TWI706851B - Molding apparatus - Google Patents
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- TWI706851B TWI706851B TW107144230A TW107144230A TWI706851B TW I706851 B TWI706851 B TW I706851B TW 107144230 A TW107144230 A TW 107144230A TW 107144230 A TW107144230 A TW 107144230A TW I706851 B TWI706851 B TW I706851B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/18—Thermoforming apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/30—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
Abstract
Description
本發明涉及工裝治具領域,尤其涉及一種成型裝置。 The invention relates to the field of tooling and fixtures, in particular to a molding device.
目前無論VR(Virtual Reality,虛擬現實)設備、AR(Augmented Reality,增強現實)設備、穿戴式電腦等均普遍需要貼附光學薄膜,而上述之光學薄膜普遍利用熱壓塑形來完成。以熱壓塑形形成光學薄膜之製程為例,尤其是形成曲面之光學薄膜時,熱壓塑形製程中,需要將薄膜材料放置於熱壓塑形之治具上,該治具包括一成型區域,成型區域之輪廓與目標產品輪廓相同。從薄膜材料遠離治具之一側向薄膜材料施加壓力,使薄膜材料最終形成目標產品。 At present, regardless of VR (Virtual Reality, virtual reality) devices, AR (Augmented Reality, augmented reality) devices, wearable computers, etc., it is generally necessary to attach optical films, and the above-mentioned optical films are generally completed by hot pressing. Take the process of forming an optical film by hot press molding as an example, especially when forming a curved optical film. In the process of hot press molding, the film material needs to be placed on a hot press molding jig, which includes a molding The contour of the forming area is the same as the contour of the target product. Pressure is applied to the film material from one side of the film material away from the jig, so that the film material finally forms the target product.
而習知之治具中,當從薄膜材料遠離治具之一側向薄膜材料施加壓力時,在成型區域邊緣對應之薄膜材料之應力較強,導致薄膜材料被拉伸產生形變,由形變進一步衍生出薄膜材料在光學特性及材料厚度上之變化,諸如光學性能變差、薄膜材料厚薄不均等,上述之問題將導致薄膜材料最終形成之目標產品,在應用到VR設備、AR設備、穿戴式電腦等設備時設備品質下降。 In the conventional jig, when pressure is applied to the film material from one side of the film material away from the jig, the stress of the film material corresponding to the edge of the forming area is stronger, causing the film material to be stretched and deformed, which is further derived from the deformation Changes in the optical properties and material thickness of thin film materials, such as deterioration of optical properties, uneven thickness of thin film materials, etc. The above-mentioned problems will lead to the final formation of target products of thin film materials, which are used in VR devices, AR devices, and wearable computers. The quality of the equipment decreases while waiting for the equipment.
本發明提供一種成型裝置,包括:承載部,所述承載部上設置有一凹槽,所述凹槽具有一底壁及與所述底壁連接之側壁;及成型部,所述成型部設置於所述底壁上且與所述側壁相間隔,所述成型部具有一遠離底壁之頂表面,所述頂表面用以承載待成型之產品;所述凹槽之開口之輪廓與所述頂表面之邊緣之輪廓相同。 The present invention provides a molding device, which includes: a carrying part, on which a groove is provided, the groove has a bottom wall and a side wall connected to the bottom wall; and a shaping part, the shaping part is arranged on On the bottom wall and spaced apart from the side wall, the molding part has a top surface away from the bottom wall, and the top surface is used to carry the product to be molded; the contour of the opening of the groove is consistent with the top surface The contours of the edges of the surface are the same.
本發明實施例提供之成型裝置,藉由將承載部凹槽之開口之輪廓設置為與成型部頂表面之邊緣之輪廓相同,熱塑成型製程中,對薄膜材料施加 壓力時,薄膜材料邊緣應力相對較小,有利於改善熱塑成型製程中薄膜材料上應力導致薄膜材料光學特性等受到影響之問題。 In the molding device provided by the embodiment of the present invention, the contour of the opening of the recess of the carrying portion is set to be the same as the contour of the edge of the top surface of the molding portion. During the thermoplastic molding process, the film material is applied When pressure is applied, the edge stress of the film material is relatively small, which is beneficial to improve the problem of the optical properties of the film material being affected by the stress on the film material in the thermoplastic molding process.
10:成型裝置 10: Forming device
11:承載部 11: Bearing Department
12:成型部 12: Forming department
111:凹槽 111: Groove
112:底壁 112: bottom wall
113:側壁 113: Sidewall
114:開口 114: opening
121:頂表面 121: top surface
d1:深度 d1: depth
d2:高度 d2: height
O:極點 O: pole
M:第一射線 M: first ray
N:第二射線 N: second ray
P、Q:交點 P, Q: intersection point
X、Y:曲線 X, Y: curve
20:薄膜材料 20: Thin film material
D1、D2:開口直徑 D1, D2: opening diameter
圖1為本發明實施例一提供之成型裝置之立體結構示意圖。
FIG. 1 is a schematic diagram of a three-dimensional structure of a molding device provided by
圖2為圖1沿Ⅱ-Ⅱ方向之剖面結構示意圖。 Figure 2 is a schematic cross-sectional view of Figure 1 along the direction II-II.
圖3為凹槽開口而成型部頂表面之投影圖形。 Fig. 3 is a projection pattern of the top surface of the forming part with the opening of the groove.
圖4為成型裝置之使用狀態之剖面示意圖。 Figure 4 is a schematic cross-sectional view of the molding device in use.
圖5為成型裝置之使用狀態之另一剖面示意圖。 Figure 5 is another schematic cross-sectional view of the molding device in use.
實施例一 Example one
請參閱圖1,本實施例提供之成型裝置10,包括承載部11與結合在承載部11上之成型部12。
Please refer to FIG. 1, the
如圖1所示,承載部11上設置有一凹槽111,凹槽111用以容置待成型之產品。凹槽111具有一底壁112、與底壁112連接之側壁113及遠離底壁112開口114。成型部12設置於凹槽111之底壁112上,且成型部12容置於凹槽111內。成型部12與凹槽111之側壁113相間隔。
As shown in FIG. 1, a
本實施例中,承載部11與成型部12為一體成型,一體成型之方式可包括但不限於:3D打印、注塑成型,採用一體成型之方式效率較高。於另一實施例中,成型部12以可拆卸方式結合於凹槽111之底壁112,可拆卸方式為包括但不限於:膠黏、採用固件(例如螺栓)進行鎖緊。以可拆卸方式設置時,可實現僅更換一個成型裝置中之承載部11或成型部12,亦可實現不同之承載部11與成型部12搭配組合,提高部件利用靈活度。
In this embodiment, the
如圖1所示,成型部12具有一遠離凹槽111底壁112之頂表面121。使用該成型裝置10加工待成型之產品時,頂表面121用於承載待成型之產品,待成型之產品將貼附在頂表面121並被擠壓。頂表面121之邊緣之輪廓與凹槽111之開口114之輪廓相同。
As shown in FIG. 1, the
如圖1所示,本實施例提供之成型裝置10,成型部12之頂表面121為不規則之形狀,凹槽111之開口114輪廓設置為與頂表面121之邊緣輪廓相同。
本實施例中,承載部11設置為中空之圓柱狀,為保持凹槽111之開口114之輪廓與頂表面121之邊緣之輪廓相同且為不規則之輪廓,承載部11之壁厚為不均勻之。本發明對承載部11之整體外形不作限制,於其他實施例中,可考慮調整成型裝置10之外觀,以使承載部11之壁厚可設置為相等。
As shown in FIG. 1, in the
請參閱圖2,頂表面121為一曲面。本實施例中,頂表面121為一向凹槽111底壁112方向凹陷之曲面。於其他實施例中,頂表面121可為向遠離凹槽111底壁112方向凸出之曲面,於另一實施例中,頂表面121亦可設置為一平面。頂表面121之形狀根據目標成型物件之形狀確定,凹槽111之開口114之輪廓由頂表面121之邊緣之輪廓確定,凹槽111之開口大小滿足大於頂表面121面積即可。
Please refer to FIG. 2, the
以下將對凹槽111之開口114之輪廓與成型部12之頂表面121之邊緣之輪廓之間之關係進行進一步說明:請一併參閱圖2與圖3,將開口114之輪廓而頂表面121之邊緣之輪廓在凹槽111之底壁112上作正投影,形成之投影圖形如圖3,圖3中分別有曲線X而曲線Y,曲線X為開口114之輪廓在底壁112上之投影圖形,曲線Y為頂表面121之邊緣之輪廓在底壁112上之投影圖形。
The relationship between the contour of the
請參閱圖3,在投影圖形所在平面上建立極坐標系,以曲線Y圍成之圖形之幾何中心為極點,極點表示為O,以極點O任意方向引出第一射線M,作為極軸,以極點O向任意方向引出第二射線N,第二射線N與曲線X及曲線Y分別具有一交點。第二射線N與曲線X之交點表示為P,P點坐標表示為(ρ1,θ1),其中ρ1表示極點O與P點之間之距離,θ1表示P點與極點O之連線與第一射線M之夾角;第二射線N與曲線Y之交點為Q,Q點坐標表示為(ρ2,θ2),其中ρ2表示極點O與Q點之間之距離,θ2表示Q點與極點O之連線與第一射線M之夾角。則P點與Q點坐標滿足如下關係:θ1=θ2=第一射線M與第二射線N之夾角,ρ1=S×ρ2,且S>1,即ρ1大於ρ2。 Please refer to Figure 3. Establish a polar coordinate system on the plane where the projected figure is located. Take the geometric center of the figure enclosed by curve Y as the pole, and the pole is denoted as O. The first ray M is drawn in any direction from the pole O as the polar axis. The pole O draws a second ray N in any direction, and the second ray N has an intersection with the curve X and the curve Y respectively. The intersection of the second ray N and the curve X is denoted as P, and the coordinates of point P are denoted as (ρ1, θ1), where ρ1 represents the distance between the pole O and the P point, and θ1 represents the connection line between the P point and the pole O and the first The angle between the ray M; the intersection of the second ray N and the curve Y is Q, and the coordinates of the Q point are expressed as (ρ2, θ2), where ρ2 represents the distance between the pole O and the Q point, and θ2 represents the connection between the Q point and the pole O The angle between the line and the first ray M. Then the coordinates of point P and point Q satisfy the following relationship: θ1=θ2=the angle between the first ray M and the second ray N, ρ1=S×ρ2, and S>1, that is, ρ1 is greater than ρ2.
亦即,凹槽111之開口114之輪廓與頂表面121之邊緣之輪廓相同,且在頂表面121之基礎上放大。
That is, the contour of the
於一實施例中,凹槽111之開口114之輪廓與頂表面121之邊緣之輪廓相同,且S1.5;於另一實施例中,1.5S1.75。
In one embodiment, the contour of the
請參閱圖4,本實施例提供之成型裝置10,用於熱塑成型形成目標成型物件(圖未示),目標成型物件為光學薄膜。在成型製程中,先將薄膜材料20放置於承載部11上,此時薄膜材料20尚未進入凹槽111,然後在薄膜材料20遠離成型部12一側(圖4中複數平行箭頭指向方向)施加壓力使薄膜材料20進入凹槽111中並最終抵持成型部12之頂表面121。薄膜材料20進入凹槽111前可加熱軟化,亦可進入凹槽111後加熱使其軟化,使軟化之薄膜材料20抵持成型部12之頂表面121並被擠壓以成型為頂表面121之形狀。本實施例中,施加壓力之方式為以一機械壓頭直接向薄膜材料20施加壓力。
Please refer to FIG. 4, the
為提供機械壓頭之容納空間,本實施例中,凹槽111之側壁113垂直於底壁112所在之平面且側壁113各處高度相等。凹槽之深度d1(亦即側壁113之高度)大於成型部12之最大高度d2(成型部12為一曲面,各處高度不等,因此具有最大高度)。
In order to provide a accommodating space for the mechanical indenter, in this embodiment, the
於其他實施例中,施加壓力之方式亦可以為氣壓、液壓等方式,本發明不對此作限定。 In other embodiments, the method of applying pressure may also be pneumatic, hydraulic, etc., which is not limited in the present invention.
請參閱圖5,保持施加壓力,使薄膜材料20緊貼成型部12頂表面121。與成型部12頂表面121緊貼之部分薄膜材料20即為目標成型物件,其餘部分則為廢料。為了形成所需形狀之目標成型物件,成型部12頂表面121設置為與目標成型物件之形狀一致。本實施例中,成型部12之頂表面121為一曲面,則目標成型物件為一曲面光學薄膜。
Please refer to FIG. 5, keep applying pressure so that the
本實施例提供之成型裝置10,藉由將凹槽111之開口114之輪廓設置為與成型部12頂表面121之邊緣之輪廓相同,熱塑成型製程中薄膜材料20被擠壓時,薄膜材料20邊緣應力相對較小,整個受力面之應力相對均衡,有助於保持薄膜材料20之結構不變,使得薄膜材料20保持原有特性。因此有利於改善熱塑成型製程中薄膜材料20上應力太強導致薄膜材料受到拉扯,結構發生變化進而光學特性等受到影響之問題。
In the
以下是對比例之成型裝置與本案中之成型裝置10之效果對照:請參閱表一:表一為採用對比例之成型裝置(承載部之凹槽之開口為圓形,成型部與上述成型部12完全相同,頂表面為不規則之形狀),向薄膜材料施加之壓力與薄膜材料邊緣之應力之間之關係。表一中以成型裝置開口為圓柱狀為例,展示了開口直徑分別為65mm與70mm兩組數據:
請參閱表二:表二為採用本案中之成型裝置10,向薄膜材料20施加之壓力與薄膜材料20邊緣之應力之間之關係。表二中展示了凹槽111之開口114相對成型部12之頂表面121放大比例分別為1.5(即S=1.5)與1.75(即S=1.75)時兩組數據:
參閱表一中第五組數據、表二中第一組數據、表二中第六組數據,上述三組數據中,對薄膜材料20施加壓力均為0.3,當對薄膜材料20施加壓力為0.3時,採用對比例成型裝置,薄膜材料邊緣應力為4.4141%(表一中第一組數據),而採用本案中之成型裝置10時,薄膜材料20邊緣之應力分別為2.4588%(表二中第一組數據)與2.5087%(表二中第六組數據),說明,在對薄膜材料施加相同壓力時,採用本案中之成型裝置10比採用對比例成型裝置,薄膜材料邊緣之應力要小。
Refer to the fifth set of data in Table 1, the first set of data in Table 2, and the sixth set of data in Table 2. In the above three sets of data, the pressure applied to the
進一步之,請參閱表一中第一組數據與表二中第一組數據,採用對比例成型裝置,對薄膜材料施加壓力為0.138時,薄膜材料邊緣之應力達到2.4588%,而採用本案中之成型裝置10,對薄膜材料20施加壓力為0.3,薄膜材料20邊緣之應力才與對比例一致。則說明,若於一實施例中,薄膜材料邊緣可承受應力為2.4588%時,採用本案中之成型裝置10比採用對比例成型裝置,薄膜材料可承受之壓力範圍更大。
Further, please refer to the first set of data in Table 1 and the first set of data in Table 2. Using a comparative molding device, when the pressure applied to the film material is 0.138, the stress at the edge of the film material reaches 2.4588%. The forming
根據上述分析,本實施例提供之成型裝置10,藉由將凹槽111之開口114之輪廓設置為與成型部12頂表面121之邊緣之輪廓相同,可有效改善熱塑成型製程中薄膜材料20上應力導致薄膜材料光學特性受到影響之問題。
According to the above analysis, the
本技術領域之普通技術人員應當認識到,以上之實施方式僅是用來說明本發明,而並非用作為對本發明之限定,只要於本發明之實質精神範圍之內,對以上實施例所作之適當改變及變化均落於本發明要求保護之範圍之內。 Those of ordinary skill in the art should realize that the above embodiments are only used to illustrate the present invention, but not to limit the present invention. As long as they fall within the essential spirit of the present invention, the above embodiments are appropriate Changes and changes fall within the scope of protection of the present invention.
10:成型裝置 10: Forming device
11:承載部 11: Bearing Department
12:成型部 12: Forming department
111:凹槽 111: Groove
112:底壁 112: bottom wall
113:側壁 113: Sidewall
114:開口 114: opening
121:頂表面 121: top surface
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CN109571916B (en) | 2021-01-29 |
TW202019662A (en) | 2020-06-01 |
CN109571916A (en) | 2019-04-05 |
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