CN110243004A - A kind of thin formula floor heating mounting structure - Google Patents
A kind of thin formula floor heating mounting structure Download PDFInfo
- Publication number
- CN110243004A CN110243004A CN201910509254.9A CN201910509254A CN110243004A CN 110243004 A CN110243004 A CN 110243004A CN 201910509254 A CN201910509254 A CN 201910509254A CN 110243004 A CN110243004 A CN 110243004A
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- China
- Prior art keywords
- parts
- floor heating
- mounting structure
- layer
- heating
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Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/02—Arrangement of mountings or supports for radiators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
Abstract
The invention discloses a kind of thin formula floor heating mounting structures, it is related to floor heating mounting structure technical field, by using the ground decoration layer, the heat sink of heating special bonding agent connection and the thin formula floor heating mounting structure of insulating layer for including ceramic thin plate material, the thickness of construction finished surface is set to save 50% or more, the excellent results of " three, which subtract one, adds " can be played, wherein " three subtract " specifically: reduction floor heating energy consumption, reduction house layer height are lost and reduce the integral construction period, " one adds " as increase floor heating heating efficiency.
Description
Technical field
The present invention relates to floor heating mounting structure technical fields, and in particular to a kind of thin formula floor heating mounting structure.
Background technique
Floor heating is abbreviation of the floor by radiant heating, and the most frequently used at present is water floor heating.Water floor heating refers to be pacified under floor
Thin hot water pipeline is filled, so that it is constantly distributed heat to the interior space by injecting the continuous reflux cycle of low-temperature water heating in pipeline
Floor.Compared with air-conditioning adjusts room temperature, be laid with the room on the floor of floor heating from bottom to top with the increase of height, temperature by
Step decline warms up a cool comfort to ethnic group foot, and the physiology for being more in line with human body is earnestly hoped;Compared with heating heating, interior is taken
Disappeared radiator and its branch pipe, increases indoor net usable floor area, easily facilitates the arrangement of indoor finishing and household.
Ground heating floor mainly uses wet type paving method at present, ground heating floor structure from top to bottom respectively by ground decoration layer,
Cement mortar screeding layer, in-situ layer, protective layer, heat insulation layer (insulation board) and damp-proof layer composition.This ground heater laying is complex,
Laying structure is thicker, and the fixation of hot-water heating pipe and the accuracy of layout path depend entirely on the good of on-site personnel construction technology
It is bad.It since stone material is easy to expand with heat and contract with cold, cannot be laid immediately on water floor heating, need to be laid with water between floor heating pipe and floor
Cement mortar, cement mortar condensation hardening could be laid with stone floor surface layer after reaching some strength, therefore construction speed is slower.
In addition to this, heat is transmitted to ground decoration layer by heat-conducting medium layer layer by layer, is easy to produce local heating in transmittance process
Unevenness, heat up low efficiency, the big problem of energy consumption, and layer height loss in house is big, and house is easily made to generate sense of depression.
Summary of the invention
It is an object of the invention to: a kind of thin formula floor heating mounting structure and preparation method thereof is provided, existing wet type is solved
Paving method construction speed is slower, and heat is transmitted to ground decoration layer in transmittance process, through heat-conducting medium layer layer by layer, is easy to produce
Raw local heating is uneven, and heat up low efficiency, the big problem of energy consumption, and layer height loss in house is big, easily generates house and constrains
Sense.
The technical solution adopted by the invention is as follows:
A kind of thin formula floor heating mounting structure, including ground decoration layer, heat sink and the insulating layer set gradually from top to bottom,
The insulating layer is set on concrete building board finish, and the heat sink is equipped with several U-lags, and the U-lag is embedded in guarantor
In warm layer, floor heating water pipe is equipped in the U-lag, the material of the ground decoration layer is ceramic thin plate, the ground decoration layer
It is adhered on heat sink by heating special bonding agent, the heat sink is coated on insulating layer, the heating special bonding
Agent includes the component of following parts by weight: 50-55 parts of special cement, 3-5 parts of quartz sand, 5-10 parts of cellulose ether, redispersible
5-10 parts of latex powder, 5-8 parts of plasticiser and 3-5 parts of starch ether.
Further, the heating special bonding agent includes the component of following parts by weight: 52 parts of special cement, quartz sand
4 parts, 8 parts of cellulose ether, 6 parts of redispersable latex powder, 6 parts of plasticiser and 4 parts of starch ether.
Further, the ground decoration layer with a thickness of 4-6mm, optimal selection 5.5mm.
Further, the material of the heat sink is aluminum substrate.
Further, the heat sink and the overall thickness of heating special bonding agent are 10mm.
Further, the insulating layer with a thickness of 30-40mm, optimal selection 30mm.
Further, the firing press of the ground decoration layer is 10000 tons, and firing temperature is 1230 DEG C.
In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:
1. floor heating mounting structure of the invention is without reheating ground dress after additionally heating to cement mortar screeding layer
Exterior material, and the used more conventional use of floor decorative material of ground decoration layer such as slabstone are more light for traditional ceramic tile
It is thin, i.e., make 30% or more the efficiency raising that heats up by reducing the thickness of thermally conductive interlayer and Heat Conduction Material.
2. floor heating is cold operation, heating coolant-temperature gage is 50-60 DEG C, and operation energy consumption is thermally conductive in initial heating pipeline
Energy consumption highest when medium, energy consumption when being significantly larger than operation such as energy consumption of the automobile in starting are of the present invention thin
Formula floor heating mounting structure is less compared with heating interlayer thickness and quantity for conventional mounting structure, can play and reduce the useless energy
The effect of consumption reduces the time of high energy consumption operation, achievees the effect that energy-efficient.
3. thin formula floor heating mounting structure of the present invention compared with can make for conventional mounting structure house layer height be lost
Reduce 40% or more.
4. thin formula floor heating mounting structure of the present invention is substituted in conventional mounting structure with heating special bonding agent
Cement mortar, dosage is less, and molding is faster, it is possible to reduce the period of integral construction.
5. the more traditional ceramic tile of ceramic thin plate of the present invention is lighter and thinner, worker relatively more saves in work progress
Power reduces the construction time to improve construction efficiency.
6. thin formula floor heating mounting structure of the present invention is simple compared with structure for conventional mounting structure, easy for installation,
Cost is lower, and application prospect is wide.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention;
In the figure, it is marked as 1- ground decoration layer, 2- heat sink, 3- insulating layer, 4-U shape slot, 5- floor heating water pipe, 6- heating are special
Use bonding agent.
Specific embodiment
1 technical solution in the embodiment of the present invention that following will be combined with the drawings in the embodiments of the present invention carries out clear and complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Embodiment 1
A kind of thin formula floor heating mounting structure, including the ground decoration layer 1, heat sink 2 and heat preservation set gradually from top to bottom
Layer 3, the insulating layer 3 are set on concrete building board finish, and the heat sink 2 is equipped with several U-lags 4, the U-lag 4
It is embedded in insulating layer 3, floor heating water pipe 5 is equipped in the U-lag 4, the material of the ground decoration layer 1 is ceramic thin plate, institute
Ground decoration layer 1 to be stated to be adhered on heat sink 2 by heating special bonding agent 6, the heat sink 2 is coated on insulating layer 3,
The component of the heating special bonding agent 6 including following parts by weight: 52 parts of special cement, 4 parts of quartz sand, 8 parts of cellulose ether,
6 parts of redispersable latex powder, 6 parts of plasticiser and 4 parts of starch ether.
The ground decoration layer 1 with a thickness of 5.5mm, the overall thickness of the heat sink 2 and bonding agent is 10mm, the guarantor
Warm layer 3 with a thickness of 30mm, i.e., the overall thickness of entire thin formula floor heating mounting structure is 45.5mm, and traditional floor heating mounting structure
In, under normal circumstances, ground decoration layer 1 with a thickness of 10mm, cement mortar screeding layer with a thickness of 10mm, the thickness of in-situ layer
For 30mm, protective layer with a thickness of 5mm, heat insulation layer (insulation board) with a thickness of 30mm, damp-proof layer with a thickness of 5mm, i.e., entirely
The overall thickness of floor heating mounting structure is 90mm, and the two in contrast, save by the thickness of thin formula floor heating mounting structure construction finished surface
50% or more, the excellent results of " three subtract one plus " can be played, wherein " three subtract " specifically: reduce floor heating energy consumption, subtract
Few house layer height is lost and reduces the integral construction period, and " one adds " is to increase floor heating heating efficiency.
Embodiment 2
On the basis of embodiment 1, further, the firing press of the ground decoration layer 1 is 10000 to the present embodiment
Ton, firing temperature are 1230 DEG C, 6000-7000 tons of press of more traditional ceramic tile burning process, 6000-7000 DEG C of firing temperature
For degree, the density and crushing resistance for the ceramic thin plate that the present invention burns out are more stronger than traditional ceramic tile, so thermal coefficient is higher,
Thickness also only has 4-6mm simultaneously, and more traditional ceramic tile is more frivolous, can reduce the difficulty of construction in work progress, reduces energy consumption,
Save cost.
Embodiment 3
On the basis of embodiment 1, further, the heating special bonding agent 6 includes following parts by weight to the present embodiment
Several component: 51 parts of special cement, 4 parts of quartz sand, 9 parts of cellulose ether, 8 parts of redispersable latex powder, 7 parts of plasticiser and starch
4 parts of ether, the heating bonding agent is less compared to dosage for cement mortar, and molding faster, can effectively shorten the construction time, improves
Construction efficiency, and thickness is conducive to improve heating efficiency compared with cement mortar much thinner.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is equal
Replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this hair
Within bright protection scope.
Claims (7)
1. a kind of thin formula floor heating mounting structure, including the ground decoration layer (1), heat sink (2) and guarantor set gradually from top to bottom
Warm layer (3), the insulating layer (3) are set on concrete building board finish, and the heat sink (2) is equipped with several U-lags (4),
The U-lag (4) is embedded in insulating layer (3), is equipped with floor heating water pipe (5) in the U-lag (4), which is characterized in that describedly
The material of face decorative layer (1) is ceramic thin plate, and the ground decoration layer (1) is adhered to heat dissipation by heating special bonding agent (6)
On plate (2), the heat sink (2) is coated on insulating layer (3), and the heating special bonding agent (6) includes following parts by weight
Several component: 50-55 parts of special cement, 3-5 parts of quartz sand, 5-10 parts of cellulose ether, 5-10 parts of redispersable latex powder, plasticizing
5-8 parts of agent and 3-5 parts of starch ether.
2. a kind of thin formula floor heating mounting structure according to claim 1, which is characterized in that the heating special bonding agent
(6) include following parts by weight component: 52 parts of special cement, 4 parts of quartz sand, 8 parts of cellulose ether, redispersable latex powder 6
Part, 6 parts of plasticiser and 4 parts of starch ether.
3. a kind of thin formula floor heating mounting structure according to claim 1, which is characterized in that the ground decoration layer (1)
With a thickness of 4-6mm.
4. a kind of thin formula floor heating mounting structure according to claim 1, which is characterized in that the material of the heat sink (2)
For aluminum substrate.
5. a kind of thin formula floor heating mounting structure according to claim 4, which is characterized in that the heat sink (2) and heating
The overall thickness of special bonding agent (6) is 10mm.
6. a kind of thin formula floor heating mounting structure according to claim 1, which is characterized in that the thickness of the insulating layer (3)
For 30-40mm.
7. a kind of preparation method of thin formula floor heating mounting structure according to claim 3, which is characterized in that the ground dress
The firing press for adoring layer (1) is 10000 tons, and firing temperature is 1230 DEG C.
Priority Applications (1)
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CN201910509254.9A CN110243004A (en) | 2019-06-13 | 2019-06-13 | A kind of thin formula floor heating mounting structure |
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CN201910509254.9A CN110243004A (en) | 2019-06-13 | 2019-06-13 | A kind of thin formula floor heating mounting structure |
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CN110243004A true CN110243004A (en) | 2019-09-17 |
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CN201910509254.9A Pending CN110243004A (en) | 2019-06-13 | 2019-06-13 | A kind of thin formula floor heating mounting structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113683368A (en) * | 2021-09-30 | 2021-11-23 | 河北金铎建设工程有限公司 | Mortar board and dry-type floor heating system |
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CN203701506U (en) * | 2013-11-04 | 2014-07-09 | 上海克络蒂材料科技发展有限公司 | Ground radiation warming and cooling module |
CN204026806U (en) * | 2014-02-26 | 2014-12-17 | 石家庄市新科顺达工贸有限公司 | A kind of heating floor |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113683368A (en) * | 2021-09-30 | 2021-11-23 | 河北金铎建设工程有限公司 | Mortar board and dry-type floor heating system |
CN113683368B (en) * | 2021-09-30 | 2024-03-15 | 河北金铎建设工程有限公司 | Mortar board and dry floor heating system |
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Application publication date: 20190917 |