WO2016146407A1

WO2016146407A1 - Light module

Info

Publication number: WO2016146407A1
Application number: PCT/EP2016/054638
Authority: WO
Inventors: Alexander Kerpe; Dennis MÖLLER
Original assignee: Hella Kgaa Hueck & Co.
Priority date: 2015-03-13
Filing date: 2016-03-04
Publication date: 2016-09-22
Also published as: DE102015103747A1

Abstract

The invention relates to a light module (20) for a lighting device, comprising an at least partially encased circuit carrier (30), which has at least one light-emitting diode (31) fastened to the circuit carrier (30) as a light source and at least one lens (53) associated with the at least one light-emitting diode (31) for forming a light distribution, and comprising an electrical connection module (40) provided on the circuit carrier (30), wherein at least one supply line is provided on the circuit carrier (30) in order to connect the at least one light-emitting diode (31) to the electrical connection module (40), wherein a silicone overmolding (50) is formed as a casing for the circuit carrier (30), wherein a peripheral sealing bead (55) is provided as part of the silicone overmolding (50) and wherein the sealing bead (55) protrudes from a plane of extent (21) defined by the circuit carrier (30).

Description

light module

description

The invention relates to a light module for a lighting device comprising an at least partially sheathed circuit carrier which has at least one light-emitting diode fixed to the circuit carrier as the light source and at least one lens assigned to at least one light-emitting diode for shaping a light distribution, and comprising an electrical connection module provided on the circuit carrier. wherein at least one supply line is provided on the circuit carrier for connecting the at least one light-emitting diode to the electrical connection module.

From WO 2007/064701 A1, a light module with a circuit board as circuit carrier and a plurality of spaced on the board defined light-emitting diodes as light sources is known. The board has a cladding of a thermally conductive material with a melting temperature of 100 ° C and a thermal conductivity of 1 W / m ² K or more. The sheathing is recessed locally or in the region of the light-emitting diodes and a connection contact. A complete encapsulation in terms of protection against contact or protection against entry of foreign substances and dirt is not realized by the sheath.

From EP 1 657 758 A1, a light module with a circuit carrier and light-emitting diodes fixed on it is known. The LEDs are assigned in a dipping process made of silicone individual lenses. A complete or partial sheathing of the circuit substrate, in particular of silicone, is not disclosed.

Comparable light modules are also known from DE 10 2011 075 161 A1 and DE 298 10 708 U1. The object of the present invention is to further develop a light module with a sheathed circuit carrier in the direction of an integrated functional unit, which in particular offers advantages with regard to the mounting capability and the integration thereof into a lighting device.

To achieve the object, the invention in conjunction with the preamble of claim 1, characterized in that as coating for the circuit substrate a silicone extrusion is formed and that as part of the Silikonumsprit- tion a circumferential sealing bead is provided, wherein the sealing bead from a through the circuit substrate protrudes defined extent level.

Preferably, the light module provides two or more light-emitting diodes and a corresponding number of lenses.

The particular advantage of the invention is that the silicone coating protects the light module like a capsule from external influences, for example dirt and contact protection, and at the same time defines the interface with the adjacent functional components of the lighting device with the sealing bead. In particular, the sealing bead of the system of the light module is used for at least partially transparent cover, through which light of the light emitting diodes is radiated. The silicone encapsulation of the light module protects the circuit carrier with the optoelectrical function components fixed thereto and an electrical connection module provided for the energy supply of the light-emitting diodes. It also serves as a mechanical interface for the spatial and functional integration of the light module in the lighting device. The silicone coating acts like a seal. It is, for example, realized in such a way that an inner space accommodating the light-emitting diodes is encapsulated between the light module and an add-on component attached to the light module. Separate components, in particular a separate, elastic seal, can be dispensed with, with the consequence that the manufacturing outlay decreases, that the number of parts is reduced and that assembly is simplified. The circuit carrier of the light module is preferably made of a thermally conductive material. For example, metal core printed circuit boards are used as circuit carriers. On the circuit carrier, the LEDs are preferably soldered. In addition to the light-emitting diodes, temperature or light sensors or functional components serving for overvoltage protection can be provided on the circuit carrier as further functional components.

A contacting of the circuit substrate with the light-emitting diodes provided thereon and preferably the other circuit components takes place in particular via the electrical connection module, which has for example a fixed to the circuit board connector and a plurality of conductors, wherein the conductors can be connected to a cable and contacted with the connector are. For example, conductors of the cable can be connected directly to the circuit carrier, in particular by means of soldering. Likewise, a sealed socket can be provided, in which a driver electronics can be used with a corresponding mating connector. On a cable can then be dispensed with.

The circuit carrier is encapsulated in the region of the outside with silicone. In particular, the silicone encapsulation is provided in the region of a front side of the circuit carrier which has the light-emitting diodes in the region of an opposite rear side and on the edge surfaces connecting the front side and the rear side. To produce the silicone encapsulation, so-called liquid silicone rubber (LSR) is preferably used. Processing takes place as a liquid 2-component material in injection molding machines. The liquid 2-component mass is cured in a mold of the injection molding machine at about 150 ° C. The duration of the curing process is typically between a few seconds and a few minutes, depending in particular on the amount of material and the material thickness. The material preferably used for producing the silicone encapsulation has a transmission of more than 90% in the visible spectral range, haze value (less than 4% in the visible spectral range) and high UV resistance. The silicone offers a high temperature resistance even at temperatures of, for example, 150 ° C and a high electrical breakdown Festig speed of more than 10 kV / mm. The high electrical breakdown strength provides in particular for a good insulating property of the silicone encapsulation.

The thermal conductivity of the silicone encapsulation is typically less than 1.5 W / m K. According to a preferred embodiment of the invention, the thermal conductivity is less than 0.5 W / m K. However, in order to ensure a sufficient dissipation of the heat, a thickness of the silicone encapsulation in particular in the area of the rear side smaller than 1, 5 mm and preferably smaller than 1 mm. The small thickness also leads to a low material usage and thus to low cost of the light module.

As a light-emitting diode, for example, a commercial high-power LED can be provided with primary optics. Preferably, however, light-emitting diodes without primary optics are used. The power range of the LEDs used is typically 1 W to 10 W or more. By dispensing with the primary optics, the light-emitting diodes are particularly cost-effective. At the same time results in a high optical quality or efficiency, since the silicone lenses act as a primary optics during encapsulation of the LED and the optical properties of the built-in without primary optics LED match those of a light emitting diode with primary optics.

According to a development of the invention so-called chip size LEDs can be used, which consist only of the semiconductor material, electrical contact surfaces and a thin phosphor layer and dispense with a primary optics as well as on a ceramic support. This further reduces the cost of LEDs. A protection of the chip size LEDs against environmental influences is then ensured by the silicone encapsulation to a sufficient extent. In addition, results in an advantageous low height for the light module, so that in particular the integration into a lighting device is simplified.

A thickness of the silicone coating is in the region of the front side where no lenses are formed, preferably less than 1 mm, and more preferably less than or equal to a height of the light-emitting diodes. According to a preferred embodiment of the invention, the sealing bead is formed in cross-section V-shaped, wherein a circuit carrier facing the connecting leg and an end formed on the connecting leg free legs are provided. In particular, a recess is formed between the connecting leg and the free leg of the sealing bead, which tapers in relation to the cross section in the direction of a vertex defined by a connection point of the leg. Advantageously, the elasticity and resilience are promoted by the V-shape of the sealing bead. In the same way, the flexibility improves by the provision of the example V-shaped or wedge-shaped recess between the legs. The elasticity promotes the mounting capability of the light module. On the other hand, the sealing effect and thus the protection of the light module from environmental influences improve.

According to a development of the invention, at least one and preferably two or more sealing lips are provided on the sealing bead. For example, the sealing lips are provided in the region of the free leg on a side facing away from the connecting leg. The sealing lips, which, like the sealing bead, are made entirely of the silicone material of the encapsulation, improve the sealing effect and thus the connection of the light module to the periphery. The molding can also serve as a mechanical interface and thus define a relative position between the light module and the add-on component of the lighting device. For example, the sealing lip engage in a defined mounting position in a correspondingly shaped recess.

For example, the sealing bead may be U-shaped in cross section. A web of the cover of the lighting device can then be used for sealing in the preferably circumferentially formed U-shaped sealing bead.

According to a development of the invention, the peripheral sealing bead surrounds all light-emitting diodes and lenses of the light module and defines a central region thereof. Adjacent to the central area are two on opposite sides Flank areas provided. At the flank areas of the connector and / or at least one hole for positioning and fixing the light module are set. Advantageously, by the spatial separation of the optically active components (lenses, light-emitting diodes) of the positioning means (holes of the circuit substrate) and the connector, a separation of the optical function of the mechanical and electrical connection kinematic be realized. In particular, separate from the optical function, an electrical contacting of the light module, for example via a separate connection board done, which is attached to the connector and carries a mating connector. For example, two or more identical light modules can be electrically contacted via the connection board.

According to a development of the invention, the connector may be surrounded by a sealing ring made of the material of the silicone encapsulation. In particular, the sealing ring is realized as an integral part of the silicone encapsulation. By providing the sealing ring for the connector results in a mechanical protection of the connector. At the same time can be realized in a simple, integrated manner, the seal of the connector and an entry of protection or moisture to be prevented.

From the other dependent claims and the following description further advantages, features and details of the invention can be found. There mentioned features may be essential to the invention individually or in any combination. The drawings are merely illustrative of the clarification of the invention and are not of a restrictive nature.

Reference to the accompanying drawings, the invention is explained in more detail below. Showing:

1 shows a perspective view of a first embodiment of a light module according to the invention and a cover assigned to the light module from a front side, 2 shows the light module and the cover according to FIG. 1 from a perspective rear view, FIG.

3 is a schematic diagram of a circuit carrier and a silicone extrusion of the light module according to FIG. 1, FIG.

4 shows a cross section through the light module and the cover of FIG. 1,

5 shows a cross section through the light module and the cover of FIG. 4 in a mounting position,

6 shows an enlarged detail of a connection module of the light module before

insert molding,

FIG. 7 shows the connection module according to FIG. 6 with a connection cover defined by the silicone encapsulation, FIG.

8 is a plan view of the cover,

9 is a section D-D through the cover of FIG. 8,

10 shows a detailed view of the silicone encapsulation in the region of a strain relief for the connection module,.

11 shows a detailed view of the correspondingly configured sealing geometry on the silicone encapsulation and the cover before assembly,

12 is a detail view of the seal of FIG. 11 after assembly,

13 shows a plan view of a lens formed as part of the silicone encapsulation, 14 shows a section BB through the lens of the silicone encapsulation according to FIG. 13, FIG.

15 shows a perspective view of the lighting device with the light module, the cover and a housing accommodating the light module,

16 shows a cross section through the lighting device according to FIG. 15, FIG.

17 is a perspective view of a second embodiment of the light module according to the invention,

18 is an enlarged view of a portion of the light module of FIG.

17

19 is a plan view of a front side of the light module of FIG. 17,

20 is a longitudinal section through the light module of FIG. 17 after the section A-A,

21 shows a first cross section through the light module according to FIG. 17 according to FIG

Cut B-B and

FIG. 22 shows a second cross section through the light module according to FIG. 17 according to FIG

Section C-C.

A lighting device according to FIGS. 1 to 16 comprises a cover 10, a light module 20 which can be applied to the cover 10 and a housing 60 which is formed from metal and at the same time serves as a heat sink.

As another, not shown, component of the lighting device, according to an alternative exemplary embodiment of the invention, a separate heat sink which can be applied to the light module 20 may be provided, the housing 60 encompassing the heat sink or the light module 20. In particular, can be provided be that the housing 60 receives and positions the heat sink and that the heat sink is fixed to the light module 20 via the housing 60.

The cover 10 has a rectangular basic shape with a peripheral edge. The peripheral edge is wider in the opposite longitudinal sides than in the region of the longitudinal sides connecting narrow sides. In the region of the longitudinal sides, two fastening holes 11 are provided at a distance from one another and opposite each other, for fixing the cover to the housing 60 of the lighting device or to an external fastening body, for example a cladding or a ceiling. The edge encloses a trough-shaped recess of the cover 10, which has a substantially planar and optically-free transparent passage section 15. The transparent passage section 15 is delimited by a circumferential groove 12 on a flat side facing the light module 20. In addition, an opening is formed as a cable feedthrough 14 on the circumferential groove 12. Distributed in the region of the passage section 15, six pins 13 facing the light module 20 are provided on the cover 10. For example, the cover is made of glass or plastic, preferably PMMA.

The light module 20 is designed flat in an extension plane 21. The extension plane 21 is defined by a circuit carrier 30, for example a circuit board. On the circuit substrate 30, a plurality of light-emitting diodes 31 are distributed in a matrix-like manner. In the mounted state of the lighting device, the light-emitting diodes 31 face the passage section 15 of the cover 10 in such a way that light from the light-emitting diodes 31 is emitted through the passage section 15. In addition, a total of six holes 32 are provided distributed on the circuit board 30, which serve to receive the pins 10 provided on the cover 10 and are arranged correspondingly to the pins 13. In cooperation, the holes 32 and the pins 13 define a relative position of the light module 20 to the cover 10. The holes 32 also serve to receive and position the circuit carrier 30 in the injection molding machine during production of the silicone coating 50. The circuit carrier 30 also carries a connector 41 of an electrical connection module 40. Electrical conductors 43 connected to the connector 41, which are connected to a cable 42, serve for the electrical contacting of the light module. On the circuit substrate 30 also not shown leads for electrically conductive connection of the LEDs 31 are provided with the connector 41. In addition, a fixed to the circuit substrate 30 NTC 33 is used to limit the current or as a temperature sensor.

The circuit carrier 30 with the functional components fixed thereto surrounds a silicone encapsulation 50. The silicone encapsulation 50 is integrally formed. It extends over one of the cover 10 facing optically active front side 35 of the circuit substrate 30 as well as a trained for conditioning of the housing 60 and the heat sink back 36 and the front 35 with the back 36 connecting edge surfaces 37 of the circuit support 30. The silicone extrusion 50 realized a terminal cover 51 for the electrical connection module 40 with a cable 42 surrounded strain relief 52. The strain relief 52 is shaped so that it can be used in the assembled state in the cable gland 14 of the cover 10 and fixed there form-fitting. In addition, the silicone encapsulation 50 defines the lenses 53 associated with the light emitting diodes 31. In this case, in each case one lens 53 is produced for each light emitting diode 31 as an integral component of the encapsulation 50 made of the silicone material. In particular, the light-emitting diodes 31 can dispense with primary optics. The lenses 53 serve insofar as sole optics. Optionally, optical elements, for example a lens structure, can be realized in the region of the passage section 15 of the cover 10. Optionally, the lenses 53 may be associated with reflectors. A reflector insert may, for example, provide a plurality of reflectors.

A recess in the silicone encapsulation 50 results solely in the area of the holes 32 provided on the circuit carrier 30. The silicone encapsulation 50 thus provides free spaces 54 which permit the insertion of the pins 13 realized as part of the cover 10 into the holes 32 of the circuit carrier 30. Otherwise covered the Silikonumspritzung 50 the circuit substrate 30 with the attached thereto

Light emitting diodes 31, the leads for the LEDs 31 and the electrical connection module 40 completely. The silicone encapsulation 50 thus defines a contact protection and an encapsulation and also protects against mechanical influences or damage.

By providing the recess in the silicone encapsulation 50 and the holes 32 provided on the circuit carrier 30, the cover 10 can be supported on the light module 20 with the pins 13 or other support structures provided thereon, distributedly arranged. It can be provided in particular that the clamping or supporting forces are transmitted via the pins 3, so that the seal in the region of the sealing bead 55 and the circumferential groove 12 is substantially free of force. The pins 13 also ensure that the light module 20 or the circuit carrier 30 of the light module 20 is protected against undesired or impermissible deflection. In addition, an attachment by means of a screw through the holes 32 can be realized.

A particularly advantageous connection of the silicone encapsulation 50 to the circuit carrier 30 results from the provision of silicon-injected connection openings 34 on the circuit carrier 30. The connection openings 34 are provided in particular adjacent to the light-emitting diodes 31. By filling the connection opening 34 with the silicone material, a web 58 forms as part of the silicone encapsulation 50 which connects a front 56 of the silicone encapsulation 50 assigned to the front side 35 of the circuit carrier 30 to a rear side 57 of the silicone encapsulation 50 assigned to the rear side 36 of the circuit carrier 30 , On the one hand, this results in a good, flat contact of the silicone encapsulation 50 on the circuit carrier 30. On the other hand, the lenses 53 are fixed relative to the position of the light-emitting diodes 31.

As part of the silicone encapsulation 50, a sealing bead 55, which is assigned to the circuit carrier 30 at the edge, is provided, which is designed projecting in the direction of the cover 10. The sealing bead 55 is adapted in terms of their geometry to the Geometry of the groove 12. The sealing bead 55 is realized in particular in cross-section V-shaped with one of the front of the encapsulation 50 edge associated connecting leg 553 and an integrally formed on the connecting leg 553 free leg 554. In a vertex 555 of the connecting leg 553 and the free leg 554 connected. The sealing bead 55 is formed on the one hand due to the material properties of the silicone encapsulation 50 and on the other hand by a formed between the legs 553, 554, in cross-section v-shaped clearance elastically deformable. The sealing bead 55 has on the free leg 554 on a side facing away from the connecting leg 553 spaced apart from each other two sealing lips 551, 552 as protrusions.

According to an alternative, not shown embodiment of the invention, the sealing bead 55 may be formed for example U-shaped. For example, a web provided on the cover 10 can be inserted into the recess of the sealing bead 55 for realizing the seal. In this respect, the sealing principle is constructively realized vice versa.

Identical components and component functions are identified by the same reference numerals.

When attaching the light module 20 to the cover 10, the sealing bead 55 is inserted into the circumferential groove 12 of the cover 10. In this case, the apex 555 is provided at a distance from a groove base 16 of the groove 12. The legs 553, 554 rest on opposite groove flanks 17, 18 of the groove 12. The groove flanks 17, 18 are mutually adjusted so that the groove 12 tapers in the direction of the groove base 16 and the sealing lips 551, 552 are applied to an outer groove flank 18 of the groove 12 when receiving the sealing bead 55. This results in that a defined sealing area between the groove flanks 17, 18 and the legs 553, 554 of the sealing bead 55. In addition, the supported during installation of the lighting device via the mounting holes 11 forces are distributed evenly over a large area, so that an inadmissibly high local load and Damage to the sealing bead 55 or an impairment of the sealing effect is prevented. In the assembled state, the strain relief 52 designed as part of the silicone encapsulation 50 is additionally inserted into the cable bushing 14 of the cover 10.

The cover 10 is connected to the housing 60 via a plurality of screws 70 guided through the mounting holes 11. In this case, the assignment of the cover 10 to the housing 60 takes place in such a way that the light module 20 with the rear side 57 of the silicone encapsulation 50 is pressed against an inner side of the housing 60. The elastic silicone encapsulation 50, which preferably has a thickness 59 of not more than 1 mm in the region of the rear side 57, is compressed onto the housing 60 in order to realize a good heat transfer. The elasticity of the silicone encapsulation 50 at the same time favors the planar contact with the housing 60.

For example, while the metal case 60 has a lifetime of, for example, 50 years, a lifetime of the light module 20 is 10 years or 20 years. It must insofar the light module 20 be replaced more frequently during the life of the housing 60. For replacement, the light module 20 is removed together with the cover 10 from the housing 60. The dismantling of the light module 20 can then be done without tools, since the cover 10 and the light module 20 are connected to each other in particular via the sealing bead 55 inserted into the groove 12. The recycling of the light module 20 is thereby simplified.

An alternative embodiment of a light module 20 according to the invention according to FIGS. 17 to 22 provides the circuit carrier 30 with the silicone encapsulation 50 and the connector 41 fixed to the circuit carrier 30. As before, leads for connecting the connector 41 to the LEDs 31 are provided on the circuit board 30, but not shown. Furthermore, the light-emitting diodes 31 are associated with lenses 53 produced as part of the silicone encapsulation 50, as described above. In the area of the lenses 53, ribs 58 made of the material of the silicone encapsulation 50 are realized, which are guided in the region of the connection openings 34 through the circuit carrier 30 and connect the front side 56 of the silicone encapsulation 50 with its rear side 57. As part of the silicone extrusion 50, the circumferential sealing bead 55 is realized as usual. It protrudes from the circuit carrier 30 to the optically effective, the light-emitting diodes 31 and the lenses 53 having front side 35 and surrounds the matrix-like arranged light emitting diodes 31 and the lenses 53 like a frame. The encircling sealing bead 55 defines a central region 84 of the light module 20 on both sides of the central region 84, two flank regions 85 are provided. On the flank areas 85, the plug connector 41 and the holes 32 for electrically contacting and positioning the light module 20 are realized on the one hand. In this case, the connector 41 provides a sealing ring 81 made of the material of the silicone encapsulation 50 for protection against external influences and for sealing. On the other hand, a likewise annular positioning web 80 is provided in the region of the holes 32 designed for positioning the light module 20. The positioning web 80, which encloses the holes 32, and the connector 41 associated with the sealing ring 81 protrude like the circumferential sealing bead 55 from the front side 35 of the circuit substrate 30 from.

The circumferential sealing bead 55 has a substantially V-shaped and tapered with increasing distance from the circuit substrate 30 cross-sectional geometry. The circumferential sealing bead 55 is solid. It lies here in the assembled state on a lens 82 of a lamp surface. For example, it can be provided that adjacent to the cover plate 82, a connection plate 83 is provided for contacting the connector 41 of the light module 20. The connection board 83 is preferably also designed jacketed and is applied to the sealing ring 81, which surrounds the connector 41. It is likewise provided that the circuit carrier 30 has connection openings 34 where the sealing bead 55 is formed. Via the webs 58 provided at the connecting openings 34, the front side 56 and the rear side 57 of the casing 50 are connected directly underneath the circumferential sealing bead 55. The sealing bead 55 is set or positioned over the silicone webs 58. LIST OF REFERENCE NUMBERS

10 cover

11 mounting hole

12 groove

13 pen

14 cable feedthrough

15 passage section

16 groove base

17 groove flank

18 groove flank

20 light module

21 extension level

30 circuit carrier

31 LED

32 holes

33 NTC

34 connection opening

35 front side

36 back side

37 edge surface

40 connection module

41 connectors

42 cables

43 conductors

50 silicone injection

51 Terminal cover

52 strain relief

53 lens

54 free space

55 sealing bead

56 front side back

web

thickness

casing

screw

Positioning bar Sealing ring

Cover plate Connection board Central area

Flank area sealing lip

sealing lip

Connecting leg free leg crest

Claims

Light module claims

1. Light module (20) for a lighting device comprising an at least partially encased circuit carrier (30), which at least one on the circuit substrate (30) fixed light emitting diode (31) as a light source and at least one of the at least one light emitting diode (31) associated lens (53) for forming a light distribution, and comprising an electrical connection module (40) provided on the circuit carrier (30), wherein at least one supply line is provided on the circuit carrier (30) for connecting the at least one light-emitting diode (31) to the electrical connection module (40) , characterized in that as Ummante- ment for the circuit carrier (30) is a Silikonumspritzung (50) is formed and that as part of the Silikonumspritzung (50) a circumferential sealing bead (55) is provided, wherein the sealing bead (55) from a through the Circuit carrier (30) protrudes defined plane of extent (21).

2. Light module according to claim 1, characterized in that the sealing bead

(55) is V-shaped in cross section, wherein the circuit carrier (30) facing the connecting leg (553) and an end of the connecting leg (553) integrally formed free leg (554) are provided.

3. light module (20) according to claim 1 or 2, characterized in that the

Has sealing bead (55) at least one formed as a molding sealing lip (551, 552).

4. light module (20) according to one of claims 1 to 3, characterized in that on the free leg (554) of the sealing bead (55) the at least one sealing lip (551, 552) is provided.

5. light module (20) according to one of claims 1 to 4, characterized the sealing lip (551, 552) is provided on the free leg (554) on a side facing away from the connecting leg (553).

6. Light module (20) according to any one of claims 1 to 5, characterized in that the sealing bead (55) protrudes in the direction of a through the at least one on the circuit carrier (30) held light emitting diode (31) defined front side.

7. light module (20) according to any one of claims 1 to 6, characterized in that the sealing bead 55 is formed in cross-section U-shaped.

8. light module (20) according to one of claims 1 to 7, characterized in that the electrical connection module (40) on the circuit carrier (30) fixed connector (41) and a plurality of conductors (43) exhibiting cable (42) provides, wherein the conductors (43) are contacted with the connector (41).

9. light module (20) according to one of claims 1 to 8, characterized in that between the legs (553, 554) of the sealing bead (55) has a cross-section in the direction of a through a connection point of the legs (553, 554) defined vertex (555) tapered recess is formed.

10. Light module (20) according to one of claims 1 to 9, characterized in that the at least one light emitting diode (31) associated with at least one lens (53) are formed as an integral part of the silicone extrusion (50).

11. Light module (20) according to any one of claims 1 to 10, characterized in that the silicone coating (50) the at least one light emitting diode (31) itself and / or on the circuit carrier (30) provided at least one supply line for the at least one light emitting diode (31) at least partially covered.

12. Light module (20) according to any one of claims 1 to 11, characterized in that the Silikonumspritzung (50) at least parts of the electrical connection module (40), preferably to the circuit carrier (30) fixed connector (41) and / or a Connector (41) facing part of the cable (42) and / or in the cable (42) combined electrical conductor (43), covered.

13. Light module (20) according to any one of claims 1 to 12, characterized in that the silicone encapsulation (50) is designed to be elastic.

14. Light module (20) according to any one of claims 9 to 13, characterized in that the connector (41) outside the circumferential sealing bead (55) is provided and by a separate sealing ring (81) is included, wherein the sealing ring (81) Part of the Silikonumspritzung (55) is made and protrudes from the front (56).

15. Light module (20) according to any one of claims 9 to 14, characterized in that an optically effective central region (84) with the lenses (53) and with the light-emitting diodes (31) is provided and of the peripheral sealing bead (55) is included and in that two flank regions (85) are provided adjacent to the central region (84), which have the plug connector (41) and positioning means (80) for fixing the light module (20) to a luminaire.