CN207534187U - laser drilling device - Google Patents
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- CN207534187U CN207534187U CN201721377880.XU CN201721377880U CN207534187U CN 207534187 U CN207534187 U CN 207534187U CN 201721377880 U CN201721377880 U CN 201721377880U CN 207534187 U CN207534187 U CN 207534187U
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Abstract
The utility model provides a kind of laser drilling device, includes at least：Laser emitting module sends out laser beam for edge perpendicular to the direction of workpiece to be processed；The laser beam received for receiving laser beam, and is divided into several beams and is divided light beam, and each light splitting light beam is horizontal-extending towards the surrounding of workpiece to be processed respectively by spectral module；Reflection and focus module, for receiving each light splitting light beam, and by each light splitting light beam along being reflected and being focused on perpendicular to the direction of workpiece to be processed, to form several laser points on workpiece to be processed；Drive module, for each laser point to be driven to carry out circle rotation around laser beam, to form several concentric circular scans lines on workpiece to be processed, so as to fulfill the punching of workpiece to be processed.The utility model only needs primary high speed circle rotation that can complete the scanning punching of multiple concentric circles simultaneously, substantially increases the efficiency of laser boring, while can realize and complete fast laser punching task, greatly improves production efficiency.
Description
Technical field
The utility model is related to laser drilling field, more particularly to a kind of laser drilling device.
Background technology
Laser drilling is generally divided into high-energy directly perforation and scan line cutting and boring, wherein, high-energy is directly worn
Hole applies in general to micro hole, and scan line cutting and boring can process bigger hole.
Chinese patent CN205733461U discloses a kind of scheme of laser light splitting, and it is direct that the program is mainly used in laser
Perforation, and can realize multiple micro holes while process, but the thinking that is distributed of its practical light path and solve the problems, such as cannot be real
The requirement of the processing request and edge cut width of existing different pore size.
Relative to the laser technology of large hole, currently in many cases using 2-D vibration mirror as basic scanning device,
Movement in two-dimensional plane is realized by the eyeglass of two swings, so as to fulfill circular motion.Although it can pass through interpolation
Operation realizes circular motion, but its sport efficiency is not high；Simultaneously because galvanometer be linear motion, be to circumference by short-term into
Row is fitted to realize, therefore the machining accuracy of its circumference cannot reach high-precision laser boring requirement.
Chinese patent CN101670492A discloses a kind of scheme of LED tri-laser-beam scribings, wherein using can be directly
It is divided into the optical element of three-beam, three-beam light beam being divided into approximately the same plane, and the plane by controlling three-beam
The cutting scribing requirement of one fixed width is realized with the angle of the direction of motion.It, should although the program can also realize laser boring
The light splitting technology scheme of scheme is different and has significant limitation, and quantity and the spacing of light splitting optical path are confined to optical element
The design of structure, and it can only separate limited light path quantity, it is impossible to meet the requirement of different workpieces laser boring technique.Together
If when the program in the two-dimensional working platform that uses for high-speed perforating operation, processing efficiency and processing quality are all paid no attention to very much
Think.
In practice in many cases, it in order to accurately control punching size, the precision of bore edges and easily excludes residual
Remaining material needs to cut a small width namely needs multiple parallel circular motion；Especially in processing fragile material
In the case of, it is necessary to a width is cut at the edge in hole, and needs to adjust cutting width according to the difference of thickness of workpiece
Section.Simultaneously in many cases, it is also necessary to multiple multiple scanning is carried out on same circumference.
Using the prior art, all there are above-mentioned shortcomings, and processing efficiency is low, and precision is not high.
Invention content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of laser drilling device,
For solving, laser drilling inefficiency, circumference precision in the prior art be not high and cutting width adjusts difficulty etc.
Problem.
In order to achieve the above objects and other related objects, the utility model provides a kind of laser drilling device, wherein, it is described
Laser drilling device includes at least：
Laser emitting module sends out laser beam for edge perpendicular to the direction of workpiece to be processed；
Spectral module is connected to the laser emitting module, for receiving the laser beam, and described in receiving
Laser beam is divided into several beam light splitting light beams, and each light splitting light beam is horizontal-extending towards the surrounding of the workpiece to be processed respectively；
Reflection and focus module, are connected to the spectral module, for receiving each light splitting light beam, and are divided light beam edge by each
It is reflected and is focused on perpendicular to the direction of the workpiece to be processed, to form several laser points on the workpiece to be processed；
Drive module is connected to the spectral module and the reflection and focus module, for driving each laser
Point carries out circle rotation around the laser beam, to form several concentric circular scans lines on the workpiece to be processed, so as to
Realize the punching of the workpiece to be processed.
Preferably, the laser emitting module includes at least：Laser and the beam expanding lens for being connected to the laser.
Preferably, the spectral module includes at least：The laser beam is placed perpendicular to around the laser beam
Several planes on several spectroscopes, wherein, each spectroscope is with uniform or non-uniform angular distribution in the laser light
Around beam.
Preferably, the reflection and focus module include at least：Several reflections being arranged in a one-to-one correspondence with each light splitting light beam
Mirror and several focus lamps being arranged in a one-to-one correspondence with each speculum.
Preferably, the reflection and focus module be by adjusting position and the angle of each speculum and each focus lamp respectively,
Each laser point is adjusted to the air line distance at the center of the workpiece to be processed, to meet what is punched needed for the workpiece to be processed
The spacing of circular diameter and several concentric circular scans lines.
Preferably, the air line distance at each laser point to the center of the workpiece to be processed is identical, part is identical or
It is entirely different.
Preferably, the drive module includes at least：Driving motor.
Preferably, the spacing between each concentric circular scans line is more than or equal to zero.
Preferably, the laser drilling device further includes：Movable platform for placing the workpiece to be processed, and adjusts
The distance between the workpiece to be processed and each laser point.
As described above, the laser drilling device of the utility model, has the advantages that：The utility model will be by that will swash
After light light beam is divided into several light splitting light beams and is reflected and focused on, several laser points are formed on workpiece to be processed, are then driven
It moves each laser point and carries out circle rotation around laser beam, it is only necessary to which primary high speed circle rotation can be realized in workpiece to be processed
The upper scanning punching for completing multiple concentric circles simultaneously, breaches the rate limitation of laser boring in the prior art, substantially increases
The efficiency of laser boring.Meanwhile the utility model is divided light beam quilt in the case of only beam of laser light beam by adjusting each
Reflection and the position focused on and angle, to adjust each laser point to the air line distance at the center of workpiece to be processed, so as to fulfill right
The adjustment of spacing and bore edges cutting width etc. between the different circular diameters of laser boring, each concentric circular scans line, can
It realizes and completes fast laser punching task, greatly improve production efficiency.
Description of the drawings
Fig. 1 is shown as the flow diagram of the laser boring method of the utility model first embodiment.
Fig. 2 is shown as the structural schematic block diagram of the laser drilling device of the utility model second embodiment.
Fig. 3 is shown as the structure diagram of the laser drilling device of the utility model third embodiment.
Component label instructions
10 laser emitting modules
11 lasers
12 beam expanding lens
13 laser beams
20 spectral modules
21 first spectroscopes
22 second spectroscopes
23 third spectroscopes
24 the 4th spectroscopes
30 reflections and focus module
31 first speculums
32 second speculums
33 third speculums
34 the 4th speculums
35 first focus lamps
36 second focus lamps
37 tertiary focusing mirrors
38 the 4th focus lamps
40 drive modules
50 workpieces to be processed
51 first scan lines
52 second scan lines
53 third scan lines
54 the 4th scan lines
60 movable platforms
S1~S4 steps
Specific embodiment
Illustrate the embodiment of the utility model below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints with answering
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Referring to Fig. 1, the first embodiment of the utility model is related to a kind of laser boring method.It should be noted that
Diagram provided in present embodiment only illustrates the basic conception of the utility model in a schematic way, is only shown and this in schema
Related component rather than component count, shape and size during according to actual implementation are drawn in utility model, during actual implementation
Kenel, quantity and the ratio of each component can be a kind of random change, and its assembly layout kenel may also be increasingly complex.
As shown in Figure 1, the laser boring method of present embodiment includes at least following steps：
Step S1 sends out laser beam along perpendicular to the direction of workpiece to be processed.
Laser beam is divided into several light splitting light beams, and each light splitting light beam is respectively towards the week of workpiece to be processed by step S2
It encloses horizontal-extending.
Step S3, by each light splitting light beam along being reflected and being focused on perpendicular to the direction of workpiece to be processed, with to be processed
Several laser points are formed on workpiece.
Step S4 drives each laser point to carry out circle rotation around laser beam, several to be formed on workpiece to be processed
Concentric circular scans line, so as to fulfill the punching of workpiece to be processed.
Wherein, in step s3, when forming each laser point, by adjusting each position for being divided light beam and being reflected and being focused on
And angle, to adjust each laser point to the air line distance at the center of workpiece to be processed, to meet what is punched needed for workpiece to be processed
The spacing of circular diameter and several concentric circular scans lines.
In the present embodiment, several concentric circular scans lines punched needed for workpiece to be processed, spacing between any two can
To be more than zero, zero can also be equal to.Also, the spacing between adjacent two concentric circular scans lines can be equal or differs.
In addition, in the present embodiment, the air line distance at the center of each laser point to workpiece to be processed is identical, part
It is identical or entirely different.Therefore, the adjacent two concentric circular scans lines obtained by two neighboring laser point circle rotation, circle
Diameter can it is identical, part is identical or entirely different.
In addition, in the present embodiment, when laser beam is divided into several light splitting light beams, by the way that several spectroscopes are enclosed
It is placed perpendicular to realize in several planes of laser beam around laser beam, wherein, each spectroscope is with uniform or uneven
Even angular distribution is around laser beam.Wherein, quantity and each concentric circles of spectroscopical transmitance according to light splitting light beam
The energy requirement of scan line is adjusted.Certainly, in other implementations, other modes can also be used to laser beam
It is divided, not using present embodiment as limitation.
In addition, in the present embodiment, by each light splitting light beam along perpendicular to the direction of workpiece to be processed carry out reflection and
During focusing, corresponding speculum is set, while after being reflected by a reflector by being divided in the light path of light beam in the every beam separated
Light splitting light beam light path on corresponding focus lamp is set, by adjusting the position and angle of speculum and focus lamp, to meet
The mutual range distribution of different circular diameters and several concentric circular scans lines of realization.Certainly, in other implementations,
Other modes may be used each light splitting light beam is reflected and focused on, not using present embodiment as limitation.
In addition, in the present embodiment, the quantity for being divided light beam will according to the width of practical laser drilling technology cutting line
The quantitative requirement of each concentric circular scans line of summing is configured.It is noted that the minimum number of light splitting light beam can be 1
Beam in the case where not needing to using multiple scanning lines, can close the light path of other light splitting light beams, light is divided only with 1 beam
Beam works；The maximum quantity for being divided light beam is set according to the concentric circular scans line quantitative requirement of laser boring technological requirement；
According to the characteristic of the wanted cutting material such as features such as hardness, thickness, it is sometimes desirable to a broader cutting width, in this situation
Under, it can realize broader split requirement by being circumferentially distributed more laser points (namely light splitting light beam).
In addition, in the present embodiment, the energy of laser beam is divided equally by each light splitting light beam, i.e. energy of laser beam etc.
In the energy of every beam light splitting light beam and the product of the quantity of light splitting light beam.To be divided the quantity of light beam for four beams, to divide per beam
Light light beam can convert 25% laser beam energy.Certainly, in other implementations, the energy of laser beam can root
It needing to be allocated in each light splitting optical path according to technique, that is to say, that the energy of laser beam can not be divided equally in each light splitting optical path,
The i.e. each laser beam energy that can convert of light splitting light beam can be different, can also part it is identical, such as intermediate line
The energy of use is higher than edge lines or vice versa, it is not limited to which the energy of laser beam is by each light splitting light beam in present embodiment
The method of salary distribution divided equally.
The laser boring method of present embodiment, by the way that laser beam is divided into several light splitting light beams and is reflected and is gathered
It is defocused, several laser points are formed on workpiece to be processed, each laser point are then driven to carry out circle rotation around laser beam, only
Primary high speed circle rotation is needed to can be realized on workpiece to be processed while completes the scanning punching of multiple concentric circles, is breached
The rate limitation of laser boring in the prior art substantially increases the efficiency of laser boring.
Further, the laser boring method of present embodiment, in the case of only beam of laser light beam, by adjusting
Each light splitting light beam is reflected and the position focused on and angle, come adjust each laser point to the center of workpiece to be processed straight line away from
From so as to fulfill the mutual spacing of different circular diameters, each concentric circular scans line to laser boring and bore edges cutting
The adjustment of width etc. can be realized and complete fast laser punching task, greatly improve production efficiency.
The step of various methods divide above, be intended merely to describe it is clear, when realization can be merged into a step or
Certain steps are split, are decomposed into multiple steps, as long as comprising identical logical relation, all in the protection domain of this patent
It is interior；To inessential modification is either added in algorithm in flow or introduces inessential design, but do not change its algorithm
Core design with flow is all in the protection domain of the patent.
Fig. 2 and Fig. 3 are please referred to, the utility model second embodiment is related to a kind of laser drilling device, includes at least：
Laser emitting module 10 sends out laser beam 13 for edge perpendicular to the direction of workpiece to be processed 50；
Spectral module 20 is connected to laser emitting module 10, for receiving laser beam 13, and the laser light that will be received
Beam 13 is divided into several beam light splitting light beams, and each light splitting light beam is horizontal-extending towards the surrounding of workpiece to be processed 50 respectively；
Reflection and focus module 30, are connected to spectral module 20, for receiving each light splitting light beam, and are divided light beam edge by each
It is reflected and is focused on perpendicular to the direction of workpiece to be processed 50, to form several laser points on workpiece to be processed 50；
Drive module 40 is connected to spectral module 20 and reflection and focus module 30, for driving each laser point
Circle rotation is carried out around laser beam 13, to form several concentric circular scans lines on workpiece to be processed 50, so as to fulfill treating
The punching of workpieces processing 50.
In the present embodiment, as shown in figure 3, laser emitting module 10 includes at least：It laser 11 and is connected to sharp
The beam expanding lens 12 of light device 11.Wherein, for launching initial laser, beam expanding lens 12 is used to expand initial laser laser 11
Beam, to form laser beam 13.
In the present embodiment, spectral module 20 includes at least：Laser beam is placed perpendicular to around laser beam 13
Several spectroscopes in 13 several planes, wherein, each spectroscope is with uniform or non-uniform angular distribution in laser beam
Around 13.By taking Fig. 3 as an example, spectral module 20 includes：First spectroscope 21, the second spectroscope 22, third spectroscope 23 and
Four spectroscopes 24, and they are placed perpendicular in four planes of laser beam 13 around laser beam 13 with uniform angle
Distribution.
In the present embodiment, reflection and focus module 30 include at least：If it is arranged in a one-to-one correspondence with each light splitting light beam
Dry speculum and several focus lamps being arranged in a one-to-one correspondence with each speculum.It should be noted that each speculum corresponds
It is arranged in the light path of each light splitting light beam, for each light splitting light beam edge to be reflected perpendicular to the direction of workpiece to be processed 50,
And focus lamp is arranged in a one-to-one correspondence in the light path of each light splitting light beam after being reflected by each speculum, for each after being reflected
Light splitting light beam is focused.By taking Fig. 3 as an example, reflection and focus module 30 include：The light splitting light separated with the first spectroscope 21
The second speculum that the first speculum 31 that beam is correspondingly arranged and the light splitting light beam that the second spectroscope 22 is separated are correspondingly arranged
32nd, the third speculum 33 and divide with the 4th spectroscope 24 that the light splitting light beam separated with third spectroscope 23 is correspondingly arranged
The 4th speculum 34 that the light splitting light beam gone out is correspondingly arranged, further includes：It is correspondingly arranged at point after being reflected by the first speculum 31
The first focus lamp 35 in the light path of light light beam, in the light path of light splitting light beam being correspondingly arranged at after being reflected by the second speculum 32
The second focus lamp 36, be correspondingly arranged at after being reflected by third speculum 33 light splitting light beam light path on tertiary focusing mirror 37
And it is correspondingly arranged at the 4th focus lamp 38 in the light path of the light splitting light beam after being reflected by the 4th speculum 34；Each light splitting light beam
Four laser points are formd on workpiece to be processed 50 after the reflection of each speculum and the focusing of each focus lamp.
Also, in the present embodiment, reflection and focus module 30 by adjusting each speculum and each focus lamp respectively
Position and angle, to adjust each laser point to the air line distance at the center of workpiece to be processed 50, to meet 50 institute of workpiece to be processed
The circular diameter and the spacing of several concentric circular scans lines that need to be punched.
In addition, in the present embodiment, the air line distance at each laser point to the center of workpiece to be processed 50 is identical, portion
Split-phase is same or entirely different.
In the present embodiment, drive module 40 includes at least：Driving motor.By taking Fig. 3 as an example, driving motor is (in figure not
Draw) by controlling four spectroscopes, four speculums and the rotation of four focus lamps, four laser points to be driven to surround laser
Light beam 13 carries out circle rotation, so as to form four concentric circular scans lines, i.e. the first scan line 51, the on workpiece to be processed 50
Two scan lines 52,53 and the 4th scan line 54 of third scan line.
In addition, in the present embodiment, the mutual spacing of each concentric circular scans line is more than or equal to zero.Need what is illustrated
It is that the mutual spacing of each concentric circular scans line can be zero, when the technological requirement for needing multiple scanning on the same circumference
Under, position and the angle of speculum are can adjust, all concentric circular scans lines are coincided together.
In addition, the laser drilling device of present embodiment further includes：Movable platform 60, for placing workpiece to be processed 50,
And adjust the distance between workpiece to be processed 50 and each laser point.By taking Fig. 3 as an example, movable platform 60 is set to bottom, passes through
Movable platform 60 is lifted to realize the lifting of workpiece to be processed 50.When carrying out laser boring for thicker material, pass through work
Moving platform 60 makes workpiece to be processed 50 move up and down, and changes the distance between workpiece to be processed 50 and each laser point, can realize
Multi-level laser boring is cut so as to fulfill the laser boring of thick material.Laser boring is being carried out for brittle transparent material
When, laser drilling operation can be started in the lower surface of material with permeable material, and pass through the relative motion of movable platform 60, realized
Through-hole operation is conducive to cut the exclusion of residue, improves drilling quality.
Laser beam is divided into several light splitting light beams by spectral module and passed through by the laser drilling device of present embodiment
After each light splitting light beam is reflected and focused on by reflection and focus module, several laser points are formed on workpiece to be processed, then
Each laser point is driven to carry out circle rotation around laser beam by drive module, it is only necessary to which primary high speed circle rotation can be real
The scanning punching of multiple concentric circles is completed on present workpiece to be processed simultaneously, breaches the speed limit of laser boring in the prior art
System substantially increases the efficiency of laser boring.
Further, the laser drilling device of present embodiment in the case of only beam of laser light beam, passes through reflection
It is reflected with each light splitting light beam of focus module adjustment and the position focused on and angle, workpiece to be processed is arrived to adjust each laser point
The air line distance at center, so as to fulfill the mutual spacing of different circular diameters, each concentric circular scans line to laser boring with
And the adjustment of bore edges cutting width etc., it can realize and complete fast laser punching task, greatly improve production efficiency.
It is not difficult to find that present embodiment be with the corresponding device embodiments of first embodiment, present embodiment can
It works in coordination implementation with first embodiment.The relevant technical details mentioned in first embodiment are in the present embodiment still
Effectively, in order to reduce repetition, which is not described herein again.Correspondingly, the relevant technical details mentioned in present embodiment can also be applied
In the first embodiment.
It is noted that each module involved in present embodiment is logic module, and in practical applications, one
A logic unit can be a part for a physical unit or a physical unit, can also be with multiple physics lists
The combination of member is realized.In addition, in order to protrude the innovative part of the utility model, it will not be with solving this reality in present embodiment
With it is novel proposed the technical issues of the less close unit of relationship introduce, but this does not indicate in present embodiment and it is not present
Its unit.
In conclusion the laser drilling device of the utility model, has the advantages that：The utility model will be by that will swash
After light light beam is divided into several light splitting light beams and is reflected and focused on, several laser points are formed on workpiece to be processed, are then driven
It moves each laser point and carries out circle rotation around laser beam, it is only necessary to which primary high speed circle rotation can be realized in workpiece to be processed
The upper scanning punching for completing multiple concentric circles simultaneously, breaches the rate limitation of laser boring in the prior art, substantially increases
The efficiency of laser boring.Meanwhile the utility model is divided light beam quilt in the case of only beam of laser light beam by adjusting each
Reflection and the position focused on and angle, to adjust each laser point to the air line distance at the center of workpiece to be processed, so as to fulfill right
The adjustment of spacing and bore edges cutting width etc. between the different circular diameters of laser boring, each concentric circular scans line, can
It realizes and completes fast laser punching task, greatly improve production efficiency.So the utility model effectively overcomes existing skill
Various shortcoming in art and have high industrial utilization.
The above embodiment is only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art all can under the spirit and scope without prejudice to the utility model, to the above embodiment into
Row modifications and changes.Therefore, such as those of ordinary skill in the art revealed without departing from the utility model
All equivalent modifications completed under spirit and technological thought or change, should be covered by the claim of the utility model.
Claims (9)
1. a kind of laser drilling device, which is characterized in that the laser drilling device includes at least：
Laser emitting module sends out laser beam for edge perpendicular to the direction of workpiece to be processed；
Spectral module is connected to the laser emitting module, for receiving the laser beam, and the laser that will be received
Light beam is divided into several beam light splitting light beams, and each light splitting light beam is horizontal-extending towards the surrounding of the workpiece to be processed respectively；
Reflection and focus module, are connected to the spectral module, for receiving each light splitting light beam, and by each light splitting light beam along vertically
It is reflected and is focused in the direction of the workpiece to be processed, to form several laser points on the workpiece to be processed；
Drive module is connected to the spectral module and the reflection and focus module, for each laser point to be driven to enclose
Circle rotation is carried out around the laser beam, to form several concentric circular scans lines on the workpiece to be processed, so as to fulfill
The punching of the workpiece to be processed.
2. laser drilling device according to claim 1, which is characterized in that the laser emitting module includes at least：Swash
Light device and the beam expanding lens for being connected to the laser.
3. laser drilling device according to claim 1, which is characterized in that the spectral module includes at least：Around institute
Several spectroscopes that laser beam is placed perpendicular in several planes of the laser beam are stated, wherein, each spectroscope is with equal
Even or non-uniform angular distribution is around the laser beam.
4. laser drilling device according to claim 1, which is characterized in that the reflection and focus module include at least：
Several speculums being arranged in a one-to-one correspondence with each light splitting light beam and several focus lamps being arranged in a one-to-one correspondence with each speculum.
5. laser drilling device according to claim 4, which is characterized in that the reflection and focus module by adjusting respectively
Position and the angle of whole each speculum and each focus lamp, come adjust each laser point to the center of the workpiece to be processed straight line away from
From to meet the spacing of the circular diameter punched needed for the workpiece to be processed and several concentric circular scans lines.
6. laser drilling device according to claim 5, which is characterized in that in each laser point to the workpiece to be processed
The air line distance of the heart is identical, part is identical or entirely different.
7. laser drilling device according to claim 1, which is characterized in that the drive module includes at least：Driving electricity
Machine.
8. according to claim 1~7 any one of them laser drilling device, which is characterized in that between each concentric circular scans line
Spacing be more than or equal to zero.
9. according to claim 1~7 any one of them laser drilling device, which is characterized in that the laser drilling device is also
Including：Movable platform, for placing the workpiece to be processed, and adjust between the workpiece to be processed and each laser point away from
From.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721377880.XU CN207534187U (en) | 2017-10-24 | 2017-10-24 | laser drilling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721377880.XU CN207534187U (en) | 2017-10-24 | 2017-10-24 | laser drilling device |
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| Publication Number | Publication Date |
|---|---|
| CN207534187U true CN207534187U (en) | 2018-06-26 |
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|---|---|---|---|
| CN201721377880.XU Active CN207534187U (en) | 2017-10-24 | 2017-10-24 | laser drilling device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107695544A (en) * | 2017-10-24 | 2018-02-16 | 袁卉 | Laser boring method and device |
| CN110539070A (en) * | 2019-10-14 | 2019-12-06 | 颀中科技（苏州）有限公司 | Laser processing method and laser processing apparatus |
-
2017
- 2017-10-24 CN CN201721377880.XU patent/CN207534187U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107695544A (en) * | 2017-10-24 | 2018-02-16 | 袁卉 | Laser boring method and device |
| CN110539070A (en) * | 2019-10-14 | 2019-12-06 | 颀中科技（苏州）有限公司 | Laser processing method and laser processing apparatus |
| WO2021073485A1 (en) * | 2019-10-14 | 2021-04-22 | 颀中科技（苏州）有限公司 | Laser processing method and laser processing device |
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