WO2016123992A1 - 换热装置及具有其的半导体制冷冰箱 - Google Patents
换热装置及具有其的半导体制冷冰箱 Download PDFInfo
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- WO2016123992A1 WO2016123992A1 PCT/CN2015/091091 CN2015091091W WO2016123992A1 WO 2016123992 A1 WO2016123992 A1 WO 2016123992A1 CN 2015091091 W CN2015091091 W CN 2015091091W WO 2016123992 A1 WO2016123992 A1 WO 2016123992A1
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- heat exchange
- exchange device
- fins
- heat
- hole
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
Definitions
- the invention relates to the technical field of heat exchange equipment, in particular to a heat exchange device and a semiconductor refrigeration refrigerator having the heat exchange device.
- the heat exchanger of the prior art may be composed of a plurality of fins arranged in parallel at predetermined intervals, a plurality of heat transfer tubes which are inserted substantially perpendicularly into the fins and have a refrigerant flow therein, and a forced convection heat dissipation for the fins.
- the composition of the fan Existing fans can be directly attached to the circumferential edge of each fin to blow airflow to the gap between each two adjacent fins, or to draw airflow from the gap between each two adjacent fins. .
- Such a heat exchanger is relatively large in size and requires a large installation space, and is not suitable for installation in a small space.
- heat dissipation of a heat source having a high heat flux density such as a semiconductor refrigerating sheet may not achieve an ideal effect.
- An object of the first aspect of the present invention is to overcome at least one of the drawbacks of the prior art heat exchange apparatus, and to provide a novel heat exchange apparatus having a compact structure and a small volume.
- a further object of the first aspect of the present invention is to maximize the heat dissipation or cooling efficiency of the heat exchange device for heat sources or sources of high heat flux density.
- An object of the second aspect of the present invention is to provide a semiconductor refrigeration refrigerator having the above heat exchange device.
- a heat exchange apparatus comprising a plurality of fins and a fan, the plurality of fins being correspondingly disposed in parallel spaced apart to form a fin set.
- each of the fins is provided with a receiving through hole and at least one through hole spaced apart from the receiving through hole, and the receiving through hole of each of the fins is configured to define the fin set An accommodation space extending along an axis of each of the receiving through holes; and the fan is disposed in the receiving space.
- the fan is configured to draw airflow from its air inlet zone and blow it to a gap between each two adjacent fins.
- the fan is a centrifugal fan, and a rotation axis of the blade coincides with an axis of each of the receiving through holes to take in airflow from the axial direction of the centrifugal fan and use a centrifugal force to direct the airflow to every two The gap between adjacent fins is blown.
- each of the fins is a plate having a central receiving hole and a rectangular outer contour.
- the contour of the receiving through hole of each of the fins is parallel to the outer contour of the fin; the number of through holes of each of the fins is eight, evenly distributed on the corresponding fins.
- the heat exchange device further includes: at least one heat conductor, the fin group being mounted to each of the heat conductors through a through hole of each of the fins.
- each of the heat conductors is a heat pipe, and includes a main pipe that is closed at both ends, each of the main pipes has a first pipe segment and a second pipe segment, and the first pipe segment is configured to be thermally connected to a heat source or a cold source; And a furcation tube for dissipating heat or cooling is respectively extended at one or more portions of the second pipe section of each of the main tubes; each of the furcation tubes passes through a corresponding one of each of the fins Through the tube through hole.
- the second pipe section of each of the main pipes includes a first straight pipe portion having one end in communication with the corresponding first pipe segment and a first straight pipe portion in a direction perpendicular to the first straight pipe portion a second straight pipe portion extending from the other end of the end; and a starting end of the furcation pipe of each of the heat conductors is located at a first straight pipe portion of the corresponding second pipe segment; each of the heat conductors
- the second straight tube portion of the second tube section passes through a corresponding through tube through hole of each of the fins.
- the heat exchange device further includes: a fixed bottom plate having one or more grooves on one surface thereof; and a fixed cover plate having one or more grooves on one surface thereof, configured to be fixed with the fixing
- the bottom plate cooperates to sandwich a first tube segment of each of the main tubes between a recess of the fixed cover and a recess of the fixed base.
- a semiconductor refrigerating refrigerator comprising a liner, a semiconductor refrigerating sheet and a heat exchange device; the heat exchange device being configured to dissipate heat from a hot end of the semiconductor refrigerating sheet to The ambient air, or the cooling amount from the cold end of the semiconductor refrigeration sheet is transferred to the storage compartment of the inner tank, wherein the heat exchange device is any one of the above heat exchange devices; and the heat exchange A portion of each of the heat conductors of the device is thermally coupled to the hot or cold end of the semiconductor refrigeration sheet; each fin of the heat exchange device is used to dissipate heat into the ambient air or to cool the storage compartment.
- the fan is installed in the fin group, the structure of the heat exchange device is compact, and the volume of the heat exchange device is remarkably reduced.
- the heat exchange device of the present invention and the semiconductor refrigerating refrigerator having the same have a plurality of branching tubes for dissipating heat or cooling on the second pipe section, the heat dissipation or cooling efficiency is remarkably improved, so that The heat exchange device is particularly suitable for heat/cooling of high heat flux density sources such as semiconductor refrigeration sheets.
- Figure 1 is a schematic front view of a heat exchange device in accordance with one embodiment of the present invention.
- FIG. 2 is a schematic left side view of a heat exchange device in accordance with one embodiment of the present invention.
- FIG. 3 is a schematic structural view of a fin in a heat exchange device according to an embodiment of the present invention.
- FIG. 4 is a schematic structural view of a heat conductor in a heat exchange device according to an embodiment of the present invention.
- Figure 5 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention.
- Figure 6 is a schematic rear view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.
- FIG. 1 is a schematic front view of a heat exchange device in accordance with one embodiment of the present invention. As shown in Figure 1, and with reference to Figures 2 and 3. Embodiments of the present invention provide a compact heat exchange device.
- the heat exchange device can generally include a plurality of fins 400 and a fan 500, the plurality of fins 400 being disposed in parallel spaced apart to form a set of fins.
- each of the fins 400 is provided with a receiving through hole 410 and at least one through hole 420 spaced apart from the receiving through hole 410, and the receiving of each of the fins 400
- the through hole 410 is configured to define the fin group to define the accommodation space 430 that extends along the axis of each of the accommodation through holes 410.
- the fan 500 is disposed in the accommodation space 430.
- the fan 500 can be configured to draw airflow from its intake region and blow it into the gap between each two adjacent fins 400.
- the heat exchange device of the embodiment of the present invention installs the fan 500 in the fin group, which significantly reduces the volume of the heat exchange device.
- each of the fins 400 has a plate having a central portion that accommodates the through hole 410 and has a rectangular outer shape.
- the contour of the receiving through hole 410 of each of the fins 400 is parallel to the outer contour of the fins 400, and the number of the through-holes 420 of each of the fins 400 is eight, evenly distributed on the corresponding fins 400.
- the fan 500 may be a centrifugal fan whose axis of rotation coincides with the axis of each of the receiving through holes 410 to take in airflow from the axial direction of the centrifugal fan and use centrifugal force to direct the airflow to each of the two adjacent fins 400.
- the gap between the blows That is, the blower 500 draws air from its axial direction and then draws out the airflow around it, thereby forcibly convectively dissipating or cooling the plurality of fins 400.
- the heat exchange device further includes at least one heat conductor 200 to which a set of fins is mounted through each of the fins 420 of each fin 400.
- each of the heat conductors 200 can be a heat pipe.
- each of the heat conductors 200 may also be a heat transfer tube for the refrigerant to flow therethrough.
- Each of the heat conductors 200 can include a main tube 210 that is closed at both ends, each main tube 210 having a first tube section 211 and a second tube section 212 that is configured to be thermally coupled to a heat or cold source.
- a branching pipe 220 for heat dissipation or cooling is respectively extended at one or more portions of the second pipe section 212 of each main pipe 210 to improve the heat dissipation or cooling efficiency of the heat exchange device.
- Each furcation tube 220 passes through a respective through tube through hole 420 of each fin 400.
- each furcation tube 220 can be in communication with the working chamber of the respective main tube 210 to facilitate vapor flow within the thermal conductor 200.
- the wick in each furcation tube 220 and the suction in the main tube 210 The liquid core is connected.
- the wick in each furcation tube 220 and the wick in the main tube 210 are in close contact with the inner wall of the corresponding tube to facilitate the flow of the working liquid.
- the diameter of each furcation tube 220 may be equal to the diameter of the main tube 210. In some alternative embodiments of the invention, the diameter of each furcation tube 220 may also be less than the diameter of the main tube 210.
- the first tube section 211 of each main tube 210 is formed by extending a predetermined length from one end of the main tube 210 to the other end of the main tube 210.
- the second tube section 212 of each main tube 210 is formed by extending a predetermined length from the other end of the main tube 210 to one end of the main tube 210.
- first pipe section 211 of each main pipe 210 may be a straight pipe, and the first pipe sections 211 of the plurality of main pipes 210 are located in the same plane in parallel intervals.
- the second pipe section 212 of each main pipe 210 includes a first straight pipe portion 2121 whose one end is in communication with the corresponding first pipe section 211 and a second straight pipe portion 2121 extending from the other end of the first straight pipe portion 2121 in a direction perpendicular to the first straight pipe portion 2121. a second straight tube portion 2122 that is closed at the end.
- the first straight tube portions 2121 of the second tube segments 212 of the plurality of main tubes 210 are located in parallel in the same plane.
- the starting end of the furcation tube 220 of each heat conductor 200 is located at the first straight tube portion 2121 of the corresponding second tube segment 212, and each furcation tube 220 is perpendicular to the corresponding main tube 210 from a corresponding portion of the corresponding main tube 210.
- the direction extends outward.
- the projection of the furcation tube 220 of each of the heat conductors 200 in a plane perpendicular to the respective first straight tube portions 2121 coincides with the projection of the respective second straight tube portions 2122 in the plane.
- the second straight tube portion 2122 of the second tube segment 212 of each heat conductor 200 also passes through a respective through tube through hole 420 of each fin 400.
- each main pipe 210 and the first straight pipe section 2121 of the second pipe section 212 may be disposed in parallel, and each main pipe 210 further includes a connecting pipe section 213 connected between the first pipe section 211 and the second pipe section 212, It is disposed at an angle of 100 to 170 with both the first pipe section 211 and the first straight pipe section 2121 of the second pipe section 212.
- the heat exchange device of the embodiment of the present invention may include four heat conductors 200.
- the main tubes 210 of the four heat conductors 200 are symmetrically in the same plane with respect to a geometric plane of symmetry, and a heat conductor 200 on the same side of the geometric plane of symmetry
- the length of the connecting pipe section 213 is smaller than the length of the connecting pipe section 213 of the other heat conductor 200 to facilitate the rational layout of the four heat conductors 200.
- the number of the bifurcation tubes 220 of each of the heat conductors 200 is one such that the furcation tube 220 and the second straight tube portion 2122 of each of the heat conductors 200 pass through a corresponding through tube on each of the fins 400, respectively. Hole 420.
- the heat exchange device in the embodiment of the present invention further includes a fixed bottom plate 310 and a fixed cover plate 320.
- the fixed bottom plate 310 has one or more grooves on one surface thereof, and the other surface can abut the hot end or the cold end of the semiconductor refrigerating sheet 150, that is, the first tube portion 211 of each of the sintered heat pipes 200 can pass through the fixed bottom plate 310.
- the heat source or the cold source is thermally connected.
- the fixed cover plate 320 also has one or more grooves on one surface thereof, and is configured to cooperate with the fixed bottom plate 310 to sandwich the first pipe section 211 of each main pipe 210 in the groove of the fixed cover plate 320 and the fixed bottom plate 310. Between the grooves. After the fixed bottom plate 310 and the fixed cover plate 320 are clamped to the heat conductor 200, the three are firmly fixed together by a welding process or a mechanical extrusion process for effective heat transfer, usually in the heat conductor 200 and the fixed bottom plate 310/fixed cover 320. Apply thermal grease or the like to the contact surface.
- the first tube section 211 of each main tube 210 may be a straight tube, and the first tube sections 211 of the plurality of main tubes 210 are located in the same plane in parallel intervals.
- the second pipe section 212 of each main pipe 210 is a straight pipe, and the second pipe sections 212 of the plurality of main pipes 210 are located in the same plane in parallel intervals.
- the furcation tubes 220 of each of the heat conductors 200 are respectively located on opposite sides of the respective main tubes 210.
- the furcation tubes 220 on each side of the main tube 210 are each at least three, and the starting ends of the furcation tubes 220 on each side of the main tube 210 are equally spaced on the main tube 210 in the extending direction of the main tube 210.
- the number of furcation tubes 220 on the side of the main pipe 210 is equal to the other side of the main pipe 210; and each of the branch pipes 220 on the side of the main pipe 210 is in line with a corresponding branch pipe 220 on the other side of the main pipe 210.
- the furcation tube 220 on the side of the main tube 210 can also be spaced apart from the furcation tube 220 on the other side of the main tube 210.
- the heat exchange device in the embodiment of the present invention may include: two fin sets and two fans 500. Each of the fans 500 is disposed in an accommodation space 430 defined by a respective fin group.
- FIG. 5 is a schematic right side view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.
- an embodiment of the present invention further provides a semiconductor refrigeration refrigerator including a liner 100, a semiconductor refrigerating sheet 150, and a heat exchange device.
- the heat exchange device is configured to receive the semiconductor refrigerating sheet 150. The heat at the hot end is dissipated into the ambient air or the cold amount from the cold end of the semiconductor refrigerating sheet 150 is transferred to the storage compartment of the inner liner 100.
- the heat exchange device is the heat exchange device of any of the above embodiments. Portions of each of the heat conductors 200 of the heat exchange device are thermally coupled to the hot or cold ends of the semiconductor fins 150.
- Each fin 400 of the heat exchange device is used to dissipate heat into the ambient air or to cool the storage compartment.
- Each of the heat conductors 200 of the heat exchange device can be a heat pipe.
- the heat exchange device is a hot end heat exchange device
- the first pipe section 211 of the main pipe 210 of each of the heat conductors 200 is thermally connected to the hot end of the semiconductor refrigerating sheet 150
- the second pipe section 212 of the main pipe 210 of each heat conductor 200 It may be above the first pipe section 211.
- the heat exchange device is a cold junction heat exchange device
- the first pipe section 211 of the main pipe 210 of each of the heat conductors 200 is thermally connected to the cold end of the semiconductor refrigerating sheet 150
- the second pipe section 212 of the main pipe 210 of each heat conductor 200 It may be below the first pipe section 211.
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Abstract
一种换热装置及具有该换热装置的半导体制冷冰箱，换热装置包括多个翅片（400）和风机（500），多个翅片（400）相对应的平行间隔地设置以形成翅片组，每个翅片（400）上开设有容纳通孔（410）和至少一个与容纳通孔（410）间隔开的穿管通孔（420），每个翅片（400）的容纳通孔（410）配置成使翅片组限定出沿每个容纳通孔（410）的轴线延伸的容纳空间（430）；风机（500）设置于容纳空间（430）内。因为换热装置及具有其的半导体制冷冰箱中的风机（500）安装于翅片组内，使换热装置的结构紧凑，且显著减小了换热装置的体积。
Description
本申请要求了申请日为2015年05月27日，申请号为201510055830.9，发明名称为“换热装置及具有其的半导体制冷冰箱”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本发明涉及换热设备技术领域，特别是涉及一种换热装置及具有该换热装置的半导体制冷冰箱。
现有技术中的热交换器可由以规定间隔平行排列的多个翅片、大致垂直地插入各翅片中且在内部有制冷剂流动的多个传热管、以及用于翅片强制对流散热的风机构成。现有的风机可直接固定于每个翅片的周向边缘，以向每两个相邻的翅片之间的间隙吹送气流，或从每两个相邻的翅片之间的间隙吸入气流。这种热交换器的体积比较大，需要安装空间大等问题，不适合在较小的空间内安装。此外，对于半导体制冷片等高热流密度的热源进行散热，现有的热交换器可能达不到理想的效果。
发明内容
本发明第一方面的一个目的旨在克服现有的换热装置的至少一个缺陷，提供一种结构新颖的换热装置，其结构紧凑、体积小。
本发明第一方面的一个进一步的目的是要尽量提高换热装置的散热或传冷效率，以适用于高热流密度的热源或冷源。
本发明第二方面的一个目的是要提供一种具有上述换热装置的半导体制冷冰箱。
根据本发明的第一方面，本发明提供了一种换热装置，包括多个翅片和风机，所述多个翅片相对应的平行间隔地设置以形成翅片组。特别地，每个所述翅片上开设有容纳通孔和至少一个与所述容纳通孔间隔开的穿管通孔，每个所述翅片的容纳通孔配置成使所述翅片组限定出沿每个所述容纳通孔的轴线延伸的容纳空间；且所述风机设置于所述容纳空间内。
可选地，所述风机配置成从其进风区吸入气流并向每两个相邻翅片之间的间隙吹送。
可选地，所述风机为离心式风扇，其扇叶的旋转轴线与每个所述容纳通孔的轴线重合，以从所述离心式风扇的轴向吸入气流并利用离心力将气流向每两个相邻翅片之间的间隙吹送。
可选地，每个所述翅片为中央具有所述容纳通孔且外轮廓为矩形的板片。
可选地，每个所述翅片的容纳通孔的轮廓与所述翅片的外轮廓平行；每个所述翅片的穿管通孔为8个，均布在相应所述翅片上。
可选地，所述换热装置还包括：至少一个导热体，所述翅片组通过每个所述翅片的穿管通孔安装于每个所述导热体。
可选地，每个所述导热体为热管，包括两端均封闭的主管，每个所述主管具有第一管段和第二管段，所述第一管段配置成与热源或冷源热连接；且在每个所述主管的第二管段的一个或多个部位处分别延伸出一个用于散热或传冷的分叉管；每个所述分叉管穿过每个所述翅片的相应穿管通孔。
可选地，每个所述主管的第二管段包括一端与相应所述第一管段连通的第一直管部分和沿垂直于所述第一直管部分的方向从所述第一直管部分的另一端延伸出的、末端封闭的第二直管部分；且每个所述导热体的分叉管的起始端位于相应所述第二管段的第一直管部分；每个所述导热体的第二管段的第二直管部分穿过每个所述翅片的相应穿管通孔。
可选地，所述换热装置还包括：固定底板，其一个表面上具有一个或多个凹槽；和固定盖板，其一个表面上具有一个或多个凹槽，配置成与所述固定底板配合以将每个所述主管的第一管段夹置在所述固定盖板的凹槽和所述固定底板的凹槽之间。
根据本发明的第二方面，本发明提供了一种半导体制冷冰箱，包括内胆、半导体制冷片和换热装置；所述换热装置配置成将来自所述半导体制冷片的热端的热量散发到环境空气中，或将来自所述半导体制冷片的冷端的冷量传递至所述内胆的储物间室，其中，所述换热装置为上述任一种换热装置；且所述换热装置的每个导热体的部分与所述半导体制冷片的热端或冷端热连接；所述换热装置的每个翅片用于向环境空气中散热或向储物间室传冷。
本发明的换热装置及具有其的半导体制冷冰箱中因为风机安装于翅片组内，使换热装置的结构紧凑，且显著减小了换热装置的体积。
进一步地，由于本发明的换热装置及具有其的半导体制冷冰箱中因为第二管段上延伸出多个用于散热或传冷的分叉管，显著提高了其散热或传冷效率，以使该换热装置特别适用于半导体制冷片等高热流密度的热源/冷源进行散热/传冷。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些
附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的换热装置的示意性主视图；
图2是根据本发明一个实施例的换热装置的示意性左视图；
图3是根据本发明一个实施例的换热装置中翅片的示意性结构图；
图4是根据本发明一个实施例的换热装置中导热体的示意性结构图；
图5是根据本发明一个实施例的半导体制冷冰箱的示意性右视图；
图6是根据本发明一个实施例的半导体制冷冰箱的示意性后视图。
图1是根据本发明一个实施例的换热装置的示意性主视图。如图1所示，并参考图2和图3。本发明实施例提供了一种结构紧凑的换热装置。换热装置一般性可包括多个翅片400和风机500，多个翅片400相对应的平行间隔地设置以形成翅片组。特别地，在本发明实施例的换热装置中，每个翅片400上开设有容纳通孔410和至少一个与容纳通孔410间隔开的穿管通孔420，每个翅片400的容纳通孔410配置成使翅片组限定出沿每个容纳通孔410的轴线延伸的容纳空间430。风机500设置于容纳空间430内。该风机500可配置成从其进风区吸入气流并向每两个相邻翅片400之间的间隙吹送。本发明实施例的换热装置将风机500安装于翅片组中，显著减小了换热装置的体积。
具体地，如图3所示，每个翅片400为中央具有容纳通孔410且外轮廓为矩形的板片。每个翅片400的容纳通孔410的轮廓与翅片400的外轮廓平行，每个翅片400的穿管通孔420为8个，均布在相应翅片400上。风机500可为离心式风扇，其扇叶的旋转轴线与每个容纳通孔410的轴线重合，以从离心式风扇的轴向吸入气流并利用离心力将气流向每两个相邻翅片400之间的间隙吹送。也就是说，风机500从其轴向吸风，然后在其四周将气流甩出，从而对多个翅片400进行强制对流散热或传冷。
在本发明的一些实施例中，换热装置还包括至少一个导热体200，翅片组通过每个翅片400的穿管通孔420安装于每个导热体200。优选地，每个导热体200可为热管。在本发明的一些替代性实施例中，每个导热体200也可为其内用于制冷剂流过的传热管。
图4是根据本发明一个实施例的换热装置中导热体200的示意性结构图。每个导热体200可包括两端均封闭的主管210，每个主管210具有第一管段211和第二管段212，第一管段211配置成与热源或冷源热连接。优选地，在每个主管210的第二管段212的一个或多个部位处分别延伸出一个用于散热或传冷的分叉管220，以提高换热装置的散热或传冷效率。每个分叉管220穿过每个翅片400的相应穿管通孔420。
在本发明的一些实施例中，每个分叉管220的工作腔可与相应主管210的工作腔相连通，以便于导热体200内的蒸汽流动。每个分叉管220内的吸液芯与主管210内的吸
液芯相连接。每个分叉管220内的吸液芯与主管210内的吸液芯均紧贴相应管内壁，以便于工作液体的流动。进一步地，每个分叉管220的直径可等于主管210的直径。在本发明的一些替代性实施例中，每个分叉管220的直径也可小于主管210的直径。
在本发明的一些优选的实施例中，每个主管210的第一管段211是从主管210一端向主管210另一端延伸一预设长度形成的。每个主管210的第二管段212是从主管210另一端向主管210一端延伸一预设长度形成的。
例如，每个主管210的第一管段211可为直管，多个主管210的第一管段211平行间隔地位于同一平面内。每个主管210的第二管段212包括一端与相应第一管段211连通的第一直管部分2121和沿垂直于第一直管部分2121的方向从第一直管部分2121的另一端延伸出的、末端封闭的第二直管部分2122。多个主管210的第二管段212的第一直管部分2121平行间隔地位于同一平面内。每个导热体200的分叉管220的起始端位于相应第二管段212的第一直管部分2121，且每个分叉管220是从相应主管210的相应部位处沿垂直于相应主管210的方向向外延伸出的。每个导热体200的分叉管220在一垂直于相应第一直管部分2121的平面内的投影与相应第二直管部分2122在该平面内的投影重合。优选地，每个导热体200的第二管段212的第二直管部分2122也穿过每个翅片400的相应穿管通孔420。
每个主管210的第一管段211和第二管段212的第一直管部分2121可平行设置，且每个主管210还包括连接在第一管段211和第二管段212之间的连接管段213，其与第一管段211和第二管段212的第一直管部分2121均呈100°至170°的角度设置。本发明实施例的换热装置可包括4个导热体200，4个导热体200的主管210关于一几何对称面对称地处于同一平面内，位于该几何对称面同一侧的一个导热体200的连接管段213的长度小于另一导热体200的连接管段213的长度，以便于4个导热体200的合理布局。每个导热体200的分叉管220的数量为1个，以使每个导热体200的分叉管220和第二直管部分2122分别穿过每个翅片400上的一个相应穿管通孔420。
为了便于导热体200与热源与冷源的热连接，以及导热体200的固定，本发明实施例中的换热装置还包括固定底板310和固定盖板320。固定底板310的一个表面上具有一个或多个凹槽，另一表面可贴靠在半导体制冷片150的热端或冷端，即每个烧结热管200的第一管段211可通过固定底板310与热源或者冷源热连接。固定盖板320的一个表面上也具有一个或多个凹槽，配置成与固定底板310配合以将每个主管210的第一管段211夹置在固定盖板320的凹槽和固定底板310的凹槽之间。固定底板310和固定盖板320夹住导热体200后采用焊接工艺或者机械挤压工艺将三者牢靠的固定在一起，为有效传热，通常在导热体200与固定底板310/固定盖板320的接触面上涂抹导热硅脂等。
在本发明的一些替代性实施例中，每个主管210的第一管段211可为直管，多个主管210的第一管段211平行间隔地位于同一平面内。每个主管210的第二管段212为直管，多个主管210的第二管段212平行间隔地位于同一平面内。每个导热体200的分叉管220分别位于相应主管210的相对两侧。主管210每一侧的分叉管220均为至少3个，主管210每一侧的分叉管220的起始端在主管210上沿主管210的延伸方向等间距地布置。主管210一侧的分叉管220的数量与主管210另一侧的相等；且主管210一侧的每个分叉管220与主管210另一侧的一个相应分叉管220处于同一直线上。由本领域技术人员所习知的，主管210一侧的分叉管220也可与主管210另一侧的分叉管220相互间隔地设置。本发明实施例中的换热装置可包括：两个翅片组和两个风机500。每个风机500分别设置于一个相应翅片组限定出的容纳空间430内。
图5是根据本发明一个实施例的半导体制冷冰箱的示意性右视图。如图5所示，并参考图6，本发明实施例还提供了一种半导体制冷冰箱，其包括内胆100、半导体制冷片150和换热装置；换热装置配置成将来自半导体制冷片150的热端的热量散发到环境空气中，或将来自半导体制冷片150的冷端的冷量传递至内胆100的储物间室。特别地，换热装置为上述任一实施例中的换热装置。换热装置的每个导热体200的部分与半导体制冷片150的热端或冷端热连接。换热装置的每个翅片400用于向环境空气中散热或向储物间室传冷。
该换热装置的每个导热体200可为热管。当该换热装置为热端换热装置，其每个导热体200的主管210的第一管段211与半导体制冷片150的热端热连接，每个导热体200的主管210的第二管段212可处于第一管段211的上方。当该换热装置为冷端换热装置，其每个导热体200的主管210的第一管段211与半导体制冷片150的冷端热连接，每个导热体200的主管210的第二管段212可处于第一管段211的下方。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。
Claims (10)
- 一种换热装置，包括多个翅片和风机，所述多个翅片相对应的平行间隔地设置以形成翅片组，其中每个所述翅片上开设有容纳通孔和至少一个与所述容纳通孔间隔开的穿管通孔，每个所述翅片的容纳通孔配置成使所述翅片组限定出沿每个所述容纳通孔的轴线延伸的容纳空间；且所述风机设置于所述容纳空间内。
- 根据权利要求1所述的换热装置，其中所述风机配置成从其进风区吸入气流并向每两个相邻翅片之间的间隙吹送。
- 根据权利要求2所述的换热装置，其中所述风机为离心式风扇，其扇叶的旋转轴线与每个所述容纳通孔的轴线重合，以从所述离心式风扇的轴向吸入气流并利用离心力将气流向每两个相邻翅片之间的间隙吹送。
- 根据权利要求1所述的换热装置，其中每个所述翅片为中央具有所述容纳通孔且外轮廓为矩形的板片。
- 根据权利要求4所述的换热装置，其中每个所述翅片的容纳通孔的轮廓与所述翅片的外轮廓平行；每个所述翅片的穿管通孔为8个，均布在相应所述翅片上。
- 根据权利要求1所述的换热装置，还包括：至少一个导热体，所述翅片组通过每个所述翅片的穿管通孔安装于每个所述导热体。
- 根据权利要求6所述的换热装置，其中每个所述导热体为热管，包括两端均封闭的主管，每个所述主管具有第一管段和第二管段，所述第一管段配置成与热源或冷源热连接；且在每个所述主管的第二管段的一个或多个部位处分别延伸出一个用于散热或传冷的分叉管；每个所述分叉管穿过每个所述翅片的相应穿管通孔。
- 根据权利要求7所述的换热装置，其中每个所述主管的第二管段包括一端与相应所述第一管段连通的第一直管部分和沿垂直于所述第一直管部分的方向从所述第一直管部分的另一端延伸出的、末端封闭的第二直管部分；且每个所述导热体的分叉管的起始端位于相应所述第二管段的第一直管部分；每个所述导热体的第二管段的第二直管部分穿过每个所述翅片的相应穿管通孔。
- 根据权利要求7所述的换热装置，还包括：固定底板，其一个表面上具有一个或多个凹槽；和固定盖板，其一个表面上具有一个或多个凹槽，配置成与所述固定底板配合以将每个所述主管的第一管段夹置在所述固定盖板的凹槽和所述固定底板的凹槽之间。
- 一种半导体制冷冰箱，包括内胆、半导体制冷片和换热装置；所述换热装置配置成将来自所述半导体制冷片的热端的热量散发到环境空气中，或将来自所述半导体制冷片的冷端的冷量传递至所述内胆的储物间室，其中所述换热装置为权利要求1至9中任一项所述的换热装置；且所述换热装置的每个导热体的部分与所述半导体制冷片的热端或冷端热连接；所述换热装置的每个翅片用于向环境空气中散热或向储物间室传冷。
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