CN105140417A - Organic light-emitting diode device, fabrication method and display device - Google Patents

Organic light-emitting diode device, fabrication method and display device Download PDF

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Publication number
CN105140417A
CN105140417A CN201510516240.1A CN201510516240A CN105140417A CN 105140417 A CN105140417 A CN 105140417A CN 201510516240 A CN201510516240 A CN 201510516240A CN 105140417 A CN105140417 A CN 105140417A
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China
Prior art keywords
layer
emitting diode
organic light
light emitting
concaveconvex structure
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CN201510516240.1A
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Chinese (zh)
Inventor
李�瑞
徐德智
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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Priority to CN201510516240.1A priority Critical patent/CN105140417A/en
Publication of CN105140417A publication Critical patent/CN105140417A/en
Priority to US15/322,328 priority patent/US10181578B2/en
Priority to PCT/CN2015/097123 priority patent/WO2017028412A1/en
Priority to EP15894512.1A priority patent/EP3340330B1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention relates to an organic light-emitting diode device, a fabrication method and a display device, so as to improve the waterproof oxidation performance of the organic light-emitting diode device (OLED) device. An organic light-emitting diode display device comprises a first substrate, the organic light-emitting diode device, at least one packaging layer, a bonding layer and a second substrate, wherein the organic light-emitting diode device is arranged on the first substrate; the at least one packaging layer is arranged on the organic light-emitting diode device; the bonding layer is arranged on the at least one packaging layer; the second substrate is arranged on the bonding layer; and a concave-convex structure is formed in at least one side surface of the packaging layer. According to the technical scheme provided by the invention, compared with the prior art, the damages to the OLED device caused by water vapor and oxygen in air can be reduced; and the waterproof oxidation performance of the OLED device is improved.

Description

A kind of organic light emitting diode device and manufacture method and display unit
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of organic light emitting diode device and manufacture method and display unit.
Background technology
OLED (OrganicLight-EmittingDiode, Organic Light Emitting Diode, be called for short OLED) display screen due to have thin, light, wide viewing angle, active illuminating, glow color continuously adjustabe, cost are low, fast response time, energy consumption are little, driving voltage is low, operating temperature range is wide, production technology is simple, luminous efficiency is high and can the advantage such as Flexible Displays, for having the Display Technique of future generation of development prospect.
Research shows, the compositions such as the steam in air and oxygen are very large to the aging effects of OLED in OLED display screen, this is because: need during OLED work to inject electronics from negative electrode, this just requires that cathode work function number is more low better, but negative electrode adopts the metal materials such as aluminium, magnesium, calcium usually, chemical property ripple relatively more alive, the steam of very easily coming in infiltration and oxygen react.In addition, steam and oxygen also can with the hole transmission layer of OLED and electron transfer layer generation chemical reaction, these reactions all can cause the inefficacy of OLED.Therefore OLED is effectively encapsulated, the composition such as steam, oxygen in each functional layer of OLED and air is fully separated, just greatly can extend the life-span of OLED, thus extend the useful life of OLED display screen.
How improving OLED water oxygen resistant performance is technical problem urgently to be resolved hurrily at present.
Summary of the invention
The present invention seeks to propose a kind of organic light emitting diode device and manufacture method and display unit, to reduce the steam of air and oxygen to the infringement of OLED, improve OLED water oxygen resistant performance.
Embodiments provide a kind of organic light emitting diode device and manufacture method and display unit, wherein organic light emitting diode device comprises: first substrate, be arranged on the Organic Light Emitting Diode on described first substrate, be arranged at least one deck encapsulated layer on described Organic Light Emitting Diode, adhesive linkage described in being arranged at least on one deck encapsulated layer, and the second substrate above described adhesive linkage, at least one side surface of described at least one deck encapsulated layer has concaveconvex structure.
Have concaveconvex structure in the surface design of encapsulated layer, the concaveconvex structure on inorganic layer surface increases the surface area of inorganic layer, and then improves the performance of water oxygen resistant; The concaveconvex structure of organic surface increases the contact area of organic layer and inorganic layer, improves bond effect, because organic layer self has water absorption, also improves the water resistance of organic layer simultaneously.Therefore, compared to existing technology, this programme to reduce the steam of air and oxygen to the infringement of OLED, can improve OLED water oxygen resistant performance.
Preferably, described Organic Light Emitting Diode comprises at least two-layer encapsulated layer, and described at least two-layer encapsulated layer comprises the organic layer and inorganic layer that are crisscross arranged.
Organic layer and inorganic layer staggered designs, take full advantage of the premium properties of the water oxygen resistant of inorganic layer, and organic layer wherein has water absorption, and can play good bonding effect between OLED and inorganic layer.
Preferably, described organic light emitting diode device comprises two-layer encapsulated layer, described two-layer encapsulated layer comprises the organic layer be positioned on Organic Light Emitting Diode and the inorganic layer be positioned on described organic layer, the upper surface of described organic layer has concaveconvex structure, upper surface and the lower surface of described inorganic layer all have concaveconvex structure, and the concaveconvex structure of the concaveconvex structure of described organic layer upper surface and described inorganic layer lower surface is coupled.
The design that one deck organic layer adds one deck inorganic layer can reach good waterproof effect, and multiple-layer stacked can meet the medium-term and long-term use of the severe wet environment situation higher to waterproof requirement, but multiple-layer stacked has transmitance loss.It is because organic layer does not need etching technics that organic layer and Organic Light Emitting Diode directly contact, and does not damage the risk of light-emitting diode in manufacturing process.
Preferably, described organic layer thickness is 1 ~ 2 micron, and described inorganic layer thickness is 0.1 ~ 1 micron.
Cross thin inorganic layer in the process of etching concaveconvex structure, have the risk etching and wear, blocked up inorganic layer can waste material, and the thickness of inorganic layer needs to adjust according to product requirement in concrete product design process.
Preferably, described organic layer comprises polyacrylate organic layer.
Optionally, described inorganic layer comprises silicon nitride inorganic layer or silicon oxynitride inorganic layer.
Preferably, described adhesive linkage is thermosets adhesive linkage, and optionally, described thermosets adhesive linkage comprises thermosetting phenolic resin adhesive linkage or UV solidifies glue adhesive linkage.
Wherein, the preferred negativity Polyacrylate materials of polyacrylate organic layer.Thermosetting phenolic resin material produces chemical reaction and hardened forming gradually by adding thermal response, is again heated and does not also soften; UV solidifies glue can absorb uv energy under UV-irradiation, produces living radical or cation, makes adhesive linkage generation series of chemical and finally solidify.
Optionally, described first substrate and/or second substrate are flexible base, board, and optionally, described flexible base, board comprises polybutylene terephthalate (PBT) substrate or PET substrate.
Substrate can be flexible base, board, is applied to flexible display apparatus.The material of flexible base, board is not limit, such as, can comprise at least one in polyimides, Merlon, polyacrylate, Polyetherimide, polyether sulfone, PETG and PEN.In addition, substrate also can be common hard substrate, such as glass substrate, resin substrate etc.
Optionally, described concaveconvex structure comprises square concave-convex structure, waveform concaveconvex structure or zigzag concaveconvex structure.
Concaveconvex structure can increase the contact area between encapsulated layer, between encapsulated layer and adhesive linkage, plays the effect improving water oxygen resistant performance, strengthen adhesive effect.
The embodiment of the present invention additionally provides a kind of manufacture method of organic light emitting diode device, comprising:
OLED is formed on first substrate;
On Organic Light Emitting Diode, form at least one deck encapsulated layer, at least one side surface of described encapsulated layer has concaveconvex structure;
Adhesive linkage is formed on described at least one deck encapsulated layer;
Described second substrate is bonding with described adhesive linkage.
In the technical scheme of the method embodiment, have concaveconvex structure in the surface design of encapsulated layer, the concaveconvex structure on inorganic layer surface increases the surface area of inorganic layer, and then improves the performance of water oxygen resistant; The concaveconvex structure of organic surface increases the contact area of organic layer and inorganic layer, improves bond effect, because organic layer self has water absorption, also improves the water resistance of organic layer simultaneously.Therefore, compared to existing technology, this programme to reduce the steam of air and oxygen to the infringement of OLED, can improve OLED water oxygen resistant performance.
Preferably, describedly on Organic Light Emitting Diode, form at least one deck encapsulated layer, comprising:
Form the concaveconvex structure of the upper surface of described encapsulated layer.
Preferably, the concaveconvex structure of the upper surface of the described encapsulated layer of described formation, specifically comprises:
Organic layer is formed on Organic Light Emitting Diode;
The concaveconvex structure of the upper surface of described organic layer is formed by exposure imaging technique;
Inorganic layer is formed at described organic surface;
The concaveconvex structure of the upper surface of described inorganic layer is formed by etching technics.
Organic layer and inorganic layer staggered designs, take full advantage of the premium properties of the water oxygen resistant of inorganic layer, and organic layer wherein has water absorption, and can play good bonding effect between OLED and inorganic layer.
The embodiment of the present invention additionally provides a kind of display unit, comprises the organic light emitting diode device described in aforementioned arbitrary technical scheme.Because organic light emitting diode device water oxygen resistant performance is improved, this display unit has preferably product quality.
Accompanying drawing explanation
Fig. 1 is organic light emitting diode device schematic diagram in the embodiment of the present invention;
Fig. 2 is embodiment of the present invention organic light emitting diode device manufacture method schematic flow sheet;
Fig. 3 is the encapsulated layer concaveconvex structure manufacture method schematic flow sheet of organic light emitting diode device in the embodiment of the present invention.
Reference numeral:
1-first substrate;
2-Organic Light Emitting Diode;
3-organic layer;
4-inorganic layer;
5-adhesive linkage;
6-second substrate.
Embodiment
In order to improve OLED water oxygen resistant performance, embodiments provide a kind of organic light emitting diode device and manufacture method and display unit.In the technical scheme of the embodiment of the present invention, have concaveconvex structure in the surface design of encapsulated layer, the concaveconvex structure on inorganic layer surface increases the surface area of inorganic layer, and then improves the performance of water oxygen resistant; The concaveconvex structure of organic surface increases the contact area of organic layer and inorganic layer, improves bond effect, because organic layer self has water absorption, also improves the water resistance of organic layer simultaneously.Therefore, compared to existing technology, this programme to reduce the steam of air and oxygen to the infringement of OLED, can improve OLED water oxygen resistant performance.
For making the object, technical solutions and advantages of the present invention clearly, by the following examples the present invention is described in further detail.
As shown in Figure 1, embodiments provide a kind of organic light emitting diode device, comprise: first substrate 1, Organic Light Emitting Diode 2 is on first substrate 1 set, be arranged on the encapsulated layer on Organic Light Emitting Diode 2, be arranged on the adhesive linkage 5 on encapsulated layer, and the second substrate 6 above adhesive linkage 5, at least one side surface of encapsulated layer has concaveconvex structure.
As shown in Figure 1, in the technical scheme of the embodiment of the present invention, encapsulated layer comprises organic layer 3 and inorganic layer 4 is two-layer.But in actual applications, can only comprise organic layer or inorganic layer by encapsulated layer, also can be the multilayer of organic layer and inorganic layer staggered designs.Organic layer and inorganic layer staggered designs, take full advantage of the premium properties of the water oxygen resistant of inorganic layer, and organic layer wherein has water absorption, and can play good bonding effect between OLED and inorganic layer.
As shown in Figure 1, the encapsulated layer of organic light emitting diode device comprises the organic layer 3 be positioned on Organic Light Emitting Diode and the inorganic layer 4 be positioned on organic layer 3, the upper surface of organic layer 3 has concaveconvex structure, upper surface and the lower surface of inorganic layer 4 all have concaveconvex structure, and the concaveconvex structure of the concaveconvex structure of described organic layer upper surface and described inorganic layer lower surface is coupled.Because inorganic layer is formed directly on organic layer, so inorganic layer lower surface can form the concaveconvex structure be coupled with organic layer upper surface.
The design that one deck organic layer adds one deck inorganic layer can reach good waterproof effect, and multiple-layer stacked can meet the medium-term and long-term use of the severe wet environment situation higher to waterproof requirement, but multiple-layer stacked has transmitance loss.It is because organic layer does not need etching technics that organic layer and Organic Light Emitting Diode directly contact, and does not damage the risk of light-emitting diode in manufacturing process.
In the technical scheme of the embodiment of the present invention, organic layer thickness is 1 ~ 2 micron, and inorganic layer thickness is 0.1 ~ 1 micron.
Cross thin organic layer or inorganic layer in the process of etching concaveconvex structure, have the risk etching and wear, blocked up organic layer or inorganic layer can waste material, and the thickness of organic layer or inorganic layer needs to adjust according to product requirement in concrete product design process.
In the technical scheme of the embodiment of the present invention, organic layer material adopts polyacrylate, wherein, and preferred negativity polyacrylate.
In the technical scheme of the embodiment of the present invention, inorganic layer can adopt silicon nitride or silicon oxynitride material.
In the technical scheme of the embodiment of the present invention, adhesive linkage adopts thermosets adhesive linkage, and thermosets adhesive linkage comprises thermosetting phenolic resin adhesive linkage or UV solidifies glue adhesive linkage.
Thermosetting phenolic resin material produces chemical reaction and hardened forming gradually by adding thermal response, is again heated and does not also soften; UV solidifies glue can absorb uv energy under UV-irradiation, produces living radical or cation, makes adhesive linkage generation series of chemical and finally solidify.
First substrate and/or second substrate can be flexible base, board, are applied to flexible display apparatus.The material of flexible base, board is not limit, such as, can comprise at least one in polyimides, Merlon, polyacrylate, Polyetherimide, polyether sulfone, PETG and PEN.In embodiments of the present invention, preferably polybutylene terephthalate (PBT) substrate or PET substrate is adopted.In addition, first substrate and second substrate also can be common hard substrate, such as glass substrate, resin substrate etc.If first substrate can be flexible base, board, second substrate is hard substrate, or first substrate is hard substrate, and second substrate is flexible base, board, or first substrate and second substrate are flexible base, board or hard substrate etc., and the embodiment of the present invention does not limit.
As shown in Figure 1, the concaveconvex structure on encapsulated layer is square concave-convex structure, but actual conditions are not limited thereto, and concaveconvex structure also can be other shape and structures such as waveform concaveconvex structure or zigzag concaveconvex structure.Concaveconvex structure can increase the contact area between encapsulated layer, between encapsulated layer and adhesive linkage, plays the effect improving water oxygen resistant performance, strengthen adhesive effect.
The embodiment of the present invention additionally provides a kind of manufacture method of organic light emitting diode device, as shown in Figure 2, comprises the following steps:
Step S101, on first substrate, be formed with OLED;
Step S102, on Organic Light Emitting Diode, form at least one deck encapsulated layer, at least one side surface of encapsulated layer has concaveconvex structure;
Step S103, at least one deck encapsulated layer, form adhesive linkage;
Step S104, second substrate is bonding with adhesive linkage.
In the technical scheme of the embodiment of the present invention, make organic light emitting diode device as shown in Figure 1, need on Organic Light Emitting Diode, apply organic film and form organic layer, and concaveconvex structure is formed on organic layer, one deck inorganic matter is deposited at organic surface again by plasma enhanced chemical vapor deposition method, and form concaveconvex structure at the upper surface of inorganic layer, finally on inorganic layer, apply one deck glued membrane, by first substrate and second substrate bonding after glued membrane solidification.
Preferably, on Organic Light Emitting Diode, form at least one deck encapsulated layer, comprising:
Form the concaveconvex structure of the upper surface of encapsulated layer.
In the technical scheme of the embodiment of the present invention, the organic light emitting diode device after coating organic film obtained required concaveconvex structure after entering soft baking, exposure imaging technique; Form concaveconvex structure on inorganic layer surface, need elder generation at inorganic layer surface-coated photoresist and carry out exposure imaging, then being etched the inorganic layer not having photoresist to cover by dry lithography.Certainly, form concaveconvex structure and also can adopt other patterning processes, as laser engraving etc.
Preferably, form the concaveconvex structure of the upper surface of encapsulated layer, as shown in Figure 3, specifically comprise the following steps:
Step S105, on Organic Light Emitting Diode, form organic layer;
Step S106, formed the concaveconvex structure of upper surface of organic layer by exposure imaging technique;
Step S107, organic surface formed inorganic layer;
Step S108, formed the concaveconvex structure of upper surface of inorganic layer by etching technics.
In the technical scheme of the method embodiment, have concaveconvex structure in the surface design of encapsulated layer, the concaveconvex structure on inorganic layer surface increases the surface area of inorganic layer, and then improves the performance of water oxygen resistant; The concaveconvex structure of organic surface increases the contact area of organic layer and inorganic layer, improves bond effect, because organic layer self has water absorption, also improves the water resistance of organic layer simultaneously.Therefore, compared to existing technology, this programme to reduce the steam of air and oxygen to the infringement of OLED, can improve OLED water oxygen resistant performance.
The embodiment of the present invention additionally provides a kind of display unit, comprises the organic light emitting diode device of aforementioned arbitrary technical scheme.Because organic light emitting diode device water oxygen resistant performance is improved, this display unit has preferably product quality.The type of display unit is not limit, and can be common panel display apparatus, also can be flexible display apparatus.The particular type of display unit can be display, Electronic Paper, panel computer, television set, intelligent display label, smart display card, etc.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.

Claims (13)

1. an organic light emitting diode device, it is characterized in that, comprise: first substrate, be arranged on the Organic Light Emitting Diode on described first substrate, be arranged at least one deck encapsulated layer on described Organic Light Emitting Diode, adhesive linkage described in being arranged at least on one deck encapsulated layer, and the second substrate above described adhesive linkage, at least one side surface of described at least one deck encapsulated layer has concaveconvex structure.
2. organic light emitting diode device as claimed in claim 1, it is characterized in that, described organic light emitting diode device comprises at least two-layer encapsulated layer, and described at least two-layer encapsulated layer comprises the organic layer and inorganic layer that are crisscross arranged.
3. organic light emitting diode device as claimed in claim 2, it is characterized in that, described organic light emitting diode device comprises two-layer encapsulated layer, described two-layer encapsulated layer comprises the organic layer be positioned on Organic Light Emitting Diode and the inorganic layer be positioned on described organic layer, the upper surface of described organic layer has concaveconvex structure, upper surface and the lower surface of described inorganic layer all have concaveconvex structure, and the concaveconvex structure of the concaveconvex structure of described organic layer upper surface and described inorganic layer lower surface is coupled.
4. organic light emitting diode device as claimed in claim 2, it is characterized in that, described organic layer thickness is 1 ~ 2 micron, and described inorganic layer thickness is 0.1 ~ 1 micron.
5. organic light emitting diode device as claimed in claim 2, it is characterized in that, described organic layer comprises polyacrylate organic layer.
6. organic light emitting diode device as claimed in claim 2, it is characterized in that, described inorganic layer comprises silicon nitride inorganic layer or silicon oxynitride inorganic layer.
7. organic light emitting diode device as claimed in claim 2, it is characterized in that, described adhesive linkage is thermosets adhesive linkage, and described thermosets adhesive linkage comprises thermosetting phenolic resin adhesive linkage or UV solidifies glue adhesive linkage.
8. organic light emitting diode device as claimed in claim 1, it is characterized in that, described first substrate and/or second substrate are flexible base, board, and described flexible base, board comprises polybutylene terephthalate (PBT) substrate or PET substrate.
9. the organic light emitting diode device as described in any one of claim 1 ~ 8, is characterized in that, described concaveconvex structure comprises square concave-convex structure, waveform concaveconvex structure or zigzag concaveconvex structure.
10. a manufacture method for organic light emitting diode device, is characterized in that, comprising:
OLED is formed on first substrate;
On Organic Light Emitting Diode, form at least one deck encapsulated layer, at least one side surface of described encapsulated layer has concaveconvex structure;
Adhesive linkage is formed on described at least one deck encapsulated layer;
Described second substrate is bonding with described adhesive linkage.
The manufacture method of 11. organic light emitting diode devices as claimed in claim 10, is characterized in that, describedly on Organic Light Emitting Diode, forms at least one deck encapsulated layer, comprising:
Form the concaveconvex structure of the upper surface of described encapsulated layer.
The manufacture method of 12. organic light emitting diode devices as claimed in claim 11, it is characterized in that, the concaveconvex structure of the upper surface of the described encapsulated layer of described formation, specifically comprises:
Organic layer is formed on Organic Light Emitting Diode;
The concaveconvex structure of the upper surface of described organic layer is formed by exposure imaging technique;
Inorganic layer is formed at described organic surface;
The concaveconvex structure of the upper surface of described inorganic layer is formed by etching technics.
13. 1 kinds of display unit, is characterized in that, comprise the organic light emitting diode device as described in any one of claim 1 ~ 9.
CN201510516240.1A 2015-08-20 2015-08-20 Organic light-emitting diode device, fabrication method and display device Pending CN105140417A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201510516240.1A CN105140417A (en) 2015-08-20 2015-08-20 Organic light-emitting diode device, fabrication method and display device
US15/322,328 US10181578B2 (en) 2015-08-20 2015-12-11 Organic light-emitting diode (OLED) device, manufacturing method thereof and display device
PCT/CN2015/097123 WO2017028412A1 (en) 2015-08-20 2015-12-11 Organic light-emitting diode device, manufacturing method, and display apparatus
EP15894512.1A EP3340330B1 (en) 2015-08-20 2015-12-11 Organic light-emitting diode device, manufacturing method, and display apparatus

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Application Number Priority Date Filing Date Title
CN201510516240.1A CN105140417A (en) 2015-08-20 2015-08-20 Organic light-emitting diode device, fabrication method and display device

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US (1) US10181578B2 (en)
EP (1) EP3340330B1 (en)
CN (1) CN105140417A (en)
WO (1) WO2017028412A1 (en)

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CN105762300A (en) * 2016-05-10 2016-07-13 金皓 Organic Light-Emitting Diode (OLED) device
WO2017028412A1 (en) * 2015-08-20 2017-02-23 京东方科技集团股份有限公司 Organic light-emitting diode device, manufacturing method, and display apparatus
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Application publication date: 20151209