WO2016041253A1

WO2016041253A1 - Oled device encapsulation structure and manufacturing method therefor

Info

Publication number: WO2016041253A1
Application number: PCT/CN2014/092540
Authority: WO
Inventors: 徐德智
Original assignee: 京东方科技集团股份有限公司; 合肥京东方光电科技有限公司
Priority date: 2014-09-17
Filing date: 2014-11-28
Publication date: 2016-03-24
Also published as: CN104300091B; CN104300091A

Abstract

An OLED device encapsulation structure and manufacturing method therefor. The OLED device encapsulation structure comprises an upper substrate (11) and a lower substrate (12), wherein an OLED working layer (13) is arranged between the upper substrate (11) and the lower substrate (12), the surface of the OLED working surface (13) is provided with an encapsulation layer (14), and the encapsulation layer (14) respectively fits the inner surfaces of the upper substrate (11) and lower substrate (12). The outer surfaces of the upper substrate (11) and lower substrate (12) are respectively provided with a water and oxygen blocking layer (15).

Description

OLED device package structure and manufacturing method thereof

Technical field

Embodiments of the present invention relate to an OLED device package structure and a method of fabricating the same.

Background technique

Compared with an LCD display device, an OLED display device using an organic light-emitting diode (OLED) has a thin, light, wide viewing angle, active illumination, continuously adjustable color, low cost, fast response, and energy consumption. Small, low driving voltage, wide operating temperature range, simple production process, high luminous efficiency, etc. Since the OLED display device has advantages that other displays are incomparable, and has a good application prospect, it has received great attention from the industry and the scientific community.

The OLED device includes an upper and a lower substrate, an anode, an organic thin film layer, a cathode, an encapsulation layer, and the like. Since the OLED device is to be injected with electrons from the cathode during operation, this requires that the lower the cathode work function, the better. However, the material used to make the cathode is usually a metal such as a metal such as aluminum, magnesium, or calcium. These metals are generally active and easily chemically react with the infiltrated water vapor, thereby causing the OLED device to fail. Therefore, the OLED device must be packaged so that the functional layers of the OLED device are separated from the components of moisture, oxygen, and the like in the atmosphere.

At present, a barrier layer is generally disposed between the encapsulation layer of the OLED device and the substrate to block the infiltration of components such as moisture, oxygen, and the like. Since the barrier layer must be attached to the surface of the encapsulation layer, damage to the OLED working layer is easily caused in the process of fabricating the barrier layer, resulting in failure of the OLED device.

Summary of the invention

According to an embodiment of the present invention, an OLED device package structure is provided. The OLED device package structure includes an upper substrate and a lower substrate, an OLED working layer is disposed between the upper substrate and the lower substrate, and an anodic working layer is disposed on the surface of the OLED working layer, the encapsulating layer and the upper substrate and the lower layer respectively The inner surface of the substrate is bonded, wherein the outer surfaces of the upper substrate and the lower substrate are each provided with a water oxygen barrier layer.

For example, the water-oxygen barrier layer includes a first water-oxygen barrier layer respectively bonded to the upper substrate and the lower substrate, and the first water-oxygen barrier layer is provided with a concave-convex structure, and the concave-convex structure is covered with a first Two Water oxygen barrier layer.

For example, the material of the first water oxygen barrier layer is a polyacrylate material.

For example, the polyacrylate material is a negative polyacrylate organic film material.

For example, the relief structure includes grooves and protrusions having an opening width on the order of microns.

For example, the second water-oxygen barrier layer is a polystyrene particle coating or a hydrophobized silica particle coating.

For example, the size of the particles is on the order of microns or microns.

For example, the upper substrate and the lower substrate are both flexible substrates.

For example, the flexible substrate is made of PET or PBT.

In accordance with an embodiment of the present invention, a method of fabricating an OLED device package structure is provided. The OLED device package structure includes an upper substrate and a lower substrate, an OLED working layer is disposed between the upper substrate and the lower substrate, and an anodic working layer is disposed on the surface of the OLED working layer, the encapsulating layer and the upper substrate and the lower layer respectively The inner surface of the substrate is bonded. The method includes fabricating a water oxygen barrier layer on both outer surfaces of the upper and lower substrates.

For example, fabricating a water oxygen barrier layer on the outer surfaces of the upper substrate and the lower substrate includes the following steps:

Forming the first water-oxygen barrier layer on the outer surfaces of the upper substrate and the lower substrate, respectively, and forming the uneven structure on the first water-oxygen barrier layer;

A second water oxygen barrier layer is covered on the relief structure.

For example, covering the relief structure with the second water-oxygen barrier layer includes the following steps:

A polystyrene emulsion is obtained by an in-situ emulsion polymerization method, and the polystyrene emulsion is coated on the surface of the uneven structure to form a polystyrene particle coating, and the polystyrene particle coating is used as the second Water oxygen barrier layer.

For example, a polystyrene emulsion is obtained by an in-situ emulsion polymerization method, and coating the polystyrene emulsion on the surface of the textured structure to form a polystyrene particle coating includes the following steps:

A mixture of 100 parts of styrene, 6 parts of acrylic acid and 1000 parts of distilled water was placed in a four-necked flask equipped with a reflux condenser, a thermometer, and a stirrer; stirring was carried out at a stirring rate of 300 rpm, and nitrogen gas was passed for 2 minutes during the stirring; a potassium persulfate initiator; then reacting under nitrogen for 30 minutes in a 70 ° C water bath to obtain a polystyrene emulsion; the polystyrene emulsion obtained by the reaction It was coated on the uneven structure, vacuum drying time was 30 seconds, vacuum drying temperature was 50 ° C, and vacuum value was 26 Pa.

Silica particles are plated on the surface of the relief structure by plasma-chemical vapor deposition;

The uneven structure of the silica particles is subjected to a hydrophobic treatment to obtain a coating of silica particles, which is used as the second water-oxygen barrier layer.

For example, the hydrophobic treatment comprises: chemically modifying the silica-coated relief structure in a n-hexane solution of 1.0 wt% silane coupling agent for 1 min.

For example, the silane coupling agent is γ-methacryloxypropyl-trimethoxysilane, vinyltrichlorosilane, γ-glycidylpropyl-trimethoxysilane, or a combination thereof.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below. It is obvious that the drawings in the following description relate only to some embodiments of the present invention, and are not intended to limit the present invention. .

1 is a schematic cross-sectional view showing an OLED device package structure according to an embodiment of the present invention;

Figure 2 is an enlarged view of a portion A of Figure 1;

3 is a top plan view of an OLED device package structure according to an embodiment of the present invention;

4 is a top plan view 2 of an OLED device package structure according to an embodiment of the present invention.

detailed description

The technical solutions of the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings. It is apparent that the described embodiments are part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present invention without departing from the scope of the invention are within the scope of the invention.

In the description of the specification, specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Referring to FIG. 1 , an embodiment of the present invention provides an OLED device package structure, and the package structure The upper substrate 11 and the lower substrate 12 are disposed, and the OLED working layer 13 is disposed between the upper substrate 11 and the lower substrate 12. The surface of the OLED working layer 13 is provided with an encapsulation layer 14, which is respectively disposed inside the upper substrate 11 and the lower substrate 12. The surface is bonded, and the outer surfaces of the upper substrate 11 and the lower substrate 12 are each provided with a water and oxygen barrier layer 15.

The inner surface of the upper substrate 11 is the surface of the upper substrate 11 close to the OLED working layer 13, and the outer surface of the upper substrate 11 is the surface of the upper substrate 11 away from the OLED working layer 13. Similarly, the inner surface of the lower substrate 12 is the surface of the lower substrate 12 near the OLED working layer 13, and the outer surface of the lower substrate 12 is the surface of the lower substrate 12 remote from the OLED working layer 13.

The encapsulation layer 14 is disposed on the surface of the OLED working layer 13 to completely cover the upper surface and the side surface of the OLED working layer 13.

In the OLED device package structure provided by the embodiment of the present invention, since the outer surfaces of the upper substrate 11 and the lower substrate 12 are respectively provided with a water and oxygen barrier layer 15, the water and oxygen barrier layer 15 can block water vapor and oxygen from entering the OLED working layer 13, The OLED working layer plays a protective role. In addition, since the water-oxygen barrier layer is disposed on the outer surfaces of the upper substrate 11 and the lower substrate 12, damage to the encapsulation layer 14 is avoided in the fabrication of the water-oxygen barrier layer 15, thereby preventing the OLED working layer 13 from being damaged and OLEDs from occurring. Device failure condition.

Referring to FIG. 2, for example, the water oxygen barrier layer 15 disposed on the outer surface of the upper substrate 11 may include a first water oxygen barrier layer 21 that is bonded to the outer surface of the upper substrate 11; similarly, the outer surface of the lower substrate 12 is disposed. The water oxygen barrier layer 15 may include a first water oxygen barrier layer 21 that is bonded to the outer surface of the lower substrate 12. Further, the first water-oxygen barrier layer 21 is provided with a concave-convex structure 211, and the first water-oxygen barrier layer 21 having the uneven structure 211 has a good barrier effect against moisture or oxygen.

The uneven structure 211 includes grooves and projections. FIG. 3 and FIG. 4 are schematic top views of an OLED device package structure according to an embodiment of the present invention. As shown in FIG. 3, the groove and the protrusion may be alternately arranged in the first direction and the second direction; or, as shown in FIG. 4, the groove and the protrusion may be alternately arranged only in the first direction or the second direction. . For example, the first direction and the second direction are perpendicular to each other. For example, the cross section of the groove is rectangular or trapezoidal in a direction perpendicular to the package structure. The uneven structure 211 can be obtained by performing a photolithography process on the first water-oxygen barrier layer 21. Of course, the uneven structure can also be obtained by other processes, and the cross section of the groove can be other patterns, such as a circular arc shape. For example, the opening width of the groove is on the order of microns.

For example, the concave-convex structure 211 is covered with a second water-oxygen barrier layer 22 having a water-oxygen barrier function. In order to further improve the water vapor barrier function of the water and oxygen barrier layer 15, the probability of damage to the OLED working layer 13 is reduced, thereby ensuring that the function of the OLED device does not fail.

For example, the material of the first water oxygen barrier layer 21 may be a polyacrylate material, and the polyacrylate material may include a negative polyacrylate organic film material. Polyacrylate materials have good water and vapor barrier properties. In addition, the process steps for preparing the first water-oxygen barrier layer 21 from the negative polyacrylate organic film material are relatively simple compared to other types of polyacrylate materials.

For example, in the above OLED device package structure, the second water-oxygen barrier layer 22 may be a polystyrene particle coating or a hydrophobized silica particle coating, both of which have good water resistance. , anti-steam function, and the production process is relatively simple. For example, the size of the particles is on the order of microns or microns (eg, on the order of nanometers).

For example, the upper substrate 11 and the lower substrate 12 may be of a flexible polymer material. The upper substrate 11 and the lower substrate 12 are fabricated using a flexible polymer material to enable flexible display of the OLED device. Flexible OLED devices are relatively flexible and can be deformed and less susceptible to damage, allowing the OLED device to be mounted on a curved surface and even worn. For example, a flexible substrate can be made of PET or PBT material. However, the material for fabricating the flexible substrate is not limited to the above two materials.

Embodiments of the present invention also provide a method of fabricating the above OLED device package structure. The method includes the steps of fabricating the water-oxygen barrier layer on the outer surfaces of the upper and lower substrates, and the step includes the steps of:

First, a first water-oxygen barrier layer is formed by using a negative polyacrylate organic film material, and the concave-convex structure is obtained on the first water-oxygen barrier layer by a photolithography process or an imprint process;

Second, a polystyrene emulsion is obtained by in-situ emulsion polymerization, and the polystyrene emulsion is coated on the surface of the textured structure to form a polystyrene particle coating; or, by plasma-chemical vapor deposition Method A silica particle is plated on the surface of the textured structure to obtain a coating of silica particles. The polystyrene particle coating or silica particle coating is used as a second water oxygen barrier layer.

For example, a polystyrene emulsion is obtained by an in-situ emulsion polymerization method, and coating the polystyrene emulsion on the surface of the textured structure to form polystyrene particles includes the following steps:

A mixture of 100 parts of styrene, 6 parts of acrylic acid and 1000 parts of distilled water was placed in a four-necked flask equipped with a reflux condenser, a thermometer, and a stirrer; stirring was carried out at a stirring rate of 300 rpm, and nitrogen gas was passed for 2 minutes during the stirring; Part of potassium persulfate initiator; then under nitrogen protection, at The polystyrene emulsion was obtained by reacting in a 70 ° C water bath for 30 minutes; the polystyrene emulsion obtained by the reaction was uniformly covered on the uneven structure by a spin coating method, vacuum drying time was 30 seconds, and vacuum drying temperature was 50 ° C. , the vacuum value is 26Pa;

For example, plating a silica particle on the surface of the textured structure by a plasma-chemical vapor deposition method to obtain a silica particle coating includes the following steps:

Silica particles are plated on the surface of the uneven structure by a plasma-chemical vapor deposition method; the uneven structure coated with the silica particles is subjected to a hydrophobic treatment.

For example, the hydrophobic treatment comprises: chemically modifying the silica-coated relief structure in a n-hexane solution of 1.0 wt% silane coupling agent for 1 min. For example, the silane coupling agent is γ-methacryloxypropyl-trimethoxysilane, vinyltrichlorosilane, γ-glycidylpropyl-trimethoxysilane or a combination thereof.

A specific example according to an embodiment of the present invention will be described in detail below. First, a first water-oxygen barrier layer is formed by using a negative polyacrylate organic film material, and then the first water and oxygen barrier is formed by a photolithography process or an imprint process. The concave-convex structure is obtained on the layer; and the second water-oxygen barrier layer is formed by one of the following two options.

Scheme 1: A mixture of 100 parts of styrene, 6 parts of acrylic acid and 1000 parts of distilled water was placed in a four-necked flask equipped with a reflux condenser, a thermometer, and a stirrer. The mixture was purged with nitrogen for 2 minutes, and 1 part of potassium persulfate was added. The agent is then reacted under a nitrogen atmosphere for 30 minutes in a 70 ° C water bath to maintain a stirring rate of 300 rpm to form a polystyrene emulsion. The polystyrene emulsion is uniformly coated on the uneven structure by spin coating at a rotation speed of 1000 rpm. The vacuum drying temperature was 50 ° C, the vacuum value was 26 Pa, and the vacuum drying time was 30 seconds. The hydrophobic property of the surface of the polystyrene particles is greatly enhanced, so that the waterproofing ability of the flexible substrate is greatly enhanced.

It should be noted that polystyrene particles may be directly formed on the uneven structure 211. That is, the in-situ emulsion polymerization method is carried out on the uneven structure 211 to form a polystyrene emulsion, thereby directly forming polystyrene particles on the surface of the uneven structure 211. In this way, the step of spin coating can be reduced.

Scheme 2: The silica particles are plated on the relief structure by plasma-chemical vapor deposition. The typical parameters of plasma-chemical vapor deposition are as follows: using equipment prepared by AKT, using silane (SiH4) and laughing gas ( N2O) is reacted in a plasma state at a process temperature of 350 °C. The reaction equation is: SiH4 (gaseous) + 2N2O (gaseous) → SiO2 (solid state) + 2N2 (gaseous) +H2 (gaseous), after which the silica-attached textured structure is placed at 1.0 wt% of a silane coupling agent (for example, γ-methacryloxypropyl-trimethoxysilane, vinyltrichlorosilane) Chemical modification of n-hexane solution of γ-glycidylpropyl-trimethoxysilane for 1 minute. The resulting silica coating has a superhydrophobic interface.

The above is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. The scope of the present invention is defined by the appended claims.

The present application claims priority to Chinese Patent Application No. 20141047552, filed on Sep. 17, 2014, the entire disclosure of which is hereby incorporated by reference.

Claims

An OLED device package structure includes an upper substrate and a lower substrate, an OLED working layer is disposed between the upper substrate and the lower substrate, and an encapsulation layer is disposed on a surface of the OLED working layer, and the encapsulation layer and the upper substrate are respectively And bonding to the inner surface of the lower substrate, wherein the outer surfaces of the upper substrate and the lower substrate are each provided with a water oxygen barrier layer.
The OLED device package structure according to claim 1, wherein the water-oxygen barrier layer comprises a first water-oxygen barrier layer respectively bonded to the upper substrate and the lower substrate, wherein the first water-oxygen barrier layer is provided The concave-convex structure is covered with a second water-oxygen barrier layer.
The OLED device package structure according to claim 2, wherein the first water-oxygen barrier layer is made of a polyacrylate material.
The OLED device package structure according to claim 3, wherein the polyacrylate material is a negative polyacrylate-based organic film material.
The OLED device package structure according to claim 2, wherein the relief structure comprises a groove and a protrusion, the groove having an opening width on the order of micrometers.
The OLED device package structure according to any one of claims 2 to 4, wherein the second water-oxygen barrier layer is a polystyrene particle coating or a hydrophobized silica particle coating.
The OLED device package structure according to claim 6, wherein the size of the particles is on the order of micrometers or less.
The OLED device package structure according to any one of claims 1 to 7, wherein the upper substrate and the lower substrate are both flexible substrates.
The OLED device package structure according to claim 8, wherein the flexible substrate is made of PET or PBT.
A method for fabricating an OLED device package structure, the OLED device package structure includes an upper substrate and a lower substrate, an OLED working layer is disposed between the upper substrate and the lower substrate, and an anodic encapsulation layer is disposed on the surface of the OLED working layer, The encapsulation layer is respectively adhered to the inner surfaces of the upper substrate and the lower substrate,

Wherein the method includes fabricating a water oxygen barrier layer on both outer surfaces of the upper substrate and the lower substrate.
The method of fabricating an OLED device package structure according to claim 10, wherein the water-oxygen barrier layer is formed on both outer surfaces of the upper substrate and the lower substrate, comprising the steps of:

Forming the first water-oxygen barrier layer on the outer surfaces of the upper substrate and the lower substrate, respectively, and forming the uneven structure on the first water-oxygen barrier layer;

A second water oxygen barrier layer is covered on the relief structure.
The method of fabricating an OLED device package structure according to claim 11, wherein the material of the first water-oxygen barrier layer is a polyacrylate-based material.
The method of fabricating an OLED device package structure according to claim 12, wherein the polyacrylate material is a negative polyacrylate-based organic film material.
The method of fabricating an OLED device package structure according to claim 11, wherein the covering the second water-oxygen barrier layer on the relief structure comprises the steps of:

A polystyrene emulsion is obtained by an in-situ emulsion polymerization method, and the polystyrene emulsion is coated on the surface of the uneven structure to form a polystyrene particle coating, and the polystyrene particle coating is used as the second Water oxygen barrier layer.
The method of fabricating an OLED device package structure according to claim 14, wherein a polystyrene emulsion is obtained by an in-situ emulsion polymerization method, and the polystyrene emulsion is coated on the surface of the uneven structure to form polystyrene particles. The coating includes the following steps:

A mixture of 100 parts of styrene, 6 parts of acrylic acid and 1000 parts of distilled water was placed in a four-necked flask equipped with a reflux condenser, a thermometer, and a stirrer; stirring was carried out at a stirring rate of 300 rpm, and nitrogen gas was passed for 2 minutes during the stirring; Part of potassium persulfate initiator; then reacted under nitrogen for 30 minutes in a water bath at 70 ° C to obtain a polystyrene emulsion; the polystyrene emulsion obtained by the reaction is coated on the concave-convex structure, vacuum drying time 30 Seconds, the vacuum drying temperature was 50 ° C and the vacuum value was 26 Pa.
The method of fabricating an OLED device package structure according to claim 11, wherein the covering the second water-oxygen barrier layer on the relief structure comprises the steps of:

Silica particles are plated on the surface of the relief structure by plasma-chemical vapor deposition;

The uneven structure of the silica particles is subjected to a hydrophobic treatment to obtain a coating of silica particles, which is used as the second water-oxygen barrier layer.
The method of fabricating an OLED device package structure according to claim 16, wherein the hydrophobic treatment comprises: chemically modifying the silica-coated textured structure in a n-hexane solution of 1.0 wt% of a silane coupling agent for 1 min.
The method of fabricating an OLED device package structure according to claim 17, wherein the silane coupling agent is γ-methacryloxypropyl-trimethoxysilane, vinyltrichlorosilane, γ-glycidylpropyl group- Trimethoxysilane or a combination thereof.