WO2016002980A1

WO2016002980A1 - High-speed laser processing optical system and high-speed laser processing method using same

Info

Publication number: WO2016002980A1
Application number: PCT/KR2014/005798
Authority: WO
Inventors: 이천재; 임하나; 박훈
Original assignee: 주식회사 코윈디에스티
Priority date: 2014-06-30
Filing date: 2014-06-30
Publication date: 2016-01-07
Also published as: KR20160002468A

Abstract

The present invention relates to a high-speed laser processing optical system and a high-speed laser processing method using the same. A high-speed laser processing optical system according to an embodiment of the present invention comprises: a laser light source for irradiating a laser beam; a diffractive optical element for controlling at least one among the processing size, shape and distribution of the laser beam; a high-speed scanner which moves in a first direction and processes a processing member by irradiating the laser beam controlled by the diffractive optical element; and a stage which has the processing member mounted thereon and moves in a second direction different from the first direction.

Description

High speed laser processing optical system and high speed laser processing method using the same

Embodiments of the present invention relate to a high speed laser processing optical system and a high speed laser processing method using the same.

Recently, a technique of processing a workpiece using a laser optical system has been widely used.

1 is a view for explaining a laser processing method using a scanner according to the prior art.

As shown in FIG. 1, a conventional laser processing optical system includes a beam expander 120, an x-axis driving motor 130, an x-axis mirror 135, a y-axis driving motor 145, and a y-axis mirror ( 140, and a lens 150.

In the laser processing optical system according to the related art, the laser beam 110 is introduced through a beam expander 120, and the x-axis is driven by the x-axis driving motor 130. It is transmitted to the machining member 160 by the y-axis mirror 140 driven by the mirror 135 and the y-axis drive motor 145.

That is, the machining position on the machining member 160 is determined by controlling the x-axis mirror 135 and the y-axis mirror 140 using the x-axis driving motor 130 and the y-axis driving motor 145.

However, according to the prior art, the driving delay occurs due to the On / Off control of the laser and the movement of the position while the motor is moved to the machining position during the control and driving of the x-axis driving motor 130 and the y-axis driving motor 145. As a result, the processing speed was low, and it was difficult to secure a processing speed that could be applied to mass production.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and the present invention intends to implement high-speed machining by interlocking a high-speed scanner and a stage by dividing a plurality of beams according to a processing speed magnification using a diffractive optical element and controlling beam profiles and intensities. .

In addition, the present invention is to enable a plurality of laser beams branched from the diffractive optical element can be continuously processed in accordance with the driving of the stage in conjunction with the high-speed scanner.

In addition, the present invention enables a variety of processing with a single processing optical system for a variety of processing members such as solar cell wafers, Roy glass, semiconductors and display substrates, so that a large number of split beams at the time of processing a solar cell wafer It can be used for texturing without the use of hydrofluoric acid on the surface, and by realizing the line beam with diffractive optical elements and processing the glass surface at high speed through high-speed scanning elements, high-speed annealing effects can be achieved. It is possible to increase the energy efficiency by enabling the optical system for the line beam, and to improve the productivity through high-speed processing during patterning and marking of the semiconductor and display substrate.

The high speed laser processing optical system according to the present embodiment for solving the above problems includes a laser light source for irradiating a laser beam; A diffractive optical element for controlling at least one of the processing size, shape, and distribution of the laser beam; A high speed scanner moving in a first direction and processing a laser beam by controlling the laser beam controlled by the diffractive optical element; And a stage on which the processing member is mounted to move in a second direction different from the first direction.

According to another embodiment of the present invention, the diffractive optical element is a liquid crystal on silicon (LCoS), deformable mirror (DM), digital mirror divice (DMD), diffractive optical elements (DOE) and acoustic optic difflactor (AOD) It can be configured as either.

According to another embodiment of the present invention, the diffractive optical element may control the laser beam to form a line laser beam in which the laser beam is divided into a plurality and arranged.

According to another embodiment of the present invention, the diffractive optical element may arrange the plurality of laser beams at a predetermined interval or a predetermined interval of a user.

According to another embodiment of the present invention, the diffractive optical element varies the phase and the amplification value of the laser beam, the number, shape, number of focal length and focal length of the laser beam, At least one of the shape and the position may be controlled.

According to another embodiment of the present invention, the high speed scanner may include a high speed driving unit for rotating the mirror at high speed, and may process the laser beam reflected from the mirror by irradiating the processing member.

According to another embodiment of the present invention, the first direction and the second direction may be perpendicular to each other.

According to another embodiment of the present invention, a computer terminal for controlling the laser light source, the diffractive optical element, the stage and the high-speed scanner; may further include.

According to another embodiment of the present invention, a shock mitigation device for mitigating heat and physical shock generated when a laser beam is applied to the diffractive optical element; may further include.

A high speed laser processing method using a high speed laser processing optical system according to an embodiment of the present invention includes a first step of irradiating a laser beam with a laser light source; A second step of diffractive optical elements controlling at least one of the processing size, shape and distribution of the laser beam; A third step of moving a high speed scanner in a first direction and irradiating the laser beam controlled by the diffractive optical element to process a machining member; And a fourth step in which the stage is mounted with the processing member and moved in a second direction different from the first direction.

According to another embodiment of the present invention, in the second step, the diffractive optical element may control the laser beam to form a line laser beam in which the laser beam is divided into a plurality of arrays.

According to another embodiment of the present invention, in the second step, the diffractive optical element may arrange the plurality of laser beams at regular intervals.

According to another embodiment of the present invention, in the second step, the diffractive optical element may control at least one of the number, shape, shape, and position of the laser beam by varying a phase and an amplification value of the laser beam. Can be.

According to another embodiment of the present invention, the second step may further include the step of mitigating the heat and physical shock generated when the laser beam is applied to the diffractive optical element by the impact mitigating device.

According to an exemplary embodiment of the present invention, a plurality of beams may be divided according to a processing speed magnification by using a diffractive optical element, and the beam profile and intensity may be controlled to implement high speed processing by interlocking a high speed scanner and a stage.

In addition, according to the embodiment of the present invention, since a plurality of laser beams branched from the diffractive optical element can be continuously processed in accordance with the driving of the stage linked with the high speed scanner, the moving speed of the high speed scanner and the number of branches of the laser beam can be improved. Multiplying speed can be improved.

In addition, according to an embodiment of the present invention, various processing members such as solar cell wafers, Roy glass, semiconductors and display substrates can be variously processed by one processing optical system, so that a plurality of divisions can be performed during processing of the solar cell wafers. By driving the beam at high speed to enable texturing without the use of hydrofluoric acid on the surface, and by implementing a line beam with diffractive optical elements and processing the glass surface at high speed through a high speed scanning device, high speed annealing By enabling the effect without expensive optical system for line beam, it is possible to improve energy efficiency and improve productivity through high-speed processing during patterning and marking processing of semiconductor and display substrate.

2 is a block diagram of a high speed laser processing optical system according to an embodiment of the present invention.

3 is a flowchart illustrating a laser processing method using a diffraction optical system according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention. However, in describing the embodiments, when it is determined that detailed descriptions of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted. In addition, the size of each component in the drawings may be exaggerated for description, it does not mean the size that is actually applied.

Referring to Figure 2 will be described the configuration of a high speed laser processing optical system according to an embodiment of the present invention.

As shown in FIG. 2, a high speed laser processing optical system according to an embodiment of the present invention includes a laser light source 210, a diffractive optical element 220, a high speed scanner 230, a stage 240 and a computer. It is configured to include a terminal 250.

The computer terminal 250 may control the laser light source 210, the diffractive optical element 220, the high speed scanner 230, and the stage 240.

The laser light source 210 irradiates a laser beam, and under the control of the computer terminal 250, the diffractive optical element 220 is at least one of the processing size, shape, and distribution of the laser beam emitted from the laser light source 210. To control.

In this case, the diffractive optical element 220 may be configured of any one of a liquid crystal on silicon (LCoS), a deformable mirror (DM), a digital mirror divice (DMD), a diffractive optical element (DOE), and an acoustic optic difflactor (AOD). have.

For example, when LCoS (Liquid Crystal on Silicon) is used as the diffractive optical element 220, the intensity of output light can be controlled by modulating the phase of incident light, and the DM (Deformable mirror) is used as the diffractive optical element 220. In the case of using, a piezo motor capable of controlling the phase and amplitude of the laser beam, a material capable of changing the phase and amplitude according to a voltage or a control factor may be included in the lower portion of the reflective material to change the shape of incident light.

In addition, the diffractive optical element may transmit the incident laser to the next optical element in the form of reflection or transmission of phase and amplitude.

Accordingly, the diffractive optical element 220 varies the phase and amplification values of the laser beam, so that at least one of the number, shape, shape, and position of the laser beam, the focal length, and the focal point is at least. Either one can be controlled.

More specifically, the diffractive optical element 220 may control the laser beam to divide the laser beam into a plurality of pieces, and arrange the divided laser beams in a line, wherein the plurality of laser beams are designated by a user. Can be arranged at intervals or at regular intervals.

In addition, the diffractive optical element may generate a diffraction of the laser beam at a predetermined angle to divide the beam into a plurality of pieces, and control the phase and amplitude to uniformly control the intensity of each divided beam.

On the other hand, the diffractive optical element may control the phase to make a plurality of focal values of the beam.

On the other hand, the shape and shape of the laser beam can be determined according to the machining process (Spot, Line, Scribing, Cutting).

In addition, according to an embodiment of the present invention may further include a shock absorbing device 225.

The impact mitigation device 225 may mitigate heat and physical shock generated when a laser beam is applied to the diffractive optical element 220.

The high speed scanner 230 irradiates the laser beam controlled by the diffractive optical element 220.

In this case, the high-speed scanner 230 moves in the first direction A and may process the processing member 241 by irradiating the laser beam controlled by the diffractive optical element 220, and processing the processing member 241 may include a solar cell wafer, Roy glass, a semiconductor and a display substrate.

In addition, the high speed scanner 230 may include a high speed driver that rotates the mirror at high speed, and may be configured to irradiate and process the laser beam reflected from the mirror to the processing member 241.

Accordingly, the laser beam 215 is divided into a plurality of diffractive optical elements 220 and arranged in a row at regular intervals, and the high speed scanner 230 irradiates the arranged laser beam 215 through the lens 235. The processing member 241 may be processed, wherein the lens 235 may be composed of an optical element for focusing a laser beam on the processing member from a telecentric, f-theta lens or other scanner.

The stage 240 mounts the processing member 241 and may move in the second direction B. FIG. In this case, the second direction B is a direction different from the first direction A, which is a moving direction of the high speed scanner 230, and more specifically, the second direction B is in the first direction A. FIG. It may correspond to a vertical direction with respect to.

Therefore, according to the present invention, by using the diffractive optical element 220, a plurality of beams are divided according to the processing speed magnification, and the beam profile and the intensity are controlled to implement the high speed machining by interlocking the high speed scanner 230 and the stage 240. have.

More specifically, according to the present invention, since a plurality of laser beams branched from the diffractive optical element 220 may be continuously processed in accordance with the driving of the stage 240 interlocked with the high speed scanner 230, the high speed scanner 230 may be used. The processing speed can be improved by multiplying the moving speed by and the number of branches of the laser beam, and the size restriction of the processing member can be eliminated by providing a plurality of diffractive optical elements and a high speed scanner as necessary.

In addition, according to the present invention, it is possible to process a variety of processing members such as solar cell wafers, Roy glass, semiconductors and display substrates, the surface processing at a high speed during the processing of the solar cell wafer texturing without the use of hydrofluoric acid (texturing) It is possible to improve the energy efficiency by implementing the line beam without implementing the expensive line beam optical system at the time of annealing during the processing of the roy glass, and high-speed processing during the patterning and marking of the processing of semiconductor and display substrate It is possible to improve productivity through.

Referring to Figure 3 will be described a laser processing method using a diffractive optical system according to an embodiment of the present invention.

First, the laser light source irradiates a laser beam (S410).

In this case, the user may control the laser light source through a computer terminal to irradiate a laser beam.

Thereafter, the diffractive optical element controls at least one of the processing size, shape, and distribution of the laser beam (S420).

In this case, the diffractive optical element may control at least one of the number, shape, shape, and position of the laser beam by varying the phase and amplification value of the laser beam under the control of the computer terminal.

More specifically, the diffractive optical element may control the laser beam to divide the laser beam into a plurality, and arrange the divided laser beams in a row, wherein the plurality of laser beams may be arranged at regular intervals. have.

Further, in order to prevent damage to the device by energy of the laser beam applied to the diffractive optical element while the beam of the laser is incident on the diffractive optical element, a shock absorbing device is generated when the laser beam is applied to the diffractive optical element. Heat and physical shock can be alleviated.

Thereafter, the high speed scanner moves in the first direction, and the processing member is processed by irradiating the laser beam controlled by the diffractive optical element (S430).

That is, the high speed scanner may process the processing member by irradiating the laser beam controlled by the diffractive optical element while moving in the first direction.

Therefore, in the diffractive optical element, the laser beam is divided into a plurality and arranged in a row at regular intervals, and the high speed scanner can process the processed member by irradiating the arranged laser beam through a lens.

In addition, the stage on which the processing member is mounted can move in the second direction.

In this case, the second direction may be different from the first direction in which the high-speed scanner moves, and more specifically, the second direction may correspond to a direction perpendicular to the first direction.

Therefore, according to the present invention, a plurality of beams may be divided according to a processing speed magnification using a diffractive optical element, and a beam profile and an intensity may be controlled to implement a high speed machining by interlocking a high speed scanner and a stage.

In the detailed description of the invention as described above, specific embodiments have been described. However, many modifications are possible without departing from the scope of the invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

Claims

A laser light source for irradiating a laser beam;

A diffractive optical element for controlling at least one of the processing size, shape, and distribution of the laser beam;

A high speed scanner moving in a first direction and processing a laser beam by controlling the laser beam controlled by the diffractive optical element; And

A stage on which the processing member is mounted to move in a second direction different from the first direction;

High speed laser processing optical system comprising a.
The method according to claim 1,

The diffractive optical element,

High speed laser processing optics system: liquid crystal on silicon (LCoS), deformable mirror (DM), digital mirror divice (DMD), diffactive optical elements (DOE), and acoustic optic difflactor (AOD).
The method according to claim 1,

The diffractive optical element,

And controlling the laser beam to form a line laser beam which is arranged by dividing the laser beam into a plurality of laser beams.
The method according to claim 2,

The diffractive optical element,

A high speed laser processing optical system for arranging the plurality of laser beams at a user-specified or constant interval.
The method according to claim 1,

The diffractive optical element,

A high speed laser processing optical system for controlling at least one of the number of laser beams, the focal length and the number, shape, shape and position of the laser beam by varying the phase and amplification values of the laser beam. .
The method according to claim 1,

The high speed scanner,

And a high speed drive unit configured to rotate the mirror at a high speed, wherein the laser beam reflected from the mirror is irradiated to the processing member to process the laser beam.
The method according to claim 1,

The first direction and the second direction,

High-speed, vertical laser processing optical system.
The method according to claim 1,

A computer terminal for controlling the laser light source, the diffractive optical element, the stage, and the high speed scanner;

High speed laser processing optical system further comprising.
The method according to claim 1,

An impact mitigating device that mitigates heat and physical shock generated when a laser beam is applied to the diffractive optical element;

High speed laser processing optical system further comprising.
A first step of irradiating a laser beam with a laser light source;

A second step of diffractive optical elements controlling at least one of the processing size, shape and distribution of the laser beam;

A third step of moving a high speed scanner in a first direction and irradiating the laser beam controlled by the diffractive optical element to process a machining member; And

A fourth step in which the stage is mounted with the processing member and moved in a second direction different from the first direction;

High speed laser processing method using a high speed laser processing optical system comprising a.
The method according to claim 10,

The second step,

A high speed laser processing method using a high speed laser processing optical system, wherein the diffractive optical element controls the laser beam to form a line laser beam in which the laser beam is divided into a plurality.
The method according to claim 11,

The second step,

A high speed laser processing method using a high speed laser processing optical system in which the diffractive optical element arranges the plurality of laser beams at regular intervals.
The method according to claim 10,

The second step,

And a diffraction optical element varying a phase and an amplification value of the laser beam to control at least one of the number, shape, shape, and position of the laser beam.
The method according to claim 10,

The second step,

A shock mitigating device to alleviate heat and physical shock generated when a laser beam is applied to the diffractive optical element;

High speed laser processing method using a high speed laser processing optical system further comprising.