WO2016114430A1 - Appareil de séparation de plaques fines solides - Google Patents

Appareil de séparation de plaques fines solides Download PDF

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Publication number
WO2016114430A1
WO2016114430A1 PCT/KR2015/000490 KR2015000490W WO2016114430A1 WO 2016114430 A1 WO2016114430 A1 WO 2016114430A1 KR 2015000490 W KR2015000490 W KR 2015000490W WO 2016114430 A1 WO2016114430 A1 WO 2016114430A1
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WO
WIPO (PCT)
Prior art keywords
chuck
substrate
lower chuck
upper chuck
solid sheet
Prior art date
Application number
PCT/KR2015/000490
Other languages
English (en)
Korean (ko)
Inventor
박근노
이문경
Original Assignee
박근노
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박근노 filed Critical 박근노
Publication of WO2016114430A1 publication Critical patent/WO2016114430A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material

Definitions

  • the present invention relates to a solid sheet separating apparatus, and more particularly, to a solid sheet separating apparatus capable of separating the outermost solid sheet without damaging the sheet among multilayer adhesive substrates having a plurality of sheets of solid sheet attached thereto. .
  • a manufacturing process is performed while dealing with a very thin glass substrate. Therefore, in order to prevent breakage of the substrate in the manufacturing process of such a display device, a manufacturing process may be performed in a state in which an auxiliary substrate is attached to the outside.
  • various solid thin plates may be attached in a multi-layered fabrication process.
  • the technical problem to be solved by the present invention is to provide a solid sheet separation apparatus capable of separating the outermost solid sheet of the multilayer adhesive substrate to which a plurality of sheets of solid sheet are attached without damaging the sheet.
  • a solid sheet separator comprising: a lower chuck made of a porous material and adsorbing a lower surface of a lowermost substrate of a multilayer adhesive substrate with a vacuum suction force; An upper chuck made of a porous material and adsorbing the upper surface of the uppermost substrate of the multilayer adhesive substrate with a vacuum suction force; A lower deformation ring formed in a closed curve shape at an upper edge of the lower chuck and forming an airtight space between a lower surface of a lowermost substrate of the multilayer adhesive substrate and an upper surface of the lower chuck; An upper deformation ring formed in a closed curve shape at an edge of a lower surface of the upper chuck and forming an airtight space between an upper surface of an uppermost substrate of the multilayer adhesive substrate and a lower surface of the upper chuck; Lower chuck vertical driving means for driving the lower chuck in a vertical direction; And an upper chuck vertical driving means for driving the upper chuck in the
  • a vacuum groove is formed on the surface of any one of the lower chuck and the upper chuck.
  • the lower deformation ring is entered along the deformation ring installation groove formed on the edge of the lower chuck, it is preferable that the top protrudes above the surface of the lower chuck.
  • the upper deformation ring is entered along the deformation ring installation groove formed on the edge of the upper chuck, it is preferable that the lower end protrudes below the upper chuck surface.
  • the lower chuck vertical drive means or the upper chuck vertical drive means is preferably composed of a wedge stage (wedge stage).
  • the interval adjusting means for adjusting the interval between the upper chuck and the lower chuck is further provided.
  • the gap adjusting means is preferably a gap holding jig inserted between the upper chuck and the lower chuck.
  • the gap adjusting means may be composed of a wedge stage inserted between the upper chuck and the lower chuck.
  • the upper chuck surface is preferably a shape in which the central portion gently projects below the edge portion.
  • the solid sheet separator of the present invention has an effect that can be easily separated even without damaging the substrate even for a thin sheet substrate.
  • by precisely controlling the distance between the upper chuck and the lower chuck has the advantage that the accurate substrate separation operation is possible.
  • FIG. 1 is a side cross-sectional view showing the structure of a solid sheet separating apparatus according to an embodiment of the present invention.
  • FIG. 2 is a plan view showing a structure of a lower chuck according to an embodiment of the present invention.
  • FIG 3 is a view illustrating an operation process of a push pin according to an embodiment of the present invention.
  • FIG. 4 is a view showing an operation of the gap-forming knife according to an embodiment of the present invention.
  • FIG. 5 is a view showing the structure of the lower chuck vertical drive means according to an embodiment of the present invention.
  • FIG. 6 is a sectional view showing a structure of an upper chuck according to an embodiment of the present invention.
  • FIG. 7 is a perspective view showing the structure of a lower chuck according to another embodiment of the present invention.
  • FIG. 8 is a partial cross-sectional view showing a structure of a lower deformation ring according to an embodiment of the present invention.
  • FIG. 9 is a partial cross-sectional view showing a deformation state of the lower deformation ring according to an embodiment of the present invention.
  • the solid sheet separator 1 has a lower chuck 10, an upper chuck 20, a lower strain ring 30, an upper strain ring 40, and a lower chuck upper and lower sides. It comprises a drive means 50, the upper chuck vertical drive means (60).
  • the lower chuck 10 is a component that adsorbs the lower surface of the substrate S1 disposed on the lowermost side of the multilayer adhesive substrate S, which is the object of separation, by vacuum suction force.
  • the multilayer adhesive substrate refers to substrates in which a plurality of thin plate-like substrates are stacked and attached to each other by electrostatic force or separate adhesive force. Therefore, the lower chuck 10 is disposed below the entire solid sheet separator 1, and serves to fix the multilayer chuck substrate S using a vacuum suction force so that the multilayer adhesive substrate S does not move during the separation operation.
  • the lower chuck 10 is provided with a vacuum adsorption portion for applying a vacuum adsorption force.
  • the vacuum suction unit may be provided in various structures. For example, as shown in FIGS. 1 and 2, a vacuum groove 12 for vacuum suction is formed on a surface of the lower chuck 10, and the vacuum groove ( 12 is connected to a vacuum pump (not shown) provided separately. The reason why the vacuum groove 12 is formed evenly over the entire surface of the lower chuck 10 is to give a uniform suction force over the entire surface of the lower chuck 10.
  • the lower chuck 10 is made of a porous material in order to give uniform vacuum suction force over the entire surface of the lower chuck 10.
  • the inside of the lower chuck 10 may be further provided with a heating unit 14 for heating the multilayer adhesive substrate (S) adsorbed on the surface of the lower chuck 10. This is because when the multilayer adhesive substrate S is heated by using the heating unit 14, the adhesive force between the multilayer adhesive substrates S is weakened and separation becomes easy.
  • the upper chuck 20 is a component that adsorbs the upper surface of the substrate S2 disposed on the uppermost side of the multilayer adhesive substrate S with a vacuum suction force.
  • the upper chuck 20 is installed parallel to the position completely opposite the lower chuck 10, the detailed components installed therein are substantially the same as the lower chuck 10. That is, similarly to the lower chuck 10, the upper chuck 20 is provided with a vacuum groove 22, a heating unit 24, and the like.
  • the lower deformation ring 30 is formed in a closed curve on the upper edge of the lower chuck 10, and the lower surface of the lowermost substrate S1 of the multilayer adhesive substrate S is formed. It is a component that forms a closed space between the upper surface of the lower chuck (10).
  • the lower deformable ring 30 is made of an elastic material, and as shown in FIG. 1, is installed along the deformed ring installation groove 16 formed at the edge of the lower chuck 10.
  • the lower deformation ring 30 is preferably installed so that the upper end protrudes above the surface of the lower chuck (10).
  • a closed space may be formed between the lower substrate S1 of the multilayer adhesive substrate S and the lower chuck 10.
  • the deformable ring installation groove 16 preferably has a structure in which a space in which the lower deformable ring 30 can be deformed and inserted is formed.
  • the lower deformation ring 30 may be made of various materials having elasticity, for example, silicon o-rings.
  • the upper deformation ring 40 is formed in a closed curve shape at the edge of the lower surface of the upper chuck 20, and between the upper surface of the uppermost substrate S2 and the lower surface of the upper chuck 20 of the multilayer adhesive substrate S. It is a component that forms an enclosed space.
  • the upper deformation ring 40 is also placed along the deformation ring installation groove 26 formed at the edge of the upper chuck 20, and the lower surface of the upper chuck 20 is formed. It is preferable to protrude further downward.
  • the lower chuck vertical driving means 50 is a component for driving the lower chuck 10 in the vertical direction.
  • the lower chuck vertical driving means 50 may have various structures capable of precisely driving the lower chuck 10 in the vertical direction.
  • a wedge stage is provided. It can be configured as.
  • the wedge stage may be provided with an upper block 52 and a lower block 54, respectively, which face each other with the inclined surfaces facing each other, and the upper block 52 may move upward and downward. It is coupled to the vertical movement guide (not shown in the figure) to guide so that, the lower block 54 has a structure coupled to the horizontal movement guide (not shown in the figure) to guide the movement in the horizontal direction.
  • the lower block 54 is coupled to the driving means 56 for horizontal driving and is driven in the horizontal direction.
  • the upper block 52 is driven in the vertical direction by the horizontal driving of the lower block 54.
  • Such a wedge stage has an advantage that can be stably supported even if a lot of loads are imposed on the top to enable very fine spacing adjustment in the vertical direction.
  • the lower chuck vertical drive means 50 may be modified into various structures such as a cylinder, a ball screw, a linear motor, a rack & pinion gear.
  • the upper chuck vertical driving means 60 is a component for driving the upper chuck 20 in the vertical direction.
  • the upper chuck vertical driving means 60 makes the upper chuck 20 the multilayer adhesive substrate S in the process of contacting the upper chuck 20 surface and the upper surface of the multilayer adhesive substrate S during the separating operation. To drive the upper chuck 20 in the vertical direction to approach.
  • the interval adjusting means 70 for adjusting the interval of the further.
  • the gap adjusting means 70 is charged between the upper chuck 20 and the lower chuck 10 in a state where the multilayer adhesive substrate S is loaded, thereby allowing the upper chuck 20 to be loaded. It is to maintain the gap between and the lower chuck 10 accurately.
  • the interval between the upper chuck 20 and the lower chuck 10 is determined in advance by the thickness of the separation target substrate.
  • the gap adjusting means 70 may be configured as a gap holding jig inserted between the upper chuck 20 and the lower chuck 10.
  • the interval maintaining jig is provided in various thicknesses at regular intervals and inserts the interval maintaining jig for each necessary interval between the upper chuck 20 and the lower chuck 10 at each operation to perform the separation operation.
  • the gap adjusting means 70 is inserted between the upper chuck 20 and the lower chuck 10 and may be provided as an interval active variable changing the interval by its own power.
  • the interval active variable portion may have various structures that can adjust the interval in the vertical direction by its own power, for example, may be configured as a wedge stage.
  • the gap adjusting means 70 is configured as a wedge stage, the gap between the upper chuck and the lower chuck is adjusted by driving the wedge stage up and down at an interval requested by a preset program.
  • the upper and lower deformation rings 30 and 40 are inserted and installed in the installation groove 16, as shown in FIGS. 1 and 2, and are deformed when the absorbed member S1 is adsorbed.
  • S1 is a component that imparts a vacuum suction force to the space formed by the upper and lower chucks 10 and 20. That is, the deforming ring 30 is deformed without contacting only the edges of the absorbed member S1 in the contact process with the absorbed member S1 and not contacting the rest of the absorbed member S1 and the lower chuck 10.
  • the lower deformation ring 30 includes an insertion base 31, a buffer part 32, and a deformation part 33, as shown in FIGS. 7 and 8.
  • the insertion base 31 forms a closed curve as a whole and is a component inserted into and fixed to the installation groove 16. Therefore, the insertion base 131 may have a rectangular shape, as shown in Figure 7, may have a variety of closed curves, such as circular or elliptical, which is the shape of the lower chuck 10 is installed the deformation ring It may vary.
  • the shock absorbing part 32 is a component formed by standing up perpendicularly to the upper surface of the insertion base part 31, and the deformation part in the process of absorbing the suction member S1. Deformed excessively 33 or serves to prevent the member to be absorbed (S1) in contact with the surface of the lower chuck (10). Therefore, the shock absorbing portion 32 is installed to protrude higher than the surface of the lower chuck 10 in a state in which the deforming ring 30 is installed on the lower chuck 10, as shown in FIG. 8.
  • the buffer part 32 is formed to have a predetermined height in a direction perpendicular to the insertion base part 31, and thus, the buffer part (1) is in contact with the suction member S1.
  • the pressure-sensitive member S1 is prevented from excessively approaching the lower chuck 10 without being compressed even when pressure is applied in the longitudinal direction of the end 32.
  • the deformable portion 33 is inclined at a predetermined installation angle ⁇ with the buffer portion 32 on the upper surface of the buffer portion 32, and is formed of an elastically deformable material. It is a component. That is, the deformable portion 33 is a component that generates a vacuum adsorption force while being deformed by an external force in the process of contacting the member S1 to be absorbed. Therefore, the deformable portion 33 is preferably made of elastically deformable silicone or urethane.
  • the deformable portion 33 is elastically deformable, the closed space is folded out of the contact process with the absorbed member S1 and surrounded by the absorbed member S1, the lower chuck 10, and the lower deforming ring 30.
  • S While the gas inside is discharged to the outside, the pressure inside the closed space is made lower than the pressure in the outside space to generate a vacuum suction force.
  • the deformable portion 33 has elasticity, when the external force is removed, the deformable portion 33 is restored to its original shape so as to be able to absorb the absorbed member again.
  • the installation angle ⁇ of the deformation part 33 may be sufficient as the deformation part 33 is inclined in the outward direction, and may have a wide variety of angles.
  • a residue preventing film 34 is further formed on the surface of the deformable portion 33 according to the present embodiment.
  • the deformation ring 30 is in contact with only the edge of the member to be absorbed (S1) in the adsorption process, but not in contact with the other part, that is, the center portion where the actual process is performed, but in order to leave no residue on the edge where the contact occurs.
  • the residue prevention film 34 is further formed.
  • the residue prevention film formed by carrying out the perlin coating of diX dimer of following formula (1) is preferable.
  • the anti-residue film 34 thus formed can be coated by a CVD method at a very low temperature of 30 ° C. or less, and thus does not generate thermal stress on the deformation ring, and does not generate pinholes and pores because it is coated using a gaseous coating material.
  • a CVD method at a very low temperature of 30 ° C. or less, and thus does not generate thermal stress on the deformation ring, and does not generate pinholes and pores because it is coated using a gaseous coating material.
  • the deformation ring has been described as having one substrate absorbing chuck.
  • the deformation ring may have a structure in which a plurality of deformation rings are provided in one substrate absorption chuck.
  • the upper deformation ring 40 is also substantially the same as the lower deformation ring 30 and thus will not be repeated.
  • the multi-layer adhesive substrate S to be separated may be pre-worked before being loaded into the thin film separator 1.
  • the operation may be a preliminary peeling of the corner portion.
  • the lower substrate S1 of the multilayer adhesive substrate S has chamfered edges
  • the upper substrate S2 has a structure in which the push pin is repeatedly driven from the lower side to the upper side. (push pin, 80) to lift the edge of the upper substrate (S2) to separate in advance.
  • a gap forming knife 90 is inserted into a gap separated by the push pin 80, and the gap forming knife 90 is horizontally moved to move the upper substrate ( One edge of S2) is to be separated.
  • the separating work made in the thin plate separating device 1 is made easier.
  • the step of loading the multilayer adhesive substrate S is performed.
  • the multilayer adhesive substrate S enters a space between the upper chuck 20 and the lower chuck 10, and then is adsorbed to either one of the upper chuck 20 or the lower chuck 10. Loaded. Then, the upper and lower chucks 20 and 10 are moved close to each other to contact the multilayer adhesive substrate S.
  • a vacuum suction force is applied to the upper chuck 20 and the lower chuck 10. Then, a vacuum is formed in the space between the lower chuck 10, the lower substrate S1, and the lower strain ring 30, and between the upper chuck 20, the upper substrate S2, and the upper strain ring 40. Vacuum is also formed in the space. When the vacuum is formed in this way, the substrate is separated by the vacuum suction force.
  • the process of unloading the separated substrates is performed.
  • the substrate may be flipped over and reloaded for further separation, and further separation may be performed.
  • the solid sheet separator of the present invention has an effect that can be easily separated even without damaging the substrate even for a thin sheet substrate.
  • by precisely controlling the distance between the upper chuck and the lower chuck has the advantage that the accurate substrate separation operation is possible.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un appareil permettant de séparer des plaques fines solides, capable de séparer les plaques fines solides le plus à l'extérieur de substrats collés à multiples couches dans lesquels les plaques d'une pluralité de plaques fines solides ont été collées, sans endommager les plaques fines. L'appareil de séparation de plaques fines solides, selon la présente invention, comprend : un préhenseur inférieur fabriqué en matériau poreux, permettant d'aspirer, grâce à une force d'aspiration par le vide, la surface inférieure du substrat le plus bas parmi les substrats collés à multiples couches ; un préhenseur supérieur fabriqué en matériau poreux, permettant d'aspirer, grâce à une force d'aspiration par le vide, la surface supérieure du substrat supérieur parmi les substrats collés à multiples couches ; un anneau adaptatif inférieur formant une courbe fermée au bord de la surface supérieure du préhenseur inférieur, permettant de former un espace étanche à l'air entre la surface supérieure du préhenseur inférieur et la surface inférieure du substrat le plus bas parmi les substrats collés à multiples couches ; un anneau supérieur adaptatif formant une courbe fermée au bord de la surface inférieure du préhenseur supérieur, permettant de former un espace étanche à l'air entre la surface inférieure du préhenseur supérieur et la surface supérieure du substrat supérieur parmi les substrats collés à multiples couches ; un moyen d'entraînement vertical de préhenseur inférieur permettant d'entraîner verticalement le préhenseur inférieur ; et un moyen d'entraînement vertical de préhenseur supérieur permettant d'entraîner verticalement le préhenseur supérieur.
PCT/KR2015/000490 2015-01-13 2015-01-16 Appareil de séparation de plaques fines solides WO2016114430A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0005642 2015-01-13
KR1020150005642A KR102274315B1 (ko) 2015-01-13 2015-01-13 고형 박판 분리 장치

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WO2016114430A1 true WO2016114430A1 (fr) 2016-07-21

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318195A (ja) * 2002-04-24 2003-11-07 Ricoh Co Ltd 薄膜デバイス装置とその製造方法
US20140251533A1 (en) * 2013-03-11 2014-09-11 Samsung Display Co., Ltd. Substrate peeling device, method for peeling substrate, and method for fabricating flexible display device
KR20140120785A (ko) * 2013-04-04 2014-10-14 (주) 나인테크 고형 박판 분리 장치
KR20140133350A (ko) * 2013-05-10 2014-11-19 (주) 나인테크 고형 박판 분리 장치
KR20140141841A (ko) * 2013-05-31 2014-12-11 삼성디스플레이 주식회사 기판 분리 장치 및 기판 분리 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200157797Y1 (ko) * 1997-06-30 1999-10-01 윤종용 진공 척
KR101019148B1 (ko) * 2010-10-20 2011-03-04 (주) 티오피에스 디스플레이용 박판유리의 센터링 지그

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318195A (ja) * 2002-04-24 2003-11-07 Ricoh Co Ltd 薄膜デバイス装置とその製造方法
US20140251533A1 (en) * 2013-03-11 2014-09-11 Samsung Display Co., Ltd. Substrate peeling device, method for peeling substrate, and method for fabricating flexible display device
KR20140120785A (ko) * 2013-04-04 2014-10-14 (주) 나인테크 고형 박판 분리 장치
KR20140133350A (ko) * 2013-05-10 2014-11-19 (주) 나인테크 고형 박판 분리 장치
KR20140141841A (ko) * 2013-05-31 2014-12-11 삼성디스플레이 주식회사 기판 분리 장치 및 기판 분리 방법

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KR20160087123A (ko) 2016-07-21
KR102274315B1 (ko) 2021-07-07

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