新型光伏旁路集成模块

Publications (1)

Publication Number Publication Date
WO2016150064A1 true WO2016150064A1 (zh) 2016-09-29

Family

ID=53870025

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/086152 WO2016150064A1 (zh) 2015-03-20 2015-08-05 新型光伏旁路集成模块

Country Status (2)

Country Link
CN (1) CN204577425U (zh)
WO (1) WO2016150064A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109509723A (zh) * 2017-09-15 2019-03-22 无锡华润华晶微电子有限公司 一种封装结构和接线盒
CN114005761A (zh) * 2021-10-29 2022-02-01 重庆平伟伏特集成电路封测应用产业研究院有限公司 光伏旁路模块的封装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102664202A (zh) * 2012-02-24 2012-09-12 上海泰阳绿色能源有限公司 新型光伏接线盒及其封装方法
CN202443985U (zh) * 2011-12-22 2012-09-19 泰科电子(上海)有限公司 光伏组件接线盒及具有其的光伏组件
CN202651125U (zh) * 2012-05-29 2013-01-02 苏州固锝电子股份有限公司 光伏旁路集成模块

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202443985U (zh) * 2011-12-22 2012-09-19 泰科电子(上海)有限公司 光伏组件接线盒及具有其的光伏组件
CN102664202A (zh) * 2012-02-24 2012-09-12 上海泰阳绿色能源有限公司 新型光伏接线盒及其封装方法
CN202651125U (zh) * 2012-05-29 2013-01-02 苏州固锝电子股份有限公司 光伏旁路集成模块

Also Published As

Publication number Publication date
CN204577425U (zh) 2015-08-19

Similar Documents

Publication Publication Date Title
US10340617B2 (en) Power modules and pin thereof
WO2016150064A1 (zh) 新型光伏旁路集成模块
CN103117355A (zh) 贴片式二极管器件结构
WO2011130996A1 (zh) 具有多接线盒的太阳电池组件
CN204257664U (zh) 二极管
CN202721119U (zh) 一种改进型的三极管引线框架
CN103383932A (zh) 用于提高芯片电性能的封装结构
CN109449360A (zh) 软包装锂离子蓄电池串联连接的电池同向排列组装方法
US7481669B1 (en) Plug-in wiring structure of optoelectronic device
CN203367267U (zh) 自适应焊料用量的整流器结构
CN203118997U (zh) 防偏位的二极管器件
CN203367266U (zh) 用于缓冲芯片表面焊料用量的封装结构
CN103532490B (zh) 光伏电源管理模块
CN204315552U (zh) 晶片封装结构
CN104900620A (zh) 一种塑封式ipm的pcb板固定结构及其固定方法
CN203118934U (zh) 贴片式二极管器件
CN209027541U (zh) 一种采用直插式装配的霍尔传感器
WO2018210284A1 (zh) 一种光伏装置、金属导线网络层状结构及其制造方法
CN204088438U (zh) 一种联接片
CN203645563U (zh) 一种汽车整流桥
CN203386741U (zh) 一种引脚框架
CN204577437U (zh) 光伏电池用旁路二极管模块
CN207351279U (zh) 一种散热器扣片结构
CN202651125U (zh) 光伏旁路集成模块
CN208353712U (zh) 一种显示模组的fpc焊接结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15885996

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15885996

Country of ref document: EP

Kind code of ref document: A1