WO2016114272A1 - Procédé de fabrication de capteur sensible à la pression - Google Patents

Procédé de fabrication de capteur sensible à la pression Download PDF

Info

Publication number
WO2016114272A1
WO2016114272A1 PCT/JP2016/050747 JP2016050747W WO2016114272A1 WO 2016114272 A1 WO2016114272 A1 WO 2016114272A1 JP 2016050747 W JP2016050747 W JP 2016050747W WO 2016114272 A1 WO2016114272 A1 WO 2016114272A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet member
electrode
pressure
sensitive sensor
conductive layer
Prior art date
Application number
PCT/JP2016/050747
Other languages
English (en)
Japanese (ja)
Inventor
和也 永田
耕治 岩田
Original Assignee
ニッタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ニッタ株式会社 filed Critical ニッタ株式会社
Priority claimed from JP2016003932A external-priority patent/JP2016130736A/ja
Publication of WO2016114272A1 publication Critical patent/WO2016114272A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes

Definitions

  • the present invention relates to a method for manufacturing a pressure-sensitive sensor that detects pressure.
  • Patent Documents 1 and 2 a first sheet member in which a plurality of rows of first electrodes and a conductive layer (ink layer) covering these electrodes is formed, a plurality of rows of second electrodes, and a conductive layer covering these electrodes (
  • a pressure-sensitive sensor including a second sheet member on which an ink layer is formed.
  • the first sheet member and the second sheet member are arranged so as to overlap each other so that the first electrode and the second electrode intersect and face each other. Therefore, when pressure is applied to the pressure sensitive sensor, the electrical resistance value of the conductive layer changes due to contact between the conductive layers, and the pressure applied to the pressure sensitive sensor can be detected from this electrical resistance value.
  • each electrode and each conductive layer are formed by a printing method such as an inkjet method, a screen offset printing method, a flexographic printing method, a gravure printing method, an offset printing method, or a screen printing.
  • a printing method such as an inkjet method, a screen offset printing method, a flexographic printing method, a gravure printing method, an offset printing method, or a screen printing.
  • the 1st electrode and the 2nd electrode are formed by apply
  • the conductive layer the conductive layer is formed by applying conductive ink to the electrode, heating and drying.
  • silver particles having a small particle diameter are included in the ink. Thereby, the electrode surface and the conductive layer surface become smooth.
  • the conventional manufacturing method has a limit in improving the detection accuracy of the pressure sensor. Further, since it is difficult to increase the density of the electrodes while maintaining the detection accuracy, there is a limit to increasing the pressure detection resolution.
  • the present invention has been made in consideration of such points, and an object thereof is to provide a method of manufacturing a pressure-sensitive sensor capable of improving detection accuracy.
  • the present invention adopts the following configuration in order to solve the above-described problems.
  • the pressure sensor manufacturing method includes a first sheet member having a plurality of first electrodes and a second sheet member having a plurality of second electrodes, and the first electrode.
  • a conductive layer is provided on at least one of the top and the second electrode, and the first sheet member and the second sheet member are arranged such that the first electrode and the second electrode intersect and face each other.
  • a method for manufacturing a pressure-sensitive sensor arranged in an overlapping manner comprising: a first sheet member manufacturing step for manufacturing the first sheet member; and a second sheet member manufacturing step for manufacturing the second sheet member.
  • At least one of the first sheet member manufacturing process and the second sheet member manufacturing process is configured by a photolithography process, and the photolithography process is performed on the sheet base material on which the metal thin film is formed.
  • a photosensitive resist laminating step of laminating a photosensitive resist so as to cover a metal thin film, a circuit pattern arranging step of arranging a circuit pattern corresponding to a predetermined circuit pattern on the photosensitive resist, and the circuit pattern An exposure step of exposing a photosensitive resist as a mask, and a first photosensitive resist removal step of removing the circuit pattern and an exposed or unexposed portion of the photosensitive resist from the metal thin film after the exposure step; The exposed region of the metal thin film is removed using the photosensitive resist as a mask to form an electrode forming step for forming the electrodes, and a second photosensitive resist removing step for removing the remaining photosensitive resist. And.
  • At least one electrode of the first sheet member and the second sheet member is formed by a so-called photolithography process.
  • the electrode surface can be made smoother than when electrodes are formed by conventional methods (ink-jet method, screen offset printing method, flexographic printing method, gravure printing method, offset printing method, screen printing method, etc.). it can. Therefore, in the above method, the electrode formed on at least one of the first electrode and the second electrode is smoothed, and thereby the conductive layer formed on at least one of the first electrode and the second electrode is also smoothed. can do. Therefore, according to the above method, the contact state of the pressure-sensitive portion (conductive layer) can be improved, and the detection accuracy of the pressure-sensitive sensor can be improved.
  • a production process based on a conventional printing method such as screen printing is adopted in the one process. May be.
  • both the first sheet member manufacturing step and the second sheet member manufacturing step may be configured by the photolithography step. According to the method, since both the electrodes formed on the first sheet member and the second sheet member can be smoothed, the contact state of the pressure-sensitive portion (conductive layer) can be further improved, The detection accuracy of the pressure sensor can be improved.
  • the first sheet member manufacturing step includes the photolithography step, and the first sheet member manufacturing step is performed after the second photosensitive resist removing step.
  • the method may further include a step of plating the surfaces of the plurality of first electrodes. By plating the surface of the first electrode, the unevenness of the surface of the first electrode can be filled with a plating film, and the surface of the first electrode including the plating film can be further smoothed. Thereby, when forming a conductive layer on the 1st electrode, since the surface of the conductive layer can also be made smooth, the detection accuracy of a pressure sensor can be raised.
  • the second sheet member manufacturing step includes the photolithography step, and the second sheet member manufacturing step is performed after the second photosensitive resist removing step.
  • the method may further include a step of plating the surfaces of the plurality of second electrodes. By plating the surface of the second electrode, the unevenness of the surface of the second electrode can be filled with a plating film, and the surface of the second electrode including the plating film can be further smoothed. Thereby, when forming a conductive layer on the 2nd electrode, since the surface of the conductive layer can also be made smooth, the detection accuracy of a pressure sensor can be raised.
  • the first sheet member manufacturing step includes the photolithography step, and the first sheet member manufacturing step is performed after the second photosensitive resist removing step.
  • a step of forming a first conductive layer on each of the first electrodes as the conductive layer can be further provided.
  • the second sheet member manufacturing step includes the photolithography step, and the second sheet member manufacturing step includes the second photosensitive resist removal. After the step, a step of forming a second conductive layer on each of the second electrodes as the conductive layer can be further provided.
  • a pressure-sensitive sensor is a pressure-sensitive sensor including a first sheet member having a plurality of first electrodes and a second sheet member having a plurality of second electrodes, A conductive layer is provided on at least one of the first electrode and the second electrode, and the first sheet member and the second sheet are arranged such that the first electrode and the second electrode intersect and face each other. And a member having a surface roughness Ra of at least one surface of the plurality of first electrodes and the plurality of second electrodes is 0.6 ⁇ m or less, and the surface roughness Ra of the conductive layer is 0. .1 ⁇ m or less. According to the pressure-sensitive sensor according to this configuration, the applied pressure can be detected with higher accuracy than the conventional pressure-sensitive sensor.
  • the surface roughness Ra of the surface of at least one of the plurality of first electrodes and the plurality of second electrodes can be 0.2 ⁇ m or less, and The surface roughness Ra can be 0.06 ⁇ m or less. According to this configuration, a pressure sensitive sensor with high pressure detection accuracy can be provided.
  • At least one of the plurality of first electrodes and the plurality of second electrodes may have an electrode pitch of 40 mm or less. Furthermore, in the pressure-sensitive sensor according to the one aspect, an electrode pitch of at least one of the plurality of first electrodes and the plurality of second electrodes can be less than 0.65 mm. According to this configuration, a pressure sensitive sensor with high pressure detection resolution can be provided.
  • the detection accuracy of the pressure sensitive sensor can be increased.
  • FIG. 1A is a perspective view illustrating a pressure-sensitive sensor according to an embodiment.
  • 1B is a cross-sectional view taken along line IB-IB in FIG. 1A.
  • FIG. 2A illustrates the lower surface of the first sheet member according to the embodiment.
  • FIG. 2B illustrates the upper surface of the second sheet member according to the embodiment.
  • FIG. 3 is a flowchart illustrating the manufacturing process of the sheet member according to the embodiment.
  • FIG. 4A is a perspective view illustrating the state of the first sheet member in the manufacturing process.
  • FIG. 4B is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process.
  • FIG. 4C is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (photosensitive resist lamination step).
  • FIG. 4D is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (circuit pattern arranging step).
  • FIG. 5A is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (exposure process).
  • FIG. 5B is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (circuit pattern removal step).
  • FIG. 5C is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (first photosensitive resist removing step).
  • FIG. 5D is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (electrode formation process).
  • FIG. 6A is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (second photosensitive resist removing step).
  • FIG. 6B is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (plating process).
  • FIG. 6C is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (conductive layer forming step).
  • FIG. 6D is a cross-sectional view illustrating the state of the first sheet member in the manufacturing process (adhesion layer forming step).
  • FIG. 7 is a cross-sectional view illustrating the configuration of a conductive layer according to another embodiment.
  • FIG. 8 schematically illustrates the configuration of a pressurizing device used in an output variation measurement experiment between pressure sensitive points.
  • FIG. 8 schematically illustrates the configuration of a pressurizing device used in an output variation measurement experiment between pressure sensitive points.
  • FIG. 10A is a diagram illustrating a method for measuring the resolution of pressure detection.
  • FIG. 10B is a diagram illustrating a method for measuring the resolution of pressure detection.
  • FIG. 11A shows an experimental result of pressure detection according to a comparative example.
  • FIG. 11B shows an experimental result of pressure detection according to the example.
  • FIG. 11C shows an experimental result of pressure detection according to the example.
  • FIG. 11D shows an experimental result of pressure detection according to the example.
  • FIG. 12 schematically illustrates the configuration of a pressurizing device used in an output reproducibility measurement experiment.
  • FIG. 13 shows the experimental results of output reproducibility.
  • FIG. 14 shows the experimental results of creep property.
  • this embodiment will be described with reference to the drawings.
  • this embodiment described below is only an illustration of the present invention in all respects.
  • Various improvements and modifications may be made without departing from the scope of the present invention. That is, in implementing the present invention, a specific configuration according to the embodiment may be adopted as appropriate.
  • FIG. 1A is a perspective view illustrating a pressure-sensitive sensor 1 according to this embodiment.
  • 1B is a cross-sectional view taken along line IB-IB in FIG. 1A.
  • each direction is illustrated using the X axis, the Y axis, and the Z axis.
  • the X-axis direction and the Y-axis direction are orthogonal to each other in the plane of each sheet member (10, 20) described later, and the electrodes (22, 12) formed on each sheet member (10, 20), respectively.
  • the Z-axis direction is orthogonal to the X-axis direction and the Y-axis direction, and corresponds to a direction in which both sheet members (10, 20) are overlapped. The same applies to the subsequent drawings.
  • the pressure-sensitive sensor (tactile sensor) 1 As shown in FIG. 1A and FIG. 1B, the pressure-sensitive sensor (tactile sensor) 1 according to the present embodiment is arranged so as to face each other in the vertical direction (Z-axis direction in the drawing) and overlap each other.
  • a sheet member 10 and a second sheet member 20 are provided.
  • the pressure sensor 1 is connected to a connector 30 having an electric circuit (not shown) having a pressure detection function, whereby the pressure distribution applied to the pressure sensor 1 can be detected.
  • the first sheet member 10 is disposed above the second sheet member 20.
  • FIG. 2A illustrates the lower surface of the first sheet member 10 according to this embodiment.
  • FIG. 2B illustrates the upper surface of the second sheet member 20 according to this embodiment.
  • the first sheet member 10 includes a film-like sheet base material 11 and a plurality of elongated shapes formed on one side (the lower face in the drawing) of the sheet base material 11.
  • the electrode 12 includes a plurality of wirings 13 connected to end portions of the plurality of electrodes 12, and a plurality of terminals 14 respectively connected to end portions of the wirings 13.
  • the electrode 12 corresponds to the “first electrode” of the present invention.
  • the plurality of electrodes (row electrodes) 12 extend in the Y-axis direction and are arranged at a predetermined pitch in the X-axis direction. Further, as illustrated in FIG. 1B, a plating film 15 is formed on the surface (bottom surface) of each electrode 12. A conductive layer 16 is formed on each electrode 12 including the plating film 15 so as to cover each electrode 12 and the plating film 15. Each wiring 13 electrically connects each electrode 12 and each terminal 14 as described above. Each terminal 14 is connected to a connector 30 shown in FIG. 1A.
  • the conductive layer 16 is formed so as to cover the entire region of the first sheet member 10 where the electrodes 12 are formed. However, each electrode 12 and the plating film 15 may not be completely covered with the conductive layer 16, and a part thereof is exposed from the conductive layer 16 to the extent that the pressure detection of the pressure sensor 1 is not affected. May be.
  • the conductive layer 16 corresponds to the “first conductive layer” of the present invention.
  • the second sheet member 20 includes a film-like sheet base material 21 and a plurality of long sheets formed on one side (upper surface in the figure) of the sheet base material 21.
  • the electrode 22 corresponds to the “second electrode” of the present invention.
  • the plurality of electrodes (column electrodes) 22 extend in the X-axis direction and are arranged at a predetermined pitch in the Y-axis direction.
  • the second sheet member 20 is formed in substantially the same manner as the first sheet member 10. That is, as illustrated in FIG. 1B, a plating film 26 is formed on the surface (upper surface) of each electrode 22. A conductive layer 27 is formed on each electrode 22 including the plating film 26 so as to cover each electrode 22 and the plating film 26.
  • Each wiring 23 electrically connects each electrode 22 and each terminal 25 as described above. Each terminal 25 is connected to a connector 30 shown in FIG. 1A.
  • the conductive layer 27 is formed so as to cover the entire region of the second sheet member 20 where the electrodes 22 are formed. However, each electrode 22 and the plating film 26 may not be completely covered with the conductive layer 27, and a part thereof is exposed from the conductive layer 27 to the extent that the pressure detection of the pressure-sensitive sensor 1 is not affected. May be.
  • the conductive layer 27 corresponds to the “second conductive layer” of the present invention.
  • the first sheet member 10 and the second sheet member 20 are in the vertical direction (Z-axis direction in the figure) so that the electrode 12 and the electrode 22 intersect and face each other. Are arranged opposite to each other. Specifically, as illustrated in FIG. 1B, the first sheet member 10 and the second sheet member 20 are opposed to each other in the vertical direction by the adhesive layers (18, 28) formed on the peripheral edge. It is pasted together.
  • the electrode pitch p of each electrode (12, 22) can be appropriately set according to the embodiment, and can be set to 40 mm or less, for example.
  • the lower limit value of the electrode pitch p may not be particularly limited, but the electrode pitch p of each electrode (12, 22) may be set to 10 ⁇ m or more.
  • the electrode pitch p of each electrode (12, 22) can be made less than 0.65 mm (650 ⁇ m) while ensuring detection accuracy by adopting a photolithography process described later. .
  • the electrode pitch p can be set to 0.1 mm (100 ⁇ m) or less (see Examples described later). Thereby, high resolution of pressure detection can be achieved.
  • the “electrode pitch p” is a distance between the width centers of two adjacent electrodes as illustrated in FIG. 1B.
  • the dimensions of the electrodes (12, 22) may be appropriately set according to the embodiment.
  • the width w of each electrode (12, 22) can be set to 35 mm or less.
  • the lower limit of the width w may not be particularly limited, but the width w of each electrode (12, 22) may be set to 5 ⁇ m or more.
  • the height h of each electrode (12, 22) is , 20 ⁇ m or less.
  • the width w of each electrode (12, 22) is preferably 100 ⁇ m or less, and more preferably 50 ⁇ m or less, from the viewpoint of ensuring the pressure detection resolution.
  • the height h of each electrode (12, 22) is preferably 10 ⁇ m or less.
  • each component can be appropriately selected according to the embodiment.
  • a resin sheet such as polyimide or polyethylene terephthalate (PET) can be used for each sheet base material (11, 21).
  • a metal foil such as a copper foil or an aluminum foil can be used.
  • an alloy of nickel and gold, a flux / lead-free leveler, or the like can be used for each conductive layer (16, 27).
  • a resin material containing conductive particles, a conductive polymer, or the like can be used.
  • the conductive particles include not only carbon particles and metal particles such as gold, silver, and copper, but also any particles that are energized.
  • the conductive polymer include polyaniline, polythiophene, and polypyrrole.
  • each conductive layer (16, 27) When pressure is applied to the pressure-sensitive sensor 1 configured as described above, the conductive layer 16 and the conductive layer 27 facing each other come into contact with each other and are pressed, whereby the electric resistance of each conductive layer (16, 27) is reduced. Change.
  • the electric resistance of each conductive layer (16, 27) is supplied from a crossing point between the electrode (row electrode) 12 and the electrode (column electrode) 22 to a power source (not shown) in the connector 30 through each wiring (13, 23). Communicated. Thereby, the electric circuit in the connector 30 can measure the electric resistance value and detect the pressure applied to the pressure sensor 1 from the measured electric resistance value.
  • FIG. 3 is a flowchart showing an example of a production process of each sheet member (10, 20) according to the present embodiment.
  • 4A to 4D, FIG. 5A to FIG. 5D, and FIG. 6A to FIG. 6D show the production of the first sheet member 10 of the pressure-sensitive sensor 1 as an example of the production process of each sheet member (10, 20). The process is shown in order.
  • the manufacturing process of the pressure-sensitive sensor 1 demonstrated below is only an example, and each step may be changed as much as possible. Further, in the manufacturing process described below, steps can be omitted, replaced, and added as appropriate according to the embodiment.
  • the 1st sheet member 10 and the 2nd sheet member 20 are each produced.
  • the manufacturing process of each sheet member (10, 20) shown in FIG. 3 corresponds to the “first sheet member manufacturing process” and the “second sheet member manufacturing process” of the present invention.
  • the process of manufacturing the first sheet member 10 out of the first sheet member 10 and the second sheet member 20 will be described in detail.
  • the first sheet member and the second sheet member are produced, for example, an inkjet method, a screen offset printing method, a flexographic printing method, a gravure printing method, an offset printing method, a screen printing, etc.
  • An electrode and a conductive layer are formed by a printing method.
  • the surface roughness (arithmetic mean roughness) Ra of the surface of the electrode can be reduced only to about 1.2 ⁇ m. Therefore, when a conductive layer is formed on this electrode, unevenness along the unevenness of the electrode surface is formed in the conductive layer, so that the surface roughness Ra of the conductive layer becomes as rough as about 0.2 ⁇ m.
  • step S1 as illustrated in FIGS. 4A to 4C, the metal thin film 31 is coated on the sheet base material 11 on which the metal thin film 31 is formed.
  • a photosensitive film 32 is laminated on the substrate. This step corresponds to the “photosensitive resist lamination step” of the present invention.
  • the sheet base material 11 on which the metal thin film 31 is formed is cut into a predetermined size.
  • the metal thin film 31 is, for example, a copper foil.
  • the photosensitive film 32 is laminated
  • a negative dry film is used as the photosensitive film 32 in order to carry out negative photography.
  • the photosensitive resist that can be used in step S1 is not limited to such a photosensitive film 32 (dry film), and may be appropriately selected according to the embodiment.
  • a liquid etching resist agent may be used as the photosensitive resist.
  • the photosensitive resist is laminated on the sheet substrate 11 by applying a liquid etching resist agent on the metal thin film 31.
  • an ink-like photosensitive resist may be laminated on the sheet substrate 11 by screen printing. The method for laminating the photosensitive resist can be appropriately selected according to the embodiment.
  • a circuit pattern film 33 corresponding to a predetermined circuit pattern is placed on the photosensitive film 32 as illustrated in FIG. 4D.
  • This step corresponds to the “circuit pattern placement step” of the present invention.
  • the circuit pattern film 33 in order to perform negative photography, has a predetermined pitch of transmission portions such as holes through which a plurality of rows of ultraviolet rays are transmitted corresponding to the regions where the electrodes 12 are formed. It is formed with.
  • the circuit pattern film 33 corresponds to the “circuit pattern” of the present invention.
  • the circuit pattern is not limited to a film material such as the circuit pattern film 33, and may be composed of, for example, a glass material.
  • the photosensitive film 32 is exposed using the circuit pattern film 33 as a mask by irradiating light such as ultraviolet rays from the side where the circuit pattern film 33 is disposed.
  • This step corresponds to the “exposure step” of the present invention.
  • the exposed part of the photosensitive film 32 that is, the exposed part 32a is cured.
  • the light irradiation conditions can be appropriately selected according to the type of the photosensitive film 32.
  • the circuit pattern film 33 is removed as illustrated in FIG. 5B.
  • the unexposed portion 32b of the photosensitive film 32 is removed by dissolution or the like.
  • an aqueous sodium carbonate solution or the like can be used for dissolving the unexposed portion 32b.
  • the exposed photosensitive film 32 in other words, the exposed region 31a of the metal thin film 31 is removed by etching using the exposed portion 32a of the photosensitive film 32 as a mask.
  • a plurality of rows of electrodes (row electrodes) 12 are formed by the remaining metal thin film 31.
  • This step corresponds to the “electrode formation step” of the present invention.
  • step S7 as illustrated in FIG. 6A, the photosensitive film 32 remaining on each electrode 12, in other words, the exposed portion 32a of the photosensitive film 32 is removed.
  • a sodium hydroxide aqueous solution or the like is used to remove the exposed portion 32a.
  • This step corresponds to the “second photosensitive resist removing step” of the present invention.
  • the processes from step S1 to S7 correspond to the “photolithography process” of the present invention.
  • the surface of each electrode 12 is plated after the second photosensitive resist removing step.
  • the plating film 15 is formed on the surface of the electrode 12.
  • This process corresponds to the “plating process” of the present invention.
  • the range to which the plating process is applied is not limited to such an example.
  • the entire surface of the electrode 12 may be plated.
  • an alloy of nickel and gold, a flux / lead-free leveler, or the like can be used for plating.
  • the conductive ink 34 is applied to the sheet base material 11 so as to cover each electrode 12 and the plating film 15, whereby each electrode 12 is covered.
  • the conductive layer 16 is formed on the plating film 15.
  • This step corresponds to the “step of forming a conductive layer” in the present invention.
  • the ink 34 is applied to a predetermined region (region where the conductive layer 16 is formed) of the sheet base material 11 by screen printing using the squeegee 41. Then, when the ink 34 is heated and dried, the conductive layer 16 is formed.
  • the material of the ink 34 can be a resin material containing conductive particles, a conductive polymer, or the like.
  • the adhesive layer 18 is formed by applying the adhesive 35 to the sheet base material 11.
  • the adhesive 35 is applied by screen printing using a squeegee 51.
  • the region where the adhesive 35 is applied may be appropriately selected according to the embodiment.
  • the adhesive 35 is applied to the peripheral portion of the sheet base material 11.
  • a pressure sensitive adhesive or the like can be used for the adhesive 35.
  • the adhesive 35 is heated and dried, the adhesion layer 18 will be formed.
  • the first sheet member 10 can be manufactured by the above manufacturing process. Further, the second sheet member 20 can be manufactured by changing the circuit pattern film 33 used in steps S2 to S4 to a circuit pattern corresponding to a pattern different from the pattern of the circuit pattern film 33. Specifically, in steps S2 to S4, a circuit pattern is used in which transmitting portions such as holes through which a plurality of rows of ultraviolet rays are transmitted are formed at a predetermined pitch. Thereby, a plurality of rows of electrodes 22 can be formed on the sheet base material 21. In addition, this circuit pattern may be comprised with a film material, a glass material, etc. similarly to preparation of the said 1st sheet
  • the manufacturing process of the second sheet member 20 may be the same as the manufacturing process of the first sheet member 10 except that circuit patterns corresponding to different patterns are used in steps S2 to S4.
  • the manufacturing process of the second sheet member 20 and the manufacturing process of the first sheet member 10 are different except that circuit patterns corresponding to different patterns are used. May be.
  • the plating process (step S8) and the conductive layer forming process (step S9) are performed, whereas in the manufacturing process of the second sheet member 20, the plating process is performed.
  • the step (step S8) and / or the conductive layer formation step (step S9) may be omitted.
  • the obtained first sheet member 10 and second sheet member 20 are opposed to each other such that the electrode 12 and the electrode 22 overlap and face each other.
  • the pressure-sensitive adhesive layer 18 and the pressure-sensitive adhesive layer 28 are bonded together. Thereby, the pressure-sensitive sensor 1 can be manufactured. Note that, as illustrated in FIG. 1A, the manufactured pressure-sensitive sensor 1 is connected to a connector 30.
  • the surface roughness (arithmetic mean roughness) of each electrode (12, 22) is formed by forming each electrode (12, 22) of each sheet member (10, 20) by the steps S2 to S6.
  • Ra can be 0.6 ⁇ m or less. Therefore, according to the manufacturing method of the present embodiment, the surface of each electrode (12, 22) can be made significantly smoother than a conventional manufacturing method using a printing method such as screen printing.
  • the surface roughness Ra of each electrode (12, 22) can be more preferably 0.2 ⁇ m or less.
  • the lower limit value of the surface roughness Ra of each electrode (12, 22) depends on the surface roughness Ra of the metal thin film formed on the sheet base material used for manufacturing each sheet member. For example, when the surface roughness Ra of the metal thin film formed on the sheet base material used for manufacturing each sheet member is about 0.01 ⁇ m, the lower limit value of the surface roughness Ra of each electrode (12, 22) Is about 0.01 ⁇ m.
  • the lower limit value of the surface roughness Ra of each electrode (12, 22) is not limited to such an example, and may be as low as possible.
  • the surface roughness Ra is defined by JIS B0601-2001 (ISO 4287; 1997), and is represented by, for example, the following equation (1).
  • This surface roughness Ra can be measured by, for example, a laser microscope (VK-8710) manufactured by Keyence Corporation.
  • l is a reference length
  • f (x) represents a roughness curve
  • the plating films (15, 26) are formed on the electrodes (12, 22) by the step S8. Therefore, the surface of each electrode (12, 22) including the plating film (15, 26) becomes smoother by the plating film (15, 26) entering the recess of each electrode (12, 22).
  • each conductive layer (16, 27) is also smoothed by forming each conductive layer (16, 27) on each electrode (12, 22) formed in this way smoothly. can do.
  • the surface roughness (arithmetic average roughness) Ra of each conductive layer (16, 27) can be 0.1 ⁇ m or less. Therefore, according to the manufacturing method of the present embodiment, the surface of each conductive layer (16, 27) can be significantly smoothened compared to the conventional manufacturing method. According to the present embodiment, more preferably, the surface roughness Ra of each conductive layer (16, 27) can be set to 0.06 ⁇ m or less.
  • the lower limit value of the surface roughness Ra of each conductive layer (16, 27) depends on the surface roughness Ra of each electrode (12, 22). For example, when the surface roughness Ra of each electrode (12, 22) is 0.01 ⁇ m, the lower limit value of the surface roughness Ra of each conductive layer (16, 27) is about 0.002 ⁇ m. However, the lower limit value of the surface roughness Ra of each conductive layer (16, 27) is not limited to such an example, and may be as low as possible.
  • each electrode (12, 22) by forming each electrode (12, 22) by a photolithography process, compared to the case of forming the electrode by a conventional method (screen printing or the like),
  • the surface of each electrode (12, 22) can be made smoother. Therefore, the surface of each conductive layer (16, 27) formed on each electrode (12, 22) can also be made smoother, whereby the opposing pressure sensitive portions (conductive layer 16 and conductive layer 27) are opposed to each other.
  • the contact state can be improved. Therefore, according to this embodiment, the pressure sensitive sensor 1 with high detection accuracy can be manufactured and provided.
  • the first sheet member 10 is disposed on the upper side
  • the second sheet member 20 is disposed on the lower side.
  • the present invention is not limited to such an example, and the first sheet member 10 may be disposed on the lower side and the second sheet member 20 may be disposed on the upper side.
  • each electrode 12 of the first sheet member 10 extends along the Y-axis direction
  • each electrode 22 of the second sheet member 20 extends along the X-axis direction.
  • the extending direction of each electrode 12 and each electrode 22 does not have to be limited to such an example. If each electrode 12 and each electrode 22 cross each other, the direction is appropriately selected according to the embodiment. May be.
  • each conductive layer (16, 27) are formed so as to cover the entire region where the electrodes (12, 22) are formed. That is, in step S9, the conductive ink 34 is applied (solid coating) to the entire region where each electrode 12 (22) is formed.
  • the configuration of each conductive layer (16, 27) may not be limited to such an example, and may be appropriately selected according to the embodiment. For example, as illustrated in FIG. 7, each conductive layer (16, 27) may be configured.
  • FIG. 7 illustrates the configuration of the conductive layer 16 according to this modification.
  • the ink 34 may be applied (slit applied) with a gap between each electrode 12 so as to cover each electrode 12 one by one.
  • the conductive layer 16 (27) may be formed individually for each electrode 12 (22). That is, on the sheet base material 11 (21), the conductive layer 16 (27) may be formed at a plurality of spaced locations so as to individually cover the respective electrodes 12 (22).
  • each conductive layer 16 (27) is separated from the electrode 12 (22) adjacent to each electrode 12 (22) that it covers. Therefore, it can prevent that each conductive layer 16 (27) interferes with the said adjacent electrode 12 (22), and, thereby, the detection accuracy of the pressure-sensitive sensor 1 can be improved.
  • the electrode pitch p is relatively short, it is difficult to apply a slit to the conductive layer in this way. Therefore, for example, when the electrode pitch p exceeds 1 mm, the slit coating of the conductive layer according to this modification is selected, and when the electrode pitch p is 1 mm or less, the solid coating of the conductive layer according to the above embodiment is selected. May be.
  • the conductive layers (16, 27) are formed on both the first sheet member 10 and the second sheet member 20.
  • the conductive layer only needs to be formed on at least one of the first sheet member 10 and the second sheet member 20. That is, in any of the manufacturing steps of the first sheet member 10 and the second sheet member 20, one of the conductive layer 16 and the conductive layer 27 may be omitted by omitting the step S9.
  • the type of photography used when manufacturing each electrode 12 (22) is not limited to the negative type, and may be a positive type in which the exposed region is dissolved.
  • the circuit pattern film 33 arranged in step S2 is provided with a transmission portion such as a hole through which ultraviolet rays are transmitted corresponding to a region where each electrode 12 (22) is not formed.
  • a dry film can be used as the photosensitive film 32 in carrying out the positive photolithography, and an ink-like resist can be applied by screen printing, or a liquid etching resist can be coated. .
  • the plating process is performed to the surface of each electrode 12 (22), and the plating film 15 (26) is formed.
  • the plating treatment of each electrode 12 (22) may be omitted. That is, in each production process of the first sheet member 10 and the second sheet member 20, the plating film (15, 26) may be omitted by omitting the step S8.
  • the pressure-sensitive sensor 1 is connected to the connector 30 having an electric circuit having a pressure detection function, thereby detecting (measuring) the pressure applied to the pressure-sensitive sensor 1. )can do.
  • the configuration for detecting (measuring) the pressure applied to the pressure sensor 1 may not be limited to such an example, and may be appropriately selected according to the embodiment.
  • the manufacturing process of the first sheet member 10 and the manufacturing process of the second sheet member 20 are both configured by a photolithography process.
  • the manufacturing process of the first sheet member 10 and the manufacturing process of the second sheet member 20 may not be limited to an example employing a photolithography process. Either one may be manufactured by a method different from the photolithography process.
  • one of the first sheet member 10 and the second sheet member 20 may be manufactured by a conventional manufacturing method using a printing method such as screen printing.
  • the surface roughness Ra of the electrode of the sheet member manufactured by the conventional manufacturing method is about 1.2 ⁇ m
  • the surface roughness Ra of the conductive layer formed on the electrode is about 0.2 ⁇ m.
  • the surface roughness Ra of the electrode of the sheet member can be smoothed as described above by manufacturing any one of the sheet members using the photolithography process, the other sheet member is conventionally used. Even with this manufacturing method, a pressure-sensitive sensor with high detection accuracy can be configured.
  • Example 1 ⁇ Output variation between pressure sensitive points>
  • Example 1 and Comparative Example 1 were produced as the pressure-sensitive sensor according to Example 1. That is, as the pressure-sensitive sensor according to Example 1, a pressure-sensitive sensor having the configuration shown in FIGS. 1A and 1B was manufactured by the above manufacturing method. In addition, as a pressure-sensitive sensor according to Comparative Example 1, a pressure-sensitive sensor having the same configuration as the pressure-sensitive sensor according to Example 1 was manufactured. However, in Comparative Example 1, each electrode of each sheet member was produced by screen printing instead of the photolithography. The production conditions of Example 1 and Comparative Example 1 are shown in Table 1 below.
  • the electrode pitch, the electrode width, and the electrode gap were the same between the electrode of the first sheet member (upper side) and the electrode of the second sheet member (lower side).
  • the electrode gap is a distance between adjacent electrodes. That is, in the pressure sensitive sensor according to Example 1 and Comparative Example 1, the column electrodes and the row electrodes were formed with the same pitch and the same width, respectively.
  • FIG. 8 schematically illustrates the structure of the pressure device 400 used.
  • the pressurizing device 400 has an internal space 401 in the housing, and a tare 402 is provided in the internal space 401.
  • the tare 402 is connected to the air supply port 403 and is configured to expand when air is supplied from the air supply port 403.
  • this pressurizing device 400 by supplying air to the tare 402, the tare 402 is inflated, and a uniform pressure can be applied to the entire pressure-sensitive sensor disposed in the internal space 401. Therefore, using such a pressure device 400, pressure was applied to each of the pressure sensitive sensors according to Example 1 and Comparative Example 1. And the output value of each pressure-sensitive point was acquired, and the value of the output variation (variation coefficient Cv) between pressure-sensitive points was calculated by the following formula 2.
  • Table 2 below shows the measurement results of the surface roughness Ra and the output variation measured by the method as described above.
  • the surface roughness Ra of each electrode was 1.21 ⁇ m, and the surface roughness of each conductive layer was 0.22 ⁇ m.
  • the surface roughness Ra of each electrode was 0.18 ⁇ m, and the surface roughness Ra of each conductive layer was 0.06 ⁇ m. Therefore, according to the manufacturing method by this invention, it turned out that an electrode and a conductive layer can be made smooth. Specifically, it has been found that the surface roughness Ra of each electrode can be 0.2 ⁇ m or less, and the surface roughness Ra of each conductive layer can be 0.06 ⁇ m or less.
  • the output variation of the pressure-sensitive sensor according to Comparative Example 1 was 0.256, whereas the output variation of the pressure-sensitive sensor according to Example 1 was 0.208. Therefore, according to the manufacturing method of the present invention, it has been found that a pressure sensitive sensor with less output variation than the conventional one can be manufactured.
  • the electrode pitch and the electrode width of each electrode in the first sheet member and the second sheet member of Example 1 were set to 0.1 mm and 0.05 mm, respectively.
  • a pressure-sensitive sensor according to was prepared. Using a Keyence Corporation laser microscope (VK-8710), the surface roughness Ra of each electrode and each conductive layer of the pressure-sensitive sensor according to Example 2 was measured to find 0.18 ⁇ m and 0 as in Example 1. 0.06 ⁇ m.
  • the formation of the conductive layer was omitted, so that the pressure-sensitive sensor according to Example 3 was produced. That is, as the pressure-sensitive sensor according to Example 3, a pressure-sensitive sensor having the same configuration as that of the pressure-sensitive sensor according to Example 2 was manufactured except that the conductive layer of the first sheet member was omitted.
  • FIG. 9 illustrates the configuration of the first sheet member of the pressure-sensitive sensor according to the fourth embodiment.
  • the 2nd sheet member of the pressure sensor which concerns on Example 4 produced the pressure sensor which has the same structure as the 2nd sheet member of the pressure sensor which concerns on Example 2 and Example 3.
  • FIG. 9 illustrates the configuration of the first sheet member of the pressure-sensitive sensor according to the fourth embodiment.
  • FIG. 10A and 10B show a pattern of an experiment for measuring the pressure detection resolution in the Y-axis direction.
  • each pressure sensor was placed on a rubber sheet (NBR rubber sheet) having a thickness of 1.0 mm.
  • a metal weight was placed on each pressure sensor.
  • a substantially rectangular parallelepiped metal square having a thickness (X-axis direction) and width (Y-axis direction) of 2.0 mm was used.
  • roundness an arc having a radius of 0.35 mm was formed at the corner of the weight.
  • each pressure sensor when the weight is placed on each pressure sensor, each pressure sensor includes a flat portion (1.3 mm) of the weight and a roundness (radius of 0.35 mm arc) on both side corners. It was in contact with the 0 mm area.
  • the measurement detection distance was calculated by the calculation formula shown in the following equation (3). The results of each experiment are shown in FIGS. 11A to 11D.
  • FIG. 11A shows the experimental results of Comparative Example 1.
  • 11B to 11D show the experimental results of Examples 2 to 4.
  • Each detection section A to D corresponds to the detection section of Comparative Example 1.
  • FIGS. 11A to 11D as is apparent from comparison in each detection section A to D in Comparative Example 1, in each of Examples 2 to 4, there are many output values in a shorter section than in Comparative Example 1 ( Number of detection) was obtained.
  • the measurement detection distance in Comparative Example 1 was 2.60 mm, whereas in each of Examples 2 to 4, the measurement detection distance was 2.00 mm. That is, in Comparative Example 1, the dimension of the weight was detected erroneously, whereas in each of Examples 2 to 4, the dimension of the weight could be accurately detected. Therefore, from this experimental result, it was found that according to the present invention, a pressure-sensitive sensor with high pressure detection resolution can be manufactured.
  • Example 5 a pressure-sensitive sensor having the configuration shown in FIGS. 1A and 1B was manufactured by the above manufacturing method.
  • a pressure-sensitive sensor according to Comparative Example 2 a pressure-sensitive sensor having the same configuration as the pressure-sensitive sensor according to Examples 5 and 6 was manufactured.
  • each electrode of each sheet member was produced by screen printing instead of photolithography.
  • each electrode was produced by screen printing instead of photolithography.
  • Example 6 and Comparative Example 2 were measured using a Keyence laser microscope (VK-8710).
  • Table 4 shows the production conditions of Example 5, Example 6, and Comparative Example 2 and the measurement results of the surface roughness Ra of the electrodes and the conductive layer.
  • the electrode pitch, the electrode width, and the electrode gap were the same between the electrode of the first sheet member (upper side) and the electrode of the second sheet member (lower side). That is, in the pressure sensitive sensors according to Example 5, Example 6, and Comparative Example 2, the column electrodes and the row electrodes were formed with the same pitch and the same width, respectively.
  • the thicknesses of the electrodes according to the second sheet member of Example 5 and the both sheet members of Example 6 were 9 ⁇ m, whereas the first sheet member of Example 5 and both sheet members of Comparative Example 2 were used.
  • the thickness of each electrode according to was 8 ⁇ m.
  • seat member of Example 5 and both the sheet members of Example 6 performed the plating process with nickel and gold
  • the plating film formed by the plating process had a thickness of 2 ⁇ m.
  • the thickness of the adhesive layer of the pressure-sensitive sensor according to each of the examples (5, 6) and the comparative example was 10 ⁇ m.
  • Example 6 For the pressure sensitive sensors according to Example 5, Example 6 and Comparative Example 2 produced in this way, the following experiment on output reproducibility was performed using the pressurizing apparatus 500 shown in FIG.
  • FIG. 12 schematically illustrates the configuration of the pressure device 500 used in this experiment.
  • the pressure device 500 used in this experiment includes a rubber sheet (NBR) 501. On this rubber sheet 501, a blade 502 having a diameter of 30 mm, a pressure sensor, and a blade 504 having a diameter of 25 mm are arranged in this order. Be placed.
  • Each blade (502, 504) is made of stainless steel (SUS) and has a mirror finish.
  • the pressurizing device 500 further includes an air cylinder 505 that pressurizes the blade 504 disposed on the top, thereby applying a certain load to the pressure-sensitive sensor sandwiched between the two blades (502, 504). be able to.
  • FIG. 13 shows the rate of change in output according to the number of pressurizations of the pressure sensitive sensors according to Example 5, Example 6, and Comparative Example 2.
  • the horizontal axis represents the number of measurements (number of pressurizations), and the vertical axis represents the output change rate.
  • the output is a value proportional to the voltage, and the output change rate was calculated by the following formula 4.
  • the initial output is the first output (output value) after pressurization.
  • FIG. 13 shows the measurement results up to 15 pressurization times.
  • the output change rate greatly increased as the number of pressurizations increased. This is because the contact area between the first sheet member and the second sheet member is increased and the resistance value between the two electrodes is reduced due to the unevenness formed on the surface of the conductive layer being crushed according to the number of pressurizations. This is thought to be the cause. Another possible cause is that the contact portion is sequentially changed due to unevenness on the surface of the conductive layer. That is, while the output change rate is increasing, it is considered that the unevenness on the surface of the conductive layer is continuously crushed. Therefore, in the pressure-sensitive sensor according to Comparative Example 2, such an output change continuously occurs. It was found that the surface of the conductive layer was rough enough.
  • the output change rate of the pressure sensor according to Examples 5 and 6 was lower than that of Comparative Example 2. Specifically, the output change rate of the pressure-sensitive sensor according to Example 5 increased until the number of pressurizations increased to about 8, but did not increase after that and became steady. Moreover, although the output change rate of the pressure sensor which concerns on Example 6 increased to the pressurization frequency
  • Example 5 and Example 6 since it is considered that the above-mentioned uneven deformation of the unevenness does not occur, Example 5 and Example 6 are compared with the pressure-sensitive sensor according to Comparative Example 2. It has been found that the surface of the conductive layer of the pressure sensitive sensor according to the present invention is very smooth.
  • the output change rate increases according to the number of pressurizations, the output value of the pressure sensor changes in each measurement, so that measurement errors are likely to occur. That is, the output change rate can also be used as an index of the measurement accuracy of the pressure sensor. Therefore, from this viewpoint, when Example 5 and Comparative Example 2 are compared, the pressure-sensitive sensor according to Example 5 differs from Comparative Example 2 in that the change in the output change rate is small and the number of pressurizations is the eighth and subsequent times. The output change rate value became steady. For this reason, the pressure sensor according to Example 5 is less likely to cause a measurement error than that of Comparative Example 2, in other words, the pressure detection accuracy is high.
  • the detection accuracy of the pressure-sensitive sensor can be improved even if a photolithography process is employed for producing the electrode of one sheet member.
  • the change in the output change rate is smaller than that in the fifth embodiment, the output change rate value itself is very low, and the output change rate value is stabilized at an early stage. It was. Therefore, it was found that the detection accuracy of the pressure-sensitive sensor can be greatly improved by adopting a photolithography process for electrode preparation of both sheet members.
  • FIG. 14 shows the change over time (creep rate) of the output of the pressure-sensitive sensor according to Example 5, Example 6, and Comparative Example 2.
  • the horizontal axis represents the pressure holding time, and the vertical axis represents the creep rate (output change rate).
  • the output is a value proportional to the voltage.
  • the creep rate was calculated by a calculation formula in which “output of each number” in the above equation 4 was changed to “output of each time”.
  • the creep rate (output change rate) changes because, as described above, the unevenness formed on the surface of the conductive layer is crushed, thereby increasing the contact area between the first sheet member and the second sheet member,
  • the cause is considered to be that the resistance value between the two electrodes is reduced.
  • Another possible cause is that the contact portion is sequentially changed due to unevenness on the surface of the conductive layer.
  • the creep rate of the pressure-sensitive sensor according to each Example (5, 6) was lower than that of Comparative Example 2.
  • the creep rate was reduced to about 1/5 compared with Comparative Example 2.
  • the creep rate continues to increase, whereas in the pressure sensitive sensor according to Example 6, the creep rate is about 30 seconds after the pressurization holding time has elapsed. Almost no increase.
  • the pressure-sensitive sensor according to each Example (5, 6) is considered not to continuously generate the unevenness on the surface of the conductive layer as described above.
  • the surface of the conductive layer was found to be smooth.
  • the pressure-sensitive sensor according to each of the examples (5, 6) has a lower creep rate and higher pressure detection accuracy than the pressure-sensitive sensor according to comparative example 2. I understood.
  • the creep rate was significantly improved and the creep rate did not continuously change, so that the pressure detection accuracy was very high.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

L'invention porte sur l'amélioration de la sensibilité de détection d'un capteur sensible à la pression. Une résine photosensible est stratifiée sur une base en feuille munie d'un film métallique mince (S1), et un tracé de circuit est disposé sur la résine (S2). Après l'exposition de la résine photosensible à la lumière en utilisant le tracé de circuit en tant que masque (S3), le tracé de circuit est retirée (S4), et la partie exposée à la lumière ou partie non exposée à la lumière de la résine photosensible est retirée (S5). Ensuite, la région exposée du film métallique mince est retirée en utilisant la résine photosensible restante en tant que masque (S6), formant ainsi une électrode (S7). Après, la résine photosensible restante est retirée (S7).
PCT/JP2016/050747 2015-01-13 2016-01-12 Procédé de fabrication de capteur sensible à la pression WO2016114272A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015004407 2015-01-13
JP2015-004407 2015-01-13
JP2016-003932 2016-01-12
JP2016003932A JP2016130736A (ja) 2015-01-13 2016-01-12 感圧センサの製造方法

Publications (1)

Publication Number Publication Date
WO2016114272A1 true WO2016114272A1 (fr) 2016-07-21

Family

ID=56405815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/050747 WO2016114272A1 (fr) 2015-01-13 2016-01-12 Procédé de fabrication de capteur sensible à la pression

Country Status (1)

Country Link
WO (1) WO2016114272A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038432A (ja) * 1989-03-30 1991-01-16 Kobayashi Kose Co Ltd 油中水型乳化組成物
JP2004347415A (ja) * 2003-05-21 2004-12-09 Alps Electric Co Ltd 面圧分布センサの製造方法
JP2012057992A (ja) * 2010-09-06 2012-03-22 Nitta Ind Corp 感圧センサー
JP2012057991A (ja) * 2010-09-06 2012-03-22 Nitta Ind Corp 感圧センサー
JP2013529803A (ja) * 2010-06-11 2013-07-22 スリーエム イノベイティブ プロパティズ カンパニー 力測定を用いるタッチ位置センサ
JP2014215098A (ja) * 2013-04-24 2014-11-17 横河電機株式会社 力変換素子

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038432A (ja) * 1989-03-30 1991-01-16 Kobayashi Kose Co Ltd 油中水型乳化組成物
JP2004347415A (ja) * 2003-05-21 2004-12-09 Alps Electric Co Ltd 面圧分布センサの製造方法
JP2013529803A (ja) * 2010-06-11 2013-07-22 スリーエム イノベイティブ プロパティズ カンパニー 力測定を用いるタッチ位置センサ
JP2012057992A (ja) * 2010-09-06 2012-03-22 Nitta Ind Corp 感圧センサー
JP2012057991A (ja) * 2010-09-06 2012-03-22 Nitta Ind Corp 感圧センサー
JP2014215098A (ja) * 2013-04-24 2014-11-17 横河電機株式会社 力変換素子

Similar Documents

Publication Publication Date Title
JP2014535111A (ja) 柔軟な誘電体基板上に導電性の顕微鏡的なパターンを印刷するために巻き出し・巻き取り式のプロセスを用いる容量式タッチセンサ回路の製造方法
US20160147335A1 (en) Sheet for manufacturing sensor sheet, method for manufacturing sheet for manufacturing sensor sheet, sensor sheet for touch pad, and method for manufacturing sensor sheet for touch pad
KR101193803B1 (ko) 전자부품의 제조방법 및 제조장치
TWI556703B (zh) 多層基板及其製造方法
CN103906364A (zh) 一种印制电路板中隐埋电阻的加工方法
TW201331586A (zh) 接觸膜及其製造方法以及探針單元和ｌｃｄ面板檢測裝置
CN110612783A (zh) 印刷配线板及其制造方法
JP2005026525A (ja) 配線基板および配線基板の製造方法
WO2016114272A1 (fr) Procédé de fabrication de capteur sensible à la pression
US20040209197A1 (en) Photogravure press and method for manufacturing multilayer-ceramic electronic component
JP6001985B2 (ja) 感光性樹脂捲回体の製造装置及び製造方法
JP2016130736A (ja) 感圧センサの製造方法
JP2016110179A (ja) タッチパネルの製造方法及び品質管理方法
JP2009172949A (ja) グラビア印刷版および積層電子部品の製造方法
JP2009089869A (ja) 静電容量式水分センサ及びその製造方法
JP2006287138A (ja) 受動部品形成用積層フィルム及びシート型受動部品並びにその製造方法
JP2014057096A (ja) 基板内蔵用チップ抵抗器およびその製造方法
JP6337419B2 (ja) レジストパターンの形成方法及びラミネート構造体
US11482801B2 (en) Electric connector and method for manufacturing the same
JP4093425B2 (ja) 積層基板の製造方法
JP5850574B2 (ja) 連続パターンメッキ転写システム及び連続パターンメッキ転写物製造方法
JP2017072472A (ja) 感圧センサ
CN219659994U (zh) 一种高频电路板碳油图形加工结构
US20190135010A1 (en) Array-type electrode, digital printing mold and method for manufacturing array-type electrode
US11172581B2 (en) Multi-planar circuit board having reduced z-height

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16737343

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16737343

Country of ref document: EP

Kind code of ref document: A1