WO2016014087A1 - Tête d'impression ayant un certain nombre de memristances fermées par une électrode supérieure - Google Patents

Tête d'impression ayant un certain nombre de memristances fermées par une électrode supérieure Download PDF

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Publication number
WO2016014087A1
WO2016014087A1 PCT/US2014/048297 US2014048297W WO2016014087A1 WO 2016014087 A1 WO2016014087 A1 WO 2016014087A1 US 2014048297 W US2014048297 W US 2014048297W WO 2016014087 A1 WO2016014087 A1 WO 2016014087A1
Authority
WO
WIPO (PCT)
Prior art keywords
printhead
memristor
bottom electrode
fluid
oxide
Prior art date
Application number
PCT/US2014/048297
Other languages
English (en)
Inventor
Ning GE
Jianhua Yang
Lu Zhang
Sity Lam
Max ZHANG
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2014/048297 priority Critical patent/WO2016014087A1/fr
Publication of WO2016014087A1 publication Critical patent/WO2016014087A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04581—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04541—Specific driving circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0455—Details of switching sections of circuit, e.g. transistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17566—Ink level or ink residue control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17566—Ink level or ink residue control
    • B41J2002/17579—Measuring electrical impedance for ink level indication

Definitions

  • a memory system may be used to store data.
  • imaging devices such as printheads may include memory to store information relating to printer cartridge identification, security information, and authentication information, among other types of information.
  • FIG. 1 is a diagram of a printing system according to one example of the principles described herein.
  • Fig. 2A is a diagram of a printer cartridge with a number of top electrode-enclosed memristors according to one example of the principles described herein.
  • Fig. 2B is a cross sectional diagram of a printer cartridge with a number of top electrode-enclosed memristors according to one example of the principles described herein.
  • FIG. 3 is a block diagram of a printer cartridge that uses a printhead with a number of top electrode-enclosed memristors according to one example of the principles described herein.
  • Fig. 4 is a cross-sectional view of a top electrode-enclosed memristor according to one example of the principles described herein.
  • Fig. 5 is a diagram depicting a cross bar memristor array according to one example of the principles described herein.
  • Fig. 6 is a view of a top electrode-enclosed memristor in a cross bar memristor array according to one example of the principles described herein.
  • Fig. 7 is a view of top electrode-enclosed memristor in a one transistor-one memristor structure according to one example of the principles described herein.
  • Memory devices are used to store information for a printer cartridge.
  • Printer cartridges include memory to store information related to the operation of the printhead.
  • a printhead may include memory to store information related 1) to the printhead; 2) to fluid, such as ink, used by the printhead; or 3) to the use and maintenance of the printhead.
  • Other examples of information that may be stored on a printhead include information relating to
  • fluid usage data examples include identification information, serial numbers, security information, feature information, Anti-Counterfeiting (ACF) information, among other types of information. While memory usage on printheads is desirable, changing circumstances may reduce their efficacy in storing information.
  • manufacturer may desire to store more information on a memory device.
  • Memristors may be used due to their non-volatility, low operational power consumption characteristics, and their compact size. However, while memristors may serve as beneficial memory storage devices, their use presents a number of complications.
  • memristors may be incorporated onto a silicon wafer during a back end of the line (BEOL) process that occurs at the end of fabrication of an integrated circuit.
  • BEOL back end of the line
  • memristors while presenting beneficial memory endurance and retention, may use a high voltage to set the memristor to a particular value, which may lead to bits that are improperly set during a read/write operation.
  • a top electrode-enclosed memristor as described in the present specification may utilize a particular architecture to facilitate a more simple switching mechanism and which may reduce a forming voltage for the memristor.
  • a memristor includes a bottom electrode and a switching oxide that encompasses a number of surfaces of the bottom electrode.
  • the memristor also includes a top electrode that encompasses a number of surfaces of the switching oxide.
  • the present disclosure describes a printhead with a number of top electrode-enclosed memristors.
  • the printhead includes a number of nozzles to deposit an amount of fluid onto a print medium.
  • Each nozzle includes a firing chamber to hold the amount of fluid, an opening to dispense the amount of fluid onto a print medium, and an ejector to eject the amount of fluid through the opening.
  • the printhead also includes a number of memristors.
  • Each memristor includes a bottom electrode, a switching oxide disposed on a top surface of the bottom electrode and a number of side surfaces of the bottom electrode, and a top electrode disposed on a portion of a top surface of the switching oxide and a portion of a number of side surfaces of the switching oxide.
  • the present disclosure describes a printer cartridge with a number of top electrode-enclosed memristors.
  • the cartridge includes a fluid supply and a printhead to deposit fluid from the fluid supply onto a print medium.
  • the printhead includes a number of memristors.
  • Each memristor includes a bottom electrode, a switching oxide disposed on a top surface of the bottom electrode and a number of side surfaces of the bottom electrode, and a top electrode disposed on a portion of a top surface of the switching oxide and a portion of a number of side surfaces of the switching oxide.
  • a printer cartridge and a printhead that utilize a top electrode- enclosed memristor may be beneficial by providing a large amount of memory storage on a relatively small space on the printhead as compared to other memory devices. Additionally, a top electrode-enclosed memristor may facilitate a simpler switching mechanism which reduces the effects of stubborn or stock bite. The top electrode-enclosed memristor also reduces the forming voltage of a memristor which reduces the potential of an overwritten or broken memristor.
  • the top electrode-enclosed memristor as described herein may be 1) cost effective by reducing the manufacturing costs of a memory device on a printhead, 2) efficient by storing more information in a smaller footprint, and 3) reliable by reducing the potential of malfunctioning memory storage.
  • a printer cartridge may refer to a device used in the ejection of ink, or other fluid, onto a print medium
  • a printer cartridge may be a fluidic ejection device that dispenses fluid such as ink, wax, polymers or other fluids.
  • a printer cartridge may include a printhead.
  • a printhead may be used in printers, graphic plotters, copiers and facsimile machines.
  • a printhead may eject ink, or another fluid, onto a medium such as paper to form a desired image or a desired three-dimensional geometry.
  • the term "printer” is meant to be understood broadly as any device capable of selectively placing a fluid onto a print medium.
  • the printer is an inkjet printer.
  • the printer is a three-dimensional printer.
  • the printer is a digital titration device.
  • a fluid is meant to be understood broadly as any substance that continually deforms under an applied shear stress
  • a fluid may be a pharmaceutical.
  • the fluid may be an ink.
  • the fluid may be a liquid.
  • the term "print medium” is meant to be understood broadly as any surface onto which a fluid ejected from a nozzle of a printer cartridge may be deposited.
  • the print medium may be paper.
  • the print medium may be en edible substrate.
  • the print medium may be a medicinal pill.
  • the term “memristor” may refer to a passive two-terminal circuit element that maintains a functional relationship between the time integral of current, and the time integral of voltage.
  • forming voltage may refer to a voltage used to place a particular memristor in a "state" in which the memristor stores information.
  • a number of or similar language may include any positive number including 1 to infinity; zero not being a number, but the absence of a number.
  • Fig. 1 is a diagram of a printing system (100) according to one example of the principles described herein.
  • the printing system (100) includes a printer (104).
  • the printer (104) includes an interface with a computing device (102).
  • the interface enables the printer (104) and specifically the processor (108) to interface with various hardware elements, such as the computing device (102), external and internal to the printer (104).
  • Other examples of external devices include external storage devices, network devices such as servers, switches, routers, and client devices among other types of external devices.
  • the computing device (102) may be any source from which the printer (104) may receive data describing a print job to be executed by the controller (106) of the printer (104) in order to print an image onto the print medium (126).
  • the controller (106) receives data from the computing device (102) and temporarily stores the data in the data storage device (110).
  • Data may be sent to the printer (104) along an electronic, infrared, optical, or other information transfer path.
  • the data may represent a document and/or file to be printed.
  • data forms a print job for the printer (104) and includes one or more print job commands and/or command parameters.
  • a controller (106) of the printer (104) includes a processor (108), a data storage device (110), firmware, software, and other electronics for communicating with and controlling the printhead (1 16), mounting assembly (1 18), and media transport assembly (120).
  • the controller (106) receives data from the computing device (102) and temporarily stores data in the data storage device (110).
  • the controller (106) controls the printhead (1 16) in ejecting fluid from the nozzles (124). For example, the controller (106) defines a pattern of ejected fluid drops that form characters, symbols, and/or other graphics or images on the print medium (126). The pattern of ejected fluid drops is determined by the print job commands and/or command parameters received from the computing device (102).
  • the controller (106) may be a printer (104) application specific integrated circuit (ASIC) to determine the level of fluid in the printhead (1 16) based on resistance values of memristors integrated on the printhead (1 16).
  • the printer ASIC may include a current source and an analog to digital converter (ADC).
  • the ASIC converts a voltage present at the current source to determine a resistance of a memristor, and then determine a corresponding digital resistance value through the ADC.
  • Computer readable program code, executed through executable instructions enables the resistance determination and the subsequent digital conversion through the ADC.
  • the processor (108) may include the hardware architecture to retrieve executable code from the data storage device (110) and execute the executable code.
  • the executable code may, when executed by the processor (108), cause the processor (108) to implement at least the functionality of printing on the print medium (126), and actuating the mounting assembly (118) and the media transport assembly (120) according to the present specification.
  • the executable code may, when executed by the processor (108), cause the processor (108) to implement the functionality of providing instructions to the power supply (130) such that the power supply (130) provides power to the components of the printer (104).
  • the data storage device (110) may store data such as executable program code that is executed by the processor (108) or other processing device.
  • the data storage device (110) may specifically store computer code representing a number of applications that the processor (108) executes to implement at least the functionality described herein.
  • the data storage device (110) may include various types of memory modules, including volatile and nonvolatile memory.
  • the data storage device (1 10) of the present example includes Random Access Memory (RAM), Read Only Memory (ROM), and Hard Disk Drive (HDD) memory.
  • RAM Random Access Memory
  • ROM Read Only Memory
  • HDD Hard Disk Drive
  • Many other types of memory may also be utilized, and the present specification contemplates the use of many varying type(s) of memory in the data storage device (1 10) as may suit a particular application of the principles described herein.
  • different types of memory in the data storage device (110) may be used for different data storage needs.
  • the processor (108) may boot from Read Only Memory (ROM), maintain nonvolatile storage in the Hard Disk Drive (HDD) memory, and execute program code stored in Random Access Memory (RAM).
  • the data storage device (110) may include a computer readable medium, a computer readable storage medium, or a non- transitory computer readable medium, among others.
  • the data storage device (110) may be, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing.
  • a computer readable storage medium may include, for example, the following: an electrical connection having a number of wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
  • a computer readable storage medium may be any tangible medium that can contain, or store computer usable program code for use by or in connection with an instruction execution system, apparatus, or device.
  • a computer readable storage medium may be any non-transitory medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
  • the printing system (100) includes a printer cartridge (1 14) that includes a printhead (116), a reservoir (112), and a conditioning assembly (132).
  • the printer cartridge (1 14) may be removable from the printer (104) for example, as a replaceable printer cartridge (114).
  • the printer cartridge (1 14) includes a printhead (1 16) that ejects drops of fluid through a plurality of nozzles (124) towards a print medium (126).
  • the print medium (126) may be any type of suitable sheet or roll material, such as paper, card stock, transparencies, polyester, plywood, foam board, fabric, canvas, and the like.
  • the print medium (126) may be en edible substrate.
  • the print medium (126) may be a medicinal pill.
  • Nozzles (124) may be arranged in one or more columns or arrays such that properly sequenced ejection of fluid from the nozzles (124) causes characters, symbols, and/or other graphics or images to be printed on the print medium (126) as the printhead (116) and print medium (126) are moved relative to each other.
  • the number of nozzles (124) fired may be a number less than the total number of nozzles (124) available and defined on the printhead (116).
  • the printer cartridge (1 14) also includes a fluid reservoir (1 12) to supply an amount of fluid to the printhead (1 16).
  • fluid flows from the reservoir (1 12) to the printhead (116), and the reservoir (112) and the printhead (116) form a one-way fluid delivery system or a recirculating fluid delivery system.
  • a one-way fluid delivery system fluid supplied to the printhead (116) is consumed during printing.
  • a recirculating fluid delivery system however, a portion of the fluid supplied to printhead (1 16) is consumed during printing. Fluid not consumed during printing is returned to the reservoir (112).
  • the reservoir (112) may supply fluid under positive pressure through a conditioning assembly (132) to the printhead (116) via an interface connection, such as a supply tube.
  • the reservoir (1 12) may include pumps and pressure regulators.
  • Conditioning in the conditioning assembly (132) may include filtering, pre-heating, pressure surge absorption, and degassing. Fluid is drawn under negative pressure from the printhead (1 16) to the reservoir (1 12). The pressure difference between the inlet and outlet to the printhead (1 16) is selected to achieve the correct backpressure at the nozzles (124).
  • a mounting assembly (118) positions the printhead (1 16) relative to media transport assembly (120), and media transport assembly (120) positioning the print medium (126) relative to printhead (1 16).
  • a print zone (128) is defined adjacent to the nozzles (124) in an area between the printhead (116) and the print medium (126).
  • the printhead (1 16) is a scanning type printhead (116).
  • the mounting assembly (118) includes a carriage for moving the printhead (1 16) relative to the media transport assembly (120) to scan the print medium (126).
  • the printhead (116) is a non-scanning type printhead (1 16).
  • the mounting assembly (118) fixes the printhead (116) at a prescribed position relative to the media transport assembly (120).
  • the media transport assembly (120) positions the print medium (126) relative to the printhead (116).
  • Fig. 2A is a diagram of a printer cartridge (1 14) and printhead (1 16) with a number of memristors having parallel current distributors according to one example of the principles described herein.
  • the printhead (1 16) may comprise a number of nozzles (124).
  • the printhead (116) may be broken up into a number of print dies with each die having a number of nozzles (124).
  • the printhead (116) may be any type of printhead (116) including, for example, a printhead (116) as described in Figs. 2A and 2B.
  • the examples shown in Figs. 2A and 2B are not meant to limit the present description. Instead, various types of printheads (116) may be used in conjunction with the principles described herein.
  • the printer cartridge (1 14) also includes a fluid reservoir (1 12), a flexible cable (236), conductive pads (238), and a memristor array (240).
  • the flexible cable (236) is adhered to two sides of the printer cartridge (1 14) and contains traces that electrically connect the memristor array (240) and printhead (1 16) with the conductive pads (238).
  • the printer cartridge (1 14) may be installed into a cradle that is integral to the carriage of a printer (Fig. 1 , 104).
  • the conductive pads (238) are pressed against corresponding electrical contacts in the cradle, allowing the printer (Fig. 1, 104) to communicate with, and control the electrical functions of, the printer cartridge (1 14).
  • the conductive pads (238) allow the printer (Fig. 1 , 104) to access and write to the memristor array (240).
  • the memristor array (240) may contain a variety of information including the type of printer cartridge (1 14), the kind of fluid contained in the printer cartridge (1 14), an estimate of the amount of fluid remaining in the fluid reservoir (1 12), calibration data, error information, and other data.
  • the memristor array (240) may include information regarding when the printer cartridge (1 14) should be maintained.
  • the memristor array (240) may include other information as described below in connection with Fig. 3.
  • the printer moves the carriage containing the printer cartridge (114) over a print medium (Fig. 1, 126).
  • the printer sends electrical signals to the printer cartridge (1 14) via the electrical contacts in the cradle.
  • the electrical signals pass through the conductive pads (238) and are routed through the flexible cable (236) to the printhead (116).
  • the printhead (1 16) then ejects a small droplet of fluid from the reservoir (1 12) onto the surface of the print medium (Fig. 1, 126). These droplets combine to form an image on the surface of the print medium (Fig. 1, 126).
  • the printhead (1 16) may include any number of nozzles (124).
  • a first subset of nozzles (124) may eject a first color of ink while a second subset of nozzles (124) may eject a second color of ink.
  • Additional groups of nozzles (124) may be reserved for additional colors of ink.
  • Fig. 2B is a cross sectional diagram of a printer cartridge (114) and printhead (116) with a number of memristors disposed on enclosed gate transistors according to one example of the principles described herein.
  • the printer cartridge (1 14) may include a fluid supply (1 12) that supplies the fluid to the printhead (1 16) for deposition onto a print medium.
  • the fluid may be ink.
  • the printer cartridge (1 14) may be an inkjet printer cartridge
  • the printhead (1 16) may be an inkjet printhead
  • the ink may be inkjet ink.
  • the printer cartridge (114) may include a printhead (1 16) to carry out at least a part of the functionality of depositing fluid onto a print medium.
  • the printhead (1 16) may include a number of components for depositing a fluid onto a print medium.
  • the printhead (116) may include a number of nozzles (124).
  • Fig. 2B indicates a single nozzle (124), however a number of nozzles (124) are present on the printhead (1 16).
  • a nozzle (124) may include an ejector (242), a firing chamber (244), and an opening (246).
  • the opening (246) may allow fluid, such as ink, to be deposited onto a surface, such as a print medium (Fig. 1, 126).
  • the firing chamber (244) may include a small amount of fluid.
  • the ejector (242) may be a mechanism for ejecting fluid through an opening (246) from a firing chamber (244), where the ejector (242) may include a firing resistor or other thermal device, a piezoelectric element, or other mechanism for ejecting fluid from the firing chamber (244).
  • the ejector (242) may be a firing resistor.
  • the firing resistor heats up in response to an applied voltage.
  • a portion of the fluid in the firing chamber (244) vaporizes to form a bubble.
  • This bubble pushes liquid fluid out the opening (246) and onto the print medium (Fig. 1, 126).
  • a vacuum pressure within the firing chamber (244) draws fluid into the firing chamber (244) from the fluid supply (1 12), and the process repeats.
  • the printhead (1 16) may be a thermal inkjet printhead.
  • the ejector (242) may be a piezoelectric device. As a voltage is applied, the piezoelectric device changes shape which generates a pressure pulse in the firing chamber (244) that pushes a fluid out the opening (246) and onto the print medium (Fig. 1, 126).
  • the printhead (116) may be a piezoelectric inkjet printhead.
  • the printhead (116) and printer cartridge (114) may also include other components to carry out various functions related to printing. For simplicity, in Figs. 2A and 2B, a number of these components and circuitry included in the printhead (116) and printer cartridge (114) are not indicated; however such components may be present in the printhead (1 16) and printer cartridge (1 14). In some examples, the printer cartridge (1 14) is removable from a printing system for example, as a disposable printer cartridge. [0053] Fig. 3 is a block diagram of a printer cartridge (114) that uses a printhead (116) with a number of top electrode-end osed memristors (348) according to one example of the principles described herein.
  • the printer cartridge (114) includes a printhead (116) that carries out at least a part of the functionality of the printer cartridge (114).
  • the printhead (116) may include a number of nozzles (Fig. 1, 124).
  • the printhead (1 16) ejects drops of fluid from the nozzles (Fig. 1, 124) onto a print medium (Fig. 1, 126) in accordance with a received print job.
  • the printhead (116) may also include other circuitry to carry out various functions related to printing.
  • the printhead (1 16) is part of a larger system such as an integrated printhead (IPH).
  • the printhead (1 16) may be of varying types.
  • the printhead (1 16) may be a thermal inkjet ( ⁇ J) printhead or a piezoelectric inkjet (PI J) printhead, among other types of printhead (116).
  • the printhead (1 16) includes a memristor array (240) to store information relating to at least one of the printer cartridge (1 14) and the printhead (116).
  • the memristor array (240) includes a number of memristors (348) formed in the printhead (1 16).
  • a memristor (348) may be set to a particular resistance state. As memristors (348) are non-volatile, this resistance state is retained even when power is removed from the printhead (1 16).
  • a memristor has a metal-insulator-metal layered structure. More specifically, the memristor may include a bottom electrode (metal), a switching oxide (insulator or semi-conductor), and a top electrode (metal).
  • a memristor may be classified as an anion device which includes an oxide insulator. Examples of such oxide insulators include transition metal oxides, complex oxides, and large band gap dielectrics in addition to other non-oxide materials.
  • an aluminum-copper-silicon alloy oxide or tantalum oxide may be examples of a switching oxide in an anion device. In an anionic device, the switching mechanism is the oxygen vacancies in the oxide that are positively charged.
  • the electrodes i.e., the bottom electrode, the top electrode, or combinations thereof are formed from an electrochemically active metal such as copper or silver.
  • the number of memristors (348) are grouped together into a memristor array (240).
  • the memristor array (240) may be a cross bar array.
  • each memristor may be formed at an intersection of a first set of elements and a second number of elements, the elements forming a grid of intersecting nodes, each node defining a memristor.
  • an integrated circuit may include a number of addressing units. Each addressing unit may include a number of components that allow for multiplexing and logic operations.
  • the memristor (348) may be designed to be individually addressed by a distinct addressing unit
  • the addressing units may be transistors.
  • the memristor (348) may share a one transistor-one memristor (1T1M) addressing structure with the addressing units of the integrated circuit.
  • the memristor array (240) may be used to store any type of data. Examples of data that may be stored in the memristor array (240) include fluid supply specific data and/or fluid identification data, fluid characterization data, fluid usage data, printhead (116) specific data, printhead (116) identification data, warranty data, printhead (116) characterization data, printhead (116) usage data, authentication data, security data, Arrti- Counterfeiting data (ACF), ink drop weight, firing frequency, initial printing position, acceleration information, and gyro information, among other forms of data. In a number of examples, the memristor array (240) is written at the time of manufacturing and/or during the operation of the printer cartridge (114).
  • the printer cartridge (1 14) may be coupled to a controller (106) that is disposed within the printer (Fig. 1, 104).
  • the controller (106) receives a control signal from an external computing device (Fig. 1, 102).
  • the controller (106) may be an application-specific integrated circuit (ASIC) found on the printer (Fig. 1, 104).
  • a computing device (Fig. 1,
  • the controller (102) may send a print job to the printer cartridge (1 14), the print job being made up of text, images, or combinations thereof to be printed.
  • the controller (106) may facilitate storing information to the memristor array (240). Specifically, the controller (106) may pass at least one control signal to the number of memristors (348).
  • the controller (106) may be coupled to the printhead (116), via a control line such as an identification line. Via the identification line, the controller (106) may change the resistance state of a number of memristors in the memristor array (240) to effectively store information to a memristor array (240).
  • the controller (106) may send data such as authentication data, security data, and print job data, in addition to other types of data to the printhead (1 16) to be stored on the memristor array (240).
  • the controller (106) may share a number of lines of communication with the printhead (116), such as data lines, clock lines, and fire lines.
  • lines of communication such as data lines, clock lines, and fire lines.
  • the different communication lines are indicated by a single arrow.
  • Fig. 4 is a cross-sectional view of a top electrode-enclosed memristor (348) according to one example of the principles described herein.
  • a memristor (348) is a non-volatile memory device that retains stored information even when not powered on.
  • the memristor (348) may selectively store data based on a resistance state of the memristor (348).
  • the memristor (348) may be in a low resistance state indicated by a "1," or a high resistance state indicated by a "0.”
  • the memristors (348) in a memristor array (Fig. 2, 240) may form a string of ones and zeroes that will store the aforementioned data. If an analog memristor (348) is used, there may be many different resistance states.
  • a memristor (348) has a metal-insulator-metal layered structure. More specifically, the memristor (348) may include a bottom electrode (450), a switching oxide (452), and a top electrode (454). As will be described in detail below, the memristor (348) may share a number of these components with other memristors (348), for example in a cross bar array as depicted in Figs. 5 and 6. In other examples, the memristor (348) may have distinct bottom electrodes (450), switching oxides (452), top electrodes (454), or combinations thereof in a one transistor-one memristor structure as depicted in Fig. 7.
  • the bottom electrode (450) may be an electrical connection between the memristor (348) and other components that may attach to the bottom electrode (450).
  • the bottom electrode (450) may Include a top surface and a bottom surface. Via the bottom surface, the bottom electrode (309) may be coupled to a data line, which bottom surface is opposite a top surface of the bottom electrode (450).
  • Examples of components that may attach to the bottom electrode (450) include a ground connection, a number of connection pads, a current regulator, a capacitor, a resistor, and metal traces, among other memristor array (Fig. 2, 240) components.
  • the top electrode (454) may also be coupled to different components.
  • the bottom electrode (450) may be formed such that a top surface of the bottom electrode (450) and a side surface of the bottom electrode (450) form a right angle profile as indicated by the dashed circle (456). As depicted in Fig. 4, in some examples, the distance between the bottom electrode (450) and the top electrode (454) at the right angle profile indicated by (456) might be less than the distance between 1) a side surface of the bottom electrode (450) and the top electrode (454), 2) a top surface of the bottom electrode (450) and the top electrode (454), or 3) combinations thereof. The right angle of the profile of the bottom electrode (450) may generate an enhanced electrical field at this point.
  • the enhanced electrical field increases the likelihood of a successful switching event of the memristor (348) through this point as less current is used during a switching event While specific reference is made to a right angle profile, any profile may be used that generates an enhanced electrical field.
  • the bottom electrode (450) may be formed of a metallic alloy or other material that facilitates passage of current throughout the bottom electrode (450).
  • the memristor (348) may also include a switching oxide (452) that is disposed on a top surface of the bottom electrode (450) and a number of side surfaces of the bottom electrode (450).
  • the switching oxide (452) may encompass ail surfaces of the bottom electrode (450) except a surface which receives a data line, or other electrical communication line.
  • the switching oxide (452) may encompass the entirety of a number of side surfaces.
  • the switching oxide (452) may cover more of the bottom electrode (450) than just the portion of the bottom electrode (450) that is in line with the top electrode (454).
  • the switching oxide (452) may be an insulator between the bottom electrode (450) and the top electrode (454). For example, in a first state, the switching oxide (452) may be insulating such that current does not readily pass from the bottom electrode (450) to the top electrode (454). Then, during a switching event, the switching oxide (452) may switch to a second state, becoming conductive. In a conductive state, the switching oxide (452) allows current to pass to the memristor (348), allowing the memristor (348) to change state and thereby store information.
  • the switching oxide (452) has a number of surfaces. More specifically, the switching oxide (452) has a top surface (458) and a number of side surfaces (460-1, 460-2). In some examples, the side surfaces (460-1, 460- 2) may be thinner than the top surface (458). While Fig. 4 depicts straight side surfaces (460-1, 460-2), the side surfaces (460) may be uneven, being thinner at the top near the top surface (458) and wider at the bottom near a bottom surface of the switching oxide (452).
  • a side surface (460) that is thinner than a top surface (458) may provide another surface, in addition to the right angle indicated by circle (456), wherein conducting filaments are more likely to form, which conducting filaments allow current to pass through the memristor (348).
  • a lower voltage may be used to "form'' the memristor (348) or to execute a switching event, a switching event referring to a process of changing the resistance state of the memristor (348).
  • the switching oxides (452) may have a thickness of between about, a few nanometers to a dozen nanometers.
  • the particular profile of the switching oxide (452) may be selected during the formation of the switching oxide (452), for example by altering a physical vapor deposition angle and rotation.
  • the switching oxides (452) may be formed by oxidizing the bottom electrode (450).
  • the switching oxides (452) may be formed by thermal oxidation, a process which exposes the bottom electrode (450) to oxidizing agents at elevated temperatures.
  • thermal oxidation processes include a furnace oxidation process, a rapid thermal process, a rapid thermal oxidation, and a rapid thermal annealing, among other oxidation processes.
  • the switching oxides (452) are formed by performing plasma oxidation, which exposes the bottom electrode (450) to oxygen plasma at controlled
  • the switching oxides (452) are formed through a physical vapor deposition process wherein atoms or molecules may be ejected from a target material to the bottom electrode (450). For example, a target material is bombarded with energetic particles. In response, atoms or molecules of the target material are dislodged and built up to form the switching oxides (452). While specific examples of switching oxide (452) formation processes have been given, other oxide forming processes are also possible.
  • the switching oxides (452) may be made of a metallic oxide.
  • switching oxide (452) materials include magnesium oxide, titanium oxide, zirconium oxide, hafnium oxide, vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, molybdenum oxide, tungsten oxide, manganese oxide, iron oxide, cobalt oxide, copper oxide, zinc oxide, aluminum oxide, gallium oxide, silicon oxide, germanium oxide, tin dioxide, bismuth oxide, nickel oxide, yttrium oxide, gadolinium oxide, and rhenium oxide, among other oxides.
  • the switching oxides (452) may be ternary and complex oxides such as silicon oxynitride.
  • the oxides presented may be formed using a number of different processes such as sputtering from an oxide target reactive sputtering from a metal target, atomic payer deposition (ALD), or oxidizing a deposited metal or alloy layer.
  • the memristor also includes a top electrode (454) disposed on at least a portion of a top surface (458) of the switching oxide (452) and a portion of a number of side surfaces (460) of the switching oxide (452).
  • a top electrode (454) disposed on at least a portion of a top surface (458) of the switching oxide (452) and a portion of a number of side surfaces (460) of the switching oxide (452).
  • the top electrode (454) may be disposed on a portion of a top surface (458) and a portion of a number of side surfaces (460) of the switching oxide (452).
  • the top electrode (454) may be disposed on the entire top surface (458) and the entirety of side surfaces (460) of the switching oxide (452).
  • the top electrode (454) may be an electrical connection between the memristor (348) and other components that may attach to the top electrode (454).
  • components that may attach to the top electrode (454) include a ground connection, a number of connection pads, a current regulator, a capacitor, a resistor, and metal traces, among other memristor array (Fig. 2, 240) components.
  • the top electrodes (454) may be formed from a metallic material such as tantalum or a tantalum-aluminum alloy, or other conducting material such as titanium, titanium nitride, copper, aluminum, and gold among other metallic materials.
  • the top electrode (454) may be formed by a metallic deposition process such as physical vapor deposition (PVD), in which a target material is vaporized, meaning atoms are dislodged from the surface of the target material. The atoms are then built up on a surface. More specifically, atoms of the target material may be built up on the surface of the switching oxide (452) to form the top electrode (454). While specific reference is made to PVD, other processes may be used to form the top electrode (454). Examples of such processes include a lift-off process and shadow masking deposition, among other processes.
  • the top electrode (454) may then be further altered via a number of processes including photolithography, lithography, and etching, among other surface altering processes.
  • a top electrode-enclosed memristor (348) as described herein may be beneficial by lowering a forming voltage of the memristor (348) and creating a simplified switching event More specifically, the memristor (348) as described in the present specification provides a greater surface area wherein current can be passed from the bottom electrode (450) to the top electrode (454).
  • the memristor (348) as described herein allows for a current to pass through a number of surfaces of the bottom electrode (450) through a number of surfaces (458, 460) of the switching oxide (452) as opposed to a purely linear current passage through a single surface of the bottom electrode (450) and the switching oxide (452).
  • the geometry of the switching oxide (452) which forms a shorter distance between the bottom electrode (450) and the top electrode (454) at a right angle profile (456) of the bottom electrode (450) allows for an enhanced electrical field.
  • This simplified switching process indicates an increased likelihood of a switching event taking place, which improves the reliability of the memristor (348) and increases the fabrication yield of memristors (348) that produce a switching event.
  • the manufacturing process of the memristor (348) as described herein alleviates the need for a chemical-mechanical polishing operation.
  • Fig. 5 is a diagram depicting a cross bar memristor array (240) according to one example of the principles described herein.
  • the memristor array (240) may be a cross bar array.
  • a first number of elements (562-1) may run in a first direction and a second number of elements (562*2) may run in a second direction, the second direction being perpendicular to the first direction.
  • the intersection of each of the first number of elements (562-1) and the second number of elements (562-2) may result in a node that defines a memristor (348).
  • one memristor (348) is identified with a reference number.
  • one of the first number of elements (562-1) and the second number of elements (562-2) may be the bottom electrode (Fig. 4, 450) and the other may be the top electrode (Fig. 4, 545).
  • a specific example of a memristor (348) in a cross bar array (240) is given as follows.
  • the first number of elements (562-1) may form the bottom electrode (Fig. 4, 450) of a memristor (348).
  • a switching oxide (Fig. 4, 452) material may then be deposited on the first number of elements (562-1) as described in connection with Fig. 4.
  • the second number of elements (562-2) may then be disposed on the first number of elements (562-
  • each memristor (348) along a particular element of the second number of elements (562-2) may share a top electrode (Fig. 4, 454).
  • a node being a memristor (348) may include a bottom electrode (Fig. 4, 450) from the first number of elements (562-1), a switching oxide (Fig. 4, 452) disposed on the bottom electrode (Fig. 4, 450), and a top electrode (Fig. 4, 454) from the second number of elements (562-2) disposed on the switching oxide (Fig. 4, 452).
  • Fig. 6 is a view of a top electrode-enclosed memristor (Fig. 3, 348) in a cross bar memristor array (Fig. 2, 240) according to one example of the principles described herein. More specifically, Fig. 6 depicts a single node of the cross bar memristor array (Fig. 2, 240), the node being a memristor (Fig. 3, 348) of the memristor array (Fig. 2, 240).
  • the memristor may include a bottom electrode (450).
  • the bottom electrode (450) may be formed from one of the first number of elements (Fig. 5, 562-1) or the second number of elements (Fig. 5, 562-2) and may be shared by a number of memristors (Fig. 3, 348). Put another way, a number of nodes may be formed in part by the intersection of one of the first number of elements (Fig. 5, 562-1) and one of the second number of elements (Fig. 5, 562-2).
  • the bottom electrode (450) may be formed such that a right angle profile is formed on the bottom electrode (450).
  • the right angle profile may exhibit an enhanced electrical field which increases the likelihood of a switching event and lowers the voltage used to "form" the memristor (Fig. 3, 348).
  • the right angle profile may exhibit a reduced distance between the bottom electrode (450) and the top electrode (454).
  • the memristor may also include a switching oxide (452) that is disposed on a top surface of the bottom electrode (450) and a number of side surfaces of the bottom electrode (450). Disposing the switching oxide (452) on a number of side surfaces may be beneficial by providing a greater surface area, and more directions, though which current may pass. For example, as opposed to passing current though a top surface of the bottom electrode (450) in a unkiirectionai fashion, the current may be passed through the top surface and the side surfaces of the bottom electrode (450) to the switching oxide (452).
  • the switching oxide (452) may be thinner along the side surfaces as compared to the top surface such that current is passed more easily through the number of side surfaces again improving the reliability of the memristor (Fig. 3, 348) as well as lowering the forming voltage of the memristor (Fig. 3, 348).
  • the memristor (Fig. 3, 348) also includes a top electrode (454) through which a current is passed from the switching oxide (452).
  • a bottom surface of the top electrode (454) may be disposed on, and in contact with the switching oxide (452).
  • the top electrode (454) may be disposed on a portion of the top surface and a portion of a number of side surfaces of the switching oxide (452). Disposing the top electrode (454) on a number of side surfaces may be beneficial by providing a greater surface area, and more directions, though which current may pass.
  • the current may be passed through the top surface and the side surfaces of the switching oxide (452) to the top electrode (454).
  • Fig. 7 is a view of top electrode- enclosed memristor (348) in a one transistor-one memristor structure according to one example of the principles described herein. More specifically, Fig. 7 depicts a top electrode- enclosed memristor (348) that forms a one-to-one addressing structure with an integrated circuit.
  • an integrated circuit may include a number of addressing units. Each addressing unit may include a number of components that allow for multiplexing and logic operations.
  • the memristor (348) may be designed to be individually addressed by a distinct addressing unit. In some examples, the addressing units may be transistors.
  • the memristor (348) may share a one transistor-one memristor (1T1M) addressing structure with the addressing units of the integrated circuit.
  • the memristor (348) may include a bottom electrode (450) that is encompassed on all side surfaces and the top surface by the switching oxide (452).
  • a bottom surface of the bottom electrode (450) may be flush with a bottom surface of the switching oxide (452).
  • the switching oxide (452) may be encompassed on all side surfaces and the top surface by the top electrode (454).
  • a bottom surface of the top electrode (454) may be flush with a bottom surface of the switching oxide (452) and a bottom surface of the bottom electrode (450).
  • a printer cartridge (Fig. 1, 114) and printhead (Fig. 1, 116) with a number of top electrode-enclosed memristors (Fig. 3, 348) may have a number of advantages, including lowering a forming voltage of a memristor (Fig. 3, 348) by facilitating switching at a weak point within the memristor (Fig. 3, 348) and increasing the fabrication yield by reducing malfunctioning bits by implementing an easier switching mechanism. Additional advantages include simplifying manufacturing processes, increasing storage capacity of memory used on a printhead (Fig. 1, 116), improving printhead (Fig. 1, 116) memory performance, reducing cost of effective memristor (Fig. 3, 348) fabrication.
  • the computer usable program code may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the computer usable program code, when executed via, for example, the processor (Fig. 1, 108) of the printer (Fig. 1, 104) or other programmable data processing apparatus, implement the functions or acts specified in the flowchart and/or block diagram block or blocks.
  • the computer usable program code may be embodied within a computer readable storage medium; the computer readable storage medium being part of the computer program product.
  • the computer readable storage medium is a non-transitory computer readable medium.

Abstract

L'invention concerne une tête d'impression avec un certain nombre de memristances fermées par une électrode supérieure. La tête d'impression comprend un certain nombre de buses destinées à déposer une quantité de fluide sur un support d'impression. Chaque buse comprend une chambre de combustion destinée à contenir la quantité de fluide, une ouverture destinée à distribuer la quantité de fluide sur le support d'impression et un éjecteur destiné à éjecter la quantité de fluide à travers l'ouverture. La tête d'impression comprend également un certain nombre de memristances. Chaque memristance comprend une électrode inférieure, un oxyde de commutation disposé sur une surface supérieure de l'électrode inférieure et un certain nombre de surfaces latérales de l'électrode inférieure, et une électrode supérieure disposée sur une partie d'une surface supérieure de l'oxyde de commutation et sur une partie d'un certain nombre de surfaces latérales de l'oxyde de commutation.
PCT/US2014/048297 2014-07-25 2014-07-25 Tête d'impression ayant un certain nombre de memristances fermées par une électrode supérieure WO2016014087A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020106288A1 (fr) * 2018-11-21 2020-05-28 Hewlett-Packard Development Company, L.P. Puces fluidiques avec trajets de transmission ayant des capacités parasites correspondantes

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090244132A1 (en) * 2008-04-01 2009-10-01 Kevin Bruce Fluid Ejection Device
US20090284558A1 (en) * 2005-12-23 2009-11-19 Telecom Italia S.P.A Inkjet printhead and a method of inkjet printing
US20110310181A1 (en) * 2009-03-31 2011-12-22 Hewlett-Packard Development Company, L.P. Inkjet pen/printhead with shipping fluid
US8325507B2 (en) * 2010-09-29 2012-12-04 Hewlett-Packard Development Company, L.P. Memristors with an electrode metal reservoir for dopants
US20130106930A1 (en) * 2011-10-27 2013-05-02 Perry V. Lea Printhead assembly including memory elements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090284558A1 (en) * 2005-12-23 2009-11-19 Telecom Italia S.P.A Inkjet printhead and a method of inkjet printing
US20090244132A1 (en) * 2008-04-01 2009-10-01 Kevin Bruce Fluid Ejection Device
US20110310181A1 (en) * 2009-03-31 2011-12-22 Hewlett-Packard Development Company, L.P. Inkjet pen/printhead with shipping fluid
US8325507B2 (en) * 2010-09-29 2012-12-04 Hewlett-Packard Development Company, L.P. Memristors with an electrode metal reservoir for dopants
US20130106930A1 (en) * 2011-10-27 2013-05-02 Perry V. Lea Printhead assembly including memory elements

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020106288A1 (fr) * 2018-11-21 2020-05-28 Hewlett-Packard Development Company, L.P. Puces fluidiques avec trajets de transmission ayant des capacités parasites correspondantes
CN112638652A (zh) * 2018-11-21 2021-04-09 惠普发展公司，有限责任合伙企业 带有具有相应寄生电容的传输路径的流体模
CN112638652B (zh) * 2018-11-21 2022-04-29 惠普发展公司，有限责任合伙企业 带有具有相应寄生电容的传输路径的流体模
US11383516B2 (en) 2018-11-21 2022-07-12 Hewlett-Packard Development Company, L.P. Fluidic dies with transmission paths having corresponding parasitic capacitances

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