WO2016079829A1 - ヒートポンプシステム - Google Patents
ヒートポンプシステム Download PDFInfo
- Publication number
- WO2016079829A1 WO2016079829A1 PCT/JP2014/080666 JP2014080666W WO2016079829A1 WO 2016079829 A1 WO2016079829 A1 WO 2016079829A1 JP 2014080666 W JP2014080666 W JP 2014080666W WO 2016079829 A1 WO2016079829 A1 WO 2016079829A1
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- Prior art keywords
- refrigerant
- pressure
- compressor
- heater
- substance
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B30/00—Heat pumps
- F25B30/02—Heat pumps of the compression type
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B40/00—Subcoolers, desuperheaters or superheaters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/04—Details of condensers
- F25B2339/047—Water-cooled condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/02—Compressor control
- F25B2600/025—Compressor control by controlling speed
- F25B2600/0253—Compressor control by controlling speed with variable speed
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/13—Pump speed control
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2501—Bypass valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2513—Expansion valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/19—Pressures
- F25B2700/193—Pressures of the compressor
- F25B2700/1931—Discharge pressures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2115—Temperatures of a compressor or the drive means therefor
- F25B2700/21152—Temperatures of a compressor or the drive means therefor at the discharge side of the compressor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2116—Temperatures of a condenser
- F25B2700/21163—Temperatures of a condenser of the refrigerant at the outlet of the condenser
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Definitions
- the present invention relates to a heat pump system.
- Patent Document 1 discloses a thermal cycle system using a working medium containing 1,1,2-trifluoroethylene (HFO-1123).
- the heat pump water heater is required to operate at a tapping temperature of 65 ° C. or higher as a countermeasure for preventing Legionella bacteria from breeding.
- the critical temperature of HFO-1123 is 59.2 ° C.
- HFO-1123 is used as a refrigerant for a heat pump water heater, there is a possibility that a portion where the state of the refrigerant is at or near the critical point of HFO-1123 may be generated inside the heater that exchanges heat between water and the refrigerant. .
- HFO-1123 A reaction that cleaves the double bond is promoted at and near the critical point of a substance having a carbon-carbon double bond, such as HFO-1123.
- HFO-1123 may be decomposed and may not function as a refrigerant.
- sludge is generated in the refrigerant circuit due to the decomposition products, which may cause clogging of the expansion valve and the like.
- the present invention has been made to solve the above-described problems, and is a heat pump system capable of suppressing decomposition of a substance having a carbon-carbon double bond contained in a refrigerant and increasing the heating temperature of a heat medium.
- the purpose is to provide.
- the heat pump system of the present invention includes a refrigerant containing a substance having a carbon-carbon double bond, a compressor that compresses the refrigerant, a pump that sends out a heat medium, and a heat medium that is connected to the compressor and sent by the pump.
- a heater that exchanges heat between the refrigerant and the refrigerant compressed by the compressor, a depressurizer that has an inlet and an outlet and depressurizes the refrigerant, and an evaporator that is connected to the depressurizer and evaporates the refrigerant depressurized by the depressurizer
- a control device that is connected to the compressor, the decompression device, and the pump and sequentially performs the first operation, the second operation, and the third operation after the start of the compressor.
- the specific enthalpy of the refrigerant at the inlet is kept at a higher level than the specific enthalpy of the critical point of the substance, and in the first operation, the refrigerant pressure between the compressor and the inlet of the decompression device becomes the critical pressure of the substance.
- Low pressure to critical pressure In the second operation, the refrigerant pressure between the compressor and the inlet of the decompression device is maintained at a level higher than the critical pressure, and in the second operation, the inlet of the decompression device
- the temperature of the heat medium flowing out from the heater is reduced to a lower level than the specific enthalpy of the critical point. It is kept at a higher level than the critical temperature.
- the heat pump system of the present invention it is possible to suppress the decomposition of the substance having a carbon-carbon double bond contained in the refrigerant and to increase the heating temperature of the heat medium.
- FIG. 2 is a Ph diagram, that is, a Mollier diagram, of a refrigerant circuit of a heat pump unit in a first operation.
- FIG. 10 is a Ph diagram, that is, a Mollier diagram, of the refrigerant circuit of the heat pump unit during the second operation and the third operation. It is a block diagram which shows the modification of the heat pump unit of Embodiment 1 of this invention. It is a graph which shows the change of the temperature and specific enthalpy of a refrigerant
- FIG. 1 is a configuration diagram of a heat pump unit 1 provided in the heat pump system according to Embodiment 1 of the present invention.
- the heat pump unit 1 of the first embodiment includes a refrigerant circuit.
- This refrigerant circuit includes a compressor 2, a heater 3, a decompression device 5, an evaporator 6, an accumulator 7, a high-low pressure heat exchanger 8, and a refrigerant pipe 10 connecting them.
- the refrigerant circuit of the heat pump unit 1 further includes a bypass passage 11 that bypasses the low-pressure portion 82 of the high-low pressure heat exchanger 8 and a bypass valve 13 that opens and closes the bypass passage 11.
- the heat pump unit 1 has a refrigerant sealed in a refrigerant circuit.
- the bypass passage 11 may be provided so as to bypass the high-pressure portion 81 of the high-low pressure heat exchanger 8.
- the heat pump unit 1 further includes a heat medium pipe 9, a blower 12 that blows air to the evaporator 6, a first refrigerant temperature sensor 14, a refrigerant pressure sensor 15, a second refrigerant temperature sensor 16, and a control device 50.
- a heat medium that is a fluid heated by the heat pump unit 1 flows through the heat medium pipe 9.
- the heat medium pipe 9 has an inlet 91 and an outlet 92.
- the heat medium is water.
- the heat medium in the present invention may be a liquid other than water, such as an antifreeze liquid or brine.
- the heat pump unit 1 according to the first embodiment is used as a hot water supply device.
- the heat pump system in the present invention can be applied to a heating medium used for applications other than hot water supply (for example, heating).
- the high / low pressure heat exchanger 8 has a high pressure part 81 and a low pressure part 82.
- the high-pressure refrigerant that has passed through the refrigerant flow path 31 of the heater 3 flows into the high-pressure portion 81 of the high-low pressure heat exchanger 8.
- the decompression device 5 has a variable opening. As the decompression device 5, for example, an expansion valve can be used.
- the inlet of the decompression device 5 is connected to the outlet of the high pressure part 81 of the high / low pressure heat exchanger 8.
- the outlet of the decompression device 5 is connected to the inlet of the evaporator 6.
- the high-pressure refrigerant that has passed through the high-pressure portion 81 of the high-low pressure heat exchanger 8 is expanded and depressurized by passing through the decompression device 5, and becomes low-pressure refrigerant.
- This low-pressure refrigerant flows into the evaporator 6.
- the bypass valve 13 When the bypass valve 13 is closed, the low-pressure refrigerant that has passed through the evaporator 6 flows into the low-pressure part 82 of the high-low pressure heat exchanger 8.
- the high-low pressure heat exchanger 8 exchanges heat between the high-pressure refrigerant after heat exchange with the heat medium and the low-pressure refrigerant that has passed through the evaporator 6.
- the low-pressure refrigerant that has passed through the low-pressure part 82 of the high-low pressure heat exchanger 8 flows into the accumulator 7.
- the bypass valve 13 When the bypass valve 13 is open, the low-pressure refrigerant flows from the evaporator 6 through the bypass passage 11 into the accumulator 7.
- the refrigerant liquid is stored in the accumulator 7, and the refrigerant gas exits the accumulator 7 and is sucked into the compressor 2. In this way, the accumulator 7 stores excess refrigerant liquid in the refrigerant circuit.
- a section between the outlet of the compressor 2 and the inlet of the decompression device 5 is referred to as a “high pressure side”, and a section between the outlet of the decompression device 5 and the inlet of the compressor 2 is referred to as “low pressure”.
- side a section between the outlet of the decompression device 5 and the inlet of the compressor 2
- side pressure a section between the outlet of the decompression device 5 and the inlet of the compressor 2
- side The pressure of the high-pressure side refrigerant is referred to as “high-pressure side pressure”
- the pressure of the low-pressure side refrigerant is referred to as “low-pressure side pressure”.
- the first refrigerant temperature sensor 14 detects the temperature of the refrigerant discharged from the compressor 2.
- the temperature of the refrigerant discharged from the compressor 2, that is, the temperature of the refrigerant after being compressed by the compressor 2, is hereinafter referred to as “compressor discharge temperature”.
- the refrigerant pressure sensor 15 detects the pressure of the refrigerant discharged from the compressor 2.
- the pressure of the refrigerant discharged from the compressor 2, that is, the pressure of the refrigerant after being compressed by the compressor 2, is hereinafter referred to as “compressor discharge pressure”.
- the second refrigerant temperature sensor 16 detects the temperature of the high-pressure refrigerant at the outlet of the refrigerant flow path 31 of the heater 3. It can be considered that the high-pressure side pressure is approximately equal to the compressor discharge pressure.
- the control device 50 includes a CPU (Central Processing Unit) 50a, a storage unit 50b, and an input / output interface 50c.
- the storage unit 50b includes a ROM (Read Only Memory), a RAM (Random Access Memory), a nonvolatile memory, and the like.
- the storage unit 50b stores a control program, data, and the like.
- the input / output interface 50c inputs / outputs external signals to / from the CPU 50a.
- the actuators and sensors included in the heat pump unit 1 are electrically connected to the control device 50.
- the control device 50 controls the operation of the heat pump unit 1 by the CPU 50a executing the control program stored in the storage unit 50b.
- the control device 50 can control the opening degree of the decompression device 5.
- the control device 50 can control the capacity of the compressor 2.
- the capacity of the compressor 2 is the amount of refrigerant that the compressor 2 sends out per unit time.
- the control device 50 can control the capacity of the compressor 2 by changing the rotation speed of the compressor 2 by, for example, inverter control.
- the control device 50 can control the flow rate of the heat medium (water) in the heat medium flow path 32 of the heater 3 by controlling the operation of the water pump 22 described later.
- the control device 50 can control the flow rate of water in the heat medium flow path 32 of the heater 3 by changing the rotation speed of the water pump 22 by, for example, inverter control.
- the temperature of the heat medium (water) flowing out from the heat medium flow path 32 of the heater 3 is hereinafter referred to as “heat medium heating temperature”.
- the heating medium heating temperature decreases.
- the heating medium heating temperature increases.
- the control device 50 can control the heating medium heating temperature to match the target temperature by adjusting the water flow rate of the heater 3. It is desirable that the target temperature of the heat medium heating temperature during steady operation (third operation described later) of the heat pump unit 1 is 65 ° C. or higher. Thereby, since the temperature of the hot water stored in the hot water storage tank 21 to be described later can be set to 65 ° C. or higher, the reproduction of Legionella can be reliably suppressed.
- the refrigerant of the heat pump unit 1 contains a substance having a carbon-carbon double bond.
- the substance is hereinafter referred to as “first substance”.
- the critical temperature of the first substance is lower than the heat medium heating temperature during the steady operation (third operation) of the heat pump unit 1.
- 1,1,2-trifluoroethylene is used as the first substance.
- 1,1,2-trifluoroethylene is referred to as HFO-1123.
- the critical temperature of HFO-1123 is 59.2 ° C.
- the heat pump system of Embodiment 1 contributes to the suppression of global warming by using a first substance having a carbon-carbon double bond and a low global warming potential (GWP) as a refrigerant.
- GWP global warming potential
- HFO-1234yf 2,3,3,3-tetrafluoropropene
- the critical temperature of HFO-1234yf is 95 ° C.
- HFO-1234yf has a carbon-carbon double bond.
- FIG. 2 is a block diagram of a hot water storage type hot water supply system having the heat pump unit 1 and the tank unit 20 shown in FIG.
- the tank unit 20 includes a hot water storage tank 21 and a water pump 22.
- the heat pump unit 1 and the hot water storage tank 21 are connected via water channels 23 and 24.
- the heat pump unit 1 and the tank unit 20 are connected via an electric wiring (not shown).
- One end of the water channel 23 is connected to the inlet 91 of the heat medium pipe 9 of the heat pump unit 1.
- the other end of the water channel 23 is connected to the lower part of the hot water storage tank 21 in the tank unit 20.
- a water pump 22 is installed in the middle of the water channel 23 in the tank unit 20.
- One end of the water channel 24 is connected to the outlet 92 of the heat medium pipe 9 of the heat pump unit 1.
- the other end of the water channel 24 is connected to the upper part of the hot water storage tank 21 in the tank unit 20.
- the water pump 22 may be built in the heat pump unit 1 instead of the illustrated configuration.
- the heat pump unit 1 and the tank unit 20 may be integrated instead of the illustrated configuration.
- a water supply pipe 25 is further connected to the lower part of the hot water storage tank 21 of the tank unit 20. Water supplied from an external water source such as water supply flows into the hot water storage tank 21 through the water supply pipe 25 and is stored. The hot water storage tank 21 is always kept in a full state when water flows in from the water supply pipe 25.
- a mixing valve 26 is further provided in the tank unit 20. The mixing valve 26 is connected to the upper part of the hot water storage tank 21 through a hot water discharge pipe 27.
- a water supply branch pipe 28 branched from the water supply pipe 25 is connected to the mixing valve 26.
- One end of a hot water supply pipe 29 is further connected to the mixing valve 26.
- the other end of the hot water supply pipe 29 is connected to a hot water supply terminal such as a faucet, a shower, or a bathtub.
- the control device 50 When the heat storage operation for increasing the heat storage amount of the hot water storage tank 21 is performed, the control device 50 operates the compressor 2 and the water pump 22. In the heat storage operation, the water stored in the hot water storage tank 21 is sent to the heat pump unit 1 through the water channel 23 by the water pump 22 and is heated by the heater 3 of the heat pump unit 1 to become hot hot water. The hot water returns to the tank unit 20 through the water channel 24 and flows into the hot water storage tank 21 from above. By such a heat storage operation, hot water is stored in the hot water storage tank 21 by forming a temperature stratification in which the upper side is high temperature and the lower side is low temperature. In the heat storage operation, the control device 50 can control the heat medium heating temperature to match the target temperature by adjusting the water flow rate of the heater 3.
- the control device 50 can control the hot water supply temperature to the hot water supply pipe 29 by adjusting the mixing ratio of the high temperature hot water and the low temperature water with the mixing valve 26.
- FIG. 3 is a flowchart showing a control operation performed by the control device 50 when the operation of the compressor 2 is started.
- the control device 50 first performs a first operation (step S1).
- the control device 50 performs the second operation after the end of the first operation (step S2).
- the control device 50 performs the third operation after the end of the second operation (step S3).
- the third operation corresponds to a steady operation.
- the control device 50 performs the fourth operation before stopping the compressor 2 (step S4).
- the flow path passing through the low pressure part 82 of the high / low pressure heat exchanger 8 is longer than the bypass passage 11 and has a large resistance to the fluid. Therefore, when the bypass valve 13 is fully open, most of the refrigerant that has exited the evaporator 6 passes through the bypass passage 11 without passing through the low-pressure portion 82 of the high-low pressure heat exchanger 8. In the following description, for the sake of convenience, it is assumed that all the refrigerant that has exited the evaporator 6 passes through the bypass passage 11 during the first operation.
- FIG. 5 is a Ph diagram, that is, a Mollier diagram, of the refrigerant circuit of the heat pump unit 1 during the first operation.
- the curves in FIG. 5 are the saturated vapor line and saturated liquid line of the first substance.
- the critical point of the first substance and its vicinity are set as the operation prohibited area.
- the heat pump system of Embodiment 1 can suppress decomposition of the first substance by operating so that the refrigerant does not pass through the state of the operation prohibited region as much as possible.
- 5A to 5G correspond to the refrigerant pressure and specific enthalpy at positions A to G in FIG.
- A1, B1, and C1 indicate states immediately after the operation of the compressor 2 is started.
- A2, B2, and C2 indicate states at the end of the first operation.
- the state of the refrigerant changes from the point G to the point A.
- the state of the refrigerant changes from point A to point B. Since the water flow rate of the heater 3 is zero or low, the difference in specific enthalpy between the point A and the point B is smaller than that in the third operation. Since the refrigerant exiting the evaporator 6 does not pass through the low pressure portion 82 of the high / low pressure heat exchanger 8, heat exchange is not performed in the high / low pressure heat exchanger 8.
- the refrigerant that has left the evaporator 6 does not pass through the low-pressure part 82 of the high-low pressure heat exchanger 8 but flows into the accumulator 7 through the bypass passage 11 as it is. For this reason, the state of the refrigerant at point E and point F is substantially the same as point G.
- the gas-liquid of the refrigerant is separated, and the refrigerant gas is mainly sucked into the compressor 2 (point G).
- the refrigerant at the outlet of the evaporator 6 tends to be in a gas-liquid two-phase state. Therefore, the refrigerant liquid easily accumulates in the accumulator 7.
- the refrigerant density at the inlet of the decompression device 5 during the first operation is smaller than the refrigerant density at the inlet of the decompression device 5 during the third operation.
- the state of the refrigerant sucked into the compressor 2 is not a saturated gas state but a slightly moist wet steam according to the refrigerant storage amount of the accumulator 7 (the liquid level in the accumulator 7). It becomes a state. Therefore, when a large amount of refrigerant liquid accumulates in the accumulator 7, the compressor discharge temperature decreases.
- the controller 50 controls the decompressor 5 so that the compressor discharge temperature detected by the first refrigerant temperature sensor 14 is slightly lower than the compressor discharge temperature during the third operation. It is desirable to control the opening. Thereby, the refrigerant liquid does not overflow from the accumulator 7, and the liquid level height of the accumulator 7 can be controlled appropriately.
- the specific enthalpy of the refrigerant at the inlet of the decompression device 5 is higher than the specific enthalpy of the critical point of the first substance.
- the specific enthalpy of the refrigerant at the inlet of the decompression device 5 is maintained at a higher level than the specific enthalpy of the critical point of the first substance, so that the operation at and around the critical point of the first substance is prohibited. It is possible to reliably prevent the refrigerant from passing through the region. For this reason, decomposition of the first substance can be suppressed.
- the refrigerant storage amount of the accumulator 7 is increased from that in the third operation, so that the operation on the side (gas side) having a higher specific enthalpy than the critical point of the first substance becomes possible.
- the control device 50 controls the blower 12 so that the flow rate of air passing through the evaporator 6 is lower than the flow rate of air passing through the evaporator 6 in the third operation. Is desirable. As a result, the refrigerant at the outlet of the evaporator 6 is likely to be in a gas-liquid two-phase state, and the refrigerant liquid is likely to accumulate in the accumulator 7.
- the control device 50 adjusts the refrigerant temperature at the outlet of the refrigerant flow path 31 of the heater 3 detected by the second refrigerant temperature sensor 16 and the compressor discharge pressure (high-pressure side pressure) detected by the refrigerant pressure sensor 15. Based on this, the specific enthalpy of the refrigerant at the outlet of the refrigerant flow path 31 of the heater 3 can be calculated.
- the control device 50 uses the water pump so that the calculated value of the specific enthalpy of the refrigerant at the outlet of the refrigerant flow path 31 of the heater 3 is higher than the specific enthalpy of the critical point of the first substance.
- the operation of 22 may be controlled to adjust the water flow rate of the heater 3. Thereby, the specific enthalpy of the refrigerant
- the high-pressure side pressure (points A1, B1, C1) at the start of the first operation is at a lower level than the critical pressure of the first substance.
- the high-pressure side pressure (points A2, B2, C2) at the end of the first operation is at a higher level than the critical pressure of the first substance.
- the high-pressure side pressure increases from a low level (points A1, B1, C1) compared to the critical pressure of the first substance to a high level (points A2, B2, C1) compared to the critical pressure of the first substance.
- the control device 50 ends the first operation and shifts to the second operation.
- FIG. 6 is a diagram illustrating the operation of the heat pump unit 1 during the second operation and the third operation.
- FIG. 7 is a Ph diagram, that is, a Mollier diagram, of the refrigerant circuit of the heat pump unit 1 during the second operation and the third operation.
- the curves in FIG. 7 are the saturated vapor line and saturated liquid line of the first substance.
- a to G in FIG. 7 correspond to the refrigerant pressure and specific enthalpy at positions A to G in FIG.
- A2, B2, C2, D2, F2, and G2 indicate states at the start of the second operation.
- A3, B3, C3, D3, F3, and G3 indicate states at the end of the second operation and during the third operation.
- the control device 50 controls as follows. (1) The bypass valve 13 is fully closed. Accordingly, the refrigerant does not pass through the bypass passage 11 but passes through the low pressure portion 82 of the high / low pressure heat exchanger 8. (2) The water flow rate of the heater 3 is increased continuously or stepwise by gradually increasing the rotation speed of the water pump 22. By gradually increasing the water flow rate of the heater 3, the high-pressure side pressure can be maintained at a higher level than the critical pressure of the first substance. (3) The opening of the decompression device 5 is made smaller than the opening of the decompression device 5 during the first operation. (4) The compressor discharge temperature is made higher than the compressor discharge temperature during the first operation. (5) The capacity of the compressor 2 is made higher than the capacity of the compressor 2 during the first operation.
- the state of the refrigerant circuit changes as follows. (1) The state of the refrigerant sucked into the compressor 2 changes from the point G2 to the point G3. The refrigerant is heated by the high / low pressure heat exchanger 8 before being sucked into the compressor 2, thereby increasing the specific enthalpy of the refrigerant sucked into the compressor 2. (2) The state of the refrigerant discharged from the compressor 2 changes from the point A2 to the point A3. As the specific enthalpy of the refrigerant sucked into the compressor 2 increases, the specific enthalpy of the refrigerant discharged from the compressor 2 increases.
- the specific enthalpy of the refrigerant at the inlet of the decompression device 5 is higher than the specific enthalpy of the critical point of the first substance (point C2), but lower than the specific enthalpy of the critical point of the first substance ( It drops to point C3).
- point C2 the specific enthalpy of the refrigerant at the inlet of the decompression device 5 decreases.
- the control device 50 controls each device as follows. (1) The bypass valve 13 is fully closed. Accordingly, the refrigerant does not pass through the bypass passage 11 but passes through the low pressure portion 82 of the high / low pressure heat exchanger 8. (2) The water flow rate of the heater 3 is controlled so that the heat medium heating temperature becomes a target temperature (for example, 65 ° C.). When the heat medium heating temperature exceeds the target temperature, the water pump 22 is corrected so as to increase the rotation speed. When the heat medium heating temperature is less than the target temperature, the rotation speed of the water pump 22 is corrected so as to be slow. (3) The opening of the decompression device 5 is made smaller than the opening of the decompression device 5 during the first operation.
- the compressor discharge temperature is made higher than the compressor discharge temperature during the first operation.
- the capacity of the compressor 2 is made higher than the capacity of the compressor 2 during the first operation.
- the capacity of the compressor 2 is adjusted so that the compressor discharge pressure exceeds the critical pressure of the first substance.
- the state of the refrigerant at the outlet of the evaporator 6 (point E) is a gas-liquid two-phase, saturated gas, or superheated steam.
- the refrigerant leaving the evaporator 6 is further heated by the high / low pressure heat exchanger 8 to change from the state at the point E to the state at the point F3.
- the state at point F3 is superheated steam.
- This superheated steam refrigerant is sucked into the compressor 2 via the accumulator 7. Therefore, the refrigerant liquid does not accumulate in the accumulator 7.
- the control device 50 can estimate the state of the refrigerant sucked into the compressor 2 based on the compressor discharge temperature detected by the first refrigerant temperature sensor 14.
- the control device 50 may adjust the opening degree of the decompression device 5 so that the state of the refrigerant sucked into the compressor 2 estimated as described above becomes superheated steam.
- the control device 50 When stopping the refrigerant circuit of the heat pump unit 1 from the state of performing the third operation, the control device 50 performs the fourth operation.
- control is performed as follows. (1) The bypass valve 13 is fully opened. Thereby, the refrigerant passes through the bypass passage 11 and bypasses the low pressure portion 82 of the high / low pressure heat exchanger 8. (2) The water flow rate of the heater 3 is gradually decreased by gradually decreasing the rotation speed of the water pump 22. (3) The opening degree of the decompression device 5 is made larger than the opening degree of the decompression device 5 during the second operation and the third operation. (4) The compressor discharge temperature is set lower than the compressor discharge temperature in the second operation and the third operation. (5) The capacity of the compressor 2 is made lower than the capacity of the compressor 2 during the second operation and the third operation.
- the specific enthalpy of the refrigerant at the inlet of the decompression device 5 rises from the start to the end of the fourth operation.
- the specific enthalpy of the refrigerant at the inlet of the decompression device 5 increases.
- the specific enthalpy of the refrigerant at the inlet of the decompression device 5 is higher than the specific enthalpy of the critical point of the first substance.
- the high pressure side pressure is maintained at a higher level than the critical pressure of the first substance.
- the refrigerant liquid gradually accumulates in the accumulator 7.
- the control device 50 stops the compressor 2 when the specific enthalpy of the refrigerant at the outlet of the refrigerant flow path 31 of the heater 3 becomes higher than the specific enthalpy of the critical point of the first substance.
- the amount of refrigerant stored in the accumulator 7 is sufficiently large.
- FIG. 8 is a configuration diagram showing a modification of the heat pump unit according to the first embodiment of the present invention.
- the refrigerant circuit of the heat pump unit 1 ⁇ according to the modification includes a heater bypass passage 17 that bypasses the refrigerant passage 31 of the heater 3, and a heater bypass valve 18 that opens and closes the heater bypass passage 17. Is further provided.
- the control device 50 opens the heater bypass valve 18.
- the control device 50 can adjust the flow rate of the refrigerant flowing through the refrigerant flow path 31 of the heater 3 by adjusting the opening degree of the heater bypass valve 18. In the first operation and the fourth operation, the control device 50 performs heating so that the specific enthalpy of the refrigerant at the outlet of the refrigerant flow path 31 of the heater 3 is higher than the specific enthalpy of the critical point of the first substance.
- the flow rate of the refrigerant flowing through the refrigerant flow path 31 of the vessel 3 is controlled. According to the heat pump unit 1 ⁇ of the modified example, an excessive increase in the heat medium heating temperature can be more reliably prevented during the first operation and the fourth operation.
- FIG. 9 is a graph showing changes in temperature and specific enthalpy of refrigerant and water when the compressor discharge pressure becomes supercritical.
- FIG. 10 is a graph showing changes in the temperature and specific enthalpy of refrigerant and water when the compressor discharge pressure is equal to or lower than the critical pressure.
- the hot water temperature heat medium heating temperature
- the condensing temperature increases as the hot water temperature increases. Yes, it may be considered that the tapping temperature is approximately equal to the condensation temperature.
- the condensation temperature is close to the critical temperature.
- HFO-1123 has a critical temperature of 59.2 ° C., and the condensing temperature is close to the critical temperature when the tapping temperature is 65 ° C. in order to suppress the growth of Legionella. Therefore, the control of the present invention is particularly effective when HFO-1123 is used as the first refrigerant material.
- the critical pressure of HFO-1123 is 4.60 MPa (absolute pressure).
- the critical temperature of CO 2 frequently used as a refrigerant in conventional heat pump water heaters is 31 ° C., and the critical pressure is 7.38 MPa (absolute pressure). Since the refrigerant in the supercritical state continuously changes in temperature, it is easy to increase the hot water temperature (heat medium heating temperature). In the heat pump system of the first embodiment, the heating temperature of the heat medium is easily increased because the first substance is in a supercritical state.
- HFO-1123 When HFO-1123 is used as the first substance of the refrigerant, it becomes supercritical at a lower pressure than the CO 2 refrigerant, so that the design pressure of the refrigerant circuit can be lowered. Therefore, it can be configured at a lower cost.
- the decomposition of the first substance having a carbon-carbon double bond can be reliably suppressed, the possibility that the first substance does not function as a refrigerant can be reduced. Moreover, since it is suppressed that the sludge by a decomposition product generate
- the liquid reservoir (accumulator 7) is provided on the low pressure side of the refrigerant circuit, so that the refrigerant liquid in the liquid reservoir does not enter a supercritical state and the refrigerant is reliably decomposed. Can be prevented.
Abstract
Description
図1は、本発明の実施の形態1のヒートポンプシステムが備えるヒートポンプユニット1の構成図である。図1に示すように、本実施の形態1のヒートポンプユニット1は、冷媒回路を備える。この冷媒回路は、圧縮機2と、加熱器3と、減圧装置5と、蒸発器6と、アキュムレータ7と、高低圧熱交換器8と、これらを接続する冷媒配管10とを含む。ヒートポンプユニット1の冷媒回路は、さらに、高低圧熱交換器8の低圧部82をバイパスするバイパス通路11と、バイパス通路11を開閉するバイパス弁13とを含む。ヒートポンプユニット1は、冷媒回路に封入された冷媒を有する。図示の構成に代えて、バイパス通路11は、高低圧熱交換器8の高圧部81をバイパスするように設けられても良い。
図4は、第一運転のときのヒートポンプユニット1の動作を示す図である。第一運転のとき、制御装置50は、以下のように制御する。
(1)バイパス弁13は全開にされる。これにより、冷媒は、バイパス通路11を通り、高低圧熱交換器8の低圧部82をバイパスする。
(2)加熱器3の水流量は、第三運転のときの加熱器3の水流量に比べて、低くされる。好ましくは、水ポンプ22は、停止状態にされるか、または最低回転速度で駆動される。好ましくは、加熱器3の水流量は、ゼロまたは最低流量とされる。
(3)減圧装置5の開度は、第二運転及び第三運転のときの減圧装置5の開度に比べて、大きくされる。
(4)圧縮機吐出温度は、第二運転及び第三運転のときの圧縮機吐出温度に比べて、低くされる。
(5)圧縮機2の容量は、第二運転及び第三運転のときの圧縮機2の容量に比べて、低くされる。
第二運転のとき、制御装置50は、以下のように制御する。
(1)バイパス弁13は全閉にされる。これにより、冷媒は、バイパス通路11を通らず、高低圧熱交換器8の低圧部82を通る。
(2)水ポンプ22の回転速度を徐々に速くすることで、加熱器3の水流量を連続的または段階的に高くする。加熱器3の水流量を徐々に高くすることで、高圧側圧力を、第一物質の臨界圧力に比べて高いレベルに保てる。
(3)減圧装置5の開度は、第一運転のときの減圧装置5の開度に比べて、小さくされる。
(4)圧縮機吐出温度は、第一運転のときの圧縮機吐出温度に比べて、高くされる。
(5)圧縮機2の容量は、第一運転のときの圧縮機2の容量に比べて、高くされる。
(1)圧縮機2に吸入される冷媒の状態が点G2から点G3へ変化する。圧縮機2に吸入される前に冷媒が高低圧熱交換器8で加熱されることで、圧縮機2に吸入される冷媒の比エンタルピが上昇する。
(2)圧縮機2から吐出される冷媒の状態が点A2から点A3へ変化する。圧縮機2に吸入される冷媒の比エンタルピが上昇することで、圧縮機2から吐出される冷媒の比エンタルピが上昇する。
(3)減圧装置5の入口の冷媒の比エンタルピが、第一物質の臨界点の比エンタルピに比べて高いレベル(点C2)から、第一物質の臨界点の比エンタルピに比べて低いレベル(点C3)へ低下する。加熱器3の水流量が増加し、加熱器3での冷媒の冷却量が増加することで、減圧装置5の入口の冷媒の比エンタルピが低下する。減圧装置5の入口の冷媒の状態が点B2から点B3へ変化する間、高圧側圧力が第一物質の臨界圧力に比べて高いレベルに保たれることで、高圧側の冷媒が、第一物質の臨界点及びその付近の運転禁止領域を通過することがない。このため、第一物質の分解を抑制できる。減圧装置5の入口の冷媒の比エンタルピが、第一物質の臨界点の比エンタルピに等しい値を通過するとき、減圧装置5で膨張する過程の冷媒が運転禁止領域を通過する。しかしながら、このときに運転禁止領域を通過する冷媒は、減圧装置5内部の、ごく僅かな容積の冷媒に過ぎないので、その影響は少ない。
第三運転のとき、制御装置50は、各機器を以下のように制御する。
(1)バイパス弁13は全閉にされる。これにより、冷媒は、バイパス通路11を通らず、高低圧熱交換器8の低圧部82を通る。
(2)熱媒体加熱温度が目標温度(例えば65℃)になるように、加熱器3の水流量が制御される。熱媒体加熱温度が目標温度を超えている場合には、水ポンプ22の回転速度が速くなるように補正される。熱媒体加熱温度が目標温度に満たない場合には、水ポンプ22の回転速度が遅くなるように補正される。
(3)減圧装置5の開度は、第一運転のときの減圧装置5の開度に比べて、小さくされる。
(4)圧縮機吐出温度は、第一運転のときの圧縮機吐出温度に比べて、高くされる。
(5)圧縮機2の容量は、第一運転のときの圧縮機2の容量に比べて、高くされる。圧縮機吐出圧力が第一物質の臨界圧力を超える圧力になるように、圧縮機2の容量が調整される。
第三運転をしている状態から、ヒートポンプユニット1の冷媒回路を停止させる場合には、制御装置50は、第四運転を行う。第四運転のとき、以下のように制御する。
(1)バイパス弁13は全開にされる。これにより、冷媒は、バイパス通路11を通り、高低圧熱交換器8の低圧部82をバイパスする。
(2)水ポンプ22の回転速度を徐々に遅くすることで、加熱器3の水流量を徐々に低下させる。
(3)減圧装置5の開度は、第二運転及び第三運転のときの減圧装置5の開度に比べて、大きくされる。
(4)圧縮機吐出温度は、第二運転及び第三運転のときの圧縮機吐出温度に比べて、低くされる。
(5)圧縮機2の容量は、第二運転及び第三運転のときの圧縮機2の容量に比べて、低くされる。
Claims (9)
- 炭素-炭素二重結合を有する物質を含む冷媒と、
前記冷媒を圧縮する圧縮機と、
熱媒体を送出するポンプと、
前記圧縮機に接続され、前記ポンプにより送出された前記熱媒体と前記圧縮機で圧縮された前記冷媒とを熱交換する加熱器と、
入口及び出口を有し、前記冷媒を減圧する減圧装置と、
前記減圧装置に接続され、前記減圧装置で減圧された前記冷媒を蒸発させる蒸発器と、
前記圧縮機、前記減圧装置、及び前記ポンプに接続され、前記圧縮機の起動後、第一運転、第二運転、及び第三運転を順に行う制御装置と、
を備え、
前記第一運転において、前記減圧装置の前記入口の前記冷媒の比エンタルピが、前記物質の臨界点の比エンタルピに比べて高いレベルに保たれ、
前記第一運転において、前記圧縮機と前記減圧装置の前記入口との間の前記冷媒の圧力が、前記物質の臨界圧力に比べて低いレベルから前記臨界圧力に比べて高いレベルへ上昇し、
前記第二運転において、前記圧縮機と前記減圧装置の前記入口との間の前記冷媒の圧力が、前記臨界圧力に比べて高いレベルに保たれ、
前記第二運転において、前記減圧装置の前記入口の前記冷媒の比エンタルピが、前記臨界点の比エンタルピに比べて高いレベルから前記臨界点の比エンタルピに比べて低いレベルへ低下し、
前記第三運転において、前記加熱器から流出する前記熱媒体の温度が、前記物質の臨界温度に比べて高いレベルに保たれるヒートポンプシステム。 - 前記蒸発器と前記圧縮機との間に接続され、液体の前記冷媒を貯留するアキュムレータを備え、
前記第一運転のときの前記アキュムレータの冷媒貯留量が、前記第三運転のときの前記アキュムレータの冷媒貯留量に比べて多い請求項1に記載のヒートポンプシステム。 - 前記第一運転のときの前記減圧装置の開度が、前記第二運転及び前記第三運転のときの前記減圧装置の開度に比べて大きい請求項1または請求項2に記載のヒートポンプシステム。
- 前記第一運転のときに前記加熱器を流れる前記熱媒体の流量が、前記第三運転のときに前記加熱器を流れる前記熱媒体の流量に比べて低く、
前記第二運転のとき、前記加熱器を流れる前記熱媒体の流量が連続的または段階的に高くなる請求項1から請求項3のいずれか一項に記載のヒートポンプシステム。 - 前記蒸発器で前記冷媒と熱交換する流体の流量を調整する流量調整部を備え、
前記第一運転のときの前記流体の流量が前記第三運転のときの前記流体の流量に比べて低い請求項1から請求項4のいずれか一項に記載のヒートポンプシステム。 - 高圧部及び低圧部を有し、前記加熱器の下流側の高圧冷媒と、前記蒸発器の下流側の低圧冷媒とを熱交換させる高低圧熱交換器と、
前記高圧部または前記低圧部をバイパス通路と、
前記バイパス通路を開閉するバイパス弁と、
を備え、
前記第一運転のときに前記バイパス弁が閉じられ、前記第二運転及び前記第三運転のときに前記バイパス弁が開かれる請求項1から請求項5のいずれか一項に記載のヒートポンプシステム。 - 前記圧縮機と前記減圧装置の前記入口との間の前記冷媒の圧力を検知する圧力センサと、
前記加熱器の冷媒流路の出口の前記冷媒の温度を検知する温度センサと、
を備え、
前記第一運転のとき、前記制御装置は、前記圧力センサで検知される圧力及び前記温度センサで検知される温度に基づいて前記加熱器の冷媒流路の出口の前記冷媒の比エンタルピを計算し、その計算値が前記物質の臨界点の比エンタルピに比べて高くなるように、前記ポンプの動作を制御する請求項1から請求項6のいずれか一項に記載のヒートポンプシステム。 - 前記加熱器の冷媒流路をバイパスする加熱器バイパス通路と、
前記加熱器バイパス通路を開閉する加熱器バイパス弁と、
を備え、
前記第一運転のとき、前記加熱器バイパス弁が開かれる請求項1から請求項7のいずれか一項に記載のヒートポンプシステム。 - 前記制御装置は、前記第三運転から前記圧縮機を停止する場合に第四運転を行い、
前記第四運転において、前記圧縮機と前記減圧装置の前記入口との間の前記冷媒の圧力が、前記臨界圧力に比べて高いレベルに保たれ、
前記第四運転において、前記減圧装置の前記入口の前記冷媒の比エンタルピが、前記臨界点の比エンタルピに比べて低いレベルから前記臨界点の比エンタルピに比べて高いレベルへ上昇する請求項1から請求項8のいずれか一項に記載のヒートポンプシステム。
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KR102313304B1 (ko) | 2017-06-21 | 2021-10-14 | 엘지전자 주식회사 | 이산화탄소 공기조화기 |
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EP3222932A1 (en) | 2017-09-27 |
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