WO2016078048A1 - Led模组 - Google Patents

Led模组 Download PDF

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Publication number
WO2016078048A1
WO2016078048A1 PCT/CN2014/091722 CN2014091722W WO2016078048A1 WO 2016078048 A1 WO2016078048 A1 WO 2016078048A1 CN 2014091722 W CN2014091722 W CN 2014091722W WO 2016078048 A1 WO2016078048 A1 WO 2016078048A1
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WIPO (PCT)
Prior art keywords
substrate
led chip
led
led module
module according
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PCT/CN2014/091722
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English (en)
French (fr)
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史利利
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史利利
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Priority to CN201490000305.6U priority Critical patent/CN205790041U/zh
Priority to PCT/CN2014/091722 priority patent/WO2016078048A1/zh
Publication of WO2016078048A1 publication Critical patent/WO2016078048A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the present application relates to the field of light emitting diodes, and in particular, to an LED module.
  • LED Light Emitting Diode
  • the LED module has a rectangular shape.
  • the LED module is composed of a chip type LED and a connector mounted on a printed circuit board (PCB) board.
  • the PCB board has different types such as FR-4, CEM-3 and aluminum substrate, and the shape of the LED is also different.
  • the existing LED module includes a PCB board, and is mounted on the PCB board and is electrically connected to the chip type LED. Specifically, the chip type LED is electrically connected to the PCB board by way of solder paste reflow mounting LED.
  • SMD LEDs In order to meet the requirements of backlight brightness, SMD LEDs generally use high-power LEDs.
  • the existing LED modules have at least the following problems: since the SMD LEDs are directly soldered on the PCB, the patch The heat generated by the LED is transmitted to the PCB through the LED bracket, and then transmitted to the heat sink provided on the PCB, resulting in poor heat dissipation, large thermal resistance, easy to produce light fade and color drift, thereby affecting the LCD TV image. quality.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present invention provides an LED module, comprising: a substrate, an LED chip disposed on the substrate, and a first fluorescent adhesive layer overlying the LED chip, the LED module further comprising: a thermally conductive insulating layer on the substrate on one side of the LED chip and bonded to the LED chip to dissipate heat, and a second fluorescent adhesive layer disposed on the thermally conductive insulating layer.
  • a transparent adhesive layer is further disposed on an outer side of the first fluorescent adhesive layer.
  • the thermally conductive insulating layer is made of graphene, alumina thermal conductive rubber or boron nitride thermal conductive rubber material.
  • a metallized hole communicating with the LED chip is disposed on the substrate, and the LED chip is electrically connected to the metallized hole through a pin.
  • thermally conductive insulating layer has a through hole through which the pin passes.
  • a heat sink is disposed on a side of the substrate opposite to the LED chip.
  • thermally conductive insulating layer is provided with an extension that is in contact with the heat sink.
  • a heat conducting hole through which the extending portion passes is formed on the substrate.
  • the substrate is a ceramic substrate or a copper clad substrate.
  • the LED chip is a blue LED chip.
  • An LED module includes: a substrate, an LED chip disposed on the substrate, and a first fluorescent glue layer disposed over the LED chip, the LED module further comprising: a thermally conductive insulating layer on one side of the LED chip and bonded to the LED chip for heat dissipation, and a second fluorescent adhesive layer disposed on the thermally conductive insulating layer.
  • FIG. 1 is a schematic structural view of an LED module according to an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature is “on” or “on” the second feature, unless otherwise explicitly stated and defined.
  • “Bottom” may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the embodiment provides an LED module, which can be applied to the field of LED display or illumination, and can specifically integrate corresponding devices, such as an LED display, an LED signal light or an LED bulb.
  • the LED module mainly includes a substrate 1 , an LED chip 2 disposed on the substrate 1 , and a first fluorescent adhesive layer 3 disposed on the LED chip 2 .
  • the LED module further includes: the LED is disposed on the substrate 1 and disposed on the LED A thermally conductive insulating layer 4 on one side of the chip 2 and bonded to the LED chip 2 for heat dissipation, and a second fluorescent adhesive layer 5 disposed on the thermally conductive insulating layer 4.
  • the heat generated by the LED chip is dissipated through the thermal conductive layer, the heat dissipation resistance is reduced, the heat dissipation efficiency is improved, the problem of large light decay and color drift is avoided, and the quality of the LED module is improved; Since the second fluorescent adhesive layer absorbs light from the LED chip toward the substrate and excites fluorescence, the overall luminous effect is further improved.
  • the outer side of the first fluorescent rubber layer 3 is further provided with a transparent adhesive layer.
  • Both the first fluorescent layer and the transparent layer can be made of silica gel as a colloidal base.
  • the thermally conductive insulating layer 4 may be made of a material such as graphene, alumina thermal conductive rubber or boron nitride thermal conductive rubber.
  • the substrate 1 is provided with a metallized hole 11 communicating with the LED chip 2, and the LED chip 2 is electrically connected to the metallized hole 11 through the pin 21.
  • the thermally conductive insulating layer 4 has a through hole 41 through which the lead 21 passes.
  • the substrate 1 is provided with a heat sink 6 on the opposite side of the LED chip 2.
  • the thermally conductive insulating layer 4 is provided with an extension that is in contact with the heat sink.
  • the substrate 1 is provided with a heat conducting hole through which the extending portion passes.
  • the substrate 1 may be a ceramic substrate or a copper clad substrate.
  • the LED chip 2 can be a blue LED chip or a red LED chip.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED模组，包括：基板（1）、设置于基板（1）上的LED芯片（2），以及设于LED芯片（2）上方的第一荧光胶层（3），设于基板（1）上位于LED芯片（2）一面且与LED芯片（2）贴合以散热的导热绝缘层（4），设于导热绝缘层（4）上的第二荧光胶层（5）。LED芯片（2）产生的热量通过导热绝缘层（4）散发出去，提高了散热效率，避免出现较大的光衰和色漂问题，提高了LED模组的品质。由于第二荧光胶层（5）可将LED芯片（2）向基板（1）方向的光吸收并激发出荧光，导致整体发光效果提升。

Description

LED模组 技术领域
本申请涉及发光二极管领域，尤其涉及一种LED模组。
背景技术
发光二极管(Light Emitting Diode，LED)广泛的应用于背光领域，在色彩还原性、寿命和响应速度等方面具有颠覆性优势，已成为液晶电视的主要背光源。目前，LED模组外形为长方形。LED模组是把贴片式LED、连接器贴装于电路板(Printed Circuit Board，PCB)板上组成，PCB板有FR-4、CEM-3及铝基板等不同类型，LED的外形也有不同的封装形式，现有LED模组包括PCB板，设置于PCB板上与其电连接的贴片式LED，具体的，贴片式LED通过锡膏回流贴装LED的方式与PCB板实现电连接，为了满足背光屏亮度的要求，贴片式LED一般采用大功率LED，现有的这种LED模组至少存在以下问题：由于是将贴片式LED直接焊接在PCB板上，作时，贴片式LED产生的热量需通过LED支架传递到PCB板，然后传至PCB板设置的散热器上，导致散热效果差、散热热阻大，易产生光衰和色漂问题，从而影响液晶电视图像的品质。
发明内容
本申请旨在至少在一定程度上解决上述技术问题之一。
本申请提供一种LED模组，包括：基板、设置于所述基板上的LED芯片，以及覆设于所述LED芯片上方的第一荧光胶层，所述LED模组还包括：覆设于所述基板上位于所述LED芯片一面且与所述LED芯片贴合以散热的导热绝缘层，以及设置于所述导热绝缘层上的第二荧光胶层。
进一步地，所述第一荧光胶层的外侧还设置有透明胶层。
进一步地，所述导热绝缘层采用石墨烯、氧化铝导热橡胶或氮化硼导热橡胶材料。
进一步地，所述基板上设置有与所述LED芯片连通的金属化孔，所述LED芯片通过引脚与所述金属化孔电连接。
进一步地，所述导热绝缘层具有供所述引脚穿过的通孔。
进一步地，所述基板的位于所述LED芯片相对一面设置有散热器。
进一步地，所述导热绝缘层设置有与所述散热器相接的延伸部。
进一步地，所述基板上开设有供所述延伸部穿过的导热孔。
进一步地，所述基板为陶瓷基板或覆铜基板。
进一步地，所述LED芯片为蓝光LED芯片。
本申请的有益效果是：
通过提供一种LED模组，包括：基板、设置于所述基板上的LED芯片，以及覆设于所述LED芯片上方的第一荧光胶层，所述LED模组还包括：覆设于所述基板上位于所述LED芯片一面且与所述LED芯片贴合以散热的导热绝缘层，以及设置于所述导热绝缘层上的第二荧光胶层。这样，LED芯片所产生热量通过导热绝缘层散发出去，减小了其散热热阻，提高了散热效率，避免出现较大的光衰和色漂的问题，提高了LED模组的品质；另外，由于第二荧光胶层可将LED芯片向基板方向的光吸收并激发出荧光，导致整体发光效果进一步提升。
附图说明
图1为本申请实施例的LED模组的结构示意图。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之 “下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下面通过具体实施方式结合附图对本申请作进一步详细说明。
请参考图1，本实施例提供了一种LED模组，可应用于LED显示或照明领域，具体可集成相应设备，如LED显示屏、LED信号灯或LED球泡灯等。
上述LED模组主要包括：基板1、设置于基板1上的LED芯片2，以及覆设于LED芯片2上方的第一荧光胶层3，LED模组还包括：覆设于基板1上位于LED芯片2一面且与LED芯片2贴合以散热的导热绝缘层4，以及设置于导热绝缘层4上的第二荧光胶层5。
这样，LED芯片所产生热量通过导热绝缘层散发出去，减小了其散热热阻，提高了散热效率，避免出现较大的光衰和色漂的问题，提高了LED模组的品质；另外，由于第二荧光胶层可将LED芯片向基板方向的光吸收并激发出荧光，导致整体发光效果进一步提升。
作为另一种实施例，为提高出光效果，第一荧光胶层3的外侧还设置有透明胶层。第一荧光胶层与透明胶层均可采用硅胶作为胶体底料。
在具体应用时，导热绝缘层4可采用石墨烯、氧化铝导热橡胶或氮化硼导热橡胶等材料。
为保证LED模组散热，作为一种优选实施例，基板1上设置有与LED芯片2连通的金属化孔11，LED芯片2通过引脚21与金属化孔11电连接。而导热绝缘层4具有供引脚21穿过的通孔41。
为保证LED模组散热，作为另一种优选实施例，基板1的位于LED芯片2相对一面设置有散热器6。导热绝缘层4设置有与散热器相接的延伸部。相应地，基板1上开设有供延伸部穿过的导热孔。
一般，基板1可为陶瓷基板或覆铜基板等。而LED芯片2可为蓝光LED芯片或红光LED芯片等。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本 说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换。

Claims (10)

  1. 一种LED模组，包括：基板、设置于所述基板上的LED芯片，以及覆设于所述LED芯片上方的第一荧光胶层，其特征在于，所述LED模组还包括：覆设于所述基板上位于所述LED芯片一面且与所述LED芯片贴合以散热的导热绝缘层，以及设置于所述导热绝缘层上的第二荧光胶层。
  2. 如权利要求1所述的LED模组，其特征在于，所述第一荧光胶层的外侧还设置有透明胶层。
  3. 如权利要求1所述的LED模组，其特征在于，所述导热绝缘层采用石墨烯、氧化铝导热橡胶或氮化硼导热橡胶材料。
  4. 如权利要求1所述的LED模组，其特征在于，所述基板上设置有与所述LED芯片连通的金属化孔，所述LED芯片通过引脚与所述金属化孔电连接。
  5. 如权利要求4所述的LED模组，其特征在于，所述导热绝缘层具有供所述引脚穿过的通孔。
  6. 如权利要求1所述的LED模组，其特征在于，所述基板的位于所述LED芯片相对一面设置有散热器。
  7. 如权利要求6所述的LED模组，其特征在于，所述导热绝缘层设置有与所述散热器相接的延伸部。
  8. 如权利要求7所述的LED模组，其特征在于，所述基板上开设有供所述延伸部穿过的导热孔。
  9. 如权利要求1至8中任一项所述的LED模组，其特征在于，所述基板为陶瓷基板或覆铜基板。
  10. 如权利要求1至8中任一项所述的LED模组，其特征在于，所述LED芯片为蓝光LED芯片。
PCT/CN2014/091722 2014-11-20 2014-11-20 Led模组 WO2016078048A1 (zh)

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CN107731994A (zh) * 2017-11-17 2018-02-23 惠州光弘科技股份有限公司 一种led制造方法
CN110253986B (zh) * 2019-02-28 2021-08-24 罗化芯显示科技开发(江苏)有限公司 荧光陶瓷及其制备方法

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