WO2015170639A1

WO2015170639A1 - Laser processing machine, composite processing system, composite processing machine, and processing origin correction method

Info

Publication number: WO2015170639A1
Application number: PCT/JP2015/062781
Authority: WO
Inventors: 遠藤　広一
Original assignee: 株式会社アマダホールディングス
Priority date: 2014-05-09
Filing date: 2015-04-28
Publication date: 2015-11-12
Also published as: JP5947869B2; JP2015226933A

Abstract

In the present invention, a laser processing machine comprises: a laser irradiation unit; an imaging unit that captures an image of a reference hole that has been pre-formed corresponding to at least one of a plurality of product portions on a workpiece; a workpiece moving unit that moves the workpiece horizontally relative to an irradiation position of the laser irradiation unit and an imaging position of the imaging unit; an image acquisition unit that acquires the image from the imaging unit after the workpiece has been moved by the workpiece moving unit based on a position of the reference hole in a processing program and the image has been captured by the imaging unit; and a first origin correction unit that, prior to laser processing by the laser irradiation unit, corrects a processing origin position of laser processing in the processing program, on the basis of the acquired image.

Description

Laser processing machine, combined processing system, combined processing machine, and processing origin correction method

The present invention relates to a laser processing machine [laser processing machine], a combined processing system [combined processing system] that performs a plurality of processing including laser processing, a combined processing system [combined processing system], and a processing origin correction method [method for correction]. a working original point].

In recent years, complex processing machines (combined-type laser processing (machine combined type laser processing [machine]) that process plate-like workpieces (punching and laser processing [laser processing] [laser cutting]) ) Is widely used. A general multi-tasking machine includes a punching unit [punchinglasunit], a laser irradiation unit [laser emitter], and a workpiece moving unit [workpiece carrier]. The workpiece moving unit includes a punching position [punching position] ([in a working program] punching position on the machining program) and an irradiation position [emitting position] (irradiation position on the machining program, irradiation reference position [ The workpiece is moved in the X-axis direction and the Y-axis direction (horizontal direction) relative to “emission (reference) position]). In addition, a general multi-task machine has an NC (Numerical Control) device [NC (Numerical Control) device] (control unit [Control Unit [] controller]).

An example of a workpiece before laser processing is shown in FIG. The product portion [product portion (s)] (product portion [portion (s) to be a product]) M on the plate-like workpiece W held by the clamper 203 of the workpiece moving unit 201 has a punching portion. Product hole [product hole] (product punched hole) Mh is formed by blanking [blanking] (a type of punching), and countersinking (countersinking) (molding [ A product forming part [product formed portion] Mf is formed by a kind of forming process: a forming process is a kind of punching process. Further, in the vicinity of each product portion M, a reference hole [reference hole] (reference punch hole) as a starting point of laser processing is formed by punching by a punching portion. A pilot hole Mh ′ is formed in advance by punching before the product forming portion Mf is formed by dishing.

Note that Patent Documents 1 and 2 below disclose prior art related to the present invention.

Japanese Unexamined Patent Publication No. 2013-154383 Japanese Unexamined Patent Publication No. 2013-146733

As shown in FIG. 24, when a punching process such as punching or a forming process such as dishing is performed on the product portion M, the workpiece W expands in the X-axis direction and the Y-axis direction (see white arrows in FIG. 24). ) Elongation is accumulated in the X-axis direction and the Y-axis direction with the progress of punching and molding. For this reason, if the number of times punching or forming is performed on the workpiece W, the workpiece W is displaced and the processing accuracy (product accuracy) of the product is lowered.

This problem is not limited to the combined processing machine (punch processing and laser processing), but the product portion M of the workpiece W is processed by the laser processing machine after punching or forming the product portion M of the workpiece W by a punch press. The same occurs when laser processing is performed.

An object of the present invention is to provide a laser processing machine, a combined processing system, a combined processing machine, and a processing origin correction method capable of solving the above-described problems.

A first feature of the present invention is a laser processing machine that laser-processes a plurality of product parts on the workpiece based on a machining program after forming a plate-shaped workpiece, and irradiates the workpiece with laser light. A laser irradiation unit, an imaging unit that captures an image of a reference hole formed in advance corresponding to at least one of the plurality of product parts on the workpiece, an irradiation position of the laser irradiation unit, and an imaging unit A workpiece moving unit that moves the workpiece relatively in the horizontal direction with respect to the imaging position, and the workpiece moving unit is controlled based on the position of the reference hole on the machining program to bring the workpiece into the imaging position. An image acquisition unit that positions the image in the horizontal direction relative to the image pickup unit and controls the image pickup unit to pick up the image and then acquires the image from the image pickup unit; and a laser by the laser irradiation unit. Provided is a laser processing machine comprising a first origin correction unit that corrects a machining origin position of laser machining on the machining program based on the image acquired by the image acquisition unit before construction. .

Here, the “laser processing machine” includes not only a laser processing machine that performs only laser processing but also a complex processing machine that can perform punching. The “forming process” is a kind of punching process, and includes a dishing process and a burring process. The “reference hole” is a hole that serves as a reference for correcting the origin of processing (including molding processing and laser processing), and is a punch hole formed as the starting point of laser processing, formed inside the product. Product holes (product punch holes) and punch holes formed on the outside of the product.

A second feature of the present invention is a combined processing system that performs punching including laser processing and laser processing on a plate-like workpiece, and includes the laser processing machine according to the first feature and punching including molding. A punching unit that performs the processing on the plurality of product parts based on the machining program, and the workpiece moving unit moves the workpiece in the horizontal direction even with respect to the punching position of the punching unit. The image capturing unit captures the image during the molding process, the image acquisition unit acquires the image during the molding process, and the composite processing system is acquired by the image acquisition unit. Provided is a combined machining system further comprising a second origin correction unit that corrects the machining origin position of the molding process on the machining program based on the image.

The “composite processing system” is not only a system that combines a single punch press that performs punching and a single laser processing machine that performs laser processing, but also one that performs punching and laser processing. This includes systems equipped with only these multi-task machines. The “correction data” also includes a correction amount of the machining origin position and data related to the correction amount.

A third feature of the present invention is a multi-tasking machine that forms a plurality of product parts on the workpiece based on a machining program, a laser irradiation unit that irradiates the workpiece with laser light, and a workpiece on the workpiece. An imaging unit that captures an image of a reference hole formed in advance corresponding to at least one of the plurality of product parts, an irradiation position of the laser irradiation unit, and a relative position of the workpiece with respect to the imaging position of the imaging unit A workpiece moving portion that moves horizontally in a horizontal direction and controls the workpiece moving portion based on the position of the reference hole on the machining program to position the workpiece in the horizontal direction relative to the imaging position. Then, after controlling the imaging unit to capture the image, the image acquisition unit acquires the image from the imaging unit, and the processing process is performed based on the image acquired by the image acquisition unit. And it includes a second origin correction unit for correcting the machining origin position of the molding on the ram, and provides a composite processing machine.

A fourth feature of the present invention is a processing origin correction method for laser processing of a plurality of product parts on the workpiece based on a processing program after forming the plate-shaped workpiece, [a] A reference hole is formed corresponding to at least one of the plurality of product parts, [b] an image of the reference hole is taken based on the position of the reference hole on the machining program, and [c] the image is taken Correcting the processing origin position of laser processing on the processing program based on the image, and [d] laser processing at least one of the plurality of product parts based on the corrected processing origin position; Provide machining origin correction method.

A fifth feature of the present invention is a machining origin correction method for forming a plurality of product parts on a plate-like workpiece based on a machining program, and [A] at least one of the plurality of product parts. And [B] an image of the reference hole based on the position of the reference hole on the processing program, and [C] the processing program based on the captured image. Provided is a machining origin correction method in which the machining origin position of the above molding process is corrected, and [D] the at least one of the plurality of product parts is molded based on the corrected machining origin position.

FIG. 1 is a side view of a multi-task machine (system) according to first to sixth embodiments. FIG. 2 is a plan view taken along line II-II in FIG. FIG. 3 is a block diagram of the multi-tasking machine according to the first embodiment. FIG. 4 is a flowchart showing the operation of the multi-task machine. FIG. 5 is a flowchart of processing origin correction processing in the first embodiment. FIG. 6 is a plan view showing a reference hole (first, fourth and sixth embodiments). FIG. 7 is an enlarged plan view of a portion indicated by an arrow VII in FIG. FIG. 8 is a plan view showing the workpiece after the punching process and the dishing process. FIG. 9 is a block diagram of a multi-tasking machine according to the second embodiment. FIG. 10 is a flowchart of processing origin correction processing in the second embodiment. FIG. 11 is a plan view showing a predetermined locus and a reference hole (second, fifth and seventh embodiments). FIG. 12 is a block diagram of a combined processing machine (combined processing system) according to the third embodiment. FIG. 13A is a diagram illustrating a correction amount and a correction pattern in the X-axis direction, and FIG. 13B is a diagram illustrating a correction amount and a correction pattern in the Y-axis direction. FIG. 14 is a block diagram of a combined processing machine (combined processing system) according to the fourth embodiment. FIG. 15 is a flowchart showing the operation of the multi-task machine. FIG. 16 is a flowchart of processing origin correction processing in the fourth embodiment. FIG. 17 is an enlarged plan view of a portion indicated by an arrow XVII in FIG. FIG. 18 is a plan view showing the workpiece during dish-shaping. FIG. 19 is a block diagram of a combined processing machine (combined processing system) according to the fifth embodiment. FIG. 20 is a flowchart of processing origin correction processing in the fifth embodiment. FIG. 21 is a block diagram of a combined processing machine (combined processing system) according to the sixth embodiment. FIG. 22A is a diagram showing a deviation amount and a deviation pattern in the X-axis direction, and FIG. 22B is a diagram showing a deviation amount and a deviation pattern in the Y-axis direction. FIG. 23 is a block diagram of a combined processing machine (combined processing system) according to the seventh embodiment. FIG. 24 is an explanatory diagram of the background art.

(First embodiment)
A multi-task machine 1 according to the first embodiment will be described with reference to FIGS. In the drawings, “L” indicates the left direction, “R” indicates the right direction, “FF” indicates the front direction, and “FR” indicates the rear direction.

As shown in FIG. 1 and FIG. 2, the multi-tasking machine 1 performs punching (dish frying, etc.) on a plurality of product parts (parts to be products) M of a plate-like workpiece W based on a machining program. Forming process and punching process). In addition, the multi-task machine 1 performs laser machining (laser processing) along the outline of a plurality of product parts M cut out from the work W based on a machining program after punching the product part M of the work W. Disconnect). In other words, the multi-task machine 1 performs laser machining (laser cutting) along the contours of a plurality of product parts M cut out from the workpiece W based on a machining program after punching the product part M of the workpiece W. ).

The multi-tasking machine 1 includes a main body base 3. The main body base 3 includes an upper frame 5 and a lower frame 7 which are vertically opposed to each other. The lower frame 7 is provided with a fixed table 9 that supports the workpiece W so as to be movable in the X-axis direction (horizontal direction: left-right direction) and the Y-axis direction (horizontal direction: front-rear direction). On both sides of the fixed table 9 along the X-axis direction, movable tables 11 and 13 that support the workpiece W so as to be movable in the X-axis direction are provided on the lower frame 7 so as to be movable in the Y-axis direction.

The main body base 3 is provided with a punching section 15 that performs punching (including forming and punching such as dishing) on the product portion M based on a processing program. Specifically, the upper frame 5 is provided with an upper turret 19 that holds a plurality of upper molds [upper tools] 17 so as to be rotatable around a vertical axis. The lower frame 7 is provided with a lower turret 23 that holds a plurality of lower molds [lower tools] 21 so as to face the upper turret 19 in the vertical direction so as to be rotatable around a vertical axis. By rotating the upper turret 19 and the lower turret 23 synchronously with a motor (not shown), the desired upper die 17 and the desired lower die 21 are punched at the punching position of the punching unit 15 (punch processing on the processing program). Position) It can be positioned at P1. Above the upper turret 19, a ram 25 is provided on the upper frame 5 so as to be movable up and down. The ram 25 is moved up and down by a hydraulic cylinder (not shown). Further, the ram 25 is provided with a striker 27 for hitting the upper die 17 positioned at the punching position P1 from above.

A laser irradiation unit 29 that irradiates a laser beam while injecting an assist gas toward the workpiece W is provided at a position separated from the punching unit 15. Specifically, a Y-axis slider 31 is provided on the upper frame 5 so as to be movable in the Y-axis direction. A laser irradiation head 33 is provided on the Y-axis slider 31. At the tip of the laser irradiation head 33, there is provided a nozzle 35 that emits laser light while ejecting an assist gas. A laser oscillator 37 that oscillates laser light is disposed in the vicinity of the main body base 3. The laser oscillator 37 is optically connected to the laser irradiation head 33. Further, in the vicinity of the main body base 3, an assist gas supply source (assist gas supply unit) (not shown) for supplying assist gas is disposed. The assist gas supply source is connected to the laser irradiation head 33. A through slot 39 extending in the Y-axis direction is formed at a position on the fixed table 9 that is vertically opposed to the moving area of the laser irradiation head 33 along the Y-axis direction. The through long hole 39 is connected to a recovery unit (not shown) that recovers scraps that are cut and dropped.

A CCD camera (imaging device) 41 is provided on the side of the laser irradiation head 33. For example, each time the nozzle 35 is replaced, the CCD camera 41 captures an image G (see FIG. 6) of the reference punch hole Wh that is formed in advance by the punching unit 15 and that corresponds to the product portion M. Further, a laser beam irradiation position (irradiation reference position / irradiation position on the processing program) P2 by the laser irradiation head 33 (laser irradiation unit 29) and an imaging position (camera center position / imaging position on the processing program) by the CCD camera 41. The distance from P3 is calibrated by a known method disclosed in Patent Documents 1 and 2, for example. That is, the imaging position P3 is set relative to the irradiation position P2.

The work moving part 43 is provided over the fixed table 9 and the upper frame 5 and the like. The workpiece moving unit 43 moves the workpiece W in the X-axis direction and the Y-axis direction relative to the punching position P1, the irradiation position P2, and the imaging position P3. Specifically, a carriage base 45 that extends in the X-axis direction is provided between the front portion of the movable table 11 and the front portion of the movable table 13 so as to connect the two. The upper frame 5 is provided with a first Y-axis motor 47 for moving the carriage base 45 in the Y-axis direction integrally with the movable tables 11 and 13. A carriage 49 is provided on the carriage base 45 so as to be movable in the X-axis direction. The carriage base 45 is also provided with an X-axis motor 51 for moving the carriage 49 in the X-axis direction. The carriage 49 is provided with a clamper 53 that holds the side edge of the workpiece W. The upper frame 5 is provided with a second Y-axis motor 55 for moving the Y-axis slider 31 of the laser irradiation unit 29 in the Y-axis direction.

As shown in FIG. 3, the multi-tasking machine 1 includes an NC device 57 in addition to the punching unit 15 and the laser irradiation unit 29. The NC device 57 controls the punching unit 15, the laser irradiation unit 29, the CCD camera 41, and the workpiece moving unit 43 based on the machining program. The NC device 57 includes a memory that stores a machining program, mold information, and the like, and a CPU that interprets and executes the machining program. The NC device 57 functions as an image acquisition unit [image retriever] (image acquisition module [image retrieval module]) 59, and functions as a displacement calculation unit [displacement calculator] (displacement calculation module [displacement calculation module]) 61. And (first) origin correction unit 63. The image acquisition unit 59, the deviation amount calculation unit 61, and the origin correction unit 63 will be described later.

Subsequently, the operation of the multi-task machine 1 will be described with reference to the flowchart shown in FIG.

The first Y-axis motor 47 and the X-axis motor 51 are controlled based on the machining program, and the workpiece W is positioned at the punching position P1 of the punching unit 15. Thereafter, the punching unit 15 is controlled, and the workpiece W is punched and dished (molded) (step S101). As shown in FIG. 7 and FIG. 8, a reference hole (reference punch hole) Wh corresponding to the product portion M is formed by punching and dishing (molding), and a product hole ( A product punch hole) Mh and a product molding portion Mf are formed. Note that the pilot hole Mh ′ is formed in advance by punching before forming the product forming portion Mf by dishing.

After the punching process and dish grinding process (molding process), a process origin correction process is executed (step S102). The processing origin correction process will be described in detail later. After step S102, the X-axis motor 51, the second Y-axis motor 55, and the like are controlled based on the machining program, and the laser irradiation unit moves the workpiece W in the X-axis direction and the Y-axis direction with respect to the irradiation position P2. By controlling 29, laser processing (laser cutting) is performed along the contour of the product portion M (step S103).

Until the laser processing of all the product parts M is completed, the processes of step S102 and step S103 are repeated (step S104). Further, the processes from step S101 to step S104 are repeated until the combined machining of the target number of workpieces W is completed (step S105). In the present embodiment, the processing of step S102 and step S103 is repeated for each laser processing of one product part M. However, step S102 and step S103 are performed for each laser processing of a predetermined number (for example, 10) of product parts M. The above process may be repeated (that is, 10 product parts M are laser-cut by one process in step S103).

Next, the flowchart shown in FIG. 5 for the processing origin correction processing (step S102: processing origin correction method) described above, including the description of the image acquisition unit 59, the deviation amount calculation unit 61, and the origin correction unit 63. This will be described with reference to FIG. The processing origin correction process (method) of the present embodiment is performed before the laser processing (step S103) of the product part M based on the processing program after the punching processing and dish-shaping processing (step S101) based on the processing program, Correct the machining origin position on the machining program.

In addition, the “machining origin” on the program means the point that becomes the standard of machining. For example, one “machining origin” for the workpiece W is set on the program (for example, the lower left corner of the workpiece W shown in FIG. 8), and machining such as laser machining is performed based on this “machining origin”. Alternatively, if attention is paid to each product part M, the center position (processing reference position) of the reference hole Wh becomes a reference point for processing, and therefore, this processing reference position can be regarded as the processing origin. That is, the “machining origin” on the program is a reference point for performing machining based on the program.

First, the workpiece W is moved in the X-axis direction and the Y-axis direction relative to the imaging position P3 of the CCD camera 41 by the first Y-axis motor 47 (and / or the second Y-axis motor 55) and the X-axis motor 51. Then, the center position (processing reference position) of the reference hole Wh on the processing program and the center position Gc (see FIG. 6) of the image G of the CCD camera 41 are positioned so as to coincide with each other (step S201). After the workpiece W is positioned, an image G of the reference hole Wh is taken by the CCD camera 41 (step S202). The image acquisition unit 59 acquires the image G from the CCD camera 41 (step S203).

Subsequently, based on the image G, the deviation amount calculation unit 61 determines the center position of the reference hole Wh on the machining program (matched with the center position Gc of the image G in step S201) and the actual reference hole Wh. A deviation amount (ΔX, ΔY) from the center position Whc is calculated (step S204: see FIG. 6). Based on the calculated deviation amounts (ΔX, ΔY), the origin correction unit 63 corrects the machining origin position on the machining program so that the deviation amounts (ΔX, ΔY) become zero (step S205). Thereby, the processing origin position of the laser processing can be corrected.

According to the present embodiment, based on the image G, the deviation amount between the center position of the reference hole Wh on the machining program (which is coincident with the center position Gc of the image G) and the actual center position Whc of the reference hole Wh. Since (ΔX, ΔY) is calculated and the processing origin position of laser processing on the processing program is corrected, even if the dimension of the workpiece W is changed by punch processing including molding processing performed before laser processing ( The above-described change in the processing origin position of the laser processing due to the change can be corrected on the processing program (processing program data can be corrected). Therefore, it is possible to prevent the position of the reference punch hole Wh or product hole Mh formed by punching including molding and the laser processing position from being shifted. In this embodiment, since the outline of the product part M is cut by laser processing, the reference punch hole Wh and the product hole Mh are accurately arranged on the cut out product.

That is, according to this embodiment, the combined accuracy of punching and laser processing including molding processing can be maintained high, and the product formed before laser processing with respect to the contour of the product formed by laser processing (laser cutting) The relative displacement between the hole Mh and the product molding portion Mf (for example, caused by the displacement of the workpiece W due to dish-shaping) can be suppressed, and the product processing accuracy (product accuracy) can be sufficiently improved.

(Second Embodiment)
The multi-task machine 1 according to the second embodiment will be described with reference to FIGS. Note that the multi-tasking machine 1 according to the present embodiment also has a configuration similar to the configuration shown in FIGS. 1 and 2 of the first embodiment described above. Therefore, a detailed description of these similar configurations is omitted. In addition, the same or equivalent components as those in the first embodiment are given the same reference numerals and detailed description thereof is omitted.

As shown in FIG. 9, the NC device 57 of this embodiment includes a trajectory forming unit in addition to a function as an image acquisition unit 59, a function as a deviation amount calculation unit 61, and a function as an origin correction unit 63. It functions as [track [line marker] 65.

Also in the present embodiment, the operation of the flowchart shown in FIG. 4 is performed. In step S102, a machining origin correction process (method) different from the machining origin correction process (method) of the first embodiment described above is performed. Is called. The processing origin correction processing in the present embodiment including the description of the locus forming unit 65 will be described with reference to the flowchart shown in FIG.

First, the trajectory forming unit 65 controls the laser oscillator 37 to irradiate the low-power laser beam from the nozzle 35, and relative to the irradiation position P2 of the laser irradiation head 33, the trajectory forming unit 65 is a reference in the machining program. Circular movement around the center position (processing reference position) of the hole Wh. As a result, a circular locus (marking line) T surrounding the reference hole Wh is formed on the workpiece W (step S301: see FIG. 11). The “low output laser beam” is a laser beam with an output that does not cut the workpiece. Further, instead of the circular motion of the workpiece W, another specific operation such as a regular polygon motion of the workpiece W may be performed.

Next, based on the center position of the reference hole Wh on the machining program, the workpiece W is picked up by the first Y-axis motor 47 (and / or the second Y-axis motor 55) and the X-axis motor 51, and the image pickup position P3 of the CCD camera 41. The workpiece W is positioned so that the reference hole Wh can be imaged by being moved relative to the X axis direction and the Y axis direction. After the workpiece W is positioned, an image G of the reference hole Wh including the locus T is taken by the CCD camera 41 (step S302: see FIG. 11). That is, the image G includes an actual reference hole Wh and a trajectory T formed based on the center position of the reference hole Wh on the machining program. The image acquisition unit 59 acquires the image G from the CCD camera 41 (step S303).

Subsequently, based on the image G, the deviation amount calculation unit 61 determines the center position Tc of the trajectory T (formed about the center position of the reference hole Wh on the machining program in step S301) and the reference hole Wh. The deviation (ΔX, ΔY) from the actual center position Whc is calculated (step S304: see FIG. 11). The origin correction unit 63 corrects the machining origin position on the machining program based on the calculated deviation amounts (ΔX, ΔY) so that the deviation amounts (ΔX, ΔY) become zero (step S305). Thereby, the processing origin position of the laser processing can be corrected.

According to the present embodiment, the trajectory T is formed on the workpiece W based on the center position of the reference hole Wh on the machining program, and the center position Tc of the trajectory T is determined based on the image G of the reference hole Wh including the trajectory T. Since the deviation amount (ΔX, ΔY) of the reference hole Wh from the actual center position Whc is calculated and the machining origin position of the laser machining on the machining program is corrected, the molding process performed before the laser machining is included. Even if the dimension of the workpiece W is changed by punching (e.g., the elongation indicated by the white arrow in FIG. 24 described above), the deviation of the processing origin position of the laser processing caused by the change can be corrected on the processing program (processing) Program data can be modified). Therefore, it is possible to prevent the position of the reference punch hole Wh or product hole Mh formed by punching including molding and the laser processing position from being shifted. Also in this embodiment, since the contour of the product part M is cut by laser processing, the reference punch hole Wh and the product hole Mh are accurately arranged on the cut out product.

That is, according to the present embodiment, as in the first embodiment described above, the combined accuracy of punching including molding and laser processing can be maintained high, and the product processing accuracy (product accuracy) can be sufficiently improved. be able to.

(Third embodiment)
The multi-tasking machine 1 according to the third embodiment will be described with reference to FIG. Note that the multi-tasking machine 1 according to the present embodiment also has a configuration similar to the configuration shown in FIGS. 1 and 2 of the first embodiment described above. Therefore, a detailed description of these similar configurations is omitted. Further, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 12, in addition to the functions of the NC device 57 of the first or second embodiment described above, the NC device 57 of this embodiment has a correction data storage unit [corrected data storage] (correction data storage module). [corrected data storage module]) 73 function, correction pattern determining unit [correction pattern determining module] (correction pattern determining module 75) function, and second origin correcting unit 77 function Have.

Processing origin correction processing (method) in this embodiment will be described below, including descriptions of the correction data storage unit 73, the correction pattern determination unit 75, and the second origin correction unit 77.

In the present embodiment, the machining origin position is corrected based on at least two product parts M, and these correction amounts are stored in the correction data storage unit 73 as correction data. The machining origin correction process for at least two product parts M is performed by the machining origin correction process in the first or second embodiment described above. Thereafter, based on the correction data (see the white triangle in FIG. 13A) stored in the correction data storage unit 73, the correction pattern determination unit 75 determines the processing reference position (the center position of the reference hole Wh on the processing program). ) And a correction pattern RPx (a straight line or a curve obtained from a plurality of white triangles) indicating the relationship between the position in the X-axis direction and the amount of correction in the X-axis direction at that position. Similarly, the correction pattern determination unit 75 determines the processing reference position (the center of the reference hole Wh on the processing program) based on the correction data stored in the correction data storage unit 73 (see the white square in FIG. 13B). A correction pattern RPy (a straight line or a curve obtained from a plurality of white squares) indicating the relationship between the position in the Y-axis direction position and the correction amount in the Y-axis direction at that position is also determined.

In the present embodiment, it is preferable that “at least two product portions M” used for a plurality of machining origin corrections are selected so that both data of ΔX and ΔY can be suitably obtained. For example, “correction data” is acquired based on the machining origin correction of the product portion M in one row along the X-axis direction and one row along the Y-axis direction. Alternatively, “correction data” is acquired based on the machining origin correction of the product portion M aligned on the diagonal line of the workpiece W. Since the deviation amount (ΔX, ΔY) tends to increase as the distance from the clamper 53 increases, the product portion M selected to acquire “correction data” includes the product portion M far from the clamper 53. Preferably. The “correction data” includes not only the deviation amounts (ΔX, ΔY) calculated by the deviation amount calculation unit 61 but also the correction amounts (−ΔX, −ΔY) corrected by the origin correction unit 63.

Then, based on the correction pattern (RPx, RPy) determined by the correction pattern determination unit 75, the second origin correction unit 77 is not used for a plurality of machining origin corrections (on the same workpiece W). For the product part M or a plurality of product parts M on another workpiece W, the machining origin position on the machining program is corrected. Accordingly, the machining origin position of the laser machining is corrected with respect to the other product part M (not used for the plurality of machining origin corrections) on the same workpiece W or the plurality of product parts M on the other workpiece W. be able to.

According to this embodiment, after a plurality of machining origin corrections based on at least two product parts M on the workpiece W, the same workpiece is determined based on the correction pattern (RPx, RPy) determined based on the correction data. The machining origin position of another product part M on W or a plurality of product parts M on another workpiece W is corrected. For this reason, even if the dimension of the workpiece W is changed by punching including molding (e.g., the elongation indicated by the white arrow in FIG. 24 described above), the correction data created in advance is used to cause the change. Displacement of the processing origin position of laser processing can be easily and efficiently corrected on the processing program (processing program data can be corrected easily and efficiently).

(Fourth embodiment)
The multi-task machine 1 according to the fourth embodiment will be described with reference to FIGS. 14 to 18. Note that the multi-tasking machine 1 according to the present embodiment also has a configuration similar to the configuration shown in FIGS. 1 and 2 of the first embodiment described above. Therefore, a detailed description of these similar configurations is omitted. Further, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 14, the NC device 57 of this embodiment includes an image acquisition unit 59, a deviation amount calculation unit 61, a first origin correction unit 63, a correction data storage unit 73, a correction pattern determination unit 75, and a first It has a function as the two origin correction unit 77.

Subsequently, the operation of the multi-task machine 1 as a multi-task machining system including the machining origin correction process (method) of the present embodiment will be described with reference to a flowchart shown in FIG.

The first Y-axis motor 47 and the X-axis motor 51 are controlled based on the machining program, and the workpiece W is positioned at the punching position P1 of the punching unit 15. Thereafter, the punching unit 15 is controlled, and the workpiece W is punched (step S401). As shown in FIGS. 17 and 18 (excluding the product part M1 at the upper left) by punching, a reference hole (reference punch hole) Wh corresponding to each product part M is formed, and the product part M has a product. A hole (product punch hole) Mh and a pilot hole Mh ′ are formed.

After the punching process, dish mixing is started (step S402). Specifically, similarly to the punching process, the first Y-axis motor 47 and the X-axis motor 51 are controlled based on the machining program, and the workpiece W is positioned at the punching position P1 of the punching unit 15. Thereafter, the punching section 15 is controlled, and the first upper left product portion M1 is dished (molded).

In the present embodiment, after the first product portion M1 is dish-milled, processing origin correction processing for dish-shaft processing is executed in the present embodiment (step S403). Here, with reference to the flowchart shown in FIG. 16, the processing origin correction processing for dish grinding will be described. The processing origin correction processing for dish grinding according to the present embodiment is the same as the processing origin correction processing for laser processing according to the first embodiment.

First, the workpiece W is moved in the X-axis direction and the Y-axis direction relative to the imaging position P3 of the CCD camera 41 by the first Y-axis motor 47 (and / or the second Y-axis motor 55) and the X-axis motor 51. Thus, the center position of the reference hole Wh on the machining program and the center position Gc of the image G of the CCD camera 41 (see FIG. 6: as in the first embodiment) are positioned so as to coincide with each other (step S501). . After the workpiece W is positioned, an image G of the reference hole Wh is captured by the CCD camera 41 (step S502). The image acquisition unit 59 acquires the image G from the CCD camera 41 (step S503).

Subsequently, based on the image G, the deviation amount calculation unit 61 matches the center position of the reference hole Wh on the machining program (matched with the center position Gc of the image G in step 501) and the actual position of the reference hole Wh. A deviation amount (ΔX, ΔY) from the center position Whc is calculated (step S504: see FIG. 6: the same as in the first embodiment). Based on the calculated deviation amount (ΔX, ΔY), the second origin correction unit 77 corrects the machining origin position on the machining program so that the deviation amount (ΔX, ΔY) becomes zero (step S505). This makes it possible to correct the processing origin position of dish grinding (molding).

Returning to the flowchart shown in FIG. After step S403, the first Y-axis motor 47 and the X-axis motor 51 are controlled on the basis of the machining program, and the workpiece W is positioned at the punching position P1 of the punching unit 15 in the same manner as the dish grinding already performed. The Thereafter, the punching unit 15 is controlled, and the dishing (molding) of the next product part M is resumed (step S404).

The processing of step S403 and step S404 is repeated until dishing (molding) of all product parts M is completed (step S405). In this embodiment, the processing of step S403 and step S404 is repeated for each dish milling of one product portion M. However, for each dish processing of a predetermined number (for example, 10) of product portions M, step S403 and The process of step S404 may be repeated (that is, 10 product parts M are dished in one process of step S404). It should be noted that correction data similar to the correction data of the above-described third embodiment is generated during dishing (molding).

After all the product parts M are dished (YES in step S405), a processing origin correction process for laser processing is executed (step S406). Specifically, the first origin correction unit 63 performs laser processing in the same manner as in the third embodiment described above based on correction data (molding correction data) created during dishing of the product portion M. Correct the machining origin position. Thereby, the processing origin position of the laser processing can be corrected.

The “molding correction data” includes not only the deviation amounts (ΔX, ΔY) calculated by the deviation amount calculation unit 61 but also the correction amounts (−ΔX, −ΔY) corrected by the origin correction unit 63. included. In the present embodiment, the processing origin position of the laser processing is corrected based on the correction data of the forming processing. However, in step S407 of the present invention, the machining origin correction process (see FIG. 5) in the first embodiment or the machining origin correction process (see FIG. 10) in the second embodiment may be performed.

After step S406, the X-axis motor 51, the second Y-axis motor 55, and the like are controlled based on the machining program, and the laser irradiation unit moves the workpiece W in the X-axis direction and the Y-axis direction with respect to the irradiation position P2. By controlling 29, laser processing (laser cutting) is performed along the contour of the product part M (step S407). Then, the processes from step S401 to step S407 are repeated until the combined machining of the target number of workpieces W is completed (step S408).

According to the present embodiment, based on the image G, the deviation amount between the center position of the reference hole Wh on the machining program (which is coincident with the center position Gc of the image G) and the actual center position Whc of the reference hole Wh. Since (ΔX, ΔY) is calculated and the processing origin position of the dish milling (forming process) on the processing program is corrected, the dimension of the workpiece W is changed by punching performed before the dish milling. (Elongation indicated by the white arrow in FIG. 24 described above), the deviation of the processing origin position of the dish milling caused by the change can be corrected on the processing program (processing program data can be corrected).

Moreover, according to this embodiment, based on the correction pattern determined based on the correction data generated during dish kneading (molding), another product part M on the same workpiece W, or other The machining origin positions of the plurality of product parts M on the workpiece W are corrected. For this reason, even if the dimension of the workpiece W is changed by punching including forming (elongation indicated by the white arrow in FIG. 24 described above), the laser caused by the change using the correction data described above. Displacement of the machining origin position of machining can be easily and efficiently corrected on the machining program (machining program data can be easily and efficiently corrected).

That is, according to this embodiment, the combined accuracy of punching and laser processing including molding processing can be maintained high, and the product formed before laser processing with respect to the contour of the product formed by laser processing (laser cutting) The relative displacement between the hole Mh and the product molding portion Mf (for example, caused by the displacement of the workpiece W due to dish-shaping) can be suppressed, and the product processing accuracy (product accuracy) can be sufficiently improved. In particular, since the machining origin position on the machining program is corrected even during dish kneading, the machining accuracy (product accuracy) of the product can be further improved.

(Fifth embodiment)
A multi-tasking machine 1 according to a fifth embodiment will be described with reference to FIGS. 19 and 20. Note that the multi-tasking machine 1 according to the present embodiment also has a configuration similar to the configuration shown in FIGS. 1 and 2 of the first embodiment described above. Therefore, a detailed description of these similar configurations is omitted. Further, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 19, the NC device 57 of the present embodiment is the same as the NC device 57 of the present embodiment in that an image acquisition unit 59, a deviation amount calculation unit 61, a first origin correction unit 63, a trajectory formation unit 65, a correction It has functions as a data storage unit 73, a correction pattern determination unit 75, and a second origin correction unit 77.

In the fourth embodiment, as the processing origin correction processing for dishing (see step S403 in FIG. 15 and FIG. 16), the processing origin correction processing for laser processing in the first embodiment (see FIGS. 5 and 6). The same processing was performed. In the present embodiment, processing similar to the processing origin correction processing (see FIGS. 10 and 11) for laser processing in the second embodiment is performed as processing origin correction processing (see FIG. 20) for dish-shaping. As in the fourth embodiment, correction data is also generated during dish kneading in this embodiment.

Referring to the flowchart shown in FIG. 20, description will be given of the processing origin correction processing for dish grinding according to the present embodiment. First, the trajectory forming unit 65 controls the laser oscillator 37 to irradiate the low-power laser beam from the nozzle 35, and relative to the irradiation position P2 of the laser irradiation head 33, the trajectory forming unit 65 is a reference in the machining program. Circular movement around the center position of the hole Wh. As a result, a circular trajectory (marking line) T surrounding the reference hole Wh is formed on the workpiece W (step S601: see FIG. 11: similar to the second embodiment).

Next, based on the center position of the reference hole Wh on the machining program, the workpiece W is picked up by the first Y-axis motor 47 (and / or the second Y-axis motor 55) and the X-axis motor 51, and the image pickup position P3 of the CCD camera 41. The workpiece W is positioned so that the reference hole Wh can be imaged by being moved relative to the X axis direction and the Y axis direction. After the workpiece W is positioned, an image G of the reference hole Wh including the locus T is captured by the CCD camera 41 (step S602: see FIG. 11: the same as in the second embodiment). That is, the image G includes an actual reference hole Wh and a trajectory T formed based on the center position of the reference hole Wh on the machining program. The image acquisition unit 59 acquires the image G from the CCD camera 41 (step S603).

Subsequently, based on the image G, the deviation amount calculation unit 61 determines the center position Tc of the trajectory T (formed about the center position of the reference hole Wh on the machining program in step S601) and the reference hole Wh. The deviation (ΔX, ΔY) from the actual center position Whc is calculated (step S604: see FIG. 11: the same as in the second embodiment). Based on the calculated deviation amounts (ΔX, ΔY), the second origin correction unit 77 corrects the machining origin position on the machining program so that the deviation amounts (ΔX, ΔY) become zero (step S605). This makes it possible to correct the processing origin position for dish mixing.

According to the present embodiment, the trajectory T is formed on the workpiece W based on the center position of the reference hole Wh on the machining program, and the center position Tc of the trajectory T is determined based on the image G of the reference hole Wh including the trajectory T. Since the deviation amount (ΔX, ΔY) of the reference hole Wh from the actual center position Whc is calculated and the processing origin position of dish grinding (molding) in the machining program is corrected, before the dish grinding Even if the dimension of the workpiece W is changed by punching including forming (such as elongation indicated by the white arrow in FIG. 24 described above), the deviation of the processing origin position of the dishing process due to the change is processed. Can be modified on the program (processing program data can be modified).

Also in this embodiment, using the correction data generated during dish grinding (molding), the deviation of the processing origin position of laser processing can be easily and efficiently corrected on the processing program (processing program data). Can be modified easily and efficiently). That is, according to the present embodiment, as in the fourth embodiment described above, the combined accuracy of punching including molding and laser processing can be maintained high, and the product processing accuracy (product accuracy) can be sufficiently improved. be able to.

(Sixth embodiment)
A multi-tasking machine 1 according to a sixth embodiment will be described with reference to FIGS. 21 and 22. Note that the multi-tasking machine 1 according to the present embodiment also has a configuration similar to the configuration shown in FIGS. 1 and 2 of the first embodiment described above. Therefore, a detailed description of these similar configurations is omitted. Further, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 21, the NC device 57 of the present embodiment includes an image acquisition unit 59, a deviation amount calculation unit 61, a first origin correction unit 63, a second origin correction unit 77, and a deviation amount storage unit [displacement storage]. (Displacement storage module [displacement storage module]) 79 and a displacement pattern determination unit [displacement pattern determiner] (displacement pattern determination module [displacement pattern determination module]) 81. Further, the NC device 57 may include a trajectory forming unit 65, a correction data storage unit 73, and a correction pattern determining unit 75 in accordance with the processing origin correction process of laser processing.

The processing origin correction process (method) of dish grinding (molding) in this embodiment will be described below, including descriptions of the correction data storage unit 73, the deviation amount storage unit 79, and the deviation pattern determination unit 81. .

皿 After the punching process, at least two product parts M are dished (molded). In this embodiment, it is preferable that the “at least two product portions M” to be dish-milled in advance are selected so that both ΔX and ΔY data can be suitably obtained. The preferable selection of the product part M for acquiring data is the same as the selection of the product part M for acquiring “correction data” in the third embodiment described above. The CCD camera 41 captures an image G of the reference hole Wh of at least two product portions M that have been dished. The image acquisition unit 59 acquires all the images G from the CCD camera 41.

Subsequently, as in the processing origin correction process of laser processing in the first embodiment, the deviation amount calculation unit 61 determines the center position of the reference hole Wh on the processing program based on each image G (the center position of the image G). The amount of deviation (ΔX, ΔY) between the reference center Whc and the actual center position Whc is calculated. All the calculated shift amounts (ΔX, ΔY) are stored in the shift amount storage unit 79 (see the white triangle in FIG. 22A and the white square in FIG. 22B).

Thereafter, the deviation pattern determination unit 81 determines the X-axis direction position of the machining reference position (the center position of the reference hole Wh on the machining program) based on the deviation amount ΔX in the X-axis direction stored in the deviation amount storage unit 79. A shift pattern SPx (a straight line or a curve obtained from a plurality of white triangles) indicating the relationship with the shift amount ΔX in the X-axis direction at that position is determined. Similarly, the deviation pattern determination unit 81 is based on the deviation amount ΔY in the Y-axis direction stored in the deviation amount storage unit 79, and the Y-axis direction position of the machining reference position (the center position of the reference hole Wh on the machining program). And a displacement pattern SPy (a straight line or a curve obtained from a plurality of white squares) indicating the relationship between the displacement amount ΔY in the Y-axis direction at that position.

Based on the deviation pattern (SPx, SPy) determined by the deviation pattern determination unit 81, the second origin correction unit 77 is another product part M on the same workpiece W (which is not subjected to dish kneading), or Then, with respect to the plurality of product parts M on the other workpiece W, the processing origin position of the dish grinding is corrected. Therefore, it is possible to correct the processing origin position of dish milling for other product parts M on the same workpiece W (not dish-milled) or a plurality of product parts M on other workpieces W. it can.

After that, the origin machining position of the laser machining position is also corrected by the first origin correction unit 63 by the same process as in any of the first to fifth embodiments. The origin machining position correction process of the laser machining position may be performed based on the above-described correction pattern (RPx, RPy), or may be performed based on the deviation pattern (SPx, SPy).

According to the present embodiment, after calculating the shift amount (ΔX, ΔY) of the product portion M after machining at least two dishes on the workpiece W, the shift pattern (SPx) determined based on the (ΔX, ΔY) thereof. , SPy), the processing origin position of the dish grinding process of the other product parts M on the same work W or the plurality of product parts M on the other work W is corrected. For this reason, even if the dimension of the workpiece W is changed by punching including dishing (molding) (e.g., the elongation indicated by the white arrow in FIG. 24 described above) The deviation of the processing origin position of dish milling due to the above change can be easily and efficiently corrected on the processing program (processing program data can be corrected easily and efficiently). In addition, according to the present embodiment, since the processing origin position of laser processing is also corrected, it is possible to maintain a high combined accuracy of punch processing including dish milling (molding processing) and laser processing, and processing accuracy of the product (product Accuracy) can be sufficiently improved.

(Seventh embodiment)
A multi-tasking machine 1 according to a seventh embodiment will be described with reference to FIG. Note that the multi-tasking machine 1 according to the present embodiment also has a configuration similar to the configuration shown in FIGS. 1 and 2 of the first embodiment described above. Therefore, a detailed description of these similar configurations is omitted. Further, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 23, the NC device 57 of the present embodiment is the same as the NC device 57 of the present embodiment, in that an image acquisition unit 59, a deviation amount calculation unit 61, a first origin correction unit 63, a trajectory formation unit 65, It has functions as a two-origin correction unit 77, a deviation amount storage unit 79, and a deviation pattern determination unit 81. Further, the NC device 57 may include a correction data storage unit 73 and a correction pattern determination unit 75 in accordance with the processing origin correction process of laser processing.

The processing origin correction process (method) for dish-shaping (molding) in the present embodiment will be described below. In the sixth embodiment, the same technique (see FIG. 6) as the processing origin correction process of laser processing in the first embodiment is used to calculate the deviation amount (ΔX, ΔY). However, in the present embodiment, the same method (see FIG. 11) as the processing origin correction process of laser processing in the second embodiment is used to calculate the deviation amount (ΔX, ΔY).

皿 After the punching process, at least two product parts M are dished (molded). Also in this embodiment, it is preferable that the “at least two product portions M” on which the dishing is performed in advance is selected so that both ΔX and ΔY data can be suitably obtained. The preferable selection of the product part M for acquiring data is the same as the selection of the product part M for acquiring “correction data” in the third embodiment described above. The locus forming unit 65 controls the laser oscillator 37 to irradiate the low-power laser beam from the nozzle 35 and controls the workpiece W as a reference in the machining program, similarly to the laser beam machining origin correction process in the second embodiment. Circular movement around the center position of the hole Wh. As a result, a circular trajectory T that surrounds each reference hole Wh of at least two product parts M on which dishing has been performed is formed.

Thereafter, similarly to the laser beam machining origin correction process in the first embodiment, images G (including the trajectory T) of the reference holes Wh of the at least two product portions M that have been dished by the CCD camera 41 are displayed. Imaged. The image acquisition unit 95 acquires all the images G from the CCD camera 41.

Subsequently, similarly to the laser beam machining origin correction process in the first embodiment, the deviation amount calculation unit 61 is based on each image G and has a trajectory T (centering on the center position of the reference hole Wh on the machining program). The amount of deviation (ΔX, ΔY) between the center position Tc (which is formed) and the actual center position Whc of the reference hole Wh is calculated. All the calculated shift amounts (ΔX, ΔY) are stored in the shift amount storage unit 79.

Thereafter, the deviation pattern determination unit 81 is based on the deviation amount ΔX in the X-axis direction stored in the deviation amount storage unit 79 and shows a relationship between the X-axis direction position of the processing origin and the deviation amount ΔX in the X-axis direction. A pattern SPx (see FIG. 22A: the same as in the sixth embodiment) is determined. Similarly, the deviation pattern determination unit 81 indicates the relationship between the Y-axis direction position of the processing origin and the Y-axis direction deviation amount ΔY based on the Y-axis direction deviation amount ΔY stored in the deviation amount storage unit 79. The shift pattern SPy (see FIG. 22B: the same as in the sixth embodiment) is determined.

After that, the origin machining position of the laser machining position is also corrected by the first origin correction unit 63 by the same process as in any of the rudder 1 to the fifth embodiment. The origin machining position correction process of the laser machining position may be performed based on the above-described correction pattern (RPx, RPy), or may be performed based on the deviation pattern (SPx, SPy).

The present invention is not limited to the above embodiment, and can be implemented in various modes. For example, the laser processing in the above embodiment may not be laser cutting along the contour of the product part M, and in that case, the product part M may be separated from the workpiece W by punching.

The scope of rights included in the invention of the laser processing machine is not limited to the combined processing machine as in the above embodiment, and the laser is applied to the product portion M of the workpiece W punched by another punch press (processing machine). Also includes a laser processing machine that performs processing. Furthermore, the scope of the invention of the composite processing system includes not only a composite processing system composed of one composite processing machine but also a composite processing system in which one punch press and one laser processing machine are combined. .

Claims

A laser processing machine that performs laser processing on a plurality of product parts on the workpiece based on a processing program after forming a plate-shaped workpiece,
A laser irradiation unit for irradiating the workpiece with laser light;
An imaging unit that captures an image of a reference hole formed in advance corresponding to at least one of the plurality of product parts on the workpiece;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the imaging position of the imaging unit;
The workpiece moving unit is controlled based on the position of the reference hole on the machining program to position the workpiece in the horizontal direction relative to the imaging position, and the imaging unit is controlled to display the image. An image acquisition unit for acquiring the image from the imaging unit after imaging;
A first origin correction unit that corrects a processing origin position of laser processing on the processing program based on the image acquired by the image acquisition unit before laser processing by the laser irradiation unit; Laser processing machine.
The laser processing machine according to claim 1,
A deviation amount calculation unit that calculates a deviation amount between the position of the reference hole on the processing program and the actual position of the reference hole in the image based on the image acquired by the image acquisition unit; Has
The first origin correction unit corrects the machining origin position of laser processing on the machining program so that the deviation amount becomes zero based on the deviation amount calculated by the deviation amount calculation unit. Processing machine.
The laser processing machine according to claim 1,
A trajectory forming unit that forms a trajectory surrounding the reference hole on the workpiece;
A deviation amount calculation unit that calculates a deviation amount between the position of the trajectory and the actual position of the reference hole in the image based on the image acquired by the image acquisition unit;
The trajectory forming unit is configured to capture the image by the imaging unit.
While controlling the laser irradiation unit to irradiate the low-power laser beam, the workpiece moving unit is controlled to move the workpiece relatively based on the position of the reference hole on the machining program. Forming the trajectory,
The first origin correction unit corrects the machining origin position of laser processing on the machining program so that the deviation amount becomes zero based on the deviation amount calculated by the deviation amount calculation unit. Processing machine.
A laser processing machine according to any one of claims 1 to 3,
The first origin correction unit generates correction data by correcting the processing origin position of the forming process for at least two of the plurality of product parts on the workpiece, and using the correction data, The laser processing machine which correct | amends the said process | work origin position of the laser processing of the remaining product part on the said workpiece | work, or several product parts on another workpiece | work.
A laser processing machine according to any one of claims 1 to 4,
The laser processing machine, wherein the laser processing machine is a combined processing machine further comprising a punch processing unit that performs punch processing including the forming processing on the plurality of product parts based on the processing program.
It is a combined processing system that performs punch processing including molding processing and laser processing on a plate-shaped workpiece,
A laser beam machine according to claim 1;
A punching unit that performs punching including molding on the plurality of product parts based on the processing program,
The workpiece moving unit moves the workpiece in the horizontal direction with respect to the punching position of the punching unit,
The imaging unit captures the image during the molding process, and the image acquisition unit acquires the image during the molding process,
The combined machining system further includes a second origin correction unit that corrects the machining origin position of the forming process on the machining program based on the image acquired by the image acquisition unit.
The combined machining system according to claim 6,
A deviation amount calculation unit that calculates a deviation amount between the position of the reference hole on the processing program and the actual position of the reference hole in the image based on the image acquired by the image acquisition unit; Has
The second origin correction unit corrects the machining origin position of the forming process on the machining program based on the deviation amount calculated by the deviation amount calculation unit so that the deviation amount becomes zero. Processing system.
The combined machining system according to claim 6,
A trajectory forming unit that forms a trajectory surrounding the reference hole on the workpiece;
A deviation amount calculation unit that calculates a deviation amount between the position of the trajectory and the actual position of the reference hole in the image based on the image acquired by the image acquisition unit;
The trajectory forming unit is configured to capture the image by the imaging unit.
While controlling the laser irradiation unit to irradiate the low-power laser beam, the workpiece moving unit is controlled to move the workpiece relatively based on the position of the reference hole on the machining program. Forming the trajectory,
The first origin correction unit corrects the machining origin position of laser processing on the machining program so that the deviation amount becomes zero based on the deviation amount calculated by the deviation amount calculation unit. Processing system.
The combined machining system according to claim 7 or 8,
The second origin correction unit generates correction data by correcting the processing origin position of the forming process for at least two of the plurality of product parts on the workpiece,
The combined machining system, wherein the first origin correction unit corrects a machining origin position of laser machining on the machining program for the plurality of product parts on the workpiece by using the correction data.
A combined machining system according to any one of claims 7 to 9,
The second origin correction unit generates correction data by correcting the processing origin position of the forming process for at least two of the plurality of product parts on the workpiece,
The second origin correction unit corrects the processing origin position of the molding process of the remaining product part on the workpiece or a plurality of product parts on another workpiece by using the correction data. system.
A combined machining system according to any one of claims 6 to 10,
The combined processing system, wherein the laser processing machine is a combined processing machine further including a punch processing unit that performs punch processing including the forming processing on the plurality of product parts based on the processing program.
A multi-tasking machine that forms a plurality of product parts on the workpiece based on a processing program,
A laser irradiation unit for irradiating the workpiece with laser light;
An imaging unit that captures an image of a reference hole formed in advance corresponding to at least one of the plurality of product parts on the workpiece;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the imaging position of the imaging unit;
The workpiece moving unit is controlled based on the position of the reference hole on the machining program to position the workpiece in the horizontal direction relative to the imaging position, and the imaging unit is controlled to display the image. An image acquisition unit for acquiring the image from the imaging unit after imaging;
A multi-tasking machine comprising: a second origin correcting unit that corrects a processing origin position of molding processing on the processing program based on the image acquired by the image acquisition unit.
A processing origin correction method for laser processing on a plurality of product parts on the workpiece based on a machining program after forming the plate-like workpiece,
[A] forming a reference hole corresponding to at least one of the plurality of product parts;
[B] taking an image of the reference hole based on the position of the reference hole on the machining program;
[C] Based on the captured image, correct the processing origin position of the laser processing on the processing program,
[D] A processing origin correction method of performing laser processing on at least one of the plurality of product portions based on the corrected processing origin position.
The processing origin correction method according to claim 13,
In [c],
[C-1] On the basis of the imaged image, a deviation amount between the position of the reference hole on the processing program and the actual position of the reference hole in the image is calculated,
[C-2] A machining origin correction method for correcting the machining origin position of laser processing on the machining program so that the deviation amount becomes zero based on the calculated deviation amount.
The processing origin correction method according to claim 13,
Prior to [b], while irradiating a low-power laser beam, relatively moving the workpiece based on the position of the reference hole on the machining program to form the locus on the workpiece,
In [c],
[C-1 ′] On the basis of the imaged image, a shift amount between the position of the locus and the actual position of the reference hole in the image is calculated,
[C-2 ′] A machining origin correction method for correcting the machining origin position of laser processing on the machining program so that the deviation amount becomes zero based on the calculated deviation amount.
The machining origin correction method according to any one of claims 13 to 15,
Correction data is generated by correcting the processing origin position of the molding processing for at least two of the plurality of product parts on the workpiece,
A processing origin correction method for correcting the processing origin position of laser processing of the remaining product portion on the workpiece or a plurality of product portions on another workpiece using the correction data.
The processing origin correction method according to any one of claims 13 to 16,
[B] is performed during the molding process;
[I] A processing origin correction method for correcting a processing origin position of molding processing on the processing program based on the captured image.
The processing origin correction method according to claim 17,
In [i]
[I-1] Based on the captured image, calculate a deviation amount between the position of the reference hole on the processing program and the actual position of the reference hole in the image,
[I-2] A machining origin correction method for correcting the machining origin position of the forming process on the machining program so that the deviation amount becomes zero based on the calculated deviation amount.
The processing origin correction method according to claim 17,
Prior to [b], while irradiating a low-power laser beam, relatively moving the workpiece based on the position of the reference hole on the machining program to form the locus on the workpiece,
In [i]
[I-1 ′] On the basis of the imaged image, a deviation amount between the position of the locus and the actual position of the reference hole in the image is calculated,
[I-2 ′] A machining origin correction method for correcting the machining origin position of the forming process on the machining program so that the deviation amount becomes zero based on the calculated deviation amount.
The processing origin correction method according to claim 17 or 18,
During the forming process, correction data is generated by correcting the processing origin position of the forming process for at least two of the plurality of product parts on the workpiece,
A machining origin correction method for correcting a machining origin position of laser machining on the machining program for the plurality of product parts on the workpiece by using the correction data.
A machining origin correction method according to any one of claims 17 to 19,
During the forming process, correction data is generated by correcting the processing origin position of the forming process for at least two of the plurality of product parts on the workpiece,
A machining origin correction method for correcting the machining origin position of the molding process of the remaining product part on the workpiece or a plurality of product parts on another workpiece by using the correction data.
A processing origin correction method for forming a plurality of product parts on a plate-shaped workpiece based on a processing program,
[A] forming a reference hole corresponding to at least one of the plurality of product parts;
[B] Taking an image of the reference hole based on the position of the reference hole on the machining program;
[C] Based on the captured image, correct the processing origin position of the forming process on the processing program,
[D] A processing origin correction method in which the at least one of the plurality of product parts is formed based on the corrected processing origin position.