WO2015196673A1 - Pcb板及电子装置 - Google Patents

Pcb板及电子装置 Download PDF

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Publication number
WO2015196673A1
WO2015196673A1 PCT/CN2014/089432 CN2014089432W WO2015196673A1 WO 2015196673 A1 WO2015196673 A1 WO 2015196673A1 CN 2014089432 W CN2014089432 W CN 2014089432W WO 2015196673 A1 WO2015196673 A1 WO 2015196673A1
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WO
WIPO (PCT)
Prior art keywords
area
wiring layer
pcb board
layer
digital
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PCT/CN2014/089432
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English (en)
French (fr)
Inventor
吴月
任妍
王子锋
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/653,723 priority Critical patent/US9635752B2/en
Publication of WO2015196673A1 publication Critical patent/WO2015196673A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein

Definitions

  • the present disclosure relates to the field of circuits, and in particular to a PCB board and an electronic device that reduce electromagnetic interference.
  • PCB printed Circuit Board
  • Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, is the support of electronic components, is the carrier of electrical connection of electronic components. Because it is made by electronic printing, it is called a "printing" circuit board.
  • the division of the digital area and the analog area on the wiring layer of the conventional PCB board is only the division of the copper surface on the wiring layer of the PCB board, that is, the intersection of the digital area and the analog area, so that the copper of the two areas is kept constant. Insulation spacing. Add a few magnetic beads to connect the digital zone to the analog zone to provide a return path for the analog signal.
  • This division of the wiring layer of the conventional PCB board makes it difficult to control the division pitch, and the copper foil of the large area of the digital area and the analog area can be separated from each other by a short distance, or a large amount of electromagnetic interference can be generated from each other. Moreover, in the PCB Layout phase, it is possible to neglect to cross the split parts and traces, and the control is not strong.
  • the present disclosure provides a PCB board and an electronic device for reducing electromagnetic interference.
  • a PCB board comprising: a substrate and a wiring layer disposed on the substrate, the wiring layer includes a digital area and an analog area, and the digital area and the analog area are disposed in a gap.
  • the substrate is provided with a hole at the gap position, a digital area and a simulation area of the wiring layer Connected by magnetic beads.
  • the gap position is provided with a plurality of holes, and the magnetic beads are disposed between adjacent holes.
  • a capacitor is further connected to the digital area and the analog area on the wiring layer, and the capacitor is disposed between adjacent holes.
  • one of a magnetic bead and a capacitor is disposed between adjacent holes.
  • the wiring layer including a top wiring layer and a bottom wiring layer, wherein the ground layer and the power layer are disposed on the top wiring layer and the underlying wiring layer between.
  • the ground layer includes a first area corresponding to the digital area and a second area corresponding to the analog area
  • the power supply layer includes a third area corresponding to the digital area and a fourth area corresponding to the analog area
  • the area of the first zone is larger than the area of the third zone
  • the area of the second zone is larger than the area of the fourth zone.
  • the first region and the second region on the formation are provided with via holes penetrating the wiring layer, the ground layer, and the power layer near the gap position.
  • the distance between the power layer and the gap is greater than or equal to 0.5 mm, and the distance between the power layer and the boundary is greater than or equal to 0.5 mm.
  • the hole has a width greater than 1 mm and a length greater than 3 mm.
  • a distance between the digital region of the wiring layer and a gap of the dummy region is greater than or equal to 0.5 mm.
  • the present disclosure also provides an electronic device comprising the PCB board as described above.
  • the beneficial effects of the present disclosure are as follows: in this embodiment, holes are provided in the digital area and the analog area gap position of the PCB board wiring layer, and the magnetic beads are connected to maximize the digital signal and the analog signal from the physical segmentation.
  • the independent distribution increases the digital-to-analog spacing and is independent of each other, which greatly reduces the electromagnetic interference generated by digital-to-analog conversion, and fully guarantees the integrity and independence of digital signals and analog signals.
  • FIG. 1 is a schematic structural view of a PCB board according to an embodiment of the present disclosure
  • Figure 2 is a partial enlarged view of Figure 1;
  • FIG. 3 is a schematic structural diagram of a PCB board of the present disclosure.
  • the PCB board includes a top wiring layer 1, a ground layer 2, a power layer 3, and an underlying wiring layer 4.
  • the ground layer 2 and the power layer 3 are disposed in two. Between the wiring layers, the wiring layer, the ground layer, and the power supply layer are disposed on a substrate (not shown).
  • the PCB board of this embodiment is described by taking a four-layer structure as an example. Of course, it may also be two or more layers.
  • the disclosure is not limited. Among them, the top wiring layer and the bottom wiring layer are used for circuit wiring, and the power layer is mainly used for current circulation, and the ground layer is mainly ground property, and is used as a signal loop.
  • the power layer and the ground layer serve as reference layers for the top wiring layer and the underlying wiring layer, respectively.
  • the PCB board of this embodiment includes: a substrate and a wiring layer 1 disposed on the substrate, the wiring layer 1 including a digital area 11 and a dummy area 12, A gap is disposed between the digital area and the analog area, and the substrate is provided with a hole 13 at the gap position, and the digital area and the analog area of the wiring layer are connected by the magnetic beads 14.
  • a hole is arranged in the gap between the digital area and the analog section of the PCB board wiring layer, and is connected by the magnetic beads, so that the digital signal and the analog signal are maximally independently distributed on the basis of physical division, so that the number is The die spacing is increased and independent of each other, which greatly reduces the electromagnetic interference generated by digital-to-analog conversion, and fully guarantees the integrity and independence of digital signals and analog signals.
  • the wiring layer of this embodiment is provided with a plurality of holes 13 at the gap positions of the digital area and the analog area, and magnetic beads 14 are disposed between the adjacent holes to provide a return path for the analog signal.
  • the magnetic bead 14 of this embodiment has two connecting legs which are respectively connected to the digital area and the analog area of the wiring layer to realize the connection between the digital area and the analog area.
  • the embodiment further includes a capacitor connecting the digital area and the analog area on the wiring layer, the capacitor being disposed between adjacent holes.
  • a capacitor or a magnetic bead is disposed between adjacent holes, and a capacitor is used to implement filtering.
  • Capacitors can be set as needed, and can be one or more.
  • the ground layer of the embodiment includes a first area corresponding to the digital area and a second area corresponding to the analog area, and the power layer includes the digital area.
  • the area of the first zone is larger than the area of the third zone
  • the area of the second zone is larger than the area of the fourth zone.
  • the area corresponding to the digital area and the analog area is smaller than the area corresponding to the ground layer, so that the power supply layer forms a retracted structure, thereby effectively preventing EMI (electromagnetic) generation.
  • the power supply layer of the embodiment is 0.5 mm smaller than the ground layer, and can effectively prevent the segmentation from being too narrow and causing a short circuit. Of course, other suitable retractable sizes can be set as needed.
  • the hole of the present embodiment has a length H>3 mm and a width W>1 mm.
  • both sides of the PCB are hollowed out on the segmented edges.
  • the analog area and the digital area are divided from the physical process. Greatly reduces the area adjacent to the simulated copper and digital copper.
  • the signal and electromagnetic interference areas of the two areas are reduced as much as possible.
  • the distance S1 between the digital region of the wiring layer and the gap of the analog region of the present embodiment is greater than or equal to 0.5 mm
  • the distance S2 of the power supply layer from the gap is greater than or equal to 0.5 mm
  • the distance S3 of the power supply layer from the boundary is greater than or equal to 0.5 mm.
  • the ground layer of the embodiment also has a via hole penetrating the wiring layer, the ground layer and the power layer in the first region and the second region near the gap position, which is favorable for conducting the signal of the top wiring layer, the underlying wiring layer and the ground layer. .
  • the holes are evenly distributed at the edges of the analog partition and the digital partition, so that the analog and digital regions provide a timely return path, which blocks the formation of electromagnetic interference in time.
  • the present disclosure also provides an electronic device including any one of the above PCB boards.
  • the electronic device may be any product or component having electronic components such as a mobile phone, a television, a computer, a printer, an air conditioner, a refrigerator, a washing machine, a microwave oven, and the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种PCB板及电子装置，PCB板包括：一基板和设置在基板上的布线层（1），布线层包括数字区（11）和模拟区（12），数字区和模拟区间隙设置，基板在间隙位置设置有洞孔（13），布线层的数字区和模拟区通过磁珠（14）进行连接。

Description

PCB板及电子装置
相关申请的交叉引用
本申请主张在2014年6月26日在中国提交的中国专利申请号No.201420351013.9的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及电路领域，特别是涉及一种减少电磁干扰的PCB板及电子装置。
背景技术
PCB(Printed Circuit Board)，中文名称为印制电路板，又称印刷电路板、印刷线路板，是重要的电子部件，是电子元器件的支撑体，是电子元器件电气连接的载体。由于它是采用电子印刷术制作的，故被称为“印刷”电路板。
传统的PCB板的布线层上的数字区和模拟区的分割，仅仅是在PCB板的布线层上进行铜面的分区，即，将数字区和模拟区交汇边缘，使两区域的铜保持一定的绝缘间距。再添加几颗磁珠将数字区和模拟区连接起来，为模拟信号提供回流路径。
传统PCB板的布线层的这种分割方式，很难控制分割间距，并且，数字区和模拟区大面积的铜箔，仅仅依靠较短距离的绝缘分割，还是会相互产生大量的电磁干扰。而且，在PCB Layout阶段，有可能会疏忽跨分割部件和走线，控制力不强。
发明内容
为了解决现有PCB板的布线层进行模拟区和数字区分割时产生大量的电磁干扰，本公开提供了一种减少电磁干扰的PCB板及电子装置。
本公开采用的技术方案是：一种PCB板，包括：一基板和设置在所述基板上的布线层，所述布线层包括数字区和模拟区，所述数字区和模拟区间隙设置，所述基板在所述间隙位置设置有洞孔，所述布线层的数字区和模拟区 通过磁珠进行连接。
可选地，所述间隙位置设置有多个洞孔，所述磁珠设置在相邻的洞孔之间。
可选地，还包括一连接布线层上数字区和模拟区的电容，所述电容设置在相邻的洞孔之间。
可选地，相邻的洞孔之间设置有磁珠和电容中的其中一种。
可选地，还包括与布线层层叠设置的地层和电源层，所述布线层包括顶层布线层和底层布线层，所述地层和电源层设置在所述顶层布线层和所述底层布线层之间。
可选地，所述地层包括与数字区对应的第一区和与模拟区对应的第二区，所述电源层包括与数字区对应的第三区和与模拟区对应的第四区，所述第一区的面积大于第三区的面积，所述第二区的面积大于第四区的面积。
可选地，所述地层上的第一区和第二区在靠近间隙位置设置有贯穿布线层、地层和电源层的过孔。
可选地，所述电源层距离间隙的距离大于等于0.5mm，所述电源层距离边界的距离大于等于0.5mm。
可选地，所述洞孔的宽度大于1mm，长度大于3mm。
可选地，所述布线层的所述数字区和所述模拟区的间隙之间的距离大于等于0.5mm。
本公开还提供了一种电子装置，其包括如上任意所述的PCB板。
本公开的有益效果是：本实施例在PCB板布线层的数字区和模拟区间隙位置设置有洞孔，并通过磁珠进行连接，将数字信号与模拟信号从物理分割基础上做到最大限度的独立分布，使数模间距增加，并且相互独立，极大的降低了数模转换所产生的电磁干扰，充分保证数字信号与模拟信号的完整性，独立性。
附图说明
图1为本公开一种实施例的PCB板的结构示意图；
图2为图1的局部放大图；
图3为本公开PCB板的具体结构示意图。
具体实施方式
为使本公开要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
如图1所示，为本公开一种实施例的PCB板的结构示意图，该PCB板包括顶层布线层1、地层2、电源层3和底层布线层4，地层2和电源层3设置在两个布线层之间，布线层、地层、电源层设置在基板(图中未示出)上。本实施例的PCB板以四层结构为例进行说明，当然还可以是两层或者多层，在此，本公开不进行限制。其中，顶层布线层和底层布线层进行电路的布线，电源层主要用作电流的流通，地层主要是接地属性，用作信号回路。电源层和地层分别作为顶层布线层和底层布线层的参考层。
如图2所示，为图1的局部放大图，该实施例的PCB板包括：一基板和设置在所述基板上的布线层1，所述布线层1包括数字区11和模拟区12，所述数字区和模拟区之间设置间隙，所述基板在所述间隙位置设置有洞孔13，所述布线层的数字区和模拟区通过磁珠14进行连接。
本实施例在PCB板布线层的数字区和模拟区间的隙位置设置有洞孔，并通过磁珠进行连接，将数字信号与模拟信号在物理分割基础上做到最大限度的独立分布，使数模间距增加，并且相互独立，极大的降低了数模转换所产生的电磁干扰，充分保证数字信号与模拟信号的完整性，独立性。
本实施例的布线层在数字区和模拟区的间隙位置设置有多个洞孔13，相邻的洞孔之间设置有磁珠14，为模拟信号提供回流路径。本实施例的磁珠14具有两个连接脚，分别连接在布线层的数字区和模拟区，实现数字区和模拟区的连接。
本实施例还包括一连接布线层上数字区和模拟区的电容，所述电容设置在相邻的洞孔之间。在相邻的洞孔之间设置电容或者磁珠中的一种，利用电容来实现滤波等作用。电容可以根据需要来设置，可以是一个或者多个。
如图3所示，为本公开PCB板的具体结构示意图，本实施例的地层包括与数字区对应的第一区和与模拟区对应的第二区，所述电源层包括与数字区 对应的第三区和与模拟区对应的第四区，所述第一区的面积大于第三区的面积，所述第二区的面积大于第四区的面积。本实施例的电源层中与数字区、模拟区对应的面积小于地层对应的区域，使得电源层形成内缩结构，从而有效预防EMI(电磁)的产生。本实施例的电源层较地层内缩0.5mm，能有效预防分割过窄而导致短路。当然，还可以根据需要进行其他合适内缩尺寸的设置。
再次参阅图3，本实施例的洞孔的长度H＞3mm，宽度W＞1mm。每隔一段距离，在分割边缘上既进行该尺寸的PCB镂空。从物理制程上将模拟区和数字区进行了分割。极大的减少了模拟铜与数字铜相邻的面积。尽可能的减少了两区域的信号和电磁干扰面积。本实施例的布线层的数字区和模拟区的间隙之间的距离S1大于等于0.5mm，电源层距离间隙的距离S2大于等于0.5mm，电源层距离边界的距离S3大于等于0.5mm。
本实施例的地层上还在第一区和第二区在靠近间隙位置设置有贯穿布线层、地层和电源层的过孔，有利于顶层布线层、底层布线层和地层铺设地层信号的导通。在模拟分割区和数字分割区边缘均布孔，这样使模拟区和数字区提供及时回流路径，及时阻断了电磁干扰的形成。
本公开还提供了一种电子装置，其包括上述任意一种PCB板。所述电子装置可以为：手机、电视机、电脑、打印机、空调、冰箱、洗衣机、微波炉等任何具有电子元器件的产品或部件。
以上所述是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (11)

  1. 一种PCB板，包括：一基板和设置在所述基板上的布线层，所述布线层包括数字区和模拟区，所述数字区和模拟区间隙设置，所述基板在所述间隙位置设置有洞孔，所述布线层的数字区和模拟区通过磁珠进行连接。
  2. 根据权利要求1所述的PCB板，其中，所述间隙位置设置有多个洞孔，所述磁珠设置在相邻的洞孔之间。
  3. 根据权利要求2所述的PCB板，其中，还包括一连接布线层上数字区和模拟区的电容，所述电容设置在相邻的洞孔之间。
  4. 根据权利要求3所述的PCB板，其中，相邻的洞孔之间设置有磁珠和电容中的其中一种。
  5. 根据权利要求1-4中任一项所述的PCB板，其中，还包括与布线层层叠设置的地层和电源层，所述布线层包括顶层布线层和底层布线层，所述地层和电源层设置在所述顶层布线层和所述底层布线层之间。
  6. 根据权利要求5所述的PCB板，其中，所述地层包括与数字区对应的第一区和与模拟区对应的第二区，所述电源层包括与数字区对应的第三区和与模拟区对应的第四区，所述第一区的面积大于第三区的面积，所述第二区的面积大于第四区的面积。
  7. 根据权利要求5所述的PCB板，其中，所述地层上的第一区和第二区在靠近间隙位置设置有贯穿布线层、地层和电源层的过孔。
  8. 根据权利要求5所述的PCB板，其中，所述电源层距离间隙的距离大于等于0.5mm，所述电源层距离边界的距离大于等于0.5mm。
  9. 根据权利要求1-4中任一项所述的PCB板，其中，所述洞孔的宽度大于1mm，长度大于3mm。
  10. 根据权利要求1-4中任一项所述的PCB板，其中，所述布线层的所述数字区和所述模拟区的间隙之间的距离大于等于0.5mm。
  11. 一种电子装置，包括如权利要求1-10中任一项所述的PCB板。
PCT/CN2014/089432 2014-06-26 2014-10-24 Pcb板及电子装置 WO2015196673A1 (zh)

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CN107135454A (zh) * 2017-06-13 2017-09-05 南京钟山苑航空技术有限公司 一种用于小型无人机的扩音装置
CN108846202B (zh) * 2018-06-13 2022-02-18 郑州云海信息技术有限公司 一种检查模拟地和数字地电气连接的方法及装置
CN111132444B (zh) * 2018-11-01 2022-06-17 深圳迈瑞生物医疗电子股份有限公司 多功能集成电路板及监护仪
CN114302554B (zh) * 2021-12-17 2023-11-28 上海御渡半导体科技有限公司 基于电容提高跨分割信号完整性的pcb板及其布图方法
CN115996515B (zh) * 2023-03-21 2023-07-11 之江实验室 电路板和转接器

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