WO2016121690A1 - 被覆工具 - Google Patents
被覆工具 Download PDFInfo
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- WO2016121690A1 WO2016121690A1 PCT/JP2016/052015 JP2016052015W WO2016121690A1 WO 2016121690 A1 WO2016121690 A1 WO 2016121690A1 JP 2016052015 W JP2016052015 W JP 2016052015W WO 2016121690 A1 WO2016121690 A1 WO 2016121690A1
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- layer
- hkl
- aluminum oxide
- tcf
- tcr
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/141—Specially shaped plate-like cutting inserts, i.e. length greater or equal to width, width greater than or equal to thickness
- B23B27/145—Specially shaped plate-like cutting inserts, i.e. length greater or equal to width, width greater than or equal to thickness characterised by having a special shape
- B23B27/146—Means to improve the adhesion between the substrate and the coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/148—Composition of the cutting inserts
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/347—Carbon nitride
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/36—Carbonitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/406—Oxides of iron group metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2222/00—Materials of tools or workpieces composed of metals, alloys or metal matrices
- B23B2222/88—Titanium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
- B23B2228/04—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner applied by chemical vapour deposition [CVD]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
- B23B2228/10—Coatings
Definitions
- the present disclosure relates to a coated tool having a coating layer on a surface of a substrate.
- Such a cutting tool has been increasingly used for heavy interrupted cutting where a large impact is applied to the cutting edge in accordance with recent high efficiency cutting. And in such severe cutting conditions, in order to suppress chipping and peeling of the coating layer due to a large impact on the coating layer, improvement of chipping resistance and wear resistance is required.
- Patent Document 1 optimizes the particle size and thickness of the aluminum oxide layer and sets the (012) plane organization coefficient (Texture Coefficient: 1). .3 or more, a technique capable of forming a dense aluminum oxide layer having high fracture resistance is disclosed.
- Patent Document 2 by making the organization coefficient in the (012) plane of the aluminum oxide layer 2.5 or more, the residual stress in the aluminum oxide layer is easily released, so that the fracture resistance of the aluminum oxide layer is improved. A technique that can improve the above is disclosed.
- Patent Document 3 as a technique for improving the wear resistance in the cutting tool, an aluminum oxide layer located immediately above the intermediate layer is formed by laminating two or more unit layers exhibiting different X-ray diffraction patterns. The technique which can improve the intensity
- Patent Document 4 the (006) plane orientation coefficient of the aluminum oxide layer is increased to 1.8 or more, and the peak intensity ratio I (104) / I (110) between the (104) plane and the (110) plane is set as follows. A cutting tool controlled to a predetermined range is disclosed.
- the peak intensity ratio I (104) / I (012) between the (104) plane and the (012) plane of the aluminum oxide layer is set to be higher than that of the first plane below the aluminum oxide layer.
- a cutting tool that is larger in surface is disclosed.
- Japanese Patent No. 6-316758 Japanese Patent Laid-Open No. 2003-025114 Japanese Patent Laid-Open No. 10-204639 JP 2013-132717 A JP 2009-202264 A
- the coated tool of the present embodiment includes a first surface, a second surface adjacent to the first surface, and a cutting blade positioned at at least a part of a ridge line portion between the first surface and the second surface. It is a coated tool.
- the coating tool includes a base and a coating layer provided on the surface of the base.
- the coating layer includes a titanium carbonitride layer and an aluminum oxide layer having an ⁇ -type crystal structure. The titanium carbonitride layer is located closer to the substrate than the aluminum oxide layer. Further, based on the peak of the aluminum oxide layer analyzed by X-ray diffraction analysis, when the value represented by the following formula is the orientation coefficient Tc (hkl), the orientation coefficient Tcf (104) on the second surface.
- Tcf (104) / Tcf (012) is the ratio of the orientation coefficient Tcr (104) to Tcr (012) on the first surface (Tcr (104) / Tcr (012)). Higher).
- Orientation coefficient Tc (hkl) ⁇ I (hkl) / I 0 (hkl) ⁇ / [(1/7) ⁇ ⁇ ⁇ I (HKL) / I 0 (HKL) ⁇ ]
- (HKL) indicates crystal planes of (012), (104), (110), (006), (113), (024), and (116).
- I (HKL) and I (hkl) represent peak intensities of peaks attributed to each crystal plane detected in the X-ray diffraction analysis of the aluminum oxide layer.
- I 0 (HKL) and I 0 (hkl) are JCPDS card numbers. The standard diffraction intensity of each crystal plane described in 43-1484 is shown.
- FIG. 4A is a schematic diagram in which a plurality of setting jigs are stacked.
- FIG. 4B is a cross-sectional view for explaining the arrangement of the substrates.
- FIG. 10 is another example of a substrate setting method in a film forming apparatus for forming a coating layer, and is a cross-sectional view for explaining the arrangement of the substrate.
- a cutting tool (hereinafter simply referred to as a tool) 1 showing an embodiment of the present disclosure includes a first surface 2, a second surface 3 adjacent to the first surface 2, a first surface 2, and a second surface 3. And a cutting blade 4 positioned at a ridge line portion between the two.
- the tool 1 has a polyhedron shape
- the first surface 2 is a rake surface 2
- the second surface 3 is a flank surface.
- the first surface 2 is referred to as a rake surface 2
- the second surface 3 is referred to as a flank surface 3.
- the screw hole 15 exists in the center of the rake face 2 of the tool 1 shown in FIG. 1, the screw hole 15 is not necessarily required.
- the tool 1 includes a base 5 and a coating layer 6 provided on the surface of the base 5.
- the covering layer 6 includes a lower layer 7, a titanium carbonitride layer 8, an intermediate layer 9, an aluminum oxide layer 10, and a surface layer 11.
- the lower layer 7, the titanium carbonitride layer 8, the intermediate layer 9, the aluminum oxide layer 10, and the surface layer 11 are laminated in this order from the substrate 5 side.
- the aluminum oxide layer 10 has an ⁇ -type crystal structure.
- the rake face 2, the flank face 3, and the cutting edge 4 are the outermost surfaces of the tool 1, respectively. That is, when the outermost surface of the tool 1 is the covering layer 6 as in this embodiment, the rake face 2, the flank face 3, and the cutting edge 4 refer to the surface of the covering layer 6. When the coating layer 6 is worn, the rake face 2, the flank surface 3, and the cutting edge 4 refer to the worn surface of the coating layer 6. When the coating layer 6 is worn away and the base 5 is exposed, the outermost surface of the tool 1 is the base 5, so that the rake face 2, the flank 3 and the cutting edge 4 are the surfaces of the exposed base 5. Say.
- Orientation coefficient Tc (hkl) ⁇ I (hkl) / I 0 (hkl) ⁇ / [(1/7) ⁇ ⁇ ⁇ I (HKL) / I 0 (HKL) ⁇ ]
- (HKL) indicates the crystal plane of (012), (104), (110), (006), (113), (024), (116), and I (HKL) and I (hkl) are The peak intensities of the peaks belonging to the crystal planes detected in the X-ray diffraction analysis of the aluminum oxide layer 10 are shown.
- I 0 (HKL) and I 0 (hkl) are JCPDS (Joint Committee on Powder Diffraction Standards) card numbers. The standard diffraction intensity of each crystal plane described in 43-1484 is shown.
- the orientation coefficient on the flank 3 side is defined as Tcf
- the orientation coefficient on the rake face 2 side is defined as Tcr.
- the orientation coefficient Tc is an index representing the degree of orientation of each crystal plane because it is determined by a ratio to the non-oriented standard data defined by the JCPDS card. Further, “(hkl)” of Tc (hkl) indicates a crystal plane for calculating the orientation coefficient.
- the ratio (Tcf (104) / Tcf (012)) between the orientation coefficients Tcf (104) and Tcf (012) is equal to the ratio (Tcr) between the orientation coefficients Tcr (104) and Tcr (012). (104) / Tcr (012)).
- the coating layer 6 on the rake face 2 has high fracture resistance, crater wear caused by chipping and chipping or peeling hardly occurs due to collision of chips.
- the coating layer 6 on the flank 3 has high wear resistance, the progress of flank wear due to contact with the work material can be suppressed.
- Tcf (104) is higher than Tcf (012) and Tcr (104) is lower than Tcr (012).
- Condition 1 In the X-ray diffraction chart, among the peaks on the flank 3, the peak intensity If (006) of the peak attributed to the (006) plane or the peak intensity If (104) attributed to the (104) plane Is the highest.
- Condition 2 In the X-ray diffraction chart, of the peaks in the rake face 2, the peak intensity Ir (006) of the peak attributed to the (006) plane or the peak intensity Ir (012) attributed to the (012) plane Is the highest.
- the X-ray diffraction analysis of the aluminum oxide layer 10 is measured using an X-ray diffraction analysis apparatus using a general CuK ⁇ ray.
- the area to be measured is a central 3 mm ⁇ area which is a flat surface of the rake face 2 and a 3 mm ⁇ area which is the center of the flank 3.
- the JCPDS card No In obtaining the peak intensity of each crystal plane of the aluminum oxide layer 10 from the X-ray diffraction chart, the JCPDS card No. The diffraction angle of each crystal face described in 43-1484 is confirmed, the crystal face of the detected peak is identified, and the peak intensity is measured.
- the position of the peak may be shifted due to residual stress or the like existing in the coating layer 6. Therefore, in order to confirm whether or not the detected peak is the peak of the aluminum oxide layer 10, X-ray diffraction analysis is performed with the coating layer 6 polished so that the aluminum oxide layer 10 is exposed and polished. Compare the peaks detected before and after. From this difference, it can be confirmed that it is the peak of the aluminum oxide layer 10.
- the surface peak measured from the surface of the aluminum oxide layer 10 is measured. Specifically, the peak intensity of the aluminum oxide layer 10 is measured in a region from the rake face 2 side surface of the aluminum oxide layer 10 to the substrate 5 side surface. In the measurement, even if the surface layer 11 exists, the X-ray diffraction analysis is basically performed without polishing the surface layer 11. If the surface layer 11 does not detect the surface peak of the aluminum oxide layer 10, the aluminum oxide layer 10 is exposed and X-ray diffraction analysis is performed.
- the peak of aluminum oxide is identified using a JCPDS card
- a thickness of 20% or less of the thickness of the aluminum oxide layer 10 may be removed. Even when X-ray diffraction analysis is performed on the surface layer 11 without polishing, (012), (104), (110), (006), (113), (024) of aluminum oxide , (116) 7 peaks may be measured.
- the wear resistance and fracture resistance of the aluminum oxide layer 10 are good.
- the titanium carbonitride layer 8 includes a so-called MT (Moderate Temperature) -titanium carbonitride layer 8a and HT (High Temperature) -titanium carbonitride layer 8b.
- the MT-titanium carbonitride layer 8a and the HT-titanium carbonitride layer 8b are sequentially stacked from the substrate side.
- the MT-titanium carbonitride layer 8a is made of columnar crystals containing acetonitrile (CH 3 CN) gas as a raw material and formed at a relatively low film formation temperature of 780 to 900 ° C.
- the HT-titanium carbonitride layer 8b is made of granular crystals formed at a high film formation temperature of 950 to 1100.degree. According to this embodiment, the surface of the HT-titanium carbonitride layer 8b is formed with triangular projections in a cross-sectional view that tapers toward the aluminum oxide layer 10, thereby increasing the adhesion of the aluminum oxide layer 10. Further, peeling and chipping of the coating layer 6 can be suppressed.
- the thickness of the titanium carbonitride layer 8 is 6.0 to 13.0 ⁇ m, the wear resistance and fracture resistance of the tool 1 are high.
- the intermediate layer 9 is provided on the surface of the HT-titanium carbonitride layer 8b.
- the intermediate layer 9 is made of a compound containing titanium and oxygen. This compound includes TiAlCNO, TiCNO and the like.
- the intermediate layer 9 shown in FIG. 2 has a two-layer structure and includes a lower intermediate layer 9a and an upper intermediate layer 9b.
- the aluminum oxide particles constituting the aluminum oxide layer 10 have an ⁇ -type crystal structure.
- the aluminum oxide layer 10 having an ⁇ -type crystal structure has high hardness, and can improve the wear resistance of the coating layer 6.
- the intermediate layer 9 has a laminated structure of the lower intermediate layer 9a made of TiAlCNO and the upper intermediate layer 9b made of TiCNO, there is an effect of improving the fracture resistance of the cutting tool 1.
- the intermediate layer 9 may be a single layer or three or more layers. When the thickness of the intermediate layer 9 is 0.05 to 0.5 ⁇ m, the adhesion of the aluminum oxide layer 10 is high.
- the lower layer 7 and the surface layer 11 are made of titanium nitride. In other embodiments, at least one of the lower layer 7 and the surface layer 11 may not be provided.
- the lower layer 7 is provided with a thickness of 0.1 to 1.0 ⁇ m
- the surface layer 11 is provided with a thickness of 0.1 to 3.0 ⁇ m.
- each layer and the properties of the crystals constituting each layer should be measured by observing an electron microscope image (scanning electron microscope (SEM) image or transmission electron microscope (TEM) image) in the cross section of the tool 1.
- SEM scanning electron microscope
- TEM transmission electron microscope
- the crystal form of the crystals constituting each layer of the coating layer 6 is columnar.
- the average ratio of the average crystal width to the length in the thickness direction of the coating layer 6 of each crystal is 0.3 on average. Indicates the following state.
- the crystal form is defined as granular.
- examples of the material of the base 5 of the tool 1 include cemented carbide, cermet, ceramics, and metal.
- the cemented carbide is a hard phase composed of tungsten carbide (WC) and, if desired, at least one selected from the group consisting of carbides, nitrides, and carbonitrides of Group 4, 5, and 6 metals of the periodic table other than tungsten carbide. May be a material obtained by binding a metal in a binder phase made of an iron group metal such as cobalt (Co) or nickel (Ni).
- the cermet is a hard phase composed of titanium carbonitride (TiCN) and, if desired, at least one selected from the group consisting of carbides, nitrides, and carbonitrides of Group 4, 5, and 6 metals of the periodic table other than titanium carbonitride. May be a material obtained by binding a metal in a binder phase made of an iron group metal such as cobalt (Co) or nickel (Ni).
- the ceramic may be Si 3 N 4 , Al 2 O 3 , diamond, cubic boron nitride (cBN), or the like.
- the metal may be carbon steel, high speed steel, alloy steel or the like.
- the substrate 5 may be made of cemented carbide or cermet in terms of fracture resistance and wear resistance.
- the cutting edge 4 has a curved surface shape.
- 3 is a partial cross-sectional view of the tool 1 shown in FIG. 1, but in FIG. 3, the cutting edge 4 has a curved shape. Thereby, chipping and chipping of the cutting edge 4 can be suppressed.
- the ratio (L1 / L2) between the curved surface width L1 when the rake face 2 is viewed in front and the curved surface width L2 when the flank 3 is viewed in front is 1.3-2. In the case of 0.0, the sharpness and fracture resistance of the cutting blade 4 can be further improved.
- the cutting edge 4 can be curved by honing.
- both the wear resistance and the chipping resistance of the cutting edge 4 can be improved.
- the interface roughness in the present embodiment refers to ten points specified in JIS (Japanese Industrial Standards) standard JISB0601-2001 with respect to the interface line between the base of the tool and the coating layer mirrored by a scanning electron microscope. It is the value calculated based on the calculation method of average roughness (Rz). In the present embodiment, the length of the boundary line used for calculating the ten-point average roughness (Rz) is 40 ⁇ m.
- the cutting tool such as the tool 1 performs cutting by applying the cutting edge 4 formed on at least a part of the ridge line portion between the rake face 2 and the flank face 3 to the workpiece, as described above. An excellent effect can be exhibited.
- the coated tool can be applied to various uses such as an excavating tool and a blade, and in this case also has excellent mechanical reliability.
- Step 1 A substrate 5 is produced. First, a mixture in which metal powder, carbon powder, binder, and the like are appropriately added to and mixed with the inorganic powder is generated. Examples of inorganic powders include metal carbides, nitrides, carbonitrides, oxides and the like that can form hard alloys by firing. Examples of the metal powder include cobalt powder. Next, a predetermined molded body is produced from the mixture by a known molding method. In this embodiment, since the tool 1 has the screw hole 15, it is set as the molded object in which the hole corresponding to the screw hole 15 exists. Examples of the molding method include press molding, cast molding, extrusion molding, and cold isostatic pressing.
- the substrate 5 is manufactured by firing in a vacuum or in a non-oxidizing atmosphere. Then, the surface of the substrate 5 is subjected to polishing or honing of the cutting edge as desired.
- FIG. 4 shows an example of a method for setting the substrate 5 in the film forming apparatus for forming the coating layer 6.
- FIG. 4A is a schematic view in which a plurality of setting jigs 20 are stacked
- FIG. 4B is a cross-sectional view for explaining the arrangement of the base 5.
- a setting jig 20 in which support bars are arranged at predetermined intervals is prepared.
- the substrate 5 is held by the support rod 21 through the screw hole 15 in the center of the substrate 5 through the support rod 21.
- a plurality of setting jigs 20 are stacked.
- the base bodies 5 and the distance between the base body 5 and the setting jig 20 are adjusted.
- the distance d1 between the base body 5a serving as the rake face 2 and the setting jig 20 is adjusted and set so as to be narrower than the distance d2 between the base bodies 5b serving as the flank face 3.
- the distance between the rake faces 2 is adjusted to 0.7 or less with respect to the diameter L of the inscribed circle of the rake face 2 (the largest circle that can be drawn in the rake face 2).
- the interval is larger than 0.7 with respect to the diameter L.
- FIG. 5 shows another example of the method for setting the substrate 5 in the film forming apparatus for forming the coating layer 6.
- FIG. 5 is a cross-sectional view for explaining the arrangement of the base 5.
- the base 5 is repeatedly inserted by inserting the support rod into the central screw hole 15 of the base 5, then inserting the spacer, and then inserting the second base 5 into the support rod. Is a state of being skewered on a support rod at a predetermined interval.
- the distance d1 between the surfaces of the base 5a may be adjusted and set so as to be narrower than the distance d2 between the surfaces of the base 5b.
- the coating layer 6 is formed by forming the lower layer 7, the titanium carbonitride layer 8, the intermediate layer 9, the aluminum oxide layer 10, and the surface layer 11 in this order.
- the film formation conditions for the lower layer 7 include 0.5 to 10% by volume of titanium tetrachloride (TiCl 4 ) gas, 10 to 60% by volume of nitrogen (N 2 ) gas, and the remaining hydrogen (H 2 ) gas as a reaction gas.
- TiCl 4 titanium tetrachloride
- N 2 nitrogen
- H 2 hydrogen
- the MT-titanium carbonitride layer 8a is formed, and then the HT-titanium carbonitride layer 8b is formed.
- the film formation conditions of the MT-titanium carbonitride layer 8a are 0.5 to 10% by volume of titanium tetrachloride (TiCl 4 ) gas, 5 to 60% by volume of nitrogen (N 2 ) gas, and acetonitrile (CH 3 CN) gas. Is a mixed gas composed of 0.1 to 3.0% by volume and the remainder of hydrogen (H 2 ) gas, the film forming temperature is 780 to 880 ° C., and the gas pressure is 5 to 25 kPa.
- the average crystal width of the titanium carbonitride columnar crystals constituting the MT-titanium carbonitride layer 8a is increased to the substrate 5 side.
- the surface may be larger than the surface.
- the film forming conditions of the HT-titanium carbonitride layer 8b are as follows: titanium tetrachloride (TiCl 4 ) gas is 1 to 4% by volume, nitrogen (N 2 ) gas is 5 to 20% by volume, and methane (CH 4 ) gas is 0. The reaction gas is 1 to 10% by volume and the remainder is hydrogen (H 2 ) gas, the film forming temperature is 900 to 1050 ° C., and the gas pressure is 5 to 40 kPa.
- the film formation conditions for the first stage of the intermediate layer 9 include titanium tetrachloride (TiCl 4 ) gas of 3 to 30% by volume, methane (CH 4 ) gas of 3 to 15% by volume, and nitrogen (N 2 ) gas of 5 to 5%. 10% by volume, carbon monoxide (CO) gas 0.5-1% by volume, aluminum trichloride (AlCl 3 ) gas 0.5-3% by volume, and the remainder hydrogen (H 2 ) gas as a reaction gas,
- the film forming temperature is 900 to 1050 ° C., and the gas pressure is 5 to 40 kPa.
- the film formation conditions for the second stage of the intermediate layer 9 include titanium tetrachloride (TiCl 4 ) gas of 3 to 15% by volume, methane (CH 4 ) gas of 3 to 10% by volume, and nitrogen (N 2 ) gas of 10 to 10%. 25 vol%, carbon monoxide (CO) gas is 1 to 5 vol%, and the remainder is hydrogen (H 2 ) gas as a reaction gas, the film forming temperature is 900 to 1050 ° C., and the gas pressure is 5 to 40 kPa.
- the nitrogen (N 2 ) gas may be changed to argon (Ar) gas.
- the conditions for forming the aluminum oxide layer 10 are 0.5 to 5.0% by volume of aluminum trichloride (AlCl 3 ) gas, 1.5 to 5.0% by volume of hydrogen chloride (HCl) gas, carbon dioxide (CO 2 ) A gas mixture of 0.5 to 5.0% by volume, hydrogen sulfide (H 2 S) gas of 0 to 1.0% by volume, and the remainder of hydrogen (H 2 ) gas as a mixed gas, and a film formation temperature of 950 to 1100 The film is formed at a temperature of 5 ° C. and a pressure of 5 to 20 kPa.
- AlCl 3 aluminum trichloride
- HCl hydrogen chloride
- CO 2 carbon dioxide
- the film is formed at a temperature of 5 ° C. and
- the deposition conditions of the surface layer 11 made of TiN are as follows: titanium tetrachloride (TiCl 4 ) gas is 0.1 to 10% by volume, nitrogen (N 2 ) gas is 10 to 60% by volume, and the remainder is hydrogen (H 2 ) The gas is a reactive gas, the film formation temperature is 960 to 1100 ° C., and the gas pressure is 10 to 85 kPa.
- Step 3 The surface of the formed coating layer 6 corresponding to the cutting edge 4 is polished. By this polishing process, the cutting edge 4 is processed smoothly, the welding of the work material is suppressed, and the tool is further excellent in fracture resistance.
- Examples of the polishing method include brushing, blasting, and polishing using an elastic grindstone.
- a coating layer was formed on the cemented carbide substrate by the chemical vapor deposition (CVD) method under the film formation conditions shown in Table 1 to produce a cutting tool.
- CVD chemical vapor deposition
- Tables 1 and 2 each compound is represented by a chemical symbol.
- the above samples were subjected to X-ray diffraction analysis using CuK ⁇ rays, and the peaks measured from the surface of the aluminum oxide layer and the peak intensity of each peak were measured.
- a flat surface at the center of the surface of the coating layer 6 on the rake face 2 and a flat surface at the center of the surface of the coating layer on the flank 3 were selected.
- the highest intensity peak was confirmed, and the orientation coefficients Tcf (104), Tcf (012), Tcr (104), and Tcr (012) were calculated.
- the said X-ray-diffraction measurement measured about three arbitrary samples, and evaluated it with the average value.
- the mirror-processed cross section of the said tool was observed with the scanning electron microscope (SEM), and the thickness of each layer was measured.
- SEM scanning electron microscope
- the results are shown in Tables 2 and 3.
- the roughness Rz of the interface was estimated with respect to the interface line between the tool substrate and the coating layer mirrored by a scanning electron microscope.
- the measurement was performed at a boundary line length of 40 ⁇ m using a 3000 times SEM photograph.
- the width L1 of the curved surface when the rake face is viewed from the front and the width L2 of the curved surface when the flank is viewed from the front are measured by a projector, and the ratio (L1 / L2) is calculated.
- sample no. 14 the ratio (Tcf (104) / Tcf (012)) is equal to the ratio (Tcr (104) / Tcr (012)).
- 15 and 16 have a ratio (Tcf (104) / Tcf (012)) smaller than the ratio (Tcr (104) / Tcr (012)).
- Tcf (104) are higher than Tcf (012) and Tcr (104) is lower than Tcr (012).
- samples 1 to 7, 9, and 11 to 13 sample nos. Compared to 8 and 10, the flank wear width was small. Further, the sample No.
- flank wear width was particularly small.
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Abstract
Description
また、X線回折分析にて分析される前記酸化アルミニウム層のピークを基に、下記式で表される値を配向係数Tc(hkl)としたとき、前記第2面における配向係数Tcf(104)とTcf(012)との比(Tcf(104)/Tcf(012))が、前記第1面における配向係数Tcr(104)とTcr(012)との比(Tcr(104)/Tcr(012))よりも高い。
配向係数Tc(hkl)={I(hkl)/I0(hkl)}/〔(1/7)×Σ{I(HKL)/I0(HKL)}〕
ここで、(HKL)は、(012)、(104)、(110)、(006)、(113)、(024)、(116)の結晶面を示す。I(HKL)およびI(hkl)は、前記酸化アルミニウム層のX線回折分析において検出される各結晶面に帰属されるピークのピーク強度を示す。I0(HKL)およびI0(hkl)は、JCPDSカードNo.43-1484に記載された各結晶面の標準回折強度を示す。
本開示の一実施態様を示す切削工具(以下、単に工具と略す)1は、第1面2と、第1面2に隣り合う第2面3と、第1面2と第2面3との間の稜線部に位置する切刃4と、を備える。本実施形態においては、図1に示すように、工具1は、その形状が多面体であり、第1面2がすくい面2、第2面3が逃げ面である。以下、第1面2をすくい面2、第2面3を逃げ面3という。なお、図1に示す工具1のすくい面2の中央にはネジ孔15が存在するが、ネジ孔15は必ずしも必要ではない。
被覆層6は、下層7、炭窒化チタン層8、中間層9、酸化アルミニウム層10および表層11を備えている。下層7、炭窒化チタン層8、中間層9、酸化アルミニウム層10および表層11は、基体5側から順に積層されている。なお、酸化アルミニウム層10はα型結晶構造からなる。
配向係数Tc(hkl)={I(hkl)/I0(hkl)}/〔(1/7)×Σ{I(HKL)/I0(HKL)}〕
ここで、(HKL)は、(012)、(104)、(110)、(006)、(113)、(024)、(116)の結晶面を示し
I(HKL)およびI(hkl)は、酸化アルミニウム層10のX線回折分析において検出される各結晶面に帰属されるピークのピーク強度を示す。I0(HKL)およびI0(hkl)は、JCPDS(Joint Committee on Powder Diffraction Standards)カードNo.43-1484に記載された各結晶面の標準回折強度を示す。
条件1:X線回折チャートにおいて、逃げ面3におけるピークのうち、(006)面に帰属されるピークのピーク強度If(006)または(104)面に帰属されるピークのピーク強度If(104)が最も高い。
条件2:X線回折チャートにおいて、すくい面2におけるピークのうち、(006)面に帰属されるピークのピーク強度Ir(006)または(012)面に帰属されるピークのピーク強度Ir(012)が最も高い。
以上の条件1、2の双方を満足することによって、逃げ面3における耐摩耗性をより改善することができる。
まず、無機物粉末に、金属粉末、カーボン粉末、バインダー等を適宜添加、混合した混合物を生成する。無機物粉末の例としては、硬質合金を焼成によって形成しうる金属炭化物、窒化物、炭窒化物、酸化物等が挙げられる。金属粉末の例としては、コバルト粉末等が挙げられる。次に、前記混合物を公知の成形方法によって所定の成形体を生成する。本実施形態においては、工具1はネジ孔15を有することから、ネジ孔15に対応する孔が存在するような成形体とする。成形方法としては、プレス成形、鋳込成形、押出成形、冷間静水圧プレス成形等が挙げられる。そして、前記成形体を所望によって脱バインダ処理した後、真空中または非酸化性雰囲気中にて焼成することによって基体5を作製する。そして、上記基体5の表面に所望によって研磨加工や切刃部のホーニング加工を施す。
本実施態様においては、被覆層6を化学気相蒸着(CVD)法によって成膜する。図4に、被覆層6を成膜する成膜装置内における基体5のセット方法の一例を示す。図4Aは、セット治具20を複数段積み重ねた模式図であり、図4Bは、基体5の配置を説明するための断面図である。基体5のセットにあたり、図4のセット方法によれば、まず、所定の間隔で支持棒を配置したセット治具20を準備する。支持棒21に基体5の中央のネジ孔15を通して、基体5を支持棒21で保持する。そして、セット治具20を複数段積み重ねる。セット治具20内に複数の基体5をセットする場合、基体5同士、および基体5とセット治具20との間隔を調整する。具体的には、すくい面2となる基体5aとセット治具20との間の間隔d1が、逃げ面3となる基体5b同士間の間隔d2よりも狭くなるように調整してセットする。より具体的には、すくい面2間の間隔はすくい面2の内接円(すくい面2内に描ける最大の円)の直径Lに対して0.7以下に調整し、逃げ面3間の間隔は直径Lに対して0.7より大きくする。これによって、すくい面2および逃げ面3における酸化アルミニウム層10の結晶配向を制御することができる。
この研磨加工により、切刃4が平滑に加工され、被削材の溶着を抑制して、さらに耐欠損性に優れた工具となる。研磨方法としては、ブラシ加工、ブラスト加工および弾性砥石を用いた研磨加工が挙げられる。
(連続切削条件)
被削材 :クロムモリブデン鋼材(SCM435)
工具形状:CNMG120408
切削速度:300m/分
送り速度:0.3mm/rev
切り込み:1.5mm
切削時間:25分
その他 :水溶性切削液使用
評価項目:走査型電子顕微鏡にて刃先ホーニング部分を観察し、実際に摩耗している部分において、逃げ面摩耗幅を測定。
(断続切削条件)
被削材 :クロムモリブデン鋼 4本溝入り鋼材(SCM440)
工具形状:CNMG120408
切削速度:300m/分
送り速度:0.3mm/rev
切り込み:1.5mm
その他 :水溶性切削液使用
評価項目:欠損に至る衝撃回数を測定。
2・・・すくい面
3・・・逃げ面
4・・・切刃
5・・・基体
6・・・被覆層
7・・・下層
8・・・炭窒化チタン層
8a・・・MT-炭窒化チタン層
8b・・・HT-炭窒化チタン層
9・・・中間層
9a・・・下部中間層
9b・・・上部中間層
10・・酸化アルミニウム層
11・・・表層
15・・・ネジ孔
Claims (7)
- 第1面と、該第1面に隣り合う第2面と、前記第1面と第2面との稜線部の少なくとも一部に位置する切刃とを有する被覆工具において、
基体と、該基体上に位置する被覆層と、を備え、
前記被覆層は、炭窒化チタン層と、α型結晶構造の酸化アルミニウム層と、を備え、
前記炭窒化チタン層は、前記酸化アルミニウム層よりも前記基体に対して近くに位置し、
X線回折分析にて分析される前記酸化アルミニウム層のピークを基に、下記式で表される値を配向係数Tc(hkl)としたとき、
前記第2面における前記被覆層の配向係数Tcf(104)とTcf(012)との比(Tcf(104)/Tcf(012))が、前記第1面における前記被覆層における配向係数Tcr(104)とTcr(012)との比(Tcr(104)/Tcr(012))よりも高い被覆工具。
配向係数Tc(hkl)={I(hkl)/I0(hkl)}/〔(1/7)×Σ{I(HKL)/I0(HKL)}〕
ここで、(HKL)は、(012)、(104)、(110)、(006)、(113)、(024)、(116)の結晶面を示し、
I(HKL)およびI(hkl)は、前記酸化アルミニウム層のX線回折分析において検出される各結晶面に帰属されるピークのピーク強度を示し
I0(HKL)およびI0(hkl)は、JCPDSカードNo.43-1484に記載された各結晶面の標準回折強度を示す。 - 前記Tcf(104)が前記Tcf(012)よりも高く、かつ前記Tcr(104)が前記Tcr(012)よりも低い請求項1に記載の被覆工具。
- 前記第2面における前記被覆層での前記酸化アルミニウム層のピークのうち、(006)面に帰属されるピークのピーク強度If(006)または(104)面に帰属されるピークのピーク強度If(104)が最も高く、かつ前記第1面における前記被覆層での前記酸化アルミニウム層のピークのうち、(006)面に帰属されるピークのピーク強度Ir(006)または(012)面に帰属されるピークのピーク強度Ir(012)が最も高い請求項1または2に記載の被覆工具。
- 前記切刃は曲面状であり、前記第1面を正面視したときにおける前記曲面の幅L1と前記第2面を正面視したときにおける前記曲面の幅L2との比(L1/L2)が1.3~2.0である請求項1乃至3のいずれか記載の被覆工具。
- 前記第2面を正面視したときにおける前記曲面の幅L2が0.030~0.080mmである請求項4記載の被覆工具。
- 前記第1面に対応する前記基体の表面の界面粗さが、前記第2面に対応する前記基体の表面の界面粗さよりも小さい請求項1乃至5のいずれか記載の被覆工具。
- 前記第1面がすくい面であり、前記第2面が逃げ面である請求項1乃至6のいずれか記載の被覆工具。
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JPWO2016121690A1 (ja) | 2017-11-02 |
CN107427930A (zh) | 2017-12-01 |
US20180015548A1 (en) | 2018-01-18 |
JP6419220B2 (ja) | 2018-11-07 |
CN107427930B (zh) | 2019-11-22 |
US10744568B2 (en) | 2020-08-18 |
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