WO2016091101A1

WO2016091101A1 - Method for making plane pattern, method for processing steel plate pattern, steel plate, curved surface product, and processing method therefor

Info

Publication number: WO2016091101A1
Application number: PCT/CN2015/096178
Authority: WO
Inventors: 赵树明; 唐柳平; 张昌才; 邵延胜; 潘力争; 许本凯
Original assignee: 比亚迪股份有限公司
Priority date: 2014-12-10
Filing date: 2015-12-01
Publication date: 2016-06-16
Also published as: CN105730037A

Abstract

A method for making a plane pattern comprises the following steps: S1: processing a 3D electronic circuit on a curved surface printing stock (1); S2: coating colored ink on the 3D electronic circuit; S3: performing transfer printing on the 3D electronic circuit on the curved surface printing stock to a transfer printing piece (3); and S4: pressing, on a plane (4), one side, on which transfer printing is performed on the 3D electronic circuit, on the transfer printing piece, to obtain a plane pattern (5) corresponding to the 3D electronic circuit on the plane. A method for processing a steel plate pattern adopts the method for making a plane pattern to obtain a steel plate pattern. A steel plate is manufactured by processing a steel plate pattern on a steel plate plane by using the method for processing a steel plate pattern. A method for processing a curved surface product adopts the method for processing a steel plate pattern to process a steel plate pattern, and a curved surface product is processed by using the method for processing a curved surface product.

Description

Method for preparing planar pattern, processing method for steel plate pattern, steel plate, curved surface product and processing method thereof

Technical field

The present invention relates to the field of pad printing technology, and more particularly to a method for preparing a planar pattern, a method for processing a steel sheet pattern, a steel sheet with a steel plate pattern, a curved surface product, and a processing method therefor.

Background technique

Pad printing technology is often used for decorative pattern printing, such as LOGO, toy people's eyeballs, etc., with flat printing and simple curved printing. Because of decorative printing, the dimensional accuracy of the pattern on the substrate is low. Therefore, there is almost no dimensional accuracy requirement for the pattern on the etched steel sheet.

Because the printing technology has the characteristics of high efficiency, high ink utilization rate and low pollution, the application of printing technology has been continuously expanded. Currently, the printing technology is gradually applied to printed electronic circuits. The dimensional accuracy of the electronic circuit is relatively high, and higher requirements are placed on the dimensional accuracy of the pattern etched onto the steel plate.

If the surface of the electronic circuit on the substrate is a flat surface, the pattern on the substrate is identical to the surface of the steel plate of the etching pattern. As long as the pattern of the line is directly etched onto the steel plate, an electronic circuit that satisfies the dimensional accuracy requirement can be printed.

If the surface of the electronic circuit on the substrate is a curved surface, the electronic circuit is a 3D electronic circuit, and the surface of the etched pattern is inconsistent. This requires that the 3D electronic circuit pattern be first developed into a planar pattern.

In the related art, the 3D electronic circuit pattern is developed into a planar pattern in the 3D software, and then plate making and printing are performed, and the printing dimensional accuracy cannot be satisfied due to uncontrollable deformation of the plastic head during printing. Therefore, it is necessary to repeatedly modify the plane pattern - making steel plate - proofing - measuring size - modifying the pattern until the printing size meets the accuracy requirements.

The 3D electronic circuit pattern printed by the flat pattern of the steel plate to the curved substrate, the pattern will produce complex secondary deformation, the first deformation is from the flat steel plate to the curved rubber head, and the second deformation is from the curved plastic head to the curved surface printing. Therefore, it is necessary to print a target pattern satisfying dimensional accuracy requirements on a curved substrate, and it is necessary to repeatedly modify the steel plate pattern. The process is cumbersome, inefficient and wasteful. For some surface patterns that are difficult to measure, the pattern accuracy is not guaranteed. The method of preparing the steel plate pattern needs to be improved.

Summary of the invention

The present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, the present invention proposes a method for preparing a planar pattern, and the planar pattern obtained by the method for preparing the planar pattern has high precision and does not require repeated adjustment.

The present invention also proposes a method of processing a steel sheet pattern including the above-described method for producing a planar pattern.

The present invention also proposes a steel sheet obtained by the above-described processing method of a steel sheet pattern.

The invention also proposes a method of processing a curved article.

The present invention also proposes a curved article obtained by the above processing method.

A method for preparing a planar pattern according to an embodiment of the present invention includes the following steps: S1: processing a 3D electronic circuit on a curved substrate; S2: coating a color ink on the 3D electronic circuit; S3: printing the curved surface The 3D electronic circuit on the object is printed onto the printing member; S4: pressing one side of the printing member on which the 3D electronic circuit is printed on a plane, and the 3D is obtained on the plane The planar pattern corresponding to the electronic circuit.

According to the method for preparing a planar pattern according to the embodiment of the present invention, the conventional steps are broken, and the reverse pad printing method is creatively adopted, and the planar pattern of the 3D electronic circuit pattern satisfying the dimensional accuracy requirement can be quickly obtained, and the size is not required to be repeatedly adjusted. The process is simpler and has achieved unexpected results.

In addition, the method for preparing a planar pattern according to the above embodiment of the present invention may further have the following additional technical features:

According to an embodiment of the invention, in the step S1, the processing method is laser energy beam processing or machining.

According to an embodiment of the invention, in the step S1, the 3D electronic circuit processed on the curved substrate is a pattern outline line or pattern of a 3D electronic circuit.

According to an embodiment of the present invention, in the step S2, coating is performed using a colored pen.

According to an embodiment of the invention, the pad is a pad printing head.

A method for processing a steel sheet pattern according to an embodiment of the present invention includes the following steps: S1': obtaining a planar pattern corresponding to a 3D electronic circuit on a curved substrate on a plane of a steel sheet by using a method for preparing a planar pattern according to an embodiment of the present invention S2': scanning and picking up the planar pattern of the steel sheet to obtain a steel plate pattern corresponding to the 3D electronic circuit; S3': processing the steel plate pattern onto the plane of the steel plate.

According to an embodiment of the present invention, in step S3', the steel sheet pattern is processed onto the plane of the steel sheet by etching.

According to an embodiment of the present invention, the step S2' further includes: finely adjusting the picked-up planar pattern to obtain a high-precision steel plate pattern corresponding to the 3D electronic circuit.

According to the steel sheet of the embodiment of the invention, the steel sheet has a pattern on a plane thereof, and the pattern is prepared by a processing method of a steel sheet pattern according to an embodiment of the present invention.

A method of processing a curved article according to an embodiment of the present invention, comprising the steps of: S1": processing a steel plate pattern on a steel plate using the processing method of the steel plate pattern according to any one of claims 6-8; S2": Applying a color ink to the steel plate pattern of the steel plate; S3": printing the steel plate pattern onto the printing member; S4": pressing the steel plate pattern printed on the printing member on the curved substrate, A 3D electronic circuit pattern corresponding to the steel plate pattern is obtained on the curved substrate; S5": a 3D electronic circuit is processed on the 3D electronic circuit pattern.

According to the curved article of the embodiment of the invention, the curved article comprises a curved substrate and a 3D electronic circuit on the surface of the curved substrate, and the curved article is processed by the processing method of the curved article of the embodiment of the invention.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

DRAWINGS

1 is a flow chart of a method for preparing a planar pattern according to an embodiment of the present invention;

2 is a schematic structural diagram of step 1 of a method for preparing a planar pattern according to an embodiment of the present invention;

3 is a schematic structural diagram of step 2 of a method for preparing a planar pattern according to an embodiment of the present invention;

4 is a schematic structural diagram of step 3 of a method for preparing a planar pattern according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a fourth step of a method for preparing a planar pattern according to an embodiment of the present invention; FIG.

6 is a flow chart of a method of processing a steel sheet pattern in accordance with an embodiment of the present invention.

Reference mark:

Curved substrate 1; 3D electronic circuit 2; pad printing head 3; plane 4;

detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

A method for preparing a planar pattern according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 1, a method for preparing a planar pattern according to an embodiment of the present invention includes the following steps:

S1: Processing a 3D electronic circuit on a curved substrate.

S2: Apply color ink to the 3D electronic circuit.

S3: Pad the 3D electronic circuit on the curved substrate onto the pad.

S4: pressing one side of the pad printing on which the 3D electronic circuit is printed on the plane, and obtaining a planar pattern corresponding to the 3D electronic circuit on the plane.

According to the method for preparing a planar pattern according to an embodiment of the present invention, the accuracy of preparing a planar pattern is high. Since this method is reverse pad printing, the advantages of reverse pad printing are the process of printing a 3D electronic circuit pattern on a curved substrate onto a plane and the process of printing from a plane onto a curved substrate, the 3D wire pattern. The deformation that occurs is exactly the process of reciprocity. The secondary deformation produced by the 3D electronic circuit pattern on the curved substrate printed on the plane and the secondary deformation generated from the planar printing onto the curved substrate can cancel each other out, so that the final surface can be printed on the curved substrate. The precise pattern is obtained, so the planar pattern obtained by the method does not need to be repeatedly adjusted, and the planar pattern of the 3D electronic circuit pattern satisfying the dimensional accuracy requirement can be quickly obtained, and the implementation is strong.

In the related art, it is necessary to carry out the process of making a plate-proofing-revision process according to the target pattern model, and the process is rather cumbersome. However, this scheme breaks the routine in the plate making process, and the order of acquiring the planar pattern is changed, and the reverse printing method is innovatively used, and the precise planar pattern can be quickly obtained.

The method for preparing the planar pattern of the embodiment of the present invention will be described in detail below with reference to FIG. 2 to FIG.

2(a), 2(b) and 2(c) in Fig. 2 are three views of the curved substrate 1. As shown in FIG. 2, the 3D electronic circuit 2 is first processed on the curved substrate 1, and the 3D electronic circuit 2 can be processed according to the needs of dimensional accuracy. Among them, the required 3D electronic circuit 2 can be processed on the curved substrate by laser energy beam processing or machining. Specifically, a pattern of a 3D electronic circuit or a pattern outline of a 3D electronic circuit can be processed on a curved substrate.

3(a), 3(b) and 3(c) in Fig. 3 are three views of the 3D electronic circuit 2 of the curved substrate 1 coated with color ink. As shown in FIG. 3, color ink can then be applied to the 3D electronic circuit 2. Alternatively, the coating can be carried out with a colored pen. When the pattern outline line of the 3D electronic circuit 2 is processed on the curved substrate 1, the color ink may be coated in the pattern outline line; when the pattern of the 3D electronic circuit 2 is processed on the curved substrate, the pattern may be coated Color ink.

4 is a schematic view showing the structure of the pad printing head 3. As shown in FIG. 4, the 3D electronic circuit 2 coated with the color ink on the curved substrate 1 is printed onto the pad. Alternatively, the pad printing head 3 can be used as the pad printing member. The pad printing head 3 has good deformability and is suitable for pad printing of the curved substrate 1 to the plane 4. Specifically, the pad 3 can be pressed against the 3D electronic circuit 2 coated with the color ink of the curved substrate 1 and pressed until the pad 3 is completely in contact with the 3D electronic circuit 2, and the 3D electronic circuit 2 is It can be printed on the pad printing head 3.

Fig. 5(a) is a structural schematic view of another angle of the pad printing head 3, and Fig. 5(b) is a structural schematic view of the plane 4 having the planar pattern 5. As shown in FIG. 5, the side of the pad 3 on which the 3D electronic circuit 2 is printed is pressed against the plane 4, and the plane pattern 4 corresponding to the 3D electronic circuit is obtained on the plane 4.

A method of processing a steel sheet pattern according to an embodiment of the present invention will be described in detail below with reference to FIG.

Specifically, the processing method includes the following steps:

S1': A planar pattern corresponding to the 3D electronic circuit on the curved substrate is obtained on the plane of the steel sheet by the method for preparing the planar pattern described above.

S2': Scan and pick up the planar pattern of the steel sheet to obtain a steel sheet pattern corresponding to the 3D electronic circuit.

S3': The steel plate pattern is machined onto the plane of the steel sheet.

Since the method for preparing a planar pattern according to the embodiment of the present invention has the above-mentioned advantageous technical effects, the steel plate pattern obtained by the method for processing a steel plate pattern according to an embodiment of the present invention does not need to be repeatedly adjusted in size, and the dimensional accuracy requirement can be quickly obtained. The steel plate pattern of the 3D electronic circuit pattern is more precise when the surface of the three-dimensional substrate is printed, and the problem of inaccurate pad printing pattern caused by multiple deformation of the plastic head can be eliminated.

Specifically, a 3D electronic circuit is first processed on the curved substrate, and the 3D electronic circuit can be a pattern or a pattern outline of the 3D electronic circuit. The color ink can then be applied to the 3D electronic circuit using a colored pen. Then, the pad printing pad and the like can be pressed on the 3D electronic circuit of the curved substrate coated with the color ink, so that the 3D electronic circuit is printed on the pad printing head such as the pad printing head. Then, the side on which the 3D electronic circuit is printed on the pad is pressed against the plane of the steel plate, and a planar pattern corresponding to the 3D electronic circuit can be obtained on the plane of the steel plate.

The planar pattern can then be scanned and the lines can be picked up along the pattern outline of the 3D electronic circuit to obtain a steel plate pattern corresponding to the 3D electronic circuit pattern. The pattern of the steel sheet can then be processed into the plane of the steel sheet by etching.

Among them, the subsequent steel plate pattern can be finely adjusted according to the experience of conventional flat plate making in the process of plate making, and the high-precision steel plate pattern corresponding to the 3D electronic circuit printing can be obtained.

The processing method of the steel plate pattern according to the embodiment of the present invention is a reverse process of pad printing. When the steel plate obtained by the method is printed on the surface of the three-dimensional substrate, the 3D electronic circuit pattern is more precise, and the plastic head can be removed and deformed multiple times. The printing pattern is inaccurate and the printing effect is good.

Operations such as the structure of the steel sheet and the processing method of the steel sheet pattern according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail herein.

The method of processing a curved article according to an embodiment of the present invention may include the following steps:

S1": A steel sheet pattern is processed on a steel sheet by the method of processing a steel sheet pattern according to any one of claims 6-8.

S2": Apply color ink to the steel plate pattern of the steel plate.

S3": The steel plate pattern is printed onto the pad.

S4": pressing the steel plate pattern printed on the pad on the curved substrate, and obtaining a 3D electronic circuit pattern corresponding to the steel plate pattern on the curved substrate.

S5": 3D electronic circuit is processed on the 3D electronic circuit pattern.

The method for processing a curved surface article according to an embodiment of the present invention adopts a combination of reverse pad printing and forward pad printing, and adopts a reverse pad printing method when the planar pattern is prepared, and then adopts a D3 electronic circuit when processing the curved substrate. The positive pad printing method, the two are exactly the reciprocal process, the secondary deformation generated in the process of printing the 3D electronic circuit pattern on the curved substrate onto the plane and the printing from the plane to the curved substrate The secondary deformations cancel each other out, resulting in a precise pattern on the curved substrate, which ultimately results in a curved substrate with precise 3D electronics.

According to the method for processing a curved article according to the embodiment of the present invention, the method for processing the 3D electronic circuit on the 3D electronic circuit pattern in the step S5" is a conventional processing method in the art. The method provided by the embodiment of the present invention can be in various shapes. The surface of the complex substrate is printed with a precision 3D electronic circuit pattern, and the corresponding 3D electronic circuit is processed, which greatly expands the field of use of the existing pad printing, and the precision of the processed electronic circuit is high.

A curved article according to an embodiment of the invention comprising a curved substrate and a 3D electron line on the surface of the curved substrate road. The curved surface product can be processed by the foregoing processing method. Specifically, the curved surface substrate can be provided with a 3D electronic circuit, and the 3D electronic circuit can be processed by using steps S1" to S5". As a result, the 3D electronic circuit on the curved substrate is more accurate and the product quality is good.

In the description of the present invention, it is to be understood that the orientation or positional relationship of the terms "upper", "lower", "front", "rear" and the like is based on the orientation or positional relationship shown in the drawings, only for the purpose of The invention is not limited by the scope of the invention, and is not intended to be a limitation of the invention.

In the description of the present specification, the description of the terms "one embodiment", "some embodiments" or "example" or the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in the present invention. At least one embodiment or example. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The embodiments are subject to variations, modifications, substitutions and variations.

Claims

A method for preparing a planar pattern, comprising the steps of:

S1: processing a 3D electronic circuit on a curved substrate;

S2: coating a color ink on the 3D electronic circuit;

S3: printing the 3D electronic circuit on the curved substrate onto the printing member;

S4: pressing one side of the pad on which the 3D electronic circuit is printed on a plane, and obtaining a planar pattern corresponding to the 3D electronic circuit on the plane.
The method of producing a planar pattern according to claim 1, wherein in the step S1, the processing method is laser energy beam processing or machining.
The method for preparing a planar pattern according to claim 1 or 2, wherein in the step S1, the 3D electronic circuit processed on the curved substrate is a pattern outline line or pattern of a 3D electronic circuit.
The method for producing a planar pattern according to any one of claims 1 to 3, wherein in the step S2, coating is performed using a colored pen.
The method for preparing a planar pattern according to any one of claims 1 to 4, wherein the printing member is a pad printing head.
A method for processing a steel plate pattern, comprising the steps of:

S1': obtaining a planar pattern corresponding to a 3D electronic circuit on a curved substrate on a plane of the steel sheet by using the method for preparing a planar pattern according to any one of claims 1-5;

S2': scanning and picking up a planar pattern of the steel plate to obtain a steel plate pattern corresponding to the 3D electronic circuit;

S3': The steel sheet pattern is machined onto the plane of the steel sheet.
The method of processing a steel sheet pattern according to claim 6, wherein in step S3', the steel sheet pattern is processed onto a plane of the steel sheet by etching.
The method for processing a steel sheet pattern according to claim 6 or 7, wherein the step S2' further comprises: finely adjusting the planar pattern obtained by the pickup to obtain a high-precision steel plate corresponding to the 3D electronic circuit. pattern.
A steel sheet characterized by having a pattern on a plane of the steel sheet, the pattern being produced by the method for processing a steel sheet pattern according to any one of claims 6-8.
A method for processing a curved article, comprising the steps of:

S1": processing a steel plate pattern on a steel sheet by the method for processing a steel sheet pattern according to any one of claims 6-8;

S2": applying a color ink on the steel plate pattern of the steel sheet;

S3": printing the steel plate pattern onto the printing member;

S4": pressing a steel plate pattern printed on the pad on a curved substrate, and obtaining a 3D electronic circuit pattern corresponding to the steel plate pattern on the curved substrate;

S5": processing a 3D electronic circuit on the 3D electronic circuit pattern.
A curved article, characterized in that the curved article comprises a curved substrate and a 3D electronic circuit on the surface of the curved substrate, the curved article being processed by the processing method of claim 10.