WO2016021564A1 - 無アルカリガラス板の切断方法、ディスプレイパネルの切断方法、無アルカリガラス板の製造方法、およびディスプレイパネルの製造方法 - Google Patents

無アルカリガラス板の切断方法、ディスプレイパネルの切断方法、無アルカリガラス板の製造方法、およびディスプレイパネルの製造方法 Download PDF

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Publication number
WO2016021564A1
WO2016021564A1 PCT/JP2015/071996 JP2015071996W WO2016021564A1 WO 2016021564 A1 WO2016021564 A1 WO 2016021564A1 JP 2015071996 W JP2015071996 W JP 2015071996W WO 2016021564 A1 WO2016021564 A1 WO 2016021564A1
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WIPO (PCT)
Prior art keywords
cutting
glass plate
alkali
display panel
free glass
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Application number
PCT/JP2015/071996
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English (en)
French (fr)
Japanese (ja)
Inventor
田中　宏樹
博文 ▲徳▼永
和孝 小野
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to JP2016540228A priority Critical patent/JPWO2016021564A1/ja
Priority to CN201580042071.0A priority patent/CN106660853B/zh
Priority to KR1020177001983A priority patent/KR20170039143A/ko
Publication of WO2016021564A1 publication Critical patent/WO2016021564A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the present invention relates to a method for cutting an alkali-free glass plate, a method for cutting a display panel, a method for manufacturing an alkali-free glass plate, and a method for manufacturing a display panel.
  • Patent Documents 1 and 2 there has been known a method of cutting a glass plate along a cutting line after processing the cutting line on the surface of the glass plate using a cutter wheel (see Patent Documents 1 and 2).
  • non-alkali glass plates used for display panels are also thinner than conventional plate thicknesses (for example, 0.50 to 0.70 mm) ( For example, 0.05 to 0.30 mm) is required.
  • the present inventors have found that a satisfactory cutting result cannot be obtained under the conditions adapted to the conventional plate thickness (specifically, after cutting the wire) It was found that there is a case where the glass plate cannot be cut by the cutting device. Furthermore, the present inventors have found that even if the plate thickness is the same, the cutting results are different when the B 2 O 3 content of the alkali-free glass plate is different.
  • the present invention has been made in view of the above points, and can provide a satisfactory cutting result.
  • a method for cutting an alkali-free glass plate, a method for cutting a display panel, a method for manufacturing an alkali-free glass plate, and a display panel An object is to provide a manufacturing method.
  • the inventors of the present invention have found that the above-mentioned object can be achieved by cutting a line using a specific cutter wheel, and have completed the present invention.
  • the present invention is a method for cutting an alkali-free glass plate, wherein the alkali-free glass plate has a B 2 O 3 content (C) of 0 to 8.5% by mass. Yes, with a plate thickness (T) of 0.05 to 0.30 mm, and using a cutter wheel that satisfies the following (1) to (3) on the surface of the non-alkali glass plate to scribe and cut the cut line.
  • a method for cutting an alkali-free glass plate wherein the alkali-free glass plate is cut by applying a tensile stress or a bending stress to the cut line.
  • Wheel diameter ⁇ 1-5mm
  • Projection pitch 20 to 2000 ⁇ m
  • B 400 ⁇ T + (1.53 ⁇ C-22.1)
  • the present invention includes a melting step of obtaining a molten glass by heating a glass raw material, a forming step of obtaining the alkali-free glass plate by making the molten glass into a plate shape, and a cutting step of cutting the alkali-free glass plate,
  • the said cutting process provides the manufacturing method of an alkali free glass plate which cut
  • the present invention also relates to a display panel cutting method for cutting a display panel, wherein the display panel is formed by partially bonding two non-alkali glass plates with an adhesive having a thickness of 3 to 5 ⁇ m.
  • the alkali-free glass plate has a B 2 O 3 content (C) of 0 to 8.5% by mass, a plate thickness (T) of 0.05 to 0.30 mm, and the upper surface of the display panel.
  • the surface of the alkali-free glass plate constituting the bottom surface is scribed using a cutter wheel satisfying the following (1) ′ to (3) ′ to cut a cut line, and tensile stress or bending stress is applied to the cut line.
  • the present invention provides a display panel cutting method for cutting the display panel.
  • the present invention includes a melting step of obtaining a molten glass by heating a glass raw material, a forming step of obtaining the alkali-free glass plate by making the molten glass into a plate shape, and a cutting step of cutting the alkali-free glass plate,
  • the display panel cutting step provides a display panel manufacturing method in which the display panel is cut by the display panel cutting method.
  • the present invention it is possible to provide a method for cutting an alkali-free glass plate, a method for cutting a display panel, a method for manufacturing an alkali-free glass plate, and a method for manufacturing a display panel, which can provide good cutting results.
  • FIG. 1 is a schematic diagram illustrating an example of the cutter device 12.
  • FIG. 2 is an operation explanatory diagram of the cutting device 110.
  • FIG. 3 is an explanatory diagram of the operation of the cutting device 110.
  • FIG. 4 is an explanatory diagram of the operation of the cutting device 110.
  • 5 (a) and 5 (b) are diagrams illustrating an example of a cutter wheel
  • FIG. 5 (a) is a side view of the cutter wheel 12h
  • FIG. 5 (b) is a front view of the cutter wheel 12h.
  • FIG. FIG. 6 is a cross-sectional view showing the glass plate 20 scribed using the cutter wheel 12h.
  • 7 (a) and 7 (b) are diagrams showing an embodiment of the method for cutting the display panel of the present invention, and FIG.
  • FIG. 7 (a) is a cross-sectional view showing the display panel 200 in which the cut line L is processed.
  • FIG. 7B is a cross-sectional view showing the display panel 200 after cutting.
  • the non-alkali glass plate cutting method of the present invention (hereinafter also referred to as “the glass cutting method of the present invention” for convenience) is a non-alkali glass plate cutting method for cutting the non-alkali glass plate.
  • the alkali glass plate has a B 2 O 3 content (C) of 0 to 8.5% by mass and a plate thickness (T) of 0.05 to 0.30 mm.
  • C B 2 O 3 content
  • T plate thickness
  • the glass cutting method of the present invention is generally a method of cutting an alkali-free glass plate after cutting it with a cutter wheel.
  • an alkali-free glass plate hereinafter, also simply referred to as “glass plate” used in the present invention will be described.
  • the glass plate used in the present invention is a non-alkali glass that is a thin plate having a B 2 O 3 content (C) of 0 to 8.5% by mass and a thickness (T) of 0.05 to 0.30 mm.
  • C B 2 O 3 content
  • T thickness
  • a display panel such as a liquid crystal panel.
  • the glass plate is obtained by melting a glass raw material and molding the molten glass into a plate shape.
  • a molding method may be a general one, and for example, a float method, a fusion method, a slot down draw method, or the like is used.
  • the glass plate once formed into a plate shape may be formed by a method (redraw method) that is heated to a moldable temperature and stretched by means of stretching or the like, or once formed into a plate shape. It may be thinly formed by etching or other general methods.
  • the plate thickness (T) of the glass plate is 0.05 to 0.30 mm from the viewpoint of reducing the thickness and / or weight of the glass plate.
  • the blade edge angle A to B ° becomes an acute angle, and the rigidity of the cutter decreases.
  • the cutter blade load shifts to a low load side due to the sharp edge angle of the cutter, but is lower than the cutter wheel load that can be stably applied with the current technology (the cutter wheel load is less than 1N).
  • the thickness of the glass plate is preferably 0.10 to 0.30 mm, more preferably 0.15 to 0.30 mm, and further preferably 0.15 to 0.20 mm.
  • the glass plate does not substantially contain alkali metal components (that is, does not contain except unavoidable impurities).
  • the content of the alkali metal component is preferably 0.5% by mass or less, more preferably 0.2% by mass or less, and further preferably 0.1% by mass or less.
  • the glass plate is an alkali-free glass plate containing B 2 O 3 : 0 to 8.5% in terms of mass percentage based on oxide.
  • an alkali-free glass plate for example, SiO 2 : 54 to 73%, Al 2 O 3 : 10 to 23%, B 2 O 3 : 0 to 8.5% in terms of mass percentage based on oxide.
  • the percentage expressed by mass is synonymous with the percentage expressed by weight.
  • the glass cutting method of the present invention is more effective. Toward prominent.
  • the B 2 O 3 content is preferably 0 to 5%, more preferably 0 to 3%, and further preferably 0 to 2.5% in terms of oxide-based mass percentage.
  • 0 to 2% is particularly preferable, and 0 to 1.5% is most preferable.
  • the alkali-free glass plate used in the present invention preferably has a Young's modulus of 70 GPa or more. If the Young's modulus is 70 GPa or more, the strength is strong and the alkali-free glass plate after being cut is difficult to break.
  • the Young's modulus is more preferably 75 GPa or more, further preferably 80 GPa or more, and particularly preferably 85 GPa or more.
  • the Young's modulus is preferably 100 GPa or less. If the Young's modulus is 100 GPa or less, it is possible to suppress the glass from becoming brittle and to suppress chipping during the cutting of the alkali-free glass plate.
  • the Young's modulus is more preferably 97 GPa or less, further preferably 95 GPa or less, and particularly preferably 90 GPa or less. In this specification, the Young's modulus represents a value measured by an ultrasonic pulse method.
  • the alkali-free glass plate used in the present invention is made of ZnO, Fe 2 O 3 , SO 3 , F, Cl, SnO 2 and the like in addition to the above components from the viewpoint of improving the solubility, clarity and moldability of the glass.
  • ZnO is not substantially contained.
  • FIG. 5 (a) is a side view of the cutter wheel 12h
  • FIG. 5 (b) is a front view of the cutter wheel 12h
  • FIG. 6 is a cross-sectional view showing the glass plate 20 scribed using the cutter wheel 12h.
  • the disc-shaped cutter wheel 12h has a rotating shaft inserted through a hole shown at the center thereof and is rotatably supported.
  • the disc-shaped cutter wheel 12h rolls in a press-contact state on the surface of the glass plate 20 so as to make a cut line L.
  • a depression on the upper surface of the glass plate 20 is a minute deformation and a minute crack (crack) of the glass generated at the time of scribing, and this is referred to as a scribe line (scribe line) L.
  • the cut line L extends in the depth direction and the front direction in FIG. Simultaneously with the engraving of the cut line L, it is preferable that a crack (vertical crack) K extending from the cut line L in the downward direction is generated.
  • the thin glass plate 20 having a plate thickness of 0.05 to 0.30 mm is cut and cut. For this reason, a favorable cutting result may not be obtained under the conditions adapted to the conventional plate thickness (for example, 0.50 to 0.70 mm). Specifically, when the cut line processing is performed, circumstances such as the crack K not entering from the cut line L to a desired depth may occur, and the glass plate may not be cut by the cutting device after the cut line processing. Further, even if the same thickness, if the content of B 2 O 3 of the alkali-free glass plate is different, the cutting results differ.
  • the wheel diameter indicated by “D” in FIG. 5A is ⁇ 1 to 5 mm, preferably ⁇ 2 to 4 mm, and more preferably ⁇ 2 to 3 mm.
  • the pitch between adjacent protrusions J (the apexes) indicated by “P” in FIG. 5B is 20 to 2000 ⁇ m, preferably 30 to 2000 ⁇ m, more preferably 30 to 1000 ⁇ m, Is more preferably from 500 to 500 ⁇ m, particularly preferably from 30 to 100 ⁇ m.
  • T represents the plate thickness (unit: mm) of the glass plate
  • C represents the B 2 O 3 content (unit: mass%) of the glass plate 20.
  • the upper limit of the edge angle (A to B °) in the glass cutting method of the present invention is preferably 150 °, more preferably 140 °, still more preferably 130 °, and particularly preferably 120 °.
  • the lower limit is preferably 80 °, more preferably 90 °, and even more preferably 100 °.
  • the wheel thickness of the cutter wheel 12h is not particularly limited, and may be 0.4 to 5 mm, for example.
  • a material of the cutter wheel 12h a conventionally well-known material can be used, for example, a super steel alloy, a sintered diamond, etc. are mentioned.
  • the scribe speed is preferably 100 to 1000 mm / sec, more preferably 200 to 800 mm / sec, and further preferably 200 to 400 mm / sec.
  • the load of the cutter wheel 12h can be arbitrarily set by the cutter device 12 to be described later, and is preferably 1 to 25.8N. More specifically, for example, when the plate thickness of the glass plate 20 is 0.15 mm, 1.5N to 4.2N is preferable, although it depends on the cutting edge angle of the cutter wheel 12h, and 1.5 to 3. 8N is more preferable. Further, when the thickness of the glass plate 20 is 0.2 mm, it is preferably 2.3 to 6.5 N, and more preferably 2.7 N to 5.3 N.
  • a cutter device 12 is used.
  • FIG. 1 is a schematic diagram showing an example of the cutter device 12. As shown in FIG. 1, the cutter device 12 relatively moves the cutter wheel 12 h and the glass plate 20 in a state where the cutter wheel 12 h connected to one end of the air cylinder 12 a via the holder 12 b is pressed against the glass plate 20. Is a device for processing a cutting line L having a cutting depth d in the glass plate 20.
  • the air cylinder 12a includes a cylinder body 12c, a piston 12d that can reciprocate within the cylinder body 12c, and a rod 12e that is coupled to the piston 12d.
  • the rod 12e protrudes outside from a bearing portion 12f that is one end of the cylinder body 12c, and a holder 12b that supports the cutter wheel 12h is connected to the tip of the rod 12e.
  • the cutter wheel 12h is rotatably supported by the holder 12b via the shaft 12g.
  • the cutter wheel 12h rotates around the axis of the shaft 12g while making a cutting line L on the glass plate 20. Engrave continuously.
  • the holder 12b is rotatably connected to the rod 12e, and is rotatable about the axis of the rod 12e.
  • the cutter wheel 12h is moved relative to the glass plate 20 while being pressed against the glass plate 20, the holder 12b rotates so as to be parallel to the tangential direction of the cutting line L.
  • a moving mechanism for moving the cutter wheel 12h and the glass plate 20 at a desired scribe speed may have a known configuration.
  • the moving mechanism includes a base, a transport device, a guide rail, and a driving device.
  • a conveyance apparatus is an apparatus which conveys the glass plate 20 with respect to a base.
  • the glass plate 20 is conveyed horizontally, for example.
  • the guide rail is a member that movably supports the cylinder body 11 with respect to the base.
  • the cylinder body 12c is supported, for example, such that the axial direction is the vertical direction.
  • the drive device is a device that moves the cylinder body 12c along the guide rail under the control of the control device.
  • the moving mechanism relatively moves the cutter wheel 12h and the glass plate 20 by moving the glass plate 20 horizontally and / or moving the cylinder body 12c.
  • a cutting device 110 is used for cutting.
  • FIG. 2 to 4 are operation explanatory views of the cutting device 110.
  • the glass plate 20 on which the cutting line L is processed is placed on the table 116 so that the cutting line L is located outward.
  • one glass plate 20 which opposes across the cutting line L of the glass plate 20 is also called “glass plate 20A”
  • the other glass plate 20 is also called “glass plate 20B.”
  • dampers 122A and 122B made of rubber, resin, or plastic are attached to the glass contact surfaces of the holding members 120A and 120B, respectively.
  • the damper 122A has a gap on the lower surface of the glass plate 20A.
  • the damper 122B comes into contact with the upper surface of the glass plate 20A without any gap.
  • the lower surface of the glass plate 20B is supported by the support member 126A, and the folding member 126B is disposed with a predetermined gap with respect to the upper surface of the glass plate 20B.
  • the glass contact of each of the supporting member 126A and the folding member 126B Rubber, resin, or plastic dampers 130A and 130B are attached to the surface.
  • the damper 130A is in contact with the lower surface of the glass plate 20B without a gap, and the damper 130B is arranged with a gap with respect to the upper surface of the glass plate 20B.
  • the glass contact surfaces of the dampers 130 ⁇ / b> A and 130 ⁇ / b> B have a flat shape parallel to the surface of the glass plate 20 ⁇ / b> B, but the present invention is not limited to this.
  • the dampers 130A and 130B may be inclined surfaces inclined downward to the right.
  • the cutting member composed of the support member 126A and the folding member 126B is rotated in the clockwise direction as shown in FIG. 2 around the shaft 134 set at a position lower than the glass plate 20 of the cutting line L.
  • the lower surface edge portion E1 farthest from the cutting line L presses and contacts the upper surface of the glass plate 20B.
  • the damper 130B of the folding member 126B gradually increases the area in contact with the glass plate 20B from the lower surface edge portion E1 toward the lower surface edge portion E2 closest to the cutting line L as shown in FIG. It is pressed against the upper surface of the glass plate 20B while increasing.
  • a tensile stress or bending stress in the direction of bending the glass plate 20 is applied to the cut line L of the glass plate 20, and the glass plate 20 is moved along the cut line L as shown in FIG. It is cut into a plate 20A and a glass plate 20B.
  • the cutting line L is not subjected to excessive force from the folding member 126B due to the above-described operation of increasing the contact area of the folding member 126B. Therefore, the cut surfaces of the glass plate 20A and the glass plate 20B are not chipped. A large shell-shaped chipping) does not occur, and therefore the cut surface is good. Also, as shown in FIG. 4, when the glass plate 20 is cut, the cut surfaces of the glass plate 20A and the glass plate 20B are separated from each other, so that contact between the cut surfaces can be prevented and a good cut surface can be obtained.
  • the cut glass plate 20B passes through the supporting member 126A and the folding member 126B by its own weight and falls. Therefore, in order to drop the cut glass plate 20B, the operation of widening the interval between the support member 126A and the folding member 126B can be omitted.
  • the glass plate 20 (glass plate 20A, glass plate 20B) cut
  • the present invention also relates to an alkali-free glass plate cut by the above-described glass cutting method of the present invention (hereinafter also referred to as “the alkali-free glass plate of the present invention”).
  • the alkali-free glass plate of the present invention is suitably used for a display panel such as a liquid crystal display, for example, but the application is not limited thereto.
  • the method for producing an alkali-free glass plate of the present invention is as follows. A melting step of heating the glass raw material to obtain molten glass; A molding step for obtaining a non-alkali glass plate by forming molten glass into a plate; A cutting step for cutting the alkali-free glass plate; And the cutting step is a method for producing an alkali-free glass plate, wherein the alkali-free glass plate is cut by the method for cutting an alkali-free glass plate.
  • the display panel cutting method of the present invention (hereinafter also referred to as “the display cutting method of the present invention” for convenience) is a display panel cutting method for cutting a display panel.
  • the alkali-free glass plate is partially bonded with an adhesive having a thickness of 3 to 5 ⁇ m.
  • the alkali-free glass plate has a B 2 O 3 content (C) of 0 to 8.5% by mass.
  • the following conditions (1) ′ to (3) ′ are applied to the surface of the non-alkali glass plate having a plate thickness (T) of 0.05 to 0.30 mm and constituting the upper and lower surfaces of the display panel: Cutting the display panel by cutting the display panel by applying a tensile stress or a bending stress to the cut line by scribing and cutting the cut line using the cutter wheel to be filled. It is the law.
  • B ′ 400 ⁇ T + (1.53 ⁇ C-22.1) +5
  • FIG. 7A and FIG. 7B Based on FIG. 7A and FIG. 7B, one aspect of the display cutting method of the present invention will be described.
  • FIG. 7A is a cross-sectional view showing the display panel 200 in which the cutting line L is processed
  • FIG. 7B is a cross-sectional view showing the display panel 200 after cutting.
  • the display panel 200 to be cut is configured by partially bonding two glass plates 20 with an adhesive 210 having a thickness of 3 to 5 ⁇ m. Since the details of the glass plate 20 are the same as those described above, description thereof is omitted here. In addition, between the two glass plates 20, for example, liquid crystal is filled and sealed with an adhesive 210.
  • the cutter wheel 12h (see FIG. 5A, FIG. 5B, etc.), as shown in FIG. 7A, symmetrical positions of the upper and lower surfaces of the display panel 200 (the surface of the glass plate 20).
  • the cutting line L is processed. Note that the cutter apparatus 12 described above can be used for the cutting process.
  • T represents the plate thickness (unit: mm) of the glass plate
  • C represents the B 2 O 3 content (unit: mass%) of the glass plate 20.
  • the cutting edge angle of the display cutting method of the present invention is 5 ° larger than that of the glass cutting method of the present invention.
  • the upper limit value of the blade edge angle (A ′ to B ′ °) is preferably 150 + 5 °, and the lower limit value is preferably 80 + 5 °.
  • the display panel 200 is cut by applying a tensile stress or a bending stress to the cut line L as shown in FIG.
  • tensile stress or bending stress is applied to the cutting line of the glass plate 20 in the bending direction.
  • bending is performed to the cutting line on one side of the glass plate 20. Even if tensile stress or bending stress is applied in the direction, only one glass plate 20 is cut, and the other glass plate 20 is not cut. Therefore, in the display cutting method of the present invention, tensile stress or bending stress is applied in the surface direction of the glass plate 20 (left-right direction in FIG. 7).
  • the display panel 200 is cut
  • a cutting device for applying a tensile stress or a bending stress to the surface direction of the glass plate 20 and a conventionally well-known apparatus can be used.
  • Display panel also relates to a display panel cut by the above-described display cutting method of the present invention (hereinafter also referred to as “display panel of the present invention”).
  • the manufacturing method of the display panel of the present invention includes: A melting step of heating the glass raw material to obtain molten glass; A molding step for obtaining an alkali-free glass plate by making the molten glass into a plate shape, A cutting step of cutting the alkali-free glass plate; A display panel assembling step for obtaining a display panel by partially bonding the two alkali-free glass plates with an adhesive having a thickness of 3 to 5 ⁇ m; A display panel cutting step for cutting the display panel; The display panel cutting step is a method for manufacturing a display panel, wherein the display panel is cut by the method for cutting the display panel.
  • the glass laminate S1 is a product in which a glass plate to be a product is adhered in a peelable manner on a silicone resin layer fixed on a supporting substrate that is a glass plate.
  • glass laminate S1-1 On the second main surface of the glass plate in one glass laminate S1 (hereinafter also referred to as “glass laminate S1-1”), silicon nitride, silicon oxide, and amorphous silicon are deposited in this order by plasma CVD. Next, low concentration boron is injected into the amorphous silicon layer by an ion doping apparatus, and a dehydrogenation process is performed by heating at 450 ° C. for 60 minutes in a nitrogen atmosphere.
  • the amorphous silicon layer is crystallized by a laser annealing apparatus.
  • low concentration phosphorus is implanted into the amorphous silicon layer by an etching and ion doping apparatus using a photolithography method, thereby forming N-type and P-type TFT areas.
  • a silicon oxide film is formed on the second main surface side of the glass plate by a plasma CVD method to form a gate insulating film, then molybdenum is formed by a sputtering method, and the gate is etched by photolithography. An electrode is formed.
  • boron and phosphorus are implanted into desired areas of the N-type and P-type by photolithography and an ion doping apparatus, thereby forming a source area and a drain area.
  • an interlayer insulating film is formed by silicon oxide film formation by plasma CVD, and a TFT electrode is formed by aluminum film formation by sputtering and etching using photolithography.
  • a passivation layer is formed by film formation of nitrogen silicon by a plasma CVD method.
  • an ultraviolet curable resin is applied to the second main surface side of the glass plate, and a planarization layer and a contact hole are formed by photolithography.
  • a film of indium tin oxide is formed by a sputtering method, and a pixel electrode is formed by etching using a photolithography method.
  • the other glass laminate S1 (hereinafter also referred to as “glass laminate S1-2”) is heated at 450 ° C. for 60 minutes in an air atmosphere.
  • a chromium film is formed on the second main surface of the glass plate in the glass laminate S1 by a sputtering method, and a light shielding layer is formed by etching using a photolithography method.
  • a color resist is applied to the second main surface side of the glass plate by a die coating method, and a color filter layer is formed by a photolithography method and heat curing.
  • a film of indium tin oxide is formed by a sputtering method to form a counter electrode.
  • an ultraviolet curable resin liquid is applied to the second main surface side of the glass plate by a die coating method, and columnar spacers are formed by a photolithography method and heat curing.
  • a polyimide resin solution is applied by a roll coating method, an alignment layer is formed by thermosetting, and rubbing is performed.
  • a sealing resin liquid is drawn in a frame shape by the dispenser method, and after the liquid crystal is dropped into the frame by the dispenser method, two glass plates are used by using the glass laminate S1-1 on which the pixel electrode is formed as described above. The second principal surface sides of the glass plates of the laminate S1 are bonded together, and ultraviolet curing and heat curing are performed.
  • the second main surface of the glass laminate S1-1 is vacuum-adsorbed on a surface plate, and a stainless steel having a thickness of 0.1 mm is formed at the interface between the glass plate and the silicone resin layer at the corner of the glass laminate S1-2.
  • a blade is inserted to provide a trigger for peeling between the first main surface of the glass plate and the peelable surface of the silicone resin layer.
  • the blade is inserted while spraying a static eliminating fluid on the interface from an ionizer (manufactured by Keyence Corporation).
  • the vacuum suction pad is pulled up while the static elimination fluid is continuously sprayed from the ionizer toward the formed gap.
  • the suction pad is raised after the second main surface of the supporting base material of the glass laminate S1-2 is sucked by the vacuum suction pad.
  • the support substrate with the silicone resin layer can be peeled off.
  • the second main surface of the glass plate having the color filter formed on the first main surface is vacuum-adsorbed to the surface plate, and the interface between the glass plate and the silicone resin layer at the corner of the glass laminate S1-1 is A stainless steel blade having a thickness of 0.1 mm is inserted to give a trigger for peeling between the first main surface of the glass plate and the peelable surface of the silicone resin layer.
  • the suction pad is raised after the second main surface of the supporting base material of the glass laminate S1-1 is sucked by the vacuum suction pad.
  • the support substrate to which the silicone resin layer is fixed can be peeled off.
  • a liquid crystal panel composed of two glass plates is obtained.
  • the liquid crystal panel can be cut by applying a tensile stress or a bending stress in the surface direction of the liquid crystal panel to the cut line.
  • the alkali-free glass plate was cut (including the cutting process). Details of glass plates A to C, which are non-alkali glass plates used in the following examples, are as follows.
  • the thickness (T) is shown in Tables 1 to 3 below.
  • the glass plates A to C were cut by cutting the surface with a scribe speed shown in the following Tables 1 to 3 using the cutter wheel shown in the following Tables 1 to 3, and the cutting situation was evaluated.
  • the cutter wheel used had a wheel thickness of 0.40 mm (when the wheel diameter was ⁇ 1 mm) or 0.65 mm (when the wheel diameter was ⁇ 2 mm or ⁇ 3 mm), and the material was sintered diamond.
  • the cutter wheel load range (difference between the upper limit and the lower limit) when the cutter wheel load is changed in the range of 1 to 25.8 N and the glass plate can be cut by the cutting device after the cutting process is shown below. Evaluated by criteria. A to C are examples, and good cutting results were obtained. D is a comparative example, and good cutting results were not obtained. A: Load range is 1.5N or more B: Load range is 0.5N or more and less than 1.5N C: Load range is less than 0.5N D: With a cutter wheel load of 1 to 25.8N, glass is cut and cut The board could not be cut.
  • Tables 1 to 3 are shown in the graphs of FIGS. In the graphs of FIGS. 8 to 10, the evaluations A to C in Tables 1 to 3 are plotted with “ ⁇ ”, and the evaluation D is plotted with “ ⁇ ”.
  • Table 4 below is a comparative example, and the thickness (T) under the condition that the conventional alkali-free glass plate having a thickness (for example, 0.50 to 0.70 mm) can be cut well.
  • the cutter wheel used has a wheel thickness of 1.1 mm and is made of sintered diamond. Under these conditions, a non-alkali glass plate having a projection pitch exceeding 2000 ⁇ m and a plate thickness (T) of 0.05 to 0.30 mm is obtained after cutting with a cutting wheel load of 1 to 25.8 N. could not be cut.

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  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Glass Compositions (AREA)
PCT/JP2015/071996 2014-08-04 2015-08-03 無アルカリガラス板の切断方法、ディスプレイパネルの切断方法、無アルカリガラス板の製造方法、およびディスプレイパネルの製造方法 WO2016021564A1 (ja)

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CN201580042071.0A CN106660853B (zh) 2014-08-04 2015-08-03 无碱玻璃板的切割方法、显示面板的切割方法、无碱玻璃板的制造方法、以及显示面板的制造方法
KR1020177001983A KR20170039143A (ko) 2014-08-04 2015-08-03 무알칼리 유리판의 절단 방법, 디스플레이 패널의 절단 방법, 무알칼리 유리판의 제조 방법, 및 디스플레이 패널의 제조 방법

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TWI837150B (zh) 2018-09-28 2024-04-01 日商三星鑽石工業股份有限公司 GaN基板之分斷方法

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WO2005072926A1 (ja) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co., Ltd. カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法、ならびにカッターホイールの製造方法
JP2013112534A (ja) * 2011-11-25 2013-06-10 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP2013173653A (ja) * 2012-02-27 2013-09-05 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール、スクライブ装置及びスクライビングホイールの製造方法。
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TWI837150B (zh) 2018-09-28 2024-04-01 日商三星鑽石工業股份有限公司 GaN基板之分斷方法

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TW201612120A (en) 2016-04-01
KR20170039143A (ko) 2017-04-10

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