WO2016130033A1 - Multi-layer thermal conductive panel on a floor with floor heating - Google Patents

Multi-layer thermal conductive panel on a floor with floor heating Download PDF

Info

Publication number
WO2016130033A1
WO2016130033A1 PCT/PL2016/000015 PL2016000015W WO2016130033A1 WO 2016130033 A1 WO2016130033 A1 WO 2016130033A1 PL 2016000015 W PL2016000015 W PL 2016000015W WO 2016130033 A1 WO2016130033 A1 WO 2016130033A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
heat
carrier layer
floor
panel
Prior art date
Application number
PCT/PL2016/000015
Other languages
French (fr)
Inventor
Jerzy Stachowicz
Jarosław OĆWIEJA
Original Assignee
Jerzy Stachowicz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jerzy Stachowicz filed Critical Jerzy Stachowicz
Publication of WO2016130033A1 publication Critical patent/WO2016130033A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/148—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor with heat spreading plates
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
    • E04F15/041—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/08—Flooring or floor layers composed of a number of similar elements only of stone or stone-like material, e.g. ceramics, concrete; of glass or with a top layer of stone or stone-like material, e.g. ceramics, concrete or glass
    • E04F15/082—Flooring or floor layers composed of a number of similar elements only of stone or stone-like material, e.g. ceramics, concrete; of glass or with a top layer of stone or stone-like material, e.g. ceramics, concrete or glass with a top layer of stone or stone-like material, e.g. ceramics, concrete or glass in combination with a lower layer of other material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/141—Tube mountings specially adapted therefor
    • F24D3/142—Tube mountings specially adapted therefor integrated in prefab construction elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
    • E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2220/00—Components of central heating installations excluding heat sources
    • F24D2220/20—Heat consumers
    • F24D2220/2081—Floor or wall heating panels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the subject matter of an invention is a muiti-!ayer thermal conductive panel on a floor with floor heating, assembled on a layer with a built-in surface heat source.
  • multi-layer conductive panel according to this invention contains the surface layer and the carrier layer made of non-absorbent, wood-based, standard hardboard.
  • the essence of the invention is that between the carrier layer and the surface layer it has the heating plate pasted to which flat bar fronts constituting heat-pipes are adjoined from the side of the carrier layer.
  • Heat pipe flats are put in and pasted into the transverse crevices cut in the carrier layer paraliel to the longer sides and with a length smaller than them, and with ends placed at equal distances from the perpendicular sides of the panel.
  • the heat plate and heat-pipes are made of material with a high heat conductivity coefficient, especially aluminium or magnesium alloy.
  • the material from which the carrier layer is made is characterized by high heat absorption capability, approx. 2000 J/kgK and a low heat conductivity coefficient ⁇ ⁇ 0.4.
  • boundary clip is a joint made along all four side walls of the carrier layer and a coupling strip is made of hard, non-absorbent material, especially plastics.
  • the panel heats evenly on its whole surface.
  • the passive metal heating plate connected with the carrier and surface layer by a waterproof adhesive bond constitutes a very effective hydrophobic barrier. This allows for safe heating of the panel up to a temperature of 33°C without a risk of excessive dryness and, consequently, for forming structural changes in the surface layer under heating conditions, for example in the bathroom.
  • Advantageous are effects obtained in the scope of use, operational heat flow through the panel.
  • Fig. 1 presents a vertical section perpendicular to the longer sides
  • Fig. 2 - top view presents a vertical section perpendicular to the longer sides
  • Fig. 3 presents a bottom view of the panel.
  • the multi-layer panel according to the exemplary performance of the invention is a flat cuboidal solid with a structure determined by bonding with polyurethane adhesive for wood in the D4 water resistance class: the carrier layer 1 , the heating plate 4, the heat pipes 5 and the surface layer 3.
  • Carrier layer 1 is made of wood-based standard hardboard 8 mm thick, destined to carry loads in humid conditions, produced by SEICO company, type: HB.HLA1- process T2.
  • the plate is characterized by ⁇ ⁇ 0.4 W/(mK) heat conductivity coefficient and the heat accumulation capacity of 2000 J / (kgK).
  • the boundary clips 2 have been made in the form of channels with a width of 3.5 and a depth of 8 mm and placed with a movement nearby the upper surface.
  • the plate In the upper surface, the plate has been longitudinally cut by three crevices with a width of 3.5 mm, with intervals between perpendicular sides having 30 mm maintained.
  • the adhesion to the aluminum plate having a thickness of 2 mm and the carrier layer 1 having dimensions 140 x 700 mm has been made using thin adhesive bond having a high heat transfer coefficient - three aluminium flats with a width of 3 mm and a height of 8.5 mm, which are heat pipes 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Central Heating Systems (AREA)
  • Floor Finish (AREA)

Abstract

A panel is assembled on a layer with a built-in surface heat source; it contains a carrier layer (1) made of non-absorbent, wood- based, standard hardboard and its upper surface consists of a surface layer (3) made of wooden, wooden-based lamella, terracotta, ceramic or stone plate. Between the carrier layer (1) and the surface layer (3), it has a heating plate (4) pasted to which fiat fronts constituting heat-pipes (5) are adjoined from the side of the carrier layer (1), which are put in and pasted into transverse crevices, cut in the carrier layer (1) parallel to the longer sides and with a length smaller than them, and with ends placed at equal distances from the perpendicular sides of the panel. The heat plate (4) and the heat-pipes (5) are made of high heat conductivity coefficient material, especially aluminium or magnesium alloy, while the material from which the carrier layer (1) is made is characterized by high heat absorption capability, approx. 2000 J/kgK and low heat conductivity coefficient λ < 0.4.

Description

Multi-layer thermal conductive panel on a
floor with floor heating
The subject matter of an invention is a muiti-!ayer thermal conductive panel on a floor with floor heating, assembled on a layer with a built-in surface heat source.
Commonly known are floor heating solutions for premises where panel covering is laid on a levelled layer with a built-in heat source in a form of a tubular coil of a liquid heat carrier rolled out on a surface or resistance cables or mats supplied by the electricity network. Floor panels are plate elements with a rectangular outline which connected with each other by boundary clips create floor covering which significantly participates in a basic function of carrying mechanical loads and distribution of concentrated forces and heat insulation and/or conducting, acoustic and damp-proof insulation. In order to provide comfort for people who stay in a room in floor heating conditions it is required that an average temperature of the surface layer be from 26 to 29°C and maximum 33°C in the bathroom. Materials and glues used in the panel have to present structural endurance in such heat load and variable humidity conditions. Available sandwich panel solutions made of non-absorbent, wood-based, standard hardboard whose upper layer consists of a surface layer from wooden or wood-based lamella, terracotta, ceramic or stone plate have quality restrictions concerning acceptable heating temperature up to 27°C. Their structure does not provide homogenization of the surface layer temperature area by surface heat distribution provided by a curvilinear system of spiral or meander coil.
As in the above description, multi-layer conductive panel according to this invention contains the surface layer and the carrier layer made of non-absorbent, wood-based, standard hardboard. The essence of the invention is that between the carrier layer and the surface layer it has the heating plate pasted to which flat bar fronts constituting heat-pipes are adjoined from the side of the carrier layer. Heat pipe flats are put in and pasted into the transverse crevices cut in the carrier layer paraliel to the longer sides and with a length smaller than them, and with ends placed at equal distances from the perpendicular sides of the panel. The heat plate and heat-pipes are made of material with a high heat conductivity coefficient, especially aluminium or magnesium alloy. On the other hand, the material from which the carrier layer is made is characterized by high heat absorption capability, approx. 2000 J/kgK and a low heat conductivity coefficient λ < 0.4.
It is advantageous when the boundary clip is a joint made along all four side walls of the carrier layer and a coupling strip is made of hard, non-absorbent material, especially plastics.
It is also beneficial when the bottom heat-pipe flat fronts are sticking out form the lower surface of the carrier layer equally to the thickness of the adhesive bond between the panel and the floor which contains the surface heat source.
According to the invention, by using the heating plate under the surface layer, the panel heats evenly on its whole surface. At the same time, the passive metal heating plate connected with the carrier and surface layer by a waterproof adhesive bond constitutes a very effective hydrophobic barrier. This allows for safe heating of the panel up to a temperature of 33°C without a risk of excessive dryness and, consequently, for forming structural changes in the surface layer under heating conditions, for example in the bathroom. Advantageous are effects obtained in the scope of use, operational heat flow through the panel. During the heating phase - low thermal resistance of transmission through heat-pipes - heat plate - surface layer of small tightness, and during the phase when the heat source is off - decrease in the temperature of the surface layer as a result of heat distribution in the carrier layer, extended over time.
In its description, the invention is similar to exemplary performance of the panel shown in a figure where Fig. 1 presents a vertical section perpendicular to the longer sides, Fig. 2 - top view and Fig. 3 - bottom view of the panel.
The multi-layer panel according to the exemplary performance of the invention, having externa! dimensions: width of 140 mm, length of 700 mm and total thickness of 13 mm, is a flat cuboidal solid with a structure determined by bonding with polyurethane adhesive for wood in the D4 water resistance class: the carrier layer 1 , the heating plate 4, the heat pipes 5 and the surface layer 3. Carrier layer 1 is made of wood-based standard hardboard 8 mm thick, destined to carry loads in humid conditions, produced by SEICO company, type: HB.HLA1- process T2. The plate is characterized by λ <0.4 W/(mK) heat conductivity coefficient and the heat accumulation capacity of 2000 J / (kgK). In four side wails of the plate cut in abovementioned dimensions, the boundary clips 2 have been made in the form of channels with a width of 3.5 and a depth of 8 mm and placed with a movement nearby the upper surface. In the upper surface, the plate has been longitudinally cut by three crevices with a width of 3.5 mm, with intervals between perpendicular sides having 30 mm maintained. In the next operation, the adhesion to the aluminum plate having a thickness of 2 mm and the carrier layer 1 having dimensions 140 x 700 mm has been made using thin adhesive bond having a high heat transfer coefficient - three aluminium flats with a width of 3 mm and a height of 8.5 mm, which are heat pipes 5. After the application of adhesive, such an aluminium element has been put in by the heat pipes 5 into the crevices of the carrier layer 1 and after pressing they have been rigidiy connected together. Further operations consisted of sticking the surface layer 3 made of oak wood with a thickness of 3 mm to the upper surface of the heating plate 4. Finally, after sanding, the surface layer 3 has been coated with floor varnish manufactured by Bona.
Measurements carried out on prototype panels with the surface layer with the thickness of 3 mm showed the following results connected with the panel's new structure: temperature differences at the surface of the wear layer not exceeding 0.5°C, and the thermal conductivity coefficient at the level of 0.82 W / (rnK).

Claims

Patent claims
1. A multi-layer thermai conductive pane! on a floor with floor heating, assembled on a layer with a built-in surface heat source, which contains a flat, cuboidai carrier layer (1) with shaped along the side walls a boundary clip (2) made of non-absorbent, wood- based, standard hardboard and whose upper layer consists of a surface layer (3) from wooden or wood-based iamella, terracotta, ceramic or stone piate characterized in that between the carrier layer (1) and the surface layer (3) it has a sticked in heating plate (4) to which from the side of the carrier layer (1) are adjoined flat fronts constituting heat-pipes (5) which are put in and pasted into the transverse crevices cut in the carrier layer (1) parallel to the longer sides and with a length smaller than them and with ends placed at equal distances from the perpendicular sides of the panel where the heat plate (4) and heat-pipes (5) are made of high heat conductivity coefficient material, especially aluminium or magnesium alloy, while the material from which is made the carrier iayer (1) is characterized by high heat absorption capability, approx. 2000 J/kgK and a low heat conductivity coefficient λ < 0.4.
2. The panel according to Claim no. 1 , characterized in that the boundary clip (2) is a joint made along all four side walls of the carrier layer (1) and a strip is made of hard, non-absorbent material, especially synthetic materials.
3. The panel according to Claim no. 1 , characterized in that the lower flat fronts of the heat pipes (5) are sticking out from the lower surface of the carrier layer (1) at a dimension (a) equal to the adhesive bond thickness between the panel and the floor containing the surface heat source.
PCT/PL2016/000015 2015-02-13 2016-02-11 Multi-layer thermal conductive panel on a floor with floor heating WO2016130033A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PL411273A PL411273A1 (en) 2015-02-13 2015-02-13 Multi-layered thermally conductive panel for the floor warming system
PLP.411273 2015-02-13

Publications (1)

Publication Number Publication Date
WO2016130033A1 true WO2016130033A1 (en) 2016-08-18

Family

ID=55538571

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/PL2016/000015 WO2016130033A1 (en) 2015-02-13 2016-02-11 Multi-layer thermal conductive panel on a floor with floor heating

Country Status (2)

Country Link
PL (1) PL411273A1 (en)
WO (1) WO2016130033A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106677483A (en) * 2017-01-10 2017-05-17 邢台垠通新能源科技开发有限公司 Infrared heating floor
WO2019155007A1 (en) * 2018-02-09 2019-08-15 Ilo Technology Method for the production of a component of a modular radiating false-ceiling component, corresponding component and corresponding false ceiling

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110243004A (en) * 2019-06-13 2019-09-17 四川赛特威斯科技有限公司 A kind of thin formula floor heating mounting structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1982001058A1 (en) * 1980-09-12 1982-04-01 R Jacobsen Device for use in plants for heating or cooling of room-limiting surfaces
US4865120A (en) * 1988-02-26 1989-09-12 Shigetomo Shiroki Floor structure for heating
US6009612A (en) * 1996-11-12 2000-01-04 Fiedrich; Joachim Apparatus for attaching radiating plate to holders of modular unit for radiant floor and wall hydronic heating systems
DE20110201U1 (en) * 2001-06-19 2001-10-31 Reinhold Guenter Drywall system for surface heating or cooling

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1982001058A1 (en) * 1980-09-12 1982-04-01 R Jacobsen Device for use in plants for heating or cooling of room-limiting surfaces
US4865120A (en) * 1988-02-26 1989-09-12 Shigetomo Shiroki Floor structure for heating
US6009612A (en) * 1996-11-12 2000-01-04 Fiedrich; Joachim Apparatus for attaching radiating plate to holders of modular unit for radiant floor and wall hydronic heating systems
DE20110201U1 (en) * 2001-06-19 2001-10-31 Reinhold Guenter Drywall system for surface heating or cooling

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106677483A (en) * 2017-01-10 2017-05-17 邢台垠通新能源科技开发有限公司 Infrared heating floor
WO2019155007A1 (en) * 2018-02-09 2019-08-15 Ilo Technology Method for the production of a component of a modular radiating false-ceiling component, corresponding component and corresponding false ceiling
FR3077870A1 (en) * 2018-02-09 2019-08-16 Ilo COMPONENT OF A MODULAR RADIANT CEILING AND CORRESPONDING CEILING.

Also Published As

Publication number Publication date
PL411273A1 (en) 2016-08-16

Similar Documents

Publication Publication Date Title
US20190040626A1 (en) Layered insulation system
US20160192443A1 (en) Support structure for electric cables of a surface heater
US20100089899A1 (en) Heatable covering system
WO2016130033A1 (en) Multi-layer thermal conductive panel on a floor with floor heating
US20090014152A1 (en) Hydronic floor heating system with adaptive fluid circuit
US20150135623A1 (en) Systems, devices, and methods of an insulated panel structure
CN102661023B (en) Metal heat-conduction enhanced floor
EP1055087B1 (en) Floor heating device with self-regulating cable
KR101284739B1 (en) Warm-water floor
CN204693575U (en) A kind of Graphene heat conducting floor
NL7900711A (en) FLOOR UNIT.
JP3826244B2 (en) Heated floor panel
GB2440204A (en) Acoustic flooring for underfloor heating
DE202017106881U1 (en) Electric underfloor heating
CN204043094U (en) A kind of cold and hot radiation air-conditioner module
EP3502574A1 (en) Improvements in flooring systems
DE20020483U1 (en) Insulation system and edge strips for the thermal and / or acoustic insulation of an insulation system
CA2906554A1 (en) Support structure for electric cables of a surface heater
SE1650446A1 (en) Building construction arrangement and method for installing a heating or cooling system
JPH03175216A (en) Soft flooring heating panel
JP3115837U (en) Floor heating panel
GB2460420A (en) Heat transfer panel with reinforcing layer
CN203771512U (en) A capillary pipe net floor heating system
CN203464376U (en) Capillary network floor heating system
EP3666993A1 (en) Multilayer floor covering

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16710339

Country of ref document: EP

Kind code of ref document: A1

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16710339

Country of ref document: EP

Kind code of ref document: A1