WO2016045151A1 - 阵列基板与彩膜基板的对组方法 - Google Patents

阵列基板与彩膜基板的对组方法 Download PDF

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Publication number
WO2016045151A1
WO2016045151A1 PCT/CN2014/088317 CN2014088317W WO2016045151A1 WO 2016045151 A1 WO2016045151 A1 WO 2016045151A1 CN 2014088317 W CN2014088317 W CN 2014088317W WO 2016045151 A1 WO2016045151 A1 WO 2016045151A1
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Prior art keywords
array substrate
substrate
color filter
glue
filter substrate
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French (fr)
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谢克成
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Definitions

  • the present invention relates to a manufacturing method of a thin film transistor liquid crystal display (TFT-LCD), and more particularly to a method for grouping an array substrate and a color filter substrate for a liquid crystal display.
  • TFT-LCD thin film transistor liquid crystal display
  • the TFT-LCD includes an array substrate and a color filter substrate.
  • the liquid crystal is coated with a sealant on the array substrate or the color filter substrate, and the array substrate containing the liquid crystal and the sealant is paired with the color filter substrate, and baked and aligned.
  • the process completes the fabrication of the TFT display device.
  • the adhesion between the array substrate and the color filter substrate is relatively poor, because the manufacturing process of the array substrate and the color film substrate pair is not in the same machine as the frame glue curing.
  • the substrate needs to be transported after the completion of the group. During this period, the problem of the offset between the array substrate and the color filter substrate easily occurs during the substrate transfer process, resulting in defects such as light leakage of the TFT display device.
  • the technical problem to be solved by the present invention is to provide a method for grouping an array substrate and a color filter substrate, which can accurately align the alignment between the array substrate and the color filter substrate, and avoid the substrate pair caused by handling or flipping. Poor position.
  • the present invention provides a method for grouping an array substrate and a color filter substrate, including:
  • glue particles comprising a film layer and glue, the film layer coating the glue
  • the array substrate and the color filter substrate are bonded together, and during the bonding process, the glue flows out from the film layer to fix the array substrate and the color filter substrate.
  • step of making the glue particles comprises filling the glue layer in the film layer by means of injection molding.
  • the film layer is an organic film.
  • an outer layer of the film layer is coated with an adhesive layer for adhering to the color filter substrate or the array substrate.
  • the method further includes:
  • the glue particles are positioned in the groove during the process of placing the glue particles on the array substrate or the color film substrate.
  • the fixing position is a non-metal material, and an adhesive is disposed between the glue particles and the groove.
  • a bump is provided at the position of the groove, the bump contacting the glue particles.
  • the glue particles are pressed by the array substrate and the color filter substrate in the process of bonding, and the glue particles are pressed.
  • the film layer is broken such that the glue flows out of the film layer.
  • the method further comprises applying a sealant on the array substrate or the color filter substrate, wherein the inner surrounding area of the sealant comprises a display area
  • the periphery of the sealant includes a non-display area, and the glue particles are placed in the non-display area.
  • the height of the glue particles protruding from the array substrate or the color filter substrate is greater than the height of the frame glue protruding from the array substrate or the color filter substrate.
  • the present invention also provides a method for grouping an array substrate and a color filter substrate, comprising:
  • the glue particles comprising a film layer and a glue, the film layer coating the glue, the film layer being an organic film;
  • step of making the glue particles comprises filling the glue layer in the film layer by means of injection molding.
  • an outer layer of the film layer is coated with an adhesive layer for adhering to the color filter substrate or the array substrate.
  • the method further includes:
  • the glue particles are positioned in the groove during the process of placing the glue particles on the array substrate or the color film substrate.
  • the fixing position is a non-metal material, and an adhesive is disposed between the glue particles and the groove.
  • a bump is provided at the position of the groove, the bump contacting the glue particles.
  • the method further comprises applying a sealant on the array substrate or the color filter substrate, wherein the inner surrounding area of the sealant comprises a display area
  • the periphery of the sealant includes a non-display area, and the glue particles are placed in the non-display area.
  • the height of the glue particles protruding from the array substrate or the color filter substrate is greater than the height of the frame glue protruding from the array substrate or the color filter substrate.
  • the glue flows out from the film layer, and the instant curing of the array substrate and the color film substrate in the bonding process is realized by the instant curing of the glue, and the frame is avoided.
  • the substrate is offset before the thermal curing is completed, resulting in quality problems such as product leakage.
  • the invention achieves accurate alignment and avoids the situation of poor substrate alignment caused by handling or flipping. It also strengthens the guarantee of product quality and enhances the product yield, which is conducive to the rapid development of products and enhance the market competitiveness of products.
  • 1 is a schematic view of glue particles in a method of grouping an array substrate and a color filter substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing the positional relationship between the array substrate, the color filter substrate, the glue particles, and the sealant in the method of grouping the array substrate and the color filter substrate according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of providing a sealant and a glue particle on an array substrate or a color filter substrate in a method of grouping an array substrate and a color filter substrate according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing a groove provided on an array substrate or a color filter substrate in a method of grouping an array substrate and a color filter substrate according to an embodiment of the present invention.
  • the invention provides a method for grouping an array substrate and a color filter substrate in a liquid crystal display, comprising the following steps:
  • step 101 glue particles are prepared.
  • the glue particles 10 include a film layer 12 and a glue 14, and the film layer 12 covers the glue 14 to form a pellet.
  • the glue 14 is an instant curing glue which is capable of reacting with oxygen in an instant to achieve curing in a short time.
  • the step of making the glue particles 10 includes filling the glue layer 14 in the film layer 12 by injection molding.
  • the film layer 12 is an organic film.
  • the film layer 12 has a thickness of between 100 A and 1 um.
  • the glue 14 has a capacity of between 10 ng and 10 g, and the glue particles are broken by the external pressing force, and the film layer 12 is broken, so that the glue 14 flows out of the film layer 12.
  • Step 102 referring to FIG. 2 and FIG. 3, the glue particles 10 are placed on the array substrate 20 or the color filter substrate 40.
  • the glue particles 10 are added to the syringe dropping device, and the syringe dropping device is installed. Above the array substrate 20 or the color filter substrate 40, the syringe dropping device is manipulated to drop the glue particles 10, thereby effecting the placement of the glue particles 10 on the array substrate 20 or the color filter substrate 40.
  • Step 103 bonding the array substrate 20 and the color filter substrate 40, and during the bonding process, the glue 14 flows out from the film layer 12 to the array substrate 20 and the The color filter substrate 40 is fixed.
  • the film layer 12 of the glue particles 10 is broken due to the pressing action between the array substrate 20 and the color filter substrate 40, so that the glue 14 is removed from the film layer.
  • the process of bonding the group is completed in a vacuum environment.
  • the vacuum is broken, that is, when the product is taken out from the vacuum environment, since the flowing glue 14 is in contact with oxygen, it can be instantaneously solidified.
  • the array substrate 20 and the color filter substrate 40 are fixed together in a short time, avoiding relative offset in subsequent processes.
  • the film layer 12 is broken due to the pressing force between the array substrate 20 and the color filter substrate 40, so that the glue 14 flows out of the film layer 12 through the glue 14
  • the instant curing realizes the pre-fixing of the array substrate 20 and the color film substrate 40 in the bonding process, thereby avoiding the substrate from being displaced before the completion of the frame glue thermal curing, resulting in quality problems such as light leakage of the product.
  • the invention achieves accurate alignment and avoids the situation of poor substrate alignment caused by handling or flipping. It also strengthens the guarantee of product quality and enhances the product yield, which is conducive to the rapid development of products and enhance the market competitiveness of products.
  • the method further includes: coating the outer surface of the film layer 12 with the color film
  • An adhesion layer (not shown) to which the substrate 40 or the array substrate 20 is adhered, the adhesion layer is insoluble in lubricating oil, and the adhesion layer can adhere to an organic material, the adhesion layer and Stainless steel has no adhesion.
  • the adhesion layer may be coated with a solid glue.
  • the present invention borrows a syringe dropping device
  • the syringe dropping device is made of stainless steel
  • the glue particles 10 are added inside the syringe dropping device
  • lubricating oil is added inside the syringe dropping device.
  • the lubricating oil can keep the plurality of glue particles 10 independent and non-blocking, and the lubricating oil can ensure that the glue particles 10 are dripped smoothly.
  • the array substrate 20 or the color filter substrate 40 is made of an organic material, and the adhesion layer on the surface of the film layer 12 can adhere to the array substrate 20 or the color filter substrate 40, thereby ensuring that the glue particles 10 are on the array substrate 20 or the color film. Pre-position of the substrate 40.
  • step 102 that is, before the step of placing the glue particles 10 on the array substrate 20 or the color filter substrate 40, the method further includes the following steps:
  • Step 201 selecting at least one fixed position on the array substrate 20 or the color filter substrate 40;
  • Step 202 providing a groove C at the fixed position.
  • the groove C may be formed on the array substrate 20 or the color filter substrate 40 by exposure and development.
  • the recessed depth of C is smaller than the size of the glue particles 10;
  • Step 203 during the process of placing the glue particles 10 on the array substrate 20 or the color filter substrate 40, the glue particles 10 are positioned in the groove C.
  • the ITO (Indium Tin Oxide) layer is not used at the fixed position of the fixing substrate at the fixed position where the glue particles 10 are coated on the array substrate 20 or the color filter substrate 40.
  • the groove C can be provided at a fixed position by the exposure developing method so that the glue particle 10 can be positioned to the array substrate 20 or the color filter substrate 40 when it is dropped.
  • An adhesive is provided between the glue particles 10 and the groove C.
  • the adherend enables positioning when the glue particles 10 are placed on the array substrate 20 or the color filter substrate 40.
  • the adherend may be disposed in the recess C, and the glue particles 10 fall on the adherent when dropped into the recess C.
  • the adherend may also be disposed on the outer surface of the glue particle 10, similar to the structure of the adhesive layer on the outer surface of the film layer 12 of the glue particle 10 previously described.
  • the array substrate 20 and the color filter substrate 40 are close to each other during the bonding process.
  • the glue particles 10 are extruded such that the film layer 12 is broken, so that the glue 14 flows out of the film layer 12.
  • the present invention provides a bump 90 in the groove C, and the bump 90 contacts the glue particle 10.
  • the arrangement of the bumps 90 facilitates the cracking of the film layer 12 of the glue particles 10 during the process of laminating and pressing the array substrate 20 and the color filter substrate 40.
  • the method further includes coating the sealant 50 on the array substrate 20 or the color filter substrate 40,
  • the inner surrounding area of the sealant 50 includes a display area 52.
  • the periphery of the sealant 50 includes a non-display area 54 (referred to as a dummy area in the industry), and the glue particles 10 are placed in the non-display area 54. Pass The sealant 50 can seal the display area 52 after the array substrate 20 and the color filter substrate 40 are bonded together.
  • the height of the glue particles 10 protruding from the array substrate 20 or the color filter substrate 40 is greater than the height of the sealant 50 protruding from the array substrate 20 or the color filter substrate 40.
  • the sealant 50 does not affect the cracking of the film layer 12 of the glue particles 10.
  • the process of bonding the array substrate 20 and the color filter substrate 40 to each other is that the distance between the two is constantly moving and fine-tuning, and the process of continuously moving and fine-tuning is generally Controlled in the range of 1 s to 10 s, the curing time of the glue 14 in the glue particles 10 of the present invention after flowing out of the film layer 12 is between 10 s and 30 s to instantaneously cure the array 20 and the color filter substrate 40.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Optical Filters (AREA)

Abstract

一种阵列基板与彩膜基板的对组方法，包括如下步骤：制作胶水颗粒（10），所述胶水颗粒（10）包括膜层（12）和胶水（14），所述膜层（12）包覆所述胶水（14）。将所述胶水颗粒（10）置于阵列基板（20）或彩膜基板（40）上。将所述阵列基板（20）和所述彩膜基板（40）进行贴合，在贴合的过程中，所述胶水（14）从所述膜层（12）内流出，以将所述阵列基板（20）和所述彩膜基板（40）固定。所述阵列基板（20）与彩膜基板（40）的对组方法通过胶水颗粒实现了阵列基板（20）与彩膜基板（40）的贴合过程中的提前固定，实现精确对位。

Description

阵列基板与彩膜基板的对组方法
本发明要求2014年9月26日递交的发明名称为“阵列基板与彩膜基板的对组方法”的申请号201410505190.2的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及薄膜晶体管液晶显示器(Thin Film Transistor liquid crystal display，TFT-LCD)的制造技术，特别涉及一种用于液晶显示器的阵列基板与彩膜基板的对组方法。
背景技术
TFT-LCD包括阵列基板和彩膜基板，在阵列基板或彩膜基板上滴入液晶与涂上框胶，并将含有液晶和框胶的阵列基板与彩膜基板对组，经过烘烤、配向制程完成TFT显示器件的制作。在阵列基板与彩膜基板对组后框胶固化前，阵列基板与彩膜基板的粘结性还比较差，由于阵列基板与彩膜基板对组的制作工序与框胶固化不是在同一个机台完成的，对组完成后需要对基板进行搬运。在此期间基板搬运过程中很容易发生阵列基板与彩膜基板偏移的问题，导致TFT显示器件发生漏光等不良。
发明内容
本发明所要解决的技术问题在于提供一种阵列基板与彩膜基板的对组方法，可以使阵列基板与彩膜基板的贴合过程中实现精确对位，避免由于搬运或翻转而引起的基板对位不良的情形。
为了实现上述目的，本发明实施方式提供如下技术方案：
一方面，本发明供了一种阵列基板与彩膜基板的对组方法，包括：
制作胶水颗粒，所述胶水颗粒包括膜层和胶水，所述膜层包覆所述胶水；
将所述胶水颗粒置于阵列基板或彩膜基板上；
将所述阵列基板和所述彩膜基板进行贴合，在贴合的过程中，所述胶水从所述膜层内流出，以将所述阵列基板和所述彩膜基板固定。
其中，所述制作胶水颗粒的步骤包括通过注塑填充的方法在所述膜层内填充所述胶水。
其中，所述膜层为有机薄膜。
其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，在所述膜层外表面涂覆有用于与所述彩膜基板或所述阵列基板粘附的粘附层。
其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，还包括：
在所述阵列基板或所述彩膜基板上选择至少一个固定位置；
在所述固定位置处设置凹槽；
将所述胶水颗粒置于阵列基板或彩膜基板上的过程中，将所述胶水颗粒定位在所述凹槽内。
其中，在所述固定位置处为非金属材质，所述胶水颗粒与所述凹槽之间设有粘附物。
其中，在所述凹槽的位置处设置突点，所述突点接触所述胶水颗粒。
其中，在将所述阵列基板和所述彩膜基板进行贴合的步骤中，通过所述阵列基板和所述彩膜基板在贴合过程中的相互靠近，挤压所述胶水颗粒，使所述膜层破裂，从而使得所述胶水流出所述膜层。
其中，在将所述胶水颗粒置于阵列基板或彩膜基板上步骤之前，还包括在所述阵列基板或所述彩膜基板上涂布框胶，所述框胶的内部包围区域包括显示区，所述框胶的外围包括非显示区，所述胶水颗粒置于所述非显示区。
其中，所述胶水颗粒突出于所述阵列基板或所述彩膜基板的高度大于所述框胶突出于所述阵列基板或所述彩膜基板的高度。
另一方面，本发明还提供一种阵列基板与彩膜基板的对组方法，包括：
制作胶水颗粒，所述胶水颗粒包括膜层和胶水，所述膜层包覆所述胶水，所述膜层为有机薄膜；
将所述胶水颗粒置于阵列基板或彩膜基板上；
将所述阵列基板和所述彩膜基板进行贴合，通过所述阵列基板和所述彩膜基板在贴合过程中的相互靠近，挤压所述胶水颗粒，使所述膜层破裂，从而使得所述胶水从所述膜层内流出，以将所述阵列基板和所述彩膜基板固定。
其中，所述制作胶水颗粒的步骤包括通过注塑填充的方法在所述膜层内填充所述胶水。
其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，在所述膜层外表面涂覆有用于与所述彩膜基板或所述阵列基板粘附的粘附层。
其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，还包括：
在所述阵列基板或所述彩膜基板上选择至少一个固定位置；
在所述固定位置处设置凹槽；
将所述胶水颗粒置于阵列基板或彩膜基板上的过程中，将所述胶水颗粒定位在所述凹槽内。
其中，在所述固定位置处为非金属材质，所述胶水颗粒与所述凹槽之间设有粘附物。
其中，在所述凹槽的位置处设置突点，所述突点接触所述胶水颗粒。
其中，在将所述胶水颗粒置于阵列基板或彩膜基板上步骤之前，还包括在所述阵列基板或所述彩膜基板上涂布框胶，所述框胶的内部包围区域包括显示区，所述框胶的外围包括非显示区，所述胶水颗粒置于所述非显示区。
其中，所述胶水颗粒突出于所述阵列基板或所述彩膜基板的高度大于所述框胶突出于所述阵列基板或所述彩膜基板的高度。
本发明通过在阵列基板与彩膜基板的贴合挤压过程中，胶水从膜层内流出，通过胶水的瞬间固化实现了阵列基板与彩膜基板在贴合过程中的提前固定，避免在框胶热固化完成前基板发生偏移，导致产品漏光等品质问题。本发明实现精确对位，避免由于搬运或翻转而引起的基板对位不良的情形。也加强了产品品质的保证，提升产品良率，有利于产品的快速开发，提升产品的市场竞争力。
附图说明
为了更清楚地说明本发明的技术方案，下面将对实施方式中所需要使用的 附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是本发明一种实施方式提供的阵列基板与彩膜基板的对组方法中的胶水颗粒的示意图。
图2是本发明一种实施方式提供的阵列基板与彩膜基板的对组方法中的阵列基板、彩膜基板、胶水颗粒及框胶之间位置关系的示意图。
图3是本发明一种实施方式提供的阵列基板与彩膜基板的对组方法中在阵列基板或彩膜基板上设置框胶及胶水颗粒的示意图。
图4是本发明一种实施方式提供的阵列基板与彩膜基板的对组方法中在阵列基板或彩膜基板上设置凹槽的示意图。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。
本发明供了一种液晶显示器中的阵列基板与彩膜基板的对组方法，包括如下步骤：
步骤101，制作胶水颗粒，请参阅图1，所述胶水颗粒10包括膜层12和胶水14，所述膜层12包覆所述胶水14形成颗粒状。所述胶水14为瞬间固化胶水，所述胶水14能够在瞬间与氧气发生反应，从而实现短时间内的固化。
具体而言，一种实施方式中，所述制作胶水颗粒10的步骤包括通过注塑填充的方法在所述膜层12内填充所述胶水14。
一种实施方式中，所述膜层12为有机薄膜。所述膜层12的厚度为100A至1um之间。所述胶水14的容量为10ng至10g之间，且胶水颗粒在受到外界挤压力的作用下，膜层12破裂，从而使胶水14从膜层12内流出
步骤102，请参阅图2和图3，将所述胶水颗粒10置于阵列基板20或彩膜基板40上。
具体的，是将胶水颗粒10添加到针筒滴下装置内，将针筒滴下装置安装 在阵列基板20或彩膜基板40上方，操纵针筒滴下装置以将胶水颗粒10滴下，从而实现将胶水颗粒10置于阵列基板20或彩膜基板40上。
步骤103，将所述阵列基板20和所述彩膜基板40进行贴合，在贴合的过程中，所述胶水14从所述膜层12内流出，以将所述阵列基板20和所述彩膜基板40固定。
在阵列基板20与彩膜基板40对组贴合的过程中，由于阵列基板20与彩膜基板40之间的挤压作用，使胶水颗粒10的膜层12破裂，从而使胶水14从膜层12内流出。通常，对组贴合的过程是在真空环境下完成的，破真空时，也就是说，将产品从真空环境中取出来的时候，由于流出的胶水14与氧气接触，能够瞬时固化，这样就使得阵列基板20与彩膜基板40在短时间内固定在一起，避免了后续制程中的相对偏移。
本发明在阵列基板20与彩膜基板40的贴合过程中，由于阵列基板20与彩膜基板40之间的挤压力，使得膜层12破裂，使胶水14流出膜层12，通过胶水14的瞬间固化实现了阵列基板20与彩膜基板40在贴合过程中的提前固定，避免在框胶热固化完成前基板发生偏移，导致产品漏光等品质问题。本发明实现精确对位，避免由于搬运或翻转而引起的基板对位不良的情形。也加强了产品品质的保证，提升产品良率，有利于产品的快速开发，提升产品的市场竞争力。
具体而言，在步骤102之前，即在将所述胶水颗粒10置于阵列基板20或彩膜基板40上之前，还包括：在所述膜层12外表面涂覆有用于与所述彩膜基板40或所述阵列基板20粘附的粘附层(未图示)，所述粘附层不溶于润滑油，所述粘附层与有机材料能够发生粘附作用，所述粘附层与不锈钢材质没有粘附作用。本实施例中，粘附层可由固体胶水涂覆而成。
一种实施方式中，本发明借用针筒滴下装置，针筒滴下装置为不锈钢材质，将所述胶水颗粒10添加在所述针筒滴下装置内部，并且在所述针筒滴下装置内部添加润滑油，润滑油能够使得多个胶水颗粒10之间保持独立，不粘连，而且润滑油能保证胶水颗粒10顺利滴下。阵列基板20或彩膜基板40为有机材料制成，膜层12表面的粘附层能够与阵列基板20或彩膜基板40发生粘附作用，这样能够保证胶水颗粒10在阵列基板20或彩膜基板40的预定位。
一种实施方式中，在步骤102之前，即在将所述胶水颗粒10置于阵列基板20或彩膜基板40上的步骤之前，还包括如下步骤：
步骤201，在所述阵列基板20或所述彩膜基板40上选择至少一个固定位置；
步骤202，在所述固定位置处设置凹槽C，请参阅图4，所述凹槽C可以通过曝光显影的方式形成在所述阵列基板20或所述彩膜基板40上，所述凹槽C的凹入深度小于胶水颗粒10的尺寸；及
步骤203，将所述胶水颗粒10置于阵列基板20或彩膜基板40上的过程中，将所述胶水颗粒10定位在所述凹槽C内。
具体而言，在所述固定位置处为非金属材质，即在阵列基板20或彩膜基板40上涂覆胶水颗粒10的固定位置处采用不做ITO(Indium tin oxide，氧化铟锡)层，从而能通过曝光显影方式在固定位置处设置凹槽C，以使胶水颗粒10被滴下时，能够定位至阵列基板20或彩膜基板40。所述胶水颗粒10与所述凹槽C之间设有粘附物。所述粘附物能够实现在胶水颗粒10置于所述阵列基板20或所述彩膜基板40上时的定位。一种实施方式中，粘附物可以设置在凹槽C中，胶水颗粒10滴入所述凹槽C内时落在粘附物上。另一种实施方式中，粘附物也可以设置在胶水颗粒10外表面，类似前面所述的胶水颗粒10的膜层12外表面的粘附层的结构。
本发明一种实施方式中，在将所述阵列基板20和所述彩膜基板40贴合的步骤中，通过所述阵列基板20和所述彩膜基板40在贴合过程中的相互靠近，挤压所述胶水颗粒10，使得所述膜层12破裂，从而使得所述胶水14从所述膜层12流出。
进一步而言，请参阅图4，本发明在所述凹槽C内设置突点90，所述突点90接触所述胶水颗粒10。突点90的设置，在将所述阵列基板20和所述彩膜基板40贴合挤压的过程中，有利于胶水颗粒10的膜层12的破裂。
在步骤102之前，即，在将所述胶水颗粒10置于阵列基板20或彩膜基板40上步骤之前，还包括在所述阵列基板20或所述彩膜基板40上涂布框胶50，所述框胶50的内部包围区域包括显示区52，所述框胶50的外围包括非显示区54(业界称之为dummy区)，所述胶水颗粒10置于所述非显示区54。通过 所述框胶50，能够实现阵列基板20与彩膜基板40贴合后显示区52的密封。
所述胶水颗粒10突出于所述阵列基板20或所述彩膜基板40的高度大于所述框胶50突出于所述阵列基板20或所述彩膜基板40的高度。这样框胶50不会影响胶水颗粒10的膜层12的破裂。
在阵列基板20与彩膜基板40贴合的过程中，阵列基板20与彩膜基板40相互贴合的过程是二者之间的距离由大至小不断移动微调，这个不断移动微调的过程一般控制在1s至10s的范围内，本发明的所述胶水颗粒10中的胶水14从膜层12内流出后的固化时间在10s至30s之间，以使阵列20与彩膜基板40瞬间固化。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (18)

  1. 一种阵列基板与彩膜基板的对组方法，包括：
    制作胶水颗粒，所述胶水颗粒包括膜层和胶水，所述膜层包覆所述胶水；
    将所述胶水颗粒置于阵列基板或彩膜基板上；
    将所述阵列基板和所述彩膜基板进行贴合，在贴合的过程中，所述胶水从所述膜层内流出，以将所述阵列基板和所述彩膜基板固定。
  2. 如权利要求1所述的阵列基板与彩膜基板的对组方法，其中，所述制作胶水颗粒的步骤包括通过注塑填充的方法在所述膜层内填充所述胶水。
  3. 如权利要求1所述的阵列基板与彩膜基板的对组方法，其中，所述膜层为有机薄膜。
  4. 如权利要求1所述的阵列基板与彩膜基板的对组方法，其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，在所述膜层外表面涂覆有用于与所述彩膜基板或所述阵列基板粘附的粘附层。
  5. 如权利要求1所述的阵列基板与彩膜基板的对组方法，其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，还包括：
    在所述阵列基板或所述彩膜基板上选择至少一个固定位置；
    在所述固定位置处设置凹槽；
    将所述胶水颗粒置于阵列基板或彩膜基板上的过程中，将所述胶水颗粒定位在所述凹槽内。
  6. 如权利要求5所述的阵列基板与彩膜基板的对组方法，其中，在所述固定位置处为非金属材质，所述胶水颗粒与所述凹槽之间设有粘附物。
  7. 如权利要求5所述的阵列基板与彩膜基板的对组方法，其中，在所述凹槽内设置突点，所述突点接触所述胶水颗粒。
  8. 如权利要求1所述的阵列基板与彩膜基板的对组方法，其中，在将所述阵列基板和所述彩膜基进行板贴合的步骤中，通过所述阵列基板和所述彩膜基板在贴合过程中的相互靠近，挤压所述胶水颗粒，使所述膜层破裂，从而使得所述胶水从所述膜层内流出。
  9. 如权利要求1所述的阵列基板与彩膜基板的对组方法，其中，在将所述胶水颗粒置于阵列基板或彩膜基板上步骤之前，还包括在所述阵列基板或所述彩膜基板上涂布框胶，所述框胶的内部包围区域包括显示区，所述框胶的外围包括非显示区，所述胶水颗粒置于所述非显示区。
  10. 如权利要求9所述的阵列基板与彩膜基板的对组方法，其中，所述胶水颗粒突出于所述阵列基板或所述彩膜基板的高度大于所述框胶突出于所述阵列基板或所述彩膜基板的高度。
  11. 一种阵列基板与彩膜基板的对组方法，包括：
    制作胶水颗粒，所述胶水颗粒包括膜层和胶水，所述膜层包覆所述胶水，所述膜层为有机薄膜；
    将所述胶水颗粒置于阵列基板或彩膜基板上；
    将所述阵列基板和所述彩膜基板进行贴合，通过所述阵列基板和所述彩膜基板在贴合过程中的相互靠近，挤压所述胶水颗粒，使所述膜层破裂，从而使得所述胶水从所述膜层内流出，以将所述阵列基板和所述彩膜基板固定。
  12. 如权利要求11所述的阵列基板与彩膜基板的对组方法，其中，所述制作胶水颗粒的步骤包括通过注塑填充的方法在所述膜层内填充所述胶水。
  13. 如权利要求11所述的阵列基板与彩膜基板的对组方法，其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，在所述膜层外表面涂覆有用于与所述彩膜基板或所述阵列基板粘附的粘附层。
  14. 如权利要求11所述的阵列基板与彩膜基板的对组方法，其中，在将所述胶水颗粒置于阵列基板或彩膜基板上的步骤之前，还包括：
    在所述阵列基板或所述彩膜基板上选择至少一个固定位置；
    在所述固定位置处设置凹槽；
    将所述胶水颗粒置于阵列基板或彩膜基板上的过程中，将所述胶水颗粒定位在所述凹槽内。
  15. 如权利要求14所述的阵列基板与彩膜基板的对组方法，其中，在所述固定位置处为非金属材质，所述胶水颗粒与所述凹槽之间设有粘附物。
  16. 如权利要求14所述的阵列基板与彩膜基板的对组方法，其中，在所述凹槽内设置突点，所述突点接触所述胶水颗粒。
  17. 如权利要求11所述的阵列基板与彩膜基板的对组方法，其中，在将所述胶水颗粒置于阵列基板或彩膜基板上步骤之前，还包括在所述阵列基板或所述彩膜基板上涂布框胶，所述框胶的内部包围区域包括显示区，所述框胶的外围包括非显示区，所述胶水颗粒置于所述非显示区。
  18. 如权利要求17所述的阵列基板与彩膜基板的对组方法，其中，所述胶水颗粒突出于所述阵列基板或所述彩膜基板的高度大于所述框胶突出于所述阵列基板或所述彩膜基板的高度。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114038838A (zh) * 2021-05-07 2022-02-11 重庆康佳光电技术研究院有限公司 拼接显示屏、彩膜组件、显示背板、面板及其制作方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107579168B (zh) * 2017-08-31 2023-11-03 京东方科技集团股份有限公司 一种彩膜基板及其制备方法、显示面板以及封装方法
CN110794620B (zh) * 2018-08-01 2021-08-03 深圳Tcl新技术有限公司 一种液晶面板及其制作方法、应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729031A (en) * 1980-07-28 1982-02-16 Nissan Motor Co Ltd Liquid crystal display panel
KR20040062757A (ko) * 2003-01-03 2004-07-09 삼성전자주식회사 액정 표시 장치의 제조 방법
US20040218135A1 (en) * 2003-05-01 2004-11-04 Yu-Chi Lee Liquid crystal panel with isolation wall structure and its producing method
JP2007047240A (ja) * 2005-08-08 2007-02-22 Sanyo Epson Imaging Devices Corp 仮止め材及びそれを用いた液晶表示装置の製造方法
CN201110932Y (zh) * 2007-10-19 2008-09-03 群康科技(深圳)有限公司 液晶面板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004029410A (ja) * 2002-06-26 2004-01-29 Advanced Display Inc 液晶表示装置の製法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729031A (en) * 1980-07-28 1982-02-16 Nissan Motor Co Ltd Liquid crystal display panel
KR20040062757A (ko) * 2003-01-03 2004-07-09 삼성전자주식회사 액정 표시 장치의 제조 방법
US20040218135A1 (en) * 2003-05-01 2004-11-04 Yu-Chi Lee Liquid crystal panel with isolation wall structure and its producing method
JP2007047240A (ja) * 2005-08-08 2007-02-22 Sanyo Epson Imaging Devices Corp 仮止め材及びそれを用いた液晶表示装置の製造方法
CN201110932Y (zh) * 2007-10-19 2008-09-03 群康科技(深圳)有限公司 液晶面板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114038838A (zh) * 2021-05-07 2022-02-11 重庆康佳光电技术研究院有限公司 拼接显示屏、彩膜组件、显示背板、面板及其制作方法

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