WO2016055277A1 - Dispositif et procede de mesure de courant dans un piste conductrice d'une carte de circuit imprimé - Google Patents

Dispositif et procede de mesure de courant dans un piste conductrice d'une carte de circuit imprimé Download PDF

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Publication number
WO2016055277A1
WO2016055277A1 PCT/EP2015/071975 EP2015071975W WO2016055277A1 WO 2016055277 A1 WO2016055277 A1 WO 2016055277A1 EP 2015071975 W EP2015071975 W EP 2015071975W WO 2016055277 A1 WO2016055277 A1 WO 2016055277A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor track
resistance structure
resistance
circuit board
current
Prior art date
Application number
PCT/EP2015/071975
Other languages
German (de)
English (en)
Inventor
Friedrich Loskarn
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Publication of WO2016055277A1 publication Critical patent/WO2016055277A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts

Definitions

  • the invention relates to a device and a method for determining a current intensity of a current flowing through a conductor track of a printed circuit board electrical current.
  • Multilayer printed circuit boards are known from the prior art, which have a plurality of superimposed layers of conductor tracks.
  • precision resistors are known, which are connected as separate components with connecting leads to the electrically conductive connection.
  • Such precision resistors exist z.
  • B. essentially of a film which is formed of a copper-nickel-manganese alloy.
  • the invention is based on the object to provide a comparison with the prior art improved device and an improved method for current detection in at least one conductor of a circuit board.
  • At least a portion of the conductor track comprises a resistor structure which is formed integrally with the conductor track, wherein the resistance structure forms a measuring resistor for determining the current intensity.
  • the resistance structure of the track replaces separate
  • Measuring resistors which are coupled to determine the current with a conductor track, wherein the conductor track and the resistor structure are formed of one and the same material.
  • the section of the at least one conductor track having the resistance structure has a number of material recesses which interrupt a complete structure of the conductor track at least in sections, so that a resistance is set against the electrical current.
  • the abutment structure was ⁇ a meander shape parallel to the current direction. In this way, a correspondingly high resistance value, for. B. between 20 mOhm and 90 mOhm of the electrically conductive connection can be generated in this section. This means that resistance values of for example 25 or 80 mOhm mOhm re ⁇ alisierbar which for high current strengths, in particular
  • the resistance structure has a web extending perpendicular to the current direction with rib-shaped formations projecting parallel to the current direction.
  • the printed circuit board has a multi-layered construction and comprises a predetermined number of conductor track-carrying layers which are arranged one above the other, wherein the resistance structure is arranged in a lower layer.
  • the resistance structure is arranged in a lower layer.
  • the resistance structure generates a loss of heat due to the electrical resistance during current flow, resulting in an increase of the resistance value.
  • the resistance structure is arranged in one of the lower layers, the heat loss to a thermally conductive component, for.
  • a thermal adhesive which connect a base plate and the conductor carrying layers cohesively with each other, are dissipated. This arrangement thus represents a close thermal coupling of the resistor structures to the base plate.
  • the dissipation of the lost heat can preferably be additionally supported by so-called vias, also known as through-contacts, which electrically connect the electrically conductive connections of different layers of the printed circuit board to one another.
  • vias also known as through-contacts
  • a spatially close temperature sensor is also thermally bonded by surface mounting on the circuit board, the formation of so-called thermal vias underneath the temperature sensor closely to the base plate. This is advantageous to maintain a Tem ⁇ peraturdifferenz between the temperature sensor and to be calibrated resistor structures to a minimum.
  • a method according to the invention is provided in which at least one conductor track is provided in sections with a resistance structure. Furthermore, it is provided that the resistance structure with measuring lines or measuring points electrically is coupled, by means of a voltage drop across the Wi ⁇ derstands für is detected.
  • a measuring resistor for determining a current strength can be realized, which is produced in a common method step with the conductor track.
  • the conductor track and the resistor structure are etched from a thin layer of copper, wherein the Wider ⁇ stand structure and the interconnect are formed integrally. The method thus also allows a cost and zeitef ⁇ efficient production of the device.
  • the measuring ⁇ lines are arranged in a different position to the resistance structure of the circuit board.
  • the measuring lines can be electrically coupled to the resistance structure by means of vias or plated-through holes.
  • the measuring points and the resistance structure are arranged in a common position of the printed circuit board.
  • 1 is a schematic sectional view of a multilayer printed circuit board
  • FIG. 3 is a plan view of a layer of the printed circuit board with a number of mutually parallel measuring leads
  • FIG. 1 shows an exemplary embodiment of a multi-layer printed circuit board 1 in a sectional view, in particular in a longitudinal section.
  • the circuit board 1 is arranged on a base plate 2, which in particular for the cooling of the circuit board 1 as a metal core, for. B. consisting of aluminum or an aluminum alloy is formed.
  • the printed circuit board 1 comprises six electrically conductive layers, which are arranged one above the other on the base plate 2.
  • the circuit board 1 is preferably integrally connected to the base plate 2 before ⁇ being discussed in more detail later on it.
  • the electrically conductive layers each carry a layer LI to L6 with a predetermined number of interconnects 3, which are not shown electronic components of the printed circuit board 1 electrically interconnect and which are suitably made of an electrically conductive material, in particular of copper.
  • the interconnects 3 are preferably by etching processes, for. B. copper etching, produced.
  • An upper first layer LI and a lower sixth layer L6 are each provided with a copper layer 4 and an overlying gold layer 5 according to the exemplary embodiment.
  • the copper layer 4 is z. B. applied by means of chemical and / or galvanic copper-plating in the manufacture of the circuit board 1 to the corresponding layer. In particular, bores, milling ends and other components for which a metallization is provided are provided with the copper coating 4.
  • Another metallization layer for. B. consisting of silver, can be used.
  • the gold layer 5 is for component mounting of the circuit board 1 with respect to use arranged a so-called Silberleitklebers, which is not discussed in the context of this application.
  • a layer with an adhesive 6 is brought a ⁇ for an integral connection of the circuit board 1 and the base plate. 2
  • adhesive 6 in this case, in particular, a thermal adhesive, which is laminated to the base plate 2 is suitable.
  • the adhesive 6 is electrically connected by means of the gold layer 5 to the conductor tracks 3 of the sixth layer L6 and by means of plated-through holes 7 with the interconnects 3 of a fifth layer L5 arranged above the sixth layer L6.
  • the plated-through holes 7 are formed as bores in a carrier material of the fifth and sixth layers L5 and L6 and have an electrically conductive inner coating.
  • the vias 7 thus also connect the interconnects 3 of the sixth layer L6 with the interconnects 3 of the overlying fifth layer L5 electrically.
  • measuring resistors are provided, by means of which a voltage drop across the resistor can be detected and, as a result, a current intensity of an electrical current I flowing through the measuring resistor
  • the measuring resistor is formed by a section of a conductor 3, which has a resistance structure, which is produced by a number of material recesses A of the conductor 3, which form a resistance for the electric current I.
  • the conductor 3 and the resistance structure are thus formed from one and the same material.
  • Figure 2 shows a first embodiment of the invention, wherein a portion of a conductor track 3 is shown in plan view.
  • the section of the conductor track 3 shown has a meandering Resistor structure in the direction of the electric current I, whereby this portion of the conductor track 3 has a reduced width in relation to the current flow direction and thus receives a correspondingly opposite to the adjacent conductor track 3 an increased resistance value.
  • the meandering shape is formed by the material recesses A, which interrupt a solid structure of the conductor track 3.
  • the conductor 3, together with the resistor structure shown, can preferably be produced in a common method step.
  • the meander-shaped resistance structure is, for example, a section of a conductor track 3 which is arranged in the sixth layer L6.
  • the resistance structure is electrically connected to the overlying fifth layer L5 as well as to the adhesion means 6 by means of the plated-through holes 7.
  • a resistance value between 20 mOhm and 90 mOhm can be generated for the conductor track section shown, so that the meander-shaped resistance structure forms a measuring resistor having a resistance value of for example 25 mOhm or 80 mOhm.
  • a current intensity of an electric current I flowing through the conductor track section with the meandering resistance structure can be detected by detecting a voltage drop across the resistance structure by means of the generally known ohmic law
  • R electrical resistance to be determined. For example, with a voltage drop of 500 yV detected across the resistor structure at a resistance of 25 mOhm, a current of 20 mA can be determined. For detecting a voltage drop Messleitun ⁇ gen 1.8 to 6.8 are provided, which are exemplarily shown in FIG. 3
  • Figure 3 shows a plan view of the above the lower layer L6 lying position L5 which six mutually parallel measurement lines 1.8 to 6.8 comprising, the longitudinal ⁇ orientations in each case perpendicular to the longitudinal direction of the meander-shaped resistor structure extend, as based on a position of the vias 7 can be seen in Figures 2 and 3.
  • the electrical voltage is detected between a first measuring line 8.1 and a second measuring line 8.2, which are electrically coupled, for example, with a measuring amplifier, not shown.
  • the measuring amplifier prepares the voltage signal accordingly by amplifying it.
  • the measuring amplifier is further coupled to a processing unit, not shown, which determines the current intensity of the electric current I with the aid of the above-mentioned Ohm's Law on the basis of the voltage signal transmitted by the measuring amplifier.
  • Figure 4 shows an alternative embodiment of a resistor ⁇ structure comprising a web 3.1 with a longitudinal orientation perpendicular to the flow direction and the rib-shaped protrusions 3.2 which 3.1abragen parallel to the current direction of the web, said rib-like formations are made by Materialaus- recesses A 3.2.
  • the electric current I is divided according to the number of rib-shaped formations 3.2.
  • measuring points 9.1, 9.2 are provided, which together with the resistance structure z.
  • the sixth Location L6 of the circuit board 1 are arranged.
  • the measurement punk ⁇ te 9.1, 9.2 protrude on a front side of the web 3.1 axially in the longitudinal orientation, and are analogous to the Messlei ⁇ obligations 8.1, 8.2 connected to a not shown measurement amplifier which amplifies the voltage signal and transmitted to a computing unit.
  • the alternatively executed resistance structure By means of the alternatively executed resistance structure, a resistance value of 1 mOhm can be realized for the conductor track section, so that a measuring resistor for higher current strengths in the ampere range is possible.
  • the alternatively executed resistance structure may also be formed without rib-shaped formations 3.2, whereby a width of the web 3.1 running longitudinally to the current flow direction is preferably smaller than the adjacent conductor track sections both in the shown alternative embodiment and in the alternative embodiment, not shown. to obtain an ent ⁇ speaking high resistance value.
  • the arrangement of the resistance structures is preferably carried out in the sixth position L6, in order to achieve optimum cooling of the printed circuit board 1, wherein a loss of heat of the resistance structures can be derived via the heat-conductive adhesive 6.
  • the resistor structures can also be arranged in the fifth position L5. It is also conceivable to provide a meander-shaped resistance structure in the sixth position L6 and a web-shaped resistance structure according to FIG. 4 in the fifth position L5 or vice versa. Furthermore, other forms of resistance structures can be realized by means of which a corresponding resistance value of a conductor track section can be generated.
  • a calibration of the resistance structure via temperature and electric current I is necessary.
  • the calibration is carried out by means of a calibration process at least two temperatures and at least two currents.
  • the calibration takes place in such a way that both an absolute tolerance compensation of the resistance structure and a compensation of a temperature variation of the resistance structure takes place.
  • a temperature value that is calibrated during calibration and used to determine an actual amperage during operation is a temperature of the PCB mounted temperature sensor.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un dispositif destiné à déterminer l'intensité d'un courant électrique (I) circulant dans une piste conductrice (3) d'une carte de circuit imprimé (1). Selon l'invention, au moins une partie de l'au moins une piste conductrice (3) comporte une structure de résistance qui est formée d'une seule pièce avec la piste conductrice (3), une résistance de mesure peut être générée au moyen de la structure de résistance pour déterminer l'intensité du courant. L'invention concerne également un procédé de fabrication d'un tel dispositif, dans lequel il est prévu de pourvoir partiellement au moins une piste conductrice (3) d'une structure de résistance qui est formée d'une seule pièce avec la piste conductrice (3) et de coupler électriquement la structure de résistance à un nombre prédéterminé de lignes de mesure (8.1 à 8.6) ou de points de mesure (9.1, 9.2) qui sont prévus pour détecter une chute de tension aux bornes de la structure de résistance.
PCT/EP2015/071975 2014-10-09 2015-09-24 Dispositif et procede de mesure de courant dans un piste conductrice d'une carte de circuit imprimé WO2016055277A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014220480.1 2014-10-09
DE102014220480.1A DE102014220480A1 (de) 2014-10-09 2014-10-09 Vorrichtung und Verfahren zur Strommessung in einer Leiterbahn einer Leiterplatte

Publications (1)

Publication Number Publication Date
WO2016055277A1 true WO2016055277A1 (fr) 2016-04-14

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PCT/EP2015/071975 WO2016055277A1 (fr) 2014-10-09 2015-09-24 Dispositif et procede de mesure de courant dans un piste conductrice d'une carte de circuit imprimé

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DE (1) DE102014220480A1 (fr)
WO (1) WO2016055277A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016216348A1 (de) 2016-08-30 2018-03-01 Continental Teves Ag & Co. Ohg Messanordnung zur Strommessung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19838974A1 (de) * 1998-08-27 2000-03-02 Bosch Gmbh Robert Elektrische Schaltung mit einer Vorrichtung zur Erfassung einer Stromgröße
US6876104B1 (en) * 2001-11-27 2005-04-05 Yazaki North America, Inc. High-speed switching circuit and automotive accessory controller using same
DE102004042719A1 (de) * 2004-09-03 2005-09-29 Audi Ag Stromsensor mit einem Messwiderstand
WO2006087342A1 (fr) * 2005-02-16 2006-08-24 Continental Teves Ag & Co. Ohg Dispositif pour saisir des courants electriques
DE102006039097A1 (de) * 2006-02-20 2007-08-23 Conti Temic Microelectronic Gmbh Strommess-Einrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19540570A1 (de) * 1995-03-18 1996-09-19 Hartmann Karlheinz Elektronic Leiterplatte und Verfahren zu ihrer Herstellung
WO2005109973A1 (fr) * 2004-05-06 2005-11-17 Microbridge Technologies Inc, Ajustage de composants passifs integres par chauffage pulse
DE102005047090A1 (de) * 2005-09-30 2007-04-05 Robert Bosch Gmbh Elektrische Vorrichtung mit einem darauf angeordneten Widerstand

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19838974A1 (de) * 1998-08-27 2000-03-02 Bosch Gmbh Robert Elektrische Schaltung mit einer Vorrichtung zur Erfassung einer Stromgröße
US6876104B1 (en) * 2001-11-27 2005-04-05 Yazaki North America, Inc. High-speed switching circuit and automotive accessory controller using same
DE102004042719A1 (de) * 2004-09-03 2005-09-29 Audi Ag Stromsensor mit einem Messwiderstand
WO2006087342A1 (fr) * 2005-02-16 2006-08-24 Continental Teves Ag & Co. Ohg Dispositif pour saisir des courants electriques
DE102006039097A1 (de) * 2006-02-20 2007-08-23 Conti Temic Microelectronic Gmbh Strommess-Einrichtung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016216348A1 (de) 2016-08-30 2018-03-01 Continental Teves Ag & Co. Ohg Messanordnung zur Strommessung

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