WO2016125255A1 - Dispositif de conversion de courant et dispositif de climatisation - Google Patents

Dispositif de conversion de courant et dispositif de climatisation Download PDF

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Publication number
WO2016125255A1
WO2016125255A1 PCT/JP2015/052986 JP2015052986W WO2016125255A1 WO 2016125255 A1 WO2016125255 A1 WO 2016125255A1 JP 2015052986 W JP2015052986 W JP 2015052986W WO 2016125255 A1 WO2016125255 A1 WO 2016125255A1
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Prior art keywords
switching element
diode
terminal
semiconductor module
conversion device
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PCT/JP2015/052986
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English (en)
Japanese (ja)
Inventor
利成 平井
岩田　明彦
真作 楠部
健太 湯淺
正之 安藤
山田　順治
Original Assignee
三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2015/052986 priority Critical patent/WO2016125255A1/fr
Priority to JP2016572981A priority patent/JPWO2016125255A1/ja
Publication of WO2016125255A1 publication Critical patent/WO2016125255A1/fr

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only

Definitions

  • the present invention relates to a power conversion device that converts a commercial power source into power supplied to a motor or the like of a compressor, and an air conditioner that includes the power conversion device.
  • an inverter circuit is configured using a power module in which a semiconductor element is put in one module (package), thereby reducing the effort required for circuit design and structural design (see, for example, Patent Document 1).
  • booster circuits Various types are conceivable, but a multi-level chopper circuit equipped with an intermediate capacitor is suitable from the viewpoint of improving circuit efficiency and expanding the boost width.
  • discrete components constituting the multilevel chopper circuit are mounted on the substrate one by one, there is a problem that the design load further increases.
  • the present invention has been made to solve the above-described problems, and provides a power conversion device and an air conditioner that realize one-packaged semiconductor elements in a multilevel chopper circuit having an intermediate capacitor. With the goal.
  • a power converter includes a first switching element and a second switching element connected to a load and connected in series to each other, a first freewheeling diode connected in parallel to the first switching element, and a second switching element.
  • a semiconductor module formed by packaging a semiconductor element has terminals for connecting peripheral components, it is possible to realize a one-package semiconductor element in a multi-level chopper circuit having an intermediate capacitor.
  • FIG. 2 is a schematic diagram of a semiconductor module in which the semiconductor element of the MLC circuit is made into one package in the power conversion device of FIG. 1. It is explanatory drawing which shows the state of the operation mode A in the MLC circuit of the power converter device of FIG. It is explanatory drawing which shows the state of the operation mode B in the MLC circuit of the power converter device of FIG. It is explanatory drawing which shows the state of the operation mode C in the MLC circuit of the power converter device of FIG. It is explanatory drawing which shows the state of the operation mode D in the MLC circuit of the power converter device of FIG. In the power converter of FIG.
  • FIG. 1 is a schematic configuration diagram of a power converter and an air conditioner according to an embodiment of the present invention.
  • the air conditioner 40 includes a power conversion device 20 that converts commercial power and supplies it to the load side, and a refrigeration cycle 30 that includes a motor 31 a driven by the power conversion device 20. is doing.
  • the refrigeration cycle 30 condenses and liquefies the compressor 31 having the motor 31a driven by the power converter 20 and the refrigerant gas compressed in the compressor 31 by heat exchange with the outside air. It has a condenser 32, a decompressor 33 that lowers the pressure of the refrigerant, and an evaporator 34 that evaporates the refrigerant decompressed by the decompressor 33.
  • the compressor 31, the condenser 32, the decompressor 33, and the evaporator 34 are connected by a refrigerant pipe, and the refrigerant is configured to circulate in the refrigerant pipe.
  • the rotation speed of the motor 31a is controlled by the AC voltage from the inverter circuit 4.
  • the power conversion device 20 includes a rectifier diode, and is connected to a commercial power supply 50, a multi-level chopper circuit 2 (hereinafter referred to as “MLC circuit 2”) that is a booster circuit, and an output of the MLC circuit 2.
  • MLC circuit 2 multi-level chopper circuit 2
  • a smoothing capacitor 3 connected between them, an inverter circuit 4 connected between both electrodes of the smoothing capacitor 3, a control circuit 5, an MLC drive circuit 6, and an inverter drive circuit 7 are provided.
  • the inverter circuit 4 includes a plurality of switching elements Tr3 to Tr8 and a plurality of freewheeling diodes RD3 to RD8 connected in parallel to each of the plurality of switching elements Tr3 to Tr8.
  • a motor 31 a of the compressor 31 is connected to the output side of the inverter circuit 4.
  • the compressor 31 includes a compression mechanism (not shown) that compresses the refrigerant on the refrigerant circuit by the rotation of a motor 31a made of, for
  • the rectifier 1 is a three-phase full-wave rectifier configured to bridge a plurality of rectifier diodes D3 to D8 and rectify an AC voltage (for example, AC200V or AC400V) of the commercial power supply 50. But as the rectifier 1, you may employ
  • the MLC circuit 2 is connected in parallel to the reactor L connected in series between the outputs of the rectifier 1, the first switching element Tr1 and the second switching element Tr2 connected to the load and connected in series to each other, and the first switching element Tr1. It has a first free-wheeling diode RD1 connected and a second free-wheeling diode RD2 connected in parallel to the second switching element Tr2.
  • the reactor L is connected to the load side of the first switching element Tr1. In the first embodiment, one end of the reactor L is connected between the second diode D2 and the first switching element Tr1.
  • the MLC circuit 2 includes a first diode D1 and a second diode D2 (backflow prevention diode) connected in series, and an intermediate capacitor Cf connected in parallel to the second diode D2 and the first switching element Tr1. ing.
  • the first diode D1 and the second diode D2 are inserted between the connection point between the reactor L and the first switching element Tr1 and the smoothing capacitor 3.
  • the MLC circuit 2 boosts the DC voltage rectified by the rectifier 1 based on switching signals (see Cp and Cn in FIG. 1) from the MLC driving circuit 6.
  • the smoothing capacitor 3 smoothes and charges the output from the MLC circuit 2.
  • the inverter circuit 4 includes a three-phase bridge-connected switching element (for example, IGBT) and a free-wheeling diode that is connected in parallel to each of the switching elements and circulates the motor current.
  • the inverter circuit 4 includes a third switching element Tr3, a fourth switching element Tr4, a fifth switching element Tr5, a sixth switching element Tr6, a seventh switching element Tr7, and an eighth switching element Tr8, A third free-wheeling diode RD3, a fourth free-wheeling diode RD4, a fifth free-wheeling diode RD5, a sixth free-wheeling diode RD6, a seventh free-wheeling diode RD7, and an eighth free-wheeling diode connected in parallel to each of the eighth to eighth switching elements Tr3 to Tr8. It has RD8.
  • the inverter circuit 4 converts the DC voltage smoothed by the smoothing capacitor 3 (hereinafter referred to as “bus voltage Vdc1”) into three-phase AC power based on the PWM signal from the inverter drive circuit 7, and the compressor 31. To the motor 31a.
  • the third to eighth switching elements Tr3 to Tr8 of the inverter circuit 4 are configured using silicon (Si). However, instead of silicon (Si), silicon carbide (SiC) is used. A wide band gap semiconductor such as an element may be used.
  • an input current detection unit 8 that detects an input current Idc1 input to the reactor L is provided.
  • a motor current detection unit 9 that detects motor currents Iu and Iw from the inverter circuit 4 is provided on the output side of the inverter circuit 4.
  • a differential amplifier 10 is provided between both electrodes of the smoothing capacitor 3, and the differential amplifier 10 detects a bus voltage Vdc1 generated between the two electrodes by charging the smoothing capacitor 3 ( (Not shown).
  • the control circuit 5 includes an input current AD converter 5a that converts the input current Idc1 detected by the input current detector 8 into a digital quantity, and a bus voltage AD converter that converts the bus voltage Vdc1 from the differential amplifier 10 into a digital quantity. 5b, a motor current AD conversion unit 5c that converts the motor currents Iu and Iw detected by the motor current detection unit 9 into digital quantities, a boost mode switching unit 5d, an MLC control unit 5e, an inverter control unit 5f, and a modulation degree calculation unit 5g etc. are provided.
  • the step-up mode switching unit 5d selects a step-up mode for changing the step-up level of the input voltage Vdc in accordance with the operating state of the motor 31a of the compressor 31.
  • the MLC control unit 5e calculates the duty ratio of the ON / OFF times of the first and second switching elements Tr1 and Tr2 based on the boost mode selected by the boost mode switching unit 5d and inputs the duty ratio to the MLC drive circuit 6 .
  • FIG. 2 is a schematic diagram of the semiconductor module 11 in which the semiconductor element of the MLC circuit 2 is packaged in the power converter 20.
  • the semiconductor module 11 is connected in parallel to the first switching element Tr1 and the second switching element Tr2, the first diode D1 and the second diode D2, and the first switching element Tr1 connected in series.
  • the booster module 11A includes a first free-wheeling diode RD1 and a second free-wheeling diode RD2 connected in parallel to the second switching element Tr2.
  • the semiconductor module 11 is drawn from between the first diode D1 and the second diode D2 on the collector side of the first switching element Tr1, and has a first capacitance terminal a to which one end of the intermediate capacitor Cf is connected, And a second capacitance terminal b which is drawn from between the first switching element Tr1 and the second switching element Tr2 and to which the other end of the intermediate capacitor Cf is connected. That is, the first capacitor terminal a and the second capacitor terminal b are terminals for connecting the intermediate capacitor Cf.
  • the semiconductor module 11 is pulled out from the first switching element Tr1, and the first on / off driving terminal f to which the driving signal is input and the second on / off driving that is pulled out from the second switching element Tr2 and to which the driving signal is input.
  • the semiconductor module 11 has a first load side terminal d drawn from the cathode side of the first diode D1 and a second load side terminal e drawn from the anode side of the second return diode RD2. .
  • the semiconductor module 11 has one end-side induction terminal c that is drawn from between the second diode D2 and the first switching element Tr1 and to which one end of the reactor L is connected.
  • the semiconductor module 11 may be configured to include a temperature detection unit that detects the internal temperature and a temperature detection terminal that is drawn from the temperature detection unit.
  • the Si material IGBT element is used for both the first switching element Tr1 and the second switching element Tr2, but a MOSFET using a SiC material may be used.
  • the Si diode is used as the first diode D1 and the second diode D2
  • an element such as an SBD (Schottky barrier diode) or a fast recovery diode made of SiC may be used.
  • Si material FWD free wheel diode
  • the first switching element Tr1 and the second switching element Tr2, the first diode D1 and the second diode D2, and the first free-wheeling diode RD1 and the second free-wheeling diode RD2 have a band gap compared to silicon (Si). May be composed of a wide band gap semiconductor such as silicon carbide (SiC), gallium nitride (GaN), or a diamond element.
  • the first switching element Tr1 and the second switching element Tr2, the first diode D1 and the second diode D2, and the first free-wheeling diode RD1 and the second free-wheeling diode RD2 are made of wide band gap semiconductors, so that they are conventionally used. The loss can be reduced as compared with the case where the Si-based switching element is used. But you may employ
  • the power conversion device 20 has four operation modes A to D with respect to the operation of the MLC circuit 2.
  • FIG. 3 is an explanatory diagram showing a state of the operation mode A in the MLC circuit 2 of the power conversion device 20.
  • the operation mode A is a state in which the first switching element Tr1 is off (Off) and the second switching element Tr2 is on (On).
  • the operation mode A energy is stored in the intermediate capacitor Cf.
  • FIG. 4 is an explanatory diagram showing a state of the operation mode B in the MLC circuit 2 of the power conversion device 20.
  • the operation mode B is a state in which the first switching element Tr1 is on and the second switching element Tr2 is off. In the operation mode B, the energy stored in the intermediate capacitor Cf is released.
  • FIG. 5 is an explanatory diagram showing a state of the operation mode C in the MLC circuit 2 of the power conversion device 20.
  • the operation mode C is a state in which the first switching element Tr1 is off and the second switching element Tr2 is off. In the operation mode C, the energy of the reactor L is released.
  • FIG. 6 is an explanatory diagram showing a state of the operation mode D in the MLC circuit 2 of the power conversion device 20.
  • the operation mode D is a state in which the first switching element Tr1 is on and the second switching element Tr2 is on. In the operation mode D, energy is accumulated in the reactor L.
  • the control circuit 5 appropriately adjusts the time ratio of the four operation modes A to D via the MLC driving circuit 6, it is possible to perform a boosting operation with an arbitrary boosting ratio.
  • the MLC control unit 5e causes the MLC control unit 5e to make the voltage Vcf between the terminals of the intermediate capacitor Cf about half of the output voltage Vout in the steady state.
  • the drive circuit 6 is controlled.
  • the magnitude relationship among the input voltage Vin, the output voltage Vout, and the terminal voltage Vcf of the intermediate capacitor Cf is “output voltage Vout> input voltage Vin> terminal voltage Vcf”.
  • the MLC control unit 5e controls the MLC circuit 2 via the MLC driving circuit 6 so as to be in the operation mode A in which the first switching element Tr1 is off and the second switching element Tr2 is on. To do.
  • the path of the reactor L ⁇ the second diode D2 ⁇ the intermediate capacitor Cf ⁇ the second switching element Tr2 is conducted, and energy is transferred to the reactor L and the intermediate capacitor Cf.
  • the MLC control unit 5e controls the MLC circuit 2 so as to be in the operation mode C in which the first switching element Tr1 is off and the second switching element Tr2 is off.
  • the operation mode C the path of the reactor L ⁇ the second diode D 2 ⁇ the first diode D 1 ⁇ the smoothing capacitor 3 is conducted, and the energy accumulated in the reactor L is transferred to the smoothing capacitor 3.
  • the MLC control unit 5e controls the MLC circuit 2 so as to be in the operation mode B in which the first switching element Tr1 is on and the second switching element Tr2 is off.
  • the path of the reactor L ⁇ the first switching element Tr1 ⁇ the intermediate capacitor Cf ⁇ the first diode D1 ⁇ the smoothing capacitor 3 is conducted, and the energy accumulated in the intermediate capacitor Cf is transferred to the smoothing capacitor 3 and the reactor Energy is stored in L.
  • the MLC control unit 5e controls the MLC circuit 2 to the operation mode C.
  • the MLC control unit 5e repeats the above series of operations (operation mode A ⁇ operation mode C ⁇ operation mode B ⁇ operation mode C) when the step-up ratio by the MLC circuit 2 is set to be twice or less.
  • the output voltage Vout boosted according to an arbitrary boost ratio from 1 to 2 is output to the load side with respect to the input voltage Vin.
  • the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2 are applied with a voltage smaller than the output voltage Vout.
  • the current I 1 and the current I 2 have the relationship of the following formula (1). Equation (1) means that a current larger than the output current flows through the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2.
  • the MLC control unit 5e is configured so that, in a steady state, the terminal voltage Vcf of the intermediate capacitor Cf is approximately a half of the output voltage Vout.
  • the drive circuit 6 is controlled.
  • the magnitude relationship among the input voltage Vin, the output voltage Vout, and the terminal voltage Vcf of the intermediate capacitor is “output voltage Vout> terminal voltage Vcf> input voltage Vin”.
  • the MLC control unit 5e controls the MLC circuit 2 via the MLC driving circuit 6 so that the operation mode D is in a state where the first switching element Tr1 is on and the second switching element Tr2 is on. To do. In the operation mode D, the path of the reactor L ⁇ the first switching element Tr1 ⁇ the second switching element Tr2 is conducted, and energy is transferred to the reactor L.
  • the MLC control unit 5e controls the MLC circuit 2 so as to be in the operation mode A in which the first switching element Tr1 is off and the second switching element Tr2 is on.
  • the path of the reactor L ⁇ the second diode D2 ⁇ the intermediate capacitor Cf ⁇ the second switching element Tr2 is conducted, and the energy stored in the reactor L is transferred to the intermediate capacitor Cf.
  • the MLC control unit 5e controls the MLC circuit 2 so as to be in the operation mode D in which the first switching element Tr1 is on and the second switching element Tr2 is on.
  • the path of the reactor L ⁇ the first switching element Tr1 ⁇ the second switching element Tr2 is conducted, and energy is transferred to the reactor L.
  • the MLC control unit 5e controls the MLC circuit 2 so as to be in the operation mode B in which the first switching element Tr1 is on and the second switching element Tr2 is off.
  • the path of reactor L ⁇ first switching element Tr1 ⁇ intermediate capacitor Cf ⁇ first diode D1 ⁇ smoothing capacitor 3 is conducted, and energy accumulated in reactor L and intermediate capacitor Cf is transferred to smoothing capacitor 3. .
  • the MLC control unit 5e repeats the above-described series of operations (operation mode D ⁇ operation mode A ⁇ operation mode D ⁇ operation mode B) when the step-up ratio by the MLC circuit 2 is doubled or more.
  • the output voltage Vout boosted according to an arbitrary step-up ratio of 2 or more with respect to the input voltage Vin is output to the load side.
  • the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2 are applied with a voltage smaller than the output voltage Vout.
  • the relationship between the input voltage Vin and the output voltage Vout is 1 to n
  • the relationship of the above formula (1) is established between the current I 1 and the current I 2 as shown in FIG. That is, a current larger than the output current flows through the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2.
  • the semiconductor module 11 formed by packaging the semiconductor element since the semiconductor module 11 formed by packaging the semiconductor element has terminals for connecting peripheral components, the multilevel chopper circuit having an intermediate capacitor is provided. It is possible to realize a one-package semiconductor device. Therefore, since peripheral components can be easily connected to the miniaturized semiconductor module 11, the board mounting area and the wiring inductance are reduced, and the power converter and the air conditioner including the power converter are included. Miniaturization can be realized. That is, according to the power conversion device 20, by configuring the semiconductor element as a module, it is possible to improve the cooling efficiency and reduce the restriction on the impedance of the wiring pattern, and the semiconductor module 11 is connected to the MLC circuit 2. Since it has the terminal which connects a structural member etc., the power converter device 20 can be designed easily and cheaply.
  • FIG. 8 is a schematic diagram of the semiconductor module 12 according to the second embodiment.
  • the semiconductor module 12 is a package of the semiconductor elements of the MLC circuit 2 and the rectifier 1.
  • the same reference numerals are used for the same constituent members as those in the first embodiment.
  • the step-up module 11A and the third diode D3, the fourth diode D4, the fifth diode D5, the sixth diode D6, the seventh diode D7, and the eighth diode D8 are bridge-connected.
  • the rectifier 1 is provided.
  • the semiconductor module 12 includes a first capacitance terminal a drawn from between the first diode D1 and the second diode D2, and a second drawn from between the first switching element Tr1 and the second switching element Tr2. It has a capacitance terminal b, a first load side terminal d, a second load side terminal e, a first on / off drive terminal f, and a second on / off drive terminal g.
  • the semiconductor module 12 is drawn from between the second diode D2 and the first switching element Tr1 and connected to one end of the reactor L, a third diode D3, a fifth diode D5,
  • the other end side induction terminal h is drawn from the cathode side of the seventh diode D7 and connected to the other end of the reactor L. That is, the reactor L is connected to the one end side induction terminal c and the other end side induction terminal h, and is a constituent member of the power conversion device 20 that is required when the control circuit 5 performs step-up control.
  • the third diode D3 and the fourth diode D4 are connected in series, the fifth diode D5 and the sixth diode D6 are connected in series, and the seventh diode D7 and the eighth diode D8 are connected in series. Yes.
  • the third diode D3, the fifth diode D5, and the seventh diode D7 are connected in parallel.
  • the semiconductor module 12 is drawn from the cathode side of the fourth diode D4, the sixth diode D6, and the eighth diode D8 (the anode side of the third diode D3, the fifth diode D5, and the seventh diode D7), and is commercially available.
  • Power supply terminals i, j, and k are connected to a power supply.
  • the semiconductor module 12 in which the semiconductor elements of the MLC circuit 2 and the rectifier 1 are packaged has terminals for connecting peripheral components, the semiconductor elements constituting the MLC circuit 2 and the rectifier 1 are packaged in one package. Can be realized.
  • diodes D1 to D8 diodes made of Si are used, but SBD (Schottky barrier diode) made of SiC may be used. Other configurations and operations are the same as those in the first embodiment.
  • FIG. 9 is a schematic diagram of the semiconductor module 13 according to the third embodiment.
  • the semiconductor module 13 is a package of the semiconductor elements of the MLC circuit 2 and the inverter circuit 4.
  • the same reference numerals are used for the same constituent members as those in the first embodiment.
  • the semiconductor module 13 includes a step-up module 11A and a plurality of switching elements Tr3 to Tr8 and a plurality of free-wheeling diodes RD3 to RD8 connected in parallel to each of the plurality of switching elements Tr3 to Tr8. And an inverter circuit 4.
  • the third to eighth switching elements Tr3 to Tr8 constituting the rectifier 1 are switching elements necessary for the control circuit 5 to perform three-phase AC sine wave modulation driving.
  • the semiconductor module 12 includes a first capacitance terminal a drawn from between the first diode D1 and the second diode D2, and a second drawn from between the first switching element Tr1 and the second switching element Tr2.
  • a capacitor terminal b one end side induction terminal c, a first load side terminal d, a second load side terminal e, a first on / off drive terminal f, and a second on / off drive terminal g; Yes.
  • the semiconductor module 13 inputs a drive signal to each of the third switching element Tr3, the fourth switching element Tr4, the fifth switching element Tr5, the sixth switching element Tr6, the seventh switching element Tr7, and the eighth switching element Tr8. It has six input terminals l, m, n, o, p, q. That is, the third to eighth switching elements Tr3 to Tr8 are provided with input terminals 1 to q for inputting a drive signal from the inverter drive circuit 7.
  • the semiconductor module 13 includes the third switching element Tr3 and the fourth switching element Tr4, the fifth switching element Tr5 and the sixth switching element Tr6, and the seventh switching element Tr7 and the eighth switching element Tr8.
  • output terminals x, y, and z that output an AC power supply for driving the motor.
  • the output terminals x, y, and z are terminals to which the motor 31a of the compressor 31 is connected, for example.
  • the semiconductor module 13 was drawn from the anode side of the third free-wheeling diode RD3, the fourth free-wheeling diode RD4, the fifth free-wheeling diode RD5, the sixth free-wheeling diode RD6, the seventh free-wheeling diode RD7, and the eighth free-wheeling diode RD8.
  • Another output terminal r, s, t, u, v, w is provided. That is, in the semiconductor module 13, between the third switching element Tr3 and the fourth switching element Tr4, between the fifth switching element Tr5 and the sixth switching element Tr6, and between the seventh switching element Tr7 and the eighth switching element Tr8.
  • an IGBT element made of a Si material is used for any of the first to eighth switching elements Tr1 to Tr8, but a MOSFET using an SiC material may be used.
  • the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2 constituting the MLC circuit 2 are the voltages of the third to eighth switching elements Tr3 to Tr8 constituting the inverter circuit 4. Since a semiconductor element smaller than the rated withstand voltage may be employed, cost can be reduced. As an example, when the rated voltage of the third to eighth switching elements Tr3 to Tr8 is 1200V, and the rated voltage of the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2 is 600V.
  • the voltage rectified by the three-phase 200V input and the three-phase 400V input can be boosted to nearly 800V.
  • the currents of the third to eighth switching elements Tr3 to Tr8 can be set smaller than the current ratings of the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2. Cost reduction can be achieved.
  • the semiconductor module 13 in which the semiconductor elements of the MLC circuit 2 and the inverter circuit 4 are packaged has a terminal for connecting peripheral components, one of the semiconductor elements constituting the MLC circuit 2 and the inverter circuit 4 is provided. Packaging can be realized. Other configurations and operations are the same as those in the first embodiment.
  • FIG. 10 is a schematic diagram of the semiconductor module 14 according to the fourth embodiment.
  • the semiconductor module 14 is a package of the semiconductor elements of the MLC circuit 2, the rectifier 1, and the inverter circuit 4.
  • the same reference numerals are used for the same components as those in the first to third embodiments.
  • the semiconductor module 14 includes a boost module 11 ⁇ / b> A, a rectifier 1, and an inverter circuit 4.
  • the semiconductor module 12 includes a first capacitor terminal a, a second capacitor terminal b, a first load side terminal d, a second load side terminal e, a first on / off drive terminal f, and a second on / off drive. It has a terminal g, one end side induction terminal c, and the other end side induction terminal h.
  • the semiconductor module 14 includes output terminals x, y, and z that output an AC power source for driving the motor, and other output terminals r, s, t, and u for suppressing the routing of an extra pattern during board design. , V, w, and power terminals i, j, k to which the commercial power supply 50 is connected.
  • FIG. 11 is a schematic diagram showing the arrangement of each terminal included in the semiconductor module 14.
  • the semiconductor module 14 is a power module that includes the semiconductor elements of the MLC circuit 2, the rectifier 1, and the inverter circuit 4.
  • the semiconductor module 14 is formed in a rectangular shape such as a square, for example, and includes a first capacitance terminal a, a second capacitance terminal b, one end side induction terminal c, a first load side terminal d, a second load side terminal e,
  • the first on / off driving terminal f and the second on / off driving terminal g are provided on one side of the rectangular shape of the semiconductor module 14.
  • the semiconductor elements constituting the power conversion device 20 (first to eighth diodes D1 to D8, first to eighth free-wheeling diodes RD1 to RD8, first To the eighth switching elements Tr1 to Tr8), the material to be applied is selected, and at least the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2 are formed using a wide band gap semiconductor as a material. Has been.
  • the elements (the first diode D1 and the second diode D2, the first free-wheeling diode RD1 and the second free-wheeling diode RD2, A configuration is adopted in which a wide band gap material is applied to the first switching element Tr1 and the second switching element Tr2). For this reason, cost can be reduced and the size of the package of the semiconductor module 14 can be reduced.
  • the first switching element Tr1, the second switching element Tr2, the first diode D1, and the second diode D2 may be formed using silicon (Si) as a material.
  • the semiconductor module 14 in which the semiconductor elements of the MLC circuit 2, the rectifier 1 and the inverter circuit 4 are packaged has terminals for connecting peripheral components, the MLC circuit 2, the rectifier 1 and the inverter circuit 1 can be realized as a single package.
  • Other configurations and operations are the same as those in the first to third embodiments.
  • FIG. 1 shows an example in which the rectifier 1 is a three-phase rectifier corresponding to a commercial power supply 50 composed of a three-phase AC power supply, but a single-phase rectifier corresponding to a single-phase AC power supply is adopted as the rectifier 1.
  • the rectifier 1 is a three-phase rectifier corresponding to a commercial power supply 50 composed of a three-phase AC power supply, but a single-phase rectifier corresponding to a single-phase AC power supply is adopted as the rectifier 1.
  • May be. 1 illustrates the inverter circuit 4 that converts a DC voltage into a three-phase AC voltage, but the inverter circuit 4 may be configured to convert a DC voltage into a single-phase AC voltage.
  • the power conversion device 20 drives the motor 31a of the compressor 31.
  • the power conversion device 20 is a fan that is provided in the condenser 32 or the evaporator 34.
  • a fan motor (not shown) may be driven.
  • the semiconductor modules 11 to 13 shown in FIGS. 2, 8, and 9 may be formed in a rectangular shape like the semiconductor module 14, and the terminals a to g for taking out the main elements of the MLC circuit 2 are semiconductors.
  • the modules 11 to 13 may be provided on one side.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Air Conditioning Control Device (AREA)
  • Rectifiers (AREA)
  • Dc-Dc Converters (AREA)

Abstract

L'invention concerne un dispositif de conversion de courant qui comprend : un module à semi-conducteur dans lequel un premier élément de commutation et un second élément de commutation connectés à une charge et connectés en série l'un avec l'autre, une première diode de reflux connectée en parallèle avec le premier élément de commutation, et une seconde diode de reflux connectée en parallèle avec le second élément de commutation sont mis sous boîtier ; un condensateur intermédiaire connecté en parallèle avec le premier élément de commutation ; et une réactance connectée au côté charge du premier élément de commutation. Dans le dispositif de conversion de courant, le module à semi-conducteur comporte : une première borne de condensateur qui est amenée à l'extérieur à partir du côté charge du premier élément de commutation et à laquelle une extrémité du condensateur intermédiaire est connectée ; et une seconde borne de condensateur qui est amenée à l'extérieur à partir d'entre le premier élément de commutation et le second élément de commutation et à laquelle l'autre extrémité du condensateur intermédiaire est connectée.
PCT/JP2015/052986 2015-02-03 2015-02-03 Dispositif de conversion de courant et dispositif de climatisation WO2016125255A1 (fr)

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JP2016572981A JPWO2016125255A1 (ja) 2015-02-03 2015-02-03 電力変換装置及び空気調和装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020171163A (ja) * 2019-04-04 2020-10-15 富士電機株式会社 電力変換装置および電源装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014912A1 (fr) * 2010-07-30 2012-02-02 三菱電機株式会社 Convertisseur cc-cc
JP3175985U (ja) * 2009-02-03 2012-06-07 加賀電子株式会社 電源装置および電子機器
JP2012228114A (ja) * 2011-04-21 2012-11-15 Toyota Motor Corp パワーモジュール及び該パワーモジュールを搭載したハイブリッド車又は電気自動車
JP2013183571A (ja) * 2012-03-02 2013-09-12 Mitsubishi Electric Corp 電力変換装置並びにそれを備えた圧縮機、送風機、空気調和機及び冷蔵庫

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3175985U (ja) * 2009-02-03 2012-06-07 加賀電子株式会社 電源装置および電子機器
WO2012014912A1 (fr) * 2010-07-30 2012-02-02 三菱電機株式会社 Convertisseur cc-cc
JP2012228114A (ja) * 2011-04-21 2012-11-15 Toyota Motor Corp パワーモジュール及び該パワーモジュールを搭載したハイブリッド車又は電気自動車
JP2013183571A (ja) * 2012-03-02 2013-09-12 Mitsubishi Electric Corp 電力変換装置並びにそれを備えた圧縮機、送風機、空気調和機及び冷蔵庫

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020171163A (ja) * 2019-04-04 2020-10-15 富士電機株式会社 電力変換装置および電源装置
JP7263893B2 (ja) 2019-04-04 2023-04-25 富士電機株式会社 電力変換装置および電源装置

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