WO2016055277A1 - Device and method for measuring a current in a conductor track of a printed circuit board - Google Patents

Device and method for measuring a current in a conductor track of a printed circuit board Download PDF

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Publication number
WO2016055277A1
WO2016055277A1 PCT/EP2015/071975 EP2015071975W WO2016055277A1 WO 2016055277 A1 WO2016055277 A1 WO 2016055277A1 EP 2015071975 W EP2015071975 W EP 2015071975W WO 2016055277 A1 WO2016055277 A1 WO 2016055277A1
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WO
WIPO (PCT)
Prior art keywords
conductor track
resistance structure
resistance
circuit board
current
Prior art date
Application number
PCT/EP2015/071975
Other languages
German (de)
French (fr)
Inventor
Friedrich Loskarn
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Publication of WO2016055277A1 publication Critical patent/WO2016055277A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts

Definitions

  • the invention relates to a device and a method for determining a current intensity of a current flowing through a conductor track of a printed circuit board electrical current.
  • Multilayer printed circuit boards are known from the prior art, which have a plurality of superimposed layers of conductor tracks.
  • precision resistors are known, which are connected as separate components with connecting leads to the electrically conductive connection.
  • Such precision resistors exist z.
  • B. essentially of a film which is formed of a copper-nickel-manganese alloy.
  • the invention is based on the object to provide a comparison with the prior art improved device and an improved method for current detection in at least one conductor of a circuit board.
  • At least a portion of the conductor track comprises a resistor structure which is formed integrally with the conductor track, wherein the resistance structure forms a measuring resistor for determining the current intensity.
  • the resistance structure of the track replaces separate
  • Measuring resistors which are coupled to determine the current with a conductor track, wherein the conductor track and the resistor structure are formed of one and the same material.
  • the section of the at least one conductor track having the resistance structure has a number of material recesses which interrupt a complete structure of the conductor track at least in sections, so that a resistance is set against the electrical current.
  • the abutment structure was ⁇ a meander shape parallel to the current direction. In this way, a correspondingly high resistance value, for. B. between 20 mOhm and 90 mOhm of the electrically conductive connection can be generated in this section. This means that resistance values of for example 25 or 80 mOhm mOhm re ⁇ alisierbar which for high current strengths, in particular
  • the resistance structure has a web extending perpendicular to the current direction with rib-shaped formations projecting parallel to the current direction.
  • the printed circuit board has a multi-layered construction and comprises a predetermined number of conductor track-carrying layers which are arranged one above the other, wherein the resistance structure is arranged in a lower layer.
  • the resistance structure is arranged in a lower layer.
  • the resistance structure generates a loss of heat due to the electrical resistance during current flow, resulting in an increase of the resistance value.
  • the resistance structure is arranged in one of the lower layers, the heat loss to a thermally conductive component, for.
  • a thermal adhesive which connect a base plate and the conductor carrying layers cohesively with each other, are dissipated. This arrangement thus represents a close thermal coupling of the resistor structures to the base plate.
  • the dissipation of the lost heat can preferably be additionally supported by so-called vias, also known as through-contacts, which electrically connect the electrically conductive connections of different layers of the printed circuit board to one another.
  • vias also known as through-contacts
  • a spatially close temperature sensor is also thermally bonded by surface mounting on the circuit board, the formation of so-called thermal vias underneath the temperature sensor closely to the base plate. This is advantageous to maintain a Tem ⁇ peraturdifferenz between the temperature sensor and to be calibrated resistor structures to a minimum.
  • a method according to the invention is provided in which at least one conductor track is provided in sections with a resistance structure. Furthermore, it is provided that the resistance structure with measuring lines or measuring points electrically is coupled, by means of a voltage drop across the Wi ⁇ derstands für is detected.
  • a measuring resistor for determining a current strength can be realized, which is produced in a common method step with the conductor track.
  • the conductor track and the resistor structure are etched from a thin layer of copper, wherein the Wider ⁇ stand structure and the interconnect are formed integrally. The method thus also allows a cost and zeitef ⁇ efficient production of the device.
  • the measuring ⁇ lines are arranged in a different position to the resistance structure of the circuit board.
  • the measuring lines can be electrically coupled to the resistance structure by means of vias or plated-through holes.
  • the measuring points and the resistance structure are arranged in a common position of the printed circuit board.
  • 1 is a schematic sectional view of a multilayer printed circuit board
  • FIG. 3 is a plan view of a layer of the printed circuit board with a number of mutually parallel measuring leads
  • FIG. 1 shows an exemplary embodiment of a multi-layer printed circuit board 1 in a sectional view, in particular in a longitudinal section.
  • the circuit board 1 is arranged on a base plate 2, which in particular for the cooling of the circuit board 1 as a metal core, for. B. consisting of aluminum or an aluminum alloy is formed.
  • the printed circuit board 1 comprises six electrically conductive layers, which are arranged one above the other on the base plate 2.
  • the circuit board 1 is preferably integrally connected to the base plate 2 before ⁇ being discussed in more detail later on it.
  • the electrically conductive layers each carry a layer LI to L6 with a predetermined number of interconnects 3, which are not shown electronic components of the printed circuit board 1 electrically interconnect and which are suitably made of an electrically conductive material, in particular of copper.
  • the interconnects 3 are preferably by etching processes, for. B. copper etching, produced.
  • An upper first layer LI and a lower sixth layer L6 are each provided with a copper layer 4 and an overlying gold layer 5 according to the exemplary embodiment.
  • the copper layer 4 is z. B. applied by means of chemical and / or galvanic copper-plating in the manufacture of the circuit board 1 to the corresponding layer. In particular, bores, milling ends and other components for which a metallization is provided are provided with the copper coating 4.
  • Another metallization layer for. B. consisting of silver, can be used.
  • the gold layer 5 is for component mounting of the circuit board 1 with respect to use arranged a so-called Silberleitklebers, which is not discussed in the context of this application.
  • a layer with an adhesive 6 is brought a ⁇ for an integral connection of the circuit board 1 and the base plate. 2
  • adhesive 6 in this case, in particular, a thermal adhesive, which is laminated to the base plate 2 is suitable.
  • the adhesive 6 is electrically connected by means of the gold layer 5 to the conductor tracks 3 of the sixth layer L6 and by means of plated-through holes 7 with the interconnects 3 of a fifth layer L5 arranged above the sixth layer L6.
  • the plated-through holes 7 are formed as bores in a carrier material of the fifth and sixth layers L5 and L6 and have an electrically conductive inner coating.
  • the vias 7 thus also connect the interconnects 3 of the sixth layer L6 with the interconnects 3 of the overlying fifth layer L5 electrically.
  • measuring resistors are provided, by means of which a voltage drop across the resistor can be detected and, as a result, a current intensity of an electrical current I flowing through the measuring resistor
  • the measuring resistor is formed by a section of a conductor 3, which has a resistance structure, which is produced by a number of material recesses A of the conductor 3, which form a resistance for the electric current I.
  • the conductor 3 and the resistance structure are thus formed from one and the same material.
  • Figure 2 shows a first embodiment of the invention, wherein a portion of a conductor track 3 is shown in plan view.
  • the section of the conductor track 3 shown has a meandering Resistor structure in the direction of the electric current I, whereby this portion of the conductor track 3 has a reduced width in relation to the current flow direction and thus receives a correspondingly opposite to the adjacent conductor track 3 an increased resistance value.
  • the meandering shape is formed by the material recesses A, which interrupt a solid structure of the conductor track 3.
  • the conductor 3, together with the resistor structure shown, can preferably be produced in a common method step.
  • the meander-shaped resistance structure is, for example, a section of a conductor track 3 which is arranged in the sixth layer L6.
  • the resistance structure is electrically connected to the overlying fifth layer L5 as well as to the adhesion means 6 by means of the plated-through holes 7.
  • a resistance value between 20 mOhm and 90 mOhm can be generated for the conductor track section shown, so that the meander-shaped resistance structure forms a measuring resistor having a resistance value of for example 25 mOhm or 80 mOhm.
  • a current intensity of an electric current I flowing through the conductor track section with the meandering resistance structure can be detected by detecting a voltage drop across the resistance structure by means of the generally known ohmic law
  • R electrical resistance to be determined. For example, with a voltage drop of 500 yV detected across the resistor structure at a resistance of 25 mOhm, a current of 20 mA can be determined. For detecting a voltage drop Messleitun ⁇ gen 1.8 to 6.8 are provided, which are exemplarily shown in FIG. 3
  • Figure 3 shows a plan view of the above the lower layer L6 lying position L5 which six mutually parallel measurement lines 1.8 to 6.8 comprising, the longitudinal ⁇ orientations in each case perpendicular to the longitudinal direction of the meander-shaped resistor structure extend, as based on a position of the vias 7 can be seen in Figures 2 and 3.
  • the electrical voltage is detected between a first measuring line 8.1 and a second measuring line 8.2, which are electrically coupled, for example, with a measuring amplifier, not shown.
  • the measuring amplifier prepares the voltage signal accordingly by amplifying it.
  • the measuring amplifier is further coupled to a processing unit, not shown, which determines the current intensity of the electric current I with the aid of the above-mentioned Ohm's Law on the basis of the voltage signal transmitted by the measuring amplifier.
  • Figure 4 shows an alternative embodiment of a resistor ⁇ structure comprising a web 3.1 with a longitudinal orientation perpendicular to the flow direction and the rib-shaped protrusions 3.2 which 3.1abragen parallel to the current direction of the web, said rib-like formations are made by Materialaus- recesses A 3.2.
  • the electric current I is divided according to the number of rib-shaped formations 3.2.
  • measuring points 9.1, 9.2 are provided, which together with the resistance structure z.
  • the sixth Location L6 of the circuit board 1 are arranged.
  • the measurement punk ⁇ te 9.1, 9.2 protrude on a front side of the web 3.1 axially in the longitudinal orientation, and are analogous to the Messlei ⁇ obligations 8.1, 8.2 connected to a not shown measurement amplifier which amplifies the voltage signal and transmitted to a computing unit.
  • the alternatively executed resistance structure By means of the alternatively executed resistance structure, a resistance value of 1 mOhm can be realized for the conductor track section, so that a measuring resistor for higher current strengths in the ampere range is possible.
  • the alternatively executed resistance structure may also be formed without rib-shaped formations 3.2, whereby a width of the web 3.1 running longitudinally to the current flow direction is preferably smaller than the adjacent conductor track sections both in the shown alternative embodiment and in the alternative embodiment, not shown. to obtain an ent ⁇ speaking high resistance value.
  • the arrangement of the resistance structures is preferably carried out in the sixth position L6, in order to achieve optimum cooling of the printed circuit board 1, wherein a loss of heat of the resistance structures can be derived via the heat-conductive adhesive 6.
  • the resistor structures can also be arranged in the fifth position L5. It is also conceivable to provide a meander-shaped resistance structure in the sixth position L6 and a web-shaped resistance structure according to FIG. 4 in the fifth position L5 or vice versa. Furthermore, other forms of resistance structures can be realized by means of which a corresponding resistance value of a conductor track section can be generated.
  • a calibration of the resistance structure via temperature and electric current I is necessary.
  • the calibration is carried out by means of a calibration process at least two temperatures and at least two currents.
  • the calibration takes place in such a way that both an absolute tolerance compensation of the resistance structure and a compensation of a temperature variation of the resistance structure takes place.
  • a temperature value that is calibrated during calibration and used to determine an actual amperage during operation is a temperature of the PCB mounted temperature sensor.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a device for ascertaining a current strength of an electric current (I) flowing through a conductor track (3) of a printed circuit board (1). At least one section of the at least one conductor track (3) has a resistor structure which is formed as a single piece together with the conductor track (3), and a measurement resistance can be generated by means of the resistor structure in order to ascertain the current strength. The invention further relates to a method for producing such a device, wherein - at least one conductor track (3) is provided with a resistor structure in at least some sections, said structure being formed as a single piece together with the conductor track (3), and - the resistor structure is electrically coupled to a specified number of measurement lines (8.1 to 8.6) or measurement points (9.1, 9.2) which are provided in order to detect a voltage drop over the resistor structure.

Description

Beschreibung description
Vorrichtung und Verfahren zur Strommessung in einer Leiterbahn einer Leiterplatte Device and method for current measurement in a printed conductor of a printed circuit board
Die Erfindung betrifft eine Vorrichtung und ein Verfahren zur Ermittlung einer Stromstärke eines durch eine Leiterbahn einer Leiterplatte fließenden elektrischen Stroms. Aus dem Stand der Technik sind mehrschichtige Leiterplatten bekannt, die mehrere übereinanderliegende Lagen von Leiterbahnen aufweisen. Zur Erfassung eines Stroms in einer dieser Leiterbahnen sind Präzisionswiderstände bekannt, die als separate Bauteile mit Anschlussleitungen an die elektrisch leitende Verbindung angeschlossen werden. Derartige Präzisionswiderstände bestehen z. B. im Wesentlichen aus einer Folie, die aus einer Kupfer-Nickel-Mangan-Legierung gebildet ist. The invention relates to a device and a method for determining a current intensity of a current flowing through a conductor track of a printed circuit board electrical current. Multilayer printed circuit boards are known from the prior art, which have a plurality of superimposed layers of conductor tracks. For detecting a current in one of these tracks precision resistors are known, which are connected as separate components with connecting leads to the electrically conductive connection. Such precision resistors exist z. B. essentially of a film which is formed of a copper-nickel-manganese alloy.
Der Erfindung liegt die Aufgabe zu Grunde, eine gegenüber dem Stand der Technik verbesserte Vorrichtung sowie ein verbessertes Verfahren zur Stromerfassung in mindestens einer Leiterbahn einer Leiterplatte anzugeben. The invention is based on the object to provide a comparison with the prior art improved device and an improved method for current detection in at least one conductor of a circuit board.
Hinsichtlich der Vorrichtung wird die Aufgabe erfindungsgemäß mit den in Anspruch 1 angegebenen Merkmalen und hinsichtlich des Verfahrens mit den in Anspruch 8 angegebenen Merkmalen gelöst. With regard to the device, the object is achieved according to the invention with the features specified in claim 1 and in terms of the method with the features specified in claim 8.
Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche . Advantageous embodiments of the invention are the subject of the dependent claims.
Bei einer Vorrichtung zur Ermittlung einer Stromstärke eines durch eine Leiterbahn einer Leiterplatte fließenden elektrischen Stroms umfasst erfindungsgemäß zumindest ein Abschnitt der Leiterbahn eine Widerstandsstruktur, die einteilig mit der Leiterbahn ausgebildet ist, wobei die Widerstandsstruktur einen Messwiderstand zur Ermittlung der Stromstärke bildet. Die Widerstandsstruktur der Leiterbahn ersetzt separate In a device for determining a current intensity of an electrical current flowing through a conductor track of a printed circuit board according to the invention at least a portion of the conductor track comprises a resistor structure which is formed integrally with the conductor track, wherein the resistance structure forms a measuring resistor for determining the current intensity. The resistance structure of the track replaces separate
Messwiderstände, die zur Ermittlung der Stromstärke mit einer Leiterbahn gekoppelt werden, wobei die Leiterbahn und die Widerstandsstruktur aus ein und demselben Material gebildet sind. Damit werden zum Einem Kosten gegenüber dem Stand der Technik eingespart und zum Anderen eine Zuverlässigkeit der Messergebnisse gesteigert, da die Widerstandsstruktur und die Leiterbahn einteilig ausgebildet sind und somit keine Beein¬ flussung der Messergebnisse durch Kontaktwiderstände mit se- paraten Bauteilen erfolgt. Measuring resistors, which are coupled to determine the current with a conductor track, wherein the conductor track and the resistor structure are formed of one and the same material. In order for a cost over the prior art are saved and on the other hand increased reliability of the measurement results, as the resistance structure and the strip conductor are formed integrally and therefore no Impress ¬ flussung the measurement results by contact resistance with sepa- rate components takes place.
Die Ermittlung der Stromstärke mit Hilfe eines Messwiderstands erfolgt dabei anhand des allgemein bekannten Ohm' sehen Gesetzes . Dabei wird bei Stromfluss durch die Widerstandsstruktur ein Spannungsabfall erzeugt, welcher erfasst wird und aus dem resultierend eine Stromstärke des elektrischen Stroms The determination of the current with the aid of a measuring resistor takes place on the basis of the well-known Ohm 'see law. In this case, a current drop is generated by the resistance structure, a voltage drop, which is detected and from the resulting current strength of the electric current
ermittelbar ist. can be determined.
Der die Widerstandsstruktur aufweisende Abschnitt der mindestens einen Leiterbahn weist eine Anzahl von Materialausnehmungen auf, die eine Vollstruktur der Leiterbahn zumindest abschnittsweise unterbrechen, so dass dem elektrischen Strom ein Widerstand entgegengesetzt wird. Gemäß einem bevorzugten Ausführungsbeispiel weist die Wider¬ standsstruktur eine Mäanderform parallel zur Stromrichtung auf. Auf diese Weise kann ein entsprechend hoher Widerstandswert, z. B. zwischen 20 mOhm und 90 mOhm der elektrisch leitenden Verbindung in diesem Abschnitt erzeugt werden. Damit sind Widerstandswerte von beispielsweise 25 mOhm oder 80 mOhm re¬ alisierbar, welche für hohe Stromstärken , insbesondere The section of the at least one conductor track having the resistance structure has a number of material recesses which interrupt a complete structure of the conductor track at least in sections, so that a resistance is set against the electrical current. According to a preferred embodiment, the abutment structure was ¬ a meander shape parallel to the current direction. In this way, a correspondingly high resistance value, for. B. between 20 mOhm and 90 mOhm of the electrically conductive connection can be generated in this section. This means that resistance values of for example 25 or 80 mOhm mOhm re ¬ alisierbar which for high current strengths, in particular
Stromstärken bis zwei Ampere, ausgelegt sind. Amperage up to two amps, are designed.
Alternativ weist die Widerstandsstruktur einen senkrecht zur Stromrichtung verlaufenden Steg mit parallel zur Stromrichtung abragenden, rippenförmigen Ausformungen auf. Mittels der alternativ ausgeführten Widerstandsstruktur ist ein Widerstandswert von 1 mOhm realisierbar, so dass hierbei höhere Stromstärken im Amperebereich, insbesondere in einem Bereich bis zu 150 Ampere, ermittelbar sind. Alternatively, the resistance structure has a web extending perpendicular to the current direction with rib-shaped formations projecting parallel to the current direction. By means of the alternatively executed resistance structure, a resistance value of 1 mOhm can be realized, so that in this case higher Amperages in the ampere range, in particular in a range up to 150 amps, can be determined.
Die Leiterplatte ist gemäß einem Ausführungsbeispiel mehrlagig ausgebildet und umfasst eine vorgegebene Anzahl Leiterbahn tragender Lagen, die übereinander angeordnet sind, wobei die Widerstandsstruktur in einer unteren Lage angeordnet ist. Dies ist insbesondere im Hinblick auf eine Temperaturdrift vor¬ teilhaft, da die Widerstandsstruktur aufgrund des elektrischen Widerstands bei Stromfluss eine Verlustwärme erzeugt, aus der eine Erhöhung des Widerstandswerts resultiert. Dadurch, dass die Widerstandsstruktur in einer der unteren Lagen angeordnet ist, kann die Verlustwärme an eine wärmeleitende Komponente, z. B. ein Wärmeleitkleber, welcher eine Grundplatte und die Leiterbahn tragenden Lagen stoffschlüssig miteinander verbinden, abgeführt werden. Diese Anordnung stellt somit eine enge thermische Kopplung der Widerstandsstrukturen zur Grundplatte dar. According to one exemplary embodiment, the printed circuit board has a multi-layered construction and comprises a predetermined number of conductor track-carrying layers which are arranged one above the other, wherein the resistance structure is arranged in a lower layer. This is especially advantageous with regard to a temperature drift because the resistance structure generates a loss of heat due to the electrical resistance during current flow, resulting in an increase of the resistance value. Characterized in that the resistance structure is arranged in one of the lower layers, the heat loss to a thermally conductive component, for. Example, a thermal adhesive, which connect a base plate and the conductor carrying layers cohesively with each other, are dissipated. This arrangement thus represents a close thermal coupling of the resistor structures to the base plate.
Damit ist ein schneller Temperaturanstieg im Bereich der Wi- derstandsstruktur verringerbar. Das Abführen der Verlustwärme kann vorzugsweise durch sogenannte Vias, auch als Durch- kontaktierungen bekannt, die elektrisch leitende Verbindungen unterschiedlicher Lagen der Leiterplatte elektrisch miteinander verbinden, zusätzlich unterstützt werden. Auch ein räumlich nahe angeordneter Temperatursensor, wird durch flächige Montage auf der Leiterplatte, der Ausbildung von sogenannten thermischen Vias unterhalb des Temperatursensors ebenfalls thermisch eng an die Grundplatte gebunden. Dies ist vorteilhaft, um eine Tem¬ peraturdifferenz zwischen des Temperatursensors und den zu kalibrierenden Widerstandsstrukturen möglichst gering zu halten . This makes it possible to reduce a rapid rise in temperature in the area of the resistance structure. The dissipation of the lost heat can preferably be additionally supported by so-called vias, also known as through-contacts, which electrically connect the electrically conductive connections of different layers of the printed circuit board to one another. Also, a spatially close temperature sensor is also thermally bonded by surface mounting on the circuit board, the formation of so-called thermal vias underneath the temperature sensor closely to the base plate. This is advantageous to maintain a Tem ¬ peraturdifferenz between the temperature sensor and to be calibrated resistor structures to a minimum.
Zur Herstellung einer zuvor beschriebenen Vorrichtung ist ein erfindungsgemäßes Verfahren vorgesehen, bei dem mindestens eine Leiterbahn abschnittsweise mit einer Widerstandsstruktur versehen wird. Weiterhin ist vorgesehen, dass die Widerstandsstruktur mit Messleitungen oder Messpunkten elektrisch gekoppelt wird, mittels der ein Spannungsabfall über der Wi¬ derstandsstruktur erfasst wird. To produce a device described above, a method according to the invention is provided in which at least one conductor track is provided in sections with a resistance structure. Furthermore, it is provided that the resistance structure with measuring lines or measuring points electrically is coupled, by means of a voltage drop across the Wi ¬ derstandsstruktur is detected.
Mittels des Verfahrens kann ein Messwiderstand zur Ermittlung einer Stromstärke realisiert werden, der in einem gemeinsamen Verfahrensschritt mit der Leiterbahn hergestellt wird. Bei¬ spielsweise werden die Leiterbahn und die Widerstandsstruktur aus einer dünnen Schicht Kupfer geätzt, wobei die Wider¬ standsstruktur und die Leiterbahn einteilig ausgebildet werden. Das Verfahren ermöglicht somit auch eine kosten- und zeitef¬ fiziente Herstellung der Vorrichtung. By means of the method, a measuring resistor for determining a current strength can be realized, which is produced in a common method step with the conductor track. In ¬ example, the conductor track and the resistor structure are etched from a thin layer of copper, wherein the Wider ¬ stand structure and the interconnect are formed integrally. The method thus also allows a cost and zeitef ¬ efficient production of the device.
Gemäß einem bevorzugten Ausführungsbeispiel werden die Mess¬ leitungen in einer zur Widerstandsstruktur verschiedenen Lage der Leiterplatte angeordnet. Die Messleitungen können hierbei mittels Vias bzw. Durchkontaktierungen mit der Widerstandsstruktur elektrisch gekoppelt werden. According to a preferred embodiment, the measuring ¬ lines are arranged in a different position to the resistance structure of the circuit board. In this case, the measuring lines can be electrically coupled to the resistance structure by means of vias or plated-through holes.
Alternativ werden die Messpunkte und die Widerstandsstruktur in einer gemeinsamen Lage der Leiterplatte angeordnet. Alternatively, the measuring points and the resistance structure are arranged in a common position of the printed circuit board.
Ausführungsbeispiele der Erfindung werden im Folgenden anhand von Zeichnungen näher erläutert. Dabei zeigen: Embodiments of the invention are explained in more detail below with reference to drawings. Showing:
Fig. 1 schematisch eine Schnittdarstellung einer mehrschichtigen Leiterplatte, 1 is a schematic sectional view of a multilayer printed circuit board,
Fig.2 eine Draufsicht auf eine erste erfindungsgemäße 2 shows a plan view of a first invention
WiderStandsstruktur,  Resistance structure,
Fig.3 eine Draufsicht auf eine Lage der Leiterplatte mit einer Anzahl von parallel zueinander verlaufenden Messleitungen, und 3 is a plan view of a layer of the printed circuit board with a number of mutually parallel measuring leads, and
Fig.4 eine Draufsicht auf eine zweite erfindungsgemäße 4 shows a plan view of a second invention
WiderStandsstruktur . Einander entsprechende Teile sind in allen Figuren mit den gleichen Bezugszeichen versehen. Resistance structure. Corresponding parts are provided in all figures with the same reference numerals.
Figur 1 zeigt eine beispielhafte Ausführungsform einer mehr- schichtigen Leiterplatte 1 in Schnittdarstellung, insbesondere in einem Längsschnitt. FIG. 1 shows an exemplary embodiment of a multi-layer printed circuit board 1 in a sectional view, in particular in a longitudinal section.
Die Leiterplatte 1 ist auf einer Grundplatte 2 angeordnet, welche insbesondere zur Entwärmung der Leiterplatte 1 als Metallkern, z. B. bestehend aus Aluminium oder einer Aluminium-Legierung, ausgebildet ist. Die Leiterplatte 1 umfasst sechs elektrisch leitende Schichten, die auf der Grundplatte 2 übereinander angeordnet sind. Die Leiterplatte 1 ist vor¬ zugsweise stoffschlüssig mit der Grundplatte 2 verbunden, wobei darauf später näher eingegangen wird. The circuit board 1 is arranged on a base plate 2, which in particular for the cooling of the circuit board 1 as a metal core, for. B. consisting of aluminum or an aluminum alloy is formed. The printed circuit board 1 comprises six electrically conductive layers, which are arranged one above the other on the base plate 2. The circuit board 1 is preferably integrally connected to the base plate 2 before ¬ being discussed in more detail later on it.
Die elektrisch leitenden Schichten tragen jeweils eine Lage LI bis L6 mit einer vorgegebenen Anzahl von Leiterbahnen 3, welche nicht gezeigte elektronische Bauelemente der Leiter- platte 1 elektrisch miteinander verbinden und die zweckmäßigerweise aus einem elektrisch leitenden Material, insbesondere aus Kupfer, gebildet sind. Die Leiterbahnen 3 sind vorzugsweise durch Ätzprozesse, z. B. Kupferätzung, herstellbar. Eine obere erste Lage LI und eine untere sechste Lage L6 sind gemäß der beispielhaften Ausführungsform jeweils mit einer Kupferschicht 4 und einer darüber liegenden Goldschicht 5 versehen . Die Kupferschicht 4 wird z. B. mittels chemischer und/oder galvanischer Aufkupferung bei der Herstellung der Leiterplatte 1 auf die entsprechende Schicht aufgebracht. Hierbei werden insbesondere Bohrungen, Fräsenden und weitere Bestandteile, für die eine Metallisierung vorgesehen ist, mit der Kupferbe- Schichtung 4 versehen. Alternativ zur Kupferbeschichtung 4 kann auch eine andere Metallisierungsschicht, z. B. bestehend aus Silber, verwendet werden. Die Goldschicht 5 ist für eine Bauteilmontage der Leiterplatte 1 hinsichtlich der Verwendung eines sogenannten Silberleitklebers angeordnet, worauf im Rahmen dieser Anmeldung nicht näher eingegangen wird. The electrically conductive layers each carry a layer LI to L6 with a predetermined number of interconnects 3, which are not shown electronic components of the printed circuit board 1 electrically interconnect and which are suitably made of an electrically conductive material, in particular of copper. The interconnects 3 are preferably by etching processes, for. B. copper etching, produced. An upper first layer LI and a lower sixth layer L6 are each provided with a copper layer 4 and an overlying gold layer 5 according to the exemplary embodiment. The copper layer 4 is z. B. applied by means of chemical and / or galvanic copper-plating in the manufacture of the circuit board 1 to the corresponding layer. In particular, bores, milling ends and other components for which a metallization is provided are provided with the copper coating 4. As an alternative to the copper coating 4, another metallization layer, for. B. consisting of silver, can be used. The gold layer 5 is for component mounting of the circuit board 1 with respect to use arranged a so-called Silberleitklebers, which is not discussed in the context of this application.
Zwischen der Grundplatte 2 und der unteren Goldschicht 5 ist für eine Stoffschlüssige Verbindung der Leiterplatte 1 und der Grundplatte 2 eine Schicht mit einem Adhäsionsmittel 6 ein¬ gebracht. Als Adhäsionsmittel 6 eignet sich hierbei insbesondere ein Wärmeleitkleber, welcher auf die Grundplatte 2 auflaminiert ist. Das Adhäsionsmittel 6 ist mittels der Goldschicht 5 elektrisch leitend mit den Leiterbahnen 3 der sechsten Lage L6 und mittels Durchkontaktierungen 7 mit den Leiterbahnen 3 einer über der sechsten Lage L6 angeordneten fünften Lage L5 verbunden . Die Durchkontaktierungen 7 sind als Bohrungen in einem Trägermaterial der fünften und sechsten Lagen L5 und L6 ausgebildet und weisen eine elektrisch leitende Innenbeschichtung auf. Die Durchkontaktierungen 7 verbinden somit zusätzlich die Leiterbahnen 3 der sechsten Lage L6 mit den Leiterbahnen 3 der darüber liegenden fünften Lage L5 elektrisch. Between the base plate 2 and the lower gold layer 5 is a layer with an adhesive 6 is brought a ¬ for an integral connection of the circuit board 1 and the base plate. 2 As adhesive 6, in this case, in particular, a thermal adhesive, which is laminated to the base plate 2 is suitable. The adhesive 6 is electrically connected by means of the gold layer 5 to the conductor tracks 3 of the sixth layer L6 and by means of plated-through holes 7 with the interconnects 3 of a fifth layer L5 arranged above the sixth layer L6. The plated-through holes 7 are formed as bores in a carrier material of the fifth and sixth layers L5 and L6 and have an electrically conductive inner coating. The vias 7 thus also connect the interconnects 3 of the sixth layer L6 with the interconnects 3 of the overlying fifth layer L5 electrically.
Zur Strommessung in den Leiterbahnen 3 sind Messwiderstände vorgesehen, mittels der ein Spannungsabfall am Widerstand erfassbar und daraus resultierend eine Stromstärke eines durch den Messwiderstand fließenden, elektrischen Stroms I For current measurement in the interconnects 3, measuring resistors are provided, by means of which a voltage drop across the resistor can be detected and, as a result, a current intensity of an electrical current I flowing through the measuring resistor
ermittelbar ist. can be determined.
Erfindungsgemäß wird der Messwiderstand durch einen Abschnitt einer Leiterbahn 3 gebildet, der eine Widerstandsstruktur aufweist, wobei diese durch eine Anzahl von Materialausneh- mungen A der Leiterbahn 3 hergestellt wird, die für den elektrischen Strom I einen Widerstand bilden. Die Leiterbahn 3 und die Widerstandsstruktur sind somit aus ein und demselben Material gebildet. According to the invention, the measuring resistor is formed by a section of a conductor 3, which has a resistance structure, which is produced by a number of material recesses A of the conductor 3, which form a resistance for the electric current I. The conductor 3 and the resistance structure are thus formed from one and the same material.
Figur 2 zeigt eine erste Ausführungsform der Erfindung, wobei ein Abschnitt einer Leiterbahn 3 in Draufsicht gezeigt ist. Der gezeigte Abschnitt der Leiterbahn 3 weist eine mäanderförmige Widerstandsstruktur in Richtung des elektrischen Stroms I auf, wodurch dieser Abschnitt der Leiterbahn 3 eine in Bezug auf die Stromflussrichtung verringerte Breite aufweist und damit einen entsprechend gegenüber der angrenzenden Leiterbahn 3 einen erhöhten Widerstandswert erhält. Die Mäanderform wird durch die Materialausnehmungen A gebildet, die eine Vollstruktur der Leiterbahn 3 unterbrechen. Die Leiterbahn 3 ist zusammen mit der gezeigten Widerstandsstruktur vorzugsweise in einem gemeinsamen Verfahrensschritt herstellbar. Figure 2 shows a first embodiment of the invention, wherein a portion of a conductor track 3 is shown in plan view. The section of the conductor track 3 shown has a meandering Resistor structure in the direction of the electric current I, whereby this portion of the conductor track 3 has a reduced width in relation to the current flow direction and thus receives a correspondingly opposite to the adjacent conductor track 3 an increased resistance value. The meandering shape is formed by the material recesses A, which interrupt a solid structure of the conductor track 3. The conductor 3, together with the resistor structure shown, can preferably be produced in a common method step.
Die mäanderförmige Widerstandsstruktur ist beispielsweise ein Abschnitt einer Leiterbahn 3, welcher in der sechsten Lage L6 angeordnet ist. Die Widerstandsstruktur ist hierbei mittels der Durchkontaktierungen 7 sowohl mit der darüber liegenden fünften Lage L5 als auch mit dem Adhäsionsmittel 6 elektrisch verbunden . The meander-shaped resistance structure is, for example, a section of a conductor track 3 which is arranged in the sixth layer L6. In this case, the resistance structure is electrically connected to the overlying fifth layer L5 as well as to the adhesion means 6 by means of the plated-through holes 7.
Mittels der mäanderförmigen Widerstandsstruktur kann für den gezeigten Leiterbahnabschnitt ein Widerstandswert zwischen 20 mOhm und 90 mOhm erzeugt werden, so dass die mäanderförmige Widerstandsstruktur einen Messwiderstand mit einem Widerstandswert von beispielsweise 25 mOhm oder 80 mOhm bildet. By means of the meander-shaped resistance structure, a resistance value between 20 mOhm and 90 mOhm can be generated for the conductor track section shown, so that the meander-shaped resistance structure forms a measuring resistor having a resistance value of for example 25 mOhm or 80 mOhm.
Eine Stromstärke eines elektrischen Stroms I, welcher den Leiterbahnabschnitt mit der mäanderförmigen Widerstandsstruktur durchströmt, kann durch Erfassen eines Spannungsabfalls über der Widerstandsstruktur mit Hilfe des allgemein bekannten Ohm' sehen Gesetzes A current intensity of an electric current I flowing through the conductor track section with the meandering resistance structure can be detected by detecting a voltage drop across the resistance structure by means of the generally known ohmic law
U U
1= — (1) , p  1 = - (1), p
30  30
mit I elektrischer Strom, with I electric current,
U elektrische Spannung,  U electrical voltage,
R elektrischer Widerstand, ermittelt werden. Beispielsweise kann bei einem über der Widerstandsstruktur erfassten Spannungsabfall von 500 yV bei einem Widerstandswert von 25 mOhm eine Stromstärke von 20 mA ermittelt werden. Zur Erfassung eines Spannungsabfalls sind Messleitun¬ gen 8.1 bis 8.6 vorgesehen, die beispielhaft in Figur 3 gezeigt sind . R electrical resistance, to be determined. For example, with a voltage drop of 500 yV detected across the resistor structure at a resistance of 25 mOhm, a current of 20 mA can be determined. For detecting a voltage drop Messleitun ¬ gen 1.8 to 6.8 are provided, which are exemplarily shown in FIG. 3
Figur 3 zeigt dabei eine Draufsicht auf die über der unteren Lage L6 liegende Lage L5, welche sechs parallel zueinander verlaufende Messleitungen 8.1 bis 8.6 umfasst, deren Längs¬ ausrichtungen jeweils senkrecht zur Längsausrichtung der mä- anderförmigen Widerstandsstruktur verlaufen, wie es anhand einer Position der Durchkontaktierungen 7 in den Figuren 2 und 3 zu erkennen ist. Figure 3 shows a plan view of the above the lower layer L6 lying position L5 which six mutually parallel measurement lines 1.8 to 6.8 comprising, the longitudinal ¬ orientations in each case perpendicular to the longitudinal direction of the meander-shaped resistor structure extend, as based on a position of the vias 7 can be seen in Figures 2 and 3.
Die elektrische Spannung wird zwischen einer ersten Messleitung 8.1 und einer zweiten Messleitung 8.2 erfasst, die beispielsweise mit einem nicht gezeigten Messverstärker elektrisch gekoppelt sind. Der Messverstärker bereitet das Spannungssignal entsprechend auf, in dem er dieses verstärkt. Der Messverstärker ist weiterhin mit einer nicht gezeigten Recheneinheit gekoppelt, die anhand des von dem Messverstärker übermittelten Spannungssignals die Stromstärke des elektrischen Stroms I mit Hilfe des oben genannten Ohm' sehen Gesetzes ermittelt. The electrical voltage is detected between a first measuring line 8.1 and a second measuring line 8.2, which are electrically coupled, for example, with a measuring amplifier, not shown. The measuring amplifier prepares the voltage signal accordingly by amplifying it. The measuring amplifier is further coupled to a processing unit, not shown, which determines the current intensity of the electric current I with the aid of the above-mentioned Ohm's Law on the basis of the voltage signal transmitted by the measuring amplifier.
Figur 4 zeigt eine alternative Ausführung einer Widerstands¬ struktur, welche einen Steg 3.1 mit einer Längsausrichtung senkrecht zur Stromrichtung und rippenförmigen Ausformungen 3.2 umfasst, die parallel zur Stromrichtung von dem Steg 3.1abragen, wobei die rippenförmigen Ausformungen 3.2 durch Materialaus- nehmungen A hergestellt sind. Der elektrische Strom I teilt sich hierbei entsprechend der Anzahl der rippenförmigen Ausformungen 3.2 auf. Figure 4 shows an alternative embodiment of a resistor ¬ structure comprising a web 3.1 with a longitudinal orientation perpendicular to the flow direction and the rib-shaped protrusions 3.2 which 3.1abragen parallel to the current direction of the web, said rib-like formations are made by Materialaus- recesses A 3.2. The electric current I is divided according to the number of rib-shaped formations 3.2.
Zur Erfassung eines Spannungsabfalls über der Widerstands¬ struktur sind hierbei Messpunkte 9.1, 9.2 vorgesehen, die gemeinsam mit der Widerstandsstruktur z. B. in der sechsten Lage L6 der Leiterplatte 1 angeordnet sind. Die Messpunk¬ te 9.1, 9.2 ragen an einer Stirnseite des Stegs 3.1 axial in dessen Längsausrichtung ab und sind analog zu den Messlei¬ tungen 8.1 ,8.2 mit einem nicht gezeigten Messverstärker verbunden, welcher das Spannungssignal verstärkt und an eine Recheneinheit übermittelt. To detect a voltage drop across the resistance ¬ structure here measuring points 9.1, 9.2 are provided, which together with the resistance structure z. In the sixth Location L6 of the circuit board 1 are arranged. The measurement punk ¬ te 9.1, 9.2 protrude on a front side of the web 3.1 axially in the longitudinal orientation, and are analogous to the Messlei ¬ obligations 8.1, 8.2 connected to a not shown measurement amplifier which amplifies the voltage signal and transmitted to a computing unit.
Mittels der alternativ ausgeführten Widerstandsstruktur ist für den Leiterbahnabschnitt ein Widerstandswert von 1 mOhm rea- lisierbar, so dass ein Messwiderstand für höhere Stromstärken im Amperebereich möglich ist. Die alternativ ausgeführte Widerstandsstruktur kann auch ohne rippenförmige Ausformungen 3.2 ausgebildet sein, wobei eine längs zur Stromflussrichtung verlaufende Breite des Stegs 3.1 sowohl in der gezeigten al- ternativen Ausführungsform als auch in der nicht gezeigten, zuvor erwähnten alternativen Ausführungsform vorzugsweise geringer ist als die angrenzenden Leiterbahnabschnitte, um einen ent¬ sprechend hohen Widerstandswert zu erhalten. Die Anordnung der Widerstandsstrukturen erfolgt vorzugsweise in der sechsten Lage L6, um eine optimale Kühlung der Leiterplatte 1 zu erreichen, wobei eine Verlustwärme der Widerstandsstrukturen über das wärmeleitende Adhäsionsmittel 6 abgeleitet werden kann. Alternativ können die Widerstandsstrukturen auch in der fünften Lage L5 angeordnet werden. Denkbar ist auch eine mäanderförmige Widerstandsstruktur in der sechsten Lage L6 und eine stegförmige Widerstandsstruktur gemäß Figur 4 in der fünften Lage L5 oder andersherum vorzusehen. Weiterhin sind auch andere Formen von Widerstandsstrukturen realisierbar, mittels denen ein ent- sprechender Widerstandswert eines Leiterbahnabschnitts erzeugbar ist. By means of the alternatively executed resistance structure, a resistance value of 1 mOhm can be realized for the conductor track section, so that a measuring resistor for higher current strengths in the ampere range is possible. The alternatively executed resistance structure may also be formed without rib-shaped formations 3.2, whereby a width of the web 3.1 running longitudinally to the current flow direction is preferably smaller than the adjacent conductor track sections both in the shown alternative embodiment and in the alternative embodiment, not shown. to obtain an ent ¬ speaking high resistance value. The arrangement of the resistance structures is preferably carried out in the sixth position L6, in order to achieve optimum cooling of the printed circuit board 1, wherein a loss of heat of the resistance structures can be derived via the heat-conductive adhesive 6. Alternatively, the resistor structures can also be arranged in the fifth position L5. It is also conceivable to provide a meander-shaped resistance structure in the sixth position L6 and a web-shaped resistance structure according to FIG. 4 in the fifth position L5 or vice versa. Furthermore, other forms of resistance structures can be realized by means of which a corresponding resistance value of a conductor track section can be generated.
Vor der Inbetriebnahme der beschriebenen Vorrichtung ist aufgrund einer Temperaturabhängigkeit des Materials der Lei- terbahnen 3, insbesondere von Kupfer, sowie Fehlertoleranzen beim Ätzen der Leiterbahnen 3 eine Kalibrierung der Widerstandsstruktur über Temperatur und elektrischen Strom I notwendig . Die Kalibrierung erfolgt mittels eines Abgleichverfahrens bei mindestens zwei Temperaturen und mindestens zwei Stromstärken. Die Kalibrierung erfolgt dabei derart, dass sowohl ein absoluter Toleranzausgleich der Widerstandsstruktur als auch ein Ausgleich eines Temperaturgangs der Widerstandsstruktur stattfindet. Ein Temperaturwert, auf den bei der Kalibrierung abgeglichen wird und der zur Ermittlung einer tatsächlichen Stromstärke im Betrieb dient, ist eine Temperatur des leiterplattenmontierten Temperatursensors . Before starting up the device described, due to a temperature dependence of the material of the conductor tracks 3, in particular of copper, as well as fault tolerances in the etching of the conductor tracks 3, a calibration of the resistance structure via temperature and electric current I is necessary. The calibration is carried out by means of a calibration process at least two temperatures and at least two currents. The calibration takes place in such a way that both an absolute tolerance compensation of the resistance structure and a compensation of a temperature variation of the resistance structure takes place. A temperature value that is calibrated during calibration and used to determine an actual amperage during operation is a temperature of the PCB mounted temperature sensor.
Bezugs zeichenliste Reference sign list
1 Leiterplatte 1 circuit board
2 Grundplatte  2 base plate
3 Leiterbahn 3 trace
3.1 Steg  3.1 Footbridge
3.2 rippenförmige Ausformungen 3.2 rib-shaped formations
4 Kupferschicht 4 copper layer
5 Goldschicht  5 gold layer
6 Adhäsionsmittel 6 Adhesives
7 Durchkontaktierung  7 via
8.1, 8.2 Messleitung  8.1, 8.2 Test lead
9.1 , 9.2 Messpunkt I elektrischer Strom 9.1, 9.2 Measuring point I electrical current
LI bis L6 Lagen  LI to L6 layers
A Materialausnehmung  A material recess

Claims

Patentansprüche claims
1. Vorrichtung zur Ermittlung einer Stromstärke eines durch eine Leiterbahn (3) einer Leiterplatte (1) fließenden elekt- rischen Stroms (I), 1. Device for determining a current intensity of a conductor track (3) of a printed circuit board (1) flowing electrical current (I),
dadurch gekennzeichnet, dass zumindest ein Abschnitt der mindestens einen Leiterbahn (3) eine Widerstandsstruktur aufweist, die mit der Leiterbahn (3) einteilig ausgebildet ist, wobei mittels der Widerstandsstruktur ein Messwiderstand zur Ermittlung der Stromstärke erzeugbar ist. characterized in that at least a portion of the at least one conductor track (3) has a resistance structure, which is integrally formed with the conductor track (3), wherein by means of the resistance structure, a measuring resistor for determining the current intensity can be generated.
2. Vorrichtung nach Anspruch 1, 2. Apparatus according to claim 1,
dadurch gekennzeichnet, dass der die Widerstandsstruktur aufweisende Abschnitt der mindestens einen Leiterbahn (3) eine Anzahl von Materialausnehmungen (A) aufweist, die eine Vollstruktur der Leiterbahn (3) zumindest abschnittsweise unter¬ brechen . characterized in that the portion of the resistive structure having the at least one conductor track (3) comprises a number of material recesses (A) which at least partially interrupt a full structure of the conductor track (3) under ¬.
3. Vorrichtung nach Anspruch 1 oder 2, 3. Apparatus according to claim 1 or 2,
dadurch gekennzeichnet, dass die Widerstandsstruktur eine Mäanderform parallel zur Stromrichtung aufweist. characterized in that the resistance structure has a meandering shape parallel to the current direction.
4. Vorrichtung nach Anspruch 3, 4. Apparatus according to claim 3,
dadurch gekennzeichnet, dass mittels der Widerstandsstruktur ein Widerstandswert zwischen 20 mOhm und 90 mOhm erzeugbar ist. characterized in that by means of the resistance structure, a resistance value between 20 mOhm and 90 mOhm can be generated.
5. Vorrichtung nach Anspruch 1 oder 2, 5. Apparatus according to claim 1 or 2,
dadurch gekennzeichnet, dass die Widerstandsstruktur einen senkrecht zur Stromrichtung verlaufenden Steg (3.1) mit parallel zur Stromrichtung abragenden, rippenförmigen Ausformungen (3.2) umfasst . characterized in that the resistance structure comprises a perpendicular to the current direction extending web (3.1) with projecting parallel to the flow direction, rib-shaped formations (3.2).
6. Vorrichtung nach Anspruch 5, 6. Apparatus according to claim 5,
dadurch gekennzeichnet, dass die Widerstandsstruktur einen Widerstandswert von 1 mOhm aufweist. characterized in that the resistance structure has a resistance of 1 mOhm.
7. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leiterplatte (1) eine vor- gegebene Anzahl von Leiterbahnen (3) tragenden Lagen (LI bis L6) umfasst, die übereinander angeordnet sind, wobei die Widerstandsstruktur in einer unteren Lage (L6) angeordnet ist . 7. Device according to one of the preceding claims, characterized in that the circuit board (1) has a a given number of tracks (3) carrying layers (LI to L6), which are arranged one above the other, wherein the resistance structure in a lower layer (L6) is arranged.
8. Verfahren zur Herstellung einer Vorrichtung nach einem der vorhergehenden Ansprüche, 8. A method for producing a device according to one of the preceding claims,
dadurch gekennzeichnet, dass characterized in that
- mindestens eine Leiterbahn (3) abschnittsweise mit einer Widerstandsstruktur versehen wird, die einteilig mit der - At least one conductor track (3) is provided in sections with a resistance structure, which is integral with the
Leiterbahn (3) ausgebildet wird, und Conductor track (3) is formed, and
- die Widerstandsstruktur mit einer vorgegebenen Anzahl von Messleitungen (8.1 bis 8.6) oder Messpunkten (9.1, 9.2) elektrisch gekoppelt wird, die zur Erfassung eines Span- nungsabfalls über der Widerstandsstruktur vorgesehen sind.  - The resistance structure with a predetermined number of test leads (8.1 to 8.6) or measuring points (9.1, 9.2) is electrically coupled, which are provided for detecting a voltage drop across the resistor structure.
9. Verfahren nach Anspruch 8, 9. The method according to claim 8,
dadurch gekennzeichnet, dass die Messleitungen (8.1 bis 8.6) in einer zu der Widerstandsstruktur verschiedenen Lage (LI bis L6) der Leiterplatte (1) angeordnet werden. characterized in that the measuring leads (8.1 to 8.6) are arranged in a position different from the resistance structure (LI to L6) of the printed circuit board (1).
10. Verfahren nach Anspruch 9, 10. The method according to claim 9,
dadurch gekennzeichnet, dass die Messleitungen (8.1 bis 8.6) mittels Durchkontaktierungen (7) mit der Widerstandsstruktur elektrisch gekoppelt werden. characterized in that the measuring lines (8.1 to 8.6) are electrically coupled by means of plated-through holes (7) with the resistance structure.
11. Verfahren nach Anspruch 8, 11. The method according to claim 8,
dadurch gekennzeichnet, dass die Messpunkte und die Wider¬ standsstruktur in einer gemeinsamen Lage (LI bis L6) der Leiterplatte (1) angeordnet werden. characterized in that the measuring points and the Wider ¬ stand structure in a common position (LI to L6) of the printed circuit board (1) are arranged.
PCT/EP2015/071975 2014-10-09 2015-09-24 Device and method for measuring a current in a conductor track of a printed circuit board WO2016055277A1 (en)

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