WO2016052292A1 - Silver metal, method for producing silver metal, and laminate - Google Patents
Silver metal, method for producing silver metal, and laminate Download PDFInfo
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- WO2016052292A1 WO2016052292A1 PCT/JP2015/076895 JP2015076895W WO2016052292A1 WO 2016052292 A1 WO2016052292 A1 WO 2016052292A1 JP 2015076895 W JP2015076895 W JP 2015076895W WO 2016052292 A1 WO2016052292 A1 WO 2016052292A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Definitions
- the present invention relates to metallic silver, a method for producing the same, and a laminate including a layer made of the metallic silver on a substrate.
- a laminate in which a patterned silver layer is provided on a base material is used to configure wiring, electrodes, antennas and the like in electronic devices such as communication devices.
- the silver layer is formed, for example, by a method of preparing a silver ink composition containing metallic silver or a material for forming the silver, depositing the composition on a substrate, and heating (baking) the deposited composition. Is done. In recent years, since it is easy to form a silver layer having good characteristics, a technique for forming metallic silver using a silver ink composition containing a metallic silver forming material instead of metallic silver itself has become widely used. It is coming.
- Such a silver ink composition includes a metal complex compound obtained by reacting one or more metals or metal compounds with one or more specific ammonium carbamate or ammonium carbonate compounds, and additives.
- a conductive ink composition in which the metal is silver is disclosed (see Patent Document 1).
- the silver ink composition disclosed in Patent Document 1 has a heating (firing) temperature required for forming metallic silver having sufficient conductivity of 130 ° C. or higher, and the substrate used has a certain degree of heat resistance. There is a problem that the material of the base material is limited.
- the present invention provides a metallic silver which can be obtained by a heat treatment at a lower temperature and has sufficient conductivity, a method for producing the same, and a laminate comprising a layer made of the metallic silver on a substrate. This is the issue.
- the present invention provides metallic silver having a crystallite diameter of 15 nm or more and a volume resistivity of 8 ⁇ ⁇ cm or less.
- the metal silver of the present invention may have a crystallite diameter of 16.5 nm or more and 80 nm or less.
- the metallic silver of the present invention may be formed using silver ⁇ -ketocarboxylate represented by the following general formula (1).
- R represents an aliphatic hydrocarbon group having 1 to 20 carbon atoms in which one or more hydrogen atoms may be substituted with a substituent, a phenyl group, a hydroxyl group, an amino group, or a group represented by the general formula “R 1 -CY 1 2- ",” CY 1 3- “,” R 1 -CHY 1- ",” R 2 O- “,” R 5 R 4 N- “,” (R 3 O) 2 CY 1- "or” R 6 —C ( ⁇ O) —CY 1 2 — ”;
- Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom;
- R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group;
- R 2 is an aliphatic having 1 to 20 carbon atoms
- R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms;
- R 4 and R 5 are each independently an alipha
- the present invention uses silver ⁇ -ketocarboxylate represented by the following general formula (1) to form metallic silver having a crystallite diameter of 15 nm or more and a volume resistivity of 8 ⁇ ⁇ cm or less.
- the manufacturing method of metallic silver which has the process to perform is provided.
- R represents an aliphatic hydrocarbon group having 1 to 20 carbon atoms in which one or more hydrogen atoms may be substituted with a substituent, a phenyl group, a hydroxyl group, an amino group, or a group represented by the general formula “R 1 -CY 1 2- ",” CY 1 3- “,” R 1 -CHY 1- ",” R 2 O- “,” R 5 R 4 N- “,” (R 3 O) 2 CY 1- "or” R 6 —C ( ⁇ O) —CY 1 2 — ”;
- Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom;
- R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group;
- R 2 is an aliphatic having 1 to 20 carbon atoms
- R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms;
- R 4 and R 5 are each independently an alipha
- the silver ink composition containing the ⁇ -ketocarboxylate is heat-treated under non-humidified conditions, and further humidified conditions.
- the metallic silver may be formed by heat treatment under or in contact with a heated liquid.
- this invention provides the laminated body provided with the layer which consists of the said metal silver on a base material.
- the base material may have a thickness of 0.5 to 5000 ⁇ m, and the metal silver layer may have a thickness of 0.01 to 5 ⁇ m.
- the base material may have a deflection temperature under load of 120 ° C. or less when the deflection amount is 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648. Good.
- the metallic silver of the present invention can be obtained by heat treatment at a lower temperature, has sufficient conductivity, and can constitute a laminate comprising a layer made of the metallic silver on a substrate.
- the metallic silver of the present invention has a crystallite diameter of 15 nm or more and a volume resistivity of 8 ⁇ ⁇ cm or less. Even if the metallic silver is formed by performing a post-treatment such as a drying treatment or a heating (firing) treatment at a temperature as low as less than 130 ° C., the crystallite diameter is 15 nm or more. By being constituted, the volume resistivity is 8 ⁇ ⁇ cm or less, and the conductivity is sufficiently high.
- the crystallite diameter of metallic silver is determined by a known method.
- the X-ray diffraction measurement can be performed using, for example, a thin film X-ray diffraction apparatus.
- the crystallite diameter of the metallic silver is 15 nm or more, preferably 15.5 nm or more, more preferably 16 nm or more, and particularly preferably 16.5 nm or more.
- the upper limit of the crystallite diameter of the metallic silver is not particularly limited, but is preferably 80 nm because the degree of increase in the effect of the present invention obtained is limited with respect to the increase in crystallite diameter. , 70 nm is more preferable. For example, it may be 40 nm, but is not limited thereto.
- the volume resistivity of the metallic silver is 8 ⁇ ⁇ cm or less, and can be any of 7.6 ⁇ ⁇ cm or less, 7.3 ⁇ ⁇ cm or less, 7 ⁇ ⁇ cm or less, and the like.
- the volume resistivity of the metallic silver is preferably as low as possible, and the lower limit is not particularly limited, but can be, for example, either 1.59 ⁇ ⁇ cm or 2.5 ⁇ ⁇ cm.
- the volume resistivity of the metal silver usually tends to decrease as the crystallite diameter of the metal silver increases.
- the metallic silver is prepared by preparing a composition (silver ink composition) for forming the metallic silver and adhering it to a desired location such as a base material to be described later, followed by solidification treatment such as drying treatment or heating (firing) treatment. It can manufacture by selecting suitably and performing.
- the heat treatment may be performed also as a drying treatment.
- ⁇ Silver ink composition> it is preferable to use a silver ink composition containing a metallic silver forming material as the silver ink composition.
- the metallic silver forming material to be blended may be only one kind or two or more kinds, and in the case of two or more kinds, the combination and ratio can be arbitrarily adjusted.
- the metal silver forming material may be any material that has silver atoms (elements) and generates metallic silver by structural change such as decomposition, and is a silver salt, a silver complex, an organic silver compound (a compound having a silver-carbon bond) ) Etc. can be illustrated.
- the silver salt and the silver complex may be either a silver compound having an organic group or a silver compound having no organic group.
- the metal silver forming material is preferably a silver salt.
- the upper limit of the ratio of metallic silver is, for example, 100% by mass, 99.9% by mass, 99.8% by mass, 99.7% by mass, 99.6% by mass, 99.5% by mass, 99.4% by mass. , 99.3% by mass, 99.2% by mass, and 99.1% by mass, but is not limited thereto.
- the silver ink composition a liquid one is preferable, and one in which a metal silver forming material is dissolved or uniformly dispersed is preferable.
- silver carboxylate examples of the material for forming metallic silver include silver carboxylate having a group represented by the formula “—COOAg”, and such silver carboxylate is suitable for forming metallic silver having a crystallite diameter of 15 nm or more. It is a thing.
- silver carboxylate may be used individually by 1 type, and may use 2 or more types together. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
- the silver carboxylate is not particularly limited as long as it has a group represented by the formula “—COOAg”.
- the number of groups represented by the formula “—COOAg” may be one, or two or more.
- the position of the group represented by the formula “—COOAg” in the silver carboxylate is not particularly limited.
- the silver carboxylate is represented by the following general formula (1) ⁇ -ketocarboxylate silver (hereinafter sometimes abbreviated as “ ⁇ -ketocarboxylate (1)”) and the following general formula (4). It is preferably one or more selected from the group consisting of silver carboxylates (hereinafter sometimes abbreviated as “silver carboxylate (4)").
- ⁇ -ketocarboxylate (1) ⁇ -ketocarboxylate
- (4) silver carboxylate (4)
- the simple description of “silver carboxylate” is not limited to “silver ⁇ -ketocarboxylate (1)” and “silver carboxylate (4)”, unless otherwise specified. It is intended to mean “silver carboxylate having a group represented by the formula“ —COOAg ””.
- R represents an aliphatic hydrocarbon group having 1 to 20 carbon atoms in which one or more hydrogen atoms may be substituted with a substituent, a phenyl group, a hydroxyl group, an amino group, or a group represented by the general formula “R 1 -CY 1 2- ",” CY 1 3- “,” R 1 -CHY 1- ",” R 2 O- “,” R 5 R 4 N- “,” (R 3 O) 2 CY 1- "or” R 6 —C ( ⁇ O) —CY 1 2 — ”;
- Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom;
- R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group;
- R 2 is an aliphatic having 1 to 20 carbon atoms
- R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms;
- R 4 and R 5 are each independently an alipha
- R 8 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms, a carboxy group, or a group represented by the formula “—C ( ⁇ O) —OAg”, wherein the aliphatic hydrocarbon group is a methylene group. And one or more of the methylene groups may be substituted with a carbonyl group.
- the ⁇ -ketocarboxylate (1) is more suitable for forming metallic silver represented by the general formula (1) and having a crystallite diameter of 15 nm or more.
- R is an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a phenyl group, a hydroxyl group, an amino group, or a group represented by the general formula “R 1 -CY 1 ” in which one or more hydrogen atoms may be substituted with a substituent. 2- “,” CY 1 3- “,” R 1 -CHY 1- ",” R 2 O- “,” R 5 R 4 N- “,” (R 3 O) 2 CY 1- "or” R 6 —C ( ⁇ O) —CY 1 2 — ”.
- the aliphatic hydrocarbon group having 1 to 20 carbon atoms in R may be any of linear, branched and cyclic (aliphatic cyclic group), and may be monocyclic or polycyclic when cyclic. . Further, the aliphatic hydrocarbon group may be either a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group. The aliphatic hydrocarbon group preferably has 1 to 10 carbon atoms, and more preferably 1 to 6 carbon atoms. Preferred examples of the aliphatic hydrocarbon group for R include an alkyl group, an alkenyl group, and an alkynyl group.
- Examples of the linear or branched alkyl group in R include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n -Pentyl group, isopentyl group, neopentyl group, tert-pentyl group, 1-methylbutyl group, 2-methylbutyl group, n-hexyl group, 1-methylpentyl group, 2-methylpentyl group, 3-methylpentyl group, 4- Methylpentyl group, 1,1-dimethylbutyl group, 2,2-dimethylbutyl group, 3,3-dimethylbutyl group, 2,3-dimethylbutyl group, 1-ethylbutyl group, 2-ethylbutyl group, 3-ethylbutyl group 1-ethyl-1-methylpropyl group,
- Examples of the cyclic alkyl group in R include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, norbornyl group, isobornyl group, 1-adamantyl group, 2- Examples thereof include an adamantyl group and a tricyclodecyl group.
- alkenyl group in R examples include a vinyl group (ethenyl group, —CH ⁇ CH 2 ), an allyl group (2-propenyl group, —CH 2 —CH ⁇ CH 2 ), and a 1-propenyl group (—CH ⁇ CH—CH).
- one single bond (C—C) between carbon atoms of the alkyl group in R such as ethynyl group (—C ⁇ CH), propargyl group (—CH 2 —C ⁇ CH), etc. ) Is substituted with a triple bond (C ⁇ C).
- one or more hydrogen atoms may be substituted with a substituent, and preferred examples of the substituent include a fluorine atom, a chlorine atom, and a bromine atom.
- the number and position of substituents are not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other. That is, all the substituents may be the same, all the substituents may be different, or only some of the substituents may be different.
- one or more hydrogen atoms may be substituted with a substituent.
- the substituent include a saturated or unsaturated monovalent aliphatic hydrocarbon group having 1 to 16 carbon atoms.
- a monovalent group formed by bonding the aliphatic hydrocarbon group to an oxygen atom, a fluorine atom, a chlorine atom, a bromine atom, a hydroxyl group (—OH), a cyano group (—C ⁇ N), a phenoxy group (—O—), C 6 H 5 ) and the like can be exemplified, and the number and position of substituents are not particularly limited.
- the plural substituents may be the same as or different from each other.
- Examples of the aliphatic hydrocarbon group that is a substituent include the same aliphatic hydrocarbon groups as those described above for R except that the number of carbon atoms is 1 to 16.
- Y 1 in R is independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom.
- a plurality of Y 1 may be the same as each other. May be different.
- R 1 in R is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group (C 6 H 5 —), and the aliphatic hydrocarbon group in R 1 has 1 to 19 carbon atoms. Except for this point, the same aliphatic hydrocarbon groups as those in R can be exemplified.
- R 2 in R is an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and examples thereof are the same as the aliphatic hydrocarbon group in R.
- R 3 in R is an aliphatic hydrocarbon group having 1 to 16 carbon atoms, and examples thereof are the same as the aliphatic hydrocarbon group in R except that the carbon number is 1 to 16.
- R 4 and R 5 in R are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms. That is, R 4 and R 5 may be the same as or different from each other, and examples thereof are the same as the aliphatic hydrocarbon group for R except that the number of carbon atoms is 1 to 18.
- R 6 in R is an aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”. The aliphatic hydrocarbon group in R 6 has 1 to Except for being 19, the same aliphatic hydrocarbon groups as those described above for R can be exemplified.
- R is a linear or branched alkyl group, a group represented by the general formula “R 6 —C ( ⁇ O) —CY 1 2 —”, a hydroxyl group, or a phenyl group.
- R 6 is preferably a linear or branched alkyl group, a hydroxyl group, or a group represented by the formula “AgO—”.
- each X 1 independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group in which one or more hydrogen atoms may be substituted with a substituent, or A benzyl group (C 6 H 5 —CH 2 —), a cyano group, an N-phthaloyl-3-aminopropyl group, a 2-ethoxyvinyl group (C 2 H 5 —O—CH ⁇ CH—), or the general formula “R 7 O— ”,“ R 7 S— ”,“ R 7 —C ( ⁇ O) — ”or“ R 7 —C ( ⁇ O) —O— ”.
- Examples of the aliphatic hydrocarbon group having 1 to 20 carbon atoms in X 1 include those similar to the aliphatic hydrocarbon group in R.
- Examples of the halogen atom in X 1 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the substituent include a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, an iodine atom), A nitro group (—NO 2 ) and the like can be exemplified, and the number and position of substituents are not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other.
- R 7 in X 1 represents an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group (C 4 H 3 S—), a phenyl group in which one or more hydrogen atoms may be substituted with a substituent, or A diphenyl group (biphenyl group, C 6 H 5 —C 6 H 4 —);
- Examples of the aliphatic hydrocarbon group for R 7 include those similar to the aliphatic hydrocarbon group for R except that the aliphatic hydrocarbon group has 1 to 10 carbon atoms.
- halogen atom fluorine atom, chlorine atom, bromine atom, iodine atom
- R 7 is a thienyl group or a diphenyl group
- the bonding position of these groups with an adjacent group or atom oxygen atom, sulfur atom, carbonyl group, carbonyloxy group
- the thienyl group may be either a 2-thienyl group or a 3-thienyl group.
- two X 1 s may be bonded as one group through a double bond with a carbon atom sandwiched between two carbonyl groups.
- Examples thereof include a group represented by the formula “ ⁇ CH—C 6 H 4 —NO 2 ”.
- X 1 is preferably a hydrogen atom, a linear or branched alkyl group, a benzyl group, or a group represented by the general formula “R 7 —C ( ⁇ O) —” among the above. It is preferable that at least one X 1 is a hydrogen atom.
- ⁇ -ketocarboxylate (1) can further reduce the concentration of the remaining raw materials and impurities in the conductor (metal silver) formed by solidification treatment such as drying treatment or heating (firing) treatment.
- solidification treatment such as drying treatment or heating (firing) treatment.
- the ⁇ -ketocarboxylate (1) is decomposed at a low temperature of preferably 60 to 210 ° C., more preferably 60 to 200 ° C. without using a reducing agent known in the art, as will be described later. It is possible to form metallic silver. And by using together with a reducing agent, it decomposes at a lower temperature to form metallic silver.
- the reducing agent will be described later.
- silver ⁇ -ketocarboxylate (1) may be used alone or in combination of two or more. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
- the silver carboxylate (4) is represented by the general formula (4) and is more suitable for forming metallic silver having a crystallite diameter of 15 nm or more.
- R 8 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms, a carboxy group (—COOH), or a group represented by the formula “—C ( ⁇ O) —OAg”.
- Examples of the aliphatic hydrocarbon group for R 8 include those similar to the aliphatic hydrocarbon group for R except that the aliphatic hydrocarbon group has 1 to 19 carbon atoms. However, the aliphatic hydrocarbon group for R 8 preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms.
- the aliphatic hydrocarbon group for R 8 has a methylene group (—CH 2 —)
- one or more of the methylene groups may be substituted with a carbonyl group.
- the number and position of the methylene groups that may be substituted with a carbonyl group are not particularly limited, and all methylene groups may be substituted with a carbonyl group.
- the “methylene group” is not only a single group represented by the formula “—CH 2 —” but also one of alkylene groups in which a plurality of groups represented by the formula “—CH 2 —” are linked. And a group represented by the formula “—CH 2 —”.
- Silver carboxylate (4) includes silver pyruvate (CH 3 —C ( ⁇ O) —C ( ⁇ O) —OAg), silver acetate (CH 3 —C ( ⁇ O) —OAg), silver butyrate (CH 3 — (CH 2 ) 2 —C ( ⁇ O) —OAg), silver isobutyrate ((CH 3 ) 2 CH—C ( ⁇ O) —OAg), silver 2-ethylhexanoate (CH 3 — (CH 2 ) 3 —CH (CH 2 CH 3 ) —C ( ⁇ O) —OAg), silver neodecanoate (CH 3 — (CH 2 ) 5 —C (CH 3 ) 2 —C ( ⁇ O) —OAg), Shu It is preferably silver oxide (AgO—C ( ⁇ O) —C ( ⁇ O) —OAg) or silver malonate (AgO—C ( ⁇ O) —CH 2 —C ( ⁇ O) —OAg).
- silver oxalate (AgO—C ( ⁇ O) —C ( ⁇ O) —OAg) and silver malonate (AgO—C ( ⁇ O) —CH 2 —C ( ⁇ O) —OAg)
- silver oxalate (AgO—C ( ⁇ O) —C ( ⁇ O) —OAg)
- silver malonate (AgO—C ( ⁇ O) —CH 2 —C ( ⁇ O) —OAg)
- —COOAg one of the groups represented by the formula “—COOH” (HO—C ( ⁇ O) —C ( ⁇ O) —OAg, HO)
- —C ( ⁇ O) —CH 2 —C ( ⁇ O) —OAg is —COOH
- silver carboxylate (4) is also used in the conductor (metal silver) formed by solidification treatment such as drying treatment or heating (firing) treatment.
- concentration can be further reduced.
- a reducing agent it decomposes at a lower temperature to form metallic silver.
- the silver carboxylate (4) may be used alone or in combination of two or more. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
- the silver carboxylate is silver 2-methylacetoacetate, silver acetoacetate, silver 2-ethylacetoacetate, silver propionylacetate, silver isobutyrylacetate, silver pivaloylacetate, silver caproylacetate, silver 2-n-butylacetoacetate, 2-benzylacetoacetate Silver acetate, silver benzoyl acetate, silver pivaloyl acetoacetate, silver isobutyryl acetoacetate, silver acetone dicarboxylate, silver pyruvate, silver acetate, silver butyrate, silver isobutyrate, silver 2-ethylhexanoate, silver neodecanoate, silver It is preferably at least one selected from the group consisting of silver oxide and silver malonate.
- silver 2-methylacetoacetate and silver acetoacetate are excellent in compatibility with a nitrogen-containing compound (particularly an amine compound) described later, and are particularly suitable for increasing the concentration of silver ink compositions. It is mentioned as a thing.
- the content of silver derived from the metal silver forming material is preferably 5% by mass or more, and more preferably 10% by mass or more. By being in such a range, the formed conductor (metal silver) becomes superior in quality.
- the upper limit of the silver content is not particularly limited as long as the effects of the present invention are not impaired, but it is preferably 25% by mass in consideration of handling properties and the like.
- silver derived from a metallic silver forming material means silver in the metallic silver forming material blended during the production of the silver ink composition, unless otherwise specified. It is a concept that includes both silver constituting the metal silver forming material after blending, and silver and silver itself in the decomposition product generated by decomposition of the metal silver forming material after blending.
- the silver ink composition is preferably one in which a nitrogen-containing compound is further blended in addition to the metal silver forming material, particularly when the metal silver forming material is the silver carboxylate.
- the nitrogen-containing compound is preferably used in order to form metallic silver having a crystallite diameter of 15 nm or more.
- the nitrogen-containing compound is an amine compound having 25 or less carbon atoms (hereinafter sometimes abbreviated as “amine compound”), a quaternary ammonium salt having 25 or less carbon atoms (hereinafter abbreviated as “quaternary ammonium salt”).
- Ammonia an ammonium salt formed by reacting an amine compound having 25 or less carbon atoms with an acid (hereinafter sometimes abbreviated as “ammonium salt derived from an amine compound”), and ammonia reacting with an acid.
- ammonium salt derived from an amine compound an acid
- ammonium salts derived from ammonia One or more selected from the group consisting of ammonium salts (hereinafter sometimes abbreviated as “ammonium salts derived from ammonia”). That is, the nitrogen-containing compound to be blended may be only one kind, or two or more kinds. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
- the amine compound has 1 to 25 carbon atoms, and may be any of primary amine, secondary amine, and tertiary amine.
- the quaternary ammonium salt has 4 to 25 carbon atoms.
- the amine compound and the quaternary ammonium salt may be either chain or cyclic. Further, the number of nitrogen atoms constituting the amine moiety or ammonium salt moiety (for example, the nitrogen atom constituting the amino group (—NH 2 ) of the primary amine) may be one, or two or more.
- Examples of the primary amine include monoalkylamines, monoarylamines, mono (heteroaryl) amines, and diamines in which one or more hydrogen atoms may be substituted with a substituent.
- the alkyl group constituting the monoalkylamine may be linear, branched or cyclic, and examples thereof are the same as the alkyl group in R, and are linear or branched having 1 to 19 carbon atoms. It is preferably a chain alkyl group or a cyclic alkyl group having 3 to 7 carbon atoms.
- Preferred examples of the monoalkylamine include n-butylamine, n-hexylamine, n-octylamine, n-dodecylamine, n-octadecylamine, sec-butylamine, tert-butylamine, 3-aminopentane, 3 Examples include -methylbutylamine, 2-heptylamine (2-aminoheptane), 2-aminooctane, 2-ethylhexylamine, and 1,2-dimethyl-n-propylamine.
- aryl group constituting the monoarylamine examples include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, and the like, and preferably has 6 to 10 carbon atoms.
- the heteroaryl group constituting the mono (heteroaryl) amine has a heteroatom as an atom constituting the aromatic ring skeleton, and the heteroatom includes a nitrogen atom, a sulfur atom, an oxygen atom, and a boron atom. Can be illustrated.
- the number of the said hetero atom which comprises an aromatic ring skeleton is not specifically limited, One may be sufficient and two or more may be sufficient. When there are two or more, these heteroatoms may be the same or different from each other. That is, these heteroatoms may all be the same, may all be different, or may be partially different.
- the heteroaryl group may be either monocyclic or polycyclic, and the number of ring members (the number of atoms constituting the ring skeleton) is not particularly limited, but is preferably a 3- to 12-membered ring.
- Examples of the monoaryl group having 1 to 4 nitrogen atoms as the heteroaryl group include pyrrolyl group, pyrrolinyl group, imidazolyl group, pyrazolyl group, pyridyl group, pyrimidyl group, pyrazinyl group, pyridazinyl group, triazolyl group, tetrazolyl group A pyrrolidinyl group, an imidazolidinyl group, a piperidinyl group, a pyrazolidinyl group, and a piperazinyl group, which are preferably 3- to 8-membered rings, and more preferably 5- to 6-membered rings.
- Examples of the monoaryl group having one oxygen atom as the heteroaryl group include a furanyl group, preferably a 3- to 8-membered ring, and more preferably a 5- to 6-membered ring.
- Examples of the monoaryl group having one sulfur atom as the heteroaryl group include a thienyl group, preferably a 3- to 8-membered ring, and more preferably a 5- to 6-membered ring.
- Examples of the monoaryl group having 1 to 2 oxygen atoms and 1 to 3 nitrogen atoms as the heteroaryl group include an oxazolyl group, an isoxazolyl group, an oxadiazolyl group, and a morpholinyl group.
- it is a 5- to 6-membered ring.
- the monoaryl group having 1 to 2 sulfur atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a thiazolyl group, a thiadiazolyl group, and a thiazolidinyl group, and is a 3- to 8-membered ring.
- a 5- to 6-membered ring is preferable.
- Examples of the polyaryl having 1 to 5 nitrogen atoms as the heteroaryl group include indolyl group, isoindolyl group, indolizinyl group, benzimidazolyl group, quinolyl group, isoquinolyl group, indazolyl group, benzotriazolyl group, tetra Examples thereof include a zolopyridyl group, a tetrazolopyridazinyl group, and a dihydrotriazolopyridazinyl group, preferably a 7-12 membered ring, and more preferably a 9-10 membered ring.
- Examples of the polyaryl group having 1 to 3 sulfur atoms as the heteroaryl group include a dithiaphthalenyl group and a benzothiophenyl group, preferably a 7 to 12 membered ring, preferably a 9 to 10 membered ring. More preferably, it is a ring.
- Examples of the polyaryl group having 1 to 2 oxygen atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a benzoxazolyl group and a benzooxadiazolyl group. Preferably, it is a 9 to 10 membered ring.
- Examples of the polyaryl group having 1 to 2 sulfur atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a benzothiazolyl group and a benzothiadiazolyl group, and is a 7 to 12 membered ring. Preferably, it is a 9 to 10 membered ring.
- the diamine only needs to have two amino groups, and the positional relationship between the two amino groups is not particularly limited.
- the preferred diamine in the monoalkylamine, monoarylamine or mono (heteroaryl) amine, one hydrogen atom other than the hydrogen atom constituting the amino group (—NH 2 ) is substituted with an amino group.
- the diamine preferably has 1 to 10 carbon atoms, and more preferable examples include ethylenediamine, 1,3-diaminopropane, and 1,4-diaminobutane.
- secondary amine examples include dialkylamine, diarylamine, di (heteroaryl) amine and the like in which one or more hydrogen atoms may be substituted with a substituent.
- the alkyl group constituting the dialkylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 9 carbon atoms, or having 3 to 7 carbon atoms.
- a cyclic alkyl group is preferred.
- Two alkyl groups in one molecule of dialkylamine may be the same as or different from each other.
- Specific examples of preferable dialkylamines include N-methyl-n-hexylamine, diisobutylamine, and di (2-ethylhexyl) amine.
- the aryl group constituting the diarylamine is the same as the aryl group constituting the monoarylamine, and preferably has 6 to 10 carbon atoms. Two aryl groups in one molecule of diarylamine may be the same as or different from each other.
- the heteroaryl group constituting the di (heteroaryl) amine is the same as the heteroaryl group constituting the mono (heteroaryl) amine, and is preferably a 6-12 membered ring.
- Two heteroaryl groups in one molecule of di (heteroaryl) amine may be the same or different from each other.
- tertiary amine examples include trialkylamine and dialkylmonoarylamine in which one or more hydrogen atoms may be substituted with a substituent.
- the alkyl group constituting the trialkylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 19 carbon atoms, or 3 to 7 carbon atoms.
- the cyclic alkyl group is preferably.
- the three alkyl groups in one molecule of trialkylamine may be the same as or different from each other. That is, all three alkyl groups may be the same, all may be different, or only a part may be different.
- Preferable examples of the trialkylamine include N, N-dimethyl-n-octadecylamine and N, N-dimethylcyclohexylamine.
- the alkyl group constituting the dialkyl monoarylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 6 carbon atoms, or 3 to 3 carbon atoms. 7 is a cyclic alkyl group. Two alkyl groups in one molecule of dialkyl monoarylamine may be the same or different from each other.
- the aryl group constituting the dialkyl monoarylamine is the same as the aryl group constituting the monoarylamine, and preferably has 6 to 10 carbon atoms.
- examples of the quaternary ammonium salt include halogenated tetraalkylammonium, in which one or more hydrogen atoms may be substituted with a substituent.
- the alkyl group constituting the halogenated tetraalkylammonium is the same as the alkyl group constituting the monoalkylamine, and preferably has 1 to 19 carbon atoms.
- the four alkyl groups in one molecule of the tetraalkylammonium halide may be the same as or different from each other. That is, all four alkyl groups may be the same, all may be different, or only a part may be different.
- halogen constituting the halogenated tetraalkylammonium examples include fluorine, chlorine, bromine and iodine.
- Specific examples of the preferred tetraalkylammonium halide include dodecyltrimethylammonium bromide.
- the chain amine compound and the quaternary organic ammonium salt have been mainly described.
- the nitrogen atom constituting the amine moiety or the ammonium salt moiety is a ring skeleton structure ( A heterocyclic compound which is a part of a heterocyclic skeleton structure) may be used. That is, the amine compound may be a cyclic amine, and the quaternary ammonium salt may be a cyclic ammonium salt.
- the ring (ring containing the nitrogen atom constituting the amine moiety or ammonium salt moiety) structure may be either monocyclic or polycyclic, and the number of ring members (number of atoms constituting the ring skeleton) is also particularly limited. Any of an aliphatic ring and an aromatic ring may be sufficient. If it is a cyclic amine, a pyridine can be illustrated as a preferable thing.
- the “hydrogen atom optionally substituted with a substituent” means a nitrogen atom constituting an amine moiety or an ammonium salt moiety.
- the number of substituents at this time is not particularly limited, and may be one or two or more, and all of the hydrogen atoms may be substituted with a substituent.
- the plural substituents may be the same as or different from each other. That is, the plurality of substituents may all be the same, may all be different, or only some may be different. Further, the position of the substituent is not particularly limited.
- Examples of the substituent in the amine compound and the quaternary ammonium salt include an alkyl group, an aryl group, a halogen atom, a cyano group, a nitro group, a hydroxyl group, and a trifluoromethyl group (—CF 3 ).
- examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the alkyl group constituting the monoalkylamine has a substituent
- the alkyl group has an aryl group as a substituent, a linear or branched alkyl group having 1 to 9 carbon atoms, or a substituent
- a cyclic alkyl group having 3 to 7 carbon atoms having an alkyl group having 1 to 5 carbon atoms is preferable, and a monoalkylamine having such a substituent is specifically 2-phenylethylamine. , Benzylamine, and 2,3-dimethylcyclohexylamine.
- aryl group and the alkyl group which are substituents may further have one or more hydrogen atoms substituted with halogen atoms, and as monoalkylamines having such substituents substituted with halogen atoms, And 2-bromobenzylamine.
- the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the aryl group constituting the monoarylamine has a substituent
- the aryl group is preferably an aryl group having a halogen atom as a substituent and having 6 to 10 carbon atoms, and the monoaryl having such a substituent
- Specific examples of the amine include bromophenylamine.
- examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the alkyl group constituting the dialkylamine has a substituent
- the alkyl group is preferably a linear or branched alkyl group having 1 to 9 carbon atoms and having a hydroxyl group or an aryl group as a substituent
- Specific examples of the dialkylamine having such a substituent include diethanolamine and N-methylbenzylamine.
- the amine compound is n-propylamine, n-butylamine, n-hexylamine, n-octylamine, n-dodecylamine, n-octadecylamine, sec-butylamine, tert-butylamine, 3-aminopentane, 3-methyl.
- 2-ethylhexylamine is excellent in compatibility with the above-mentioned silver carboxylate, particularly suitable for increasing the concentration of the silver ink composition, and particularly for reducing the surface roughness of metallic silver. Listed as suitable.
- the ammonium salt derived from the amine compound is an ammonium salt obtained by reacting the amine compound with an acid
- the acid may be an inorganic acid such as hydrochloric acid, sulfuric acid or nitric acid, or an organic acid such as acetic acid.
- the type of acid is not particularly limited.
- the ammonium salt derived from the amine compound include, but are not limited to, n-propylamine hydrochloride, N-methyl-n-hexylamine hydrochloride, N, N-dimethyl-n-octadecylamine hydrochloride and the like. .
- ammonium salt derived from ammonia is an ammonium salt formed by reacting ammonia with an acid, and examples of the acid include the same ones as in the case of the ammonium salt derived from the amine compound.
- examples of the ammonium salt derived from ammonia include ammonium chloride, but are not limited thereto.
- the amine compound, the quaternary ammonium salt, the ammonium salt derived from the amine compound and the ammonium salt derived from ammonia may be used singly or in combination of two or more. .
- the combination and ratio can be adjusted arbitrarily.
- you may use individually by 1 type selected from the group which consists of said amine compound, quaternary ammonium salt, ammonium salt derived from an amine compound, and ammonium salt derived from ammonia More than one species may be used in combination.
- the combination and ratio can be adjusted arbitrarily.
- the compounding amount of the nitrogen-containing compound is preferably 0.3 to 15 mol, more preferably 0.3 to 5 mol, per mol of the metal silver forming material. preferable.
- the blending amount of the nitrogen-containing compound is within such a range, the silver ink composition is further improved in stability and the quality of the conductor (metal silver) is further improved. Furthermore, the conductor can be formed more stably without performing heat treatment at a high temperature.
- the silver ink composition preferably contains a reducing agent in addition to the metal silver forming material.
- the reducing agent is preferably used to form metallic silver having a crystallite diameter of 15 nm or more.
- the silver ink composition can more easily form metallic silver.
- a conductor (metal silver) having sufficient conductivity can be formed even by heat treatment at a low temperature.
- the reducing agent is one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and a compound represented by the following general formula (5) (hereinafter sometimes abbreviated as “compound (5)”). (Hereinafter, sometimes simply abbreviated as “reducing compound”).
- compound (5) a compound represented by the following general formula (5) (hereinafter, sometimes simply abbreviated as “reducing compound”).
- the reducing compound is at least one selected from the group consisting of oxalic acid (HOOC—COOH), hydrazine (H 2 N—NH 2 ) and the compound represented by the general formula (5) (compound (5)). It is. That is, the reducing compound to be blended may be only one kind, or two or more kinds. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
- the alkyl group having 20 or less carbon atoms in R 21 has 1 to 20 carbon atoms and may be linear, branched or cyclic, and is the same as the alkyl group in R in the general formula (1) The thing can be illustrated.
- the alkoxy group having 20 or less carbon atoms in R 21 has 1 to 20 carbon atoms, and examples thereof include monovalent groups in which the alkyl group in R 21 is bonded to an oxygen atom.
- the N, N-dialkylamino group having 20 or less carbon atoms in R 21 has 2 to 20 carbon atoms, and the two alkyl groups bonded to the nitrogen atom may be the same as or different from each other. Each alkyl group has 1 to 19 carbon atoms. However, the total value of the carbon number of these two alkyl groups is 2 to 20.
- the alkyl group bonded to the nitrogen atom may be linear, branched or cyclic, respectively, and the alkyl group in R of the general formula (1) except that it has 1 to 19 carbon atoms. The thing similar to group can be illustrated.
- hydrazine may be monohydrate (H 2 N—NH 2 .H 2 O).
- Preferred examples of the reducing compound include formic acid (HC ( ⁇ O) —OH); methyl formate (HC ( ⁇ O) —OCH 3 ), ethyl formate (HC ( ⁇ O) —OCH). 2 CH 3 ), formic acid esters such as butyl formate (HC ( ⁇ O) —O (CH 2 ) 3 CH 3 ); propanal (HC ( ⁇ O) —CH 2 CH 3 ), butanal (H Aldehydes such as —C ( ⁇ O) — (CH 2 ) 2 CH 3 ) and hexanal (HC ( ⁇ O) — (CH 2 ) 4 CH 3 ); formamide (HC ( ⁇ O) —NH 2 ), N, N-dimethylformamide (HC ( ⁇ O) —N (CH 3 ) 2 ) and other formamides (groups represented by the formula “HC ( ⁇ O) —N (—) —”) And oxalic acid.
- formic acid esters such as butyl formate
- the compounding amount of the reducing agent is preferably 0.04 to 3.5 mol, and preferably 0.06 to 2.5 mol per mol of the metal silver forming material. Is more preferable.
- the silver ink composition can form a conductor (metal silver) more easily and more stably.
- the silver ink composition may further contain an alcohol in addition to the metal silver forming material.
- the alcohol is preferably an acetylene alcohol represented by the following general formula (2) (hereinafter sometimes abbreviated as “acetylene alcohol (2)”).
- R ′ and R ′′ are each independently an alkyl group having 1 to 20 carbon atoms, or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.
- the acetylene alcohol (2) is represented by the general formula (2).
- R ′ and R ′′ are each independently an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.
- the alkyl group having 1 to 20 carbon atoms in R ′ and R ′′ may be linear, branched or cyclic, and when it is cyclic, it may be monocyclic or polycyclic. Examples of the alkyl group in R ′ and R ′′ include the same alkyl groups as in R.
- Examples of the substituent in which the hydrogen atom of the phenyl group in R ′ and R ′′ may be substituted include a saturated or unsaturated monovalent aliphatic hydrocarbon group having 1 to 16 carbon atoms, the aliphatic carbon Examples thereof include a monovalent group formed by bonding a hydrogen group to an oxygen atom, a fluorine atom, a chlorine atom, a bromine atom, a hydroxyl group, a cyano group, a phenoxy group, and the like, and the hydrogen atom of the phenyl group in R may be substituted. This is the same as the substituent. And the number and position of a substituent are not specifically limited, When there are two or more substituents, these several substituents may mutually be same or different.
- R ′ and R ′′ are preferably an alkyl group having 1 to 20 carbon atoms, and more preferably a linear or branched alkyl group having 1 to 10 carbon atoms.
- Examples of preferable acetylene alcohol (2) include 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-butyn-3-ol, and 3-methyl-1-pentyn-3-ol.
- the amount of acetylene alcohol (2) in the silver ink composition is preferably 0.03 to 0.7 mol per mol of the metal silver forming material. 0.05 to 0.3 mol is more preferable. When the blending amount of acetylene alcohol (2) is within such a range, the stability of the silver ink composition is further improved.
- the alcohol may be used alone or in combination of two or more. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
- the silver ink composition may contain other components other than the metallic silver forming material, nitrogen-containing compound, reducing agent, and alcohol.
- the other components in the silver ink composition can be arbitrarily selected according to the purpose, and are not particularly limited. Preferred examples include solvents other than alcohol.
- the solvent can be arbitrarily selected according to the type and amount of the compounding components.
- Preferred examples of the solvent include liquid alkanes under normal temperature and normal pressure conditions, and the alkane may be linear, branched or cyclic, and preferably has 15 or less carbon atoms, more preferably. Examples thereof include pentane, hexane, cyclohexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane and the like.
- the other components in the silver ink composition may be used alone or in combination of two or more. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
- the blending amount of the solvent may be selected according to the purpose, such as the viscosity of the silver ink composition, but is usually blended in the silver ink composition.
- the ratio of the amount of the solvent to the total amount of the components is preferably 25% by mass or less, more preferably 20% by mass or less, and particularly preferably 15% by mass or less.
- the ratio of the blending amount of the other component to the total amount of the blending component is preferably 10% by mass or less. % Or less is more preferable.
- the ratio of the blended amount of the other components with respect to the total amount of the blended components is 0 mass, that is, even if the other components are not blended, the silver ink composition exhibits its effect sufficiently.
- all the compounding components may be dissolved, or some or all of the components may be dispersed without dissolving, but it is preferable that all the compounding components are dissolved.
- the undissolved component is preferably dispersed uniformly.
- the silver ink composition is obtained by blending components other than the metallic silver forming material and the metallic silver forming material. After the blending of each component, the resulting product may be used as it is as a silver ink composition, or a product obtained by performing a known purification operation as necessary may be used as a silver ink composition.
- ⁇ -ketocarboxylate (1) when ⁇ -ketocarboxylate (1) is used as the metal silver forming material, no impurities that inhibit conductivity are generated at the time of blending each of the above components, or such Since the generation amount of impurities can be suppressed to a very small amount, a conductor (metal silver) having sufficient conductivity can be obtained even if a silver ink composition that has not been subjected to a purification operation is used.
- each component may be added and then mixed, or some components may be mixed while being added sequentially, or all components may be mixed while being added sequentially.
- blend the said reducing agent by dripping, and exists in the tendency which can further reduce the surface roughness of metal silver by suppressing the fluctuation
- the mixing method is not particularly limited, a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer, a three-roller, a kneader, a bead mill or the like; a method of mixing by adding ultrasonic waves, etc.
- the undissolved component when the undissolved component is uniformly dispersed, for example, a method of dispersing using the above-described three rolls, kneader, bead mill or the like is preferably applied.
- the temperature at the time of compounding is not particularly limited as long as each compounding component does not deteriorate, but it is preferably ⁇ 5 to 60 ° C. And the temperature at the time of mixing
- the silver ink composition may be further supplied with carbon dioxide.
- a silver ink composition has a high viscosity.
- a flexographic printing method, a screen printing method, a gravure printing method, a gravure offset printing method, a pad printing method, etc. Suitable for application.
- Carbon dioxide may be supplied at any time during the production of the silver ink composition.
- carbon dioxide is supplied to the first mixture in which the metal silver forming material and the nitrogen-containing compound are blended to form a second mixture, and if necessary, the second mixture
- a silver ink composition is produced by further blending the reducing agent with the mixture.
- blending the said alcohol or another component these can be mix
- the first mixture can be produced by the same method as the above silver ink composition except that the blending components are different.
- the first mixture may have all of the compounding components dissolved, or may be in a state of being dispersed without dissolving some of the components, but preferably all of the compounding components are dissolved and dissolved. It is preferable that the components not dispersed are uniformly dispersed.
- the compounding temperature at the time of producing the first mixture is not particularly limited as long as each compounding component does not deteriorate, but it is preferably ⁇ 5 to 30 ° C.
- the blending time may be appropriately adjusted according to the type of blending component and the temperature at the time of blending, but is preferably 0.5 to 12 hours, for example.
- Carbon dioxide (CO 2 ) supplied to the first mixture may be either gaseous or solid (dry ice), or both gaseous and solid. By supplying carbon dioxide, it is estimated that this carbon dioxide dissolves in the first mixture and acts on the components in the first mixture, thereby increasing the viscosity of the obtained second mixture.
- the carbon dioxide gas may be supplied by various known methods for blowing gas into the liquid, and a suitable supply method may be selected as appropriate. For example, a method in which one end of a pipe is immersed in the first mixture, the other end is connected to a carbon dioxide gas supply source, and the carbon dioxide gas is supplied to the first mixture through the pipe. At this time, the carbon dioxide gas may be supplied directly from the end of the pipe. For example, a plurality of voids that can serve as gas flow paths, such as a porous one, are provided to diffuse the introduced gas. A gas diffusion member that can be discharged as minute bubbles may be connected to the end of the pipe, and the carbon dioxide gas may be supplied through the gas diffusion member. Moreover, you may supply a carbon dioxide gas, stirring the 1st mixture by the method similar to the time of manufacture of a 1st mixture. By doing in this way, carbon dioxide can be supplied efficiently.
- the supply amount of carbon dioxide gas is not particularly limited, and may be appropriately adjusted according to the amount of the first mixture at the supply destination and the viscosity of the target silver ink composition or the second mixture.
- the viscosity at 20 to 25 ° C. of the silver ink composition has been described here, the temperature at the time of using the silver ink composition is not limited to 20 to 25 ° C. and can be arbitrarily selected.
- “viscosity” means a value measured using an ultrasonic vibration viscometer unless otherwise specified.
- the flow rate of carbon dioxide gas may be appropriately adjusted in consideration of the required supply amount of carbon dioxide gas, but is preferably 0.5 mL / min or more per 1 g of the first mixture, and is 1 mL / min or more. It is more preferable that The upper limit value of the flow rate is not particularly limited, but is preferably 40 mL / min per 1 g of the mixture in consideration of handling properties and the like.
- the carbon dioxide gas supply time may be appropriately adjusted in consideration of the required supply amount and flow rate of carbon dioxide gas.
- the temperature of the first mixture at the time of supplying carbon dioxide gas is preferably 5 to 70 ° C, more preferably 7 to 60 ° C, and particularly preferably 10 to 50 ° C.
- carbon dioxide can be supplied more efficiently, and when the temperature is equal to or lower than the upper limit value, a silver ink composition having better quality with fewer impurities can be obtained.
- the flow rate and supply time of carbon dioxide gas, and the temperature at the time of supplying carbon dioxide gas may be adjusted to a suitable range while considering each value. For example, even if the temperature is set lower, the carbon dioxide gas flow rate is set higher, the carbon dioxide gas supply time is set longer, or both are performed efficiently. Can supply carbon. Moreover, even if the flow rate of carbon dioxide gas is set to a small value, the carbon dioxide gas can be efficiently produced by increasing the temperature, setting the carbon dioxide gas supply time longer, or both. Can supply. That is, a silver ink of good quality can be obtained by flexibly combining the numerical values in the above numerical range exemplified as the flow rate of carbon dioxide gas and the temperature at the time of carbon dioxide gas supply while considering the supply time of carbon dioxide gas. A composition is obtained efficiently.
- the carbon dioxide gas is preferably supplied while stirring the first mixture. By doing in this way, the supplied carbon dioxide gas diffuses more uniformly in the first mixture, and carbon dioxide can be supplied more efficiently.
- the stirring method at this time may be the same as in the case of the mixing method at the time of producing the above silver ink composition not using carbon dioxide.
- the supply of dry ice may be performed by adding dry ice to the first mixture.
- the total amount of dry ice may be added all at once, or may be added stepwise (continuously across a time zone during which no addition is performed). What is necessary is just to adjust the usage-amount of dry ice in consideration of the supply amount of said carbon dioxide gas.
- the first mixture is preferably stirred.
- the first mixture is preferably stirred in the same manner as in the production of the above silver ink composition without using carbon dioxide. By doing in this way, carbon dioxide can be supplied efficiently.
- the temperature at the time of stirring may be the same as that at the time of supplying carbon dioxide gas.
- stirring time suitably according to stirring temperature.
- the viscosity of the second mixture may be appropriately adjusted according to the purpose, such as a method for handling the silver ink composition or the second mixture, and is not particularly limited.
- the viscosity of the second mixture at 20 to 25 ° C. is 3 Pa ⁇ s or more. It is preferable.
- the viscosity of the second mixture at 20 to 25 ° C. has been described, but the temperature at the time of use of the second mixture is not limited to 20 to 25 ° C. and can be arbitrarily selected.
- the second mixture may be further blended with one or more selected from the group consisting of the reducing agent, alcohol and other components to form a silver ink composition.
- the silver ink composition at this time can be produced by the same method as the above silver ink composition not using carbon dioxide except that the blending components are different.
- the obtained silver ink composition may have all of the compounding components dissolved therein or may be in a state where some of the components are dispersed without dissolving, but all of the compounding components are dissolved.
- the undissolved component is preferably dispersed uniformly.
- the temperature at the time of blending the reducing agent is not particularly limited as long as each blended component does not deteriorate, but is preferably ⁇ 5 to 60 ° C. And the temperature at the time of mixing
- the blending time may be appropriately adjusted according to the type of blending component and the temperature at the time of blending, but is preferably 0.5 to 12 hours, for example.
- the other components may be blended during the production of either the first mixture or the second mixture, or may be blended during the production of both. That is, in the process of producing the silver ink composition through the first mixture and the second mixture, the ratio of the blended amount of the other components to the total amount of blended components other than carbon dioxide ([other components (mass)] / [Formation material of metallic silver, nitrogen-containing compound, reducing agent, alcohol, and other components (mass)] ⁇ 100) is 25% by mass or less when the other components are solvents other than alcohol. Is more preferable, it is more preferable that it is 20 mass% or less, and it is especially preferable that it is 15 mass% or less.
- the ratio of the said compounding quantity is 10 mass% or less, and it is more preferable that it is 5 mass% or less. And even if the ratio of the said compounding quantity is 0 mass, ie, it does not mix
- the silver ink composition to which carbon dioxide is supplied is, for example, a viscosity at 20 to 25 ° C. when the silver ink composition is applied to a printing method using a high viscosity ink such as a screen printing method or a flexographic printing method. Is preferably 1 Pa ⁇ s or more.
- the resulting blend (silver ink composition) tends to generate heat relatively easily.
- blending of a reducing agent is high, since this compounding will be in the state similar to the time of the heat processing of the silver ink composition mentioned later, by the decomposition
- action of the said metal silver formation material by a reducing agent It is presumed that the formation of metal silver may be started in at least a part of the metal silver forming material.
- a silver ink composition containing such metallic silver may be able to form a conductor by performing post-treatment under milder conditions than the silver ink composition not containing metallic silver at the time of forming the conductor.
- the conductor may be formed by performing the post-treatment under the same mild conditions.
- the conductor can be used as a post-treatment, either by a heat treatment at a lower temperature or by a drying treatment at normal temperature without performing the heat treatment. Can be formed.
- the silver ink composition containing such metal silver can be handled in the same manner as the silver ink composition not containing metal silver, and the handleability is not particularly inferior.
- the second mixture in the present invention has a higher viscosity than usual due to the supply of carbon dioxide as described above.
- the reducing agent when blended into the second mixture, depending on the type of the second mixture or the reducing agent, formation of metallic silver is started in at least part of the metallic silver forming material as described above.
- Metallic silver may precipitate.
- the viscosity of the second mixture is high, the aggregation of the precipitated metallic silver is suppressed, and the dispersibility of the metallic silver in the obtained silver ink composition is improved.
- a conductor obtained by forming metallic silver by a method described later using such a silver ink composition is obtained by blending a reducing agent in a mixture having a low viscosity, that is, carbon dioxide is not supplied.
- it has higher electrical conductivity (lower volume resistivity), lower surface roughness, and more favorable characteristics than a conductor using a silver ink composition.
- a silver ink composition by supplying carbon dioxide to a mixture containing the metallic silver forming material, alcohol and nitrogen-containing compound.
- a method similar to the above can be adopted as a method for supplying carbon dioxide.
- the silver ink composition When the silver ink composition is subjected to a drying treatment, it may be carried out by a known method, for example, under normal pressure, under reduced pressure, or under a blowing condition, either under the atmosphere or under an inert gas atmosphere. You may do it.
- the drying temperature is not particularly limited, and may be either heat drying or room temperature drying. As a preferable drying method when the heat treatment is unnecessary, a method of drying in the atmosphere at 18 to 30 ° C. can be exemplified.
- the conditions may be adjusted as appropriate according to the type of ingredients of the silver ink composition.
- the heating temperature is preferably 60 to 370 ° C., more preferably 70 to 280 ° C.
- the heating time may be adjusted according to the heating temperature, but it is usually preferably 1 minute to 24 hours, and more preferably 1 minute to 12 hours.
- the silver carboxylate, particularly silver ⁇ -ketocarboxylate (1) is different from the metal silver forming material such as silver oxide, for example, using a reducing agent known in the art. Even if not, it decomposes at low temperature. Reflecting such decomposition temperature, the silver ink composition can form metallic silver at an extremely lower temperature than the conventional one as described above.
- the heating temperature is preferably less than 130 ° C., more preferably 125 ° C. or less. Preferably, it is 120 degrees C or less especially.
- the method for heat treatment of the silver ink composition is not particularly limited, and for example, heating by an electric furnace, heating by a thermal head, heating by far infrared irradiation, heating by blowing a hot gas, or the like can be performed. Further, the heat treatment of the silver ink composition may be performed in the air, in an inert gas atmosphere, or may be performed under humidified conditions. And you may carry out under any of normal pressure, pressure reduction, and pressurization.
- humidity means that the humidity is artificially increased unless otherwise specified, and the relative humidity is preferably 5% or more. At the time of heat treatment, since the humidity in the treatment environment becomes extremely low due to the high treatment temperature, it can be said that the relative humidity of 5% is clearly artificially increased.
- the relative humidity when the heat treatment of the silver ink composition is performed under humidified conditions is preferably 10% or more, more preferably 30% or more, further preferably 50% or more, and 70%. It is particularly preferable that it be 90% or more, or 100%. And you may perform the heat processing under humidification conditions by spraying the high pressure steam heated to 100 degreeC or more. Thus, by heat-processing under humidification conditions, highly pure metallic silver can be formed in a short time.
- the heat treatment of the silver ink composition may be performed in two stages.
- the first stage heat treatment there is exemplified a method in which the silver ink composition is mainly dried rather than the formation of metal silver, and the formation of metal silver is completed in the second stage heat treatment.
- the heating temperature may be appropriately adjusted according to the type of compounding component of the silver ink composition, but is preferably 60 to 110 ° C, more preferably 70 to 90 ° C. preferable.
- the heating time may be adjusted according to the heating temperature, but it is usually preferably 5 seconds to 12 hours, and more preferably 30 seconds to 2 hours.
- the heating temperature may be appropriately adjusted according to the type of compounding component of the silver ink composition so that metallic silver is formed satisfactorily, but it should be 60 to 280 ° C.
- the temperature is 70 to 260 ° C.
- the heating time may be adjusted according to the heating temperature, but it is usually preferably 1 minute to 12 hours, and more preferably 1 minute to 10 hours.
- the heating temperature in the first and second stages is less than 130 ° C. It is preferably 125 ° C. or lower, more preferably 120 ° C. or lower.
- the heat treatment of the silver ink composition described so far is performed in the gas phase.
- the heat treatment in the second step is performed in the gas phase.
- the silver ink composition that has been completely or partially dried through the first stage heat treatment can be subjected to the second stage heat treatment without impairing its shape by contacting with the heated liquid.
- the heating temperature and heating time in the heat treatment in the liquid phase are the same as the heating temperature and heating time in the second-stage heat treatment described above.
- the heated liquid is preferably hot water (heated water), and the second stage heat treatment is performed by immersing the silver ink composition subjected to the first stage heat treatment in hot water, that is, by hot water bathing. Preferably it is done.
- the metallic silver formed by this heat treatment may be further dried.
- the first stage heat treatment of the silver ink composition is preferably performed under non-humidified conditions.
- non-humidification means that the above “humidification” is not performed, that is, the humidity is not artificially increased, and preferably the relative humidity is less than 5%. .
- the heat treatment of the silver ink composition is not the formation of metallic silver as described above under non-humidified conditions in the first stage heat treatment. It is particularly preferable to perform drying in a two-stage method in which the formation of metallic silver is performed to the end as described above under humidified conditions in the second-stage heat treatment.
- the heating temperature during the heat treatment under the first stage non-humidified conditions is preferably 60 to 110 ° C., and preferably 70 to 90 ° C. More preferred.
- the heating time is preferably 5 seconds to 1 hour, more preferably 30 seconds to 30 minutes, and particularly preferably 30 seconds to 10 minutes.
- the heating temperature during the heat treatment under the second-stage humidification condition, which is performed after the heat treatment under the first-stage non-humidification conditions is preferably 60 to 140 ° C, and preferably 70 to 130 ° C. Is more preferable.
- the heating time is preferably 1 minute to 2 hours, more preferably 1 minute to 1 hour, and particularly preferably 1 minute to 30 minutes.
- the heat treatment under the first non-humidifying condition and the second humidifying condition are performed.
- the heating temperature in the heat treatment at is preferably less than 130 ° C, more preferably 125 ° C or less, and particularly preferably 120 ° C or less.
- preferred examples of the method for producing metallic silver include those having the step of forming metallic silver using ⁇ -ketocarboxylate silver (1).
- a silver ink composition containing silver ⁇ -ketocarboxylate (1) is heat-treated under non-humidified conditions and then further humidified or heated. What forms the said metal silver is mentioned by making it contact with the liquid which was made and heat-processing.
- the laminate of the present invention comprises a layer made of the above-described metallic silver of the present invention (hereinafter sometimes abbreviated as “silver layer”) on a substrate.
- the metallic silver can be formed by subjecting the silver ink composition for forming it to a post-treatment such as drying or heating (firing) at a temperature as low as less than 130 ° C.
- the silver layer can be formed even when a material having a low thickness is used, and a wide variety of base materials can be used.
- a volume resistivity will be 8 microhm * cm or less, and it has sufficiently high electroconductivity.
- FIG. 1 is a cross-sectional view schematically showing an example of the laminate of the present invention.
- the laminated body 1 shown here is formed by laminating a silver layer 12 on the surface (one main surface) 11a of a base material 11.
- the base material 11 will not be specifically limited if the composition for forming the above-mentioned metallic silver can be used.
- the material of the substrate 11 is polyethylene (PE); polypropylene (PP); polyvinyl chloride (PVC); polyvinylidene chloride (PVDC); polymethylpentene (PMP); polycycloolefin; polystyrene (PS).
- An acrylic resin such as polymethyl methacrylate (PMMA); an AS resin; an ABS resin; a polyamide (PA) such as nylon 6, 6 and nylon 6; a polyimide; a polyamideimide (PAI); a polyacetal ( POM); polyethylene terephthalate (PET); polybutylene terephthalate (PBT); polytrimethylene terephthalate (PTT); polyethylene naphthalate (PEN); polybutylene naphthalate (PBN); polyphenylene sulfide (PPS); Polyethersulfone (PES); Polyetherketone (PEK); Polyetheretherketone (PEEK); Polycarbonate (PC); Polyurethane; Polyphenyleneether (PPE); Modified polyphenyleneether (m-PPE); Polyarylate An epoxy resin; a melamine resin; a phenol resin; and a synthetic resin such as a urea resin.
- the material of the base material 11 can be exemplified by ceramics
- a material having a deflection temperature under a load of 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648 is 120 ° C. or less. It can be illustrated.
- Preferred examples of such a material for the substrate 11 include polyethylene, polypropylene homopolymer, ABS resin, polyacetal copolymer, polyethylene terephthalate, nylon 6,6, nylon 6, polycarbonate / ABS resin alloy, and the like.
- the substrate 11 can be selected in any shape depending on the purpose, and is preferably in the form of a film or a sheet, for example, preferably having a thickness of 0.5 to 5000 ⁇ m, and 0.5 to 2500 ⁇ m. It is more preferable.
- the thickness of the base material 11 is equal to or greater than the lower limit value, the structure of the silver layer can be more stably maintained, and when the thickness of the base material 11 is equal to or less than the upper limit value, handling at the time of forming the silver layer The property becomes better.
- the substrate 11 may be composed of a single layer, or may be composed of two or more layers.
- these multiple layers may be the same as or different from each other. That is, all the layers may be the same, all the layers may be different, or only some of the layers may be different. And when several layers differ from each other, the combination of these several layers is not specifically limited.
- the plurality of layers being different from each other means that at least one of the material and the thickness of each layer is different from each other.
- the base material 11 consists of multiple layers, it is good to make it the thickness of the total of each layer be the thickness of said preferable base material 11.
- the silver layer 12 is made of the above-described metallic silver of the present invention.
- the shape of the silver layer 12 when the laminate 1 is viewed in plan so that one main surface (surface) 11a of the substrate 11 is looked down from above can be arbitrarily set according to the purpose, and the surface of the substrate 11
- the silver layer 12 may be provided on the entire surface of 11a, or the silver layer 12 may be provided on only a part of the surface 11a of the base material 11. In this case, the silver layer 12 is patterned. May be.
- the patterned silver layer 12 is useful as a wiring, for example.
- the thickness of the silver layer 12 can be arbitrarily set according to the purpose, but is preferably 0.01 to 5 ⁇ m, and more preferably 0.05 to 3 ⁇ m. When the thickness of the silver layer 12 is equal to or more than the lower limit value, the conductivity can be further improved, and the structure of the silver layer 12 can be more stably maintained. Moreover, the laminated body 1 can be made thinner by the thickness of the silver layer 12 being the said upper limit or less.
- the silver layer 12 may be composed of a single layer or may be composed of two or more layers. When the silver layer 12 consists of a plurality of layers, these layers may be the same as or different from each other, and can be configured in the same manner as in the case of the substrate 11. For example, the silver layer 12 composed of a plurality of layers may be configured such that the total thickness of each layer is the thickness of the preferred silver layer 12 described above.
- the silver layer 12 is excellent in conductivity, and its volume resistivity is 8 ⁇ ⁇ cm or less as described above.
- the laminated body of the present invention is not limited to that shown in FIG. 1, and other configurations may be added or a part of the configuration may be appropriately changed within a range not impairing the effects of the present invention.
- another layer other than the silver layer 12 may be provided on the base material 11, and the other layer may include a receiving layer (not shown) provided between the base material 11 and the silver layer 12,
- An overcoat layer (not shown) for covering the silver layer 12 can be exemplified.
- the receptor layer improves the adhesion between the silver layer and the substrate.
- the laminate 1 is shown having a silver layer 12 on one main surface (surface) 11a of the base material 11, but the laminate of the present invention is the other main surface of the base material 11.
- the surface (back surface) 11b may be provided with the silver layer 12 (on both main surfaces of the base material 11).
- the laminate of the present invention can be produced, for example, by a production method having a step of forming a silver layer on a substrate (hereinafter sometimes abbreviated as “silver layer formation step”).
- ⁇ Silver layer formation process> In the silver layer forming step, a silver layer is formed on the surface of the substrate (in FIG. 1, the surface (main surface) 11a of the substrate 11).
- the silver ink composition for forming the above-described metallic silver is attached to a desired location on the surface (main surface) of the substrate, and solidification treatment such as drying treatment or heating (firing) treatment is appropriately performed. It can be formed by selecting and performing.
- the heat treatment may be performed also as a drying treatment.
- a silver ink composition can be made to adhere to a base material by well-known methods, such as a printing method, the apply
- the printing method include screen printing method, flexographic printing method, offset printing method, dip printing method, ink jet printing method, dispenser printing method, jet dispenser printing method, gravure printing method, gravure offset printing method, pad printing. Laws can be exemplified.
- the coating method include spin coaters, air knife coaters, curtain coaters, die coaters, blade coaters, roll coaters, gate roll coaters, bar coaters, rod coaters, gravure coaters, and other methods such as wire bars. It can be illustrated.
- the thickness of the silver layer can be adjusted by adjusting the amount of the silver ink composition to be deposited on the substrate, or the blending amount of the metallic silver forming material in the silver ink composition. .
- the substrate may be heat-treated (annealed) before the silver ink composition is attached.
- heat-treating the base material for example, when the silver ink composition is heat-treated (baked), shrinkage of the base material is suppressed and dimensional stability is improved.
- the conditions for the heat treatment of the base material before adhering the silver ink composition may be appropriately adjusted according to the type of the base material, and are not particularly limited, but the heat treatment is performed at 60 to 200 ° C. for 10 to 60 minutes. For example, it may be the same as the conditions of the heating (firing) treatment of the silver ink composition in the silver layer forming step.
- the surface of the substrate may be plasma-treated before the silver ink composition is attached.
- the plasma treatment may be performed by a known method.
- it can be performed under conditions of a voltage of 290 to 300 W, an air velocity of 1.0 to 5.0 m / min, and the like.
- the silver layer can be formed by the same method as the method for producing metallic silver described above.
- a step of forming other layers at a predetermined timing is appropriately added.
- a receiving layer is formed on the surface of the substrate (receiving layer) before the silver layer is formed on the substrate.
- Layer formation step a silver layer may be formed on the receiving layer (silver layer formation step).
- the receiving layer is prepared by preparing a composition (composition for receiving layer) in which components for forming the receiving layer such as various resins are blended, and depositing the composition on the substrate, for example, drying treatment, heat treatment, etc. It can form by performing operation for forming a receiving layer.
- the receiving layer composition can be deposited on the substrate in the same manner as the silver ink composition.
- the said laminated body is suitable for comprising various electronic devices, a transparent conductive film, etc.
- the electronic device can be configured to use the laminate and include the base material as a casing (exterior material), and at least a part of the casing (exterior material) is configured with the base material in the laminate. Except for this point, the configuration can be the same as that of a known electronic device. For example, a flat or curved portion of an exterior material in a communication device such as a mobile phone is used as the base material, and a thin wire made of the metallic silver is formed on the exterior material (base material), and the thin wire is used as a circuit.
- the laminate can be used as a circuit board.
- a cellular phone can be configured by combining a voice input unit, a voice output unit, an operation switch, a display unit, and the like in addition to the laminate.
- the laminated body can be used as an antenna structure, and the configuration is the same as that of a known data transmitting / receiving body except that the antenna structure is used.
- a new data receiving / transmitting body can be obtained.
- an IC chip electrically connected to the silver layer is provided on the base material to form an antenna portion, whereby a non-contact type data receiving / transmitting body can be configured.
- the transparent conductive film can be configured to use the laminate and include a silver layer as an ultrafine wiring or an ultrathin wiring, except that the silver layer is provided as an ultrafine wiring or an ultrathin wiring.
- a structure similar to that of the conductive film can be employed.
- a touch panel or an optical display can be configured by combining with a transparent substrate or the like.
- the line width of the ultrafine wiring is preferably 1 to 20 ⁇ m, more preferably 1.3 to 15 ⁇ m, and particularly preferably 1.5 to 13 ⁇ m.
- the cross-sectional shape of the ultrafine wiring is preferably a semi-elliptical shape in which approximately half the region in the minor axis direction of the ellipse is cut off.
- the thickness of the ultra-thin wiring is preferably 5 nm to 10 ⁇ m, more preferably 7 nm to 5 ⁇ m, and particularly preferably 10 nm to 1 ⁇ m.
- the cross-sectional shape of the ultrathin wiring is the same as the cross-sectional shape of the ultrafine wiring.
- the silver layer preferably satisfies at least one of such a line width and thickness. If the silver layer has such a line width or thickness, its presence is difficult to recognize by visual observation, which is preferable as a transparent conductive film.
- the silver layer can be formed at a low temperature, and a wide range of materials such as a base material can be selected.
- a wide range of materials such as a base material can be selected.
- electronic devices, transparent conductive films, etc. Can be made more rational.
- the above electronic devices, transparent conductive films, and the like can maintain high performance over a long period of time.
- Example 1 ⁇ Manufacture of laminates> (Manufacture of silver ink composition) Add 2-methylacetoacetic acid silver to 2-ethylhexylamine (0.4 times molar amount relative to 2-methylacetoacetate silver described later) in a beaker so that the liquid temperature is 50 ° C. or less, and The mixture was stirred for 15 minutes to obtain a liquid material. To this liquid, formic acid (0.7-fold molar amount with respect to silver 2-methylacetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C.
- nitrogen-containing compound (molar ratio) means the compounding amount (number of moles) of nitrogen-containing compound per mol of compounding material of the metallic silver ([number of moles of nitrogen-containing compound] / [metal The number of moles of silver forming material]).
- reducing agent (molar ratio) is the amount (mole number) of the reducing agent per mole of the metal silver forming material ([mole number of reducing agent] / [mole of metal silver forming material). Number]).
- “Other components (mass%)” means the ratio of the blending amount (mass) of other components to the total amount (mass) of the blending components of the silver ink composition ([blending amount (mass) of other components] / [ Total amount (mass) of compounding components of silver ink composition] ⁇ 100).
- “-” in the column of the blending component means that the component is not blended. The same applies to the following tables.
- the silver ink composition obtained above was applied by spin coating.
- the spin coating was performed under conditions of 7500 rpm and 30 seconds.
- the base material has a deflection temperature under load of 120 ° C. or less when the deflection amount is 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648.
- the coated base material is dried at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), and further placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes.
- a silver layer having a size of 30 mm ⁇ 30 mm and a thickness of 1 to 2 ⁇ m was formed on the substrate to obtain a laminate.
- Table 2 shows the conditions for the heat treatment.
- the thickness T (cm) of the formed silver layer was measured using a laser microscope ("VK-X100" manufactured by Keyence Corporation).
- the surface resistance value of the formed silver layer was measured by a four-terminal method using a resistivity meter (“Loresta MCP-T610, PSP type probe” manufactured by Mitsubishi Chemical Analytech Co., Ltd.).
- the surface resistivity R ( ⁇ / ⁇ ) was calculated by multiplying the resistivity correction coefficient (4.04) calculated from the layer pattern shape and the probe shape.
- a silver ink composition was obtained by stirring at 25 ° C. until Table 1 shows the types and blending ratios of each blending component.
- Example 3 As shown in Tables 1 and 2, at the time of forming the silver layer, instead of heating the coated substrate in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes, 120 ° C. and relative humidity 100 A laminate was manufactured and evaluated in the same manner as in Example 1 except that it was heat-treated for 2 minutes in a water vapor atmosphere of 2%. The results are shown in Table 2.
- Example 4 As shown in Tables 1 and 2, when the silver layer was formed, the coated substrate was dried at 80 ° C. for 1 minute, and then this substrate was placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. Instead of heat treatment, a laminate was produced in the same manner as in Example 2 except that the coated substrate was heat treated at 80 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second) and evaluated. did. The results are shown in Table 2.
- Example 5 As shown in Tables 1 and 2, when the silver layer was formed, the coated substrate was dried at 80 ° C. for 1 minute, and then this substrate was placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. Instead of heat treatment, a laminate was produced in the same manner as in Example 2 except that the coated substrate was heat treated at 120 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second) and evaluated. did. The results are shown in Table 2.
- Example 2 As shown in Tables 1 and 2, the silver ink composition containing metal silver particles (“TEC-PA-010” manufactured by INK TEC) was used, and the spin coating conditions were set at 7500 rpm when the silver layer was formed. , 7500 rpm for 15 seconds instead of 30 seconds, the coated substrate is dried at 80 ° C. for 1 minute, and then the substrate is heated for 2 minutes in a steam atmosphere at 80 ° C. and 100% relative humidity. Instead of processing, a laminated body was manufactured and evaluated in the same manner as in Example 1 except that the coated substrate was heated at 80 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second). . The results are shown in Table 2.
- the silver layer has a sufficiently low volume resistivity and excellent conductivity even though it was formed at a low heat treatment temperature of 120 ° C. or less. It was.
- the crystallite diameter of metallic silver constituting the silver layer was 16.8 nm or more.
- the heat treatment temperature was lower than that of the silver ink composition used, and the silver layer has a high volume resistivity and poor conductivity. It was.
- Example 6 ⁇ Manufacture of laminates> (Manufacture of silver ink composition) In the same manner as in Example 1, a silver ink composition was obtained. Table 3 shows the types and mixing ratios of the respective components.
- a base material coated with the silver ink composition was obtained in the same manner as in Example 1. Subsequently, the coated base material is dried at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), and then the coated base material is baked at 80 ° C. for 2 minutes (80 ° C. A silver layer having a size of 30 mm ⁇ 30 mm and a thickness of 1 to 2 ⁇ m was formed on the substrate by immersing in hot water (2 minutes) and heating (firing) to obtain a laminate. As the hot water, distilled water heated to 80 ° C. was used. Table 4 shows the conditions for the heat treatment.
- Example 7 ⁇ Manufacture of laminates> (Manufacture of silver ink composition) Add silver acetoacetate to 2-ethylhexylamine (1.0 times the molar amount of silver acetoacetate described later) in a beaker so that the liquid temperature is 50 ° C. or less, and use a mechanical stirrer for 15 minutes. By stirring, a liquid material was obtained. To this liquid, formic acid (1.2 times molar amount with respect to silver acetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 3 shows the types and mixing ratios of the respective components.
- a silver layer was formed by the same method as in Example 6 except that the silver ink composition obtained above was used to produce a laminate.
- Table 4 shows the conditions for the heat treatment.
- Example 8 As shown in Tables 3 and 4, at the time of forming the silver layer, instead of heat-treating the coated substrate at 80 ° C. for 2 minutes, 2 ° A laminate was produced and evaluated in the same manner as in Example 7, except that the heat treatment was performed for a minute. The results are shown in Table 4.
- Example 9 ⁇ Manufacture of laminates> (Manufacture of silver ink composition) Using a mechanical stirrer, add silver acetonedicarboxylate to 2-ethylhexylamine (2.0 times molar amount relative to silver acetonedicarboxylate described later) in a beaker so that the liquid temperature is 50 ° C. or less. A liquid was obtained by stirring for 15 minutes. To this liquid, formic acid (2.0 times the molar amount with respect to silver acetone dicarboxylate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution would be 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 3 shows the types and mixing ratios of the respective components.
- a silver layer was formed by the same method as in Example 6 except that the silver ink composition obtained above was used to produce a laminate.
- Table 4 shows the conditions for the heat treatment.
- Example 10 As shown in Tables 3 and 4, at the time of forming the silver layer, instead of heat-treating the coated substrate at 80 ° C. for 2 minutes, 2 ° C. in a water vapor atmosphere at 80 ° C. and 100% relative humidity. A laminate was produced and evaluated in the same manner as in Example 9 except that the heat treatment was performed for a minute. The results are shown in Table 4.
- the silver layer was formed despite the fact that it was formed at a low heat treatment temperature of 80 ° C. or less, and the heat treatment method was changed. Had a sufficiently low volume resistivity and excellent conductivity.
- the crystallite diameter of metallic silver constituting the silver layer was 22.1 nm or more.
- the heat treatment temperature was lower than that of the silver ink composition used, and the silver layer has a high volume resistivity and poor conductivity. It was.
- the present invention can be used for various electronic devices having a metallic silver layer on a substrate, such as a wiring board, an electromagnetic wave shield, a touch panel, and an antenna of a wireless communication device casing.
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Abstract
This silver metal is configured of crystallites having a crystallite diameter of 15 nm or more, and has a volume resistivity of 8 μΩ·cm or less. This laminate is provided with a layer, which is formed of the silver metal, on a base.
Description
本発明は、金属銀、その製造方法、及び前記金属銀からなる層を基材上に備えた積層体に関する。
本願は、2014年9月29日に、日本に出願された特願2014-197818号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to metallic silver, a method for producing the same, and a laminate including a layer made of the metallic silver on a substrate.
This application claims priority based on Japanese Patent Application No. 2014-197818 filed in Japan on September 29, 2014, the contents of which are incorporated herein by reference.
本願は、2014年9月29日に、日本に出願された特願2014-197818号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to metallic silver, a method for producing the same, and a laminate including a layer made of the metallic silver on a substrate.
This application claims priority based on Japanese Patent Application No. 2014-197818 filed in Japan on September 29, 2014, the contents of which are incorporated herein by reference.
基材上にパターニングされた銀層が設けられた積層体は、通信機器等の電子機器において、配線、電極、アンテナ等を構成するのに利用される。
銀層は、例えば、金属銀又はその形成材料が配合された銀インク組成物を調製し、この組成物を基材上に付着させ、付着させた組成物を加熱(焼成)処理する手法により形成される。そして近年では、特性のよい銀層を形成し易いことから、金属銀自体ではなく金属銀の形成材料が配合された銀インク組成物を用いて金属銀を形成する手法が汎用されるようになってきている。 A laminate in which a patterned silver layer is provided on a base material is used to configure wiring, electrodes, antennas and the like in electronic devices such as communication devices.
The silver layer is formed, for example, by a method of preparing a silver ink composition containing metallic silver or a material for forming the silver, depositing the composition on a substrate, and heating (baking) the deposited composition. Is done. In recent years, since it is easy to form a silver layer having good characteristics, a technique for forming metallic silver using a silver ink composition containing a metallic silver forming material instead of metallic silver itself has become widely used. It is coming.
銀層は、例えば、金属銀又はその形成材料が配合された銀インク組成物を調製し、この組成物を基材上に付着させ、付着させた組成物を加熱(焼成)処理する手法により形成される。そして近年では、特性のよい銀層を形成し易いことから、金属銀自体ではなく金属銀の形成材料が配合された銀インク組成物を用いて金属銀を形成する手法が汎用されるようになってきている。 A laminate in which a patterned silver layer is provided on a base material is used to configure wiring, electrodes, antennas and the like in electronic devices such as communication devices.
The silver layer is formed, for example, by a method of preparing a silver ink composition containing metallic silver or a material for forming the silver, depositing the composition on a substrate, and heating (baking) the deposited composition. Is done. In recent years, since it is easy to form a silver layer having good characteristics, a technique for forming metallic silver using a silver ink composition containing a metallic silver forming material instead of metallic silver itself has become widely used. It is coming.
このような銀インク組成物としては、一つ以上の金属又は金属化合物と、特定の一つ以上のカルバミン酸アンモニウム又はアンモニウムカーボネート系化合物と、を反応させて得られる金属錯体化合物、及び添加剤を含み、前記金属が銀である導電性インク組成物が開示されている(特許文献1参照)。
Such a silver ink composition includes a metal complex compound obtained by reacting one or more metals or metal compounds with one or more specific ammonium carbamate or ammonium carbonate compounds, and additives. In addition, a conductive ink composition in which the metal is silver is disclosed (see Patent Document 1).
しかし、特許文献1で開示されている銀インク組成物は、十分な導電性を有する金属銀の形成に必要な加熱(焼成)温度が130℃以上であり、使用する基材はある程度の耐熱性を有することが必要であり、基材の材質が限定されてしまうという問題点があった。
However, the silver ink composition disclosed in Patent Document 1 has a heating (firing) temperature required for forming metallic silver having sufficient conductivity of 130 ° C. or higher, and the substrate used has a certain degree of heat resistance. There is a problem that the material of the base material is limited.
本発明は、より低温での加熱処理により得ることが可能であり、十分な導電性を有する金属銀、その製造方法、及び前記金属銀からなる層を基材上に備えた積層体を提供することを課題とする。
The present invention provides a metallic silver which can be obtained by a heat treatment at a lower temperature and has sufficient conductivity, a method for producing the same, and a laminate comprising a layer made of the metallic silver on a substrate. This is the issue.
本発明は、結晶子径が15nm以上のもので構成され、体積抵抗率が8μΩ・cm以下である金属銀を提供する。
本発明の金属銀は、前記結晶子径が16.5nm以上80nm以下であってもよい。 The present invention provides metallic silver having a crystallite diameter of 15 nm or more and a volume resistivity of 8 μΩ · cm or less.
The metal silver of the present invention may have a crystallite diameter of 16.5 nm or more and 80 nm or less.
本発明の金属銀は、前記結晶子径が16.5nm以上80nm以下であってもよい。 The present invention provides metallic silver having a crystallite diameter of 15 nm or more and a volume resistivity of 8 μΩ · cm or less.
The metal silver of the present invention may have a crystallite diameter of 16.5 nm or more and 80 nm or less.
本発明の金属銀は、下記一般式(1)で表わされるβ-ケトカルボン酸銀を用いて形成されたものでもよい。
The metallic silver of the present invention may be formed using silver β-ketocarboxylate represented by the following general formula (1).
Y1はそれぞれ独立にフッ素原子、塩素原子、臭素原子又は水素原子であり;R1は炭素数1~19の脂肪族炭化水素基又はフェニル基であり;R2は炭素数1~20の脂肪族炭化水素基であり;R3は炭素数1~16の脂肪族炭化水素基であり;R4及びR5はそれぞれ独立に炭素数1~18の脂肪族炭化水素基であり;R6は炭素数1~19の脂肪族炭化水素基、水酸基又は式「AgO-」で表される基であり;
X1はそれぞれ独立に水素原子、炭素数1~20の脂肪族炭化水素基、ハロゲン原子、1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはベンジル基、シアノ基、N-フタロイル-3-アミノプロピル基、2-エトキシビニル基、又は一般式「R7O-」、「R7S-」、「R7-C(=O)-」若しくは「R7-C(=O)-O-」で表される基であり;
R7は、炭素数1~10の脂肪族炭化水素基、チエニル基、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはジフェニル基である。)
Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom; R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group; R 2 is an aliphatic having 1 to 20 carbon atoms R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms; R 4 and R 5 are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms; R 6 is An aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”;
X 1 is independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group or benzyl group in which one or more hydrogen atoms may be substituted with a substituent, a cyano group, N -Phthaloyl-3-aminopropyl group, 2-ethoxyvinyl group, or “R 7 O—”, “R 7 S—”, “R 7 —C (═O) —” or “R 7 —C ( ═O) —O— ”;
R 7 is an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group, or a phenyl group or diphenyl group in which one or more hydrogen atoms may be substituted with a substituent. )
また、本発明は、下記一般式(1)で表わされるβ-ケトカルボン酸銀を用いて、結晶子径が15nm以上のもので構成され、体積抵抗率が8μΩ・cm以下である金属銀を形成する工程を有する、金属銀の製造方法を提供する。
Further, the present invention uses silver β-ketocarboxylate represented by the following general formula (1) to form metallic silver having a crystallite diameter of 15 nm or more and a volume resistivity of 8 μΩ · cm or less. The manufacturing method of metallic silver which has the process to perform is provided.
Y1はそれぞれ独立にフッ素原子、塩素原子、臭素原子又は水素原子であり;R1は炭素数1~19の脂肪族炭化水素基又はフェニル基であり;R2は炭素数1~20の脂肪族炭化水素基であり;R3は炭素数1~16の脂肪族炭化水素基であり;R4及びR5はそれぞれ独立に炭素数1~18の脂肪族炭化水素基であり;R6は炭素数1~19の脂肪族炭化水素基、水酸基又は式「AgO-」で表される基であり;
X1はそれぞれ独立に水素原子、炭素数1~20の脂肪族炭化水素基、ハロゲン原子、1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはベンジル基、シアノ基、N-フタロイル-3-アミノプロピル基、2-エトキシビニル基、又は一般式「R7O-」、「R7S-」、「R7-C(=O)-」若しくは「R7-C(=O)-O-」で表される基であり;
R7は、炭素数1~10の脂肪族炭化水素基、チエニル基、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはジフェニル基である。)
本発明の金属銀の製造方法においては、前記金属銀を形成する工程において、前記β-ケトカルボン酸銀が配合されてなる銀インク組成物を、非加湿条件下で加熱処理した後、さらに加湿条件下で、又は加熱した液体と接触させて、加熱処理することで前記金属銀を形成してもよい。
Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom; R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group; R 2 is an aliphatic having 1 to 20 carbon atoms R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms; R 4 and R 5 are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms; R 6 is An aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”;
X 1 is independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group or benzyl group in which one or more hydrogen atoms may be substituted with a substituent, a cyano group, N -Phthaloyl-3-aminopropyl group, 2-ethoxyvinyl group, or “R 7 O—”, “R 7 S—”, “R 7 —C (═O) —” or “R 7 —C ( ═O) —O— ”;
R 7 is an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group, or a phenyl group or diphenyl group in which one or more hydrogen atoms may be substituted with a substituent. )
In the method for producing metallic silver of the present invention, in the step of forming metallic silver, the silver ink composition containing the β-ketocarboxylate is heat-treated under non-humidified conditions, and further humidified conditions. The metallic silver may be formed by heat treatment under or in contact with a heated liquid.
また、本発明は、前記金属銀からなる層を基材上に備えた積層体を提供する。
本発明の積層体においては、前記基材の厚さが0.5~5000μmであり、前記金属銀からなる層の厚さが0.01~5μmであってもよい。
本発明の積層体においては、前記基材は、ASTM D648で規定される、1.8MPaの曲げ応力でたわみ量が0.25mmとなるときの荷重たわみ温度が120℃以下のものであってもよい。 Moreover, this invention provides the laminated body provided with the layer which consists of the said metal silver on a base material.
In the laminate of the present invention, the base material may have a thickness of 0.5 to 5000 μm, and the metal silver layer may have a thickness of 0.01 to 5 μm.
In the laminate of the present invention, the base material may have a deflection temperature under load of 120 ° C. or less when the deflection amount is 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648. Good.
本発明の積層体においては、前記基材の厚さが0.5~5000μmであり、前記金属銀からなる層の厚さが0.01~5μmであってもよい。
本発明の積層体においては、前記基材は、ASTM D648で規定される、1.8MPaの曲げ応力でたわみ量が0.25mmとなるときの荷重たわみ温度が120℃以下のものであってもよい。 Moreover, this invention provides the laminated body provided with the layer which consists of the said metal silver on a base material.
In the laminate of the present invention, the base material may have a thickness of 0.5 to 5000 μm, and the metal silver layer may have a thickness of 0.01 to 5 μm.
In the laminate of the present invention, the base material may have a deflection temperature under load of 120 ° C. or less when the deflection amount is 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648. Good.
本発明の金属銀は、より低温での加熱処理により得ることが可能であり、十分な導電性を有し、前記金属銀からなる層を基材上に備えた積層体を構成できる。
The metallic silver of the present invention can be obtained by heat treatment at a lower temperature, has sufficient conductivity, and can constitute a laminate comprising a layer made of the metallic silver on a substrate.
本発明の金属銀、その製造方法及び積層体の好ましい例について以下に説明する。ただし、本発明はこれら例のみに限定されることはなく、例えば、本発明の趣旨を逸脱しない範囲で、追加、省略、置換、及びその他の変更(量、数、位置、サイズなど)が可能である。
Favorable examples of the metallic silver of the present invention, its production method and laminate are described below. However, the present invention is not limited to these examples. For example, additions, omissions, substitutions, and other changes (amount, number, position, size, etc.) are possible without departing from the spirit of the present invention. It is.
<<金属銀>>
本発明の金属銀は、結晶子径が15nm以上のもので構成され、体積抵抗率が8μΩ・cm以下のものである。
前記金属銀は、これを形成するための組成物を130℃未満という低い温度で、乾燥処理や加熱(焼成)処理等の後処理を行うことで形成しても、結晶子径が15nm以上のもので構成されていることにより、体積抵抗率が8μΩ・cm以下となり、十分に高い導電性を有する。 << Metallic silver >>
The metallic silver of the present invention has a crystallite diameter of 15 nm or more and a volume resistivity of 8 μΩ · cm or less.
Even if the metallic silver is formed by performing a post-treatment such as a drying treatment or a heating (firing) treatment at a temperature as low as less than 130 ° C., the crystallite diameter is 15 nm or more. By being constituted, the volume resistivity is 8 μΩ · cm or less, and the conductivity is sufficiently high.
本発明の金属銀は、結晶子径が15nm以上のもので構成され、体積抵抗率が8μΩ・cm以下のものである。
前記金属銀は、これを形成するための組成物を130℃未満という低い温度で、乾燥処理や加熱(焼成)処理等の後処理を行うことで形成しても、結晶子径が15nm以上のもので構成されていることにより、体積抵抗率が8μΩ・cm以下となり、十分に高い導電性を有する。 << Metallic silver >>
The metallic silver of the present invention has a crystallite diameter of 15 nm or more and a volume resistivity of 8 μΩ · cm or less.
Even if the metallic silver is formed by performing a post-treatment such as a drying treatment or a heating (firing) treatment at a temperature as low as less than 130 ° C., the crystallite diameter is 15 nm or more. By being constituted, the volume resistivity is 8 μΩ · cm or less, and the conductivity is sufficiently high.
金属銀の結晶子径は、公知の方法で求められる。例えば、金属銀をX線回折測定に供し、得られたX線回折ピークの測定結果から、最も強度が強い結晶面のピークに関し、シェラー(Scherrer)の式「D=kλ/βcosθ(式中、Dは結晶子径(nm)であり;kは定数(ここでは0.9を用いる)であり;λはX線の波長(CuKα線)0.154nmであり;βはピーク半値幅(rad)であり;θは測定角度の1/2の角度である。)」を用いることで、金属銀の結晶子径を算出できる。
X線回折の測定は、例えば、薄膜X線回折装置を用いて行うことができる。 The crystallite diameter of metallic silver is determined by a known method. For example, metal silver is subjected to X-ray diffraction measurement, and from the measurement result of the obtained X-ray diffraction peak, Scherrer's formula “D = kλ / βcos θ (where, D is the crystallite size (nm); k is a constant (0.9 is used here); λ is the X-ray wavelength (CuKα line) 0.154 nm; β is the peak half-width (rad) And θ is an angle that is ½ of the measurement angle.) ”Can be used to calculate the crystallite diameter of metallic silver.
The X-ray diffraction measurement can be performed using, for example, a thin film X-ray diffraction apparatus.
X線回折の測定は、例えば、薄膜X線回折装置を用いて行うことができる。 The crystallite diameter of metallic silver is determined by a known method. For example, metal silver is subjected to X-ray diffraction measurement, and from the measurement result of the obtained X-ray diffraction peak, Scherrer's formula “D = kλ / βcos θ (where, D is the crystallite size (nm); k is a constant (0.9 is used here); λ is the X-ray wavelength (CuKα line) 0.154 nm; β is the peak half-width (rad) And θ is an angle that is ½ of the measurement angle.) ”Can be used to calculate the crystallite diameter of metallic silver.
The X-ray diffraction measurement can be performed using, for example, a thin film X-ray diffraction apparatus.
前記金属銀の結晶子径は、15nm以上であり、15.5nm以上であることが好ましく、16nm以上であることがより好ましく、16.5nm以上であることが特に好ましい。
前記金属銀の結晶子径の上限値は、特に限定されないが、結晶子径の増大に対して、得られる本発明の効果の増大の程度が限定的となることから、80nmであることが好ましく、70nmであることがより好ましく、例えば、40nm等であってもよいが、これらに限定されない。 The crystallite diameter of the metallic silver is 15 nm or more, preferably 15.5 nm or more, more preferably 16 nm or more, and particularly preferably 16.5 nm or more.
The upper limit of the crystallite diameter of the metallic silver is not particularly limited, but is preferably 80 nm because the degree of increase in the effect of the present invention obtained is limited with respect to the increase in crystallite diameter. , 70 nm is more preferable. For example, it may be 40 nm, but is not limited thereto.
前記金属銀の結晶子径の上限値は、特に限定されないが、結晶子径の増大に対して、得られる本発明の効果の増大の程度が限定的となることから、80nmであることが好ましく、70nmであることがより好ましく、例えば、40nm等であってもよいが、これらに限定されない。 The crystallite diameter of the metallic silver is 15 nm or more, preferably 15.5 nm or more, more preferably 16 nm or more, and particularly preferably 16.5 nm or more.
The upper limit of the crystallite diameter of the metallic silver is not particularly limited, but is preferably 80 nm because the degree of increase in the effect of the present invention obtained is limited with respect to the increase in crystallite diameter. , 70 nm is more preferable. For example, it may be 40 nm, but is not limited thereto.
前記金属銀の体積抵抗率は、8μΩ・cm以下であり、例えば、7.6μΩ・cm以下、7.3μΩ・cm以下及び7μΩ・cm以下等のいずれかとすることも可能である。
一方、前記金属銀の体積抵抗率は低いほど好ましく、その下限値は特に限定されないが、例えば、1.59μΩ・cm及び2.5μΩ・cm等のいずれかとすることができる。
前記金属銀の体積抵抗率は、通常、金属銀の結晶子径が大きくなるほど、低くなる傾向にある。 The volume resistivity of the metallic silver is 8 μΩ · cm or less, and can be any of 7.6 μΩ · cm or less, 7.3 μΩ · cm or less, 7 μΩ · cm or less, and the like.
On the other hand, the volume resistivity of the metallic silver is preferably as low as possible, and the lower limit is not particularly limited, but can be, for example, either 1.59 μΩ · cm or 2.5 μΩ · cm.
The volume resistivity of the metal silver usually tends to decrease as the crystallite diameter of the metal silver increases.
一方、前記金属銀の体積抵抗率は低いほど好ましく、その下限値は特に限定されないが、例えば、1.59μΩ・cm及び2.5μΩ・cm等のいずれかとすることができる。
前記金属銀の体積抵抗率は、通常、金属銀の結晶子径が大きくなるほど、低くなる傾向にある。 The volume resistivity of the metallic silver is 8 μΩ · cm or less, and can be any of 7.6 μΩ · cm or less, 7.3 μΩ · cm or less, 7 μΩ · cm or less, and the like.
On the other hand, the volume resistivity of the metallic silver is preferably as low as possible, and the lower limit is not particularly limited, but can be, for example, either 1.59 μΩ · cm or 2.5 μΩ · cm.
The volume resistivity of the metal silver usually tends to decrease as the crystallite diameter of the metal silver increases.
<<金属銀の製造方法>>
前記金属銀は、これを形成するための組成物(銀インク組成物)を調製し、これを後述する基材等の所望の箇所に付着させ、乾燥処理や加熱(焼成)処理等の固化処理を適宜選択して行うことで製造できる。加熱処理は、乾燥処理を兼ねて行ってもよい。 << Method for producing metallic silver >>
The metallic silver is prepared by preparing a composition (silver ink composition) for forming the metallic silver and adhering it to a desired location such as a base material to be described later, followed by solidification treatment such as drying treatment or heating (firing) treatment. It can manufacture by selecting suitably and performing. The heat treatment may be performed also as a drying treatment.
前記金属銀は、これを形成するための組成物(銀インク組成物)を調製し、これを後述する基材等の所望の箇所に付着させ、乾燥処理や加熱(焼成)処理等の固化処理を適宜選択して行うことで製造できる。加熱処理は、乾燥処理を兼ねて行ってもよい。 << Method for producing metallic silver >>
The metallic silver is prepared by preparing a composition (silver ink composition) for forming the metallic silver and adhering it to a desired location such as a base material to be described later, followed by solidification treatment such as drying treatment or heating (firing) treatment. It can manufacture by selecting suitably and performing. The heat treatment may be performed also as a drying treatment.
<銀インク組成物>
本発明においては、前記銀インク組成物として、金属銀の形成材料が配合されてなる銀インク組成物を用いることが好ましい。
配合される金属銀の形成材料は、一種のみでもよいし、二種以上でもよく、二種以上である場合、その組み合わせ及び比率は、任意に調節できる。 <Silver ink composition>
In the present invention, it is preferable to use a silver ink composition containing a metallic silver forming material as the silver ink composition.
The metallic silver forming material to be blended may be only one kind or two or more kinds, and in the case of two or more kinds, the combination and ratio can be arbitrarily adjusted.
本発明においては、前記銀インク組成物として、金属銀の形成材料が配合されてなる銀インク組成物を用いることが好ましい。
配合される金属銀の形成材料は、一種のみでもよいし、二種以上でもよく、二種以上である場合、その組み合わせ及び比率は、任意に調節できる。 <Silver ink composition>
In the present invention, it is preferable to use a silver ink composition containing a metallic silver forming material as the silver ink composition.
The metallic silver forming material to be blended may be only one kind or two or more kinds, and in the case of two or more kinds, the combination and ratio can be arbitrarily adjusted.
前記金属銀の形成材料は、銀原子(元素)を有し、分解等の構造変化によって金属銀を生じるものであればよく、銀塩、銀錯体、有機銀化合物(銀-炭素結合を有する化合物)等が例示できる。前記銀塩及び銀錯体は、有機基を有する銀化合物及び有機基を有しない銀化合物のいずれでもよい。なかでも金属銀の形成材料は、銀塩であることが好ましい。
金属銀の形成材料を用いることで、前記材料から金属銀が生じる。この場合の金属銀は高純度であり、金属銀の比率が、見かけ上金属銀だけからなるとみなし得る程度に十分に高く、金属銀の比率は、好ましくは97質量%以上、より好ましくは98質量%以上、特に好ましくは99質量%以上である。金属銀の比率の上限値は、例えば、100質量%、99.9質量%、99.8質量%、99.7質量%、99.6質量%、99.5質量%、99.4質量%、99.3質量%、99.2質量%及び99.1質量%のいずれかとすることができるが、これらに限定されない。 The metal silver forming material may be any material that has silver atoms (elements) and generates metallic silver by structural change such as decomposition, and is a silver salt, a silver complex, an organic silver compound (a compound having a silver-carbon bond) ) Etc. can be illustrated. The silver salt and the silver complex may be either a silver compound having an organic group or a silver compound having no organic group. Among these, the metal silver forming material is preferably a silver salt.
By using a metallic silver forming material, metallic silver is produced from the material. The metallic silver in this case is of high purity, and the ratio of metallic silver is sufficiently high that it can be regarded as consisting of only metallic silver. The metallic silver ratio is preferably 97% by mass or more, more preferably 98% by mass. % Or more, particularly preferably 99% by mass or more. The upper limit of the ratio of metallic silver is, for example, 100% by mass, 99.9% by mass, 99.8% by mass, 99.7% by mass, 99.6% by mass, 99.5% by mass, 99.4% by mass. , 99.3% by mass, 99.2% by mass, and 99.1% by mass, but is not limited thereto.
金属銀の形成材料を用いることで、前記材料から金属銀が生じる。この場合の金属銀は高純度であり、金属銀の比率が、見かけ上金属銀だけからなるとみなし得る程度に十分に高く、金属銀の比率は、好ましくは97質量%以上、より好ましくは98質量%以上、特に好ましくは99質量%以上である。金属銀の比率の上限値は、例えば、100質量%、99.9質量%、99.8質量%、99.7質量%、99.6質量%、99.5質量%、99.4質量%、99.3質量%、99.2質量%及び99.1質量%のいずれかとすることができるが、これらに限定されない。 The metal silver forming material may be any material that has silver atoms (elements) and generates metallic silver by structural change such as decomposition, and is a silver salt, a silver complex, an organic silver compound (a compound having a silver-carbon bond) ) Etc. can be illustrated. The silver salt and the silver complex may be either a silver compound having an organic group or a silver compound having no organic group. Among these, the metal silver forming material is preferably a silver salt.
By using a metallic silver forming material, metallic silver is produced from the material. The metallic silver in this case is of high purity, and the ratio of metallic silver is sufficiently high that it can be regarded as consisting of only metallic silver. The metallic silver ratio is preferably 97% by mass or more, more preferably 98% by mass. % Or more, particularly preferably 99% by mass or more. The upper limit of the ratio of metallic silver is, for example, 100% by mass, 99.9% by mass, 99.8% by mass, 99.7% by mass, 99.6% by mass, 99.5% by mass, 99.4% by mass. , 99.3% by mass, 99.2% by mass, and 99.1% by mass, but is not limited thereto.
前記銀インク組成物としては、液状のものが好ましく、金属銀の形成材料が溶解又は均一に分散されたものが好ましい。
As the silver ink composition, a liquid one is preferable, and one in which a metal silver forming material is dissolved or uniformly dispersed is preferable.
[カルボン酸銀]
金属銀の形成材料としては、式「-COOAg」で表される基を有するカルボン酸銀が例示でき、このようなカルボン酸銀は、結晶子径が15nm以上の金属銀を形成するのに好適なものである。
本発明において、カルボン酸銀は、一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。
前記カルボン酸銀は、式「-COOAg」で表される基を有していれば特に限定されない。例えば、式「-COOAg」で表される基の数は1個のみでもよいし、2個以上でもよい。また、カルボン酸銀中の式「-COOAg」で表される基の位置も特に限定されない。 [Silver carboxylate]
Examples of the material for forming metallic silver include silver carboxylate having a group represented by the formula “—COOAg”, and such silver carboxylate is suitable for forming metallic silver having a crystallite diameter of 15 nm or more. It is a thing.
In this invention, silver carboxylate may be used individually by 1 type, and may use 2 or more types together. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
The silver carboxylate is not particularly limited as long as it has a group represented by the formula “—COOAg”. For example, the number of groups represented by the formula “—COOAg” may be one, or two or more. Further, the position of the group represented by the formula “—COOAg” in the silver carboxylate is not particularly limited.
金属銀の形成材料としては、式「-COOAg」で表される基を有するカルボン酸銀が例示でき、このようなカルボン酸銀は、結晶子径が15nm以上の金属銀を形成するのに好適なものである。
本発明において、カルボン酸銀は、一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。
前記カルボン酸銀は、式「-COOAg」で表される基を有していれば特に限定されない。例えば、式「-COOAg」で表される基の数は1個のみでもよいし、2個以上でもよい。また、カルボン酸銀中の式「-COOAg」で表される基の位置も特に限定されない。 [Silver carboxylate]
Examples of the material for forming metallic silver include silver carboxylate having a group represented by the formula “—COOAg”, and such silver carboxylate is suitable for forming metallic silver having a crystallite diameter of 15 nm or more. It is a thing.
In this invention, silver carboxylate may be used individually by 1 type, and may use 2 or more types together. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
The silver carboxylate is not particularly limited as long as it has a group represented by the formula “—COOAg”. For example, the number of groups represented by the formula “—COOAg” may be one, or two or more. Further, the position of the group represented by the formula “—COOAg” in the silver carboxylate is not particularly limited.
前記カルボン酸銀は、下記一般式(1)で表わされるβ-ケトカルボン酸銀(以下、「β-ケトカルボン酸銀(1)」と略記することがある)及び下記一般式(4)で表されるカルボン酸銀(以下、「カルボン酸銀(4)」と略記することがある)からなる群から選択される一種以上であることが好ましい。
なお、本明細書においては、単なる「カルボン酸銀」との記載は、特に断りの無い限り、「β-ケトカルボン酸銀(1)」及び「カルボン酸銀(4)」だけではなく、これらを包括する、「式「-COOAg」で表される基を有するカルボン酸銀」を意味するものとする。 The silver carboxylate is represented by the following general formula (1) β-ketocarboxylate silver (hereinafter sometimes abbreviated as “β-ketocarboxylate (1)”) and the following general formula (4). It is preferably one or more selected from the group consisting of silver carboxylates (hereinafter sometimes abbreviated as "silver carboxylate (4)").
In this specification, the simple description of “silver carboxylate” is not limited to “silver β-ketocarboxylate (1)” and “silver carboxylate (4)”, unless otherwise specified. It is intended to mean “silver carboxylate having a group represented by the formula“ —COOAg ””.
なお、本明細書においては、単なる「カルボン酸銀」との記載は、特に断りの無い限り、「β-ケトカルボン酸銀(1)」及び「カルボン酸銀(4)」だけではなく、これらを包括する、「式「-COOAg」で表される基を有するカルボン酸銀」を意味するものとする。 The silver carboxylate is represented by the following general formula (1) β-ketocarboxylate silver (hereinafter sometimes abbreviated as “β-ketocarboxylate (1)”) and the following general formula (4). It is preferably one or more selected from the group consisting of silver carboxylates (hereinafter sometimes abbreviated as "silver carboxylate (4)").
In this specification, the simple description of “silver carboxylate” is not limited to “silver β-ketocarboxylate (1)” and “silver carboxylate (4)”, unless otherwise specified. It is intended to mean “silver carboxylate having a group represented by the formula“ —COOAg ””.
Y1はそれぞれ独立にフッ素原子、塩素原子、臭素原子又は水素原子であり;R1は炭素数1~19の脂肪族炭化水素基又はフェニル基であり;R2は炭素数1~20の脂肪族炭化水素基であり;R3は炭素数1~16の脂肪族炭化水素基であり;R4及びR5はそれぞれ独立に炭素数1~18の脂肪族炭化水素基であり;R6は炭素数1~19の脂肪族炭化水素基、水酸基又は式「AgO-」で表される基であり;
X1はそれぞれ独立に水素原子、炭素数1~20の脂肪族炭化水素基、ハロゲン原子、1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはベンジル基、シアノ基、N-フタロイル-3-アミノプロピル基、2-エトキシビニル基、又は一般式「R7O-」、「R7S-」、「R7-C(=O)-」若しくは「R7-C(=O)-O-」で表される基であり;
R7は、炭素数1~10の脂肪族炭化水素基、チエニル基、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはジフェニル基である。)
Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom; R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group; R 2 is an aliphatic having 1 to 20 carbon atoms R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms; R 4 and R 5 are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms; R 6 is An aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”;
X 1 is independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group or benzyl group in which one or more hydrogen atoms may be substituted with a substituent, a cyano group, N -Phthaloyl-3-aminopropyl group, 2-ethoxyvinyl group, or “R 7 O—”, “R 7 S—”, “R 7 —C (═O) —” or “R 7 —C ( ═O) —O— ”;
R 7 is an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group, or a phenyl group or diphenyl group in which one or more hydrogen atoms may be substituted with a substituent. )
(β-ケトカルボン酸銀(1))
β-ケトカルボン酸銀(1)は、前記一般式(1)で表され、結晶子径が15nm以上の金属銀を形成するのに、より好適なものである。
式中、Rは1個以上の水素原子が置換基で置換されていてもよい炭素数1~20の脂肪族炭化水素基若しくはフェニル基、水酸基、アミノ基、又は一般式「R1-CY1 2-」、「CY1 3-」、「R1-CHY1-」、「R2O-」、「R5R4N-」、「(R3O)2CY1-」若しくは「R6-C(=O)-CY1 2-」で表される基である。 (Silver β-ketocarboxylate (1))
The β-ketocarboxylate (1) is more suitable for forming metallic silver represented by the general formula (1) and having a crystallite diameter of 15 nm or more.
In the formula, R is an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a phenyl group, a hydroxyl group, an amino group, or a group represented by the general formula “R 1 -CY 1 ” in which one or more hydrogen atoms may be substituted with a substituent. 2- "," CY 1 3- "," R 1 -CHY 1- "," R 2 O- "," R 5 R 4 N- "," (R 3 O) 2 CY 1- "or" R 6 —C (═O) —CY 1 2 — ”.
β-ケトカルボン酸銀(1)は、前記一般式(1)で表され、結晶子径が15nm以上の金属銀を形成するのに、より好適なものである。
式中、Rは1個以上の水素原子が置換基で置換されていてもよい炭素数1~20の脂肪族炭化水素基若しくはフェニル基、水酸基、アミノ基、又は一般式「R1-CY1 2-」、「CY1 3-」、「R1-CHY1-」、「R2O-」、「R5R4N-」、「(R3O)2CY1-」若しくは「R6-C(=O)-CY1 2-」で表される基である。 (Silver β-ketocarboxylate (1))
The β-ketocarboxylate (1) is more suitable for forming metallic silver represented by the general formula (1) and having a crystallite diameter of 15 nm or more.
In the formula, R is an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a phenyl group, a hydroxyl group, an amino group, or a group represented by the general formula “R 1 -CY 1 ” in which one or more hydrogen atoms may be substituted with a substituent. 2- "," CY 1 3- "," R 1 -CHY 1- "," R 2 O- "," R 5 R 4 N- "," (R 3 O) 2 CY 1- "or" R 6 —C (═O) —CY 1 2 — ”.
Rにおける炭素数1~20の脂肪族炭化水素基は、直鎖状、分岐鎖状及び環状(脂肪族環式基)のいずれでもよく、環状である場合、単環状及び多環状のいずれでもよい。また、前記脂肪族炭化水素基は、飽和脂肪族炭化水素基及び不飽和脂肪族炭化水素基のいずれでもよい。そして、前記脂肪族炭化水素基は、炭素数が1~10であることが好ましく、1~6であることがより好ましい。Rにおける好ましい前記脂肪族炭化水素基としては、アルキル基、アルケニル基、アルキニル基が例示できる。
The aliphatic hydrocarbon group having 1 to 20 carbon atoms in R may be any of linear, branched and cyclic (aliphatic cyclic group), and may be monocyclic or polycyclic when cyclic. . Further, the aliphatic hydrocarbon group may be either a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group. The aliphatic hydrocarbon group preferably has 1 to 10 carbon atoms, and more preferably 1 to 6 carbon atoms. Preferred examples of the aliphatic hydrocarbon group for R include an alkyl group, an alkenyl group, and an alkynyl group.
Rにおける直鎖状又は分枝鎖状の前記アルキル基としては、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基、sec-ブチル基、tert-ブチル基、n-ペンチル基、イソペンチル基、ネオペンチル基、tert-ペンチル基、1-メチルブチル基、2-メチルブチル基、n-ヘキシル基、1-メチルペンチル基、2-メチルペンチル基、3-メチルペンチル基、4-メチルペンチル基、1,1-ジメチルブチル基、2,2-ジメチルブチル基、3,3-ジメチルブチル基、2,3-ジメチルブチル基、1-エチルブチル基、2-エチルブチル基、3-エチルブチル基、1-エチル-1-メチルプロピル基、n-ヘプチル基、1-メチルヘキシル基、2-メチルヘキシル基、3-メチルヘキシル基、4-メチルヘキシル基、5-メチルヘキシル基、1,1-ジメチルペンチル基、2,2-ジメチルペンチル基、2,3-ジメチルペンチル基、2,4-ジメチルペンチル基、3,3-ジメチルペンチル基、4,4-ジメチルペンチル基、1-エチルペンチル基、2-エチルペンチル基、3-エチルペンチル基、4-エチルペンチル基、2,2,3-トリメチルブチル基、1-プロピルブチル基、n-オクチル基、イソオクチル基、1-メチルヘプチル基、2-メチルヘプチル基、3-メチルヘプチル基、4-メチルヘプチル基、5-メチルヘプチル基、1-エチルヘキシル基、2-エチルヘキシル基、3-エチルヘキシル基、4-エチルヘキシル基、5-エチルヘキシル基、1,1-ジメチルヘキシル基、2,2-ジメチルヘキシル基、3,3-ジメチルヘキシル基、4,4-ジメチルヘキシル基、5,5-ジメチルヘキシル基、1-プロピルペンチル基、2-プロピルペンチル基、ノニル基、デシル基、ウンデシル基、ドデシル基、トリデシル基、テトラデシル基、ペンタデシル基、ヘキサデシル基、ヘプタデシル基、オクタデシル基、ノナデシル基、イコシル基が例示できる。
Rにおける環状の前記アルキル基としては、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基、シクロノニル基、シクロデシル基、ノルボルニル基、イソボルニル基、1-アダマンチル基、2-アダマンチル基、トリシクロデシル基が例示できる。 Examples of the linear or branched alkyl group in R include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n -Pentyl group, isopentyl group, neopentyl group, tert-pentyl group, 1-methylbutyl group, 2-methylbutyl group, n-hexyl group, 1-methylpentyl group, 2-methylpentyl group, 3-methylpentyl group, 4- Methylpentyl group, 1,1-dimethylbutyl group, 2,2-dimethylbutyl group, 3,3-dimethylbutyl group, 2,3-dimethylbutyl group, 1-ethylbutyl group, 2-ethylbutyl group, 3-ethylbutyl group 1-ethyl-1-methylpropyl group, n-heptyl group, 1-methylhexyl group, 2-methylhexyl group, 3-methylhexyl group, -Methylhexyl group, 5-methylhexyl group, 1,1-dimethylpentyl group, 2,2-dimethylpentyl group, 2,3-dimethylpentyl group, 2,4-dimethylpentyl group, 3,3-dimethylpentyl group 4,4-dimethylpentyl group, 1-ethylpentyl group, 2-ethylpentyl group, 3-ethylpentyl group, 4-ethylpentyl group, 2,2,3-trimethylbutyl group, 1-propylbutyl group, n -Octyl, isooctyl, 1-methylheptyl, 2-methylheptyl, 3-methylheptyl, 4-methylheptyl, 5-methylheptyl, 1-ethylhexyl, 2-ethylhexyl, 3-ethylhexyl Group, 4-ethylhexyl group, 5-ethylhexyl group, 1,1-dimethylhexyl group, 2,2-dimethylhexyl group, 3, -Dimethylhexyl group, 4,4-dimethylhexyl group, 5,5-dimethylhexyl group, 1-propylpentyl group, 2-propylpentyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group And pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group and icosyl group.
Examples of the cyclic alkyl group in R include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, norbornyl group, isobornyl group, 1-adamantyl group, 2- Examples thereof include an adamantyl group and a tricyclodecyl group.
Rにおける環状の前記アルキル基としては、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基、シクロノニル基、シクロデシル基、ノルボルニル基、イソボルニル基、1-アダマンチル基、2-アダマンチル基、トリシクロデシル基が例示できる。 Examples of the linear or branched alkyl group in R include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n -Pentyl group, isopentyl group, neopentyl group, tert-pentyl group, 1-methylbutyl group, 2-methylbutyl group, n-hexyl group, 1-methylpentyl group, 2-methylpentyl group, 3-methylpentyl group, 4- Methylpentyl group, 1,1-dimethylbutyl group, 2,2-dimethylbutyl group, 3,3-dimethylbutyl group, 2,3-dimethylbutyl group, 1-ethylbutyl group, 2-ethylbutyl group, 3-ethylbutyl group 1-ethyl-1-methylpropyl group, n-heptyl group, 1-methylhexyl group, 2-methylhexyl group, 3-methylhexyl group, -Methylhexyl group, 5-methylhexyl group, 1,1-dimethylpentyl group, 2,2-dimethylpentyl group, 2,3-dimethylpentyl group, 2,4-dimethylpentyl group, 3,3-dimethylpentyl group 4,4-dimethylpentyl group, 1-ethylpentyl group, 2-ethylpentyl group, 3-ethylpentyl group, 4-ethylpentyl group, 2,2,3-trimethylbutyl group, 1-propylbutyl group, n -Octyl, isooctyl, 1-methylheptyl, 2-methylheptyl, 3-methylheptyl, 4-methylheptyl, 5-methylheptyl, 1-ethylhexyl, 2-ethylhexyl, 3-ethylhexyl Group, 4-ethylhexyl group, 5-ethylhexyl group, 1,1-dimethylhexyl group, 2,2-dimethylhexyl group, 3, -Dimethylhexyl group, 4,4-dimethylhexyl group, 5,5-dimethylhexyl group, 1-propylpentyl group, 2-propylpentyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group And pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group and icosyl group.
Examples of the cyclic alkyl group in R include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, norbornyl group, isobornyl group, 1-adamantyl group, 2- Examples thereof include an adamantyl group and a tricyclodecyl group.
Rにおける前記アルケニル基としては、ビニル基(エテニル基、-CH=CH2)、アリル基(2-プロペニル基、-CH2-CH=CH2)、1-プロペニル基(-CH=CH-CH3)、イソプロペニル基(-C(CH3)=CH2)、1-ブテニル基(-CH=CH-CH2-CH3)、2-ブテニル基(-CH2-CH=CH-CH3)、3-ブテニル基(-CH2-CH2-CH=CH2)、シクロヘキセニル基、シクロペンテニル基等の、Rにおける前記アルキル基の炭素原子間の1個の単結合(C-C)が二重結合(C=C)に置換された基が例示できる。
Rにおける前記アルキニル基としては、エチニル基(-C≡CH)、プロパルギル基(-CH2-C≡CH)等の、Rにおける前記アルキル基の炭素原子間の1個の単結合(C-C)が三重結合(C≡C)に置換された基が例示できる。 Examples of the alkenyl group in R include a vinyl group (ethenyl group, —CH═CH 2 ), an allyl group (2-propenyl group, —CH 2 —CH═CH 2 ), and a 1-propenyl group (—CH═CH—CH). 3 ), isopropenyl group (—C (CH 3 ) ═CH 2 ), 1-butenyl group (—CH═CH—CH 2 —CH 3 ), 2-butenyl group (—CH 2 —CH═CH—CH 3) ), 3-butenyl group (—CH 2 —CH 2 —CH═CH 2 ), cyclohexenyl group, cyclopentenyl group and the like, one single bond (C—C) between the carbon atoms of the alkyl group in R Is a group in which is substituted with a double bond (C═C).
As the alkynyl group in R, one single bond (C—C) between carbon atoms of the alkyl group in R, such as ethynyl group (—C≡CH), propargyl group (—CH 2 —C≡CH), etc. ) Is substituted with a triple bond (C≡C).
Rにおける前記アルキニル基としては、エチニル基(-C≡CH)、プロパルギル基(-CH2-C≡CH)等の、Rにおける前記アルキル基の炭素原子間の1個の単結合(C-C)が三重結合(C≡C)に置換された基が例示できる。 Examples of the alkenyl group in R include a vinyl group (ethenyl group, —CH═CH 2 ), an allyl group (2-propenyl group, —CH 2 —CH═CH 2 ), and a 1-propenyl group (—CH═CH—CH). 3 ), isopropenyl group (—C (CH 3 ) ═CH 2 ), 1-butenyl group (—CH═CH—CH 2 —CH 3 ), 2-butenyl group (—CH 2 —CH═CH—CH 3) ), 3-butenyl group (—CH 2 —CH 2 —CH═CH 2 ), cyclohexenyl group, cyclopentenyl group and the like, one single bond (C—C) between the carbon atoms of the alkyl group in R Is a group in which is substituted with a double bond (C═C).
As the alkynyl group in R, one single bond (C—C) between carbon atoms of the alkyl group in R, such as ethynyl group (—C≡CH), propargyl group (—CH 2 —C≡CH), etc. ) Is substituted with a triple bond (C≡C).
Rにおける炭素数1~20の脂肪族炭化水素基は、1個以上の水素原子が置換基で置換されていてもよく、好ましい前記置換基としては、フッ素原子、塩素原子、臭素原子が例示できる。また、置換基の数及び位置は特に限定されない。そして、置換基の数が複数である場合、これら複数個の置換基は互いに同一でも異なっていてもよい。すなわち、すべての置換基が同一であってもよいし、すべての置換基が異なっていてもよく、一部の置換基のみが異なっていてもよい。
In the aliphatic hydrocarbon group having 1 to 20 carbon atoms in R, one or more hydrogen atoms may be substituted with a substituent, and preferred examples of the substituent include a fluorine atom, a chlorine atom, and a bromine atom. . Moreover, the number and position of substituents are not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other. That is, all the substituents may be the same, all the substituents may be different, or only some of the substituents may be different.
Rにおけるフェニル基は、1個以上の水素原子が置換基で置換されていてもよく、好ましい前記置換基としては、炭素数が1~16の飽和又は不飽和の一価の脂肪族炭化水素基、前記脂肪族炭化水素基が酸素原子に結合してなる一価の基、フッ素原子、塩素原子、臭素原子、水酸基(-OH)、シアノ基(-C≡N)、フェノキシ基(-O-C6H5)等が例示でき、置換基の数及び位置は特に限定されない。そして、置換基の数が複数である場合、これら複数個の置換基は互いに同一でも異なっていてもよい。
置換基である前記脂肪族炭化水素基としては、炭素数が1~16である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。 In the phenyl group in R, one or more hydrogen atoms may be substituted with a substituent. Preferred examples of the substituent include a saturated or unsaturated monovalent aliphatic hydrocarbon group having 1 to 16 carbon atoms. A monovalent group formed by bonding the aliphatic hydrocarbon group to an oxygen atom, a fluorine atom, a chlorine atom, a bromine atom, a hydroxyl group (—OH), a cyano group (—C≡N), a phenoxy group (—O—), C 6 H 5 ) and the like can be exemplified, and the number and position of substituents are not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other.
Examples of the aliphatic hydrocarbon group that is a substituent include the same aliphatic hydrocarbon groups as those described above for R except that the number of carbon atoms is 1 to 16.
置換基である前記脂肪族炭化水素基としては、炭素数が1~16である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。 In the phenyl group in R, one or more hydrogen atoms may be substituted with a substituent. Preferred examples of the substituent include a saturated or unsaturated monovalent aliphatic hydrocarbon group having 1 to 16 carbon atoms. A monovalent group formed by bonding the aliphatic hydrocarbon group to an oxygen atom, a fluorine atom, a chlorine atom, a bromine atom, a hydroxyl group (—OH), a cyano group (—C≡N), a phenoxy group (—O—), C 6 H 5 ) and the like can be exemplified, and the number and position of substituents are not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other.
Examples of the aliphatic hydrocarbon group that is a substituent include the same aliphatic hydrocarbon groups as those described above for R except that the number of carbon atoms is 1 to 16.
RにおけるY1は、それぞれ独立にフッ素原子、塩素原子、臭素原子又は水素原子である。そして、一般式「R1-CY1
2-」、「CY1
3-」及び「R6-C(=O)-CY1
2-」においては、それぞれ複数個のY1は、互いに同一でも異なっていてもよい。
Y 1 in R is independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom. In the general formulas “R 1 —CY 1 2 —”, “CY 1 3 —” and “R 6 —C (═O) —CY 1 2 —”, a plurality of Y 1 may be the same as each other. May be different.
RにおけるR1は、炭素数1~19の脂肪族炭化水素基又はフェニル基(C6H5-)であり、R1における前記脂肪族炭化水素基としては、炭素数が1~19である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。
RにおけるR2は、炭素数1~20の脂肪族炭化水素基であり、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。
RにおけるR3は、炭素数1~16の脂肪族炭化水素基であり、炭素数が1~16である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。
RにおけるR4及びR5は、それぞれ独立に炭素数1~18の脂肪族炭化水素基である。すなわち、R4及びR5は、互いに同一でも異なっていてもよく、炭素数が1~18である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。
RにおけるR6は、炭素数1~19の脂肪族炭化水素基、水酸基又は式「AgO-」で表される基であり、R6における前記脂肪族炭化水素基としては、炭素数が1~19である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。 R 1 in R is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group (C 6 H 5 —), and the aliphatic hydrocarbon group in R 1 has 1 to 19 carbon atoms. Except for this point, the same aliphatic hydrocarbon groups as those in R can be exemplified.
R 2 in R is an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and examples thereof are the same as the aliphatic hydrocarbon group in R.
R 3 in R is an aliphatic hydrocarbon group having 1 to 16 carbon atoms, and examples thereof are the same as the aliphatic hydrocarbon group in R except that the carbon number is 1 to 16.
R 4 and R 5 in R are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms. That is, R 4 and R 5 may be the same as or different from each other, and examples thereof are the same as the aliphatic hydrocarbon group for R except that the number of carbon atoms is 1 to 18.
R 6 in R is an aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”. The aliphatic hydrocarbon group in R 6 has 1 to Except for being 19, the same aliphatic hydrocarbon groups as those described above for R can be exemplified.
RにおけるR2は、炭素数1~20の脂肪族炭化水素基であり、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。
RにおけるR3は、炭素数1~16の脂肪族炭化水素基であり、炭素数が1~16である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。
RにおけるR4及びR5は、それぞれ独立に炭素数1~18の脂肪族炭化水素基である。すなわち、R4及びR5は、互いに同一でも異なっていてもよく、炭素数が1~18である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。
RにおけるR6は、炭素数1~19の脂肪族炭化水素基、水酸基又は式「AgO-」で表される基であり、R6における前記脂肪族炭化水素基としては、炭素数が1~19である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。 R 1 in R is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group (C 6 H 5 —), and the aliphatic hydrocarbon group in R 1 has 1 to 19 carbon atoms. Except for this point, the same aliphatic hydrocarbon groups as those in R can be exemplified.
R 2 in R is an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and examples thereof are the same as the aliphatic hydrocarbon group in R.
R 3 in R is an aliphatic hydrocarbon group having 1 to 16 carbon atoms, and examples thereof are the same as the aliphatic hydrocarbon group in R except that the carbon number is 1 to 16.
R 4 and R 5 in R are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms. That is, R 4 and R 5 may be the same as or different from each other, and examples thereof are the same as the aliphatic hydrocarbon group for R except that the number of carbon atoms is 1 to 18.
R 6 in R is an aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”. The aliphatic hydrocarbon group in R 6 has 1 to Except for being 19, the same aliphatic hydrocarbon groups as those described above for R can be exemplified.
Rは、上記の中でも、直鎖状若しくは分枝鎖状のアルキル基、一般式「R6-C(=O)-CY1
2-」で表される基、水酸基又はフェニル基であることが好ましい。そして、R6は、直鎖状若しくは分枝鎖状のアルキル基、水酸基又は式「AgO-」で表される基であることが好ましい。
Among them, R is a linear or branched alkyl group, a group represented by the general formula “R 6 —C (═O) —CY 1 2 —”, a hydroxyl group, or a phenyl group. preferable. R 6 is preferably a linear or branched alkyl group, a hydroxyl group, or a group represented by the formula “AgO—”.
一般式(1)において、X1はそれぞれ独立に水素原子、炭素数1~20の脂肪族炭化水素基、ハロゲン原子、1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはベンジル基(C6H5-CH2-)、シアノ基、N-フタロイル-3-アミノプロピル基、2-エトキシビニル基(C2H5-O-CH=CH-)、又は一般式「R7O-」、「R7S-」、「R7-C(=O)-」若しくは「R7-C(=O)-O-」で表される基である。
X1における炭素数1~20の脂肪族炭化水素基としては、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。 In the general formula (1), each X 1 independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group in which one or more hydrogen atoms may be substituted with a substituent, or A benzyl group (C 6 H 5 —CH 2 —), a cyano group, an N-phthaloyl-3-aminopropyl group, a 2-ethoxyvinyl group (C 2 H 5 —O—CH═CH—), or the general formula “R 7 O— ”,“ R 7 S— ”,“ R 7 —C (═O) — ”or“ R 7 —C (═O) —O— ”.
Examples of the aliphatic hydrocarbon group having 1 to 20 carbon atoms in X 1 include those similar to the aliphatic hydrocarbon group in R.
X1における炭素数1~20の脂肪族炭化水素基としては、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。 In the general formula (1), each X 1 independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group in which one or more hydrogen atoms may be substituted with a substituent, or A benzyl group (C 6 H 5 —CH 2 —), a cyano group, an N-phthaloyl-3-aminopropyl group, a 2-ethoxyvinyl group (C 2 H 5 —O—CH═CH—), or the general formula “R 7 O— ”,“ R 7 S— ”,“ R 7 —C (═O) — ”or“ R 7 —C (═O) —O— ”.
Examples of the aliphatic hydrocarbon group having 1 to 20 carbon atoms in X 1 include those similar to the aliphatic hydrocarbon group in R.
X1におけるハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が例示できる。
X1におけるフェニル基及びベンジル基は、1個以上の水素原子が置換基で置換されていてもよく、好ましい前記置換基としては、ハロゲン原子(フッ素原子、塩素原子、臭素原子、ヨウ素原子)、ニトロ基(-NO2)等が例示でき、置換基の数及び位置は特に限定されない。そして、置換基の数が複数である場合、これら複数個の置換基は互いに同一でも異なっていてもよい。 Examples of the halogen atom in X 1 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
In the phenyl group and benzyl group in X 1 , one or more hydrogen atoms may be substituted with a substituent. Preferred examples of the substituent include a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, an iodine atom), A nitro group (—NO 2 ) and the like can be exemplified, and the number and position of substituents are not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other.
X1におけるフェニル基及びベンジル基は、1個以上の水素原子が置換基で置換されていてもよく、好ましい前記置換基としては、ハロゲン原子(フッ素原子、塩素原子、臭素原子、ヨウ素原子)、ニトロ基(-NO2)等が例示でき、置換基の数及び位置は特に限定されない。そして、置換基の数が複数である場合、これら複数個の置換基は互いに同一でも異なっていてもよい。 Examples of the halogen atom in X 1 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
In the phenyl group and benzyl group in X 1 , one or more hydrogen atoms may be substituted with a substituent. Preferred examples of the substituent include a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, an iodine atom), A nitro group (—NO 2 ) and the like can be exemplified, and the number and position of substituents are not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other.
X1におけるR7は、炭素数1~10の脂肪族炭化水素基、チエニル基(C4H3S-)、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはジフェニル基(ビフェニル基、C6H5-C6H4-)である。R7における前記脂肪族炭化水素基としては、炭素数が1~10である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。また、R7におけるフェニル基及びジフェニル基の前記置換基としては、ハロゲン原子(フッ素原子、塩素原子、臭素原子、ヨウ素原子)等が例示でき、置換基の数及び位置は特に限定されない。そして、置換基の数が複数である場合、これら複数個の置換基は互いに同一でも異なっていてもよい。
R7がチエニル基又はジフェニル基である場合、これらの、X1において隣接する基又は原子(酸素原子、硫黄原子、カルボニル基、カルボニルオキシ基)との結合位置は、特に限定されない。例えば、チエニル基は、2-チエニル基及び3-チエニル基のいずれでもよい。 R 7 in X 1 represents an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group (C 4 H 3 S—), a phenyl group in which one or more hydrogen atoms may be substituted with a substituent, or A diphenyl group (biphenyl group, C 6 H 5 —C 6 H 4 —); Examples of the aliphatic hydrocarbon group for R 7 include those similar to the aliphatic hydrocarbon group for R except that the aliphatic hydrocarbon group has 1 to 10 carbon atoms. Further, examples of the substituent of the phenyl group and a diphenyl group in R 7, halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom) can be exemplified the like, the number and position of the substituent is not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other.
When R 7 is a thienyl group or a diphenyl group, there are no particular limitations on the bonding position of these groups with an adjacent group or atom (oxygen atom, sulfur atom, carbonyl group, carbonyloxy group) in X 1 . For example, the thienyl group may be either a 2-thienyl group or a 3-thienyl group.
R7がチエニル基又はジフェニル基である場合、これらの、X1において隣接する基又は原子(酸素原子、硫黄原子、カルボニル基、カルボニルオキシ基)との結合位置は、特に限定されない。例えば、チエニル基は、2-チエニル基及び3-チエニル基のいずれでもよい。 R 7 in X 1 represents an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group (C 4 H 3 S—), a phenyl group in which one or more hydrogen atoms may be substituted with a substituent, or A diphenyl group (biphenyl group, C 6 H 5 —C 6 H 4 —); Examples of the aliphatic hydrocarbon group for R 7 include those similar to the aliphatic hydrocarbon group for R except that the aliphatic hydrocarbon group has 1 to 10 carbon atoms. Further, examples of the substituent of the phenyl group and a diphenyl group in R 7, halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom) can be exemplified the like, the number and position of the substituent is not particularly limited. When the number of substituents is plural, the plural substituents may be the same as or different from each other.
When R 7 is a thienyl group or a diphenyl group, there are no particular limitations on the bonding position of these groups with an adjacent group or atom (oxygen atom, sulfur atom, carbonyl group, carbonyloxy group) in X 1 . For example, the thienyl group may be either a 2-thienyl group or a 3-thienyl group.
一般式(1)において、2個のX1は、2個のカルボニル基で挟まれた炭素原子と二重結合を介して1個の基として結合していてもよく、このようなものとしては式「=CH-C6H4-NO2」で表される基が例示できる。
In the general formula (1), two X 1 s may be bonded as one group through a double bond with a carbon atom sandwiched between two carbonyl groups. Examples thereof include a group represented by the formula “═CH—C 6 H 4 —NO 2 ”.
X1は、上記の中でも、水素原子、直鎖状若しくは分枝鎖状のアルキル基、ベンジル基、又は一般式「R7-C(=O)-」で表される基であることが好ましく、少なくとも一方のX1が水素原子であることが好ましい。
X 1 is preferably a hydrogen atom, a linear or branched alkyl group, a benzyl group, or a group represented by the general formula “R 7 —C (═O) —” among the above. It is preferable that at least one X 1 is a hydrogen atom.
β-ケトカルボン酸銀(1)は、2-メチルアセト酢酸銀(CH3-C(=O)-CH(CH3)-C(=O)-OAg)、アセト酢酸銀(CH3-C(=O)-CH2-C(=O)-OAg)、2-エチルアセト酢酸銀(CH3-C(=O)-CH(CH2CH3)-C(=O)-OAg)、プロピオニル酢酸銀(CH3CH2-C(=O)-CH2-C(=O)-OAg)、イソブチリル酢酸銀((CH3)2CH-C(=O)-CH2-C(=O)-OAg)、ピバロイル酢酸銀((CH3)3C-C(=O)-CH2-C(=O)-OAg)、カプロイル酢酸銀(CH3(CH2)3CH2-C(=O)-CH2-C(=O)-OAg)、2-n-ブチルアセト酢酸銀(CH3-C(=O)-CH(CH2CH2CH2CH3)-C(=O)-OAg)、2-ベンジルアセト酢酸銀(CH3-C(=O)-CH(CH2C6H5)-C(=O)-OAg)、ベンゾイル酢酸銀(C6H5-C(=O)-CH2-C(=O)-OAg)、ピバロイルアセト酢酸銀((CH3)3C-C(=O)-CH2-C(=O)-CH2-C(=O)-OAg)、イソブチリルアセト酢酸銀((CH3)2CH-C(=O)-CH2-C(=O)-CH2-C(=O)-OAg)、2-アセチルピバロイル酢酸銀((CH3)3C-C(=O)-CH(-C(=O)-CH3)-C(=O)-OAg)、2-アセチルイソブチリル酢酸銀((CH3)2CH-C(=O)-CH(-C(=O)-CH3)-C(=O)-OAg)、又はアセトンジカルボン酸銀(AgO-C(=O)-CH2-C(=O)-CH2-C(=O)-OAg)であることが好ましい。
Silver β-ketocarboxylate (1) is silver 2-methylacetoacetate (CH 3 —C (═O) —CH (CH 3 ) —C (═O) —OAg), silver acetoacetate (CH 3 —C (= O) —CH 2 —C (═O) —OAg), silver 2-ethylacetoacetate (CH 3 —C (═O) —CH (CH 2 CH 3 ) —C (═O) —OAg), silver propionyl acetate (CH 3 CH 2 —C (═O) —CH 2 —C (═O) —OAg), silver isobutyryl acetate ((CH 3 ) 2 CH—C (═O) —CH 2 —C (═O) — OAg), silver pivaloyl acetate ((CH 3 ) 3 C—C (═O) —CH 2 —C (═O) —OAg), silver caproyl acetate (CH 3 (CH 2 ) 3 CH 2 —C (═O ) —CH 2 —C (═O) —OAg), 2-n-butylacetoacetate silver (CH 3 —C (═O) —CH (C H 2 CH 2 CH 2 CH 3 ) —C (═O) —OAg), silver 2-benzylacetoacetate (CH 3 —C (═O) —CH (CH 2 C 6 H 5 ) —C (═O) —OAg), silver benzoyl acetate (C 6 H 5 —C (═O) —CH 2 —C (═O) —OAg), silver pivaloyl acetoacetate ((CH 3 ) 3 C—C (═O) —CH 2 —C (═O) —CH 2 —C (═O) —OAg), silver isobutyrylacetoacetate ((CH 3 ) 2 CH—C (═O) —CH 2 —C (═O) —CH 2 -C (= O) -OAg), silver 2-acetylpivaloyl acetate ((CH 3 ) 3 CC (= O) -CH (-C (= O) -CH 3 ) -C (= O) -OAg), 2- acetyl isobutyryl silver acetate ((CH 3) 2 CH- C (= O) -CH (-C (= O) -CH 3) -C (= O) - Ag), or is preferably acetone dicarboxylic silver (AgO-C (= O) -CH 2 -C (= O) -CH 2 -C (= O) -OAg).
β-ケトカルボン酸銀(1)は、乾燥処理や加熱(焼成)処理等の固化処理により形成された導電体(金属銀)において、残存する原料や不純物の濃度をより低減できる。原料や不純物が少ない程、例えば、形成された金属銀同士の接触が良好となり、導通が容易となり、抵抗率が低下する。
Β-ketocarboxylate (1) can further reduce the concentration of the remaining raw materials and impurities in the conductor (metal silver) formed by solidification treatment such as drying treatment or heating (firing) treatment. The smaller the raw materials and impurities, for example, the better the contact between the formed metal silvers, the easier the conduction, and the lower the resistivity.
β-ケトカルボン酸銀(1)は、後述するように、当該分野で公知の還元剤等を使用しなくても、好ましくは60~210℃、より好ましくは60~200℃という低温で分解し、金属銀を形成することが可能である。そして、還元剤と併用することで、より低温で分解して金属銀を形成する。還元剤については後ほど説明する。
The β-ketocarboxylate (1) is decomposed at a low temperature of preferably 60 to 210 ° C., more preferably 60 to 200 ° C. without using a reducing agent known in the art, as will be described later. It is possible to form metallic silver. And by using together with a reducing agent, it decomposes at a lower temperature to form metallic silver. The reducing agent will be described later.
本発明において、β-ケトカルボン酸銀(1)は、一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。
In the present invention, silver β-ketocarboxylate (1) may be used alone or in combination of two or more. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
(カルボン酸銀(4))
カルボン酸銀(4)は、前記一般式(4)で表され、結晶子径が15nm以上の金属銀を形成するのに、より好適なものである。
式中、R8は炭素数1~19の脂肪族炭化水素基、カルボキシ基(-COOH)又は式「-C(=O)-OAg」で表される基である。
R8における前記脂肪族炭化水素基としては、炭素数が1~19である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。ただし、R8における前記脂肪族炭化水素基は、炭素数が1~15であることが好ましく、1~10であることがより好ましい。 (Silver carboxylate (4))
The silver carboxylate (4) is represented by the general formula (4) and is more suitable for forming metallic silver having a crystallite diameter of 15 nm or more.
In the formula, R 8 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms, a carboxy group (—COOH), or a group represented by the formula “—C (═O) —OAg”.
Examples of the aliphatic hydrocarbon group for R 8 include those similar to the aliphatic hydrocarbon group for R except that the aliphatic hydrocarbon group has 1 to 19 carbon atoms. However, the aliphatic hydrocarbon group for R 8 preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms.
カルボン酸銀(4)は、前記一般式(4)で表され、結晶子径が15nm以上の金属銀を形成するのに、より好適なものである。
式中、R8は炭素数1~19の脂肪族炭化水素基、カルボキシ基(-COOH)又は式「-C(=O)-OAg」で表される基である。
R8における前記脂肪族炭化水素基としては、炭素数が1~19である点以外は、Rにおける前記脂肪族炭化水素基と同様のものが例示できる。ただし、R8における前記脂肪族炭化水素基は、炭素数が1~15であることが好ましく、1~10であることがより好ましい。 (Silver carboxylate (4))
The silver carboxylate (4) is represented by the general formula (4) and is more suitable for forming metallic silver having a crystallite diameter of 15 nm or more.
In the formula, R 8 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms, a carboxy group (—COOH), or a group represented by the formula “—C (═O) —OAg”.
Examples of the aliphatic hydrocarbon group for R 8 include those similar to the aliphatic hydrocarbon group for R except that the aliphatic hydrocarbon group has 1 to 19 carbon atoms. However, the aliphatic hydrocarbon group for R 8 preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms.
R8における前記脂肪族炭化水素基がメチレン基(-CH2-)を有する場合、1個以上の前記メチレン基はカルボニル基で置換されていてもよい。カルボニル基で置換されていてもよいメチレン基の数及び位置は特に限定されず、すべてのメチレン基がカルボニル基で置換されていてもよい。ここで「メチレン基」とは、単独の式「-CH2-」で表される基だけでなく、式「-CH2-」で表される基が複数個連なったアルキレン基中の1個の式「-CH2-」で表される基も含むものとする。
When the aliphatic hydrocarbon group for R 8 has a methylene group (—CH 2 —), one or more of the methylene groups may be substituted with a carbonyl group. The number and position of the methylene groups that may be substituted with a carbonyl group are not particularly limited, and all methylene groups may be substituted with a carbonyl group. Here, the “methylene group” is not only a single group represented by the formula “—CH 2 —” but also one of alkylene groups in which a plurality of groups represented by the formula “—CH 2 —” are linked. And a group represented by the formula “—CH 2 —”.
カルボン酸銀(4)は、ピルビン酸銀(CH3-C(=O)-C(=O)-OAg)、酢酸銀(CH3-C(=O)-OAg)、酪酸銀(CH3-(CH2)2-C(=O)-OAg)、イソ酪酸銀((CH3)2CH-C(=O)-OAg)、2-エチルへキサン酸銀(CH3-(CH2)3-CH(CH2CH3)-C(=O)-OAg)、ネオデカン酸銀(CH3-(CH2)5-C(CH3)2-C(=O)-OAg)、シュウ酸銀(AgO-C(=O)-C(=O)-OAg)、又はマロン酸銀(AgO-C(=O)-CH2-C(=O)-OAg)であることが好ましい。また、上記のシュウ酸銀(AgO-C(=O)-C(=O)-OAg)及びマロン酸銀(AgO-C(=O)-CH2-C(=O)-OAg)の2個の式「-COOAg」で表される基のうち、1個が式「-COOH」で表される基となったもの(HO-C(=O)-C(=O)-OAg、HO-C(=O)-CH2-C(=O)-OAg)も好ましい。
Silver carboxylate (4) includes silver pyruvate (CH 3 —C (═O) —C (═O) —OAg), silver acetate (CH 3 —C (═O) —OAg), silver butyrate (CH 3 — (CH 2 ) 2 —C (═O) —OAg), silver isobutyrate ((CH 3 ) 2 CH—C (═O) —OAg), silver 2-ethylhexanoate (CH 3 — (CH 2 ) 3 —CH (CH 2 CH 3 ) —C (═O) —OAg), silver neodecanoate (CH 3 — (CH 2 ) 5 —C (CH 3 ) 2 —C (═O) —OAg), Shu It is preferably silver oxide (AgO—C (═O) —C (═O) —OAg) or silver malonate (AgO—C (═O) —CH 2 —C (═O) —OAg). Further, silver oxalate (AgO—C (═O) —C (═O) —OAg) and silver malonate (AgO—C (═O) —CH 2 —C (═O) —OAg) Of the groups represented by the formula “—COOAg”, one of the groups represented by the formula “—COOH” (HO—C (═O) —C (═O) —OAg, HO) Also preferred is —C (═O) —CH 2 —C (═O) —OAg).
カルボン酸銀(4)も、β-ケトカルボン酸銀(1)と同様に、乾燥処理や加熱(焼成)処理等の固化処理により形成された導電体(金属銀)において、残存する原料や不純物の濃度をより低減できる。そして、還元剤と併用することで、より低温で分解して金属銀を形成する。
Similarly to the β-ketocarboxylate silver (1), silver carboxylate (4) is also used in the conductor (metal silver) formed by solidification treatment such as drying treatment or heating (firing) treatment. The concentration can be further reduced. And by using together with a reducing agent, it decomposes at a lower temperature to form metallic silver.
本発明において、カルボン酸銀(4)は、一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。
In the present invention, the silver carboxylate (4) may be used alone or in combination of two or more. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
前記カルボン酸銀は、2-メチルアセト酢酸銀、アセト酢酸銀、2-エチルアセト酢酸銀、プロピオニル酢酸銀、イソブチリル酢酸銀、ピバロイル酢酸銀、カプロイル酢酸銀、2-n-ブチルアセト酢酸銀、2-ベンジルアセト酢酸銀、ベンゾイル酢酸銀、ピバロイルアセト酢酸銀、イソブチリルアセト酢酸銀、アセトンジカルボン酸銀、ピルビン酸銀、酢酸銀、酪酸銀、イソ酪酸銀、2-エチルへキサン酸銀、ネオデカン酸銀、シュウ酸銀及びマロン酸銀からなる群から選択される一種以上であることが好ましい。
そして、これらカルボン酸銀の中でも、2-メチルアセト酢酸銀及びアセト酢酸銀は、後述する含窒素化合物(なかでもアミン化合物)との相溶性に優れ、銀インク組成物の高濃度化に、特に適したものとして挙げられる。 The silver carboxylate is silver 2-methylacetoacetate, silver acetoacetate, silver 2-ethylacetoacetate, silver propionylacetate, silver isobutyrylacetate, silver pivaloylacetate, silver caproylacetate, silver 2-n-butylacetoacetate, 2-benzylacetoacetate Silver acetate, silver benzoyl acetate, silver pivaloyl acetoacetate, silver isobutyryl acetoacetate, silver acetone dicarboxylate, silver pyruvate, silver acetate, silver butyrate, silver isobutyrate, silver 2-ethylhexanoate, silver neodecanoate, silver It is preferably at least one selected from the group consisting of silver oxide and silver malonate.
Among these silver carboxylates, silver 2-methylacetoacetate and silver acetoacetate are excellent in compatibility with a nitrogen-containing compound (particularly an amine compound) described later, and are particularly suitable for increasing the concentration of silver ink compositions. It is mentioned as a thing.
そして、これらカルボン酸銀の中でも、2-メチルアセト酢酸銀及びアセト酢酸銀は、後述する含窒素化合物(なかでもアミン化合物)との相溶性に優れ、銀インク組成物の高濃度化に、特に適したものとして挙げられる。 The silver carboxylate is silver 2-methylacetoacetate, silver acetoacetate, silver 2-ethylacetoacetate, silver propionylacetate, silver isobutyrylacetate, silver pivaloylacetate, silver caproylacetate, silver 2-n-butylacetoacetate, 2-benzylacetoacetate Silver acetate, silver benzoyl acetate, silver pivaloyl acetoacetate, silver isobutyryl acetoacetate, silver acetone dicarboxylate, silver pyruvate, silver acetate, silver butyrate, silver isobutyrate, silver 2-ethylhexanoate, silver neodecanoate, silver It is preferably at least one selected from the group consisting of silver oxide and silver malonate.
Among these silver carboxylates, silver 2-methylacetoacetate and silver acetoacetate are excellent in compatibility with a nitrogen-containing compound (particularly an amine compound) described later, and are particularly suitable for increasing the concentration of silver ink compositions. It is mentioned as a thing.
銀インク組成物において、前記金属銀の形成材料に由来する銀の含有量は、5質量%以上であることが好ましく、10質量%以上であることがより好ましい。このような範囲であることで、形成された導電体(金属銀)は品質により優れたものとなる。前記銀の含有量の上限値は、本発明の効果を損なわない限り特に限定されないが、取り扱い性等を考慮すると25質量%であることが好ましい。
なお、本明細書において、「金属銀の形成材料に由来する銀」とは、特に断りの無い限り、銀インク組成物の製造時に配合された前記金属銀の形成材料中の銀を意味し、配合後に引き続き金属銀の形成材料を構成している銀と、配合後に金属銀の形成材料が分解して生じた分解物中の銀及び銀自体と、の両方を含む概念とする。 In the silver ink composition, the content of silver derived from the metal silver forming material is preferably 5% by mass or more, and more preferably 10% by mass or more. By being in such a range, the formed conductor (metal silver) becomes superior in quality. The upper limit of the silver content is not particularly limited as long as the effects of the present invention are not impaired, but it is preferably 25% by mass in consideration of handling properties and the like.
In the present specification, “silver derived from a metallic silver forming material” means silver in the metallic silver forming material blended during the production of the silver ink composition, unless otherwise specified. It is a concept that includes both silver constituting the metal silver forming material after blending, and silver and silver itself in the decomposition product generated by decomposition of the metal silver forming material after blending.
なお、本明細書において、「金属銀の形成材料に由来する銀」とは、特に断りの無い限り、銀インク組成物の製造時に配合された前記金属銀の形成材料中の銀を意味し、配合後に引き続き金属銀の形成材料を構成している銀と、配合後に金属銀の形成材料が分解して生じた分解物中の銀及び銀自体と、の両方を含む概念とする。 In the silver ink composition, the content of silver derived from the metal silver forming material is preferably 5% by mass or more, and more preferably 10% by mass or more. By being in such a range, the formed conductor (metal silver) becomes superior in quality. The upper limit of the silver content is not particularly limited as long as the effects of the present invention are not impaired, but it is preferably 25% by mass in consideration of handling properties and the like.
In the present specification, “silver derived from a metallic silver forming material” means silver in the metallic silver forming material blended during the production of the silver ink composition, unless otherwise specified. It is a concept that includes both silver constituting the metal silver forming material after blending, and silver and silver itself in the decomposition product generated by decomposition of the metal silver forming material after blending.
[含窒素化合物]
銀インク組成物は、特に前記金属銀の形成材料が前記カルボン酸銀である場合、前記金属銀の形成材料以外に、さらに含窒素化合物が配合されてなるものが好ましい。前記含窒素化合物は、結晶子径が15nm以上の金属銀を形成するために、使用することが好ましいものである。
前記含窒素化合物は、炭素数25以下のアミン化合物(以下、「アミン化合物」と略記することがある)、炭素数25以下の第4級アンモニウム塩(以下、「第4級アンモニウム塩」と略記することがある)、アンモニア、炭素数25以下のアミン化合物が酸と反応してなるアンモニウム塩(以下、「アミン化合物由来のアンモニウム塩」と略記することがある)、及びアンモニアが酸と反応してなるアンモニウム塩(以下、「アンモニア由来のアンモニウム塩」と略記することがある)からなる群から選択される一種以上のものである。すなわち、配合される含窒素化合物は、一種のみでよいし、二種以上でもよく、二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。 [Nitrogen-containing compounds]
The silver ink composition is preferably one in which a nitrogen-containing compound is further blended in addition to the metal silver forming material, particularly when the metal silver forming material is the silver carboxylate. The nitrogen-containing compound is preferably used in order to form metallic silver having a crystallite diameter of 15 nm or more.
The nitrogen-containing compound is an amine compound having 25 or less carbon atoms (hereinafter sometimes abbreviated as “amine compound”), a quaternary ammonium salt having 25 or less carbon atoms (hereinafter abbreviated as “quaternary ammonium salt”). Ammonia, an ammonium salt formed by reacting an amine compound having 25 or less carbon atoms with an acid (hereinafter sometimes abbreviated as “ammonium salt derived from an amine compound”), and ammonia reacting with an acid. One or more selected from the group consisting of ammonium salts (hereinafter sometimes abbreviated as “ammonium salts derived from ammonia”). That is, the nitrogen-containing compound to be blended may be only one kind, or two or more kinds. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
銀インク組成物は、特に前記金属銀の形成材料が前記カルボン酸銀である場合、前記金属銀の形成材料以外に、さらに含窒素化合物が配合されてなるものが好ましい。前記含窒素化合物は、結晶子径が15nm以上の金属銀を形成するために、使用することが好ましいものである。
前記含窒素化合物は、炭素数25以下のアミン化合物(以下、「アミン化合物」と略記することがある)、炭素数25以下の第4級アンモニウム塩(以下、「第4級アンモニウム塩」と略記することがある)、アンモニア、炭素数25以下のアミン化合物が酸と反応してなるアンモニウム塩(以下、「アミン化合物由来のアンモニウム塩」と略記することがある)、及びアンモニアが酸と反応してなるアンモニウム塩(以下、「アンモニア由来のアンモニウム塩」と略記することがある)からなる群から選択される一種以上のものである。すなわち、配合される含窒素化合物は、一種のみでよいし、二種以上でもよく、二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。 [Nitrogen-containing compounds]
The silver ink composition is preferably one in which a nitrogen-containing compound is further blended in addition to the metal silver forming material, particularly when the metal silver forming material is the silver carboxylate. The nitrogen-containing compound is preferably used in order to form metallic silver having a crystallite diameter of 15 nm or more.
The nitrogen-containing compound is an amine compound having 25 or less carbon atoms (hereinafter sometimes abbreviated as “amine compound”), a quaternary ammonium salt having 25 or less carbon atoms (hereinafter abbreviated as “quaternary ammonium salt”). Ammonia, an ammonium salt formed by reacting an amine compound having 25 or less carbon atoms with an acid (hereinafter sometimes abbreviated as “ammonium salt derived from an amine compound”), and ammonia reacting with an acid. One or more selected from the group consisting of ammonium salts (hereinafter sometimes abbreviated as “ammonium salts derived from ammonia”). That is, the nitrogen-containing compound to be blended may be only one kind, or two or more kinds. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
(アミン化合物、第4級アンモニウム塩)
前記アミン化合物は、炭素数が1~25であり、第1級アミン、第2級アミン及び第3級アミンのいずれでもよい。また、前記第4級アンモニウム塩は、炭素数が4~25である。前記アミン化合物及び第4級アンモニウム塩は、鎖状及び環状のいずれでもよい。また、アミン部位又はアンモニウム塩部位を構成する窒素原子(例えば、第1級アミンのアミノ基(-NH2)を構成する窒素原子)の数は1個でもよいし、2個以上でもよい。 (Amine compound, quaternary ammonium salt)
The amine compound has 1 to 25 carbon atoms, and may be any of primary amine, secondary amine, and tertiary amine. The quaternary ammonium salt has 4 to 25 carbon atoms. The amine compound and the quaternary ammonium salt may be either chain or cyclic. Further, the number of nitrogen atoms constituting the amine moiety or ammonium salt moiety (for example, the nitrogen atom constituting the amino group (—NH 2 ) of the primary amine) may be one, or two or more.
前記アミン化合物は、炭素数が1~25であり、第1級アミン、第2級アミン及び第3級アミンのいずれでもよい。また、前記第4級アンモニウム塩は、炭素数が4~25である。前記アミン化合物及び第4級アンモニウム塩は、鎖状及び環状のいずれでもよい。また、アミン部位又はアンモニウム塩部位を構成する窒素原子(例えば、第1級アミンのアミノ基(-NH2)を構成する窒素原子)の数は1個でもよいし、2個以上でもよい。 (Amine compound, quaternary ammonium salt)
The amine compound has 1 to 25 carbon atoms, and may be any of primary amine, secondary amine, and tertiary amine. The quaternary ammonium salt has 4 to 25 carbon atoms. The amine compound and the quaternary ammonium salt may be either chain or cyclic. Further, the number of nitrogen atoms constituting the amine moiety or ammonium salt moiety (for example, the nitrogen atom constituting the amino group (—NH 2 ) of the primary amine) may be one, or two or more.
前記第1級アミンとしては、1個以上の水素原子が置換基で置換されていてもよいモノアルキルアミン、モノアリールアミン、モノ(ヘテロアリール)アミン、ジアミン等が例示できる。
Examples of the primary amine include monoalkylamines, monoarylamines, mono (heteroaryl) amines, and diamines in which one or more hydrogen atoms may be substituted with a substituent.
前記モノアルキルアミンを構成するアルキル基は、直鎖状、分岐鎖状及び環状のいずれでもよく、Rにおける前記アルキル基と同様のものが例示でき、炭素数が1~19の直鎖状若しくは分岐鎖状のアルキル基、又は炭素数が3~7の環状のアルキル基であることが好ましい。
好ましい前記モノアルキルアミンとして、具体的には、n-ブチルアミン、n-へキシルアミン、n-オクチルアミン、n-ドデシルアミン、n-オクタデシルアミン、sec-ブチルアミン、tert-ブチルアミン、3-アミノペンタン、3-メチルブチルアミン、2-ヘプチルアミン(2-アミノヘプタン)、2-アミノオクタン、2-エチルヘキシルアミン、1,2-ジメチル-n-プロピルアミンが例示できる。 The alkyl group constituting the monoalkylamine may be linear, branched or cyclic, and examples thereof are the same as the alkyl group in R, and are linear or branched having 1 to 19 carbon atoms. It is preferably a chain alkyl group or a cyclic alkyl group having 3 to 7 carbon atoms.
Preferred examples of the monoalkylamine include n-butylamine, n-hexylamine, n-octylamine, n-dodecylamine, n-octadecylamine, sec-butylamine, tert-butylamine, 3-aminopentane, 3 Examples include -methylbutylamine, 2-heptylamine (2-aminoheptane), 2-aminooctane, 2-ethylhexylamine, and 1,2-dimethyl-n-propylamine.
好ましい前記モノアルキルアミンとして、具体的には、n-ブチルアミン、n-へキシルアミン、n-オクチルアミン、n-ドデシルアミン、n-オクタデシルアミン、sec-ブチルアミン、tert-ブチルアミン、3-アミノペンタン、3-メチルブチルアミン、2-ヘプチルアミン(2-アミノヘプタン)、2-アミノオクタン、2-エチルヘキシルアミン、1,2-ジメチル-n-プロピルアミンが例示できる。 The alkyl group constituting the monoalkylamine may be linear, branched or cyclic, and examples thereof are the same as the alkyl group in R, and are linear or branched having 1 to 19 carbon atoms. It is preferably a chain alkyl group or a cyclic alkyl group having 3 to 7 carbon atoms.
Preferred examples of the monoalkylamine include n-butylamine, n-hexylamine, n-octylamine, n-dodecylamine, n-octadecylamine, sec-butylamine, tert-butylamine, 3-aminopentane, 3 Examples include -methylbutylamine, 2-heptylamine (2-aminoheptane), 2-aminooctane, 2-ethylhexylamine, and 1,2-dimethyl-n-propylamine.
前記モノアリールアミンを構成するアリール基としては、フェニル基、1-ナフチル基、2-ナフチル基等が例示でき、炭素数が6~10であることが好ましい。
Examples of the aryl group constituting the monoarylamine include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, and the like, and preferably has 6 to 10 carbon atoms.
前記モノ(ヘテロアリール)アミンを構成するヘテロアリール基は、芳香族環骨格を構成する原子として、ヘテロ原子を有するものであり、前記ヘテロ原子としては、窒素原子、硫黄原子、酸素原子、ホウ素原子が例示できる。また、芳香族環骨格を構成する前記へテロ原子の数は特に限定されず、1個でもよいし、2個以上でもよい。2個以上である場合、これらへテロ原子は互いに同一でも異なっていてもよい。すなわち、これらへテロ原子は、すべて同じでもよいし、すべて異なっていてもよく、一部だけ異なっていてもよい。
前記ヘテロアリール基は、単環状及び多環状のいずれでもよく、その環員数(環骨格を構成する原子の数)も特に限定されないが、3~12員環であることが好ましい。 The heteroaryl group constituting the mono (heteroaryl) amine has a heteroatom as an atom constituting the aromatic ring skeleton, and the heteroatom includes a nitrogen atom, a sulfur atom, an oxygen atom, and a boron atom. Can be illustrated. Moreover, the number of the said hetero atom which comprises an aromatic ring skeleton is not specifically limited, One may be sufficient and two or more may be sufficient. When there are two or more, these heteroatoms may be the same or different from each other. That is, these heteroatoms may all be the same, may all be different, or may be partially different.
The heteroaryl group may be either monocyclic or polycyclic, and the number of ring members (the number of atoms constituting the ring skeleton) is not particularly limited, but is preferably a 3- to 12-membered ring.
前記ヘテロアリール基は、単環状及び多環状のいずれでもよく、その環員数(環骨格を構成する原子の数)も特に限定されないが、3~12員環であることが好ましい。 The heteroaryl group constituting the mono (heteroaryl) amine has a heteroatom as an atom constituting the aromatic ring skeleton, and the heteroatom includes a nitrogen atom, a sulfur atom, an oxygen atom, and a boron atom. Can be illustrated. Moreover, the number of the said hetero atom which comprises an aromatic ring skeleton is not specifically limited, One may be sufficient and two or more may be sufficient. When there are two or more, these heteroatoms may be the same or different from each other. That is, these heteroatoms may all be the same, may all be different, or may be partially different.
The heteroaryl group may be either monocyclic or polycyclic, and the number of ring members (the number of atoms constituting the ring skeleton) is not particularly limited, but is preferably a 3- to 12-membered ring.
前記ヘテロアリール基で、窒素原子を1~4個有する単環状のものとしては、ピロリル基、ピロリニル基、イミダゾリル基、ピラゾリル基、ピリジル基、ピリミジル基、ピラジニル基、ピリダジニル基、トリアゾリル基、テトラゾリル基、ピロリジニル基、イミダゾリジニル基、ピペリジニル基、ピラゾリジニル基、ピペラジニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、酸素原子を1個有する単環状のものとしては、フラニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1個有する単環状のものとしては、チエニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、酸素原子を1~2個及び窒素原子を1~3個有する単環状のものとしては、オキサゾリル基、イソオキサゾリル基、オキサジアゾリル基、モルホリニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1~2個及び窒素原子を1~3個有する単環状のものとしては、チアゾリル基、チアジアゾリル基、チアゾリジニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、窒素原子を1~5個有する多環状のものとしては、インドリル基、イソインドリル基、インドリジニル基、ベンズイミダゾリル基、キノリル基、イソキノリル基、インダゾリル基、ベンゾトリアゾリル基、テトラゾロピリジル基、テトラゾロピリダジニル基、ジヒドロトリアゾロピリダジニル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1~3個有する多環状のものとしては、ジチアナフタレニル基、ベンゾチオフェニル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。
前記ヘテロアリール基で、酸素原子を1~2個及び窒素原子を1~3個有する多環状のものとしては、ベンゾオキサゾリル基、ベンゾオキサジアゾリル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1~2個及び窒素原子を1~3個有する多環状のものとしては、ベンゾチアゾリル基、ベンゾチアジアゾリル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。 Examples of the monoaryl group having 1 to 4 nitrogen atoms as the heteroaryl group include pyrrolyl group, pyrrolinyl group, imidazolyl group, pyrazolyl group, pyridyl group, pyrimidyl group, pyrazinyl group, pyridazinyl group, triazolyl group, tetrazolyl group A pyrrolidinyl group, an imidazolidinyl group, a piperidinyl group, a pyrazolidinyl group, and a piperazinyl group, which are preferably 3- to 8-membered rings, and more preferably 5- to 6-membered rings.
Examples of the monoaryl group having one oxygen atom as the heteroaryl group include a furanyl group, preferably a 3- to 8-membered ring, and more preferably a 5- to 6-membered ring.
Examples of the monoaryl group having one sulfur atom as the heteroaryl group include a thienyl group, preferably a 3- to 8-membered ring, and more preferably a 5- to 6-membered ring.
Examples of the monoaryl group having 1 to 2 oxygen atoms and 1 to 3 nitrogen atoms as the heteroaryl group include an oxazolyl group, an isoxazolyl group, an oxadiazolyl group, and a morpholinyl group. Preferably, it is a 5- to 6-membered ring.
Examples of the monoaryl group having 1 to 2 sulfur atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a thiazolyl group, a thiadiazolyl group, and a thiazolidinyl group, and is a 3- to 8-membered ring. A 5- to 6-membered ring is preferable.
Examples of the polyaryl having 1 to 5 nitrogen atoms as the heteroaryl group include indolyl group, isoindolyl group, indolizinyl group, benzimidazolyl group, quinolyl group, isoquinolyl group, indazolyl group, benzotriazolyl group, tetra Examples thereof include a zolopyridyl group, a tetrazolopyridazinyl group, and a dihydrotriazolopyridazinyl group, preferably a 7-12 membered ring, and more preferably a 9-10 membered ring.
Examples of the polyaryl group having 1 to 3 sulfur atoms as the heteroaryl group include a dithiaphthalenyl group and a benzothiophenyl group, preferably a 7 to 12 membered ring, preferably a 9 to 10 membered ring. More preferably, it is a ring.
Examples of the polyaryl group having 1 to 2 oxygen atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a benzoxazolyl group and a benzooxadiazolyl group. Preferably, it is a 9 to 10 membered ring.
Examples of the polyaryl group having 1 to 2 sulfur atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a benzothiazolyl group and a benzothiadiazolyl group, and is a 7 to 12 membered ring. Preferably, it is a 9 to 10 membered ring.
前記ヘテロアリール基で、酸素原子を1個有する単環状のものとしては、フラニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1個有する単環状のものとしては、チエニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、酸素原子を1~2個及び窒素原子を1~3個有する単環状のものとしては、オキサゾリル基、イソオキサゾリル基、オキサジアゾリル基、モルホリニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1~2個及び窒素原子を1~3個有する単環状のものとしては、チアゾリル基、チアジアゾリル基、チアゾリジニル基が例示でき、3~8員環であることが好ましく、5~6員環であることがより好ましい。
前記ヘテロアリール基で、窒素原子を1~5個有する多環状のものとしては、インドリル基、イソインドリル基、インドリジニル基、ベンズイミダゾリル基、キノリル基、イソキノリル基、インダゾリル基、ベンゾトリアゾリル基、テトラゾロピリジル基、テトラゾロピリダジニル基、ジヒドロトリアゾロピリダジニル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1~3個有する多環状のものとしては、ジチアナフタレニル基、ベンゾチオフェニル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。
前記ヘテロアリール基で、酸素原子を1~2個及び窒素原子を1~3個有する多環状のものとしては、ベンゾオキサゾリル基、ベンゾオキサジアゾリル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。
前記ヘテロアリール基で、硫黄原子を1~2個及び窒素原子を1~3個有する多環状のものとしては、ベンゾチアゾリル基、ベンゾチアジアゾリル基が例示でき、7~12員環であることが好ましく、9~10員環であることがより好ましい。 Examples of the monoaryl group having 1 to 4 nitrogen atoms as the heteroaryl group include pyrrolyl group, pyrrolinyl group, imidazolyl group, pyrazolyl group, pyridyl group, pyrimidyl group, pyrazinyl group, pyridazinyl group, triazolyl group, tetrazolyl group A pyrrolidinyl group, an imidazolidinyl group, a piperidinyl group, a pyrazolidinyl group, and a piperazinyl group, which are preferably 3- to 8-membered rings, and more preferably 5- to 6-membered rings.
Examples of the monoaryl group having one oxygen atom as the heteroaryl group include a furanyl group, preferably a 3- to 8-membered ring, and more preferably a 5- to 6-membered ring.
Examples of the monoaryl group having one sulfur atom as the heteroaryl group include a thienyl group, preferably a 3- to 8-membered ring, and more preferably a 5- to 6-membered ring.
Examples of the monoaryl group having 1 to 2 oxygen atoms and 1 to 3 nitrogen atoms as the heteroaryl group include an oxazolyl group, an isoxazolyl group, an oxadiazolyl group, and a morpholinyl group. Preferably, it is a 5- to 6-membered ring.
Examples of the monoaryl group having 1 to 2 sulfur atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a thiazolyl group, a thiadiazolyl group, and a thiazolidinyl group, and is a 3- to 8-membered ring. A 5- to 6-membered ring is preferable.
Examples of the polyaryl having 1 to 5 nitrogen atoms as the heteroaryl group include indolyl group, isoindolyl group, indolizinyl group, benzimidazolyl group, quinolyl group, isoquinolyl group, indazolyl group, benzotriazolyl group, tetra Examples thereof include a zolopyridyl group, a tetrazolopyridazinyl group, and a dihydrotriazolopyridazinyl group, preferably a 7-12 membered ring, and more preferably a 9-10 membered ring.
Examples of the polyaryl group having 1 to 3 sulfur atoms as the heteroaryl group include a dithiaphthalenyl group and a benzothiophenyl group, preferably a 7 to 12 membered ring, preferably a 9 to 10 membered ring. More preferably, it is a ring.
Examples of the polyaryl group having 1 to 2 oxygen atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a benzoxazolyl group and a benzooxadiazolyl group. Preferably, it is a 9 to 10 membered ring.
Examples of the polyaryl group having 1 to 2 sulfur atoms and 1 to 3 nitrogen atoms as the heteroaryl group include a benzothiazolyl group and a benzothiadiazolyl group, and is a 7 to 12 membered ring. Preferably, it is a 9 to 10 membered ring.
前記ジアミンは、アミノ基を2個有していればよく、2個のアミノ基の位置関係は特に限定されない。好ましい前記ジアミンとしては、前記モノアルキルアミン、モノアリールアミン又はモノ(ヘテロアリール)アミンにおいて、アミノ基(-NH2)を構成する水素原子以外の1個の水素原子が、アミノ基で置換されたものが例示できる。
前記ジアミンは炭素数が1~10であることが好ましく、より好ましいものとしてはエチレンジアミン、1,3-ジアミノプロパン、1,4-ジアミノブタンが例示できる。 The diamine only needs to have two amino groups, and the positional relationship between the two amino groups is not particularly limited. As the preferred diamine, in the monoalkylamine, monoarylamine or mono (heteroaryl) amine, one hydrogen atom other than the hydrogen atom constituting the amino group (—NH 2 ) is substituted with an amino group. The thing can be illustrated.
The diamine preferably has 1 to 10 carbon atoms, and more preferable examples include ethylenediamine, 1,3-diaminopropane, and 1,4-diaminobutane.
前記ジアミンは炭素数が1~10であることが好ましく、より好ましいものとしてはエチレンジアミン、1,3-ジアミノプロパン、1,4-ジアミノブタンが例示できる。 The diamine only needs to have two amino groups, and the positional relationship between the two amino groups is not particularly limited. As the preferred diamine, in the monoalkylamine, monoarylamine or mono (heteroaryl) amine, one hydrogen atom other than the hydrogen atom constituting the amino group (—NH 2 ) is substituted with an amino group. The thing can be illustrated.
The diamine preferably has 1 to 10 carbon atoms, and more preferable examples include ethylenediamine, 1,3-diaminopropane, and 1,4-diaminobutane.
前記第2級アミンとしては、1個以上の水素原子が置換基で置換されていてもよいジアルキルアミン、ジアリールアミン、ジ(ヘテロアリール)アミン等が例示できる。
Examples of the secondary amine include dialkylamine, diarylamine, di (heteroaryl) amine and the like in which one or more hydrogen atoms may be substituted with a substituent.
前記ジアルキルアミンを構成するアルキル基は、前記モノアルキルアミンを構成するアルキル基と同様であり、炭素数が1~9の直鎖状若しくは分岐鎖状のアルキル基、又は炭素数が3~7の環状のアルキル基であることが好ましい。また、ジアルキルアミン一分子中の2個のアルキル基は、互いに同一でも異なっていてもよい。
好ましい前記ジアルキルアミンとして、具体的には、N-メチル-n-ヘキシルアミン、ジイソブチルアミン、ジ(2-エチルへキシル)アミンが例示できる。 The alkyl group constituting the dialkylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 9 carbon atoms, or having 3 to 7 carbon atoms. A cyclic alkyl group is preferred. Two alkyl groups in one molecule of dialkylamine may be the same as or different from each other.
Specific examples of preferable dialkylamines include N-methyl-n-hexylamine, diisobutylamine, and di (2-ethylhexyl) amine.
好ましい前記ジアルキルアミンとして、具体的には、N-メチル-n-ヘキシルアミン、ジイソブチルアミン、ジ(2-エチルへキシル)アミンが例示できる。 The alkyl group constituting the dialkylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 9 carbon atoms, or having 3 to 7 carbon atoms. A cyclic alkyl group is preferred. Two alkyl groups in one molecule of dialkylamine may be the same as or different from each other.
Specific examples of preferable dialkylamines include N-methyl-n-hexylamine, diisobutylamine, and di (2-ethylhexyl) amine.
前記ジアリールアミンを構成するアリール基は、前記モノアリールアミンを構成するアリール基と同様であり、炭素数が6~10であることが好ましい。また、ジアリールアミン一分子中の2個のアリール基は、互いに同一でも異なっていてもよい。
The aryl group constituting the diarylamine is the same as the aryl group constituting the monoarylamine, and preferably has 6 to 10 carbon atoms. Two aryl groups in one molecule of diarylamine may be the same as or different from each other.
前記ジ(ヘテロアリール)アミンを構成するヘテロアリール基は、前記モノ(ヘテロアリール)アミンを構成するヘテロアリール基と同様であり、6~12員環であることが好ましい。また、ジ(ヘテロアリール)アミン一分子中の2個のヘテロアリール基は、互いに同一でも異なっていてもよい。
The heteroaryl group constituting the di (heteroaryl) amine is the same as the heteroaryl group constituting the mono (heteroaryl) amine, and is preferably a 6-12 membered ring. Two heteroaryl groups in one molecule of di (heteroaryl) amine may be the same or different from each other.
前記第3級アミンとしては、1個以上の水素原子が置換基で置換されていてもよいトリアルキルアミン、ジアルキルモノアリールアミン等が例示できる。
Examples of the tertiary amine include trialkylamine and dialkylmonoarylamine in which one or more hydrogen atoms may be substituted with a substituent.
前記トリアルキルアミンを構成するアルキル基は、前記モノアルキルアミンを構成するアルキル基と同様であり、炭素数が1~19の直鎖状若しくは分岐鎖状のアルキル基、又は炭素数が3~7の環状のアルキル基であることが好ましい。また、トリアルキルアミン一分子中の3個のアルキル基は、互いに同一でも異なっていてもよい。すなわち、3個のアルキル基は、すべてが同じでもよいし、すべてが異なっていてもよく、一部だけが異なっていてもよい。
好ましい前記トリアルキルアミンとして、具体的には、N,N-ジメチル-n-オクタデシルアミン、N,N-ジメチルシクロヘキシルアミンが例示できる。 The alkyl group constituting the trialkylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 19 carbon atoms, or 3 to 7 carbon atoms. The cyclic alkyl group is preferably. Further, the three alkyl groups in one molecule of trialkylamine may be the same as or different from each other. That is, all three alkyl groups may be the same, all may be different, or only a part may be different.
Preferable examples of the trialkylamine include N, N-dimethyl-n-octadecylamine and N, N-dimethylcyclohexylamine.
好ましい前記トリアルキルアミンとして、具体的には、N,N-ジメチル-n-オクタデシルアミン、N,N-ジメチルシクロヘキシルアミンが例示できる。 The alkyl group constituting the trialkylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 19 carbon atoms, or 3 to 7 carbon atoms. The cyclic alkyl group is preferably. Further, the three alkyl groups in one molecule of trialkylamine may be the same as or different from each other. That is, all three alkyl groups may be the same, all may be different, or only a part may be different.
Preferable examples of the trialkylamine include N, N-dimethyl-n-octadecylamine and N, N-dimethylcyclohexylamine.
前記ジアルキルモノアリールアミンを構成するアルキル基は、前記モノアルキルアミンを構成するアルキル基と同様であり、炭素数が1~6の直鎖状若しくは分岐鎖状のアルキル基、又は炭素数が3~7の環状のアルキル基であることが好ましい。また、ジアルキルモノアリールアミン一分子中の2個のアルキル基は、互いに同一でも異なっていてもよい。
前記ジアルキルモノアリールアミンを構成するアリール基は、前記モノアリールアミンを構成するアリール基と同様であり、炭素数が6~10であることが好ましい。 The alkyl group constituting the dialkyl monoarylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 6 carbon atoms, or 3 to 3 carbon atoms. 7 is a cyclic alkyl group. Two alkyl groups in one molecule of dialkyl monoarylamine may be the same or different from each other.
The aryl group constituting the dialkyl monoarylamine is the same as the aryl group constituting the monoarylamine, and preferably has 6 to 10 carbon atoms.
前記ジアルキルモノアリールアミンを構成するアリール基は、前記モノアリールアミンを構成するアリール基と同様であり、炭素数が6~10であることが好ましい。 The alkyl group constituting the dialkyl monoarylamine is the same as the alkyl group constituting the monoalkylamine, and is a linear or branched alkyl group having 1 to 6 carbon atoms, or 3 to 3 carbon atoms. 7 is a cyclic alkyl group. Two alkyl groups in one molecule of dialkyl monoarylamine may be the same or different from each other.
The aryl group constituting the dialkyl monoarylamine is the same as the aryl group constituting the monoarylamine, and preferably has 6 to 10 carbon atoms.
本発明において、前記第4級アンモニウム塩としては、1個以上の水素原子が置換基で置換されていてもよいハロゲン化テトラアルキルアンモニウム等が例示できる。
前記ハロゲン化テトラアルキルアンモニウムを構成するアルキル基は、前記モノアルキルアミンを構成するアルキル基と同様であり、炭素数が1~19であることが好ましい。また、ハロゲン化テトラアルキルアンモニウム一分子中の4個のアルキル基は、互いに同一でも異なっていてもよい。すなわち、4個のアルキル基は、すべてが同じでもよいし、すべてが異なっていてもよく、一部だけが異なっていてもよい。
前記ハロゲン化テトラアルキルアンモニウムを構成するハロゲンとしては、フッ素、塩素、臭素、ヨウ素が例示できる。
好ましい前記ハロゲン化テトラアルキルアンモニウムとして、具体的には、ドデシルトリメチルアンモニウムブロミドが例示できる。 In the present invention, examples of the quaternary ammonium salt include halogenated tetraalkylammonium, in which one or more hydrogen atoms may be substituted with a substituent.
The alkyl group constituting the halogenated tetraalkylammonium is the same as the alkyl group constituting the monoalkylamine, and preferably has 1 to 19 carbon atoms. Further, the four alkyl groups in one molecule of the tetraalkylammonium halide may be the same as or different from each other. That is, all four alkyl groups may be the same, all may be different, or only a part may be different.
Examples of the halogen constituting the halogenated tetraalkylammonium include fluorine, chlorine, bromine and iodine.
Specific examples of the preferred tetraalkylammonium halide include dodecyltrimethylammonium bromide.
前記ハロゲン化テトラアルキルアンモニウムを構成するアルキル基は、前記モノアルキルアミンを構成するアルキル基と同様であり、炭素数が1~19であることが好ましい。また、ハロゲン化テトラアルキルアンモニウム一分子中の4個のアルキル基は、互いに同一でも異なっていてもよい。すなわち、4個のアルキル基は、すべてが同じでもよいし、すべてが異なっていてもよく、一部だけが異なっていてもよい。
前記ハロゲン化テトラアルキルアンモニウムを構成するハロゲンとしては、フッ素、塩素、臭素、ヨウ素が例示できる。
好ましい前記ハロゲン化テトラアルキルアンモニウムとして、具体的には、ドデシルトリメチルアンモニウムブロミドが例示できる。 In the present invention, examples of the quaternary ammonium salt include halogenated tetraalkylammonium, in which one or more hydrogen atoms may be substituted with a substituent.
The alkyl group constituting the halogenated tetraalkylammonium is the same as the alkyl group constituting the monoalkylamine, and preferably has 1 to 19 carbon atoms. Further, the four alkyl groups in one molecule of the tetraalkylammonium halide may be the same as or different from each other. That is, all four alkyl groups may be the same, all may be different, or only a part may be different.
Examples of the halogen constituting the halogenated tetraalkylammonium include fluorine, chlorine, bromine and iodine.
Specific examples of the preferred tetraalkylammonium halide include dodecyltrimethylammonium bromide.
ここまでは、主に鎖状のアミン化合物及び第4級有機アンモニウム塩について説明したが、前記アミン化合物及び第4級アンモニウム塩は、アミン部位又はアンモニウム塩部位を構成する窒素原子が環骨格構造(複素環骨格構造)の一部であるようなヘテロ環化合物であってもよい。すなわち、前記アミン化合物は環状アミンでもよく、前記第4級アンモニウム塩は環状アンモニウム塩でもよい。この時の環(アミン部位又はアンモニウム塩部位を構成する窒素原子を含む環)構造は、単環状及び多環状のいずれでもよく、その環員数(環骨格を構成する原子の数)も特に限定されず、脂肪族環及び芳香族環のいずれでもよい。
環状アミンであれば、好ましいものとして、ピリジンが例示できる。 So far, the chain amine compound and the quaternary organic ammonium salt have been mainly described. However, in the amine compound and the quaternary ammonium salt, the nitrogen atom constituting the amine moiety or the ammonium salt moiety is a ring skeleton structure ( A heterocyclic compound which is a part of a heterocyclic skeleton structure) may be used. That is, the amine compound may be a cyclic amine, and the quaternary ammonium salt may be a cyclic ammonium salt. At this time, the ring (ring containing the nitrogen atom constituting the amine moiety or ammonium salt moiety) structure may be either monocyclic or polycyclic, and the number of ring members (number of atoms constituting the ring skeleton) is also particularly limited. Any of an aliphatic ring and an aromatic ring may be sufficient.
If it is a cyclic amine, a pyridine can be illustrated as a preferable thing.
環状アミンであれば、好ましいものとして、ピリジンが例示できる。 So far, the chain amine compound and the quaternary organic ammonium salt have been mainly described. However, in the amine compound and the quaternary ammonium salt, the nitrogen atom constituting the amine moiety or the ammonium salt moiety is a ring skeleton structure ( A heterocyclic compound which is a part of a heterocyclic skeleton structure) may be used. That is, the amine compound may be a cyclic amine, and the quaternary ammonium salt may be a cyclic ammonium salt. At this time, the ring (ring containing the nitrogen atom constituting the amine moiety or ammonium salt moiety) structure may be either monocyclic or polycyclic, and the number of ring members (number of atoms constituting the ring skeleton) is also particularly limited. Any of an aliphatic ring and an aromatic ring may be sufficient.
If it is a cyclic amine, a pyridine can be illustrated as a preferable thing.
前記第1級アミン、第2級アミン、第3級アミン及び第4級アンモニウム塩において、「置換基で置換されていてもよい水素原子」とは、アミン部位又はアンモニウム塩部位を構成する窒素原子に結合している水素原子以外の水素原子である。この時の置換基の数は特に限定されず、1個でもよいし、2個以上でもよく、前記水素原子のすべてが置換基で置換されていてもよい。置換基の数が複数の場合には、これら複数個の置換基は互いに同一でも異なっていてもよい。すなわち、複数個の置換基はすべて同じでもよいし、すべて異なっていてもよく、一部だけが異なっていてもよい。また、置換基の位置も特に限定されない。
In the primary amine, secondary amine, tertiary amine and quaternary ammonium salt, the “hydrogen atom optionally substituted with a substituent” means a nitrogen atom constituting an amine moiety or an ammonium salt moiety. A hydrogen atom other than a hydrogen atom bonded to. The number of substituents at this time is not particularly limited, and may be one or two or more, and all of the hydrogen atoms may be substituted with a substituent. When the number of substituents is plural, the plural substituents may be the same as or different from each other. That is, the plurality of substituents may all be the same, may all be different, or only some may be different. Further, the position of the substituent is not particularly limited.
前記アミン化合物及び第4級アンモニウム塩における前記置換基としては、アルキル基、アリール基、ハロゲン原子、シアノ基、ニトロ基、水酸基、トリフルオロメチル基(-CF3)等が例示できる。ここで、ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が例示できる。
Examples of the substituent in the amine compound and the quaternary ammonium salt include an alkyl group, an aryl group, a halogen atom, a cyano group, a nitro group, a hydroxyl group, and a trifluoromethyl group (—CF 3 ). Here, examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
前記モノアルキルアミンを構成するアルキル基が置換基を有する場合、前記アルキル基は、置換基としてアリール基を有する、炭素数が1~9の直鎖状若しくは分岐鎖状のアルキル基、又は置換基として好ましくは炭素数が1~5のアルキル基を有する、炭素数が3~7の環状のアルキル基が好ましく、このような置換基を有するモノアルキルアミンとして、具体的には、2-フェニルエチルアミン、ベンジルアミン、2,3-ジメチルシクロヘキシルアミンが例示できる。
また、置換基である前記アリール基及びアルキル基は、さらに1個以上の水素原子がハロゲン原子で置換されていてもよく、このようなハロゲン原子で置換された置換基を有するモノアルキルアミンとしては、2-ブロモベンジルアミンが例示できる。ここで、前記ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が例示できる。 When the alkyl group constituting the monoalkylamine has a substituent, the alkyl group has an aryl group as a substituent, a linear or branched alkyl group having 1 to 9 carbon atoms, or a substituent Preferably, a cyclic alkyl group having 3 to 7 carbon atoms having an alkyl group having 1 to 5 carbon atoms is preferable, and a monoalkylamine having such a substituent is specifically 2-phenylethylamine. , Benzylamine, and 2,3-dimethylcyclohexylamine.
In addition, the aryl group and the alkyl group which are substituents may further have one or more hydrogen atoms substituted with halogen atoms, and as monoalkylamines having such substituents substituted with halogen atoms, And 2-bromobenzylamine. Here, examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
また、置換基である前記アリール基及びアルキル基は、さらに1個以上の水素原子がハロゲン原子で置換されていてもよく、このようなハロゲン原子で置換された置換基を有するモノアルキルアミンとしては、2-ブロモベンジルアミンが例示できる。ここで、前記ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が例示できる。 When the alkyl group constituting the monoalkylamine has a substituent, the alkyl group has an aryl group as a substituent, a linear or branched alkyl group having 1 to 9 carbon atoms, or a substituent Preferably, a cyclic alkyl group having 3 to 7 carbon atoms having an alkyl group having 1 to 5 carbon atoms is preferable, and a monoalkylamine having such a substituent is specifically 2-phenylethylamine. , Benzylamine, and 2,3-dimethylcyclohexylamine.
In addition, the aryl group and the alkyl group which are substituents may further have one or more hydrogen atoms substituted with halogen atoms, and as monoalkylamines having such substituents substituted with halogen atoms, And 2-bromobenzylamine. Here, examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
前記モノアリールアミンを構成するアリール基が置換基を有する場合、前記アリール基は、置換基としてハロゲン原子を有する、炭素数が6~10のアリール基が好ましく、このような置換基を有するモノアリールアミンとして、具体的には、ブロモフェニルアミンが例示できる。ここで、前記ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が例示できる。
When the aryl group constituting the monoarylamine has a substituent, the aryl group is preferably an aryl group having a halogen atom as a substituent and having 6 to 10 carbon atoms, and the monoaryl having such a substituent Specific examples of the amine include bromophenylamine. Here, examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
前記ジアルキルアミンを構成するアルキル基が置換基を有する場合、前記アルキル基は、置換基として水酸基又はアリール基を有する、炭素数が1~9の直鎖状若しくは分岐鎖状のアルキル基が好ましく、このような置換基を有するジアルキルアミンとして、具体的には、ジエタノールアミン、N-メチルベンジルアミンが例示できる。
When the alkyl group constituting the dialkylamine has a substituent, the alkyl group is preferably a linear or branched alkyl group having 1 to 9 carbon atoms and having a hydroxyl group or an aryl group as a substituent, Specific examples of the dialkylamine having such a substituent include diethanolamine and N-methylbenzylamine.
前記アミン化合物は、n-プロピルアミン、n-ブチルアミン、n-へキシルアミン、n-オクチルアミン、n-ドデシルアミン、n-オクタデシルアミン、sec-ブチルアミン、tert-ブチルアミン、3-アミノペンタン、3-メチルブチルアミン、2-ヘプチルアミン、2-アミノオクタン、2-エチルヘキシルアミン、2-フェニルエチルアミン、エチレンジアミン、1,3-ジアミノプロパン、1,4-ジアミノブタン、N-メチル-n-ヘキシルアミン、ジイソブチルアミン、N-メチルベンジルアミン、ジ(2-エチルへキシル)アミン、1,2-ジメチル-n-プロピルアミン、N,N-ジメチル-n-オクタデシルアミン又はN,N-ジメチルシクロヘキシルアミンであることが好ましい。
そして、これらアミン化合物の中でも、2-エチルヘキシルアミンは、前記カルボン酸銀との相溶性に優れ、銀インク組成物の高濃度化に特に適しており、さらに金属銀の表面粗さの低減に特に適したものとして挙げられる。 The amine compound is n-propylamine, n-butylamine, n-hexylamine, n-octylamine, n-dodecylamine, n-octadecylamine, sec-butylamine, tert-butylamine, 3-aminopentane, 3-methyl. Butylamine, 2-heptylamine, 2-aminooctane, 2-ethylhexylamine, 2-phenylethylamine, ethylenediamine, 1,3-diaminopropane, 1,4-diaminobutane, N-methyl-n-hexylamine, diisobutylamine, N-methylbenzylamine, di (2-ethylhexyl) amine, 1,2-dimethyl-n-propylamine, N, N-dimethyl-n-octadecylamine or N, N-dimethylcyclohexylamine is preferable. .
Among these amine compounds, 2-ethylhexylamine is excellent in compatibility with the above-mentioned silver carboxylate, particularly suitable for increasing the concentration of the silver ink composition, and particularly for reducing the surface roughness of metallic silver. Listed as suitable.
そして、これらアミン化合物の中でも、2-エチルヘキシルアミンは、前記カルボン酸銀との相溶性に優れ、銀インク組成物の高濃度化に特に適しており、さらに金属銀の表面粗さの低減に特に適したものとして挙げられる。 The amine compound is n-propylamine, n-butylamine, n-hexylamine, n-octylamine, n-dodecylamine, n-octadecylamine, sec-butylamine, tert-butylamine, 3-aminopentane, 3-methyl. Butylamine, 2-heptylamine, 2-aminooctane, 2-ethylhexylamine, 2-phenylethylamine, ethylenediamine, 1,3-diaminopropane, 1,4-diaminobutane, N-methyl-n-hexylamine, diisobutylamine, N-methylbenzylamine, di (2-ethylhexyl) amine, 1,2-dimethyl-n-propylamine, N, N-dimethyl-n-octadecylamine or N, N-dimethylcyclohexylamine is preferable. .
Among these amine compounds, 2-ethylhexylamine is excellent in compatibility with the above-mentioned silver carboxylate, particularly suitable for increasing the concentration of the silver ink composition, and particularly for reducing the surface roughness of metallic silver. Listed as suitable.
(アミン化合物由来のアンモニウム塩)
本発明において、前記アミン化合物由来のアンモニウム塩は、前記アミン化合物が酸と反応してなるアンモニウム塩であり、前記酸は、塩酸、硫酸、硝酸等の無機酸でもよいし、酢酸等の有機酸でもよく、酸の種類は特に限定されない。
前記アミン化合物由来のアンモニウム塩としては、n-プロピルアミン塩酸塩、N-メチル-n-ヘキシルアミン塩酸塩、N,N-ジメチル-n-オクタデシルアミン塩酸塩等が例示できるが、これらに限定されない。 (Ammonium salts derived from amine compounds)
In the present invention, the ammonium salt derived from the amine compound is an ammonium salt obtained by reacting the amine compound with an acid, and the acid may be an inorganic acid such as hydrochloric acid, sulfuric acid or nitric acid, or an organic acid such as acetic acid. However, the type of acid is not particularly limited.
Examples of the ammonium salt derived from the amine compound include, but are not limited to, n-propylamine hydrochloride, N-methyl-n-hexylamine hydrochloride, N, N-dimethyl-n-octadecylamine hydrochloride and the like. .
本発明において、前記アミン化合物由来のアンモニウム塩は、前記アミン化合物が酸と反応してなるアンモニウム塩であり、前記酸は、塩酸、硫酸、硝酸等の無機酸でもよいし、酢酸等の有機酸でもよく、酸の種類は特に限定されない。
前記アミン化合物由来のアンモニウム塩としては、n-プロピルアミン塩酸塩、N-メチル-n-ヘキシルアミン塩酸塩、N,N-ジメチル-n-オクタデシルアミン塩酸塩等が例示できるが、これらに限定されない。 (Ammonium salts derived from amine compounds)
In the present invention, the ammonium salt derived from the amine compound is an ammonium salt obtained by reacting the amine compound with an acid, and the acid may be an inorganic acid such as hydrochloric acid, sulfuric acid or nitric acid, or an organic acid such as acetic acid. However, the type of acid is not particularly limited.
Examples of the ammonium salt derived from the amine compound include, but are not limited to, n-propylamine hydrochloride, N-methyl-n-hexylamine hydrochloride, N, N-dimethyl-n-octadecylamine hydrochloride and the like. .
(アンモニア由来のアンモニウム塩)
本発明において、前記アンモニア由来のアンモニウム塩は、アンモニアが酸と反応してなるアンモニウム塩であり、ここで酸としては、前記アミン化合物由来のアンモニウム塩の場合と同じものが例示できる。
前記アンモニア由来のアンモニウム塩としては、塩化アンモニウム等が例示できるが、これに限定されない。 (Ammonium salt derived from ammonia)
In the present invention, the ammonium salt derived from ammonia is an ammonium salt formed by reacting ammonia with an acid, and examples of the acid include the same ones as in the case of the ammonium salt derived from the amine compound.
Examples of the ammonium salt derived from ammonia include ammonium chloride, but are not limited thereto.
本発明において、前記アンモニア由来のアンモニウム塩は、アンモニアが酸と反応してなるアンモニウム塩であり、ここで酸としては、前記アミン化合物由来のアンモニウム塩の場合と同じものが例示できる。
前記アンモニア由来のアンモニウム塩としては、塩化アンモニウム等が例示できるが、これに限定されない。 (Ammonium salt derived from ammonia)
In the present invention, the ammonium salt derived from ammonia is an ammonium salt formed by reacting ammonia with an acid, and examples of the acid include the same ones as in the case of the ammonium salt derived from the amine compound.
Examples of the ammonium salt derived from ammonia include ammonium chloride, but are not limited thereto.
本発明においては、前記アミン化合物、第4級アンモニウム塩、アミン化合物由来のアンモニウム塩及びアンモニア由来のアンモニウム塩は、それぞれ一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。
そして、前記含窒素化合物としては、前記アミン化合物、第4級アンモニウム塩、アミン化合物由来のアンモニウム塩及びアンモニア由来のアンモニウム塩からなる群から選択される一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。 In the present invention, the amine compound, the quaternary ammonium salt, the ammonium salt derived from the amine compound and the ammonium salt derived from ammonia may be used singly or in combination of two or more. . When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
And as said nitrogen-containing compound, you may use individually by 1 type selected from the group which consists of said amine compound, quaternary ammonium salt, ammonium salt derived from an amine compound, and ammonium salt derived from ammonia, More than one species may be used in combination. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
そして、前記含窒素化合物としては、前記アミン化合物、第4級アンモニウム塩、アミン化合物由来のアンモニウム塩及びアンモニア由来のアンモニウム塩からなる群から選択される一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。 In the present invention, the amine compound, the quaternary ammonium salt, the ammonium salt derived from the amine compound and the ammonium salt derived from ammonia may be used singly or in combination of two or more. . When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
And as said nitrogen-containing compound, you may use individually by 1 type selected from the group which consists of said amine compound, quaternary ammonium salt, ammonium salt derived from an amine compound, and ammonium salt derived from ammonia, More than one species may be used in combination. When using 2 or more types together, the combination and ratio can be adjusted arbitrarily.
銀インク組成物において、前記含窒素化合物の配合量は、前記金属銀の形成材料の配合量1モルあたり0.3~15モルであることが好ましく、0.3~5モルであることがより好ましい。前記含窒素化合物の前記配合量がこのような範囲であることで、銀インク組成物は安定性がより向上し、導電体(金属銀)の品質がより向上する。さらに、高温による加熱処理を行わなくても、より安定して導電体を形成できる。
In the silver ink composition, the compounding amount of the nitrogen-containing compound is preferably 0.3 to 15 mol, more preferably 0.3 to 5 mol, per mol of the metal silver forming material. preferable. When the blending amount of the nitrogen-containing compound is within such a range, the silver ink composition is further improved in stability and the quality of the conductor (metal silver) is further improved. Furthermore, the conductor can be formed more stably without performing heat treatment at a high temperature.
[還元剤]
銀インク組成物は、前記金属銀の形成材料以外に、さらに還元剤が配合されてなるものが好ましい。前記還元剤は、結晶子径が15nm以上の金属銀を形成するために、使用することが好ましいものである。還元剤を配合することで、前記銀インク組成物は、金属銀をより形成し易くなり、例えば、低温での加熱処理でも十分な導電性を有する導電体(金属銀)を形成できる。 [Reducing agent]
The silver ink composition preferably contains a reducing agent in addition to the metal silver forming material. The reducing agent is preferably used to form metallic silver having a crystallite diameter of 15 nm or more. By blending a reducing agent, the silver ink composition can more easily form metallic silver. For example, a conductor (metal silver) having sufficient conductivity can be formed even by heat treatment at a low temperature.
銀インク組成物は、前記金属銀の形成材料以外に、さらに還元剤が配合されてなるものが好ましい。前記還元剤は、結晶子径が15nm以上の金属銀を形成するために、使用することが好ましいものである。還元剤を配合することで、前記銀インク組成物は、金属銀をより形成し易くなり、例えば、低温での加熱処理でも十分な導電性を有する導電体(金属銀)を形成できる。 [Reducing agent]
The silver ink composition preferably contains a reducing agent in addition to the metal silver forming material. The reducing agent is preferably used to form metallic silver having a crystallite diameter of 15 nm or more. By blending a reducing agent, the silver ink composition can more easily form metallic silver. For example, a conductor (metal silver) having sufficient conductivity can be formed even by heat treatment at a low temperature.
前記還元剤は、シュウ酸、ヒドラジン及び下記一般式(5)で表される化合物(以下、「化合物(5)」と略記することがある)からなる群から選択される一種以上の還元性化合物(以下、単に「還元性化合物」と略記することがある)であることが好ましい。
H-C(=O)-R21 ・・・・(5)
(式中、R21は、炭素数20以下のアルキル基、アルコキシ基若しくはN,N-ジアルキルアミノ基、水酸基又はアミノ基である。) The reducing agent is one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and a compound represented by the following general formula (5) (hereinafter sometimes abbreviated as “compound (5)”). (Hereinafter, sometimes simply abbreviated as “reducing compound”).
HC (= O) -R 21 (5)
(Wherein R 21 represents an alkyl group having 20 or less carbon atoms, an alkoxy group, or an N, N-dialkylamino group, a hydroxyl group, or an amino group.)
H-C(=O)-R21 ・・・・(5)
(式中、R21は、炭素数20以下のアルキル基、アルコキシ基若しくはN,N-ジアルキルアミノ基、水酸基又はアミノ基である。) The reducing agent is one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and a compound represented by the following general formula (5) (hereinafter sometimes abbreviated as “compound (5)”). (Hereinafter, sometimes simply abbreviated as “reducing compound”).
HC (= O) -R 21 (5)
(Wherein R 21 represents an alkyl group having 20 or less carbon atoms, an alkoxy group, or an N, N-dialkylamino group, a hydroxyl group, or an amino group.)
(還元性化合物)
前記還元性化合物は、シュウ酸(HOOC-COOH)、ヒドラジン(H2N-NH2)及び前記一般式(5)で表される化合物(化合物(5))からなる群から選択される一種以上である。すなわち、配合される還元性化合物は、一種のみでよいし、二種以上でもよく、二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。 (Reducing compounds)
The reducing compound is at least one selected from the group consisting of oxalic acid (HOOC—COOH), hydrazine (H 2 N—NH 2 ) and the compound represented by the general formula (5) (compound (5)). It is. That is, the reducing compound to be blended may be only one kind, or two or more kinds. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
前記還元性化合物は、シュウ酸(HOOC-COOH)、ヒドラジン(H2N-NH2)及び前記一般式(5)で表される化合物(化合物(5))からなる群から選択される一種以上である。すなわち、配合される還元性化合物は、一種のみでよいし、二種以上でもよく、二種以上を併用する場合、その組み合わせ及び比率は、任意に調節できる。 (Reducing compounds)
The reducing compound is at least one selected from the group consisting of oxalic acid (HOOC—COOH), hydrazine (H 2 N—NH 2 ) and the compound represented by the general formula (5) (compound (5)). It is. That is, the reducing compound to be blended may be only one kind, or two or more kinds. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
R21における炭素数20以下のアルキル基は、炭素数が1~20であり、直鎖状、分岐鎖状及び環状のいずれでもよく、前記一般式(1)のRにおける前記アルキル基と同様のものが例示できる。
The alkyl group having 20 or less carbon atoms in R 21 has 1 to 20 carbon atoms and may be linear, branched or cyclic, and is the same as the alkyl group in R in the general formula (1) The thing can be illustrated.
R21における炭素数20以下のアルコキシ基は、炭素数が1~20であり、R21における前記アルキル基が酸素原子に結合してなる一価の基が例示できる。
The alkoxy group having 20 or less carbon atoms in R 21 has 1 to 20 carbon atoms, and examples thereof include monovalent groups in which the alkyl group in R 21 is bonded to an oxygen atom.
R21における炭素数20以下のN,N-ジアルキルアミノ基は、炭素数が2~20であり、窒素原子に結合している2個のアルキル基は、互いに同一でも異なっていてもよく、前記アルキル基はそれぞれ炭素数が1~19である。ただし、これら2個のアルキル基の炭素数の合計値が2~20である。
窒素原子に結合している前記アルキル基は、それぞれ直鎖状、分岐鎖状及び環状のいずれでもよく、炭素数が1~19である点以外は、前記一般式(1)のRにおける前記アルキル基と同様のものが例示できる。 The N, N-dialkylamino group having 20 or less carbon atoms in R 21 has 2 to 20 carbon atoms, and the two alkyl groups bonded to the nitrogen atom may be the same as or different from each other. Each alkyl group has 1 to 19 carbon atoms. However, the total value of the carbon number of these two alkyl groups is 2 to 20.
The alkyl group bonded to the nitrogen atom may be linear, branched or cyclic, respectively, and the alkyl group in R of the general formula (1) except that it has 1 to 19 carbon atoms. The thing similar to group can be illustrated.
窒素原子に結合している前記アルキル基は、それぞれ直鎖状、分岐鎖状及び環状のいずれでもよく、炭素数が1~19である点以外は、前記一般式(1)のRにおける前記アルキル基と同様のものが例示できる。 The N, N-dialkylamino group having 20 or less carbon atoms in R 21 has 2 to 20 carbon atoms, and the two alkyl groups bonded to the nitrogen atom may be the same as or different from each other. Each alkyl group has 1 to 19 carbon atoms. However, the total value of the carbon number of these two alkyl groups is 2 to 20.
The alkyl group bonded to the nitrogen atom may be linear, branched or cyclic, respectively, and the alkyl group in R of the general formula (1) except that it has 1 to 19 carbon atoms. The thing similar to group can be illustrated.
前記還元性化合物として、ヒドラジンは、一水和物(H2N-NH2・H2O)を用いてもよい。
As the reducing compound, hydrazine may be monohydrate (H 2 N—NH 2 .H 2 O).
前記還元性化合物で好ましいものとしては、ギ酸(H-C(=O)-OH);ギ酸メチル(H-C(=O)-OCH3)、ギ酸エチル(H-C(=O)-OCH2CH3)、ギ酸ブチル(H-C(=O)-O(CH2)3CH3)等のギ酸エステル;プロパナール(H-C(=O)-CH2CH3)、ブタナール(H-C(=O)-(CH2)2CH3)、ヘキサナール(H-C(=O)-(CH2)4CH3)等のアルデヒド;ホルムアミド(H-C(=O)-NH2)、N,N-ジメチルホルムアミド(H-C(=O)-N(CH3)2)等のホルムアミド類(式「H-C(=O)-N(-)-」で表される基を有する化合物);シュウ酸が例示できる。
Preferred examples of the reducing compound include formic acid (HC (═O) —OH); methyl formate (HC (═O) —OCH 3 ), ethyl formate (HC (═O) —OCH). 2 CH 3 ), formic acid esters such as butyl formate (HC (═O) —O (CH 2 ) 3 CH 3 ); propanal (HC (═O) —CH 2 CH 3 ), butanal (H Aldehydes such as —C (═O) — (CH 2 ) 2 CH 3 ) and hexanal (HC (═O) — (CH 2 ) 4 CH 3 ); formamide (HC (═O) —NH 2 ), N, N-dimethylformamide (HC (═O) —N (CH 3 ) 2 ) and other formamides (groups represented by the formula “HC (═O) —N (—) —”) And oxalic acid.
銀インク組成物において、還元剤の配合量は、前記金属銀の形成材料の配合量1モルあたり0.04~3.5モルであることが好ましく、0.06~2.5モルであることがより好ましい。還元剤の前記配合量がこのような範囲であることで、銀インク組成物は、より容易に、より安定して導電体(金属銀)を形成できる。
In the silver ink composition, the compounding amount of the reducing agent is preferably 0.04 to 3.5 mol, and preferably 0.06 to 2.5 mol per mol of the metal silver forming material. Is more preferable. When the blending amount of the reducing agent is within such a range, the silver ink composition can form a conductor (metal silver) more easily and more stably.
[アルコール]
銀インク組成物は、前記金属銀の形成材料以外に、さらにアルコールが配合されてなるものでもよい。 [alcohol]
The silver ink composition may further contain an alcohol in addition to the metal silver forming material.
銀インク組成物は、前記金属銀の形成材料以外に、さらにアルコールが配合されてなるものでもよい。 [alcohol]
The silver ink composition may further contain an alcohol in addition to the metal silver forming material.
前記アルコールは、下記一般式(2)で表されるアセチレンアルコール類(以下、「アセチレンアルコール(2)」と略記することがある)であることが好ましい。
The alcohol is preferably an acetylene alcohol represented by the following general formula (2) (hereinafter sometimes abbreviated as “acetylene alcohol (2)”).
(アセチレンアルコール(2))
アセチレンアルコール(2)は、前記一般式(2)で表される。
式中、R’及びR’’は、それぞれ独立に炭素数1~20のアルキル基、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基である。
R’及びR’’における炭素数1~20のアルキル基は、直鎖状、分岐鎖状及び環状のいずれでもよく、環状である場合、単環状及び多環状のいずれでもよい。R’及びR’’における前記アルキル基としては、Rにおける前記アルキル基と同様のものが例示できる。 (Acetylene alcohol (2))
The acetylene alcohol (2) is represented by the general formula (2).
In the formula, R ′ and R ″ are each independently an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.
The alkyl group having 1 to 20 carbon atoms in R ′ and R ″ may be linear, branched or cyclic, and when it is cyclic, it may be monocyclic or polycyclic. Examples of the alkyl group in R ′ and R ″ include the same alkyl groups as in R.
アセチレンアルコール(2)は、前記一般式(2)で表される。
式中、R’及びR’’は、それぞれ独立に炭素数1~20のアルキル基、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基である。
R’及びR’’における炭素数1~20のアルキル基は、直鎖状、分岐鎖状及び環状のいずれでもよく、環状である場合、単環状及び多環状のいずれでもよい。R’及びR’’における前記アルキル基としては、Rにおける前記アルキル基と同様のものが例示できる。 (Acetylene alcohol (2))
The acetylene alcohol (2) is represented by the general formula (2).
In the formula, R ′ and R ″ are each independently an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.
The alkyl group having 1 to 20 carbon atoms in R ′ and R ″ may be linear, branched or cyclic, and when it is cyclic, it may be monocyclic or polycyclic. Examples of the alkyl group in R ′ and R ″ include the same alkyl groups as in R.
R’及びR’’におけるフェニル基の水素原子が置換されていてもよい前記置換基としては、炭素数が1~16の飽和又は不飽和の一価の脂肪族炭化水素基、前記脂肪族炭化水素基が酸素原子に結合してなる一価の基、フッ素原子、塩素原子、臭素原子、水酸基、シアノ基、フェノキシ基等が例示でき、Rにおけるフェニル基の水素原子が置換されていてもよい前記置換基と同様である。そして、置換基の数及び位置は特に限定されず、置換基の数が複数である場合、これら複数個の置換基は互いに同一でも異なっていてもよい。
Examples of the substituent in which the hydrogen atom of the phenyl group in R ′ and R ″ may be substituted include a saturated or unsaturated monovalent aliphatic hydrocarbon group having 1 to 16 carbon atoms, the aliphatic carbon Examples thereof include a monovalent group formed by bonding a hydrogen group to an oxygen atom, a fluorine atom, a chlorine atom, a bromine atom, a hydroxyl group, a cyano group, a phenoxy group, and the like, and the hydrogen atom of the phenyl group in R may be substituted. This is the same as the substituent. And the number and position of a substituent are not specifically limited, When there are two or more substituents, these several substituents may mutually be same or different.
R’及びR’’は、炭素数1~20のアルキル基であることが好ましく、炭素数1~10の直鎖状又は分岐鎖状のアルキル基であることがより好ましい。
R ′ and R ″ are preferably an alkyl group having 1 to 20 carbon atoms, and more preferably a linear or branched alkyl group having 1 to 10 carbon atoms.
好ましいアセチレンアルコール(2)としては、3,5-ジメチル-1-ヘキシン-3-オール、3-メチル-1-ブチン-3-オール、3-メチル-1-ペンチン-3-オールが例示できる。
Examples of preferable acetylene alcohol (2) include 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-butyn-3-ol, and 3-methyl-1-pentyn-3-ol.
アセチレンアルコール(2)を用いる場合、銀インク組成物において、アセチレンアルコール(2)の配合量は、前記金属銀の形成材料の配合量1モルあたり0.03~0.7モルであることが好ましく、0.05~0.3モルであることがより好ましい。アセチレンアルコール(2)の前記配合量がこのような範囲であることで、銀インク組成物の安定性がより向上する。
When acetylene alcohol (2) is used, the amount of acetylene alcohol (2) in the silver ink composition is preferably 0.03 to 0.7 mol per mol of the metal silver forming material. 0.05 to 0.3 mol is more preferable. When the blending amount of acetylene alcohol (2) is within such a range, the stability of the silver ink composition is further improved.
前記アルコールは、一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合で、その組み合わせ及び比率は、任意に調節できる。
The alcohol may be used alone or in combination of two or more. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
[その他の成分]
銀インク組成物は、前記金属銀の形成材料、含窒素化合物、還元剤及びアルコール以外の、その他の成分が配合されてなるものでもよい。
銀インク組成物における前記その他の成分は、目的に応じて任意に選択でき、特に限定されず、好ましいものとしては、アルコール以外の溶媒が例示できる。 [Other ingredients]
The silver ink composition may contain other components other than the metallic silver forming material, nitrogen-containing compound, reducing agent, and alcohol.
The other components in the silver ink composition can be arbitrarily selected according to the purpose, and are not particularly limited. Preferred examples include solvents other than alcohol.
銀インク組成物は、前記金属銀の形成材料、含窒素化合物、還元剤及びアルコール以外の、その他の成分が配合されてなるものでもよい。
銀インク組成物における前記その他の成分は、目的に応じて任意に選択でき、特に限定されず、好ましいものとしては、アルコール以外の溶媒が例示できる。 [Other ingredients]
The silver ink composition may contain other components other than the metallic silver forming material, nitrogen-containing compound, reducing agent, and alcohol.
The other components in the silver ink composition can be arbitrarily selected according to the purpose, and are not particularly limited. Preferred examples include solvents other than alcohol.
前記溶媒は、配合成分の種類や量に応じて任意に選択できる。好ましい溶媒としては、常温常圧条件下で液状のアルカンが例示でき、前記アルカンは直鎖状、分岐鎖状及び環状のいずれでもよく、炭素数が15以下であることが好ましく、より好ましいものとしては、ペンタン、ヘキサン、シクロヘキサン、ヘプタン、オクタン、ノナン、デカン、ウンデカン、ドデカン、トリデカン、テトラデカン、ペンタデカン等が例示できる。
The solvent can be arbitrarily selected according to the type and amount of the compounding components. Preferred examples of the solvent include liquid alkanes under normal temperature and normal pressure conditions, and the alkane may be linear, branched or cyclic, and preferably has 15 or less carbon atoms, more preferably. Examples thereof include pentane, hexane, cyclohexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane and the like.
銀インク組成物における前記その他の成分は、一種を単独で使用してもよいし、二種以上を併用してもよい。二種以上を併用する場合で、その組み合わせ及び比率は、任意に調節できる。
The other components in the silver ink composition may be used alone or in combination of two or more. When two or more kinds are used in combination, the combination and ratio can be arbitrarily adjusted.
銀インク組成物における前記その他の成分の配合量は、前記その他の成分の種類に応じて、適宜選択すればよい。
例えば、前記その他の成分がアルコール以外の溶媒である場合、前記溶媒の配合量は、銀インク組成物の粘度等、目的に応じて選択すればよいが、通常は、銀インク組成物において、配合成分の総量に対する前記溶媒の配合量の割合は、25質量%以下であることが好ましく、20質量%以下であることがより好ましく、15質量%以下であることが特に好ましい。
また、前記その他の成分が前記溶媒以外の成分である場合、銀インク組成物において、配合成分の総量に対する前記その他の成分の配合量の割合は、10質量%以下であることが好ましく、5質量%以下であることがより好ましい。
配合成分の総量に対する前記その他の成分の配合量の割合が0質量、すなわちその他の成分を配合しなくても、銀インク組成物は十分にその効果を発現する。 What is necessary is just to select suitably the compounding quantity of the said other component in a silver ink composition according to the kind of said other component.
For example, when the other component is a solvent other than alcohol, the blending amount of the solvent may be selected according to the purpose, such as the viscosity of the silver ink composition, but is usually blended in the silver ink composition. The ratio of the amount of the solvent to the total amount of the components is preferably 25% by mass or less, more preferably 20% by mass or less, and particularly preferably 15% by mass or less.
Further, when the other component is a component other than the solvent, in the silver ink composition, the ratio of the blending amount of the other component to the total amount of the blending component is preferably 10% by mass or less. % Or less is more preferable.
The ratio of the blended amount of the other components with respect to the total amount of the blended components is 0 mass, that is, even if the other components are not blended, the silver ink composition exhibits its effect sufficiently.
例えば、前記その他の成分がアルコール以外の溶媒である場合、前記溶媒の配合量は、銀インク組成物の粘度等、目的に応じて選択すればよいが、通常は、銀インク組成物において、配合成分の総量に対する前記溶媒の配合量の割合は、25質量%以下であることが好ましく、20質量%以下であることがより好ましく、15質量%以下であることが特に好ましい。
また、前記その他の成分が前記溶媒以外の成分である場合、銀インク組成物において、配合成分の総量に対する前記その他の成分の配合量の割合は、10質量%以下であることが好ましく、5質量%以下であることがより好ましい。
配合成分の総量に対する前記その他の成分の配合量の割合が0質量、すなわちその他の成分を配合しなくても、銀インク組成物は十分にその効果を発現する。 What is necessary is just to select suitably the compounding quantity of the said other component in a silver ink composition according to the kind of said other component.
For example, when the other component is a solvent other than alcohol, the blending amount of the solvent may be selected according to the purpose, such as the viscosity of the silver ink composition, but is usually blended in the silver ink composition. The ratio of the amount of the solvent to the total amount of the components is preferably 25% by mass or less, more preferably 20% by mass or less, and particularly preferably 15% by mass or less.
Further, when the other component is a component other than the solvent, in the silver ink composition, the ratio of the blending amount of the other component to the total amount of the blending component is preferably 10% by mass or less. % Or less is more preferable.
The ratio of the blended amount of the other components with respect to the total amount of the blended components is 0 mass, that is, even if the other components are not blended, the silver ink composition exhibits its effect sufficiently.
銀インク組成物は、配合成分がすべて溶解していてもよいし、一部又は全ての成分が溶解せずに分散した状態であってもよいが、配合成分がすべて溶解していることが好ましく、溶解していない成分は均一に分散していることが好ましい。
In the silver ink composition, all the compounding components may be dissolved, or some or all of the components may be dispersed without dissolving, but it is preferable that all the compounding components are dissolved. The undissolved component is preferably dispersed uniformly.
[銀インク組成物の製造方法]
銀インク組成物は、前記金属銀の形成材料、及び前記金属銀の形成材料以外の成分を配合することで得られる。各成分の配合後は、得られたものをそのまま銀インク組成物としてもよいし、必要に応じて引き続き公知の精製操作を行って得られたものを銀インク組成物としてもよい。本発明においては、特に前記金属銀の形成材料としてβ-ケトカルボン酸銀(1)を用いた場合、上記の各成分の配合時において、導電性を阻害する不純物が生成しないか、又はこのような不純物の生成量を極めて少量に抑制できるため、精製操作を行っていない銀インク組成物を用いても、十分な導電性を有する導電体(金属銀)が得られる。 [Method for producing silver ink composition]
The silver ink composition is obtained by blending components other than the metallic silver forming material and the metallic silver forming material. After the blending of each component, the resulting product may be used as it is as a silver ink composition, or a product obtained by performing a known purification operation as necessary may be used as a silver ink composition. In the present invention, in particular, when β-ketocarboxylate (1) is used as the metal silver forming material, no impurities that inhibit conductivity are generated at the time of blending each of the above components, or such Since the generation amount of impurities can be suppressed to a very small amount, a conductor (metal silver) having sufficient conductivity can be obtained even if a silver ink composition that has not been subjected to a purification operation is used.
銀インク組成物は、前記金属銀の形成材料、及び前記金属銀の形成材料以外の成分を配合することで得られる。各成分の配合後は、得られたものをそのまま銀インク組成物としてもよいし、必要に応じて引き続き公知の精製操作を行って得られたものを銀インク組成物としてもよい。本発明においては、特に前記金属銀の形成材料としてβ-ケトカルボン酸銀(1)を用いた場合、上記の各成分の配合時において、導電性を阻害する不純物が生成しないか、又はこのような不純物の生成量を極めて少量に抑制できるため、精製操作を行っていない銀インク組成物を用いても、十分な導電性を有する導電体(金属銀)が得られる。 [Method for producing silver ink composition]
The silver ink composition is obtained by blending components other than the metallic silver forming material and the metallic silver forming material. After the blending of each component, the resulting product may be used as it is as a silver ink composition, or a product obtained by performing a known purification operation as necessary may be used as a silver ink composition. In the present invention, in particular, when β-ketocarboxylate (1) is used as the metal silver forming material, no impurities that inhibit conductivity are generated at the time of blending each of the above components, or such Since the generation amount of impurities can be suppressed to a very small amount, a conductor (metal silver) having sufficient conductivity can be obtained even if a silver ink composition that has not been subjected to a purification operation is used.
各成分の配合時には、すべての成分を添加してからこれらを混合してもよいし、一部の成分を順次添加しながら混合してもよく、すべての成分を順次添加しながら混合してもよい。ただし、本発明においては、前記還元剤は滴下により配合することが好ましく、さらに滴下速度の変動を抑制することで、金属銀の表面粗さをより低減できる傾向にある。
混合方法は特に限定されず、撹拌子又は撹拌翼等を回転させて混合する方法;ミキサー、三本ロール、ニーダー又はビーズミル等を使用して混合する方法;超音波を加えて混合する方法等、公知の方法から適宜選択すればよい。
銀インク組成物において、溶解していない成分を均一に分散させる場合には、例えば、上記の三本ロール、ニーダー又はビーズミル等を用いて分散させる方法を適用するのが好ましい。 At the time of blending each component, all the components may be added and then mixed, or some components may be mixed while being added sequentially, or all components may be mixed while being added sequentially. Good. However, in this invention, it is preferable to mix | blend the said reducing agent by dripping, and exists in the tendency which can further reduce the surface roughness of metal silver by suppressing the fluctuation | variation of dripping speed | rate.
The mixing method is not particularly limited, a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer, a three-roller, a kneader, a bead mill or the like; a method of mixing by adding ultrasonic waves, etc. What is necessary is just to select suitably from a well-known method.
In the silver ink composition, when the undissolved component is uniformly dispersed, for example, a method of dispersing using the above-described three rolls, kneader, bead mill or the like is preferably applied.
混合方法は特に限定されず、撹拌子又は撹拌翼等を回転させて混合する方法;ミキサー、三本ロール、ニーダー又はビーズミル等を使用して混合する方法;超音波を加えて混合する方法等、公知の方法から適宜選択すればよい。
銀インク組成物において、溶解していない成分を均一に分散させる場合には、例えば、上記の三本ロール、ニーダー又はビーズミル等を用いて分散させる方法を適用するのが好ましい。 At the time of blending each component, all the components may be added and then mixed, or some components may be mixed while being added sequentially, or all components may be mixed while being added sequentially. Good. However, in this invention, it is preferable to mix | blend the said reducing agent by dripping, and exists in the tendency which can further reduce the surface roughness of metal silver by suppressing the fluctuation | variation of dripping speed | rate.
The mixing method is not particularly limited, a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer, a three-roller, a kneader, a bead mill or the like; a method of mixing by adding ultrasonic waves, etc. What is necessary is just to select suitably from a well-known method.
In the silver ink composition, when the undissolved component is uniformly dispersed, for example, a method of dispersing using the above-described three rolls, kneader, bead mill or the like is preferably applied.
配合時の温度は、各配合成分が劣化しない限り特に限定されないが、-5~60℃であることが好ましい。そして、配合時の温度は、配合成分の種類及び量に応じて、配合して得られた混合物が撹拌し易い粘度となるように、適宜調節するとよい。
また、配合時間も、各配合成分が劣化しない限り特に限定されないが、10分~36時間であることが好ましい。 The temperature at the time of compounding is not particularly limited as long as each compounding component does not deteriorate, but it is preferably −5 to 60 ° C. And the temperature at the time of mixing | blending is good to adjust suitably so that the mixture obtained by mix | blending may become the viscosity which is easy to stir according to the kind and quantity of a mixing | blending component.
Also, the blending time is not particularly limited as long as each blending component does not deteriorate, but it is preferably 10 minutes to 36 hours.
また、配合時間も、各配合成分が劣化しない限り特に限定されないが、10分~36時間であることが好ましい。 The temperature at the time of compounding is not particularly limited as long as each compounding component does not deteriorate, but it is preferably −5 to 60 ° C. And the temperature at the time of mixing | blending is good to adjust suitably so that the mixture obtained by mix | blending may become the viscosity which is easy to stir according to the kind and quantity of a mixing | blending component.
Also, the blending time is not particularly limited as long as each blending component does not deteriorate, but it is preferably 10 minutes to 36 hours.
[二酸化炭素]
銀インク組成物は、さらに二酸化炭素が供給されてなるものでもよい。このような銀インク組成物は高粘度となり、例えば、フレキソ印刷法、スクリーン印刷法、グラビア印刷法、グラビアオフセット印刷法、パッド印刷法等の、インクを厚盛りすることが必要な印刷法への適用に好適である。 [carbon dioxide]
The silver ink composition may be further supplied with carbon dioxide. Such a silver ink composition has a high viscosity. For example, a flexographic printing method, a screen printing method, a gravure printing method, a gravure offset printing method, a pad printing method, etc. Suitable for application.
銀インク組成物は、さらに二酸化炭素が供給されてなるものでもよい。このような銀インク組成物は高粘度となり、例えば、フレキソ印刷法、スクリーン印刷法、グラビア印刷法、グラビアオフセット印刷法、パッド印刷法等の、インクを厚盛りすることが必要な印刷法への適用に好適である。 [carbon dioxide]
The silver ink composition may be further supplied with carbon dioxide. Such a silver ink composition has a high viscosity. For example, a flexographic printing method, a screen printing method, a gravure printing method, a gravure offset printing method, a pad printing method, etc. Suitable for application.
二酸化炭素は、銀インク組成物製造時のいずれの時期に供給してもよい。
そして、本発明においては、例えば、前記金属銀の形成材料及び含窒素化合物が配合されてなる第一の混合物に、二酸化炭素を供給して第二の混合物とし、必要に応じて前記第二の混合物に、さらに、前記還元剤を配合して、銀インク組成物を製造することが好ましい。また、前記アルコール又はその他の成分を配合する場合、これらは、第一の混合物及び第二の混合物のいずれか一方又は両方の製造時に配合でき、目的に応じて任意に選択できる。 Carbon dioxide may be supplied at any time during the production of the silver ink composition.
In the present invention, for example, carbon dioxide is supplied to the first mixture in which the metal silver forming material and the nitrogen-containing compound are blended to form a second mixture, and if necessary, the second mixture It is preferable that a silver ink composition is produced by further blending the reducing agent with the mixture. Moreover, when mix | blending the said alcohol or another component, these can be mix | blended at the time of manufacture of any one or both of a 1st mixture and a 2nd mixture, and can be arbitrarily selected according to the objective.
そして、本発明においては、例えば、前記金属銀の形成材料及び含窒素化合物が配合されてなる第一の混合物に、二酸化炭素を供給して第二の混合物とし、必要に応じて前記第二の混合物に、さらに、前記還元剤を配合して、銀インク組成物を製造することが好ましい。また、前記アルコール又はその他の成分を配合する場合、これらは、第一の混合物及び第二の混合物のいずれか一方又は両方の製造時に配合でき、目的に応じて任意に選択できる。 Carbon dioxide may be supplied at any time during the production of the silver ink composition.
In the present invention, for example, carbon dioxide is supplied to the first mixture in which the metal silver forming material and the nitrogen-containing compound are blended to form a second mixture, and if necessary, the second mixture It is preferable that a silver ink composition is produced by further blending the reducing agent with the mixture. Moreover, when mix | blending the said alcohol or another component, these can be mix | blended at the time of manufacture of any one or both of a 1st mixture and a 2nd mixture, and can be arbitrarily selected according to the objective.
前記第一の混合物は、配合成分が異なる点以外は、上記の銀インク組成物と同様の方法で製造できる。
The first mixture can be produced by the same method as the above silver ink composition except that the blending components are different.
第一の混合物は、配合成分がすべて溶解していてもよいし、一部の成分が溶解せずに分散した状態であってもよいが、配合成分がすべて溶解していることが好ましく、溶解していない成分は均一に分散していることが好ましい。
The first mixture may have all of the compounding components dissolved, or may be in a state of being dispersed without dissolving some of the components, but preferably all of the compounding components are dissolved and dissolved. It is preferable that the components not dispersed are uniformly dispersed.
第一の混合物製造時の配合温度は、各配合成分が劣化しない限り特に限定されないが、-5~30℃であることが好ましい。また、配合時間は、配合成分の種類や配合時の温度に応じて適宜調節すればよいが、例えば、0.5~12時間であることが好ましい。
The compounding temperature at the time of producing the first mixture is not particularly limited as long as each compounding component does not deteriorate, but it is preferably −5 to 30 ° C. In addition, the blending time may be appropriately adjusted according to the type of blending component and the temperature at the time of blending, but is preferably 0.5 to 12 hours, for example.
第一の混合物に供給される二酸化炭素(CO2)は、ガス状及び固形状(ドライアイス)のいずれでもよく、ガス状及び固形状の両方でもよい。二酸化炭素が供給されることにより、この二酸化炭素が第一の混合物に溶け込み、第一の混合物中の成分に作用することで、得られる第二の混合物の粘度が上昇すると推測される。
Carbon dioxide (CO 2 ) supplied to the first mixture may be either gaseous or solid (dry ice), or both gaseous and solid. By supplying carbon dioxide, it is estimated that this carbon dioxide dissolves in the first mixture and acts on the components in the first mixture, thereby increasing the viscosity of the obtained second mixture.
二酸化炭素ガスの供給は、液体中にガスを吹き込む公知の各種方法で行えばよく、適した供給方法を適宜選択すればよい。例えば、配管の一端を第一の混合物中に浸漬し、他端を二酸化炭素ガスの供給源に接続して、この配管を通じて二酸化炭素ガスを第一の混合物に供給する方法が例示できる。この時、配管の端部から直接二酸化炭素ガスを供給してもよいが、例えば、多孔質性のものなど、ガスの流路となり得る空隙部が多数設けられ、導入されたガスを拡散させて微小な気泡として放出することが可能なガス拡散部材を配管の端部に接続し、このガス拡散部材を介して二酸化炭素ガスを供給してもよい。また、第一の混合物の製造時と同様の方法で、第一の混合物を撹拌しながら二酸化炭素ガスを供給してもよい。このようにすることで、効率的に二酸化炭素を供給できる。
The carbon dioxide gas may be supplied by various known methods for blowing gas into the liquid, and a suitable supply method may be selected as appropriate. For example, a method in which one end of a pipe is immersed in the first mixture, the other end is connected to a carbon dioxide gas supply source, and the carbon dioxide gas is supplied to the first mixture through the pipe. At this time, the carbon dioxide gas may be supplied directly from the end of the pipe. For example, a plurality of voids that can serve as gas flow paths, such as a porous one, are provided to diffuse the introduced gas. A gas diffusion member that can be discharged as minute bubbles may be connected to the end of the pipe, and the carbon dioxide gas may be supplied through the gas diffusion member. Moreover, you may supply a carbon dioxide gas, stirring the 1st mixture by the method similar to the time of manufacture of a 1st mixture. By doing in this way, carbon dioxide can be supplied efficiently.
二酸化炭素ガスの供給量は、供給先の第一の混合物の量や、目的とする銀インク組成物又は第二の混合物の粘度に応じて適宜調節すればよく、特に限定されない。例えば、20~25℃における粘度が5Pa・s以上である銀インク組成物を100~1000g程度得るためには、二酸化炭素ガスを100L以上供給することが好ましく、200L以上供給することがより好ましい。なお、ここでは銀インク組成物の20~25℃における粘度について説明したが、銀インク組成物の使用時の温度は、20~25℃に限定されるものではなく、任意に選択できる。また、本明細書において「粘度」とは、特に断りのない限り、超音波振動式粘度計を用いて測定したものを意味する。
The supply amount of carbon dioxide gas is not particularly limited, and may be appropriately adjusted according to the amount of the first mixture at the supply destination and the viscosity of the target silver ink composition or the second mixture. For example, in order to obtain about 100 to 1000 g of a silver ink composition having a viscosity at 20 to 25 ° C. of 5 Pa · s or more, it is preferable to supply 100 L or more of carbon dioxide gas, and more preferably 200 L or more. Although the viscosity at 20 to 25 ° C. of the silver ink composition has been described here, the temperature at the time of using the silver ink composition is not limited to 20 to 25 ° C. and can be arbitrarily selected. In the present specification, “viscosity” means a value measured using an ultrasonic vibration viscometer unless otherwise specified.
二酸化炭素ガスの流量は、必要とされる二酸化炭素ガスの供給量を考慮して適宜調節すればよいが、第一の混合物1gあたり0.5mL/分以上であることが好ましく、1mL/分以上であることがより好ましい。流量の上限値は特に限定されないが、取り扱い性等を考慮すると、混合物1gあたり40mL/分であることが好ましい。
そして、二酸化炭素ガスの供給時間は、必要とされる二酸化炭素ガスの供給量や、流量を考慮して適宜調節すればよい。 The flow rate of carbon dioxide gas may be appropriately adjusted in consideration of the required supply amount of carbon dioxide gas, but is preferably 0.5 mL / min or more per 1 g of the first mixture, and is 1 mL / min or more. It is more preferable that The upper limit value of the flow rate is not particularly limited, but is preferably 40 mL / min per 1 g of the mixture in consideration of handling properties and the like.
The carbon dioxide gas supply time may be appropriately adjusted in consideration of the required supply amount and flow rate of carbon dioxide gas.
そして、二酸化炭素ガスの供給時間は、必要とされる二酸化炭素ガスの供給量や、流量を考慮して適宜調節すればよい。 The flow rate of carbon dioxide gas may be appropriately adjusted in consideration of the required supply amount of carbon dioxide gas, but is preferably 0.5 mL / min or more per 1 g of the first mixture, and is 1 mL / min or more. It is more preferable that The upper limit value of the flow rate is not particularly limited, but is preferably 40 mL / min per 1 g of the mixture in consideration of handling properties and the like.
The carbon dioxide gas supply time may be appropriately adjusted in consideration of the required supply amount and flow rate of carbon dioxide gas.
二酸化炭素ガス供給時の第一の混合物の温度は、5~70℃であることが好ましく、7~60℃であることがより好ましく、10~50℃であることが特に好ましい。前記温度が前記下限値以上であることで、より効率的に二酸化炭素を供給でき、前記温度が前記上限値以下であることで、不純物が少ないより良好な品質の銀インク組成物が得られる。
The temperature of the first mixture at the time of supplying carbon dioxide gas is preferably 5 to 70 ° C, more preferably 7 to 60 ° C, and particularly preferably 10 to 50 ° C. When the temperature is equal to or higher than the lower limit value, carbon dioxide can be supplied more efficiently, and when the temperature is equal to or lower than the upper limit value, a silver ink composition having better quality with fewer impurities can be obtained.
二酸化炭素ガスの流量及び供給時間、並びに二酸化炭素ガス供給時の前記温度は、それぞれの値を相互に考慮しながら適した範囲に調節すればよい。例えば、前記温度を低めに設定しても、二酸化炭素ガスの流量を多めに設定するか、二酸化炭素ガスの供給時間を長めに設定することで、あるいはこの両方を行うことで、効率的に二酸化炭素を供給できる。また、二酸化炭素ガスの流量を少なめに設定しても、前記温度を高めにするか、二酸化炭素ガスの供給時間を長めに設定することで、あるいはこの両方を行うことで、効率的に二酸化炭素を供給できる。すなわち、二酸化炭素ガスの流量、二酸化炭素ガス供給時の前記温度として例示した上記数値範囲の中の数値を、二酸化炭素ガスの供給時間も考慮しつつ柔軟に組み合わせることで、良好な品質の銀インク組成物が効率的に得られる。
The flow rate and supply time of carbon dioxide gas, and the temperature at the time of supplying carbon dioxide gas may be adjusted to a suitable range while considering each value. For example, even if the temperature is set lower, the carbon dioxide gas flow rate is set higher, the carbon dioxide gas supply time is set longer, or both are performed efficiently. Can supply carbon. Moreover, even if the flow rate of carbon dioxide gas is set to a small value, the carbon dioxide gas can be efficiently produced by increasing the temperature, setting the carbon dioxide gas supply time longer, or both. Can supply. That is, a silver ink of good quality can be obtained by flexibly combining the numerical values in the above numerical range exemplified as the flow rate of carbon dioxide gas and the temperature at the time of carbon dioxide gas supply while considering the supply time of carbon dioxide gas. A composition is obtained efficiently.
二酸化炭素ガスの供給は、第一の混合物を撹拌しながら行うことが好ましい。このようにすることで、供給した二酸化炭素ガスがより均一に第一の混合物中に拡散し、より効率的に二酸化炭素を供給できる。
この時の撹拌方法は、二酸化炭素を用いない上記の銀インク組成物の製造時における前記混合方法の場合と同様でよい。 The carbon dioxide gas is preferably supplied while stirring the first mixture. By doing in this way, the supplied carbon dioxide gas diffuses more uniformly in the first mixture, and carbon dioxide can be supplied more efficiently.
The stirring method at this time may be the same as in the case of the mixing method at the time of producing the above silver ink composition not using carbon dioxide.
この時の撹拌方法は、二酸化炭素を用いない上記の銀インク組成物の製造時における前記混合方法の場合と同様でよい。 The carbon dioxide gas is preferably supplied while stirring the first mixture. By doing in this way, the supplied carbon dioxide gas diffuses more uniformly in the first mixture, and carbon dioxide can be supplied more efficiently.
The stirring method at this time may be the same as in the case of the mixing method at the time of producing the above silver ink composition not using carbon dioxide.
ドライアイス(固形状二酸化炭素)の供給は、第一の混合物中にドライアイスを添加することで行えばよい。ドライアイスは、全量を一括して添加してもよいし、分割して段階的に(添加を行わない時間帯を挟んで連続的に)添加してもよい。
ドライアイスの使用量は、上記の二酸化炭素ガスの供給量を考慮して調節すればよい。
ドライアイスの添加中及び添加後は、第一の混合物を撹拌することが好ましく、例えば、二酸化炭素を用いない上記の銀インク組成物の製造時と同様の方法で撹拌することが好ましい。このようにすることで、効率的に二酸化炭素を供給できる。
撹拌時の温度は、二酸化炭素ガス供給時と同様でよい。また、撹拌時間は、撹拌温度に応じて適宜調節すればよい。 The supply of dry ice (solid carbon dioxide) may be performed by adding dry ice to the first mixture. The total amount of dry ice may be added all at once, or may be added stepwise (continuously across a time zone during which no addition is performed).
What is necessary is just to adjust the usage-amount of dry ice in consideration of the supply amount of said carbon dioxide gas.
During and after the addition of dry ice, the first mixture is preferably stirred. For example, the first mixture is preferably stirred in the same manner as in the production of the above silver ink composition without using carbon dioxide. By doing in this way, carbon dioxide can be supplied efficiently.
The temperature at the time of stirring may be the same as that at the time of supplying carbon dioxide gas. Moreover, what is necessary is just to adjust stirring time suitably according to stirring temperature.
ドライアイスの使用量は、上記の二酸化炭素ガスの供給量を考慮して調節すればよい。
ドライアイスの添加中及び添加後は、第一の混合物を撹拌することが好ましく、例えば、二酸化炭素を用いない上記の銀インク組成物の製造時と同様の方法で撹拌することが好ましい。このようにすることで、効率的に二酸化炭素を供給できる。
撹拌時の温度は、二酸化炭素ガス供給時と同様でよい。また、撹拌時間は、撹拌温度に応じて適宜調節すればよい。 The supply of dry ice (solid carbon dioxide) may be performed by adding dry ice to the first mixture. The total amount of dry ice may be added all at once, or may be added stepwise (continuously across a time zone during which no addition is performed).
What is necessary is just to adjust the usage-amount of dry ice in consideration of the supply amount of said carbon dioxide gas.
During and after the addition of dry ice, the first mixture is preferably stirred. For example, the first mixture is preferably stirred in the same manner as in the production of the above silver ink composition without using carbon dioxide. By doing in this way, carbon dioxide can be supplied efficiently.
The temperature at the time of stirring may be the same as that at the time of supplying carbon dioxide gas. Moreover, what is necessary is just to adjust stirring time suitably according to stirring temperature.
第二の混合物の粘度は、銀インク組成物又は第二の混合物の取り扱い方法など、目的に応じて適宜調節すればよく、特に限定されない。例えば、銀インク組成物をスクリーン印刷法、フレキソ印刷法等の高粘度インクを使用する印刷法へ適用する場合には、第二の混合物の20~25℃における粘度は、3Pa・s以上であることが好ましい。なお、ここでは第二の混合物の20~25℃における粘度について説明したが、第二の混合物の使用時の温度は、20~25℃に限定されるものではなく、任意に選択できる。
The viscosity of the second mixture may be appropriately adjusted according to the purpose, such as a method for handling the silver ink composition or the second mixture, and is not particularly limited. For example, when the silver ink composition is applied to a printing method using a high viscosity ink such as a screen printing method or a flexographic printing method, the viscosity of the second mixture at 20 to 25 ° C. is 3 Pa · s or more. It is preferable. Here, the viscosity of the second mixture at 20 to 25 ° C. has been described, but the temperature at the time of use of the second mixture is not limited to 20 to 25 ° C. and can be arbitrarily selected.
前記第二の混合物には、さらに、必要に応じて前記還元剤、アルコール及びその他の成分からなる群から選択される一種以上を配合して、銀インク組成物とすることができる。
このときの銀インク組成物は、配合成分が異なる点以外は、二酸化炭素を用いない上記の銀インク組成物と同様の方法で製造できる。そして、得られた銀インク組成物は、配合成分がすべて溶解していてもよいし、一部の成分が溶解せずに分散した状態であってもよいが、配合成分がすべて溶解していることが好ましく、溶解していない成分は均一に分散していることが好ましい。 If necessary, the second mixture may be further blended with one or more selected from the group consisting of the reducing agent, alcohol and other components to form a silver ink composition.
The silver ink composition at this time can be produced by the same method as the above silver ink composition not using carbon dioxide except that the blending components are different. The obtained silver ink composition may have all of the compounding components dissolved therein or may be in a state where some of the components are dispersed without dissolving, but all of the compounding components are dissolved. Preferably, the undissolved component is preferably dispersed uniformly.
このときの銀インク組成物は、配合成分が異なる点以外は、二酸化炭素を用いない上記の銀インク組成物と同様の方法で製造できる。そして、得られた銀インク組成物は、配合成分がすべて溶解していてもよいし、一部の成分が溶解せずに分散した状態であってもよいが、配合成分がすべて溶解していることが好ましく、溶解していない成分は均一に分散していることが好ましい。 If necessary, the second mixture may be further blended with one or more selected from the group consisting of the reducing agent, alcohol and other components to form a silver ink composition.
The silver ink composition at this time can be produced by the same method as the above silver ink composition not using carbon dioxide except that the blending components are different. The obtained silver ink composition may have all of the compounding components dissolved therein or may be in a state where some of the components are dispersed without dissolving, but all of the compounding components are dissolved. Preferably, the undissolved component is preferably dispersed uniformly.
前記還元剤配合時の温度は、各配合成分が劣化しない限り特に限定されないが、-5~60℃であることが好ましい。そして、配合時の温度は、配合成分の種類及び量に応じて、配合して得られた混合物が撹拌し易い粘度となるように、適宜調節するとよい。
また、配合時間は、配合成分の種類や配合時の温度に応じて適宜調節すればよいが、例えば、0.5~12時間であることが好ましい。 The temperature at the time of blending the reducing agent is not particularly limited as long as each blended component does not deteriorate, but is preferably −5 to 60 ° C. And the temperature at the time of mixing | blending is good to adjust suitably so that the mixture obtained by mix | blending may become the viscosity which is easy to stir according to the kind and quantity of a mixing | blending component.
In addition, the blending time may be appropriately adjusted according to the type of blending component and the temperature at the time of blending, but is preferably 0.5 to 12 hours, for example.
また、配合時間は、配合成分の種類や配合時の温度に応じて適宜調節すればよいが、例えば、0.5~12時間であることが好ましい。 The temperature at the time of blending the reducing agent is not particularly limited as long as each blended component does not deteriorate, but is preferably −5 to 60 ° C. And the temperature at the time of mixing | blending is good to adjust suitably so that the mixture obtained by mix | blending may become the viscosity which is easy to stir according to the kind and quantity of a mixing | blending component.
In addition, the blending time may be appropriately adjusted according to the type of blending component and the temperature at the time of blending, but is preferably 0.5 to 12 hours, for example.
前記その他の成分は、先に説明したように、前記第一の混合物及び第二の混合物のいずれかの製造時に配合されてもよく、両方の製造時に配合されてもよい。すなわち、第一の混合物及び第二の混合物を経て銀インク組成物を製造する過程において、二酸化炭素以外の配合成分の総量に対する前記その他の成分の配合量の割合([その他の成分(質量)]/[金属銀の形成材料、含窒素化合物、還元剤、アルコール、及びその他の成分(質量)]×100)は、前記その他の成分がアルコール以外の溶媒である場合、25質量%以下であることが好ましく、20質量%以下であることがより好ましく、15質量%以下であることが特に好ましい。一方、前記その他の成分が前記溶媒以外の成分である場合、前記配合量の割合は、10質量%以下であることが好ましく、5質量%以下であることがより好ましい。そして、前記配合量の割合が0質量、すなわちその他の成分を配合しなくても、銀インク組成物は十分にその効果を発現する。
As described above, the other components may be blended during the production of either the first mixture or the second mixture, or may be blended during the production of both. That is, in the process of producing the silver ink composition through the first mixture and the second mixture, the ratio of the blended amount of the other components to the total amount of blended components other than carbon dioxide ([other components (mass)] / [Formation material of metallic silver, nitrogen-containing compound, reducing agent, alcohol, and other components (mass)] × 100) is 25% by mass or less when the other components are solvents other than alcohol. Is more preferable, it is more preferable that it is 20 mass% or less, and it is especially preferable that it is 15 mass% or less. On the other hand, when the said other component is components other than the said solvent, it is preferable that the ratio of the said compounding quantity is 10 mass% or less, and it is more preferable that it is 5 mass% or less. And even if the ratio of the said compounding quantity is 0 mass, ie, it does not mix | blend another component, a silver ink composition fully expresses the effect.
二酸化炭素が供給されてなる銀インク組成物は、例えば、銀インク組成物をスクリーン印刷法、フレキソ印刷法等の高粘度インクを使用する印刷法へ適用する場合には、20~25℃における粘度が、1Pa・s以上であることが好ましい。
The silver ink composition to which carbon dioxide is supplied is, for example, a viscosity at 20 to 25 ° C. when the silver ink composition is applied to a printing method using a high viscosity ink such as a screen printing method or a flexographic printing method. Is preferably 1 Pa · s or more.
例えば、還元剤の配合時には、得られる配合物(銀インク組成物)は比較的発熱し易い。そして、還元剤の配合時の温度が高い場合、この配合物は、後述する銀インク組成物の加熱処理時と同様の状態になるため、還元剤による前記金属銀の形成材料の分解促進作用によって、金属銀の形成材料の少なくとも一部において金属銀の形成が開始されることがあると推測される。このような金属銀を含有する銀インク組成物は、導電体形成時において、金属銀を含有しない銀インク組成物よりも温和な条件で後処理を行うことにより、導電体を形成できることがある。また、還元剤の配合量が十分に多い場合にも、同様に温和な条件で後処理を行うことにより、導電体を形成できることがある。このように、金属銀の形成材料の分解を促進する条件を採用することで、後処理として、より低温での加熱処理で、あるいは加熱処理を行わずに常温での乾燥処理のみで、導電体を形成できることがある。また、このような金属銀を含有する銀インク組成物は、金属銀を含有しない銀インク組成物と同様に取り扱うことができ、特に取り扱い性が劣ることもない。
For example, when a reducing agent is blended, the resulting blend (silver ink composition) tends to generate heat relatively easily. And when the temperature at the time of mixing | blending of a reducing agent is high, since this compounding will be in the state similar to the time of the heat processing of the silver ink composition mentioned later, by the decomposition | disassembly acceleration | stimulation effect | action of the said metal silver formation material by a reducing agent It is presumed that the formation of metal silver may be started in at least a part of the metal silver forming material. A silver ink composition containing such metallic silver may be able to form a conductor by performing post-treatment under milder conditions than the silver ink composition not containing metallic silver at the time of forming the conductor. Further, even when the amount of the reducing agent is sufficiently large, the conductor may be formed by performing the post-treatment under the same mild conditions. In this way, by adopting conditions that promote the decomposition of the metal silver forming material, the conductor can be used as a post-treatment, either by a heat treatment at a lower temperature or by a drying treatment at normal temperature without performing the heat treatment. Can be formed. Moreover, the silver ink composition containing such metal silver can be handled in the same manner as the silver ink composition not containing metal silver, and the handleability is not particularly inferior.
なお、本発明における第二の混合物は、上記のように二酸化炭素の供給によって、粘度が通常よりも高い。一方で、第二の混合物への還元剤の配合時には、第二の混合物又は還元剤の種類によっては、上記のように前記金属銀の形成材料の少なくとも一部において金属銀の形成が開始され、金属銀が析出することがある。ここで、第二の混合物の粘度が高い場合には、析出した金属銀の凝集が抑制され、得られた銀インク組成物中での金属銀の分散性が向上する。このような銀インク組成物を用いて、後述する方法で金属銀を形成して得られた導電体は、粘度が低い、すなわち二酸化炭素が供給されていない混合物に還元剤が配合されて得られた銀インク組成物を用いた場合の導電体よりも、導電性が高く(体積抵抗率が低く)、表面粗さも小さくなり、より好ましい特性を有するものとなる。
The second mixture in the present invention has a higher viscosity than usual due to the supply of carbon dioxide as described above. On the other hand, when the reducing agent is blended into the second mixture, depending on the type of the second mixture or the reducing agent, formation of metallic silver is started in at least part of the metallic silver forming material as described above. Metallic silver may precipitate. Here, when the viscosity of the second mixture is high, the aggregation of the precipitated metallic silver is suppressed, and the dispersibility of the metallic silver in the obtained silver ink composition is improved. A conductor obtained by forming metallic silver by a method described later using such a silver ink composition is obtained by blending a reducing agent in a mixture having a low viscosity, that is, carbon dioxide is not supplied. In addition, it has higher electrical conductivity (lower volume resistivity), lower surface roughness, and more favorable characteristics than a conductor using a silver ink composition.
また、本発明においては、前記金属銀の形成材料、アルコール及び含窒素化合物が配合されてなる混合物に、二酸化炭素を供給して、銀インク組成物を製造することも好ましい。この場合、二酸化炭素の供給方法としては、上記と同様の方法が採用できる。
In the present invention, it is also preferable to produce a silver ink composition by supplying carbon dioxide to a mixture containing the metallic silver forming material, alcohol and nitrogen-containing compound. In this case, a method similar to the above can be adopted as a method for supplying carbon dioxide.
銀インク組成物を乾燥処理する場合には、公知の方法で行えばよく、例えば、常圧下、減圧下及び送風条件下のいずれで行ってもよく、大気下及び不活性ガス雰囲気下のいずれでおこなってもよい。そして、乾燥温度も特に限定されず、加熱乾燥及び常温乾燥のいずれでもよい。加熱処理が不要な場合の好ましい乾燥方法としては、18~30℃で大気下において乾燥させる方法が例示できる。
When the silver ink composition is subjected to a drying treatment, it may be carried out by a known method, for example, under normal pressure, under reduced pressure, or under a blowing condition, either under the atmosphere or under an inert gas atmosphere. You may do it. Also, the drying temperature is not particularly limited, and may be either heat drying or room temperature drying. As a preferable drying method when the heat treatment is unnecessary, a method of drying in the atmosphere at 18 to 30 ° C. can be exemplified.
銀インク組成物を加熱(焼成)処理する場合、その条件は、銀インク組成物の配合成分の種類に応じて適宜調節すればよい。通常は、加熱温度が60~370℃であることが好ましく、70~280℃であることがより好ましい。加熱時間は、加熱温度に応じて調節すればよいが、通常は、1分~24時間であることが好ましく、1分~12時間であることがより好ましい。前記金属銀の形成材料の中でも前記カルボン酸銀、特にβ-ケトカルボン酸銀(1)は、例えば、酸化銀等の金属銀の形成材料とは異なり、当該分野で公知の還元剤等を使用しなくても、低温で分解する。そして、このような分解温度を反映して、前記銀インク組成物は、上記のように、従来のものより極めて低温で金属銀を形成できる。
When the silver ink composition is heated (baked), the conditions may be adjusted as appropriate according to the type of ingredients of the silver ink composition. Usually, the heating temperature is preferably 60 to 370 ° C., more preferably 70 to 280 ° C. The heating time may be adjusted according to the heating temperature, but it is usually preferably 1 minute to 24 hours, and more preferably 1 minute to 12 hours. Among the metal silver forming materials, the silver carboxylate, particularly silver β-ketocarboxylate (1) is different from the metal silver forming material such as silver oxide, for example, using a reducing agent known in the art. Even if not, it decomposes at low temperature. Reflecting such decomposition temperature, the silver ink composition can form metallic silver at an extremely lower temperature than the conventional one as described above.
後述するように、銀インク組成物を耐熱性が低い基材に付着させて加熱(焼成)処理する場合には、加熱温度は130℃未満であることが好ましく、125℃以下であることがより好ましく、120℃以下であることが特に好ましい。
As will be described later, when the silver ink composition is attached to a substrate having low heat resistance and is heated (baked), the heating temperature is preferably less than 130 ° C., more preferably 125 ° C. or less. Preferably, it is 120 degrees C or less especially.
銀インク組成物の加熱処理の方法は、特に限定されず、例えば、電気炉による加熱、感熱方式の熱ヘッドによる加熱、遠赤外線照射による加熱、高熱ガスの吹き付けによる加熱等で行うことができる。また、銀インク組成物の加熱処理は、大気下で行ってもよいし、不活性ガス雰囲気下で行ってもよく、加湿条件下で行ってもよい。そして、常圧下、減圧下及び加圧下のいずれで行ってもよい。
The method for heat treatment of the silver ink composition is not particularly limited, and for example, heating by an electric furnace, heating by a thermal head, heating by far infrared irradiation, heating by blowing a hot gas, or the like can be performed. Further, the heat treatment of the silver ink composition may be performed in the air, in an inert gas atmosphere, or may be performed under humidified conditions. And you may carry out under any of normal pressure, pressure reduction, and pressurization.
本明細書において「加湿」とは、特に断りのない限り、湿度を人為的に増大させることを意味し、好ましくは相対湿度を5%以上とすることである。加熱処理時には、処理温度が高いことによって、処理環境での湿度が極めて低くなるため、5%という相対湿度は、明らかに人為的に増大されたものであるといえる。
In this specification, “humidification” means that the humidity is artificially increased unless otherwise specified, and the relative humidity is preferably 5% or more. At the time of heat treatment, since the humidity in the treatment environment becomes extremely low due to the high treatment temperature, it can be said that the relative humidity of 5% is clearly artificially increased.
銀インク組成物の加熱処理を加湿条件下で行う場合の相対湿度は、10%以上であることが好ましく、30%以上であることがより好ましく、50%以上であることがさらに好ましく、70%以上であることが特に好ましく、90%以上であってもよいし、100%であってもよい。そして、加湿条件下での加熱処理は、100℃以上に加熱した高圧水蒸気の吹き付けにより行ってもよい。このように加湿条件下で加熱処理することにより、短時間でより高純度の金属銀を形成できる。
The relative humidity when the heat treatment of the silver ink composition is performed under humidified conditions is preferably 10% or more, more preferably 30% or more, further preferably 50% or more, and 70%. It is particularly preferable that it be 90% or more, or 100%. And you may perform the heat processing under humidification conditions by spraying the high pressure steam heated to 100 degreeC or more. Thus, by heat-processing under humidification conditions, highly pure metallic silver can be formed in a short time.
銀インク組成物の加熱処理は、二段階で行ってもよい。例えば、一段階目の加熱処理では、金属銀の形成ではなく銀インク組成物の乾燥を主に行い、二段階目の加熱処理で、金属銀の形成を最後まで行う方法が例示できる。
一段階目の加熱処理において、加熱温度は、銀インク組成物の配合成分の種類に応じて適宜調節すればよいが、60~110℃であることが好ましく、70~90℃であることがより好ましい。また、加熱時間は、加熱温度に応じて調節すればよいが、通常は、5秒~12時間であることが好ましく、30秒~2時間であることがより好ましい。
二段階目の加熱処理において、加熱温度は、金属銀が良好に形成されるように、銀インク組成物の配合成分の種類に応じて適宜調節すればよいが、60~280℃であることが好ましく、70~260℃であることがより好ましい。また、加熱時間は、加熱温度に応じて調節すればよいが、通常は、1分~12時間であることが好ましく、1分~10時間であることがより好ましい。
後述するように、銀インク組成物を耐熱性が低い基材に付着させて加熱(焼成)処理する場合には、一段階目及び二段階目の加熱処理における加熱温度は、130℃未満であることが好ましく、125℃以下であることがより好ましく、120℃以下であることが特に好ましい。 The heat treatment of the silver ink composition may be performed in two stages. For example, in the first stage heat treatment, there is exemplified a method in which the silver ink composition is mainly dried rather than the formation of metal silver, and the formation of metal silver is completed in the second stage heat treatment.
In the first-stage heat treatment, the heating temperature may be appropriately adjusted according to the type of compounding component of the silver ink composition, but is preferably 60 to 110 ° C, more preferably 70 to 90 ° C. preferable. The heating time may be adjusted according to the heating temperature, but it is usually preferably 5 seconds to 12 hours, and more preferably 30 seconds to 2 hours.
In the second stage heat treatment, the heating temperature may be appropriately adjusted according to the type of compounding component of the silver ink composition so that metallic silver is formed satisfactorily, but it should be 60 to 280 ° C. Preferably, the temperature is 70 to 260 ° C. The heating time may be adjusted according to the heating temperature, but it is usually preferably 1 minute to 12 hours, and more preferably 1 minute to 10 hours.
As will be described later, when the silver ink composition is attached to a substrate having low heat resistance and is heated (baked), the heating temperature in the first and second stages is less than 130 ° C. It is preferably 125 ° C. or lower, more preferably 120 ° C. or lower.
一段階目の加熱処理において、加熱温度は、銀インク組成物の配合成分の種類に応じて適宜調節すればよいが、60~110℃であることが好ましく、70~90℃であることがより好ましい。また、加熱時間は、加熱温度に応じて調節すればよいが、通常は、5秒~12時間であることが好ましく、30秒~2時間であることがより好ましい。
二段階目の加熱処理において、加熱温度は、金属銀が良好に形成されるように、銀インク組成物の配合成分の種類に応じて適宜調節すればよいが、60~280℃であることが好ましく、70~260℃であることがより好ましい。また、加熱時間は、加熱温度に応じて調節すればよいが、通常は、1分~12時間であることが好ましく、1分~10時間であることがより好ましい。
後述するように、銀インク組成物を耐熱性が低い基材に付着させて加熱(焼成)処理する場合には、一段階目及び二段階目の加熱処理における加熱温度は、130℃未満であることが好ましく、125℃以下であることがより好ましく、120℃以下であることが特に好ましい。 The heat treatment of the silver ink composition may be performed in two stages. For example, in the first stage heat treatment, there is exemplified a method in which the silver ink composition is mainly dried rather than the formation of metal silver, and the formation of metal silver is completed in the second stage heat treatment.
In the first-stage heat treatment, the heating temperature may be appropriately adjusted according to the type of compounding component of the silver ink composition, but is preferably 60 to 110 ° C, more preferably 70 to 90 ° C. preferable. The heating time may be adjusted according to the heating temperature, but it is usually preferably 5 seconds to 12 hours, and more preferably 30 seconds to 2 hours.
In the second stage heat treatment, the heating temperature may be appropriately adjusted according to the type of compounding component of the silver ink composition so that metallic silver is formed satisfactorily, but it should be 60 to 280 ° C. Preferably, the temperature is 70 to 260 ° C. The heating time may be adjusted according to the heating temperature, but it is usually preferably 1 minute to 12 hours, and more preferably 1 minute to 10 hours.
As will be described later, when the silver ink composition is attached to a substrate having low heat resistance and is heated (baked), the heating temperature in the first and second stages is less than 130 ° C. It is preferably 125 ° C. or lower, more preferably 120 ° C. or lower.
ここまでで説明した銀インク組成物の加熱処理は、いずれも気相中で行うものであるが、銀インク組成物の加熱処理を二段階で行う場合、二段階目の加熱処理は、気相中ではなく液相中で行ってもよい。一段階目の加熱処理を経て、完全に又はある程度乾燥した銀インク組成物は、加熱した液体と接触させることで、その形状を損なうことなく、二段階目の加熱処理を行うことができる。そして、銀インク組成物の、一段階目の加熱処理を行った後の二段階目の液相中での加熱処理は、加熱した液体に銀インク組成物を浸漬することで行うことが好ましい。この液相中での加熱処理における加熱温度及び加熱時間は、先に説明した二段階目の加熱処理における加熱温度及び加熱時間と同じである。
上記の加熱した液体は湯(加熱した水)であることが好ましく、二段階目の加熱処理は、一段階目の加熱処理を行った銀インク組成物を湯中に浸漬すること、すなわち湯煎によって行うことが好ましい。
二段階目の加熱処理を液相中で行った場合には、この加熱処理によって形成された金属銀を、さらに乾燥させればよい。 The heat treatment of the silver ink composition described so far is performed in the gas phase. However, when the heat treatment of the silver ink composition is performed in two steps, the heat treatment in the second step is performed in the gas phase. You may carry out in a liquid phase instead of inside. The silver ink composition that has been completely or partially dried through the first stage heat treatment can be subjected to the second stage heat treatment without impairing its shape by contacting with the heated liquid. And it is preferable to perform the heat processing in the liquid phase of the 2nd step after performing the heat processing of the 1st step of a silver ink composition by immersing a silver ink composition in the heated liquid. The heating temperature and heating time in the heat treatment in the liquid phase are the same as the heating temperature and heating time in the second-stage heat treatment described above.
The heated liquid is preferably hot water (heated water), and the second stage heat treatment is performed by immersing the silver ink composition subjected to the first stage heat treatment in hot water, that is, by hot water bathing. Preferably it is done.
When the second stage heat treatment is performed in the liquid phase, the metallic silver formed by this heat treatment may be further dried.
上記の加熱した液体は湯(加熱した水)であることが好ましく、二段階目の加熱処理は、一段階目の加熱処理を行った銀インク組成物を湯中に浸漬すること、すなわち湯煎によって行うことが好ましい。
二段階目の加熱処理を液相中で行った場合には、この加熱処理によって形成された金属銀を、さらに乾燥させればよい。 The heat treatment of the silver ink composition described so far is performed in the gas phase. However, when the heat treatment of the silver ink composition is performed in two steps, the heat treatment in the second step is performed in the gas phase. You may carry out in a liquid phase instead of inside. The silver ink composition that has been completely or partially dried through the first stage heat treatment can be subjected to the second stage heat treatment without impairing its shape by contacting with the heated liquid. And it is preferable to perform the heat processing in the liquid phase of the 2nd step after performing the heat processing of the 1st step of a silver ink composition by immersing a silver ink composition in the heated liquid. The heating temperature and heating time in the heat treatment in the liquid phase are the same as the heating temperature and heating time in the second-stage heat treatment described above.
The heated liquid is preferably hot water (heated water), and the second stage heat treatment is performed by immersing the silver ink composition subjected to the first stage heat treatment in hot water, that is, by hot water bathing. Preferably it is done.
When the second stage heat treatment is performed in the liquid phase, the metallic silver formed by this heat treatment may be further dried.
銀インク組成物の二段階目の加熱処理を液相中で行う場合、銀インク組成物の一段階目の加熱処理は、非加湿条件下で行うことが好ましい。
なお、本明細書において「非加湿」とは、上述の「加湿」を行わないこと、すなわち、湿度を人為的に増大させないことを意味し、好ましくは相対湿度を5%未満とすることである。 When the second stage heat treatment of the silver ink composition is performed in a liquid phase, the first stage heat treatment of the silver ink composition is preferably performed under non-humidified conditions.
In the present specification, “non-humidification” means that the above “humidification” is not performed, that is, the humidity is not artificially increased, and preferably the relative humidity is less than 5%. .
なお、本明細書において「非加湿」とは、上述の「加湿」を行わないこと、すなわち、湿度を人為的に増大させないことを意味し、好ましくは相対湿度を5%未満とすることである。 When the second stage heat treatment of the silver ink composition is performed in a liquid phase, the first stage heat treatment of the silver ink composition is preferably performed under non-humidified conditions.
In the present specification, “non-humidification” means that the above “humidification” is not performed, that is, the humidity is not artificially increased, and preferably the relative humidity is less than 5%. .
加湿条件下での加熱処理を採用する場合、銀インク組成物の加熱処理は、一段階目の加熱処理において、非加湿条件下で、上述のように金属銀の形成ではなく銀インク組成物の乾燥を主に行い、二段階目の加熱処理において、加湿条件下で、上述のように金属銀の形成を最後まで行う、二段階の方法で行うことが特に好ましい。
When heat treatment under humidified conditions is employed, the heat treatment of the silver ink composition is not the formation of metallic silver as described above under non-humidified conditions in the first stage heat treatment. It is particularly preferable to perform drying in a two-stage method in which the formation of metallic silver is performed to the end as described above under humidified conditions in the second-stage heat treatment.
二段階目の加熱処理を加湿条件下で行う場合、一段階目の非加湿条件下での加熱処理時の加熱温度は、60~110℃であることが好ましく、70~90℃であることがより好ましい。また、加熱時間は、5秒~1時間であることが好ましく、30秒~30分であることがより好ましく、30秒~10分であることが特に好ましい。
一段階目の非加湿条件下での加熱処理に次いで行う、二段階目の加湿条件下での加熱処理時の加熱温度は、60~140℃であることが好ましく、70~130℃であることがより好ましい。また、加熱時間は、1分~2時間であることが好ましく、1分~1時間であることがより好ましく、1分~30分であることが特に好ましい。
後述するように、銀インク組成物を耐熱性が低い基材に付着させて加熱(焼成)処理する場合には、一段階目の非加湿条件下での加熱処理及び二段階目の加湿条件下での加熱処理における加熱温度は、いずれも130℃未満であることが好ましく、125℃以下であることがより好ましく、120℃以下であることが特に好ましい。 When the second stage heat treatment is performed under humidified conditions, the heating temperature during the heat treatment under the first stage non-humidified conditions is preferably 60 to 110 ° C., and preferably 70 to 90 ° C. More preferred. The heating time is preferably 5 seconds to 1 hour, more preferably 30 seconds to 30 minutes, and particularly preferably 30 seconds to 10 minutes.
The heating temperature during the heat treatment under the second-stage humidification condition, which is performed after the heat treatment under the first-stage non-humidification conditions, is preferably 60 to 140 ° C, and preferably 70 to 130 ° C. Is more preferable. The heating time is preferably 1 minute to 2 hours, more preferably 1 minute to 1 hour, and particularly preferably 1 minute to 30 minutes.
As will be described later, when the silver ink composition is attached to a substrate having low heat resistance and heated (baked), the heat treatment under the first non-humidifying condition and the second humidifying condition are performed. The heating temperature in the heat treatment at is preferably less than 130 ° C, more preferably 125 ° C or less, and particularly preferably 120 ° C or less.
一段階目の非加湿条件下での加熱処理に次いで行う、二段階目の加湿条件下での加熱処理時の加熱温度は、60~140℃であることが好ましく、70~130℃であることがより好ましい。また、加熱時間は、1分~2時間であることが好ましく、1分~1時間であることがより好ましく、1分~30分であることが特に好ましい。
後述するように、銀インク組成物を耐熱性が低い基材に付着させて加熱(焼成)処理する場合には、一段階目の非加湿条件下での加熱処理及び二段階目の加湿条件下での加熱処理における加熱温度は、いずれも130℃未満であることが好ましく、125℃以下であることがより好ましく、120℃以下であることが特に好ましい。 When the second stage heat treatment is performed under humidified conditions, the heating temperature during the heat treatment under the first stage non-humidified conditions is preferably 60 to 110 ° C., and preferably 70 to 90 ° C. More preferred. The heating time is preferably 5 seconds to 1 hour, more preferably 30 seconds to 30 minutes, and particularly preferably 30 seconds to 10 minutes.
The heating temperature during the heat treatment under the second-stage humidification condition, which is performed after the heat treatment under the first-stage non-humidification conditions, is preferably 60 to 140 ° C, and preferably 70 to 130 ° C. Is more preferable. The heating time is preferably 1 minute to 2 hours, more preferably 1 minute to 1 hour, and particularly preferably 1 minute to 30 minutes.
As will be described later, when the silver ink composition is attached to a substrate having low heat resistance and heated (baked), the heat treatment under the first non-humidifying condition and the second humidifying condition are performed. The heating temperature in the heat treatment at is preferably less than 130 ° C, more preferably 125 ° C or less, and particularly preferably 120 ° C or less.
以上のように、前記金属銀の製造方法で好ましいものとしては、例えば、β-ケトカルボン酸銀(1)を用いて、前記金属銀を形成する工程を有するものが挙げられ、中でも好ましい製造方法としては、例えば、前記金属銀を形成する工程において、β-ケトカルボン酸銀(1)が配合されてなる銀インク組成物を、非加湿条件下で加熱処理した後、さらに加湿条件下で、又は加熱した液体と接触させて、加熱処理することで、前記金属銀を形成するものが挙げられる。
As described above, preferred examples of the method for producing metallic silver include those having the step of forming metallic silver using β-ketocarboxylate silver (1). For example, in the step of forming metallic silver, a silver ink composition containing silver β-ketocarboxylate (1) is heat-treated under non-humidified conditions and then further humidified or heated. What forms the said metal silver is mentioned by making it contact with the liquid which was made and heat-processing.
<<積層体>>
本発明の積層体は、上述の本発明の金属銀からなる層(以下、「銀層」と略記することがある)を基材上に備えたものである。
前記金属銀は、これを形成するための銀インク組成物を130℃未満という低い温度で、乾燥処理や加熱(焼成)処理等の後処理を行うことで形成できるため、前記基材として耐熱性が低いものを用いても前記銀層を形成でき、幅広い材質の基材を用いることができる。また、前記積層体の銀層は、前記金属銀からなるため、体積抵抗率が8μΩ・cm以下となり、十分に高い導電性を有する。 << Laminate >>
The laminate of the present invention comprises a layer made of the above-described metallic silver of the present invention (hereinafter sometimes abbreviated as “silver layer”) on a substrate.
The metallic silver can be formed by subjecting the silver ink composition for forming it to a post-treatment such as drying or heating (firing) at a temperature as low as less than 130 ° C. The silver layer can be formed even when a material having a low thickness is used, and a wide variety of base materials can be used. Moreover, since the silver layer of the said laminated body consists of said metallic silver, a volume resistivity will be 8 microhm * cm or less, and it has sufficiently high electroconductivity.
本発明の積層体は、上述の本発明の金属銀からなる層(以下、「銀層」と略記することがある)を基材上に備えたものである。
前記金属銀は、これを形成するための銀インク組成物を130℃未満という低い温度で、乾燥処理や加熱(焼成)処理等の後処理を行うことで形成できるため、前記基材として耐熱性が低いものを用いても前記銀層を形成でき、幅広い材質の基材を用いることができる。また、前記積層体の銀層は、前記金属銀からなるため、体積抵抗率が8μΩ・cm以下となり、十分に高い導電性を有する。 << Laminate >>
The laminate of the present invention comprises a layer made of the above-described metallic silver of the present invention (hereinafter sometimes abbreviated as “silver layer”) on a substrate.
The metallic silver can be formed by subjecting the silver ink composition for forming it to a post-treatment such as drying or heating (firing) at a temperature as low as less than 130 ° C. The silver layer can be formed even when a material having a low thickness is used, and a wide variety of base materials can be used. Moreover, since the silver layer of the said laminated body consists of said metallic silver, a volume resistivity will be 8 microhm * cm or less, and it has sufficiently high electroconductivity.
図1は、本発明の積層体の一例を模式的に示す断面図である。
ここに示す積層体1は、基材11の表面(一方の主面)11aに銀層12が積層されてなるものである。 FIG. 1 is a cross-sectional view schematically showing an example of the laminate of the present invention.
The laminated body 1 shown here is formed by laminating asilver layer 12 on the surface (one main surface) 11a of a base material 11.
ここに示す積層体1は、基材11の表面(一方の主面)11aに銀層12が積層されてなるものである。 FIG. 1 is a cross-sectional view schematically showing an example of the laminate of the present invention.
The laminated body 1 shown here is formed by laminating a
<基材>
基材11は、上述の金属銀を形成するための組成物を使用できるものであれば、特に限定されない。
基材11の材質として具体的には、ポリエチレン(PE);ポリプロピレン(PP);ポリ塩化ビニル(PVC);ポリ塩化ビニリデン(PVDC);ポリメチルペンテン(PMP);ポリシクロオレフィン;ポリスチレン(PS);ポリ酢酸ビニル(PVAc);ポリメタクリル酸メチル(PMMA)等のアクリル樹脂;AS樹脂;ABS樹脂;ナイロン6,6、ナイロン6等のポリアミド(PA);ポリイミド;ポリアミドイミド(PAI);ポリアセタール(POM);ポリエチレンテレフタレート(PET);ポリブチレンテレフタレート(PBT);ポリトリメチレンテレフタレート(PTT);ポリエチレンナフタレート(PEN);ポリブチレンナフタレート(PBN);ポリフェニレンスルファイド(PPS);ポリスルホン(PSF);ポリエーテルスルホン(PES);ポリエーテルケトン(PEK);ポリエーテルエーテルケトン(PEEK);ポリカーボネート(PC);ポリウレタン;ポリフェニレンエーテル(PPE);変性ポリフェニレンエーテル(m-PPE);ポリアリレート;エポキシ樹脂;メラミン樹脂;フェノール樹脂;尿素樹脂等の合成樹脂が例示できる。
また、基材11の材質としては、上記以外にも、ガラス、シリコン等のセラミックスや、紙が例示できる。
また、基材11は、ガラスエポキシ樹脂、ポリマーアロイ等の、二種以上の材質を併用したものでもよい。 <Base material>
Thebase material 11 will not be specifically limited if the composition for forming the above-mentioned metallic silver can be used.
Specifically, the material of thesubstrate 11 is polyethylene (PE); polypropylene (PP); polyvinyl chloride (PVC); polyvinylidene chloride (PVDC); polymethylpentene (PMP); polycycloolefin; polystyrene (PS). An acrylic resin such as polymethyl methacrylate (PMMA); an AS resin; an ABS resin; a polyamide (PA) such as nylon 6, 6 and nylon 6; a polyimide; a polyamideimide (PAI); a polyacetal ( POM); polyethylene terephthalate (PET); polybutylene terephthalate (PBT); polytrimethylene terephthalate (PTT); polyethylene naphthalate (PEN); polybutylene naphthalate (PBN); polyphenylene sulfide (PPS); Polyethersulfone (PES); Polyetherketone (PEK); Polyetheretherketone (PEEK); Polycarbonate (PC); Polyurethane; Polyphenyleneether (PPE); Modified polyphenyleneether (m-PPE); Polyarylate An epoxy resin; a melamine resin; a phenol resin; and a synthetic resin such as a urea resin.
In addition to the above, the material of thebase material 11 can be exemplified by ceramics such as glass and silicon, and paper.
Thesubstrate 11 may be a combination of two or more materials such as glass epoxy resin and polymer alloy.
基材11は、上述の金属銀を形成するための組成物を使用できるものであれば、特に限定されない。
基材11の材質として具体的には、ポリエチレン(PE);ポリプロピレン(PP);ポリ塩化ビニル(PVC);ポリ塩化ビニリデン(PVDC);ポリメチルペンテン(PMP);ポリシクロオレフィン;ポリスチレン(PS);ポリ酢酸ビニル(PVAc);ポリメタクリル酸メチル(PMMA)等のアクリル樹脂;AS樹脂;ABS樹脂;ナイロン6,6、ナイロン6等のポリアミド(PA);ポリイミド;ポリアミドイミド(PAI);ポリアセタール(POM);ポリエチレンテレフタレート(PET);ポリブチレンテレフタレート(PBT);ポリトリメチレンテレフタレート(PTT);ポリエチレンナフタレート(PEN);ポリブチレンナフタレート(PBN);ポリフェニレンスルファイド(PPS);ポリスルホン(PSF);ポリエーテルスルホン(PES);ポリエーテルケトン(PEK);ポリエーテルエーテルケトン(PEEK);ポリカーボネート(PC);ポリウレタン;ポリフェニレンエーテル(PPE);変性ポリフェニレンエーテル(m-PPE);ポリアリレート;エポキシ樹脂;メラミン樹脂;フェノール樹脂;尿素樹脂等の合成樹脂が例示できる。
また、基材11の材質としては、上記以外にも、ガラス、シリコン等のセラミックスや、紙が例示できる。
また、基材11は、ガラスエポキシ樹脂、ポリマーアロイ等の、二種以上の材質を併用したものでもよい。 <Base material>
The
Specifically, the material of the
In addition to the above, the material of the
The
本発明において、耐熱性が低い基材11としては、ASTM D648で規定される、1.8MPaの曲げ応力でたわみ量が0.25mmとなるときの荷重たわみ温度が、120℃以下となるものが例示できる。
このような基材11の材質で好ましいものとしては、ポリエチレン、ポリプロピレンホモポリマー、ABS樹脂、ポリアセタールコポリマー、ポリエチレンテレフタレート、ナイロン6,6、ナイロン6、ポリカーボネート/ABS樹脂アロイ等が例示できる。 In the present invention, as thebase material 11 having low heat resistance, a material having a deflection temperature under a load of 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648 is 120 ° C. or less. It can be illustrated.
Preferred examples of such a material for thesubstrate 11 include polyethylene, polypropylene homopolymer, ABS resin, polyacetal copolymer, polyethylene terephthalate, nylon 6,6, nylon 6, polycarbonate / ABS resin alloy, and the like.
このような基材11の材質で好ましいものとしては、ポリエチレン、ポリプロピレンホモポリマー、ABS樹脂、ポリアセタールコポリマー、ポリエチレンテレフタレート、ナイロン6,6、ナイロン6、ポリカーボネート/ABS樹脂アロイ等が例示できる。 In the present invention, as the
Preferred examples of such a material for the
基材11は、目的に応じて任意の形状を選択でき、例えば、フィルム状又はシート状であることが好ましく、厚さが0.5~5000μmであることが好ましく、0.5~2500μmであることがより好ましい。基材11の厚さが前記下限値以上であることで、銀層の構造をより安定して保持でき、基材11の厚さが前記上限値以下であることで、銀層形成時の取り扱い性がより良好となる。
The substrate 11 can be selected in any shape depending on the purpose, and is preferably in the form of a film or a sheet, for example, preferably having a thickness of 0.5 to 5000 μm, and 0.5 to 2500 μm. It is more preferable. When the thickness of the base material 11 is equal to or greater than the lower limit value, the structure of the silver layer can be more stably maintained, and when the thickness of the base material 11 is equal to or less than the upper limit value, handling at the time of forming the silver layer The property becomes better.
基材11は、単層からなるものでもよいし、二層以上の複数層からなるものでもよい。基材11が複数層からなる場合、これら複数層は、互いに同一でも異なっていてもよい。すなわち、すべての層が同一であってもよいし、すべての層が異なっていてもよく、一部の層のみが異なっていてもよい。そして、複数層が互いに異なる場合、これら複数層の組み合わせは特に限定されない。ここで、複数層が互いに異なるとは、各層の材質及び厚さの少なくとも一方が互いに異なることを意味する。
なお、基材11が複数層からなる場合には、各層の合計の厚さが、上記の好ましい基材11の厚さとなるようにするとよい。 Thesubstrate 11 may be composed of a single layer, or may be composed of two or more layers. When the base material 11 consists of multiple layers, these multiple layers may be the same as or different from each other. That is, all the layers may be the same, all the layers may be different, or only some of the layers may be different. And when several layers differ from each other, the combination of these several layers is not specifically limited. Here, the plurality of layers being different from each other means that at least one of the material and the thickness of each layer is different from each other.
In addition, when thebase material 11 consists of multiple layers, it is good to make it the thickness of the total of each layer be the thickness of said preferable base material 11.
なお、基材11が複数層からなる場合には、各層の合計の厚さが、上記の好ましい基材11の厚さとなるようにするとよい。 The
In addition, when the
<銀層>
銀層12は、上述の本発明の金属銀からなる。
基材11の一方の主面(表面)11aを上方から見下ろすように、積層体1を平面視したときの、銀層12の形状は、目的に応じて任意に設定でき、基材11の表面11aの全面に銀層12が設けられていてもよいし、基材11の表面11aのうち、一部のみに銀層12が設けられていてもよく、この場合、銀層12はパターニングされていてもよい。
パターニングされた銀層12は、例えば、配線として有用である。 <Silver layer>
Thesilver layer 12 is made of the above-described metallic silver of the present invention.
The shape of thesilver layer 12 when the laminate 1 is viewed in plan so that one main surface (surface) 11a of the substrate 11 is looked down from above can be arbitrarily set according to the purpose, and the surface of the substrate 11 The silver layer 12 may be provided on the entire surface of 11a, or the silver layer 12 may be provided on only a part of the surface 11a of the base material 11. In this case, the silver layer 12 is patterned. May be.
The patternedsilver layer 12 is useful as a wiring, for example.
銀層12は、上述の本発明の金属銀からなる。
基材11の一方の主面(表面)11aを上方から見下ろすように、積層体1を平面視したときの、銀層12の形状は、目的に応じて任意に設定でき、基材11の表面11aの全面に銀層12が設けられていてもよいし、基材11の表面11aのうち、一部のみに銀層12が設けられていてもよく、この場合、銀層12はパターニングされていてもよい。
パターニングされた銀層12は、例えば、配線として有用である。 <Silver layer>
The
The shape of the
The patterned
銀層12の厚さは、目的に応じて任意に設定できるが、0.01~5μmであることが好ましく、0.05~3μmであることがより好ましい。銀層12の厚さが前記下限値以上であることで、導電性をより向上させることができ、さらに、銀層12の構造をより安定して維持できる。また、銀層12の厚さが前記上限値以下であることで、積層体1をより薄層化できる。
The thickness of the silver layer 12 can be arbitrarily set according to the purpose, but is preferably 0.01 to 5 μm, and more preferably 0.05 to 3 μm. When the thickness of the silver layer 12 is equal to or more than the lower limit value, the conductivity can be further improved, and the structure of the silver layer 12 can be more stably maintained. Moreover, the laminated body 1 can be made thinner by the thickness of the silver layer 12 being the said upper limit or less.
銀層12は、単層からなるものでもよいし、二層以上の複数層からなるものでもよい。銀層12が複数層からなる場合、これら複数層は、互いに同一でも異なっていてもよく、基材11の場合と同様に構成できる。例えば、複数層からなる銀層12は、各層の合計の厚さが、上記の好ましい銀層12の厚さとなるようにするとよい。
The silver layer 12 may be composed of a single layer or may be composed of two or more layers. When the silver layer 12 consists of a plurality of layers, these layers may be the same as or different from each other, and can be configured in the same manner as in the case of the substrate 11. For example, the silver layer 12 composed of a plurality of layers may be configured such that the total thickness of each layer is the thickness of the preferred silver layer 12 described above.
銀層12は導電性に優れ、その体積抵抗率は、上述のように8μΩ・cm以下である。
The silver layer 12 is excellent in conductivity, and its volume resistivity is 8 μΩ · cm or less as described above.
本発明の積層体は、図1に示すものに限定されず、本発明の効果を損なわない範囲内において、他の構成が追加されたり、一部構成が適宜変更されたものでもよい。例えば、基材11上に銀層12以外のその他の層が設けられたものでもよく、前記その他の層としては、基材11と銀層12との間に設けられる受容層(図示略)、及び銀層12を被覆するオーバーコート層(図示略)等が例示できる。前記受容層は、銀層と基材との密着性を向上させるものである。
また、ここでは、積層体1として基材11の一方の主面(表面)11a上に銀層12を備えたものを示しているが、本発明の積層体は、基材11の他方の主面(裏面)11b上にも同様に(基材11の両方の主面上に)銀層12を備えたものでもよい。 The laminated body of the present invention is not limited to that shown in FIG. 1, and other configurations may be added or a part of the configuration may be appropriately changed within a range not impairing the effects of the present invention. For example, another layer other than thesilver layer 12 may be provided on the base material 11, and the other layer may include a receiving layer (not shown) provided between the base material 11 and the silver layer 12, An overcoat layer (not shown) for covering the silver layer 12 can be exemplified. The receptor layer improves the adhesion between the silver layer and the substrate.
In addition, here, the laminate 1 is shown having asilver layer 12 on one main surface (surface) 11a of the base material 11, but the laminate of the present invention is the other main surface of the base material 11. Similarly, the surface (back surface) 11b may be provided with the silver layer 12 (on both main surfaces of the base material 11).
また、ここでは、積層体1として基材11の一方の主面(表面)11a上に銀層12を備えたものを示しているが、本発明の積層体は、基材11の他方の主面(裏面)11b上にも同様に(基材11の両方の主面上に)銀層12を備えたものでもよい。 The laminated body of the present invention is not limited to that shown in FIG. 1, and other configurations may be added or a part of the configuration may be appropriately changed within a range not impairing the effects of the present invention. For example, another layer other than the
In addition, here, the laminate 1 is shown having a
<<積層体の製造方法>>
本発明の積層体は、例えば、基材上に銀層を形成する工程(以下、「銀層形成工程」と略記することがある)を有する製造方法で製造できる。 << Manufacturing Method of Laminate >>
The laminate of the present invention can be produced, for example, by a production method having a step of forming a silver layer on a substrate (hereinafter sometimes abbreviated as “silver layer formation step”).
本発明の積層体は、例えば、基材上に銀層を形成する工程(以下、「銀層形成工程」と略記することがある)を有する製造方法で製造できる。 << Manufacturing Method of Laminate >>
The laminate of the present invention can be produced, for example, by a production method having a step of forming a silver layer on a substrate (hereinafter sometimes abbreviated as “silver layer formation step”).
<銀層形成工程>
銀層形成工程においては、基材の表面(図1においては、基材11の表面(主面)11a)上に銀層を形成する。 <Silver layer formation process>
In the silver layer forming step, a silver layer is formed on the surface of the substrate (in FIG. 1, the surface (main surface) 11a of the substrate 11).
銀層形成工程においては、基材の表面(図1においては、基材11の表面(主面)11a)上に銀層を形成する。 <Silver layer formation process>
In the silver layer forming step, a silver layer is formed on the surface of the substrate (in FIG. 1, the surface (main surface) 11a of the substrate 11).
銀層は、上述の金属銀を形成するための銀インク組成物を、基材の表面(主面)上の所望の箇所に付着させ、乾燥処理や加熱(焼成)処理等の固化処理を適宜選択して行うことで形成できる。加熱処理は、乾燥処理を兼ねて行ってもよい。
For the silver layer, the silver ink composition for forming the above-described metallic silver is attached to a desired location on the surface (main surface) of the substrate, and solidification treatment such as drying treatment or heating (firing) treatment is appropriately performed. It can be formed by selecting and performing. The heat treatment may be performed also as a drying treatment.
銀インク組成物は、例えば、印刷法、塗布法、浸漬法等の公知の方法で基材に付着させることができる。
前記印刷法としては、スクリーン印刷法、フレキソ印刷法、オフセット印刷法、ディップ式印刷法、インクジェット式印刷法、ディスペンサー式印刷法、ジェットディスペンサー式印刷法、グラビア印刷法、グラビアオフセット印刷法、パッド印刷法等が例示できる。
前記塗布法としては、スピンコーター、エアーナイフコーター、カーテンコーター、ダイコーター、ブレードコーター、ロールコーター、ゲートロールコーター、バーコーター、ロッドコーター、グラビアコーター等の各種コーターや、ワイヤーバー等を用いる方法が例示できる。 A silver ink composition can be made to adhere to a base material by well-known methods, such as a printing method, the apply | coating method, and the immersion method, for example.
Examples of the printing method include screen printing method, flexographic printing method, offset printing method, dip printing method, ink jet printing method, dispenser printing method, jet dispenser printing method, gravure printing method, gravure offset printing method, pad printing. Laws can be exemplified.
Examples of the coating method include spin coaters, air knife coaters, curtain coaters, die coaters, blade coaters, roll coaters, gate roll coaters, bar coaters, rod coaters, gravure coaters, and other methods such as wire bars. It can be illustrated.
前記印刷法としては、スクリーン印刷法、フレキソ印刷法、オフセット印刷法、ディップ式印刷法、インクジェット式印刷法、ディスペンサー式印刷法、ジェットディスペンサー式印刷法、グラビア印刷法、グラビアオフセット印刷法、パッド印刷法等が例示できる。
前記塗布法としては、スピンコーター、エアーナイフコーター、カーテンコーター、ダイコーター、ブレードコーター、ロールコーター、ゲートロールコーター、バーコーター、ロッドコーター、グラビアコーター等の各種コーターや、ワイヤーバー等を用いる方法が例示できる。 A silver ink composition can be made to adhere to a base material by well-known methods, such as a printing method, the apply | coating method, and the immersion method, for example.
Examples of the printing method include screen printing method, flexographic printing method, offset printing method, dip printing method, ink jet printing method, dispenser printing method, jet dispenser printing method, gravure printing method, gravure offset printing method, pad printing. Laws can be exemplified.
Examples of the coating method include spin coaters, air knife coaters, curtain coaters, die coaters, blade coaters, roll coaters, gate roll coaters, bar coaters, rod coaters, gravure coaters, and other methods such as wire bars. It can be illustrated.
銀層形成工程においては、基材上に付着させる銀インク組成物の量、又は銀インク組成物における前記金属銀の形成材料等の配合量を調節することで、銀層の厚さを調節できる。
In the silver layer forming step, the thickness of the silver layer can be adjusted by adjusting the amount of the silver ink composition to be deposited on the substrate, or the blending amount of the metallic silver forming material in the silver ink composition. .
銀層形成工程においては、銀インク組成物を付着させる前に、基材を加熱処理(アニール処理)してもよい。基材を加熱処理しておくことで、例えば、銀インク組成物を加熱(焼成)処理したときに、基材の収縮が抑制され、寸法安定性が向上する。
銀インク組成物を付着させる前の、基材の加熱処理の条件は、基材の種類に応じて適宜調節すればよく、特に限定されないが、60~200℃で10~60分間加熱処理することが好ましく、例えば、銀層形成工程での銀インク組成物の加熱(焼成)処理の条件と同じでもよい。 In the silver layer forming step, the substrate may be heat-treated (annealed) before the silver ink composition is attached. By heat-treating the base material, for example, when the silver ink composition is heat-treated (baked), shrinkage of the base material is suppressed and dimensional stability is improved.
The conditions for the heat treatment of the base material before adhering the silver ink composition may be appropriately adjusted according to the type of the base material, and are not particularly limited, but the heat treatment is performed at 60 to 200 ° C. for 10 to 60 minutes. For example, it may be the same as the conditions of the heating (firing) treatment of the silver ink composition in the silver layer forming step.
銀インク組成物を付着させる前の、基材の加熱処理の条件は、基材の種類に応じて適宜調節すればよく、特に限定されないが、60~200℃で10~60分間加熱処理することが好ましく、例えば、銀層形成工程での銀インク組成物の加熱(焼成)処理の条件と同じでもよい。 In the silver layer forming step, the substrate may be heat-treated (annealed) before the silver ink composition is attached. By heat-treating the base material, for example, when the silver ink composition is heat-treated (baked), shrinkage of the base material is suppressed and dimensional stability is improved.
The conditions for the heat treatment of the base material before adhering the silver ink composition may be appropriately adjusted according to the type of the base material, and are not particularly limited, but the heat treatment is performed at 60 to 200 ° C. for 10 to 60 minutes. For example, it may be the same as the conditions of the heating (firing) treatment of the silver ink composition in the silver layer forming step.
また、本発明においては、銀インク組成物を付着させる前に、基材の表面をプラズマ処理してもよい。基材をプラズマ処理しておくことで、銀インク組成物の滲みが抑制されることがある。
プラズマ処理は公知の方法で行えばよく、例えば、大気圧プラズマ処理の場合には、電圧290~300W、気流速度1.0~5.0m/分等の条件で行うことができる。 In the present invention, the surface of the substrate may be plasma-treated before the silver ink composition is attached. By subjecting the substrate to plasma treatment, bleeding of the silver ink composition may be suppressed.
The plasma treatment may be performed by a known method. For example, in the case of atmospheric pressure plasma treatment, it can be performed under conditions of a voltage of 290 to 300 W, an air velocity of 1.0 to 5.0 m / min, and the like.
プラズマ処理は公知の方法で行えばよく、例えば、大気圧プラズマ処理の場合には、電圧290~300W、気流速度1.0~5.0m/分等の条件で行うことができる。 In the present invention, the surface of the substrate may be plasma-treated before the silver ink composition is attached. By subjecting the substrate to plasma treatment, bleeding of the silver ink composition may be suppressed.
The plasma treatment may be performed by a known method. For example, in the case of atmospheric pressure plasma treatment, it can be performed under conditions of a voltage of 290 to 300 W, an air velocity of 1.0 to 5.0 m / min, and the like.
銀層は、これらの点以外は、上述の金属銀の製造方法と同じ方法で形成できる。
Except for these points, the silver layer can be formed by the same method as the method for producing metallic silver described above.
本発明の積層体として、基材上に銀層以外のその他の層が設けられたものを製造する場合には、上記の製造方法において、所定のタイミングでその他の層を形成する工程を適宜追加して行えばよい。
例えば、基材と銀層との間に受容層を備えた積層体を製造する場合には、基材上に銀層を形成する前に、基材の表面上に受容層を形成し(受容層形成工程)、この受容層上に銀層を形成すればよい(銀層形成工程)。受容層は、各種樹脂等の受容層を形成するための成分が配合されてなる組成物(受容層用組成物)を調製し、これを基材上に付着させ、例えば、乾燥処理、加熱処理等の、受容層を形成するための操作を行うことにより形成できる。受容層用組成物は、銀インク組成物の場合と同じ方法で、基材上に付着させることができる。 When manufacturing the laminate of the present invention in which other layers other than the silver layer are provided on the base material, in the above manufacturing method, a step of forming other layers at a predetermined timing is appropriately added. You can do it.
For example, in the case of producing a laminate having a receiving layer between a substrate and a silver layer, a receiving layer is formed on the surface of the substrate (receiving layer) before the silver layer is formed on the substrate. Layer formation step), a silver layer may be formed on the receiving layer (silver layer formation step). The receiving layer is prepared by preparing a composition (composition for receiving layer) in which components for forming the receiving layer such as various resins are blended, and depositing the composition on the substrate, for example, drying treatment, heat treatment, etc. It can form by performing operation for forming a receiving layer. The receiving layer composition can be deposited on the substrate in the same manner as the silver ink composition.
例えば、基材と銀層との間に受容層を備えた積層体を製造する場合には、基材上に銀層を形成する前に、基材の表面上に受容層を形成し(受容層形成工程)、この受容層上に銀層を形成すればよい(銀層形成工程)。受容層は、各種樹脂等の受容層を形成するための成分が配合されてなる組成物(受容層用組成物)を調製し、これを基材上に付着させ、例えば、乾燥処理、加熱処理等の、受容層を形成するための操作を行うことにより形成できる。受容層用組成物は、銀インク組成物の場合と同じ方法で、基材上に付着させることができる。 When manufacturing the laminate of the present invention in which other layers other than the silver layer are provided on the base material, in the above manufacturing method, a step of forming other layers at a predetermined timing is appropriately added. You can do it.
For example, in the case of producing a laminate having a receiving layer between a substrate and a silver layer, a receiving layer is formed on the surface of the substrate (receiving layer) before the silver layer is formed on the substrate. Layer formation step), a silver layer may be formed on the receiving layer (silver layer formation step). The receiving layer is prepared by preparing a composition (composition for receiving layer) in which components for forming the receiving layer such as various resins are blended, and depositing the composition on the substrate, for example, drying treatment, heat treatment, etc. It can form by performing operation for forming a receiving layer. The receiving layer composition can be deposited on the substrate in the same manner as the silver ink composition.
<<電子機器、透明導電膜>>
前記積層体は、各種電子機器、透明導電膜等を構成するのに好適である。
例えば、電子機器は、前記積層体を用い、前記基材を筐体(外装材)として備えるように構成でき、前記積層体中の基材で筐体(外装材)の少なくとも一部を構成した点以外は、公知の電子機器と同様の構成とすることができる。例えば、携帯電話機等の通信機器における外装材の平面又は曲面部分を前記基材とし、この外装材(基材)上に前記金属銀からなる細線を形成し、この細線を回路とすることで、前記積層体を回路基板として用いることができる。そして、例えば、前記積層体に加え、音声入力部、音声出力部、操作スイッチ、表示部等を組み合わせることにより、携帯電話機を構成できる。また、パターニングされた銀層をアンテナとすることで、前記積層体をアンテナ構造体とすることができ、前記アンテナ構造体を用いた点以外は、公知のデータ受送信体と同様の構成とすることで、新規のデータ受送信体とすることができる。例えば、前記積層体において、基材上に銀層と電気的に接続されたICチップを設けてアンテナ部とすることにより、非接触型データ受送信体を構成できる。 << Electronic equipment, transparent conductive film >>
The said laminated body is suitable for comprising various electronic devices, a transparent conductive film, etc.
For example, the electronic device can be configured to use the laminate and include the base material as a casing (exterior material), and at least a part of the casing (exterior material) is configured with the base material in the laminate. Except for this point, the configuration can be the same as that of a known electronic device. For example, a flat or curved portion of an exterior material in a communication device such as a mobile phone is used as the base material, and a thin wire made of the metallic silver is formed on the exterior material (base material), and the thin wire is used as a circuit. The laminate can be used as a circuit board. For example, a cellular phone can be configured by combining a voice input unit, a voice output unit, an operation switch, a display unit, and the like in addition to the laminate. Further, by using the patterned silver layer as an antenna, the laminated body can be used as an antenna structure, and the configuration is the same as that of a known data transmitting / receiving body except that the antenna structure is used. Thus, a new data receiving / transmitting body can be obtained. For example, in the laminate, an IC chip electrically connected to the silver layer is provided on the base material to form an antenna portion, whereby a non-contact type data receiving / transmitting body can be configured.
前記積層体は、各種電子機器、透明導電膜等を構成するのに好適である。
例えば、電子機器は、前記積層体を用い、前記基材を筐体(外装材)として備えるように構成でき、前記積層体中の基材で筐体(外装材)の少なくとも一部を構成した点以外は、公知の電子機器と同様の構成とすることができる。例えば、携帯電話機等の通信機器における外装材の平面又は曲面部分を前記基材とし、この外装材(基材)上に前記金属銀からなる細線を形成し、この細線を回路とすることで、前記積層体を回路基板として用いることができる。そして、例えば、前記積層体に加え、音声入力部、音声出力部、操作スイッチ、表示部等を組み合わせることにより、携帯電話機を構成できる。また、パターニングされた銀層をアンテナとすることで、前記積層体をアンテナ構造体とすることができ、前記アンテナ構造体を用いた点以外は、公知のデータ受送信体と同様の構成とすることで、新規のデータ受送信体とすることができる。例えば、前記積層体において、基材上に銀層と電気的に接続されたICチップを設けてアンテナ部とすることにより、非接触型データ受送信体を構成できる。 << Electronic equipment, transparent conductive film >>
The said laminated body is suitable for comprising various electronic devices, a transparent conductive film, etc.
For example, the electronic device can be configured to use the laminate and include the base material as a casing (exterior material), and at least a part of the casing (exterior material) is configured with the base material in the laminate. Except for this point, the configuration can be the same as that of a known electronic device. For example, a flat or curved portion of an exterior material in a communication device such as a mobile phone is used as the base material, and a thin wire made of the metallic silver is formed on the exterior material (base material), and the thin wire is used as a circuit. The laminate can be used as a circuit board. For example, a cellular phone can be configured by combining a voice input unit, a voice output unit, an operation switch, a display unit, and the like in addition to the laminate. Further, by using the patterned silver layer as an antenna, the laminated body can be used as an antenna structure, and the configuration is the same as that of a known data transmitting / receiving body except that the antenna structure is used. Thus, a new data receiving / transmitting body can be obtained. For example, in the laminate, an IC chip electrically connected to the silver layer is provided on the base material to form an antenna portion, whereby a non-contact type data receiving / transmitting body can be configured.
また、透明導電膜は、前記積層体を用い、銀層を極微細配線又は極薄配線として備えるように構成でき、銀層を極微細配線又は極薄配線として備えた点以外は、公知の透明導電膜と同様の構成とすることができる。例えば、前記積層体に加え、透明基材等と組合せることにより、タッチパネルや光学ディスプレイを構成できる。
極微細配線の線幅は、1~20μmであることが好ましく、1.3~15μmであることがより好ましく、1.5~13μmであることが特に好ましい。
また、極微細配線の断面形状は、好ましくは楕円の短軸方向のほぼ半分の領域が切り取られた半楕円形状である。
一方、極薄配線の厚さは、5nm~10μmであることが好ましく、7nm~5μmであることがより好ましく、10nm~1μmであることが特に好ましい。
極薄配線の断面形状は、前記極微細配線の断面形状と同様である。
前記透明導電膜は、銀層がこのような線幅及び厚さの少なくとも一方を満たしていることが好ましい。銀層がこのような線幅又は厚さであれば、目視によってその存在が認識困難となるので、透明導電膜として好ましいものとなる。 In addition, the transparent conductive film can be configured to use the laminate and include a silver layer as an ultrafine wiring or an ultrathin wiring, except that the silver layer is provided as an ultrafine wiring or an ultrathin wiring. A structure similar to that of the conductive film can be employed. For example, in addition to the laminate, a touch panel or an optical display can be configured by combining with a transparent substrate or the like.
The line width of the ultrafine wiring is preferably 1 to 20 μm, more preferably 1.3 to 15 μm, and particularly preferably 1.5 to 13 μm.
In addition, the cross-sectional shape of the ultrafine wiring is preferably a semi-elliptical shape in which approximately half the region in the minor axis direction of the ellipse is cut off.
On the other hand, the thickness of the ultra-thin wiring is preferably 5 nm to 10 μm, more preferably 7 nm to 5 μm, and particularly preferably 10 nm to 1 μm.
The cross-sectional shape of the ultrathin wiring is the same as the cross-sectional shape of the ultrafine wiring.
In the transparent conductive film, the silver layer preferably satisfies at least one of such a line width and thickness. If the silver layer has such a line width or thickness, its presence is difficult to recognize by visual observation, which is preferable as a transparent conductive film.
極微細配線の線幅は、1~20μmであることが好ましく、1.3~15μmであることがより好ましく、1.5~13μmであることが特に好ましい。
また、極微細配線の断面形状は、好ましくは楕円の短軸方向のほぼ半分の領域が切り取られた半楕円形状である。
一方、極薄配線の厚さは、5nm~10μmであることが好ましく、7nm~5μmであることがより好ましく、10nm~1μmであることが特に好ましい。
極薄配線の断面形状は、前記極微細配線の断面形状と同様である。
前記透明導電膜は、銀層がこのような線幅及び厚さの少なくとも一方を満たしていることが好ましい。銀層がこのような線幅又は厚さであれば、目視によってその存在が認識困難となるので、透明導電膜として好ましいものとなる。 In addition, the transparent conductive film can be configured to use the laminate and include a silver layer as an ultrafine wiring or an ultrathin wiring, except that the silver layer is provided as an ultrafine wiring or an ultrathin wiring. A structure similar to that of the conductive film can be employed. For example, in addition to the laminate, a touch panel or an optical display can be configured by combining with a transparent substrate or the like.
The line width of the ultrafine wiring is preferably 1 to 20 μm, more preferably 1.3 to 15 μm, and particularly preferably 1.5 to 13 μm.
In addition, the cross-sectional shape of the ultrafine wiring is preferably a semi-elliptical shape in which approximately half the region in the minor axis direction of the ellipse is cut off.
On the other hand, the thickness of the ultra-thin wiring is preferably 5 nm to 10 μm, more preferably 7 nm to 5 μm, and particularly preferably 10 nm to 1 μm.
The cross-sectional shape of the ultrathin wiring is the same as the cross-sectional shape of the ultrafine wiring.
In the transparent conductive film, the silver layer preferably satisfies at least one of such a line width and thickness. If the silver layer has such a line width or thickness, its presence is difficult to recognize by visual observation, which is preferable as a transparent conductive film.
また、前記積層体においては、銀層を低温で形成することも可能であり、基材等の材質を幅広く選択できるので、設計の自由度が飛躍的に向上し、電子機器、透明導電膜等をより合理的な構造とすることも可能である。
上記のような電子機器、透明導電膜等は、長期に渡って高い性能を維持することが可能である。 In the laminate, the silver layer can be formed at a low temperature, and a wide range of materials such as a base material can be selected. Thus, the degree of freedom in design is greatly improved, and electronic devices, transparent conductive films, etc. Can be made more rational.
The above electronic devices, transparent conductive films, and the like can maintain high performance over a long period of time.
上記のような電子機器、透明導電膜等は、長期に渡って高い性能を維持することが可能である。 In the laminate, the silver layer can be formed at a low temperature, and a wide range of materials such as a base material can be selected. Thus, the degree of freedom in design is greatly improved, and electronic devices, transparent conductive films, etc. Can be made more rational.
The above electronic devices, transparent conductive films, and the like can maintain high performance over a long period of time.
以下、具体的実施例により、本発明についてより詳細に説明する。ただし、本発明は、以下に示す実施例に、何ら限定されるものではない。
Hereinafter, the present invention will be described in more detail with reference to specific examples. However, the present invention is not limited to the following examples.
[実施例1]
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述する2-メチルアセト酢酸銀に対して0.4倍モル量)に2-メチルアセト酢酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(2-メチルアセト酢酸銀に対して0.7倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表1に示す。表1中、「含窒素化合物(モル比)」とは、金属銀の形成材料の配合量1モルあたりの含窒素化合物の配合量(モル数)([含窒素化合物のモル数]/[金属銀の形成材料のモル数])を意味する。「還元剤(モル比)」も同様に、金属銀の形成材料の配合量1モルあたりの還元剤の配合量(モル数)([還元剤のモル数]/[金属銀の形成材料のモル数])を意味する。「その他の成分(質量%)」とは、銀インク組成物の配合成分の総量(質量)に対するその他の成分の配合量(質量)の割合([その他の成分の配合量(質量)]/[銀インク組成物の配合成分の総量(質量)]×100)を意味する。なお、表1中、配合成分の欄の「-」は、その成分が未配合であることを意味する。これらは、以降の表においても同様である。 [Example 1]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Add 2-methylacetoacetic acid silver to 2-ethylhexylamine (0.4 times molar amount relative to 2-methylacetoacetate silver described later) in a beaker so that the liquid temperature is 50 ° C. or less, and The mixture was stirred for 15 minutes to obtain a liquid material. To this liquid, formic acid (0.7-fold molar amount with respect to silver 2-methylacetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 1 shows the types and blending ratios of each blending component. In Table 1, “nitrogen-containing compound (molar ratio)” means the compounding amount (number of moles) of nitrogen-containing compound per mol of compounding material of the metallic silver ([number of moles of nitrogen-containing compound] / [metal The number of moles of silver forming material]). Similarly, the “reducing agent (molar ratio)” is the amount (mole number) of the reducing agent per mole of the metal silver forming material ([mole number of reducing agent] / [mole of metal silver forming material). Number]). “Other components (mass%)” means the ratio of the blending amount (mass) of other components to the total amount (mass) of the blending components of the silver ink composition ([blending amount (mass) of other components] / [ Total amount (mass) of compounding components of silver ink composition] × 100). In Table 1, “-” in the column of the blending component means that the component is not blended. The same applies to the following tables.
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述する2-メチルアセト酢酸銀に対して0.4倍モル量)に2-メチルアセト酢酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(2-メチルアセト酢酸銀に対して0.7倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表1に示す。表1中、「含窒素化合物(モル比)」とは、金属銀の形成材料の配合量1モルあたりの含窒素化合物の配合量(モル数)([含窒素化合物のモル数]/[金属銀の形成材料のモル数])を意味する。「還元剤(モル比)」も同様に、金属銀の形成材料の配合量1モルあたりの還元剤の配合量(モル数)([還元剤のモル数]/[金属銀の形成材料のモル数])を意味する。「その他の成分(質量%)」とは、銀インク組成物の配合成分の総量(質量)に対するその他の成分の配合量(質量)の割合([その他の成分の配合量(質量)]/[銀インク組成物の配合成分の総量(質量)]×100)を意味する。なお、表1中、配合成分の欄の「-」は、その成分が未配合であることを意味する。これらは、以降の表においても同様である。 [Example 1]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Add 2-methylacetoacetic acid silver to 2-ethylhexylamine (0.4 times molar amount relative to 2-methylacetoacetate silver described later) in a beaker so that the liquid temperature is 50 ° C. or less, and The mixture was stirred for 15 minutes to obtain a liquid material. To this liquid, formic acid (0.7-fold molar amount with respect to silver 2-methylacetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 1 shows the types and blending ratios of each blending component. In Table 1, “nitrogen-containing compound (molar ratio)” means the compounding amount (number of moles) of nitrogen-containing compound per mol of compounding material of the metallic silver ([number of moles of nitrogen-containing compound] / [metal The number of moles of silver forming material]). Similarly, the “reducing agent (molar ratio)” is the amount (mole number) of the reducing agent per mole of the metal silver forming material ([mole number of reducing agent] / [mole of metal silver forming material). Number]). “Other components (mass%)” means the ratio of the blending amount (mass) of other components to the total amount (mass) of the blending components of the silver ink composition ([blending amount (mass) of other components] / [ Total amount (mass) of compounding components of silver ink composition] × 100). In Table 1, “-” in the column of the blending component means that the component is not blended. The same applies to the following tables.
(積層体の製造)
ポリカーボネート/ABS樹脂アロイからなる基材(厚さ2mm)の一方の主面(表面)上に、スピンコート法により、上記で得られた銀インク組成物を塗布した。スピンコートは、7500rpm、30秒の条件で行った。なお、前記基材は、ASTM D648で規定される、1.8MPaの曲げ応力でたわみ量が0.25mmとなるときの荷重たわみ温度が、120℃以下となるものである。
次いで、熱風の吹き付け(風速:15m/秒)により、塗布済みの前記基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱(焼成)処理することで、30mm×30mmの大きさで、厚さ1~2μmの銀層を基材上に形成し、積層体を得た。加熱処理の条件を表2に示す。 (Manufacture of laminates)
On one main surface (surface) of a substrate (thickness 2 mm) made of polycarbonate / ABS resin alloy, the silver ink composition obtained above was applied by spin coating. The spin coating was performed under conditions of 7500 rpm and 30 seconds. The base material has a deflection temperature under load of 120 ° C. or less when the deflection amount is 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648.
Next, the coated base material is dried at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), and further placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. By heating (firing) treatment, a silver layer having a size of 30 mm × 30 mm and a thickness of 1 to 2 μm was formed on the substrate to obtain a laminate. Table 2 shows the conditions for the heat treatment.
ポリカーボネート/ABS樹脂アロイからなる基材(厚さ2mm)の一方の主面(表面)上に、スピンコート法により、上記で得られた銀インク組成物を塗布した。スピンコートは、7500rpm、30秒の条件で行った。なお、前記基材は、ASTM D648で規定される、1.8MPaの曲げ応力でたわみ量が0.25mmとなるときの荷重たわみ温度が、120℃以下となるものである。
次いで、熱風の吹き付け(風速:15m/秒)により、塗布済みの前記基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱(焼成)処理することで、30mm×30mmの大きさで、厚さ1~2μmの銀層を基材上に形成し、積層体を得た。加熱処理の条件を表2に示す。 (Manufacture of laminates)
On one main surface (surface) of a substrate (thickness 2 mm) made of polycarbonate / ABS resin alloy, the silver ink composition obtained above was applied by spin coating. The spin coating was performed under conditions of 7500 rpm and 30 seconds. The base material has a deflection temperature under load of 120 ° C. or less when the deflection amount is 0.25 mm with a bending stress of 1.8 MPa as defined by ASTM D648.
Next, the coated base material is dried at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), and further placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. By heating (firing) treatment, a silver layer having a size of 30 mm × 30 mm and a thickness of 1 to 2 μm was formed on the substrate to obtain a laminate. Table 2 shows the conditions for the heat treatment.
<積層体の評価>
(金属銀の結晶子径の算出)
上記で形成した銀層について、薄膜X線回折装置(Bruker AXS,D8 DISCOVER with GADDS)を用いて、X線回折測定を行った。X線源としてはCuKα線(波長λ:0.154nm)を用い、測定角度(2θ)を20~100°とした。X線回折が示すピークの各測定角度とミラー指数は以下のとおりであり、結晶方位を考慮した結晶子径を算出した。
測定角度:38.1°(111)、44.2°(200)、64.4°(220)、77.4°(311)、81.5°(222)、97.8°(400)
ここでは、ストークス(Stokes)- ウィルソン(Wilson)の理論により、結晶の形に依存しないサイズの広がりを考慮して、上述のシェラーの式に基づいて結晶子径を算出した。結果を表2に示す。 <Evaluation of laminate>
(Calculation of crystallite diameter of metallic silver)
The silver layer formed as described above was subjected to X-ray diffraction measurement using a thin film X-ray diffractometer (Bruker AXS, D8 DISCOVER with GADDS). CuKα rays (wavelength λ: 0.154 nm) were used as the X-ray source, and the measurement angle (2θ) was set to 20 to 100 °. Each measurement angle and Miller index of the peak indicated by X-ray diffraction are as follows, and the crystallite diameter in consideration of the crystal orientation was calculated.
Measurement angle: 38.1 ° (111), 44.2 ° (200), 64.4 ° (220), 77.4 ° (311), 81.5 ° (222), 97.8 ° (400)
Here, based on the Stokes-Wilson theory, the crystallite size was calculated based on the Scherrer equation described above in consideration of the size expansion independent of the crystal shape. The results are shown in Table 2.
(金属銀の結晶子径の算出)
上記で形成した銀層について、薄膜X線回折装置(Bruker AXS,D8 DISCOVER with GADDS)を用いて、X線回折測定を行った。X線源としてはCuKα線(波長λ:0.154nm)を用い、測定角度(2θ)を20~100°とした。X線回折が示すピークの各測定角度とミラー指数は以下のとおりであり、結晶方位を考慮した結晶子径を算出した。
測定角度:38.1°(111)、44.2°(200)、64.4°(220)、77.4°(311)、81.5°(222)、97.8°(400)
ここでは、ストークス(Stokes)- ウィルソン(Wilson)の理論により、結晶の形に依存しないサイズの広がりを考慮して、上述のシェラーの式に基づいて結晶子径を算出した。結果を表2に示す。 <Evaluation of laminate>
(Calculation of crystallite diameter of metallic silver)
The silver layer formed as described above was subjected to X-ray diffraction measurement using a thin film X-ray diffractometer (Bruker AXS, D8 DISCOVER with GADDS). CuKα rays (wavelength λ: 0.154 nm) were used as the X-ray source, and the measurement angle (2θ) was set to 20 to 100 °. Each measurement angle and Miller index of the peak indicated by X-ray diffraction are as follows, and the crystallite diameter in consideration of the crystal orientation was calculated.
Measurement angle: 38.1 ° (111), 44.2 ° (200), 64.4 ° (220), 77.4 ° (311), 81.5 ° (222), 97.8 ° (400)
Here, based on the Stokes-Wilson theory, the crystallite size was calculated based on the Scherrer equation described above in consideration of the size expansion independent of the crystal shape. The results are shown in Table 2.
(銀層の体積抵抗率の測定)
上記で得られた積層体について、レーザ顕微鏡(キーエンス社製「VK-X100」)を用いて、形成した銀層の厚さT(cm)を測定した。また、抵抗率計(三菱化学アナリテック社製「ロレスタMCP-T610、PSP型プローブ」)を用いて、4端子法により、形成した銀層の表面抵抗値を測定し、この測定値に、銀層のパターン形状とプローブ形状とから算出された抵抗率補正係数(4.04)を乗じて、表面抵抗率R(Ω/□)を算出した。そして、式「ρ=R×T」により、銀層の体積抵抗率ρ(μΩ・cm)を算出した。結果を表2に示す。 (Measurement of volume resistivity of silver layer)
About the laminated body obtained above, the thickness T (cm) of the formed silver layer was measured using a laser microscope ("VK-X100" manufactured by Keyence Corporation). In addition, the surface resistance value of the formed silver layer was measured by a four-terminal method using a resistivity meter (“Loresta MCP-T610, PSP type probe” manufactured by Mitsubishi Chemical Analytech Co., Ltd.). The surface resistivity R (Ω / □) was calculated by multiplying the resistivity correction coefficient (4.04) calculated from the layer pattern shape and the probe shape. Then, the volume resistivity ρ (μΩ · cm) of the silver layer was calculated by the formula “ρ = R × T”. The results are shown in Table 2.
上記で得られた積層体について、レーザ顕微鏡(キーエンス社製「VK-X100」)を用いて、形成した銀層の厚さT(cm)を測定した。また、抵抗率計(三菱化学アナリテック社製「ロレスタMCP-T610、PSP型プローブ」)を用いて、4端子法により、形成した銀層の表面抵抗値を測定し、この測定値に、銀層のパターン形状とプローブ形状とから算出された抵抗率補正係数(4.04)を乗じて、表面抵抗率R(Ω/□)を算出した。そして、式「ρ=R×T」により、銀層の体積抵抗率ρ(μΩ・cm)を算出した。結果を表2に示す。 (Measurement of volume resistivity of silver layer)
About the laminated body obtained above, the thickness T (cm) of the formed silver layer was measured using a laser microscope ("VK-X100" manufactured by Keyence Corporation). In addition, the surface resistance value of the formed silver layer was measured by a four-terminal method using a resistivity meter (“Loresta MCP-T610, PSP type probe” manufactured by Mitsubishi Chemical Analytech Co., Ltd.). The surface resistivity R (Ω / □) was calculated by multiplying the resistivity correction coefficient (4.04) calculated from the layer pattern shape and the probe shape. Then, the volume resistivity ρ (μΩ · cm) of the silver layer was calculated by the formula “ρ = R × T”. The results are shown in Table 2.
[実施例2]
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述する2-メチルアセト酢酸銀に対して0.4倍モル量)に2-メチルアセト酢酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(2-メチルアセト酢酸銀に対して0.6倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌した後、配合成分の総量に対する配合量の割合が11質量%となるようにドデカンを反応液に添加して、配合成分が均一となるまで25℃で撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表1に示す。 [Example 2]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Add 2-methylacetoacetic acid silver to 2-ethylhexylamine (0.4 times molar amount relative to 2-methylacetoacetate silver described later) in a beaker so that the liquid temperature is 50 ° C. or less, and The mixture was stirred for 15 minutes to obtain a liquid material. To this liquid, formic acid (0.6-fold molar amount with respect to silver 2-methylacetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After completion of the formic acid dropwise addition, the reaction solution was further stirred at 25 ° C. for 1 hour, and then dodecane was added to the reaction solution so that the ratio of the compounding amount to the total amount of the compounding components was 11% by mass. A silver ink composition was obtained by stirring at 25 ° C. until Table 1 shows the types and blending ratios of each blending component.
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述する2-メチルアセト酢酸銀に対して0.4倍モル量)に2-メチルアセト酢酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(2-メチルアセト酢酸銀に対して0.6倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌した後、配合成分の総量に対する配合量の割合が11質量%となるようにドデカンを反応液に添加して、配合成分が均一となるまで25℃で撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表1に示す。 [Example 2]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Add 2-methylacetoacetic acid silver to 2-ethylhexylamine (0.4 times molar amount relative to 2-methylacetoacetate silver described later) in a beaker so that the liquid temperature is 50 ° C. or less, and The mixture was stirred for 15 minutes to obtain a liquid material. To this liquid, formic acid (0.6-fold molar amount with respect to silver 2-methylacetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After completion of the formic acid dropwise addition, the reaction solution was further stirred at 25 ° C. for 1 hour, and then dodecane was added to the reaction solution so that the ratio of the compounding amount to the total amount of the compounding components was 11% by mass. A silver ink composition was obtained by stirring at 25 ° C. until Table 1 shows the types and blending ratios of each blending component.
(積層体の製造)
上記で得られた銀インク組成物を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて4500rpm、15秒とした点以外は、実施例1と同じ方法で積層体を得た。 (Manufacture of laminates)
Lamination was performed in the same manner as in Example 1 except that the silver ink composition obtained above was used, and that the spin coating conditions were changed to 4500 rpm and 15 seconds instead of 7500 rpm and 30 seconds when forming the silver layer. Got the body.
上記で得られた銀インク組成物を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて4500rpm、15秒とした点以外は、実施例1と同じ方法で積層体を得た。 (Manufacture of laminates)
Lamination was performed in the same manner as in Example 1 except that the silver ink composition obtained above was used, and that the spin coating conditions were changed to 4500 rpm and 15 seconds instead of 7500 rpm and 30 seconds when forming the silver layer. Got the body.
<積層体の評価>
実施例1と同じ方法で、上記で得られた積層体を評価した。結果を表2に示す。 <Evaluation of laminate>
The laminate obtained above was evaluated in the same manner as in Example 1. The results are shown in Table 2.
実施例1と同じ方法で、上記で得られた積層体を評価した。結果を表2に示す。 <Evaluation of laminate>
The laminate obtained above was evaluated in the same manner as in Example 1. The results are shown in Table 2.
<積層体の製造及び評価>
[実施例3]
表1及び2に示すように、銀層形成時において、塗布済み基材を80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理するのに代えて、120℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理した点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 <Manufacture and evaluation of laminate>
[Example 3]
As shown in Tables 1 and 2, at the time of forming the silver layer, instead of heating the coated substrate in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes, 120 ° C. and relative humidity 100 A laminate was manufactured and evaluated in the same manner as in Example 1 except that it was heat-treated for 2 minutes in a water vapor atmosphere of 2%. The results are shown in Table 2.
[実施例3]
表1及び2に示すように、銀層形成時において、塗布済み基材を80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理するのに代えて、120℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理した点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 <Manufacture and evaluation of laminate>
[Example 3]
As shown in Tables 1 and 2, at the time of forming the silver layer, instead of heating the coated substrate in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes, 120 ° C. and relative humidity 100 A laminate was manufactured and evaluated in the same manner as in Example 1 except that it was heat-treated for 2 minutes in a water vapor atmosphere of 2%. The results are shown in Table 2.
[実施例4]
表1及び2に示すように、銀層形成時において、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を80℃で60分間加熱処理した点以外は、実施例2と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Example 4]
As shown in Tables 1 and 2, when the silver layer was formed, the coated substrate was dried at 80 ° C. for 1 minute, and then this substrate was placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. Instead of heat treatment, a laminate was produced in the same manner as in Example 2 except that the coated substrate was heat treated at 80 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second) and evaluated. did. The results are shown in Table 2.
表1及び2に示すように、銀層形成時において、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を80℃で60分間加熱処理した点以外は、実施例2と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Example 4]
As shown in Tables 1 and 2, when the silver layer was formed, the coated substrate was dried at 80 ° C. for 1 minute, and then this substrate was placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. Instead of heat treatment, a laminate was produced in the same manner as in Example 2 except that the coated substrate was heat treated at 80 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second) and evaluated. did. The results are shown in Table 2.
[実施例5]
表1及び2に示すように、銀層形成時において、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を120℃で60分間加熱処理した点以外は、実施例2と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Example 5]
As shown in Tables 1 and 2, when the silver layer was formed, the coated substrate was dried at 80 ° C. for 1 minute, and then this substrate was placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. Instead of heat treatment, a laminate was produced in the same manner as in Example 2 except that the coated substrate was heat treated at 120 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second) and evaluated. did. The results are shown in Table 2.
表1及び2に示すように、銀層形成時において、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を120℃で60分間加熱処理した点以外は、実施例2と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Example 5]
As shown in Tables 1 and 2, when the silver layer was formed, the coated substrate was dried at 80 ° C. for 1 minute, and then this substrate was placed in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes. Instead of heat treatment, a laminate was produced in the same manner as in Example 2 except that the coated substrate was heat treated at 120 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second) and evaluated. did. The results are shown in Table 2.
[比較例1]
表1及び2に示すように、銀インク組成物として金属銀粒子を含むもの(INK TEC社製「TEC-PA-010」)を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて7500rpm、15秒とした点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Comparative Example 1]
As shown in Tables 1 and 2, the silver ink composition containing metal silver particles (“TEC-PA-010” manufactured by INK TEC) was used. A laminate was produced and evaluated in the same manner as in Example 1 except that 7500 rpm and 15 seconds were used instead of 30 seconds. The results are shown in Table 2.
表1及び2に示すように、銀インク組成物として金属銀粒子を含むもの(INK TEC社製「TEC-PA-010」)を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて7500rpm、15秒とした点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Comparative Example 1]
As shown in Tables 1 and 2, the silver ink composition containing metal silver particles (“TEC-PA-010” manufactured by INK TEC) was used. A laminate was produced and evaluated in the same manner as in Example 1 except that 7500 rpm and 15 seconds were used instead of 30 seconds. The results are shown in Table 2.
[比較例2]
表1及び2に示すように、銀インク組成物として金属銀粒子を含むもの(INK TEC社製「TEC-PA-010」)を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて7500rpm、15秒とした点、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を80℃で60分間加熱処理した点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Comparative Example 2]
As shown in Tables 1 and 2, the silver ink composition containing metal silver particles (“TEC-PA-010” manufactured by INK TEC) was used, and the spin coating conditions were set at 7500 rpm when the silver layer was formed. , 7500 rpm for 15 seconds instead of 30 seconds, the coated substrate is dried at 80 ° C. for 1 minute, and then the substrate is heated for 2 minutes in a steam atmosphere at 80 ° C. and 100% relative humidity. Instead of processing, a laminated body was manufactured and evaluated in the same manner as in Example 1 except that the coated substrate was heated at 80 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second). . The results are shown in Table 2.
表1及び2に示すように、銀インク組成物として金属銀粒子を含むもの(INK TEC社製「TEC-PA-010」)を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて7500rpm、15秒とした点、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を80℃で60分間加熱処理した点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Comparative Example 2]
As shown in Tables 1 and 2, the silver ink composition containing metal silver particles (“TEC-PA-010” manufactured by INK TEC) was used, and the spin coating conditions were set at 7500 rpm when the silver layer was formed. , 7500 rpm for 15 seconds instead of 30 seconds, the coated substrate is dried at 80 ° C. for 1 minute, and then the substrate is heated for 2 minutes in a steam atmosphere at 80 ° C. and 100% relative humidity. Instead of processing, a laminated body was manufactured and evaluated in the same manner as in Example 1 except that the coated substrate was heated at 80 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / second). . The results are shown in Table 2.
[比較例3]
表1及び2に示すように、銀インク組成物として金属銀粒子を含むもの(INK TEC社製「TEC-PA-010」)を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて7500rpm、15秒とした点、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を120℃で60分間加熱処理した点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Comparative Example 3]
As shown in Tables 1 and 2, the silver ink composition containing metal silver particles (“TEC-PA-010” manufactured by INK TEC) was used, and the spin coating conditions were set at 7500 rpm when the silver layer was formed. , 7500 rpm for 15 seconds instead of 30 seconds, the coated substrate is dried at 80 ° C. for 1 minute, and then the substrate is heated for 2 minutes in a steam atmosphere at 80 ° C. and 100% relative humidity. Instead of processing, a laminate was produced and evaluated in the same manner as in Example 1 except that the coated substrate was heated at 120 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / sec). . The results are shown in Table 2.
表1及び2に示すように、銀インク組成物として金属銀粒子を含むもの(INK TEC社製「TEC-PA-010」)を用いた点、銀層形成時において、スピンコートの条件を7500rpm、30秒に代えて7500rpm、15秒とした点、塗布済み基材を80℃で1分間乾燥させ、さらに、80℃、相対湿度100%の水蒸気雰囲気下にこの基材を2分間置いて加熱処理するのに代えて、熱風の吹き付け(風速:15m/秒)により塗布済み基材を120℃で60分間加熱処理した点以外は、実施例1と同じ方法で積層体を製造し、評価した。結果を表2に示す。 [Comparative Example 3]
As shown in Tables 1 and 2, the silver ink composition containing metal silver particles (“TEC-PA-010” manufactured by INK TEC) was used, and the spin coating conditions were set at 7500 rpm when the silver layer was formed. , 7500 rpm for 15 seconds instead of 30 seconds, the coated substrate is dried at 80 ° C. for 1 minute, and then the substrate is heated for 2 minutes in a steam atmosphere at 80 ° C. and 100% relative humidity. Instead of processing, a laminate was produced and evaluated in the same manner as in Example 1 except that the coated substrate was heated at 120 ° C. for 60 minutes by blowing hot air (wind speed: 15 m / sec). . The results are shown in Table 2.
上記結果から明らかなように、実施例1~5の積層体では、120℃以下という低い加熱処理温度で形成したにもかかわらず、銀層は体積抵抗率が十分に低く、導電性に優れていた。これら実施例において、銀層を構成する金属銀の結晶子径は、16.8nm以上であった。
これに対して、比較例1~3の積層体では、用いた銀インク組成物に対して加熱処理温度が低かったことが原因と考えられ、銀層は体積抵抗率が高く、導電性に劣っていた。 As is clear from the above results, in the laminates of Examples 1 to 5, the silver layer has a sufficiently low volume resistivity and excellent conductivity even though it was formed at a low heat treatment temperature of 120 ° C. or less. It was. In these examples, the crystallite diameter of metallic silver constituting the silver layer was 16.8 nm or more.
On the other hand, in the laminates of Comparative Examples 1 to 3, it is considered that the heat treatment temperature was lower than that of the silver ink composition used, and the silver layer has a high volume resistivity and poor conductivity. It was.
これに対して、比較例1~3の積層体では、用いた銀インク組成物に対して加熱処理温度が低かったことが原因と考えられ、銀層は体積抵抗率が高く、導電性に劣っていた。 As is clear from the above results, in the laminates of Examples 1 to 5, the silver layer has a sufficiently low volume resistivity and excellent conductivity even though it was formed at a low heat treatment temperature of 120 ° C. or less. It was. In these examples, the crystallite diameter of metallic silver constituting the silver layer was 16.8 nm or more.
On the other hand, in the laminates of Comparative Examples 1 to 3, it is considered that the heat treatment temperature was lower than that of the silver ink composition used, and the silver layer has a high volume resistivity and poor conductivity. It was.
[実施例6]
<積層体の製造>
(銀インク組成物の製造)
実施例1と同じ方法で、銀インク組成物を得た。各配合成分の種類と配合比を表3に示す。 [Example 6]
<Manufacture of laminates>
(Manufacture of silver ink composition)
In the same manner as in Example 1, a silver ink composition was obtained. Table 3 shows the types and mixing ratios of the respective components.
<積層体の製造>
(銀インク組成物の製造)
実施例1と同じ方法で、銀インク組成物を得た。各配合成分の種類と配合比を表3に示す。 [Example 6]
<Manufacture of laminates>
(Manufacture of silver ink composition)
In the same manner as in Example 1, a silver ink composition was obtained. Table 3 shows the types and mixing ratios of the respective components.
(積層体の製造)
上記で得られた銀インク組成物を用い、実施例1と同じ方法で、銀インク組成物を塗布済みの基材を得た。
次いで、熱風の吹き付け(風速:15m/秒)により、塗布済みの前記基材を80℃で1分間乾燥させ、さらに、この塗布済みの前記基材を80℃で2分間湯煎して(80℃の湯中に2分間浸漬して)加熱(焼成)処理することで、30mm×30mmの大きさで、厚さ1~2μmの銀層を基材上に形成し、積層体を得た。湯としては蒸留水を80℃に加熱したものを用いた。加熱処理の条件を表4に示す。 (Manufacture of laminates)
Using the silver ink composition obtained above, a base material coated with the silver ink composition was obtained in the same manner as in Example 1.
Subsequently, the coated base material is dried at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), and then the coated base material is baked at 80 ° C. for 2 minutes (80 ° C. A silver layer having a size of 30 mm × 30 mm and a thickness of 1 to 2 μm was formed on the substrate by immersing in hot water (2 minutes) and heating (firing) to obtain a laminate. As the hot water, distilled water heated to 80 ° C. was used. Table 4 shows the conditions for the heat treatment.
上記で得られた銀インク組成物を用い、実施例1と同じ方法で、銀インク組成物を塗布済みの基材を得た。
次いで、熱風の吹き付け(風速:15m/秒)により、塗布済みの前記基材を80℃で1分間乾燥させ、さらに、この塗布済みの前記基材を80℃で2分間湯煎して(80℃の湯中に2分間浸漬して)加熱(焼成)処理することで、30mm×30mmの大きさで、厚さ1~2μmの銀層を基材上に形成し、積層体を得た。湯としては蒸留水を80℃に加熱したものを用いた。加熱処理の条件を表4に示す。 (Manufacture of laminates)
Using the silver ink composition obtained above, a base material coated with the silver ink composition was obtained in the same manner as in Example 1.
Subsequently, the coated base material is dried at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), and then the coated base material is baked at 80 ° C. for 2 minutes (80 ° C. A silver layer having a size of 30 mm × 30 mm and a thickness of 1 to 2 μm was formed on the substrate by immersing in hot water (2 minutes) and heating (firing) to obtain a laminate. As the hot water, distilled water heated to 80 ° C. was used. Table 4 shows the conditions for the heat treatment.
<積層体の評価>
上記で形成した銀層について、実施例1と同じ方法で、金属銀の結晶子径を算出した。結果を表4に示す。
また、上記で得られた銀層について、実施例1と同じ方法で、体積抵抗率ρ(μΩ・cm)を算出した。結果を表4に示す。 <Evaluation of laminate>
About the silver layer formed above, the crystallite diameter of metallic silver was computed by the same method as Example 1. The results are shown in Table 4.
Further, the volume resistivity ρ (μΩ · cm) of the silver layer obtained above was calculated in the same manner as in Example 1. The results are shown in Table 4.
上記で形成した銀層について、実施例1と同じ方法で、金属銀の結晶子径を算出した。結果を表4に示す。
また、上記で得られた銀層について、実施例1と同じ方法で、体積抵抗率ρ(μΩ・cm)を算出した。結果を表4に示す。 <Evaluation of laminate>
About the silver layer formed above, the crystallite diameter of metallic silver was computed by the same method as Example 1. The results are shown in Table 4.
Further, the volume resistivity ρ (μΩ · cm) of the silver layer obtained above was calculated in the same manner as in Example 1. The results are shown in Table 4.
[実施例7]
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述するアセト酢酸銀に対して1.0倍モル量)にアセト酢酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(アセト酢酸銀に対して1.2倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表3に示す。 [Example 7]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Add silver acetoacetate to 2-ethylhexylamine (1.0 times the molar amount of silver acetoacetate described later) in a beaker so that the liquid temperature is 50 ° C. or less, and use a mechanical stirrer for 15 minutes. By stirring, a liquid material was obtained. To this liquid, formic acid (1.2 times molar amount with respect to silver acetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 3 shows the types and mixing ratios of the respective components.
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述するアセト酢酸銀に対して1.0倍モル量)にアセト酢酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(アセト酢酸銀に対して1.2倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表3に示す。 [Example 7]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Add silver acetoacetate to 2-ethylhexylamine (1.0 times the molar amount of silver acetoacetate described later) in a beaker so that the liquid temperature is 50 ° C. or less, and use a mechanical stirrer for 15 minutes. By stirring, a liquid material was obtained. To this liquid, formic acid (1.2 times molar amount with respect to silver acetoacetate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution was 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 3 shows the types and mixing ratios of the respective components.
(積層体の製造)
上記で得られた銀インク組成物を用いた点以外は、実施例6と同じ方法で銀層を形成し、積層体を製造した。加熱処理の条件を表4に示す。 (Manufacture of laminates)
A silver layer was formed by the same method as in Example 6 except that the silver ink composition obtained above was used to produce a laminate. Table 4 shows the conditions for the heat treatment.
上記で得られた銀インク組成物を用いた点以外は、実施例6と同じ方法で銀層を形成し、積層体を製造した。加熱処理の条件を表4に示す。 (Manufacture of laminates)
A silver layer was formed by the same method as in Example 6 except that the silver ink composition obtained above was used to produce a laminate. Table 4 shows the conditions for the heat treatment.
<積層体の評価>
上記で形成した銀層について、実施例6と同じ方法で、金属銀の結晶子径を算出した。結果を表4に示す。
また、上記で得られた銀層について、実施例6と同じ方法で、体積抵抗率ρ(μΩ・cm)を算出した。結果を表4に示す。 <Evaluation of laminate>
About the silver layer formed above, the crystallite diameter of metallic silver was computed by the same method as Example 6. The results are shown in Table 4.
Further, the volume resistivity ρ (μΩ · cm) of the silver layer obtained above was calculated in the same manner as in Example 6. The results are shown in Table 4.
上記で形成した銀層について、実施例6と同じ方法で、金属銀の結晶子径を算出した。結果を表4に示す。
また、上記で得られた銀層について、実施例6と同じ方法で、体積抵抗率ρ(μΩ・cm)を算出した。結果を表4に示す。 <Evaluation of laminate>
About the silver layer formed above, the crystallite diameter of metallic silver was computed by the same method as Example 6. The results are shown in Table 4.
Further, the volume resistivity ρ (μΩ · cm) of the silver layer obtained above was calculated in the same manner as in Example 6. The results are shown in Table 4.
<積層体の製造及び評価>
[実施例8]
表3及び4に示すように、銀層形成時において、塗布済みの基材を80℃で2分間湯煎して加熱処理するのに代えて、80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理した点以外は、実施例7と同じ方法で積層体を製造し、評価した。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Example 8]
As shown in Tables 3 and 4, at the time of forming the silver layer, instead of heat-treating the coated substrate at 80 ° C. for 2 minutes, 2 ° A laminate was produced and evaluated in the same manner as in Example 7, except that the heat treatment was performed for a minute. The results are shown in Table 4.
[実施例8]
表3及び4に示すように、銀層形成時において、塗布済みの基材を80℃で2分間湯煎して加熱処理するのに代えて、80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理した点以外は、実施例7と同じ方法で積層体を製造し、評価した。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Example 8]
As shown in Tables 3 and 4, at the time of forming the silver layer, instead of heat-treating the coated substrate at 80 ° C. for 2 minutes, 2 ° A laminate was produced and evaluated in the same manner as in Example 7, except that the heat treatment was performed for a minute. The results are shown in Table 4.
[実施例9]
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述するアセトンジカルボン酸銀に対して2.0倍モル量)にアセトンジカルボン酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(アセトンジカルボン酸銀に対して2.0倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表3に示す。 [Example 9]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Using a mechanical stirrer, add silver acetonedicarboxylate to 2-ethylhexylamine (2.0 times molar amount relative to silver acetonedicarboxylate described later) in a beaker so that the liquid temperature is 50 ° C. or less. A liquid was obtained by stirring for 15 minutes. To this liquid, formic acid (2.0 times the molar amount with respect to silver acetone dicarboxylate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution would be 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 3 shows the types and mixing ratios of the respective components.
<積層体の製造>
(銀インク組成物の製造)
液温が50℃以下となるように、ビーカー中で2-エチルヘキシルアミン(後述するアセトンジカルボン酸銀に対して2.0倍モル量)にアセトンジカルボン酸銀を添加して、メカニカルスターラーを用いて15分間撹拌することにより、液状物を得た。この液状物に、反応液の温度が50℃以下となるように、シリンジポンプを用いてギ酸(アセトンジカルボン酸銀に対して2.0倍モル量)を30分間かけて滴下した。ギ酸の滴下終了後、25℃にて反応液をさらに1時間撹拌することにより、銀インク組成物を得た。各配合成分の種類と配合比を表3に示す。 [Example 9]
<Manufacture of laminates>
(Manufacture of silver ink composition)
Using a mechanical stirrer, add silver acetonedicarboxylate to 2-ethylhexylamine (2.0 times molar amount relative to silver acetonedicarboxylate described later) in a beaker so that the liquid temperature is 50 ° C. or less. A liquid was obtained by stirring for 15 minutes. To this liquid, formic acid (2.0 times the molar amount with respect to silver acetone dicarboxylate) was added dropwise over 30 minutes using a syringe pump so that the temperature of the reaction solution would be 50 ° C. or lower. After the formic acid was dropped, the reaction solution was further stirred at 25 ° C. for 1 hour to obtain a silver ink composition. Table 3 shows the types and mixing ratios of the respective components.
(積層体の製造)
上記で得られた銀インク組成物を用いた点以外は、実施例6と同じ方法で銀層を形成し、積層体を製造した。加熱処理の条件を表4に示す。 (Manufacture of laminates)
A silver layer was formed by the same method as in Example 6 except that the silver ink composition obtained above was used to produce a laminate. Table 4 shows the conditions for the heat treatment.
上記で得られた銀インク組成物を用いた点以外は、実施例6と同じ方法で銀層を形成し、積層体を製造した。加熱処理の条件を表4に示す。 (Manufacture of laminates)
A silver layer was formed by the same method as in Example 6 except that the silver ink composition obtained above was used to produce a laminate. Table 4 shows the conditions for the heat treatment.
<積層体の評価>
上記で形成した銀層について、実施例6と同じ方法で、金属銀の結晶子径を算出した。結果を表4に示す。
また、上記で得られた銀層について、実施例6と同じ方法で、体積抵抗率ρ(μΩ・cm)を算出した。結果を表4に示す。 <Evaluation of laminate>
About the silver layer formed above, the crystallite diameter of metallic silver was computed by the same method as Example 6. The results are shown in Table 4.
Further, the volume resistivity ρ (μΩ · cm) of the silver layer obtained above was calculated in the same manner as in Example 6. The results are shown in Table 4.
上記で形成した銀層について、実施例6と同じ方法で、金属銀の結晶子径を算出した。結果を表4に示す。
また、上記で得られた銀層について、実施例6と同じ方法で、体積抵抗率ρ(μΩ・cm)を算出した。結果を表4に示す。 <Evaluation of laminate>
About the silver layer formed above, the crystallite diameter of metallic silver was computed by the same method as Example 6. The results are shown in Table 4.
Further, the volume resistivity ρ (μΩ · cm) of the silver layer obtained above was calculated in the same manner as in Example 6. The results are shown in Table 4.
<積層体の製造及び評価>
[実施例10]
表3及び4に示すように、銀層形成時において、塗布済みの基材を80℃で2分間湯煎して加熱処理するのに代えて、80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理した点以外は、実施例9と同じ方法で積層体を製造し、評価した。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Example 10]
As shown in Tables 3 and 4, at the time of forming the silver layer, instead of heat-treating the coated substrate at 80 ° C. for 2 minutes, 2 ° C. in a water vapor atmosphere at 80 ° C. and 100% relative humidity. A laminate was produced and evaluated in the same manner as in Example 9 except that the heat treatment was performed for a minute. The results are shown in Table 4.
[実施例10]
表3及び4に示すように、銀層形成時において、塗布済みの基材を80℃で2分間湯煎して加熱処理するのに代えて、80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理した点以外は、実施例9と同じ方法で積層体を製造し、評価した。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Example 10]
As shown in Tables 3 and 4, at the time of forming the silver layer, instead of heat-treating the coated substrate at 80 ° C. for 2 minutes, 2 ° C. in a water vapor atmosphere at 80 ° C. and 100% relative humidity. A laminate was produced and evaluated in the same manner as in Example 9 except that the heat treatment was performed for a minute. The results are shown in Table 4.
<積層体の製造及び評価>
[比較例4]
表1~4に示すように、銀層形成時において、塗布済みの基材を80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理するのに代えて、80℃で2分間湯煎して加熱処理した点以外は、比較例1と同じ方法で積層体を製造し、評価した。湯としては蒸留水を80℃に加熱したものを用いた。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Comparative Example 4]
As shown in Tables 1 to 4, at the time of forming the silver layer, instead of heat-treating the coated base material in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes, it was performed at 80 ° C. for 2 minutes. A laminate was produced and evaluated in the same manner as in Comparative Example 1 except that it was heat-treated by hot water bathing. As the hot water, distilled water heated to 80 ° C. was used. The results are shown in Table 4.
[比較例4]
表1~4に示すように、銀層形成時において、塗布済みの基材を80℃、相対湿度100%の水蒸気雰囲気下に2分間置いて加熱処理するのに代えて、80℃で2分間湯煎して加熱処理した点以外は、比較例1と同じ方法で積層体を製造し、評価した。湯としては蒸留水を80℃に加熱したものを用いた。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Comparative Example 4]
As shown in Tables 1 to 4, at the time of forming the silver layer, instead of heat-treating the coated base material in a steam atmosphere at 80 ° C. and 100% relative humidity for 2 minutes, it was performed at 80 ° C. for 2 minutes. A laminate was produced and evaluated in the same manner as in Comparative Example 1 except that it was heat-treated by hot water bathing. As the hot water, distilled water heated to 80 ° C. was used. The results are shown in Table 4.
<積層体の製造及び評価>
[比較例5]
表3及び4に示すように、銀層形成時において、熱風の吹き付け(風速:15m/秒)により、塗布済みの基材を80℃で1分間乾燥させるのに代えて、熱風の吹き付け(風速:15m/秒)により、塗布済みの基材を120℃で1分間乾燥させた点以外は、比較例4と同じ方法で積層体を製造し、評価した。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Comparative Example 5]
As shown in Tables 3 and 4, at the time of forming the silver layer, instead of drying the coated substrate at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), blowing hot air (wind speed) : 15 m / sec), a laminate was produced and evaluated in the same manner as in Comparative Example 4 except that the coated substrate was dried at 120 ° C. for 1 minute. The results are shown in Table 4.
[比較例5]
表3及び4に示すように、銀層形成時において、熱風の吹き付け(風速:15m/秒)により、塗布済みの基材を80℃で1分間乾燥させるのに代えて、熱風の吹き付け(風速:15m/秒)により、塗布済みの基材を120℃で1分間乾燥させた点以外は、比較例4と同じ方法で積層体を製造し、評価した。結果を表4に示す。 <Manufacture and evaluation of laminate>
[Comparative Example 5]
As shown in Tables 3 and 4, at the time of forming the silver layer, instead of drying the coated substrate at 80 ° C. for 1 minute by blowing hot air (wind speed: 15 m / second), blowing hot air (wind speed) : 15 m / sec), a laminate was produced and evaluated in the same manner as in Comparative Example 4 except that the coated substrate was dried at 120 ° C. for 1 minute. The results are shown in Table 4.
上記結果から明らかなように、実施例6~10の積層体では、80℃以下という低い加熱処理温度で形成したにもかかわらず、また、加熱処理の方法を変更したにもかかわらず、銀層は体積抵抗率が十分に低く、導電性に優れていた。これら実施例において、銀層を構成する金属銀の結晶子径は、22.1nm以上であった。
これに対して、比較例4~5の積層体では、用いた銀インク組成物に対して加熱処理温度が低かったことが原因と考えられ、銀層は体積抵抗率が高く、導電性に劣っていた。 As is clear from the above results, in the laminates of Examples 6 to 10, the silver layer was formed despite the fact that it was formed at a low heat treatment temperature of 80 ° C. or less, and the heat treatment method was changed. Had a sufficiently low volume resistivity and excellent conductivity. In these examples, the crystallite diameter of metallic silver constituting the silver layer was 22.1 nm or more.
On the other hand, in the laminates of Comparative Examples 4 to 5, it is considered that the heat treatment temperature was lower than that of the silver ink composition used, and the silver layer has a high volume resistivity and poor conductivity. It was.
これに対して、比較例4~5の積層体では、用いた銀インク組成物に対して加熱処理温度が低かったことが原因と考えられ、銀層は体積抵抗率が高く、導電性に劣っていた。 As is clear from the above results, in the laminates of Examples 6 to 10, the silver layer was formed despite the fact that it was formed at a low heat treatment temperature of 80 ° C. or less, and the heat treatment method was changed. Had a sufficiently low volume resistivity and excellent conductivity. In these examples, the crystallite diameter of metallic silver constituting the silver layer was 22.1 nm or more.
On the other hand, in the laminates of Comparative Examples 4 to 5, it is considered that the heat treatment temperature was lower than that of the silver ink composition used, and the silver layer has a high volume resistivity and poor conductivity. It was.
本発明は、配線基板、電磁波シールド、タッチパネル、無線通信機筐体のアンテナ等、基材上に金属銀の層を備えた各種電子機器に利用可能である。
The present invention can be used for various electronic devices having a metallic silver layer on a substrate, such as a wiring board, an electromagnetic wave shield, a touch panel, and an antenna of a wireless communication device casing.
1 積層体
11 基材
11a 基材の一方の主面(表面)
11b 基材の他方の主面(裏面)
12 銀層 DESCRIPTION OF SYMBOLS 1Laminated body 11 Base material 11a One main surface (surface) of a base material
11b The other main surface (back surface) of the base material
12 Silver layer
11 基材
11a 基材の一方の主面(表面)
11b 基材の他方の主面(裏面)
12 銀層 DESCRIPTION OF SYMBOLS 1
11b The other main surface (back surface) of the base material
12 Silver layer
Claims (8)
- 結晶子径が15nm以上のもので構成され、体積抵抗率が8μΩ・cm以下である金属銀。 Metal silver with a crystallite diameter of 15 nm or more and a volume resistivity of 8 μΩ · cm or less.
- 前記結晶子径が16.5nm以上80nm以下である、請求項1に記載の金属銀。 The metallic silver according to claim 1, wherein the crystallite diameter is 16.5 nm or more and 80 nm or less.
- 下記一般式(1)で表わされるβ-ケトカルボン酸銀を用いて形成された、請求項1に記載の金属銀。
Y1はそれぞれ独立にフッ素原子、塩素原子、臭素原子又は水素原子であり;R1は炭素数1~19の脂肪族炭化水素基又はフェニル基であり;R2は炭素数1~20の脂肪族炭化水素基であり;R3は炭素数1~16の脂肪族炭化水素基であり;R4及びR5はそれぞれ独立に炭素数1~18の脂肪族炭化水素基であり;R6は炭素数1~19の脂肪族炭化水素基、水酸基又は式「AgO-」で表される基であり;
X1はそれぞれ独立に水素原子、炭素数1~20の脂肪族炭化水素基、ハロゲン原子、1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはベンジル基、シアノ基、N-フタロイル-3-アミノプロピル基、2-エトキシビニル基、又は一般式「R7O-」、「R7S-」、「R7-C(=O)-」若しくは「R7-C(=O)-O-」で表される基であり;
R7は、炭素数1~10の脂肪族炭化水素基、チエニル基、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはジフェニル基である。) The metallic silver according to claim 1, which is formed using silver β-ketocarboxylate represented by the following general formula (1).
Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom; R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group; R 2 is an aliphatic having 1 to 20 carbon atoms R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms; R 4 and R 5 are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms; R 6 is An aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”;
X 1 is independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group or benzyl group in which one or more hydrogen atoms may be substituted with a substituent, a cyano group, N -Phthaloyl-3-aminopropyl group, 2-ethoxyvinyl group, or “R 7 O—”, “R 7 S—”, “R 7 —C (═O) —” or “R 7 —C ( ═O) —O— ”;
R 7 is an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group, or a phenyl group or diphenyl group in which one or more hydrogen atoms may be substituted with a substituent. ) - 下記一般式(1)で表わされるβ-ケトカルボン酸銀を用いて、結晶子径が15nm以上のもので構成され、体積抵抗率が8μΩ・cm以下である金属銀を形成する工程を有する、金属銀の製造方法。
Y1はそれぞれ独立にフッ素原子、塩素原子、臭素原子又は水素原子であり;R1は炭素数1~19の脂肪族炭化水素基又はフェニル基であり;R2は炭素数1~20の脂肪族炭化水素基であり;R3は炭素数1~16の脂肪族炭化水素基であり;R4及びR5はそれぞれ独立に炭素数1~18の脂肪族炭化水素基であり;R6は炭素数1~19の脂肪族炭化水素基、水酸基又は式「AgO-」で表される基であり;
X1はそれぞれ独立に水素原子、炭素数1~20の脂肪族炭化水素基、ハロゲン原子、1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはベンジル基、シアノ基、N-フタロイル-3-アミノプロピル基、2-エトキシビニル基、又は一般式「R7O-」、「R7S-」、「R7-C(=O)-」若しくは「R7-C(=O)-O-」で表される基であり;
R7は、炭素数1~10の脂肪族炭化水素基、チエニル基、又は1個以上の水素原子が置換基で置換されていてもよいフェニル基若しくはジフェニル基である。) A metal having a step of forming silver metal having a crystallite diameter of 15 nm or more and a volume resistivity of 8 μΩ · cm or less, using silver β-ketocarboxylate represented by the following general formula (1) Silver production method.
Y 1 is each independently a fluorine atom, a chlorine atom, a bromine atom or a hydrogen atom; R 1 is an aliphatic hydrocarbon group having 1 to 19 carbon atoms or a phenyl group; R 2 is an aliphatic having 1 to 20 carbon atoms R 3 is an aliphatic hydrocarbon group having 1 to 16 carbon atoms; R 4 and R 5 are each independently an aliphatic hydrocarbon group having 1 to 18 carbon atoms; R 6 is An aliphatic hydrocarbon group having 1 to 19 carbon atoms, a hydroxyl group or a group represented by the formula “AgO—”;
X 1 is independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 20 carbon atoms, a halogen atom, a phenyl group or benzyl group in which one or more hydrogen atoms may be substituted with a substituent, a cyano group, N -Phthaloyl-3-aminopropyl group, 2-ethoxyvinyl group, or “R 7 O—”, “R 7 S—”, “R 7 —C (═O) —” or “R 7 —C ( ═O) —O— ”;
R 7 is an aliphatic hydrocarbon group having 1 to 10 carbon atoms, a thienyl group, or a phenyl group or diphenyl group in which one or more hydrogen atoms may be substituted with a substituent. ) - 前記金属銀を形成する工程において、前記β-ケトカルボン酸銀が配合されてなる銀インク組成物を、非加湿条件下で加熱処理した後、さらに加湿条件下で、又は加熱した液体と接触させて、加熱処理することで前記金属銀を形成する、請求項4に記載の金属銀の製造方法。 In the step of forming the metallic silver, the silver ink composition containing the β-ketocarboxylate is heat-treated under non-humidified conditions, and then further contacted with the heated liquid under humidified conditions. The method for producing metallic silver according to claim 4, wherein the metallic silver is formed by heat treatment.
- 請求項1に記載の金属銀からなる層を基材上に備えた積層体。 A laminate comprising a layer of metallic silver according to claim 1 on a substrate.
- 前記基材の厚さが0.5~5000μmであり、前記金属銀からなる層の厚さが0.01~5μmである、請求項6に記載の積層体。 The laminate according to claim 6, wherein the thickness of the base material is 0.5 to 5000 µm, and the thickness of the layer made of metallic silver is 0.01 to 5 µm.
- 前記基材は、ASTM D648で規定される、1.8MPaの曲げ応力でたわみ量が0.25mmとなるときの荷重たわみ温度が120℃以下のものである、請求項6に記載の積層体。 The laminate according to claim 6, wherein the base material has a deflection temperature under load of 120 ° C. or less when a deflection amount is 0.25 mm under a bending stress of 1.8 MPa as defined by ASTM D648.
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