TW202019662A - Molding apparatus - Google Patents

Molding apparatus Download PDF

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Publication number
TW202019662A
TW202019662A TW107144230A TW107144230A TW202019662A TW 202019662 A TW202019662 A TW 202019662A TW 107144230 A TW107144230 A TW 107144230A TW 107144230 A TW107144230 A TW 107144230A TW 202019662 A TW202019662 A TW 202019662A
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Taiwan
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molding
top surface
groove
contour
bottom wall
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TW107144230A
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Chinese (zh)
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TWI706851B (en
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周佩吟
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大陸商業成科技(成都)有限公司
大陸商業成光電(深圳)有限公司
英特盛科技股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/18Thermoforming apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26Component parts, details or accessories; Auxiliary operations
    • B29C51/30Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00Flat articles, e.g. films or sheets

Abstract

The disclosure provides a molding apparatus including a bearing portion and a molding portion. The bearing portion is provided with a groove, the groove has a bottom wall and a side wall connected to the bottom wall. The molding portion is on the bottom wall and spaced apart from the side wall. The molding portion has a top surface away from the bottom wall, the top surface is configured for carrying a product to be formed. The contour of the opening of the groove and the contour of the edge of the top surface are the same. The contour of the opening of the groove and the contour of the edge of the top surface are the same, so that the molding apparatus helps to improve the optical properties problem of the film material caused by the stress on the film material in the thermoplastic molding process .

Description

成型裝置Molding device

本發明涉及工裝治具領域,尤其涉及一種成型裝置。The invention relates to the field of tooling fixtures, in particular to a molding device.

目前無論VR (Virtual Reality,虛擬現實)設備、AR(Augmented Reality,增強現實)設備、穿戴式電腦等均普遍需要貼附光學薄膜,而上述之光學薄膜普遍利用熱壓塑形來完成。以熱壓塑形形成光學薄膜之製程為例,尤其是形成曲面之光學薄膜時,熱壓塑形製程中,需要將薄膜材料放置於熱壓塑形之治具上,該治具包括一成型區域,成型區域之輪廓與目標產品輪廓相同。從薄膜材料遠離治具之一側向薄膜材料施加壓力,使薄膜材料最終形成目標產品。At present, regardless of VR (Virtual Reality, virtual reality) equipment, AR (Augmented Reality, augmented reality) equipment, wearable computers, etc., it is generally necessary to attach an optical film, and the above-mentioned optical film is generally completed by hot compression molding. Taking the process of forming the optical film by hot compression molding as an example, especially when forming a curved optical film, the film material needs to be placed on the jig for hot compression molding during the process of hot compression molding, which includes a molding The contour of the area and molding area is the same as the contour of the target product. Apply pressure to the film material from one side of the film material away from the jig, so that the film material eventually forms the target product.

而習知之治具中,當從薄膜材料遠離治具之一側向薄膜材料施加壓力時,在成型區域邊緣對應之薄膜材料之應力較強,導致薄膜材料被拉伸產生形變,由形變進一步衍生出薄膜材料在光學特性及材料厚度上之變化,諸如光學性能變差、薄膜材料厚薄不均等,上述之問題將導致薄膜材料最終形成之目標產品,在應用到VR設備、AR設備、穿戴式電腦等設備時設備品質下降。In the conventional jig, when pressure is applied to the film material from the side of the film material away from the jig, the stress of the film material corresponding to the edge of the forming area is strong, causing the film material to be stretched and deformed, which is further derived from the deformation Changes in the optical properties and thickness of thin-film materials, such as poor optical performance and uneven thickness of thin-film materials, etc. The above-mentioned problems will lead to the final formation of thin-film materials as target products, which are applied to VR devices, AR devices, wearable computers When the equipment is waiting, the quality of the equipment is reduced.

本發明提供一種成型裝置,包括: 承載部,所述承載部上設置有一凹槽,所述凹槽具有一底壁及與所述底壁連接之側壁;及 成型部,所述成型部設置於所述底壁上且與所述側壁相間隔,所述成型部具有一遠離底壁之頂表面,所述頂表面用以承載待成型之產品; 所述凹槽之開口之輪廓與所述頂表面之邊緣之輪廓相同。The invention provides a molding device, which includes: a bearing portion provided with a groove provided with a bottom wall and a side wall connected to the bottom wall; and a molding portion provided with the molding portion The bottom wall is spaced from the side wall, the forming portion has a top surface away from the bottom wall, the top surface is used to carry the product to be formed; the contour of the opening of the groove and the top The contours of the edges of the surface are the same.

本發明實施例提供之成型裝置,藉由將承載部凹槽之開口之輪廓設置為與成型部頂表面之邊緣之輪廓相同,熱塑成型製程中,對薄膜材料施加壓力時,薄膜材料邊緣應力相對較小,有利於改善熱塑成型製程中薄膜材料上應力導致薄膜材料光學特性等受到影響之問題。The forming device provided by the embodiment of the present invention sets the contour of the opening of the groove of the bearing part to be the same as the contour of the edge of the top surface of the forming part. During the thermoplastic molding process, when the film material is subjected to pressure, the film material edge stress It is relatively small, which is helpful to improve the problem that the optical properties of the film material are affected by the stress on the film material during the thermoplastic molding process.

實施例一Example one

請參閱圖1,本實施例提供之成型裝置10,包括承載部11而結合在承載部11上之成型部12。Referring to FIG. 1, the molding device 10 provided in this embodiment includes a bearing portion 11 and a molding portion 12 coupled to the bearing portion 11.

如圖1所示,承載部11上設置有一凹槽111,凹槽111用以容置待成型之產品。凹槽111具有一底壁112、與底壁112連接之側壁113及遠離底壁112開口114。成型部12設置於凹槽111之底壁112上,且成型部12容置於凹槽111內。成型部12與凹槽111之側壁113相間隔。As shown in FIG. 1, a groove 111 is provided on the bearing portion 11, and the groove 111 is used to accommodate a product to be molded. The groove 111 has a bottom wall 112, a side wall 113 connected to the bottom wall 112, and an opening 114 away from the bottom wall 112. The molding portion 12 is disposed on the bottom wall 112 of the groove 111, and the molding portion 12 is accommodated in the groove 111. The molding portion 12 is spaced from the side wall 113 of the groove 111.

本實施例中,承載部11而成型部12為一體成型,一體成型之方式可包括但不限於:3D打印、注塑成型,採用一體成型之方式效率較高。於另一實施例中,成型部12以可拆卸方式結合於凹槽111之底壁112,可拆卸方式為包括但不限於:膠黏、採用固件(例如螺栓)進行鎖緊。以可拆卸方式設置時,可實現僅更換一個成型裝置中之承載部11或成型部12,亦可實現不同之承載部11而成型部12搭配組合,提高部件利用靈活度。In this embodiment, the bearing portion 11 and the molding portion 12 are integrally molded. The methods of integral molding may include, but are not limited to: 3D printing and injection molding. The method of integral molding is more efficient. In another embodiment, the molding portion 12 is detachably coupled to the bottom wall 112 of the groove 111. The detachable method includes but is not limited to: gluing and locking with fasteners (such as bolts). When it is installed in a detachable manner, it is possible to replace only the bearing portion 11 or the molding portion 12 in one molding device, or to realize the combination of different bearing portions 11 and the molding portion 12 to improve the flexibility of component utilization.

如圖1所示,成型部12具有一遠離凹槽111底壁112之頂表面121。使用該成型裝置10加工待成型之產品時,頂表面121用於承載待成型之產品,待成型之產品將貼附在頂表面121並被擠壓。頂表面121之邊緣之輪廓與凹槽111之開口114之輪廓相同。As shown in FIG. 1, the molding portion 12 has a top surface 121 away from the bottom wall 112 of the groove 111. When the molding device 10 is used to process the product to be molded, the top surface 121 is used to carry the product to be molded, and the product to be molded will be attached to the top surface 121 and pressed. The contour of the edge of the top surface 121 is the same as the contour of the opening 114 of the groove 111.

如圖1所示,本實施例提供之成型裝置10,成型部12之頂表面121為不規則之形狀,凹槽111之開口114 輪廓設置為與頂表面121之邊緣輪廓相同。本實施例中,承載部11設置為中空之圓柱狀,為保持凹槽111之開口114之輪廓與頂表面121之邊緣之輪廓相同且為不規則之輪廓,承載部11之壁厚為不均勻之。本發明對承載部11之整體外形不作限制,於其他實施例中,可考慮調整成型裝置10之外觀,以使承載部11之壁厚可設置為相等。As shown in FIG. 1, in the molding device 10 provided in this embodiment, the top surface 121 of the molding portion 12 has an irregular shape, and the contour of the opening 114 of the groove 111 is set to be the same as the edge contour of the top surface 121. In this embodiment, the bearing portion 11 is provided in a hollow cylindrical shape. In order to keep the contour of the opening 114 of the groove 111 the same as the contour of the edge of the top surface 121 and an irregular contour, the wall thickness of the bearing portion 11 is uneven Of it. The present invention does not limit the overall shape of the bearing portion 11. In other embodiments, it may be considered to adjust the appearance of the molding device 10 so that the wall thickness of the bearing portion 11 can be set to be equal.

請參閱圖2,頂表面121為一曲面。本實施例中,頂表面121為一向凹槽111底壁112方向凹陷之曲面。於其他實施例中,頂表面121可為向遠離凹槽111底壁112方向凸出之曲面,於另一實施例中,頂表面121亦可設置為一平面。頂表面121之形狀根據目標成型物件之形狀確定,凹槽111之開口114之輪廓由頂表面121之邊緣之輪廓確定,凹槽111之開口大小滿足大於頂表面121面積即可。Please refer to FIG. 2, the top surface 121 is a curved surface. In this embodiment, the top surface 121 is a curved surface that is recessed toward the bottom wall 112 of the groove 111. In other embodiments, the top surface 121 may be a curved surface protruding away from the bottom wall 112 of the groove 111. In another embodiment, the top surface 121 may also be a flat surface. The shape of the top surface 121 is determined according to the shape of the target molded object. The contour of the opening 114 of the groove 111 is determined by the contour of the edge of the top surface 121. The size of the opening of the groove 111 should be larger than the area of the top surface 121.

以下將對凹槽111之開口114之輪廓與成型部12之頂表面121之邊緣之輪廓之間之關係進行進一步說明:The relationship between the contour of the opening 114 of the groove 111 and the contour of the edge of the top surface 121 of the molding portion 12 will be further described below:

請一併參閱圖2而圖3,將開口114之輪廓而頂表面121之邊緣之輪廓在凹槽111之底壁112上作正投影,形成之投影圖形如圖3,圖3中分別有曲線X而曲線Y,曲線X為開口114之輪廓在底壁112上之投影圖形,曲線Y為頂表面121之邊緣之輪廓在底壁112上之投影圖形。Please refer to FIG. 2 and FIG. 3 together. The contour of the opening 114 and the contour of the edge of the top surface 121 are orthographically projected on the bottom wall 112 of the groove 111. The resulting projection pattern is shown in FIG. 3, which has curves respectively X and curve Y, curve X is the projection pattern of the contour of the opening 114 on the bottom wall 112, and curve Y is the projection pattern of the contour of the edge of the top surface 121 on the bottom wall 112.

請參閱圖3,在投影圖形所在平面上建立極坐標系,以曲線Y圍成之圖形之幾何中心為極點,極點表示為O,以極點O任意方向引出第一射線M,作為極軸,以極點O向任意方向引出第二射線N,第二射線N與曲線X而曲線Y分別具有一交點。第二射線N與曲線X之交點表示為P,P點坐標表示為(ρ1,θ1),其中ρ1表示極點O與P點之間之距離,θ1表示P點而極點O之連線與第一射線M之夾角;第二射線N與曲線Y之交點為Q,Q點坐標表示為(ρ2,θ2),其中ρ2表示極點O與Q點之間之距離,θ2表示Q點而極點O之連線與第一射線M之夾角。則P點而Q點坐標滿足如下關係: θ1=θ2=第一射線M與第二射線N之夾角,ρ1=S×ρ2,且S>1,即ρ1大於ρ2。Please refer to FIG. 3, establish a polar coordinate system on the plane where the projected figure is located, take the geometric center of the figure enclosed by the curve Y as the pole, the pole is expressed as O, and the first ray M is drawn in any direction from the pole O as the polar axis, The pole O leads the second ray N in any direction, and the second ray N and the curve X and the curve Y respectively have an intersection point. The intersection point of the second ray N and the curve X is represented as P, the coordinates of the P point are represented as (ρ1, θ1), where ρ1 represents the distance between the pole O and the point P, θ1 represents the point P and the connection between the pole O and the first The angle between the ray M; the intersection point of the second ray N and the curve Y is Q, the coordinates of the Q point are expressed as (ρ2, θ2), where ρ2 represents the distance between the pole O and the Q point, θ2 represents the connection between the Q point and the pole O The angle between the line and the first ray M. Then the coordinates of point P and point Q satisfy the following relationship: θ1=θ2=the angle between the first ray M and the second ray N, ρ1=S×ρ2, and S>1, that is, ρ1 is greater than ρ2.

亦即,凹槽111之開口114之輪廓與頂表面121之邊緣之輪廓相同,且在頂表面121之基礎上放大。That is, the contour of the opening 114 of the groove 111 is the same as the contour of the edge of the top surface 121, and is enlarged on the basis of the top surface 121.

於一實施例中,凹槽111之開口114之輪廓與頂表面121之邊緣之輪廓相同,且S≥1.5;於另一實施例中,1.5≤S≤1.75。In one embodiment, the contour of the opening 114 of the groove 111 is the same as the contour of the edge of the top surface 121, and S ≥ 1.5; in another embodiment, 1.5 ≤ S ≤ 1.75.

請參閱圖4,本實施例提供之成型裝置10,用於熱塑成型形成目標成型物件(圖未示),目標成型物件為光學薄膜。在成型製程中,先將薄膜材料20放置於承載部11上,此時薄膜材料20尚未進入凹槽111,然後在薄膜材料20遠離成型部12一側(圖4中複數平行箭頭指向方向)施加壓力使薄膜材料20進入凹槽111中並最終抵持成型部12之頂表面121。薄膜材料20進入凹槽111前可加熱軟化,亦可進入凹槽111後加熱使其軟化,使軟化之薄膜材料20抵持成型部12之頂表面121並被擠壓以成型為頂表面121之形狀。本實施例中,施加壓力之方式為以一機械壓頭直接向薄膜材料20施加壓力。Referring to FIG. 4, the molding device 10 provided in this embodiment is used to form a target molded object (not shown) by thermoforming. The target molded object is an optical film. In the forming process, the film material 20 is first placed on the bearing portion 11, the film material 20 has not yet entered the groove 111, and then the film material 20 is away from the forming portion 12 side (the plural parallel arrows in FIG. 4 point in the direction) The pressure causes the film material 20 to enter the groove 111 and finally bear against the top surface 121 of the forming portion 12. The film material 20 may be heated and softened before entering the groove 111, or may be heated and softened after entering the groove 111, so that the softened film material 20 bears against the top surface 121 of the forming portion 12 and is pressed to form the top surface 121 shape. In this embodiment, the method of applying pressure is to directly apply pressure to the film material 20 with a mechanical indenter.

為提供機械壓頭之容納空間,本實施例中,凹槽111之側壁113垂直於底壁112所在之平面且側壁113各處高度相等。凹槽之深度d1(亦即側壁113之高度)大於成型部12之最大高度d2(成型部12為一曲面,各處高度不等,因此具有最大高度)。In order to provide a receiving space for the mechanical indenter, in this embodiment, the side wall 113 of the groove 111 is perpendicular to the plane where the bottom wall 112 is located and the height of the side wall 113 is equal everywhere. The depth d1 of the groove (that is, the height of the side wall 113) is greater than the maximum height d2 of the molding portion 12 (the molding portion 12 is a curved surface, and the heights are not equal everywhere, so it has the maximum height).

於其他實施例中,施加壓力之方式亦可以為氣壓、液壓等方式,本發明不對此作限定。In other embodiments, the method of applying pressure may also be air pressure, hydraulic pressure, etc., which is not limited in the present invention.

請參閱圖5,保持施加壓力,使薄膜材料20緊貼成型部12頂表面121。與成型部12頂表面121緊貼之部分薄膜材料20即為目標成型物件,其餘部分則為廢料。為了形成所需形狀之目標成型物件,成型部12頂表面121設置為與目標成型物件之形狀一致。本實施例中,成型部12之頂表面121為一曲面,則目標成型物件為一曲面光學薄膜。Please refer to FIG. 5 to keep the pressure applied so that the film material 20 is in close contact with the top surface 121 of the forming portion 12. A part of the film material 20 which is in close contact with the top surface 121 of the forming part 12 is the target forming object, and the rest is waste. In order to form a target shaped object of a desired shape, the top surface 121 of the forming portion 12 is set to conform to the shape of the target shaped object. In this embodiment, the top surface 121 of the molding portion 12 is a curved surface, and the target molding object is a curved optical film.

本實施例提供之成型裝置10,藉由將凹槽111之開口114之輪廓設置為與成型部12頂表面121之邊緣之輪廓相同,熱塑成型製程中薄膜材料20被擠壓時,薄膜材料20邊緣應力相對較小,整個受力面之應力相對均衡,有助於保持薄膜材料20之結構不變,使得薄膜材料20保持原有特性。因此有利於改善熱塑成型製程中薄膜材料20上應力太強導致薄膜材料受到拉扯,結構發生變化進而光學特性等受到影響之問題。In the molding device 10 provided in this embodiment, by setting the contour of the opening 114 of the groove 111 to be the same as the contour of the edge of the top surface 121 of the molding portion 12, when the film material 20 is extruded in the thermoplastic molding process, the film material The edge stress of 20 is relatively small, and the stress on the entire bearing surface is relatively balanced, which helps to maintain the structure of the film material 20 unchanged, so that the film material 20 maintains the original characteristics. Therefore, it is beneficial to improve the problem that the film material 20 is pulled too strongly in the thermoplastic molding process, the film material is pulled, the structure changes, and the optical characteristics are affected.

以下是對比例之成型裝置與本案中之成型裝置10之效果對照:The following is a comparison of the effects of the molding device of the comparative example and the molding device 10 in this case:

請參閱表一:表一為採用對比例之成型裝置(承載部之凹槽之開口為圓形,成型部與上述成型部12完全相同,頂表面為不規則之形狀),向薄膜材料施加之壓力與薄膜材料邊緣之應力之間之關係。表一中以成型裝置開口為圓柱狀為例,展示了開口直徑分別為65mm與70mm兩組數據: 表一

Figure 107144230-A0304-0001
Please refer to Table 1: Table 1 uses a comparative molding device (the opening of the groove of the bearing part is circular, the molding part is exactly the same as the molding part 12 above, and the top surface is an irregular shape), which is applied to the film material The relationship between pressure and stress on the edge of the film material. In Table 1, taking the cylindrical opening of the molding device as an example, two sets of data with opening diameters of 65 mm and 70 mm are shown: Table 1
Figure 107144230-A0304-0001

請參閱表二:表二為採用本案中之成型裝置10,向薄膜材料20施加之壓力與薄膜材料20邊緣之應力之間之關係。表二中展示了凹槽111之開口114相對成型部12之頂表面121放大比例分別為1.5(即S=1.5)與1.75(即S=1.75)時兩組數據: 表二

Figure 107144230-A0304-0002
Please refer to Table 2: Table 2 shows the relationship between the pressure applied to the film material 20 and the stress on the edge of the film material 20 using the forming device 10 in this case. Table 2 shows the two sets of data when the enlargement ratio of the opening 114 of the groove 111 relative to the top surface 121 of the forming portion 12 is 1.5 (ie S=1.5) and 1.75 (ie S=1.75): Table 2
Figure 107144230-A0304-0002

參閱表一中第五組數據、表二中第一組數據、表二中第六組數據,上述三組數據中,對薄膜材料20施加壓力均為0.3,當對薄膜材料20施加壓力為0.3時,採用對比例成型裝置,薄膜材料邊緣應力為4.4141%(表一中第一組數據),而採用本案中之成型裝置10時,薄膜材料20邊緣之應力分別為2.4588%(表二中第一組數據)而2.5087%(表二中第六組數據),說明,在對薄膜材料施加相同壓力時,採用本案中之成型裝置10比採用對比例成型裝置,薄膜材料邊緣之應力要小。Refer to the fifth set of data in Table 1, the first set of data in Table 2, and the sixth set of data in Table 2. In the above three sets of data, the pressure applied to the film material 20 is all 0.3, when the pressure applied to the film material 20 is 0.3 When using the comparative molding device, the film material edge stress is 4.4141% (the first set of data in Table 1), while using the molding device 10 in this case, the film material 20 edge stress is 2.4588% (Table 2 One set of data) and 2.5087% (the sixth set of data in Table 2) show that when the same pressure is applied to the film material, using the forming device 10 in this case is less stressful than the comparative example forming device.

進一步之,請參閱表一中第一組數據而表二中第一組數據,採用對比例成型裝置,對薄膜材料施加壓力為0.138時,薄膜材料邊緣之應力達到2.4588%,而採用本案中之成型裝置10,對薄膜材料20施加壓力為0.3,薄膜材料20邊緣之應力才與對比例一致。則說明,若於一實施例中,薄膜材料邊緣可承受應力為2.4588%時,採用本案中之成型裝置10比採用對比例成型裝置,薄膜材料可承受之壓力範圍更大。Further, please refer to the first set of data in Table 1 and the first set of data in Table 2, using a comparative molding device, when the pressure on the film material is 0.138, the stress on the edge of the film material reaches 2.4588%, and the The forming device 10 applies a pressure of 0.3 to the film material 20 so that the stress on the edge of the film material 20 is consistent with the comparative example. It means that, in an embodiment, if the film material edge can withstand a stress of 2.4588%, using the molding device 10 in this case is greater than the comparative molding device, the film material can withstand a larger pressure range.

根據上述分析,本實施例提供之成型裝置10,藉由將凹槽111之開口114之輪廓設置為與成型部12頂表面121之邊緣之輪廓相同,可有效改善熱塑成型製程中薄膜材料20上應力導致薄膜材料光學特性受到影響之問題。Based on the above analysis, the molding device 10 provided in this embodiment can effectively improve the film material 20 in the thermoplastic molding process by setting the contour of the opening 114 of the groove 111 to be the same as the contour of the edge of the top surface 121 of the molding portion 12 The upper stress causes the problem that the optical properties of the thin film material are affected.

本技術領域之普通技術人員應當認識到,以上之實施方式僅是用來說明本發明,而並非用作為對本發明之限定,只要於本發明之實質精神範圍之內,對以上實施例所作之適當改變及變化均落於本發明要求保護之範圍之內。Persons of ordinary skill in the art should realize that the above embodiments are only used to illustrate the present invention, and are not used to limit the present invention, as long as they are within the scope of the spirit of the present invention, the above embodiments are appropriate Changes and changes fall within the scope of the claimed invention.

10:成型裝置 11:承載部 12:成型部 111:凹槽 112:底壁 113:側壁 114:開口 121:頂表面 d1:深度 d2:高度 O:極點 M:第一射線 N:第二射線 P、Q:交點 X、Y:曲線 20:薄膜材料 D1、D2:開口直徑 10: Molding device 11: Carrying Department 12: Molding Department 111: groove 112: bottom wall 113: Side wall 114: opening 121: top surface d1: depth d2: height O: pole M: first ray N: second ray P, Q: intersection X, Y: Curve 20: Film material D1, D2: opening diameter

圖1為本發明實施例一提供之成型裝置之立體結構示意圖。FIG. 1 is a three-dimensional schematic diagram of a molding device provided by Embodiment 1 of the present invention.

圖2為圖1沿Ⅱ-Ⅱ方向之剖面結構示意圖。FIG. 2 is a schematic diagram of the cross-sectional structure of FIG. 1 along the direction II-II.

圖3為凹槽開口而成型部頂表面之投影圖形。Fig. 3 is a projection pattern of the top surface of the molding portion of the groove opening.

圖4為成型裝置之使用狀態之剖面示意圖。Fig. 4 is a schematic cross-sectional view of the use state of the molding device.

圖5為成型裝置之使用狀態之另一剖面示意圖。5 is another schematic cross-sectional view of the use state of the molding device.

10:成型裝置 10: Molding device

11:承載部 11: Carrying Department

12:成型部 12: Molding Department

111:凹槽 111: groove

112:底壁 112: bottom wall

113:側壁 113: Side wall

114:開口 114: opening

121:頂表面 121: top surface

Claims (10)

一種成型裝置,其改良在於,包括: 承載部,所述承載部上設置有一凹槽,所述凹槽具有一底壁及與所述底壁連接之側壁;及 成型部,所述成型部設置於所述底壁上且與所述側壁相間隔,所述成型部具有一遠離底壁之頂表面,所述頂表面用以承載待成型之產品; 所述凹槽之開口之輪廓與所述頂表面之邊緣之輪廓相同。An improvement of a molding device includes: a bearing portion provided with a groove provided with a bottom wall and a side wall connected to the bottom wall; and a molding portion provided with the molding portion On the bottom wall and spaced from the side wall, the forming part has a top surface away from the bottom wall, the top surface is used to carry the product to be formed; the contour of the opening of the groove and the The contours of the edges of the top surface are the same. 如請求項1所述之成型裝置,其中,所述開口之輪廓與所述頂表面在與所述凹槽之所述底壁之上形成之投影圖形,滿足以下關係: 在所述投影面上建立極坐標系,以所述頂表面之投影圖形之幾何中心為極點,所述開口之輪廓之投影圖形之點之坐標表示為(ρ1,θ1),所述頂表面之輪廓之投影圖形之點之坐標表示為(ρ2,θ2),ρ1、ρ2為點與極點之距離,θ1、θ2為點而極點之間之連線與極軸之間之夾角; 其中,當θ1=θ2時,ρ1=S×ρ2,S>1。The molding device according to claim 1, wherein the contour of the opening and the projection pattern formed by the top surface and the bottom wall of the groove satisfy the following relationship: On the projection surface Establish a polar coordinate system, taking the geometric center of the projection pattern of the top surface as the pole, the coordinates of the point of the projection pattern of the outline of the opening are expressed as (ρ1, θ1), and the point of the projection pattern of the contour of the top surface The coordinates are expressed as (ρ2, θ2), ρ1, ρ2 are the distance between the point and the pole, θ1, θ2 are the points and the angle between the line between the poles and the polar axis; where, when θ1=θ2, ρ1= S×ρ2, S>1. 如請求項2所述之成型裝置,其中:S≥1.5。The molding device according to claim 2, wherein: S≥1.5. 如請求項2所述之成型裝置,其中:1.5≤S≤1.75。The molding device according to claim 2, wherein: 1.5≤S≤1.75. 如請求項1所述之成型裝置,其中,所述凹槽之深度大於所述成型部之高度。The molding device according to claim 1, wherein the depth of the groove is greater than the height of the molding portion. 如請求項1所述之成型裝置,其中,所述成型部之所述頂表面之輪廓與目標成型物件之輪廓一致。The molding device according to claim 1, wherein the contour of the top surface of the molding portion coincides with the contour of the target molding object. 如請求項6所述之成型裝置,其中,所述成型部之所述頂表面為一曲面。The molding device according to claim 6, wherein the top surface of the molding portion is a curved surface. 如請求項6所述之成型裝置,其中,所述成型部之所述頂表面為一平面。The molding device according to claim 6, wherein the top surface of the molding portion is a flat surface. 如請求項1所述之成型裝置,其中,所述承載部而所述成型部一體成型。The molding device according to claim 1, wherein the carrying portion and the molding portion are integrally molded. 如請求項1所述之成型裝置,其中,所述成型部以可拆卸方式設置於所述凹槽之底壁。The molding device according to claim 1, wherein the molding portion is detachably provided on the bottom wall of the groove.
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