WO2016101875A1 - 通讯设备金属外壳以及其制备方法 - Google Patents

通讯设备金属外壳以及其制备方法 Download PDF

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Publication number
WO2016101875A1
WO2016101875A1 PCT/CN2015/098297 CN2015098297W WO2016101875A1 WO 2016101875 A1 WO2016101875 A1 WO 2016101875A1 CN 2015098297 W CN2015098297 W CN 2015098297W WO 2016101875 A1 WO2016101875 A1 WO 2016101875A1
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WIPO (PCT)
Prior art keywords
slit
metal substrate
support layer
plastic support
metal
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PCT/CN2015/098297
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English (en)
French (fr)
Inventor
刘晨岑
郭丽芬
赵桂网
董明杰
李孔林
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BYD Co Ltd
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BYD Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present invention relates to the field of materials, and in particular, to a metal casing for a communication device and a method of manufacturing the same.
  • the metal casing has gradually replaced the plastic casing because of its more beautiful appearance, more texture, and better wear resistance and scratch resistance, and has become a future development trend.
  • the electronic communication device can only be designed with a non-metallic outer casing, or a metal outer casing needs to be partitioned with a non-metallic material at the antenna. Therefore, when a metal casing is used, a slit is usually provided in a portion corresponding to the antenna of the metal casing and the inside of the device to ensure that the antenna can work normally.
  • the strength of the metal casing is often deteriorated after the slit is processed because the thickness of the outer casing is thin. Therefore, when the outer casing is re-injected, the deformation of the outer casing is extremely likely to occur.
  • the injection molding process parameters need precise control during injection molding, and the requirements for the injection molding machine and the injection molding process are relatively high. high.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, it is an object of the invention to provide a metal housing for a communication device.
  • the metal substrate of the metal casing of the communication device provided by the invention has no deformation or uniformity in appearance.
  • the invention provides a metal housing for a communication device.
  • the metal casing comprises:
  • a slit extending through an outer surface and an inner surface of the metal substrate, the slit extending into the plastic support layer but not penetrating the plastic support layer; the longitudinal section of the slit being a reverse cone At least one of an arc, a rectangle, and an inverted trapezoid.
  • the present invention provides a plastic support layer on the inner surface of the metal substrate, a slit is formed on the metal substrate on which the plastic support layer is formed, and the slit is penetrated through the metal substrate but not Through the plastic support layer.
  • the plastic support layer can provide support for the metal substrate, thereby preventing deformation of the metal casing.
  • the metal housing of the communication device includes a metal substrate, a slit, and a plastic support layer covering at least a portion of the inner surface of the metal substrate, wherein the slit penetrates the metal through the metal substrate a support layer, and a cross-sectional shape of a portion of the slit in the plastic support layer is one or more of an inverted cone shape, an arc shape, a rectangular shape, and an inverted trapezoid shape.
  • the invention provides a method of making a metal casing for a communication device.
  • the method comprises: (1) providing a plastic support layer on an inner surface of the metal substrate; and (2) forming a slit in the metal substrate, the slit extending through the metal base
  • the outer and inner surfaces of the material are such that the metal casing of the communication device is obtained.
  • the metal support can be supported by the plastic support layer, thereby preventing the slit and the metal substrate around the slit from being deformed during the slit processing.
  • the above method comprises: 1) molding a resin on at least a portion of the inner surface of the metal substrate to form a plastic support layer; 2) forming more than one slit in the region of the metal substrate on which the plastic support layer is formed
  • the slit penetrates the metal substrate and does not penetrate the plastic support layer.
  • the metal casing of the communication device obtained by the method of the invention has a slit for the communication signal to pass through to realize a normal communication function.
  • the plastic support layer on the inner surface of the metal substrate can provide a good support for the metal substrate, especially the metal substrate at the slit, to avoid deformation of the metal substrate.
  • the metal substrate can be well decorated and protected without affecting the normal transmission of the communication signal.
  • the plastic support layer is set by injection molding first, and the processing method of the post-processing slit can be used without adding reinforcement rib before injection molding, and the injection molding parameters do not need precise requirements. Ordinary injection molding means that it can be processed.
  • the plastic support layer is supported before the slit, the deformation of the material generated during the injection of the slit can be reduced, and the processing strength of the outer casing can be improved.
  • FIG. 1 is a schematic structural view of a metal casing of a communication device according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view showing a metal casing of a communication device according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a metal casing of a communication device according to still another embodiment of the present invention.
  • FIG. 4 is a schematic structural view showing a metal casing of a communication device according to still another embodiment of the present invention.
  • FIG. 5 is a schematic structural view showing a metal casing of a communication device according to still another embodiment of the present invention.
  • FIG. 6 is a schematic structural view showing a metal casing of a communication device according to still another embodiment of the present invention.
  • Figure 7 is a block diagram showing the structure of a metal casing of a communication device according to still another embodiment of the present invention.
  • Figure 8 is a block diagram showing the structure of a metal casing of a communication device in accordance with still another embodiment of the present invention.
  • the invention proposes a metal outer casing.
  • the metal casing comprises: a metal substrate 100, a slit 200, and a plastic support layer 300.
  • the slit 200 penetrates the outer and inner surfaces of the metal substrate 100
  • the plastic support layer 300 is disposed on the inner surface of the metal substrate 100 .
  • the plastic support layer 300 can provide good support for the metal casing according to the embodiment of the present invention, thereby preventing the metal substrate 100 and the slit 200 from being deformed during the preparation of the metal casing and subsequent use.
  • the communication device may be: a mobile phone, a tablet computer, a notebook computer, a Bluetooth headset, etc., and the specific type of the communication device is not particularly limited.
  • the "outer surface" of the metal casing is defined as the surface of the metal casing facing the outside when it is used in a communication device, and the “inner surface” of the metal casing is oriented when it is used in a communication device. The surface inside the communication device.
  • the inner and outer surfaces of the metal substrate used for preparing the metal outer casing are also applicable to the above definition, that is, the surface of the metal substrate facing the interior of the communication device is the inner surface of the metal substrate, and the surface away from the interior of the communication device and facing the outside is a metal bottom.
  • the outer surface of the material is also applicable to the above definition, that is, the surface of the metal substrate facing the interior of the communication device is the inner surface of the metal substrate, and the surface away from the interior of the communication device and facing the outside.
  • the slit 200 is used to ensure signal transmission between the antenna and the outside, and to realize communication. Therefore, according to an embodiment of the present invention, referring to FIG. 2, the metal casing may have a plurality of slits.
  • a person skilled in the art can select a specific number of slits according to a specific location of the metal casing in the communication device in the actual application and a specific type of communication signal that needs to pass through the slit 200, so as to improve communication signals transmitted through the slit.
  • the pass rate can further make the signal transmission of the communication device with the metal casing more smooth. Referring to FIGS.
  • the slit 200 may have at least one selected from the group consisting of an inverted cone (shown in FIG. 2), an arc (shown in FIG. 3), a rectangle (shown in FIG. 4), and an inverted trapezoid (shown in FIG. 5).
  • a longitudinal section of one herein means a section in a direction perpendicular to the plane in which the metal casing is located.
  • the longitudinal section of the slit 200 is cut along a direction perpendicular to the inner surface or the outer surface of the metal substrate 100, and the portion of the metal casing having the slit 200 is cut, and the obtained slit 200 has a plane in the cut plane.
  • the shape may be one or more of an inverted cone shape, an arc shape, a rectangular shape, and an inverted trapezoid shape.
  • the line shape constituting the slit 200 may be a straight line, a curved line, a square wave line shape or a zigzag line shape (not shown), and is preferably a straight line shape.
  • the shape of the slit may be a straight line, a curved line, a square wave line shape or a zigzag line shape. According to a specific embodiment of the present invention, referring to FIG.
  • the length L 1 of the slit 200 may be 10-70 mm, more preferably 20-30 mm; the width L 2 of the slit 200 may be 5-500 ⁇ m, preferably 10-50 ⁇ m. More preferably, it is 25-50 ⁇ m; the spacing D between adjacent slits may be 0.3-1.6 mm, preferably 0.5-1.2 mm. Further, the number of slits 200 is not particularly limited as long as communication can be realized, and for example, it may be 1-200, preferably 5-50.
  • the depth of the slit 200 is mainly composed of a metal bottom.
  • the thickness of the material 100 is determined.
  • the specific width, the spacing, the length, the number of the strips, and the shape of the slits those skilled in the art can adjust the range of the communication signal and the frequency that are actually needed to be adjusted within the above range.
  • the specific adjustment method is well known in the art. It will not be described in detail in the present invention.
  • the material of the metal casing metal substrate 100 may be various metals commonly used in communications equipment in the art, such as aluminum alloy, stainless steel, magnesium alloy or titanium alloy.
  • the plastic cover layer 300 covers the slit 200.
  • the plastic tube cover 300 may not cover the entire inner surface of the metal substrate 100, but is formed only around the position having the slit 200.
  • the support strength of the metal substrate 100 at the slit 200 can be reinforced by the plastic support layer 300, and the metal substrate 100 due to the slit 200 can be prevented from being easily deformed.
  • the structure in which the plastic cover layer 300 covers the slit 200 can also prevent the slit 200 from being deformed during processing and subsequent use, thereby avoiding deterioration of the metal casing signal transmission capability due to deformation of the slit 200.
  • the plastic support layer 300 covers the entire inner surface of the metal substrate 100. Thereby, a more powerful support can be provided for the metal substrate 100 and the slit 200.
  • the material forming the plastic support layer 300 may be a resin, and specifically, may be polyethylene, polypropylene, polyacetal, polystyrene, modified polyphenylene ether, polyethylene terephthalate, polyparaphenylene.
  • Butylene formate polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamideimide, polyetherimide, polysulfone, polyethersulfone, polyetherketone, polyether One or more of the ether magnesium, polycarbonate, polyamide, and acrylonitrile-butadiene-styrene copolymer.
  • the material forming the plastic support layer 300 is a mixture of a resin and a glass fiber.
  • the resin is one selected from the group consisting of polyphenylene sulfide, polycarbonate, and polyamide, and the content of the glass fiber may be 1 to 50% by weight based on the weight of the mixture of the resin and the glass fiber.
  • a method of forming the plastic supporting layer 300 it is preferable to form by molding the above resin or a mixture of a resin and a glass fiber on the inner surface of the metal substrate 100. Thereby, the material strength and toughness of the plastic support layer 300 itself can be improved, and the metal substrate 100 and the slit 200 can be provided with more reliable support.
  • the metal casing may further have a decorative layer 400.
  • the decorative layer 400 is disposed on the outer surface of the metal substrate 100 and covers the slit 200.
  • the metal housing of the communication device further includes a decorative layer on the outer surface of the metal substrate, the decorative layer covering the slit.
  • the decorative layer 400 can cover the slit 200 penetrating the outer surface and the inner surface of the metal substrate 100, so that the metal casing can be made more beautiful; on the other hand, the decorative layer 400 can also be outside the metal substrate 100.
  • the surface provides additional support and protection for the metal substrate 100 and the slit 200.
  • the above decorative layer 400 may be formed by one or more of electrophoresis, micro-arc oxidation, anodization, hard anode, and spray coating, and the material forming the decorative layer 400 is not particularly limited. A person skilled in the art can select a method of forming the decorative layer 400 according to actual conditions.
  • a portion of the decorative layer 400 may protrude into the slit 200.
  • the slit 200 can be better covered by the decorative layer 400, and the degree of bonding between the decorative layer 400 and the slit 200 and the metal substrate 100 can be improved.
  • the metal casing having the preferred structure can also reduce the accuracy requirement of the instrument used when the decorative layer 400 is disposed, that is, when the decorative layer 400 is disposed, there is no need to additionally protect the slit 200 to prevent the formation of the decorative layer 400.
  • the material enters the slit 200, and only the material forming the decorative layer 400 needs to be controlled so as not to fill the slit 200.
  • the metal casing may also have the following structure:
  • the slit 200 can extend into the plastic support layer 300.
  • the depth of the portion of the slit 200 in the plastic support layer 300 is 1 mm or less, that is, the depth h of the slit 200 in the plastic support layer 300 does not exceed 1 mm. More preferably, the depth h may be 0.2-0.6 mm. Change sentence In other words, the slit 200 extends into the plastic support layer 300 but does not penetrate the plastic support layer 300.
  • the bottom of the slit 200 can be closer to the antenna of the communication device and the like, thereby facilitating signal transmission; on the other hand, the process precision for injection molding, cutting, etc. when processing the slit 200 can be reduced, as long as the narrowness is required
  • the slit 200 can penetrate the outer surface and the inner surface of the metal substrate 100 and realize signal transmission.
  • the plastic support layer 300 may be first disposed on the inner surface of the metal substrate 100, and then the slit 200 penetrating the metal substrate 100 may be formed by cutting, without the need for the bottom of the slit 200. The exact location is precisely defined.
  • the specific thickness of the metal substrate 100, the plastic support layer 300, and the decorative layer 400 is not particularly limited, and those skilled in the art can set the specific thickness of the above position according to actual needs and the specific structure of the communication device.
  • the thickness of the plastic support layer 300 may be a conventional thickness in the art, for example, may be 1-2 mm, preferably 1.2-1.8 mm.
  • the thickness of the metal substrate 100 is not particularly limited, and those skilled in the art can appropriately select according to a specific communication device.
  • the metal substrate 100 may have a thickness of 0.1 to 0.6 mm, preferably 0.2 to 0.5 mm.
  • the thickness of the decorative layer 400 is not particularly limited and may be a conventional thickness in the art.
  • the decorative layer 400 may have a thickness of 5 to 50 ⁇ m, preferably 10 to 35 ⁇ m.
  • the metal housing of the communication device includes a metal substrate 100, a slit 200, and a plastic support layer 300 covering at least a portion of the inner surface of the metal substrate 100, wherein the slit 200 penetrates the metal substrate 100 but The plastic support layer 300 is not penetrated, and the cross-sectional shape of the portion of the slit 200 located in the plastic support layer 300 is one or more of an inverted cone shape, an arc shape, a rectangular shape, and an inverted trapezoid shape.
  • the invention provides a method of making a metal casing for a communication device. According to an embodiment of the invention, the method comprises:
  • a plastic support layer is provided on the inner surface of the metal substrate.
  • the metal substrate can be supported by the plastic support layer, thereby preventing the metal substrate or the slit from being deformed due to the thinness of the metal material during the subsequent formation of the slit.
  • the resin may be injection molded on at least a portion of the inner surface of the metal substrate to form a plastic support layer.
  • the resin is injection molded over the entire inner surface of the metal substrate such that the formed plastic support layer covers the entire inner surface of the metal substrate.
  • the conditions of the injection molding resin can be the conditions of conventional injection molding.
  • the conditions of injection molding may include: mold temperature 50-300 degrees Celsius, nozzle temperature 200-450 degrees Celsius, holding time 1-50s, injection pressure 50-300MPa, injection time 1-30s, delay time 1-30s, cooling time 1 -60s.
  • the injection molding conditions include: mold temperature 80-280 degrees Celsius, nozzle temperature 230-400 degrees Celsius, dwell time 5-30s, injection pressure 70-260MPa, injection time 3-20s, delay time 3-20s, cooling Time 5-40s.
  • the material used in the above injection molding may be a resin conventionally used in the art, and may be, for example, selected from the group consisting of polyethylene, polypropylene, polyacetal, polystyrene, modified polyphenylene ether, and polyethylene terephthalate. Ester, polybutylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamideimide, polyetherimide, polysulfone, polyethersulfone, One or more of polyether ketone, polyether ether magnesium, polycarbonate, polyamide, and acrylonitrile-butadiene-styrene copolymer.
  • the material used in the injection molding may be a mixture of a resin and a glass fiber. More preferably, in the above mixture, the resin is selected from the group consisting of polyphenylene sulfide, polycarbonate, and polyamide; and the glass fiber is contained in an amount of 1 to 50 by weight based on the weight of the mixture. %.
  • the thickness of the metal substrate and the thickness of the plastic support layer are not particularly limited, and those skilled in the art can appropriately select according to a specific communication device.
  • the thickness of the metal substrate may be from 0.1 to 0.6 mm, preferably from 0.2 to 0.5 mm; the thickness of the plastic support layer may be from 1 to 2 mm, preferably from 1.2 to 1.8 mm.
  • a slit is formed in the metal substrate, and the slit penetrates the outer and inner surfaces of the metal substrate to obtain the metal casing of the communication device.
  • the slit can be formed on the premise that the plastic support layer is provided, and it is possible to prevent the metal substrate or the slit from being deformed due to the too thin metal material in the process of forming the slit.
  • a slit is formed in a region of the metal substrate on which the plastic support layer is formed, and the slit penetrates the metal substrate and does not penetrate the plastic support layer.
  • the region corresponding to the plastic support layer forms a slit.
  • a plurality of slits may be formed in the metal substrate to satisfy the requirements of the metal casing for signal transmission. For example, it is necessary to form more than one slit on the metal substrate of the metal casing. The above slit can effectively ensure the signal transmission between the antenna and the outside world, and realize communication.
  • more than one slit is formed in the region of the metal substrate on which the plastic support layer is formed, the slit penetrating through the metal substrate and not penetrating the plastic support layer.
  • a longitudinal section selected from at least one of an inverted cone (shown in FIG. 2), an arc (shown in FIG. 3), a rectangle (shown in FIG. 4), and an inverted trapezoid (shown in FIG. 5).
  • the slit width may be from 5 to 500 ⁇ m, preferably from 10 to 50 ⁇ m, more preferably from 25 to 50 ⁇ m.
  • the slit length is from 10 to 70 mm, more preferably from 20 to 30 mm; the spacing between adjacent two slits may be from 0.3 to 1.6 mm, preferably from 0.5 to 1.2 mm.
  • the number of slits is not particularly limited as long as it can be The communication can be performed, for example, it can be 1-200, preferably 5-50.
  • the line shape constituting the slit may be a straight line, a curved line, a square wave line shape or a zigzag line shape, and is preferably a straight line shape.
  • the slit can be formed by cutting on a metal substrate; the cutting method is not particularly limited as long as the slit formed penetrates the metal substrate and does not penetrate the plastic support layer.
  • the cutting method may be selected from one of laser cutting, electron beam cutting, water cutting, and wire cutting.
  • the specific operations and conditions can be selected according to actual conditions.
  • the laser cutting conditions are: power of 2-150 W, cutting speed of 20-3000 mm/s, laser frequency of 20-80 kHz, and output wavelength of 1064 nm.
  • the slit width formed by the above laser cutting method is usually from 10 to 200 ⁇ m.
  • the electron beam cutting method may be carried out under the conditions of a vacuum of 10 -3 -10 -4 Pa, at a current of 3 - 9 mA, and a power density of 10 7 W/cm 2 .
  • the slit width formed by the above electron beam cutting method is usually from 5 to 100 ⁇ m.
  • the method may further include:
  • a decorative layer may be provided on the outer surface of the metal substrate.
  • the specific position of the decorative layer and the relative positional relationship between the decorative layer and the slit have been described in detail above and will not be described herein.
  • the decorative layer can be provided by conventional methods and conditions in the art, for example, the decorative layer can be formed by one or more of electrophoresis, micro-arc oxidation, anodization, hard anode, and spray coating. It should be noted that the thickness of the decorative layer may vary within a wide range. Preferably, the decorative layer may have a thickness of 5 to 50 ⁇ m, more preferably 10 to 35 ⁇ m.
  • the decorative layer may be an existing decorative layer of various electronic product casings, for example, one of an aluminum oxide layer, an epoxy resin coating, and an acrylic resin coating.
  • the decorative layer may be formed by an anodizing method
  • the anodizing condition may be a condition known in the art, for example, sulfuric acid having a concentration of 150-210 g/L may be used as a bath, and the voltage is 10-15 V.
  • the current density is 1-2A/dm 2
  • the temperature is 10-22 degrees Celsius
  • the anodizing time is 20-60min
  • the sealing liquid concentration is 1-10g/L
  • the sealing temperature is 50-95 degrees Celsius
  • the sealing time is It is 10-50min.
  • the thickness of the decorative layer formed by the above anodizing method is usually 10 to 30 ⁇ m.
  • the decorative layer may be formed by a micro-arc oxidation method, and the micro-arc oxidation conditions may be under conditions known in the art, for example, a pH of 6-12, a voltage of 0-800 V, and a current density of 1-10 A/dm 2 .
  • the temperature is 15-60 degrees Celsius
  • the time is 10-60 minutes
  • the sealing liquid is water
  • the sealing temperature is 70-90 degrees Celsius
  • the sealing time is 1-10 minutes.
  • the thickness of the decorative layer formed by the above micro-arc oxidation method is usually from 10 to 50 ⁇ m.
  • the decorative layer is formed by electrophoresis
  • the electrophoresis conditions may be conditions well known in the art, for example, cathodic electrophoresis: voltage is 20-60 V, pH is 4-6, temperature is 15-30 degrees Celsius, and time is 20-60 s; Anodic electrophoresis: voltage is 40-100V, pH is 6-8, temperature is 15-30 degrees Celsius, time is 40-180s; baking temperature is 120-200 degrees Celsius, baking time is 30-60min.
  • the thickness of the decorative layer formed by the above electrophoresis method is usually 5 to 50 ⁇ m.
  • the slit formed by the slit processing method is a slit penetrating the metal substrate and not penetrating the plastic support layer.
  • the cross-sectional shape of the portion of the slit located in the plastic support layer is inversely tapered. One or more of an arc, a rectangle, and an inverted trapezoid.
  • Aluminum alloy (purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.6mm) was cut into a metal substrate of 15mm x 80mm.
  • the above metal substrate was degreased and washed to remove surface stains and oil stains, and then dried at 80 degrees Celsius for 20 minutes to obtain a metal substrate A11 after washing and drying.
  • the above metal substrate A11 was placed in a mold, and the inner surface of the metal substrate A11 was injection molded using a polyphenylene sulfide resin.
  • the injection molding conditions are: mold temperature 280 ° C, nozzle temperature 400 ° C, holding time 30 s, injection pressure 260 MPa, injection time 20 s, delay time 20 s, cooling time 40 s, forming a plastic support layer (thickness 2.0 mm), thus The metal casing A12 of the injection support layer is injection molded.
  • the metal casing A12 with an injection-molded support layer includes a metal substrate 1 and a plastic support layer 2.
  • the laser drilling machine (model LSF20 laser drilling machine produced by Huagong Laser) performs slit processing on the metal substrate (in which the slit is 6 and the shape is linear), the slit width is 50 ⁇ m, and the slit The length is 30mm and the spacing between adjacent slits is 1.2mm.
  • the laser processing power is 150W, the speed is 3000mm/s, the frequency is 80kHz, the wavelength is 1064nm, the metal substrate is completely penetrated, the plastic support layer is not transparent, and the slit is connected to the metal casing A13 (where the slit
  • the cross-sectional shape of the portion of the plastic support layer is an inverted cone, and the depth h of the plastic support layer is 0.6 mm). Among them, the slit is not deformed during the slit processing.
  • the metal casing A13 is subjected to alkali etching, water washing, pickling, and water washing treatment, and then immersed in an electrolytic bath containing an aqueous solution of H 2 SO 4 having a concentration of 210 g/L, using a metal casing A13 as an anode and a stainless steel plate as a cathode.
  • the voltage is 15V
  • the current density is 2A/dm 2
  • the temperature is 22 degrees Celsius.
  • the anode is anodized for 60min. After the anodization is completed, it is taken out and ultrasonically cleaned to avoid the subsequent acidation in the slit. At this point, the slit is completely covered by the decorative layer and is invisible to the naked eye.
  • the anodized metal shell A13 was immersed in an acid dye solution (purchased from Okuno Industry Co., Ltd., dye type TAC BLACK-SLH) for 10 min, and the acid dye solution concentration was 5 g/L, and the pH was 5.5.
  • the temperature of the dye solution is 50 degrees Celsius, and after removal, it is taken out and cleaned.
  • the structure of the metal casing of the communication device obtained as described above is as shown in FIG. 2.
  • the metal substrate has a plurality of slits, and a portion of the slit in the plastic support layer has an inverted tapered shape; the plastic support layer is fixed on the inner surface of the metal substrate, and a decorative layer is attached to the outer surface of the metal substrate.
  • the decorative layer has no grooves and irregularities, the surface is flat, and the decorative layer partially protrudes into the slit.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.6mm was cut into a metal substrate of 15mm x 80mm.
  • the metal substrate was degreased and washed with water to remove surface stains and oil stains, and then dried at 80 degrees Celsius for 20 minutes to obtain a metal substrate A21 after washing and drying.
  • the above metal substrate A21 was placed in a mold, and the inner surface of the metal substrate A21 was injection molded using a polyphenylene sulfide resin.
  • the injection molding conditions are: mold temperature 80 ° C, nozzle temperature 230 ° C, holding time 5 s, injection pressure 70 MPa, injection time 3 s, delay time 3 s, cooling time 5 s, forming a plastic support layer (thickness 1 mm), thus obtaining injection molding
  • the metal casing A22 of the support layer are: mold temperature 80 ° C, nozzle temperature 230 ° C, holding time 5 s, injection pressure 70 MPa, injection time 3 s, delay time 3 s, cooling time 5 s, forming a plastic support layer (thickness 1 mm), thus obtaining injection molding
  • the metal casing A22 of the support layer are: mold temperature 80 ° C, nozzle temperature 230 ° C, holding time 5 s, injection pressure 70 MPa, injection time 3 s, delay time 3 s, cooling time 5 s
  • the laser drilling machine (model LSF20 laser drilling machine produced by Huagong Laser) performs slit processing on the metal substrate (in which the slit is 6 and the shape is linear), the slit width is 25 ⁇ m, and the slit The length is 20 mm and the spacing between adjacent slits is 0.5 mm.
  • the laser processing power is 2W, the speed is 20mm/s, the frequency is 20kHz, the wavelength is 1064nm, the metal substrate is completely penetrated, the plastic support layer is not transparent, and the slit is connected to the metal casing A23 (where the slit The cross-sectional shape of the portion of the plastic support layer is curved, and the depth of the portion is 0.2 mm). Among them, the slit is not deformed during the slit processing.
  • the metal casing A23 is subjected to alkali etching, water washing, pickling, and water washing, and then immersed in an electrolytic bath containing a 150 g/L aqueous solution of H 2 SO 4 , using a metal casing A23 as an anode and a stainless steel plate as a cathode.
  • the voltage is 10V
  • the current density is 1A/dm 2
  • the temperature is 10 degrees Celsius for anodization for 20min.
  • the anodization is completed, it is taken out and ultrasonically cleaned to avoid the subsequent acidation in the slit. At this point, the slit is completely covered by the decorative layer and is invisible to the naked eye.
  • the anodized metal shell A23 was immersed in an acid dye solution (purchased from Okuno Industry Co., Ltd., dye type TAC BLACK-SLH) for 10 min, and the acid dye solution concentration was 5 g/L, and the pH was 5.5.
  • the temperature of the dye solution is 50 degrees Celsius, and after removal, it is taken out and cleaned.
  • the structure of the metal casing of the communication device prepared above is shown in FIG.
  • the metal substrate has a plurality of slits, and a portion of the slit in the plastic support layer has an arc shape; the plastic support layer is fixed on the inner surface of the metal substrate, and a decorative layer is attached to the outer surface of the metal substrate.
  • the decorative layer has no grooves and irregularities, the surface is flat, and the decorative layer partially protrudes into the slit.
  • Aluminum alloy (purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.6mm) was cut into a metal substrate of 15mm x 80mm.
  • the metal substrate was degreased and washed with water to remove surface stains and oil stains, and then dried at 80 degrees Celsius for 20 minutes to obtain a metal substrate A31 after washing and drying.
  • the above metal substrate A31 was placed in a mold, and the inner surface of the metal substrate A31 was injection molded using a polyphenylene sulfide resin.
  • the injection molding conditions are: mold temperature 100 ° C, nozzle temperature 280 ° C, holding time 15 s, injection pressure 140 MPa, injection time 10 s, delay time 10 s, cooling time 15 s, forming a plastic support layer (thickness 1.2 mm), thus The metal casing A32 of the injection support layer is injection molded.
  • the laser drilling machine (model LSF20 laser drilling machine manufactured by Huagong Laser) performs slit processing on the metal substrate (in which the slit is 6 and the shape is linear), the slit width is 30 ⁇ m, and the slit The length is 25 mm and the spacing between adjacent slits is 0.6 mm.
  • the laser processing power is 8W, the speed is 60mm/s, the frequency is 60kHz, the wavelength is 1064nm, the metal substrate is completely penetrated, the plastic support layer is not transparent, and the slit is connected to the metal casing A33 (where the slit
  • the portion of the plastic support layer has a rectangular cross section with a depth of 0.4 mm. Among them, the slit is not deformed during the slit processing.
  • the metal casing A33 is subjected to alkali etching, water washing, pickling, water washing treatment, and then immersed in an electrolytic bath containing a H 2 SO 4 aqueous solution having a concentration of 180 g/L, using a metal casing A33 as an anode and a stainless steel plate as a cathode.
  • the voltage was 14V
  • the current density was 1.5A/dm 2
  • the temperature was 19 ° C.
  • the anode was anodized for 40 min. After the anodization was completed, it was taken out and ultrasonically cleaned to avoid the subsequent acidation in the slit. At this point, the slit is completely covered by the decorative layer and is invisible to the naked eye.
  • the anodized metal shell A33 was immersed in an acid dye solution (purchased from Okuno Industry Co., Ltd., dye type TAC BLACK-SLH) for 10 min, and the acid dye solution concentration was 5 g/L, and the pH was 5.5.
  • the temperature of the dye solution is 50 degrees Celsius, and after removal, it is taken out and cleaned.
  • the structure of the metal casing of the communication device obtained as described above is as shown in FIG.
  • the metal substrate has a plurality of slits, and a portion of the slit in the plastic support layer has a rectangular cross section; the plastic support layer is fixed on the inner surface of the metal substrate, and the outer surface of the metal substrate is decorated with a decorative layer.
  • the layer has no grooves and irregularities, the surface is flat, and the decorative layer partially protrudes into the slit.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.6mm was cut into a metal substrate of 15mm x 80mm.
  • the metal substrate was degreased and washed with water to remove surface stains and oil stains, and then dried at 80 degrees Celsius for 20 minutes to obtain a metal substrate A41 after washing and drying.
  • the above metal substrate A41 was placed in a mold, and the inner surface of the metal substrate A41 was injection molded using a polyphenylene sulfide resin.
  • the injection molding conditions are: mold temperature 80 ° C, nozzle temperature 250 ° C, holding time 20 s, injection pressure 140 MPa, injection time 2 s, delay time 2 s, cooling time 10 s, forming a plastic support layer (thickness 1.0 mm), thus The metal casing A42 of the support layer is injection molded.
  • the laser drilling machine (model LSF20 laser drilling machine produced by Huagong Laser) performs slit processing on the metal substrate (the slit is 9 and the shape is linear), and the slit width is 20 ⁇ m. The length is 25 mm and the spacing between adjacent slits is 0.6 mm.
  • the laser processing power is 5W, the speed is 20mm/s, the frequency is 20kHz, the wavelength is 1064nm, the metal substrate is completely penetrated, and the plastic support layer is not transparent.
  • the metal casing A43 with slit is provided (where the slit is located in the plastic)
  • the cross-sectional shape of the portion of the support layer is an inverted trapezoid having a depth of 0.5 mm). Among them, the slit is not deformed during the slit processing.
  • the metal casing A43 was subjected to alkali etching, water washing, pickling, and water washing treatment, and then an electrophoretic paint (available as an acrylic resin (purchased from Shimizu Corporation) was dissolved in water as a cathode, and the content of acrylic acid was 10% by weight.
  • an electrophoretic paint available as an acrylic resin (purchased from Shimizu Corporation) was dissolved in water as a cathode, and the content of acrylic acid was 10% by weight.
  • the cathode electrophoretic paint pH 4.5 the temperature is 23 degrees Celsius, the voltage is 35V, electrophoresis for 120s, the surface forms an electrophoretic coating.
  • the substrate was immersed in clean water for 120 s to remove the residual liquid on the surface of the coating.
  • a metal casing after electrophoretic coating is obtained. At this point, the slit is completely covered by the electrophoretic coating and the surface slit is invisible to the naked eye.
  • the above substrate was placed in an oven at a temperature of 175 ° C for 50 min, and after baking curing, a metal casing A44 of a communication device having a surface smoothing electrophoretic coating having a thickness of 30 ⁇ m was obtained.
  • the structure of the metal casing of the communication device prepared as described above is as shown in FIG.
  • the metal substrate has a plurality of slits, and a portion of the slit in the plastic support layer has an inverted trapezoidal shape; the plastic support layer is fixed on the inner surface of the metal substrate, and a decorative layer is attached to the outer surface of the metal substrate.
  • the decorative layer has no grooves and irregularities, the surface is flat, and the decorative layer partially protrudes into the slit.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.6mm was cut into a metal substrate of 15mm x 80mm.
  • the above metal substrate was degreased and washed to remove surface stains and oil stains, and then dried at 80 degrees Celsius for 20 minutes to obtain a metal substrate A51 after washing and drying.
  • the above metal substrate A51 was placed in a mold, and the inner surface of the metal substrate A51 was injection molded using a polyphenylene sulfide resin.
  • the injection molding conditions are: mold temperature of 90 ° C, nozzle temperature of 280 ° C, holding time of 30 s, injection pressure of 140 MPa, injection time of 5 s, delay time of 5 s, cooling time of 15 s, forming a plastic support layer (thickness of 1.0 mm), thus The metal casing A52 of the support layer is injection molded.
  • the metal casing A52 was placed in a vacuum chamber, evacuated to 10 -3 -10 -4 Pa, and the current was 5 mA.
  • the electron beam was collected by a magnetic focusing system into a 15 ⁇ m diameter spot to achieve a power density of 10 7 W/cm 2 .
  • slits are formed in the metal casing A52 (in which the slits are nine and the shape is a straight shape), the slit width is 15 ⁇ m, the slit length is 25 mm, and the adjacent slit pitch is 0.6 mm, and a metal bottom is obtained.
  • the material is completely penetrated, and the plastic support layer is not transparent, and the communication device metal casing A53 is provided with a slit (wherein the cross section of the slit in the plastic support layer has an inverted cone shape, and the depth of the portion is 0.6 mm). Among them, the slit is not deformed during the slit processing.
  • the metal casing A53 is subjected to alkali etching, water washing, pickling, and water washing treatment, and then an electrophoretic paint (available as an acrylic resin (purchased from Shimizu Corporation) in a colloidal form in water is used as a cathode, and the content of acrylic acid is 10% by weight.
  • an electrophoretic paint available as an acrylic resin (purchased from Shimizu Corporation) in a colloidal form in water is used as a cathode, and the content of acrylic acid is 10% by weight.
  • the cathode electrophoretic paint pH 4.5 the temperature is 23 degrees Celsius, the voltage is 35V, electrophoresis for 120s, the surface forms an electrophoretic coating. Thereafter, the substrate was immersed in clean water for 120 s to remove the residual liquid on the surface of the coating. A metal casing after electrophoretic coating is obtained.
  • the above substrate was placed in an oven at a temperature of 175 ° C for 50 min, and after baking curing, a metal casing A55 of a communication device having a surface smoothing electrophoretic coating having a thickness of 30 ⁇ m was obtained.
  • a plastic support layer is formed on the inner surface of the metal substrate, and the plastic support layer has a good strengthening effect on the metal substrate, especially the metal substrate at the slit, to avoid The slit is deformed during the slit processing and in the surface decoration, so that a decorative layer having a uniform surface on the outer surface of the metal substrate can be formed, and the flatness uniformity and the all-metal texture of the metal casing can be ensured.

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Abstract

提出了一种通讯设备金属外壳。该金属外壳包括：金属底材（100），塑料支撑层（300）和狭缝（200）；所述塑料支撑层（300）设置在所述金属底材（100）的内表面，所述狭缝（200）贯穿所述金属底材（100）的外表面和内表面，狭缝（200）延伸至所述塑料支撑层（300）中但不贯穿所述塑料支撑层（300）；所述狭缝（200）的纵截面为倒锥形、弧形、矩形和倒梯形的至少之一。金属底材（100）外表面可设置装饰层（400）。

Description

通讯设备金属外壳以及其制备方法
优先权信息
本申请请求2014年12月26日向中国国家知识产权局提交的、专利申请号为201410829037.5的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及材料领域，具体地，本发明涉及通讯设备金属外壳以及其制备方法。
背景技术
目前手机、平板电脑、笔记本电脑等的电子通讯设备中，金属外壳由于具有更加美观，更具质感，同时耐磨耐划伤等性能更加优越的特点，已逐渐取代塑料外壳，成为今后的发展趋势。然而由于电磁波不能穿透金属，因此电子通讯设备在设计时只能采用非金属外壳，或采用金属外壳时需要在天线处用非金属材质进行隔断。因此，在采用金属外壳时，通常采用在金属外壳与设备内部的天线所对应的部位上设置狭缝，以便确保天线能正常工作。
然而，在金属外壳上设置狭缝时，常常因为外壳的厚度较薄，造成加工狭缝后金属壳体强度变差。因此，在对外壳进行再注塑时，极易出现外壳变形的情况。此外，为了保证底部塑胶支撑件与外壳之间有足够的结合强度，在注塑前常常需要增加加强筋处理，并且注塑时的注塑工艺参数需要精确控制，对注塑机台和注塑工艺的要求均较高。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明的一个目的在于提出一种通讯设备金属外壳。本发明提供的通讯设备金属外壳的狭缝或狭缝处金属底材无变形，或在外观上具有平整一致性。
在本发明的一个方面，本发明提出了一种通讯设备金属外壳。根据本发明的实施例，该金属外壳包括：
金属底材；
塑料支撑层，所述塑料支撑层设置在所述金属底材的内表面；以及
狭缝，所述狭缝贯穿所述金属底材的外表面和内表面，狭缝延伸至所述塑料支撑层中但不贯穿所述塑料支撑层；所述狭缝的纵截面为倒锥形、弧形、矩形和倒梯形的至少之一。
发明人经过深入的研究发现，在加工通讯设备金属外壳时，若先在金属底材上设置 狭缝，再进行注塑加工，由于狭缝所在部位的金属底材很薄，易发生变形。即使加工狭缝时金属底材无变形，但在后续进行注塑时，注塑产生的推力也极易使金属底材在狭缝处发生变形。为了克服上述问题，本发明通过在金属底材内表面设置塑料支撑层，在形成有所述塑料支撑层的金属底材上设置狭缝，并使所述狭缝贯穿所述金属底材但不贯穿所述塑料支撑层。由此，能够在狭缝加工过程中防止狭缝发生变形，同时上述过程形成的狭缝可供通讯讯号穿过，进而实现通讯设备正常的通讯功能。而塑料支撑层可以为金属底材提供支撑，进而可以防止金属外壳发生变形。
换句话说，上述通讯设备金属外壳包括金属底材、狭缝以及覆盖所述金属底材内表面的至少一部分的塑料支撑层，其中，所述狭缝贯穿所述金属底材不贯穿所述塑料支撑层，且所述狭缝位于所述塑料支撑层的部分的截面形状为倒锥形、弧形、矩形和倒梯形中的一种或多种。
在本发明的另一方面，本发明提出了一种制备通讯设备金属外壳的方法。根据本发明的实施例，该方法包括：(1)在金属底材的内表面设置塑料支撑层；以及(2)在所述金属底材中形成狭缝，所述狭缝贯穿所述金属底材的外表面和内表面，以便获得所述通讯设备金属外壳。由此，可以由塑料支撑层为金属底材提供支撑，进而能够在狭缝加工过程中防止狭缝以及狭缝周围的金属底材发生变形。
换句话说，上述方法包括：1)在金属底材内表面的至少一部分上注塑树脂，形成塑料支撑层；2)在形成有所述塑料支撑层的金属底材区域内形成一条以上的狭缝，所述狭缝贯穿所述金属底材且不贯穿所述塑料支撑层。通过本发明的方法得到的通讯设备金属外壳具有狭缝，可供通讯信号穿过，实现正常的通讯功能。金属底材内表面的塑料支撑层对金属底材，尤其是狭缝处的金属底材能够起到良好的加强支撑作用，避免金属底材发生变形。另外，通过在金属底材外表面设置装饰层，即可对金属底材起到良好的装饰和保护作用，又不会影响通讯信号的正常传输。同时，与之前先加工狭缝后注塑的加工方式相比，采用先注塑设置塑料支撑层，后加工狭缝的加工方式可使注塑前不需要增加加强筋处理，注塑参数不需精确要求，用普通注塑方式即能够加工。此外，因为加工狭缝前已有塑料支撑层支撑，故可减少加工狭缝后注塑时产生的素材变形情况，提高外壳加工强度。
附图说明
图1显示了根据本发明一个实施例的通讯设备金属外壳的结构示意图；
图2显示了根据本发明另一个实施例的通讯设备金属外壳的结构示意图；
图3显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图；
图4显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图；
图5显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图；
图6显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图；
图7显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图；以及
图8显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图。
附图标记说明：
100：金属底材
200：狭缝
300：塑料支撑层
400：装饰层
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
需要说明的是，在本发明的各个方面中所描述的特征和效果可以互相适用，在此不再赘述。
在本发明的一个方面，本发明提出了一种金属外壳。根据本发明的实施例，该金属外壳包括：金属底材100、狭缝200以及塑料支撑层300。具体地，参考图1，狭缝200贯穿金属底材100的外表面和内表面，塑料支撑层300设置在金属底材100的内表面。由此，可以由塑料支撑层300为根据本发明实施例的金属外壳提供良好的支撑，进而可以防止金属底材100以及狭缝200在金属外壳制备以及后续使用的过程中发生变形。
需要说明的是，在本发明中，通讯设备可以为：手机、平板电脑、笔记本电脑、蓝牙耳机等，通讯设备的具体类型并不受特别限制。在本发明中，金属外壳的“外表面”定义为将其用于通讯设备中时，金属外壳朝向外界的表面，金属外壳的“内表面”为将其用于通讯设备中时，金属外壳朝向通讯设备内部的表面。另外，用于制备金属外壳的金属底材的内外表面也适用于上述定义，即金属底材朝向通讯设备内部的表面为金属底材的内表面，远离通讯设备内部、朝向外界的表面为金属底材的外表面。
下面参考图1～图8对该金属外壳的具体结构进行详细描述。
根据本发明的实施例，在本发明中，狭缝200用于保证天线与外界的信号传输，实现通讯。因此，根据本发明的实施例，参考图2，该金属外壳可以具有多条狭缝。本领域技术人员可以根据实际应用中通讯设备中该金属外壳的具体位置以及需要穿过狭缝200的通讯信号的具体类型，对狭缝的具体数目进行选择，以便提高通讯信号通过狭缝传输的通过率，进而可以使具有该金属外壳的通讯设备信号传输更加通畅。参考图2～5，狭缝200可以具有选自倒锥形(图2所示)、弧形(图3所示)、矩形(图4所示)和倒梯形(图5所示)至少之一的纵截面。需要说明的是，本文中的术语“纵截面”表示沿垂直于该金属外壳所在平面的方向上的截面。狭缝200的纵截面即沿垂直于该金属底材100内表面或者外表面的方向，对该金属外壳具有狭缝200的部位进行切割，所获得的狭缝200在切割出的平面内所具有的形状，上述形状可以为倒锥形、弧形、矩形和倒梯形之中的一种或多种。构成狭缝200的线形可以为直线形、曲线形、方波线形或锯齿线形(图中未示出)，优选为直线形。换句话说，狭缝的形状可以为直线型、曲线形、方波线形或锯齿线形。根据本发明的具体实施例，参考图8，狭缝200的长度L1可以为10-70mm，更优选为20-30mm；狭缝200的宽度L2可以为5-500μm，优选为10-50μm，更优选为25-50μm；相邻两条狭缝之间的间距D可以为0.3-1.6mm，优选为0.5-1.2mm。另外，狭缝200的条数没有特别的限定，只要能够实现通讯即可，例如可以为1-200条，优选为5-50条。能够理解的是，由于狭缝200贯穿地形成在金属底材100中，狭缝200的深度，即由狭缝200外表面上最高点到狭缝200内表面最低点的距离，主要由金属底材100的厚度决定。对于上述狭缝的具体宽度、间距、长度、条数和形状，本领域技术人员可通过实际需要实现的通讯信号类别及频率等条件在上述范围内进行调整，具体调整方法是本领域公知的，在本发明中不再赘述。
根据本发明的实施例，金属外壳金属底材100的材质可以为本领域通常用于通讯设备的各种金属，例如可以为铝合金、不锈钢、镁合金或钛合金等。
根据本发明的实施例，塑料覆盖层300覆盖狭缝200。换句话说，塑料管覆盖层300可以不覆盖金属底材100的全部内表面，而只形成在具有狭缝200的位置周围。由此，可以利用塑料支撑层300加强狭缝200处金属底材100的支撑强度，进而可以避免由于狭缝200造成的金属底材100易变形的情况。此外，塑料覆盖层300覆盖狭缝200的结构还可以避免狭缝200在加工以及后续使用过程中发生变形，进而可以避免由于狭缝200变形而导致的金属外壳信号传输能力变差。
根据本发明的实施例，优选塑料支撑层300覆盖金属底材100的整个内表面。由此，可以为金属底材100以及狭缝200提供更加有力的支撑。根据本发明的实施例， 形成塑料支撑层300的材料可以为树脂，具体地，可以为聚乙烯、聚丙烯、聚缩醛、聚苯乙烯、改性聚苯醚、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚萘二甲酸乙二醇之、聚苯硫醚、聚酰亚胺、聚酰胺酰亚胺、聚醚酰亚胺、聚砜、聚醚砜、聚醚酮、聚醚醚镁、聚碳酸酯、聚酰胺和丙烯腈-丁二烯-苯乙烯共聚物中的一种或多种。
为了进一步提高得到的金属外壳的力学强度，优选形成塑料支撑层300的材料为树脂与玻璃纤维的混合物。进一步优选地，上述混合物中，树脂选自聚苯硫醚、聚碳酸酯、聚酰胺中的一种，并且基于树脂与玻璃纤维混合物的重量，玻璃纤维的含量可以为1-50重量％。此外，作为塑料支撑层300的形成方法，优选通过在金属底材100的内表面上注塑上述树脂或树脂与玻璃纤维的混合物而形成。由此，可以提高塑料支撑层300自身的材料强度以及韧性，进而可以为金属底材100以及狭缝200提供更加可靠的支撑。
此外，根据本发明的实施例，参考图6，该金属外壳还可以进一步具有装饰层400。根据本发明的实施例，装饰层400设置在金属底材100的外表面并覆盖狭缝200。换句话说，该通讯设备金属外壳还包括位于金属底材外表面的装饰层，该装饰层覆盖狭缝。一方面，装饰层400可以将贯穿金属底材100外表面以及内表面的狭缝200覆盖起来，从而可以使该金属外壳更加美观；另一方面，装饰层400还可以在金属底材100的外表面为金属底材100以及狭缝200提供额外的支撑以及保护。上述装饰层400可以通过电泳、微弧氧化、阳极氧化、硬质阳极和喷涂中的一种或多种方法形成，并且形成装饰层400的材料不受特别限定。本领域技术人员可以根据实际情况，对形成装饰层400的方法进行选择。
另外，根据本发明的实施例，参考图7，在优选的情况下，装饰层400的一部分可以伸入狭缝200中。由此，可以利用装饰层400更好地覆盖狭缝200，并且能够提高装饰层400与狭缝200以及金属底材100之间结合的牢固程度。此外，具有该优选结构的金属外壳还可以降低设置装饰层400时所使用的仪器的精度要求，即在设置装饰层400时，不需要对狭缝200处进行额外保护以防止形成装饰层400的材料进入狭缝200中，只需要控制形成装饰层400的材料不要将狭缝200填满即可。
此外，为了进一步提高该金属外壳的机械强度以及信号传输能力，并简化制备该金属外壳的生产程序、降低对注塑、切割等设备的要求，参考图6，该金属外壳还可以具有以下结构：狭缝200可以延伸至塑料支撑层300中。根据本发明的具体实施例，优选狭缝200位于塑料支撑层300中部分的深度为1mm以下，即狭缝200在塑料支撑层300中的深度h不超过1mm。更优选地，深度h可以为0.2-0.6mm。换句 话说，狭缝200伸入塑料支撑层300之中，但不贯穿塑料支撑层300。由此，一方面可以使狭缝200的底部更加接近通讯设备的天线等部件，进而有利于信号传输；另一方面，可以降低加工狭缝200时对于注塑、切割等工艺精度的要求，只要狭缝200能够贯穿金属底材100的外表面以及内表面，并实现信号的传输即可。在制备该金属外壳的过程中，可以首先在金属底材100的内表面设置塑料支撑层300，然后利用切割的方式，形成贯穿金属底材100的狭缝200，而不需要对狭缝200底部的具体位置进行精确的限定。
此外，金属底材100、塑料支撑层300以及装饰层400的具体厚度不受特别限定，本领域技术人员可以根据实际需求以及通讯设备的具体结构，对上述位置的具体厚度进行设置。根据本发明的实施例，塑料支撑层300的厚度可以本领域的常规厚度，例如可以为1-2mm，优选为1.2-1.8mm。金属底材100的厚度没有特别的限定，本领域技术人员可以根据具体的通讯设备适当地进行选择。例如金属底材100的厚度可以为0.1-0.6mm，优选为0.2-0.5mm。根据本发明的实施例，装饰层400的厚度不受特别限定，可以为本领域的常规厚度。例如装饰层400的厚度可以为5-50μm，优选为10-35μm。
综上所述，本发明提供的通讯设备金属外壳包括金属底材100、狭缝200以及覆盖金属底材100内表面的至少一部分的塑料支撑层300，其中，狭缝200贯穿金属底材100但不贯穿塑料支撑层300，且狭缝200位于塑料支撑层300的部分的截面形状为倒锥形、弧形、矩形和倒梯形中的一种或多种。由此，可以避免金属底材100以及狭缝200发生变形，并且上述金属壳体有利于通讯设备的通讯信号传输。
在本发明的另一方面，本发明提出了一种通讯设备金属外壳的制备方法。根据本发明的实施例，该方法包括：
(1)设置塑料支撑层
根据本发明的实施例，在该步骤中，在金属底材的内表面设置塑料支撑层。由此，可以通过塑料支撑层，为该金属底材提供支撑，进而可以防止在后续形成狭缝的过程中金属底材或者狭缝由于金属材料过薄而发生变形。
具体地，可以在金属底材内表面的至少一部分上注塑树脂，形成塑料支撑层。优选地，在金属底材的整个内表面上注塑树脂，使形成的塑料支撑层覆盖整个金属底材的内表面。
根据本发明的实施例，注塑树脂的条件可采用常规的注塑成型的条件。例如，注塑的条件可以包括：模温50-300摄氏度，喷嘴温度200-450摄氏度，保压时间1-50s，射出压力50-300MPa，射出时间1-30s，延迟时间1-30s，冷却时间1-60s。优选的情 况下，所述注塑的条件包括：模温80-280摄氏度，喷嘴温度230-400摄氏度，保压时间5-30s，射出压力70-260MPa，射出时间3-20s，延迟时间3-20s，冷却时间5-40s。由此，可以使利用上述注塑条件制备的塑料支撑层更好地成型。
此外，上述注塑时采用的材料可以为本领域常规使用的树脂，例如可以为选自聚乙烯、聚丙烯、聚缩醛、聚苯乙烯、改性聚苯醚、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚萘二甲酸乙二醇之、聚苯硫醚、聚酰亚胺、聚酰胺酰亚胺、聚醚酰亚胺、聚砜、聚醚砜、聚醚酮、聚醚醚镁、聚碳酸酯、聚酰胺和丙烯腈-丁二烯-苯乙烯共聚物中的一种或多种。
为了进一步提高得到的金属外壳的力学强度，优选情况下，注塑时采用的材料可以为树脂与玻璃纤维的混合物。更优选情况下，上述混合物中，所述树脂选自聚苯硫醚、聚碳酸酯、聚酰胺中的一种；以所述混合物的重量为基准，所述玻璃纤维的含量为1-50重量％。
根据本发明的实施例，金属底材的厚度以及塑料支撑层的厚度没有特别的限定，本领域技术人员可以根据具体的通讯设备适当地进行选择。例如，金属底材的厚度可以为0.1-0.6mm，优选为0.2-0.5mm；塑料支撑层的厚度可以为1-2mm，优选为1.2-1.8mm。
(2)设置狭缝
根据本发明的实施例，在该步骤中，在金属底材中形成狭缝，并且该狭缝贯穿金属底材的外表面和内表面，以便获得该通讯设备金属外壳。由此，可以在有塑料支撑层的前提下形成狭缝，进而可以避免在形成狭缝的过程中金属底材或者狭缝由于金属材料过薄而发生变形。
具体地，根据本发明的实施例，在该步骤中，在形成有塑料支撑层的金属底材区域内，形成狭缝，并且该狭缝贯穿金属底材且不贯穿塑料支撑层。换句话说，即在金属底材中，与塑料支撑层对应的区域形成狭缝。根据本发明的实施例，可以在金属底材中形成多条狭缝，以便满足信号传输对该金属外壳的要求。例如，需要在金属外壳的金属底材上形成一条以上的狭缝。上述狭缝可有效的保证天线与外界的信号传输，实现通讯。换句话说，在形成有塑料支撑层的金属底材区域内形成一条以上的狭缝，狭缝贯穿金属底材且不贯穿塑料支撑层。对于上述狭缝，可以具有选自倒锥形(图2所示)、弧形(图3所示)、矩形(图4所示)和倒梯形(图5所示)至少之一的纵截面，狭缝宽度可以为5-500μm，优选为10-50μm，更优选为25-50μm。优选地，狭缝长度为10-70mm，更优选为20-30mm；相邻两条狭缝之间的间距可以为0.3-1.6mm，优选为0.5-1.2mm。另外，狭缝的条数没有特别的限定，只要能够实 现通讯即可，例如可以为1-200条，优选为5-50条。此外，构成狭缝的线形可以为直线形、曲线形、方波线形或锯齿线形，优选为直线形。对于上述狭缝的具体宽度、间距、长度、条数和形状，本领域技术人员可通过实际需要实现的通讯信号类别及频率等条件在上述范围内进行调整，而具体调整方法本领域技术人员可以根据实际需求进行选择，在本发明中不再赘述。
在本发明中，可以通过在金属底材上进行切割，形成狭缝；切割方法没有特别的限定，只要形成的狭缝贯穿金属底材且不贯穿塑料支撑层即可。例如，根据本发明的实施例，切割方法可以选自激光切割、电子束切割、水切割和线切割中的一种。
采用上述各种方法进行切割时，其具体操作和条件可以根据实际情况进行选择。例如，根据本发明的实施例，激光切割条件为：功率为2-150W，切割速度为20-3000mm/s，激光频率为20-80kHz，输出波长为1064nm。通过上述激光切割的方法形成的狭缝宽度通常在10-200μm。
电子束切割方法的条件可以为：在真空度为10-3-10-4Pa的环境中，在电流为3-9mA，功率密度为107W/cm2的条件下进行切割。通过上述电子束切割的方法形成的狭缝宽度通常在5-100μm。
此外，为了提高利用该方法制备的金属外壳的美观程度，并加强对于金属底材以及狭缝的支撑、保护程度，该方法还可以进一步包括：
(3)设置装饰层
根据本发明的实施例，在该步骤中，可以在金属底材的外表面设置装饰层。关于装饰层的具体位置以及装饰层与狭缝之间的相对位置关系，前面已经进行了详细的描述，在此不在赘述。根据本发明的实施例，为了提高金属外壳的美观程度，优选在金属底材的外表面形成装饰层。由此，可以提高利用该方法制备的金属外壳的美观程度，并加强对于金属底材以及狭缝的支撑、保护程度。
具体地，装饰层可以采用本领域的常规方法和条件设置，例如可以通过电泳、微弧氧化、阳极氧化、硬质阳极和喷涂中的一种或多种形成装饰层。需要说明的是，上述装饰层的厚度可在较大范围内变动，优选情况下，装饰层的厚度可以为5-50μm，更优选为10-35μm。装饰层可以为现有的各种电子产品外壳装饰层，例如可以为氧化铝层、环氧树脂涂层、丙烯酸树脂涂层中的一种。
根据本发明的实施例，可采用阳极氧化方法形成装饰层，阳极氧化条件可以本领域所公知的条件，例如可以为：以浓度为150-210g/L的硫酸作为槽液，电压为10-15V，电流密度为1-2A/dm2，温度为10-22摄氏度，阳极氧化时间为20-60min，封孔槽液浓度为1-10g/L，封孔温度为50-95摄氏度，封孔时间为10-50min。通过上述阳极氧 化方法形成的装饰层厚度通常为10-30μm。
或者，也可通过微弧氧化方法形成装饰层，微弧氧化条件可以本领域所公知的条件，例如可以为：pH为6-12，电压为0-800V，电流密度为1-10A/dm2，温度为15-60摄氏度，时间为10-60min，封孔槽液为水，封孔温度为70-90摄氏度，封孔时间为1-10min。通过上述微弧氧化方法形成的装饰层厚度通常为10-50μm。
或者，通过电泳形成装饰层，电泳条件可以本领域所公知的条件，例如可以为：阴极电泳：电压为20-60V，pH为4-6，温度为15-30摄氏度，时间为20-60s；阳极电泳：电压为40-100V，pH为6-8，温度为15-30摄氏度，时间为40-180s；烘烤温度为120-200摄氏度，烘烤时间为30-60min。通过上述电泳方法形成的装饰层厚度通常为5-50μm。
综上所述，根据本发明的方法，由于是在附着有塑料支撑层的金属底材区域内形成一条以上的狭缝，狭缝贯穿金属底材且不贯穿塑料支撑层。通过将金属底材完全打通，塑料支撑层不通透，可使金属外壳表面的狭缝具有非通透性，从而保证通讯。此外，通过在塑料支撑层的支撑下对金属底材进行狭缝加工，能够防止加工过程中狭缝发生变形。如上所述，通过上述狭缝加工方法，形成的狭缝为贯穿金属底材且不贯穿塑料支撑层的狭缝，具体而言，狭缝位于塑料支撑层的部分的截面形状为倒锥形、弧形、矩形和倒梯形中的一种或多种。
下面通过具体实施例对本发明进行说明，需要说明的是，下面的具体实施例仅仅是用于说明的目的，而不以任何方式限制本发明的范围，另外，如无特殊说明，未具体记载条件或者步骤的方法均为常规方法，所采用的试剂和材料均可从商业途径获得。
实施例1
1)在金属底材的一个表面上进行注塑
将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.6mm)切割为15mm x 80mm的尺寸作为金属底材。对上述金属底材进行除油、水洗处理除去表面污迹和油渍，之后在80摄氏度烘干20min，得到清洗烘干后的金属底材A11。
将上述金属底材A11放入模具中，采用聚苯硫醚树脂对金属底材A11的内表面进行注塑。注塑条件为：模温280摄氏度，喷嘴温度400摄氏度，保压时间30s，射出压力260MPa，射出时间20s，延迟时间20s，冷却时间40s，形成塑料支撑层(厚度为2.0mm)，从而得到带有注塑支撑层的金属外壳A12。
如图1所示，带有注塑支撑层的金属外壳A12包括金属底材1和塑料支撑层2。
2)形成狭缝
采用激光打孔机(华工激光生产的型号为LSF20激光打孔机)在金属底材上进行狭缝加工(其中，狭缝为6条，形状为直线形)，狭缝宽度为50μm，狭缝长度为30mm，相邻狭缝间距为1.2mm。激光加工功率为150W，速度为3000mm/s，频率为80kHz，波长为1064nm，得到金属底材完全打穿，塑料支撑层未通透的开设有狭缝的通讯设备金属外壳A13(其中，狭缝位于塑料支撑层的部分的截面形状为倒锥形，伸入塑料支撑层的深度h为0.6mm)。其中，狭缝加工过程中狭缝未发生变形。
3)采用阳极氧化方法形成表面装饰层。
将上述金属外壳A13进行碱蚀、水洗、酸洗、水洗处理，之后浸入盛有浓度为210g/L的H2SO4水溶液的电解槽中，以金属外壳A13作为阳极，不锈钢板作为阴极，在电压为15V，电流密度为2A/dm2、温度为22摄氏度的条件下阳极氧化60min，完成阳极氧化后取出并超声波清洗干净，避免狭缝内藏酸影响后续着色。此时，狭缝完全被装饰层填充覆盖，肉眼不可见。
将上述经过阳极氧化的金属壳体A13浸入酸性染液(购自奥野制业工业株式会社，染料型号为TAC BLACK-SLH)中染色10min，该酸性染液浓度为5g/L，PH值为5.5，染液的温度为50摄氏度，完成后取出并清洗干净。
然后在封孔剂(NiSO4水溶液，浓度为10g/L)中浸渍50min，温度为95摄氏度，完成封孔后用90摄氏度的纯水清洗干净，并在60摄氏度条件下烘烤15min。得到厚度为30μm的装饰层。最终得到外观上表面平整一致的通讯设备金属外壳A14。
上述制备得到的通讯设备金属外壳的结构如图2所示。金属底材上具有多条狭缝，狭缝位于塑料支撑层的部分的截面形状为倒锥形；塑料支撑层覆盖固定于金属底材的内表面上，金属底材外表面上附着有装饰层，装饰层没有沟槽和凹凸不平，表面平整，且装饰层部分伸入到狭缝中。
实施例2
1)在金属底材的一个表面上进行注塑
将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.6mm)切割为15mm x 80mm的尺寸作为金属底材。对上述金属底材进行除油、水洗处理除去表面污迹和油渍，之后在80摄氏度烘干20min，得到清洗烘干后的金属底材A21。
将上述金属底材A21放入模具中，采用聚苯硫醚树脂对金属底材A21的内表面进行注塑。注塑条件为：模温80摄氏度，喷嘴温度230摄氏度，保压时间5s，射出压力70MPa，射出时间3s，延迟时间3s，冷却时间5s，形成塑料支撑层(厚度为1mm)，从而得到带有注塑支撑层的金属外壳A22。
2)形成狭缝
采用激光打孔机(华工激光生产的型号为LSF20激光打孔机)在金属底材上进行狭缝加工(其中，狭缝为6条，形状为直线形)，狭缝宽度为25μm，狭缝长度为20mm，相邻狭缝间距为0.5mm。激光加工功率为2W，速度为20mm/s，频率为20kHz，波长为1064nm，得到金属底材完全打穿，塑料支撑层未通透的开设有狭缝的通讯设备金属外壳A23(其中，狭缝位于塑料支撑层的部分的截面形状为弧形，该部分的深度为0.2mm)。其中，狭缝加工过程中狭缝未发生变形。
3)采用阳极氧化方法形成表面装饰层。
将上述金属外壳A23进行碱蚀、水洗、酸洗、水洗处理，之后浸入盛有浓度为150g/L的H2SO4水溶液的电解槽中，以金属外壳A23作为阳极，不锈钢板作为阴极，在电压为10V，电流密度为1A/dm2、温度为10摄氏度的条件下阳极氧化20min，完成阳极氧化后取出并超声波清洗干净，避免狭缝内藏酸影响后续着色。此时，狭缝完全被装饰层填充覆盖，肉眼不可见。
将上述经过阳极氧化的金属壳体A23浸入酸性染液(购自奥野制业工业株式会社，染料型号为TAC BLACK-SLH)中染色10min，该酸性染液浓度为5g/L，PH值为5.5，染液的温度为50摄氏度，完成后取出并清洗干净。
然后在封孔剂(NiSO4水溶液，浓度为10g/L)中浸渍10min，温度为50摄氏度，完成封孔后用90摄氏度的纯水清洗干净，并在60摄氏度条件下烘烤15min。得到厚度为10μm的装饰层。最终得到外观上表面平整一致的通讯设备金属外壳A24。
上述制备得到的通讯设备金属外壳的结构如图3所示。金属底材上具有多条狭缝，狭缝位于塑料支撑层的部分的截面形状为弧形；塑料支撑层覆盖固定于金属底材的内表面上，金属底材外表面上附着有装饰层，装饰层没有沟槽和凹凸不平，表面平整，且装饰层部分伸入到狭缝中。
实施例3
1)在金属底材的一个表面上进行注塑
将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.6mm)切割为15mm x 80mm的尺寸作为金属底材。对上述金属底材进行除油、水洗处理除去表面污迹和油渍，之后在80摄氏度烘干20min，得到清洗烘干后的金属底材A31。
将上述金属底材A31放入模具中，采用聚苯硫醚树脂对金属底材A31的内表面进行注塑。注塑条件为：模温100摄氏度，喷嘴温度280摄氏度，保压时间15s，射出压力140MPa，射出时间10s，延迟时间10s，冷却时间15s，形成塑料支撑层(厚度为1.2mm)，从而得到带有注塑支撑层的金属外壳A32。
2)形成狭缝
采用激光打孔机(华工激光生产的型号为LSF20激光打孔机)在金属底材上进行狭缝加工(其中，狭缝为6条，形状为直线形)，狭缝宽度为30μm，狭缝长度为25mm，相邻狭缝间距为0.6mm。激光加工功率为8W，速度为60mm/s，频率为60kHz，波长为1064nm，得到金属底材完全打穿，塑料支撑层未通透的开设有狭缝的通讯设备金属外壳A33(其中，狭缝位于塑料支撑层的部分的截面形状为矩形，该部分的深度为0.4mm)。其中，狭缝加工过程中狭缝未发生变形。
3)采用阳极氧化方法形成表面装饰层。
将上述金属外壳A33进行碱蚀、水洗、酸洗、水洗处理，之后浸入盛有浓度为180g/L的H2SO4水溶液的电解槽中，以金属外壳A33作为阳极，不锈钢板作为阴极，在电压为14V，电流密度为1.5A/dm2、温度为19摄氏度的条件下阳极氧化40min，完成阳极氧化后取出并超声波清洗干净，避免狭缝内藏酸影响后续着色。此时，狭缝完全被装饰层填充覆盖，肉眼不可见。
将上述经过阳极氧化的金属壳体A33浸入酸性染液(购自奥野制业工业株式会社，染料型号为TAC BLACK-SLH)中染色10min，该酸性染液浓度为5g/L，PH值为5.5，染液的温度为50摄氏度，完成后取出并清洗干净。
然后在封孔剂(NiSO4水溶液，浓度为10g/L)中浸渍20min，温度为90摄氏度，完成封孔后用90摄氏度的纯水清洗干净，并在60摄氏度条件下烘烤15min。得到厚度为20μm的装饰层。最终得到外观上表面平整一致的通讯设备金属外壳A34。
上述制备得到的通讯设备金属外壳的结构如图4所示。金属底材上具有多条狭缝，狭缝位于塑料支撑层的部分的截面形状为矩形；塑料支撑层覆盖固定于金属底材的内表面上，金属底材外表面上附着有装饰层，装饰层没有沟槽和凹凸不平，表面平整，且装饰层部分伸入到狭缝中。
实施例4
1)在金属底材的一个表面上进行注塑
将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.6mm)切割为15mm x 80mm的尺寸作为金属底材。对上述金属底材进行除油、水洗处理除去表面污迹和油渍，之后在80摄氏度烘干20min，得到清洗烘干后的金属底材A41。
将上述金属底材A41放入模具中，采用聚苯硫醚树脂对金属底材A41的内表面进行注塑。注塑条件为：模温80摄氏度，喷嘴温度250摄氏度，保压时间20s，射出压力140MPa，射出时间2s，延迟时间2s，冷却时间10s，形成塑料支撑层(厚度为1.0mm)，从而得到带有注塑支撑层的金属外壳A42。
2)形成狭缝
采用激光打孔机(华工激光生产的型号为LSF20激光打孔机)在金属底材上进行狭缝加工(其中，狭缝为9条，形状为直线形)，狭缝宽度为20μm，狭缝长度为25mm，相邻狭缝间距为0.6mm。激光加工功率为5W，速度为20mm/s，频率为20kHz，波长为1064nm，得到金属底材完全打穿，塑料支撑层未通透的开设有狭缝的金属外壳A43(其中，狭缝位于塑料支撑层的部分的截面形状为倒梯形，该部分的深度为0.5mm)。其中，狭缝加工过程中狭缝未发生变形。
3)采用电泳方法形成表面装饰层
将金属外壳A43进行碱蚀、水洗、酸洗和水洗处理，之后作为阴极放入电泳漆(将丙烯酸树脂(购于清水株式会社)以胶体形式溶解在水中而得到，丙烯酸的含量为10重量％)中，在阴极电泳漆pH为4.5，温度为23摄氏度，电压为35V的条件下，电泳120s，表面形成电泳涂层。之后，将上述基材放入清水中浸洗120s，去除涂层表面残液。得到电泳涂装后的金属外壳。此时，狭缝完全被电泳涂层覆盖，表面狭缝肉眼不可见。最后，将上述基材放入温度为175摄氏度的烘箱中，烘烤50min，经过烘烤固化后，得到具有30μm厚度的表面平整的电泳涂层的通讯设备金属外壳A44。
上述制备得到的通讯设备金属外壳的结构如图5所示。金属底材上具有多条狭缝，狭缝位于塑料支撑层的部分的截面形状为倒梯形；塑料支撑层覆盖固定于金属底材的内表面上，金属底材外表面上附着有装饰层，装饰层没有沟槽和凹凸不平，表面平整，且装饰层部分伸入到狭缝中。
实施例5
1)在金属底材的一个表面上进行注塑
将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.6mm)切割为15mm x 80mm的尺寸作为金属底材。对上述金属底材进行除油、水洗处理除去表面污迹和油渍，之后在80摄氏度烘干20min，得到清洗烘干后的金属底材A51。
将上述金属底材A51放入模具中，采用聚苯硫醚树脂对金属底材A51的内表面进行注塑。注塑条件为：模温90摄氏度，喷嘴温度280摄氏度，保压时间30s，射出压力140MPa，射出时间5s，延迟时间5s，冷却时间15s，形成塑料支撑层(厚度为1.0mm)，从而得到带有注塑支撑层的金属外壳A52。
2)形成狭缝
将金属外壳A52放在真空室中，抽真空至10-3-10-4Pa，电流为5mA，通过磁聚集系统将电子束汇聚成直径15um的斑，使功率密度达到107W/cm2后，在该金属外 壳A52上形成狭缝(其中，狭缝为9条，形状为直线形)，狭缝宽度为15μm，狭缝长度为25mm，相邻狭缝间距为0.6mm，得到金属底材完全打穿，塑料支撑层未通透的开设有狭缝的通讯设备金属外壳A53(其中，狭缝位于塑料支撑层的部分的截面形状为倒锥形，该部分的深度为0.6mm)。其中，狭缝加工过程中狭缝未发生变形。
3)采用电泳方法形成表面装饰层
将金属外壳A53进行碱蚀、水洗、酸洗和水洗处理，之后作为阴极放入电泳漆(将丙烯酸树脂(购于清水株式会社)以胶体形式溶解在水中而得到，丙烯酸的含量为10重量％)中，在阴极电泳漆pH为4.5，温度为23摄氏度，电压为35V的条件下，电泳120s，表面形成电泳涂层。之后，将上述基材放入清水中浸洗120s，去除涂层表面残液。得到电泳涂装后的金属外壳。此时，狭缝完全被电泳涂层覆盖，表面狭缝肉眼不可见。最后，将上述基材放入温度为175摄氏度的烘箱中，烘烤50min，经过烘烤固化后，得到具有30μm厚度的表面平整的电泳涂层的通讯设备金属外壳A55。
通过上述实施例可知，通过本发明的方法，在金属底材内表面形成塑料支撑层，该塑料支撑层对金属底材，尤其是狭缝处的金属底材起到良好的加强作用，避免在狭缝加工过程中和表面装饰中狭缝发生变形，从而能够在金属底材外表面形成表面平整一致的装饰层，保证金属外壳外观上的平整一致性和全金属质感。
以上详细描述了本发明的优选实施方式，但是，本发明并不限于上述实施方式中的具体细节，在本发明的技术构思范围内，可以对本发明的技术方案进行多种简单变型，这些简单变型均属于本发明的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合。
此外，本发明的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明的思想，其同样应当视为本发明所公开的内容。
在本发明的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。

Claims (30)

  1. 一种通讯设备金属外壳，其特征在于，包括：
    金属底材，
    塑料支撑层，所述塑料支撑层设置在所述金属底材的内表面；以及
    狭缝，所述狭缝贯穿所述金属底材的外表面和内表面，所述狭缝延伸至所述塑料支撑层中但不贯穿所述塑料支撑层，
    所述狭缝的纵截面为倒锥形、弧形、矩形和倒梯形的至少之一。
  2. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述狭缝在所述塑料支撑层中的深度不超过1毫米。
  3. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述塑料支撑层的厚度为1～2毫米。
  4. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述金属底材的厚度为0.1～0.6毫米。
  5. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述狭缝的宽度为5～500微米。
  6. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述狭缝的长度为10～70毫米。
  7. 根据权利要求1所述的通讯设备金属外壳，其特征在于，包括多条狭缝，其中，相邻两个所述狭缝的间距为0.3～1.6毫米。
  8. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述塑料支撑层完全覆盖所述金属底材的内表面。
  9. 根据权利要求1所述的通讯设备金属外壳，其特征在于，进一步包括装饰层，所述装饰层设置在所述金属底材的外表面并且覆盖所述狭缝。
  10. 根据权利要求9所述的通讯设备金属外壳，其特征在于，所述装饰层的厚度为5～50微米。
  11. 一种制备通讯设备金属外壳的方法，其特征在于，包括：
    (1)在金属底材的内表面设置塑料支撑层；以及
    (2)在所述金属底材中形成狭缝，所述狭缝贯穿所述金属底材的外表面和内表面，以便获得所述通讯设备金属外壳。
  12. 根据权利要求11所述的方法，其特征在于，所述塑料支撑层是通过注塑树 脂形成的。
  13. 根据权利要求12所述的方法，其特征在于，所述注塑的条件包括：模温为50～300摄氏度，喷嘴温度为200～450摄氏度，保压时间为1～50s，射出压力为50～300MPa，射出时间为1～30s，延迟时间为1～30s，冷却时间为1～60s。
  14. 根据权利要求11所述的方法，其特征在于，所述塑料支撑层的厚度为1～2毫米。
  15. 根据权利要求11所述的方法，其特征在于，所述金属底材的厚度为0.1～0.6毫米。
  16. 根据权利要求11所述的方法，其特征在于，在步骤(2)中，形成的所述狭缝延伸至所述塑料支撑层中。
  17. 根据权利要求16所述的方法，其特征在于，所述狭缝在所述塑料支撑层中的深度不超过1毫米。
  18. 根据权利要求11所述的方法，其特征在于，所述狭缝的宽度为5～500微米。
  19. 根据权利要求11所述的方法，其特征在于，所述狭缝的长度为10～70毫米。
  20. 根据权利要求11所述的方法，其特征在于，在步骤(2)中形成多条所述狭缝，相邻两条所述狭缝的间距为0.3～1.6毫米。
  21. 根据权利要求11所述的方法，其特征在于，在步骤(2)中，通过切割形成所述狭缝，所述切割选自激光切割、电子束切割、水切割和线切割的至少一种。
  22. 根据权利要求21所述的方法，其特征在于，所述激光切割的条件为：功率为2-140W，切割速度为20-3000mm/s，激光频率为20-80kHz，输出波长为1064nm。
  23. 根据权利要求21所述的方法，其特征在于，所述电子束切割的条件为：真空度为10-3-10-4Pa，电流为3-9mA，功率密度为107W/cm2。
  24. 根据权利要求11所述的方法，其特征在于，在步骤(2)中，在所述金属底材中与所述塑料支撑层对应的区域形成所述狭缝。
  25. 根据权利要求11所述的方法，其特征在于，进一步包括：
    (3)在所述金属底材的外表面形成装饰层。
  26. 根据权利要求25所述的方法，其特征在于，所述装饰层的厚度为5～50微米。
  27. 根据权利要求25所述的方法，其特征在于，所述装饰层是通过电泳、微弧氧化、阳极氧化、硬质阳极以及喷涂中至少之一的方法形成的。
  28. 根据权利要求27所述的方法，其特征在于，通过所述阳极氧化形成所述装饰层，所述阳极氧化条件为：以浓度为150-210g/L的硫酸作为槽液，电压为10-15V， 电流密度为1-2A/dm2，温度为10-22摄氏度，阳极氧化时间为20-60min，封孔槽液浓度为1-10g/L，封孔温度为50-95摄氏度，封孔时间为10-50min。
  29. 根据权利要求27所述的方法，其特征在于，通过所述微弧氧化形成所述装饰层，所述微弧氧化条件为：pH为6-12，电压为0-800V，电流密度为1-10A/dm2，温度为15-60摄氏度，时间为10-60min，封孔槽液为水，封孔温度为70-90摄氏度，封孔时间为1-10min。
  30. 根据权利要求27所述的方法，其特征在于，通过所述电泳所述装饰层，所述电泳条件为：阴极电泳：电压为20-60V，pH为4-6，温度为15-30摄氏度，时间为20-60s；阳极电泳：电压为40-100V，pH为6-8，温度为15-30摄氏度，时间为40-180s；烘烤温度为120-200摄氏度，烘烤时间为30-60min。
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