WO2016086536A1 - Oled材料真空热蒸镀用掩模板 - Google Patents

Oled材料真空热蒸镀用掩模板 Download PDF

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Publication number
WO2016086536A1
WO2016086536A1 PCT/CN2015/072481 CN2015072481W WO2016086536A1 WO 2016086536 A1 WO2016086536 A1 WO 2016086536A1 CN 2015072481 W CN2015072481 W CN 2015072481W WO 2016086536 A1 WO2016086536 A1 WO 2016086536A1
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WIPO (PCT)
Prior art keywords
mask
insert
hole
thermal evaporation
groove
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Ceased
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PCT/CN2015/072481
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English (en)
French (fr)
Inventor
吴聪原
刘亚伟
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/429,352 priority Critical patent/US9896759B2/en
Publication of WO2016086536A1 publication Critical patent/WO2016086536A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of fabrication of organic light emitting diode displays, and more particularly to a mask for vacuum thermal evaporation of OLED materials.
  • OLED Organic Light Emitting Diode
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • the functional material layer and the cathode metal layer film of the OLED are prepared by a vacuum thermal evaporation process, and the vacuum thermal evaporation process requires the use of a mask.
  • the role of the mask is to evaporate the OLED material to the design location, so the location, shape and surface flatness of the mask are important.
  • FIG. 1 is a schematic view showing a vacuum thermal evaporation process of an OLED material, in which an OLED material 200 to be evaporated is added in a crucible 100, and in a vacuum environment of less than 10 ⁇ 5 Pa, the crucible 100 is slowly heated to reach the gas of the OLED material 200. After the temperature, the OLED material 200 gradually becomes gaseous sublimation, and passes through the opening of the mask 300, and gaseous molecules are deposited on the surface of the substrate 400, and are cooled and solidified into solid molecules. The continuous accumulation of molecules of the OLED material slowly forms a thin film on the substrate 400.
  • FIG. 2 to FIG. 6 are schematic diagrams of a process for fabricating a mask for vacuum thermal evaporation of an existing OLED material.
  • the manufacturing process generally includes: Step 1. As shown in FIG. 2, a stainless steel mask frame 10 is formed; and in step 2, as shown in FIG. 3, a mask substrate 20' is provided, and the mask substrate 20' is generally 50. a micron or 100 micron sheet of stainless steel or nickel-iron alloy steel; step 3, as shown in FIG. 4, the mask substrate 20' is patterned, that is, a small hole 21 is formed in the mask substrate 20' to form a mask. 20; Step 4, as shown in FIG.
  • Step 5 a certain force is applied around the mask 20 to make the surface flat, and the opening 21 is not deformed, and then the mask 20 is aligned with the mask frame 10; Step 5 As shown in FIG. 6, laser spot welding causes the mask 20 to be soldered to the mask frame 10. After the above manufacturing process is completed, the mask 20 is flattened, the opening 21 is not deformed, and the mask 20 can be conveniently accessed by moving the mask frame 10.
  • the mask After the mask is used for a period of time, a certain thickness of the OLED material is deposited on the upper side, which is liable to cause the mask to sag under the action of gravity, and the OLED material may also block the opening or reduce the effective size of the opening. Therefore, after a certain period of time, the mask needs to be cleaned and even replaced with a new mask.
  • the original mask When a new mask needs to be replaced, the original mask needs to be separated from the mask frame, the mask is removed, and the surface of the mask frame is polished. Because the original spot weld position should be raised, the mask frame surface needs to be ground to a flat surface (with a flatness of 50 microns). At the same time, in the original spot welding position, the heat during welding is equal to the heat treatment of the solder joint position, resulting in the hardness of the spot welding position becoming larger, so this hard layer needs to be removed by grinding so as not to affect the next mask. Spot welding effect.
  • the mask frame is polished a plurality of times, and the thickness is gradually thinned, which not only affects the structural strength of the frame, but also affects the alignment position of the mask in the evaporation device. Therefore, after the mask frame is polished and polished to a certain thickness, it needs to be scrapped, and the mask frame needs to be transported to a manufacturer with a large polishing grinder for polishing and polishing, which is time consuming, so it is necessary to make a plurality of mask frames for use, resulting in production cost. increase.
  • the object of the present invention is to provide a mask for vacuum thermal evaporation of OLED materials, which can repeatedly use the mask frame to reduce the amount of waste of the mask frame, improve the utilization rate of the mask frame, and reduce the mask.
  • the number of backups of the border saves materials and production costs.
  • the present invention provides a mask for vacuum thermal evaporation of an OLED material, comprising a mask frame, a insert fixed to the mask frame, and a mask fixed on the insert;
  • the mask frame includes four sides, and the four sides surround an opening corresponding to the mask; the surface of the mask frame adjacent to the mask side is defined as an upper surface, and each side of the mask frame is provided with a recess a groove on the upper surface thereof;
  • the insert is fixed in the groove; the mask is fixed on the insert by spot welding, and the solder joint is located on the insert.
  • the insert forms a tight fit with the groove in a tight fit.
  • At least two first stepped holes are disposed under each of the grooves, the first stepped holes include a first sinking hole and a light hole through hole; the insert is provided with a threaded hole corresponding to the first stepped hole; A screw is inserted into the threaded hole through the through hole of the optical hole to fix the insert in the groove.
  • At least one second stepped hole is further disposed under each of the grooves, the second stepped hole includes a second sinker hole and a threaded through hole; a second screw is screwed into the threaded through hole; Groove When the insert is taken out, the second screw can be rotated to raise it, and the insert can be pushed out of the groove.
  • the width of the trench is greater than 1.5 times the diameter of the solder joint, and the depth of the trench is less than 1/2 of the thickness of the mask frame.
  • the groove has the same cross-sectional shape as the insert, and is square or rectangular.
  • the depth of the first sinkhole and the second sinkhole is less than 1/3 of the thickness of the mask frame.
  • the upper surface of the insert has the same flatness as the upper surface of the mask frame, and is controlled within 50 microns.
  • the insert has the same material as the mask frame and is stainless steel.
  • the inserts are in one piece or in combination.
  • the invention also provides a mask for vacuum thermal evaporation of an OLED material, comprising a mask frame, a insert fixed on the frame of the mask, and a mask fixed on the insert;
  • the mask frame includes four sides, and the four sides surround an opening corresponding to the mask; the surface of the mask frame adjacent to the mask side is defined as an upper surface, and each side of the mask frame is provided with a recess a groove on the upper surface thereof;
  • first stepped holes are disposed under each of the grooves, the first stepped holes include a first sinking hole and a light hole through hole; the insert is provided with a threaded hole corresponding to the first stepped hole; A first screw is inserted into the threaded hole through the optical hole through hole to fix the insert in the groove.
  • the invention provides a mask for vacuum thermal evaporation of an OLED material, wherein grooves are respectively arranged on four sides of the mask frame, the insert is fixed in the groove, and the mask is passed through the point. Soldering is fixed on the insert; when the mask is deformed and needs to be replaced, the insert only needs to be taken out and polished, without the need to transport the entire mask frame to a manufacturer with a large polishing grinder for polishing and polishing. It saves time and effort, avoids the thinning of the mask frame caused by polishing and the scrapping caused by multiple polishing of the mask frame; when the insert is polished many times and the thickness is unqualified, the insert can be replaced.
  • FIG. 1 is a schematic view of a vacuum thermal evaporation process of an OLED material
  • FIG. 2 is a schematic view showing a first step 1 of a mask manufacturing process for vacuum thermal evaporation of an OLED material
  • FIG. 3 is a schematic view showing a step 2 of a conventional mask manufacturing process for vacuum thermal evaporation of an OLED material
  • FIG. 4 is a schematic view showing a step 3 of a conventional mask manufacturing process for vacuum thermal evaporation of an OLED material
  • FIG. 5 is a schematic view showing a step 4 of a conventional mask manufacturing process for vacuum thermal evaporation of an OLED material
  • FIG. 6 is a schematic view showing a step 5 of a conventional mask manufacturing process for vacuum thermal evaporation of an OLED material
  • FIG. 7 is a top plan view showing a mask for vacuum thermal evaporation of an OLED material according to the present invention.
  • FIG. 8 is an exploded perspective view of a mask frame and a cutting insert of a mask for vacuum thermal evaporation of an OLED material according to the present invention
  • FIG. 9 is a schematic cross-sectional view showing a corresponding stepped hole in a mask for vacuum thermal evaporation of an OLED material according to the present invention.
  • FIG. 10 is a schematic cross-sectional view showing a second stepped hole in a mask for vacuum thermal evaporation of an OLED material according to the present invention.
  • the present invention provides a mask for vacuum thermal evaporation of an OLED material, comprising a mask frame 1, a insert 3 fixed on the mask frame 1, and fixed to the Mask 5 on the insert 3.
  • the mask frame 1 includes four sides, and the four sides surround an opening corresponding to the mask 5.
  • the surface of the mask frame 1 near the side of the mask 5 is defined as an upper surface, and each side of the mask frame 1 is provided with a groove 11 recessed on the upper surface thereof.
  • the insert 3 is fixed in the groove 11.
  • the mask 5 is fixed to the insert 3 by spot welding, and the solder joint 7 is located on the insert 3.
  • the mask 5 includes a plurality of openings 51 extending through the thickness thereof, and the plurality of openings 51 penetrating the thickness of the mask 5 constitute a pattern corresponding to the area to be evaporated of the OLED.
  • the insert 3 has the same cross-sectional shape as the groove 11, and may be, but not limited to, a square or a rectangle, and the insert 3 and the groove 11 are closely matched in size. .
  • the width of the groove 11 should be greater than 1.5 times the diameter of the solder joint 7 to accommodate the solder joint 7.
  • the depth of the trench 11 should be less than 1/2 of the thickness of the mask frame 1.
  • the upper surface of the insert 3 has the same flatness as the upper surface of the mask frame 1, and is controlled within 50 micrometers to ensure the flatness of the mask 5 after fixing, so that the mask 5 is accurately aligned.
  • the insert 3 and the mask frame 1 are made of the same material and are all stainless steel.
  • the insert 3 is integral or combined, that is, the insert 3 can be a complete integral rectangular frame as shown in FIG. 8, or can be combined by two, three, four, or eight inserts. Together form a rectangular frame.
  • At least two first stepped holes 13 are disposed under each of the grooves 11, and the first stepped holes 13 include a first sinking hole 131 and a light hole through hole 133.
  • the at least two first stepped holes 13 are symmetrical about a center line of the mask frame 1.
  • the insert 3 is provided with a threaded hole 33 corresponding to the first stepped hole 13 .
  • a first screw 91 is engaged in the threaded hole 33 through the light hole through hole 133, thereby fixing the insert 3 in the groove 11.
  • the depth of the first sinker hole 131 is less than 1/3 of the thickness of the mask frame 1 , and the function is to accommodate the head of the first screw 91 to prevent the head of the first screw 91 from protruding from the mask frame 1 The lower surface.
  • the polishing grinder manufacturer performs grinding and polishing, which is simple in operation, saves time and labor, and avoids thinning of the mask frame 1 caused by polishing and scrapping due to multiple polishing of the mask frame 1; when the insert 3 is excessive When the thickness is unqualified, the new insert 3 can be replaced, and the entire mask frame 1 is not scrapped, so that the mask frame 1 can be repeatedly used multiple times, reducing the scrap amount of the mask frame 1 and improving the masking.
  • the utilization rate of the film frame 1 can reduce the number of backups of the mask frame 1 at the same time, and only need to back up several sets of inserts 3, thereby saving material and production cost.
  • each groove 11 is further disposed below There is at least one second stepped hole 15 including a second sinker hole 151 and a threaded through hole 153, and the insert 3 has no opening at a position corresponding to the second stepped hole 15;
  • the second screw 93 is screwed into the threaded through hole 153, and the threaded portion of the second screw 93 is long; when the insert 3 is to be taken out from the groove 11, the second screw 93 can be rotated To raise it, the insert 3 is pushed out of the groove 11, and the insert 3 can be easily taken out from the groove 11.
  • the depth of the second sinker hole 151 is less than 1/3 of the thickness of the mask frame 1, and its function is to prevent the burr generated during the rotation of the thread from affecting the flatness of the lower surface of the mask frame 1.
  • the mask for vacuum thermal evaporation of the above OLED material is applied to vapor deposition of an OLED organic material and an inorganic material such as lithium fluoride (LiF).
  • an inorganic material such as lithium fluoride (LiF).
  • the mask can also be applied to other fields of vacuum thermal evaporation.
  • the mask for vacuum thermal evaporation of the OLED material of the present invention is provided with grooves on the four sides of the mask frame, the insert is fixed in the groove, and the mask is fixed by spot welding.
  • the insert On the strip; when the mask deformation needs to be replaced, the insert only needs to be taken out and polished, without the need to transport the entire mask frame to a manufacturer with a large polishing grinder for polishing and polishing, which is simple in operation, saves time and effort It avoids the thinning of the mask frame caused by polishing and the scrapping caused by multiple polishing of the mask frame; when the insert is polished many times and the thickness is unqualified, the insert can be replaced without the need to The mask frame is scrapped, so that the mask frame can be repeatedly used multiple times, reducing the amount of scrapping of the mask frame, improving the utilization of the mask frame, and reducing the number of backups of the mask frame, and only need to back up several sets of inserts. Yes, saving materials and production costs.

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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Abstract

本发明提供一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框(1)、固定于所述掩膜边框(1)上的插条(3)、及固定于所述插条(3)上的掩膜(5)；所述掩膜边框(1)包括四条边，该四条边围拢出一对应掩膜(5)的开口；掩膜边框(1)的每条边均设置一条凹陷于其上表面的沟槽(11)；所述插条(3)固定于所述沟槽(11)内；所述掩膜(5)通过点焊固定于插条(3)上，焊点(7)位于插条(3)上。当掩膜变形需要更换时，仅需将插条取出进行抛光、或更换插条即可，掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，节约材料及生产成本。

Description

OLED材料真空热蒸镀用掩模板 技术领域
本发明涉及有机发光二极管显示器的制作领域，尤其涉及一种OLED材料真空热蒸镀用掩模板。
背景技术
有机发光二级管显示器(Organic Light Emitting Diode，OLED)是一种极具发展前景的平板显示技术，它具有十分优异的显示性能，特别是自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，再加上其生产设备投资远小于TFT-LCD，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。OLED各功能材料层与阴极金属层薄膜通过真空热蒸镀工艺制备，真空热蒸镀工艺需要使用到掩膜板(Mask)。掩膜板的作用是使OLED材料蒸镀到设计的位置，因此掩膜板的开孔位置、形状以及表面平整度都相当重要。图1所示为OLED材料真空热蒸镀过程的示意图，坩埚100内添置有待蒸镀的OLED材料200，在小于10-5Pa的真空度环境下，坩埚100缓慢升温，到达OLED材料200的气化温度以后，OLED材料200慢慢变成气态升华上来，穿过掩膜板300的开孔，气态分子在基板400表面沉积，并降温凝结成固态分子。OLED材料分子的不断堆积慢慢形成薄膜于基板400上。
请参阅图2至图6，为现有的OLED材料真空热蒸镀用掩膜板制作过程的示意图。该制作过程一般包括：步骤1、如图2所示，制作不锈钢掩膜边框(Frame)10；步骤2、如图3所示，提供掩膜基板20’，该掩膜基板20’一般是50微米或者100微米的不锈钢或镍铁合金钢的薄片；步骤3、如图4所示，对掩膜基板20’进行图案化处理，即在掩膜基板20’上开一些小孔21，形成掩膜20；步骤4、如图5所示，在掩膜20四周施加一定的力，使其表面平整，并且开孔21无变形，然后将掩膜20与掩膜边框10对位好；步骤5、如图6所示，激光点焊，使掩膜20与掩膜边框10焊接在一起。完成上述制作过程后，掩膜20就会表面平整，开孔21无形变，并且通过挪动掩膜边框10可以方便取用掩膜20。
掩膜在使用一段时间后，上边会沉积一定厚度的OLED材料，在重力作用下容易导致掩膜下垂变形，而且OLED材料也可能堵塞开孔，或者使开孔有效尺寸变小。所以，掩膜在使用一定的时间后，就需要进行清洗，甚至要更换一张新的掩膜。
当需要更换一张新的掩膜时，需要把原来的掩膜与掩膜边框分离，去掉掩膜，并对掩膜边框表面进行研磨抛光。因为原来的点焊位置应该有凸起，需要将掩膜边框表面研磨成平面(平面度在50微米内)。同时，在原来的点焊位置，焊接时的热量也等于是给焊点位置进行了热处理，导致点焊位置硬度变大，所以这一层硬化层也需要研磨去掉，以便不影响下一片掩膜的点焊效果。
这样的情况下，多次更换掩膜后，掩膜边框经过多次抛光，厚度会逐渐变薄，不仅影响到边框的结构强度，也会影响到掩膜在蒸镀设备里的对位位置。所以，掩膜边框经过研磨抛光一定的厚度后就需要报废，并且掩膜边框需要运输到有大型抛光磨床的厂家进行研磨抛光，比较耗时，所以需要制作多块掩膜边框备用，导致生产成本增加。
发明内容
本发明的目的在于提供一种OLED材料真空热蒸镀用掩膜板，其掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，节约材料及生产成本。
为实现上述目的，本发明提供一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所述掩膜边框上的插条、及固定于所述插条上的掩膜；
所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边均设置一条凹陷于其上表面的沟槽；
所述插条固定于所述沟槽内；所述掩膜通过点焊固定于插条上，焊点位于插条上。
所述插条与所述沟槽在尺寸上形成紧密配合无缝隙。
每条沟槽下方设有至少两个第一阶梯孔，所述第一阶梯孔包括第一下沉孔及光孔通孔；所述插条对应所述第一阶梯孔设有螺纹孔；一第一螺钉穿过所述光孔通孔锁合于螺纹孔内，从而将所述插条固定于所述沟槽内。
每条沟槽下方还设有至少一个第二阶梯孔，所述第二阶梯孔包括第二下沉孔及螺纹通孔；一第二螺钉旋合于所述螺纹通孔内；当需从所述沟槽 内取出插条时，能够通过旋转该第二螺钉，使其上升，将所述插条顶出沟槽。
所述沟槽的宽度大于焊点直径的1.5倍，所述沟槽的深度小于掩膜边框厚度的1/2。
所述沟槽与插条的横截面形状相同，均为正方形或长方形。
所述第一下沉孔与第二下沉孔的深度小于掩膜边框厚度的1/3。
所述插条的上表面与掩膜边框的上表面的平整度相同，均控制在50微米以内。
所述插条与掩膜边框的材质相同，均为不锈钢。
所述插条为整体式或组合式。
本发明还提供一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所述掩膜边框上的插条、及固定于所述插条上的掩膜；
所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边均设置一条凹陷于其上表面的沟槽；
所述插条固定于所述沟槽内；所述掩膜通过点焊固定于插条上，焊点位于插条上；
其中，所述插条与所述沟槽在尺寸上形成紧密配合无缝隙；
其中，每条沟槽下方设有至少两个第一阶梯孔，所述第一阶梯孔包括第一下沉孔及光孔通孔；所述插条对应所述第一阶梯孔设有螺纹孔；一第一螺钉穿过所述光孔通孔锁合于螺纹孔内，从而将所述插条固定于所述沟槽内。
本发明的有益效果：本发明提供的一种OLED材料真空热蒸镀用掩膜板，在掩膜边框的四条边上分别设置沟槽，将插条固定于沟槽内，将掩膜通过点焊固定于插条上；当掩膜变形需要更换时，仅需要将插条取出并进行抛光处理即可，而不需要将整个掩膜边框运输到有大型抛光磨床的厂家进行研磨抛光，操作简单，省时省力，避免了因抛光引起的掩膜边框厚度变薄及由于对掩膜边框多次抛光导致的报废；当插条经多次抛光，厚度不合格时，更换插条即可，而不需要将整个掩膜边框报废，从而掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，只需多备份几套插条即可，节约材料及生产成本。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发 明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为OLED材料真空热蒸镀过程的示意图；
图2为现有的OLED材料真空热蒸镀用掩膜板制作过程步骤1的示意图；
图3为现有的OLED材料真空热蒸镀用掩膜板制作过程步骤2的示意图；
图4为现有的OLED材料真空热蒸镀用掩膜板制作过程步骤3的示意图；
图5为现有的OLED材料真空热蒸镀用掩膜板制作过程步骤4的示意图；
图6为现有的OLED材料真空热蒸镀用掩膜板制作过程步骤5的示意图；
图7为本发明OLED材料真空热蒸镀用掩模板的平面俯视示意图；
图8为本发明OLED材料真空热蒸镀用掩模板的掩膜边框与插条的立体分解图；
图9为本发明OLED材料真空热蒸镀用掩模板中对应第一阶梯孔处的剖面示意图；
图10为本发明OLED材料真空热蒸镀用掩模板中对应第二阶梯孔处的剖面示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请同时参阅图7至图10，本发明提供一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框1、固定于所述掩膜边框1上的插条3、及固定于所述插条3上的掩膜5。
所述掩膜边框1包括四条边，该四条边围拢出一对应掩膜5的开口。将所述掩膜边框1靠近掩膜5一侧的表面定义为上表面，掩膜边框1的每条边均设置一条凹陷于其上表面的沟槽11。
所述插条3固定于所述沟槽11内。所述掩膜5通过点焊固定于插条3上，焊点7位于插条3上。
所述掩膜5包括多个贯穿其厚度的开孔51，所述多个贯穿掩膜5厚度的开孔51构成与OLED欲蒸镀区域相对应的图案。
具体的，所述插条3与所述沟槽11的横截面形状相同，均可以但不限于为正方形或长方形，且所述插条3与所述沟槽11在尺寸上形成紧密配合无缝隙。
所述沟槽11的宽度应大于焊点7直径的1.5倍，以足够容纳焊点7。所述沟槽11的深度应小于掩膜边框1厚度的1/2。
所述插条3的上表面与掩膜边框1的上表面的平整度相同，均控制在50微米以内，以保证掩膜5固定后的平整度，使掩膜5准确对位。
所述插条3与掩膜边框1的材质相同，均为不锈钢。
所述插条3为整体式或组合式，即所述插条3可以如图8所示，是一个完整的整体式矩形框，也可以由两根、三根、四根、或八根插条组合在一起形成一个矩形框。
进一步的，如图9所示，每条沟槽11下方设有至少两个第一阶梯孔13，所述第一阶梯孔13包括第一下沉孔131及光孔通孔133，较佳的，所述至少两个第一阶梯孔13关于掩膜边框1的中心线对称。所述插条3对应所述第一阶梯孔13设有螺纹孔33。一第一螺钉91穿过所述光孔通孔133锁合于螺纹孔33内，从而将所述插条3固定于所述沟槽11内。所述第一下沉孔131的深度小于掩膜边框1厚度的1/3，其作用是容置所述第一螺钉91的头部，防止第一螺钉91的头部凸出掩膜边框1的下表面。
采用上述结构，当所述掩膜5变形需要更换时，仅需松动所述第一螺钉91，将插条3取下进行抛光处理即可，而不需要将整个掩膜边框1运输到有大型抛光磨床的厂家进行研磨抛光，操作简单，省时省力，避免了因抛光引起的掩膜边框1厚度变薄及由于对掩膜边框1多次抛光导致的报废；当所述插条3经多次抛光，厚度不合格时，更换新的插条3即可，而不需要将整个掩膜边框1报废，从而掩膜边框1能够重复多次使用，减少掩膜边框1的报废量，提高掩膜边框1的利用率，同时能够减少掩膜边框1的备份数量，只需多备份几套插条3即可，节约材料及生产成本。
由于所述插条3与所述沟槽11在尺寸上形成紧密配合无缝隙，当需要将插条3取出进行抛光或更换时，为便于插条3的取出，每条沟槽11下方还设有至少一个第二阶梯孔15，所述第二阶梯孔15包括第二下沉孔151及螺纹通孔153，而所述插条3在对应第二阶梯孔15的位置处没有开孔；一 第二螺钉93旋合于所述螺纹通孔153内，且该第二螺钉93的螺纹段较长；当需从所述沟槽11内取出插条3时，能够通过旋转该第二螺钉93，使其上升，将所述插条3顶出沟槽11，可方便的将插条3从沟槽11内取出。第二下沉孔151的深度小于掩膜边框1厚度的1/3，其作用是防止螺纹旋转过程中产生的毛刺对掩膜边框1下表面的平整度造成影响。
上述OLED材料真空热蒸镀用掩膜板应用于OLED有机材料以及氟化锂(LiF)等无机材料的蒸镀。当然，该掩膜板也可应用于其它真空热蒸镀领域。
综上所述，本发明的OLED材料真空热蒸镀用掩膜板，在掩膜边框的四条边上分别设置沟槽，将插条固定于沟槽内，将掩膜通过点焊固定于插条上；当掩膜变形需要更换时，仅需要将插条取出并进行抛光处理即可，而不需要将整个掩膜边框运输到有大型抛光磨床的厂家进行研磨抛光，操作简单，省时省力，避免了因抛光引起的掩膜边框厚度变薄及由于对掩膜边框多次抛光导致的报废；当插条经多次抛光，厚度不合格时，更换插条即可，而不需要将整个掩膜边框报废，从而掩膜边框能够重复多次使用，减少掩膜边框的报废量，提高掩膜边框的利用率，同时能够减少掩膜边框的备份数量，只需多备份几套插条即可，节约材料及生产成本。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所述掩膜边框上的插条、及固定于所述插条上的掩膜；
    所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边均设置一条凹陷于其上表面的沟槽；
    所述插条固定于所述沟槽内；所述掩膜通过点焊固定于插条上，焊点位于插条上。
  2. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条与所述沟槽在尺寸上形成紧密配合无缝隙。
  3. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，每条沟槽下方设有至少两个第一阶梯孔，所述第一阶梯孔包括第一下沉孔及光孔通孔；所述插条对应所述第一阶梯孔设有螺纹孔；一第一螺钉穿过所述光孔通孔锁合于螺纹孔内，从而将所述插条固定于所述沟槽内。
  4. 如权利要求3所述的OLED材料真空热蒸镀用掩膜板，其中，每条沟槽下方还设有至少一个第二阶梯孔，所述第二阶梯孔包括第二下沉孔及螺纹通孔；一第二螺钉旋合于所述螺纹通孔内；当需从所述沟槽内取出插条时，能够通过旋转该第二螺钉，使其上升，将所述插条顶出沟槽。
  5. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述沟槽的宽度大于焊点直径的1.5倍，所述沟槽的深度小于掩膜边框厚度的1/2。
  6. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述沟槽与插条的横截面形状相同，均为正方形或长方形。
  7. 如权利要求4所述的OLED材料真空热蒸镀用掩膜板，其中，所述第一下沉孔与第二下沉孔的深度小于掩膜边框厚度的1/3。
  8. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条的上表面与掩膜边框的上表面的平整度相同，均控制在50微米以内。
  9. 如权利要求1所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条与掩膜边框的材质相同，均为不锈钢。
  10. 如权利要求4所述的OLED材料真空热蒸镀用掩膜板，其中，所述插条为整体式或组合式。
  11. 一种OLED材料真空热蒸镀用掩膜板，包括掩膜边框、固定于所 述掩膜边框上的插条、及固定于所述插条上的掩膜；
    所述掩膜边框包括四条边，该四条边围拢出一对应掩膜的开口；将所述掩膜边框靠近掩膜一侧的表面定义为上表面，掩膜边框的每条边均设置一条凹陷于其上表面的沟槽；
    所述插条固定于所述沟槽内；所述掩膜通过点焊固定于插条上，焊点位于插条上；
    其中，所述插条与所述沟槽在尺寸上形成紧密配合无缝隙；
    其中，每条沟槽下方设有至少两个第一阶梯孔，所述第一阶梯孔包括第一下沉孔及光孔通孔；所述插条对应所述第一阶梯孔设有螺纹孔；一第一螺钉穿过所述光孔通孔锁合于螺纹孔内，从而将所述插条固定于所述沟槽内。
  12. 如权利要求11所述的OLED材料真空热蒸镀用掩膜板，其中，每条沟槽下方还设有至少一个第二阶梯孔，所述第二阶梯孔包括第二下沉孔及螺纹通孔；一第二螺钉旋合于所述螺纹通孔内；当需从所述沟槽内取出插条时，能够通过旋转该第二螺钉，使其上升，将所述插条顶出沟槽。
  13. 如权利要求11所述的OLED材料真空热蒸镀用掩膜板，其中，所述沟槽的宽度大于焊点直径的1.5倍，所述沟槽的深度小于掩膜边框厚度的1/2。
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