JP6730162B2 - Laser processing machine - Google Patents

Description

The present invention relates to a laser processing machine that performs laser processing (laser cutting processing) on a punched plate-shaped work (sheet metal).

In the field of laser processing, it has a function to match the origin position that is the reference for punching and the origin position that is the reference for laser processing, in other words, the function to correct the composite origin (composite precision) of punching and laser processing. A laser processing machine has been developed (see Patent Document 1). The configuration of the laser processing machine (conventional laser processing machine) according to the prior art is as follows.

A laser processing machine according to the prior art includes a processing machine main body (processing machine base), and the processing machine main body includes a processing table that supports a plate-shaped work piece at a lower portion thereof. The processing table has a large number of brushes or a plurality of free ball bearings for supporting the work on its upper surface. Further, the processing machine main body is provided at a position above the processing table so as to be movable in the Y-axis direction so as to irradiate a laser beam toward the work from above. Further, a laser opening for passing a laser beam is formed on the upper surface of the processing table located below the moving region of the laser irradiation unit in the Y-axis direction.

The laser processing head is provided with an image pickup unit on its side part for picking up an image of the periphery including a reference hole such as a reference punch hole formed in a punched work, and the image pickup unit is integrated with the laser processing head. It is designed to move in the Y-axis direction. The imaging position of the imaging unit is shifted in the X-axis direction with respect to the irradiation position of the laser irradiation unit. Further, the laser processing machine according to the prior art includes a work moving unit that moves the work in the X-axis direction and the Y-axis direction relative to the irradiation position of the laser irradiation unit and the imaging position of the imaging unit.

A laser processing machine according to the prior art includes a control device that controls a laser irradiation unit, an imaging unit, a work moving unit, and the like based on a processing program. In addition, the control device is configured to detect (calculate) the coordinate position of the reference hole based on the imaged image from the imaging unit after the imaging of the reference hole by the imaging unit. Further, the control device is adapted to correct the origin position on the machining program serving as a reference for laser machining, based on the detection result (coordinate position of the reference hole). In other words, the control device corrects the composite origin, which aligns the machining origin serving as the punch machining reference and the laser machining reference based on the captured image from the imaging unit (compound origin of punching and laser machining). Correction).

JP, 2005-226933, A

By the way, when the composite origin of punching and laser processing is corrected, scrap generated by punching or the like may exist below the reference hole on the upper surface of the processing table. In such a case, even if the imaging unit captures an image of the periphery including the reference hole, the contour portion of the reference hole cannot be accurately read, which may lead to erroneous detection or detection failure of the coordinate position of the reference hole. is there. That is, there is a problem in that it is not easy to stably and appropriately correct the composite origin of punching and laser processing without being affected by scrap.

Therefore, an object of the present invention is to provide a laser processing machine having a novel configuration, which can solve the above-mentioned problems.

According to an aspect of the present invention, a plate-like work which is moved and positioned in the X-axis direction and the Y-axis direction relative to the irradiation position of the laser irradiation unit on the processing table is moved from above by the laser irradiation unit. A laser processing machine for performing laser processing by irradiating a laser beam to a work, the reference hole being formed in a punched work, provided so as to be displaced from the irradiation position of the laser irradiation unit in the X-axis direction. And a work moving unit that moves the work in the X-axis direction and the Y-axis direction relative to the irradiation position of the laser irradiation unit and the imaging position of the imaging unit. That is, an opening for discharging scrap is formed in the processing table at a position below the movement area of the unit in the Y-axis direction.

According to the aspect of the present invention, as described above, the opening is formed in the processing table at a position below the movement region of the imaging unit in the Y-axis direction. Therefore, when scraps generated by punching or the like are located on the processing table below the Y-axis movement region of the imaging unit, they are discharged from the processing table via the opening. This makes it possible to sufficiently prevent scrap from existing below the reference hole on the upper surface of the processing table when correcting the composite origin (composite accuracy) of punching and laser processing.

According to the present invention, by imaging the periphery including the reference hole by the imaging unit, the coordinate position of the reference hole can be accurately determined based on the captured image from the imaging unit without being affected by scrap. Can be detected. In other words, according to the present invention, the correction of the composite origin that aligns the processing origin serving as the punch processing reference and the processing origin serving as the laser processing reference without being influenced by scrap (correction of the composite origin of punch processing and laser processing is performed. ) Can be performed stably and appropriately.

FIG. 1 is a view taken along line I-I in FIG. FIG. 2 is a schematic side view (side cross-sectional view) of the multi-tasking machine according to the embodiment of the present invention, and a part of the multi-tasking machine according to the embodiment of the present invention is omitted. FIG. 3 is an enlarged view of the arrow III in FIG. FIG. 4 is an enlarged cross-sectional view taken along the line IV-IV in FIG. FIG. 5A is an enlarged cross-sectional view of the arrow V in FIG. 4 and shows a state of reflected light of light emitted from the ring light. FIG. 5B is a photographic view of the surrounding area including the reference hole. FIG. 6 is a control block diagram of the multi-tasking machine according to the embodiment of the present invention. FIG. 7A is a diagram showing a state of reflected light of the light emitted from the ring light when the slit is not formed. FIG. 7B is a photographic view of the periphery including the reference hole when the slit is not formed. FIG. 8A is an enlarged cross-sectional view showing a characteristic part of the modified example 1 of the embodiment of the present invention, and FIG. 8B is an enlarged cross-sectional view showing a characteristic part of the modified example 2 of the embodiment of the present invention. is there.

Embodiments of the present invention (including modifications 1 and 2 of the embodiment of the present invention) will be described with reference to the drawings. In the specification and claims of the present application, “provided” means not only being provided directly but also being indirectly provided through another member, and “provided”. Is synonymous with. “Providing” includes not only providing directly but also indirectly providing via another member, and is synonymous with “providing”. The “X-axis direction” is one in the horizontal direction, and in the embodiment of the present invention, the horizontal direction. The “Y-axis direction” is one of the horizontal directions orthogonal to the X-axis direction, and in the embodiment of the present invention, the front-back direction. In the drawings, "FF" is forward, "FR" is rearward, "L" is leftward, "R" is rightward, "U" is upward, "D" is Each points downward.

As shown in FIGS. 1 to 4, a multi-tasking machine 1 according to an embodiment of the present invention is configured such that a plate-shaped work (sheet metal) W is subjected to laser processing (laser cutting) and punching (punching and forming). It is a composite type processing machine that performs (including). In other words, the combined processing machine 1 according to the embodiment of the present invention is one of the laser processing machines that performs laser processing on the punched plate-shaped workpiece W. The multi-tasking machine 1 includes a machine body (machine base) 3, and the machine body 3 includes a bridge-type body frame 9 having an upper frame 5 and a lower frame 7 which are vertically opposed to each other. , And a support frame (side frame) 11 provided on each of the left and right sides of the lower frame 7.

The composite processing machine 1 includes a processing table (processing table unit) 13 that supports the work W at an appropriate position on the processing machine body 3. Then, the specific configuration of the processing table 13 is as follows.

The lower frame 7 is provided with a center table 15 that supports the work W movably in the X-axis direction and the Y-axis direction at an appropriate position. Further, each support frame 11 is provided with a moving table 17 that is adjacent to the center table 15 in the X-axis direction and that supports the workpiece W so as to be movable in the X-axis direction. It is configured to be movable to. Further, each support frame 11 is provided with a side table 19 that is movably supported in the X axis direction and the Y axis direction at a position adjacent to the moving table 17 in the X axis direction. The center table 15, the moving tables 17, and the side tables 19 have a large number of brushes (brush bundles) 21 for supporting the work W and a plurality of free ball bearings (not shown) on their upper surfaces, respectively. Have

The center table 15 has a shooter table 23 for discharging a product (not shown) or a residual material (not shown) separated from the work W to the outside. The shooter table 23 extends in the Y-axis direction and is configured to be vertically swingable around a horizontal swing shaft 25 provided on the lower frame 7. The details of the structure of the shooter table 23, which is a part of the center table 15, will be described later.

The multi-tasking machine 1 includes a punching unit 27 for punching a workpiece W at an appropriate position of the machine body 3. Then, the specific configuration of the punching unit 27 is as follows.

The upper frame 5 is provided with a circular upper turret 31 which holds a plurality of punch dies 29 on the front portion thereof. Further, the lower frame 7 is provided with a circular lower turret 35 that holds a plurality of die dies 33 at a position vertically opposed to the upper turret 31. By driving a motor (not shown) to rotate the upper turret 31 and the lower turret 35 in synchronism, an arbitrary punch die 29 and die die 33 are indexed to the punching position P1.

The upper frame 5 is provided above the upper turret 31 with a ram 37 capable of moving up and down (movable in the vertical direction). Further, the ram 37 is provided with a striker 39 on its lower side, which strikes the punch die 29 indexed to the punching position P1. Then, by driving a cylinder (not shown), the striker 39 is lowered integrally with the ram 37, and the punch die 29 is pressed to punch the work W that is moved and positioned on the working table 13. Be seen.

The processing machine body 3 irradiates a laser beam above the center table 15 with a laser beam from above to a portion to be cut of the work W (including contours of a portion Wm corresponding to a plurality of products). Is provided so as to be movable in the Y-axis direction. Then, the specific configuration of the laser irradiation unit 41 is as follows.

The upper frame 5 is equipped with a Y-axis slider 43 so as to be movable in the Y-axis direction. Further, the Y-axis slider 43 is provided with a cylindrical laser processing head 45 that irradiates a laser beam so that the position (height position) in the vertical direction (Z-axis direction) with respect to the Y-axis slider 43 can be adjusted. The laser processing head 45 has a laser nozzle 47 on the tip side thereof. Then, the position of the laser processing head 45 is adjusted on the work W by driving a motor (not shown), and a laser beam is emitted from the laser processing head 45 toward the work W, whereby the laser processing head 45 is moved and positioned on the processing table 13. Laser processing is performed on the work W.

The laser processing head 45 is optically connected to a fiber laser oscillator 49 that oscillates a laser beam having a wavelength of 1 μm band. The laser processing head 45 may be optically connected to a YAG laser oscillator (not shown), a CO ₂ laser oscillator (not shown), a semiconductor laser oscillator (not shown), or the like, instead of the fiber laser oscillator 49. Good.

The laser processing head 45 is provided with an imaging unit 51 on its side part for imaging the periphery including the reference hole Wh formed in the punched work W. The reference hole Wh is a reference hole when the combined origin of punching and laser processing is corrected, and has a circular reference punching hole Wha and a circular reference laser formed in a portion of the work W corresponding to the remaining material. This is the hole Whb (see FIG. 3). Then, the specific configuration of the imaging unit 51 is as follows.

As shown in FIGS. 3 to 5, the laser processing head 45 is integrally provided with a cylindrical imaging case 53 on its side portion, and the lower side of the imaging case 53 is released (opened). .. The imaging case 53 (imaging unit 51) moves in the Y-axis direction integrally with the laser processing head 45. Further, the image pickup case 53 is provided with a CCD camera 55 for picking up an image of the periphery including the reference hole Wh (Wha, Whb) inside. The image pickup position P3 of the CCD camera 55 (image pickup unit 51) is displaced from the irradiation position P2 of the laser processing head 45 in the X axis direction and the Y axis direction. Further, the imaging case 53 is provided with a ring light 57 as a light source for irradiating the periphery including the reference hole Wh with the light (irradiation light) IL from above in the lower part thereof.

The compound machine 1 moves the work W in the X-axis direction and the Y-axis direction with respect to the punching position P1 of the punching unit 27, the irradiation position P2 of the laser processing head 45, and the imaging position P3 of the CCD camera 55. The mobile unit 59 is provided. The concrete configuration of the work moving unit 59 is as follows.

As shown in FIGS. 1 and 2, the pair of moving tables 17 are integrally provided with a carriage base 61 extending in the X-axis direction across their rear portions. The upper frame 5 includes a first Y-axis motor 63 for moving the carriage base 61 integrally with the pair of moving tables 17 in the Y-axis direction. Further, the carriage base 61 is provided with a carriage 65 on the front side thereof so as to be movable in the X-axis direction. The carriage base 61 includes an X-axis motor 67 for moving the carriage 65 in the X-axis direction. Further, the carriage 65 is provided with a plurality of clampers 69 for clamping the end portion of the work W on the front side thereof. Then, the upper frame 5 includes a second Y-axis motor 71 for moving the Y-axis slider 43 in the Y-axis direction.

With the above configuration, the work W clamped by the plurality of clampers 69 is moved and positioned with respect to the punching position P1 by driving the X-axis motor 67 and the first Y-axis motor 63. Then, the punching unit 27 performs punching (including punching and forming) on portions Wm of the work W corresponding to a plurality of products.

After punching, the carriage 65 is moved in the X-axis direction by driving the X-axis motor 67, and the Y-axis slider 43 is moved in the Y-axis direction by driving the second-axis motor 71. It is moved and positioned relative to the irradiation position P2 in the X-axis direction and the Y-axis direction. Then, by irradiating the laser beam from the laser processing head 45 toward the work W, laser processing (laser cutting processing) is performed on the portion to be cut in the punched work W.

After performing the punching process and before performing the laser processing, the carriage 65 is moved in the X-axis direction and the Y-axis slider 43 is moved in the Y-axis direction, so that the reference holes Wh (Wha, Whb of the work W are formed. ) Is relatively positioned to the image pickup position P3 of the CCD camera 55. Then, while the ring light 57 irradiates the periphery including the reference hole Wh with light, the CCD camera 55 captures an image of the periphery.

As shown in FIG. 6, the multi-tasking machine 1 includes a control device 73 that controls the punching unit 27, the laser irradiation unit 41, the imaging unit 51, the work moving unit 59, and the like based on a machining program. Further, the control device 73 is configured by one or a plurality of computers, and the control device 73 includes a memory that stores a machining program, work information, mold information, and the like, and a CPU that interprets and executes the machining program. Equipped with. The work information includes each dimension, material, and the like of the work W, and the die information includes the shape, each dimension, and the like of the punch die 29 and the die die 33.

As shown in FIGS. 3 and 6, the control device 73 captures an image of the reference laser hole Whb by the CCD camera 55 positioned above the circular reference laser hole Whb serving as the reference hole Wh, and then captures the image from the CCD camera 55. The coordinate position of the reference laser hole Whb is detected (calculated) based on the image. Then, the control device 73 corrects the difference (shift) in the coordinate position of the image pickup position P3 of the CCD camera 55 with respect to the irradiation position P2 of the laser processing head 45 based on the detection result (coordinate position of the reference laser hole Whb) ( Calibration of the CCD camera 55) is performed.

The control device 73 images the circular reference punch hole Wha as the reference hole Wh by the calibrated CCD camera 55, and then detects the coordinate position of the reference punch hole Wha based on the captured image from the CCD camera 55 ( Calculation). Then, the control device 73 corrects the position on the processing program which is the reference of the laser processing, based on the detection result (coordinate position of the reference punch hole Wha). In other words, the control device 73 corrects the composite origin (composite accuracy) of punching and laser processing based on the captured image from the CCD camera 55.

Next, the configuration of the shooter table 23, which is a part of the center table 15, and its surroundings will be described.

As shown in FIGS. 3 to 5, the shooter table 23 has a table base 75 extending in the Y-axis direction and horizontally swingably provided on a horizontal swing shaft 25. Further, the table base 75 is integrally provided on the upper surface thereof with a first support base 79 extending in the Y-axis direction by a plurality of columns 77. The first support base 79 is formed by stacking two plates on top of each other. It is configured. Further, the table base 75 is integrally provided with a second support base 83 extending in the Y-axis direction via the intermediate frame 81 at a position adjacent to the first support base 79 on the upper surface in the X-axis direction. The first support base 79 and the second support base 83 have a large number of brushes 21 on their upper surfaces, respectively, as described above.

A laser opening 85 extending in the Y-axis direction is formed on the upper surface of the first support base 79 located below the Y-axis movement region of the laser-processing head 45 (irradiation region of the laser processing head 45 in the Y-axis direction). Has been formed. Further, the first support base 79 integrally includes a dust collecting duct 89 extending in the Y-axis direction on the lower side thereof, and the dust collecting duct 89 collects dust by suction force (not shown). )It is connected to the.

The scrap S is discharged from the center table 15 (processing table 13) on the upper surface of the first support base 79 located below the moving area of the CCD camera 55 in the Y-axis direction (imaging area of the CCD camera 55 in the Y-axis direction). A slit 91 is formed as an example of an opening for doing this. The slit 91 extends in the Y-axis direction and penetrates the first support base 79 in the thickness direction. The width of the slit 91 (length in the X-axis direction) is preferably set larger than the inner diameter of the reference hole Wh. The table base 75 is integrally provided on the upper side thereof with a tilt plate (tilt member) 93 extending in the Y-axis direction by an appropriate column 77, and the tilt plate 93 is tilted with respect to the horizontal direction. It has a surface 93f. The inclination angle θ of the inclined surface 93f of the inclined plate 93 is set to 45 degrees or more and is invariable, but it may be variable (adjusted) by driving an adjustment motor (not shown) for the inclined plate.

Subsequently, the operation and effect of the embodiment of the present invention will be described.

By controlling the punching unit 27 and the work moving unit 59 by the control device 73 as described above, the punching is performed on the part Wm of the work W corresponding to a plurality of products. During the punching process, a circular reference punch hole Wha is formed in a portion of the work W corresponding to the residual material.

After punching, the control unit 73 controls the work moving unit 59 to relatively position the vicinity of the reference punch hole Wha in the work W to the irradiation position P2 of the laser processing head 45. Then, the laser irradiation unit 41 and the work moving unit 59 are controlled by the control device 73 to move the work W in a circular motion relative to the irradiation position P2 of the laser processing head 45 while moving from the laser processing head 45 to the work W. Irradiate a laser beam toward. As a result, a circular reference laser hole Whb is formed in the workpiece W near the reference punch hole Wha.

After the reference laser hole Whb is formed in the work W, the control unit 73 controls the work moving unit 59 to relatively position the reference laser hole Whb at the image pickup position P3 of the CCD camera 55. Next, by controlling the image pickup unit 51 by the control device 73, the periphery including the reference laser hole Whb is irradiated with the light IL by the ring light 57, and the periphery of the CCD camera 55 is imaged. Then, the control device 73 detects the coordinate position of the reference laser hole Whb based on the captured image from the CCD camera 55. Further, the control device 73 corrects the difference (deviation) in the coordinate position of the imaging position P3 of the CCD camera 55 with respect to the irradiation position P2 of the laser processing head 45 based on the detection result (coordinate position of the reference laser hole Whb) ( Calibration of the CCD camera 55) is performed.

After calibrating the CCD camera 55, the control unit 73 controls the work moving unit 59 to position the reference punch hole Wha relatively to the image pickup position P3 of the CCD camera 55. Next, by controlling the image pickup unit 51 by the control device 73, the periphery including the reference punch hole Wha is irradiated with the light IL by the ring light 57, and the periphery of the CCD camera 55 is imaged. Then, the control device 73 detects the coordinate position of the reference punch hole Wha based on the captured image from the CCD camera 55. Further, the control device 73 corrects the position on the processing program which is the reference of the laser processing, based on the detection result (coordinate position of the reference punch hole Wha). In other words, the control device 73 corrects the composite origin (composite accuracy) of punching and laser processing based on the captured image from the CCD camera 55.

The CCD camera 55 is calibrated every time the composite origin of punching and laser processing is corrected, but it may be calibrated every appropriate period (for example, once a day).

Here, as described above, the slit 91 is formed on the upper surface of the first support base 79 of the shooter table 23 below the movement area of the CCD camera 55 in the Y-axis direction. Therefore, when the scrap S generated by punching or the like is located on the upper surface of the first support base 79 below the moving area of the CCD camera 55 in the Y-axis direction, it is discharged from the shooter table 23 via the slit 91. .. Thus, when the CCD camera 55 is calibrated and the composite origin of punching and laser processing is corrected, the scrap S is below the reference hole Wh (Wha, Whb) on the upper surface of the first support base 79 of the shooter table 23. It can be sufficiently prevented from existing on the side.

Further, as described above, the inclined plate 93 having the inclined surface 93f is integrally provided on the upper side of the table base 75. Therefore, when the scrap S falls on the inclined surface 93f of the inclined plate 93 via the slit 91, the scrap S moves along the inclined surface 93f of the inclined plate 93 and is discharged to a position deviated from the lower position of the slit 91. Accordingly, when the CCD camera 55 is calibrated and the composite origin of punching and laser processing is corrected, the scrap S can be sufficiently prevented from existing within the imaging range of the CCD camera 55.

After the correction of the combined origin of punching and laser processing, the laser cutting can be performed on the cut portion of the work W with high accuracy, and a plurality of products or residual materials can be separated from the work W. After performing the laser processing, a shooter table rocking cylinder (not shown) is driven to rock the shooter table 23 downward about a horizontal rocking shaft 25 to remove a plurality of products or residual materials. Can be discharged to the outside.

As described above, according to the embodiment of the present invention, as described above, when performing the correction of the composite origin of punching and laser processing, the scrap S is only under the reference hole Wh (Wha, Whb). Therefore, it is possible to sufficiently prevent the CCD camera 55 from existing within the imaging range of the CCD camera 55. Accordingly, the reflected light RL of the light IL emitted from the ring light 57 can be suppressed from traveling toward the CCD camera 55 side, and the coordinate position of the reference hole Wh can be accurately detected. Therefore, according to the embodiment of the present invention, by imaging the periphery including the reference hole Wh with the CCD camera 55, as shown in FIG. The coordinate position of the reference hole Wh can be accurately detected based on the captured image of. That is, according to the embodiment of the present invention, correction of a compound origin that aligns a machining origin that is a reference for punching and a machining origin that is a reference for laser machining without being affected by the scrap S (for punching and laser machining). The correction of the composite origin) can be performed stably and appropriately.

If the slits 91 are not formed on the upper surface of the first support base 79 of the shooter table 23 as shown in FIG. 7A, the scrap S may be present below the reference hole Wh. .. As a result, the reflected light RL of the light IL emitted from the ring light 57 goes toward the CCD camera 55 side, and as shown in FIG. 7B, the contour portion of the reference hole Wh cannot be accurately read. Therefore, the coordinate position of the reference hole Wh is erroneously detected.

(Modification 1 of the embodiment of the present invention)
Modification 1 of the embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 8A, in the first modification of the embodiment of the present invention, the first support base 79 of the shooter table 23 is provided at an appropriate position on the slit 91 side along the inclined surface 93f of the inclined plate 93. A plurality of (only one is shown) air nozzles 95 for ejecting the air A from above. The plurality of air nozzles 95 are arranged at intervals in the Y-axis direction and are connected to a common air supply source (not shown) such as a common air compressor.

Therefore, according to the first modified example of the embodiment of the present invention, before the calibration of the CCD camera 55 and the correction of the composite origin of punching and laser processing are performed, the air nozzle 95 extends along the inclined surface 93f of the inclined plate 93. Air A is jetted from above. This can prevent the scrap S from adhering to the inclined surface 93f of the inclined plate 93. Therefore, according to the first modification of the embodiment of the present invention, it is sufficient and certain that the scrap S exists within the image pickup range of the CCD camera 55 when the composite origin of punching and laser processing is corrected. This can be prevented, and the effect of the above-described embodiment of the present invention can be further enhanced.

Instead of ejecting the air A along the inclined surface 93f of the inclined plate 93, the air nozzle 95 may eject air from above toward the inclined surface 93f of the inclined plate 93.

(Modification 2 of the embodiment of the present invention)
Modification 2 of the embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 8B, in the second modification of the embodiment of the present invention, the inclined plate 93 is omitted from the configuration around the shooter table 23. Further, the first support base 79 of the shooter table 23 is provided with a lid member 97 that opens and closes the slit 91 (the opening below the slit 91) at an appropriate position on the slit 91 side. The lid member 97 extends in the Y-axis direction and is configured to be swingable around a horizontal swing shaft 99 provided at an appropriate position on the slit 91 side of the first support base 79. Further, the lid member 97 is configured to swing by driving a lid member swing cylinder (not shown) provided at an appropriate position of the first support base 79.

Therefore, according to the second modification of the embodiment of the present invention, during punching and laser processing, the lid member 97 is swung downward by driving the lid member swing cylinder to open the slit 91. deep. After separating the product or the remaining material from the work W, the lid member 97 is swung upward by driving the lid member swing cylinder to close the slit 91. Accordingly, when the shooter table 23 discharges the product or the residual material to the outside, it is possible to sufficiently suppress the slit 91 from interfering with the discharge of the product or the like.

If the lid member 97 opens and closes the slit 91, the lid member 97 is movable (sliding) in the X-axis direction instead of being swingable around the horizontal swing shaft 99. Good.

The present invention is not limited to the above description of the embodiments, but can be implemented in various modes by making appropriate modifications as follows.

Instead of forming a slit 91 as an example of an opening on the upper surface of the first support base 79 located below the moving area of the CCD camera 55 in the Y-axis direction, a round hole or a rectangular hole larger than the inner diameter of the reference hole Wh is formed. May be formed. At this time, the reference hole Wh is preferably formed in the vicinity of the clamped portion (the portion clamped by the clamper 69) of the work W so that the calibration of the CCD camera 55 is not affected by the size of the work W.

In the multi-tasking machine 1, the laser processing head 45 is configured to be movable in the Y-axis direction, but the laser processing head 45 is fixed so as not to be movable in the Y-axis direction and the work W is moved in the X-axis direction and the Y-axis direction. It may be configured as follows.

The scope of rights included in the present invention is not limited to the above embodiment.

1 Combined processing machine (laser processing machine)
3 Processing machine main body 9 Main body frame 11 Support frame 13 Processing table (processing table unit)
15 center table 17 moving table 19 side table 21 brush 23 shooter table 25 swing shaft 27 punching unit 29 punch die 31 upper turret 33 die die 35 lower turret 37 ram 39 striker 41 laser irradiation unit 43 Y-axis slider 45 laser Processing head 47 Laser nozzle 49 Fiber laser oscillator 51 Imaging unit 55 CCDE camera 57 Ring light 59 Work moving unit 61 Carriage base 63 First Y-axis motor 65 Carriage 67 X-axis motor 69 Clamper 71 Second Y-axis motor 73 Controller 75 Table base 79 First support base 83 Second support base 85 Laser opening 89 Dust collection duct 91 Slit (opening)
93 Tilt plate (Tilt member)
93 Inclined surface of inclined plate 95 Air nozzle 97 Lid member P1 Punching position P2 of punching unit Irradiation position P3 of laser irradiation unit (laser processing head) Imaging position IL light (irradiation light) of imaging unit (CCD camera)
RL Reflected light S Scrap W Work (sheet metal)
Wh Reference hole Wha Reference punch hole Whb Reference laser hole θ Inclination angle of inclined surface of lid member

Claims (7)

For a plate-shaped work which is moved and positioned in the X-axis direction and the Y-axis direction relative to the irradiation position of the laser irradiation unit on the processing table, a laser beam is directed from above to the work by the laser irradiation unit. A laser processing machine that irradiates laser light to perform laser processing,
An image pickup unit which is provided so as to be displaced in the X-axis direction with respect to the irradiation position of the laser irradiation unit, and which picks up an image of a reference hole formed in a punched work.
A work moving unit that moves the work in the X-axis direction and the Y-axis direction relative to the irradiation position of the laser irradiation unit and the imaging position of the imaging unit,
A laser beam machine, characterized in that an opening for discharging scrap is formed on the processing table at a position below a moving region of the imaging unit in the Y-axis direction. The laser processing machine according to claim 1, further comprising an inclined member provided below the opening and having an inclined surface inclined with respect to the horizontal direction. The laser beam machine according to claim 2, further comprising an air nozzle that ejects air toward the inclined surface of the inclined member or along the inclined surface of the inclined member. The processing table includes a shooter table that is swingable about a horizontal swing axis and discharges a product or a residual material, and the opening is formed in an upper surface of the shooter table. The laser beam machine according to any one of claims 1 to 3. The laser processing machine according to claim 4, further comprising a lid member that opens and closes the opening. The laser processing machine according to claim 1, wherein the imaging unit has a light source that emits light to the periphery including the reference hole. 7. The laser beam machine according to claim 1, wherein the laser beam machine is a compound type machine having a punching unit for punching a work.