WO2009111905A1 - 半导体固态照明灯具及其照明方法 - Google Patents

半导体固态照明灯具及其照明方法 Download PDF

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Publication number
WO2009111905A1
WO2009111905A1 PCT/CN2008/000493 CN2008000493W WO2009111905A1 WO 2009111905 A1 WO2009111905 A1 WO 2009111905A1 CN 2008000493 W CN2008000493 W CN 2008000493W WO 2009111905 A1 WO2009111905 A1 WO 2009111905A1
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WO
WIPO (PCT)
Prior art keywords
heat
state lighting
lighting fixture
semiconductor solid
lampshade
Prior art date
Application number
PCT/CN2008/000493
Other languages
English (en)
French (fr)
Inventor
管新宁
Original Assignee
鑫源盛科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE212008000105U priority Critical patent/DE212008000105U1/de
Application filed by 鑫源盛科技股份有限公司 filed Critical 鑫源盛科技股份有限公司
Priority to CA2718063A priority patent/CA2718063A1/en
Priority to PCT/CN2008/000493 priority patent/WO2009111905A1/zh
Priority to US12/921,703 priority patent/US20110026261A1/en
Priority to JP2010600064U priority patent/JP3166727U/ja
Priority to AU2008352855A priority patent/AU2008352855A1/en
Priority to EP08714946A priority patent/EP2251587A4/en
Priority to BRPI0821181-7A priority patent/BRPI0821181A2/pt
Priority to KR1020107020404A priority patent/KR20100118136A/ko
Priority to MX2010009956A priority patent/MX2010009956A/es
Publication of WO2009111905A1 publication Critical patent/WO2009111905A1/zh
Priority to MA33153A priority patent/MA32147B1/fr
Priority to ZA2010/06693A priority patent/ZA201006693B/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V11/00—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
    • F21V11/06—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using crossed laminae or strips, e.g. grid-shaped louvers; using lattices or honeycombs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F21V13/10—Combinations of only two kinds of elements the elements being reflectors and screens
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/045—Optical design with spherical surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]

Definitions

  • the present invention relates to a semiconductor solid state lighting fixture and a lighting method therefor.
  • BACKGROUND OF THE INVENTION LEDs or OLEDs have long-lasting, power-saving, durable, shock-resistant, robust, mass-produced, small-sized, fast-reacting and other advantages, and can produce high-brightness light sources, which have been gradually applied to lighting.
  • LED or 0LED is practical, it still has the following disadvantages:
  • the light source generated by the luminaire is directly irradiated to the illuminated surface. If the user looks directly at the LED or the 0LED, it will be affected by the high-brightness light source generated by the LED or the 0LED, which is prone to glare.
  • a first object of the present invention is to provide a semiconductor solid-state lighting fixture to provide a lighting environment suitable for brightness, to avoid glare, and to avoid external factors such as dust from affecting heat dissipation performance, and to achieve optimal performance. heat radiation.
  • a second object of the present invention is to provide another semiconductor solid-state lighting fixture to provide a lighting environment suitable for brightness, avoiding the occurrence of glare, and avoiding external factors such as dust from affecting heat dissipation performance to achieve optimal heat dissipation. effect.
  • a third object of the present invention is to provide a semiconductor solid-state lighting method for providing a lighting environment suitable for illumination, avoiding the occurrence of glare, and avoiding external factors such as dust accumulation.
  • the semiconductor solid-state lighting fixture of the first object of the present invention comprises: a heat sink having a top surface as a bonding surface; and at least one illuminant comprising the light emitting body attached to the bonding surface of the heat sink to enable the illuminating body The generated light source is scattered toward the reflective layer of the lampshade;
  • a lampshade is provided with a light reflecting layer on the inner wall surface thereof; the lamp cover covers the heat radiating body, so that the lampshade can shield the light emitting body to refract the light source generated by the light emitting body back to the illuminated surface through the light reflecting layer.
  • the semiconductor solid-state lighting fixture of the second object of the present invention may further comprise: a heat sink having a top surface as a bonding surface; and at least one illuminant comprising the light emitting body attached to the bonding surface of the heat sink to enable the illuminating body The generated light source is scattered toward the reflective layer of the lampshade;
  • a lamp cover which is made of a heat dissipating material, and has a reflective layer on the inner wall surface and a heat dissipating fin on the outer surface;
  • the lamp cover covers the heat sink, so that the lamp cover can shield the illuminator to refract the light source generated by the illuminant back to the illuminated surface through the reflective layer.
  • the semiconductor solid-state illumination method capable of achieving the above third object is to bond the illuminant to a heat sink and to cover the illuminator through a lamp cover provided with a reflective layer on the inner wall surface, so that the light source generated by the illuminator faces the lamp cover
  • the reflective layer scatters and refracts the light source back to the illuminated surface via the reflective layer of the lampshade to avoid glare.
  • the semiconductor solid-state lighting fixture and the lighting method thereof are provided, wherein the lamp comprises a heat sink, an illuminant and a lamp cover; wherein the heat sink has a bonding surface, and the illuminating body is combined on the bonding surface; a reflective layer is disposed on the inner wall surface or coated or plated; the lamp cover is covered on the heat sink to cover the light body; when the light source generates the light source, the light source is scattered toward the reflective layer on the inner wall of the lamp cover, and The light reflecting layer of the lampshade reflects the light source back to the illuminated To mitigate the brightness of the light source emitted by the illuminator, to avoid glare caused by the brightness of the light source being too bright, to provide a suitable illumination environment; and the heat generated by the illuminator is received by the heat sink and passed through the heat sink and the atmosphere The heat exchange is performed to achieve the purpose of rapid heat dissipation.
  • the heat sink Since the heat sink is disposed below the illuminator, the better cold air can be raised from the bottom to the bottom, the air pressure can enhance the heat dissipation effect, and external factors such as dust accumulation can be avoided. It affects the heat dissipation performance and achieves the purpose of preventing dust accumulation, so that the heat sink can maintain a good heat dissipation effect.
  • a heat conductor can be added to the heat sink to quickly transfer heat to the lamp cover to increase the heat dissipation effect.
  • FIG. 1 is a schematic view showing a combination of a semiconductor solid-state lighting fixture and a lighting method thereof according to Embodiment 1 of the present invention
  • FIG. 2 is a perspective view showing a semiconductor solid-state lighting fixture and a lighting method thereof according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic view showing the assembly of a semiconductor solid-state lighting fixture and a lighting method thereof according to Embodiment 1 of the present invention
  • FIG. 4 is a schematic view showing the operation of a semiconductor solid-state lighting fixture and a lighting method thereof according to Embodiment 2 of the present invention
  • FIG. 5 is a schematic view showing the implementation of a semiconductor solid-state lighting fixture and a lighting method thereof according to Embodiment 3 of the present invention
  • Fig. 6 is a schematic view showing the implementation of a semiconductor solid-state lighting fixture and an illumination method thereof according to Embodiment 1 of the present invention.
  • heat sink fins 13 wire guide 2 illuminator 3 lampshade 31 reflective layer 32 hole 33 wing 4 power supply 5 light source 6 heat conductor embodiment embodiment 1:
  • the present invention provides a semiconductor solid-state lighting fixture and a lighting method thereof, which mainly include:
  • a heat dissipating body 1 the top surface of the heat dissipating body 1 is a bonding surface 11 , and a plurality of heat dissipating fins are extended on the outer edge or the lower surface of the heat dissipating body 1 , and the heat dissipating body 1 is provided with a wire slot 13 , the wire
  • the groove 13 is formed integrally with the heat dissipating fins 12 for receiving the conductive wires; at least one (including one or more) illuminants 2, which are bonded to the heat dissipating body 1
  • the illuminant 2 can be an LED or OLED; a lamp cover 3, the inner wall surface of the lamp cover 3 is provided with a light reflecting layer 31, and a plurality of holes 32 are arranged at the periphery;
  • the lamp cover 3 is covered on the heat dissipating body 1 so that the lamp cover 3 can shield the illuminating body 2, and the wire groove 13 or the heat dissipating fin 12
  • the hole 32 can be used as a hole to increase the heat dissipation rate of the heat sink.
  • the light reflecting layer 31 of the lampshade 3 can be directly coated or electroplated on the inner wall surface of the lampshade 3, so that the lampshade 3 is a reflector.
  • the light reflecting layer 31 of the lampshade 3 may be a metal bright surface or a glass material reflector, which is bonded to the inner wall surface of the lamp cover 3.
  • the illuminant 2 is connected to the power supply 4 (see FIG. 6) through a conductive wire to guide the power source to the illuminant 2, so that the illuminator 2 can generate a light source, and the conductive line is placed. In the wire groove 13, to achieve an aesthetic effect.
  • the combination of the lamp cover 3 and the heat dissipating body 1 is not limited, and only the structure in which the heat dissipating body 1 and the lamp cover 3 can be combined should be included in the scope of the present patent application.
  • FIG. 4 it is a schematic diagram of the operation of the present invention.
  • the illuminant 2 When the illuminant 2 generates the high-brightness light source 5, the light source 5 is scattered toward the light-reflecting layer 31 of the lamp cover 3, and the light source is transmitted through the light-reflecting layer 31 of the lamp cover 3. 5 is refracted toward the illuminated surface to achieve the effect of illumination. Since the light source 5 is reflected, the illumination effect is achieved, so that the occurrence of glare phenomenon can be avoided; and the heat energy generated by the illuminant 2 is absorbed by the heat sink 1, It is conducted to the heat dissipating fins 12, and the heat energy is dissipated to the atmosphere via the heat dissipating fins 12 for heat exchange purposes.
  • the shielding light source can be more dispersed to avoid glare.
  • the heat conducting body 6 can be received in the wire slot 13.
  • the heat conducting body 6 is connected to the heat sink 1 at one end and the heat sink 3 or the other end.
  • the heat dissipation modules are joined to quickly transfer the heat energy on the heat sink 1 to achieve rapid heat dissipation the goal of.
  • FIG. 6 is a schematic diagram of the present embodiment, wherein the lamp cover 3 can be made of a heat dissipating material, so that when the lamp cover 3 is combined with the heat dissipating body 1 , it will be in contact with the heat dissipating fin 12 so that it can receive the heat dissipating fins.
  • the thermal energy of the sheet 12, and the heat energy is dissipated, so as to achieve rapid heat dissipation.
  • the outer surface of the heat dissipation lamp cover 3 may extend out of the air piece 33 for the power supply 4 to be placed, so that the lamp cover 3 can absorb the heat generated by the power supply 4 to achieve heat dissipation of the power supply.
  • the invention scatters the light source generated by the illuminator toward the reflective layer of the lampshade, and then reflects the light source back to the illuminated surface through the reflective layer of the lampshade to provide a suitable illumination environment to avoid glare.
  • the heat dissipating body is disposed under the illuminating body, and the better cooling effect of the cold air rising from the bottom and the air pressure is enhanced.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

半导体固态照明灯具及其照明方法
技术领域 本发明涉及一种半导体固态照明灯具及其照明方法。 背景技术 由于 LED或 0LED除具有寿命长、 省电、 耐用、 耐震、 牢靠、 适合量 产、 体积小、 反应快等诸多优点外， 并可产生高亮度的光源， 使其已逐渐 被应用于照明灯具中， 作为灯具的发光源。 然而， LED或 0LED虽然实用， 但仍然具有以下的缺点：
1、 目前灯具所产生的光源均是直接朝被照面照射， 若使用者直视 LED 或 0LED时， 会受到 LED或 0LED产生的高亮度光源影响， 而容易产生眩光 情形。
2、现有针对 LED或 0LED的散热技术，大多均将热能传导致灯壳上方， 再于灯壳上延伸出散热翼片作散热的功能； 但此种设计容易引起灰尘的堆 积、 鸟类筑巢粪便等外在环境因素影响散热效果， 甚至导致灯具的烧毁。 发明内容 本发明的第一目的是在于提供一种半导体固态照明灯具， 以提供一亮 度适合的照明环境， 避免眩光现象的发生， 还可避免积尘等外在因素影响 散热效能， 达到最佳的散热效果。 本发明的第二目的是在于提供另一种半导体固态照明灯具， 以提供一 亮度适合的照明环境， 避免眩光现象的发生， 还可避免积尘等外在因素影 响散热效能， 达到最佳的散热效果。 本发明的第三目的是在于提供一种半导体固态照明方法， 以提供一亮 度适合的照明环境， 避免眩光现象的发生， 还可避免积尘等外在因素影响
^ 本 散热效能， 达到最佳的散热效果。 可达成上述发明第一目的半导体固态照明灯具， 包括： 一散热体， 其顶面为一结合表面； 至少一颗含以上的发光体， 其是贴合于散热体的结合表面上， 使发光 体产生的光源朝灯罩的反光层散射；
一灯罩， 其内壁表面设置有反光层； 所述灯罩覆盖于散热体上， 使灯罩可将发光体遮蔽， 以透过反光层将 发光体产生的光源折射回被照面。 可达成上述第二发明目的半导体固态照明灯具， 包括： 一散热体， 其顶面为一结合表面； 至少一颗含以上的发光体， 其是贴合于散热体的结合表面上， 使发光 体产生的光源朝灯罩的反光层散射；
一灯罩， 其是散热材质制成， 并于内壁表面设置有反光层， 而外表面 延伸有散热翼片；
所述灯罩覆盖于散热体上， 使灯罩可将发光体遮蔽， 以透过反光层将 发光体产生的光源折射回被照面。 可达成上述第三发明目的半导体固态照明方法， 是将发光体结合于一 散热体上， 并透过一内壁面设置有反光层的灯罩， 将发光体遮罩， 使发光 体产生的光源朝灯罩的反光层散射， 并经由灯罩的反光层将光源折射回被 照面， 避免眩光。 由上可见， 应用上述的半导体固态照明灯具及其照明方法， 由于该灯 具包括有一散热体、 发光体及灯罩； 其中， 该散热体具有一结合表面， 该 结合表面上结合有发光体； 该灯罩的内壁面上设置或涂布或电镀有一反光 层； 是将灯罩罩盖于散热体上， 以将发光体遮罩； 当发光体产生光源时， 该光源会朝灯罩内壁的反光层散射， 并经灯罩的反光层将光源反射回被照 面， 以缓和发光体发出的光源亮度， 避免因光源亮度太亮， 而发生眩光情 形， 以提供一亮度适合的照明环境； 且发光体产生的热能， 会由散热体接 收， 并经由散热体与大气进行热交换， 达到散热迅速的目的； 由于散热体 是设置于发光体的下方处， 既可达到较佳的冷空气由下往上升， 气流压力 增强散热效果， 亦可避免积尘等外在因素影响散热效能， 达到防积尘的目 的， 使散热体可维持良好的散热效果。
另外， 并可在散热体上增加一导热体， 将热量迅速的传导至灯罩， 以 增加散热效果。 附图说明 请参阅以下有关本实用发明一较佳实施例的详细说明及其附图， 将可 进一步了解本实用发明的技术内容及其目的功效； 有关该实施例的附图 为：
图 1 为本发明实施例 1的半导体固态照明灯具及其照明方法的结合示 意图；
图 2为本发明实施例 1的半导体固态照明灯具及其照明方法的立体示 意图；
图 3为本发明实施例 1的半导体固态照明灯具及其照明方法的组装示 意图；
图 4为本发明实施例 2的半导体固态照明灯具及其照明方法的操作示 意图；
图 5为本发明实施例 3的半导体固态照明灯具及其照明方法的实施示 意图； 以及
图 6为本发明实施例 1的半导体固态照明灯具及其照明方法的实施示 意图。
【主要元件符号说明】 1散热体 11结合表面
12散热翼片 13导线槽 2发光体 3灯罩 31反光层 32孔洞 33翼片 4电源供应器 5光源 6导热体 具体实施方式 实施例 1：
请参阅图 2、 图 2、 以及图 3所示， 是本发明所提供的半导体固态照 明灯具及其照明方法， 主要包括有：
一散热体 1， 该散热体 1的顶面为一结合表面 11， 并于散热体 1外缘 或下方表面延伸出数个散热翼片， 且散热体 1上并设置有导线槽 13， 该导 线槽 13是可与散热翼片 12—体成型制作而成， 以供导电线容置； 至少一颗 （含一颗以上） 的发光体 2， 该发光体 2是贴合于散热体 1 的结合表面 11上； 该发光体 2可为 LED或 0LED; 一灯罩 3， 该灯罩 3内壁表面设置有反光层 31， 并于周缘设置有数个 孔洞 32; 是将灯罩 3覆盖于散热体 1上， 使灯罩 3可将发光体 2遮蔽， 且散热 体 1上的导线槽 13或散热翼片 12并会贯穿灯罩 3周缘的孔洞 32，使灯罩 3与散热体 1结合成一体。
另外， 该孔洞 32并可作为气孔， 以增加散热体散热速度。
另外， 该灯罩 3的反光层 31可直接涂布或电镀成型于灯罩 3的内壁 表面上， 使灯罩 3为一反光罩。 另外， 该灯罩 3的反光层 31可为一金属亮面或玻璃材质反光罩， 是 结合于灯罩 3的内壁表面上。
另外， 该发光体 2是透过导电线与电源供应器 4 (请参阅图 6 ) 相连 接， 以将电源导引至发光体 2， 使发光体 2得以产生光源， 并将导电线容 置于导线槽 13中， 以达到美观的效果。 另外， 该灯罩 3与散热体 1的结合模式不拘， 仅要可将散热体 1与灯 罩 3结合的结构， 均应包含于本案申请专利范围中。
请参阅图 4所示， 是本发明的操作示意图， 当发光体 2产生高亮度光 源 5时， 该光源 5会朝灯罩 3的反光层 31散射出， 并透过灯罩 3的反光 层 31将光源 5朝被照面折射， 以达到照明的效果， 由于光源 5是经反射 后， 达到照明的效果， 使其可避免眩光现象的发生； 且该发光体 2产生的 热能并会由散热体 1吸收， 并传导至散热翼片 12， 经由散热翼片 12将热 能逸散至大气中， 以达到热交换的目的。
另外， 透过散热翼片 12的设置， 更能分散遮蔽光源， 以避免发生眩 光情形。
实施例 2:
请参阅图 5所示， 是本实施例示意图， 其中， 该导线槽 13内可容置 一导热体 6, 该导热体 6的一端是与散热体 1相接合， 另一端则与散热灯 罩 3或散热模组相接合， 以迅速将散热体 1上的热能导出， 达到散热迅速 的目的。
实施例 3:
请参阅图 6所示， 是本实施示意图， 其中， 该灯罩 3可为散热材质制 成， 使灯罩 3与散热体 1结合时， 会与散热翼片 12相接触， 使其可接收 来自散热翼片 12的热能， 并将热能逸散， 以达到散热迅速的目的。
另外， 该散热灯罩 3的外表面上可延伸出翼片 33， 以供电源供应器 4 放置，使灯罩 3可吸收电源供应器 4产生的热能， 以达到电源供应的散热。 综上， 本发明所提供的半导体固态照明灯具及其照明方法， 与其他现 有技术相互比较时， 更具有下列的优点：
1、 本发明是将发光体产生的光源朝灯罩的反光层散射， 再透过灯罩 的反光层将光源反射回被照面， 以提供一亮度适合的照明环境， 避免眩光 现象的发生。
2、 本发明是将散热体设置于发光体下方处， 可达到较佳的冷空气由 下往上升， 气流压力增强的散热效果。
上列详细说明是针对本发明的一可行实施例的具体说明， 惟该实施例 并非用以限制本发明的专利范围， 凡未脱离本发明技艺精神所为的等效实 施或变更， 均应包含于本案的专利范围中。

Claims

权 利 要 求
1、 一种半导体固态照明灯具， 包括：
一散热体， 其顶面为一结合表面；
至少一颗含以上的发光体， 其是贴合于散热体的结合表面上， 使发光 体产生的光源朝灯罩的反光层散射；
一灯罩， 其内壁表面设置有反光层；
所述灯罩覆盖于散热体上， 使灯罩可将发光体遮蔽， 以透过反光层将 发光体产生的光源折射回被照面。
2、 按权利要求 1所述的半导体固态照明灯具， 其特征是， 其中该散 热体外缘或下方延伸出数个散热翼片， 以加速散热体的散热速度。
3、 按权利要求 1所述的半导体固态照明灯具， 其特征是， 其中该散 热体上设置有导线槽， 以供导电线容置。
4、 按权利要求 3所述的半导体固态照明灯具， 其特征是， 其中该导 线槽内可容置一导热体， 该导热体的一端是与散热体相接合， 另一端则与 散热灯罩或散热模组相接合。
5、 按权利要求 1所述的半导体固态照明灯具， 其特征是， 其中该发 光体为 LED或 0LED。
6、 按权利要求 1所述的半导体固态照明灯具， 其特征是， 其中该灯 罩周缘设置有数个孔洞， 并于散热体延伸有导线槽或散热翼片， 透过导线 槽或散热翼片贯穿灯罩孔洞， 使灯罩与散热体结合成一体。
7、 按权利要求 1所述的半导体固态照明灯具， 其特征是， 其中该灯 罩的反光层可直接涂布或电镀成型于灯罩的内壁表面上。
8、 按权利要求 1所述的半导体固态照明灯具， 其特征是， 其中该灯 罩的反光层是为一反光罩， 是结合于灯罩的内壁表面上。
9、 按权利要求 1所述的半导体固态照明灯具， 其特征是， 其中该发 光体是透过导电线与电源供应器相连接， 以将电源导引至发光体， 使发光 体得以产生光源。
10、 一种半导体固态照明灯具， 包括：
一散热体， 其顶面为一结合表面；
至少一颗含以上的发光体， 其是贴合于散热体的结合表面上， 使发光 体产生的光源朝灯罩的反光层散射；
一灯罩， 其是散热材质制成， 并于内壁表面设置有反光层， 而外表面 延伸有散热翼片；
所述灯罩覆盖于散热体上， 使灯罩可将发光体遮蔽， 以透过反光层将 发光体产生的光源折射回被照面。
11、 按权利要求 10所述的半导体固态照明灯具， 其特征是， 其中该 散热体外缘或下方延伸出数个散热翼片， 以加速散热体的散热速度。
12、 按权利要求 10所述的半导体固态照明灯具， 其特征是， 其中该 散热体设置有导线槽， 以供导电线容置。
13、 按权利要求 12所述的半导体固态照明灯具， 其特征是, 其中该 导线槽内可容置一导热体， 该导热体的一端是与散热体相接合， 另一端则 与散热灯罩或散热模组相接合。
14、 按权利要求 10所述的半导体固态照明灯具， 其特征是， 其中该 发光体为 LED或 0LED。
15、 按权利要求 10所述的半导体固态照明灯具， 其特征是， 其中该 灯罩周缘是设置有数个孔洞， 并于散热体延伸有导线槽或散热翼片， 透过 导线槽或散热翼片贯穿灯罩孔洞， 使灯罩与散热体结合成一体。
16、 按权利要求 10所述的半导体固态照明灯具， 其特征是， 其中该 灯罩的反光层可直接涂布成型于灯罩的内壁表面上。
17、 按权利要求 10所述的半导体固态照明灯具， 其特征是， 其中该 灯罩的反光层是为一反光罩， 是结合于灯罩的内壁表面上。
18、 按权利要求 10所述的半导体固态照明灯具， 其特征是， 其中该 发光体是透过导电线与电源供应器相连接， 以将电源导引至发光体， 使发 光体得以产生光源。
19、 一种半导体固态照明方法， 其特征是， 是将发光体结合于一散热 体上， 并透过一内壁面设置有反光层的灯罩， 将发光体遮罩， 使发光体产 生的光源朝灯罩的反光层散射， 并经由灯罩的反光层将光源折射回被照 面， 避免眩光。
20、 按权利要求 19所述的半导体固态照明方法， 其特征是， 其中该 散热体上延伸有数个散热翼片， 透过散热翼片作为光栅将光源分散遮蔽， 避免眩光。
PCT/CN2008/000493 2008-03-13 2008-03-13 半导体固态照明灯具及其照明方法 WO2009111905A1 (zh)

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AU2008352855A AU2008352855A1 (en) 2008-03-13 2008-03-13 A semiconductor solid illuminator and the method thereof
CA2718063A CA2718063A1 (en) 2008-03-13 2008-03-13 Semiconductor solid illuminator and the method thereof
PCT/CN2008/000493 WO2009111905A1 (zh) 2008-03-13 2008-03-13 半导体固态照明灯具及其照明方法
US12/921,703 US20110026261A1 (en) 2008-03-13 2008-03-13 Semiconductor solid illuminator and the method thereof
JP2010600064U JP3166727U (ja) 2008-03-13 2008-03-13 半導体固体化照明器具
DE212008000105U DE212008000105U1 (de) 2008-03-13 2008-03-13 Halbleiter-Festkörper-Beleuchtungseinrichtung
EP08714946A EP2251587A4 (en) 2008-03-13 2008-03-13 SEMICONDUCTOR LIGHTING DEVICE AND METHOD THEREOF
MX2010009956A MX2010009956A (es) 2008-03-13 2008-03-13 Iluminador sólido semiconductor y método del mismo.
KR1020107020404A KR20100118136A (ko) 2008-03-13 2008-03-13 반도체 고상 조명기구 및 그 조명방법
BRPI0821181-7A BRPI0821181A2 (pt) 2008-03-13 2008-03-13 Aparelho de iluminação semicondutor sólido e método de iluminação
MA33153A MA32147B1 (fr) 2008-03-13 2010-09-06 Dispositif d'éclairage à semi-conducteurs et procédé associé
ZA2010/06693A ZA201006693B (en) 2008-03-13 2010-09-17 A semiconductor solid illuminator and the method thereof

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