WO2016123789A1 - 导热辐射基板及反射式辐射散热发光件 - Google Patents

导热辐射基板及反射式辐射散热发光件 Download PDF

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WO2016123789A1
WO2016123789A1 PCT/CN2015/072389 CN2015072389W WO2016123789A1 WO 2016123789 A1 WO2016123789 A1 WO 2016123789A1 CN 2015072389 W CN2015072389 W CN 2015072389W WO 2016123789 A1 WO2016123789 A1 WO 2016123789A1
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layer
heat
reflective
radiation
light
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PCT/CN2015/072389
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English (en)
French (fr)
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陈智成
钟明吉
蔡俊钦
吴俊毅
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远东科技大学
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Priority to PCT/CN2015/072389 priority Critical patent/WO2016123789A1/zh
Publication of WO2016123789A1 publication Critical patent/WO2016123789A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the invention relates to a heat-radiating radiation substrate and a reflective radiation heat-dissipating light-emitting component, in particular to a substrate for mounting an illuminant and using far-infrared radiation as a heat-dissipating means, and a reflective radiation-dissipating illuminating member comprising the substrate .
  • Light-emitting diodes have been widely used in recent years, and they have high photoelectric conversion efficiency, use of direct current, small size, long life, fixed wavelength and low heat. Several advantages have been greatly improved with the advancement of photoelectric technology. LEDs are widely used in the field of lighting and are also used in many types of lamps. In the application of the embedded/applied luminaire, due to the limitation of the thickness of the wall, the heat dissipation fins of the existing heat dissipation technology are limited in space. Furthermore, the embedded/applied luminaire is embedded/attached to the wall body, and the working heat energy radiated by the heat dissipation fins is not released by the wall covering, and cannot be effectively dissipated.
  • the metal soldering layers are respectively disposed on the side of the copper layer facing away from the ceramic layer, and the metal soldering layer is respectively combined with the LED package body and the heat dissipation module, and the above structure is used when the LED package body emits light
  • the waste heat will be transmitted to the heat dissipation module through the DBC structural layer, and the decay rate of the waste heat through the DBC structure layer is extremely low, which achieves high durability and rapid practical progress.
  • the present invention provides a heat conductive radiation substrate and a reflective radiation heat dissipation light-emitting member.
  • the thermally conductive radiation substrate of the present invention comprises: a reflective layer defining a reflective surface; a far infrared radiation radiating layer disposed on the reflective surface; an insulating layer disposed on the reflective surface; a circuit layer, The corresponding layer is disposed on the insulating layer such that the circuit layer does not contact the reflective layer.
  • the material of the reflective layer is aluminum.
  • the far infrared radiation heat dissipation layer does not contact the insulation layer and the circuit layer.
  • the present invention further provides a reflective radiation heat-dissipating light-emitting member comprising the heat-radiating radiation substrate, further comprising: at least one light-emitting diode disposed on the reflective surface; and the light source generated by the light-emitting diode is projected toward a projection direction, Projecting toward the reflective layer, and reflecting the light source toward the projection direction by the reflective layer; the working heat generated by the LED is conducted to the far infrared radiation heat dissipation layer via the reflective layer, and is radiated by the far infrared radiation The layer radiates with far infrared rays and is reflected by the aforementioned reflective layer to dissipate heat in the aforementioned projection direction.
  • a power supply unit is connected to the foregoing circuit layer.
  • the efficacy of the thermally conductive radiation substrate of the present invention is:
  • the circuit layer is correspondingly disposed on the insulating layer so that the circuit layer does not contact the reflective layer, and the short circuit phenomenon can be avoided by contacting the circuit layer with the reflective layer.
  • the reflective radiation heat-dissipating light-emitting member according to the present invention can effectively project the light source generated by the light-emitting diode to the projection direction, and the working heat energy generated by the light-emitting diode can also be radiated from the far-infrared radiation manner toward the projection direction.
  • the thickness required in the depth is small, and it can be applied to places where space is limited, especially as an embedded/applied luminaire.
  • the reflective radiation heat-dissipating light-emitting member of the present invention further comprises a power supply unit connected to the circuit layer, so that the reflective radiation heat-dissipating light-emitting member according to the present invention can be disposed at a desired position according to the needs of the user; Fixed to the wall body set by the user, the working heat generated by the LED is conducted by the reflective layer to the far infrared radiation heat dissipation layer, and the far infrared radiation is radiated by the far infrared radiation layer through the reflective layer.
  • the reflection heat dissipates in the above-mentioned projection direction, so that the reflective radiation heat-dissipating illuminator according to the present invention has a good heat dissipation effect on the wall body, and avoids the phenomenon of high temperature light decay or shortened due to high temperature life.
  • Figure 1 is a perspective view of a reflective radiation heat-dissipating light-emitting member of the present invention
  • Figure 2 is a cross-sectional view of the reflective radiation heat-dissipating member of the present invention taken along line A-A;
  • Figure 3 is a cross-sectional view of the reflective radiation heat-dissipating member of the present invention taken along line B-B;
  • FIG. 4 is a schematic diagram of heat dissipation of the reflective radiation heat-dissipating light-emitting member of the present invention.
  • Figure 5 is a perspective view showing an implementation state of the reflective radiation heat-dissipating light-emitting member of the present invention.
  • Figure 6 is a cross-sectional view showing an embodiment of a reflective radiation heat-dissipating light-emitting member of the present invention.
  • the heat conductive radiation substrate of the present invention comprises: a reflective layer 1, a far infrared radiation heat dissipation layer 2, an insulation layer 3 and a circuit layer 4, wherein;
  • the reflective layer 1 is characterized by reflected light.
  • the reflective layer 1 is made of aluminum and defines a reflective surface 11 .
  • the far infrared radiation heat dissipation layer 2 is coated on the reflective surface 11 and has light transmissivity, wherein the The far-infrared radiation heat-dissipating coating is produced by the following steps: Step A. A solution of an inorganic metal salt such as a chloride salt, a sulfate or a nitrate or an alkoxy compound such as tetraethoxysilane is used as the first material. Step B. Mixing the above first material with water, an acidic solution such as hydrochloric acid, acetic acid or nitric acid, and adjusting the pH to less than 3, and then forming a gel by a sol-gel method.
  • Step A A solution of an inorganic metal salt such as a chloride salt, a sulfate or a nitrate or an alkoxy compound such as tetraethoxysilane is used as the first material.
  • Step B Mixing the above first material with water, an acidic solution such as hydro
  • the first material is mixed with water, an alkaline solution such as sodium hydroxide, and the pH is adjusted to be between 8 and 10, and then gelled by a sol-gel method.
  • the obtained gel is applied to the reflective surface 11 to calcine the reflective layer 1, wherein the calcination temperature is between 500 and 900 ° C, so that the gel forms minute crystal grains, and the far infrared rays are formed after being cooled. Radiating heat-dissipating coating.
  • the insulating layer 3 is made of a non-conductive material and is disposed on the reflecting surface 11 .
  • the circuit layer 4 is disposed on the insulating layer 3 so that the circuit layer 4 does not contact the reflective layer 1. This prevents the circuit layer 4 from coming into contact with the reflective layer 1 to cause a short circuit.
  • the far infrared radiation heat dissipation layer 2 also does not contact the insulation layer 3 and the circuit layer 4 in order to avoid the short circuit phenomenon caused by the contact of the circuit layer 4 with the far infrared radiation heat dissipation layer 2.
  • the heat-conducting radiation substrate of the invention has a plate shape, and has a small thickness in the depth, and can be applied to a space-limited place; and can be equipped with different illuminants to dissipate heat by heat radiation, so
  • heat dissipation and heat convection are used to dissipate heat, and the heat dissipation fins used need to occupy a large space, and cannot be applied to a space-limited place.
  • a reflective radiation heat-dissipating light-emitting device including the heat-radiating radiation substrate of the present invention further includes at least one light-emitting diode 5 , which is implemented by a light-emitting diode 5 .
  • the circuit layer 4 includes a positive electrode 41 and a negative circuit 42.
  • the LED 5 has a positive pin 51 and a negative pin 52, and the positive pin 51 is electrically coupled to the foregoing.
  • the positive electrode circuit 41, and the negative electrode pin 52) electrically links the negative electrode circuit 42 to further include a power supply unit 6 connected to the positive electrode circuit 41.
  • the foregoing negative electrode circuit 42 is configured to provide power required for the light emitting diode 5 to generate a light source.
  • the power supply unit 6 is implemented by a lithium battery or a household electric device.
  • the embodiment is implemented by a lithium battery and is provided with a switch 61. To control the opening and closing.
  • the light source generated by the light-emitting diode is projected toward a projection direction 7 and also projected toward the reflective layer 1 , and the light source is reflected by the reflective layer 1 toward the projection direction 7;
  • the working heat generated by the light-emitting diode 5 is conducted to the far-infrared radiation heat-dissipating layer 2 via the reflective layer 1, and is radiated by the far-infrared radiation heat-dissipating layer 2 by far-infrared rays, and is reflected by the reflective layer 1 toward the projection direction 7 .
  • FIG. 5 and FIG. 6 are diagrams showing an implementation state of the reflective radiation heat-dissipating light-emitting member according to the present invention disposed on the wall body A.
  • the reflective surface of the present invention can be adhered or screwed during implementation.
  • the radiant heat-dissipating illuminating member is close to the wall body A. Since the present invention dissipates heat by means of heat radiation, it is different from the prior art in that heat dissipation and heat convection are used for heat dissipation, and the installation requires a large space for the heat-dissipating fins.
  • the thickness of the wall A (the wall type) or the installation of the lamp is too convex to protrude from the wall body A (adhered type).
  • the light source generated by the light-emitting diode 5 can be projected through the reflective layer 1 in the projection direction 7 to improve the illuminance of the light-emitting diode 5, and the working heat generated by the photodiode can be transmitted through the reflective layer.
  • the problem that the convection path is blocked by the wall body A allows the reflective radiation heat-dissipating light-emitting member of the present invention to be fixed to the wall body A as well as a good heat-dissipating effect, thereby avoiding the phenomenon of high-temperature light decay or shortening due to high-temperature life.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种导热辐射基板及反射式辐射散热发光件，用以解决现有散热技术于应用上受空间限制的问题；所述的反射式辐射散热发光件包含：一反射层（1），其界定有一反射面（11）；一远红外线辐射散热层（2），其设置于该反射面（11）；一绝缘层（3），其设置于该反射面（11）；一电路层（4），其对应设置于该绝缘层（3）上，使该电路层（4）不接触前述反射层（1）；至少一发光二极管（5），其设置于前述反射面（11）；将所述发光二极管（5）所产生的工作热能，经由该反射层（1）传导至该远红外线辐射散热层（2），并由该远红外线辐射散热层（2）以远红外线辐射，经前述反射层（1）反射朝前述投射方向散热。

Description

导热辐射基板及反射式辐射散热发光件 技术领域
本发明有关于一种导热辐射基板及反射式辐射散热发光件，尤指一种用以装设发光体，并以远红外线辐射作为散热手段的基板，及包含该基板的反射式辐射散热发光件。
背景技术
发光二极管近年来大量的被使用，其具有高光电转换效率、使用直流电、体积小、寿命长、波长固定与低发热等几项优点，随着光电技术的进步大幅提升了发光二极管的亮度与效率，让发光二极管广泛使用于照明领域，也应用于诸多灯种之中。其中有关嵌/贴壁式的灯具在应用时，由于受壁体厚度的限制，因此现有散热技术的散热鳍片于使用上受到空间的限制。再者，嵌/贴壁式的灯具是嵌/贴于壁体中，散热鳍片所散发的工作热能受壁体包覆无从释放，而无法有效的进行散热。
如现有技术的中国台湾新型专利第M460223号「LED灯散热模块之结构」专利案，其指一种用于LED灯的DBC(Direct Bonded Copper，直接键合铜技术)导热结构，该LED灯是包含有一LED封装体、一DBC结构层及一散热模块，其中DBC结构层包含一陶瓷层、复数铜质层及复数金属焊接层，该些铜质层分别披覆于陶瓷层一侧处，且该些金属焊接层分别披覆于铜质层背离陶瓷层的侧处，而该金属焊接层分别与LED封装体及散热模块结合，由上述的结构，当LED封装体于使用发光时，产生出来的废热将透过DBC结构层传导至散热模块散出，且废热通过DBC结构层衰减率极低，此达成高耐用度及散热快速的实用进步性。
虽然现有技术能有效解决LED灯具的散热问题，但运用于嵌/贴壁式的灯具 时，仍然存在受壁体厚度影响，于设置前述散热模块时受到限制，并且由前述主体所排出的热，因受壁体包围而无法有效散去，导致散热效果不佳。
发明内容
为解决现有散热技术于应用上受空间限制的问题，本发明提出一种导热辐射基板及反射式辐射散热发光件。
本发明所述的导热辐射基板包括有：一反射层，其界定有一反射面；一远红外线辐射散热层，其设置于该反射面；一绝缘层，其设置于该反射面；一电路层，其对应设置于该绝缘层上，使该电路层不接触前述反射层。
其中该反射层的材质为铝。
其中该远红外线辐射散热层是不接触该绝缘层及该电路层。
本发明另外提出一种包含所述的导热辐射基板的反射式辐射散热发光件，进一步包含有：至少一发光二极管，其设置于前述反射面；所述发光二极管所产生额光源朝一投射方向投射，也朝该反射层投射，并由该反射层将光源朝前述投射方向反射；所述发光二极管所产生的工作热能，经由该反射层传导至该远红外线辐射散热层，并由该远红外线辐射散热层以远红外线辐射，经前述反射层反射朝前述投射方向散热。
进一步包含一供电单元连接前述电路层。
本发明导热辐射基板的功效在于：
1.是用以配合装设多种发光体实施，有别于现有技术以热传导及热对流的方式散热，本发明导热辐射基板，是以热辐射方式朝前述投射方向进行散热；因此有别现有散热鳍片所需占据较大的空间，本发明导热辐射基板于纵深所需的厚度较小，而能适用于空间受限的地方，而且工作热能朝前述投射方向进行散热，并不会因受壁体阻挡而无法有效散去，而导致散热效果不佳。
2.由该电路层对应设置于该绝缘层上，使该电路层不接触前述反射层，能避免电路层与该反射层接触造成短路现象。
3.由该远红外线辐射散热层是不接触该绝缘层及该电路层，能避免电路层与该远红外线辐射散热层接触造成短路现象。
本发明所述的反射式辐射散热发光件的功效在于：
1.由本发明所述的反射式辐射散热发光件能将发光二极管所产生的光源有效地往前述投射方向投射，并且该发光二极管所产生的工作热能也能由远红外线辐射方式朝前述投射方向散热；而有别现有技术，于纵深所需的厚度较小，而能适用于空间受限的地方，特别是作为嵌/贴壁式的灯具。
2.由本发明所述的反射式辐射散热发光件进一步包含一供电单元连接前述电路层，方便本发明所述的反射式辐射散热发光件能依使用者的需求，设置于所需的位置；如固定于使用者设定的壁体上，该发光二极管所产生的工作热能由所述反射层传导至该远红外线辐射散热层，并由该远红外线辐射散热层以远红外线辐射，经前述反射层反射朝前述投射方向散热，使本发明所述的反射式辐射散热发光件固定于壁体上同样具有良好的散热效果，而避免因高温光衰或是因高温寿命缩短的现象。
附图说明
图1是本发明反射式辐射散热发光件的立体图；
图2是本发明反射式辐射散热发光件的A-A剖面图；
图3是本发明反射式辐射散热发光件的B-B剖面图；
图4是本发明反射式辐射散热发光件的散热示意图；
图5是本发明反射式辐射散热发光件的实施状态立体图；
图6是本发明反射式辐射散热发光件的实施状态剖面图。
上述说明书附图中标记说明：
1           反射层
11       反射面
2        远红外线辐射散热层
3           绝缘层
4           电路层
41       正极电路
42       负极电路
5           发光二极管
51       正极接脚
52       负极接脚
6           供电单元
61       开关
7           投射方向
A          壁体
具体实施方式
综合上述技术特征，本发明导热辐射基板及反射式辐射散热发光件的主要功效将可于下述实施例清楚呈现。
请参阅图1至图3所示，本发明所述的导热辐射基板，包含：一反射层1、一远红外线辐射散热层2、一绝缘层3及一电路层4，其中；
该反射层1为具反射光的特性，本实施例中该反射层1的材质为铝，且界定有一反射面11。
该远红外线辐射散热层2是涂布于该反射面11，且具有透光性，其中该 远红外线幅射散热涂层是以下列步骤制造：步骤A.以无机金属盐例如氯化盐、硫酸盐或硝酸盐或烷氧化合物例如四乙氧基硅烷的溶液为第一材料。步骤B.将上述第一材料与水、酸性溶液例如盐酸、醋酸或硝酸混合，并调整pH值小于3，再以溶胶凝胶法使其形成凝胶。或者，将上述第一材料与水、碱性溶液例如氢氧化钠混合，并调整pH值介于8～10，再以溶胶凝胶法使其形成凝胶。将所得的上述凝胶涂布于前述反射面11，锻烧该反射层1，其中锻烧温度介于500-900℃，使得所述凝胶形成微小结晶粒，经冷却后即形成该远红外线幅射散热涂层。
该绝缘层3为不导电材质，设置于该反射面11。
该电路层4对应设置于该绝缘层3上，使该电路层4不接触前述反射层1，能避免电路层4与该反射层1接触造成短路现象。其中该远红外线辐射散热层2同样不接触该绝缘层3及该电路层4，是为了避免该电路层4与该远红外线辐射散热层2接触造成短路现象。
本发明所述的导热辐射基板呈板状，于纵深所需的厚度较小，而能适用于空间受限的地方；能配合装设不同发光体，是以热辐射方式进行散热，因此有别于现有技术以热传导及热对流的方式散热，其使用的散热鳍片所需占据较大的空间，无法适用于空间受限的地方。
请参阅图1所示，为本发明一种包含所述的导热辐射基板的反射式辐射散热发光件，进一步包含有至少一个发光二极管5，本实施例以一个发光二极管5实施，该发光二极管5设置于前述反射面11；其中该电路层4包括有一正极电路41及一负极电路42，该发光二极管5具有一正极接脚51及一负极接脚52，且该正极接脚51电性链接前述正极电路41，而该负极接脚52)电性链接前述负极电路42，进一步包含一供电单元6连接前述正极电路41 及前述负极电路42，用以提供所述发光二极管5产生光源所需的电力，其中该供电单元6以锂电池或连接家用电实施，本实施例以锂电池实施，并设有一开关61用以控制启闭。
请参阅图1及图4所示，以所述发光二极管所产生的光源朝一投射方向7投射，也朝该反射层1投射，并由该反射层1将光源朝前述投射方向7反射；所述发光二极管5所产生的工作热能，经由该反射层1传导至该远红外线辐射散热层2，并由该远红外线辐射散热层2以远红外线辐射，经前述反射层1反射朝前述投射方向7散热。
请参阅图5及图6所示，为本发明所述的反射式辐射散热发光件设置于壁体A上的实施状态图，实施时能以黏贴方式或以螺丝将本发明所述的反射式辐射散热发光件贴近于壁体A上，由于本发明以热辐射方式进行散热，有别于现有技术以热传导及热对流的方式散热，安装上因散热鳍片所需占据较大的空间，而有受限于壁体A厚度(嵌壁式)或安装后灯具过于凸出壁体A(贴壁式)的问题。再者透过前述反射层1能将前述发光二极管5所产生的光源皆朝该投射方向7投射，提高该发光二极管5的照度，且能将该光二极管所产生的工作热能，经由该反射层1传导至该远红外线辐射散热层2，并由该远红外线辐射散热层2以远红外线辐射，经前述反射层1反射朝前述投射方向7散热，解决现有技术以散热鳍片散热，有热对流途径受壁体A阻挡的问题，使本发明所述的反射式辐射散热发光件固定于壁体A上同样具有良好的散热效果，而避免因高温光衰或是因高温寿命缩短的现象。
虽然本发明已以较佳实施例揭露如上，然其并非用以限定本发明，任何熟习此技艺者，在不脱离本发明的精神和范围内，当可作些许的更动与润饰，因此本发明的保护范围当视后附的申请专利范围所界定者为准。

Claims (5)

  1. 一种导热辐射基板，其特征在于：包含：
    一反射层，其界定有一反射面；
    一远红外线辐射散热层，其设置于该反射面；
    一绝缘层，其设置于该反射面；
    一电路层，其对应设置于该绝缘层上，使该电路层不接触前述反射层。
  2. 根据权利要求1所述的导热辐射基板，其特征在于：该反射层的材质为铝。
  3. 根据权利要求1所述的导热辐射基板，其特征在于：该远红外线辐射散热层是不接触该绝缘层及该电路层。
  4. 一种包含权利要求1至3任一项所述的导热辐射基板的反射式辐射散热发光件，其特征在于，包含有：
    至少一发光二极管，其设置于前述反射面；
    所述发光二极管所产生的光源朝一投射方向投射，也朝该反射层投射，并由该反射层将光源朝前述投射方向反射；所述发光二极管所产生的工作热能，经由该反射层传导至该远红外线辐射散热层，并由该远红外线辐射散热层以远红外线辐射，经前述反射层反射朝前述投射方向散热。
  5. 根据权利要求4所述的导热辐射基板及反射式辐射散热发光件，其特征在于：包含一供电单元连接前述电路层。
PCT/CN2015/072389 2015-02-06 2015-02-06 导热辐射基板及反射式辐射散热发光件 WO2016123789A1 (zh)

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