WO2016116204A1 - Refroidisseur à thermosiphon pour un dispositif électrique à inductance - Google Patents

Refroidisseur à thermosiphon pour un dispositif électrique à inductance Download PDF

Info

Publication number
WO2016116204A1
WO2016116204A1 PCT/EP2015/078869 EP2015078869W WO2016116204A1 WO 2016116204 A1 WO2016116204 A1 WO 2016116204A1 EP 2015078869 W EP2015078869 W EP 2015078869W WO 2016116204 A1 WO2016116204 A1 WO 2016116204A1
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
condenser
winding
electric device
conduit
Prior art date
Application number
PCT/EP2015/078869
Other languages
English (en)
Inventor
Thomas Gradinger
Uwe Drofenik
Original Assignee
Abb Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Technology Ag filed Critical Abb Technology Ag
Publication of WO2016116204A1 publication Critical patent/WO2016116204A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/10—Liquid cooling
    • H01F27/18—Liquid cooling by evaporating liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2876—Cooling

Definitions

  • the invention relates to the field of cooling electric devices.
  • the invention relates to an electric device having an electric inductance such as an inductor or a transformer.
  • Magnetic devices such as transformers and inductors (also called reactors or chokes) may be important elements of power-electronic systems. They may significantly contribute to the overall cost of an electrical system. Consequently, an economic design of such devices may be of paramount importance.
  • An important topic in this context may be the efficient cooling of windings of an inductor or transformer. Without sufficient cooling, the windings are thermally limited and current densities have to be kept rather low in order not to exceed a maximum admissible temperature. Furthermore, respecting temperature limits may be important to guarantee the reliability and lifetime of a winding insulation. Low current densities usually lead to large winding cross-sections and to a large amount of copper used, which usually is one of the dominant contributors to the cost of an electric device providing inductance.
  • inductors especially for inductors, the winding losses are dominant.
  • inductors even for high powers and currents (up to more than 1.000 A), usually dry designs are used.
  • Water is used herein as a short term for "water-glycol mixture", which is more customary in “water” cooling.
  • a cooler In indirect water cooling, a cooler is inserted between winding and core.
  • the cooler is thermally in contact with the winding, and optionally also with a core of the electric device.
  • the contact to the windings may be most important.
  • US 8,436,706 B2 which relates to a pumped end region refrigeration system for windings of transformers, shows a cooler with several windings fluidly connected in parallel.
  • direct water cooling the conductors of the windings are hollow, forming channels, through which water is pumped.
  • DE 43 08 974 A1 shows a flow of cooling fluid through conductors of a winding.
  • thermosyphons When cooling with water, usually the water actively has to be pumped through the cooler. It also has been proposed to use passive coolers (without a pump or fan for moving the cooling fluid), such as heat pipes and thermosyphons, which both are based on a phase- change of the cooling fluid.
  • a heat pipe uses the same conduit for evaporation and condensation of the cooling fluid, while a thermosyphon provides different conduits for these tasks.
  • DE 10 2008 004 342 B3 shows a heat-pipe cooler inserted between winding and core.
  • WO 2010/139597 A1 and EP 2 463 870 A1 relate to a dry transformer with heat pipe inside the high voltage winding, wherein the heat pipe is of annular shape.
  • EP 2 682 957 A1 relates to cooling of a transformer core with a thermosyphon.
  • WO 2013/184025 A1 describes an evaporating-condensing cooling system of a current- conducting element with a disc-shaped evaporator cooling disc-shaped windings.
  • Thermosyphons are also used for cooling of semiconductor modules such as IGBT modules as shown in EP 2 031 332 A1 .
  • WO 201 1/038184 A1 discloses a pumped liquid multiphase transformer cooling system utilizes a cold plate evaporator positioned between, insulated from, and in thermal contact with, the core and winding of the transformer.
  • the system includes a condenser and a pump to move the multiphase refrigerant through the cold plate and the condenser and back to the pump.
  • JP S60 163412 shows a transformer having a winding around a middle leg of a core Furthermore a heat exchanger is provided which comprises an evaporator portion and a condenser portion both formed as conduits.
  • Direct water cooling may be very efficient, but usually requires deionized water and the associated infrastructure (a pump, a filter, monitoring of ions/conductivity). It usually is therefore comparably expensive. In case of a leakage, there may be the risk of an electric short circuit. The winding conductors must be tubular, causing high losses (skin effect, eddy currents) at elevated frequencies. Indirect water cooling may allow the use of non-deionized water. However, for indirect water cooling, a pump is needed and the risks in case of leakage remain.
  • the invention relates to an electric device having/providing an electric inductance.
  • the electric device may be an inductor (such as a reactor or choke) or may be a transformer.
  • the electric device may be a high-power device, which may be adapted for processing currents of more than 1 .00 A, for example more than 1 .000 A. In inductors rated for several hundred A up to the kA range, usually the winding losses are typically dominant. It has to be understood that the electric device may be a device with more than one electric phase.
  • the electric device comprises at least one winding, a magnetic core with a leg surrounded by the winding and a thermosyphon cooler for cooling the winding.
  • the leg and/or the magnetic core may be manufactured from a magnetic material such as laminated metal sheets.
  • the winding may comprise one or more conductors that are wound around the leg.
  • the winding may be substantially cylindrical, thus having an axis that is substantially parallel to the leg of the magnetic core.
  • the two-phase cooler has an evaporator with at least one evaporator conduit for evaporating a cooling fluid and a condenser with at least one condenser conduit for condensing the cooling fluid .
  • the evaporator conduit may be separate from the condenser conduit.
  • a heat pipe does not have separate conduits for evaporator and condenser.
  • a winding may have two side surfaces (on the inside facing towards the leg and on the outside facing away from the leg) and two front surfaces (facing substantially in an extension direction of the leg).
  • a winding since the thermal conductivity along the conductors is very high, cooling a side surface may be very efficient, since the generated heat is transported efficiently by the conductors to the evaporator of the cooler.
  • the winding of a magnetic device may be cooled with a thermosyphon cooler, which is in thermal contact with a side surface of the winding .
  • a thermosyphon cooler which is in thermal contact with a side surface of the winding .
  • Such a cooler may be manufactured in cheap mass production. There may be no porous wick as usually employed in a heat pipe.
  • the one or more evaporator conduits may run substantially parallel to the leg and/or the axis of the winding and/or substantially orthogonal to the direction of the conductors of the winding for transporting the heat away from the winding.
  • the vaporized cooling fluid may be collected in a first manifold, may be transported upwards to the condenser and may be distributed to one or more condenser conduits, where it is liquefied.
  • the condenser of the cooler may be water cooled and/or air cooled.
  • the liquefied cooling fluid may be collected in a second manifold and transported downwards via one or more return circuits to the evaporator.
  • thermosyphon cooler may cool more than one of these windings. It also may be possible that there is a thermosyphon cooler for each winding.
  • the thermosyphon cooler may be used for cooling of multi-phase (in particular three-phase) inductors and transformers.
  • the thermosyphon cooler may enable an efficient cooling without water, deionization and pumping the cooling water.
  • the thermosyphon cooler may be purely passive, service- free, and/or may be environmentally friendly, if a cooling fluid like R1234ze is used, that is non-toxic and has a low global warming potential (GWP).
  • GWP global warming potential
  • a cooling fluid such as R134a, R245fa or R1234ze may be used.
  • such an electric device may be a component of a power converter.
  • power semiconductors usually are the main contributors to system losses.
  • air cooling is usually no option, and, therefore, water cooling is employed. This usually results in significantly higher cost as compared to two-phase cooling.
  • Two-phase cooling of power semiconductors may be an option, but as long as the magnetic devices of the converter are water cooled, the water-cooling system has to be present anyway, and is, therefore, also used for the power semiconductors.
  • By realizing two-phase cooling for the magnetic devices as described herein, also power semiconductors may be two-phase cooled, which would significantly reduce the total cost of the overall cooling system of the power converter.
  • the side surface of the winding which is in thermal contact with the evaporator, faces towards the leg of the magnetic core and the evaporator is at least partially arranged between the winding and the leg.
  • the evaporator may be arranged inside the winding and may cool the winding from the inside. In such a way, the winding and the leg may be used for mechanically mounting the evaporator and/or cooling of the electric device.
  • the side surface of the winding, which is in thermal contact with the evaporator faces away from the leg of the magnetic core and the evaporator is at least partially arranged outside of the winding. It alternatively or additionally may be possible that the evaporator is arranged outside of the winding . In this case, the assembly of the cooler separate from the assembly of winding with the magnetic core may be facilitated.
  • the evaporator is additionally in thermal contact with the magnetic core.
  • the magnetic core may be cooled with the evaporator.
  • a thermal contact between the evaporator and the leg and/or the winding may mean that there is no material between the evaporator and the leg and/or winding with low heat transfer capability such as thermal insulating plastic material and/or an air gap.
  • a material with high thermal conductivity may be arranged in between.
  • the winding is received in the magnetic core such that an end region of the winding extends out of the magnetic core.
  • the magnetic core may comprise three legs, which are connected with one or two yokes at their ends.
  • the winding may surround the middle leg and thus an end region of the winding may protrude from the magnetic core in a direction substantially orthogonal to the direction of the row of three legs.
  • the evaporator may be in thermal contact with the end region of the winding, for example at an inside and/or an outside of the winding .
  • coolers may be arranged at opposite sides of the electric device.
  • two coolers may be arranged inside and outside of an end region of the winding .
  • the evaporator comprises an evaporator plate for providing the thermal contact between the at least one evaporator conduit and the winding.
  • the evaporator plate is from a material that has a good thermal conductivity, but a low electric conductivity.
  • An example is ceramics such as AIN.
  • the evaporator plate may have slits to interrupt circular current paths, which also has the effect of reducing eddy-current losses.
  • the evaporator plate may have an outer shape adapted to the winding , for example may have a rounded and/or flat surface (adapted for a rounded and/or substantially flat surface of the winding).
  • the evaporator conduit may be at least partially incorporated inside the evaporator plate.
  • the evaporator conduit may be provided by a bore in the evaporated plate.
  • the evaporator conduit may be provided by a separate tube that is thermally connected to the evaporator plate.
  • the tube may be at least partially received inside the evaporator plate.
  • the evaporator may comprise a groove for at least partially receiving the tube.
  • the condenser is mounted above the evaporator, such that it extends above the winding and/or above the magnetic core, such that the condenser is coolable via an air flow.
  • the condenser may protrude above the electric device.
  • the condenser comprises a plurality of condenser conduits arranged in a row and/or the evaporator comprises a plurality of evaporator conduits arranged in a row.
  • the evaporator and/or the condenser may be platelike devices both of which may have conduits arranged side by side.
  • the row of condenser conduits and the row of evaporator conduits may extend in the same direction.
  • At least one collection manifold is provided between the evaporator and the condenser for collecting the fluid from the plurality of evaporator or condenser conduits.
  • at least one distribution manifold is provided between the evaporator and the condenser for distributing the fluid to the evaporator or condenser conduits. Such manifolds may be provided above and/or below the evaporator and/or may be provided above and/or below the condenser.
  • one or more return conduits may be used for guiding condensed cooling fluid from the condenser to the evaporator.
  • This return conduit(s) may connect the manifolds below the condenser and below the evaporator.
  • a vapour riser conduit may interconnect a manifold above the evaporator with a manifold above the condenser.
  • a return conduit for guiding condensed cooling fluid from the condenser to the evaporator is arranged outside of an evaporator plate and/or is at least partially arranged inside an evaporator plate of the evaporator.
  • the return conduit may not to be in thermal contact with the evaporator plate.
  • a tube providing the return conduit may run through the evaporator plate with an air gap between the tube and the evaporator plate.
  • the evaporator conduit and/or the condenser conduit are provided by a multi-channel tube, which multi-channel tube is separated by inner walls in at least two channels.
  • a multi-channel tube may be extruded from aluminium.
  • Such multi-channel tubes may have a big inner surface and may resist high inner pressures.
  • At least one channel of a multi-channel tube provides the evaporator conduit (which is accommodated in the evaporator plate) and at least one channel of the same multi-channel tube provides a return conduit for guiding condensed cooling fluid from the condenser to the evaporator (which channel may be not in direct thermal contact with the evaporator).
  • the multi-channel tubes may be accommodated in grooves of the evaporator plate that only may surround the channels for the evaporator conduits.
  • all channels of a multi-channel tube are used as evaporator conduits.
  • the corresponding multi-channel tube may be in thermal contact with the evaporator plate.
  • all channels of a multi-channel tube provide return conduits.
  • the corresponding multi-channel tube may not be in thermal contact with the evaporator plate.
  • this tube is received and/or surrounded by the evaporator plate, for example with an air gap.
  • the evaporator conduit is provided by a channel of the multi-channel tube and the condenser conduit is provided by a channel of the same multi-channel tube.
  • the cooler may comprise a row of multi-channel tubes, which lower sections are in contact with the evaporator plate and which upper sections are used as the condenser.
  • a further channel of the multi-channel tube provides a return conduit for guiding condensed cooling fluid from the condenser to the evaporator.
  • the remaining channels of the above-mentioned rows of multi- channel tubes may be used as return conduits.
  • a top manifold on top of the multi-channel tubes for connecting the channels at the top and a bottom manifold at the bottom of the multi-channel tubes for connecting the channels at the bottom.
  • the condenser comprises fins arranged between condenser conduits.
  • the fins may be mounted between tubes of the condenser, which may be multi-channel tubes.
  • the fins may comprise wavy or folded sheets, which are mounted to the tubes and are in thermal contact with the tubes such that air may flow between the tubes, which air flow may be substantially orthogonal to the extension of the tubes. Folded fins may provide an efficient heat transfer with low pressure drop and small heat-exchanger size.
  • Fig. 1 schematically shows an electric device according to an embodiment of the invention from a first side.
  • Fig. 2 schematically shows the electric device of Fig. 1 from a second side.
  • Fig. 3 schematically shows a cross-sectional view of the electric device of Fig. 2 along the line A-A.
  • Fig. 4 schematically shows a cooler for an electric device according to an embodiment of the invention.
  • Fig. 5 schematically shows a cooler for an electric device according to a further embodiment of the invention.
  • Fig. 6 schematically shows a cooler for an electric device according to a further embodiment of the invention.
  • Fig. 7 schematically shows fins for a cooler for an electric device according to an embodiment of the invention.
  • Fig. 8 schematically shows a cross-sectional view of an evaporator for an electric device according to an embodiment of the invention.
  • Fig. 9 schematically shows a cross-sectional view of an evaporator for an electric device according to a further embodiment of the invention.
  • Fig. 10 schematically shows a cross-sectional view of an evaporator for an electric device according to a further embodiment of the invention.
  • Fig. 1 1 shows a perspective view of a multi-channel tube for an electric device according to a further embodiment of the invention.
  • Fig. 1 , 2 and 3 show an electric device 10 comprising a winding 12 on a magnetic core 14.
  • the winding 12 is cooled by four thermosyphon coolers 16.
  • the electric device 10 is depicted as a single-phase inductor. However, it is also possible that the electric device 10 is a transformer and/or comprises a multi-phase winding.
  • the magnetic core 14 comprises three legs 18a, 18b, 18c, which are interconnected via two yokes.
  • the winding 12 surrounds the middle leg 18b, wherein central regions of the windings 12 are accommodated between the outer legs 18a, 18c and the middle leg 18b, such that two end regions 20 of the winding 12 extend from the magnetic core 14.
  • the winding 12 has a substantially rectangular cross-section with rounded edges.
  • the thermal conductivity of the winding 12 is highest along its conductor, which is wound around the middle leg 18b.
  • a good cooling efficiency may be achieved even if only the end regions 20 of the windings are cooled.
  • the heat transfer from the central regions of the winding to the end regions 20 can take place efficiently by conduction in the winding 12.
  • thermosyphon coolers 16 are attached, one inside the winding 12 and one outside the winding 12. It is also possible to have a thermosyphon cooler 16 only on the inside or only on the outside and/or only one or two thermosyphon coolers 16 at one of the end regions 20.
  • thermosyphon coolers 16 has an evaporator 22 and a condenser 24.
  • the evaporator 22 comprises an evaporator plate 26, which is arranged inside or outside of the winding 12.
  • Each thermosyphon cooler 16 is in thermal contact with the winding 12 via its evaporator plate 26 that has the function of transferring the heat from the winding 12 to evaporator conduits inside the evaporator 22.
  • the evaporator plate 26 is in thermal contact with a side surface 27 of the winding 12 which is provided in the end region 20.
  • An inner side surface 27 faces the leg 18b of the core 14.
  • An outer side surface faces away from the leg 18b.
  • the evaporator 22 and/or its evaporator plate 26 of the inside thermosyphon cooler 16 has rounded edges, forming a part of a bobbin for the winding 12.
  • the conductor of the winding 16 may be directly wound around one or both evaporators 22 (and the leg 18b), which may provide a tight and thermally good contact to the evaporator 22 and may avoid too low bending radii of the conductor.
  • the evaporator plate 26 of the outside thermosyphon cooler 16 is flat and may be pressed against the winding 12 by appropriate clamping means to provide good thermal contact.
  • evaporator 22 and/or its evaporator plate 26 of an inner cooler 16 also may be in thermal contact with the leg 18b.
  • the condensers 24 may be air-cooled and/or may be located above the magnetic core 14 in such a way that cooling air can flow through it without being obstructed by the magnetic core.
  • One or more of the condensers 24 may extend over the entire width of the electric device 10 to make efficient use of the available air flow cross- section. The air flows through all thermosyphon coolers 16 and/or condensers 24 in series.
  • Fig. 4 shows a first embodiment of a thermosyphon cooler 16.
  • the evaporator 22 comprises a row of parallel evaporator conduits 28 that, for example, may be tubes 29 accommodated in the evaporator plate 26 and/or may comprise bores in the evaporator plate 26.
  • the condenser 24 comprises a row of parallel condenser conduits 30 that, for example, may be tubes 29 interconnected by fins and/or the manifolds 36, 38.
  • the evaporator conduits 28 and/or condenser conduits 30 may be provided by channels of multi-channel tubes as shown in Fig. 8 to 10.
  • the vapor (evaporated cooling fluid) generated in the evaporator conduits 28 is collected by an evaporator top manifold 32 and is guided by a vapor riser conduit 34 (which may be provided by a tube 29) to a condenser top manifold 36. From there, the vapor is distributed to the condenser conduits 28 that may be in contact with folded fins for heat transfer to the air.
  • the condensate (condensed cooling fluid) is collected by a condenser bottom manifold 38 and guided by liquid return conduits 40 (which may be provided by further tubes 41 ) to an evaporator bottom manifold 42, which is interconnected with the bottom of the evaporator conduits 28.
  • the return conduits 28 are arranged outside of the evaporator 22 and/or evaporator plate 26 and thus the cooler 16 of Fig. 4 may have a maximally efficient evaporator 22.
  • the return conduits 40 may be outside of the winding 12.
  • Fig. 5 shows a further embodiment of a thermosyphon cooler 16 that may have the same components as the cooler of Fig. 4 except as otherwise indicated. Contrary to Fig. 4, in Fig. 5 the liquid return conduits 40 run through the evaporator 22.
  • a tube providing the return conduit 40 may be received in the evaporator plate 26 but may not be in thermal contact with the evaporator plate, for example with the aid of an air gap.
  • the condenser 24 extends over the full width of the magnetic core 14.
  • the winding 12 does not have to be threaded through the cooler 16 and/or the cooler 16 may be mounted to the winding 12 after the winding manufacturing (including possibly casting or impregnation) has been completed. This may result in a T-shaped cooler 16.
  • the liquid return conduits 40 may be provided in two outermost tubes 41 that are thermally not connected to the evaporator plate 26.
  • Fig. 6 shows a further embodiment of a thermosyphon cooler 16 that may have the same components as the cooler of Fig. 4 and/or 5 except as otherwise indicated.
  • Fig. 6 shows a further embodiment of a thermosyphon cooler 16 that may have the same components as the cooler of Fig. 4 and/or 5 except as otherwise indicated.
  • the cooler 16 comprises a row of parallel tubes 29, which in a lower section 44 provide the evaporator conduits 28 and in an upper section 46 provide the condenser conduits 30. Since the evaporator conduits 28 are directly connected with the condenser conduits 30, the top evaporator manifold 32 and the vapor riser conduit 34 may be omitted.
  • the liquid return conduits 40 may be provided by tubes 41 at the back of the cooler 16 or may be provided by channels of a multi-channel tube as shown in Fig. 10, which directly interconnect the top condenser manifold 36 with the bottom evaporator manifold 42.
  • Fig. 7 shows a part of a condenser 24 that may be used for the cooler 16 of Fig. 4 to 6.
  • the condenser 24 may comprise parallel tubes 29 providing the condenser conduits 30. Between the parallel tubes 29, wavy and/or folded fins 48 may be mounted to the tubes, such that air may flow through the tubes 29 and may be used for a heat transfer from the cooling fluid to the air.
  • the extension of sheets of the fins 48 may be substantially orthogonal to the direction of the tubes 29 and/or the extension of the row of tubes 29.
  • Fig. 8 to 10 show cross-sections of an embodiment of evaporators 22 that may be used with the coolers of Fig. 4 to 6.
  • the design of the evaporator plates 26 are shown for the inner thermosyphon cooler 16. Due to this, the evaporator plate 26 has rounded edges. In the case of an outer thermosyphon cooler 16, the evaporator plate may be rectangular.
  • the evaporator conduits are provided by channels 50 of multi-channel tubes 52.
  • the multi-channel tubes 52 may be extruded from aluminum and/or may have an elongated cross-section, which is divided into channels by inner walls 54.
  • condenser conduits 30 of Fig. 4 and 5 may be provided by such multi-channel tubes 52.
  • the evaporator plate 36 has grooves 56 that receive the multi-channel tubes 52 at least partially.
  • the multi-channel tubes 52 are completely received in the evaporator plate 36 and/or all multi-channel tubes 52 are in thermal contact with the evaporator plate 36. All channels 50 of the multi-channel tubes 52 are used as evaporator conduits 28.
  • the design of Fig. 8 may be used for the cooler 16 of Fig. 4 and Fig. 6.
  • the multi-channel tubes 52 are completely received in the evaporator plate 36 and the inner multi-channel tubes 52 are in thermal contact with the evaporator plate 36. All channels 50 of the inner multi-channel tubes 52 are used as evaporator conduits 28.
  • Two outer multi-channel tubes 52 are not in thermal contact with the evaporator plate 36.
  • the corresponding grooves 56 are wider than the grooves corresponding to the inner multi-channel tubes 52 and an air gap is present between the outer multi-channel tubes 52 and the evaporator plate 36. All channels 50 of the outer multi-channel tubes 52 are used as liquid return conduits 40.
  • Fig. 9 The design of Fig. 9 may be used for the cooler 16 of Fig. 4, Fig. 5 and Fig. 6.
  • the multi-channel tubes 52 are only partially received in the evaporator plate 26. Only some (here two) channels 50 are located inside the groove 56 thermally in contact with the evaporator plate 26 and act as evaporator conduits 28. The remaining (here three) channels 50, which protrude from the evaporator plate 26 act as condenser conduit 30 and as liquid return conduits 40.
  • Fig. 10 may be used for the cooler 16 of Fig. 6.
  • the channels 50 in contact with the evaporator plate 26 may be used as evaporator conduits 28.
  • channels in contact with fins 48 may be used as condenser conduits 30.
  • Fig. 1 1 shows a part of a condenser that may be used together with the cooler 16 of Fig. 6 and/or Fig. 10. Some channels 50 are in direct thermal contact with fins 48 and work as condenser circuits 30, while the remaining channels 40, which may be in direct contact with the evaporator plate 26 (and which are not in direct thermal contact with the fins 48), work as evaporator conduits 28.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cette invention concerne un dispositif électrique (10) ayant une inductance électrique, comprenant au moins un enroulement (12), un noyau magnétique (14) avec une patte (18b) entourée par l'enroulement (12) et un refroidisseur à thermosiphon (16) pour refroidir l'enroulement (12). Ledit refroidisseur (16) comprend un évaporateur (22) avec au moins un conduit d'évaporateur (28) pour l'évaporation d'un liquide de refroidissement et un condenseur (24) avec au moins un conduit de condenseur (30) pour condenser le liquide de refroidissement. Ledit évaporateur (22) est en contact thermique avec une surface latérale (27) de l'enroulement (12). De plus, le conduit d'évaporateur (28) et/ou le conduit de condenseur (30) sont fournis par un tube multi-canaux (52), ledit tube multi-canaux (52) étant séparé par des parois internes (54) en au moins deux canaux (50).
PCT/EP2015/078869 2015-01-23 2015-12-07 Refroidisseur à thermosiphon pour un dispositif électrique à inductance WO2016116204A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15152304 2015-01-23
EP15152304.0 2015-01-23

Publications (1)

Publication Number Publication Date
WO2016116204A1 true WO2016116204A1 (fr) 2016-07-28

Family

ID=52358710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/078869 WO2016116204A1 (fr) 2015-01-23 2015-12-07 Refroidisseur à thermosiphon pour un dispositif électrique à inductance

Country Status (1)

Country Link
WO (1) WO2016116204A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3517777A1 (fr) * 2018-01-30 2019-07-31 General Electric Company Système de refroidissement passif multisiphon
US10590916B2 (en) 2018-01-22 2020-03-17 General Electric Company Multisiphon passive cooling system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60163412A (ja) * 1984-02-03 1985-08-26 Matsushita Electric Ind Co Ltd トランス
EP2031332A1 (fr) * 2007-08-27 2009-03-04 ABB Research LTD Échangeur de chaleur
WO2010139597A1 (fr) * 2009-06-05 2010-12-09 Abb Technology Ag Bobine de transformateur et transformateur à refroidissement passif
WO2011038184A1 (fr) * 2009-09-24 2011-03-31 Parker Hannifin Corporation Refroidissement intégré de composants électriques bobinés
EP2682957A1 (fr) * 2012-07-04 2014-01-08 ABB Technology AG Dispositif électromagnétique comprenant un agencement de refroidissement comprenant un thermosiphon agencé spécifiquement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60163412A (ja) * 1984-02-03 1985-08-26 Matsushita Electric Ind Co Ltd トランス
EP2031332A1 (fr) * 2007-08-27 2009-03-04 ABB Research LTD Échangeur de chaleur
WO2010139597A1 (fr) * 2009-06-05 2010-12-09 Abb Technology Ag Bobine de transformateur et transformateur à refroidissement passif
WO2011038184A1 (fr) * 2009-09-24 2011-03-31 Parker Hannifin Corporation Refroidissement intégré de composants électriques bobinés
EP2682957A1 (fr) * 2012-07-04 2014-01-08 ABB Technology AG Dispositif électromagnétique comprenant un agencement de refroidissement comprenant un thermosiphon agencé spécifiquement

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10590916B2 (en) 2018-01-22 2020-03-17 General Electric Company Multisiphon passive cooling system
EP3517777A1 (fr) * 2018-01-30 2019-07-31 General Electric Company Système de refroidissement passif multisiphon

Similar Documents

Publication Publication Date Title
US9468133B2 (en) Modular cooling system
US9363930B2 (en) Passive two phase cooling solution for low, medium and high voltage drive systems
US9618244B2 (en) Power electronics cooling
EP2966660B1 (fr) Ensemble inducteur toroïdal refroidi par immersion
US10804023B2 (en) Integrated inductor windings and heat pipes
US9818525B2 (en) Cooling device of power transformer
EP2552182A1 (fr) Thermosiphon à double boucle pour refroidir des composants électriques et électroniques
EP2682957A1 (fr) Dispositif électromagnétique comprenant un agencement de refroidissement comprenant un thermosiphon agencé spécifiquement
JP2018186272A (ja) 高圧端子の冷却構造
WO2016116204A1 (fr) Refroidisseur à thermosiphon pour un dispositif électrique à inductance
EP2333798B1 (fr) Système d'échangeur de chaleur pour transformateurs non immergés
JP6719601B2 (ja) 回路遮断器
CN111504111B (zh) 蒸发器和制造方法
EP2801781B1 (fr) Système de refroidissement
JP2017112189A (ja) サーモサイフォン冷却装置
RU2621320C1 (ru) Интенсифицированная система охлаждения одиночного мощного светодиода
EP3513639B1 (fr) Agencement de refroidissement
CN215118528U (zh) 一种变压器
US20240057304A1 (en) Two-phase liquid-cooled electrical power apparatus
EP4071773A1 (fr) Installation de transformateur
EP4151943A1 (fr) Appareil de refroidissement pour un appareillage de commutation moyenne ou haute tension
JP6331849B2 (ja) 電力変換装置
CN102592866A (zh) 一种断路器蒸发冷却系统
JP2015176947A (ja) 静止誘導装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15804858

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15804858

Country of ref document: EP

Kind code of ref document: A1