WO2016106868A1 - 一种彩色滤光片基板的制作方法 - Google Patents

一种彩色滤光片基板的制作方法 Download PDF

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WO2016106868A1
WO2016106868A1 PCT/CN2015/070891 CN2015070891W WO2016106868A1 WO 2016106868 A1 WO2016106868 A1 WO 2016106868A1 CN 2015070891 W CN2015070891 W CN 2015070891W WO 2016106868 A1 WO2016106868 A1 WO 2016106868A1
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Prior art keywords
flat layer
layer
substrate
flat
photoresist
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English (en)
French (fr)
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薛景峰
陈归
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/422,660 priority Critical patent/US20160342018A1/en
Publication of WO2016106868A1 publication Critical patent/WO2016106868A1/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133519—Overcoatings

Definitions

  • the present invention relates to a method of fabricating a color filter substrate, and more particularly to a method of fabricating a color filter substrate using a photolithography process to planarize a flat surface.
  • the liquid crystal display panel includes an upper substrate and a lower substrate disposed opposite to each other, and a liquid crystal layer interposed between the upper and lower substrates.
  • the upper substrate is generally referred to as a color filter (CF) substrate
  • the lower substrate is generally referred to as an Array substrate.
  • CF color filter
  • a liquid crystal display panel composed of a red (R) sub-pixel, a green (G) sub-pixel, a blue (B) sub-pixel, and a white (W) sub-pixel is formed, that is, in a color filter.
  • one pixel is composed of a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel.
  • a color filter substrate There are various methods for fabricating a color filter substrate. For example, one of them is formed on a substrate by using red, green, blue, and white color resists, and then a flat layer is formed on the substrate, but this method adds a white color.
  • a resistive lithography process the other is to form red, green, and blue color resists on the substrate, and the same material color resist as the flat layer, and then form a flat layer on the substrate, but this method also adds a flat layer a lithography process of the same material color resist; another is to form red, green, and blue color resists on the substrate, and an opening portion, and then form a flat layer on the substrate, and the flat layer fills the opening portion, although this method A lithography process is saved, but the flat layer is recessed at the opening portion, so that the surface of the flat layer is uneven, thereby affecting the display quality of the resulting liquid crystal display panel.
  • an object of the present invention is to provide a method for fabricating a color filter substrate, comprising the steps of: providing a substrate; forming a light shielding portion on the substrate; forming color on the substrate a filter, wherein the color filter comprises a colored portion and an opening portion; Covering a flat layer on the substrate, and filling the flat portion into the opening portion; performing photolithography on the flat layer; forming a transparent electrode layer on the lithographic flat layer; at the transparent electrode layer A spacer is formed on the upper side.
  • a transparent electrode layer is formed on the lithographic flat layer, and a spacer is formed on the transparent electrode layer.
  • the flat layer is a transparent negative photoresist layer.
  • photolithography is performed on the flat layer by exposing the flat layer with a halftone mask, and then developing the exposed flat layer to planarize the surface of the developed flat layer.
  • photolithography is performed on the flat layer by exposing the flat layer with a gray scale mask, and then developing the exposed flat layer to planarize the surface of the developed flat layer.
  • the colored portion includes red, green, and blue.
  • the material of the light shielding portion is metal chromium or black resin.
  • the color portion is formed by a spin coating method to form a red photoresist on the surface of the substrate, and then exposed and developed, leaving a red photoresist in a predetermined area of the red pixel, and removing the red photoresist in the remaining positions. .
  • the color portion further includes sequentially forming a green photoresist and a blue photoresist in the same manner.
  • the material of the transparent electrode layer is indium tin oxide.
  • the spacer is formed by coating a negative photoresist material and then passing through a yellow light process.
  • the invention adopts a transparent photoresist layer to fill the opening portion as a white photoresist, and planarizes the surface of the transparent photoresist layer by a photolithography process.
  • the transparent photoresist layer on the opening portion is not recessed, and the surface of the transparent photoresist layer is prevented from being uneven, thereby improving the display quality of the liquid crystal display panel.
  • FIGS. 1A to 1E are schematic views showing a method of fabricating a color filter substrate according to a first embodiment of the present invention
  • FIG. 2E is a schematic view of a spacer forming method according to a second embodiment of the present invention.
  • 3D is a schematic view of a photolithography process for a transparent photoresist layer in accordance with a third embodiment of the present invention.
  • the display mode of the liquid crystal display panel having the color filter substrate may be, for example, a vertical alignment (VA) mode or a twisted nematic (TN) display mode.
  • VA vertical alignment
  • TN twisted nematic
  • a substrate 10 is provided, such as an insulating transparent substrate, which is defined as a color filter substrate, commonly referred to as an upper substrate; then, a black matrix shading is formed on the substrate 10.
  • the material of the black matrix light-shielding portion 12 may be a black resin or a metal chromium, for example, a black resin having a certain thickness in a yellow light process, preferably a polymer material mixed with acrylic and carbon, or the same yellow
  • the metal chromium of a certain thickness is produced by light, and the thickness of the red, green, and blue color photoresists does not overlap due to the thin thickness.
  • a color filter is formed on the substrate 10, wherein the color filter includes a red, blue, green color resist portion 14 and an opening portion 16, and the red color resist portion 14 is utilized.
  • a transparent photoresist layer 18 having a certain thickness is deposited on the color filter by spin coating or other means, wherein the transparent photoresist layer 18 is filled in the opening portion 16, and the transparent light is filled.
  • the resist layer 18 is a negative transparent photoresist layer formed of a transparent photosensitive or heat sensitive material.
  • a photolithography process is performed on the transparent photoresist layer 18 to flatten the surface of the transparent photoresist layer 18, and a photolithography process is performed on the transparent photoresist layer 18 by using a halftone mask (Half Tone Mask).
  • HTM halftone mask
  • HTM 20 exposes the transparent photoresist layer 18, and then develops the exposed transparent photoresist layer 18 to planarize the surface of the developed transparent photoresist layer 18.
  • the partial light transmittance of the opposite opening portion 16 of the halftone mask 20 is higher, and the light transmittance of the remaining portion is lower, wherein the downward arrow indicates the light transmitted by the halftone mask 20.
  • the transparent photoresist layer 18 is a negative transparent photoresist layer, the photoresist at the place where the light is irradiated is more left after being developed, and the photoresist which is exposed to the weaker light is less after development, so that By exposing the transparent photoresist layer 18 by using the halftone mask 20, after development, more transparent photoresist layer 18 above the red, blue, and green color resist portions 14 can be removed, in contrast, The transparent photoresist layer 18 of the opening portion 16 is removed less, so that the surface of the developed transparent photoresist layer 18 can be formed into a flat surface.
  • a negative photoresist material such as acryl is applied on the electrode layer 22, and then a yellow light process is left to leave a spacer-like spacer 24 for holding the liquid crystal display panel.
  • the spacing between the upper and lower substrates It is to be noted that since the surface of the bright photoresist layer 18 is flat, the spacer 24 having a relatively uniform film thickness can be obtained.
  • the method before the spacer 24 is formed is the same as that of the first embodiment, that is, the method before the spacer 24 of the second embodiment can be referred to FIGS. 1A to 1D.
  • the method before the spacer 24 of the second embodiment can be referred to FIGS. 1A to 1D.
  • the display mode of the liquid crystal display panel having the color filter substrate of the second embodiment may be, for example, a fringe field switching (FFS) mode or an area switching type (IPS) display mode.
  • FFS fringe field switching
  • IPS area switching type
  • FIG. 2E is a schematic view of a spacer forming method according to a second embodiment of the present invention.
  • the electrode layer 22 is deposited on the transparent photoresist layer 18 by sputtering, wherein the electrode layer 22 can be transparent conductive such as indium tin oxide (ITO). membrane.
  • ITO indium tin oxide
  • a negative photoresist material such as acryl is applied on the electrode layer 22, and then a yellow light process is left to leave a spacer-like spacer 24 for holding the liquid crystal display panel.
  • the spacing between the upper and lower substrates It is to be noted that since the surface of the bright photoresist layer 18 is flat, the spacer 24 having a relatively uniform film thickness can be obtained.
  • 3D is a schematic view of a photolithography process for a transparent photoresist layer in accordance with a third embodiment of the present invention.
  • the photolithography process is performed on the transparent photoresist layer 18 by using a Gray Tone Mask (GTM) 26 to expose the transparent photoresist layer 18, and then The exposed transparent photoresist layer 18 is developed to planarize the surface of the developed transparent photoresist layer 18.
  • GTM Gray Tone Mask
  • the portion of the gray-scale reticle 26 opposite the opening portion 16 is more transparent, while the remaining portion is less transparent, wherein the downward arrow indicates the light transmitted by the gray-scale reticle 26.
  • the transparent photoresist layer 18 is a negative transparent photoresist layer, the photoresist which receives more light irradiation remains more after development, and the photoresist which receives less light irradiation remains less after development, thus, By exposing the transparent photoresist layer 18 by using a gray scale mask 26, after development, more transparent photoresist layer 18 above the red, blue, and green color resist portions 14 can be removed. The transparent photoresist layer 18 of the opening portion 16 is removed less, so that the surface of the developed transparent photoresist layer 18 can be formed into a flat surface.
  • the present invention uses a transparent photoresist layer to fill the opening portion as a white photoresist, and planarizes the surface of the transparent photoresist layer by a photolithography process, and reduces the lithography process of a white color resist compared to the prior art.
  • the transparent photoresist layer on the opening portion is not recessed, and the surface of the transparent photoresist layer is prevented from being uneven, thereby improving the display quality of the liquid crystal display panel.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种彩色滤光片基板的制作方法，包括步骤：提供一基板（10）；在所述基板（10）上形成遮光部分（12）；在所述基板（10）上形成彩色滤光片，其中，所述彩色滤光片包括彩色部分（14）及开口部分（16）；在所述基板上覆盖平坦层，且所述平坦层填入所述开口部分（16）；对所述平坦层进行光刻；在所述光刻后的平坦层上形成间隔体（24）。由于采用透明光阻层（18）填入开口部分（16）作为白色光阻，并利用光刻工艺将透明光阻层（18）的表面平坦化，相对于现有技术，在减少一道白色色阻的光刻制程的同时，不会使开口部分（16）上的透明光阻层（18）凹陷，避免透明光阻层（18）的表面凹凸不平，进而提高制成的液晶显示面板的显示品质。

Description

一种彩色滤光片基板的制作方法 技术领域
本发明涉及一种彩色滤光片基板的制作方法，尤其涉及一种利用光刻工艺使平坦层表面平整的彩色滤光片基板的制作方法。
背景技术
液晶显示面板包括互相对向设置的上基板和下基板，以及夹设于上下基板之间的液晶层。而上基板通常称为彩色滤光片(Color Filter，CF)基板，下基板通常称为阵列(Array)基板。随着信息技术的发展，对于液晶显示面板的各种需求也在增加，其中，高透过率、低功耗、成像质量佳成为人们对显示面板的需求。为了满足这些需求，出现了由红色(R)子像素、绿色(G)子像素、蓝色(B)子像素和白色(W)子像素组成一个像素的液晶显示面板，即在彩色滤光片基板中，由红色子像素、绿色子像素、蓝色子像素和白色子像素组成一个像素。
彩色滤光片基板有多种制作方法，例如，其中一种是采用红色、绿色、蓝色及白色色阻形成在基板上，再在基板上形成平坦层，但这种方法会增加一道白色色阻的光刻制程；另一种是在基板上形成红色、绿色和蓝色色阻，以及与平坦层相同材料色阻，再在基板上形成平坦层，但这种方法同样是增加一道与平坦层相同材料色阻的光刻制程；再一种是在基板上形成红色、绿色和蓝色色阻，以及开口部分，再在基板上形成平坦层，并且该平坦层填入开口部分，这种方法虽然节省了一道光刻制程，但是平坦层在开口部分处出现凹陷，使得平坦层的表面凹凸不平，进而影响制成的液晶显示面板的显示品质。
发明内容
为了解决上述现有技术存在的问题，本发明的目的在于提供一种彩色滤光片基板的制作方法，包括步骤：提供一基板；在所述基板上形成遮光部分；在所述基板上形成彩色滤光片，其中，所述彩色滤光片包括彩色部分及开口部分； 在所述基板上覆盖平坦层，且所述平坦层填入所述开口部分；对所述平坦层进行光刻；在经光刻后的平坦层上形成透明电极层；在所述透明电极层上形成间隔体。
进一步地，在经光刻后的平坦层上形成间隔体之前，在经光刻后的平坦层上形成透明电极层，再在所述透明电极层上形成间隔体。
进一步地，所述平坦层为透明负光阻层。
进一步地，对所述平坦层进行光刻是利用半色调光罩对所述平坦层进行曝光，再对经曝光后的平坦层进行显影，以使经显影后的平坦层的表面平整。
进一步地，对所述平坦层进行光刻是利用灰阶光罩对所述平坦层进行曝光，再对经曝光后的平坦层进行显影，以使经显影后的平坦层的表面平整。
进一步地，所述彩色部分包括红色、绿色及蓝色。
进一步地，所述遮光部分的材料为金属铬或黑色树脂。
进一步地，所述彩色部分是利用旋涂方式在所述基板表面形成红色光阻，再以曝光显影的方式，留下红色光阻在红色的像素预定区中，并去除其余位置的红色光阻。
进一步地，所述彩色部分还包括以同样的方式依序形成绿色光阻和蓝色光阻。
进一步地，所述透明电极层的材料为氧化铟锡。
进一步地，所述间隔体通过涂布负光阻材料，再经过一黄光制程而形成。
本发明采用透明光阻层填入开口部分作为白色光阻，并且利用光刻工艺将透明光阻层的表面平坦化，相对于现有技术，在减少一道白色色阻的光刻制程的同时，不会使开口部分上的透明光阻层凹陷，避免透明光阻层的表面凹凸不平，进而提高制成的液晶显示面板的显示品质。
附图说明
通过结合附图进行的以下描述，本发明的实施例的上述和其它方面、特点和优点将变得更加清楚，附图中：
图1A至图1E是根据本发明的第一实施例的彩色滤光片基板的制作方法示意图；
图2E是根据本发明的第二实施例的间隔体形成方法的示意图；
图3D是根据本发明的第三实施例的对透明光阻层进行光刻工艺的示意图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。在附图中，相同的标号将始终被用于表示相同的元件。
<第一实施例>
图1A至图1E是根据本发明的第一实施例的彩色滤光片基板的制作方法示意图。在第一实施例中，具有彩色滤光片基板的液晶显示面板的显示模式可例如为垂直取向(VA)模式或扭曲向列型(TN)显示模式。
首先，请参照图1A，提供一基板10，例如为一绝缘透明基板，其被定义为彩色滤光片基板，通常称为上基板；接着，在基板10上形成一黑色矩阵(black matrix)遮光部分12，其中，黑色矩阵遮光部分12的材料可为黑色树脂或者金属铬，例如以黄光制程方式制作一定厚度的黑色树脂，较佳为亚克力与碳混合的高分子材料，亦或同样以黄光方式制作一定厚度的金属铬，由于厚度较薄以致红色、绿色、蓝色彩色光阻之间不会发生迭合的现象。
接着，请参照图1B，在基板10上形成彩色滤光片，其中，该彩色滤光片包括红色、蓝色、绿色的彩色光阻部分14及开口部分16，红色彩色光阻部分14是利用旋涂或者其他方式在基板10表面形成红色颜料光阻，再以曝光显影的方式，留下一定厚度的红色颜料光阻在红色的像素预定区中，并去除其余位 置的红色颜料光阻。之后，再依序以同样的方式形成相同厚度的蓝色颜料光阻和绿色颜料光阻。
接着，请参照图1C，以旋涂或者其他方式在彩色滤光片上沉积覆盖一具有一定厚度的透明光阻层18，其中，该透明光阻层18填入开口部分16，并且该透明光阻层18为负透明光阻层，其由透明感光或感热材料形成。
接着，请参照图1D，对透明光阻层18进行光刻工艺，以使透明光阻层18的表面平整，而对透明光阻层18进行光刻工艺是利用半色调光罩(Half Tone Mask，HTM)20对透明光阻层18进行曝光，再对经曝光后的透明光阻层18进行显影，以使经显影后的透明光阻层18的表面平整。这里，半色调光罩20的相对开口部分16的部分透光率较高，而其余部分的透光率较低，其中，向下的箭头表示半色调光罩20透过的光。由于透明光阻层18为负透明光阻层，接受较强光照射之处的光阻经显影后剩余较多，而接受较弱光照射之处的光阻经显影后剩余较少，这样，通过采用半色调光罩20对透明光阻层18进行曝光，在经过显影后，可去除掉较多的红色、蓝色、绿色的彩色光阻部分14上方的透明光阻层18，相对地，开口部分16的透明光阻层18被去除较少，因此可使经显影后的透明光阻层18的表面形成为平坦的表面。
最后，参照图1E，先涂布一例如压克力的负光阻材料在电极层22上，再经过一道黄光制程而留下类似柱状物的间隔体24，用来顶住液晶显示面板的上下基板的间距。值得注意的是，因为明光阻层18的表面平坦，所以可得到膜厚较均匀的间隔体24。
<第二实施例>
在根据本发明的第二实施例中，形成间隔体24之前的方法与第一实施例相同，即第二实施例的形成间隔体24之前的方法可参照图1A至图1D。这里，避免赘述，第二实施例中仅描述与第一实施例的形成间隔体24的方法的不同之处。
首先，应当说明的是，第二实施例的具有彩色滤光片基板的液晶显示面板的显示模式可例如为边缘场切换(FFS)模式或平面转换型(IPS)显示模式。
图2E是根据本发明的第二实施例的间隔体形成方法的示意图。
参照图2E，在透明光阻层18的表面平坦后，利于后续利用溅镀方式沉积电极层22在透明光阻层18上，其中，电极层22可例如是氧化铟锡(ITO)的透明导电膜。
接着，继续参照图2E，先涂布一例如压克力的负光阻材料在电极层22上，再经过一道黄光制程而留下类似柱状物的间隔体24，用来顶住液晶显示面板的上下基板的间距。值得注意的是，因为明光阻层18的表面平坦，所以可得到膜厚较均匀的间隔体24。
图3D是根据本发明的第三实施例的对透明光阻层进行光刻工艺的示意图。
在根据本发明的第三实施例中，仅在图3D所示的对透明光阻层进行光刻工艺的方法与图1D所示的对透明光阻层进行光刻工艺的方法有区别，其余方法均相同，因此二者相同之处在此不再赘述。
请参照图3D，在根据本发明的另一实施例中，对透明光阻层18进行光刻工艺是利用灰阶光罩(Gray Tone Mask，GTM)26对透明光阻层18进行曝光，再对经曝光后的透明光阻层18进行显影，以使经显影后的透明光阻层18的表面平整。这里，灰阶光罩26的相对开口部分16的部分透光较多，而其余部分透光较少，其中，向下的箭头表示灰阶光罩26透过的光。由于透明光阻层18为负透明光阻层，接受较多光照射之处的光阻经显影后剩余较多，而接受较少光照射之处的光阻经显影后剩余较少，这样，通过采用灰阶光罩26对透明光阻层18进行曝光，在经过显影后，可去除掉较多的红色、蓝色、绿色的彩色光阻部分14上方的透明光阻层18，相对地，开口部分16的透明光阻层18被去除较少，因此可使经显影后的透明光阻层18的表面形成为平坦的表面。
综上，本发明采用透明光阻层填入开口部分作为白色光阻，并且利用光刻工艺将透明光阻层的表面平坦化，相对于现有技术，在减少一道白色色阻的光刻制程的同时，不会使开口部分上的透明光阻层凹陷，避免透明光阻层的表面凹凸不平，进而提高制成的液晶显示面板的显示品质。
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。

Claims (18)

  1. 一种彩色滤光片基板的制作方法，其中，包括步骤：
    提供一基板；
    在所述基板上形成遮光部分；
    在所述基板上形成彩色滤光片，其中，所述彩色滤光片包括彩色部分及开口部分；
    在所述基板上覆盖平坦层，且所述平坦层填入所述开口部分；
    对所述平坦层进行光刻；
    在经光刻后的平坦层上形成间隔体。
  2. 根据权利要求1所述的制作方法，其中，在经光刻后的平坦层上形成间隔体之前，在经光刻后的平坦层上形成透明电极层，再在所述透明电极层上形成间隔体。
  3. 根据权利要求1所述的制作方法，其中，所述平坦层为透明负光阻层。
  4. 根据权利要求2所述的制作方法，其中，所述平坦层为透明负光阻层。
  5. 根据权利要求1所述的制作方法，其中，对所述平坦层进行光刻是利用半色调光罩对所述平坦层进行曝光，再对经曝光后的平坦层进行显影，以使经显影后的平坦层的表面平整。
  6. 根据权利要求2所述的制作方法，其中，对所述平坦层进行光刻是利用半色调光罩对所述平坦层进行曝光，再对经曝光后的平坦层进行显影，以使经显影后的平坦层的表面平整。
  7. 根据权利要求1所述的制作方法，其中，对所述平坦层进行光刻是利用灰阶光罩对所述平坦层进行曝光，再对经曝光后的平坦层进行显影，以使经显影后的平坦层的表面平整。
  8. 根据权利要求2所述的制作方法，其中，对所述平坦层进行光刻是利用灰阶光罩对所述平坦层进行曝光，再对经曝光后的平坦层进行显影，以使经显影后的平坦层的表面平整。
  9. 根据权利要求1所述的制作方法，其中，所述彩色部分包括红色、绿色及蓝色。
  10. 根据权利要求2所述的制作方法，其中，所述彩色部分包括红色、绿色及蓝色。
  11. 根据权利要求1所述的制作方法，其中，所述遮光部分的材料为金属铬或黑色树脂。
  12. 根据权利要求2所述的制作方法，其中，所述遮光部分的材料为金属铬或黑色树脂。
  13. 根据权利要求1所述的制作方法，其中，所述彩色部分是利用旋涂涂布方式在所述基板表面形成红色光阻，再以曝光显影的方式，留下红色光阻在红色的像素预定区中，并去除其余位置的红色光阻。
  14. 根据权利要求2所述的制作方法，其中，所述彩色部分是利用旋涂涂布方式在所述基板表面形成红色光阻，再以曝光显影的方式，留下红色光阻在红色的像素预定区中，并去除其余位置的红色光阻。
  15. 根据权利要求13所述的制作方法，其中，所述彩色部分还包括以同样的方式依序形成绿色光阻和蓝色光阻。
  16. 根据权利要求14所述的制作方法，其中，所述彩色部分还包括以同样的方式依序形成绿色光阻和蓝色光阻。
  17. 根据权利要求1所述的制作方法，其中，所述间隔体通过涂布负光阻材料，再经过一黄光制程而形成。
  18. 根据权利要求2所述的制作方法，其中，所述间隔体通过涂布负光阻材料，再经过一黄光制程而形成。
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