WO2016123993A1 - 换热装置及具有其的半导体制冷冰箱 - Google Patents

换热装置及具有其的半导体制冷冰箱 Download PDF

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Publication number
WO2016123993A1
WO2016123993A1 PCT/CN2015/091092 CN2015091092W WO2016123993A1 WO 2016123993 A1 WO2016123993 A1 WO 2016123993A1 CN 2015091092 W CN2015091092 W CN 2015091092W WO 2016123993 A1 WO2016123993 A1 WO 2016123993A1
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Prior art keywords
pipe
heat
main
exchange device
heat exchange
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PCT/CN2015/091092
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English (en)
French (fr)
Inventor
陶海波
张奎
刘建如
李鹏
李春阳
戚斐斐
姬立胜
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青岛海尔股份有限公司
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Publication of WO2016123993A1 publication Critical patent/WO2016123993A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/02—Details of evaporators
    • F25B2339/024—Evaporators with refrigerant in a vessel in which is situated a heat exchanger
    • F25B2339/0242—Evaporators with refrigerant in a vessel in which is situated a heat exchanger having tubular elements

Definitions

  • the present invention relates to a heat exchange device, and more particularly to a heat exchange device having a sintered heat pipe and a semiconductor refrigeration refrigerator having the same.
  • Sintering heat pipe is the use of evaporative cooling, so that the temperature difference between the two ends of the sintering heat pipe is very large, so that the heat is quickly transmitted. Because of its superior heat transfer performance and technical characteristics, it is widely used in the field of cooling and heat dissipation.
  • the existing sintered heat pipe extends from one end thereof along a single path to the other end, and the extended path may be straight, L-shaped or U-shaped.
  • One end of the sintering heat pipe is an evaporation section (heating section), and the other end is a condensation section (cooling section), and an adiabatic section can be arranged in the middle of the two sections according to the application.
  • the liquid in the wicking core evaporates and vaporizes, and the steam flows to the other end under a slight pressure difference to release heat to condense into a liquid, and the liquid flows back to the evaporation section along the porous material by the capillary force.
  • This cycle does not allow heat to pass from one end of the sintered heat pipe to the other end.
  • plate fins are usually provided on the condensation section or the evaporation section of the sintering heat pipe for heat dissipation or cooling.
  • the existing heat sink may not achieve the desired effect.
  • a further object of the first aspect of the present invention is to maximize the heat dissipation or cooling efficiency of the heat exchange device for heat sources or sources of high heat flux density.
  • An object of the second aspect of the present invention is to provide a semiconductor refrigeration refrigerator having the above heat exchange device.
  • the invention provides a heat exchange device comprising one or more sintered heat pipes.
  • each of the sintered heat pipes includes a main pipe that is closed at both ends, and a branch pipe is respectively extended at one or more portions of each of the main pipes; and hovering on each of the branch pipes Set a spiral fin.
  • the main pipe of each of the sintering heat pipes has a first pipe segment and a second pipe segment, the first pipe segment being configured to be thermally connected to a heat source or a cold source; and a starting end of the furcation pipe of each of the sintering heat pipes They are all located on the second pipe section of the corresponding main pipe for heat dissipation or cooling.
  • a first pipe section of each of the main pipes is formed by extending a predetermined length from one end of the main pipe to the other end of the main pipe; the second pipe section of each of the main pipes is from the other end of the main pipe The main end of the main pipe extends a preset The length is formed.
  • the first pipe segment of each of the main pipes is a straight pipe, and the first pipe segments of the plurality of main pipes are located in the same plane in parallel intervals.
  • the heat exchange device further includes: a fixed bottom plate having one or more grooves on one surface thereof; and a fixed cover plate having one or more grooves on one surface thereof, configured to be fixed with the fixing
  • the bottom plate cooperates to sandwich a first tube segment of each of the main tubes between a recess of the fixed cover and a recess of the fixed base.
  • the second pipe section of each of the main pipes is a straight pipe, and the second pipe segments of the plurality of main pipes are located in the same plane in parallel intervals.
  • the heat exchange device further includes: a retaining member sequentially fixed to an end portion of the second pipe segment of the corresponding main pipe away from the corresponding first pipe segment at different portions along the length direction thereof; and And/or another retaining member, in turn at a different portion along its length, is fixed to an end of the second tubular section of the respective said main pipe adjacent to the respective first tubular section.
  • the heat exchange device further includes: a fan disposed on the same side of the plurality of the furcation pipes, so that the furcation pipes of each of the sintering heat pipes are located in the air supply area of the fan or sucked Windy area.
  • the fan is an axial fan whose axis of rotation is perpendicular to each of the furcation tubes.
  • the present invention provides a semiconductor refrigerating refrigerator including a liner, a semiconductor refrigerating sheet, and a heat exchange device; the heat exchange device configured to dissipate heat from a hot end of the semiconductor refrigerating sheet To ambient air, or to transfer cold from the cold end of the semiconductor refrigeration sheet to the storage compartment of the liner.
  • the heat exchange device is any one of the above heat exchange devices; and a part or all of the main pipe of each of the sintering heat pipes of the heat exchange device is thermally connected to a hot end or a cold end of the semiconductor refrigerating sheet;
  • Each of the spiral fins of the heat exchange device is used to dissipate heat into the ambient air or to cool the storage compartment.
  • the heat exchange device of the present invention and the semiconductor refrigeration refrigerator having the same have a plurality of furcation tubes for heat dissipation or cooling and spiral fins thereon, thereby significantly improving the heat dissipation or cooling efficiency thereof, so that the replacement
  • the thermal device is particularly suitable for heat/cooling of high heat flux density such as semiconductor refrigeration sheets for heat dissipation/cooling.
  • the heat exchange device of the present invention and the special structure of each of the sintering heat pipes in the semiconductor refrigeration refrigerator having the same can make the structure of the heat exchange device compact.
  • Figure 1 is a schematic front view of a heat exchange device in accordance with one embodiment of the present invention.
  • FIG. 2 is a schematic left side view of a heat exchange device in accordance with one embodiment of the present invention.
  • Figure 3 is a schematic partial structural view of a heat exchange device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a sintered heat pipe in a heat exchange device according to an embodiment of the present invention.
  • Figure 5 is a schematic right side view of a semiconductor refrigerating refrigerator in accordance with one embodiment of the present invention.
  • Figure 6 is a schematic rear view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.
  • FIG. 1 is a schematic front view of a heat exchange device in accordance with one embodiment of the present invention.
  • an embodiment of the present invention provides a heat exchange device, which is particularly suitable for heat dissipation or cooling of a heat source or a cold source having a high heat flux density such as a semiconductor refrigerating sheet 150.
  • the heat exchange device may include one or more sintered heat pipes 200 to take full advantage of the excellent thermal conductivity of the sintered heat pipe 200.
  • each sintered heat pipe 200 includes a main pipe 210 that is closed at both ends, and some or all of the pipe sections of the main pipe 210 may be configured to be thermally coupled to a heat source or a cold source.
  • a furcation tube 220 is extended at one or more locations of each of the main tubes 210 for heat dissipation or cooling.
  • a spiral fin 400 is spirally disposed on each of the furcation tubes 220 to improve the heat dissipation or cooling efficiency of the heat exchange device.
  • each furcation tube 220 can be in communication with the working chamber of the respective main tube 210 to facilitate vapor flow within the sintered heat tube 200.
  • the wick in each furcation tube 220 is connected to the wick in the main tube 210.
  • the wick in each furcation tube 220 and the wick in the main tube 210 are in close contact with the inner wall of the corresponding tube to facilitate the flow of the working liquid.
  • the diameter of each furcation tube 220 may be equal to the diameter of the main tube 210. In some alternative embodiments of the invention, the diameter of each branch of the furcation tube 220 may also be less than the diameter of the section of the main tube 210.
  • the main tube 210 of each of the sintered heat pipes 200 has a first pipe section 211 and a second pipe section 212, the first pipe section 211 being configured to be thermally connected to a heat source or a cold source; and each of the sintering heat pipes 200
  • the starting ends of the fork tubes 220 are all located on the second tube section 212 of the respective main tube 210 for heat dissipation or cooling.
  • the first pipe section 211 of each main pipe 210 is formed by extending a predetermined length from one end of the main pipe 210 to the other end of the main pipe 210; the second pipe section 212 of each main pipe 210 is extended from the other end of the main pipe 210 to one end of the main pipe 210.
  • the preset length is formed.
  • the first pipe section 211 of each main pipe 210 may be a straight pipe, and the first pipe sections 211 of the plurality of main pipes 210 are located in the same plane in parallel intervals.
  • the second pipe section 212 of each main pipe 210 is a straight pipe, and the second pipe sections 212 of the plurality of main pipes 210 are located in the same plane in parallel intervals.
  • the first pipe section 211 and the second pipe section 212 of each main pipe 210 may be disposed in parallel, and each main pipe 210 further includes a connecting pipe section 213 connected between the first pipe section 211 and the second pipe section 212, and the first pipe section 211 and The second tube segments 212 are each disposed at an angle of 100° to 170°.
  • the heat exchange device of the embodiment of the present invention may include four sintering heat pipes 200, and the main pipes 210 of the four sintering heat pipes 200 are symmetrically in the same plane with respect to a geometric symmetry plane, and one burning on the same side of the geometric symmetry plane
  • the length of the connecting pipe section 213 of the junction heat pipe 200 is smaller than the length of the connecting pipe section 213 of the other sintering heat pipe 200 to facilitate the rational layout of the four sintering heat pipes 200.
  • the heat exchange device in the embodiment of the present invention further includes a fixed bottom plate 310 and a fixed cover plate 320.
  • the fixed bottom plate 310 has one or more grooves on one surface thereof, and the other surface can abut the hot end or the cold end of the semiconductor refrigerating sheet 150, that is, the first tube portion 211 of each of the sintered heat pipes 200 can pass through the fixed bottom plate 310.
  • the heat source or the cold source is thermally connected.
  • the fixed cover plate 320 also has one or more grooves on one surface thereof, and is configured to cooperate with the fixed bottom plate 310 to sandwich the first pipe section 211 of each main pipe 210 in the groove of the fixed cover plate 320 and the fixed bottom plate 310. Between the grooves. After the fixed bottom plate 310 and the fixed cover plate 320 are clamped to the sintering heat pipe 200, the three are firmly fixed together by a welding process or a mechanical extrusion process for effective heat transfer, usually in the sintering heat pipe 200 and the fixed bottom plate 310/fixed cover plate 320. Apply thermal grease or the like to the contact surface.
  • the heat exchange device is also Including one and/or two retaining members 600, wherein one of the retaining members 600 can be sequentially fixed at different ends along the length thereof to the end of the second tubular section 212 of a corresponding main pipe 210 away from the corresponding first tubular section 211 .
  • the other retaining members 600 may be sequentially secured to the ends of the second tubular section 212 of a respective main tube 210 adjacent the respective first tubular section 211 at different locations along its length.
  • the retaining member 600 can be a retaining steel strip, a retaining steel wire, a retaining tubular member, or the like.
  • the furcation tubes 220 of each of the sintered heat pipes 200 are located on opposite sides of the respective main tubes 210, respectively.
  • the furcation tubes 220 on each side of the main tube 210 are each at least three, and the starting ends of the furcation tubes 220 on each side of the main tube 210 are equally spaced on the main tube 210 in the extending direction of the main tube 210.
  • the number of furcation tubes 220 on the side of the main pipe 210 is equal to the other side of the main pipe 210; and each of the branch pipes 220 on the side of the main pipe 210 is in line with a corresponding branch pipe 220 on the other side of the main pipe 210.
  • the furcation tube 220 on one side of the main tube 210 and the furcation tube 220 on the other side of the main tube 210 are spaced apart from each other.
  • the furcation tubes 220 of each of the sintered heat pipes 200 are located on the same side of the respective main tubes 210.
  • Each furcation tube 220 extends outwardly from a corresponding portion of the respective main tube 210 in a direction perpendicular to the respective direction.
  • the heat exchange device may further include a fan 500 disposed on the same side of the plurality of furcation tubes 220, for example, when the second tube segments 212 are placed in a vertical direction, each of the furcation tubes 220 is horizontally longitudinal When the direction is extended, the fan 500 may be disposed on the lateral left side or the lateral right side of all the furcation tubes 220.
  • the fan 500 can be configured to: draw airflow from its inlet zone and blow it to the gap between each two adjacent helical fins, or from each two adjacent helical fins The gap between them draws in the airflow and blows it to the air supply area.
  • the fan 500 may be an axial fan whose axis of rotation is perpendicular to each of the furcation tubes 220.
  • FIG. 5 is a schematic right side view of a semiconductor refrigeration refrigerator in accordance with one embodiment of the present invention.
  • an embodiment of the present invention further provides a semiconductor refrigeration refrigerator including a liner 100, a semiconductor refrigerating sheet 150, and a heat exchange device.
  • the heat exchange device is configured to receive the semiconductor refrigerating sheet 150. The heat at the hot end is dissipated into the ambient air or the cold amount from the cold end of the semiconductor refrigerating sheet 150 is transferred to the storage compartment of the inner liner 100.
  • the heat exchange device is the heat exchange device of any of the above embodiments.
  • Part or all of the main tube 210 of each of the sintering heat pipes 200 of the heat exchange device is thermally connected to the hot or cold end of the semiconductor refrigerating sheet 150; each spiral fin 400 of the heat exchange device is used to dissipate heat into the ambient air or Passing cold to the storage room.
  • Part or all of the main pipe 210 of each of the sintering heat pipes 200 of the heat exchange device may be thermally connected to the hot or cold end of the semiconductor refrigerating sheet 150 through the fixed bottom plate 310 and the heat conducting block.
  • the first pipe section 211 of the main pipe 210 of each of the sintering heat pipes 200 of the heat exchange device is thermally connected to the hot or cold end of the semiconductor refrigerating sheet 150; the furcation pipe 220 of each of the sintering heat pipes 200 and the spiral thereon
  • the fins 400 are used to dissipate heat into the ambient air or to cool the storage compartment.
  • the heat exchange device is a hot end heat exchange device
  • the first pipe section 211 of the main pipe 210 of each of the sintering heat pipes 200 is thermally connected to the hot end of the semiconductor refrigerating sheet 150, and the second main pipe 210 of each of the sintering heat pipes 200 is second.
  • the pipe section 212 can be above the first pipe section 211.
  • the first pipe section 211 of the main pipe 210 of each of the sintering heat pipes 200 is thermally connected to the cold end of the semiconductor refrigerating sheet 150, and the second pipe section 212 of the main pipe 210 of each of the sintering heat pipes 200 It may be below the first pipe section 211.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

换热装置及具有该换热装置的半导体制冷冰箱，该换热装置包括一个或多个烧结热管（200），每个烧结热管（200）包括两端均封闭的主管（210），在每个主管（210）的一个或多个部位处分别延伸出一个分叉管（220）；且在每个分叉管（220）上盘旋地套设一个螺旋翅片（400）。换热装置及具有该换热装置的半导体制冷冰箱中因为具有多个用于散热或传冷的分叉管（220）和其上的螺旋翅片（400），显著提高了其散热或传冷效率，以使该换热装置特别适用于对半导体制冷片等高热流密度的热源/冷源进行散热/传冷。

Description

换热装置及具有其的半导体制冷冰箱
本申请要求了申请日为2015年02月03日，申请号为201510056235.7，发明名称为“换热装置及具有其的半导体制冷冰箱”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及换热装置，特别是涉及具有烧结热管的换热装置及具有该换热装置的半导体制冷冰箱。
背景技术
烧结热管就是利用蒸发制冷，使得烧结热管两端温度差很大，使热量快速传导，因其优越的传热性能和技术特性而被广泛应用于传冷散热领域。现有的烧结热管从其一端沿唯一路径延伸至其另一端，该延伸路径可为直线、L型或U型。烧结热管的一端为蒸发段(加热段)，另一端为冷凝段(冷却段)，根据应用需要在两段中间可布置绝热段。当烧结热管的一端受热时毛纫芯中的液体蒸发汽化，蒸汽在微小的压差下流向另一端放出热量凝结成液体，液体再沿多孔材料靠毛细力的作用流回蒸发段。如此循环不己，热量由烧结热管的一端传至另一端。具有该烧结热管的换热装置中通常在该烧结热管的冷凝段或蒸发段上设置板式翅片，以用于散热或传冷。然而，对于半导体制冷片等高热流密度的热源进行散热，现有的散热装置可能达不到理想的效果。
发明内容
本发明第一方面的一个目的旨在克服现有的换热装置的至少一个缺陷，提供一种结构新颖的换热装置。
本发明第一方面的一个进一步的目的是要尽量提高换热装置的散热或传冷效率，以适用于高热流密度的热源或冷源。
本发明第二方面的一个目的是要提供一种具有上述换热装置的半导体制冷冰箱。
根据本发明的第一方面，本发明提供了一种换热装置，其包括一个或多个烧结热管。特别地，每个所述烧结热管包括两端均封闭的主管，在每个所述主管的一个或多个部位处分别延伸出一个分叉管；且在每个所述分叉管上盘旋地套设一个螺旋翅片。
可选地，每个所述烧结热管的主管具有第一管段和第二管段，所述第一管段配置成与热源或冷源热连接；且每个所述烧结热管的分叉管的起始端均位于相应所述主管的第二管段上，以进行散热或传冷。
可选地，每个所述主管的第一管段是从所述主管一端向所述主管另一端延伸一预设长度形成的；每个所述主管的第二管段是从所述主管另一端向所述主管一端延伸一预设 长度形成的。
可选地，每个所述主管的第一管段为直管，所述多个主管的第一管段平行间隔地位于同一平面内。
可选地，所述换热装置还包括：固定底板，其一个表面上具有一个或多个凹槽；和固定盖板，其一个表面上具有一个或多个凹槽，配置成与所述固定底板配合以将每个所述主管的第一管段夹置在所述固定盖板的凹槽和所述固定底板的凹槽之间。
可选地，每个所述主管的第二管段为直管，所述多个主管的第二管段平行间隔地位于同一平面内。
可选地，所述换热装置还包括：固位件，在沿其长度方向的不同部位处依次固定于一个相应所述主管的第二管段的远离相应所述第一管段的端部；和/或另一固位件，在沿其长度方向的不同部位处依次固定于一个相应所述主管的第二管段的邻近相应所述第一管段的端部。
可选地，所述换热装置还包括：风机，设置在多个所述分叉管的同侧，以使每个所述烧结热管的分叉管均位于所述风机的送风区或吸风区内。
可选地，所述风机为轴流风机，其扇叶的旋转轴线垂直于每个所述分叉管。
根据本发明的第二方面，本发明还提供了一种半导体制冷冰箱，包括内胆、半导体制冷片和换热装置；所述换热装置配置成将来自所述半导体制冷片的热端的热量散发到环境空气中，或将来自所述半导体制冷片的冷端的冷量传递至所述内胆的储物间室。特别地，所述换热装置为上述任一种换热装置；且所述换热装置的每个烧结热管的主管的部分或全部与所述半导体制冷片的热端或冷端热连接；所述换热装置的每个螺旋翅片用于向环境空气中散热或向储物间室传冷。
本发明的换热装置及具有其的半导体制冷冰箱中因为具有多个用于散热或传冷的分叉管和其上的螺旋翅片，显著提高了其散热或传冷效率，以使该换热装置特别适用于半导体制冷片等高热流密度的热源/冷源进行散热/传冷。
进一步地，由于本发明的换热装置及具有其的半导体制冷冰箱中每个烧结热管的特殊的结构可使换热装置的结构紧凑。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的换热装置的示意性主视图；
图2是根据本发明一个实施例的换热装置的示意性左视图；
图3是根据本发明一个实施例的换热装置的示意性局部结构图；
图4是根据本发明一个实施例的换热装置中烧结热管的示意性结构图；
图5是根据本发明一个实施例的半导体制冷冰箱的示意性右视图；
图6是根据本发明一个实施例的半导体制冷冰箱的示意性后视图。
具体实施方式
图1是根据本发明一个实施例的换热装置的示意性主视图。如图1所示，并参考图2和图3，本发明实施例提供了一种换热装置，特别适用于半导体制冷片150等高热流密度的热源或冷源进行散热或传冷，可应用于半导体制冷冰箱。该换热装置可包括一个或多个烧结热管200，以充分利用烧结热管200优良的导热性能。特别地，每个烧结热管200包括两端均封闭的主管210，主管210的部分或全部管段可配置成与热源或冷源热连接。在每个主管210的一个或多个部位处分别延伸出一个分叉管220，以进行散热或传冷。优选地，在每个分叉管220上盘旋地套设一个螺旋翅片400，以提高换热装置的散热或传冷效率。
在本发明的一些实施例中，每个分叉管220的工作腔可与相应主管210的工作腔相连通，以便于烧结热管200内的蒸汽流动。每个分叉管220内的吸液芯与主管210内的吸液芯相连接。每个分叉管220内的吸液芯与主管210内的吸液芯均紧贴相应管内壁，以便于工作液体的流动。进一步地，每个分叉管220的直径可等于主管210的直径。在本发明的一些替代性实施例中，每个分叉管220段的直径也可小于主管210段的直径。
在本发明的一些实施例中，每个烧结热管200的主管210具有第一管段211和第二管段212，第一管段211配置成与热源或冷源热连接；且每个烧结热管200的分叉管220的起始端均位于相应主管210的第二管段212上，以进行散热或传冷。例如，每个主管210的第一管段211是从主管210一端向主管210另一端延伸一预设长度形成的；每个主管210的第二管段212是从主管210另一端向主管210一端延伸一预设长度形成的。
在本发明的一些实施例中，如图4所示，每个主管210的第一管段211可为直管，多个主管210的第一管段211平行间隔地位于同一平面内。每个主管210的第二管段212为直管，多个主管210的第二管段212平行间隔地位于同一平面内。每个主管210的第一管段211和第二管段212可平行设置，且每个主管210还包括连接在第一管段211和第二管段212之间的连接管段213，其与第一管段211和第二管段212均呈100°至170°的角度设置。本发明实施例的换热装置可包括4个烧结热管200，4个烧结热管200的主管210关于一几何对称面对称地处于同一平面内，位于该几何对称面同一侧的一个烧 结热管200的连接管段213的长度小于另一烧结热管200的连接管段213的长度，以便于4个烧结热管200的合理布局。
为了便于烧结热管200与热源与冷源的热连接，以及烧结热管200的固定，本发明实施例中的换热装置还包括固定底板310和固定盖板320。固定底板310的一个表面上具有一个或多个凹槽，另一表面可贴靠在半导体制冷片150的热端或冷端，即每个烧结热管200的第一管段211可通过固定底板310与热源或者冷源热连接。固定盖板320的一个表面上也具有一个或多个凹槽，配置成与固定底板310配合以将每个主管210的第一管段211夹置在固定盖板320的凹槽和固定底板310的凹槽之间。固定底板310和固定盖板320夹住烧结热管200后采用焊接工艺或者机械挤压工艺将三者牢靠的固定在一起，为有效传热，通常在烧结热管200与固定底板310/固定盖板320的接触面上涂抹导热硅脂等。
在本发明的一些实施例中，由于每个烧结热管200的各个分叉管220与其它烧结热管200的分叉管220之间相互独立，各烧结热管200及烧结热管200上的螺旋翅片相互独立，为避免各烧结热管200及螺旋翅片400变形，避免因运输或安装等引起的分叉管220和螺旋翅片400不必要的变形以至于影响换热装置的性能，该换热装置还包括一个和/或两个固位件600，其中一个固位件600可在沿其长度方向的不同部位处依次固定于一个相应主管210的第二管段212的远离相应第一管段211的端部。另一固位件600可在沿其长度方向的不同部位处依次固定于一个相应主管210的第二管段212的邻近相应第一管段211的端部。例如，固位件600可以为固位钢条、固位钢丝、固位管件等。
在本发明的一些实施例中，每个烧结热管200的分叉管220分别位于相应主管210的相对两侧。主管210每一侧的分叉管220均为至少3个，主管210每一侧的分叉管220的起始端在主管210上沿主管210的延伸方向等间距地布置。主管210一侧的分叉管220的数量与主管210另一侧的相等；且主管210一侧的每个分叉管220与主管210另一侧的一个相应分叉管220处于同一直线上。由本领域技术人员所习知的，主管210一侧的分叉管220与主管210另一侧的分叉管220相互间隔地设置。在本发明的一些替代性实施例中，每个烧结热管200的分叉管220均位于相应主管210的同一侧。每个分叉管220是从相应主管210的相应部位处沿垂直于相应的方向向外延伸出的。
为了进一步提高换热效率，该换热装置还可包括风机500，设置在多个分叉管220的同侧，例如当第二管段212沿竖直方向放置，每个分叉管220沿水平纵向方向延伸时，风机500可设置在所有分叉管220的横向左侧或者横向右侧。风机500可配置成：从其进风区吸入气流并向每两个相邻螺旋翅片之间的间隙吹送，或从每两个相邻螺旋翅片之 间的间隙吸入气流并向其送风区吹送。具体地，该风机500可为轴流风机，其扇叶的旋转轴线垂直于每个分叉管220。
图5是根据本发明一个实施例的半导体制冷冰箱的示意性右视图。如图5所示，并参考图6，本发明实施例还提供了一种半导体制冷冰箱，其包括内胆100、半导体制冷片150和换热装置；换热装置配置成将来自半导体制冷片150的热端的热量散发到环境空气中，或将来自半导体制冷片150的冷端的冷量传递至内胆100的储物间室。特别地，换热装置为上述任一实施例中的换热装置。所述换热装置的每个烧结热管200的主管210的部分或全部与半导体制冷片150的热端或冷端热连接；换热装置的每个螺旋翅片400用于向环境空气中散热或向储物间室传冷。换热装置的每个烧结热管200的主管210的部分或全部可通过固定底板310和导热块与半导体制冷片150的热端或冷端热连接。
具体地，该换热装置的每个烧结热管200的主管210的第一管段211与半导体制冷片150的热端或冷端热连接；每个烧结热管200的分叉管220及其上的螺旋翅片400用于向环境空气中散热或向储物间室传冷。而且，当该换热装置为热端换热装置，其每个烧结热管200的主管210的第一管段211与半导体制冷片150的热端热连接，每个烧结热管200的主管210的第二管段212可处于第一管段211的上方。当该换热装置为冷端换热装置，其每个烧结热管200的主管210的第一管段211与半导体制冷片150的冷端热连接，每个烧结热管200的主管210的第二管段212可处于第一管段211的下方。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (10)

  1. 一种换热装置，包括一个或多个烧结热管，其特征在于，
    每个所述烧结热管包括两端均封闭的主管，在每个所述主管的一个或多个部位处分别延伸出一个分叉管；且
    在每个所述分叉管上盘旋地套设一个螺旋翅片。
  2. 根据权利要求1所述的换热装置，其特征在于，
    每个所述烧结热管的主管具有第一管段和第二管段，所述第一管段配置成与热源或冷源热连接；且
    每个所述烧结热管的分叉管的起始端均位于相应所述主管的第二管段上，以进行散热或传冷。
  3. 根据权利要求2所述的换热装置，其特征在于，
    每个所述主管的第一管段是从所述主管一端向所述主管另一端延伸一预设长度形成的；
    每个所述主管的第二管段是从所述主管另一端向所述主管一端延伸一预设长度形成的。
  4. 根据权利要求2所述的换热装置，其特征在于，
    每个所述主管的第一管段为直管，所述多个主管的第一管段平行间隔地位于同一平面内。
  5. 根据权利要求4所述的换热装置，其特征在于，还包括：
    固定底板，其一个表面上具有一个或多个凹槽；和
    固定盖板，其一个表面上具有一个或多个凹槽，配置成与所述固定底板配合以将每个所述主管的第一管段夹置在所述固定盖板的凹槽和所述固定底板的凹槽之间。
  6. 根据权利要求2所述的换热装置，其特征在于，
    每个所述主管的第二管段为直管，所述多个主管的第二管段平行间隔地位于同一平面内。
  7. 根据权利要求2所述的换热装置，其特征在于，还包括：
    固位件，在沿其长度方向的不同部位处依次固定于一个相应所述主管的第二管段的远离相应所述第一管段的端部；和/或
    另一固位件，在沿其长度方向的不同部位处依次固定于一个相应所述主管的第二管段的邻近相应所述第一管段的端部。
  8. 根据权利要求1所述的换热装置，其特征在于，还包括：
    风机，设置在多个所述分叉管的同侧，以使每个所述烧结热管的分叉管均位于所述风机的送风区或吸风区内。
  9. 根据权利要求8所述的换热装置，其特征在于，
    所述风机为轴流风机，其扇叶的旋转轴线垂直于每个所述分叉管。
  10. 一种半导体制冷冰箱，包括内胆、半导体制冷片和换热装置；所述换热装置配置成将来自所述半导体制冷片的热端的热量散发到环境空气中，或将来自所述半导体制冷片的冷端的冷量传递至所述内胆的储物间室，其特征在于，
    所述换热装置为权利要求1至9中任一项所述的换热装置；且
    所述换热装置的每个烧结热管的主管的部分或全部与所述半导体制冷片的热端或冷端热连接；
    所述换热装置的每个螺旋翅片用于向环境空气中散热或向储物间室传冷。
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