WO2016143985A1 - Pâte conductrice - Google Patents

Pâte conductrice Download PDF

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Publication number
WO2016143985A1
WO2016143985A1 PCT/KR2015/013544 KR2015013544W WO2016143985A1 WO 2016143985 A1 WO2016143985 A1 WO 2016143985A1 KR 2015013544 W KR2015013544 W KR 2015013544W WO 2016143985 A1 WO2016143985 A1 WO 2016143985A1
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WO
WIPO (PCT)
Prior art keywords
fusion
metal particles
metal
conductive paste
metal particle
Prior art date
Application number
PCT/KR2015/013544
Other languages
English (en)
Korean (ko)
Inventor
문종건
신명동
이규만
최인규
Original Assignee
(주)뉴옵틱스
유주티엔씨(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)뉴옵틱스, 유주티엔씨(주) filed Critical (주)뉴옵틱스
Publication of WO2016143985A1 publication Critical patent/WO2016143985A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the present invention relates to a conductive paste, and more particularly to a conductive paste with improved electrical properties.
  • the intaglio metal pattern is formed by filling a conductive paste.
  • the conductive paste is formed by dispersing metal particles in a binder.
  • the conductive paste is required to have excellent electrical conductivity and low resistance for the purpose of use, and it is difficult to realize a conductive paste having excellent electrical conductivity and low resistance because the metal particles dispersed in the binder have difficulty in forming a fixed form. .
  • the metal particles used in the conductive pastes are modified or mixed, and metal particles such as needles and rods are used, but this causes a problem of low productivity and increased production cost.
  • An object of the present invention is to provide a conductive paste that can improve the electrical properties while solving the problems of the prior art.
  • the conductive paste of the present invention for achieving the above object is a binder; And a plurality of metal particles, wherein the plurality of metal particles includes a metal particle fusion formed by fusion of at least two metal particles.
  • the number of metal particles constituting the metal particle fusion may be 2 or 3, the metal particle fusion may have a range of 85 to 95 parts by weight based on 100 weight of the total metal particles.
  • the metal particles may have a spherical shape, wherein the length of the metal particle fusion may range from 85 to 95% of the diameter sum length of the individual metal particles constituting the metal particle fusion. have.
  • the diameter of the spherical metal particles may have a range of 100 to 400nm.
  • the method further includes spherical nanoparticles formed by fusion to the metal particle fusion, wherein the diameter of the spherical nanoparticles is 1/10 of the diameter of the individual metal particles constituting the metal particle fusion. And may range from 1/3 to 1/3. In addition, the content of the nanoparticles may have a range of 15 to 30 parts by weight based on 100 weight of the total metal particles.
  • the present invention derived to solve the problems of the prior art as described above can achieve excellent electrical properties with a conductive paste comprising a metal particle fusion fused metal particles to each other.
  • FIG. 1 is a view showing a metal particle fusion fused two metal particles according to an embodiment of the present invention.
  • FIG. 2 is a view showing a metal particle fusion fused three metal particles according to an embodiment of the present invention.
  • FIG. 3 is a view showing nanoparticles formed by fusion to a metal particle fusion according to an embodiment of the present invention.
  • the conductive paste is meant to include a binder and a plurality of metal particles, and a known material which plays an electrically conductive role regardless of names such as conductive ink and conductive paste is included in the scope of the present invention.
  • the metal particles may use various metal particles such as Ag, Cu, Ni, Al, Co, Cr, Mn, and composites thereof, and the composite includes a core-shell structure.
  • metal particles such as Ag, Cu, Ni, Al, Co, Cr, Mn, and composites thereof, and the composite includes a core-shell structure.
  • spherical Ag particles can be used.
  • the binder may be a polymer resin in which metal particles are dispersed to form a conductive paste, a surfactant-based dispersant to secure dispersibility of the conductive material, an additive to improve the viscosity, flowability, and the like of the resin, Means all components except metal particles, such as an oligomer, a monomer, a hardening
  • the polymer resin may be one or more of cellulose resin, acrylic resin, or epoxy resin, but is not limited thereto. In addition, various polymer resins may be used.
  • the conductive paste may include one or more of heat curable oligomers or heat curable monomers that react with heat such that the conductive paste may be heat cured.
  • the thermosetting oligomer may be at least one member selected from the group consisting of acrylic oligomers, metaacryl oligomers, acrylic carboxylate acrylates, epoxy acrylate oligomers (epoxy acrylate copolymers), polyester acrylate oligomers and urethane acrylate oligomers.
  • the present invention is not limited thereto, and various kinds of heat curable oligomers may be used.
  • thermosetting monomer is methyl methacrylate, ethyl methacrylate, tricyclodecane dimethanol dimethacrylate, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobornyl acrylate, acryloyloxyethyl Succinate, phenoxyethylene glycol acrylate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, hydroxyoxy acrylate, diethylene glycol dimethacrylate, aryl methacrylate, ethylene glycol dimethacrylate, Diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, glycerol dimethacrylate, pentamethyl giperidyl methacrylate, lauryl acrylate, tetrahydrofurfuryl acrylate Hydroxy ethyl acrylate, Ethoxy propyl acrylate, is
  • the conductive paste according to an embodiment of the present invention may further include a curing agent.
  • the curing agent is a material cured in response to heat so that the conductive paste according to the present embodiment may be heat cured, and may include 0.5 to 5 wt%.
  • the curing agent may be selected from one or more selected from the group consisting of azobis-based initiators, benzoyl peroxides, and triphenyl methyl chloride, and when the curing agent is less than 0.5% by weight, sufficient curing may not be performed, resulting in problems in adhesion and conductive path formation. There can be.
  • the plurality of metal particles may include a metal particle fusion formed by fusion of at least two or more metal particles.
  • fusion can be applied to various known fusion methods.
  • the mutual fusion of the metal particles is preferably formed by thermal fusion. As illustrated in FIGS. 1 and 2, outer surfaces of two or three metal particles may be melted in heat to be fused to each other.
  • Table 1 below is a result of testing the resistance value of the conductive sheet prepared by using a conductive paste in which the Ag particle fusion formed by heat fusion of a general spherical Ag particle and a spherical Ag particle is dispersed. Only the fusion of Ag particles was different only, the total content of Ag particles was the same, and all the conditions of the test were the same to measure the resistance value. Ag particle fusion was used in which 2 to 5 Ag particles are fused.
  • the lower resistance value using the fused metal particle fusion 100 not only increases the unit area of the fusion due to fusion, but also the chemical reaction between metal particles because the surface of the metal particles melts to form a fusion by thermal fusion.
  • the electrical flow is better than the coupling by and may have a low resistance value.
  • Table 2 shows the difference in resistance values according to the number of individual metal particles forming the metal particle fusion 100.
  • the metal particle fusion 100 may be formed by thermal fusion as mentioned above.
  • the spherical metal particles may be placed in a crucible and then heated to 100 to 200 ° to form a thermally fused metal particle fusion 100.
  • the formed metal particle fusion 100 may apply only vibration to the filtering device having a mesh shape to filter only the metal particle fusion 100 fused with two or three.
  • the length D of the metal particle fusion may be formed to be 85 to 95% of the diameter sum length R1 + R2 of the individual metal particles constituting the metal particle fusion. As shown in FIG. 1, when two metal particles are fused, virtual common regions (hatched portions) extending from the outer surface of the metal particles are fused together to form a metal particle fusion. If the length D of the metal particle fusion exceeds 95% of the original diameter sum length (R1 + R2) of the individual metal particles, that is, the width G of the common area is 5% of the sum length (R1 + R2).
  • the length (D) of the metal particle fusion 100 is less than 85%, that is, the width (G) of the common area summation length If it exceeds 15% of (R1 + R2), the heating temperature is increased by that much, and the possibility of forming three or more metal particle fusions in one mass increases.
  • the diameter (R1 or R2) of the metal particles, the length (D) of the metal particle fusion and the width (G) of the common region is calculated as a straight line passing through the inner center points (C) of the sphere.
  • the width of the common region may be formed from 5% to 15% of the sum of the lengths of the individual metal particle diameters R1 + R2.
  • the diameter R1 or R2 of the spherical metal particles forming the metal particle fusion 100 may be 100 to 400 nm. If it is less than 100nm, it is difficult to control the length (D) of the metal particle fusion 100 during thermal fusion, and if it exceeds 400nm, the resistance value is high and the surface area is large, which increases the possibility of agglomeration during thermal fusion, resulting in low productivity There is a problem.
  • the present invention may further include a nanoparticle 200 is formed by fusion to the metal particle fusion (100).
  • Nanoparticles 200 in the present invention refers to nanoparticles of metal smaller than the size of the individual metal particles of the metal particle fusion (100).
  • the nanoparticles 200 also have a spherical shape.
  • the diameter of the nanoparticles 200 is preferably 1/10 to 1/3 of the diameter (R1 or R2) of the individual metal particles.
  • Table 3 below shows the resistance value and the resistance value measured after the bendability test according to the size of the nanoparticles 200.
  • the individual metal particles forming the metal particle fusion 100 were 300 nm in diameter, and the length (D) of the metal particle fusion 100 was adjusted to be 90% of the sum of the individual metal particle diameters (R1 + R2).
  • the content of the nanoparticles 100 was 20 parts by weight based on 100 parts by weight of the total metal particles including the metal particle fusion 100 was tested.
  • the conductive sheet prepared by filling and sintering the conductive paste including the metal particle fusion material 100 and the nanoparticles 200 in a negative pattern was rolled to a spherical shape having a diameter of about 5 cm. After the resistance value was measured. And the metal particle fusion 100 and nanoparticles 200 used in this test used Ag particles.
  • the nanoparticles 200 may have low resistance values when they are 1/10 to 1/3 of the diameters of the individual metal particles, and may maintain electrical characteristics when applied to flexible electronic devices. .
  • the content of the nanoparticles 200 is preferably 15 to 30 parts by weight based on 100 parts by weight of the total metal particles. If it is less than 15 parts by weight, the resistance value fluctuation range after the bendability test becomes large, and if it exceeds 30 parts by weight, the effect width of the resistance improvement is insufficient.
  • the nanoparticles 200 fused and formed on the metal particle fusion 100 are the same as the method for manufacturing the metal particle fusion 200 mentioned above. That is, the nanoparticles 200 may be prepared by dispersing the nanoparticles 200 using a dispersing apparatus so that the metal particle fusion 100 may be placed in a crucible and evenly disposed throughout the metal particle fusion.
  • the nanoparticles 200 formed by being fused to the metal particle fusion 100 or the metal particle fusion 100 described above become a component of the conductive paste together with the binder.
  • the conductive paste may fill a sheet on which the intaglio pattern is formed to serve as a conductive sheet having electrical conductivity.
  • Such a conductive sheet is preferably used as a sensor electrode of a touch panel requiring high electrical conductivity and low resistance. Of course, it can be applied to other electronic devices.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne une pâte conductrice capable d'améliorer des caractéristiques électriques, la pâte conductrice comportant un liant et une pluralité de particules métalliques, la pluralité de particules métalliques comprenant une fusion de particules métalliques qui est formée par la fusion d'au moins deux particules métalliques.
PCT/KR2015/013544 2015-03-06 2015-12-10 Pâte conductrice WO2016143985A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0031634 2015-03-06
KR1020150031634A KR101773400B1 (ko) 2015-03-06 2015-03-06 전도성 페이스트

Publications (1)

Publication Number Publication Date
WO2016143985A1 true WO2016143985A1 (fr) 2016-09-15

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ID=56880152

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/013544 WO2016143985A1 (fr) 2015-03-06 2015-12-10 Pâte conductrice

Country Status (2)

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KR (1) KR101773400B1 (fr)
WO (1) WO2016143985A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145618A (ja) * 1997-06-18 1999-02-16 Internatl Business Mach Corp <Ibm> 導電ペースト構造およびその製造方法
WO2008048207A2 (fr) * 2005-07-08 2008-04-24 General Electric Company Adhésifs électriquement conducteurs
WO2009090915A1 (fr) * 2008-01-17 2009-07-23 Nichia Corporation Procédé de production d'un matériau conducteur, matériau conducteur obtenu grâce au procédé, dispositif électronique contenant le matériau conducteur, dispositif électroluminescent, et procédé de fabrication d'un dispositif électroluminescent
KR101067353B1 (ko) * 2008-09-05 2011-09-23 팀켐 컴퍼니 이방성 도전성 물질
KR20120022846A (ko) * 2009-07-21 2012-03-12 니치아 카가쿠 고교 가부시키가이샤 도전성 재료의 제조 방법, 그 방법에 의해 얻어진 도전성 재료, 그 도전성 재료를 포함하는 전자 기기 및 발광 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145618A (ja) * 1997-06-18 1999-02-16 Internatl Business Mach Corp <Ibm> 導電ペースト構造およびその製造方法
WO2008048207A2 (fr) * 2005-07-08 2008-04-24 General Electric Company Adhésifs électriquement conducteurs
WO2009090915A1 (fr) * 2008-01-17 2009-07-23 Nichia Corporation Procédé de production d'un matériau conducteur, matériau conducteur obtenu grâce au procédé, dispositif électronique contenant le matériau conducteur, dispositif électroluminescent, et procédé de fabrication d'un dispositif électroluminescent
KR101067353B1 (ko) * 2008-09-05 2011-09-23 팀켐 컴퍼니 이방성 도전성 물질
KR20120022846A (ko) * 2009-07-21 2012-03-12 니치아 카가쿠 고교 가부시키가이샤 도전성 재료의 제조 방법, 그 방법에 의해 얻어진 도전성 재료, 그 도전성 재료를 포함하는 전자 기기 및 발광 장치

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Publication number Publication date
KR101773400B1 (ko) 2017-10-13
KR20160108759A (ko) 2016-09-20

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