JP6463354B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device.

  In recent years, development of light-emitting devices having organic EL (Organic Electroluminescence) elements as light-emitting elements has been progressing. The organic EL element has a configuration in which an organic layer is sandwiched between a first electrode that is a transparent electrode and a second electrode. The transparent conductive material of the transparent electrode has a higher resistance than a metal material such as Al. For this reason, an auxiliary electrode is often formed on the transparent electrode as described in Patent Document 1, for example. In Patent Document 1, the auxiliary electrode is formed using a conductive paint.

  In Patent Document 2, it is described that in a display device using an organic EL element, when unevenness is formed in a region of a substrate in a substrate, light extraction efficiency is improved.

Japanese Utility Model Publication No.5-1198 JP 2004-111354 A

  In a light emitting device using an organic layer, it is important to improve light extraction efficiency. An example of a problem to be solved by the present invention is to improve the light extraction efficiency of the light emitting device.

The invention according to claim 1 is a translucent substrate;
A translucent first electrode formed on the substrate;
An organic layer formed on the first electrode;
A second electrode formed on the organic layer;
Metal wiring in contact with the first electrode;
With
At least a part of the metal wiring is a non-overlapping region that does not overlap with a stacked region that is a region where the organic layer and the first electrode overlap.
In the light emitting device, light is extracted from the stacked region and the non-overlapping region.

  The above-described object and other objects, features, and advantages will become more apparent from the preferred embodiments described below and the accompanying drawings.

It is a top view of the light-emitting device concerning a 1st embodiment. It is a top view of the light-emitting device concerning a 1st embodiment. It is a top view of the light-emitting device concerning a 1st embodiment. It is a top view of the light-emitting device concerning a 1st embodiment. It is AA sectional drawing of FIG. It is the figure which expanded the area | region enclosed with the dotted line (alpha) of FIG. It is sectional drawing which shows the structure of the light-emitting device which concerns on the modification 1 of 1st Embodiment. It is a top view which shows the structure of the light-emitting device which concerns on the modification 2 of 1st Embodiment. It is sectional drawing which shows a part of AA cross section of FIG. It is a top view which shows the structure of the light-emitting device which concerns on 2nd Embodiment. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is EE sectional drawing of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

(First embodiment)
1, 2, 3 and 4 are plan views of the light emitting device 100. FIG. 3 is a view in which the sealing member 180 is removed from FIG. 4, FIG. 2 is a view in which the second electrode 140 is removed from FIG. 3, and FIG. 1 is a view in which the organic layer 130 and the insulating layer 170 are removed from FIG. FIG.

  The light emitting device 100 has a polygonal shape such as a rectangle, for example, and includes a plurality of light emitting elements 102 (shown in FIG. 2), a first terminal 150, and a second terminal 160. The light emitting element 102 is an organic EL element. A light emitting unit 104 is formed by the plurality of light emitting elements 102. The light emitting unit 104 is, for example, a rectangle, and the length of one side is, for example, not less than 45 mm and not more than 105 mm. Moreover, the layout of each structure of the light-emitting device 100 shown below is an example to the last. The light emitting device 100 shown in this figure is used as, for example, a lighting device.

  The first terminal 150 and the second terminal 160 are provided to supply power to the light emitting element 102. Therefore, a connection member (for example, metal wiring) for supplying power to the light emitting device 100 is connected to the first terminal 150 and the second terminal 160. The first terminal 150 extends in a first direction (left-right direction in the drawing), and the second terminal 160 extends in a second direction (for example, up-down direction in the drawing) that intersects the first direction. Yes.

  The light emitting element 102 has a configuration in which a first electrode 120, an organic layer 130, and a second electrode 140 are stacked on a substrate 110. In the example shown in this drawing, the first electrode 120, the organic layer 130, and the second electrode 140 are laminated on the substrate 110 in this order.

  The substrate 110 is a transparent substrate such as a glass substrate or a resin substrate. The substrate 110 may have flexibility. In this case, the thickness of the substrate 110 is, for example, 10 μm or more and 1000 μm or less. Also in this case, the substrate 110 may be formed of either an inorganic material or an organic material. The substrate 110 has a polygonal shape such as a rectangle. When the substrate 110 is square, one side of the substrate 110 is, for example, not less than 50 mm and not more than 120 mm.

  The organic layer 130 has a light emitting layer. The organic layer 130 has, for example, a configuration in which a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. At least one layer of the organic layer 130 is formed by a coating method. The remaining layers of the organic layer 130 are formed by a vapor deposition method. Note that the organic layer 130 may be formed by an inkjet method, a printing method, or a spray method using a coating material.

  The first electrode 120 functions as an anode of the light emitting element 102, and the second electrode 140 functions as a cathode of the light emitting element 102. The first electrode 120 is a transparent electrode having optical transparency. Light emitted from the light emitting element 102 is emitted to the outside through the first electrode 120. The material of the transparent electrode includes, for example, an inorganic material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), or a conductive polymer such as a polythiophene derivative.

  The second electrode 140 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Sn, Zn, and In, or an alloy of a metal selected from the first group. Contains a metal layer.

  More specifically, the first electrode 120 is connected to the first terminal 150 as shown in FIG. The first electrode 120 is continuously formed from the region of the substrate 110 that becomes the light emitting unit 104 to the first terminal 150. In the example shown in this drawing, the substrate 110 is rectangular, and the first terminals 150 are provided along two opposite sides of the substrate 110. The first electrode 120 is formed between the two sides.

  In the example shown in FIG. 1, the first electrode 120 is provided with a plurality of grooves 122. The groove 122 extends between the plurality of light emitting elements 102 and divides the first electrode 120 into each of the plurality of light emitting elements 102. The first electrode 120 included in any light emitting element 102 is also connected to the first terminal 150. Further, as will be described later, a metal wiring 124 is formed in the groove 122. For this reason, even if the groove | channel 122 is formed, the 1st electrode 120 of the some light emitting element 102 is connected mutually, and functions as a common electrode.

  All the grooves 122 in FIG. 1 do not reach any of the first terminals 150. However, at least some of the grooves 122 may extend to one of the first terminals 150.

  Further, as shown in FIG. 3, the second electrodes 140 of the plurality of light emitting elements 102 are connected to each other. In other words, the second electrode 140 is formed as an electrode common to the plurality of light emitting elements 102. Specifically, the second electrode 140 is formed on the organic layer 130 and the insulating layer 170, and is connected to the second terminal 160. In the example shown in this drawing, the second terminal 160 is formed along two sides of the substrate 110 that face each other. The second electrode 140 is formed so as to cover a region between the two second terminals 160.

  In the example illustrated in FIGS. 1 to 4, the first terminal 150 and the second terminal 160 are disposed outside the light emitting unit 104. Specifically, the two first terminals 150 are arranged apart from each other in the second direction, and the two second terminals 160 are arranged apart from each other in the first direction. The light emitting unit 104 is located between the two first terminals 150 and between the two second terminals 160. In this case, the first electrode 120 is supplied with voltage from the two first terminals 150 and the second electrode 140 is supplied with voltage from the two second terminals 160. The distribution of voltage can be suppressed. Thereby, it is possible to suppress the occurrence of luminance distribution in the light emitting unit 104.

  The first terminal 150 has a configuration in which a second layer 154 is stacked on the same layer (first layer 152) as the first electrode 120. The first layer 152 is integrated with the first electrode 120. For this reason, the distance between the 1st terminal 150 and the 1st electrode 120 can be shortened, and resistance value between these can be made small. In addition, the non-light emitting region existing at the edge of the light emitting device 100 can be narrowed.

  The second layer 154 is formed of a material having a lower resistance value than the first electrode 120. The second layer 154 is formed by applying a coating material containing metal particles on the first electrode 120 and then baking it. As a method of applying the second layer 154 on the first electrode 120, for example, an inkjet method is used. Moreover, the metal particles contained in the coating material are, for example, silver particles, and the diameter thereof is about several tens of nanometers. A connection member that supplies a voltage to the first terminal 150 is connected to the second layer 154. Note that the second layer 154 has lower translucency than the first electrode 120.

  The second terminal 160 has a configuration in which a second layer 164 is stacked on the first layer 162. The first layer 162 is formed of the same material as the first electrode 120. However, the first layer 162 is separated from the first electrode 120. The second layer 164 is formed using the same material and the same method as the second layer 154.

  A conductive member such as a lead terminal or a bonding wire is connected to the first terminal 150 and the second terminal 160. The first layer 152 and the second layer 154 of the first terminal 150 both extend along the end of at least one light emitting element 102. For this reason, the 1st terminal 150 becomes long and the restrictions of arrangement | positioning of the electrically-conductive member which supplies electric power to the light-emitting device 100 reduce. Therefore, it becomes easy to attach the conductive member to the first terminal 150. Similarly, the first layer 162 and the second layer 164 of the second terminal 160 both extend along the end portion of at least one light emitting element 102. For this reason, the 2nd terminal 160 becomes long and the restrictions of arrangement | positioning of the electrically-conductive member which supplies electric power to the light-emitting device 100 reduce. Therefore, it becomes easy to attach the conductive member to the second terminal 160.

  Further, since the second layer 154 is provided on the first terminal 150 and the second layer 164 is provided on the second terminal 160, the resistance values of the first terminal 150 and the second terminal 160 can be reduced.

  A metal wiring 124 is in contact with the first electrode 120. In the example shown in this figure, the metal wiring 124 is provided in the groove 122. For this reason, the metal wiring 124 covers the side surface of the first electrode 120 and a region (hereinafter referred to as an edge portion 126) located near the side surface of the upper surface of the first electrode 120. And since the groove | channel 122 has penetrated the 1st electrode 120, the metal wiring 124 is in contact with the area | region located in the bottom of the groove | channel 122 among the board | substrates 110. FIG. The interval between the metal wirings 124, that is, the interval between the grooves 122 is, for example, not less than 0.5 mm and not more than 2 mm, preferably not less than 0.75 mm and not more than 1.25 mm. The metal wiring 124 is formed of a material having a lower resistance value than the first electrode 120. By forming the metal wiring 124, it is possible to suppress a voltage drop from occurring in the plane of the first electrode 120. Thereby, it can suppress that distribution arises in the brightness | luminance of the light-emitting device 100. FIG.

  The metal wiring 124 is formed using the same material and the same method as the second layers 154 and 164, for example. In other words, the metal wiring 124 is formed by firing metal particles and bonding them to each other. For this reason, the unevenness on the surface of the metal wiring 124 becomes larger compared to the case where the metal wiring 124 is formed using a vapor deposition method such as a vapor deposition method and an etching method.

  In the example shown in this figure, the metal wiring 124 extends between the two first terminals 150, but is not directly connected to any of the second layers 154 of the two first terminals 150. However, the metal wiring 124 may be directly connected to at least one second layer 154.

  As shown in FIG. 2, an insulating layer 170 is formed on a region of the first electrode 120 that is not covered with the second layer 154 and on the metal wiring 124. The insulating layer 170 is made of a photosensitive resin such as polyimide. A plurality of openings 172 are provided in the insulating layer 170. The opening 172 extends in parallel with the metal wiring 124. However, the opening 172 does not overlap the metal wiring 124. For this reason, the metal wiring 124 is covered with the insulating layer 170. The organic layer 130 described above is formed at least inside the opening 172. Then, when a voltage or current is applied between the first electrode 120 and the second electrode 140, the organic layer 130 located in the opening 172 emits light. In other words, the light emitting element 102 is formed in each of the openings 172.

  Further, as shown in FIG. 4, the plurality of light emitting elements 102 are sealed with a sealing member 180. The sealing member 180 has a shape in which the entire circumference of the edge 182 of a polygonal metal foil or metal plate (for example, an Al foil or an Al plate) similar to the substrate 110 is pushed down. The edge 182 is fixed to the substrate 110 with an adhesive or an adhesive.

  5 is a cross-sectional view taken along the line AA in FIG. As described above, the second terminal 160 has a configuration in which the second layer 164 is stacked on the first layer 162. An edge 182 of the sealing member 180 is fixed to a part of the second terminal 160 via an insulating adhesive layer 184. The conductive member described above is connected to a portion of the second terminal 160 exposed from the edge 182.

  A groove 122 is formed in the first electrode 120. Since a part of the metal wiring 124 is located in the groove 122, it is in contact with the inner surface of the groove 122 (in other words, the side surface of the first electrode 120). Further, the upper portion of the metal wiring 124 is in contact with an edge portion 126 that is a region adjacent to the groove 122 on the upper surface of the first electrode 120. The groove 122, the metal wiring 124, and the edge 126 of the first electrode 120 are covered with an insulating layer 170.

  6 is an enlarged view of a region surrounded by a dotted line α in FIG. As shown in the drawing, a current flows in a region (hereinafter, referred to as a stacked region 142) overlapping the first electrode 120 in the organic layer 130. Therefore, when viewed from a direction perpendicular to the substrate 110, the stacked region 142 is recognized as a region from which light is extracted (light emitting region).

  A part of the light emitted from the stacked region 142 becomes less than the critical angle for entering the substrate 110 and is reflected at the interface between the first electrode 120 and the substrate 110. Such light often travels outside the stacked region 142 because the angle with respect to the substrate 110 is shallow. On the other hand, at least a part (or all) of the metal wiring 124 does not overlap the stacked region 142. Therefore, a part of the light reflected at the interface between the first electrode 120 and the substrate 110 is further reflected by at least a part (non-overlapping region: for example, the edge portion 126) of the metal wiring 124 that does not overlap with the stacked region 142. Is done. In this reflection, the traveling direction (angle) of light may change. As a result, part of the light reflected at the interface is incident again on the substrate 110 at an angle equal to or greater than the critical angle, is transmitted through the interface between the first electrode 120 and the substrate 110, and is emitted to the outside. For this reason, the light extraction efficiency of the light emitting device 100 is improved.

  Note that a part of the light emitted from the contact region is also reflected at the interface between the substrate 110 and the light emitting device 100 (for example, air), but a part of the reflected light is also reflected by the metal wiring 124. Thereafter, the light is emitted to the outside of the light emitting device 100.

  In the example illustrated in FIG. 6, a part of the reflected light described above is a region located next to the stacked region 142 in the metal wiring 124, specifically, a region in contact with the edge 126 of the metal wiring 124. Reflected and emitted to the outside. When viewed from a direction perpendicular to the substrate 110, the edge 126 (that is, the above-described non-overlapping region) is also recognized as a region from which light is extracted (light emitting region). In other words, the area that the user recognizes as the light emitting area can be expanded.

  Next, a method for manufacturing the light emitting device 100 will be described. First, a material to be the first electrode 120 is formed on the substrate 110 by using, for example, a sputtering method or an evaporation method. Next, the conductive layer is selectively removed using etching (for example, dry etching or wet etching). As a result, the first electrode 120 and the first layers 152 and 162 are formed on the substrate 110. In this step, a groove 122 is also formed in the first electrode 120.

  Next, the metal wiring 124 is formed in the groove 122, the second layer 154 is formed on the first layer 152, and the second layer 164 is further formed on the first layer 162. The metal wiring 124 and the second layers 154 and 164 are formed using a coating method such as an ink jet method.

  Next, an insulating layer is formed on the substrate 110 and the first electrode 120, and the insulating layer is selectively removed using a chemical solution (for example, a developer). Thereby, the insulating layer 170 and the opening 172 are formed. When the insulating layer 170 is formed of an insulating material, the insulating layer 170 and the opening 172 are formed by exposure processing and development processing. In the case where the insulating layer 170 is formed of polyimide, the insulating layer 170 is further subjected to heat treatment. Thereby, imidation of the insulating layer 170 proceeds.

  Next, the organic layer 130 is formed in the opening 172. At least one layer (for example, a hole transport layer) constituting the organic layer 130 may be formed using a coating method such as spray coating, dispenser coating, inkjet, or printing. The remaining layers of the organic layer 130 are formed using, for example, a vapor deposition method, but these layers may also be formed using a coating method.

  Next, the second electrode 140 is formed on the organic layer 130 by using, for example, a vapor deposition method or a sputtering method. Next, the sealing member 180 is fixed to the substrate 110 using the adhesive layer 184.

  As described above, according to the present embodiment, part of the light emitted from the stacked region 142 is less than the critical angle for entering the substrate 110, and is reflected at the interface between the first electrode 120 and the substrate 110. Such light often travels outside the stacked region 142 because the angle with respect to the substrate 110 is shallow. On the other hand, at least a part of the metal wiring 124 does not overlap with the stacked region 142. For this reason, part of the light reflected at the interface between the first electrode 120 and the substrate 110 is further reflected by the metal wiring 124. In this reflection, the traveling direction (angle) of light may change. For this reason, a part of the light reflected at the above-described interface by being reflected by the metal wiring 124 is incident on the interface between the first electrode 120 and the substrate 110 at an angle equal to or greater than the critical angle. And radiated to the outside through the interface between the substrate 110 and the substrate 110. For this reason, the light extraction efficiency of the light emitting device 100 is improved.

  Further, since the metal wiring 124 is formed using metal particles, the surface becomes rough as compared with a case where the metal wiring 124 is formed by a film forming method such as a sputtering method. For this reason, light is irregularly reflected by the metal wiring 124. Accordingly, a component whose incident angle with respect to the substrate 110 is less than the critical angle among the light emitted from the stacked region 142 is also reflected by the side surface of the metal wiring 124, so that at least a part of the incident angle becomes greater than the critical angle. . Therefore, the light extraction efficiency of the light emitting device 100 is improved. In the present embodiment, since the groove 122 penetrates the first electrode 120, a part of the metal wiring 124 is in contact with the substrate 110. For this reason, as shown by a dotted line in FIG. 6, a part of the light less than the critical angle at the interface between the substrate 100 and the outside is reflected by the bottom of the metal wiring 124, and becomes greater than the critical angle. Thereby, the light extraction efficiency of the light emitting device 100 is further improved.

  Further, the side surface of the metal wiring 124 also reflects the above-described reflected light. Since the surface of the side surface of the metal wiring 124 is also rough, the above-described reflected light is irregularly reflected on the side surface of the metal wiring 124. Accordingly, a component of the light whose incident angle with respect to the substrate 110 is less than the critical angle is also reflected by the metal wiring 124, so that at least a part of the incident angle becomes greater than the critical angle. For this reason, the light extraction efficiency of the light emitting device 100 is further improved.

  In the present embodiment, the side surface of the groove 122 may be inclined in a direction in which the width of the groove 122 becomes narrower as it approaches the substrate 110.

(Modification 1)
FIG. 7 is a cross-sectional view illustrating a configuration of a light emitting device 100 according to Modification 1 of the first embodiment, and corresponds to FIG. 6 of the first embodiment. The light emitting device 100 according to the present embodiment has the same configuration as the light emitting device 100 according to the first embodiment, except that the groove 122 does not penetrate the first electrode 120. In this modification, the groove 122 is formed in a process different from the process of forming the first electrode 120 by etching the transparent electrode material, for example. However, depending on the width of the groove 122, it may be formed in the same process as the first electrode 120.

  Also according to this modification, the light extraction efficiency of the light emitting device 100 can be improved. In addition, since the bottom surface of the metal wiring 124 is in contact with the first electrode 120, the adhesion of the metal wiring 124 to the base can be improved when the adhesion between the metal wiring 124 and the substrate 110 is poor.

(Modification 2)
FIG. 8 is a plan view showing the configuration of the light emitting device 100 according to Modification 2 of the first embodiment. FIG. 9 is an enlarged view of a part of the AA cross section of FIG. 8 and 9 correspond to FIGS. 1 and 6 in the first embodiment, respectively. The light emitting device 100 according to this modification has the same configuration as the light emitting device 100 according to the first embodiment, except that the groove 122 is not provided.

  Specifically, the first electrode 120 is a continuous film and does not have the groove 122. A metal wiring 124 is formed in a region covered with the insulating layer 170 on the surface of the first electrode 120 opposite to the substrate 110. A portion of the metal wiring 124 facing the first electrode 120 becomes a non-overlapping region and reflects light. Here, since the light is irregularly reflected, the traveling angle of a part of the light changes, and as a result, the light is radiated out of the substrate 110.

  Also according to this modification, the light extraction efficiency of the light emitting device 100 can be improved.

(Second Embodiment)
FIG. 10 is a plan view showing the configuration of the light emitting device 100 according to the second embodiment. 11 is a sectional view taken along the line CC in FIG. 10, FIG. 12 is a sectional view taken along the line DD in FIG. 10, and FIG. 13 is a sectional view taken along the line EE in FIG. The light emitting device 100 according to the present embodiment has the same configuration as the light emitting device 100 according to the first embodiment, except that the light emitting device 100 is a display device. In the present embodiment, the light emitting device 100 may be a lighting device having color rendering properties.

  Specifically, a plurality of partition walls 190 are formed on the insulating layer 170. The plurality of partition walls 190 extend in the first direction (X direction in FIG. 10), and are spaced apart from each other at equal intervals in a second direction (Y direction in FIG. 10) orthogonal to the first direction. . A plurality of light emitting elements 102 (that is, openings 172) are provided between the plurality of partition walls 190. The plurality of light emitting elements 102 are arranged in the first direction and also in the second direction. In other words, the plurality of light emitting elements 102 are arranged in a matrix.

  The first electrodes 120 extend in the second direction (Y direction in FIG. 10), and a plurality of the first electrodes 120 are arranged apart from each other in the first direction (X direction in FIG. 10). The second electrodes 140 extend in the first direction (X direction in FIG. 10), and a plurality of the second electrodes 140 are arranged apart from each other in the second direction (Y direction in FIG. 10). An opening 172 of the light emitting element 102 and the insulating layer 170 is provided at the intersection of the first electrode 120 and the second electrode 140. For this reason, strictly speaking, in the first electrode 120 and the second electrode 140, only a portion overlapping with the opening 172 functions as an electrode, and the other portion functions as a wiring. However, in the following description, for the sake of convenience, the first electrode 120 and the second electrode 140 are also included including the region functioning as the wiring.

  The insulating layer 170 has a plurality of openings 174 in addition to the plurality of openings 172. The opening 174 is located at one end of each of the plurality of second electrodes 140 in plan view. The openings 174 are arranged along one side of the matrix formed by the openings 172. When viewed in a direction along one side (for example, the Y direction in FIG. 10), the openings 174 are arranged at a predetermined interval in the direction along the first electrode 120. In the opening 174, one end side of the second lead wiring 168 is located. The second lead wiring 168 is connected to the second electrode 140 within the opening 174. Further, the first layer 152 of the first lead wiring 158 is integrated with the first electrode 120.

  A first lead wire 158 is formed between the first terminal 150 and the first electrode 120, and a second lead wire 168 is formed between the second terminal 160 and the second electrode 140. The first lead wiring 158 has the same layer structure as the first terminal 150, and the second lead wiring 168 has the same layer structure as the second terminal 160. In other words, one end of the first lead wiring 158 is the first terminal 150, and one end of the second lead wiring 168 is the second terminal 160.

  The partition wall 190 is located between the adjacent second electrodes 140. The partition wall 190 extends in parallel with the second electrode 140, that is, in the second direction. The partition wall 190 is, for example, a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by exposure and development. The partition wall 190 is formed using, for example, a negative photosensitive resin. The partition wall 190 may be made of a resin other than a polyimide resin, for example, an inorganic material such as an epoxy resin, an acrylic resin, or silicon dioxide.

  The partition wall 190 has a trapezoidal cross-sectional shape (reverse trapezoidal shape). That is, the width of the upper surface of the partition wall 190 is larger than the width of the lower surface of the partition wall 190. For this reason, by forming the partition wall 190 before the second electrode 140, the plurality of second electrodes 140 can be collectively formed by using an evaporation method or a sputtering method.

  As shown in FIGS. 10 and 12, metal wiring 124 is formed on the edge of the first electrode 120. In the present embodiment, the metal wiring 124 has a first portion 124a and a second portion 124b.

  The first portion 124a is in contact with the end portion and the side surface of the upper surface of the first electrode 120, and is formed using a coating material. The first portion 124a has a structure in which metal particles are connected to each other by sintering, and has an uneven surface. The non-overlapping region in the first embodiment is at least a part of the first portion 124a, for example, a portion of the first portion 124a that contacts the edge of the upper surface of the first electrode 120.

  The second portion 124b is connected to the first electrode 120 through the first portion 124a. In other words, the first portion 124 a is formed between the second portion 124 b and the first electrode 120. The second portion 124b is formed by a film forming method such as a sputtering method or a vapor deposition method, and is flatter than the first portion 124a. The second portion 124b is formed of a material different from that of the first portion 124a, for example, a metal such as Al or Cr.

  The second portion 124b is formed after forming the first electrode 120 and before forming the first portion 124a. Specifically, the second portion 124b is formed by forming a conductive film on the substrate 110 and the first electrode 120 by sputtering or the like and patterning the conductive film. For this reason, the angle formed by the upper portion of the side surface of the second portion 124b and the substrate 110 is close to a right angle as compared with the first portion 124a.

  Then, a coating material that becomes the first portion 124a is applied between the first electrode 120 and the second portion 124b. For this reason, it can suppress that the coating material used as the 1st part 124a spreads on the board | substrate 110, and the width | variety of the 1st part 124a becomes wide. In addition, when the width | variety of the 1st part 124a becomes wide, the possibility that the adjacent 1st electrode 120 will short-circuit via the 1st part 124a will come out.

  Further, the portion of the metal wiring 124 facing the adjacent light emitting element 102 is formed by the second portion 124b. The surface of the second portion 124b is smoother than the surface of the first portion 124a. Therefore, even if light leaking from the adjacent light emitting element 102 is reflected by the second portion 124b, irregular reflection is unlikely to occur during this reflection. For this reason, it is unlikely that the reflected light is incident on this interface at a critical angle or more at the interface between the first electrode 120 and the substrate 110. Accordingly, the image displayed by the light emitting device 100 is clearer than the case where the entire metal wiring 124 is formed by only the first portion 124a.

  In the example shown in FIGS. 10 and 12, the metal wiring 124 is provided only along one side of the first electrode 120, but the direction in which the first electrode 120 extends in the first electrode 120. Metal wiring 124 may be provided on each of two parallel sides.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

Claims (6)

A translucent substrate;
A plurality of light emitting elements formed on the substrate;
Metal wiring,
With
The light emitting element is
A translucent first electrode;
An organic layer formed on the first electrode;
A second electrode formed on the organic layer ;
Equipped with a,
The metal wiring is in contact with the first electrode of the first light emitting element ;
At least part of the previous SL metal wires is adapted to the non-overlapping region not overlapping the organic layer and the first electrode and the overlapping area is a stack region,
Light is extracted from the stacked region and the non-overlapping region,
The metal wiring is
A first portion formed using the metal particles;
Surface Ri flat der than the surface of the first portion, a second portion you positioned between the second light emitting element and the first part of the next to the first light emitting element,
With
The light emitting device, wherein the non-overlapping region is at least a part of the first portion. The light-emitting device according to claim 1.
The light emitting device, wherein the non-overlapping region of the metal wiring is in contact with an edge of the upper surface of the first electrode. The light-emitting device according to claim 1 or 2,
The metal wiring includes a light emitting device including metal particles. In the light-emitting device as described in any one of Claims 1-3,
A light emitting device in which a part of the metal wiring is in contact with the substrate. In the light-emitting device as described in any one of Claims 1-4,
The light emitting device, wherein the first part and the second part are formed of different materials. In the light-emitting device as described in any one of Claims 1-5,
The first portion is a light emitting device located between the second portion and a side surface of the first electrode.

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