CN106677483A - Infrared heating floor - Google Patents
Infrared heating floor Download PDFInfo
- Publication number
- CN106677483A CN106677483A CN201710018820.7A CN201710018820A CN106677483A CN 106677483 A CN106677483 A CN 106677483A CN 201710018820 A CN201710018820 A CN 201710018820A CN 106677483 A CN106677483 A CN 106677483A
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- infrared
- heating
- floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Resistance Heating (AREA)
- Central Heating Systems (AREA)
Abstract
The invention provides an infrared heating floor. The floor forms a whole bottom face or wall face through splicing. The floor comprises a heating layer; a heat conduction layer covers the upper layer of the heating layer; an infrared layer is attached to the upper portion of the heat conduction layer; a substrate is attached to the lower portion of the heat conduction layer; a heat insulation layer is arranged under the substrate; female and male plug ends capable of being embedded into adjacent floors are arranged at the left end and the right end of the floor; the upper contact face and the lower contact face for inserted connection of the female and male plug ends are covered with electrodes connected with external terminals electrically; and the electrodes are connected with the heating layer. Some floors can be spliced according to the heating area, so that the large-area heating effect is obtained.
Description
Technical field
The present invention relates to heat-producing device, more particularly to a kind of infrared heating floor.
Background technology
General electrothermal heating apparatus, such as infrared warmer, heating cable, fiber fever tablet, Electric radiant Heating Film etc..Its form is consolidated
It is fixed, it is impossible to accomplish that large area is heated.It is very not square and general underground heat needs to cut pipeline position installation heating pipeline on ground
Just.
The content of the invention
The present invention proposes a kind of infrared heating floor, solves the problems of the prior art.
The technical scheme is that what is be achieved in that：
Infrared heating floor, the floor includes heating layer, institute by being spliced to form overall bottom surface or metope, the base plate
State heating layer upper strata and be covered with heat-conducting layer；The heat-conducting layer top has infrared layer, substrate is posted in the heat-conducting layer bottom, described
Substrate lower floor is heat insulation layer, and the floor or so two ends are provided with can insert with the master-slave socket end of adjacent flooring splicing, the male and female
It is covered with the electrode that can be electrically connected with external terminal on the contact surface up and down of head end grafting respectively, the electrode connects with the heating layer
It is logical.
Used as the preferred version of the present invention, the heating layer is in silicon-carbon nanorize coating, carbon fiber coating layer and PTC coatings
One kind.
Used as the preferred version of the present invention, the heat-conducting layer thickness is A, wherein 2mm≤A≤10mm, and the heat-conducting layer is
Carborundum or silica gel piece.
Used as the preferred version of the present invention, the substrate is wooden structures, specially bar labor plank, Fructus Ananadis comosi Semen Erythrophlei fourdii plate, south
It is arbitrary in square deal board, Chinese hemlock spruce plank, Pseudotsuga menziesii (Mirbel) Franco plank, Cortex Fraxini mandshuricae plank, blood-snow deal board, Xylosmae japonici plate, Pinus sylvestnis var. mongolica Litv. plank
Kind.
Used as the preferred version of the present invention, the substrate thickness is B, wherein 5mm≤B≤15mm.
Used as the preferred version of the present invention, the heat insulation layer is insulation material or coating, and specially polystyrene foam is moulded
Material, polyurethane foam plastics, aluminum silicate composite heat-insulating coating, silicate heat-protective coatings, ceramic thermal insulation material, adhesive polystyrene
Grain, steel wire adopt cement-foam panel, hard-foam polyurethane warming plate, cement board, ceramic thermal insulation plate, extruded sheet, eps foam
Plate, perlite, pearlite brick, Vermiculitum, vermiculite brick, phenolic resin, polyurethane, rubber-plastic sponge, glass cotton, rock wool steel structure material,
One kind in glass lap felt etc., phenolic foam material and EPG glue powder polyphenyl particles.
Used as the preferred version of the present invention, the master-slave socket end is two and is separately positioned on the floor or so two ends
Connection end, respectively the first connection end and the second connection end, first connection end can nothing with second connection end on adjacent floor
Gap plugs together connection, and first connection end is located at the substrate left end, and first connection end includes and substrate connection
The first recess and the first boss with the round and smooth connection of the first recess, first recess and first boss section are projected by two
Semicircle recessed convex configuration composition；Its upper surface has electrode, and the electrode is connected with the heating layer lower surface.
Used as the preferred version of the present invention, second connection end is located at the heat-conducting layer right-hand end, and described second connects
Connecing end includes the second boss that is connected with heat-conducting layer and the second recess with the round and smooth connection of second boss, the second boss and the
The projection of two recess sections is made up of the recessed convex configuration of two semicircles；Its upper surface have electrode, the electrode with described
Thermosphere upper surface connects.
Used as the preferred version of the present invention, the infrared layer is far-infrared ceramic coating, in the far-infrared ceramic coating
A layer insulating is provided with, adjacent two places plate insulating layer is brought into close contact placement electric leakage.
Beneficial effect
The present invention proposes a kind of infrared heating floor, and the floor is described by being spliced to form overall bottom surface or metope
Base plate includes heating layer, and the heating layer upper strata is covered with heat-conducting layer；The heat-conducting layer top has infrared layer, the heat-conducting layer
Substrate is posted in bottom, and the substrate lower floor is heat insulation layer, and described floor or so two ends are provided with can be with the male and female of adjacent flooring splicing
Plug end, is covered with respectively the electrode that can be electrically connected with external terminal on the contact surface up and down of master-slave socket end grafting, described
Electrode is connected with the heating layer.The present invention can be spliced according to heating service size, so as to obtain large area heating
Effect.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is cross-sectional view of the present invention.
Heat-conducting layer 1, the first recess 11, first boss 12, heating layer 2, electrode 21, substrate 3, second boss 31, second is recessed
Mouth 32, infrared layer 4, heat insulation layer 5.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example is applied, the scope of protection of the invention is belonged to.
As shown in figure 1, infrared heating floor, floor includes heating layer by being spliced to form overall bottom surface or metope, base plate
2, the upper strata of heating layer 2 is covered with heat-conducting layer 1；The top of heat-conducting layer 1 has infrared layer, substrate 3 is posted in the bottom of heat-conducting layer 1, under substrate 3
Layer be heat insulation layer 5, floor or so two ends be provided with can with the master-slave socket end of adjacent flooring splicing, the grafting of master-slave socket end it is upper and lower
It is covered with the electrode 21 that can be electrically connected with external terminal on contact surface respectively, electrode is connected with the heating layer.
Heating layer 2 is the one kind in silicon-carbon nanorize coating, carbon fiber coating layer and PTC coatings.
The thickness of heat-conducting layer 1 is A, and wherein 2mm≤A≤10mm, heat-conducting layer 1 is carborundum or silica gel piece.
Substrate 3 is wooden structures, specially bar labor plank, Fructus Ananadis comosi Semen Erythrophlei fourdii plate, Southern Pine plank, Chinese hemlock spruce plank, Pseudotsuga menziesii (Mirbel) Franco
Any one in plank, Cortex Fraxini mandshuricae plank, blood-snow deal board, Xylosmae japonici plate, Pinus sylvestnis var. mongolica Litv. plank.
Substrate thickness is B, wherein 5mm≤B≤15mm.
Heat insulation layer 5 is insulation material or coating, specially polystyrene foam plastics, polyurethane foam plastics, aluminium silicate
Composite heat-insulating coating, silicate heat-protective coatings, ceramic thermal insulation material, glue powder polyphenyl particle, steel wire are adopted cement-foam panel, are hard bubbled
Polyurethane thermal insulation board, cement board, ceramic thermal insulation plate, extruded sheet, eps foam plate, perlite, pearlite brick, Vermiculitum, Vermiculitum
Brick, phenolic resin, polyurethane, rubber-plastic sponge, glass cotton, rock wool steel structure material, glass lap felt etc., phenolic foam material and
One kind in EPG glue powder polyphenyl particles.It is preferred that one-level fire proofing material.
Master-slave socket end is two connection ends for being separately positioned on floor or so two ends, respectively the first connection end and second
Connection end, the first connection end seamless can plug together connection with second connection end on adjacent floor, and the first connection end is located at the base
The left end of plate 3, the first connection end includes the first recess 11 being connected with substrate 3 and with the round and smooth connection of the first recess 11 first
Boss 12, the first recess 11 and the projection of the section of first boss 12 are made up of the recessed convex configuration of two semicircles；Its upper surface is attached
There is electrode 21, electrode is connected with the heating layer lower surface.
Second connection end is located at the right-hand end of heat-conducting layer 1, and the second connection end includes the second boss 31 being connected with heat-conducting layer 1
And the second recess 32 with the round and smooth connection of second boss 31, the section of 31 and second recess of second boss 32 is projected by two semicircles
Recessed convex configuration composition；Its upper surface has electrode 21, and electrode is connected with heating layer upper surface.
Infrared layer 4 is far-infrared ceramic coating, and far-infrared ceramic coating is provided with a layer insulating, adjacent two floor insulation
Layer is brought into close contact placement electric leakage.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (9)
1. infrared heating floor, the floor is by being spliced to form overall bottom surface or metope, it is characterised in that the base plate includes
Heating layer (2), heating layer (2) upper strata is covered with heat-conducting layer (1)；Heat-conducting layer (1) top has infrared layer, it is described to lead
Substrate (3) is posted in thermosphere (1) bottom, and substrate (3) lower floor is heat insulation layer (5), and described floor or so two ends are provided with can be with phase
The master-slave socket end of adjacent flooring splicing, being covered with respectively on the contact surface up and down of master-slave socket end grafting can be with external terminal
The electrode (21) being electrically connected, the electrode is connected with the heating layer.
2. infrared heating floor according to claim 1, it is characterised in that the heating layer (2) is that silicon-carbon nanorize is applied
One kind in layer, carbon fiber coating layer and PTC coatings.
3. infrared heating floor according to claim 1, it is characterised in that heat-conducting layer (1) thickness is A, wherein 2mm
≤ A≤10mm, the heat-conducting layer (1) is carborundum or silica gel piece.
4. infrared heating floor according to claim 1, it is characterised in that the substrate (3) is wooden structures, specially
Bar labor plank, Fructus Ananadis comosi Semen Erythrophlei fourdii plate, Southern Pine plank, Chinese hemlock spruce plank, Pseudotsuga menziesii (Mirbel) Franco plank, Cortex Fraxini mandshuricae plank, blood-snow deal board, Xylosmae japonici
Any one in plate, Pinus sylvestnis var. mongolica Litv. plank.
5. infrared heating floor according to claim 4, it is characterised in that the substrate thickness is B, wherein 5mm≤B≤
15mm。
6. infrared heating floor according to claim 1, it is characterised in that the heat insulation layer (5) is insulation material or painting
Layer, specially polystyrene foam plastics, polyurethane foam plastics, aluminum silicate composite heat-insulating coating, silicate heat-protective coatings, pottery
Porcelain insulation material, glue powder polyphenyl particle, steel wire are adopted cement-foam panel, hard-foam polyurethane warming plate, cement board, ceramics and are protected
Warm plate, extruded sheet, eps foam plate, perlite, pearlite brick, Vermiculitum, vermiculite brick, phenolic resin, polyurethane, rubber-plastic sponge, glass
One kind in glass cotton, rock wool steel structure material, glass lap felt etc., phenolic foam material and EPG glue powder polyphenyl particles.
7. infrared heating floor according to claim 1, it is characterised in that the master-slave socket end is respectively provided with for two
In the connection end at the floor or so two ends, respectively the first connection end and the second connection end, first connection end with it is adjacent
Second connection end on floor seamless can plug together connection, and first connection end is located at the substrate (3) left end, and described the
One connection end includes the first recess (11) being connected with substrate (3) and the first boss with the round and smooth connection of the first recess (11)
(12), first recess (11) and the projection of first boss (12) section is made up of the recessed convex configuration of two semicircles；Thereon
Surface has electrode (21), and the electrode is connected with the heating layer lower surface.
8. infrared heating floor according to claim 7, it is characterised in that second connection end is located at the heat-conducting layer
(1) right-hand end, second connection end includes the second boss (31) being connected with heat-conducting layer (1) and justifies with second boss (31)
Second recess (32) of slip, the second boss (31) and the second recess (32) section projection by two semicircles it is recessed on
Male structure is constituted；Its upper surface has electrode (21), and the electrode is connected with the heating layer upper surface.
9. infrared heating floor according to claim 1, it is characterised in that the infrared layer (4) is that far-infrared ceramic is applied
Layer, the far-infrared ceramic coating is provided with a layer insulating, and adjacent two places plate insulating layer is brought into close contact placement electric leakage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710018820.7A CN106677483A (en) | 2017-01-10 | 2017-01-10 | Infrared heating floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710018820.7A CN106677483A (en) | 2017-01-10 | 2017-01-10 | Infrared heating floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106677483A true CN106677483A (en) | 2017-05-17 |
Family
ID=58850440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710018820.7A Pending CN106677483A (en) | 2017-01-10 | 2017-01-10 | Infrared heating floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106677483A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109881863A (en) * | 2019-01-29 | 2019-06-14 | 沈库 | A kind of behaviour room spontaneous-heating type floor and its laying method |
| CN109915898A (en) * | 2019-04-24 | 2019-06-21 | 武汉江生热力科技有限公司 | A kind of heat production module |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11256803A (en) * | 1998-01-06 | 1999-09-21 | Matsushita Electric Works Ltd | Floor heating panel and construction of floor heating using same, and floor panel for wiring used for construction |
| CN2491534Y (en) * | 2001-08-31 | 2002-05-15 | 商春成 | Electrothermal floor having safety, energy saving and constant temp functions |
| CN201111529Y (en) * | 2007-02-28 | 2008-09-10 | 王柏泉 | Energy-saving electrothermal heating far infrared health building decorating material |
| CN202248723U (en) * | 2011-08-08 | 2012-05-30 | 深圳市沃尔核材股份有限公司 | Heating floor |
| CN103047705A (en) * | 2011-10-11 | 2013-04-17 | 陈明星 | Electric heating floor conductive connection device and implementing method thereof |
| CN105350742A (en) * | 2015-12-04 | 2016-02-24 | 江苏洛基木业有限公司 | Spontaneous heating floor |
| WO2016130033A1 (en) * | 2015-02-13 | 2016-08-18 | Jerzy Stachowicz | Multi-layer thermal conductive panel on a floor with floor heating |
| CN205747103U (en) * | 2016-04-29 | 2016-11-30 | 湖南旺正新材料有限公司 | A kind of heating bamboo flooring |
| CN206599949U (en) * | 2017-01-10 | 2017-10-31 | 邢台垠通新能源科技开发有限公司 | Infrared heating floor |
-
2017
- 2017-01-10 CN CN201710018820.7A patent/CN106677483A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11256803A (en) * | 1998-01-06 | 1999-09-21 | Matsushita Electric Works Ltd | Floor heating panel and construction of floor heating using same, and floor panel for wiring used for construction |
| CN2491534Y (en) * | 2001-08-31 | 2002-05-15 | 商春成 | Electrothermal floor having safety, energy saving and constant temp functions |
| CN201111529Y (en) * | 2007-02-28 | 2008-09-10 | 王柏泉 | Energy-saving electrothermal heating far infrared health building decorating material |
| CN202248723U (en) * | 2011-08-08 | 2012-05-30 | 深圳市沃尔核材股份有限公司 | Heating floor |
| CN103047705A (en) * | 2011-10-11 | 2013-04-17 | 陈明星 | Electric heating floor conductive connection device and implementing method thereof |
| WO2016130033A1 (en) * | 2015-02-13 | 2016-08-18 | Jerzy Stachowicz | Multi-layer thermal conductive panel on a floor with floor heating |
| CN105350742A (en) * | 2015-12-04 | 2016-02-24 | 江苏洛基木业有限公司 | Spontaneous heating floor |
| CN205747103U (en) * | 2016-04-29 | 2016-11-30 | 湖南旺正新材料有限公司 | A kind of heating bamboo flooring |
| CN206599949U (en) * | 2017-01-10 | 2017-10-31 | 邢台垠通新能源科技开发有限公司 | Infrared heating floor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109881863A (en) * | 2019-01-29 | 2019-06-14 | 沈库 | A kind of behaviour room spontaneous-heating type floor and its laying method |
| CN109915898A (en) * | 2019-04-24 | 2019-06-21 | 武汉江生热力科技有限公司 | A kind of heat production module |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170517 |
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| WD01 | Invention patent application deemed withdrawn after publication |