WO2016117502A1 - 接合構造体及び接合構造体の製造方法 - Google Patents

接合構造体及び接合構造体の製造方法 Download PDF

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Publication number
WO2016117502A1
WO2016117502A1 PCT/JP2016/051276 JP2016051276W WO2016117502A1 WO 2016117502 A1 WO2016117502 A1 WO 2016117502A1 JP 2016051276 W JP2016051276 W JP 2016051276W WO 2016117502 A1 WO2016117502 A1 WO 2016117502A1
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WIPO (PCT)
Prior art keywords
metal member
region
joining
laser
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/051276
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English (en)
French (fr)
Inventor
和義 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of WO2016117502A1 publication Critical patent/WO2016117502A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/1222—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/1224—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a butt joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B29C66/124—Tongue and groove joints
    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12461—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being rounded, i.e. U-shaped or C-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12463—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being tapered
    • B29C66/12464—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being tapered being V-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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    • B29C66/727—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being porous, e.g. foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/82—Testing the joint
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74281—Copper or alloys of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74283—Iron or alloys of iron, e.g. steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/939—Measuring or controlling the joining process by measuring or controlling the speed characterised by specific speed values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0079—Liquid crystals

Definitions

  • the present invention relates to a joint structure having a joint region in which a metal member and a resin member are joined, and a method for manufacturing the joint structure.
  • Patent Document 1 is known as a method for manufacturing a bonded structure having a bonded region in which resins are bonded together.
  • Patent Document 1 a first member made of a transmissive thermoplastic resin that transmits laser light and a second member made of an absorptive thermoplastic resin that absorbs laser light are brought into contact with each other, and laser A method of laser welding a thermoplastic resin member that melts and joins contact surfaces with light, wherein the first member and the second member are brought into contact in a reduced-pressure atmosphere, and the two members are joined from the first member side.
  • a laser welding method of a thermoplastic resin member for irradiating the contact surface with the laser beam is disclosed.
  • a first member made of a transmissive thermoplastic resin that transmits laser light is brought into contact with a second member made of an absorptive thermoplastic resin that absorbs laser light,
  • the laser beam When the laser beam is irradiated from the side of the first member that transmits the laser beam, the laser beam generates heat by accumulating energy on the surface of the second member that does not transmit the laser beam.
  • the amount of heat generation increases, the contact surface with the first member is simultaneously heated through the contact surface, the contact surfaces of the two members are melted, and the two members are welded.
  • Patent Document 1 The technology of Patent Document 1 is an invention relating to the joining of resins, but when this invention is used for joining a resin member and a metal member, problems described below have occurred.
  • the present invention has been made in view of such a point, and the object of the present invention is to suppress thermal diffusion of the metal member even when the laser energy irradiated at the time of laser joining between the metal member and the resin member is small. It is an object of the present invention to provide a bonded structure and a method for manufacturing the bonded structure, in which the heat melting property of the resin member is improved and the bondability between the metal member and the resin member is good.
  • the present invention is configured as follows.
  • the joint structure according to the present invention is a joint structure having a joint region in which a metal member and a resin member are joined, and the joint region of the metal member has a concave shape having an opening on the surface of the metal member. And a concave portion of the metal member is filled with the resin member, and the metal member includes the joining region and an adjacent region adjacent to the joining region. A thin portion in which the thickness of the metal member is reduced is provided therein.
  • the thin portion may be formed in the bonding region.
  • the thin portion may be formed in a region including at least the adjacent region.
  • the thin portion may be provided with a heat insulating material.
  • the thin portion may be provided with a reinforcing portion that reinforces the metal member.
  • a protruding portion that protrudes inward may be formed on the inner peripheral surface of the concave portion.
  • the manufacturing method of the joining structure which concerns on this invention is a manufacturing method of the joining structure which has a joining area
  • the bonding step when the laser is irradiated on the bonding region of the metal member, the laser is scanned in the bonding region, and a plurality of the scans are performed with the same locus. It may be performed once.
  • the concave portion in the method for manufacturing the bonded structure, in the concave portion forming step, may be formed by irradiating a laser in which one pulse is composed of a plurality of subpulses.
  • the present invention even when the laser energy irradiated at the time of laser joining between the metal member and the resin member is small, the thermal diffusion of the metal member is suppressed and the heat melting property of the resin member is improved. It is possible to provide a bonded structure having good bondability and a method for manufacturing the bonded structure.
  • FIG. 1 is an explanatory view for explaining an arrangement step in the method for manufacturing a bonded structure according to the present invention.
  • FIG. 2 is an explanatory view for explaining a joining step in the method for manufacturing a joined structure according to the present invention.
  • FIG. 3 is a cross-sectional view of the first embodiment of the bonded structure according to the present invention.
  • FIG. 4A is a diagram showing a modification of the first embodiment of the joint structure according to the present invention.
  • FIG. 4B is a view showing another modification of the first embodiment of the joint structure according to the present invention.
  • FIG. 4C is a diagram showing still another modification of the first embodiment of the joint structure according to the present invention.
  • FIG. 4A is a diagram showing a modification of the first embodiment of the joint structure according to the present invention.
  • FIG. 4B is a view showing another modification of the first embodiment of the joint structure according to the present invention.
  • FIG. 4C is a diagram showing still another modification of the first embodiment of the joint structure according to the present
  • FIG. 5 is a cross-sectional view of still another modification of the first embodiment of the bonded structure according to the present invention.
  • FIG. 6 is a perspective view of still another modified example of the first embodiment of the bonded structure according to the present invention.
  • FIG. 7 is a perspective view of still another modified example of the first embodiment of the bonded structure according to the present invention.
  • FIG. 8 is a cross-sectional view of a second embodiment of the bonded structure according to the present invention.
  • FIG. 9A is a diagram showing a modification of the second embodiment of the joint structure according to the present invention.
  • FIG. 9B is a diagram showing another modified example of the second embodiment of the joint structure according to the present invention.
  • FIG. 9C is a diagram showing still another modification of the second embodiment of the joint structure according to the present invention.
  • FIG. 9A is a diagram showing a modification of the second embodiment of the joint structure according to the present invention.
  • FIG. 9B is a diagram showing another modified example of the second embodiment of the joint structure according
  • FIG. 10 is a cross-sectional view of a third embodiment of the joint structure according to the present invention.
  • FIG. 11 is a cross-sectional view of a modified example of the third embodiment of the bonded structure according to the present invention.
  • FIG. 12 is a perspective view of another modification of the third embodiment of the joint structure according to the present invention.
  • FIG. 13 is an explanatory diagram schematically illustrating an example of the bonded structure according to the first embodiment.
  • FIG. 14 is an explanatory diagram schematically illustrating an example of the bonded structure according to the third embodiment.
  • FIG. 1 is an explanatory view for explaining an arrangement step in a method for manufacturing a bonded structure
  • FIG. 2 is an explanatory view for explaining a bonding step in the method for manufacturing a bonded structure
  • FIG. 3 is a first view of the bonded structure.
  • 4A to 4C are cross-sectional views showing a modification of the first embodiment of the joint structure
  • FIG. 5 is a cross-sectional view of another modification of the first embodiment of the joint structure.
  • FIG. 6 is a perspective view of still another modified example of the first embodiment of the joined structure
  • FIG. 7 is a perspective view of still another modified example of the first embodiment of the joined structure.
  • the bonding structure 1 of the present embodiment is a bonding structure 1 in which a metal member 2 and a resin member 3 are bonded by a laser, and has a bonding region BF in which the metal member 2 and the resin member 3 are bonded. ing.
  • Examples of the metal member 2 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
  • a concave portion 21 having an opening on the surface of the metal member 2 is formed.
  • the concave portion 21 is a substantially circular non-through hole when seen in a plan view, and a plurality of the concave portions 21 are formed on the surface of the metal member 2.
  • the shape of a recessed part is not limited to a non-through-hole, For example, a groove shape may be sufficient if a cross section is a concave shape.
  • the opening diameter of the concave portion 21 is preferably 30 ⁇ m or more and 100 ⁇ m or less. This is because, when the aperture diameter is less than 30 ⁇ m, the bonding laser irradiated in the bonding process described later is not sufficiently confined in the concave portion 21, and the conversion efficiency for converting the energy of the bonding laser into heat decreases. It is because there is a case to do. On the other hand, when the opening diameter exceeds 100 ⁇ m, the number of the concave portions 21 per unit area decreases, and the conversion efficiency for converting the energy of the laser for bonding into heat may decrease. Moreover, it is preferable that the depth of the recessed part 21 is 10 micrometers or more. This is because if the depth is less than 10 ⁇ m, the conversion efficiency for converting the energy of the laser for bonding into heat may decrease.
  • the interval between the concave portions 21 (the distance between the center of the predetermined concave portion 21 and the center of the concave portion 21 adjacent to the predetermined concave portion 21) is preferably 200 ⁇ m or less. This is because if the interval between the concave portions 21 exceeds 200 ⁇ m, the number of the concave portions 21 per unit area decreases, and the conversion efficiency for converting the energy of the laser for bonding into heat may decrease. .
  • An example of the lower limit of the interval between the concave portions 21 is a distance at which the concave portions 21 are not overlapped and crushed.
  • interval of the recessed part 21 is equal intervals. This is because when the concave portions 21 are equidistant, the heat distribution when the bonding laser is irradiated is isotropic.
  • the concave member 21 is filled with a resin member 3 to be described later, whereby the metal member 2 and the resin member 3 are joined.
  • the concave portion 21 of the present embodiment is formed with a protruding portion 22 that protrudes inward.
  • a thin portion 23 in which the thickness of the metal member 2 is reduced is provided in a region including the bonding region BF and the adjacent region NF adjacent to the bonding region BF (see FIG. 3).
  • a hole is formed on the back surface of the metal member 2 to form a thin portion 23.
  • the shape of the back surface processing of the metal member 2 is not limited to the hole shape, and may be a groove shape, for example. That is, any shape may be used as long as the metal member 2 is thin.
  • the thin portion 23 is formed in the bonding region BF, but the concave portion 21 may be formed over the adjacent region NF adjacent to the bonding region BF.
  • the adjacent region NF may reduce thermal diffusion in the laser irradiation direction (thickness direction of the metal member 2) even when the laser is applied to the bonding region BF of the metal member 2 in the bonding process described later.
  • the area should be as large as possible.
  • the shape of the thin portion 23 is not limited to the shape of FIG. 3, and as shown in FIG. 4A, the shape gradually thinned from the center of the bonding region BF toward the region end of the bonding region BF, As shown in FIG. 4B, the joining region BF on the back surface of the metal member 2 is processed into a trapezoidal shape in a cross-sectional view and thinned, or the joining region BF on the back surface of the metal member 2 is cross-sectionally shown in FIG. 4C.
  • the shape may be thinned by processing by penetrating in a circular arc shape.
  • the thin portion 23 may be provided with a heat insulating material 25 (see FIG. 5).
  • An example of the heat insulating material 25 is a heat insulating material made of foamed resin.
  • the thin portion 23 may be provided with a reinforcing portion 24 that reinforces the metal member 2 (see FIGS. 6 and 7).
  • the reinforcing portion 24 may be disposed so as to be diagonally connected to each other in the groove formed on the back surface of the metal member 2, or as shown in FIG. A plurality of them may be arranged in parallel so as to connect each other.
  • the strength of the metal member 2 can be increased.
  • the resin member 3 is a thermoplastic resin or a thermosetting resin.
  • the thermoplastic resin include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile / styrene), ABS (acrylonitrile / butadiene). ⁇ Styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP (polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal) ), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyetherether) Hong), PEEK (polyetheretherketone), PAI (polyamideimide), LCP (liquid crystal
  • TPE thermoplastic elastomer
  • examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
  • thermosetting resins examples include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). Is mentioned. Further, it may be FRP (fiber reinforced plastic).
  • a filler may be added to the thermoplastic resin and the thermosetting resin.
  • the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
  • the manufacturing method of the bonded structure 1 according to the present embodiment includes a thin portion forming step, a concave portion forming step, an arranging step, and a bonding step.
  • a thin portion forming step a concave portion forming step
  • an arranging step a bonding step.
  • the thin part forming process is a thin part in which the thickness of the metal member 2 is reduced in the metal member 2 in a region including the bonding region BF and the adjacent region NF adjacent to the bonding region BF.
  • 23 is a step of forming 23.
  • a method of laser processing the metal member 2 or a method of forming a metal member 2 having the thin portion 23 by using a mold for forming the thin portion 23 in advance is not limited to these methods.
  • the shape of the thin portion 23 is not limited to the shape of FIG. 3, and may be the shape shown in FIGS. 4A to 4C. Moreover, you may form the heat insulating material 25 in the thin part 23 (refer FIG. 5). Moreover, you may form the reinforcement part 24 which reinforces the metal member 2 in the thin part 23 (FIG.6 and FIG.7).
  • the concave part formation process is a process of forming the concave part 21 having an opening in the bonding region BF on the surface of the metal member 2.
  • the concave portion 21 is formed by a known method such as laser processing, blast processing, sandpaper processing, anodizing processing, electric discharge processing, etching processing, or press processing.
  • a method for forming the concave portion 21 by laser processing will be described in detail.
  • the type of processing laser that forms the concave portion 21 is preferably a laser capable of pulse oscillation, and can be selected from a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser. Then, a fiber laser, a YAG laser, a second harmonic of a YAG laser, a YVO 4 laser, and a semiconductor laser are preferable.
  • the concave portion 21 is a substantially circular non-through hole as viewed in plan, and a plurality of the concave portions 21 are formed on the surface of the metal member 2.
  • a fiber laser marker MXZ2000 or MX-Z2050 manufactured by OMRON As an example of an apparatus for forming the concave portion 21, there can be mentioned a fiber laser marker MXZ2000 or MX-Z2050 manufactured by OMRON. With this fiber laser marker, it is possible to irradiate a laser where one pulse is composed of a plurality of subpulses. For this reason, the energy of the laser is easily concentrated in the depth direction, which is suitable for forming the concave portion 21.
  • the metal member 2 when the metal member 2 is irradiated with a laser, the metal member 2 is locally melted to advance the formation of the concave portion 21. At this time, since the laser is composed of a plurality of sub-pulses, the molten metal member 2 is not easily scattered and is easily deposited in the vicinity of the concave portion 21. When the formation of the concave portion 21 proceeds, the molten metal member 2 is deposited inside the concave portion 21, thereby forming a protruding portion 22 that protrudes inward on the inner peripheral surface of the concave portion 21. .
  • one period of the subpulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the concave portion 21 having the protruding portion 22.
  • one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
  • the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the concave portion 21 having the protruding portions 22.
  • positioning process is a process of arrange
  • a laser absorption layer (not shown) may be provided on the surface of the metal member 2 or the surface of the resin member 3.
  • a pigment-based or dye-based laser absorbing material having an absorptivity with respect to the wavelength of the laser for bonding can be appropriately selected and used. If comprised in this way, the improvement of the conversion efficiency which converts the energy of the laser for joining into heat can be aimed at.
  • the thickness of the laser absorption layer is preferably 10 ⁇ m or less in order to ensure the filling property of the concave portion 21 of the metal member 2.
  • a laser absorbing material may be blended in the resin member 3 as long as the resin member 3 satisfies the required laser transmittance.
  • the bonding process is a process in which the resin member 3 is filled and bonded to the concave portion 21 of the metal member 2 by irradiating the bonding region BF of the metal member 2 with a laser from the resin member 3 side.
  • the metal member 2 and the resin member 3 are pressed and brought into contact with each other, and then a bonding laser is irradiated toward the surface of the metal member 2.
  • the laser irradiation may be performed from the resin member 3 side or from the metal member 2 side.
  • the resin member 3 does not have laser transparency
  • the laser is irradiated from the metal member 2 side.
  • fiber laser, YAG laser, YVO 4 laser, a semiconductor laser, carbon dioxide laser, an excimer laser can be selected.
  • the energy of the laser is converted into heat inside the metal member 2, and the surface temperature of the metal member 2 is increased.
  • the resin member 3 in the vicinity of the surface of the metal member 2 is melted, and the concave portion 21 is filled with the resin member 3.
  • the thin portion 23 is formed in the bonding region BF, even if the laser is irradiated to the bonding region BF of the metal member 2, heat in the laser irradiation direction (thickness direction of the metal member 2) is generated. Diffusion can be suppressed.
  • the resin member 3 is solidified, whereby the bonded structure 1 in which the resin member 3 is bonded to the metal member 2 can be manufactured (see FIG. 3).
  • the laser when irradiating the bonding area BF of the metal member 2 with a laser, the laser may be scanned in the bonding area BF, and the scanning may be performed a plurality of times along the same locus. In this case, since the laser scanning is performed a plurality of times along the same locus, the temperature of the metal member 2 rises, and the resin member 3 and the metal member 2 can be bonded more effectively.
  • the metal is formed in the subsequent bonding step.
  • the metal member 2 and the resin member 3 can be joined with less laser energy while suppressing thermal diffusion.
  • FIG. 13 is an explanatory view schematically illustrating an example of a bonded structure.
  • the metal member used in each example and each comparative example is made of SUS304, and has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the resin member is a PMMA resin, and has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • region of a metal member and a resin member was set as width 20mm and length 20mm (refer FIG. 13).
  • the laser used for joining the metal member and the resin member in the joining process is a semiconductor laser
  • the wavelength is 808 nm
  • the oscillation mode is continuous oscillation
  • the focal diameter is 4 mm
  • the scanning speed is 2 mm / sec
  • the metal member and the resin The contact pressure with the member was set to 0.6 MPa.
  • the joint strength was evaluated using an Instron electromechanical universal testing machine 5900. Specifically, the test was performed at a tensile speed of 5 mm / min in the shear direction to evaluate the bonding strength. The evaluation results are shown in Table 1.
  • Comparative Example 1-1 In the joining structure of Comparative Example 1-1, the metal member is not provided with a thin portion, and the output of the semiconductor laser described above is set to 15 W in the joining step, and the metal member and the resin member are joined in the joining region. It was.
  • the bonding strength of this bonded structure was 7.2 MPa.
  • Example 1-1 In the bonding structure 100 of Example 1-1, a hole having a length of 20 mm, a width of 20 mm, and a thickness of 2.5 mm is formed in the bonding region BF ′ on the back surface of the metal member 200 (that is, an area substantially equal to the bonding region BF ′).
  • the output of the semiconductor laser described above was set to 15 W, and the metal member 200 and the resin member 300 were joined in the joining region BF ′.
  • the bonding strength of this bonded structure 100 was 11.8 MPa.
  • Example 1-2 In the bonding structure 100 of Example 1-2, the bonding region BF ′ on the back surface of the metal member 200 has a hole having a length of 20 mm, a width of 20 mm, and a thickness of 2.5 mm (that is, an area substantially equal to the bonding region BF ′).
  • the output of the semiconductor laser described above was set to 20 W, and the metal member 200 and the resin member 300 were joined in the joining region BF ′.
  • the bonding strength of this bonded structure 100 was 12.3 MPa.
  • the bonding region BF ′ on the back surface of the metal member 200 has a hole having a length of 20 mm, a width of 20 mm, and a thickness of 2.5 mm (that is, an area substantially equal to the bonding region BF ′). Hole) to form a thin portion, a heat insulating material is provided in the hole, and in the bonding step, the output of the semiconductor laser described above is set to 15 W, and the metal member 200 and the resin member 300 are bonded to the bonding region BF ′. And joined.
  • the bonding strength of this bonded structure 100 was 12.4 MPa.
  • the bonding region BF ′ on the back surface of the metal member 200 has a hole having a length of 20 mm, a width of 20 mm, and a thickness of 2.5 mm (that is, an area substantially equal to the bonding region BF ′). Hole) is formed into a thin portion, and reinforcing portions formed so as to connect diagonal lines to each other are provided in the hole.
  • the output of the above-described semiconductor laser is set to 15 W, and the metal The member 200 and the resin member 300 were joined at the joining region BF ′.
  • the joint strength of this joint structure 100 was 11.5 MPa.
  • the bonding region BF ′ on the back surface of the metal member 200 has a hole having a length of 20 mm, a width of 20 mm, and a thickness of 2.5 mm (that is, an area substantially equal to the bonding region BF ′). Hole) is formed into a thin portion, and reinforcing portions formed so as to connect diagonal lines to each other are provided in the hole.
  • the output of the semiconductor laser described above is set to 20 W, and the metal The member 200 and the resin member 300 were joined at the joining region BF ′.
  • the joint strength of this joint structure 100 was 11.3 MPa.
  • the bonding strengths of the bonded structures of Comparative Examples 1-1 and 1-2 that do not include the thin portion are that of Examples 1-1 to 1-5 that include the thin portion. A result lower than the bonding strength of the bonded structure 100 was obtained.
  • the bonding structure 100 corresponding to the present embodiment when the metal member 200 and the resin member 300 are bonded to each other by irradiating the bonding region BF ′ with a laser, a thin portion is formed in the bonding region BF ′. Therefore, thermal diffusion in the laser irradiation direction can be suppressed. Accordingly, the bonding strength between the metal member 200 and the resin member 300 can be improved while suppressing the laser output.
  • FIG. 8 is a cross-sectional view of the second embodiment of the bonded structure
  • FIGS. 9A to 9C are diagrams showing modifications of the second embodiment of the bonded structure.
  • the bonded structure 1 of the present embodiment is provided with a thin portion 23 by processing the surface side of the metal member 2 (see FIG. 8).
  • the thin portion 23 is formed in the bonding region BF.
  • a concave portion 21 is formed in the thin portion 23, and the metal member 2 and the resin member 3 are joined by filling the concave portion 21 with the resin member 3.
  • the protrusion part 22 which protrudes inside is formed in the concave-shaped part 21, the protrusion part 22 does not need to be formed.
  • the shape of the thin portion 23 is not limited to the shape of FIG. 8, and as shown in FIG. 9A, the surface of the bonding region BF is raised so that the central portion is not flush with the surface of the bonding region BF.
  • 9B a shape that is thinned as a convex shape in cross-sectional view, a shape that is thinned by processing the joint region BF on the surface of the metal member 2 through a trapezoidal shape in cross-sectional view, as shown in FIG.
  • the bonding region BF on the surface of the metal member 2 may be formed in a thin shape by penetrating into a circular arc shape in a cross-sectional view.
  • the resin member 3 has substantially the same size as the size of the bonding region BF (that is, the size enough to be accommodated in the groove corresponding to the thin portion 23).
  • the resin member 3 may have the same size as the metal member 2, and the surface of the resin member 3 may be bulged to the extent that it is accommodated in the groove corresponding to the thin portion 23.
  • the surface of the metal member 2 is processed into the thin part 23 by the thin part formation process.
  • the shape of the thin portion 23 is not limited to the shape of FIG. 8, and may be the shape shown in FIGS. 9A to 9C.
  • the recessed part 21 is formed in the thin part 23 of the metal member 2 by a recessed part formation process. At this time, when the laser is composed of a plurality of sub-pulses, the protruding portion 22 protruding inward can be formed on the inner peripheral surface of the concave portion 21.
  • the resin member 3 is solidified, whereby the bonded structure 1 in which the resin member 3 is bonded to the metal member 2 can be manufactured.
  • the thin portion 23 in which the thickness of the metal member 2 is reduced is formed also by the method for manufacturing the bonded structure 1 of the present embodiment, when the metal member 2 and the resin member 3 are bonded together.
  • the metal member 2 and the resin member 3 can be joined with a small amount of laser energy.
  • FIG. 10 is a cross-sectional view of the third embodiment of the joint structure
  • FIG. 11 is a cross-sectional view of a modification of the third embodiment of the joint structure
  • FIG. 12 is another view of the third embodiment of the joint structure. It is a perspective view of a modification.
  • a thin portion 23 is formed by forming a slit on the back surface of the metal member 2 (see FIG. 10).
  • two thin portions 23 are formed in a region including at least the adjacent region NF.
  • the number of thin portions 23 may be one, or may be three or more.
  • the thin portion 23 may be formed in the bonding region BF over a region including the adjacent region NF.
  • the concave portion 21 is formed in the bonding region BF on the surface of the metal member 2. By filling the concave portion 21 with the resin member 3, the metal member 2 and the resin member 3 are joined. In addition, although the protrusion part 22 which protrudes inside is formed in the concave-shaped part 21, the protrusion part 22 does not need to be formed.
  • the thin portion 23 may be provided with a heat insulating material 25 (see FIG. 11), or may be provided with a reinforcing portion 24 that reinforces the metal member 2 (see FIG. 12).
  • the reinforcement part 24 may be arrange
  • a slit is formed in the back surface of the metal member 2 by the thin part formation process, and it is set as the thin part 23.
  • a heat insulating material 25 may be formed on the thin portion 23 (see FIG. 11), or a reinforcing portion 24 that reinforces the metal member 2 may be formed.
  • the concave part 21 is formed in the joining area
  • the resin member 3 in the vicinity of the surface of the metal member 2 is melted, and the resin member 3 is filled in the concave portion 21.
  • the thin portion 23 is formed in a region including at least the adjacent region NF, thermal diffusion from the junction region BF to the outside via the thin portion 23 even if the junction region BF is irradiated with laser. Can be suppressed. That is, by forming the thin portion 23, the laser energy can be retained in the bonding region BF.
  • the resin member 3 is solidified, whereby the bonded structure 1 in which the resin member 3 is bonded to the metal member 2 can be manufactured.
  • the thin portion 23 in which the thickness of the metal member 2 is reduced is formed also by the method for manufacturing the bonded structure 1 of the present embodiment, when the metal member 2 and the resin member 3 are bonded together.
  • the metal member 2 and the resin member 3 can be joined with a small amount of laser energy.
  • FIG. 14 is an explanatory diagram schematically illustrating an example of the bonded structure according to the third embodiment.
  • the metal member used in each example and each comparative example is made of SUS304, and has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the resin member is a PMMA resin, and has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • region of a metal member and a resin member was set as width 20mm and length 20mm.
  • the laser used for joining the metal member and the resin member in the joining process is a semiconductor laser
  • the wavelength is 808 nm
  • the oscillation mode is continuous oscillation
  • the focal diameter is 4 mm
  • the scanning speed is 2 mm / sec
  • the metal member and the resin member was set to 0.6 MPa.
  • the joint strength was evaluated using an Instron electromechanical universal testing machine 5900. Specifically, the test was performed at a tensile speed of 5 mm / min in the shear direction to evaluate the bonding strength. The evaluation results are shown in Table 2.
  • Comparative Example 2-1 In the joining structure of Comparative Example 2-1, the metal member was not provided with a thin portion, and the output of the semiconductor laser was set to 15 W in the joining process, and the metal member and the resin member were joined in the joining region. It was.
  • the bonding strength of this bonded structure was 5.6 MPa.
  • Comparative Example 2-2 In the joining structure of Comparative Example 2-2, the metal member and the resin member are joined in the joining region in the joining step without setting the thin portion in the metal member and setting the output of the semiconductor laser described above to 20 W. It was.
  • the bonding strength of this bonded structure was 7.2 MPa.
  • Example 2-1 The bonding structure 100 of Example 2-1 is thin by forming a slit having a width of 0.2 mm and a depth of 2.5 mm in a region (adjacent region NF ′) surrounding the bonding region BF ′ on the back surface of the metal member 200.
  • the output of the semiconductor laser described above was set to 15 W, and the metal member 200 and the resin member 300 were joined in the joining region BF ′.
  • the bonding strength of this bonded structure 100 was 10.5 MPa.
  • Example 2-2 The bonding structure 100 of Example 2-2 is thin by forming a slit having a width of 0.2 mm and a depth of 2.5 mm in a region (adjacent region NF ′) surrounding the bonding region BF ′ on the back surface of the metal member 200.
  • the output of the semiconductor laser described above was set to 20 W, and the metal member 200 and the resin member 300 were joined in the joining region BF ′.
  • the joint strength of this joint structure 100 was 11.2 MPa.
  • Example 2-3 The bonding structure 100 of Example 2-3 is thin by forming a slit having a width of 0.2 mm and a depth of 2.5 mm in a region (adjacent region NF ′) surrounding the bonding region BF ′ on the back surface of the metal member 200.
  • the output of the semiconductor laser described above was set to 15 W, and the metal member 200 and the resin member 300 were joined in the joining region BF ′.
  • the bonding strength of this bonded structure 100 was 11.4 MPa.
  • Example 2-4 The bonding structure 100 of Example 2-4 is thin by forming a slit having a width of 0.2 mm and a depth of 2.5 mm in a region (adjacent region NF ′) surrounding the bonding region BF ′ on the back surface of the metal member 200.
  • the output of the semiconductor laser described above is set to 15 W, and the metal member 200 and the resin member 300 are joined at the joining region BF ′. It was made to join.
  • the bonding strength of this bonded structure 100 was 10.4 MPa.
  • Example 2-5 The bonding structure 100 of Example 2-5 is formed by forming a slit having a width of 0.2 mm and a depth of 2.5 mm in a region surrounding the bonding region BF ′ on the back surface of the metal member 200 (adjacent region NF ′).
  • the output of the semiconductor laser described above is set to 20 W, and the metal member 200 and the resin member 300 are joined in the joining region BF ′. It was made to join.
  • the bonding strength of this bonded structure 100 was 10.7 MPa.
  • the thin portion is formed in the region including at least the adjacent region NF ′. Therefore, the metal member 200 is irradiated with the laser to the joining region BF ′.
  • the resin member 300 and the resin member 300 are bonded, it is possible to suppress thermal diffusion from the bonding region BF ′ to the outside through the thin portion. Thereby, the energy of the laser is confined in the bonding region BF ′ with a small amount of laser energy, and the metal member 200 and the resin member 300 can be bonded.

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Abstract

　接合構造体は、金属部材と樹脂部材とが接合された接合領域を有する接合構造体であって、金属部材の接合領域には、金属部材の表面に開口を有する凹状部が形成されるとともに、金属部材の凹状部には、樹脂部材が充填されており、金属部材には、接合領域と、接合領域と隣接する隣接領域と、を包含する領域内に、金属部材の厚みが薄くされた薄厚部が設けられている。

Description

接合構造体及び接合構造体の製造方法
　本発明は、金属部材と樹脂部材とが接合された接合領域を有する接合構造体及び接合構造体の製造方法に関する。
　従来から、樹脂同士が接合された接合領域を有する接合構造体の製造方法として特許文献１が知られている。
　特許文献１には、レーザ光を透過する透過性熱可塑性樹脂から構成される第１の部材と、レーザ光を吸収する吸収性熱可塑性樹脂から構成される第２の部材とを接触させ、レーザ光で接触面を溶融して接合する熱可塑性樹脂部材のレーザ溶着方法であって、第１の部材と第２の部材とを減圧雰囲気下で接触させ、第１の部材側から前記２つの部材の接触面に前記レーザ光を照射する熱可塑性樹脂部材のレーザ溶着方法が開示されている。
　特許文献１によれば、レーザ光を透過する透過性熱可塑性樹脂から構成される第１の部材と、レーザ光を吸収する吸収性熱可塑性樹脂から構成される第２の部材とを接触させ、レーザ光を透過する第１の部材側からレーザ光を照射すると、レーザ光はレーザ光を透過しない第２の部材の表面でエネルギーが蓄積されて発熱する。レーザ光をさらに照射すると発熱量は大きくなり、接触面を通して第１の部材との接触面も同時に加熱され、２つの部材の接触面が溶融し、２つの部材が溶着される。
特開２００７－１１１９２６号公報
　特許文献１の技術は、樹脂同士の接合に関する発明であるが、この発明を、樹脂部材と金属部材との接合に用いた場合は、以下に記載する課題が生じていた。
　樹脂部材と金属部材とを減圧雰囲気下でレーザを照射して接合させた場合、減圧により樹脂側への熱拡散が生じにくいことに加え、熱伝導度の違いから金属部材側への熱拡散が圧倒的に大きいので、樹脂部材の熱溶融が生じにくかった。そのため、樹脂部材の熱溶融を生じさせて、樹脂部材と金属部材とを接合させるためには、レーザの照射エネルギーを上げる必要があった。このように、レーザの照射エネルギーを上げることは、省エネルギー化の観点から好ましくない。
　本発明は、かかる点に鑑みてなされたものであり、その目的とするところは、金属部材と樹脂部材とのレーザ接合時に照射されたレーザエネルギーが小さい場合でも、金属部材の熱拡散を抑制して樹脂部材の熱溶融性を高め、金属部材と樹脂部材との接合性が良好な接合構造体及びこの接合構造体の製造方法の提供を目的とする。
　上記目的を達するために、本発明は次のとおりの構成としている。
　本発明に係る接合構造体は、金属部材と樹脂部材とが接合された接合領域を有する接合構造体であって、前記金属部材の前記接合領域には、当該金属部材の表面に開口を有する凹状部が形成されるとともに、前記金属部材の凹状部には、前記樹脂部材が充填されており、前記金属部材には、前記接合領域と、該接合領域と隣接する隣接領域と、を包含する領域内に、前記金属部材の厚みが薄くされた薄厚部が設けられていることを特徴とする。
　また、上記接合構造体であって、前記薄厚部は、前記接合領域内に形成されていてもよい。
　また、上記接合構造体であって、前記薄厚部は、少なくとも前記隣接領域を含む領域内に形成されていてもよい。
　また、上記接合構造体であって、前記薄厚部には、断熱材が備えられていてもよい。
　また、上記接合構造体であって、前記薄厚部には、前記金属部材を補強する補強部が備えられていてもよい。
　また、上記接合構造体であって、前記凹状部の内周面には、内側に突出する突出部が形成されていてもよい。
　また、本発明に係る接合構造体の製造方法は、金属部材と樹脂部材とが接合された接合領域を有する接合構造体の製造方法であって、前記金属部材において、前記接合領域と、該接合領域と隣接する隣接領域と、を包含する領域内に、前記金属部材の厚みが薄くされた薄厚部を形成する薄厚部形成工程と、前記金属部材の表面の前記接合領域に、開口を有する凹状部を形成する凹状部形成工程と、前記金属部材の表面と前記樹脂部材とを隣接配置する配置工程と、前記樹脂部材側から前記金属部材の接合領域にレーザを照射することにより、前記金属部材の前記凹状部に前記樹脂部材を充填して接合させる接合工程と、を備えることを特徴とする。
　また、上記接合構造体の製造方法であって、前記接合工程では、前記金属部材の接合領域にレーザを照射する際に、前記接合領域内においてレーザを走査させるとともに、前記走査を同一軌跡で複数回行うこととしてもよい。
　また、上記接合構造体の製造方法であって、前記凹状部形成工程では、１パルスが複数のサブパルスで構成されるレーザを照射することにより、前記凹状部を形成してもよい。
　本発明によれば、金属部材と樹脂部材とのレーザ接合時に照射されたレーザエネルギーが小さい場合でも、金属部材の熱拡散を抑制して樹脂部材の熱溶融性を高め、金属部材と樹脂部材との接合性が良好な接合構造体及びこの接合構造体の製造方法を提供できる。
図１は、本発明に係る接合構造体の製造方法において、配置工程を説明する説明図である。 図２は、本発明に係る接合構造体の製造方法において、接合工程を説明する説明図である。 図３は、本発明に係る接合構造体の第１実施形態の断面図である。 図４Ａは、本発明に係る接合構造体の第１実施形態の変形例を示す図である。 図４Ｂは、本発明に係る接合構造体の第１実施形態の他の変形例を示す図である。 図４Ｃは、本発明に係る接合構造体の第１実施形態のさらに他の変形例を示す図である。 図５は、本発明に係る接合構造体の第１実施形態のさらに他の変形例の断面図である。 図６は、本発明に係る接合構造体の第１実施形態のさらに他の変形例の斜視図である。 図７は、本発明に係る接合構造体の第１実施形態のさらに他の変形例の斜視図である。 図８は、本発明に係る接合構造体の第２実施形態の断面図である。 図９Ａは、本発明に係る接合構造体の第２実施形態の変形例を示す図である。 図９Ｂは、本発明に係る接合構造体の第２実施形態の他の変形例を示す図である。 図９Ｃは、本発明に係る接合構造体の第２実施形態のさらに他の変形例を示す図である。 図１０は、本発明に係る接合構造体の第３実施形態の断面図である。 図１１は、本発明に係る接合構造体の第３実施形態の変形例の断面図である。 図１２は、本発明に係る接合構造体の第３実施形態の他の変形例の斜視図である。 図１３は、第１実施形態の接合構造体の実施例を模式的に説明した説明図である。 図１４は、第３実施形態の接合構造体の実施例を模式的に説明した説明図である。
　（第１実施形態）
　以下、本発明の第１実施形態の接合構造体１及びこの接合構造体１の製造方法について図１～７を参照しながら説明する。
　図１は、接合構造体の製造方法において、配置工程を説明する説明図、図２は、接合構造体の製造方法において、接合工程を説明する説明図、図３は、接合構造体の第１実施形態の断面図、図４Ａ～４Ｃは、それぞれ、接合構造体の第１実施形態の変形例を示す断面図、図５は、接合構造体の第１実施形態の他の変形例の断面図、図６は、接合構造体の第１実施形態のさらに他の変形例の斜視図、図７は、接合構造体の第１実施形態のさらに他の変形例の斜視図である。
　－接合構造体の構成－
　まず、本発明の第１実施形態の接合構造体１について説明する。
　本実施形態の接合構造体１は、金属部材２と樹脂部材３とがレーザによって接合された接合構造体１であって、金属部材２と樹脂部材３とが接合された接合領域ＢＦを有している。
　金属部材２は、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成型体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。
　金属部材２の接合領域ＢＦには、金属部材２の表面に開口を有する凹状部２１が形成される。凹状部２１は、平面的に見てほぼ円形の非貫通孔であり、金属部材２の表面に複数形成されている。なお、凹状部の形状は、非貫通孔に限定されず、断面が凹形状であれば、例えば、溝状であってもよい。
　凹状部２１の開口径は、３０μｍ以上、１００μｍ以下が好ましい。これは、開口径が３０μｍを下回ると、後述する接合工程において照射された接合用のレーザが凹状部２１内に十分に閉じ込められず、接合用のレーザのエネルギーを熱に変換する変換効率が低下する場合があるためである。一方、開口径が１００μｍを上回ると、単位面積あたりの凹状部２１の数が減少して、接合用のレーザのエネルギーを熱に変換する変換効率が低下する場合があるためである。また、凹状部２１の深さは、１０μｍ以上であることが好ましい。これは、深さが１０μｍを下回ると、接合用のレーザのエネルギーを熱に変換する変換効率が低下する場合があるためである。
　また、凹状部２１の間隔（所定の凹状部２１の中心と、所定の凹状部２１と隣接する凹状部２１の中心との距離）は、２００μｍ以下であることが好ましい。これは、凹状部２１の間隔が２００μｍを上回ると、単位面積あたりの凹状部２１の数が減少して、接合用のレーザのエネルギーを熱に変換する変換効率が低下する場合があるためである。なお、凹状部２１の間隔の下限の一例としては、凹状部２１が重畳して潰れない距離である。また、凹状部２１の間隔は等間隔であることが好ましい。これは、凹状部２１が等間隔であると、接合用のレーザが照射される際の熱の分布が等方的になるためである。
　凹状部２１には、後述する樹脂部材３が充填されることにより、金属部材２と樹脂部材３とが接合される。ここで、本実施形態の凹状部２１には、内側に突出する突出部２２が形成されている。このように凹状部２１の内周面に、内側に突出する突出部２２が形成されている場合は、凹状部２１に樹脂部材３が充填されると、突出部２２によるアンカー効果によって金属部材２と樹脂部材３との接合強度を高めることができる。なお、凹状部２１に突出部２２が形成されていなくてもよい。
　金属部材２のうちの、接合領域ＢＦと、接合領域ＢＦと隣接する隣接領域ＮＦと、を包含する領域内には、金属部材２の厚みが薄くされた薄厚部２３が設けられている（図３参照）。図示例では、金属部材２の裏面に孔が形成されて薄厚部２３とされている。なお、金属部材２の裏面加工の形状は、孔形状に限られず、例えば、溝形状でもよい。すなわち、金属部材２が薄厚とされていればどのような形状でもよい。
　また、図示例では、薄厚部２３は、接合領域ＢＦ内に形成されているが、凹状部２１が接合領域ＢＦと隣接する隣接領域ＮＦに亘って形成されていてもよい。ここで、隣接領域ＮＦは、後述する接合工程において、レーザを金属部材２の接合領域ＢＦに照射しても、レーザの照射方向（金属部材２の厚み方向）への熱拡散を少なくすることができる程度の領域とする。
　なお、薄厚部２３の形状は、図３の形状に限定されるものではなく、図４Ａのように、接合領域ＢＦの中央から接合領域ＢＦの領域端に向けて徐々に薄厚にした形状や、図４Ｂのように、金属部材２の裏面の接合領域ＢＦを断面視で台形状に刳り貫いて加工して薄厚にした形状や、図４Ｃのように金属部材２の裏面の接合領域ＢＦを断面視で円弧状に刳り貫いて加工して薄厚にした形状であってもよい。
　また、薄厚部２３には、断熱材２５が備えられていてもよい（図５参照）。断熱材２５の一例としては、発泡樹脂からなる断熱材が挙げられる。このように、薄厚部２３に断熱材２５が備えられている場合は、後述する接合構造体１の製造方法における接合工程において、接合領域ＢＦにレーザを照射させて金属部材２と樹脂部材３とを接合させた場合、接合領域ＢＦ内に熱を閉じ込める効果を高めることができる。
　また、薄厚部２３には、金属部材２を補強する補強部２４を備えていてもよい（図６及び図７参照）。補強部２４は、図６に示すように、金属部材２の裏面に形成された溝内に互いに対角を結ぶように配置されていてもよいし、図７に示すように、溝内の間隙を結ぶように平行に複数配置されていてもよい。このように、薄厚部２３に金属部材２を補強する補強部２４が備えられている場合は、金属部材２の強度を高めることができる。
　樹脂部材３は、熱可塑性樹脂、または、熱硬化性樹脂であり、熱可塑性樹脂の一例としては、ＰＶＣ（ポリ塩化ビニル）、ＰＳ（ポリスチレン）、ＡＳ（アクリロニトリル・スチレン）、ＡＢＳ（アクリロニトリル・ブタジエン・スチレン）、ＰＭＭＡ（ポリメチルメタクリレート）、ＰＥ（ポリエチレン）、ＰＰ（ポリプロピレン）、ＰＣ（ポリカーボネート）、ｍ－ＰＰＥ（変性ポリフェニレンエーテル）、ＰＡ６（ポリアミド６）、ＰＡ６６（ポリアミド６６）、ＰＯＭ（ポリアセタール）、ＰＥＴ（ポリエチレンテレフタレート）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＳＦ（ポリサルホン）、ＰＡＲ（ポリアリレート）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポリフェニレンサルファイド）、ＰＥＳ（ポリエーテルサルホン）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＡＩ（ポリアミドイミド）、ＬＣＰ（液晶ポリマー）、ＰＶＤＣ（ポリ塩化ビニリデン）、ＰＴＦＥ（ポリテトラフルオロエチレン）、ＰＣＴＦＥ（ポリクロロトリフルオロエチレン）、および、ＰＶＤＦ（ポリフッ化ビニリデン）が挙げられる。また、ＴＰＥ（熱可塑性エラストマ）であってもよく、ＴＰＥの一例としては、ＴＰＯ（オレフィン系）、ＴＰＳ（スチレン系）、ＴＰＥＥ（エステル系）、ＴＰＵ（ウレタン系）、ＴＰＡ（ナイロン系）、および、ＴＰＶＣ（塩化ビニル系）が挙げられる。
　熱硬化性樹脂の一例としては、ＥＰ（エポキシ）、ＰＵＲ（ポリウレタン）、ＵＦ（ユリアホルムアルデヒド）、ＭＦ（メラミンホルムアルデヒド）、ＰＦ（フェノールホルムアルデヒド）、ＵＰ（不飽和ポリエステル）、および、ＳＩ（シリコーン）が挙げられる。また、ＦＲＰ（繊維強化プラスチック）であってもよい。
　なお、熱可塑性樹脂および熱硬化性樹脂には、充填剤が添加されていてもよい。充填剤の一例としては、無機系充填剤（ガラス繊維、無機塩類など）、金属系充填剤、有機系充填剤、および、炭素繊維などが挙げられる。
　－接合構造体の製造方法－
　次に、本実施形態に係る接合構造体１の製造方法について説明する。
　本実施形態に係る接合構造体１の製造方法は、薄厚部形成工程と、凹状部形成工程と、配置工程と、接合工程と、を備える。以下、各工程について説明するが、本実施形態に係る接合構造体の製造方法の工程の順番は、説明する順番に限定されるものではない。
　・薄厚部形成工程
　薄厚部形成工程は、金属部材２において、接合領域ＢＦと、接合領域ＢＦと隣接する隣接領域ＮＦと、を包含する領域内に、金属部材２の厚みが薄くされた薄厚部２３を形成する工程である。
　薄厚部２３の形成には、金属部材２をレーザ加工する方法や、予め、薄厚部２３を形成するための金型を用いて、当該金型によって薄厚部２３を有する金属部材２を形成する方法等が挙げられるが、これらの方法に限定されるものではない。
　なお、薄厚部２３の形状は、図３の形状に限定されるものではなく、図４Ａ～図４Ｃに示した形状であってもよい。また、薄厚部２３には、断熱材２５を形成してもよい（図５参照）。また、薄厚部２３には、金属部材２を補強する補強部２４を形成してもよい（図６及び図７）。
　・凹状部形成工程
　凹状部形成工程は、金属部材２の表面の接合領域ＢＦに、開口を有する凹状部２１を形成する工程である。
　凹状部２１は、レーザ加工処理、ブラスト処理、サンドペーパ処理、陽極酸化処理、放電加工処理、エッチング処理、およびプレス加工処理等の公知の方法で形成される。本実施形態では、レーザ加工処理によって凹状部２１を形成する方法について詳述する。
　凹状部２１を形成する加工用レーザの種類としては、パルス発振が可能なものが好ましく、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ4レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択でき、レーザの波長を考慮すると、ファイバレーザ、ＹＡＧレーザ、ＹＡＧレーザの第２高調波、ＹＶＯ4レーザ、半導体レーザが好ましい。凹状部２１は、平面的に見てほぼ円形の非貫通孔であり、金属部材２の表面に複数形成される。
　凹状部２１を形成する装置の一例としては、オムロン製のファイバレーザマーカＭＸＺ２０００またはＭＸ－Ｚ２０５０を挙げることができる。このファイバレーザマーカでは、１パルスが複数のサブパルスで構成されるレーザを照射することが可能である。このため、レーザのエネルギーを深さ方向に集中させやすいので、凹状部２１を形成するのに好適である。
　具体的には、金属部材２にレーザが照射されると、金属部材２が局部的に溶融されることにより凹状部２１の形成が進行する。このとき、レーザが複数のサブパルスで構成されているため、溶融された金属部材２が飛散されにくく、凹状部２１の近傍に堆積されやすい。そして、凹状部２１の形成が進行すると、溶融された金属部材２が凹状部２１の内部に堆積されることにより、凹状部２１の内周面に、内側に突出する突出部２２が形成される。
　なお、上記ファイバレーザマーカによる加工条件としては、サブパルスの１周期が１５ｎｓ以下であることが好ましい。これは、サブパルスの１周期が１５ｎｓを超えると、熱伝導によりエネルギーが拡散しやすくなり、突出部２２を有する凹状部２１を形成しにくくなるためである。なお、サブパルスの１周期は、サブパルスの１回分の照射時間と、そのサブパルスの照射が終了されてから次回のサブパルスの照射が開始されるまでの間隔との合計時間である。
　また、上記ファイバレーザマーカによる加工条件としては、１パルスのサブパルス数は、２以上５０以下であることが好ましい。これは、サブパルス数が５０を超えると、サブパルスの単位あたりの出力が小さくなり、突出部２２を有する凹状部２１を形成しにくくなるためである。
　なお、凹状部形成工程は、コストの観点から薄厚部形成工程後に行うことが好ましいが、凹状部形成工程後に上述した薄厚部形成工程を行ってもよい。
　・配置工程
　配置工程は、金属部材２の表面と樹脂部材３とを隣接配置する工程である（図１参照）。隣接配置する際に、金属部材２及び樹脂部材３を加圧することにより、後述する接合工程によって接合しやすくすることができる。
　なお、金属部材２および樹脂部材３が隣接配置されたときに、金属部材２の表面または樹脂部材３の表面にレーザ吸収層（図示省略）が設けられていてもよい。このレーザ吸収層としては、接合用のレーザの波長に対して吸収性を有する顔料系または染料系のレーザ吸収材などを適宜選択して用いることができる。このように構成すれば、接合用のレーザのエネルギーを熱に変換する変換効率の向上を図ることができる。なお、レーザ吸収層の厚みは、金属部材２の凹状部２１への充填性を確保するために１０μｍ以下が好ましい。また、樹脂部材３が要求されるレーザの透過性を満たす範囲内において、樹脂部材３にレーザ吸収材が配合されていてもよい。
　・接合工程
　接合工程は、樹脂部材３側から金属部材２の接合領域ＢＦにレーザを照射することにより、金属部材２の凹状部２１に樹脂部材３を充填して接合させる工程である。
　具体的には、配置工程において、金属部材２と樹脂部材３とを加圧して接触させた後、接合用のレーザを金属部材２の表面に向けて照射する。
　ここで、レーザ照射は、樹脂部材３がレーザ透過性を有する場合は、樹脂部材３側からレーザを照射してもよいし、金属部材２側からレーザを照射してもよい。一方で、樹脂部材３がレーザ透過性を有しない場合は、金属部材２側からレーザを照射する。なお、接合用のレーザの種類としては、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ4レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択できる。
　レーザを金属部材２の接合領域ＢＦに照射することにより、レーザのエネルギーが金属部材２の内部で熱に変換され、金属部材２の表面の温度が高くなる。これにより、金属部材２の表面近傍の樹脂部材３が溶融され、その樹脂部材３が凹状部２１に充填される。本実施形態では、薄厚部２３が接合領域ＢＦ内に形成されているので、レーザを金属部材２の接合領域ＢＦに照射しても、レーザの照射方向（金属部材２の厚み方向）への熱拡散を抑制することができる。
　その後、樹脂部材３が固化されることにより、樹脂部材３が金属部材２に接合された接合構造体１を製造できる（図３参照）。
　ここで、金属部材２の接合領域ＢＦにレーザを照射する際に、接合領域ＢＦ内においてレーザを走査させるとともに、前記走査を同一軌跡で複数回行ってもよい。この場合は、レーザの走査を同一軌跡で複数回行われるため、金属部材２の温度が上昇し、より効果的に樹脂部材３と金属部材２とを接合することができる。
　以上、説明したとおり、本実施形態の接合構造体１の製造方法によれば、金属部材２の厚みが薄くされた薄厚部２３を形成する薄厚部形成工程を備えるため、その後の接合工程において金属部材２と樹脂部材３とを接合させる際に、熱拡散を抑制して少ないレーザエネルギーで金属部材２と樹脂部材３とを接合させることができる。
　－接合構造体の実験例－
　次に、上記した第１実施形態の効果を確認するために行った実験例について図１３を参照しながら説明する。図１３は、接合構造体の実施例を模式的に説明した説明図である。
　この実験例では、第１実施形態に対応する接合構造体の実施例１－１～１－５並びに比較例１－１及び１－２による接合構造体を作製した。
　なお、各実施例及び各比較例に用いた金属部材は、材質がＳＵＳ３０４であり、長さ１００ｍｍ、幅２９ｍｍ、厚み３ｍｍである。また、樹脂部材は、ＰＭＭＡ樹脂であり、長さ１００ｍｍ、幅２５ｍｍ、厚み３ｍｍである。また、金属部材と樹脂部材との接合領域は、幅２０ｍｍ、長さ２０ｍｍと設定した（図１３参照）。
　さらに、接合工程における金属部材と樹脂部材との接合に用いたレーザは、半導体レーザであり、波長が８０８ｎｍ、発振モードは連続発振、焦点径は４ｍｍ、走査速度は２ｍｍ／ｓｅｃ、金属部材と樹脂部材との密着圧力は０．６ＭＰａと設定した。
　接合強度の評価は、インストロン製の電気機械式万能試験機５９００を用いて行った。具体的には、せん断方向に引張速度５ｍｍ／ｍｉｎで試験を行い、接合強度を評価した。評価結果を表１に示す。
Figure JPOXMLDOC01-appb-T000001
  
　［比較例１－１］
　比較例１－１の接合構造体は、金属部材に薄厚部を設けずに、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材と樹脂部材とを接合領域で接合させた。
　この接合構造体の接合強度は５．６ＭＰａであった。
［比較例１－２］
　比較例１－２の接合構造体は、金属部材に薄厚部を設けずに、接合工程において、上述した半導体レーザの出力を２０Ｗと設定して、金属部材と樹脂部材とを接合領域で接合させた。
　この接合構造体の接合強度は７．２ＭＰａであった。
　［実施例１－１］
　実施例１－１の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´に、長さ２０ｍｍ、幅２０ｍｍ、厚み２．５ｍｍの孔（すなわち、接合領域ＢＦ´と略等しい面積を有する孔）を形成して薄厚部とし、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１１．８ＭＰａであった。
　［実施例１－２］
　実施例１－２の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´に、長さ２０ｍｍ、幅２０ｍｍ、厚み２．５ｍｍの孔（すなわち、接合領域ＢＦ´と略等しい面積を有する孔）を形成して薄厚部とし、接合工程において、上述した半導体レーザの出力を２０Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１２．３ＭＰａであった。
　［実施例１－３］
　実施例１－３の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´に、長さ２０ｍｍ、幅２０ｍｍ、厚み２．５ｍｍの孔（すなわち、接合領域ＢＦ´と略等しい面積を有する孔）を形成して薄厚部とするとともに、孔内に断熱材を設け、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１２．４ＭＰａであった。
　［実施例１－４］
　実施例１－４の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´に、長さ２０ｍｍ、幅２０ｍｍ、厚み２．５ｍｍの孔（すなわち、接合領域ＢＦ´と略等しい面積を有する孔）を形成して薄厚部とするとともに、孔内に互いに対角線を結ぶように形成された補強部が備えられており、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１１．５ＭＰａであった。
　［実施例１－５］
　実施例１－５の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´に、長さ２０ｍｍ、幅２０ｍｍ、厚み２．５ｍｍの孔（すなわち、接合領域ＢＦ´と略等しい面積を有する孔）を形成して薄厚部とするとともに、孔内に互いに対角線を結ぶように形成された補強部が備えられており、接合工程において、上述した半導体レーザの出力を２０Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１１．３ＭＰａであった。
　以上の接合強度の評価結果から、薄厚部が備えられていない比較例１－１及び１－２の接合構造体の接合強度は、薄厚部が備えられた実施例１－１～１－５の接合構造体１００の接合強度よりも低い結果が得られた。
　これにより、本実施形態に対応する接合構造体１００によれば、接合領域ＢＦ´にレーザを照射させて金属部材２００と樹脂部材３００とを接合させると、薄厚部が接合領域ＢＦ´内に形成されているので、レーザの照射方向への熱拡散を抑制することができる。従って、レーザ出力を抑制しながら金属部材２００と樹脂部材３００との接合強度を向上させることができる。
　（第２実施形態）
　以下、本発明の第２実施形態の接合構造体１及びこの接合構造体１の製造方法にについて図８及び９を参照しながら説明する。図８は、接合構造体の第２実施形態の断面図、図９Ａ～９Ｃは、それぞれ、接合構造体の第２実施形態の変形例を示す図である。
　なお、本実施形態は、接合構造体１の薄厚部２３に樹脂部材３が収容されて接合されている点が異なるだけであるので、以下、その相違点についてのみ説明し、同一の構成要素については、同一符号を付してその説明を省略する。
　－接合構造体の構成－
　まず、本発明の第２実施形態の接合構造体１について説明する。
　本実施形態の接合構造体１は、金属部材２の表面側を加工して薄厚部２３が設けられている（図８参照）。図示例では、薄厚部２３は、接合領域ＢＦ内に形成されている。
　薄厚部２３には、凹状部２１が形成されており、この凹状部２１に樹脂部材３が充填されることにより、金属部材２と樹脂部材３とが接合される。なお、凹状部２１には、内側に突出する突出部２２が形成されているが、突出部２２が形成されていなくてもよい。
　なお、薄厚部２３の形状は、図８の形状に限定されるものではなく、図９Ａのように、接合領域ＢＦの表面において、中央部が接合領域ＢＦの表面と面一とならない程度に隆起させて断面視凸形状として薄厚にした形状や、図９Ｂのように、金属部材２の表面の接合領域ＢＦを断面視で台形状に刳り貫いて加工して薄厚にした形状や、図９Ｃのように、金属部材２の表面の接合領域ＢＦを断面視で円弧状に刳り貫いて加工して薄厚にした形状であってもよい。
　樹脂部材３は、図８及び９Ａ～９Ｃに示すとおり、接合領域ＢＦの大きさと略同一の大きさ（つまり、薄厚部２３に相当する溝内に収容される程度の大きさ）とされているが、この例に限られない。すなわち、樹脂部材３を金属部材２と同程度の大きさとし、樹脂部材３の表面が、薄厚部２３に相当する溝内に収容される程度に膨出されていてもよい。
　－接合構造体の製造方法－
　次に、本実施形態に係る接合構造体１の製造方法について説明する。
　・薄厚部形成工程
　薄厚部形成工程により、金属部材２の表面を加工して薄厚部２３とする。なお、薄厚部２３の形状は、図８の形状に限定されるものではなく、図９Ａ～９Ｃに示した形状であってもよい。
　・凹状部形成工程
　凹状部形成工により、金属部材２の薄厚部２３に凹状部２１を形成する。このとき、レーザが複数のサブパルスで構成されている場合は、凹状部２１の内周面に、内側に突出する突出部２２を形成できる。
　・配置工程及び接合工程
　配置工程により、金属部材２の表面と樹脂部材３とを隣接配置する。そして、金属部材２と樹脂部材３とを加圧して接触させた後、接合用のレーザを金属部材２の表面に向けて照射する。これにより、金属部材２の表面近傍の樹脂部材３が溶融され、その樹脂部材３が凹状部２１に充填される。
　その後、樹脂部材３が固化されることにより、樹脂部材３が金属部材２に接合された接合構造体１を製造できる。
　以上、説明したとおり、本実施形態の接合構造体１の製造方法によっても、金属部材２の厚みが薄くされた薄厚部２３が形成されるため、金属部材２と樹脂部材３とを接合させる際に、少ないレーザエネルギーで金属部材２と樹脂部材３とを接合させることができる。
　（第３実施形態）
　以下、本発明の第３実施形態の接合構造体及びこの接合構造体の製造方法にについて図１０～１２を参照しながら説明する。
　図１０は、接合構造体の第３実施形態の断面図、図１１は、接合構造体の第３実施形態の変形例の断面図、図１２は、接合構造体の第３実施形態の他の変形例の斜視図である。
　なお、本実施形態は、接合構造体１の薄厚部２３の構造が異なるだけであるので、以下、その相違点についてのみ説明し、同一の構成要素については、同一符号を付してその説明を省略する。
　－接合構造体の構成－
　まず、本発明の第３実施形態の接合構造体１について説明する。
　本実施形態の接合構造体１は、金属部材２の裏面にスリットを形成して薄厚部２３が形成されている（図１０参照）。
　薄厚部２３は、図示例では、少なくとも隣接領域ＮＦを含む領域内に２つ形成されている。なお、薄厚部２３の数は、１つでもよいし、３つ以上であってもよい。また、薄厚部２３は、隣接領域ＮＦを含む領域に亘って接合領域ＢＦ内に形成されていてもよい。
　凹状部２１は、金属部材２の表面における接合領域ＢＦに形成されている。この凹状部２１に樹脂部材３が充填されることにより、金属部材２と樹脂部材３とが接合される。なお、凹状部２１には、内側に突出する突出部２２が形成されているが、突出部２２が形成されていなくてもよい。
　なお、薄厚部２３には、断熱材２５が備えられていてもよいし（図１１参照）、金属部材２を補強する補強部２４が備えられていてもよい（図１２参照）。また、補強部２４は、スリットの間隙を結ぶように平行に配置されていてもよいし、スリット内に対角状に配置されていてもよい。
　－接合構造体の製造方法－
　次に、本実施形態に係る接合構造体１の製造方法について説明する。
　・薄厚部形成工程
　薄厚部形成工程により、金属部材２の裏面にスリットを形成して薄厚部２３とする。なお、薄厚部２３には、断熱材２５を形成してもよいし（図１１参照）、金属部材２を補強する補強部２４を形成してもよい。
　・凹状部形成工程
　凹状部形成工程により、金属部材２の表面における接合領域ＢＦに、凹状部２１を形成する。このとき、レーザが複数のサブパルスで構成されている場合は、凹状部２１の内周面に、内側に突出する突出部２２を形成できる。
　・配置工程及び接合工程
　配置工程により、金属部材２の表面と樹脂部材３とを隣接配置する。そして、金属部材２と樹脂部材３とを加圧して接触させた後、接合工程により、接合用のレーザを金属部材２の表面に向けて照射する。
　レーザを金属部材２の接合領域ＢＦに照射することにより、金属部材２の表面近傍の樹脂部材３が溶融され、その樹脂部材３が凹状部２１に充填される。
　本実施形態では、薄厚部２３は、少なくとも隣接領域ＮＦを含む領域内に形成されているので、接合領域ＢＦにレーザを照射しても、薄厚部２３を介して接合領域ＢＦから外部に熱拡散することを抑制できる。すなわち、薄厚部２３が形成されていることにより、接合領域ＢＦ内にレーザエネルギーを留めることができる。
　その後、樹脂部材３が固化されることにより、樹脂部材３が金属部材２に接合された接合構造体１を製造できる。
　以上、説明したとおり、本実施形態の接合構造体１の製造方法によっても、金属部材２の厚みが薄くされた薄厚部２３が形成されるため、金属部材２と樹脂部材３とを接合させる際に、少ないレーザエネルギーで金属部材２と樹脂部材３とを接合させることができる。
　－接合構造体の実験例－
　次に、上記した第３実施形態の効果を確認するために行った実験例について図１４を参照しながら説明する。図１４は、第３実施形態の接合構造体の実施例を模式的に説明した説明図である。
　この実験例では、第３実施形態に対応する接合構造体の実施例２－１～２－５並びに比較例２－１及び２－２による接合構造体を作製した。
　なお、各実施例及び各比較例に用いた金属部材は、材質がＳＵＳ３０４であり、長さ１００ｍｍ、幅２９ｍｍ、厚み３ｍｍである。また、樹脂部材は、ＰＭＭＡ樹脂であり、長さ１００ｍｍ、幅２５ｍｍ、厚み３ｍｍである。また、金属部材と樹脂部材との接合領域は、幅２０ｍｍ、長さ２０ｍｍと設定した。
　さらに、接合工程における金属部材と樹脂部材との接合に用いたレーザは半導体レーザであり、波長が８０８ｎｍ、発振モードは連続発振、焦点径は４ｍｍ、走査速度は２ｍｍ／ｓｅｃ、金属部材と樹脂部材との密着圧力は０．６ＭＰａと設定した。
　接合強度の評価は、インストロン製の電気機械式万能試験機５９００を用いて行った。具体的には、せん断方向に引張速度５ｍｍ／ｍｉｎで試験を行い、接合強度を評価した。評価結果を表２に示す。
Figure JPOXMLDOC01-appb-T000002
  
　［比較例２－１］
　比較例２－１の接合構造体は、金属部材に薄厚部を設けずに、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材と樹脂部材とを接合領域で接合させた。
　この接合構造体の接合強度は５．６ＭＰａであった。
　［比較例２－２］
　比較例２－２の接合構造体は、金属部材に薄厚部を設けずに、接合工程において、上述した半導体レーザの出力を２０Ｗと設定して、金属部材と樹脂部材とを接合領域で接合させた。
　この接合構造体の接合強度は７．２ＭＰａであった。
　［実施例２－１］
　実施例２－１の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´を取り囲む領域（隣接領域ＮＦ´）に、幅０．２ｍｍ、深さ２．５ｍｍのスリットを形成して薄厚部とし、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１０．５ＭＰａであった。
　［実施例２－２］
　実施例２－２の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´を取り囲む領域（隣接領域ＮＦ´）に、幅０．２ｍｍ、深さ２．５ｍｍのスリットを形成して薄厚部とし、接合工程において、上述した半導体レーザの出力を２０Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１１．２ＭＰａであった。
　［実施例２－３］
　実施例２－３の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´を取り囲む領域（隣接領域ＮＦ´）に、幅０．２ｍｍ、深さ２．５ｍｍのスリットを形成して薄厚部とするとともに、各スリット内に断熱材を設け、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１１．４ＭＰａであった。
　［実施例２－４］
　実施例２－４の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´を取り囲む領域（隣接領域ＮＦ´）に、幅０．２ｍｍ、深さ２．５ｍｍのスリットを形成して薄厚部とするとともに、各スリット内の間隙を結ぶように補強部を設け、接合工程において、上述した半導体レーザの出力を１５Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１０．４ＭＰａであった。
　［実施例２－５］
　実施例２－５の接合構造体１００は、金属部材２００の裏面の接合領域ＢＦ´を取り囲む領域（隣接領域ＮＦ´）に、幅０．２ｍｍ、深さ２．５ｍｍのスリットを形成して薄厚部とするとともに、各スリット内の間隙を結ぶように補強部を設け、接合工程において、上述した半導体レーザの出力を２０Ｗと設定して、金属部材２００と樹脂部材３００とを接合領域ＢＦ´で接合させた。
　この接合構造体１００の接合強度は１０．７ＭＰａであった。
　以上の評価結果から、薄厚部が備えられていない比較例２－１及び２－２の接合構造体の接合強度は、薄厚部２３が備えられた実施例２－１～２－５の接合構造体１の接合強度よりも低い結果が得られた。
　これにより、本実施形態に対応する接合構造体１００によれば、薄厚部が、少なくとも隣接領域ＮＦ´を含む領域内に形成されているので、接合領域ＢＦ´にレーザを照射して金属部材２００と樹脂部材３００とを接合させると、接合領域ＢＦ´から薄厚部を介して外部に熱拡散することを抑制することができる。これにより、少ないレーザエネルギーで接合領域ＢＦ´内にレーザのエネルギーを閉じ込めて、金属部材２００と樹脂部材３００とを接合させることができる。
　なお、上記に示した本発明の実施形態及び実施例はいずれも本発明を具体化した例であって、本発明の技術的範囲を限定する性格のものではない。
１、１００　　接合構造体
２、２００　　金属部材
２１    　　　凹状部
２２　　　　　突出部
２３    　　　薄厚部
２４    　　　補強部
２５    　　　断熱材
３、３００　　樹脂部材
ＢＦ、ＢＦ´　接合領域
ＮＦ、ＮＦ´　隣接領域

Claims (9)

  1. 　金属部材と樹脂部材とが接合された接合領域を有する接合構造体であって、
    　前記金属部材の前記接合領域には、当該金属部材の表面に開口を有する凹状部が形成されるとともに、前記金属部材の凹状部には、前記樹脂部材が充填されており、
    　前記金属部材には、前記接合領域と、該接合領域と隣接する隣接領域と、を包含する領域内に、前記金属部材の厚みが薄くされた薄厚部が設けられていることを特徴とする接合構造体。
  2. 　請求項１に記載された接合構造体であって、
    　前記薄厚部は、前記接合領域内に形成されていることを特徴とする接合構造体。
  3. 　請求項１に記載された接合構造体であって、
    　前記薄厚部は、少なくとも前記隣接領域を含む領域内に形成されていることを特徴とする接合構造体。
  4. 　請求項１～３のいずれか１項に記載された接合構造体であって、
    　前記薄厚部には、断熱材が備えられていることを特徴とする接合構造体。
  5. 　請求項１～４のいずれか１項に記載された接合構造体であって、
    　前記薄厚部には、前記金属部材を補強する補強部が備えられていることを特徴とする接合構造体。
  6. 　請求項１～５のいずれか１項に記載された接合構造体であって、
    　前記凹状部の内周面には、内側に突出する突出部が形成されていることを特徴とする接合構造体。
  7. 　金属部材と樹脂部材とが接合された接合領域を有する接合構造体の製造方法であって、
    　前記金属部材において、前記接合領域と、該接合領域と隣接する隣接領域と、を包含する領域内に、前記金属部材の厚みが薄くされた薄厚部を形成する薄厚部形成工程と、
    　前記金属部材の表面の前記接合領域に、開口を有する凹状部を形成する凹状部形成工程と、
    　前記金属部材の表面と前記樹脂部材とを隣接配置する配置工程と、
    　前記樹脂部材側から前記金属部材の接合領域にレーザを照射することにより、前記金属部材の前記凹状部に前記樹脂部材を充填して接合させる接合工程と、
    　を備えることを特徴とする接合構造体の製造方法。
  8. 　請求項７に記載された接合構造体の製造方法であって、
    　前記接合工程では、前記金属部材の接合領域にレーザを照射する際に、前記接合領域内においてレーザを走査させるとともに、前記走査を同一軌跡で複数回行うことを特徴とする接合構造体の製造方法。
  9. 　請求項７又は８に記載された接合構造体の製造方法であって、
    　前記凹状部形成工程では、１パルスが複数のサブパルスで構成されるレーザを照射することにより、前記凹状部を形成することを特徴とする接合構造体の製造方法。
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CN106541209B (zh) * 2017-01-17 2018-02-09 镭蒙（苏州）微光学科技有限公司 一种用于激光焊接的方法及系统
JP2019113219A (ja) * 2017-12-21 2019-07-11 株式会社デンソー 接合構造体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001455A (ja) * 2001-06-15 2003-01-08 Matsushita Electric Ind Co Ltd 金属と樹脂との接合方法及び装置、制振鋼板の製造方法
JP2009226643A (ja) * 2008-03-19 2009-10-08 Aisin Seiki Co Ltd 接合方法及び接合体
JP2014018995A (ja) * 2012-07-13 2014-02-03 Daicel Polymer Ltd 複合成形体とその製造方法
JP2014091263A (ja) * 2012-11-05 2014-05-19 Jtekt Corp 複合成形体
JP2014166693A (ja) * 2013-02-28 2014-09-11 Daicel Polymer Ltd 複合成形体とその製造方法
JP2014177051A (ja) * 2013-03-15 2014-09-25 Denso Corp 溶着体のレーザー溶着方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302209A (ja) * 2008-06-11 2009-12-24 Nec Electronics Corp リードフレーム、半導体装置、リードフレームの製造方法および半導体装置の製造方法
JP5690051B2 (ja) * 2009-05-27 2015-03-25 公益財団法人名古屋産業科学研究所 レーザを用いた部材の接合方法
JP2013058739A (ja) * 2011-08-17 2013-03-28 Dainippon Printing Co Ltd 光半導体装置用リードフレーム、樹脂付き光半導体装置用リードフレーム、光半導体装置、および、光半導体装置用リードフレームの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001455A (ja) * 2001-06-15 2003-01-08 Matsushita Electric Ind Co Ltd 金属と樹脂との接合方法及び装置、制振鋼板の製造方法
JP2009226643A (ja) * 2008-03-19 2009-10-08 Aisin Seiki Co Ltd 接合方法及び接合体
JP2014018995A (ja) * 2012-07-13 2014-02-03 Daicel Polymer Ltd 複合成形体とその製造方法
JP2014091263A (ja) * 2012-11-05 2014-05-19 Jtekt Corp 複合成形体
JP2014166693A (ja) * 2013-02-28 2014-09-11 Daicel Polymer Ltd 複合成形体とその製造方法
JP2014177051A (ja) * 2013-03-15 2014-09-25 Denso Corp 溶着体のレーザー溶着方法

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