WO2016144107A1 - Dispositif d'analyse de contaminant de substrat et procédé d'analyse de contaminant de substrat - Google Patents

Dispositif d'analyse de contaminant de substrat et procédé d'analyse de contaminant de substrat Download PDF

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Publication number
WO2016144107A1
WO2016144107A1 PCT/KR2016/002376 KR2016002376W WO2016144107A1 WO 2016144107 A1 WO2016144107 A1 WO 2016144107A1 KR 2016002376 W KR2016002376 W KR 2016002376W WO 2016144107 A1 WO2016144107 A1 WO 2016144107A1
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WIPO (PCT)
Prior art keywords
solution
sample
substrate
sample solution
analyzer
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PCT/KR2016/002376
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English (en)
Korean (ko)
Inventor
전필권
구대환
박준호
박상현
성용익
Original Assignee
엔비스아나(주)
전필권
구대환
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Priority claimed from KR1020150034644A external-priority patent/KR101548632B1/ko
Priority claimed from KR1020150034647A external-priority patent/KR101581303B1/ko
Priority claimed from KR1020150085305A external-priority patent/KR102357431B1/ko
Application filed by 엔비스아나(주), 전필권, 구대환 filed Critical 엔비스아나(주)
Priority to CN202210114028.2A priority Critical patent/CN114464546A/zh
Priority to CN201680015283.4A priority patent/CN107567652A/zh
Publication of WO2016144107A1 publication Critical patent/WO2016144107A1/fr

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking

Definitions

  • the present invention relates to a substrate contaminant analysis apparatus and substrate contaminant analysis method capable of analyzing contaminants such as metal atoms by in-line.
  • the scanned sample must be put in the sampling cup and taken by the operator to the analyzer, so that the operator needs to check and work at any time. It is an obstacle to rapid analysis.
  • An object of the present invention is to provide a substrate contaminant analysis apparatus and analysis method that solves at least one or more problems of the prior art
  • An object of the present invention is to provide a substrate contaminant analysis apparatus and analysis method that can solve the contamination and safety problems in the moving process without the need for manual labor of the operator and can be analyzed in real time or fast.
  • an object of the present invention is to provide a substrate contaminant analysis apparatus and an analysis method that solves the problem of chemical liquid inconvenience and contaminant control problem, the calibration problem of the analyzer and the sensitivity deterioration during use.
  • a substrate contaminant analysis apparatus is a substrate contaminant analysis apparatus for transferring a sample solution scanned by using a scan nozzle in the analysis target substrate through the flow path from the scan nozzle to the analyzer,
  • a sample tube having a space for loading the sample solution; And a switching valve coupled to the sample tube and having a load position in which the sample solution is loaded into the sample tube and an injection position injecting the loaded sample solution into the analyzer.
  • the sensor is installed in the sample tube for detecting the gas section and the sample solution; characterized in that it further comprises.
  • the detection sensor is characterized in that the liquid detection sensor.
  • the liquid detection sensor is characterized in that the light sensor or proximity sensor.
  • the sample solution arrives at the sample tube from the scan nozzle when the sensor senses the gas and liquid in the load position.
  • the sample solution is determined to move toward the analyzer when the detection sensor detects the liquid and gas in the injection position.
  • a substrate contaminant analysis apparatus is a substrate contaminant analysis apparatus for transferring a sample solution scanned by using a scan nozzle in the analysis target substrate through the flow path from the scan nozzle to the analyzer,
  • a sample tube having a space for loading the sample solution;
  • a switching valve coupled to the sample tube and having a load position at which the sample solution is loaded into the sample tube and an injection position for injecting the loaded sample solution into the analyzer; and including the sample solution at the injection position. Parallel to the injection into the analyzer, at least the flow path from the scan nozzle to the switching valve is cleaned.
  • the first metering pump used for loading the sample solution into the sample tube and the first pump used for the cleaning, wherein the first metering pump and the first pump Is connected to the same port of the switching valve, wherein the first pump has a larger capacity than the first metering pump.
  • a second metering pump which pushes the loaded sample solution toward the analyzer with ultrapure water when the injection position is used.
  • the sample tube is characterized in that the sample loop.
  • the switching valve is characterized in that the six-port injection valve.
  • the substrate contaminant analysis method is a substrate contaminant analysis method performed in a substrate contaminant analysis apparatus for transferring a sample solution scanned using a scan nozzle from an analysis target substrate through the flow path from the scan nozzle to an analyzer.
  • the arrival or movement of the sample solution is detected by using a detection sensor installed in the sample tube to detect the gas section and the sample solution by distinguishing.
  • the detection sensor is characterized in that the liquid detection sensor.
  • the liquid detection sensor is characterized in that the light sensor or proximity sensor.
  • the substrate contaminant analysis method it is determined that the sample solution arrives at the sample tube from the scan nozzle when the detection sensor detects gas and liquid in the first step.
  • the detection sensor does not detect a liquid in the first step, it is determined that there is a loss of the sample solution.
  • the substrate contaminant analysis method it is determined that the sample solution moves toward the analyzer when the detection sensor detects the liquid and gas in the second step.
  • the substrate contaminant analysis method is a substrate contaminant analysis method performed in a substrate contaminant analysis apparatus for transferring a sample solution scanned using a scan nozzle from an analysis target substrate through the flow path from the scan nozzle to an analyzer.
  • the cleaning is performed by putting the scan nozzle in a cleaning solution container and then sucking by using a pump.
  • air or gas is filled in a flow path including at least a section from the scan nozzle to the front of the sample tube before the first step after the cleaning is performed again.
  • a second metering pump for pushing the loaded sample solution with ultrapure water toward the analyzer in the second step is used.
  • the sample tube is characterized in that the sample loop.
  • a switching valve coupled to the sample tube and having a load position in which the sample solution is loaded into the sample tube and an injection position injecting the loaded sample solution into the analyzer is used. It is characterized by.
  • the switching valve is characterized in that the six-port injection valve.
  • the substrate contaminant analysis apparatus is a substrate contaminant analysis apparatus for transferring a sample solution sucked using a nozzle from an analysis target substrate through the flow path from the nozzle to the analyzer,
  • a standard solution introduction part coupled to the middle of the flow path through which the sample solution is transferred to introduce a standard solution for calibration into the flow path, wherein the standard solution introduction part is loaded with the standard solution.
  • Sample tube with space to be; And a switching valve coupled to the sample tube and having at least a load position in which the standard solution is loaded into the sample tube and an injection position for injecting the loaded standard solution into the T-tube.
  • the rod position is characterized in that the standard solution flows out at a predetermined time or before calibration.
  • the loaded standard solution is pushed with ultrapure water using a metering pump at the injection position.
  • At least the sample solution is filled with the ultrapure water in at least the flow path between the T-tube and the switching valve when the sample solution is passed through the T-tube.
  • the sample tube is characterized in that the sample loop.
  • the switching valve is characterized in that the six-port injection valve.
  • the substrate contaminant analysis apparatus is a substrate contaminant analysis apparatus for transferring a sample solution sucked using a nozzle from an analysis target substrate through the flow path from the nozzle to the analyzer,
  • a sample solution inlet for loading the sample solution and then injecting the sample solution into the analyzer And a standard solution introduction unit coupled to the flow path between the sample solution introduction unit and the analyzer using a T-tube to introduce a standard solution for calibration, wherein the sample solution introduction unit injects the sample solution into the analyzer.
  • It includes an ultrapure water carrier portion for pushing the sample solution with ultrapure water, characterized in that the ultrapure water carrier portion is commonly used when diluting the standard solution for calibration.
  • a substrate contaminant analysis apparatus is a substrate contaminant analysis apparatus for transferring a sample solution sucked by using a nozzle from an analysis target substrate through a flow path from the nozzle to an analyzer, wherein the sample solution is loaded and then A sample solution inlet for injecting a sample solution into the analyzer; And a standard solution introduction unit coupled to the flow path between the sample solution introduction unit and the analyzer by using a T-tube to introduce a standard solution for calibration, and when performing calibration on the analyzer as the standard solution.
  • the sample solution introduction unit may introduce a scan solution instead of the sample solution to dilute the standard solution.
  • the standard solution introduction unit comprises: a sample tube having a space to be loaded with the standard solution; A first port and a fourth port coupled to the sample tube, a third port coupled to a flow path through which the standard solution is supplied, a second port coupled to a suction pump for sucking the standard solution, and a second port connected to the T-tube And a switching valve including a fifth port and a sixth port supplied with ultrapure water for pushing the standard solution.
  • the substrate contaminant analysis apparatus when the standard solution is loaded, the first port and the second port, the third port and the fourth port, and the fifth port and the sixth port are connected.
  • the sixth port and the first port, the second port and the third port, and the fourth port and the fifth port are connected.
  • a substrate contaminant analysis method is a substrate contaminant analysis method performed in a substrate contaminant analysis apparatus for transferring a sample solution scanned using a scan solution from an analysis target substrate to an analyzer for analysis.
  • the calibrating the analyzer may include a first step of transferring the standard solution to the analyzer while real time diluting the standard solution with the ultrapure water for at least one standard solution; And a second step of transferring the scanning solution used for the scan to the analyzer for analysis.
  • the analysis result of the scanning solution in the second step is lower than the trace concentration setting value, the analysis result of the first step is used to analyze the sample solution as it is.
  • the analysis result of the first step is corrected by the analysis result of the second step, and is used to analyze the sample solution.
  • the first step is performed at a plurality of different dilution concentrations and used to obtain a calibration curve.
  • the calibration curve is corrected based on the analysis result of the second step.
  • the concentration of the scan solution according to the analysis result of the second step may be subtracted from the concentration of the sample solution.
  • the ultrapure water and the standard solution are respectively loaded into different sample tubes and injected simultaneously by two different metering pumps for mixing in a T tube for real time dilution in the first step. It is characterized by.
  • the dilution ratio of the ultrapure water and the standard solution is determined by the discharge flow rates of the two different metering pumps.
  • a substrate contaminant analysis method is a substrate contaminant analysis method performed in a substrate contaminant analysis apparatus for transferring a sample solution scanned using a scan solution from an analysis target substrate to an analyzer for analysis.
  • the analyzer Analyze with the analyzer at a plurality of different dilution concentrations for a standard solution to obtain a calibration curve and analyze the series of sample solutions using the obtained calibration curve, the concentration measured by measuring the standard solution with the analyzer. It is characterized in that the sensitivity check step of checking the sensitivity by determining whether the value is within the set range automatically executed at a set period or a set time.
  • the process of acquiring the calibration curve may be performed again.
  • a substrate contaminant analysis method is a substrate contaminant analysis method performed in a substrate contaminant analysis apparatus for transferring a sample solution scanned using a scan nozzle from an analysis target substrate to an analyzer.
  • the substrate contaminant analysis method described above after analyzing the sample solution, after cleaning the flow path from the scan nozzle to the analyzer, ultrapure water is transferred to the analyzer for measurement, and it is determined whether the measured concentration value is within a set range. By doing so, it is characterized in that the self-verification step of verifying whether the contamination due to the transfer of the sample solution is automatically performed.
  • the self-verification step is performed when the transferred sample solution has a high concentration above a set concentration value.
  • an alarm is generated when the set range deviates by a predetermined number of times as a result of the self-verification step.
  • an apparatus for analyzing a substrate contaminant may include receiving a monitor wafer in a semiconductor manufacturing process and subjecting it to vapor phase decomposition, and then scanning a sample solution of the monitor wafer using a scan nozzle through a flow path from the scan nozzle to an analyzer.
  • a substrate contaminant analysis apparatus for transporting and analyzing by the analyzer may include receiving a monitor wafer in a semiconductor manufacturing process and subjecting it to vapor phase decomposition, and then scanning a sample solution of the monitor wafer using a scan nozzle through a flow path from the scan nozzle to an analyzer.
  • the acid-based chemicals may include hydrofluoric acid and hydrogen peroxide.
  • the base-based chemicals may include ammonium hydroxide and hydrogen peroxide.
  • the substrate contaminant analysis apparatus of claim 1, wherein the recycling unit comprises: an upper nozzle configured to spray the solution onto an upper surface of the dummy wafer; And a lower nozzle for spraying the solution onto the lower surface of the dummy wafer.
  • the recycling unit includes a chamber, and the inner bottom of the chamber is characterized in that the structure inclined to one side.
  • the substrate contaminant analysis method after receiving the monitor wafer in the semiconductor manufacturing process and subjected to vapor phase decomposition, a sample solution of scanning the monitor wafer using a scan nozzle through a flow path from the scan nozzle to the analyzer A substrate contaminant analysis method performed in a substrate contaminant analysis device which is transferred and analyzed by the analyzer
  • a substrate contaminant analysis apparatus may be configured to transfer a sample solution from a scanning nozzle to an analyzer through a flow path after the substrate to be analyzed is subjected to vapor phase decomposition using a scanning solution.
  • a substrate contaminant analysis device for analyzing with an analyzer may be configured to transfer a sample solution from a scanning nozzle to an analyzer through a flow path after the substrate to be analyzed is subjected to vapor phase decomposition using a scanning solution.
  • a scanning solution automatic preparation unit which automatically mixes ultrapure water and a central supply chemical to manufacture the scan solution.
  • the test solution is transferred to the analyzer through a flow path to verify whether at least the prepared scan solution is contaminated. Characterized in that.
  • the automatic scanning solution manufacturing unit In the substrate contaminant analysis apparatus, the automatic scanning solution manufacturing unit, the scan solution vessel to temporarily store the prepared scan solution; And a valve and a flow controller positioned between the lines for supplying the ultrapure water and the central supply chemical and the scan solution vessel, respectively.
  • the substrate contaminant analyzing apparatus further comprising: a valve positioned between the lines for supplying the central supply chemical and the drain to discharge the central supply chemical at regular intervals or periodically to prevent contamination due to congestion. It features.
  • the substrate contaminant analysis method in the substrate contaminant analysis method according to an aspect of the present invention, after the substrate to be analyzed is subjected to vapor phase decomposition by using a scanning solution, the sample solution scanned by the scanning target substrate through the flow path from the scan nozzle to the analyzer through the A substrate contaminant analysis method performed in a substrate contaminant analyzing apparatus analyzed by an analyzer,
  • At least the central supply chemical is periodically discharged to a drain or periodically discharged to prevent contamination due to stagnation of the central supply chemical.
  • a substrate contaminant analysis apparatus includes a substrate contaminant analysis in which a sample solution containing contaminants is sucked from a semiconductor substrate by using a nozzle, and the sample solution is transferred from the nozzle to the analyzer through a flow path for analysis by the analyzer.
  • etching solution manufacturing unit for automatically manufacturing an etching solution for global etching or point etching the bulk of the semiconductor substrate, wherein the etching solution manufacturing unit,
  • An etching solution vessel for storing the prepared etching solution;
  • a metering pump that sequentially inhales two or more chemicals and ultrapure water for preparing the etching solution and discharges them into the etching solution vessel, from the etching solution vessel to a chamber for global etching or a nozzle for point etching. It is characterized in that the supply through the flow path.
  • the at least two chemicals are characterized in that it comprises hydrofluoric acid and nitric acid.
  • a substrate contaminant analysis in which a sample solution containing contaminants is sucked from a semiconductor substrate using a nozzle, and the sample solution is transferred from the nozzle to the analyzer through a flow path for analysis by the analyzer.
  • an etching solution automatic manufacturing process for automatically manufacturing an etching solution for global etching or point etching of the bulk of the semiconductor substrate, wherein the etching solution automatic manufacturing process sequentially comprises two or more chemicals and ultrapure water for preparing the etching solution.
  • the suction and discharge of the etching solution vessel is repeated, wherein the prepared etching solution is supplied through the flow path from the etching solution vessel to the chamber for the global etching or the nozzle for the point etching.
  • the substrate contaminant analysis method described above is characterized in that a part or all of the flow path used for the suction and discharge is purged with non-reactive gas between the repetition of the suction and discharge.
  • the sample solution can be sensed and loaded as it arrives at the sample tube, so that the sample solution can be accurately loaded and prevent the loss of the sample solution, and use less sample solution or scan nozzle There is an effect that it may move to the sample tube at high speed.
  • the movement of the sample solution may be checked using the detection of the liquid detection sensor.
  • the sample solution of the scan nozzle can be loaded at high speed into the sample tube, thereby reducing the transfer time.
  • the amount can be corrected collectively, so that there is an effect of easily eliminating the shake of the scan solution in calibration.
  • an effect of easily eliminating a memory effect and improving reliability of a substrate contaminant analysis result in a substrate contaminant analyzing apparatus and method may be obtained. have.
  • in-line monitoring is possible in the substrate manufacturing process, and operated as a closed sampling system, there is no safety problem and cross contamination problem in chemical handling, and there is an effect of enabling real-time or rapid response.
  • FIG. 1 is a plan view showing the overall configuration of a substrate contaminant analysis apparatus according to an embodiment of the present invention.
  • FIG. 2 is a view schematically showing a flow path and a valve for supplying and transferring a scan solution, a sample solution, a standard solution, and an etchant in a substrate contaminant analysis apparatus according to an exemplary embodiment of the present invention.
  • FIG. 3 is a diagram illustrating an example in which a sample tube and a liquid detection sensor are installed.
  • FIG. 3 (A) shows an example in which a liquid detection sensor is installed in a rod-shaped sample tube
  • FIG. 3 (B) shows a loop-shaped sample tube. This is an example of a liquid sensor installed in the
  • FIG. 4 is a flowchart illustrating a sensitivity check process according to an embodiment of the present invention.
  • FIG. 5 is a flowchart illustrating a self-verification process according to an embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a recycling unit according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram showing a scan solution manufacturing unit according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing an etching solution manufacturing unit according to an embodiment of the present invention.
  • the term “substrate” includes a semiconductor wafer, an LCD substrate, an OLED substrate, and the like, and unless otherwise specified, a “substrate” does not mean only a start state in a manufacturing process, but an oxide film, a polysilicon layer, a metal layer, an interlayer film. Alternatively, one or more elements may be formed.
  • 'Scan' herein includes scanning in the depth direction to obtain a Point Depth Profile at certain points of the substrate, as well as scans of all or some regions of the substrate.
  • a 'scan solution' refers to a solution supplied or supplied to a nozzle for scanning a substrate
  • a 'sample solution' refers to a substrate as a scan solution or a scan solution and a point etching solution. It refers to a solution in which contaminants are collected after scanning.
  • FIG. 1 is a plan view showing the overall configuration of a substrate contaminant analysis apparatus according to an embodiment of the present invention.
  • the substrate contaminant analyzing apparatus of the present invention includes a load port 10, a robot 20, an aligner unit 30, a VPD unit 40, a scan unit 50, a recycling unit 60, and an analyzer 70. It is configured by.
  • the load port 10 is located at one side of the substrate contaminant analyzing apparatus and provides a passage through which the cassette containing the substrate is opened to introduce the substrate into the substrate contaminant analyzing apparatus.
  • the robot 20 grips the substrate and automatically transfers the substrate between the components of the substrate contaminant analyzing apparatus, and specifically, the cassette of the load port 10, the alignment unit 30, the VPD unit 40, and the scan unit.
  • the substrate is transferred between the 50 and the recycling unit 60.
  • the aligner unit 30 performs a function of aligning the substrate, and is particularly used to align the center of the substrate before placing the substrate on the scan stage 51.
  • the VPD unit 40 is a unit in which vapor phase decomposition (VPD) is performed on a substrate, and includes an inlet and a door for introducing the substrate, a process chamber, a load plate provided in the process chamber, a vacuum chuck, and an etching gas.
  • the injection hole and the like are etched by the gaseous etchant to etch the surface or the bulk of the substrate.
  • the scan unit 50 includes a scan stage 51 and a scan module 52.
  • the scan stage 51 includes a substrate on which the gas phase decomposition has been performed in the VPD unit 40, and is mounted thereon. The substrate is rotated in the process of scanning the substrate using the scan module 52.
  • the scan module 52 is provided on one side of the scan stage 51 and has a scan nozzle 53 (see FIG. 2) for scanning a substrate in a state in which a scan solution is held close to the substrate and a scan nozzle is mounted at one end. And a scan module arm that can move the position of the scan nozzle in, for example, three axes. One or more scan nozzles and scan modules may be provided.
  • the scan solution is supplied to the scan nozzle of the scan unit 50 through the flow path, and the sample solution which scans the substrate with the supplied scan solution is transferred to the analyzer 70 through the flow path.
  • the recycling unit 60 treats the substrate with a solution containing an acid-based or base-based chemical in order to recycle the substrate after scanning, and is provided in the inlet and the door, the process chamber, and the process chamber for introducing the substrate.
  • a load plate, a vacuum chuck, and a nozzle for spraying an etchant, and the like will be described later.
  • the analyzer 70 receives and analyzes the sample solution from the scan nozzle of the scan unit 50 through the flow path, and analyzes the presence or absence of contaminants contained in the sample solution, the amount of the contaminants, or the concentration of the contaminants.
  • an inductively coupled plasma mass spectrometer ICP-MS is preferable.
  • the substrate contaminant analysis apparatus may be configured mainly on the side or inside of the substrate contaminant analyzing apparatus, which will be described later.
  • the robot 20 introduces a substrate to be analyzed from the load port 10 into the process chamber of the VPD unit 40, and vapor-decomposes the surface of the substrate by using an etching gas in the VPD unit 40.
  • the oxide film on the surface of the substrate is combined with the etching gas and discharged in the gas state, and impurities such as metal atoms contained in the surface and the oxide film remain in the state capable of being collected on the surface of the substrate.
  • the robot 20 is used to withdraw the substrate from the VPD unit 40 and then rest on the scan stage 51.
  • the scanning solution is transferred from the scanning solution vessel (see FIG. 2) to the front end of the scanning nozzle through the flow path, so that the droplet of the scanning solution remains between the front end of the scanning solution and the substrate surface.
  • the scan of the substrate is performed in parallel with the rotation of the scan stage 51 and the position control of the scan module arm, and the scan nozzle moves to a spiral trajectory on the substrate, or the scan nozzle is performed every time the substrate completes one rotation.
  • the substrate may be scanned by moving the position of the scanning nozzle to move the plurality of concentric trajectories.
  • the scan solution becomes a sample solution that absorbs contaminants such as metal atoms.
  • the scan nozzle sucks the sample solution and the sample solution flows from the scan nozzle to the analyzer 70. Is transferred through, the analyzer 70, such as ICP-MS analyzes the transferred sample solution.
  • the scanning solution is, for example, a solution containing hydrofluoric acid (HF), hydrogen peroxide (H 2 O 2 ) and ultrapure water.
  • the scanned substrate is introduced into the process chamber of the recycling unit 60 by the robot 20 from the scan stage 51, and the substrate is brought into a solution containing an acid-based or base-based chemical by the recycling unit 60.
  • the substrate can be reused, and the robot 20 then withdraws the substrate from the process chamber of the recycling unit 60 and mounts it back to the cassette of the load port 10.
  • the substrate can be aligned using the aligner unit 30.
  • FIG. 2 is a view schematically showing a flow path and a valve for supplying and transferring a scan solution, a sample solution, a standard solution, and an etchant in a substrate contaminant analysis apparatus according to an exemplary embodiment of the present invention.
  • the sample tubes 82, 92 and 112 are tubes having a space for loading a small amount of solution, and the sample tubes may have various shapes such as rods, spirals or loops, and the sample tubes may be sample loops, for example. have.
  • the metering pumps 85,86, 95 may be syringe pumps, diaphragm pumps, gear pumps, piston pumps, etc., and pumps of high precision may be preferred, and pumps 87, 96, 116 may be metering pumps or other It may be in the form of a pump or a pump with a large capacity may be preferred.
  • the scanning solution of the scan solution vessel 121 or the etching solution of the point etchant vessel 131 is manufactured and stored through an automatic manufacturing apparatus which will be described later.
  • Each solution is delivered to the scan nozzle 53 through a valve system comprising a third pump 116 and a third valve 113, a fourth valve 114, and a fifth valve 115.
  • the valve between the scan solution vessel 121 and the third pump 116 is opened and the predetermined volume is drawn out using the third pump 116.
  • the arrival of the scan solution to the third sample tube 112 at the front end of the third pump 116 is sensed by the third liquid detection sensor 111.
  • the valve is closed, the third valve 113 is opened, and the scan solution is supplied to the scan nozzle 53 by a predetermined amount using the third pump 116.
  • an etching solution may be used together with a scan solution for the point bulk etching, and the etching solution and the scan solution may be provided to the scan nozzle 53 alternately or in a certain order.
  • air or gas may be used to further push during or after pump discharge.
  • the sample moving distance is usually used in the range of 2 ⁇ 4m, but other things are possible.
  • the sample introduction unit 100 is a device for introducing a sample solution, a standard solution, a scan solution, or ultrapure water into the analyzer 70 as a sample, and includes a sample solution introduction unit 80 and a standard solution introduction unit 90. do.
  • the switching valves 81 and 91 have sample ports 82 and 92 coupled to two ports, and have a load position in which the solution is loaded into the sample tube and an injection position injecting the loaded solution. Can be switched between positions.
  • the switching valves 81 and 91 may be injection valves or combinations of several valves and flow paths. Preferably the switching valves 81 and 91 are 6 port injection valves.
  • the liquid detection sensors 83, 93, and 111 are detection sensors for detecting a liquid, and the liquid detection sensors may be an optical sensor capable of detecting the presence or absence of a liquid, or a proximity sensor for detecting a change in coupled capacitance.
  • the liquid detection sensors 83, 93, and 111 are installed in close proximity to or attached to the sample tubes 82, 92, and 112 to detect liquid in the sample tubes.
  • FIG. 3 is a diagram illustrating an example in which a sample tube and a liquid detection sensor are installed.
  • FIG. 3 (A) shows an example in which a liquid detection sensor is installed in a rod-shaped sample tube
  • FIG. 3 (B) shows a loop-shaped sample tube. This is an example of a liquid sensor installed in the
  • the liquid detection sensors 83, 93, and 111 may be installed at the center or one side of the sample tubes 82, 92, and 112, or two or more liquid detection sensors may be installed.
  • the sample solution introduction unit 80 selectively introduces a sample solution, a scan solution, and the like, and includes a first switching valve 81, a first sample tube 82, a first liquid detection sensor 83, and a first metering pump 85. ), A second metering pump 86, a first valve 88, a second valve 89, and the like.
  • the first sample tube 82 is a tube having a space in which the sample solution scanned by the scan nozzle is to be loaded, and the first liquid detection sensor 83 is installed.
  • the first switching valve 81 has a load position in which port 1 and port 4 are coupled to the first sample tube 82, and mainly the sample solution in the sample solution or the scan solution is loaded into the first sample tube 82. It has at least an injection position for injecting the loaded sample solution towards the analyzer 70.
  • the sample solution When the sample solution is loaded into the first sample tube 82, the sample solution may include a gas section before and after the sample solution, and the gas may be air or an inert gas, and the first detection sensor 83 may include a first sample tube ( 82) to distinguish between the gas section and the sample solution.
  • the sample solution introduction unit 80 and the standard solution introduction unit 90 are installed in the sample tubes 82 and 92, and the sample solution or the standard solution using the liquid detection sensors 83 and 93 which distinguishes the gas section from the sample solution. Detect the arrival or movement of the back.
  • the first liquid detection sensor 83 detects in the order of gas and liquid at the load position, it is determined that the sample solution arrives at the sample tube 82 from the scan nozzle, and the liquid detection sensor 83 at the injection position detects the liquid and Detecting in the order of gas determines that the sample solution is moving toward the analyzer 70.
  • the first metering pump 85 is mainly used for loading the sample solution into the sample tube 81 when the switching valve 81 is in the load position
  • the second metering pump 86 is mainly used for the injection of the switching valve 81. It is used to push the loaded sample solution into the analyzer 70 with ultrapure water at the position.
  • the first switching valve 81 is in the injection position and always supplies ultrapure water through the first sample tube 82 to the analyzer 70, so as to have a cleaning effect of the first sample tube 82 and the flow path. do. Further, the tube between the scan nozzle 53 and the first switching valve 81 is filled with air or gas rather than liquid.
  • the first sample valve 88 is opened and the first switching valve 81 sucks the sample by the first metering pump 85 at the load position, thereby scanning the sample solution.
  • the first sample tube 82 is placed in the middle of the flow path between the scan nozzle 53 and the analyzer 70.
  • the moving distance of the sample solution may be, for example, in the range of 2-4 m.
  • the first liquid detection sensor 83 When the sample solution reaches the sample tube, the first liquid detection sensor 83 is sensed to switch the first switching valve 81 to the injection position. When the first liquid detection sensor 83 detects the gas and the liquid in the order, it is determined that the sample solution arrives at the first sample tube 82 from the scan nozzle.
  • the flow path between the scan nozzle 53 and the sample tube 82 is a state in which air or gas is filled, and the front and rear of the sample solution is filled with air or gas when the sample solution is moved by the pump operation.
  • This provides the advantage that only the sections of the sample solution can be identified. For example, before the sample solution is introduced into the first sample tube 82, there is a gas region and the liquid sensing sensor of the first sample tube 82 indicates an off state. At this time, when the liquid sample solution reaches the first liquid detection sensor 83, the output state of the liquid detection sensor indicates an on state, and at this time, the first switching valve 81 is switched to the injection position to switch the sample solution to the first sample. It can be stored inside the tube 82 and stops the first metering pump 85 for suction. Gas is present at both ends of the sample solution, and a plurality of sensors may be installed to add an accurate measurement.
  • the suction process of the sample solution may be repeated a predetermined number of times. If the liquid is not detected by the process, it is determined that the sample solution of the substrate is lost and the alarm is processed.
  • the sample solution can be sensed and loaded as it arrives at the sample tube, so that the sample solution can be loaded accurately and prevent the loss of the sample solution, and less sample solution can be used or scanned. There is an effect that you may move from a nozzle to a sample tube at high speed.
  • the first switching valve 80 is then switched from the load position to the injection position and the sample solution loaded in the first sample tube 82 is injected into the analyzer.
  • the sample solution is supplied to the analyzer 70 using the second metering pump 86 connected to the first switching valve 81, but at a constant flow rate.
  • the second metering pump 86 is used to push the loaded sample solution into the analyzer 70 with ultrapure water at the time of injection.
  • the first liquid detection sensor 83 When the first liquid detection sensor 83 detects the liquid and the gas in the order, it is determined that the sample solution moves toward the analyzer 70. If the first liquid detection sensor 83 does not detect the change from the liquid to the gas, it may determine that there is an abnormality and may alarm.
  • both ends of the sample solution are gaseous, and when the sample solution is moved, the first liquid detection sensor 83 may be sensed to change from the off state-on state-off state or the on state-off state. .
  • the movement of the sample solution is introduced into the analyzer in the order of sample solution-gas-ultrapure water as the whole moves together while pushing the ultrapure water to the second metering pump 86.
  • the movement of the sample solution may be checked using the detection of the first liquid detection sensor 83. And the analysis command is given to the analyzer 70 and the analysis result is confirmed.
  • sample losses may exist in the process of transferring a sample of the wafer to the analyzer.
  • Sample loss during scanning may leak from the nozzle to the wafer surface due to the characteristics of the wafer, and there may be sample loss due to an abnormality such as a pump in the process of moving the sample to the sample tube, and from the sample tube to the analyzer) It may also be lost by abnormalities in the pump or sample introduction device during the movement.
  • the flow path from the first switching valve 81 to the analyzer 70 is naturally cleaned by the pushed ultrapure water.
  • the path being cleaned includes the sample travel path from the scan nozzle 53 to the analyzer 70 and the scan nozzle 53 itself.
  • the cleaning is performed by placing the scan nozzle 53 in the nozzle cleaning vessel 54 and then sucking it using a pump.
  • the scan nozzle 53 is inserted into the nozzle cleaning vessel 54 which is always overflowed to maintain a clean state, and then the predetermined time or repetition is performed using the first switching valve 81 and the first pump 87.
  • Cleaning is performed by continuously inhaling ultrapure water or cleaning solution.
  • a chemical liquid (HF, HF + H 2 O 2 , HNO 3 , HCl, etc.) may be introduced into the cleaning solution, and the first pump 87 having a large pump capacity may be used. It is good.
  • Different pumps are used for loading and cleaning the sample solution, and pumps with higher suction speeds are used for cleaning.
  • the cleaning of the scan nozzle 530 is possible only with ultrapure water, and a chemical liquid may be introduced, which may be continuously performed in one vessel or may be divided into ultrapure water and chemical liquid.
  • the cleaning can proceed in parallel during the injection process to shorten the overall process time.
  • the analyzer 70 such as ICP-MS, must introduce a sample at a slow rate, and when the sample is introduced at a high rate, waste of the sample is severe.
  • the analyzer 70 has a rate of about 0.1 ml / min. Introduce the sample. If so, the time for injecting the sample solution of the first sample tube 82 up to the analyzer 70 is significant, and one embodiment of the present invention uses this to utilize a first switching from the scan nozzle 53 during the injection time.
  • the flow path to the valve 81 is cleaned.
  • the scan nozzle 53 ascends to the top of the nozzle cleaning vessel 54 and continues pumping in this state.
  • the tubes from the scan nozzle 53 to the first switching valve 81 and the first pump 87 are in a state filled with gas rather than liquid.
  • air or air flows into the flow path including at least a section from the scan nozzle 53 to the front of the first sample tube 82. Fill the gas. Thereafter, the scan nozzle 53 enters the nozzle cleaning vessel 54 and maintains the standby state.
  • An embodiment of the present invention is a substrate contaminant analysis apparatus for transferring a sample solution sucked by using a scan nozzle 53 from an analysis target substrate through a flow path from a scan nozzle 53 to an analyzer 70, wherein the sample solution introduction unit is provided.
  • the sample solution introduction unit is provided.
  • the standard solution introduction portion 90 is coupled using a T-tube 94 in the middle of the flow path for the sample solution is transferred to the standard solution for calibration in the flow path Can be introduced.
  • the sample introduction unit 100 loads a sample solution and then injects the sample solution into the analyzer 70, between the sample solution introduction unit 80 and the analyzer 70. It includes a standard solution introduction portion 90 that is coupled to the flow path using a T-tube 94 to introduce a standard solution for calibration.
  • the standard solution inlet 90 comprises a second switching valve 91, a second sample tube 92, a second liquid detection sensor 93, a third metering pump 95 and a second pump 96.
  • the second sample loop 92 has a space for the standard solution to be loaded, the second switching valve 91 is coupled with the second sample tube 92 and the standard solution is loaded into the second sample tube 92.
  • a valve having at least a load position and an injection position for injecting the loaded standard solution toward the T tube 94.
  • the second switching valve 91 may be a six port injection valve.
  • the second switching valve 91 is a second port, which is a first port and a fourth port coupled to the second sample tube 92, a third port coupled to a flow path through which a standard solution is supplied, and a suction pump that sucks a standard solution.
  • the second switching balance 91 loads the standard solution
  • the first port and the second port, the third port and the fourth port, and the fifth port and the sixth port are connected, and the standard solution is injected. Is connected between the sixth port and the first port, between the second port and the third port, and between the fourth port and the fifth port.
  • the sample introduction unit 100 may automatically adjust the dilution ratio of the sample solution and the standard solution by a predetermined ratio and introduce the calibration into the analyzer 70.
  • the first switching valve 81 is positioned at the injection position so that the constant ultrapure water is introduced into the analyzer 70 through the first sample loop 81, which means to always clean.
  • the third metering pump 93 pushes the loaded standard solution with ultrapure water, and then the flow path of the third metering pump 95 from the T-tube 94 is filled with ultrapure water, and after completion of calibration It will return to the load position and will remain that way. Since the second switching valve 91 is normally in the rod position (state of FIG. 2) and the flow path of the T-tube 94 to the third metering pump 95 is filled with ultrapure water, the sample solution introduction part 80 or the like is used. In the analysis of the sample solution, the standard solution is incorporated into the sample solution via the T-tube 94 to enter the analyzer 70 so as not to affect the analysis result.
  • the standard solution In the load position of the second switching pump 91, the standard solution can be thrown away at a predetermined time or before calibration. In the injection position, the standard solution loaded using the third metering pump 95 is pushed with ultrapure water. .
  • the sample solution introduction unit 90 includes an ultrapure water carrier unit 88 which pushes the sample solution with ultrapure water when injecting the sample solution into the analyzer 70, but the standard solution is used for calibration. Also in dilution, the ultrapure water carrier portion 88 is commonly used.
  • the object to be analyzed by the analyzer is a sample solution derived from the scan solution, it may be desirable to perform calibration by diluting the standard solution with the scan solution even in calibration.
  • Sample introduction unit 100 includes a sample solution introduction unit 80 for the introduction of the original sample solution, when performing a calibration for the analyzer as a standard solution sample solution introduction unit 80 Dilute the standard solution by introducing a scan solution instead of a sample solution.
  • a scan solution instead of a sample solution.
  • the scanning solution may be shaken during the manufacturing or handling process, the concentration of the trace contaminants included, as a method for solving this problem, in another embodiment of the present invention instead of diluting the standard solution with the scan solution diluted with ultrapure water And calibrate using the measurement results of the scanning solution.
  • At least one or more standard solutions are transferred to the analyzer 70 while analyzing the standard solution with ultrapure water in real time dilution, and the scan solution used for scanning is transferred to the analyzer 70 for analysis. do.
  • ultrapure water analysis ⁇ standard solution concentration 1 analysis ⁇ standard solution concentration 2 analysis ⁇ . . ⁇ standard solution concentration N analysis ⁇ scan solution analysis, and so on.
  • standard solutions they are measured in the order of low concentration to high concentration to reduce the memory effect that can be caused by precipitation of metal atoms in the flow path. Can be.
  • the first switching valve 81 is placed in the injection position and ultrapure water is introduced into the analyzer 70.
  • the ultrapure water is supplied to the analyzer 70 at a predetermined flow rate using the second metering pump 86, and the analyzer 70 Analyze ultrapure water to derive the analysis result of ultrapure water.
  • the second switching valve 91 is placed in the load position, and the second sample tube 92 is filled with the standard solution using the second pump 96. If necessary, the second sample tube 92 may be filled after the cleaning is performed on the second sample loop 92 by pumping the standard solution through the second sample loop 92 for a predetermined time.
  • the second switching valve 91 is switched to the injection position after a certain time without detecting the arrival of the standard solution using the second liquid detection sensor 93 or without using the second liquid detection sensor 93.
  • the load position is the connection state into which the standard solution can be introduced
  • the injection position is the connection state into which the standard solution can be introduced into the analyzer.
  • the third metering pump connected to the second switching valve 91 while simultaneously introducing ultrapure water from the first sample loop 82 into the analyzer 70 using the second metering pump 86 connected to the first injection valve 81.
  • the pump 95 introduces the standard solution of the second sample loop 92 into the analyzer 70.
  • Each solution meets and mixes in the middle T tube 94.
  • the mixing or dilution ratio is determined by the discharge flow rate of each pump.
  • the ultrapure water and the standard solution are loaded into different sample tubes and injected simultaneously by two different metering pumps and mixed in the T tube 94 for real time dilution.
  • the dilution ratio of is determined by the discharge flow rates of two different metering pumps.
  • the analyzer 70 analyzes and stores the result value for the standard solution concentration 1, and also measures and analyzes the standard solution concentrations sequentially. At this time, the dilution ratio is adjusted by varying the discharge flow rate as described above.
  • Assays for standard solutions are performed at a plurality of different dilution concentrations to obtain calibration curves.
  • a calibration curve is generated, which represents the relationship between the input and output of the analyzer, or the concentration of the sample introduced and the output of the analyzer.
  • the 'calibration curve' does not necessarily mean a mathematical curve, but may include such things as a mapping table or a mapping function that shows the correspondence between the input and output of the analyzer or the concentration of the sample introduced and the output of the analyzer. Can be.
  • the calibration curve created for each element in each sample is usually reliable only when it has excellent linearity. If the linearity criterion is less than the threshold value, calibration can be performed in whole or in part, and normal processing can be performed only when the set value is satisfied.
  • the substrate contaminant analyzing apparatus analyzes the scan solution with the analyzer 70.
  • the scanning solution is filled into the first sample tube 82 of the first switching valve 81, using the first pump 87 at the load position of the first switching valve 81 without passing through the scan nozzle 53.
  • One sample loop 82 is filled, with the first valve 88 closed and the second valve 89 open.
  • the scan solution is pushed to the analyzer with ultrapure water at a predetermined flow rate using the first metering pump 85, and the analyzer 70 proceeds with the analysis to derive the analysis result of the scan solution.
  • the analysis result of the standard solution may be applied as it is and used to analyze the sample solution later.
  • the analysis result of the scan solution is lower than the trace concentration setting value, it is treated as normal, and the analysis result for the standard solution may be corrected by the analysis result for the scan solution to be used to analyze the sample solution. .
  • the calibration curve may be corrected according to the analysis result of the scan solution, or in analyzing the sample solution, the concentration of the scan solution according to the analysis result of the scan solution may be subtracted from the concentration of the sample solution. If the analysis result of the scanning solution is higher than the trace concentration setting value, the measurement may be re-measured, and if it is abnormal, the countermeasure may be taken.
  • the concentration of the trace contaminants included during the manufacturing or handling process may fluctuate. Accordingly, when the scan solution is diluted with the scan solution, an error due to the scan solution may not be distinguished from the analysis result of the standard solution. According to an example, it is possible to correct such a problem even if the concentration of contaminants in the scan solution is shaken by solving such a problem, so that it is easy to exclude the shake of the scan solution in calibration.
  • the substrate contaminant analysis device analyzes a series of sample solutions by using the calibration curve obtained by analyzing the analyzer 70 at a plurality of different dilution concentrations with respect to the standard solution through auto calibration. .
  • the standard solution is automatically measured by the analyzer 70 at a set cycle or a set time to determine whether the measured concentration value is within a set range, and performs a sensitivity check step of checking sensitivity.
  • the sensitivity check step can be executed simply and at a lower frequency than the frequency of auto calibration.
  • concentration value specified in the sensitivity check step is out of the setting range, the process of acquiring the calibration curve is performed again.
  • the analyzer 70 slightly changes the analysis sensitivity with time. Accordingly, the sensitivity status is checked to check for abnormalities. This is because different sensitivity results in different measurement results and less reliable analysis results.
  • FIG. 4 is a flowchart illustrating a sensitivity check process according to an embodiment of the present invention.
  • the standard solution is diluted with a specific ratio or measured as it is by the analyzer 70 (S10), but the output value or the expected concentration value of the analyzer 70 is known in advance. Then, it is determined whether the measured concentration value is within a setting range (S12). As a result of the determination, if the concentration value is out of the setting range, the automatic calibration process is performed again (S14), and the calibration curve is acquired again. If the concentration value is not out of the setting range, analysis of the sample solution such as the next sample solution is continued ( S16). If the measured concentration value is within the set deviation, it can be processed normally and the next sample can be measured. If the error is larger than the set deviation, the error is recognized as a change in sensitivity and the calibration process is performed again.
  • Analysis of highly contaminated samples may leave some contaminants in nozzles, flow paths, and analyzers that come in contact with the sample.
  • the analysis of each sample is performed after the analysis of each sample, but in the case of a high concentration of contaminated samples, it may not be removed by one time or a predetermined number of cleaning.
  • a self validation function for checking whether the memory effect is completely removed is performed automatically.
  • FIG. 5 is a flowchart illustrating a self-verification process according to an embodiment of the present invention.
  • the sample solution is transferred to an analyzer for analysis according to a conventional procedure (S20) and every time there is an analysis, the flow path from the scanning nozzle to the analyzer is analyzed after the analysis (S22), and in this case, automatic cleaning using ultrapure water may be performed.
  • the self-validation process (S40) is added, it is determined whether the transferred sample solution was a high concentration above the set concentration value (S24), if it was not a high concentration sample analysis for the next sample solution Proceed to
  • the sample delivery part is cleaned with chemical (S26), the ultrapure water is transferred and analyzed by the analyzer together with the cleaning with ultrapure water (S28), and it is determined whether the measured concentration value of the ultrapure water is within the set range. (S30). If it is within the set range, the process proceeds to the analysis of the next sample, but if it is out of the set range, the process of chemical cleaning and ultrapure water is repeated, and if it is out of the set range even after a predetermined number of times, an alarm may be generated. As a result of executing the self-verification step, an alarm is generated when the set range is out of a predetermined number of times.
  • an effect of easily excluding a memory effect and improving reliability of a substrate contaminant analysis result in a substrate contaminant analyzing apparatus and method may be achieved.
  • Substrate contaminant analysis apparatus mainly receives the monitor wafer in the semiconductor manufacturing process and vapor-decomposes it, and then analyzes the monitor wafer by using a scan nozzle as an analyzer. Contaminant analysis of wafers by conventional ICP-MS and the like is accompanied by VPD, so it is classified as a failure analysis, and the analyzed wafers are discarded.
  • the solution in order to recycle the monitor wafer after the scan is completed, the solution is treated with a solution containing an acid-based or a base-based chemical using at least the reciting unit 60.
  • Acid-based chemicals include hydrofluoric acid and hydrogen peroxide
  • base-based chemicals include ammonium hydroxide and hydrogen peroxide.
  • FIG. 6 is a cross-sectional view of a recycling unit according to an embodiment of the present invention.
  • the recycling unit 60 includes an upper nozzle 69 (shown in a separated state), an upper nozzle mount 63, a lower nozzle 64, a wafer load plate 61, a wafer vacuum chuck 62, and an upper nozzle rotational drive ( 66, the vacuum chuck driving unit 67, the inclined portion 65 and the like.
  • the upper nozzle 69 (shown in a separated state) is mounted to the upper nozzle mounting portion 63 and sprays the above solution onto the upper surface of the monitor wafer, and the upper nozzle rotation driving portion 66 drives the upper nozzle to rotate.
  • the lower nozzle 64 sprays the above solution onto the lower surface of the monitor wafer, and may be rotationally driven by the lower nozzle rotation driver 68.
  • the recycling unit 60 may process both sides of the monitor wafer through nozzles provided at the top and the bottom.
  • the recycling unit 60 includes a chamber, the inner bottom of the chamber includes an inclined portion 65 inclined to one side to help drain the solution after the treatment.
  • the wafer load plate 61 is lowered and the door is closed. Then, the upper nozzle moves to the wafer center and ejects the chemical liquid, so that the wafer is rotated at a low speed and the upper nozzle is also rotated at a limited angle.
  • the chemical liquid injection is similarly performed on the lower part of the wafer after evenly spraying the chemical liquid by the upper nozzle.
  • the wafer is rotated at high speed, sprayed with nitrogen gas, and dried. After completion of drying, the wafer load plate is raised, the door is opened, and the wafer is taken out.
  • the cost of the monitor wafer since the monitor wafer which has been disposed of in the past may be reused, the cost of the monitor wafer may be greatly reduced.
  • the chemical liquid used in each process is manufactured by an operator or purchased by using a manufactured product. Accordingly, there is an inconvenience that the operator must periodically replenish or replace the chemical liquid.
  • the device according to the present invention is a device for analyzing trace amounts of contamination, so the level of contamination is very low, and it is very unlikely that the level of pollution will not be met or the standard concentration will not be manufactured even by the slightest carelessness or contamination of the working environment. high.
  • FIG. 7 is a schematic diagram showing a scan solution manufacturing unit according to an embodiment of the present invention.
  • the scanning solution preparation unit automatically mixes the ultrapure water and the central supply chemical to produce the scanning solution.
  • the scan solution manufacturing unit includes a scan solution vessel 121, a plurality of valves 125a to 125i, a plurality of flow controllers 122 to 124, and a pump 127.
  • the scan solution vessel 121 (same as 121 in FIG. 2) is a container in which the prepared scan solution is temporarily stored.
  • the valves and flow meters provide between the lines for supplying ultrapure water (DIW) and the central supply chemicals (Chem1, Chem2) and the scan solution vessel 121, and for the supply of ultrapure water (DIW) and the central supply chemicals (Chem1, Chem2). Between the lines 128 and the drain 128, between the scan solution vessel 121 and the drain 128.
  • the valves 125f, 125g, and 125g are positioned between the lines and the drain supplying the central supply chemical to discharge or periodically discharge the central supply chemical to prevent contamination due to stagnation of the central supply chemical.
  • an embodiment of the present invention is characterized by verifying whether or not the contamination of at least the prepared scan solution by transferring the scan solution stored in the scan solution vessel 121 to the analyzer through the flow path.
  • the chemical liquid may be supplied by a pump or a central supply system, and the volume of the chemical liquid is defined using a flow controller 122, 123, 124, or a metering pump (not shown) to supply a predetermined volume to the scan solution vessel 121.
  • the chemical liquid supply may proceed in sequence or simultaneously with the chemical liquids to be mixed and may be introduced by opening the associated valve.
  • the scan solution vessel 121 is cleaned using the ultrapure water and the central supply chemical for preparing the scan solution in the same manner, and then discharged to the drain.
  • the flow rate is controlled by using the flow controller 124 to introduce ultrapure water into the scan solution vessel 121, and likewise, the first central supply chemical HF.
  • the second central feed chemical H 2 O 2
  • the flow rate and valve opening time are adjusted to match the final volume.
  • the ultrapure water and the central feed chemical are then automatically mixed to prepare the scan solution and stored in the vessel.
  • the manufacturing process of the scan solution is the same as the process of filling the ultrapure water and the central feed chemical for cleaning the vessel described above, but the concentration and the like can be controlled differently.
  • the scan solution prepared through the flow path is transferred from the scan solution vessel 121 to the analyzer 70 to verify whether at least the prepared scan solution is contaminated.
  • the valve 89 (FIG. 2), the switching valve 81, the sample tube 82, and the like are transferred to the analyzer 70 and analyzed, and this process may be the same as the process of analyzing the scan solution during the calibration process. have. If the measured result is more than the minimum setting value, it is determined that it is contaminated, and remanufacturing and analysis are repeated as many times as the set number.
  • the substrate contaminant analyzing apparatus and method may have an effect of preventing a safety accident and chemical contamination and ensuring the quality of the prepared scan solution.
  • the scanning solution manufacturing unit periodically discharges the central supply chemical to the drain to prevent contamination due to the stagnation of the central supply chemical.
  • the chemical liquid is stagnated, spontaneous contamination is caused, and in particular, the contamination may be caused by organisms such as bacteria, but the scanning solution manufacturing unit according to an embodiment of the present invention prevents contamination due to the stagnation of the chemical liquid.
  • Exhaust may be connected to the scan solution vessel 121 to facilitate the supply of the chemical solution, and the chemical solution present in the scan solution vessel 121 may be removed to the drain 128 using a pump 127 or gas pressurization and ultrapure water It can be cleaned using.
  • the chemical solution level detection sensors 126a and 126b are installed in the scanning solution vessel 121 so that the chemical solution may be newly manufactured when the chemical solution is insufficient, or the operation may be stopped for safety when the chemical solution is excessively manufactured.
  • FIG. 8 is a schematic diagram showing an etching solution manufacturing unit according to an embodiment of the present invention.
  • the etching solution preparation unit automatically manufactures an etching solution for global etching or point etching of the bulk of the semiconductor substrate, and the etching solution preparation unit is a chemical supply container 133 and 134 for supplying chemicals, a point etching solution vessel 131, and a bulk etching solution vessel 132, a plurality of valves 136a to 136g, and a metering pump 135.
  • the point etchant vessel 131 stores an etchant for point etching the substrate for analyzing a point depth profile of the substrate, and is an etching solution vessel for supplying the etchant to the scan nozzle 53.
  • Bulk etchant vessel 132 is an etching solution vessel that etches from the VPD unit to the bulk of the substrate and stores the etchant for scanning and analyzing the bulk.
  • the metering pump 135 sequentially inhales two or more chemicals and ultrapure water for preparing the etching solution and then discharges them into the etching solution vessel of the point etching solution vessel 131 or the bulk etching solution vessel 132. Then, the etching solution is converted into a gaseous state or supplied in a liquid state through the flow path from the etching solution vessels 131 and 132 to a chamber for global etching or a nozzle for point etching, and the chemical used is preferably hydrofluoric acid (HF) and Nitric acid (HNO 3 ).
  • HF hydrofluoric acid
  • HNO 3 Nitric acid
  • the manufacturing process is a process of automatically manufacturing an etching solution for global etching or point etching of a bulk of a semiconductor substrate.
  • the process of repeatedly sucking two or more chemicals and ultrapure water for preparing an etching solution and then discharging the same into an etching solution vessel is performed.
  • the prepared nicking solution is supplied through the flow path from the etching solution vessel to a chamber for global etching or a nozzle for point etching.
  • the metering pump 135 is used to purge a portion or the entirety of the flow path used for the suction and discharge with the non-reactive gas between the processes of repeating the suction and the discharge.
  • a non-reactive gas such as N 2 may be used to completely remove or supply a chemical liquid that may remain in the tube.
  • Chemical level detection sensors (137a, 137b, 138a, and 138b) are installed in the etching vessels, so that if the chemicals are insufficient, new chemicals can be automatically manufactured, or work can be interrupted for safety in case of overproduction.
  • the chemical level detection sensors 139a and 139b are also provided in the supply vessels 133 and 134 so that an alarm can be provided when the chemical level becomes below a certain level.
  • chemical preparation of a scan solution and an etchant for analysis, supply to a scan nozzle, transfer of a sample solution after scanning, and the like may be completely performed. Maintaining and replenishing chemicals, calibrating the analyzer, maintaining sensitivity, maintaining performance, cleaning channels, and recycling monitor wafers can all be done in a single device completely automatically.
  • in-line monitoring becomes possible in a substrate manufacturing process, and is closed sampling. As it is operated as a system, there are no safety problems or cross contamination problems in chemical handling, and it has the effect of enabling real-time or rapid response.

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Abstract

La présente invention porte sur un dispositif d'analyse de contaminant de substrat, qui est un dispositif d'analyse de contaminant de substrat destiné à transférer une solution de dosage, qui est balayée au moyen d'une buse de balayage sur un substrat qui doit être analysé, depuis la buse de balayage jusqu'à un analyseur grâce à un trajet d'écoulement, ledit dispositif comprenant : un tube à échantillons ayant un espace dans lequel la solution de dosage doit être chargée; et une valve de commutation, couplée au tube à échantillons, ayant au moins une position de charge où la solution de dosage est chargée dans le tube à échantillons, et une position d'injection à partir de laquelle la solution de dosage chargée est injectée vers l'analyseur, le dispositif d'analyse de contaminant de substrat comprenant des intervalles gazeux devant et derrière la solution de dosage lorsque la solution de dosage est chargée dans le tube à échantillons, et comprenant en outre un capteur de détection, installé dans le tube à échantillons, destiné à détecter les intervalles gazeux de façon distincte de la solution de dosage.
PCT/KR2016/002376 2015-03-12 2016-03-10 Dispositif d'analyse de contaminant de substrat et procédé d'analyse de contaminant de substrat WO2016144107A1 (fr)

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CN202210114028.2A CN114464546A (zh) 2015-03-12 2016-03-10 基板污染物分析装置及基板污染物分析方法
CN201680015283.4A CN107567652A (zh) 2015-03-12 2016-03-10 基板污染物分析装置及基板污染物分析方法

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KR10-2015-0034647 2015-03-12
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KR1020150034644A KR101548632B1 (ko) 2015-03-12 2015-03-12 기판 오염물 분석 장치 및 기판 오염물 분석 방법
KR1020150034647A KR101581303B1 (ko) 2015-03-12 2015-03-12 기판 오염물 분석 장치 및 기판 오염물 분석 방법
KR10-2015-0085305 2015-06-16
KR1020150085305A KR102357431B1 (ko) 2015-03-12 2015-06-16 기판 오염물 분석 장치 및 기판 오염물 분석 방법

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107845585A (zh) * 2016-09-20 2018-03-27 非视觉污染分析科学技术有限公司 在线污染监测系统及方法
CN108885186A (zh) * 2017-03-07 2018-11-23 株式会社理学 样品回收装置、样品回收方法及使用它们的荧光x射线分析装置
CN110987584A (zh) * 2019-11-25 2020-04-10 湖南省计量检测研究院 溶液的稀释方法和系统
JP2021522505A (ja) * 2018-05-04 2021-08-30 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 処理チャンバのためのナノ粒子測定

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115932163A (zh) * 2021-08-10 2023-04-07 江苏鲁汶仪器股份有限公司 一种边缘扫描装置及金属沾污检测设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060071490A (ko) * 2004-12-22 2006-06-27 엘지.필립스 엘시디 주식회사 카세트 세정장치
KR100860269B1 (ko) * 2008-02-29 2008-09-25 주식회사 위드텍 단일 웨이퍼 공정에서의 웨이퍼 세정액 온라인 모니터링방법, 웨이퍼 세정액 온라인 모니터링 장치 및 상기 장치에사용되는 시약 용기
JP2009011919A (ja) * 2007-07-03 2009-01-22 Tokyo Ohka Kogyo Co Ltd 洗浄装置、洗浄方法、予備吐出装置、塗布装置及び予備吐出方法
KR101210295B1 (ko) * 2012-08-31 2013-01-14 글로벌게이트 주식회사 기판 오염물 분석 장치 및 이를 이용한 오염물 분석 방법
KR101368485B1 (ko) * 2012-09-28 2014-03-03 주식회사 위드텍 초순수용액 온라인 모니터링 시스템

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68924758T2 (de) * 1988-11-21 1996-05-02 Toshiba Kawasaki Kk Vorrichtung zum Behandeln von Halbleitern.
JP3116871B2 (ja) * 1997-09-03 2000-12-11 日本電気株式会社 半導体基板表面分析の前処理方法及びその装置
US5960129A (en) * 1997-12-22 1999-09-28 Bayer Corporation Method and apparatus for detecting liquid and gas segment flow through a tube
JP4664818B2 (ja) * 2004-01-29 2011-04-06 有限会社Nas技研 基板検査装置と基板検査方法と回収治具
TWI529833B (zh) * 2009-12-18 2016-04-11 埃耶士股份有限公司 基板分析裝置及基板分析方法
KR101242246B1 (ko) * 2011-03-21 2013-03-11 주식회사 엘지실트론 웨이퍼 오염 측정장치 및 웨이퍼의 오염 측정 방법
KR101497641B1 (ko) * 2013-05-28 2015-03-03 엔비스아나(주) 시료 샘플링 장치, 시료 샘플링 방법 및 시료 샘플링 분석 시스템

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060071490A (ko) * 2004-12-22 2006-06-27 엘지.필립스 엘시디 주식회사 카세트 세정장치
JP2009011919A (ja) * 2007-07-03 2009-01-22 Tokyo Ohka Kogyo Co Ltd 洗浄装置、洗浄方法、予備吐出装置、塗布装置及び予備吐出方法
KR100860269B1 (ko) * 2008-02-29 2008-09-25 주식회사 위드텍 단일 웨이퍼 공정에서의 웨이퍼 세정액 온라인 모니터링방법, 웨이퍼 세정액 온라인 모니터링 장치 및 상기 장치에사용되는 시약 용기
KR101210295B1 (ko) * 2012-08-31 2013-01-14 글로벌게이트 주식회사 기판 오염물 분석 장치 및 이를 이용한 오염물 분석 방법
KR101368485B1 (ko) * 2012-09-28 2014-03-03 주식회사 위드텍 초순수용액 온라인 모니터링 시스템

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107845585A (zh) * 2016-09-20 2018-03-27 非视觉污染分析科学技术有限公司 在线污染监测系统及方法
CN107845585B (zh) * 2016-09-20 2021-07-16 非视觉污染分析科学技术有限公司 在线污染监测系统及方法
CN108885186A (zh) * 2017-03-07 2018-11-23 株式会社理学 样品回收装置、样品回收方法及使用它们的荧光x射线分析装置
CN108885186B (zh) * 2017-03-07 2019-11-12 株式会社理学 样品回收装置、样品回收方法及使用它们的荧光x射线分析装置
JP2021522505A (ja) * 2018-05-04 2021-08-30 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 処理チャンバのためのナノ粒子測定
JP7228600B2 (ja) 2018-05-04 2023-02-24 アプライド マテリアルズ インコーポレイテッド 処理チャンバのためのナノ粒子測定
CN110987584A (zh) * 2019-11-25 2020-04-10 湖南省计量检测研究院 溶液的稀释方法和系统
CN110987584B (zh) * 2019-11-25 2022-07-01 湖南省计量检测研究院 溶液的稀释方法和系统

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