DE102005047090A1 - Electric device for conductor plate has connectors made from metal layer applied to support each with bay-type shape so that resistance material can be inserted between same - Google Patents
Electric device for conductor plate has connectors made from metal layer applied to support each with bay-type shape so that resistance material can be inserted between same Download PDFInfo
- Publication number
- DE102005047090A1 DE102005047090A1 DE200510047090 DE102005047090A DE102005047090A1 DE 102005047090 A1 DE102005047090 A1 DE 102005047090A1 DE 200510047090 DE200510047090 DE 200510047090 DE 102005047090 A DE102005047090 A DE 102005047090A DE 102005047090 A1 DE102005047090 A1 DE 102005047090A1
- Authority
- DE
- Germany
- Prior art keywords
- bay
- resistance material
- carrier
- resistance
- electrical device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
Description
Die Erfindung betrifft eine elektrische Vorrichtung mit einem Träger, vorzugsweise Leiterplatte, auf dem ein Widerstand angeordnet ist. Der Widerstand ist hierbei beispielsweise mittels Siebdruck oder einem Spritzverfahren auf den Träger aufgebracht bzw. aufgetragen. Eine derartige Vorrichtung ist aus der JP-2004327759 bekannt. Die wirksame Kontaktfläche zwischen den Kupferbahnen auf der Leiterplatte und der Widerstandspaste ist dabei im Wesentlichen in dem Bereich, in dem die Kupferkontaktflächen überdruckt bzw. beschichtet sind. Dies hat heute eine Begrenzung der Kupferdicke auf 18 Mikrometer zu Folge. In diesem Dickenbereich ist noch ein sicheres Überdrucken der Kupferkontaktflächen möglich. Nachteilig ist bei dieser bekannten Anordnung, dass diese für Automobilanwendungen in der Regel nicht geeignet ist, da Kupferdicken von mindestens 35 Mikrometer eingesetzt werden. Mit der heutigen Technik kann daher das Siebdruckverfahren für derartige Widerstände nicht angewendet werden.The The invention relates to an electrical device with a carrier, preferably Printed circuit board on which a resistor is arranged. The resistance is in this case for example by means of screen printing or a spray process on the carrier applied or applied. Such a device is off JP-2004327759 is known. The effective contact surface between the copper tracks on the circuit board and the resistor paste is essentially in the area in which the copper contact surfaces overprinted or coated. This has today a limitation of the copper thickness to 18 microns to result. In this thickness range is still a safe overprinting the copper contact surfaces possible. A disadvantage of this known arrangement that this for automotive applications usually not suitable because copper thicknesses of at least 35 micrometers can be used. Therefore, with today's technology can the screen printing process for such resistances not be applied.
Vorteile der ErfindungAdvantages of invention
Die erfindungsgemäße elektrische Vorrichtung mit einem Träger, auf dem ein Widerstand angeordnet ist, mit den Merkmalen des Hauptanspruchs hat den Vorteil, dass durch die jeweils buchtartige Form der Anschlusselemente des Widerstands Strukturen vorhanden sind, die es erstens ermöglichen zwischen diesen buchtartigen Anschlusselementen einen formlos eingebrachten Widerstand bzw. ein formlos eingebautes Widerstandsmaterial anzuordnen und gleichzeitig ein sehr guter Verbund des Widerstandsmaterials zu der Metallauflage an den Kanten gewährleistet werden kann.The electrical according to the invention Device with a carrier, on which a resistor is arranged, having the features of the main claim the advantage that by the respective bay-like shape of the connection elements of the resistance structures are present, which allow it firstly between these bay-like connection elements introduced an informal To arrange resistance or a formless built-resistance material and at the same time a very good composite of the resistance material can be ensured to the metal support at the edges.
Durch die in den Unteransprüchen aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen der elektrischen Vorrichtung nach dem Hauptanspruch möglich. So ist vorgesehen, dass zumindest ein Anschlusselement in seiner Bucht mindestens einen Steg aufweist, der zwischen Schenkeln der Anschlusselemente in das Widerstandsmaterial hineinragt. Eine derartige kammartige Struktur hat den Vorteil, dass der Oberflächenbereich, bei dem die Anbindung des Widerstandsmaterials an die Metallauflage erfolgt, weiter deutlich vergrößert ist. Durch derartige kammartige Strukturen ist darüber hinaus das Aufbringen erhöhter Schichtdicken vereinfacht, dadurch die vergrößerte Oberflächenspannung die Neigung des Widerstandsmaterials vor seiner Aushärtung wegzufließen deutlich verringert ist. Es können somit durch diese Maßnahme im Querschnitt effektiv vergrößerte Widerstände aufgetragen werden.By in the subclaims listed activities are advantageous developments of the electrical device according to the main claim possible. Thus, it is provided that at least one connecting element in his Bay has at least one bridge between the thighs of the Terminal elements protrudes into the resistance material. Such comb-like structure has the advantage that the surface area, in which the connection of the resistance material to the metal support, is further increased significantly. By such comb-like structures, moreover, the application of increased layer thicknesses simplifies, thereby the increased surface tension the tendency of the resistance material to flow away before it cures is reduced. It can thus by this measure in cross section effectively increased resistances applied become.
Es ist des weiteren vorgesehen, dass eine zum Widerstandsmaterial gerichtete Flanke der Bucht eine Ätzflanke ist. Dies hat den Vorteil, dass bei hohen Dicken der Metallauflage und damit der Bucht diese sich topologisch und geometrisch vorteilhaft auf die mechanische Kontaktierung des Widerstandsmaterials mit der Metallauflage bzw. der Bucht auswirkt. Der mechanische Verbund zwischen Widerstandsmaterial und Bucht ist verbessert. Die Gefahr, dass ein derartiges Widerstandsmaterial aufgrund von mechanischen Spannungen und Verformungen in diesem Bereich herausbricht, ist deutlich verringert.It is further provided that a directed to the resistance material Flank of the bay a Ätzflanke is. This has the advantage that at high thicknesses of the metal support and thus the bay this topologically and geometrically advantageous on the mechanical contacting of the resistance material with the Metal support or the bay affects. The mechanical bond between Resistance material and bay is improved. The danger of that such resistance material due to mechanical stresses and breaking out deformations in this area is significantly reduced.
Gemäß einem nebengeordneten Anspruch ist ein Verfahren zur Herstellung einer elektrischen Vorrichtung mit einem Träger vorgesehen, wobei Anschlusselemente für einen Widerstand jeweils buchtartig strukturiert werden und dass ein Widerstandsmaterial zwischen die Anschlusselemente formlos, vorzugsweise mittels Siebdruck oder Spritzverfahren aufgebracht wird. Des weiteren ist vorgesehen, dass in einer Bucht zumindest ein Steg herausgebildet wird; dies verbessert die mechanische Anbindung des Widerstandsmaterial an die Anschlusselemente. Gemäß einem weiteren Unteranspruch ist vorgesehen, dass die dabei entstehenden buchtartigen Formen der Anschlusselemente des Widerstands eine so genannte Ätzflanke aufweisen, die im Übergang zur Trägeroberfläche ausgerundet ist und dabei eine Kavität bilden. Durch diese Maßnahme wird die Zuverlässigkeit der Verbindung verbessert, da die Kerbwirkung verringert ist.According to one sibling claim is a method for producing a electrical device provided with a carrier, wherein connection elements for one Resistor each be structured like a book and that a resistance material between the connection elements informal, preferably by screen printing or spraying method is applied. Furthermore, it is intended that in a bay at least one bridge is formed; this improves the mechanical connection of the resistance material the connection elements. According to one further subclaim is provided that the resulting bay-like shapes of the connection elements of the resistor so a called Ätzflanke that are in transition to the Carrier surface rounded is and there is a cavity form. By this measure becomes the reliability improves the connection, since the notch effect is reduced.
Bei einem weiteren Verfahrensschritt ist vorgesehen, dass das Widerstandsmaterial zwischen die Anschlusselemente für den Widerstand aufgebracht wird. Eine Kontaktierung der Widerstandspaste an überdruckbaren Bereichen der Metallauflage ist nicht erforderlich, da die ausreichend hohe Schichtdicke der Anschlusselemente eine Kontaktierung zur Widerstandspaste an den Kanten bzw. Flanken vollauf ermöglicht. Es ist vorgesehen, dass die Konturen der Anschlusselemente in Projektionsrichtung zum Träger für unterschiedliche Widerstandsbeträge gleich sind. Dies ermöglicht die Verwendung von immer gleichen Düsen bzw. Widerstandsaufbringungsgeometrien, wobei der Widerstand dann lediglich über die aufgebrachte Menge an Widerstandsmaterial eingestellt wird. Es ist somit die Anzahl von verschiedenen Werkzeugen verringert.at a further method step is provided that the resistance material between the connection elements for the resistance is applied. A contacting of the resistor paste on overprintable Areas of metal support is not required as that is sufficient high layer thickness of the connecting elements make contact with the resistor paste at the edges or flanks fully possible. It is intended that the contours of the connecting elements in the projection direction to the carrier for different Resistance amounts equal are. this makes possible the use of always identical nozzles or resistance application geometries, the resistance then only over the amount applied is set to resistance material. It is thus the number reduced by different tools.
Zeichnungendrawings
In den Zeichnungen sind zwei Ausführungsbeispiele einer erfindungsgemäßen elektrischen Vorrichtung dargestellt. Es zeigen:In The drawings are two embodiments an electrical according to the invention Device shown. Show it:
Beschreibungdescription
In
Zur
Herstellung des Ausführungsbeispiels aus
Die
Anschlusselemente
In
In
dem Verfahrensschritt, in dem die Anschlusselemente
Schließlich werden
in einem weiteren Verfahrenschritt die Zwischenräume zwischen zwei Anschlusselementen
Gemäß einer
weiteren Ausgestaltung der Erfindung ist vorgesehen, dass für unterschiedliche
Widerstandsgrößen die
Anschlusselemente
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510047090 DE102005047090A1 (en) | 2005-09-30 | 2005-09-30 | Electric device for conductor plate has connectors made from metal layer applied to support each with bay-type shape so that resistance material can be inserted between same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510047090 DE102005047090A1 (en) | 2005-09-30 | 2005-09-30 | Electric device for conductor plate has connectors made from metal layer applied to support each with bay-type shape so that resistance material can be inserted between same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102005047090A1 true DE102005047090A1 (en) | 2007-04-05 |
Family
ID=37852710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200510047090 Withdrawn DE102005047090A1 (en) | 2005-09-30 | 2005-09-30 | Electric device for conductor plate has connectors made from metal layer applied to support each with bay-type shape so that resistance material can be inserted between same |
Country Status (1)
Country | Link |
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DE (1) | DE102005047090A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014220480A1 (en) * | 2014-10-09 | 2016-04-14 | Conti Temic Microelectronic Gmbh | Device and method for current measurement in a printed conductor of a printed circuit board |
DE102017121726A1 (en) * | 2017-09-19 | 2019-03-21 | FELA GmbH | Printed circuit board with solder stop layer and method for at least partially coating a printed circuit board with a solder stop layer |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6713399B1 (en) * | 2002-12-23 | 2004-03-30 | Uni-Circuit Inc. | Carbon-conductive ink resistor printed circuit board and its fabrication method |
JP2004327759A (en) * | 2003-04-25 | 2004-11-18 | Toppan Printing Co Ltd | Method of forming resistor |
US20050175385A1 (en) * | 2003-11-05 | 2005-08-11 | Samsung Electro-Mechanics Co., Ltd. | Method of producing printed circuit board with embedded resistor |
-
2005
- 2005-09-30 DE DE200510047090 patent/DE102005047090A1/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6713399B1 (en) * | 2002-12-23 | 2004-03-30 | Uni-Circuit Inc. | Carbon-conductive ink resistor printed circuit board and its fabrication method |
JP2004327759A (en) * | 2003-04-25 | 2004-11-18 | Toppan Printing Co Ltd | Method of forming resistor |
US20050175385A1 (en) * | 2003-11-05 | 2005-08-11 | Samsung Electro-Mechanics Co., Ltd. | Method of producing printed circuit board with embedded resistor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014220480A1 (en) * | 2014-10-09 | 2016-04-14 | Conti Temic Microelectronic Gmbh | Device and method for current measurement in a printed conductor of a printed circuit board |
DE102017121726A1 (en) * | 2017-09-19 | 2019-03-21 | FELA GmbH | Printed circuit board with solder stop layer and method for at least partially coating a printed circuit board with a solder stop layer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
R005 | Application deemed withdrawn due to failure to request examination |
Effective date: 20121002 |