WO2016127579A1 - Dispositif de protection contre le rayonnement thermique et terminal - Google Patents

Dispositif de protection contre le rayonnement thermique et terminal Download PDF

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Publication number
WO2016127579A1
WO2016127579A1 PCT/CN2015/084520 CN2015084520W WO2016127579A1 WO 2016127579 A1 WO2016127579 A1 WO 2016127579A1 CN 2015084520 W CN2015084520 W CN 2015084520W WO 2016127579 A1 WO2016127579 A1 WO 2016127579A1
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WO
WIPO (PCT)
Prior art keywords
heat
shielding device
heat dissipation
base
terminal
Prior art date
Application number
PCT/CN2015/084520
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English (en)
Chinese (zh)
Inventor
任新颖
年蕴豪
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2016127579A1 publication Critical patent/WO2016127579A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the utility model relates to a heat shielding device for a terminal such as a mobile phone, a tablet computer or the like, belonging to the hardware field of the terminal. It is a heat sink in the terminal.
  • the utility model also relates to a terminal comprising the heat dissipation shielding device.
  • Air-cooling method The heat of a chip (for example, a CPU) is guided to a heat dissipation plate by a patch, and a fan is used to blow air, thereby enhancing air flow on the surface of the heat dissipation plate. Through this air flow, heat is taken away and the temperature is lowered. However, there is not enough space in the mobile communication terminal to accommodate the fan.
  • a chip for example, a CPU
  • Water cooling method Because water has a large specific heat capacity, it is suitable for absorbing heat. The tube is attached to a patch and the patch is placed over a heat source, and then a pressure pump is used to allow the water to flow and remove the heat from the heat source. However, like air cooling, the pressure pump does not have enough installation space in the mobile terminal.
  • Liquid cooling method This principle is similar to the water cooling method, except that the water is replaced by a thermal silicone oil. It is not afraid of leaking "water.” However, again, the necessary pressure pump does not have sufficient installation space in the mobile terminal.
  • Graphite heat dissipation method suitable for heat dissipation of mobile communication terminals. Since the graphite material itself is malleable, it can be placed into a mobile phone by making it into a layered patch. And because the structural characteristics of graphite molecules have bidirectional uniform thermal conductivity, most smart phones now have built-in graphite heat sinks.
  • Frequency reduction heat dissipation method In view of the CPU heat generation principle, a large amount of work of processing data will make the CPU become a very high temperature heat source, and down frequency can ensure that the CPU works normally. At present, the processor equipped with the smart phone can automatically convert the frequency, which is why the mobile phone will be hot and usually not used when running a large program. However, the current mobile phone system is temporarily unable to artificially control the frequency.
  • the semiconductor refrigeration film is also called a thermoelectric refrigeration sheet and is a heat pump. It has the advantage of no sliding parts and is used in applications where space is limited, reliability is high, and there is no refrigerant contamination.
  • the Peltier effect of the semiconductor material when the direct current is passed through a galvanic couple of two different semiconductor materials in series, heat can be absorbed and heat can be released at both ends of the galvanic couple, and the purpose of cooling can be achieved. It is a refrigeration technology that produces negative thermal resistance, which is characterized by no moving parts and high reliability.
  • working on a semiconductor refrigerating sheet requires a large amount of electric energy and a high voltage, which cannot be carried by the mobile terminal of the mobile phone.
  • An object of the present invention is to solve the above problems in the prior art.
  • Embodiments of the present invention provide a heat dissipation shielding device including a shielding cover over a shielded element and a base supporting the shielding cover, wherein the base includes one or more surrounding shielded components
  • the annular frame is composed of a hollow tube having a cavity sealed with respect to the outside, the inner cavity being filled with a heat conductive medium.
  • the base may further comprise a heat pipe in fluid communication with the hollow tube, the heat pipe comprising a heat pipe distal section remote from the annular frame.
  • the hollow tube may include a porous portion disposed in the inner cavity.
  • the porous portion may be composed of a multiple metal mesh liner.
  • the porous portion may also be a porous structure formed by surface-treating the inner wall of the hollow tube.
  • the heat dissipation shielding device may further include an additional heat conductive material disposed between the shielding cover and the shielded member, the additional heat conductive material being in surface contact with the shield cover, and the shielded member Face contact.
  • the additional thermally conductive material may be a silicone grease or a silicone sheet.
  • the thermally conductive medium may be petroleum ether.
  • the base may be made of metal.
  • the embodiment of the present invention further provides a terminal, wherein the terminal includes the heat dissipation shielding device described above.
  • the terminal can be, for example, a mobile phone or a tablet.
  • heat generated by the shielding member can be effectively and quickly removed, and the heat-dissipating shielding device and the terminal can maintain a relatively compact volume. .
  • Figure 1a is a schematic partial view of a prior art shielding device and a shielded component
  • Figure 1b is a schematic partial view of a shielding device and a shielded element in accordance with a first embodiment of the present invention
  • Fig. 2 schematically shows a base of a shielding device according to a second embodiment of the present invention
  • FIG. 3a-3d schematically illustrate a base of a shielding device in accordance with a third embodiment of the present invention
  • Fig. 4 schematically shows a base of a shielding device according to a fourth embodiment of the present invention.
  • the original function of the shielding device is to surround the interference component of the component, the circuit, the assembly, the cable or the whole system with the shielding body to prevent the interference electromagnetic field from spreading outward;
  • the receiving circuit, device or system is surrounded by a shield to prevent them from being affected by external electromagnetic fields.
  • the shielding device is structurally divided into two parts: a shielding cover and a base supporting the shielding cover.
  • the material of the shielding cover is usually made of 0.2 mm thick stainless steel and a copper alloy such as zinc-copper alloy, nickel-copper alloy, nickel-zinc-copper alloy, which is a metal shielding material which is easy to be tinned.
  • the shielding function of the shielding device is in fact completely provided by the cover of the shielding cover, and the base merely functions as a simple fixed shielding cover.
  • Figure 1a is a schematic partial view of a prior art shielding device and shielded component.
  • the shielding means in the mobile terminal includes a shield cover 10' disposed above the shielded member 20' and a base (not shown) supporting the shield cover. As shown, a gap S is left between the shield cover 10' and the underlying shielded member 20'.
  • the shielded component 20' is typically an element that generates heat, such as a chip, which becomes a source of heat within the mobile terminal during use. Since the air filled in the gap S is a poor conductor of heat, it severely hinders the emission and transfer of heat from the shield member 20' to the outside. In this case, the shield cover 10' does not function effectively for the heat dissipation of the shielded member 20'.
  • the shielded member 20' as a heat source is now cooled by heat radiation.
  • Figure 1b is a schematic partial view of a shielding device and a shielded element in accordance with a first embodiment of the present invention.
  • the shielding device includes, in addition to the shield cover 10 disposed above the shielded member 20 and the base (not shown) that supports the shield cover, the shield cover 10 and the shield cover 10 are included. Additional thermally conductive material 30 between the shielding elements 20.
  • the additional thermally conductive material 30 herein is in sufficient face-to-face contact with the shield cover 10 and the shielded component 20, respectively.
  • the additional thermally conductive material 30 is sufficiently performed on the underside with the shielded component 20 Face-to-face contact, and full face-to-face contact with the shield cover 10 on the upper side. Since the additional thermally conductive material 30 is a good conductor of heat, a temperature difference as small as possible between the upper and lower contact faces of the additional thermally conductive material 30 can be achieved.
  • the heat emitted by the shield member 20 as a heat source is transmitted to the shield cover 10 through the additional heat conductive material 30 and is further radiated. Therefore, the shield cover 10 plays an effective role in heat dissipation by the shield member 20.
  • the shielded component 20 is now dissipated by more efficient heat transfer.
  • the additional thermally conductive material 30 may be, for example, a thermal grease or a thermally conductive silicone sheet.
  • the heat-dissipating silicone grease is a high-thermal-conductivity insulating silicone material that hardly cures forever. It can maintain the grease state for a long time at a temperature of -50 ° C to +230 ° C.
  • the heat-dissipating silicone grease has excellent electrical insulation and excellent thermal conductivity, and also has low oil dispersion (which tends to zero).
  • Thermal grease is resistant to high and low temperatures, water, ozone and weathering. It can be widely applied to the contact surfaces between heating elements (power tubes, thyristors, electrothermal stacks, etc.) and heat dissipation devices (heat sinks, heat sinks, housings, etc.) in various electronic products and electrical equipment.
  • the heat-dissipating silicone grease is suitable for surface coating or integral potting of various microwave devices such as microwave communication, microwave transmission equipment, microwave dedicated power supply, and regulated power supply.
  • microwave communication such as microwave communication, microwave transmission equipment, microwave dedicated power supply, and regulated power supply.
  • the thermal conductive silica gel sheet is a heat conductive medium material which is synthesized by a special process by using silica gel as a base material and adding various auxiliary materials such as metal oxide.
  • thermal silica gel sheets also known as thermal silica gel pads, thermal conductive silicone films, flexible thermal pads, thermal silicone gaskets, etc., are designed to transfer heat through the gap.
  • the thermal conductive silica gel sheet can fill the gap and complete the heat transfer between the heat generating portion and the heat radiating portion, and also functions as insulation, shock absorption and sealing.
  • the thermal conductive silicone sheet can meet the design requirements of miniaturization and ultra-thinness of the device, has great processability and usability, and has a wide application range of thickness, and is an excellent thermal conductive filling material.
  • FIG. 2 shows an illustration of a base 200 of a shielding device in accordance with a second embodiment of the present invention. Italian top view, front view and side view.
  • the base 200 for supporting a shield cover includes an annular frame 210 and eight snaps 220 for connecting and fixing to the shield cover.
  • the annular frame 210 may enclose the shielded element (not shown) and is, for example, in the shape of a ring of rectangular shape (as shown in Figure 2a), circular, polygonal, irregular, or the like.
  • the annular frame 210 may be in the shape of a ring that matches the shape of the element being shielded.
  • the annular frame 210 is composed of a hollow tube having a lumen sealed from the outside.
  • the inner cavity can be filled with a heat-conducting medium which is preferably liquid at normal temperature.
  • the base 200 may have other suitable shapes in addition to the annular shape.
  • annular frames 210 and an appropriate number of one or more snaps 220 may be selected.
  • the base 300 includes an annular frame 310 and an additional heat pipe 330.
  • the annular frame 310 is constructed of a hollow tube having a lumen 311 that is sealed relative to the outside.
  • the inner cavity 311 is filled with a heat conductive medium.
  • a porous portion 312 is provided in the inner cavity 311 of the hollow tube.
  • the porous portion 312 may be formed by surface-treating the inner wall of the inner cavity 311 to have a porous structure, or may be provided by providing a separate porous member in the inner cavity 311.
  • the porous portion 312 can attract liquid by capillary action.
  • a single layer of wick can be provided as the porous portion 312 in the inner chamber 311.
  • the wick may be an inner liner of a multi-metal mesh that is flocculated and conforms to the wall of the lumen 311 of the hollow tube.
  • the inner liner of the multiple metal mesh is, for example, an inner liner of a multilayer metal mesh.
  • the base 300 further includes a heat pipe 330 as shown in Figures 3a and 3c.
  • a heat pipe 330 as shown in Figures 3a and 3c.
  • FIGs 3a and 3c there is shown an annular frame 310 and associated partial heat pipes 330 that are cut away.
  • the heat pipe 330 is also constructed of a hollow tube and is in fluid communication with the hollow tube of the annular frame 310 to together form a lumen that is sealed relative to the outside.
  • the heat pipe 330 includes a heat pipe proximal section 331 adjacent to and connected to the annular frame 310, a heat pipe distal section 333 remote from the annular frame 310, and a heat pipe intermediate section between the heat pipe proximal section 331 and the heat pipe distal section 333. 332.
  • a heat dissipation principle of the base 300 of the shielding device according to the third embodiment of the present invention is schematically illustrated.
  • the annular frame 310 surrounds the shielded element as a heat source.
  • the hollow tube of the annular frame 310 becomes the evaporation end (or the heating chamber), and the heat pipe distal end portion 333, which is relatively low in temperature away from the heat source, becomes the condensation end (or cooling chamber).
  • the heat transfer medium in the hollow tube of the annular frame 310 rapidly vaporizes and simultaneously absorbs heat.
  • the resulting steam flows sequentially through the heat pipe proximal section 331 and the heat pipe intermediate section 332 to the relatively large heat pipe distal section 333 (condensing end) under a slight pressure differential, as indicated by the dashed arrow in Fig. 3d.
  • the steam condenses into a liquid and releases heat.
  • the liquid flows back to the hollow tube (evaporation end) of the annular frame 310 via the heat pipe intermediate portion 332 and the heat pipe proximal portion 331 in turn, as shown in FIG. 3d.
  • the solid line with an arrow is shown.
  • the liquid heat transfer medium re-evaporates and begins the next cycle.
  • the heat transfer medium carries heat from one end of the annular frame 310 to one end of the condensation chamber and is dissipated in the condensation chamber. This cycle is fast, so heat can be continuously transmitted.
  • the hollow tube of the annular frame 310 and the hollow tube of the heat pipe 330 have a rectangular cross section, it will be understood that the hollow tube may also have a cross section of any suitable shape, such as a triangle or a circle. Shapes, polygons, irregular shapes, etc.
  • the hollow tube is evacuated to a negative pressure state and filled with a suitable heat transfer medium.
  • the thermally conductive medium can be, for example, a petroleum ether having a low boiling point and being volatile. Petroleum ether (electrode type non-conducting) has a boiling point of 60 to 80 °C. Moreover, the boiling point of petroleum ether will decrease slightly under vacuum conditions, and gas-liquid two-phase will start at about 40 °C, which is in accordance with the needs of the embodiments of the present invention.
  • the base according to an embodiment of the present invention may be made of metal.
  • the annular frame 310 and/or the heat pipe 330 may be made of a copper tube. Copper tubes can be bent and deformed, and they can often be made into elbows and joints. The copper tube can be bent at almost any angle. In addition, copper does not leak, does not support combustion, does not produce toxic gases and is resistant to corrosion, so it is a safe material. Thus, even if the applied mobile terminal (for example, a mobile phone) is dropped, the structure of the heat shielding device is not easily damaged.
  • the annular frame and the hollow tube of the heat pipe may have a similar structure.
  • the base 400 includes a plurality of annular frames 410 and a heat pipe 430.
  • a plurality of annular frames 410 surround respective shielded elements, one or more of which are heated during operation, i.e., become a source of heat.
  • the annular frame 410 is constructed of hollow tubes that are in fluid communication with one another.
  • the heat pipe 430 is also constructed of a hollow tube and is in fluid communication with the hollow tube of the annular frame 410 to together form a lumen that is sealed relative to the outside.
  • the inner cavity of the hollow tube of the annular frame 410 surrounding the heat source becomes the evaporation end (or the heating chamber), and the inner cavity of the distal end section 433 of the heat pipe which is relatively low away from the heat source becomes the condensation end (or cooling) room).
  • the heat pipe distal sections 333, 433 and the shield cover 10 there is a relatively large area on the outer sides of the heat pipe distal sections 333, 433 and the shield cover 10, and these parts can also be fully utilized.
  • the graphite fins may be covered on the outer end of the heat pipe and the outer surface of the shield cover. Superimposed with the heat dissipation of the graphite sheet, the heat shielding device can obtain better heat dissipation effect.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de protection contre le rayonnement thermique. Le dispositif de protection contre le rayonnement thermique comprend un couvercle de protection (10) situé au-dessus d'un élément protégé (20) et une base (200, 300, 400) supportant le couvercle de protection. La base comprend un ou plusieurs cadres annulaires (210, 310, 410) entourant l'élément protégé. Les cadres annulaires sont constitués de tubes creux. Les tubes creux comportent des cavités intérieures (311) enfermées par rapport à l'extérieur. Un milieu thermoconducteur est versé dans les cavités intérieures. L'invention concerne également un terminal comprenant le dispositif de protection contre le rayonnement thermique.
PCT/CN2015/084520 2015-02-12 2015-07-20 Dispositif de protection contre le rayonnement thermique et terminal WO2016127579A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520103281.3U CN204392756U (zh) 2015-02-12 2015-02-12 散热屏蔽装置及终端
CN201520103281.3 2015-02-12

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WO2016127579A1 true WO2016127579A1 (fr) 2016-08-18

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Publication number Priority date Publication date Assignee Title
CN114129337A (zh) * 2020-09-03 2022-03-04 于仲伟 一种便携式崴伤治疗仪

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CN204392756U (zh) * 2015-02-12 2015-06-10 中兴通讯股份有限公司 散热屏蔽装置及终端
CN105357932B (zh) * 2015-10-14 2018-07-24 小米科技有限责任公司 终端设备及其散热结构
CN105246314B (zh) 2015-10-14 2018-09-04 小米科技有限责任公司 屏蔽罩、pcb板和终端设备
CN106488690B (zh) * 2016-11-16 2019-01-25 国电南瑞科技股份有限公司 一种低电磁干扰的水冷散热器
CN108156791A (zh) * 2017-11-07 2018-06-12 金湖芯磊电子有限公司 一种平板热管回路及其散热模块
CN108667991B (zh) * 2018-06-11 2020-09-04 Oppo广东移动通信有限公司 壳体组件以及电子装置
CN108617159B (zh) * 2018-06-11 2020-07-03 Oppo广东移动通信有限公司 壳体组件以及电子装置
CN109639949B (zh) * 2018-12-28 2024-01-16 安徽清新互联信息科技有限公司 一种高速布控球
CN110366362B (zh) * 2019-08-07 2020-08-07 李居强 电磁屏蔽散热装置

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JPH10227585A (ja) * 1997-02-13 1998-08-25 Furukawa Electric Co Ltd:The ヒートスプレッダとそれを用いた冷却器
US6381135B1 (en) * 2001-03-20 2002-04-30 Intel Corporation Loop heat pipe for mobile computers
CN103929935A (zh) * 2013-01-15 2014-07-16 起源技术美国股份有限公司 散热的emi/rfi屏蔽装置
CN204392756U (zh) * 2015-02-12 2015-06-10 中兴通讯股份有限公司 散热屏蔽装置及终端

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10227585A (ja) * 1997-02-13 1998-08-25 Furukawa Electric Co Ltd:The ヒートスプレッダとそれを用いた冷却器
US6381135B1 (en) * 2001-03-20 2002-04-30 Intel Corporation Loop heat pipe for mobile computers
CN103929935A (zh) * 2013-01-15 2014-07-16 起源技术美国股份有限公司 散热的emi/rfi屏蔽装置
CN204392756U (zh) * 2015-02-12 2015-06-10 中兴通讯股份有限公司 散热屏蔽装置及终端

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114129337A (zh) * 2020-09-03 2022-03-04 于仲伟 一种便携式崴伤治疗仪

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