Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
  • C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
  • C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
  • C03C17/23—Oxides
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
  • C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
  • C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
  • C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
  • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
  • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
  • C03C17/3657—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having optical properties
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
  • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/02—Diffusing elements; Afocal elements
  • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
  • G02B5/0236—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element
  • G02B5/0247—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element by means of voids or pores
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/02—Diffusing elements; Afocal elements
  • G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/02—Diffusing elements; Afocal elements
  • G02B5/0273—Diffusing elements; Afocal elements characterized by the use
  • G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/02—Details
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
  • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/85—Arrangements for extracting light from the devices
  • H10K50/854—Arrangements for extracting light from the devices comprising scattering means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
  • H10K77/10—Substrates, e.g. flexible substrates
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/40—Coatings comprising at least one inhomogeneous layer
  • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
  • C03C2217/44—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the composition of the continuous phase
  • C03C2217/45—Inorganic continuous phases
  • C03C2217/452—Glass
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/40—Coatings comprising at least one inhomogeneous layer
  • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
  • C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
  • C03C2217/48—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase having a specific function
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/70—Properties of coatings
  • C03C2217/73—Anti-reflective coatings with specific characteristics
  • C03C2217/734—Anti-reflective coatings with specific characteristics comprising an alternation of high and low refractive indexes
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/90—Other aspects of coatings
  • C03C2217/91—Coatings containing at least one layer having a composition gradient through its thickness
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/90—Other aspects of coatings
  • C03C2217/94—Transparent conductive oxide layers [TCO] being part of a multilayer coating
  • C03C2217/948—Layers comprising indium tin oxide [ITO]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/549—Organic PV cells

Definitions

• the present invention is drawn to a new method for producing translucent, light-scattering glass substrates for organic light emitting diodes (OLEDs) and to substrates obtainable by such a method.
• OLEDs are opto-electronic elements comprising a stack of organic layers with fluorescent or phosphorescent dyes sandwiched between two electrodes, at least one of which is translucent. When a voltage is applied to the electrodes the electrons injected from the cathode and the holes injected from the anode combine within the organic layers, resulting in light emission from the fluorescent/phosphorescent layers.
• Such light scattering layers have a transparent matrix with a high refractive index close to the TCL refractive index and contain a plurality of light scattering elements having a refractive index different from that of the matrix.
• Such high index matrices are commonly obtained by fusing a high index glass frit thereby obtaining thin high index enamel layers on low index glass substrates.
• the light scattering elements may be solid particles added to the glass frit before the fusing step, crystals formed during the fusing step or air bubbles formed during the fusing step. It is also known to increase out-coupling of light by texturing the interface, i.e. creating a relief at the interface between the glass and the high index layers of the OLED, for example by etching or lapping of the low index transparent substrate before applying and fusing a high index glass frit.
• I EL internal extraction layers
• EEL External extraction layers
• the present invention is in the field of internal extraction layers (IEL) having a transparent high index glass matrix containing air bubbles as low index diffusing elements.
• IEL internal extraction layers
• Such IEL with light diffusing air bubbles are advantageous over similar IEL with solid particles because there is no risk of large sized particles protruding from the matrix and generating short-circuits and/or inter-electrode leakage currents in the final OLED product.
• EP 2 178 343 B1 discloses a translucent glass substrate for OLEDs with an internal extraction layer (scattering layer) comprising a high index glass matrix and air bubble scattering elements.
• the surface of the scattering layer is free of surface defects due to open air bubble craters (see [0026] to [0028], and Fig 55).
• a thorough analysis of this document and in particular of [0202] shows however that this result is simply an artifact due to an inappropriate method of counting the scattering elements in the lower surface layers.
• the Applicant surprisingly found that a high number of individual air bubbles formed in the lower layer of a melting high index frit, sticking to the underlying glass substrate essentially without rising to the surface, when the glass frit was applied and fused not directly in contact with the glass substrate but on a thin metal oxide layer coated onto said glass surface beforehand.
• the subject-matter of the present application is a method for preparing a laminate substrate for a light emitting device, comprising at least the following four steps:
• Another subject-matter of the present application is a laminate substrate obtainable by the above method, said laminate comprising
• a plurality of spherical voids are embedded in the high index enamel layer near the interface of the enamel layer with the underlying glass substrate, at least 95 %, preferably at least 99 %, and more preferably essentially all of the spherical voids having a diameter significantly smaller than the half-thickness of the enamel layer and being located in the lower half of the high index enamel layer near the interface with the underlying glass substrate.
• the glass substrate provided in step (a) is a flat translucent or transparent substrate of mineral glass, for example soda lime glass, generally having a thickness of between 0.1 and 5 mm, preferably of between 0.3 and 1 .6 mm.
• Its light transmission ISO9050 standard, illuminant D65 (TLD) such as defined by ISO/IEC 10526 standard in considering the standard colorimetric observer CIE 1931 as defined by the ISO / IEC 10527
• TLD illuminant D65
• a thin layer of a metal oxide is coated by any suitable method onto one side of the flat glass substrate, preferably by reactive or non-reactive magnetron sputtering, atomic layer deposition (ALD) or sol-gel wet coating.
• Said metal oxide layer may cover the whole surface of one side of the glass substrate.
• only part of the surface of the substrate is coated with the metal oxide layer. It could be particularly interesting to coat the substrate with a patterned metal oxide layer in order to prepare a final laminate substrate with a non-uniform extraction pattern.
• the Applicant thinks that the light scattering spherical voids are generated during the firing step (d) by reaction between the metal oxide and a component of the overlying high index glass frit.
• the specific nature of said reaction has not yet been fully elucidated. It is thought that 0 2 gas could evolve as a reaction product.
• the majority of the spherical voids are not just air bubbles entrapped in the glass frit during the fusion-solidification steps, such as described in EP 2 178 343 B1 , but gas bubbles generated during the firing step.
• the Applicant observed that the density of spherical voids is far higher in areas where the glass frit layer is coated onto the metal oxide layer than in areas where it is coated directly onto the bare glass substrate.
• the thickness of the metal oxide layer there is no specific limit to the thickness of the metal oxide layer as long as it provides enough reactive components for generating a significant amount of spherical voids in the lower half of the resulting enamel layer.
• a metal oxide layer of a few nanometers only has turned out to be able to trigger the formation of the desirable spherical voids.
• the metal oxide layer preferably has a thickness of between 5 and
• 80 nm more preferably of between 10 and 40 nm, and even more preferably of between 15 and 30 nm.
• the Applicant had experimentally shown that at least three metal oxides, i.e. Ti0 2 , Al 2 0 3 , Zr0 2 , led to formation of spherical voids near the glass frit interface.
• the skilled person without departing from the spirit of the present invention, may easily replace these metal oxides by different metal oxides such as, Nb 2 0 5 , Hf0 2 ,Ta 2 0 5 , W0 3 , Ga 2 0 3 , ln 2 0 3 and Sn0 2 , or mixtures thereof in order to complete the experimental work of the Applicant and find additional metal oxides suitable for use in the method of the present invention.
• the metal oxide consequently is preferably selected from the group consisting of Ti0 2 , Al 2 0 3 , Zr0 2 , Nb 2 0 5 , Hf0 2 , Ta 2 0 5 , W0 3 , Ga 2 0 3 , ln 2 0 3 , Sn0 2 , and mixtures thereof.
• the side of the glass substrate carrying the patterned or non- patterned thin metal oxide layer is then coated with a high index glass frit.
• the refractive index of said glass frit is preferably comprised between 1 .70 and 2.20, more preferably between 1 .80 and 2.10.
• the glass frit should be selected to have a melting point (Littleton point) comprised between 450 °C and 570 °C and should lead to an enamel having a refractive index of 1 .8 to 2.1 .
• Preferred glass frits have the following composition:
• the glass frit particles (70 - 80 wt%) are mixed with 20 - 30 wt% of an organic vehicle (ethyl cellulose and organic solvent).
• the resulting frit paste is then applied onto the metal oxide-coated glass substrate by screen printing or slot die coating.
• the resulting layer is dried by heating at a temperature of 120 - 200 °C.
• the organic binder ethyl cellulose
• the firing step i.e. the fusing of the high index glass frit, resulting in the final enamel is carried out at a temperature of between 530 °C and 620 °C, preferably between 540 °C and 600 °C.
• the resulting enamels have been shown to have a surface roughness with an arithmetical mean deviation R a (ISO 4287) of less than 3 nm when measured by AFM on an area of 10 ⁇ x 10 ⁇ .
• the amount of the high index glass frit coated onto the metal oxide layer is generally comprised between 20 and 200 g/m 2 , preferably between 25 and 150 g/m 2 , more preferably between 30 and 100 g/m 2 , and most preferably between 35 and 70 g/m 2 .
• the glass frit is heated to a temperature above the Littleton temperature of the glass frit, resulting in fusion of the glass frit, reaction of components of the glass frit with components of the underlying metal oxide, and formation of spherical voids in this reaction zone.
• the metal oxide layer is digested by the glass frit creating locally a glass frit with a slightly different composition. It is therefore impossible to specify the thickness of each of these two layers.
• the overall thickness of the solidified enamel layer hereafter called “high index enamel layer” comprising a plurality of spherical voids (scattering elements) embedded therein is preferably comprised between 3 ⁇ and 25 ⁇ , more preferably between 4 ⁇ and 20 ⁇ and most preferably between 5 ⁇ and 15 ⁇ .
• step (d) To efficiently hold the spherical voids near the bottom of the high index enamel layer and prevent them from rising to the surface, the firing temperature of step (d) however should not be excessively high and the duration of the firing step should not be excessively long.
• the duration of the firing step (d) is preferably comprised between 3 and 30 minutes, more preferably between 5 and 20 minutes.
• the high index glass frit used in the present invention and the enamel resulting therefrom should preferably be substantially devoid of solid scattering particles such as crystalline SiO 2 or TiO 2 particles. Such particles are commonly used as scattering elements in internal extraction layers but require an additional planarization layer, thereby undesirably increasing the total thickness of extraction layer.
• the spherical voids formed during the firing step are not randomly distributed throughout the thickness of the high index enamel layer but are located predominantly in the "lower" half, i.e. near the interface of said enamel layer with the underlying glass substrate.
• the spherical voids of course must be significantly smaller than the thickness of the enamel layer.
• At least 95 %, preferably at least 99 %, and more preferably essentially all of the spherical air voids have a diameter smaller than the half-thickness of the enamel layer and are located in the lower half of the high index enamel layer near the interface with the underlying glass substrate.
• the expression "located in the lower half of the high index enamel layer” means that at least 80 % of the void's volume is located below the median plane of the enamel layer.
• the spherical voids preferably have an average equivalent spherical diameter of between 0.2 ⁇ and 8 ⁇ , more preferably of between 0.4 ⁇ and 4 ⁇ , and most preferably of between 0.5 ⁇ and 3 ⁇ .
• the spherical voids are randomly distributed over the whole area corresponding to the surface of the glass substrate previously coated with the metal oxide layer.
• the density of the spherical voids preferably is comprised between 10 4 and 25.10 6 per mm 2 , more preferably between 10 5 and 5.10 6 per mm 2 .
• the spherical voids When viewed from a direction perpendicular to the general plane of the substrate (projection view), the spherical voids preferably occupy at least 20 %, more preferably at least 25 % of the surface and at most 80 % more preferably at most 70 % of the surface of the substrate previously covered by the metal oxide.
• the laminate substrate of the present invention is meant to be used as a translucent substrate for the production of bottom emitting OLEDs.
• a bottom emitting OLED comprises a translucent substrate carrying a translucent electrode, generally the anode, and a light reflecting electrode, generally the cathode. Light emitted from the stack of light-emitting organic layers is either emitted directly via the translucent anode and substrate or first reflected by the cathode towards and through the translucent anode and substrate.
• the laminate substrate of the present invention consequently further comprises a transparent electro- conductive layer on the high index enamel layer, this electro-conductive layer preferably being directly in contact with the enamel layer or being coated onto an intermediate layer, for example a barrier layer or protection layer.
• the method of the present invention therefore further comprises an additional step of coating a transparent electro-conductive layer (TCL) on the high index enamel layer.
• This layer preferably is a transparent conductive oxide such as ITO (indium tin oxide). Formation of such a TCL may be carried out according to conventional methods familiar to the skilled person, such as magnetron sputtering.
• Figure 1 is a flowchart showing the process of preparing the laminate substrate of the present invention
• Figure 2 is a Scanning Electronic Microscope (SEM) photograph showing a cross-sectional view of a laminate substrate according to the invention
• a flat transparent glass substrate 1 is first provided in step (a).
• a metal oxide layer 2 is then coated onto one side of this substrate by magnetron sputtering.
• a layer 3 of a high index glass frit is applied for example by screen printing a paste including the glass frit and an organic medium (polymer & organic solvent).
• the resulting substrate carrying the metal oxide layer 2 and glass paste layer 3 is then submitted in step (d) to a stepwise heating to first evaporate the organic solvent, then burn out the organic polymer and eventually fuse the glass frit powder to obtain a high index enamel layer 4.
• spherical voids 5 form at the bottom of the glass frit layer from reaction between the metal oxide and the glass frit.
• the spherical voids stick to the interface of the high index enamel 4 and do not rise to the surface of the enamel layer.
• a transparent electro-conducting layer 6 is then coated, in step (e), onto the smooth surface of the high index enamel 4.
• the dark grey glass substrate is covered by a lighter grey layer of high index enamel.
• a monolayer of spherical voids is completely embedded therein and located in contact with the interface between the glass substrate and the overlying enamel.
• the laminate substrate shown does not yet comprise a transparent electro- conducting layer.
• One can see that the surface of the high index enamel layer is perfectly smooth and free of crater-like surface irregularities.
• a 0.7 mm soda lime glass sheet was spin coated with a solution of a TiO 2 precursor.
• the coated glass sheet was then submitted for 10 minutes to a temperature of 150 °C for solvent evaporation and then for about 1 hour to a temperature of 400 °C to effect densification of the TiO 2 layer.
• the resulting TiO 2 -coated glass sheet was screen printed with a paste comprising 75 wt % of a high index glass frit (Bi 2 O3-B 2 O3-ZnO-SiO2) and 25 wt % of an organic medium (ethyl cellulose and organic solvent) and submitted to a drying step (10 minutes at 150 °C).
• a paste comprising 75 wt % of a high index glass frit (Bi 2 O3-B 2 O3-ZnO-SiO2) and 25 wt % of an organic medium (ethyl cellulose and organic solvent) and submitted to a drying step (10 minutes at 150 °C).
• the substrate was then fired for about 10 minutes at 570 °C resulting in a high index enamel layer (12 ⁇ ) containing a plurality of spherical voids.
• the mean size of the spherical voids and the coverage rate were measured by image analysis on three different samples with increasing Ti0 2 layer thickness.
• the below table shows the mean size of the spherical voids, the coverage rate, and the haze ratio of the resulting substrate for increasing amounts of Ti0 2 in comparison with a negative control made by coating of the high index glass frit directly on the soda lime glass.
• the high index enamel layer of the negative control was free of spherical voids located at the bottom of the enamel layer.
• Figure 3 shows a projection view (left) and a cross-sectional view (right) for each of the above examples 1 , 2 and 3 according to the present invention.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Geochemistry & Mineralogy (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Life Sciences & Earth Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Manufacturing & Machinery (AREA)
• Dispersion Chemistry (AREA)
• Composite Materials (AREA)
• General Physics & Mathematics (AREA)
• Glass Compositions (AREA)
• Electroluminescent Light Sources (AREA)
• Surface Treatment Of Glass (AREA)
• Laminated Bodies (AREA)

Priority Applications (5)

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• 2014
  • 2014-07-16 EP EP14177291.3A patent/EP2975008B1/en not_active Not-in-force
  • 2014-07-16 ES ES14177291.3T patent/ES2625733T3/es active Active
• 2015
  • 2015-06-23 RU RU2017104776A patent/RU2693123C2/ru active
  • 2015-06-23 CN CN201580038240.3A patent/CN106488893B/zh not_active Expired - Fee Related
  • 2015-06-23 WO PCT/EP2015/064157 patent/WO2016008685A1/en not_active Ceased
  • 2015-06-23 MY MYPI2017700108A patent/MY181429A/en unknown
  • 2015-06-23 US US15/326,311 patent/US10379269B2/en not_active Expired - Fee Related
  • 2015-06-23 JP JP2017501649A patent/JP6568197B2/ja not_active Expired - Fee Related
  • 2015-06-23 KR KR1020177000858A patent/KR20170031142A/ko not_active Ceased
  • 2015-06-29 TW TW104120951A patent/TWI666804B/zh not_active IP Right Cessation

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