WO2016034124A1 - 管芯扩展工具及使用该工具扩展晶圆的方法 - Google Patents

管芯扩展工具及使用该工具扩展晶圆的方法 Download PDF

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Publication number
WO2016034124A1
WO2016034124A1 PCT/CN2015/088840 CN2015088840W WO2016034124A1 WO 2016034124 A1 WO2016034124 A1 WO 2016034124A1 CN 2015088840 W CN2015088840 W CN 2015088840W WO 2016034124 A1 WO2016034124 A1 WO 2016034124A1
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WIPO (PCT)
Prior art keywords
foil
extension tool
die extension
die
pressurized fluid
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PCT/CN2015/088840
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English (en)
French (fr)
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斯托克曼·约瑟夫·柏图斯·威廉姆斯
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NXP BV
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NXP BV
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Priority to CN201580046885.1A priority Critical patent/CN107078095B/zh
Priority to MYPI2017700754A priority patent/MY183528A/en
Priority to KR1020177009150A priority patent/KR102428556B1/ko
Publication of WO2016034124A1 publication Critical patent/WO2016034124A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/18—Preparing bulk and homogeneous wafers by shaping

Definitions

  • aspects of various embodiments of the invention relate to the expansion of wafers.
  • Modern components such as integrated circuits (ICs) or discrete transistors, are manufactured on a large scale by fabricating multiple components on a single silicon wafer.
  • the process uses thin silicon wafers, typically 150, 200 or 300 mm in diameter.
  • Various processes are applied to create the desired electronic circuitry on the silicon wafer.
  • the end result is a very dense cluster of thousands of components on a single wafer.
  • each component (often referred to as a "die") must be separated from the cluster on the wafer for packaging or further processing. Since the cluster is very dense, removing one die from the wafer often damages adjacent dies. To reduce the likelihood of damaging adjacent dies, the wafer can be expanded to introduce spacing between the dies.
  • a silicon wafer is placed on a carrier tape or carrier foil, and then the carrier tape or foil is placed onto the carrier to hold the wafer in place.
  • the wafer is then placed in a die extension tool that stretches the carrier tape or foil to introduce a space between the dies.
  • the die extension tool uses a movable anvil to push in the axial direction of the wafer to unwind the carrier tape or foil, introducing a space between the dies.
  • the anvil is typically driven by a large, heavy motor (eg, along the axial direction of the wafer).
  • the die extension tool is typically large and heavy.
  • a die extension tool for expanding a foil of a foil carrier attached to a stent.
  • the die extension tool has an inner body located within a cavity formed by the outer body.
  • the holder of the foil carrier can be located within the outer body and the wafer attached to the foil of the foil carrier can be positioned over the inner body.
  • a pressurized fluid system also located within the cavity of the outer body, is placed such that the pressurized fluid system can axially move the stent about the inner body and expand the foil.
  • a method of expanding a wafer on a foil carrier using a die extension tool involves placing a foil carrier over the body of the die extension tool, wherein the foil carrier includes a foil coupled to the stent; and pressing a fluid to axially move the stent about the body.
  • a die extension tool that extends a foil of a foil carrier attached to a wafer.
  • the die extension tool has an outer body, the outer body forms a cavity, the holder of the foil carrier can be placed in the cavity; and the immortal in the cavity of the outer body, the crystal attached to the foil
  • the circle can be placed over the immovable anvil; and a pneumatic conduit in the cavity of the outer body such that when expanded by the pressurized fluid, the pneumatic conduit moves the bracket axially about the immovable anvil to expand the foil.
  • Figure 1 is a perspective view of a foil carrier with a silicon wafer attached thereto.
  • Shown in Figure 2A is a perspective view of a known die extension tool having an anvil in a receiving position.
  • FIG. 2B is a cross-sectional view of the known die extension tool of FIG. 2A with the anvil in an axially extended position.
  • 3A is a view of a die expansion tool that uses a pressurized fluid system to expand a silicon wafer in accordance with an embodiment of the present invention.
  • Figure 3B is a view of the die extension tool of Figure 3A after the foil carrier is inserted through the opening into the outer body.
  • FIG. 4A is a side cross-sectional view of the die extension tool of FIG. 3B.
  • FIG. 4B is a side cross-sectional view of the die extension tool of FIG. 4A, in accordance with an embodiment of the present invention, wherein the pressurized fluid system has been pressurized.
  • FIG. 5 is a flow chart of a method of expanding a wafer in accordance with an embodiment of the present invention.
  • Figure 1 is a perspective view of a foil carrier 1 to which a silicon wafer 4 is attached.
  • the foil carrier comprises an adhesive tape or foil 2 which is connected to an annular support 3 which is along the outer edge of the foil.
  • the silicon wafer is attached to a foil carrier, which is then scribed to help define a plurality of dies 51 1 - 51 n .
  • the scoring is magnified on a portion of the silicon wafer to better illustrate the plurality of dies.
  • the foil carrier and the attached silicon wafer can then be rotated into the die extension tool.
  • FIG. 2A Shown in Figure 2A is a perspective view of a known die extension tool having an anvil in a receiving position.
  • the die extension tool of FIG. 2A includes an outer body 202 and an inner body 204 in a receiving position in the outer body housing portion 208.
  • an actuator (not shown) and a motor 206 for driving the actuator are also housed within the outer body.
  • the movable anvil such as the inner body
  • the silicon wafer and the foil carrier in FIG. 1 are placed so that the holder of the foil carrier is supported by the outer body, in the center of the foil 2.
  • the wafer 4 is located above the housing.
  • FIG. 2B is a cross-sectional view of the known die extension tool of FIG. 2A with the anvil in an axially extended position.
  • the actuator 210 extends the anvil up to the extension receptacle 208 and axially through the stent 3 of the foil carrier.
  • sufficient space as indicated by dimension 212 in the figure is required on the outer body so that the movable anvil can be expanded.
  • the pressure on the foil 2 increases, thereby causing the foil to be stretched. This stretching causes the individual dies 51 1 - 51 n on the wafer 4 to be pulled radially apart and introduce a space between the dies, which will reduce the damage phase when the dies are removed from the wafer. The probability of being adjacent to the core.
  • a die extender such as the die extender described with reference to Figures 2A and 2B, is typically of a larger size to accommodate the movable anvil when the movable anvil is retracted and to provide a space for the movable anvil to stretch.
  • the die expander is typically heavier due to the motor that drives the actuator that extends the movable anvil. Because each motor must generate enough force to overcome the resistance of the foil, the motor is typically large and heavy. Thus, in addition to the size and weight of the movable anvil, the size and weight of the motor also results in the die extension tool being typically large and heavy.
  • the fabrication and packaging of integrated circuit devices typically requires the use of die extension tools.
  • bottlenecks can occur in the fabrication and packaging of the die.
  • One way to increase the usability of the die extension tool is to increase the number of die extension tools that can be integrated into the manufacturing and packaging process by reducing the weight and space required to integrate additional die expansion tools.
  • the die expansion tool uses a more lightweight and rigid construction that extends the tool's fast and accurate performance while limiting the force of the die extension tool during operation to the machine frame housing the die extension tool. The impact can further alleviate the bottleneck.
  • the die extension tool can be configured to use a pressurized fluid to axially move the stent about the anvil.
  • a pressurized fluid can be used to expand a flat pneumatic conduit to push the support of the foil carrier around the fixed anvil down, thereby stretching the foil and expanding the wafer; instead of using the motor as shown in Figures 2A and 2B
  • An actuator is actuated to extend the anvil from within the outer body. Thereby, the extra space on the outer body is reduced and an internal motor is not required to lift the anvil.
  • both space and weight can be reduced as compared to existing die extension tools, such as those described with reference to Figures 2A and 2B.
  • FIG. 3A is a view of a die expansion tool 300 that uses a pressurized fluid system to expand a silicon wafer in accordance with an embodiment of the present invention.
  • the die extension tool includes an outer body 302 and a fixed anvil 304 (eg, an inner body) that remains stationary within the outer body as the foil is expanded.
  • the outer body has an opening 306 through which the foil carrier can be inserted, the foil carrier can be placed over the anvil.
  • 3B is a view of the die extension tool of FIG. 3A after the foil carrier 1 and the silicon wafer 4 (such as the foil carrier and silicon wafer shown in FIG. 1) are placed in the outer body 302 through the opening 306. .
  • the holder 3 of the foil carrier is supported within the outer body, while the wafer 4 suspended by the foil 2 of the foil carrier is centered over the anvil 304 (shown by dashed lines, not visible).
  • the die extension tool includes an outer body 302 and a fixed anvil 304.
  • the outer body forms a cavity and has a pressurized fluid interface 406 that can be coupled to the pressure line 408.
  • the fixed anvil is secured within the cavity, which may be formed, for example, by a box or cassette (eg, an outer body).
  • the anvil is fixed such that the anvil does not move while the die extension tool is in operation.
  • the anvil does not move because the anvil forms a single "C" shape with the outer body (e.g., forming a "C" shaped piece of metal).
  • the anvil and the outer body formed in a "C" shape are two separate pieces of metal, but both are configured to remain in a fixed position relative to one another as the foil is stretched.
  • a gap in the "C" shape between the top wall of the cavity and the top surface of the anvil is aligned with the opening in the outer body to accommodate the foil carrier.
  • the deflated pneumatic conduit 402 extends continuously through the cavity and is disposed along the top wall of the cavity.
  • the pneumatic conduit is a circular conduit that forms a single bore that is similar in construction to the inner tube and is disposed around the inner wall of the cavity.
  • the foil carrier 1 (such as the foil carrier shown in Figure 1) is positioned below the deflated pneumatic conduit such that the stent 3 of the foil carrier is vertically aligned with the pneumatic conduit and horizontally aligned with the "C" shaped opening.
  • the pneumatic conduit expands, the pneumatic conduit applies pressure upwardly to the upper wall of the cavity, applying pressure to the stent of the foil carrier downwardly, causing the stent to sink axially around the anvil and stretching the foil 2 as described below.
  • the continuous pneumatic conduit may be replaced by other pneumatic systems (eg, a plurality of separate pneumatic conduits, evenly spaced around the inner surface of the outer body) or configuration such that downward pressure may pass uniformly
  • the pressurized fluid system is applied to the holder of the foil carrier, causing a uniform radial expansion of the foil.
  • FIG. 4B is a side cross-sectional view of the die extension tool 300 of FIG. 4A with the pressurized fluid system already pressurized.
  • the pneumatic conduit 402 has been expanded by a pressurized fluid, such as compressed air, which is delivered through a pressure line 408 that is coupled to the pressurized fluid interface 406 and is forced into the pneumatic conduit.
  • a pressurized fluid such as compressed air
  • the catheter pushes the stent radially downwardly about the anvil 304 (as indicated by the downward arrow 410), thereby stretching the foil down the side of the anvil and expanding the wafer (not shown) . Therefore, a gap occurs between the dies.
  • the compressed air is provided by a compressor located outside of the die expansion tool through a pressure line connected to the pressurized fluid interface 406 in the outer body.
  • Module 502 The foil carrier is placed over the body of the die extension tool (eg, a fixed anvil). In one embodiment, the foil carrier is placed within the outer body of the die extension tool such that the wafer adhered to the foil of the foil carrier is positioned over the fixed anvil. Module 504, presses fluid to move the bracket axially about the body. In one embodiment, the pressurized fluid is used to expand the pneumatic conduit housed within the outer body of the die expansion tool, which axially presses the support of the foil carrier during expansion so that the foil is surrounded by the inner body Stretched axially downward.
  • Module 506 removes the expanded die from the die extension tool.
  • the pneumatic conduit is deflated before the expanded wafer is removed.
  • the wafer is reconstituted (the foil to which the wafer is attached is attached to a second annular support similar to the foil carrier), and then before the pneumatic conduit is deflated It is cut from the foil carrier to prevent the expanded foil from retracting to its original size.
  • Expanded wafers are an integral part of integrated circuit device fabrication and packaging, reducing the size and weight of die extension tools used to extend the wafer and improving process.
  • the weight and size of the die expansion tool can be reduced.
  • the reduction in weight and size can exemplarily introduce more die extension tools during the manufacturing and packaging process.
  • the use of pressurized fluid systems will require less modification to the manufacturing and packaging processes, as compressed fluids (such as compressed air) are often required in other parts of the manufacturing and packaging process, so pressurized fluid systems may require no additional equipment. And easy to get.
  • the die fabrication and packaging process can be improved.
  • an embodiment of a computer program product includes a computer usable storage medium for storing a computer readable program that, when executed on a computer, causes the computer to perform the operations described.
  • the computer usable or computer readable storage medium can be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system (or apparatus or device), or a propagation medium.
  • Examples of computer readable storage media include: semiconductor or solid state memory, magnetic tape, removable computer disks, random access memory (RAM), read only memory (ROM), hard disk, and optical disks.
  • Examples of current discs include read-only storage A compact disc (CD-ROM), a compact disc with read/write (CD-R/W), a digital video disc (DVD), and a Blu-ray disc.

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

一种管芯扩展工具（300）以及使用该管芯扩展工具（300）扩展箔载体（1）上的晶圆（4）的方法。管芯扩展工具（300）具有外部主体（302），所述外部主体（302）形成腔体，箔载体（1）的支架（3）置于腔体中；位于外部主体（302）的腔体中的内部主体；附着到箔载体（1）的箔（2）上的晶圆（4）位于内部主体之上；位于外部主体（302）的腔体之内的受压流体系统，该受压流体系统使支架（3）围绕内部主体而轴向地移动并扩展箔（2）。

Description

[根据细则37.2由ISA制定的发明名称]　管芯扩展工具及使用该工具扩展晶圆的方法 技术领域
本发明的各实施方式的方面涉及晶圆的扩展。
背景技术
现代的元件，例如集成电路(IC)或者分立晶体管，是通过在一个硅片上制造多个元件来大规模制造的。其工艺使用薄的硅片，典型的直径为150、200或300mm。应用各种工艺，以在硅片上制造出所需的电子电路。最终结果是，在单个晶圆上制造出非常致密的数千个元件的集群。一旦该元件被制造出来，每个元件(通常称为“管芯”)必须被从晶圆上的集群中分开，以进行封装或进一步工艺。由于集群非常密集，从晶圆上取下一个管芯会经常损伤相邻的管芯。为降低损伤相邻管芯的可能性，晶圆可以被扩展，以在管芯之间引入间隔。
在一种管芯扩展技术中，硅片被置于载带或托箔上，随后载带或托箔被贴装到支架上，将晶圆保持在适当的位置。晶圆随后被置于管芯扩展工具中，其拉伸载带或托箔，以在管芯之间引入间隔。通常地，管芯扩展工具使用可移动砧来沿晶圆的轴向推动，以将载带或托箔展开，在管芯之间引入间隔。典型地，在管芯扩展工具中，砧台通常是由大而重的马达来驱动(如沿晶圆的轴向)。此外，由于砧台移动，当其收回时，在管芯扩展工具内部也需要空间来容纳砧台，在管芯扩展工具上方也需要空间，以使砧台可以扩展。由于马达的尺寸与重量，以及容纳砧台所需的空间，管芯扩展工具通常大而且重。
发明内容
在一种实施方式中，披露了一种用于扩展连接到支架的箔载体的箔的管芯扩展工具。在其实施方式中，管芯扩展工具具有内部主体，位于由外部主体形成的腔体内。箔载体的支架可以位于外部主体之内，附着到箔载体的箔上的晶圆可位于内部主体之上。同样位于外部主体的腔体之内的受压流体系统被放置，从而受压流体系统可以使支架围绕内部主体而轴向地移动，并扩展箔。
在第二实施方式中，披露了一种使用管芯扩展工具来扩展箔载体上的晶圆 的方法。在该实施方式中，该方法涉及：将箔载体置于管芯扩展工具的主体之上，其中箔载体包括耦合到支架的箔；以及压入流体，以将支架围绕主体而轴向地移动。
在第三实施方式中，披露了一种扩展附着晶圆的箔载体的箔的管芯扩展工具。在该实施方式中，管芯扩展工具具有外部主体，外部主体形成腔体，箔载体的支架可以置于腔体中；以及在外部主体的腔体中的不动砧，附着在箔上的晶圆可置于不动砧之上；以及在外部主体的腔体中的气动导管，从而当由受压流体膨胀时，气动导管将支架围绕不动砧而轴向地移动，以扩展箔。
本发明的各实施方式的其他方面和优点将通过以下详细描述结合所附的附图进一步阐明。
附图说明
图1为一种箔载体的立体视图，硅片附着其上。
图2A所示的是一种已知的管芯扩展工具的透视图，其在收容位置具有砧。
图2B是图2A中的已知的管芯扩展工具的剖面视图，其中砧位于轴向扩展的位置。
图3A为一种管芯扩展工具的视图，根据本发明一种实施方式，其使用受压流体系统来扩展硅片。
图3B是图3A中的管芯扩展工具在箔载体被通过该开口插入到外部主体之后的视图。
图4A是图3B中的管芯扩展工具的侧剖视图。
图4B是图4A中的管芯扩展工具的侧剖视图，根据本发明的一种实施方式，其中受压流体系统已经受压。
图5是根据本发明一种实施方式的扩展晶圆的方法的流程图。
在本描述中，相似的标号能够用于标识相似的元件。
具体实施方式
应当理解的是，本发明各实施方式中所提及的并在后附的图形中展示的各元件可以在更广范围内以不同的设置方式进行布置和设计。从而，以下关于各实施方式所描述的以及附图中所表示的本发明的细节，仅表示各实施方式的代表，但并不表示对本发明范围的限制。同时，本发明实施方式的各部分在附图 中有所展示，但除非特别说明，附图并不绘制为限制比例。
本发明可以呈现为其他特定的形式，而并不脱离本发明的实质精神或基本特征。以下所述的各实施方式在任何情况下都应当仅理解为示例性地而非限制性地。因此，本发明的范围应当由后述的权利要求书而不是本实施方式说明来标示。任何在权早要求的意述和等同范围内的变化，都应当认为是包含于本发明的权利要求之内。
本说明书中，对于特征、优点或相似语言的指代并不意味着本发明所可能实现的所有的特征或优点都应当在本发明的单个实施方式中出现。相反，对于特征和优点的指代性语言应当理解为表明至少一个本发明的实施方式中包括了通过本发明某一实施方式所描述了的特定的特征、优点或特性。因此，本说明书中对于特征、优点或类似语言的描述可能但不必然地指向相同的实施方式。
进一步地，所描述的本发明的各特征、优点和特点在一个或多个实施方式中可以以任意合适的方式进行组合。所属技术领域的技术人员可以意识到，通过以下描述，本发明可以实现为不具备某个特定实施方式中的一个或多个特定的特征或优点。在其他例子中，也可以意识到其具有未被各实施方式所描述的其他特征或优点。
在本说明书中，对于“实施方式”或相似表述的指代，意味着与所指的实施方式相关描述的特定的特征、结构或优点是包括在本发明的至少一个实施方式中。因此，本说明书中对于“在一个实施方式中”或类似语言的描述可能但不必然地指向相同的实施方式。
图1为一种箔载体1的立体视图，硅片4附着其上。箔载体包括粘性胶带或箔2，其连接到环形的支架3，支架3沿着箔的外缘。在一种实施方式中，硅片被附着在箔载体上，晶圆随后被刻划，以帮助定义多个管芯511-51n。在图1的实施方式中，所述刻划在部分硅片上被放大显示，以更好地展示该多个管芯。箔载体及所附着的硅片随后可以被旋转到管芯扩展工具中。
图2A所示的是一种已知的管芯扩展工具的透视图，其在收容位置具有砧。图2A中的管芯扩展工具包括外部主体202和在外部主体内收容部208中的收容位置的内部主体204。此外，致动器(图未示)和用于驱动致动器的马达206也收容在外部主体之内。开始时，如图2A所示，可移动砧(如内部主体)被折叠在收容部中，图1中的硅片和箔载体被安置从而箔载体的支架被外部主体支撑，在箔2中央的晶圆4位于收容部之上。
图2B是图2A中的已知的管芯扩展工具的剖面视图，其中砧位于轴向扩展的位置。一旦箔载体如图2A中所描述的那样放置到位，致动器210将砧向上扩展到伸出收容部208，并轴向地穿过箔载体的支架3。为使得致动器可以扩展可移动砧，在外部主体上需要如图中尺寸212所示的足够的空间，从而可移动砧可以扩展。当可移动砧扩展并轴向穿过支架时，在箔2上的压力增大，从而，引起箔被拉伸。该拉伸导致晶圆4上单独的管芯511-51n被径向牵拉分开来，并在管芯之间引入间隔，这将会降低将管芯从晶圆上捡出时损伤相邻管芯的几率。
管芯扩展器，例如参考图2A和图2B所述的管芯扩展器，通常具有较大的尺寸，以在可移动砧收回时收容可移动砧，并提供可移动砧伸展的空间。除了较大的尺寸以外，由于驱动延伸可移动砧的致动器的马达，管芯扩展器通常还较重。因为每个马达必须产生足够的力来克服箔的抗涨强度，所以马达通常大而重。从而，除了可移动砧的尺寸和重量之外，马达的尺寸和重量也导致管芯扩展工具典型地大且重。
集成电路器件的制造和封装通常需要管芯扩展工具的使用。从而，由于可用的管芯扩展工具有限，在管芯的制造和封装中可能出现瓶颈。增加管芯扩展工具的可用性的一种方法是，通过减小集成额外的管芯扩展工具所需要的重量和空间，来增加可以集成到制造和封装工艺中的管芯扩展工具的数量。此外，对管芯扩展工具使用更加轻量级和刚性的构造，通过管芯扩展工具的快速且精确的性能，同时限制管芯扩展工具工作时的力对于容纳该管芯扩展工具的机器框架的影响，可以进一步缓解所述瓶颈。
根据本发明的一种实施方式，管芯扩展工具可以配置为使用受压流体来使支架围绕着砧而轴向地移动。例如，可以用受压流体来膨胀扁平的气动导管，以推动围绕固定砧的箔载体的支架向下，从而拉伸箔并扩展晶圆；而不是如图2A和图2B所示的那样使用马达驱动的致动器来将砧从外部主体内延伸出来。从而，在外部主体上的额外空间得以减小，并且不需要内部的马达来抬升砧。因此，与既有的管芯扩展工具，例如参考图2A和图2B描述的那种相比，空间和重量都可以减小。
图3A是一种管芯扩展工具300的视图，根据本发明的一种实施方式，其使用受压流体系统来扩展硅片。该管芯扩展工具包括外部主体302和固定砧304(比如，内部主体)，在箔被扩展时，固定砧304在外部主体内保持不动。 外部主体具有开口306，通过将箔载体穿过该开口306插入，箔载体可以被置于砧上方。图3B是图3A中的管芯扩展工具在箔载体1和硅片4(如图1中所示的箔载体和硅片)被通过该开口306而在外部主体302内被置位之后的视图。如图3B所示，箔载体的支架3在外部主体内被支撑，而由箔载体的箔2所悬构的晶圆4位于砧304(由虚线显示，不可见)上方的中央。
图4A是图3B中的管芯扩展工具300的侧剖视图。该管芯扩展工具包括外部主体302和固定砧304。外部主体形成腔体，并具有受压流体接口406，接口406可以接到压力管路408。固定砧被固定在腔体内，示例地，腔体可以由盒或膛(例如外部主体)形成。在一种实施方式中，砧的固定意为，在管芯扩展工具运行时，砧不会移动。在图4A的实施方式中，由于砧与外部主体形成一个单一的“C”形体(例如形成“C”形的整片金属)，因而砧不会移动。在另一实施方式中，砧和形成为“C”形的外部主体为两片分开的金属，但二者配置为在箔被拉伸时互相保持在一个固定的位置。位于腔体的顶壁与砧的顶面之间的“C”形中的间隙，与外部主体上的开口相对齐，以容纳箔载体。放气的气动导管402经过空腔连续延伸，沿着空腔顶壁布置。在一种实施方式中，气动导管是圆形导管，其形成一个单独的膛，与内管的结构相似，并围绕腔体的内壁布置。箔载体1(例如图1中所示的箔载体)位于放气的气动导管之下，从而箔载体的支架3垂直地对准气动导管，并水平地对准“C”形的开口。当气动导管膨胀时，气动导管向上对腔体的上壁施加压力，向下对箔载体的支架施加压力，导致支架围绕砧而轴向下沉，并如下所述地拉伸箔2。在其他实施方式中，连续的气动导管可以由其他气动系统(如多个单独的气动导管，均匀地围绕外部主体的内表面间隔分布)或者配置来替代，以使向下的压力可以均匀地通过受压流体系统施加到箔载体的支架上，从而引起箔的均匀的径向扩展。
图4B是图4A中的管芯扩展工具300的侧剖视图，其中受压流体系统已经受压。如图4B所示，气动导管402已经通过受压流体(如压缩空气)得以膨胀，受压流体通过接到受压流体接口406的压力管路408输送，并压入气动导管。当气动导管膨胀时，导管推动支架围绕砧304而径向向下(如向下箭头410所示)，从而将箔沿着砧的侧面向下拉伸，并将晶圆(图未示)扩展。因此，在管芯之间出现间隔。在一种实施方式中，压缩空气是由位于管芯扩展工具之外的压缩机通过连接到外部主体中受压流体接口406的压力管路提供的。
图5是根据本发明一种实施方式的扩展晶圆的方法的流程图。模块502， 将箔载体置于管芯扩展工具的主体(例如固定砧)之上。在一种实施方式中，箔载体置于管芯扩展工具的外部主体之内，以使得粘在箔载体的箔上的晶圆位于固定砧之上。模块504，压入流体，以使支架围绕主体而轴向地移动。在一种实施方式中，使用受压流体来使收容于管芯扩展工具的外部主体内的气动导管得以膨胀，其在膨胀时轴向地下压箔载体的支架，从而箔围绕着内部主体而被轴向地向下拉伸。该拉伸导致晶圆上的各管芯被径向地拉开来，在管芯之间出现间隙。模块506，将扩展的管芯从管芯扩展工具上移除。在一种实施方式中，在被扩展的晶圆被移除之前，气动导管被放气。在一种实施方式中，一旦晶圆已经被扩展，晶圆即被重构(晶圆所粘附的箔被附着到与箔载体相似的第二环形支架上)，随后在气动导管放气之前被从箔载体上割下，以防止扩展的箔回缩到原来的尺寸。
扩展晶圆是集成电路器件制造和封装的组成部分，减小用来扩展晶圆的管芯扩展工具的尺寸和重量，可以改善制程。通过使用固定砧和受压流体系统来替代可动砧、致动器和马达，管芯扩展工具的重量和尺寸可以得以减小。重量和尺寸的减小可以示例地在制造和封装过程中引入更多的管芯扩展工具。此外，使用受压流体系统将不太需要对制造和封装工艺进行改动，因为在制造和封装工艺的其他部分通常已经需要使用压缩流体(如压缩空气)，因此受压流体系统可以无需额外的设备而轻易获得。从而，通过在管芯扩展工具中使用受压流体系统，管芯的制造和封装工艺可以得到改善。
尽管此处的方法的运行以特定的顺序进行显示和表述，每个方法的运行顺序可以调整，以便特定的操作可以以相反的顺序运行，或者特定的操作可以至少部分地与其他操作同时运行。在其他实施方式中，指令或不同运算的子运算可以间歇性地和/或交互地运行。
还应当说明的是，此处描述的方法中的至少部分操作可以由存储在计算机可用存储介质中的用于计算机执行的软件指令来实现。作为一种示例，计算机程序产品的实施方式包括计算机可用存储介质，用于存储计算机可读程序，当在计算机上执行时，导致计算机进行所述的操作。
计算机可用或计算机可读存储介质可以为电子、磁、光、电磁、红外、或者半导体系统(或装置或设备)，或者传播媒质。计算机可读存储介质的例子包括：半导体或固态存储器、磁带、可移动计算机碟盘、随机存取存储器(RAM)、只读存贮器(ROM)、硬磁盘、以及光盘。当前的光盘的示例包括具有只读存 储的压缩盘(CD-ROM)、具有读/写的压缩盘(CD-R/W)、数字视频光盘(DVD)、以及蓝光盘。
在以上描述中，提供了不同实施方式的特定的详情。然而，部分实施方式可以少于这些全部的详情而实现。在其他情况下，为简明和清楚起见，特定的方法、流程、元件、结构和/或功能以不多于可实现本发明各实施方式的细节进行描述。
尽管已经描述和显示了本发明的特定实施方式，本发明并不限于所描述和展示的该特定的形式或部件安排。本发明的范围由所附的权利要求书及其等同所定义。

Claims (20)

  1. 一种管芯扩展工具，用于扩展箔载体的箔，晶圆附于箔载体上，其特征在于，所述管芯扩展工具包括：
    外部主体，所述外部主体形成腔体，箔载体的支架能够置于腔体中；
    在外部主体的腔体中的内部主体，附于箔上的晶圆可置于内部主体之上；以及
    受压流体系统，位于外部主体的腔体内，并配置为围绕内部主体轴向地移动支架，以扩展所述箔。
  2. 如权利要求1所述的管芯扩展工具，其特征在于：所述受压流体系统配置为向支架施加分配的径向压力。
  3. 如权利要求1所述的管芯扩展工具，其特征在于：所述受压流体系统包括气动导管，其在受压时将支架围绕内部主体而轴向地移动。
  4. 如权利要求3所述的管芯扩展工具，其特征在于：所述气动导管为圆形导管，其形成单一的膛。
  5. 如权利要求1所述的管芯扩展工具，其特征在于：所述外部主体与所述内部主体形成为单一主体。
  6. 如权利要求1所述的管芯扩展工具，其特征在于：所述内部主体相对外部主体配置，从而当箔被扩展时，内部主体在外部主体的腔体中保持固定。
  7. 如权利要求1所述的管芯扩展工具，其特征在于：所述外部主体进一步包括受压流体接口，受压流体通过该受压流体接口被提供给受压流体系统。
  8. 如权利要求7所述的管芯扩展工具，其特征在于：所述受压流体在所述管芯扩展工具之外被加压，并通过所述受压流体接口提供。
  9. 一种使用管芯扩展工具来扩展箔载体上的晶圆的方法，其特征在于，所述方法包括：
    将箔载体置于管芯扩展工具的主体之上，其中所述箔载体包括耦合到支架的箔；以及
    压入流体，以使支架围绕主体轴向地移动。
  10. 如权利要求9所述的方法，其特征在于：流体被加压，以将支架围绕主体从较上的位置移动到较下的位置。
  11. 如权利要求9所述的方法，其特征在于，所述压入流体以使支架围绕 主体轴向地移动包括：在气动导管中装入加压流体，从而所述导管扩张并将支架围绕内部主体而轴向地移动。
  12. 如权利要求11所述的方法，其特征在于：流体在管芯扩展工具之外通过外部压缩机被加压。
  13. 如权利要求9所述的方法，其特征在于，在流体被压入、支架围绕主体而轴向地移动之后，流体被释压之前，包括：重构并将晶圆自箔载体上切开。
  14. 如权利要求9所述的方法，其特征在于：箔载体置于主体之上，从而在箔上的晶圆位于主体之上的中央。
  15. 一种管芯扩展工具，用于扩展箔载体的箔，晶圆附于箔载体上，其特征在于，所述管芯扩展工具包括：
    外部主体，所述外部主体形成腔体，箔载体的支架能够置于腔体中；
    在外部主体的腔体中的不动砧，附于箔上的晶圆可置于不动砧之上；以及
    位于外部主体的腔体之中的气动导管，从而当用受压流体使其扩展时，气动导管将支架围绕不动砧而轴向地移动，以扩展所述箔。
  16. 如权利要求15所述的管芯扩展工具，其特征在于：所述不动砧相对外部主体配置，从而当箔被扩展时，不动砧在外部主体的腔体中保持固定。
  17. 如权利要求15所述的管芯扩展工具，其特征在于：所述气动导管配置为向支架施加分配的径向压力。
  18. 如权利要求15所述的管芯扩展工具，其特征在于：所述气动导管为圆形导管，其形成单一的膛。
  19. 如权利要求15所述的管芯扩展工具，其特征在于：所述外部主体进一步包括受压流体接口，受压流体经过该受压流体接口被提供给气动导管。
  20. 如权利要求19所述的管芯扩展工具，其特征在于：所述受压流体在所述管芯扩展工具之外被加压，并通过所述受压流体接口提供。
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